JP2008193040A - Electronic equipment and manufacturing method therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide electronic equipment with the connection reliability and packaging density improved, and to provide its manufacturing method. <P>SOLUTION: In an electronic control device provided by mounting a printed board with a connector, the printed board includes a through hole penetrating from a connector-arranged surface to the rear surface, a land for surface provided on the connector-arranged surface and a land for insertion integrally provided on a wall surface of the through hole and at the periphery of an opening of the through hole. The connector includes, as a terminal, a branched terminal containing both an inserting part which is electrically connected to the land for insertion via a solder supplied from the connector-arranged surface side into the through hole, while being inserted into the through hole and a surface part which is arranged on the land for surface to be electrically connected, as end parts. The inserting part is so extended from a portion, sandwiched between the land for surface on the surface part and the opposed surface, as to be perpendicular to the surface of the printed board. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an electronic device and a method for manufacturing the electronic device.

  Conventionally, as an electronic device in which an electronic component such as a connector is mounted on a printed circuit board, terminals of the electronic component are inserted and arranged in the through hole of the printed circuit board, and the land and terminals provided around the through hole wall surface and the opening thereof are arranged. An insertion mounting structure formed by solder bonding is known (see, for example, Patent Document 1). Also known is an electronic device having a surface mounting structure in which a terminal of an electronic component and a land provided on the surface of a printed board are joined by soldering (see Patent Document 2 and FIG. 12).

  In the case of an electronic device having an insertion mounting structure, since it is necessary to perform flow soldering (including local flow) using molten jet solder, the area exposed to the molten solder on the back surface of the electronic component placement surface of the printed circuit board An interference area with a nozzle for jetting molten solder cannot be an electronic component mounting area. That is, the electronic component mounting prohibited area is large, and it is difficult to improve the mounting density of the electronic components for the entire board (both sides).

  In the case of an electronic device having a surface mounting structure, since flow soldering is not required, the mounting density of electronic components can be improved. However, since reflow is performed in a state where the terminals are arranged on the corresponding lands, misalignment is likely to occur between the terminals and the corresponding lands in a state before the solder is cooled and solidified (molten state). . For example, during reflow, if the substrate (electronic component housing) is deformed (warped, etc.) due to the difference in coefficient of linear expansion between the printed circuit board and the electronic component, the terminal and the land may be displaced or the terminal may be dropped from the land. is there. Also, as the number of terminals increases, it becomes more difficult to ensure the coplanarity of the connection part between the terminals and the land, and it becomes difficult to ensure the connection between all the terminals and the corresponding lands due to the influence of the warp of the board or the like. . That is, there is a problem in connection reliability.

On the other hand, Patent Document 3 (see particularly FIGS. 14 to 17) describes a tip portion (insertion portion) having a shape that can be inserted into a hole (through hole) formed in a printed circuit board, and an upper portion a predetermined distance from the tip portion. A connector having a lead pin (branched terminal) having a soldered portion (surface portion) formed on the substrate is shown. Further, Patent Document 4 discloses a laterally convex portion (surface portion) bonded to the surface of a lead connection land (surface land) of a printed wiring board (printed circuit board) at the tip of a lead (branch terminal) of an electronic component. And the mounting structure of the printed wiring board integrally provided with the vertical convex part (insertion part) inserted in the through-hole of a printed wiring board is shown. In both Patent Document 3 and Patent Document 4, reflow for the insertion portion is unnecessary, and the surface portion is soldered to a corresponding surface land in a state where the insertion portion is inserted into the through hole.
JP-A-2005-327643 JP 2006-256448 A Japanese Patent Laid-Open No. 11-11407 JP-A-11-317265

  However, in Patent Literature 3 and Patent Literature 4, a portion of the terminal that extends from the connector housing and is substantially perpendicular to the printed circuit board is used as an insertion portion, and the region is substantially perpendicular to the printed circuit board. A portion extending substantially parallel to the plane of the printed circuit board is defined as a surface portion. That is, the structure of the surface part and insertion part which comprise a branched terminal is made into the reverse L-shaped structure. In the case of such an inverted L-shaped structure, a side fillet is formed only at one tip of the surface portion. In addition, the positional deviation amount with the insertion portion as the rotation center is large, and it is conceivable that the mounting density is lowered when it is attempted to secure connection reliability.

  Further, in Patent Document 3, since the insertion portion is not soldered, in order to ensure the desired connection reliability, the surface portion must be enlarged to increase the contact area with the solder. It is difficult to improve the mounting density of electronic components, and thus the mounting density of electronic components as a whole board (both sides).

  Further, in Patent Document 4, the inner surface of the through hole is covered with a conductive material, and the insertion portion is inserted into the through hole so that the tip is exposed on the back side of the connector placement surface of the printed circuit board. A large amount of the solder disposed in the through hole flows into the through hole by utilizing the capillary phenomenon. Therefore, depending on the size of the surface land, there is a possibility that a good fillet (side fillet) is not formed on the surface portion. In addition, voids (bubbles) may be formed in the solder that has flowed into the through holes. In order to avoid this problem (to ensure connection reliability), it is necessary to increase the surface land (surface portion), and it is difficult to improve the mounting density of electronic components.

  In view of the above problems, an object of the present invention is to provide an electronic device and a method for manufacturing the electronic device that can improve connection reliability and mounting density.

  In order to achieve the above object, an electronic device according to claim 1 includes a printed circuit board having lands and an electronic component in which a plurality of terminals are arranged along the plane of the printed circuit board with respect to the main body. An electronic device in which an end portion extended from a main body portion of a terminal is connected to a land via solder, and a printed circuit board has a through hole penetrating from the electronic component arrangement surface to the back surface thereof, and an electronic component arrangement as a land A surface land provided on the surface, a wall surface of the through hole, and an insertion land provided integrally around the opening of the through hole, and the electronic component is inserted into the through hole, The end portion includes the insertion portion connected to the insertion land via the solder supplied from the electronic component placement surface side and the surface portion arranged on the surface land and connected to the surface land via the solder. Branch terminal with In the branched terminal at least as a terminal, the surface portion is substantially parallel to the surface of the printed circuit board, and the insertion portion is a surface of the printed circuit board from a portion sandwiched by the surface portion facing the surface land. It is characterized by extending substantially perpendicular to.

  As described above, according to the present invention, since the insertion portion inserted and arranged in the through hole exhibits the positioning effect, it corresponds to the terminal in a state before the terminal and the land are connected (solder is in a molten state). It is possible to prevent the positional deviation from occurring with the land. That is, connection reliability can be improved as compared with the conventional surface mounting structure. In addition, since the insertion portion is soldered to the insertion land, the contact area between the terminal (land) and the solder is sufficient to satisfy the desired connection reliability while suppressing the increase in size of the surface land. Can do. Also, if the solder is a non-through hole at the time of placing the solder in the through hole, there is no air escape space in the hole, and voids are likely to occur at the solder joint between the insertion portion and the insertion land. According to this, generation of voids can be reduced.

  Also, solder is supplied from the electronic component placement surface side to the through hole by, for example, a screen printing method. Therefore, flow soldering is unnecessary, and the mounting density can be improved as compared with the conventional insertion mounting structure.

  Furthermore, the branched terminal has a substantially T-shaped structure. Accordingly, solder fillets (side fillets) are formed at both end portions sandwiching the insertion portion in the surface portion, thereby increasing the contact area and the connection reliability against the stress in the surface direction of the printed circuit board. I can expect. That is, connection reliability can be improved as compared with a conventional branched terminal having an inverted L-shaped structure. Further, if the misalignment angle with the insertion portion as the rotation center is the same, the misalignment amount can be made smaller than that of the branch terminal having an inverted L-shaped structure, so that connection reliability and mounting density can be improved. it can. The advantages of the T-shaped structure over the inverted L-shaped structure will be described in detail in the embodiment, including effects other than those described above.

  The structure of the branched terminal can be adopted as long as the insertion portion extends substantially perpendicularly to the surface of the printed board from a part of the surface portion (a structure in which the insertion portion is sandwiched between the surface portions). However, preferably, as described in claim 2, the insertion portion may be configured to extend substantially perpendicular to the surface of the printed circuit board from a substantially central position of the surface portion.

  According to this, it is possible to further reduce the amount of positional deviation with the insertion portion described above as the center of rotation. In addition, since the variation in the amount of solder flowing from the two regions on the surface land sandwiching the through hole is small, good solder fillets can be formed at both ends of the surface portion.

  In the invention described in claim 1 or claim 2, as described in claim 3, the electronic component placement surface of the printed circuit board is formed with the distal end of the insertion portion electrically connected to the terminal and the land. It is preferable to set it as the structure made into the same position as the back surface of this, or the position between an electronic component arrangement | positioning surface and its back surface.

  Thus, if it is set as the structure which does not protrude an insertion part to the back surface side of a printed circuit board, the quantity which the solder on the surface land flows into a through-hole can be made smaller than the conventional branched terminal. That is, it becomes easy to form a good fillet on the surface portion, and the possibility that voids are generated in the solder in the through hole is reduced. Therefore, it is possible to improve connection reliability while suppressing an increase in the size of the surface land. Further, when reflow mounting other electronic components arranged on the back side of the electronic component arrangement surface of the printed circuit board, the insertion portion does not block heat, so that the heat easily spreads to the solder joint portion. Therefore, it is preferable that the insertion portion does not protrude from the back surface of the printed board within a range in which connection reliability can be ensured.

  In the invention according to claim 3, as described in claim 4, the electronic component is inserted into the through hole separately from the branch terminal, and at least before the terminal is connected to the land, It is good also as a structure which has the positioning pin which the front-end | tip protrudes in the back surface side of the electronic component arrangement | positioning surface of a printed circuit board.

  As described above, as a separate member from the terminal, when the terminal has a positioning pin that protrudes to the back side of the printed circuit board at least before the terminal is connected to the land, the terminal is connected to the land. Thus, it is possible to determine the connection state of the branch terminal with the solder depending on the exposure state of the positioning pin on the back surface side of the printed circuit board. For example, such a configuration is effective when the number of branch terminals is large and the surface portion is dense and it is difficult to inspect the connected state (soldered state) from the electronic component placement surface side. It is. In addition, the positioning pin can effectively suppress a positional shift between the terminal and the corresponding land in a state before the terminal and the land are connected (solder is in a molten state).

  In the invention described in claim 1 or 2, as described in claim 5, as a branched terminal, the terminal and the land are connected to each other, and the tip of the insertion portion is an electronic circuit board. A plurality of short leg terminals located at the same position as the back surface of the component placement surface or between the electronic component placement surface and the back surface, and inserted into the through hole, and at least before the terminal is connected to the land In this state, it is possible to have a configuration in which the distal end of the insertion portion has a leg long terminal that protrudes to the back side of the electronic component placement surface of the printed circuit board, and the number of leg long terminals is smaller than that of the leg short terminals.

  As described above, since the short leg terminals are mainly used as the branch terminals, the increase in the size of the land for the surface can be suppressed as in the invention according to claim 3 as compared with the configuration in which all are the long leg terminals. Connection reliability can be improved. In addition, heat at the time of reflow can be easily spread to other electronic components arranged on the back surface of the electronic component arrangement surface of the printed circuit board. In addition, since the leg-long terminal is adopted as a part of the branch terminal, the leg-long terminal is exposed to the back side of the printed circuit board in a state where the terminal is connected to the land as in the positioning pin according to claim 4. Thus, it is possible to determine the connection state between the terminals other than the leg-long terminals and the solder, and thus to ensure the connection reliability. Further, the leg-long terminal can effectively suppress the occurrence of displacement between the terminal and the corresponding land in a state before the terminal and the land are connected (solder is in a molten state). In addition, it is good also as a structure which has several types from which the length of an insertion part mutually differs as a leg short terminal, and several types from which the length of an insertion part mutually differs as a leg long terminal.

  Next, in order to achieve the above object, an electronic device according to claim 6 includes a printed circuit board having lands, and an electronic component in which a plurality of terminals are arranged along the plane of the printed circuit board with respect to the main body. The printed circuit board includes a through-hole penetrating from the electronic component placement surface to the back surface thereof, and a land. It has a surface land provided on the electronic component placement surface, a wall surface of the through hole and an insertion land integrally provided around the opening of the through hole, and the electronic component is inserted into the through hole, An insertion portion connected to the insertion land via the solder supplied from the electronic component placement surface side in the through hole, and a surface portion arranged on the surface land and connected to the surface land via the solder Branch shape The terminal is included at least as a terminal, and the tip of the insertion portion is in the same position as the back surface of the electronic component placement surface of the printed circuit board, or between the electronic component placement surface and the back surface, with the terminal and the land connected. It is characterized by being the position of.

  As described above, according to the present invention, since the insertion portion inserted and arranged in the through hole exhibits the positioning effect, it corresponds to the terminal in a state before the terminal and the land are connected (solder is in a molten state). It is possible to prevent the positional deviation from occurring with the land. That is, connection reliability can be improved as compared with the conventional surface mounting structure. In addition, since the insertion portion is soldered to the insertion land, the contact area between the terminal (land) and the solder is sufficient to satisfy the desired connection reliability while suppressing the increase in size of the surface land. Can do. Also, if the solder is a non-through hole at the time of placing the solder in the through hole, there is no air escape space in the hole, and voids are likely to occur at the solder joint between the insertion portion and the insertion land. According to this, generation of voids can be reduced.

  Also, solder is supplied from the electronic component placement surface side to the through hole by, for example, a screen printing method. Therefore, flow soldering is unnecessary, and the mounting density can be improved as compared with the conventional insertion mounting structure.

  Furthermore, since the insertion portion does not protrude to the back side of the printed circuit board, the amount of solder on the front surface land flowing into the through hole can be made smaller than that of the conventional branched terminal. That is, it becomes easy to form a good fillet on the surface portion, and the possibility that voids are generated in the solder in the through hole is reduced. Therefore, it is possible to improve connection reliability while suppressing an increase in the size of the surface land. In addition, when reflow mounting other electronic components arranged on the back side of the electronic component arrangement surface of the printed circuit board, the insertion portion does not block heat, so that the heat easily spreads to the solder joint portion. As described above, it is preferable that the length of the insertion portion is such that the insertion portion does not protrude from the back surface of the printed circuit board as long as connection reliability can be ensured. The structure of the branched terminal in the invention described in claim 6 is not limited to the above-described T-shaped structure, and for example, an inverted L-shaped structure can also be adopted.

  The invention according to claim 7 is provided with a printed circuit board having lands, and an electronic component in which a plurality of terminals are arranged along the plane of the printed circuit board with respect to the main body, and extends from the main body of the terminal. The printed circuit board has a through-hole penetrating from the electronic component placement surface to the back surface thereof and a surface provided as a land on the electronic component placement surface. A land, a wall surface of the through-hole, and an insertion land integrally provided around the opening of the through-hole, and the electronic component is inserted into the through-hole from the electronic component placement surface side. A branch terminal having an insertion portion connected to the insertion land via the supplied solder and a surface portion arranged on the surface land and connected to the surface land via the solder as ends. , At least as a terminal As a branched terminal, with the terminal and the land connected, the tip of the insertion portion is the same position as the back surface of the electronic component placement surface of the printed circuit board, or the position between the electronic component placement surface and the back surface. The front end of the insertion portion protrudes to the back side of the electronic component placement surface of the printed circuit board in a state inserted into the through hole and at least before the terminal is connected to the land. The number of leg long terminals is smaller than the number of leg short terminals.

  As described above, according to the present invention, since the insertion portion inserted and arranged in the through hole exhibits the positioning effect, it corresponds to the terminal in a state before the terminal and the land are connected (solder is in a molten state). It is possible to prevent the positional deviation from occurring with the land. In particular, according to the present invention, since the leg-long terminal is included as the branched terminal, it is possible to effectively suppress the occurrence of the positional deviation between the terminal and the corresponding land. That is, connection reliability can be further improved as compared with the conventional surface mount structure. In addition, since the insertion portion is soldered to the insertion land, the contact area between the terminal (land) and the solder is sufficient to satisfy the desired connection reliability while suppressing the increase in size of the surface land. Can do. In particular, according to the present invention, since the leg-long terminal is included as the branched terminal, the contact area can be increased thereby. Also, if the solder is a non-through hole at the time of placing the solder in the through hole, there is no air escape space in the hole, and voids are likely to occur at the solder joint between the insertion portion and the insertion land. According to this, generation of voids can be reduced.

  Also, solder is supplied from the electronic component placement surface side to the through hole by, for example, a screen printing method. Therefore, flow soldering is unnecessary, and the mounting density can be improved as compared with the conventional insertion mounting structure.

  Moreover, since the leg short terminal is mainly employed as the branched terminal, connection reliability can be improved while suppressing an increase in the size of the surface land as in the invention described in claim 5. In addition, heat at the time of reflow can be easily spread to other electronic components arranged on the back surface of the electronic component arrangement surface of the printed circuit board. Also, because the leg-long terminal is adopted as a part of the branch terminal, the connection between the terminal other than the leg-long terminal and the solder is possible depending on the exposure state of the leg-long terminal on the back side of the printed circuit board with the terminal connected to the land. The state can be determined. In addition, it is good also as a structure which has several types from which the length of an insertion part mutually differs as a leg short terminal, and several types from which the length of an insertion part mutually differs as a leg long terminal. Further, the structure of the branched terminal is not limited to the above-described T-shaped structure, and for example, an inverted L-shaped structure can be adopted.

  In the invention according to claim 5 or claim 7, as described in claim 8, the length of the insertion portion of the leg short terminal is equal to or less than the thickness of the printed circuit board, and the length of the insertion portion of the leg long terminal is set. However, it is preferable to make the length longer than the thickness of the printed circuit board.

  With such a configuration, with the terminal and the land connected, the tip of the insertion portion of the short leg terminal is at the same position as the back surface of the electronic component placement surface of the printed circuit board, or the electronic component placement surface and the back surface thereof. The tip of the insertion part of the leg long terminal protrudes to the back side of the electronic component placement surface of the printed board in a state before being inserted into the through hole and at least before the terminal is connected to the land. Can be configured.

  More preferably, as described in claim 9, the length of the insertion portion of the leg long terminal is set to be equal to or less than the sum of the length of the insertion portion of the short leg terminal and the thickness of the printed board. With such a configuration, if the leg long terminal protrudes to the back side of the printed circuit board, at least a part of the insertion portion of the leg short terminal is inserted into the through hole, and the leg long terminal projects to the back side of the printed circuit board. If not, the insertion part of the leg short terminal is not inserted into the through hole. Therefore, the connection state between the terminals other than the leg-long terminals and the solder can be determined based on how the leg-long terminals are exposed to the back side of the printed circuit board.

