JP2021072390A - Method for manufacturing light emitting device - Google Patents

Abstract

To provide a method for manufacturing a light emitting device capable of suppressing occurrence of an unused light emitting element.SOLUTION: A method for manufacturing a light emitting device includes: the steps of: classifying a plurality of light emitting elements on a light-emitting-element mounting substrate into a plurality of n groups each consisting of at least one light emitting element array, and transferring a light emitting element array 10α included in each group onto carrier substrates 30A, 30B, 30C, and 30D having resin materials different among groups, thereby producing a plurality of n light-emitting-element mounted carrier substrates on which the light emitting element arrays included in the respective group are transferred; individualizing the plurality of n light-emitting-element mounted carrier substrates so as to contain the at least one light emitting element array, thereby producing each of a plurality of m light-emitting-element mounted carrier substrate units from each light-emitting-element mounted carrier substrate; and mounting the light emitting elements contained in the light emitting element array of the light-emitting-element mounted carrier substrate unit on a wiring substrate.SELECTED DRAWING: Figure 1B

Description

One embodiment of the present invention relates to a method for manufacturing a light emitting device.

In recent years, there has been an increasing demand for micro LEDs having micro size dimensions as light emitting elements. In Patent Document 1, micro LEDs arranged in a matrix on a wafer are transferred from the wafer to a single mounting substrate having a relatively large size (50 inches) in a plurality of times, and the micro LEDs and the mounting substrate are transferred. It has been shown that an integrated product with is used as an image display device.

Japanese Patent No. 4491948

Here, from the viewpoint of improving production efficiency, it is conceivable that the micro LEDs arranged on the wafer are collectively transferred to the mounting substrate. In this case, if the plane area of the micro LED transferred onto the mounting substrate is smaller than the entire plane area of the micro LED arranged on the wafer, there is a possibility that unused micro LEDs (light emitting elements) may remain on the wafer. is there.

One embodiment of the present invention aims to provide a method for manufacturing a light emitting device capable of suppressing the generation of an unused light emitting element.

In order to achieve the above object, in one embodiment of the present invention,
A light emitting device including mounting on a wiring base material for each light emitting element array including one or two or more light emitting elements among a plurality of light emitting elements from a light emitting element mounting base material on which a plurality of light emitting elements are mounted. It is a manufacturing method of
The plurality of light emitting elements of the light emitting element mounting base material are classified into a plurality of n groups each composed of at least one light emitting element array, and the light emitting element arrays included in each group are provided with different resin materials for each group. A step of producing a plurality of n light-emitting element-mounted carrier base materials on which the light-emitting element arrays included in each group are transferred by transferring to a carrier base material, and
The plurality of n light-emitting element-mounted carrier base materials are individually separated so as to include the at least one light-emitting element array, and a plurality of m light-emitting element-mounted carrier base material units are formed from each light-emitting element-mounted carrier base material. The process of making and
A method for manufacturing a light emitting device including a step of mounting the light emitting element included in the light emitting element array of the light emitting element mounting carrier base material unit on a wiring base material is provided.

According to the method for manufacturing a light emitting device according to an embodiment of the present invention, it is possible to suppress the generation of an unused light emitting element.

It is a schematic diagram which shows the preparation process of the base material on which a light emitting element is mounted. It is a schematic plan view which shows the manufacturing process of the carrier base material on which a light emitting element is mounted. It is a schematic diagram which shows the manufacturing process of the carrier base material unit with a light emitting element. It is a schematic perspective view which shows the completion process of the light emitting device which concerns on one Embodiment of this invention, which comprises a wiring base material and a light emitting element array arranged on a wiring base material. It is a schematic cross-sectional view which shows the positioning mode of the light emitting element mounting base material on the carrier base material with a resin material. It is a schematic diagram of the base material on which a light emitting element is mounted. It is a schematic diagram of the carrier base material with a resin material. It is a schematic plan view which shows the coating mode of the resin material on the 1st carrier base material. It is a schematic plan view which shows the coating mode of the resin material on the 2nd carrier base material. It is a schematic plan view which shows the coating mode of the resin material on the 3rd carrier base material. It is a schematic plan view which shows the coating mode of the resin material on the 4th carrier base material. It is a schematic cross-sectional view which shows the bonding mode of the carrier base material with a resin material, and a light emitting element. It is a schematic plan view which shows the bonding mode of the carrier base material with a resin material, and a light emitting element. It is a schematic cross-sectional view which shows the mode of transfer | transfer of a light emitting element onto a carrier base material with a resin material. It is a schematic diagram of the base material on which the light emitting element is mounted after the transfer of the light emitting element onto the carrier base material with a resin material. It is a schematic diagram of the carrier base material after the light-emitting element transfer on the carrier base material with a resin material. It is a schematic cross-sectional view which shows the cleaning process of the electrode surface side of a light emitting element. It is a schematic cross-sectional view which shows the mode at the time of completion of an individualization process. It is a schematic diagram which shows the mode during the individualization process. It is a schematic plan view which shows the mode at the time of completion of an individualization process. It is a schematic cross-sectional view which shows the mounting mode of the carrier base material unit which mounts a light emitting element on a wiring base material. It is a schematic partial cross-sectional view which shows the peeling mode of the carrier base material with a resin material. It is a schematic plan view which shows the light emitting element array mounted on the wiring base material at a predetermined space. It is a schematic perspective view which shows the light emitting device which was separated into pieces.

Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. In the following description, terms indicating a specific direction or position will be used as necessary. However, the use of these terms is for facilitating the understanding of the invention with reference to the drawings, and the meaning of these terms does not limit the technical scope of the invention. Further, the parts having the same reference numerals appearing in a plurality of drawings refer to the same or equivalent parts.

Furthermore, the embodiments shown below exemplify a light emitting device for embodying the technical idea of the present invention, and do not limit the present invention. In addition, the dimensions, materials, shapes, relative arrangements, etc. of the components described below are not intended to limit the scope of the present invention to the specific description, but are exemplified. It was intended. In addition, the size and positional relationship of the members shown in the drawings may be exaggerated to clarify the explanation.

[Manufacturing method of light emitting device]
Hereinafter, a method for manufacturing a light emitting device according to an embodiment of the present invention will be described with reference to the drawings. FIG. 1A is a schematic view showing a preparation process of a base material on which a light emitting element is mounted. FIG. 1B is a schematic plan view showing a process of manufacturing a carrier base material on which a light emitting element is mounted. FIG. 1C is a schematic view showing a manufacturing process of a carrier base material unit on which a light emitting element is mounted. FIG. 1D is a schematic perspective view showing a completion process of a light emitting device according to an embodiment of the present invention, which comprises a wiring base material and a light emitting element array arranged on the wiring base material.

In the method for manufacturing a light emitting device according to an embodiment of the present invention, a light emitting element mounting base material (see FIG. 1A) on which a plurality of light emitting elements are mounted is finally mounted on a wiring base material for each light emitting element array. (See FIG. 1D). In particular, the method for manufacturing a light emitting device of one embodiment is characterized in that it mainly includes the following steps before mounting each light emitting element array on a wiring base material. In the present specification, the "light emitting element array" refers to an array composed of one or two or more light emitting elements, for example, 10,000 to 30,000 light emitting elements arranged in a matrix in a plan view. Refers to those composed of elements.

(A) Step of Producing a Carrier Base Material Mounted with a Light Emitting Element As shown in FIGS. 1A and 1B, in a step of manufacturing a carrier base material mounted with a light emitting element, a plurality of light emitting elements 1 of the base material 100 mounted with a light emitting element are respectively. It is classified into a plurality of n groups (n ≧ 2) composed of at least one light emitting element array 10α, and the light emitting element array 10α included in each group is transferred to a carrier base material 30 with a different resin material for each group. That is, the light emitting element array 10α is transferred to each of a plurality of n (n ≧ 2) carrier substrates for each group. As a result, a plurality of n light-emitting element-mounted carrier base materials 200 to which the light-emitting element arrays 10α included in each group are transferred are produced.

Specifically, transfer when the shape of the entire region 10 of the plurality of light emitting elements 1 arranged on the light emitting element mounting base material 100 and the transfer region of the light emitting element array 10α to each carrier base material 30 are overlapped with each other. The light emitting element array 10 is transferred to each carrier base material 30 so that the shapes of all regions are substantially the same.

That is, in this step, a method of transferring the light emitting element array 10α to each carrier base material 30 based on the shape of the entire region 10 of the plurality of light emitting elements 1 arranged on the light emitting element mounting base material 100 “before transfer”. To be determined in advance. In other words, the transfer method is determined in advance based on the shape of the entire region 10 of the light emitting element 1 arranged on the light emitting element mounting base material 100.

