JP2021077745A - Electronic control device - Google Patents

Abstract

To suppress an increase in temperature of an electronic component in an electronic control device in which the electronic component is mounted in a connector connection region of a circuit board.SOLUTION: An electronic control device (1) is provided that comprises: circuit boards (1,41,61,71); a connector (4) connected to the circuit boards; and electronic components (6) mounted on the surfaces of the circuit boards. The circuit board has a connector connection region (A) including a region to which a connector pin (8) of the connector is connected. At least one of electronic components is located within the connector connection region, and is mounted on the surface of the circuit board, a dummy component (9) is mounted on the circuit board while being located at a back side of an electronic component (6A) mounted in the connector connection region.SELECTED DRAWING: Figure 1

Description

The present invention relates to an electronic control device including a circuit board, a connector connected to the circuit board, and electronic components mounted on the surface of the circuit board.

For example, an electronic control device such as an in-vehicle engine ECU is configured to include, for example, a circuit board on which electronic components are mounted, a connector connected to the circuit board, or the like in a metal housing. In this case, for example, a region to which the connector is connected is provided on one side of the circuit board, and a plurality of through holes for connecting the connector pins are provided in this region. Then, with the plurality of connector pins of the connector inserted into each through hole, soldering is performed by flow soldering on the back surface side of the circuit board, that is, the surface opposite to the connector mounting surface (the surface is opposite to the connector mounting surface). For example, see Patent Document 1).

JP-A-2002-280717

By the way, as the electronic components mounted on the circuit board as described above, surface mount components are often used, and some surface mount components do not have through holes in the connector connection region on the surface of the circuit board. By mounting at the position, the mounting density is increased. On the other hand, as described above, flow soldering is used to connect the connector pins to the circuit board. In this flow soldering, the temperature of the molten solder is raised and the immersion time and thus the working time are shortened. Attempts are being made.

However, if the temperature of the molten solder during flow soldering is raised in this way, the high temperature heat of the solder is transmitted to the surface mount components already mounted in the connector connection area on the surface side of the circuit board, which has an adverse effect. There is a concern that it will end up. At present, even if the temperature of the surface mount component rises, it is desired to keep it below the guaranteed temperature.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an electronic control device in which an electronic component is mounted in a connector connection region of a circuit board and which can suppress a temperature rise of the electronic component. To provide.

In order to achieve the above object, the first electronic control device of the present invention includes a circuit board (1, 41, 61, 71), a connector (4) connected to the circuit board, and a surface of the circuit board. The circuit board has a connector connection area (A) including a region to which the connector pin (8) of the connector is connected, and the electronic component is provided with the electronic component (6) mounted on the circuit board. At least one of the above is mounted in the connector connection region, and is located on the back surface side of the electronic component (6A) mounted in the connector connection region on the circuit board, and is a dummy component (dummy component). 9) is implemented

In the above configuration, the dummy component is mounted on the back side of the electronic component mounted in the connector connection area of the circuit board. By mounting the dummy component, the heat capacity of that portion is increased, and it is possible to suppress heat transfer from the back surface side of the circuit board to the electronic component in the connector connection region on the front surface side, for example, during flow soldering. .. As a result, in the case where the electronic component is mounted in the connector connection region of the circuit board, the excellent effect that the temperature rise of the electronic component can be suppressed can be obtained.
As the dummy component, for example, a 0 ohm resistor or the like can be adopted, and it can be provided so as not to affect the pattern of the circuit board.

The second electronic control device of the present invention includes a circuit board (21, 41, 51, 71), a connector (4) connected to the circuit board, and an electronic component (6) mounted on the surface of the circuit board. The circuit board has a connector connection area (A) including a region to which the connector pin (8) of the connector is connected, and at least one of the electronic components is the connector connection. The inner layer conductor patterns (23, 43, 53, 73) are mounted on the circuit board at a position corresponding to the electronic component (6A) mounted in the connector connection region. It is installed in a detached position.

In the above configuration, the inner layer conductor pattern provided on the circuit board is in a detached state that does not exist at a position corresponding to the electronic component mounted in the connector connection region. Here, since the inner layer conductor pattern has better thermal conductivity than the insulating material constituting the circuit board, the other portion where the inner layer conductor pattern exists at the position corresponding to the electronic component mounted in the connector connection region. The thermal conductivity is lower than that of. Therefore, for example, during flow soldering, heat transfer from the back surface side of the circuit board to the electronic component in the connector connection region on the front surface side can be suppressed. As a result, in the case where the electronic component is mounted in the connector connection region of the circuit board, it is possible to suppress the temperature rise of the electronic component, which is an excellent effect.

