JP2021077815A - Vacuum processing apparatus - Google Patents

Vacuum processing apparatus Download PDF

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JP2021077815A
JP2021077815A JP2019205132A JP2019205132A JP2021077815A JP 2021077815 A JP2021077815 A JP 2021077815A JP 2019205132 A JP2019205132 A JP 2019205132A JP 2019205132 A JP2019205132 A JP 2019205132A JP 2021077815 A JP2021077815 A JP 2021077815A
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hinge
vacuum processing
housing
upper lid
hole
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JP7360305B2 (en
JP2021077815A5 (en
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一幸 廣實
Kazuyuki Hiromi
一幸 廣實
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Hitachi High Tech Corp
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Abstract

To provide a vacuum processing apparatus that does not require adjustment during assembly and enables high-precision assembly.SOLUTION: A vacuum processing apparatus has a hinge mechanism 4 for opening and closing an upper lid 5 on one side of a housing 1, and the upper lid 5 can be displaced in the vertical direction by a long hole hinge hole 7, a hinge shaft 6, and a spring mechanism 8 provided in the hinge mechanism 4. Since the hinge shaft 6 can be displaced in the vertical direction, it is not necessary to adjust the height of the hinge mechanism 4 during an assembly process. As a result, an assembly time can be shortened, and an increase in manufacturing cost can be suppressed.SELECTED DRAWING: Figure 3

Description

本発明は、真空処理装置に関する。 The present invention relates to a vacuum processing apparatus.

近年、半導体素子を用いた機器が普及するにつれて価格競争が激化し、半導体処理装置自体の製造コスト低減までも求められるようになってきた。また、半導体処理装置の大きさにより設置時に占有する敷地面積が左右されることから、半導体処理装置の大きさを運用コストの一部ととらえ、低価格のみならず省スペースで高稼働率の半導体処理装置が求められているという実情がある。 In recent years, as equipment using semiconductor elements has become widespread, price competition has intensified, and it has become necessary to reduce the manufacturing cost of the semiconductor processing apparatus itself. In addition, since the site area occupied at the time of installation depends on the size of the semiconductor processing device, the size of the semiconductor processing device is regarded as a part of the operating cost, and the semiconductor is not only low-priced but also space-saving and has a high operating rate. There is a fact that processing equipment is required.

こうした要求を満たすため、特許文献1には、処理室の開閉蓋を開閉することができるヒンジ機構を採用した試料処理装置が開示されている。このようなヒンジ機構を用いることで、試料処理装置の敷地面積を小さくするとともに、メンテナンス性を向上し高稼働率を実現できる。 In order to satisfy such a requirement, Patent Document 1 discloses a sample processing apparatus adopting a hinge mechanism capable of opening and closing the opening / closing lid of the processing chamber. By using such a hinge mechanism, it is possible to reduce the site area of the sample processing device, improve maintainability, and realize a high operating rate.

特開2006−140292号公報Japanese Unexamined Patent Publication No. 2006-140292

図1、図2に従来のヒンジ機構を採用した真空処理装置の概略断面図を示す。
図1において、筐体11と上蓋15がヒンジ機構14により連結されている。ヒンジ機構14は、筐体11と上蓋15にそれぞれ備えられた突片に形成された孔にヒンジ軸を挿通(嵌合)してなり、該孔がヒンジ軸に対して摺動することで、筐体11に対して上蓋15が開閉可能となっている。筐体11と上蓋15との端部間には、全周にわたって真空シール部材19が配置されており、図2に示すように筐体11に対して上蓋15を閉じたときに、内部に真空処理室(処理室ともいう)が形成される。
図1に示すヒンジ機構14を採用した装置では、ヒンジ機構14の支持部品が筐体11の一部を構成する。
1 and 2 show schematic cross-sectional views of a vacuum processing apparatus using a conventional hinge mechanism.
In FIG. 1, the housing 11 and the upper lid 15 are connected by a hinge mechanism 14. The hinge mechanism 14 is formed by inserting (fitting) a hinge shaft into holes formed in projecting pieces provided in the housing 11 and the upper lid 15, respectively, and the holes slide with respect to the hinge shaft. The upper lid 15 can be opened and closed with respect to the housing 11. A vacuum seal member 19 is arranged over the entire circumference between the ends of the housing 11 and the upper lid 15, and as shown in FIG. 2, when the upper lid 15 is closed with respect to the housing 11, a vacuum is provided inside. A processing chamber (also called a processing chamber) is formed.
In the device using the hinge mechanism 14 shown in FIG. 1, the supporting parts of the hinge mechanism 14 form a part of the housing 11.