Therefore, according to a predetermined transfer method of the light emitting element array 10α to each carrier base material 30, substantially all of the plurality of light emitting elements 1 arranged on the light emitting element mounting base material 100 are a plurality of n carrier base materials 30. It becomes possible to transfer to the top. By using four or more carrier base materials 30 as described later, it is possible to reliably suppress the generation of an unused light emitting element 1.

When transferring the light emitting element array 10α onto each carrier base material 30, it is necessary to consider the transfer shape, transfer size, transfer position, and the like of the light emitting element array 10α.

From the viewpoint of production efficiency, it is preferable that the transfer shape and transfer size of the light emitting element array 10α correspond to the planar shape and size of a single light emitting element array which is a component of the finally obtained light emitting device. Further, the transfer position of the light emitting element array 10α is adjusted so that a plurality of transfer regions are separated from each other on each carrier base material 30 from the viewpoint of easiness of carrying out the individualization step later. It is preferable to do so.

The separation arrangement of each transfer region is carried out by alternately repeating the transfer of the light emitting element array 10α to each carrier base material 30 and the non-transfer of the light emitting element array 10α to each carrier base material 30 without carrying out the transfer. Can be done.

As an example of alternating transfer and non-transfer of the light emitting element array 10α, for example, when each transfer region is provided in at least one of the row direction and the column direction, a predetermined interval is provided along the at least one direction. Then, the light emitting element array 10α is transferred. As a result, it becomes possible to position a plurality of transfer regions separately on each carrier base material 30, and it becomes possible to facilitate the subsequent individualization step.

Hereinafter, the step (a) of manufacturing the carrier base material on which the light emitting element is mounted will be described in more detail.

The step of producing the carrier base material on which the light emitting element is mounted includes the following steps.

1) Positioning of the Light Emitting Element Mounted Base Material on the Carrier Base Material with the Resin Material FIG. 2A is a schematic cross-sectional view showing the positioning mode of the light emitting element mounting base material on the carrier base material with the resin material. FIG. 2B is a schematic view of a base material on which a light emitting element is mounted. FIG. 2C is a schematic view of a carrier base material with a resin material.

First, as shown in FIG. 2A, the light emitting element mounting base material 100 in which a plurality of light emitting elements 1 are mounted on the base material 20 is positioned on the carrier base material 30 with the resin material M.

As shown in FIG. 2B, the light emitting element mounting base material 100 has a plurality of light emitting elements 1 mounted on the base material 20 as described above. Specifically, the light emitting element-mounted base material 100 is obtained by forming a plurality of light emitting elements 1 on the base material 20 (for example, a sapphire base material) in a matrix. Although not particularly limited, in the present embodiment, 500,000 to 1,000,000 light emitting elements 1 are densely packed on the base material 20 in a matrix in the light emitting element mounting base material 100. Be placed.

The light emitting element 1 includes a semiconductor laminate and electrodes. The light emitting element 1 is a surface opposite to the light emitting surface 1a (also referred to as the main light emitting surface), the side surface 1b extending in a direction different from the light emitting surface 1a (for example, the vertical direction), and the light emitting surface 1a. It includes an electrode surface 1d provided with a pair of electrodes 1c. In the light emitting element mounting base material 100, a plurality of light emitting elements 1 are mounted on the base material 20 by using a bonding material such as resin so that the electrode surface 1d of the light emitting element faces the base material 20.

As the light emitting element 1, a semiconductor light emitting device capable of emitting light having an arbitrary wavelength can be selected. For example, a light emitting diode or the like can be selected as the light emitting element 1. As an example, as the light emitting element 1, one that emits blue light can be used. The light emitting element 1 is not limited to this, and an element that emits light of a color other than blue light may be used. When a plurality of light emitting elements 1 arranged at predetermined intervals are used in the light emitting device, one that emits light of the same color or one that emits different colors may be used.

For example, a semiconductor stacked body of the light emitting element 1 capable of emitting blue light, the use of the nitride semiconductor _{(In x Al y Ga 1-} xy N, 0 ≦ X, 0 ≦ Y, X + Y ≦ 1) it can. In this case, the nitride-based semiconductor light emitting device has, for example, a sapphire substrate and a nitride-based semiconductor laminated structure laminated on the sapphire substrate. The nitride-based semiconductor laminated structure includes a light-emitting layer, an n-type nitride-based semiconductor layer positioned so as to sandwich the light-emitting layer, and a p-type nitride-based semiconductor layer. The n-side electrode and the p-side electrode, which are electrodes 1c, are electrically connected to the n-type nitride-based semiconductor layer and the p-type nitride-based semiconductor layer, respectively.