The third electronic control device of the present invention includes a circuit board (31, 51, 61, 71), a connector (4) connected to the circuit board, and an electronic component (6) mounted on the surface of the circuit board. The circuit board has a connector connection area (A) including a region to which the connector pin (8) of the connector is connected, and at least one of the electronic components is the connector connection. Along with being mounted within the region, the circuit board is provided with a solder resist layer, and at least on the back surface of the circuit board, an electronic component (6A) mounted in the connector connection region. For the corresponding portion, the solder resist layer (33, 54, 63, 74) is provided thicker than the other regions.

In the above configuration, the solder resist layer is provided thicker than other regions on at least the portion of the back surface of the circuit board corresponding to the electronic component mounted in the connector connection region. Since the solder resist has a thermal resistance, the thick structure of the solder resist layer increases the thermal resistance of that part. For example, when flow soldering, the connector connection on the front side from the back side of the circuit board It is possible to suppress heat transfer to electronic components in the region. As a result, in the case where the electronic component is mounted in the connector connection region of the circuit board, it is possible to suppress the temperature rise of the electronic component, which is an excellent effect.

Further, in the above configuration, three means are adopted in order to suppress heat transfer to the electronic component in the connector connection region on the surface side of the circuit board. That is, by providing a dummy component, the first means for increasing the heat capacity of that portion, the inner layer conductor pattern of the circuit board, is brought into a detached state that does not exist at a position corresponding to the electronic component in the connector connection region. The second means of reducing the thermal conductivity of this part, the solder resist layer of the part corresponding to the electronic component of the connector connection area of the circuit board is provided thicker than the other parts to increase the thermal resistance of that part. This is the third means. Any two of these three means can be combined, or all three can be combined.

The first embodiment is shown, and the vertical sectional front view which shows the structure of the circuit board schematicly. Plan view of circuit board Enlarged bottom view of dummy parts Longitudinal front view of electronic control unit The figure which shows the state at the time of flow soldering schematically Longitudinal front view of a circuit board showing a second embodiment Longitudinal front view of a circuit board showing a third embodiment Longitudinal front view of a circuit board showing a fourth embodiment Longitudinal front view of a circuit board showing a fifth embodiment Longitudinal front view of a circuit board showing a sixth embodiment Longitudinal front view of a circuit board showing a seventh embodiment

Hereinafter, some embodiments applied to an in-vehicle engine ECU (Electronic Control Unit) will be described with reference to the drawings. The parts common to the plurality of embodiments are designated by the same reference numerals, and detailed description and new illustrations will be omitted. Further, FIG. 1 and the like are cross-sectional views showing the circuit board in a vertical cross section, but hatching is omitted as necessary for easy understanding.

(1) First Embodiment The first embodiment will be described with reference to FIGS. 1 to 5. FIG. 4 schematically shows the overall configuration of the electronic control device 1 according to the present embodiment. The electronic control device 1 is configured by accommodating a circuit board 3 in a housing 2 having a substantially rectangular box shape that is thin in the vertical direction in the drawing. Along with this, a connector 4 for connecting to the outside is provided on the left wall portion in the drawing of the housing 2. The housing 2 is configured by abutting and joining a thin rectangular box-shaped case 2a having an opening on the lower surface and a cover 2b that closes the opening on the lower surface. The case 2a and the cover 2b are made of a metal such as aluminum or iron.

Here, the configurations of the circuit board 3 and the connector 4 will be described with reference to FIGS. 1 to 3. As shown in FIG. 1, the circuit board 3 has ICs, diodes, capacitors, resistors, etc. on both sides of the multilayer wiring board 5, that is, the first surface 5a (upper surface in the figure) and the second surface 5b (lower surface in the figure). A control circuit or the like is configured by mounting a plurality of electronic components 6. As the electronic component 6, a chip-type surface mount component is used, and is connected to the lands of the first surface 5a and the second surface 5b of the multilayer wiring board 5 by, for example, reflow soldering. In the figure, the soldered portion of the electronic component 6 is a solder connecting portion 7. Although not shown in detail, both sides of the multilayer wiring board 5 are covered with solder resist except for the land portion.