ここで、上蓋15を閉じたときに筐体11との隙間Sが均等でないと、真空シール部材19の潰れ量が不均一となり気体漏れが生じるおそれがある。そこで、真空処理室の真空度を確保するために、上蓋15を閉じた時に真空シール部材19が均一に潰れるようヒンジ機構14の高さを調整できる機構(不図示)が設けられている。この機構を用いて真空処理装置組み立て工程においてヒンジ機構の高さ方向を調整する。しかしながら、ヒンジ機構の高さ方向の調整が難しいという問題がある。 Here, if the gap S with the housing 11 is not uniform when the upper lid 15 is closed, the amount of crushing of the vacuum seal member 19 may be non-uniform and gas leakage may occur. Therefore, in order to secure the degree of vacuum in the vacuum processing chamber, a mechanism (not shown) that can adjust the height of the hinge mechanism 14 so that the vacuum seal member 19 is uniformly crushed when the upper lid 15 is closed is provided. This mechanism is used to adjust the height direction of the hinge mechanism in the vacuum processing apparatus assembly process. However, there is a problem that it is difficult to adjust the hinge mechanism in the height direction.

さらに従来の装置では、ヒンジ機構14を支持するヒンジ軸が真空処理室の片側にしかないため、図2に示すようにヒンジ軸を最適位置より上方に調整してしまうと、上蓋15と筐体11との隙間が不均一となってしまう。このため、真空処理室内の真空度が悪化したり、最悪の場合、真空を維持できないおそれがある。このような不具合は、ヒンジ機構の調整や部品の交換などで解消できるが、それにより製造工数の増大や交換部品の増加を招き、製造コストの増加につながる。 Further, in the conventional device, since the hinge shaft supporting the hinge mechanism 14 is only on one side of the vacuum processing chamber, if the hinge shaft is adjusted above the optimum position as shown in FIG. 2, the upper lid 15 and the housing 11 are used. The gap between the and is uneven. Therefore, the degree of vacuum in the vacuum processing chamber may deteriorate, or in the worst case, the vacuum may not be maintained. Such defects can be solved by adjusting the hinge mechanism or replacing parts, but this leads to an increase in manufacturing man-hours and replacement parts, leading to an increase in manufacturing cost.

また前述したように、ヒンジ機構14により開閉される部分は上蓋15であるから、ヒンジ機構14の調整が適切でなければ、筐体11に対して上蓋15が傾いてしまう。特に、半導体の加工ではウエハと呼ばれる円盤状の基板にエッチング処理を施し、ウエハから多くのチップを生成する。より多くのチップを取り出すためには、圧力、ガス濃度などの条件をウエハ面内で厳密に同一条件とすることが望ましく、従って筐体11と上蓋15とで形成される真空処理室は、ウエハ中心に同軸の円筒状で構成されることが望ましい。 Further, as described above, since the portion opened and closed by the hinge mechanism 14 is the upper lid 15, if the hinge mechanism 14 is not properly adjusted, the upper lid 15 will be tilted with respect to the housing 11. In particular, in semiconductor processing, a disk-shaped substrate called a wafer is etched to generate many chips from the wafer. In order to take out more chips, it is desirable that the conditions such as pressure and gas concentration are exactly the same in the wafer surface. Therefore, the vacuum processing chamber formed by the housing 11 and the upper lid 15 is a wafer. It is desirable to have a cylindrical shape coaxial with the center.

そのため、上記の理由で筐体11に対して上蓋15が傾いてしまうと、真空処理室の同軸性が損なわれ、ウエハ面内で均一処理ができなくなるおそれがある。微細化が促進されている半導体デバイスにおいて、このような真空処理室の同軸性悪化が生じると、チップ取得のための歩留まり悪化が増大する懸念がある。 Therefore, if the upper lid 15 is tilted with respect to the housing 11 for the above reason, the coaxiality of the vacuum processing chamber is impaired, and uniform processing may not be possible on the wafer surface. In a semiconductor device whose miniaturization is being promoted, if such deterioration of the coaxiality of the vacuum processing chamber occurs, there is a concern that the deterioration of the yield for chip acquisition will increase.