  In the invention according to any one of claims 5, 7 to 9, as described in claim 10, at least one leg-long terminal may be arranged in an end region in the terminal arrangement direction. .

  As described above, as the number of terminals increases, it becomes more difficult to ensure the coplanarity of the connection portion with the land of the terminals. In this case, for example, the deformation amount of the printed circuit board (the deformation amount along the surface of the printed circuit board) In the longitudinal direction of the main body of the component, the distance from the center of the main body increases. Therefore, if it is set as the structure of Claim 10, it is effective in the positional offset suppression between a terminal and a corresponding land. Moreover, it is easy to insert the leg-long terminal into the through hole.

  Further, in the invention according to any one of claims 5, 7 to 10, as described in claim 11, at least one leg-long terminal is provided in a central region sandwiched between the end regions in the terminal arrangement direction. It is good also as a structure by which.

  In the reflow process, the printed circuit board is heated while being transported in a state where the opposite end portions are supported, so that, for example, depending on the weight of the arranged electronic components, the printed circuit board hangs downward, for example, at the center portion sandwiched between the end portions Warp is likely to occur. Therefore, if it is set as the structure of Claim 11, according to the exposure condition to the back surface side of the printed circuit board of the leg length terminal arrange | positioned in the center area | region, the connection state of terminals other than a leg length terminal and solder will be determined accurately. Is possible.

  In the invention described in any one of claims 5 and 7 to 11, as described in claim 12, the insertion portion is inserted into the through hole at a position farther from the main body portion than the insertion portion of the leg short terminal. It is good also as a structure which has the made leg long terminal. With such a configuration, the amount of rattling of the electronic component can be reduced by the leg-long terminals, and the connection reliability between the terminals other than the leg-long terminals and the solder can be improved.

  In the invention described in any one of claims 5 and 7 to 12, as described in claim 13, as a terminal to be soldered, reinforcement that does not provide an electrical connection function between the electronic component and the printed circuit board The terminal may be a leg long terminal. Since the number of reinforcing terminals intended to increase the connection strength is smaller than that of terminals other than the reinforcing terminals (generally several), the reinforcing terminals may be leg-long terminals. In addition to the reinforcing terminal, a part of the terminal that provides an electrical connection function between the electronic component and the printed circuit board can be used as a leg-long terminal.

  At the time of reflow, a capillary phenomenon occurs in a gap (opposite region) where the insertion land and the insertion portion formed on the wall surface of the through hole face each other. Therefore, in the invention according to any one of claims 3 to 13, as described in claim 14, with the terminal and the land connected, the tip of the electronic component placement surface of the printed circuit board is formed. The insertion portion, which is located at the same position as the back surface or between the electronic component placement surface and the back surface, and the insertion land formed on the wall surface of the through hole are disposed in a gap configured to face each other. A configuration in which the end surface of the back surface of the electronic component placement surface of the solder has a portion closer to the electronic component placement surface than the contact portion with the insertion land and the contact portion with the insertion portion in the thickness direction of the printed circuit board Can be adopted.

  In the invention described in any one of claims 1 to 14, as described in claim 15, a plurality of surface lands are arranged in a staggered manner on the electronic component arrangement surface corresponding to the arrangement direction of the terminals. It is good also as a composition.

  With such a configuration, since the side fillet formed on the side surface of the surface portion can be increased in the terminal arrangement direction, connection reliability can be further improved. In addition, the size of the printed circuit board in the terminal arrangement direction can be reduced as compared with the configuration in which the surface lands are arranged in one row in the terminal arrangement direction. The number of staggered stages is not particularly limited.

  According to the fifteenth aspect of the present invention, as described in the sixteenth aspect, the electronic component arrangement at a position where the terminal connected to the surface land excluding the surface land closest to the main body portion extends from the main body portion. The height with respect to the surface is the same as the height of the terminal connected to the surface land closest to the main unit with respect to the electronic component arrangement surface at the extended position from the main unit, or closer to the electronic component arrangement surface than that. It is preferable to have a configuration as described above.

  With such a configuration, heat can be efficiently distributed to all terminals during reflow. Also, depending on the configuration, the length of the terminal is made longer than the configuration in which the extension position from the main body portion of the terminal connected to the surface land closest to the main body portion is the closest position to the printed circuit board. In such a configuration, it is possible to improve the function of relieving the stress applied to the solder joint, and to improve the connection reliability.

  In the invention according to claim 15 or claim 16, as described in claim 17, the electronic component is such that at least one part of the terminal extending from the main body is electrically connected to the land. In the case of a connector in which the other end extended from the main body is electrically connected to the external connector, at least the end on the side electrically connected to the external connector is the main body. It is preferable that the number of steps of the end portion is n times (n is an integer of 2 or more) the number of steps of the staggered surface land. With such a configuration, the types of terminals can be reduced.

  In the invention according to any one of claims 1 to 17, as described in claim 18, the surface land corresponding to the surface portion of the branch terminal is inserted into the insertion portion of the same branch terminal. The surface land and the insertion land corresponding to the same branched terminal may be integrated as one land on the electronic component arrangement surface.

  With such a configuration, when the end position of the surface land on the side far from the insertion land is the same, the contact area between the land and the solder can be improved. Further, if the contact area is the same, the size of the printed circuit board can be reduced. Furthermore, since reflow is performed with the insertion portion inserted into the through hole, even if the distance between the surface portion and the corresponding surface land varies slightly, solder is previously inserted into the through hole before reflow as described later. In the case of placement, the solder wets the surface portion and the joint portion of the surface land through the insertion portion and the insertion land. Therefore, the contact area between the terminal (land) and the solder sufficient to satisfy the desired connection reliability can be ensured.

  In the invention according to any one of claims 1 to 17, as described in claim 19, the surface land and the insertion land corresponding to the same branched terminal are arranged on the electronic component placement surface. It is good also as a separated structure.

  With such a configuration, it is possible to prevent a part of the solder disposed on the surface land from flowing into the through hole during reflow and reducing the amount of solder on the surface land. In other words, since a good solder fillet is formed on the surface portion of the terminal on the surface land, connection reliability can be improved.

  In the invention according to any one of claims 1 to 19, as described in claim 20, in the land corresponding to the branched terminal, the part provided on the electronic component placement surface side of the printed circuit board is more It is preferable to be configured larger than a portion provided on the back surface of the electronic component placement surface. With such a configuration, in the configuration having the front surface land and the insertion land, the mounting prohibited area on the back surface of the electronic component placement surface can be further reduced.

  In the invention described in any one of claims 1 to 20, as described in claim 21, all terminals may be branched terminals. With such a configuration, since all the terminals have insertion portions, connection reliability can be further improved.

  If all terminals are branched terminals, through-holes must be provided in the printed circuit board by the number of the branched terminals. If the structure includes the surface-mounting terminal, the number of through holes provided in the printed circuit board can be reduced. Therefore, although the connection reliability is slightly inferior to that of the invention described in claim 21, it can be improved as compared with the prior art. Further, the printed circuit board can be reduced in size or the degree of freedom of the wiring pattern formed on the printed circuit board can be improved as compared with the invention described in claim 21.

  In the invention described in claim 22, the arrangement of the branch terminal and the surface mount type terminal is not particularly limited. For example, as described in claim 23, in the terminal arrangement direction, a plurality of branched terminals may be arranged so as to sandwich the surface-mounted terminal therebetween. As described above, when the branched terminals are arranged so that the surface-mounted terminals are sandwiched therebetween, it is effective to suppress the positional deviation between the terminals and the corresponding lands.

  In the invention according to any one of claims 21 to 23, as described in claim 24, both end regions are respectively configured by at least one branch terminal in the terminal arrangement direction. Is preferred. As described above, as the number of terminals increases, it becomes more difficult to ensure the coplanarity of the connection portion with the land of the terminal. The larger the distance from the center of the part, the larger. Therefore, if it is set as the structure of Claim 24, it is effective in the positional offset suppression between a terminal and a corresponding land.

  In the invention described in claim 24, as described in claim 25, when at least one branch terminal is arranged in the central region sandwiched between the end regions in the terminal arrangement direction, It is preferable that the hole diameter of the through hole corresponding to the arranged branch terminal is larger than the hole diameter of the through hole corresponding to the branch terminal arranged in the central area.

  Depending on the positional accuracy of the through holes and the positional accuracy of the terminals, it is considered that the insertion portion of the branched terminal becomes less likely to enter the corresponding through hole as the number of terminals increases. The manufacturing error of the printed circuit board and the electronic component can be absorbed in the end region, and connection reliability can be ensured.

  In the invention described in claim 25, as described in claim 26, a plurality of first terminals (for example, signal terminals for signal transmission) and a plurality of terminals having a larger terminal diameter than the first terminals are provided. The second terminal (for example, a power terminal for power transmission) may be used, and the second terminal may be used as a plurality of branched terminals constituting the end region. Thus, the second terminal having a large terminal diameter is suitable as a branched terminal disposed in the end region because the hole diameter of the through hole corresponding to the insertion portion of the second terminal and the tolerance thereof are large. In addition, the power element in which the power terminal is electrically connected via the land and the wiring is from the viewpoint of heat dissipation (shortening the heat radiation distance to the outside and reducing the influence of heat radiation to other electronic components (elements)), Generally, it is disposed in the vicinity of the edge of the printed circuit board. Therefore, the wiring can be simplified with the above-described configuration.

  In the invention described in any one of claims 1 to 26, as described in claim 27, a bent terminal formed by bending a rod-shaped terminal member on the main body is employed as the branched terminal. In the terminal arrangement direction, the terminal diameter of the surface portion may be larger than the terminal diameter of the insertion portion. With such a configuration, the contact area with the solder increases, and the connection reliability can be improved. In addition to the bent terminal, a punched terminal obtained by punching a metal plate into a predetermined shape in advance can be used as the branched terminal. In the case of a punched terminal, the width in the arrangement direction of the terminals is constant (thickness of the metal plate), so the above-mentioned bending terminal effect cannot be obtained, but the terminal can be selected by appropriately selecting the thickness of the metal plate. Can be easily deformed in the arrangement direction of the terminals, and can be configured to be effective for stress relaxation in the arrangement direction.

  Next, an invention according to claim 28 is a method of manufacturing an electronic device in which an end portion of a terminal extended from a main body portion of an electronic component and a land provided on a printed circuit board are connected via solder. As a printed circuit board, a through hole penetrating from the electronic component placement surface to the back surface thereof, and a land for the surface provided on the electronic component placement surface as a land, a wall surface of the through hole, and a periphery of the opening of the through hole are provided. A board preparing step for preparing a printed circuit board having an insertion land, and an insertion land as an electronic component via solder supplied from the electronic component placement surface side into the through hole in a state of being inserted into the through hole. An electronic component is prepared that includes at least a branched terminal that is disposed on a surface land and connected to the surface land via a solder as an end, and is connected to the surface land through a solder. Solder is placed on the surface land using the component preparation process and the screen printing method, and solder is filled from the electronic component placement surface side to the through hole, and solder is placed on at least a part of the insertion land. The coating process to be arranged, and after the coating process, the insertion portion of the branch terminal is inserted into the through hole from the electronic component placement surface side, the surface portion corresponding to the surface land by melting the solder in this insertion state, and the insertion And a reflow process for soldering the insertion portions corresponding to the lands.

  Thus, according to the present invention, the above-described electronic device can be formed. In forming an electronic device, the surface portion corresponding to the surface land and the insertion portion corresponding to the insertion land are soldered together with the insertion portion of the branched terminal inserted into the through hole. In the state before the terminal and the land are connected (solder is in a molten state), it is possible to prevent the positional deviation between the terminal and the corresponding land. That is, connection reliability can be improved as compared with the conventional surface mounting structure. In addition, since the flow soldering is unnecessary, the mounting density can be improved as compared with the conventional insertion mounting structure.

  In the reflow process, a part of the solder on the surface land is capillarity and / or in a gap (opposite region) formed so that the insertion land and the insertion portion formed on the wall surface of the through hole face each other. Alternatively, it may be possible to flow by gravity. On the other hand, in the present invention, the solder is filled in the through hole before the reflow process, so that the solder flowing into the through hole from the surface land is reduced or the solder flowing into the through hole is smaller than before. As a result, a good fillet (side fillet) can be formed on the surface portion. In addition, since a sufficient amount of solder is disposed in the through hole, the risk of voids can be reduced. That is, it is possible to improve connection reliability while suppressing an increase in the size of the surface land.

  In a twenty-eighth aspect of the present invention, as described in the twenty-ninth aspect, the coating step includes a plurality of screen printing steps each using screens having different mask shapes, At least a first step of filling a paste-form solder on the surface and a second step of applying a paste-form solder on the solder filled in the through-hole and the surface land after the first step. The second opening corresponding to the through hole of the second screen used in the second step is larger than the first opening corresponding to the through hole of the first screen used in the first step, and the first opening is the second. It may be included in the opening.

  In this way, when the coating process is configured by a plurality of screen printing processes, the solder thickness disposed on the lands can be compared with a single screen printing process without partial adjustment of the mask thickness. Can be thickened. Moreover, although it is the structure which screen-prints in multiple times, the stain | pollution | contamination (transfer from the printed circuit board side) of the screen back surface can be prevented. Furthermore, the contact area between the insertion portion and the solder can be increased.

  In the invention described in claim 29, as described in claim 30, in the substrate preparation step, the insertion land and the surface land corresponding to the same branched terminal are integrally formed, and the coating step , A region including a through hole and a surface land corresponding to the same branch terminal may be used as the second opening. Such a configuration is effective in suppressing contamination on the back surface of the screen.

  Further, in the invention described in claim 29 or claim 30, as described in claim 31, the thickness of the first screen is preferably made thinner than the thickness of the second screen. If it does in this way, in the application process, the solder thickness on the surface land can be secured while the solder is efficiently filled in the through hole.

  In invention of any one of Claims 29-31, as described in Claim 32, in the 2nd process, the surface land corresponding to an electronic component except an electronic component which has a branched terminal as an electronic component It is good to apply solder on top. According to this, it is possible to eliminate a problem caused by dirt on the back surface of the screen. Moreover, if it is set as the structure of Claim 31, a solder thickness is securable.

  In the invention described in any one of claims 28 to 32, as described in claim 33, in the component preparation process, the leading end of the insertion portion is in the reflow process and when the reflow process is completed. It is preferable to prepare an electronic component including a branched terminal that is located at the same position as the back surface of the electronic component placement surface or between the electronic component placement surface and the back surface.

  According to this, even in the reflow process, even if the main body of the printed circuit board or the electronic component is warped or the branch terminal is displaced with respect to the main body, the insertion portion is always disposed in the through hole. Therefore, connection reliability can be improved.

  In addition, since the insertion portion does not protrude from the back surface side of the printed circuit board, even when the back surface side of the printed circuit board is reflowed after mounting the electronic component, it is possible to prevent the reflow heat from being hindered by the terminals.

  Further, since the insertion portion does not protrude on the back surface side of the printed circuit board, the amount of solder flowing into the through hole from the surface land can be further reduced as compared with the configuration in which the insertion portion protrudes on the back surface side of the printed circuit board. . In addition, it is possible to further reduce the possibility that voids are generated in a gap (opposite region) configured such that the insertion land formed on the wall surface of the through hole and the insertion portion are opposed to each other. That is, connection reliability can be further improved.

  In the invention according to claim 33, as described in claim 34, in the substrate preparation step, the opening diameter on the back surface side of the electronic component placement surface is smaller than the opening diameter on the electronic component placement surface side. Thus, it is good to form a through hole.

  The molten solder is placed closer to the back side of the electronic component placement surface of the printed circuit board than the gap (opposite area) where the insertion land and the insertion portion formed on the wall surface of the through hole face each other due to its own weight. It is also possible to flow. Even in such a case, according to the present invention, the solder is pulled out to the back side of the electronic component placement surface through the through hole. Compared to a configuration in which the opening diameter is larger on the back surface than on the arrangement surface, it can be suppressed. That is, the contact area between the solder and the terminal (land) can be ensured.

  Further, in the invention according to claim 33, as described in claim 35, at least before the reflow process, the opening of the through hole is closed against the back surface of the electronic component placement surface of the printed circuit board. You may provide the lid | cover process which fixes an insulating member, and the process of removing an insulating member after a reflow process. This also can prevent the solder melted during the reflow from escaping out of the through hole through the opening on the back surface side of the electronic component placement surface, as in the case of the invention described in claim 34. According to a thirty-sixth aspect of the present invention, as the insulating member, an insulating member having a ventilation portion that allows the through hole and the outside of the printed circuit board to be ventilated to a part of a portion that covers the opening and does not allow solder to pass therethrough may be used. . According to this, the ventilation part can suppress the expansion / contraction of the air in the through hole due to the cold heat during reflow.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following embodiments, a connector is shown as an example of an electronic component including a branched terminal, and an electronic control device in which a connector is mounted on a printed board is shown as an example of an electronic device in which the electronic component is mounted on the printed board. Show.
(First embodiment)
FIG. 1 is an exploded view illustrating a schematic configuration of the electronic control device according to the first embodiment of the present invention before assembly. FIG. 2 is a plan view of the periphery of the mounting portion in a state where the connector is mounted on the printed board. FIG. 3 is a plan view of a state in which the connector is mounted on the printed circuit board as viewed from the connection side between the printed circuit board and the terminals. FIG. 4 is a plan view of the state in which the connector is mounted on the printed circuit board as viewed from the connection side with the external connector. FIG. 5 is a cross-sectional view taken along line VV shown in FIG. FIG. 6 is an enlarged plan view of the area surrounded by the broken line in FIG. 2 on the electronic component placement surface side. FIG. 7 is an enlarged plan view of the electronic component placement surface of the printed circuit board in a region surrounded by a broken line in FIG. FIG. 8 is an enlarged plan view showing the back side of the electronic component placement surface of the printed circuit board from the electronic component placement surface side in the region surrounded by the broken line in FIG. 2. In FIG. 6, for convenience, electronic components other than the solder and the connector are omitted. 7 and 8, for convenience, the solder and the solder resist are omitted.

  The electronic control device shown in the present embodiment is a non-waterproof electronic control device, and is used, for example, as an engine ECU (Electric Control Unit) of a vehicle.