As shown in FIG. 2, the connector 4 is configured to have a plurality of connector pins 8 in a connector housing 4a made of an insulating material, and is located on the left side of the multilayer wiring board 5 in the drawing. It is provided so as to extend in the front-rear direction along the line. At this time, although not shown in detail, the connector 4 is provided in a form of being divided into a plurality of blocks in the front-rear direction in the drawing. Although it does not use a kitchen, a plurality of through holes to which the connector pins 8 are connected are provided in the area on the left side of the multilayer wiring board 5 in the figure so as to penetrate the multilayer wiring board 5 vertically.

The connector housing 4a is attached to the left end portion of the first surface 5a of the multilayer wiring board 5. Each connector pin 8 is inserted into a plurality of through holes of the multilayer wiring board 5 from the first surface 5a side and projects toward the second surface 5b side. Then, as will be described later, the tip end portion of each connector pin 8 is soldered on the second surface 5b by flow soldering. In the present embodiment, the region on the left side of the multilayer wiring board 5 of the circuit board 3 to which the connector pins 8 are connected, that is, the region where the through holes are formed is defined as the connector connection region A.

As shown in FIGS. 2 and 1, the circuit board 3 is located in the connector connection area A of the first surface 5a of the multilayer wiring board 5, and is partially one electronic component 6 in this case. Is implemented. In order to distinguish this electronic component from other electronic components 6, it is referred to as an electronic component 6A directly under the connector. Then, in the present embodiment, as shown in FIGS. 3 and 5, the circuit board 3 is located on the back surface side of the electronic component 6A directly under the connector mounted in the connector connection area A, and is a surface mount component. A dummy component 9 made of the above is mounted.

The dummy component 9 is composed of, for example, a chip-type 0Ω resistor. In this case, as shown in FIG. 3, the wiring pattern 10 is formed on the back surface side of the electronic component 6A directly under the connector on the second surface 5b of the multilayer wiring board 5. A resist opening B to which solder resist is not applied is formed on a portion of the second surface 5b of the multilayer wiring board 5 on which the dummy component 9 is to be mounted, and the wiring pattern 10 is exposed. The dummy component 9 is connected to the exposed portion of the wiring pattern 10 by a solder connecting portion 7. The wiring pattern 10 may constitute a circuit or may be an independent wiring pattern that is not electrically connected to other parts.

Next, the process of mounting components on the circuit board 3 having the above configuration will be briefly described with reference to FIG. In assembling the circuit board 3, the electronic component 6 including the electronic component 6A directly under the connector is mounted on each of the first surface 5a and the second surface 5b of the multilayer wiring board 5. In this mounting, the steps of applying solder paste to the lands, temporarily fixing the electronic component 6 and the electronic component 6A directly under the connector to the first surface 5a and the second surface 5b of the multilayer wiring board 5, and reflow soldering are executed. As a result, each electronic component 6 including the electronic component 6A directly under the connector is mounted on the multilayer wiring board 5 by the solder connecting portion 7. At this time, when the electronic component 6 is mounted on the second surface 5b of the multilayer wiring board 5, the dummy component 9 is also mounted.

After mounting the electronic components 6 and the like on the multilayer wiring board 5, the connector 4 is mounted. Flow soldering is used for this mounting. In this flow soldering, as schematically shown in FIG. 5, in a solder bath in which molten solder is stored, a molten solder jet S in which molten solder is blown upward by driving a pump is provided. On the other hand, in the multilayer wiring board 5, the connector 4 is held in a temporarily fixed state in a form in which each connector pin 8 is inserted into each through hole. In this state, the multilayer wiring board 5 is passed through the second surface 5b, that is, the lower surface of FIG. 1 and the like while applying the molten solder jet S, so that the soldering of each through hole of each connector pin 8 to the land can be performed. Will be done.

According to such a first embodiment, the following actions and effects can be obtained. That is, in the electronic control device 1 of the present embodiment, the dummy component 9 is mounted on the circuit board 3 located on the back surface side of the electronic component 6A directly under the connector mounted in the connector connection area A. Due to the configuration in which the dummy component 9 is mounted, the circuit board 3 has a large heat capacity of the mounting portion of the electronic component 6A directly under the connector. Therefore, it is possible to suppress heat transfer from the second surface 5b side of the circuit board 3 to the electronic component 6A directly under the connector in the connector connection region A on the first surface 5a side at the time of flow soldering when the connector 4 is connected.