本発明は、かかる課題に鑑みてなされたものであり、ヒンジ機構を用いた場合でも、同軸性の悪化を抑制できる真空処理装置を提供することを目的とする。 The present invention has been made in view of such a problem, and an object of the present invention is to provide a vacuum processing apparatus capable of suppressing deterioration of coaxiality even when a hinge mechanism is used.

上記課題を解決するために、代表的な本発明にかかる真空処理装置の一つは、処理室内で試料を加工する真空処理装置であって、試料を内部に保持する筐体と、上蓋と、前記上蓋を、前記筐体の端部を開放する開放位置と、前記筐体の端部を遮蔽する遮蔽位置との間で枢動可能に支持するヒンジ機構と、を有し、前記ヒンジ機構は、前記上蓋を、前記筐体の軸線方向に変位可能に保持することにより達成される。 In order to solve the above problems, one of the typical vacuum processing devices according to the present invention is a vacuum processing device that processes a sample in a processing chamber, and has a housing for holding the sample inside, an upper lid, and the like. The hinge mechanism has a hinge mechanism that pivotally supports the upper lid between an open position that opens the end portion of the housing and a shielding position that shields the end portion of the housing. , The upper lid is displaceably held in the axial direction of the housing.

本発明によれば、ヒンジ機構を用いた場合でも、同軸性の悪化を抑制できる真空処理装置を提供することができる。
上記した以外の課題、構成及び効果は、以下の実施形態の説明により明らかにされる。
According to the present invention, it is possible to provide a vacuum processing apparatus capable of suppressing deterioration of coaxiality even when a hinge mechanism is used.
Issues, configurations and effects other than those described above will be clarified by the description of the following embodiments.

図1は、一般的なヒンジ機構を持つ真空処理装置の概略断面図である。FIG. 1 is a schematic cross-sectional view of a vacuum processing device having a general hinge mechanism. 図2は、一般的なヒンジ機構をもつ真空処理装置の概略断面図である。FIG. 2 is a schematic cross-sectional view of a vacuum processing device having a general hinge mechanism. 図3は、本発明の実施形態1に関わる真空処理装置の概略断面図である。FIG. 3 is a schematic cross-sectional view of the vacuum processing apparatus according to the first embodiment of the present invention. 図4は、本発明の実施形態1に関わるヒンジ開状態のヒンジ機構を示す拡大断面図である。FIG. 4 is an enlarged cross-sectional view showing the hinge mechanism in the hinge open state according to the first embodiment of the present invention. 図5は、本発明の実施形態1に関わるヒンジ閉状態のヒンジ機構を示す拡大断面図である。FIG. 5 is an enlarged cross-sectional view showing a hinge mechanism in a hinge closed state according to the first embodiment of the present invention. 図6は、本発明の実施形態1に関わるヒンジ閉状態且つ真空排気状態のヒンジ機構を示す拡大断面図である。FIG. 6 is an enlarged cross-sectional view showing a hinge mechanism in a hinge closed state and a vacuum exhaust state according to the first embodiment of the present invention. 図7は、本発明の実施形態2に関わる真空処理装置の概略断面図である。FIG. 7 is a schematic cross-sectional view of the vacuum processing apparatus according to the second embodiment of the present invention. 図8は、本発明の実施形態2に関わるヒンジ閉状態のヒンジ機構及びバネ受け機構を示す拡大断面図である。FIG. 8 is an enlarged cross-sectional view showing a hinge mechanism and a spring receiving mechanism in a hinge closed state according to the second embodiment of the present invention.