  An electronic control device 100 shown in FIG. 1 corresponds to the electronic device described in the claims, and as a main part, a circuit board 30 in which an electronic component 32 is mounted on a printed circuit board 31, and a claim. And includes a connector 50 having terminals (branched terminals 51 and reinforcing terminals 59) and a housing 52. In addition to the above-described components, the present embodiment includes a housing 10 that accommodates part of the circuit board 30 and the connector 50.

  The housing 10 is made of a metal material such as aluminum or iron or a synthetic resin material, and accommodates part of the circuit board 30 and the connector 50. The number of constituent members of the housing 10 is not particularly limited, and may be configured from one member or a plurality of members. In the present embodiment, as shown in FIG. 1, it is constituted by two members, a box-shaped case 11 with one side opened and a shallow cover 12 with a substantially rectangular plate shape that closes the open surface of the case 11. Is done. Then, by assembling the case 11 and the cover 12, the housing 10 having an internal space that accommodates part of the circuit board 30 and the connector 50 is configured. The housing 10 (case 11) is provided with a connector notch (not shown) corresponding to the connector 50, and the case 11 and the cover 12 are fastened (not shown) so as to accommodate the circuit board 30. In this state, a part of the circuit board 30 and the connector 50 (including the connection side of the branch terminal 51 to be described later with the circuit board 30) are accommodated in the housing 10, and the remaining part of the connector 50 (branch shape (Including the connection side of the terminal 51 to the external connector) is exposed outside the housing 10.

  As shown in FIG. 1, a circuit board 30 has a printed circuit board 31 formed with wirings including lands as electrodes, via holes for connecting the wirings, etc., and electronic components 32 such as microcomputers, power transistors, resistors and capacitors. Is implemented. In the present embodiment, a connector 50 that electrically connects the circuit board 30 and the outside is mounted on the printed board 31 as one of the electronic components 32.

  As a constituent material of the printed circuit board 31, a known material such as a thermoplastic resin, a thermosetting resin, ceramic, a composite of glass (for example, a glass cloth) and a resin, or the like can be applied. Further, the number of layers is not particularly limited. As shown in FIGS. 5 to 8, the printed circuit board 31 penetrates from the arrangement surface of the connector 50 (the surface on which the housing 52 is arranged) to the back surface thereof, and one of the terminals of the connector 50 is one of the branched terminals 51. A plurality of through holes 33 into which the parts are inserted are provided. Further, as lands that are mechanically and electrically connected to the branched terminals 51 via solder, surface lands 34 are provided in the vicinity of the through holes on the connector placement surface of the printed circuit board 31, and the wall surfaces of the through holes 33 and An insertion land 35 is provided around each of the openings. The surface land 34 is provided with the through hole 33 interposed therebetween so as to face each other.

  In the present embodiment, as shown in FIG. 5, the surface land 34 and the insertion land 35 connected to the same branch terminal 51 are integrated as one land on the connector arrangement surface. . With such a configuration, the contact area between the surface land 34 and the solder 70 can be increased when the end position of the surface land 34 on the side far from the insertion land 35 is constant. If the contact area is the same, the size of the printed circuit board 31 can be reduced. In the configuration in which the surface land 34 and the insertion land 35 are integrated as described above, a portion of the insertion land 35 around the opening of the connector arrangement surface is connected to the surface land 34. In the present embodiment, the land on the connector arrangement surface is used as a surface land 34 for convenience, and the surface lands 34 facing each other with the through hole 33 interposed therebetween are substantially equal in length.

  In the present embodiment, as shown in FIG. 5, in the lands (surface land 34 and insertion land 35) connected to the same branch terminal 51, on the connector placement surface side of the printed circuit board 31. The provided portion (surface land 34) is configured to be larger than the portion provided on the back surface of the connector arrangement surface (the portion surrounding the opening of the through hole 33 in the insertion land 35). With this configuration, in the printed circuit board 31 having the front surface land 34 and the insertion land 35, the part provided on the back surface of the connector arrangement surface is more than the part provided on the connector arrangement surface side of the printed circuit board 31. Compared with a configuration in which both are large or equal, it is possible to reduce the mounting prohibited area of the electronic component 32 on the back surface of the connector arrangement surface, and thus to reduce the size of the printed circuit board 31.

  In the present embodiment, the plurality of surface lands 34 are arranged on the printed circuit board 31 along the longitudinal direction of the housing 52 corresponding to the arrangement direction of the terminals (branched terminals 51) (longitudinal direction of the housing 52). And arranged in a staggered pattern. The number of staggered stages is not particularly limited. In the present embodiment, as shown in FIG. 7, the staggered pattern has two stages in the direction away from the housing 52 of the connector 50. With such a configuration, the side fillet formed on the side surface of the branch terminal 51 can be made larger in the arrangement direction of the terminals (branch terminals 51) than the configuration in which the surface lands 34 are arranged in a line. As a result, connection reliability can be improved. Further, in the arrangement direction of the terminals (branched terminals 51), the circuit board 30 can be made smaller, and thus the electronic control device 100 can be made smaller. Further, the pattern of the wiring 36 drawn from the lands 34 and 35 can be simplified as compared with the configuration in which the surface lands 34 are arranged in a lattice pattern. Further, as shown in FIGS. 7 and 8, an electronic component 32 other than the connector 50 can be disposed in the vicinity of the through hole 33 (surface land 34). As the electronic component 32 disposed in the vicinity of the through hole 33 (surface land 34), a surge absorbing capacitor, a phase fixing resistor, or the like is effective. 7 and 8 is a surface land on which the electronic component 32 is mounted.

  Moreover, in this embodiment, as shown in FIG.7 and FIG.8, the printed circuit board 31 has two types of through-holes 33 from which a diameter differs as the through-hole 33, and the through-hole 33 with a small diameter branches. Among the shaped terminals 51, the first terminal 55 has a smaller diameter, which will be described later, and the through-hole 33 having a larger diameter corresponds to the second terminal 56 having a larger diameter than the first terminal 55. That is, in the present embodiment, the size of each through hole 33 is set in consideration of the diameter of the corresponding branch terminal 51 (55, 56). As will be described later, in the present embodiment, the first terminal 55 is a signal terminal for signal transmission, and the second terminal 56 is a power terminal for power transmission. Therefore, not only the size of the through-hole 33 but also the size of the surface land 34 and the width of the wiring 36 are set according to the amount of current flowing.

  The connector 50 is formed by arranging a plurality of terminals made of a conductive material in one direction along the plane of the printed circuit board 31 with respect to a housing 52 made of an insulating material (corresponding to the main body described in the claims). Is. Here, the terminals constituting the connector 50 are arranged along the plane of the printed circuit board 31 with respect to the housing 52 of the connector 50, and the end portion extending from the housing 52 solders the land of the printed circuit board 31 and the solder. Via at least a mechanical connection. In the present embodiment, one end portion extended from the housing 52 as a plurality of terminals is electrically and mechanically connected to the lands 34 and 35 of the printed circuit board 31 via the solder 70, and extends from the housing 52. The other end exposed is exposed to the outside of the housing 10 and electrically connected to an external connector (that is, an electrical connection function between the printed circuit board 31 and the connector 50 (external connector)). A plurality of terminals) and a small number (at least one) of terminals for improving the connection reliability of the connector 50 to the circuit board 30 without providing an electrical connection function between the connector 50 and the printed board 31. Have. Specifically, it has a branched terminal 51 having a surface portion 53 and an insertion portion 54 as a plurality of terminals that perform an electrical connection function, and has a surface mounting structure as a terminal for improving connection reliability. A reinforcing terminal 59 is provided.

  As such a terminal including the branched terminal 51, a metal plate is punched into a predetermined shape bent in advance, and a so-called punched terminal integrated with the housing 52 by insert molding, or a rod-shaped punched metal plate. A so-called bending terminal in which the terminal member is inserted into a hole provided in the housing 52 and then bent can be employed. In the present embodiment, all the terminals including the branched terminal 51 are punched terminals formed by metal plating brass, and in a state in which each part is held by the housing 52 so as not to interfere with each other, FIG. As shown in FIG. 4, the flat rectangular housings 52 are arranged along the longitudinal direction. Thus, when a punched terminal is employed as the terminal, the width of each branch terminal 51 in the arrangement direction of the terminals (branch terminals 51) (longitudinal direction of the housing 52) can be determined by the thickness of the metal plate. Therefore, by appropriately selecting the thickness of the metal plate, the stress caused by the warp of the printed circuit board 31 and the housing 52 in the longitudinal direction of the housing 52 is relieved by the elastic deformation of the branch terminal 51 and acts on the solder joint. Stress can be reduced.

  Further, as shown in FIG. 5, the branch terminal 51 extends from the housing 52 and is located near the tip of the end portion of the printed circuit board 31 connected to the lands 34 and 35, and the lands 34 and 35 and the solder 70. As a connection part to be electrically connected via the surface, a surface portion 53 connected to the surface land 34 and an insertion portion 54 connected to the insertion land 35 are provided. That is, the branched terminal 51 has the surface portion 53 of the surface mounting structure and the insertion portion 54 of the insertion mounting structure as one terminal. The surface portion 53 of the branch terminal 51 is disposed on the corresponding surface land 34 and mechanically and electrically connected to the surface land 34 via the solder 70, and the insertion portion 54 of the branch terminal 51 is inserted. Are mechanically and electrically connected to the corresponding insertion land 35 and the solder 70 in a state of being inserted into the corresponding through hole 33.

  When such a configuration is employed, the effect of positioning in the direction perpendicular to the thickness direction of the printed circuit board 31 in a state where the insertion portion 54 of the branched terminal 51 is disposed in the through hole 33 of the printed circuit board 31. Can be demonstrated. Therefore, even if the printed circuit board 31 and / or the housing 52 are deformed, for example, by warping due to a difference in linear expansion coefficient between the printed circuit board 31 and the housing 52 of the connector 50, the land 34 corresponding to the branch terminal 51, 35 can be secured. Further, the insertion portion 54 is electrically and mechanically connected to a portion in the through hole 33 of the insertion land 35 via the solder 70 in a state where a part thereof is disposed in the through hole 33. Therefore, even if the number of terminals 51 in the longitudinal direction of the housing 52 is large, the coplanarity between the surface portion 53 and the corresponding surface land 34 can be ensured. Therefore, a contact area between the branched terminal 51 (land 34, 35) and the solder 70 sufficient to satisfy the desired connection reliability can be ensured. That is, connection reliability can be improved as compared with the conventional surface mounting structure. In particular, in the present embodiment, since a plurality of terminals that perform an electrical connection function are all branch terminals 51, connection reliability can be further improved.

  In the present embodiment, for example, as shown in FIG. 5, in all the branched terminals 51, the insertion portion 54 is used for the surface in the surface portion 53 in the direction perpendicular to the thickness direction of the printed circuit board 31. It extends substantially perpendicularly to the surface of the printed circuit board 31 from a part sandwiched between parts facing the land 34. More specifically, the surface portion 53 is substantially parallel to the surface of the printed circuit board 31, and the portion facing the land for a surface 34, the connection portion with the insertion portion 54, and the surface portion along the longitudinal direction of the surface portion 53. It is configured in the order of the part facing the land 34. That is, the branched terminal 51 has a substantially T-shaped structure in which the insertion portion 54 is sandwiched by the surface portion 53. In this embodiment, the shape of the branched terminal 51 is a main feature, and the effect of the substantially T-shaped structure will be described in detail later. Such a substantially T-shaped branched terminal 51 can be realized by either a punched terminal or a bent terminal.

  Further, as shown in FIGS. 1 and 3 to 5, the branched terminals 51 are arranged in multiple stages in a direction perpendicular to the surface of the printed circuit board 31. For example, as shown in FIG. 5, in all the branched terminals 51, the extended positions from the housing 52 of the branched terminals 51 connected to the surface lands 34 excluding the surface land 34 closest to the housing 52. The height of the branch terminal 51 connected to the surface land 34 closest to the housing 52 is the same as the height relative to the connector arrangement surface of the branch terminal 51 connected to the surface land 34 closest to the housing 52 (the broken line position shown in FIG. 5). ). With such a configuration, heat can be efficiently distributed to all the branched terminals 51 during reflow. Note that the height of the branch terminal 51 connected to the surface land 34 excluding the surface land 34 closest to the housing 52 with respect to the connector placement surface at the extended position from the housing 52 is for the surface closest to the housing 52. The same effect can be expected even in a configuration in which the branch terminal 51 connected to the land 34 has a height closer to the connector arrangement surface than the height of the extended position from the housing 52 relative to the connector arrangement surface. Further, depending on the configuration, the housing 52 may be compared with a configuration in which the branch terminal 51 connected to the surface land 34 closest to the housing 52 is positioned closest to the printed circuit board 31 from the housing 52. It is also possible to increase the length of the end portion extended from. For example, the branch terminal 51 extended from a position close (low) to the printed circuit board 31 is connected to the surface land 34 away from the housing 52 and extended from a position far (high) to the printed circuit board 31. The extended branch terminal 51 may be connected to the surface land 34 close to the housing 52. According to this, the function which eases the stress concerning a solder joint part can be improved, and connection reliability can be improved by extension. However, as long as the connection reliability is ensured, the correspondence between the step position of the branch terminal 51 in the housing 52 and the lands (34, 35) in the printed circuit board 31 is not limited to the above example. In the present embodiment, as shown in FIG. 5, among all the branched terminals 51 in the insertion direction of the branched terminals 51 with respect to the housing 52, it is substantially perpendicular to the surface of the printed circuit board 31 and is held by the housing 52. An example in which the parts are arranged to overlap each other is shown. However, for example, the branch terminals 51 adjacent to each other in the longitudinal direction of the housing 52 (the arrangement direction of the terminals 51) are substantially perpendicular to the surface of the printed circuit board 31 and are held by the housing 52. It is good also as a structure shifted | deviated and arrange | positioned in the insertion direction. With such a configuration, the distance between the branched terminals 51 can be increased, so that the noise resistance can be improved when the distance between the branched terminals 51 is narrowed in the longitudinal direction of the housing 52. Further, in the configuration in which the adjacent branch terminals 51 are shifted from each other, the branch terminals 51 shifted toward the external connector in the insertion direction of the branch terminals 51 with respect to the housing 52 are the lands 34 and 35 close to the housing 52. It is preferable that the terminal 51 connected and shifted to the front side of the housing 52 is connected to the lands 34 and 35 far from the housing 52. With such a configuration, in the insertion direction of the branched terminal 51 with respect to the housing 52, the overlapping of the adjacent branched terminals 51 can be completely eliminated, and the noise resistance can be further improved. In the configuration in which the adjacent branched terminals 51 are shifted from each other, the branched terminals 51 that are shifted to the external connector side are connected to the lands 34 and 35 far from the housing 52, and the terminals 51 that are shifted to the front side of the housing 52. May be connected to the lands 34 and 35 close to the housing 52. With such a configuration, it is possible to earn a length exposed from the housing 52 of the branched terminal 51 shifted to the external connector side as compared with the above configuration, and to improve connection reliability.

  In the present embodiment, for example, as shown in FIG. 5, in all the branched terminals 51, the distal ends of the insertion portions 54 are in a state where the branched terminals 51 and the lands 34 and 35 are electrically connected. The printed board 31 has a configuration protruding to the back side of the connector arrangement surface. With such a configuration, for example, even when the printed circuit board 31 and / or the housing 52 is deformed during reflow, the connection between the branched terminal 51 and the corresponding lands 34 and 35 can be ensured more reliably. it can.

  In the present embodiment, the branch terminal 51 includes a plurality of types of terminals having different diameters. Specifically, as shown in FIGS. 2 to 8, two types of terminals 51, a first terminal 55 having a smaller diameter and a second terminal 56 having a larger diameter than the first terminal 55 are included. The first terminal 55 is used as a so-called signal terminal for signal transmission, and the second terminal 56 is used as a so-called power terminal for power transmission (electrically connected to a power element and transmitting a large current). 2 to 4, the connector 50 includes, in the longitudinal direction of the housing 52, a first terminal block 57 in which only the plurality of first terminals 55 are collected, the plurality of first terminals 55, and the plurality of terminals. At least one second terminal block 58 in which the second terminals 56 are collected is provided as a terminal block used for connection with an external connector. Specifically, it is connected to three external connectors that are electrically connected to each engine-related system, and one first terminal block 57 and two second terminal blocks 58 are used as terminal blocks for this connection. have. As shown in FIG. 4, the terminal blocks 57 and 58 are separated by the housing 52 on the connection side with the external connector. Therefore, the warp of the housing 52 can be reduced in the longitudinal direction of the housing 52.

  As described above, when the first terminal block 57 and the second terminal block 58 are used as the plurality of terminal blocks provided for connection to the external connector, for example, noise from a large current signal flowing through the second terminal 56 In consideration of the influence, the first terminals 55 for signal transmission can be distributed. In the present embodiment, among the first terminals 55, the first terminal 55 that transmits an analog signal (knock sensor signal or other analog sensor signal) that is susceptible to noise is included in the first terminal block 57, so that the digital signal is less susceptible to noise. A first terminal 55 for transmitting a signal is included in the second terminal block 58. In the land corresponding to the second terminal block 58, the land is arranged in consideration of the difference in the terminal diameter between the first terminal 55 and the second terminal 56, the influence of the noise described above, or the wiring from the land. It is necessary to pull out. On the other hand, in the land corresponding to the first terminal block 57, there are few (or no) restrictions as in the second terminal block 58, so that the land placement and the wiring extraction from the land are made efficient. Can do. That is, by having the first terminal block 57 together with the second terminal block 58, the physique of the electronic control device 100 in the direction perpendicular to the thickness direction of the circuit board 30 can be reduced.

  In the longitudinal direction of the housing 52, the arrangement of the plurality of terminal blocks provided for connection with the external connector (the arrangement of the first terminal block 57 and the second terminal block 58) is not particularly limited. In the present embodiment, as shown in FIGS. 2 to 4, the second terminal block 58 is configured at both ends of the three terminal blocks 57, 58, and the first region is located in the central region sandwiched between the second terminal blocks 58. A terminal block 57 is configured. In general, a power element in which power terminals are electrically connected via lands and wirings has a heat dissipation viewpoint (an effect of heat dissipation to the outside of the electronic control device 100 and a reduction in heat dissipation distance to the outside of the electronic control device 100 and other components (elements)). Reduced), the circuit board 30 is disposed near the edge. Accordingly, when at least one end of the plurality of terminal blocks 57 and 58 is the second terminal block 58 in the longitudinal direction of the housing 52, the wiring that electrically connects the land corresponding to the second terminal 56 and the power element. The pattern can be simplified.