As a result, according to the electronic control device 1 of the first embodiment, the electronic component 6A directly under the connector is mounted on the connector connection region A of the circuit board 3, and the temperature rise of the electronic component 6A directly under the connector is suppressed. It has an excellent effect of being able to do it. As a result, even if the temperature of the molten solder in the flow soldering is raised, the adverse effect on the electronic component 6A directly under the connector can be prevented, the immersion time can be shortened, and the work efficiency can be improved. It goes without saying that the mounting density of the circuit board 3 can be improved by mounting the electronic component 6A directly under the connector in the connector connection area A.

(2) Second Embodiment Next, the second embodiment will be described with reference to FIG. The difference between this second embodiment and the first embodiment is the configuration of the circuit board 21. That is, the circuit board 21 has a plurality of electronic components 6 mounted on both sides of the multilayer wiring board 22, that is, the first surface 22a (upper surface in the figure) and the second surface 22b (lower surface in the figure), and further, the first surface. The connector 4 is mounted on the surface 22a, and the electronic component 6A directly under the connector is mounted on the connector connection area A.

At this time, the multilayer wiring board 22 is configured by alternately laminating an insulating layer and an inner layer conductor pattern, but in the present embodiment, the GND inner layer pattern 23 as the inner layer conductor pattern (for convenience, hatching is performed. (Shown with reference to) is provided at a position deviating from the position corresponding to the electronic component 6A directly under the connector mounted in the connector connection area A. That is, the GND inner layer pattern 23 is missing from the portion directly under the electronic component 6A directly under the connector. The dummy component 9 is not mounted on the portion of the second surface 22b of the multilayer wiring board 22 corresponding to the back surface side of the connector connection region A. Further, the resist opening B does not exist, and the entire area is covered with the resist except for the land of the through hole.

Even in the circuit board 21 having the above configuration, as in the first embodiment, the electronic component 6 including the electronic component 6A directly under the connector is provided for each of the first surface 22a and the second surface 22b of the multilayer wiring board 22. Mounting is done using reflow soldering. Then, after that, the connector 4 is mounted by using flow soldering. In the present embodiment, the inner layer GND pattern 23 as the inner layer conductor pattern provided on the circuit board 21 is in a detached state that does not exist at a position corresponding to the electronic component 6A directly under the connector mounted in the connector connection region A. ing.

Since the inner layer GND pattern 23 has better thermal conductivity than the insulating material constituting the multilayer wiring board 22, the inner layer GND pattern 23 is located at a position corresponding to the electronic component 6A directly under the connector mounted in the connector connection region A. The thermal conductivity is lower than in other parts where. Therefore, it is possible to suppress heat transfer from the back surface side of the circuit board 21 to the electronic component 6A directly under the connector in the connector connection region A on the front surface side during flow soldering.

As a result, also in the second embodiment, similarly to the first embodiment, the electronic component 6A directly under the connector is mounted in the connector connection area A of the circuit board 21, and the electronic component 6A directly under the connector is mounted. It has an excellent effect of being able to suppress the temperature rise of the connector. Further, in the present embodiment, the inner layer GND pattern 23 has a higher degree of freedom in which part and which route of the circuit board 21 is provided as compared with other inner layer conductor patterns, so that the target configuration is relatively high. It can be easily provided. In this embodiment, since additional parts such as the dummy part 9 are not required, the manufacturing cost can be reduced accordingly.

(3) Third Embodiment Next, the third embodiment will be described with reference to FIG. 7. The difference between this third embodiment and the first embodiment is the configuration of the circuit board 31. That is, in this circuit board 31, a plurality of electronic components 6 are mounted on both sides of the multilayer wiring board 32, that is, the first surface 32a (upper surface in the figure) and the second surface 32b (lower surface in the figure), and further, the first surface The connector 4 is mounted on the surface 32a, and the electronic component 6A directly under the connector is mounted on the connector connection area A.