以下、図面を用いて本発明の実施形態について説明する。 Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[実施例1]
図3に、実施形態1に係る真空処理装置構成の概略図を示す。本実施形態の真空処理装置は、真空処理室を内部に形成する中空円筒状の筐体1と、真空処理室内で処理される試料2を載置するためのステージ3と、筐体1に設けられたヒンジ機構4と、筐体1の上端を遮蔽する有頂円筒状の上蓋5とにより構成される。ヒンジ機構4は、上蓋5を、筐体1の上端を開放する開放位置と、筐体1の上端部を遮蔽する遮蔽位置との間で枢動可能に支持している。筐体1の上端面と上蓋5の下端面は、それぞれの軸線に対して直交している。筐体1と上蓋5の形状は、以上に限られない。
[Example 1]
FIG. 3 shows a schematic diagram of the vacuum processing apparatus configuration according to the first embodiment. The vacuum processing apparatus of the present embodiment is provided in a hollow cylindrical housing 1 in which a vacuum processing chamber is formed, a stage 3 for placing a sample 2 to be processed in the vacuum processing chamber, and a housing 1. It is composed of the hinge mechanism 4 provided and the eclipsed cylindrical upper lid 5 that shields the upper end of the housing 1. The hinge mechanism 4 pivotally supports the upper lid 5 between an open position where the upper end of the housing 1 is opened and a shielding position where the upper end of the housing 1 is shielded. The upper end surface of the housing 1 and the lower end surface of the upper lid 5 are orthogonal to each axis. The shapes of the housing 1 and the upper lid 5 are not limited to the above.

図4に、実施形態1の開いた状態でのヒンジ機構4の詳細を示す。ヒンジ機構4は、上蓋5の上側突片5aに形成された円形穴(図示せず)に挿通(嵌合)された円筒状のヒンジ軸6と、ヒンジ軸6を上下に変位可能に支持するため筐体1の下側突片1aに形成された長穴ヒンジ穴7と、下側突片1aにおいて長穴ヒンジ穴7に連通するように形成された連通孔1bと、連通孔1b内でヒンジ軸6を下方から付勢するように設置されるバネ機構8と、により構成される。長穴ヒンジ穴7の断面長手方向は、筐体1の軸線方向(上下方向)に沿っている。 FIG. 4 shows the details of the hinge mechanism 4 in the open state of the first embodiment. The hinge mechanism 4 supports a cylindrical hinge shaft 6 inserted (fitted) into a circular hole (not shown) formed in the upper projecting piece 5a of the upper lid 5 and the hinge shaft 6 so as to be displaceable up and down. Therefore, in the long hole hinge hole 7 formed in the lower projecting piece 1a of the housing 1, the communication hole 1b formed in the lower projecting piece 1a so as to communicate with the long hole hinge hole 7, and in the communication hole 1b. It is composed of a spring mechanism 8 installed so as to urge the hinge shaft 6 from below. The longitudinal direction of the cross section of the elongated hole hinge hole 7 is along the axial direction (vertical direction) of the housing 1.

バネ機構8は、連通孔1bの下端にて螺合しバネ機構8の下端を支持するねじ部8aを備える。ねじ部8aを、連通孔1bに対して螺動させることで、ばね付勢力を調整できる。筐体1の上端面に形成された周溝1c内に、Oリングなどの弾性部材からなる真空シール部材9が配置されている。 The spring mechanism 8 includes a threaded portion 8a that is screwed at the lower end of the communication hole 1b to support the lower end of the spring mechanism 8. The spring urging force can be adjusted by screwing the screw portion 8a with respect to the communication hole 1b. A vacuum seal member 9 made of an elastic member such as an O-ring is arranged in the peripheral groove 1c formed on the upper end surface of the housing 1.

本実施形態のバネ機構8は、上蓋5の重量と同じかもしくはそれ以上の重量を支持できる付勢力を有することが望ましい。そうすることで、バネ機構8に支えられたヒンジ軸6は長穴ヒンジ穴7の上端まで持ち上げられて保持され、その位置でヒンジ開閉が行われる。 It is desirable that the spring mechanism 8 of the present embodiment has an urging force capable of supporting a weight equal to or greater than the weight of the upper lid 5. By doing so, the hinge shaft 6 supported by the spring mechanism 8 is lifted and held up to the upper end of the elongated hole hinge hole 7, and the hinge is opened and closed at that position.