  The second terminal 56 is disposed on the end side in the longitudinal direction of the housing 52 in the second terminal block 58. That is, in one connector 50, the second terminal 56 is disposed in both end regions in the longitudinal direction of the housing 52, and the first terminal 55 is disposed in a central region sandwiched between the end regions. The hole diameter of the through hole 33 corresponding to the insertion part 54 of the second terminal 56 having a larger terminal diameter than the first terminal 55 and its tolerance are the hole diameter of the through hole 33 corresponding to the insertion part 54 of the first terminal 55 and its tolerance. Bigger than. Depending on the positional accuracy of the through-hole 33 and the positional accuracy of the branch terminal 51, it is considered that the insertion portion 54 becomes less likely to enter the corresponding through-hole 33 as the number of terminals increases. However, manufacturing errors between the printed circuit board 31 and the connector 50 can be absorbed by the through holes 33 in the end region. That is, connection reliability can be ensured.

  Further, the arrangement of the branch terminals 51 (55, 56) constituting the terminal blocks 57, 58 is not particularly limited. In the present embodiment, the first terminal block 57 is configured by arranging a plurality of first terminals 55 with respect to the housing 52 in a staggered manner, as shown in FIGS. 3 and 4. Specifically, the first terminals 55 are arranged in three stages in a direction perpendicular to the plane of the printed circuit board 31. Further, as shown in FIGS. 3 and 4, the second terminal block 58 is configured by arranging a plurality of first terminals 55 and a plurality of second terminals 56 with respect to the housing 52 in a staggered manner. Specifically, in the two second terminal blocks 58, the first terminals 55 are arranged in three stages in a direction perpendicular to the plane of the printed circuit board 31, and the second terminals 56 are arranged in two stages adjacent to the first terminals 55. Has been. And the 1st terminal 55 which constitutes the 2nd terminal block 58 is the 1st terminal 55 which constitutes the 1st terminal block 57, and is the same stage from the circuit board 30 side (in this embodiment, the 1st stage-the 1st stage Each of the three stages) has the same shape as the first terminal 55. That is, the same kind of branched terminals 51 are used. With such a configuration, the types of the branched terminals 51 can be reduced, and the manufacturing cost can be reduced.

  As shown in FIGS. 2 and 3, in this embodiment, the reinforcing terminals 59 are arranged along with the branch terminals 51 along the longitudinal direction of the housing 52. And in the longitudinal direction of the housing 52, it is spaced apart from each other and is provided at a plurality of locations (four locations) to enhance the reinforcing effect. However, in the present embodiment, since the branched terminal 51 has the surface portion 53 and the insertion portion 54 as the connection portions with the corresponding lands 34 and 35, the connection reliability can be achieved even in a configuration without the reinforcing terminal 59. Sex can be secured.

  Next, a method for manufacturing the electronic control device 100 configured as described above will be described with reference to FIGS. 5, 9, and 10. FIG. 9 is a diagram illustrating a coating process that is a characteristic part of the manufacturing process of the electronic control device, where (a) is a first process of the coating process, (b) is a second process of the coating process, ( c) shows the state after the coating process is completed. FIG. 10 is a plan view showing the positional relationship between the lands connected to the terminals and the openings corresponding to the lands of the screen used in the coating process.

  In manufacturing the electronic control device 100, first, the circuit board 30 having the above-described configuration and the connector 50 having the above-described configuration are respectively prepared using a known manufacturing method. For example, the through-hole 33 is formed at a position corresponding to the insertion portion 54 of the branched terminal 51 on the printed circuit board 31 according to the thickness of the printed circuit board 31 or the diameter of the through-hole 33 by mechanical processing such as a drill or laser processing. Can be formed. Further, the surface land 34 and the insertion land 35 can be formed by a known technique such as plating or metal foil etching. In the present embodiment, the metal plate is mounted so that the distal end of the insertion portion 54 of the branched terminal 51 protrudes to the back side of the connector placement surface of the printed circuit board 31 with the connector 50 mounted on the circuit board 30. The length of the insertion portion 54 is set when the branch terminal 51 is formed by punching. Further, the surface land 34 and the insertion land 35 corresponding to the same branch terminal 51 are integrally formed.

  Next, the connector placement surface side is mounted on the prepared printed circuit board 31. First, as shown in FIGS. 9A to 9C, a predetermined number of screen printing methods are used in the through holes 33 (on the insertion lands 35), on the surface lands 34, and on the surface lands 37. The paste-like solder 70 adjusted to the viscosity is applied. In the application step, it is possible to apply the solder 70 in a lump in the through-hole 33 (on the insertion land 35), the surface land 34, and the surface land 37, but in this embodiment, The application is performed in two steps, a first step and a second step, using screens having different mask shapes.

  In the first step, as shown in FIG. 9A and FIG. 10, the opening 111 is formed at a position corresponding to the through hole 33 so as to substantially coincide (size and shape) with the through hole 33. The first screen 110 provided with (corresponding to the first opening described in the range) is used. Then, paste-like solder 70 is supplied onto the first screen 110, the squeegee 112 is run, and screen printing is executed. As a result, the solder 70 is transferred to the printed circuit board 31 side through the opening 111, and the paste-like solder 70 is filled into the through hole 33 from the connector arrangement surface side. At this time, the air in the through hole 33 escapes to the outside from the opening on the back surface side of the printed circuit board 31, so that the solder 70 can be efficiently filled in the through hole 33. The thickness (mask thickness) of the first screen 110 is preferably as thin as possible in order to fill the through hole 33 with the solder 70.

  After the first step, the second step is performed. In the second step, as shown in FIGS. 9B and 10, openings are formed at positions corresponding to the through holes 33 and the surface lands 34 so as to substantially coincide (size and shape) with the surface lands 34. A portion 114 (corresponding to the second opening described in the claims) is provided, and an opening is formed at a position corresponding to the surface land 37 so as to substantially coincide (size and shape) with the surface land 37. A second screen 113 provided with a section 115 is used. Then, paste-like solder 70 is supplied onto the second screen 113, and the squeegee 112 is run to execute screen printing. As a result, the solder 70 is transferred to the printed circuit board 31 side through the openings 114 and 115, and the paste-like solder 70 is arranged on the surface land 34 and the surface land 37 from the connector arrangement surface side. It is also laminated on the solder 70 arranged in the process. The thickness of the second screen 113 (mask thickness) is preferably as thick as possible in order to dispose the solder 70 on the surface land 34. In the present embodiment, by making the thickness of the first screen 110 thinner than the thickness of the second screen 113, the solder 70 is efficiently filled in the through-hole 33, and the surface land 34. The solder thickness is ensured.

  As described above, when the coating process is configured by a plurality of screen printing processes, more solder in the through-hole 33 can be obtained without adjusting the partial mask thickness, printing pressure, or the like as in the single screen printing process. 70 can be provided, and thus the solder 70 disposed on the surface land 34 can be thickened. Therefore, the contact area between the surface portion 53 and the insertion portion 54 and the solder 70 and between the lands 34 and 35 and the solder 70 can be increased. Moreover, although it is the structure which screen-prints in multiple times, the stain | pollution | contamination (transfer from the printed circuit board side) of the screen back surface can be prevented. Furthermore, since the solder 70 is also filled in the through-hole 33 in advance, the solder 70 flowing into the through-hole 33 from the surface land 34 is reduced or reflowed into the through-hole 33 in a reflow process described later. 70 can be eliminated.

  When screen printing is performed in a plurality of times, the solder 70 transferred to the printed circuit board 31 by the first screen printing (first process) adheres to the back surface of the screen during the second screen printing (second process). As a result, problems such as dirt may occur. On the other hand, in the present embodiment, as shown in FIG. 10, the second step is more than the opening 111 of the first screen 110 used in the first step in the direction perpendicular to the thickness direction of the printed board 31. The opening 114 of the second screen 113 used in the above is larger, and the opening 111 is included in the opening 114. Therefore, the above-mentioned contamination problem can be prevented. In addition, the area including the through hole 33 and the surface land 34 corresponding to the same branched terminal 51 is formed as one opening 114, so that the number of openings is reduced, which also causes contamination. Is trying to reduce. Further, in the second step, the printing process is reduced by applying the solder 70 on the surface lands 37 corresponding to the electronic components 32 other than the connector 50, and this also reduces the occurrence of contamination. ing. Also, the solder thickness on the surface land 37 is ensured.

  When the first step and the second step (coating step) are completed, as shown in FIG. 9C, the solder is placed on the surface land 34, the insertion land 35 in the through hole 33, and the surface land 37. A printed circuit board 31 on which 70 is arranged is prepared. Then, the electronic component 32 including the connector 50 is positioned and arranged on the connector arrangement surface of the printed board 31. Thereby, each insertion part 54 penetrates the solder 70 and is inserted into the through hole 33. In addition, each surface portion 53 comes into contact with the solder 70 disposed on the corresponding surface land 34. Thus, in this embodiment, since the insertion part 54 is inserted in the through-hole 33, positioning of the connector 50 with respect to the printed circuit board 31 is easy. Moreover, since the insertion part 54 plays the role of an anchor, it is possible to suppress the positional deviation between the branched terminals 51 and the corresponding lands 34 and 35 in the direction perpendicular to the thickness direction of the printed circuit board 31.

  Then, reflow is performed in a state where the electronic component 32 including the connector 50 is disposed on the printed circuit board 31. The melted solder 70 spreads out and is preferably cooled and solidified in a state where a fillet is formed between the melted solder 70 and the surface portion 53.

  In the present embodiment, the distal end of the insertion portion 54 protrudes to the back side of the connector arrangement surface of the printed circuit board 31, and the solder 70 is filled up to the middle of the through hole 33 in the coating process. Further, the surface land 34 and the insertion land 35 are integrated. Therefore, when the surface portion 53 is in contact with the solder 70 on the surface land 34, a part of the solder 70 on the surface land 34 is formed on the wall surface of the through hole 33 during reflow. And the insertion portion 54 flow into a gap (hereinafter, referred to as a gap between the through-hole 33 and the insertion portion 54) facing each other by capillary action and / or gravity. FIG. 5 shows a structure in which the solder 70 is cooled and solidified in this state. Further, when the contact between the surface portion 53 and the solder 70 is not sufficient before reflow due to the variation in the height direction of the branch terminal 51 with respect to the connector arrangement surface, the gap between the through hole 33 and the insertion portion 54 is interposed. The melted solder 70 is wetted by the capillary phenomenon on the surface portion 53, and a desired contact area between the branched terminal 51 and the solder 70 sufficient to ensure connection reliability can be ensured. In other words, in any case, the branch terminal 51 and the lands 34 and 35 can be electrically and mechanically connected (joined) via the solder 70. In particular, in the present embodiment, the solder 70 is efficiently filled in the through-hole 33 in the coating step and the thickness of the solder 70 on the surface land 34 is ensured, so that the connection reliability can be further improved. In addition, since the solder 70 is filled in the through hole 33 in advance, the amount of the solder 70 flowing into the through hole 33 from the surface land 34 in the reflow process is set so that the solder 70 is not filled in the through hole 33 in advance. It can reduce compared with. Therefore, this also ensures the thickness of the solder 70 on the surface land 34 and further improves the connection reliability. Further, since a sufficient amount of solder 70 is disposed in the through hole 33, generation of voids can be suppressed.

  During reflow, due to the difference in coefficient of linear expansion between the printed circuit board 31 and the housing 52 of the connector 50, at least one of the printed circuit board 31 and the housing 52 before the solder 70 is cooled and solidified (melted state). Deformation such as warping may occur. In particular, like the connector 50 shown in the present embodiment, it has a shape that is long in one direction in the direction perpendicular to the thickness direction of the printed circuit board 31, and a plurality of terminals (branched terminals 51) extend along the longitudinal direction. In the arrangement arranged in this manner, the amount of deformation described above increases toward the end in the longitudinal direction. That is, in the connection between the branch terminal 51 and the corresponding lands 34 and 35, the connection reliability tends to decrease toward the end side. However, in the present embodiment, as described above, the insertion portion 54 inserted into the through-hole 33 serves as an anchor, so that the branching occurs in a state (molten state) before the solder 70 is cooled and solidified. It is possible to prevent the positional deviation between the land terminal 51 and the corresponding lands 34, 35.

  After the reflow on the connector placement surface side of the printed circuit board 31 is completed, the reflow mounting of the electronic component 32 is similarly performed on the back surface of the printed circuit board 31. Thereby, the electronic control apparatus 100 shown in FIG. 1 is formed.

  As described above, in the present embodiment, the connector 50 includes the branch terminal 51 having the surface portion 53 and the insertion portion 54 as a terminal that provides an electrical connection function, and the insertion portion 54 of the branch terminal 51 passes therethrough. Reflow is performed in a state where the hole 33 is inserted. Therefore, connection reliability can be improved as compared with the conventional surface mounting structure.

  In addition, since the insertion portion 54 is inserted into the through hole 33, flow soldering is not required, so that the mounting prohibited area of the electronic component 32 can be reduced on the back surface of the connector placement surface of the printed circuit board 31. . That is, the mounting density can be improved as compared with the conventional insertion mounting structure.

  Next, the effect of the shape of the branched terminal 51, which is the main characteristic part of the electronic control device 100 according to the present embodiment, will be described in detail with reference to FIGS. 11 and 12 are diagrams illustrating the effect of improving the mounting density, and FIG. 11 is a diagram illustrating the electronic control device according to the present embodiment, in which (a) is an enlarged side view of the branched terminal; b) is an enlarged plan view near the surface land. FIGS. 12A and 12B are diagrams showing an electronic control device having a branched terminal having an inverted L-shaped structure as a comparison target, wherein FIG. 12A is an enlarged side view of the branched terminal, and FIG. It is an enlarged plan view. FIG. 13 and FIG. 14 are diagrams showing the effect of suppressing the displacement amount, and FIG. 13 is an enlarged plan view near the surface land in the electronic control device according to the present embodiment. FIG. 14 is an enlarged plan view of the vicinity of a surface land in an electronic control device having a branch terminal having an inverted L-shaped structure as a comparison target. 15 and 16 are diagrams showing the effect of improving the connection reliability, and FIG. 15 is an enlarged cross-sectional view of the vicinity of the surface land in the electronic control device according to the present embodiment. FIG. 16 is an enlarged cross-sectional view of the vicinity of a surface land in an electronic control device having a branched terminal having an inverted L-shaped structure as a comparison target. 17 and 18 are also diagrams showing the effect of improving the connection reliability. FIG. 17 is an enlarged cross-sectional view of the vicinity of the land for the surface in the electronic control device according to the present embodiment. FIG. 18 is an enlarged cross-sectional view of the vicinity of the surface land in the electronic control device provided with a branch terminal having an inverted L-shaped structure as a comparison target. FIG. 19 is also an enlarged cross-sectional view of the vicinity of the surface land in the electronic control device according to the present embodiment, which shows the effect of improving the connection reliability. 20 and 21 are diagrams showing the effect of stress relaxation, and FIG. 20 is an enlarged cross-sectional view of the vicinity of the surface land in the electronic control device according to the present embodiment. FIG. 21 is an enlarged cross-sectional view of the vicinity of the surface land in the electronic control device provided with a branch terminal having an inverted L-shaped structure as a comparison target. Note that, in the electronic control device as a comparison target, the same two-digit numbers in the two hundreds are used for the same constituent elements as those in the electronic control device shown in the present embodiment. Specifically, reference numeral 231 is a printed circuit board, reference numeral 233 is a through hole, reference numeral 234 is a surface land, reference numeral 235 is an insertion land, reference numeral 251 is a branched terminal, reference numeral 253 is a surface portion, reference numeral 254 is an insertion portion, Reference numeral 270 is solder.

  As shown in FIGS. 11 and 12, the lengths of the portions substantially parallel to the printed circuit boards 31 and 231 are both L1 (in other words, the lengths of the surface portions 53 and 253 are the same length), and the through-holes have the same diameter. When the insertion portions 54 and 254 are inserted into the first and second portions 33 and 233, the clearance between the end portions of the surface portions 53 and 253 and the end portions of the surface lands 34 and 234 is L2, and the tolerance of the through holes 33 and 233 is L3. And Then, the length L4 (the length along the longitudinal direction of the surface portion 53 as shown in FIG. 11B) of the surface land 34 corresponding to the branch terminal 51 having a substantially T-shaped structure is L2 equal to L2. The value is doubled. On the other hand, the length L5 (the length along the longitudinal direction of the surface portion 53 as shown in FIG. 12B) of the surface land 234 corresponding to the branch terminal 251 having the inverted L-shape is L1 and L2. Furthermore, the larger value of L2 and L3 is added. Therefore, the length L4 of the surface land 34 can be made equal to or less than the length L5 of the surface land 234. In general, as shown in FIGS. 11B and 12B, L2 <L3. That is, as shown in the present embodiment, when the branch terminal 51 having a substantially T-shaped structure is employed, the electronic component 32 can be used as long as the size in the direction perpendicular to the thickness direction of the printed boards 31 and 231 is the same. The mounting density can be improved as compared with the branched terminal 251 having an inverted L-shaped structure. Further, if the mounting density is the same, the size in the direction perpendicular to the thickness direction of the printed circuit boards 31 and 231 can be made smaller than that of the branch terminal 251 having the inverted L-shaped structure. In addition, the effect of the branch terminal 51 having the substantially T-shaped structure described above is more effective in the structure in which the insertion portion 54 extends from the substantially center position of the surface portion 53.