At this time, a solder resist is applied to both surfaces of the multilayer wiring board 32 except for the land portion to provide a solder resist layer (not shown as a whole), but the second multilayer wiring board 32 is provided. A thick solder resist layer 33 is provided on the surface 32b, which corresponds to the electronic component 6A directly under the connector mounted on the connector connection region A, in which the solder resist layer is thicker than the other regions. To give a specific example, the thickness dimension of the solder resist layer is, for example, 40 μm, whereas the thickness dimension of the thick solder resist layer 33 is, for example, 80 μm, which is about twice as thick.

In the circuit board 31 having the above configuration, the solder resist layer is thicker than the other regions in the portion of the second surface 32b of the circuit board 31 corresponding to the electronic component 6A directly under the connector mounted in the connector connection region A. A thick solder resist layer 33 is provided. Since the solder resist layer has a thermal resistance, the thermal resistance of that portion is increased by providing the thick solder resist layer 33 having a larger thickness than the other portions. Therefore, it is possible to suppress heat transfer from the back surface side of the circuit board 31 to the electronic component 6A directly under the connector in the connector connection region A on the front surface side during flow soldering.

As a result, according to the third embodiment, similarly to the first and second embodiments, the electronic component 6A directly under the connector is mounted on the connector connection area A of the circuit board 31, and the connector is concerned. It has an excellent effect that the temperature rise of the electronic component 6A directly underneath can be suppressed. Further, in the present embodiment, it can be realized by a simple configuration in which the thickness dimension of a part of the solder resist layer on the second surface 32b of the multilayer wiring board 32 is increased. In the third embodiment, only the portion of the solder resist layer corresponding to the electronic component 6A directly under the connector is thickly configured, but a wide region including not only that region but also the surroundings, for example, the entire connector connection region A. The solder resist layer can also be made thicker in the above.

(4) Fourth to Seventh Embodiments and Other Embodiments FIGS. 8, 9, 10, and 11 show the fourth, fifth, sixth, and seventh embodiments, respectively. , Hereinafter, these embodiments will be described in order. Here, in the first embodiment described above, the heat capacity of this portion is increased by providing a dummy component 9 as a means for suppressing the temperature rise of the electronic component 6A directly under the connector. This is referred to as the first means.

As a means for suppressing the temperature rise of the electronic component 6A directly under the connector, in the second embodiment, the inner layer GND pattern 23 of the circuit board 21 is removed from the position corresponding to the electronic component 6A directly under the connector. By doing so, the thermal conductivity of this part was reduced. This is referred to as a second means. In the third embodiment, the thermal resistance of this portion is increased by providing the thick solder resist layer 33 in the portion of the circuit board 31 corresponding to the electronic component 6A directly under the connector. This is referred to as a third means.

FIG. 8 shows the configuration of the circuit board 41 according to the fourth embodiment. In this fourth embodiment, the first means and the second means are combined. That is, the circuit board 41 has a plurality of electronic components 6 mounted on both sides of the multilayer wiring board 42, that is, the first surface 42a (upper surface in the figure) and the second surface 42b (lower surface in the figure), and further, the first surface. The connector 4 is mounted on the 42a, and the electronic component 6A directly under the connector is mounted on the connector connection area A.

A dummy component 9 made of a surface mount component is mounted on the second surface 42b of the circuit board 41 located on the back surface side of the electronic component 6A directly under the connector. At the same time, the inner layer GND pattern 43 as the inner layer conductor pattern provided on the circuit board 41 is in a detached state that does not exist at a position corresponding to the electronic component 6A directly under the connector mounted in the connector connection area A. .. According to such a fourth embodiment, the electronic component 6A directly under the connector is mounted in the connector connection region A of the circuit board 41, and the temperature rise of the electronic component 6A directly under the connector can be suppressed. It has an excellent effect.

FIG. 9 shows the configuration of the circuit board 51 according to the fifth embodiment. In this fifth embodiment, the second means and the third means are combined. That is, the circuit board 51 has a plurality of electronic components 6 mounted on both sides of the multilayer wiring board 52, that is, the first surface 52a (upper surface in the figure) and the second surface 52b (lower surface in the figure), and further, the first surface. The connector 4 is mounted on the 52a, and the electronic component 6A directly under the connector is mounted on the connector connection area A.

The inner layer GND pattern 53 as the inner layer conductor pattern provided on the circuit board 51 is in a detached state that does not exist at a position corresponding to the electronic component 6A directly under the connector mounted in the connector connection region A. .. At the same time, in the portion of the second surface 52b of the circuit board 51 corresponding to the electronic component 6A directly under the connector mounted in the connector connection region A, the solder resist layer is thicker than the other regions. 54 is provided. According to the fifth embodiment, the electronic component 6A directly under the connector is mounted in the connector connection region A of the circuit board 51, and the temperature rise of the electronic component 6A directly under the connector can be suppressed. It has an excellent effect.