図5に、実施形態1の閉じた状態でのヒンジ機構4の詳細を示す。本実施形態において、ヒンジ軸6が長穴ヒンジ穴7の上端に位置するときの中心位置と、長穴ヒンジ穴7の下端に位置するときの中心位置との間の中心間距離Lは、真空シール部材9の潰し代Hと同じかもしくはより小さく設定される(図6参照)。図4、図5に示す状態では、長穴ヒンジ穴7の上端にヒンジ軸6が位置し、図6に示す状態では、長穴ヒンジ穴7の下端にヒンジ軸6が位置する。真空シール部材9の潰し代Hとは、真空シール部材9が潰れる前の状態から、真空シール部材が潰れた後の状態までの圧縮距離をいう。 FIG. 5 shows the details of the hinge mechanism 4 in the closed state of the first embodiment. In the present embodiment, the center-to-center distance L between the center position when the hinge shaft 6 is located at the upper end of the slotted hinge hole 7 and the center position when the hinge shaft 6 is located at the lower end of the slotted hinge hole 7 is a vacuum. It is set to be the same as or smaller than the crushing allowance H of the seal member 9 (see FIG. 6). In the state shown in FIGS. 4 and 5, the hinge shaft 6 is located at the upper end of the long hole hinge hole 7, and in the state shown in FIG. 6, the hinge shaft 6 is located at the lower end of the long hole hinge hole 7. The crushing allowance H of the vacuum seal member 9 refers to the compression distance from the state before the vacuum seal member 9 is crushed to the state after the vacuum seal member is crushed.

上蓋5が閉じた状態では、上蓋5の下端面と、真空シール部材9とが全周で接触する。この状態で、筐体1内の真空処理室を真空源(不図示)と接続(いわゆる真空引き)すれば、真空処理室内の気圧が下がるため上蓋5が筐体1に接近し、真空シール部材9が徐々に潰される。 When the upper lid 5 is closed, the lower end surface of the upper lid 5 and the vacuum seal member 9 come into contact with each other on the entire circumference. In this state, if the vacuum processing chamber in the housing 1 is connected to a vacuum source (not shown) (so-called evacuation), the air pressure in the vacuum processing chamber drops, so that the upper lid 5 approaches the housing 1 and the vacuum seal member. 9 is gradually crushed.

図6に、実施形態1の真空処理室が負圧とされた後のヒンジ機構の詳細を示す。筐体1内の真空処理室が負圧とされた後、負圧による引き込み力で上蓋5およびヒンジ軸6は、長穴ヒンジ穴7の下端まで下降し、上蓋5の下端面と筐体1の上端面が、真空シール部材9を介在させつつ完全に密着する。筐体1の上端面は、機械加工により精度の良い平面となっており、上蓋5と筐体1が密着することにより、上蓋5の軸線は筐体1の軸線と平行(好ましくは合致)するように設置される。ステージ3と筐体1の同軸性は予め確保されているため、閉じた上蓋5と、ステージ3および試料2の同軸性が損なわれることなく、これにより同軸性を備えた真空処理室を構成することができる。また、本実施形態によれば、バネ機構8によりヒンジ軸6が付勢されているため、組み立て工程中にヒンジ機構の高さ調整を行う必要がない。これにより、組み立て時間を短縮できるため製造コストの上昇を抑えることができる。 FIG. 6 shows the details of the hinge mechanism after the vacuum processing chamber of the first embodiment has a negative pressure. After the vacuum processing chamber in the housing 1 is made negative pressure, the upper lid 5 and the hinge shaft 6 are lowered to the lower end of the elongated hole hinge hole 7 by the pulling force due to the negative pressure, and the lower end surface of the upper lid 5 and the housing 1 The upper end surface of the is completely adhered with the vacuum seal member 9 interposed therebetween. The upper end surface of the housing 1 is made into a flat surface with high accuracy by machining, and the axis of the upper lid 5 is parallel (preferably aligned) with the axis of the housing 1 due to the close contact between the upper lid 5 and the housing 1. Will be installed. Since the coaxiality between the stage 3 and the housing 1 is secured in advance, the coaxiality of the closed upper lid 5 and the stage 3 and the sample 2 is not impaired, thereby forming a vacuum processing chamber having coaxiality. be able to. Further, according to the present embodiment, since the hinge shaft 6 is urged by the spring mechanism 8, it is not necessary to adjust the height of the hinge mechanism during the assembly process. As a result, the assembly time can be shortened, and an increase in manufacturing cost can be suppressed.