  Further, as shown in FIGS. 13 and 14, the insertion portion 54, 254 is inserted into the through holes 33, 233 of the printed circuit boards 31, 231 and the insertion portion 54, 254 is inserted into the through hole 33, 233. It is assumed that the surface portions 53 and 253 are displaced from the longitudinal direction of the surface lands 34 and 234 with respect to the surface lands 34 and 234. The lengths of the portions substantially parallel to the printed circuit boards 31 and 231 are both L1 (in other words, the lengths of the surface portions 53 and 253 are the same length), and the widths of the surface lands 34 and 234 are both Let L6 be the same width. At this time, in the branched terminal 251 having the inverted L-shaped structure, as shown in FIG. 14, the positional deviation amount Y in the direction perpendicular to the longitudinal direction at the longitudinal end portion of the surface portion 253 is substantially equal to L1 × sin θ. It becomes equal value. On the other hand, in the branch terminal 51 having a substantially T-shaped structure, as shown in FIG. 13, in the longitudinal direction of the surface portion 53, a region having a long length among two regions sandwiching the insertion portion 54 therebetween. However, the positional displacement amount X in the direction perpendicular to the longitudinal direction at the longitudinal end portion of the surface portion 53 is smaller than the positional displacement amount Y described above. For example, when the insertion portion 54 extends from the center position of the surface portion 53, the displacement Y is a value substantially equal to L1 × sin θ / 2. Therefore, the amount of displacement can be made smaller in the branch terminal 51 having a substantially T-shaped structure than in the branch terminal 251 having an inverted L-shaped structure. That is, the branch terminal 51 (surface portion 53) having a substantially T-shaped structure is less likely to protrude from the surface land 34 and a side fillet is easily formed, so that connection reliability (quality) is easily ensured. In addition, the effect of the branch terminal 51 having the substantially T-shaped structure described above is more effective in the structure in which the insertion portion 54 extends from the substantially center position of the surface portion 53.

  As shown in FIGS. 15 and 16, the insertion portions 54 and 254 are inserted into the through holes 33 and 233 with the branched terminals 51 and 251 tilted in the same direction with respect to the surfaces of the printed circuit boards 31 and 231. Each of them is inserted and soldered, and part of the surface of the surface portions 53, 253 facing the surface lands 34, 234 is exposed without contacting the solder 70, 270 on the surface lands 34, 234. And 15 and 16, the longitudinal ends of the surface portions 53 and 253 (the side far from the connector housing) are inclined at the same angle in the direction away from the surfaces of the printed circuit boards 31 and 231. Further, the lengths of the portions of the branched terminals 51 and 251 that are substantially parallel to the printed circuit boards 31 and 231 are both L1 (in other words, the lengths of the surface portions 53 and 253 are the same length). In such a structure, the surface of the surface portions 53 and 253 facing the surface lands 34 and 234 and the corners of the contact ends with the solder 70 and 270 (boundary portions with the external atmosphere) serve as solder joints. Cracks are likely to occur. Accordingly, in the branch terminal 251 having the inverted L-shaped structure shown in FIG. On the other hand, in the branch terminal 51 having a substantially T-shaped structure shown in FIG. 15, even if a crack may occur on one surface portion 53 (the side far from the housing) sandwiching the insertion portion 54, The other surface portion 53 (side closer to the housing) has a narrow facing distance to the surface land 34 in an inclined state, and the surface facing the surface land 34 is in contact with the solder 70 on the surface land 34. Side fillets are also formed. In other words, the branch terminal 51 having a substantially T-shaped structure is easier to ensure connection reliability (quality). In addition, the effect of the branch terminal 51 having the substantially T-shaped structure described above is more effective in the structure in which the insertion portion 54 extends from the substantially center position of the surface portion 53.

  Further, as shown in FIG. 17, in the case of the branch terminal 51 having a substantially T-shaped structure, the surface land 34 of the printed circuit board 31 corresponds to the surface portion 53 with the respective portions facing each other with the through hole 33 interposed therebetween. And formed large. Therefore, even if the solder 70 on the surface land 34 flows into the through hole 33 at the time of reflow, the solder thickness on the respective surface lands 34 facing each other across the through hole 33 can be kept substantially equal. On the other hand, as shown in FIG. 18, in the case of the branched terminal 251 having an inverted L-shaped structure, the surface land 234 of the printed circuit board 231 is the surface portion 253 among the portions facing each other with the through hole 33 interposed therebetween. Although the part corresponding to is formed large, the part that does not face the surface portion 253 (the part around the opening of the through hole of the insertion land 254) is formed small in consideration of improvement in mounting density. Therefore, when the solder 70 on the surface land 234 flows into the through-hole 33 during reflow, the solder thickness on each surface land 34 facing each other across the through-hole 33 may vary. In other words, the branch terminal 51 having a substantially T-shaped structure is easier to ensure connection reliability (quality).

  Further, as shown in FIG. 19, in the case of the branch terminal 51 having a substantially T-shaped structure, even if the surface facing the surface land 34 of the surface portion 53 is not in contact with the solder 70 in the state before reflow, Due to the capillary phenomenon in the region where the portion 53 and the surface land 34 are opposed, the solder 70 wets on the surface of the surface portion 53 facing the surface land 34 and fillets are formed. This fillet is formed in each surface part 53 which opposes on both sides of the insertion part 54. On the other hand, although not illustrated, in the case of the branched terminal 251 having an inverted L-shaped structure, the surface portion 253 is provided only on one side with respect to the insertion portion 254, so that there are few fillet portions formed on the surface portion 253. That is, the connection reliability can be improved by the branch terminal 51 having a substantially T-shaped structure.

  Further, in the case of the branch terminal 51 having a substantially T-shaped structure, the tip of a portion extending from the housing is bent to form a surface portion 53 substantially parallel to the surface of the printed circuit board 31. The insertion portion 54 extends from the portion sandwiched by the portion facing the surface land 34 toward the printed circuit board 31 substantially perpendicularly to the surface of the printed circuit board 31. As shown in FIG. 20, when stress (in the arrow in FIG. 20) in the direction perpendicular to the surface of the printed circuit board 31 acts on the solder joint between the branch terminal 51 and the printed circuit board 31, After passing through the printed circuit board 31 or the surface portion 53, it is transmitted to the printed circuit board 31 through the insertion portion 54. Therefore, stress can be relaxed at the surface portion 53. On the other hand, in the case of the branched terminal 251 having an inverted L-shaped structure, an insertion portion 254 that is substantially perpendicular to the surface of the printed circuit board 31 is formed on the extension of the portion extending from the housing, and the insertion portion 254 (or the housing) The surface portion 253 extends substantially parallel to the surface of the printed circuit board 31 from the portion extended from the surface. As shown in FIG. 21, when stress (in the arrow in FIG. 21) in the direction perpendicular to the surface of the printed circuit board 231 acts on the solder joint between the branch terminal 251 and the printed circuit board 231, the surface part 253 almost passes through. Without being transmitted to the printed circuit board 231 via the insertion portion 254. That is, the connection reliability can be improved by the branch terminal 51 having a substantially T-shaped structure.

  In the present embodiment, an example is shown in which the coating process is divided into the first process and the second process using screens 110 and 113 having different mask shapes, respectively. However, the number of screen printings is not limited to two. It is good also as 3 times or more. Also, it is possible to apply the solder 70 in a lump in the through-hole 33 (on the land 35), on the land 34, and on the surface land 37 by one screen printing. For example, as shown in FIG. 22, the thickness (mask thickness) of the screen 116 may be partially changed. Connection is made by making the corresponding portions of the lands 34 and 35 that require a lot of solder 70 to fill the solder hole 70 in the through holes 33 thicker than the portions corresponding to the surface lands 37 of the electronic component 32. Reliability can be improved. FIG. 22 is a cross-sectional view showing a modification of the coating process. In addition, the travel speed of the squeegee 112 is adjusted (slower than the surface land 37 on the lands 34 and 35), or the printing pressure is adjusted (stronger than the surface land 37 on the lands 34 and 35). ) To improve connection reliability.

  Further, in the present embodiment, the surface lands 34 are arranged in a two-stage staggered manner, and the first terminals 55 are arranged in three stages with respect to the housing 52 in the direction perpendicular to the plane of the printed circuit board 31. An example is shown in which 56 are arranged in two stages. However, the number of staggered stages is not limited to two. Since the type of the branch terminal 51 is determined by the number of stages of the branch terminal 51 and the number of stages of the surface land 34, the number of stages of the branch terminals 51 (first terminal 55 and second terminal 56) is staggered. If the number of land lands is n times (n is an integer of 2 or more), the types of terminals can be reduced.

  In the present embodiment, as shown in FIG. 7, for example, the external shape of the surface land 34 is rectangular in the direction perpendicular to the thickness direction of the printed circuit board 31. That is, in the insertion land 35, an example is shown in which the opening peripheral portion of the through hole 33 (shown as a part of the surface land 34) is included in the rectangular surface land 34. However, depending on the diameter of the branch terminal 51 (the diameter of the through hole 33), as shown in FIG. 23, the portion around the opening of the through hole 33 (shown as a part of the surface land 34) in the insertion land 35. May be larger than the surface land 34 in the longitudinal direction of the housing 52. In this case, as shown in FIG. 23, if the positions of the through holes 33 and the surface lands 34 in the second stage (upper side of the drawing) far from the housing 52 are shifted in the separating direction of the housing 52, The physique of the printed circuit board 31 in the direction, and thus the physique of the electronic control device 100 can be reduced in size. FIG. 23 is a plan view of a printed board 31 showing a modification. In this case, since the lengths of the branched terminals 51 extending from the housing 52 are different, the types of terminals are increased. However, as described above, if the number of stages of the branched terminals 51 is n times the number of stages of the surface lands 34 arranged in a staggered manner (n is an integer of 2 or more), the types of terminals can be reduced. For example, as shown in FIG. 23, in the case where the surface land 34 has two stages, if the number of stages of the branch terminals 51 is, for example, four, the position of the second surface land 34 may be shifted. The types of terminals 51 can be left as they are. Specifically, with respect to the four surface lands 34 shown in FIG. 23, from the right (second surface land 34) to the left in FIG. The branched terminal 51, the third-stage branched terminal 51, and the second-stage branched terminal 51 can be made to correspond to each other. In FIG. 23, for convenience, the solder and the solder resist are omitted.

  Further, in the present embodiment, an example in which reflow mounting on the back surface side is executed after completion of reflow on the connector arrangement surface side in the printed circuit board 31 is shown. However, after the reflow on the back surface side of the connector placement surface on the printed circuit board 31 is completed, the reflow mounting on the connector placement surface side may be executed. In this case, even if the insertion portion 54 is configured to protrude to the back side of the connector arrangement surface of the printed circuit board 31, the insertion portion 54 does not hinder the heat of reflow.

(Second Embodiment)
Next, 2nd Embodiment of this invention is described based on FIG.24 and FIG.25. FIG. 24 is an enlarged cross-sectional view of the periphery of the printed circuit board and the connector mounting portion for explaining the concern in the structure shown in the first embodiment. FIG. 25 is an enlarged cross-sectional view of the periphery of the printed circuit board and the connector mounting portion in the electronic control device according to the second embodiment.

  Since the electronic control device and the manufacturing method thereof according to the second embodiment are often the same as those according to the first embodiment, the detailed description of the common parts will be omitted below, and different parts will be described mainly. Moreover, in this embodiment, the same code | symbol shall be provided about the component similar to 1st Embodiment.

  In 1st Embodiment, the insertion part 54 of the branched terminal 51 showed the example protruded in the back surface side of the connector arrangement | positioning surface of the printed circuit board 31 in the state mounted by reflow. In such a configuration, the gap (opposite region) between the through hole 33 and the insertion portion 54 is formed over the entire thickness direction of the printed circuit board 31, and thus depends on the thickness of the printed circuit board 31. It is difficult to completely fill the gap by filling the through hole 33 with the solder 70. When the gap is not completely filled with the solder 70, it is considered that a part of the solder 70 disposed on the surface land 34 flows into the through hole 33 due to capillary action and / or gravity during reflow. . As a result, the thickness of the solder 70 on the surface land 34 is reduced, and for example, as shown in FIG. It is possible that things will not be done. Further, the solder 70 filled in the gap is insufficient, and for example, as shown in FIG. 24, there is a possibility that a cavity 71 (void) is generated in the through hole 33.

  On the other hand, in the present embodiment, the tip of the insertion portion 54 of the branch terminal 51 is in the same position as the back surface of the connector placement surface of the printed circuit board 31 in the reflow mounted state, or an electronic component. It is characterized in that it is positioned between the arrangement surface and its back surface. FIG. 25 shows an example in which the tip of the insertion portion 54 of the branch terminal 51 is positioned between the electronic component placement surface and the back surface thereof as an example.

  As described above, when the distal end of the insertion portion 54 does not protrude toward the back side of the connector arrangement surface of the printed circuit board 31, the thickness of the printed circuit board 31 is larger than the configuration in which the distal end of the insertion portion 54 protrudes toward the back surface side of the connector arrangement surface. Since the length of the gap in the vertical direction is short, the amount of solder 70 flowing into the through hole 33 from the surface land 34 can be reduced. That is, the solder thickness on the surface land 34 is ensured, and a good fillet (side fillet) is easily formed on the surface portion 53 as shown in FIG. In addition, since the length of the gap in the thickness direction of the printed circuit board 31 is short, the amount of solder necessary for filling the gap should be less than the configuration in which the distal end of the insertion portion 54 protrudes to the back side of the connector placement surface. Can do. That is, the hollow portion 71 is hardly formed in the through hole 33. Therefore, connection reliability can be improved without enlarging the surface land 34 and increasing the amount of solder 70.

  Further, since the tip of the insertion portion 54 does not protrude to the back side of the connector placement surface of the printed circuit board 31, the insertion portion 54 blocks the heat of reflow when mounting electronic components disposed on the back surface side of the printed circuit board 31. There is no. Therefore, the connection reliability on the back surface side of the printed circuit board 31 can be improved.

  In the configuration in which the distal end of the insertion portion 54 does not protrude to the back side of the connector placement surface of the printed circuit board 31, if capillary action acts on the gap between the through hole 33 and the insertion portion 54, as shown in FIG. The end surface 72 (in other words, the surface exposed on the back surface side of the printed circuit board 31) of the disposed solder 70 on the back surface side of the connector mounting surface is in contact with the insertion land 35 in the thickness direction of the printed circuit board 31. It becomes a shape (bow shape) which has a site | part close | similar to a connector arrangement | positioning surface rather than a site | part and a contact site | part with the insertion part 54. FIG. On the other hand, in the configuration in which the distal end of the insertion portion 54 protrudes to the back surface side of the connector arrangement surface of the printed circuit board 31, the capillary phenomenon acts in the opposing region (gap) between the through hole 33 and the insertion portion 54. Capillary phenomenon does not act on the protruding portion of the portion 54 from the through-hole 33, and the solder 70 spreads out by gravity. Therefore, as shown in FIG. 24, the surface corresponding to the above-described end surface 72 is a connector arrangement surface from the contact portion with the insertion land 35 toward the contact portion with the insertion portion 54 in the thickness direction of the printed circuit board 31. It becomes a shape that approaches.

  Further, in the present embodiment, an example is shown in which the branched terminal 51 whose tip does not protrude on the back surface side of the connector arrangement surface of the printed circuit board 31 has the same substantially T-shaped structure as in the first embodiment. Thus, when the branch terminal 51 having a substantially T-shaped structure is employed, the above-described effects can be exhibited in addition to the effects described in the first embodiment. Therefore, the mounting density and connection reliability can be further improved. However, the structure of the branched terminal 51 having the effect shown in the second embodiment is not limited to the above-described substantially T-shaped structure. For example, the branch of the inverted L-shaped structure as shown in FIGS. A shaped terminal 51 can also be employed. FIG. 26 and FIG. 27 are both enlarged sectional views showing modifications of the branch terminal 51. In FIG. 26, an insertion portion 54 that is substantially perpendicular to the surface of the printed circuit board 31 is formed on the extension of the portion that extends from the housing, and the printed circuit board 31 extends from the insertion portion 54 (or the portion that extends from the housing). A surface portion 53 extends substantially parallel to the surface of the surface. In FIG. 27, the tip of the portion extending from the housing is bent to form a surface portion 53 substantially parallel to the surface of the printed circuit board 31, and the tip of the surface portion 53 is bent to print the printed circuit board 31. An insertion portion 54 is formed substantially perpendicularly to the surface of this. Any structure can be constituted by either a punched terminal or a bent terminal.

  In the present embodiment, as shown in FIG. 25, the length of the insertion portion 54 is set so that the tip of the insertion portion 54 is positioned between the connector placement surface of the printed circuit board 31 and the back surface thereof. An example was shown. However, the same effect can be expected even in a configuration in which the distal end of the insertion portion 54 is substantially at the same position as the back surface of the connector placement surface of the printed circuit board 31.

(Third embodiment)
Next, a third embodiment of the present invention will be described with reference to FIG. FIG. 28 is a plan view of the periphery of the mounting portion in a state where the connector is mounted on the printed board in the electronic control device according to the third embodiment.

  Since the electronic control device 100 and the manufacturing method thereof according to the third embodiment are often in common with those according to the first embodiment, the detailed description of the common portions will be omitted, and different portions will be mainly described below. Moreover, in this embodiment, the same code | symbol shall be provided about the component similar to 1st Embodiment.

  In 1st Embodiment, all the terminals which provide an electrical connection function showed the example which is the branched terminal 51. FIG. On the other hand, in the present embodiment, as shown in FIG. 28, for example, the connector 50 includes a surface-mounted terminal 60 together with the branch terminal 51 as a terminal that provides an electrical connection function. . In other words, the terminal connected to the solder has a branched terminal 51, a reinforcing terminal 59, and a surface mount type terminal 60. The surface-mounted terminal 60 has only the surface portion 53 of the branched terminal 51 as a connection portion with the land. That is, only the insertion portion 54 is not provided, and the subsequent configuration is substantially the same as that of the branch terminal 51. Further, the through hole 33 is not formed in a portion corresponding to the surface mount type terminal 60 of the printed circuit board 31, and the surface land 34 is formed corresponding to the surface mount type terminal 60 on the connector arrangement surface.

  As shown in the first embodiment, if all the terminals that provide the electrical connection function are the branched terminals 51, the printed circuit board 31 has to be provided with the through holes 33 as many as the branched terminals 51. If the configuration includes the surface-mounted terminal 60 together with the branched terminal 51, the number of through holes 33 can be reduced. Therefore, if the number of terminals is the same, the connection reliability is slightly inferior to that of the configuration in which all of the terminals are branched terminals 51, but can be improved over the conventional surface mounting structure and insertion mounting structure. Further, compared to the configuration in which all are branched terminals 51, the printed circuit board 31 can be downsized and the electronic control device 100 can be downsized in the direction perpendicular to the thickness direction of the printed circuit board 31. Further, the degree of freedom of the wiring 36 formed on the printed board 31 can be improved.