FIG. 10 shows the configuration of the circuit board 61 according to the sixth embodiment. In this sixth embodiment, the first means and the third means are combined. That is, the circuit board 61 has a plurality of electronic components 6 mounted on both sides of the multilayer wiring board 62, that is, the first surface 62a (upper surface in the figure) and the second surface 62b (lower surface in the figure), and further, the first surface. The connector 4 is mounted on the 62a, and the electronic component 6A directly under the connector is mounted on the connector connection area A.

A dummy component 9 made of a surface mount component is mounted on the second surface 62b of the circuit board 61, located on the back surface side of the electronic component 6A directly under the connector. At the same time, in the portion of the second surface 62b of the circuit board 61 corresponding to the electronic component 6A directly under the connector mounted in the connector connection region A, the solder resist layer is thicker than the other regions. 63 is provided. According to the sixth embodiment, the electronic component 6A directly under the connector is mounted in the connector connection region A of the circuit board 61, and the temperature rise of the electronic component 6A directly under the connector can be suppressed. It has an excellent effect.

FIG. 11 shows the configuration of the circuit board 71 according to the seventh embodiment. In this seventh embodiment, the first means and the second means described above. The three of the third means are combined. That is, the circuit board 71 has a plurality of electronic components 6 mounted on both sides of the multilayer wiring board 72, that is, the first surface 72a (upper surface in the figure) and the second surface 72b (lower surface in the figure), and further, the first surface. The connector 4 is mounted on the 62a, and the electronic component 6A directly under the connector is mounted on the connector connection area A.

A dummy component 9 made of a surface mount component is mounted on the second surface 72b of the circuit board 71, located on the back surface side of the electronic component 6A directly under the connector. At the same time, the inner layer GND pattern 73 as the inner layer conductor pattern provided on the circuit board 71 is in a detached state that does not exist at a position corresponding to the electronic component 6A directly under the connector mounted in the connector connection area A. .. Further, in the portion of the second surface 72b of the circuit board 71 corresponding to the electronic component 6A directly under the connector mounted in the connector connection region A, the solder resist layer 74 is thicker than the other regions. Is provided. According to such a seventh embodiment, the electronic component 6A directly under the connector is mounted in the connector connection region A of the circuit board 71, and the temperature rise of the electronic component 6A directly under the connector can be suppressed. It has an excellent effect.

In the above-described embodiment, an in-vehicle engine ECU is given as a specific example as the electronic control device, but it can be applied to all electronic control devices in which a circuit board and a connector are arranged in a housing. In each of the above embodiments, one electronic component 6A directly under the connector is mounted in the connector connection area A, but it is needless to say that it can be applied to the case where a plurality of electronic components are mounted. Further, in the second, fourth, fifth, and seventh embodiments, the inner layer GND pattern as the inner layer conductor pattern has been described, but even with other conductor patterns, from the position corresponding to the electronic component 6A directly under the connector. By providing it at a dislocated position, the same action and effect can be obtained. Various changes can be made to the process of mounting components on the circuit board.

Although the present disclosure has been described in accordance with the examples, it is understood that the present disclosure is not limited to the examples and structures. The present disclosure also includes various modifications and modifications within an equal range. In addition, various combinations and forms, as well as other combinations and forms that include only one element, more, or less, are also within the scope of the present disclosure.

In the drawings, 1 is an electronic control device, 2 is a housing, 3, 21, 31, 41, 51, 61, 71 are circuit boards, 4 is a connector, 5, 22, 32, 42, 52, 62, 72 are multilayers. The wiring boards, 5a, 22a, 32a, 42a, 52a, 62a, 72a are the first surface, 5b, 22b, 32b, 42b, 52b, 62b, 72b are the second surface, 6 is the electronic component, and 6A is the electronic component directly under the connector. , 8 is a connector pin, 9 is a dummy component, 23, 43, 53, 73 are inner layer GND patterns (inner layer conductor patterns), 33, 54, 63, 74 are thick solder resist layers, A is a connector connection area, and S is. Indicates a molten solder jet.