以上述べた本実施形態によれば、真空処理装置の製造工程においてヒンジ機構の調整が不要となり製造コストの低減につながるとともに、ヒンジ調整に伴う真空処理室の同軸性悪化を防止できるため半導体デバイスの歩留まり改善につながる。 According to the present embodiment described above, the hinge mechanism does not need to be adjusted in the manufacturing process of the vacuum processing apparatus, which leads to a reduction in manufacturing cost and prevents deterioration of the coaxiality of the vacuum processing chamber due to the hinge adjustment. It leads to improvement of yield.

[実施例2]
図7に、実施形態2に係る真空処理装置の概略図を示す。本実施形態の真空処理装置は、真空処理室を内部に形成する中空円筒状の筐体1と、真空処理室内で処理される試料2を載置するためのステージ3と、筐体1に設けられたヒンジ機構4と、ヒンジ機構4により枢動可能に支持される上蓋5と、筐体1においてヒンジ機構4とは中心軸を挟んで反対側に設置されたバネ受け機構10とにより構成される。なお、上述の実施形態と同様な構成については同じ符号を付し、異なる点を中心に説明する。
[Example 2]
FIG. 7 shows a schematic view of the vacuum processing apparatus according to the second embodiment. The vacuum processing apparatus of the present embodiment is provided in the hollow cylindrical housing 1 forming the vacuum processing chamber inside, the stage 3 for placing the sample 2 to be processed in the vacuum processing chamber, and the housing 1. It is composed of a hinge mechanism 4 provided, an upper lid 5 pivotally supported by the hinge mechanism 4, and a spring receiving mechanism 10 installed on the opposite side of the hinge mechanism 4 from the hinge mechanism 4 in the housing 1. To. The same configurations as those in the above-described embodiment are designated by the same reference numerals, and different points will be mainly described.

図8に、実施形態2におけるヒンジ機構4、及びバネ受け機構10の詳細を示す。ヒンジ機構4は、実施形態1と同様に、上蓋5の上側突片5aに形成された円形穴(図示せず)に挿通されたヒンジ軸6と、ヒンジ軸6を上下に変位可能に支持するため筐体1の下側突片1aに形成された長穴ヒンジ穴7と、下側突片1aにおいて長穴ヒンジ穴7に連通するように形成された連通孔1bと、連通孔1b内でヒンジ軸6を下方から付勢するように設置されるバネ機構8と、により構成される。 FIG. 8 shows the details of the hinge mechanism 4 and the spring receiving mechanism 10 in the second embodiment. Similar to the first embodiment, the hinge mechanism 4 supports the hinge shaft 6 inserted into the circular hole (not shown) formed in the upper projecting piece 5a of the upper lid 5 and the hinge shaft 6 so as to be displaceable up and down. Therefore, in the long hole hinge hole 7 formed in the lower projecting piece 1a of the housing 1, the communication hole 1b formed in the lower projecting piece 1a so as to communicate with the long hole hinge hole 7, and in the communication hole 1b. It is composed of a spring mechanism 8 installed so as to urge the hinge shaft 6 from below.

バネ受け機構10は、筐体1の突片1dに形成された貫通孔1e内から上方に突出するように設けられた突出部材10aと、突出部材10aを上方に付勢するコイルばね10bと、貫通孔1eに取り付けられコイルばね10bの下端を支持する支持部材10cとを有する。 The spring receiving mechanism 10 includes a projecting member 10a provided so as to project upward from the inside of the through hole 1e formed in the projecting piece 1d of the housing 1, a coil spring 10b for urging the projecting member 10a upward, and the spring receiving mechanism 10. It has a support member 10c that is attached to the through hole 1e and supports the lower end of the coil spring 10b.

長穴ヒンジ穴7の中心間距離Lは実施形態1と同様、真空シール部材9の潰し代Hと同等かそれ以下で設定される。一方、バネ受け機構10の突出部材10aの突出量Xも長穴ヒンジ穴7中心間距離Lと同じ寸法に設定されている。そのため、図2のように上蓋5が閉じた状態のとき、上蓋5の下端面は水平に保持される。 The center-to-center distance L of the elongated hole hinge hole 7 is set to be equal to or less than the crushing allowance H of the vacuum seal member 9 as in the first embodiment. On the other hand, the protruding amount X of the protruding member 10a of the spring receiving mechanism 10 is also set to the same dimension as the distance L between the centers of the elongated hole hinge holes 7. Therefore, when the upper lid 5 is closed as shown in FIG. 2, the lower end surface of the upper lid 5 is held horizontally.