  In the present embodiment, as shown in FIG. 28, the second terminal 56 is a branched terminal 51, the first terminal 55 is a surface-mounted terminal 60, and the longitudinal direction of the housing 52 (the surface of the printed circuit board 31). A plurality of branched terminals 51 are arranged so as to sandwich the surface-mounted terminal 60 therebetween. Further, in the longitudinal direction of the housing 52, both end regions are respectively configured by at least one branch terminal 51.

  Thus, if the branched terminal 51 is disposed so that the surface-mounted terminal 60 is sandwiched therebetween, it is effective for suppressing the positional deviation between the terminal and the corresponding land. Further, as described above, as the number of terminals increases, it becomes more difficult to ensure the coplanarity of the connection portion with the land of the terminals. For example, the deformation amount of the printed circuit board 31 is from the center of the housing 52 in the longitudinal direction of the housing 52. It gets bigger as you leave. Therefore, when both the end regions are configured by the branched terminals 51, it is possible to more effectively suppress the positional deviation between the terminals and the corresponding lands.

  Further, since the second terminals 56 arranged in both end regions are the branched terminals 51, as in the first embodiment, manufacturing errors of the printed circuit board 31 and the connector 50 are absorbed by the through holes 33 in the end regions. can do. That is, connection reliability can be ensured.

  In addition, arrangement | positioning of the branched terminal 51 and the surface mount type terminal 60 is not limited to the said example. Any combination is possible. In the present embodiment, the example in which the first terminal 55 is the surface mount type terminal 60 and the second terminal 56 is the branched terminal 51 is shown, but at least a part of the first terminal 55 is the branched terminal 51, At least a part of the second terminal 56 may be the surface mount type terminal 60. Further, the configuration in which the plurality of branched terminals 51 are arranged so that the surface-mounted terminals 60 are sandwiched in the longitudinal direction of the housing 52 is not limited to the above example. For example, in the longitudinal direction of the housing 52, the branched terminals 51 and the surface mount type terminals 60 may be alternately arranged.

  Further, as shown in the present embodiment, in the configuration in which the connector 50 is divided into a plurality of terminal blocks 57 and 58, the terminal blocks 57 and 58 are connected to different external connectors. Therefore, in each of the terminal blocks 57 and 58, the respective end regions may be constituted by the branched terminals 51, and the central region may be constituted by the surface mount type terminals 60. Thereby, connection reliability can be improved in each of the terminal blocks 57 and 58.

  The configuration shown in the present embodiment can be combined with the configuration shown in the second embodiment as well as the configuration shown in the first embodiment.

(Fourth embodiment)
Next, 4th Embodiment of this invention is described based on FIG.29 and FIG.30. FIG. 29 is a diagram for explaining a concern when manufacturing the electronic control device shown in the second embodiment by the manufacturing method shown in the first embodiment. (A) is before the reflow process, (b). Indicates after the reflow process. FIG. 30 shows a part of the manufacturing process of the electronic control device according to the fourth embodiment, where (a) shows the reflow process and (b) shows the removal process after reflow.

  Since the electronic control device and the manufacturing method thereof in the fourth embodiment are in common with the configuration shown in the second embodiment (the manufacturing method shown in the first embodiment is applied to the configuration shown in the second embodiment). Hereinafter, detailed description of the common parts is omitted, and different parts are mainly described. Moreover, in this embodiment, the same code | symbol shall be provided about the component similar to 2nd Embodiment.

  When manufacturing the electronic control device 100 (configuration in which the distal end of the insertion portion 54 does not protrude to the back side of the connector placement surface of the printed circuit board 31) shown in the second embodiment by the manufacturing method shown in the first embodiment, for example, penetration Depending on the size of the gap between the hole 33 (insertion land 35) and the insertion portion 54, the viscosity of the molten solder 70, the specific gravity, and the like, as shown in FIG. Even if a sufficient amount of solder 70 for securing connection reliability is filled from the connector arrangement surface in the hole 33, the melted solder 70 is reflowed as shown in FIG. 29B, for example. It is also conceivable to flow out of the through hole 33 by flowing to the back side of the connector arrangement surface. One cause of the occurrence of such a phenomenon is that, for example, the force of trying to fasten the solder 70 in the gap by a capillary phenomenon such as the diameter of the through-hole 33 is very large with respect to the diameter of the insertion portion 54, or the like. It can be considered that the downward force (in the direction of the back surface of the printed circuit board 31) exceeds. When such a phenomenon occurs, the amount of the solder 70 on the surface land 34 may decrease, or the hollow portion 71 may be generated in the through hole 33, which may reduce connection reliability. In addition, the contact area between the insertion portion 54 and the solder 70 may be reduced, and connection reliability may be reduced. Furthermore, the solder 70 may fall out of the printed circuit board 31 from the through-hole 33 and cause a problem. Depending on the viscosity of the solder 70, it is conceivable that the paste-like solder 70 flows to the back side of the connector arrangement surface and escapes out of the through-hole 33 not only at the time of reflow but also in the coating process. The problem in this case is the same as described above.

  On the other hand, the present embodiment is characterized in that the solder 70 is prevented from escaping out of the through hole 33 until the reflow process is completed. Specifically, after the coating process is completed and before the reflow process is performed, the back side opening of the through hole 33 is formed on the back side of the connector placement surface of the printed circuit board 31 as shown in FIG. A lid step for fixing the insulating member 130 so as to close it (for example, attaching a resin film) is performed. Then, since the reflow process is performed in a state where the opening on the back surface side of the through hole 33 is closed by the insulating member 130, the melted solder 70 stays in the through hole 33 as shown in FIG. Become. And after completion | finish of a reflow process, as shown in FIG.30 (b), the insulating member 130 is removed.

  As described above, according to the method for manufacturing the electronic control device 100 according to the present embodiment, it is possible to suppress the solder 70 melted during reflow from escaping out of the through hole 33. Therefore, connection reliability can be ensured.

  In addition, when the inside of the through hole 33 is hermetically sealed by the insulating member 130, when the air in the through hole 33 (cavity portion 71) expands or contracts due to cold heat during reflow, the solder joint portion It is conceivable that stress is applied to the metal and the connection reliability is lowered (for example, cracks are generated). On the other hand, in this embodiment, as shown in FIG. 30 (a), the through hole 33 and the outside of the printed circuit board 31 can be ventilated in a part of the portion that covers the opening of the insulating member 130, and solder is used. One vent portion smaller in diameter than the through-hole 33 is provided as the vent portion 131 that does not allow the passage of 70. Therefore, it is possible to suppress a decrease in connection reliability.

  Moreover, when using the insulating member 130 having the ventilation part 131, it is possible to perform the lid process before performing the application process instead of performing the reflow process. In this case, since the air in the through hole 33 can be released to the outside through the ventilation part 131, the solder 70 can be efficiently filled in the through hole 33. In addition, the paste-like solder 70 can be prevented from escaping out of the through hole 33. Therefore, connection reliability can be ensured.

  The form of the insulating member 130 is not limited to the above example. For example, as shown in FIG. 31, the ventilation portion 132 may have a mesh portion or a porous portion. Moreover, it is good also as a structure without the ventilation parts 131 and 132. FIG. FIG. 31 is a cross-sectional view showing a modified example of the insulating member 130.

  Moreover, in this embodiment, the example which removes the insulating member 130 after a reflow process was shown. However, without removing the insulating member 130, the electronic control device 100 may be configured such that the insulating member is fixed to the back surface of the connector placement surface of the printed circuit board 31. For example, in FIG. 32, for example, the same material as the base material constituting the printed circuit board 31 is used as the insulating member 133, and the back surface side opening of the through hole 33 with respect to the printed circuit board 31 in which the through hole 33 is filled with the solder 70. Insulating member 133 is fixed so as to block. Thus, by building up the insulating member 133 on the back surface of the printed circuit board 31, it is possible to suppress the solder 70 melted during reflow from escaping out of the through hole 33. In this case, the insulating member 133 can be used as a part of the printed board 31, but the through hole 33 is sealed by the insulating member 133, so that it becomes a non-through hole. FIG. 32 is a cross-sectional view showing a modified example of the insulating member 133. Further, in a state where the insulating member 133 is built up on the back surface of the printed circuit board 31, as shown in FIG. 33, a ventilation portion 134 (by laser processing in FIG. 18) is formed in a part of the portion covering the opening of the insulating member 133. When the hole portion is provided, it is possible to suppress a decrease in connection reliability as described above. As described above, when the hole portion as shown in FIG. 33 is provided as the ventilation portion 134, the printed circuit board 31 has the through-hole 33 in which the opening diameter on the connector arrangement surface side is smaller than the opening diameter on the back surface. . FIG. 33 is a cross-sectional view showing a modified example of the insulating member 133. Note that the insulating member 133 provided with the ventilation portion 134 in advance may be built up on the back surface of the printed circuit board 31. Further, when the through hole 33 is formed in the printed circuit board 31 without separately building up the insulating member 133, the insertion portion 54 can be arranged in the through hole 33, and the back surface on the connector arrangement surface side. The through-hole 33 is formed so that the opening diameter of the connector arrangement surface is smaller than the opening diameter on the connector arrangement surface side, and more preferably, the opening diameter of the back surface on the connector arrangement surface side is smaller than the terminal diameter of the insertion portion 54. Also good. This also suppresses a decrease in connection reliability and ensures connection reliability. For example, in the thickness direction of the printed circuit board 31, after making a hole from the connector arrangement surface side to a predetermined depth, a hole having a smaller diameter than this hole is made from the back surface side, and both holes can be communicated. .

  Further, by utilizing the reflow on the back surface side of the connector placement surface in the printed circuit board 31, it is also possible to suppress the solder 70 melted at the time of reflow from escaping to the back surface side of the printed circuit board 31 through the through hole 33. is there. Specifically, before performing the application process on the connector arrangement surface side of the printed circuit board 31, first, the application process on the back surface side of the printed circuit board 31 is performed as shown in FIG. 34A, and then the reflow process is performed. . Thereby, the opening on the back surface side of the through hole 33 is closed with the solder 70. And in the state which covered the back surface side opening part of the through-hole 33 with the solder 70, as shown in FIG.34 (b), the application process by the side of the connector arrangement | positioning surface of the printed circuit board 31 is implemented, and a reflow process is implemented after that. Thereby, it can suppress that the solder 70 fuse | melted at the time of reflow escapes to the back surface side of the printed circuit board 31 through the through-hole 33. FIG. In addition, according to this manufacturing method, when the application on the connector arrangement surface side is performed, since the opening on the back surface side of the through hole 33 is blocked by the solder 70, the solder is inserted into the through hole 33 from the connector arrangement surface side. However, since the solder 70 is filled into the through-hole 33 from the back side of the connector arrangement surface, the contact area between the insertion portion 54 of the branch terminal 51 and the solder 70 can be increased. It is. FIG. 34 is a diagram showing a modification of the manufacturing process, where (a) the application process on the back surface side and (b) the application process on the connector arrangement surface side. Reference numerals 117 and 118 shown in FIGS. 34A and 34B are screens, respectively.

(Fifth embodiment)
Next, a fifth embodiment of the present invention will be described with reference to FIGS. FIG. 35 is an enlarged cross-sectional view of the periphery of the printed circuit board and connector mounting portion in the electronic control apparatus according to the fifth embodiment. FIG. 36 is an enlarged plan view of the periphery of the mounting portion with the connector on the connector placement surface of the printed circuit board.

  Since the electronic control device and the manufacturing method thereof in the fifth embodiment are often in common with those in the first embodiment and the second embodiment, the detailed description of the common parts will be omitted below, and different parts will be emphasized. explain. Moreover, in this embodiment, the same code | symbol shall be provided about the component similar to 1st Embodiment and 2nd Embodiment.

  In the first and second embodiments, the example in which the surface land 34 and the insertion land 35 are integrally formed as one land to be soldered to the branch terminal 51 is shown. In contrast, in the present embodiment, for example, as shown in FIGS. 35 and 36, the surface land 34 and the insertion land 35 corresponding to the same branch terminal 51 are arranged on the connector arrangement surface of the printed circuit board 31. It is characterized by being separated.

  With such a configuration, wetting and spreading of the solder 70 can be suppressed between the surface land 34 and the insertion land during reflow. That is, at the time of reflow, a part of the solder 70 disposed on the surface land 34 flows into the through hole 33 (gap between the through hole 33 and the insertion portion 54) by capillary action and / or gravity, and the surface land 34. It can suppress that the amount of upper solders decreases. As a result, since a good solder fillet is formed on the surface portion 53 of the branch terminal 51 on the surface land 34, the connection reliability can be improved.

  Although the surface land 34 and the insertion land 35 are separated from each other, the solder 70 is disposed on the insertion land 35 (in the through hole 33) in the coating process, so that the branched terminal 51 and the land are arranged. The desired connection reliability can be ensured while suppressing an increase in the size of the surface land 34 between 34 and 35.

(Sixth embodiment)
Next, a sixth embodiment of the present invention will be described with reference to FIGS. FIG. 37 is a plan view of a state in which the connector is mounted on the printed circuit board as viewed from the connection side between the printed circuit board and the terminals in the electronic control device according to the sixth embodiment. FIG. 38 is a plan view of the state where the connector is mounted on the printed circuit board as viewed from the connection side with the external connector. FIG. 39 is a cross-sectional view taken along line XXXIX-XXXIX shown in FIG. 40 is a cross-sectional view taken along line XL-XL shown in FIG. FIG. 41 is a plan view showing warpage of the printed circuit board in the reflow process. 42 is a cross-sectional view taken along line XLII-XLII shown in FIG. 43 is a cross-sectional view taken along line XLIII-XLIII shown in FIG.

  Since the electronic control device and the manufacturing method thereof according to the sixth embodiment are often in common with the above-described embodiments, a detailed description of the common parts will be omitted, and different parts will be mainly described below. Moreover, in this embodiment, the same code | symbol shall be provided about the component similar to each embodiment mentioned above.

  In the second embodiment, among the terminals to be soldered, all terminals that provide an electrical connection function are branch terminals 51, and the tip of the insertion portion 54 is printed in a reflow mounted state. An example in which the position is the same as the back surface of the connector placement surface of the substrate 31 (the same surface) or a position between the electronic component placement surface and the back surface is shown. With such a configuration, the insertion portion 54 does not protrude from the back surface side of the connector placement surface of the printed circuit board 31 in the reflow mounted state. Therefore, the connection state between the surface portion 53 and the solder 70 is visually inspected from the connector placement surface side of the printed circuit board 31 to determine the connection state between the branched terminal 51 and the corresponding lands 34 and 35, and thus the connection. Reliability is guaranteed. However, the appearance inspection becomes more difficult as the number of branch terminals 51 is larger and the surface portions 53 are denser.

  Therefore, in the present embodiment, as the plurality of terminals to be soldered, the terminal having the configuration shown in the second embodiment, that is, the leg portion of the insertion portion 54 with a short leg length is inserted together with the leg short terminal. The length of the leg of the part 54 is long, and at least before the reflow mounting, the distal end of the insertion part 54 has a leg long terminal that protrudes to the back side of the printed circuit board 31. The length of the leg of the insertion portion 54 is the length from the starting point to the tip of the insertion portion 54 that extends from the surface portion 53.

  In the present embodiment, among the terminals to be soldered, as shown in FIGS. 37 to 40, the first terminal 55 having a smaller diameter, the second terminal 56 having a larger diameter than the first terminal 55, and the reinforcing terminal 59. Is a branched terminal 51. That is, all the terminals connected by soldering are the branch terminals 51. Then, the first terminal 55 and the second terminal 56 that provide an electrical connection function between the printed circuit board 31 and the connector 50 (external connector) are inserted as shown in FIG. The tip of the portion 54 is configured to be at the same position as the back surface of the electronic component placement surface of the printed board 31 or between the electronic component placement surface and the back surface thereof. That is, it is configured as a short leg terminal. More specifically, the first terminal 55 and the second terminal 56 have a predetermined length L7 in which the lengths of the legs of the insertion portion 54 are equal (in FIG. 39, the first terminal 55 is shown as a representative). Yes. The predetermined length L7 is set to a length equal to or less than the thickness t of the printed circuit board 31 (in FIG. 39, a length shorter than the thickness t). In addition, the distance from the insertion portion 54 of the first terminal 55 and the second terminal 56 to the center of the insertion portion 54 inserted into the through hole 33 farthest from the housing 52 is set to a predetermined distance L8. When the first terminal 55 and the second terminal 56 having such a configuration are mounted by reflow mounting, the manufacturing method and configuration of the above-described embodiment can be applied.

  Further, the reinforcing terminal 59 that does not provide an electrical connection function between the printed circuit board 31 and the connector 50 (external connector) and improves the connection strength of the connector 50 to the printed circuit board 31 is provided through the insertion portion 54. In the state inserted into the hole 33 and at least before reflow mounting (the state after reflow is shown in FIG. 40), the tip of the insertion portion 54 protrudes to the back side of the electronic component placement surface of the printed circuit board 31. It is comprised so that. That is, it is configured as a leg-long terminal. Even after reflow, when the tip of the insertion portion 54 protrudes to the back side of the electronic component placement surface of the printed circuit board 31, the configuration is the same as that shown in the first embodiment (see FIG. 5). More specifically, the reinforcing terminal 59 is set to a predetermined length L9 in which the length of the leg of the insertion portion 54 is longer than the thickness t of the printed board 31. Furthermore, in this embodiment, the length L9 of the insertion portion 54 of the reinforcing terminal 59 is equal to the length L7 of the insertion portion 54 of the first terminal 55 and the second terminal 56 and the thickness t of the printed circuit board 31. The sum is less than or equal to (in FIG. 40, less than the sum is shown). In addition, the distance from the insertion portion 54 of the reinforcing terminal 59 to the center of the insertion portion 54 inserted into the through hole 33 farthest from the housing 52 is set to a predetermined distance L10 longer than the predetermined distance L8. The predetermined distances L8 and L10 are set based on the same position on the surface of the housing 52 where the terminals are extended.

  In addition, when the terminal diameter is the same, the longer the length of the insertion portion 54, the lower the rigidity of the insertion portion 54 and the easier it is to deform. Therefore, it is preferable that the terminal diameter of the long leg terminal is larger than the terminal diameter of the short leg terminal. In the present embodiment, the reinforcing terminal 59 as the long leg terminal has a terminal diameter (cross-sectional area) larger than that of the first terminal 55 and the second terminal 56 (larger than the cross-sectional area). In the longitudinal direction of the housing 52, at least one reinforcing terminal 59 (one in each end portion in FIGS. 37 and 38) is disposed in both end regions, and the center is sandwiched between the end regions. At least one reinforcing terminal 59 (two spaced apart from each other in FIGS. 37 and 38) is disposed in the region. That is, the four reinforcing terminals 59 as the long leg terminals are arranged apart from each other.