Claims (8)

An electronic control device (1) including a circuit board (1, 41, 61, 71), a connector (4) connected to the circuit board, and an electronic component (6) mounted on the surface of the circuit board. There,
The circuit board has a connector connection area (A) including a region to which the connector pin (8) of the connector is connected, and at least one of the electronic components is mounted so as to be located in the connector connection area. With
An electronic control device on which a dummy component (9) is mounted on the circuit board, which is located on the back surface side of the electronic component (6A) mounted in the connector connection region. An electronic control device including a circuit board (21, 41, 51, 71), a connector (4) connected to the circuit board, and an electronic component (6) mounted on the surface of the circuit board.
The circuit board has a connector connection area (A) including a region to which the connector pin (8) of the connector is connected, and at least one of the electronic components is mounted so as to be located in the connector connection area. With
An electronic control device in which an inner layer conductor pattern (23, 43, 53, 73) is provided on the circuit board at a position deviating from a position corresponding to an electronic component (6A) mounted in the connector connection region. An electronic control device including a circuit board (31, 51, 61, 71), a connector (4) connected to the circuit board, and an electronic component (6) mounted on the surface of the circuit board.
The circuit board has a connector connection area (A) including a region to which the connector pin (8) of the connector is connected, and at least one of the electronic components is mounted so as to be located in the connector connection area. With
The circuit board is provided with a solder resist layer, and at least the portion of the back surface of the circuit board corresponding to the electronic component (6A) mounted in the connector connection region is the solder resist layer (33). , 54, 63, 74) are provided thicker than other regions. An electronic control device including a circuit board (41), a connector (4) connected to the circuit board, and an electronic component (6) mounted on the surface of the circuit board.
The circuit board has a connector connection area (A) including a region to which the connector pin (8) of the connector is connected, and at least one of the electronic components is mounted so as to be located in the connector connection area. With
A dummy component (9) is mounted on the circuit board at a position on the back surface side of the electronic component (6A) mounted in the connector connection region.
An electronic control device in which an inner layer conductor pattern (43) is provided on the circuit board at a position deviating from a position corresponding to an electronic component mounted in the connector connection region. An electronic control device including a circuit board (51), a connector (4) connected to the circuit board, and an electronic component (6) mounted on the surface of the circuit board.
The circuit board has a connector connection area (A) including a region to which the connector pin (8) of the connector is connected, and at least one of the electronic components is mounted so as to be located in the connector connection area. With
The inner layer conductor pattern (53) is provided on the circuit board at a position deviated from the position corresponding to the electronic component (6A) mounted in the connector connection region.
The circuit board is provided with a solder resist layer, and the solder resist layer (54) is present on the back surface of the circuit board at least for a portion corresponding to an electronic component mounted in the connector connection region. An electronic control device that is thicker than the area of. An electronic control device including a circuit board (61), a connector (4) connected to the circuit board, and an electronic component (6) mounted on the surface of the circuit board.
The circuit board has a connector connection area (A) including a region to which the connector pin (8) of the connector is connected, and at least one of the electronic components is mounted so as to be located in the connector connection area. With
A dummy component (9) is mounted on the circuit board at a position on the back surface side of the electronic component (6A) mounted in the connector connection region.
The circuit board is provided with a solder resist layer, and the solder resist layer (63) is present on the back surface of the circuit board at least for a portion corresponding to an electronic component mounted in the connector connection region. An electronic control device that is thicker than the area of. An electronic control device including a circuit board (71), a connector (4) connected to the circuit board, and an electronic component (6) mounted on the surface of the circuit board.
The circuit board has a connector connection area (A) including a region to which the connector pin (8) of the connector is connected, and at least one of the electronic components is mounted so as to be located in the connector connection area. With
A dummy component (9) is mounted on the circuit board at a position on the back surface side of the electronic component (6A) mounted in the connector connection region.
The inner layer conductor pattern (73) is provided on the circuit board at a position deviating from the position corresponding to the electronic component mounted in the connector connection region.
The circuit board is provided with a solder resist layer, and the solder resist layer (74) is present on the back surface of the circuit board at least for a portion corresponding to an electronic component mounted in the connector connection region. An electronic control device that is thicker than the area of. The electronic control device according to any one of claims 2, 4, 5, and 7, wherein the inner layer conductor pattern is an inner layer GND pattern (23, 43, 53, 73).

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