真空シール部材9は繰返し使用することで微小な塑性変形が生じるため、少しずつ潰し代Hが減少する。そのため実施形態1のようにヒンジ機構4が片持ち構造である場合、真空シール部材9の潰し代Hが減少した状態で上蓋5を閉じると、その減少具合に応じて上蓋5が傾くおそれがある。最終的に真空処理室内が真空になり上蓋5が筐体1に完全に密着した状態になるとこの傾きは解消されるが、傾いた状態で上蓋5が下降するため、構成部品同士が干渉するなどして傷つく恐れがある。これに対し、実施形態2では、筐体1の軸線を挟んでヒンジ機構4の反対側にバネ受け機構10を設けたため、上蓋5を閉じる際に傾くことが無い。 Since the vacuum seal member 9 undergoes minute plastic deformation due to repeated use, the crushing allowance H gradually decreases. Therefore, when the hinge mechanism 4 has a cantilever structure as in the first embodiment, if the upper lid 5 is closed while the crushing allowance H of the vacuum seal member 9 is reduced, the upper lid 5 may be tilted according to the degree of reduction. .. When the vacuum processing chamber is finally evacuated and the upper lid 5 is in a state of being completely in close contact with the housing 1, this inclination is eliminated, but since the upper lid 5 is lowered in the inclined state, the components interfere with each other. There is a risk of being hurt. On the other hand, in the second embodiment, since the spring receiving mechanism 10 is provided on the opposite side of the hinge mechanism 4 with the axis of the housing 1 interposed therebetween, the upper lid 5 is not tilted when the upper lid 5 is closed.

なお、実施形態2において真空シール部材9の潰し代Hが減少した場合、ヒンジ機構4とバネ受け機構10の両持ち構造により上蓋5が支持された状態になるため、閉じた上蓋5と真空シール部材9との間に隙間ができてしまい、真空引き時に該隙間から外気を吸い込むおそれがある。そのため、実施形態2においては、上蓋5を上方より押さえつけるようなネジ機構(不図示)を備えることが望ましい。このようなネジ機構は真空排気を開始するためのきっかけを提供するもので足りるため、大きな力で締め付ける必要がない。そのため、作業時間短縮のために工具を使わず手で回すことのできるローレットノブなどを用いたものであることが望ましい。実施形態2の構成によれば、作業時間の増加を招くことなく、精度よく真空処理装置を設置することができる。 When the crushing allowance H of the vacuum seal member 9 is reduced in the second embodiment, the upper lid 5 is supported by the double-sided structure of the hinge mechanism 4 and the spring receiving mechanism 10, so that the closed upper lid 5 and the vacuum seal are sealed. A gap is formed between the member 9 and the member 9, and there is a risk that outside air may be sucked through the gap during evacuation. Therefore, in the second embodiment, it is desirable to provide a screw mechanism (not shown) for pressing the upper lid 5 from above. Since such a screw mechanism is sufficient to provide a trigger for starting vacuum exhaust, it does not need to be tightened with a large force. Therefore, in order to shorten the working time, it is desirable to use a knurled knob or the like that can be turned by hand without using a tool. According to the configuration of the second embodiment, the vacuum processing apparatus can be installed with high accuracy without increasing the working time.

なお、本発明は上記した実施の形態に限定されるものではなく、様々な変形例が含まれる。例えば、上記した実施の形態は本発明を分かりやすく説明するために詳細に説明したものであり、必ずしも説明した全ての構成を備えるものに限定されるものではない。また、ある実施の形態における構成の一部を他の実施の形態の構成に置き換えることが可能であり、また、ある実施の形態の構成に他の実施の形態の構成を加えることも可能である。また、各実施の形態における構成の一部について、他の構成の追加・削除・置換をすることも可能である。 The present invention is not limited to the above-described embodiment, and includes various modifications. For example, the above-described embodiment has been described in detail in order to explain the present invention in an easy-to-understand manner, and is not necessarily limited to the one including all the described configurations. Further, it is possible to replace a part of the configuration in one embodiment with the configuration of another embodiment, and it is also possible to add the configuration of another embodiment to the configuration of one embodiment. .. Further, it is also possible to add / delete / replace a part of the configuration in each embodiment with another configuration.