  In the printed circuit board 31, the opening diameter of the through hole 33 is set according to the terminal diameter of the corresponding insertion portion 54. That is, the through hole 33 corresponding to the reinforcing terminal 59 that is a long leg terminal is set to be larger than the through hole 33 corresponding to the first terminal 55 and the second terminal 56 that are short leg terminals. Further, the reinforcing land 59 is set larger in the surface land 34. When setting the through-holes 33 and the surface lands 34, the melted solder 70 can be supplied so as not to generate voids in the through-holes 33 during reflow, and the solder 70 can be retained in the through-holes 33. It is preferable to set so that it is possible.

  Thus, according to the present embodiment, the first terminal 55 and the second terminal 56 that provide an electrical connection function among the branched terminals 51 are short leg terminals. That is, most of the plurality of branched terminals 51 are short leg terminals, and only a few leg long terminals require a large amount of solder 70. Therefore, the connection reliability can be improved without increasing the surface land 34 and increasing the amount of the solder 70. Further, the connection reliability on the back side of the printed circuit board 31 can be improved. Such an effect is similar to or equivalent to the effect shown in the second embodiment (see FIG. 25).

  In particular, in the present embodiment, only four reinforcing terminals 59 are arranged apart from each other as the leg long terminals, and therefore, due to the leg long terminal insertion portion 54 protruding to the back side of the printed circuit board 31 during reflow. The influence of obstruction of reflow heat can be reduced.

  Further, in the present embodiment, as a part of the plurality of branched terminals 51, at least before reflow mounting, the tip of the insertion portion 54 is configured to protrude to the back side of the printed circuit board 31 (specifically, The leg length terminal has a leg length L9 longer than the thickness t of the printed circuit board 31). Therefore, in a state where the terminals to be soldered are connected to the corresponding lands, from the back surface side of the printed circuit board 31, the exposed state of the insertion portion 54 of the reinforcing terminal 59 (how much is exposed and how much is exposed when exposed). By examining the appearance of the terminal other than the leg-long terminals, the connection state between the terminals other than the leg-long terminals (in this embodiment, the first terminal 55 and the second terminal 56) and the solder 70 is not inspected. The connection state between the terminal and the solder 70 can be determined, and as a result, connection reliability can be ensured.

  In particular, in the present embodiment, the leg length L9 of the insertion portion 54 of the reinforcing terminal 59 is set to the length L7 of the insertion portion 54 of the first terminal 55 and the second terminal 56 and the thickness t of the printed circuit board 31. The sum is not more than the sum of the lengths. Therefore, after the reflow, when the insertion portion 54 of the reinforcing terminal 59 protrudes on the back side of the printed circuit board 31, a part of the insertion portion 54 of the first terminal 55 and the second terminal 56 is disposed in the through hole 33. When the insertion portion 54 of the reinforcing terminal 59 does not protrude from the back surface side of the printed circuit board 31 and the insertion portion 54 of the first terminal 55 and the second terminal 56 is a through hole. It can be determined that it is floating from 33 (the connection state with the solder 70 is bad). Therefore, the connection state between the insertion portion 54 of the first terminal 55 and the second terminal 56 and the solder 70 is determined by confirming the insertion portion 54 of the reinforcing terminal 59 by the appearance inspection from the back side of the printed circuit board 31, and consequently the connection. Reliability can be guaranteed.

  Even if the connector 50 is tilted, the insertion portion 54 of the reinforcing terminal 59 (long leg terminal) hits the wall surface of the through hole 33, so the insertion portion 54 of the first terminal 55 and the second terminal 56 (short leg terminal) is the through hole. The escape from 33 can be suppressed. Also by this, the connection reliability of the terminals to be soldered can be improved. In particular, in the present embodiment, the distance L10 from the insertion portion 54 of the reinforcing terminal 59 to the center of the insertion portion 54 inserted into the through hole 33 farthest from the housing 52 is, for example, the first terminal 55 and the second terminal 56. The insertion portion 54 is set to be longer than the distance L8 to the center of the insertion portion 54 inserted into the through hole 33 farthest from the housing 52, for example. Therefore, when the distance L10 is equal to or less than the distance L8, the inclination amount of the connector 50 (the amount of rattling of the housing 52) that is restricted by the insertion portion 54 of the reinforcing terminal 59 (leg long terminal) hitting the wall surface of the through-hole 33. Can be made smaller. That is, the connection reliability between the terminals other than the leg-long terminals and the solder 70 can be further improved.

  In addition, in order to ensure the connection reliability of the leg long terminal itself in which the insertion portion 54 protrudes to the back side of the printed circuit board 31 at least before reflow, as shown in the above-described embodiment, compared to the leg short terminal. Therefore, it is necessary to supply more solder 70 into the through hole 33. For this purpose, as described above, for example, it is preferable to increase the size of the surface land 34 corresponding to the surface portion 53 of the leg-long terminal, whereby the physique of the printed circuit board 31 increases as the number of leg-long terminals increases. Become. On the other hand, in this embodiment, the reinforcing terminal 59 is also used as a leg long terminal. In order to fulfill the function of the reinforcing terminal 59 for the purpose of improving the connection reliability of the connector 50 to the printed circuit board 31, it is preferable to increase the size of the surface land 34 corresponding to the surface portion 53 of the reinforcing terminal 59. In this way, the land 34 corresponding to the reinforcing terminal 59 is set to be large anyway (whether the reinforcing terminal 59 does not function as a leg long terminal), so that the reinforcing terminal 59 also serves as the leg long terminal. Even so, it is not necessary to increase the size of the printed circuit board 31. In other words, even if the configuration includes the leg-long terminals, it is possible to suppress an increase in the size of the printed circuit board 31, and thus the electronic control device 100.

  In the present embodiment, one reinforcing terminal 59 that is a leg-long terminal is disposed at each end in the longitudinal direction of the housing 52. For example, as described above, as the number of terminals increases, it becomes more difficult to ensure the coplanarity of the connection portion with the land of the terminals. However, the deformation amount of the printed circuit board 31 (the deformation amount along the surface of the printed circuit board 31) is the housing 52. In the longitudinal direction, the distance from the center of the housing 52 increases. Therefore, when at least one leg-long terminal (reinforcing terminal 59) is disposed in the end region, it is possible to more effectively suppress the positional deviation between the terminal and the corresponding land. Further, when the leg-long terminal is arranged in the end region, it is easy to confirm the insertion state of the insertion portion 54 into the through-hole 33, so that the leg-long terminal is easily positioned and inserted into the through-hole 33. In addition, as described above, the leg long terminal insertion portion 54 has a larger terminal diameter than the leg short terminal insertion portion 54, and the corresponding through hole 33 has a larger opening diameter. Accordingly, the through hole 33 having a large opening diameter obstructs the drawing of the wiring from the land. Therefore, the degree of freedom of the drawing of the wiring from the land can be improved by arranging the through hole 33 in the end region.

  In the present embodiment, in the longitudinal direction of the housing 52, the reinforcing terminal 59, which is a long leg terminal, is also arranged in the central region sandwiched between the end regions. In the reflow process, the printed circuit board 31 is heated while being transported in a state where the opposite end portions are supported. Therefore, the printed circuit board 31 is sandwiched between the end portions as shown in FIG. The center part is a shape that hangs downward. That is, at the time of reflow, the deformation in the thickness direction of the printed circuit board 31 is larger at the center than at the end. Therefore, if at least one leg-long terminal is arranged in the central region in the longitudinal direction of the housing 52, the length of the leg-long terminals arranged in the central region is exposed as compared with a configuration in which the leg-long terminals are not arranged in the central region. The connection state between all the terminals other than the leg-long terminals and the solder 70 can be determined. For example, as shown in FIG. 43, when the insertion portion 54 of the reinforcing terminal 59, which is a long leg terminal arranged in the central area, is not exposed on the back side of the printed circuit board 31, it is arranged in the central area as shown in FIG. The insertion portion 54 of the first terminal 55, which is the short leg terminal, is in a state of floating from the through hole 33. As described above, the floating state of the insertion portion 54 of the first terminal 55 is larger on the central portion side than the end portion of the printed circuit board 31. Therefore, an appearance inspection of the reinforcing terminal 59 which is a leg-long terminal arranged in the central region is performed. Thus, it is possible to accurately determine the connection state between the terminals other than the leg-long terminals and the solder 70, and to ensure the connection reliability.

  In the present embodiment, the length L9 of the insertion portion 54 of the reinforcing terminal 59 that is a leg long terminal is set to the length L7 of the insertion portion 54 of the first terminal 55 and the second terminal 56 that are leg short terminals. An example in which the thickness is equal to or less than the sum of the thicknesses of 31 is shown. However, the length L7 of the insertion portion 54 of the first terminal 55 and the second terminal 56 is equal to or less than the thickness t of the printed circuit board 31, and the length L9 of the insertion portion 54 of the reinforcing terminal 59 is at least that of the printed circuit board 31. What is necessary is just to make it longer than thickness t. That is, as long as the leg long terminal insertion portion 54 is inserted into the through-hole 33 and the leg long terminal insertion portion on the back side of the printed circuit board 31 is exposed before reflow, the leg long terminal after reflow is exposed. The connection state between the terminals other than the leg-long terminals and the solder 70 can be determined according to the degree of exposure of the insertion portion, and thus connection reliability can be ensured. For example, even if the length L9 of the leg long terminal insertion portion 54 is larger than the sum of the length L7 of the leg short terminal insertion portion 54 and the thickness t, the leg long terminal insertion portion 54 By providing a memory (gauge), a reference mark, etc., it is possible to determine the connection state between the terminals other than the leg-long terminals and the solder 70.

  Further, in the present embodiment, an example in which the branch terminal 51 (the first terminal 55, the second terminal 56, and the reinforcing terminal 59) has a substantially T-shaped structure is shown. However, the shape of the branched terminal 51 is not limited to the above example. For example, the configuration shown in FIGS. 26 and 27 may be used.

  In the present embodiment, an example in which two insertion portions 54 are extended from one surface portion 53 in the reinforcing terminal 59 has been described. However, the number of insertion portions 54 extending from one surface portion 53 may be at least one and is not particularly limited.

  Moreover, in this embodiment, the example which combines the reinforcement terminal 59 which does not provide an electrical connection function among the terminals connected by solder as a leg long terminal was shown. However, some of the terminals that provide an electrical connection function may also be used as the leg-long terminals. In the present embodiment, as a terminal for providing an electrical connection function, a first terminal 55 which is a so-called signal terminal for signal transmission having a small diameter and a so-called power terminal for power transmission having a diameter larger than that of the first terminal 55. A second terminal 56 is provided. Further, the size of the surface land 34 corresponding to the second terminal 56 is increased in accordance with the terminal diameter. Therefore, when at least a part of the second terminal 56 is a leg long terminal, more solder 70 is supplied into the through hole 33, and the connection reliability between the leg long terminal and the solder 70 can be improved. Further, when the second terminal 56 having a large terminal diameter is disposed at the end portion of the housing 52 in the longitudinal direction, the degree of freedom of drawing the wiring from the land can be improved. For example, in FIG. 44, the first terminal 55 is a leg short terminal, and the second end view 56 is a leg long terminal. FIG. 44 is a cross-sectional view showing a modification.

  In the present embodiment, the length L7 of the leg short terminal insertion portion 54 and the length L9 of the leg long terminal insertion portion 54 are each set to one value. However, at least one of the length of the leg short terminal insertion portion 54 and the length of the leg long terminal insertion portion 54 may be set in multiple stages (plural types) as long as the above relationship is satisfied. For example, in the configuration shown in the present embodiment (configuration in which the reinforcing terminal 59 is a leg long terminal), the length of the insertion portion 54 of the first terminal 55 may be multi-stage as shown in FIG. Since the insertion portion 54 is inserted into the corresponding through hole 33 in multiple stages for each length of the insertion portion 54, the insertion portion 54 is inserted into the insertion hole 54 in multiple stages. The stress when 54 is inserted into the through-hole 33 can be reduced (stress can be dispersed). That is, terminal bending (bending of the insertion part 54) at the time of insertion can be suppressed. FIG. 45 is a cross-sectional view showing a modification.

  In the present embodiment, an example in which a part of the branch terminal 51 is a leg-long terminal is shown. However, the connector 50 may be configured as a member different from the terminal to be soldered, and a positioning pin having a tip protruding from the back side of the printed circuit board 31 at least before the terminal is connected to the land. . That is, a positioning pin that is not solder-connected may be used instead of the leg-long terminal that is solder-connected. For example, in FIG. 46, a positioning pin 61 is adopted instead of the two reinforcing terminals 59 arranged in the central region. Although the positioning pin 61 is not connected to the solder 70, the positioning pin 61 is inserted into the through-hole 33 so that the terminal and the land corresponding to the land are in a state before the terminal and the land are connected (the solder 70 is in a molten state). It is possible to effectively suppress the occurrence of misalignment between them. Further, in a state where the terminal is connected to the land, the connection state between the solder-connected terminal (branched terminal 51) and the solder 70 is determined according to the exposure state of the positioning pin 61 on the back surface side of the printed circuit board 31. As a result, connection reliability can be guaranteed. FIG. 46 is a plan view showing a modification.

  The preferred embodiments of the present invention have been described above. However, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the present invention.

  In the above-described embodiment, the example in which the through holes 33 and the surface lands 34 in the printed board 31 are arranged in a staggered manner has been described. However, the arrangement of the through holes 33 and / or the surface lands 34 is not limited to the staggered arrangement. In addition, the direction away from the housing 52 is not limited to a plurality of steps. In the configuration in which the plurality of through holes 33 are arranged in one row and at least some of the through holes 33 are arranged adjacent to each other among the plurality of through holes 33 arranged in one row, as shown below A configuration is good. For example, when the width of the surface land 34 is larger than the diameter of the through-hole 33 and / or the outer diameter of the opening peripheral portion of the insertion land 35 in the longitudinal direction of the housing 52, as shown in FIG. The surface land 34 corresponding to the arranged through hole 33 is closer to the housing 52 than the corresponding through hole 33 in the arrangement direction of the through holes 33, and to the housing 52 than the corresponding through hole 33. It is good to arrange alternately on the far side. That is, it is preferable that adjacent surface lands 34 are arranged across the row of through holes 33. With such a configuration, the size of the printed circuit board 31 in the longitudinal direction of the housing 52 can be reduced. Further, since the through holes 33 are arranged in a row, the degree of freedom of the arrangement of other electronic components 32 and the wiring 36 drawn from the insertion land 35 can be improved on the back side of the connector arrangement surface of the printed circuit board 31. it can. FIG. 47 is a plan view showing a modified example of the printed circuit board.

  Further, a plurality of surface lands 34 are arranged in one row, and at least some of the surface lands 34 corresponding to the branch terminals 51 are adjacent to each other among the plurality of surface lands 34 and 37 arranged in one row. In the configuration arranged in this manner, the following configuration is preferable. For example, in the longitudinal direction of the housing 52, when the diameter of the through hole 33 and / or the outer diameter of the peripheral portion of the opening of the insertion land 35 is larger than the width of the surface land 34, as shown in FIG. The through holes 33 corresponding to the arranged surface lands 34 are closer to the housing 52 than the corresponding surface lands 34 in the arrangement direction of the surface lands 34, and the housings than the corresponding surface lands 34. 52 may be alternately arranged on the side far from 52. That is, it is preferable that the adjacent through holes 33 are arranged across the rows of the surface lands 34. With such a configuration, the size of the printed circuit board 31 in the longitudinal direction of the housing 52 can be reduced. In addition, since the surface lands 34 are arranged in a row, heat easily spreads uniformly to all the joints between the surface portion 53 and the surface lands 34 during reflow. FIG. 48 is a plan view showing a modified example of the printed circuit board.

  Further, when the through holes 33 and the surface lands 34 on the printed circuit board 31 are staggered (arranged in a direction away from the housing 52), for example, as shown in FIG. A part of the through hole 33 and the surface land 34 in each step in the direction may overlap each other. In FIG. 49, a four-stage configuration is adopted, and the first-stage surface land 34 and the second-stage surface land 34, the third-stage surface land 34, and the fourth-stage surface land. The lands 34 are configured to partially overlap each other in a direction away from the housing 52. With such a configuration, the physique of the printed circuit board 31 and, in turn, the physique of the electronic device can be reduced in the direction away from the housing 52. 49, in the longitudinal direction of the housing 52, the diameter of the through-hole 33 and / or the peripheral portion of the opening of the insertion land 35 is larger than the width of the surface land 34 (in FIG. The outer diameter of the portion (also shown as the surface land 34) is made larger. In the case of such a configuration, as shown in FIG. 49, if the configuration is such that the surface land 34 does not overlap with the area around the opening of the through hole 33, the physique of the printed circuit board 31 in the longitudinal direction of the housing 52, and thus the electrons The size of the device can be reduced. In FIG. 49, the positions of the through holes 33 and the surface lands 34 (center positions of the through holes 33) are shifted in the longitudinal direction of the housing 52. More specifically, the third stage, the first stage, the fourth stage, and the second stage are shifted in order. FIG. 49 is a plan view showing a modified example of the printed circuit board.

  In the present embodiment, a connector 50 is shown as an example of an electronic component including a branched terminal, and an electronic control formed by mounting the connector 50 on a printed board 31 as an example of an electronic device formed by mounting the electronic component on a printed board. An apparatus 100 is shown. However, as long as the electronic component has a configuration in which a plurality of terminals extend from the main body, the above-described configuration and manufacturing method can be adopted, and an effect equivalent to or equivalent to the effect described in each of the above-described embodiments can be adopted. You can expect. For example, the present invention may be applied to an electronic component 32 (for example, a microcomputer) other than the connector 50 shown in FIG.

  Moreover, in this embodiment, the example by which the edge part by the side mounted in the circuit board 30 was extended from one surface of the housing 52 (main-body part) of the connector 50 (electronic component) was shown. However, the above-described configuration and manufacturing method can also be adopted in a configuration in which end portions on the side mounted on the circuit board 30 are extended from a plurality of surfaces of the main body.

  In this embodiment, the example which contains the 2nd terminal 56 with a diameter larger than the 1st terminal 55 and the 1st terminal 55 as a terminal which provides an electrical connection function was shown. However, the type of terminal that provides an electrical connection function is not particularly limited. Further, the number of terminal blocks is not particularly limited.

  In the present embodiment, an example of a non-waterproof electronic control device is shown as the electronic control device 100. However, the present invention can also be applied to a waterproof electronic control device.

  In this embodiment, the example which fills the solder 70 in the through-hole 33 in the application | coating process was shown. However, when the surface land 34 and the insertion land 35 are integrally formed as one land, the solder 70 is disposed only on the surface land 34 without filling the through hole 33 with the solder 70. May be. In this case, in the reflow process, the solder 70 on the surface land 34 is formed between the through hole 33 (the insertion land 35 formed on the wall surface thereof) and the insertion portion 54 due to capillary action and / or gravity (opposing region). Therefore, the insertion land 35 and the insertion portion 54 can be soldered together. However, since it is difficult to ensure a good bonding state between the surface land 34 and the surface portion 53 and between the insertion land 35 and the insertion portion 54 only by the solder 70 on the surface land 34, as described above. In addition, it is preferable to fill the through hole 33 with the solder 70 in the coating step.

It is an exploded view which shows the state before an assembly | attachment for demonstrating schematic structure of the electronic controller which concerns on 1st Embodiment. It is a top view of the mounting part periphery of the state which mounted the connector in the printed circuit board. It is the top view which looked at the state which mounted the connector in the printed circuit board from the connection side of a printed circuit board and a terminal. It is the top view which looked at the state which mounted the connector in the printed circuit board from the connection side with an external connector. It is sectional drawing which follows the VV line shown in FIG. FIG. 3 is an enlarged plan view of an electronic component placement surface side in a region surrounded by a broken line in FIG. 2. FIG. 3 is an enlarged plan view of an electronic component placement surface of a printed circuit board in a region surrounded by a broken line in FIG. 2. FIG. 3 is an enlarged plan view showing a back side of an electronic component placement surface of a printed board from the electronic component placement surface side in a region surrounded by a broken line in FIG. 2. It is a figure which shows the application | coating process which is a characteristic part among the manufacturing processes of an electronic control apparatus, (a) is a 1st process among application processes, (b) is a 2nd process among application processes, (c) is application | coating. It shows after the completion of the process. It is a top view which shows the positional relationship between the land connected with a terminal, and the opening part corresponding to the land of the screen used in a coating process. In order to show the effect of improving the mounting density, (a) is an enlarged side view of the branched terminal, and (b) is an enlarged plan view near the surface land. It is a figure which shows the electronic control apparatus provided with the branched terminal of an inverted-L structure as a comparison object, Comprising: (a) is an enlarged side view of a branched terminal, (b) is an enlarged plan view near the land for surface. is there. It is an enlarged plan view near the land for the surface for showing the effect of the amount of displacement control. FIG. 5 is an enlarged plan view of the vicinity of a surface land in an electronic control device including an inverted L-shaped branch terminal as a comparison target. It is an expanded sectional view near the land for surface for showing the effect of connection reliability improvement. FIG. 5 is an enlarged cross-sectional view of the vicinity of a surface land in an electronic control device including an inverted L-shaped branch terminal as a comparison target. It is an expanded sectional view near the land for surface for showing the effect of connection reliability improvement. FIG. 5 is an enlarged cross-sectional view of the vicinity of a surface land in an electronic control device including an inverted L-shaped branch terminal as a comparison target. It is an expanded sectional view near the land for surface for showing the effect of connection reliability improvement. It is an expanded sectional view near the land for the surface for showing the effect of stress relaxation. FIG. 5 is an enlarged cross-sectional view of the vicinity of a surface land in an electronic control device including an inverted L-shaped branch terminal as a comparison target. It is sectional drawing which shows the modification of an application | coating process. It is a top view of the printed circuit board which shows a modification. It is an expanded sectional view of the mounting part periphery of a printed circuit board and a connector for explaining concerns in the structure shown in the first embodiment. It is an expanded sectional view of a mounting part periphery of a printed circuit board and a connector among electronic control units concerning a 2nd embodiment. It is an expanded sectional view which shows the modification of a branched terminal. It is an expanded sectional view which shows the modification of a branched terminal. In the electronic control device concerning a 3rd embodiment, it is a top view of the circumference of the mounting part in the state where the connector was mounted in the printed circuit board. It is a figure for demonstrating the concern at the time of manufacturing the electronic control apparatus shown in 2nd Embodiment with the manufacturing method shown in 1st Embodiment, (a) is before a reflow process, (b) is after a reflow process. Is shown. 10 shows a part of the manufacturing process of the electronic control device according to the fourth embodiment, wherein (a) shows a reflow process and (b) shows a removal process after reflow. It is sectional drawing which shows the modification of an insulating member. It is sectional drawing which shows the modification of an insulating member. It is sectional drawing which shows the modification of an insulating member. It is a figure which shows the modification of a manufacturing process, (a) The application process of the back surface side, (b) is the application process of the connector arrangement | positioning surface side. It is an expanded sectional view of a mounting part periphery of a printed circuit board and a connector among electronic control units concerning a 5th embodiment. It is an enlarged plan view of the periphery of the mounting portion with the connector on the connector placement surface of the printed board. In the electronic control unit concerning a 6th embodiment, it is a top view which looked at the state where a connector was mounted in a printed circuit board from the connection side of a printed circuit board and a terminal. It is the top view which looked at the state which mounted the connector in the printed circuit board from the connection side with an external connector. It is sectional drawing which follows the XXXIX-XXXIX line | wire shown in FIG. It is sectional drawing which follows the XL-XL line shown in FIG. It is a top view which shows the curvature of the printed circuit board in a reflow process. It is sectional drawing which follows the XLII-XLII line | wire shown in FIG. It is sectional drawing which follows the XLIII-XLIII line | wire shown in FIG. It is sectional drawing which shows a modification. It is sectional drawing which shows a modification. It is a top view which shows a modification. It is a top view which shows the modification of a printed circuit board. It is a top view which shows the modification of a printed circuit board. It is a top view which shows the modification of a printed circuit board.

Explanation of symbols

30 ... Circuit board 31 ... Printed circuit board 33 ... Through hole 34 ... Surface land 35 ... Insert land 50 ... Connector (electronic component)
51 ... Branch terminal 52 ... Housing (main body)
53 ... surface part 54 ... insertion part 55 ... first terminal 56 ... second terminal 59 ... reinforcing terminal 60 ... surface mount type terminal 61 ... positioning pin 70 ... Solder 100 ... Electronic control device (electronic device)

Claims (36)

A printed circuit board having a land;
A plurality of terminals with respect to the main body, and an electronic component arranged along the plane of the printed circuit board;
An electronic device in which an end portion of the terminal extending from the main body portion is connected to the land via solder,
The printed circuit board is integrated with a through hole penetrating from the electronic component arrangement surface to the back surface thereof, a land for the surface provided on the electronic component arrangement surface as the land, a wall surface of the through hole, and an opening periphery of the through hole. And an insertion land provided in
The electronic component is inserted into the through hole, and the insertion portion is connected to the insertion land through the solder supplied from the electronic component placement surface into the through hole. A branched terminal that is disposed on and has a surface portion connected to the surface land via the solder as the end portion, and includes at least the terminal,
In the branched terminal, the surface portion is substantially parallel to the surface of the printed circuit board, and the insertion portion is located from a portion sandwiched by the surface portion facing the surface land in the surface portion. An electronic device characterized by extending substantially perpendicular to the surface of the electronic device.   The electronic device according to claim 1, wherein the insertion portion extends substantially perpendicularly to a surface of the printed circuit board from a substantially central position of the surface portion.   The tip of the insertion portion is in the same position as the back surface of the electronic component placement surface of the printed circuit board, or between the electronic component placement surface and the back surface thereof, with the terminals and the lands electrically connected. The electronic device according to claim 1, wherein the electronic device is located in the position.   The electronic component is inserted into the through-hole separately from the terminal, and at least the terminal protrudes to the back side of the electronic component placement surface of the printed circuit board before being connected to the land. The electronic device according to claim 3, further comprising a positioning pin to be operated.   In the state where the terminal and the land are connected as the branched terminal, the tip of the insertion portion is at the same position as the back surface of the electronic component placement surface of the printed circuit board, or the electronic component placement surface and the back surface thereof. A plurality of short leg terminals that are positioned between the terminal and the through hole, and at least before the terminal is connected to the land, the tip of the insertion portion is connected to the printed circuit board. 3. The electronic device according to claim 1, further comprising: a leg long terminal protruding on a back surface side of the electronic component placement surface, wherein the number of the leg long terminals is smaller than the number of the leg short terminals. apparatus. A printed circuit board having a land;
A plurality of terminals with respect to the main body, and an electronic component arranged along the plane of the printed circuit board;
An electronic device in which an end portion of the terminal extending from the main body portion is connected to the land via solder,
The printed circuit board is integrated with a through hole penetrating from the electronic component arrangement surface to the back surface thereof, a land for the surface provided on the electronic component arrangement surface as the land, a wall surface of the through hole, and an opening periphery of the through hole. And an insertion land provided in
The electronic component is inserted into the through hole, and the insertion portion is connected to the insertion land through the solder supplied from the electronic component placement surface into the through hole. A branched terminal that is disposed on and has a surface portion connected to the surface land via the solder as the end portion, and includes at least the terminal,
The tip of the insertion portion is in the same position as the back surface of the electronic component placement surface of the printed circuit board, or the position between the electronic component placement surface and the back surface, with the terminal and the land connected. An electronic device characterized by being made. A printed circuit board having a land;
A plurality of terminals with respect to the main body, and an electronic component arranged along the plane of the printed circuit board;
An electronic device in which an end portion of the terminal extending from the main body portion is connected to the land via solder,
The printed circuit board is integrated with a through hole penetrating from the electronic component arrangement surface to the back surface thereof, a land for the surface provided on the electronic component arrangement surface as the land, a wall surface of the through hole, and an opening periphery of the through hole. And an insertion land provided in
The electronic component is inserted into the through hole, and the insertion portion is connected to the insertion land through the solder supplied from the electronic component placement surface into the through hole. A branched terminal that is disposed on and has a surface portion connected to the surface land via the solder as the end portion, and includes at least the terminal,
In the state where the terminal and the land are connected as the branch terminal, the tip of the insertion portion is at the same position as the back surface of the electronic component placement surface of the printed circuit board, or the electronic component placement surface and the back surface thereof. A plurality of short leg terminals that are positioned between the terminal and the through hole, and at least before the terminal is connected to the land, the tip of the insertion portion is connected to the printed circuit board. An electronic device comprising: a leg long terminal projecting on the back side of the electronic component arrangement surface, wherein the number of leg long terminals is less than the number of leg short terminals. The short leg terminal has a length of the insertion portion equal to or less than a thickness of the printed circuit board.
8. The electronic device according to claim 5, wherein the leg long terminal has a length of the insertion portion longer than a thickness of the printed circuit board. 9.   The electronic device according to claim 8, wherein the leg long terminal has a length of the insertion portion that is equal to or less than a sum of a length of the insertion portion of the leg short terminal and a thickness of the printed circuit board.   10. The electronic device according to claim 5, wherein at least one leg-long terminal is disposed in an end region in the arrangement direction of the terminals.   11. The electronic device according to claim 5, wherein at least one leg-long terminal is disposed in a central region sandwiched between end regions in the arrangement direction of the terminals.   The said insertion part has the said leg long terminal inserted in the said through-hole in the position away from the said main-body part rather than the insertion part of the said leg short terminal, The any one of Claims 5-7-11 The electronic device according to item.   The electronic device according to claim 5, wherein a reinforcing terminal that does not provide an electrical connection function between the electronic component and the printed circuit board is the leg-long terminal. apparatus.   In a state where the terminal and the land are connected, the tip is the same position as the back surface of the electronic component placement surface of the printed circuit board, or the position between the electronic component placement surface and the back surface thereof. An end surface on the back side of the electronic component placement surface of the solder arranged in a gap formed by the insertion portion and the insertion land formed on the wall surface of the through hole facing each other is the printed circuit board. 14. The method according to claim 3, further comprising a portion closer to the electronic component placement surface than a contact portion with the insertion land and a contact portion with the insertion portion in the thickness direction. The electronic device described.   The electronic device according to any one of claims 1 to 14, wherein a plurality of the surface lands are arranged in a staggered manner on the electronic component arrangement surface corresponding to the arrangement direction of the terminals. .   The height of the terminal connected to the surface land excluding the surface land closest to the main body portion with respect to the electronic component placement surface at the extended position from the main body portion is closest to the main body portion. The height of the terminal connected to the surface land is the same as the height of the electronic component placement surface at the extended position from the main body, or closer to the electronic component placement surface than that. The electronic device according to claim 15. In the electronic component, at least a part of the terminals, one end portion extending from the main body portion is electrically connected to the land, and the other end portion extending from the main body portion is external. A connector electrically connected to the connector,
Of the terminals, at least the end portion on the side electrically connected to the external connector is arranged in multiple stages in a direction perpendicular to the plane of the printed circuit board with respect to the main body portion, and the number of steps of the end portion is 17. The electronic device according to claim 15, wherein the number of stages of the surface lands arranged in a staggered manner is n times (n is an integer of 2 or more). The surface land corresponding to the surface portion of the branch terminal is provided in the vicinity of the through hole into which the same insertion portion of the branch terminal is inserted,
18. The surface land and the insertion land corresponding to the same branched terminal are integrated as one land on the electronic component placement surface. The electronic device according to item 1.   The electron according to claim 1, wherein the surface land and the insertion land corresponding to the same branched terminal are separated on the electronic component arrangement surface. apparatus.   The land corresponding to the branched terminal has a larger portion provided on the electronic component placement surface side of the printed circuit board than a portion provided on the back surface of the electronic component placement surface. The electronic device according to any one of 1 to 19.   The electronic device according to claim 1, wherein all the terminals are the branched terminals.   The electronic device according to claim 1, wherein the terminal includes a surface-mounted terminal having only the surface portion together with the branched terminal.   The electronic device according to claim 22, wherein a plurality of the branched terminals are arranged so as to sandwich the surface-mounted terminal in the arrangement direction of the terminals.   The electronic device according to any one of claims 21 to 23, wherein both end regions are respectively constituted by at least one of the branched terminals in the arrangement direction of the terminals. In the arrangement direction of the terminals, at least one branch terminal is arranged in a central region sandwiched between the end regions,
The hole diameter of the through hole corresponding to the branch terminal arranged in the end region is larger than the hole diameter of the through hole corresponding to the branch terminal arranged in the center area. The electronic device according to claim 24. The terminals include a plurality of first terminals and a plurality of second terminals having a terminal diameter larger than that of the first terminals,
26. The electronic device according to claim 25, wherein the second terminal is used as the plurality of branched terminals constituting the end region. The branched terminal is a bent terminal formed by bending a rod-shaped terminal member on the main body,
27. The electronic device according to claim 1, wherein a terminal diameter of the surface portion is larger than a terminal diameter of the insertion portion in the arrangement direction of the terminals. A method of manufacturing an electronic device, wherein an end portion of a terminal extended from a main body portion of an electronic component and a land provided on a printed circuit board are connected via solder,
As the printed circuit board, a through hole penetrating from the electronic component placement surface to the back surface thereof, a land for the surface provided as the land on the electronic component placement surface, a wall surface of the through hole, and a periphery of the opening of the through hole are provided. A substrate preparing step of preparing a printed circuit board having the inserted land,
As the electronic component, an insertion portion connected to the insertion land through the solder supplied from the electronic component placement surface side into the through hole in a state of being inserted into the through hole, and the surface land A component preparing step of preparing an electronic component including at least a branched terminal arranged on the surface and connected to the surface land via the solder as the end,
Using a screen printing method, solder is disposed on the surface land, and solder is disposed on at least a part of the insertion land by filling the through hole with solder from the electronic component placement surface side. An application process to
After the application step, the branch terminal insertion portion is inserted into the through hole from the electronic component placement surface side, the surface portion corresponding to the surface land by melting the solder in this insertion state, and A method of manufacturing an electronic device, comprising: a reflow process of soldering the insertion portions corresponding to the insertion lands. The coating step includes a plurality of screen printing steps using screens having different mask shapes,
As the plurality of screen printing steps, a paste-like solder is filled in the through-holes, and after the first step, on the solder filled in the through-holes and on the surface lands. A second step of applying a solder of
The second opening corresponding to the through hole of the second screen used in the second step as the screen is larger than the first opening corresponding to the through hole of the first screen used in the first step. 29. The method of manufacturing an electronic device according to claim 28, wherein the first opening is included in the second opening. In the substrate preparation step, the insertion land and the surface land corresponding to the same branched terminal are integrally formed,
30. The electron according to claim 29, wherein, in the coating step, a region including the through hole and the surface land corresponding to the same branched terminal is the second opening. Device manufacturing method.   31. The method of manufacturing an electronic device according to claim 29, wherein the thickness of the first screen is thinner than the thickness of the second screen.   32. The solder according to any one of claims 29 to 31, wherein, in the second step, solder is applied to the surface land corresponding to the electronic component excluding the electronic component having the branched terminal as the electronic component. The manufacturing method of the electronic device of description.   In the component preparation step, the tip of the insertion portion is located at the same position as the back surface of the electronic component placement surface of the printed circuit board during the reflow step or when the reflow step is completed, or the electronic component placement surface and the back surface thereof. 33. The method of manufacturing an electronic device according to claim 28, wherein the electronic component including the branched terminal is positioned so as to be located between the electronic device and the electronic device.   The said through-hole is formed in the said board | substrate preparation process, The said through-hole is formed so that the opening diameter by the side of the back surface of the said electronic component arrangement | positioning surface may become smaller than the opening diameter by the side of the said electronic component arrangement | positioning surface. The manufacturing method of the electronic device of description. At least before the reflow step, a lid step for fixing the insulating member so as to block the opening of the through hole with respect to the back surface of the electronic component placement surface of the printed circuit board;
The method for manufacturing an electronic device according to claim 33, further comprising a step of removing the insulating member after the reflow step.   The insulating member having an air-permeable portion that allows air to pass through the through-hole and the outside of the printed circuit board and does not allow the solder to pass therethrough is used as a part of the portion that covers the opening. Item 36. A method for manufacturing an electronic device according to Item 35.

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