1・・・筐体
2・・・試料
3・・・ステージ
4・・・ヒンジ機構
5・・・上蓋
6・・・ヒンジ軸
7・・・長穴ヒンジ穴
8・・・バネ機構
9・・・真空シール部材
10・・・バネ受け機構
1 ... Housing 2 ... Sample 3 ... Stage 4 ... Hinge mechanism 5 ... Top lid 6 ... Hinge shaft 7 ... Long hole hinge hole 8 ... Spring mechanism 9 ...・ Vacuum seal member 10 ・ ・ ・ Spring receiving mechanism

Claims (6)

処理室内で試料を加工する真空処理装置であって、
試料を内部に保持する筐体と、
上蓋と、
前記上蓋を、前記筐体の端部を開放する開放位置と、前記筐体の端部を遮蔽する遮蔽位置との間で枢動可能に支持するヒンジ機構と、を有し、
前記ヒンジ機構は、前記上蓋を、前記筐体の軸線方向に変位可能に保持する真空処理装置。
A vacuum processing device that processes a sample in a processing room.
A housing that holds the sample inside and
With the top lid
The upper lid has a hinge mechanism that pivotally supports the upper lid between an open position that opens the end portion of the housing and a shielding position that shields the end portion of the housing.
The hinge mechanism is a vacuum processing device that holds the upper lid in a displaceable manner in the axial direction of the housing.
請求項1記載の真空処理装置であって、
前記ヒンジ機構は、前記上蓋に設けられた穴に嵌合するヒンジ軸と、前記筐体に設けられ前記ヒンジ軸を保持する長穴ヒンジ穴とを有し、前記ヒンジ軸は前記長穴ヒンジ穴の断面長手方向に変位可能である真空処理装置。
The vacuum processing apparatus according to claim 1.
The hinge mechanism has a hinge shaft that fits into a hole provided in the upper lid and a long hole hinge hole that is provided in the housing and holds the hinge shaft, and the hinge shaft has the long hole hinge hole. A vacuum processing device that can be displaced in the longitudinal direction of the cross section.
請求項2に記載の真空処理装置であって、
前記上蓋と前記筐体との間に真空シール部材が配置され、
前記ヒンジ軸が、前記長穴ヒンジ穴の上端に位置するときの中心位置と、前記長穴ヒンジ穴の下端に位置するときの中心位置との間の中心間距離Lは、前記真空シール部材の潰し代Hと同じかもしくはより小さく設定されることを特徴とする真空処理装置。
The vacuum processing apparatus according to claim 2.
A vacuum seal member is arranged between the upper lid and the housing.
The center-to-center distance L between the center position when the hinge shaft is located at the upper end of the slotted hinge hole and the center position when the hinge shaft is located at the lower end of the slotted hinge hole is the vacuum seal member. A vacuum processing apparatus characterized in that it is set to be the same as or smaller than the crushing allowance H.
請求項2又は請求項3に記載の真空処理装置であって、
前記ヒンジ機構は、前記ヒンジ軸を前記長穴ヒンジ穴の上端に向かって付勢するバネ機構を有する真空処理装置。
The vacuum processing apparatus according to claim 2 or 3.
The hinge mechanism is a vacuum processing device having a spring mechanism for urging the hinge shaft toward the upper end of the elongated hole hinge hole.
請求項4に記載の真空処理装置であって、
前記バネ機構は、前記上蓋の重量と同じかもしくはそれ以上の重量を支持できる付勢力を有することを特徴とする真空処理装置。
The vacuum processing apparatus according to claim 4.
The spring mechanism is a vacuum processing device having an urging force capable of supporting a weight equal to or greater than the weight of the upper lid.
請求項1乃至請求項5のいずれか一項に記載の真空処理装置であって、
前記筐体の軸線を挟んで前記ヒンジ機構とは反対側に、閉じた状態の前記上蓋を支持するバネ受け機構を有することを特徴とする真空処理装置。
The vacuum processing apparatus according to any one of claims 1 to 5.
A vacuum processing device characterized by having a spring receiving mechanism for supporting the upper lid in a closed state on the side opposite to the hinge mechanism with the axis of the housing interposed therebetween.
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