The light emitting element 1 may have an arbitrary shape in a plan view, for example, a shape such as a square or a rectangle. Further, the plan view shape of the light emitting element 1 may be a polygon such as a triangle or a hexagon. The size of the light emitting element 1 in a plan view may have, for example, a vertical and horizontal dimension of 5 μm or more and 100 μm or less, preferably 10 μm or more and 80 μm or less in a plan view. The height of the light emitting element 1 may be 1 μm or more and 50 μm or less, preferably 2 μm to 20 μm.

Further, as shown in FIG. 2C, the carrier base material 30 with the resin material M can be obtained by applying the resin material M on the upper surface of the carrier base material 30. The resin material M is not particularly limited as long as it can bond the carrier base material 30 and the light emitting element array to be transferred onto the carrier base material 30 later. Examples of the resin include at least one resin material selected from the group consisting of a silicone-based resin material, an epoxy-based resin material, and an acrylic-based resin material. Specifically, polydimethylsiloxane (PDMS) can be used. If a low-viscosity material such as polydimethylsiloxane is used, the coating region of the resin material can be formed at a target position. Further, as the carrier base material 30, a glass base material or the like can be used.

The coating modes include "coating the resin material M on the upper surface of the carrier base material 30 at predetermined intervals" and "continuously applying the resin material M on the upper surface of the carrier base material 30". It can be divided into application mode 2. In the coating mode 1, the resin material M is applied so that a region to which the resin material M is applied and a region not to be applied are formed on the region corresponding to the entire region 10 of the plurality of light emitting elements 1 on the upper surface of the carrier base material 30. I do. On the other hand, in the coating mode 2, the resin material M is coated on the entire region corresponding to the entire region 10 of the plurality of light emitting elements 1 on the upper surface of the carrier base material 30. In the coating mode 2, the resin material M may be coated on the entire upper surface of the carrier base material 30.

FIG. 3A is a schematic plan view showing a mode in which the resin material is applied onto the first carrier base material. FIG. 3B is a schematic plan view showing a mode in which the resin material is applied onto the second carrier base material. FIG. 3C is a schematic plan view showing a mode in which the resin material is applied onto the third carrier base material. FIG. 3D is a schematic plan view showing a mode in which the resin material is applied onto the fourth carrier base material.

Hereinafter, the coating mode 1 will be mainly described. The coating mode 1 is a mode in which the resin material M is coated on the upper surface of the carrier base material 30 at predetermined intervals before the transfer of the light emitting element array 10α (see FIG. 2C). That is, in the coating mode 1, a coating region made of the resin material M is intermittently and discontinuously formed on the upper surface of the carrier base material 30.

Specifically, the coating position of the resin material M on the plurality of carrier base materials 30 is determined based on the shape of the entire region 10 of the plurality of light emitting elements 1 arranged on the light emitting element mounting base material 100, and the determined coating is performed. A coating region made of the resin material M is formed on each carrier base material 30 at predetermined intervals according to the position.

More specifically, the coating when the shape of the entire region 10 of the plurality of light emitting elements 1 arranged on the light emitting element mounting base material 100 and the coating region of the resin material M on each carrier base material 30 are overlapped with each other. A coating region made of the resin material M is formed on the upper surface of each carrier base material 30 at predetermined intervals so that the shapes of all regions are substantially the same.

That is, the mode of applying the resin material to the upper surface of each carrier base material 30 is determined in advance based on the shape of the entire region 10 of the plurality of light emitting elements 1 arranged on the light emitting element mounting base material 100 “before transfer”. .. In other words, the coating mode is determined in advance based on the shape of the entire region 10 of the light emitting element 1 arranged on the light emitting element mounting base material 100.

Further, it is preferable that the shape and size of each coating region correspond to the planar shape and planar size of the light emitting element array, which is one of the components of the finally obtained light emitting device.

As an example, when the planar shape of a single light emitting element array, which is a component of the finally obtained light emitting device, is rectangular, the planar shape of the coating region made of the resin material M is also rectangular. It is preferable to do so. Without being limited to this, the planar shape of the coating region may be a square or the like. Further, it is preferable that the size of the coating region made of the resin material M corresponds to the plane size of a single light emitting element array which is a component of the finally obtained light emitting device. Further, from the viewpoint of efficiently producing a light emitting element array having the same shape later, it is preferable that the shapes of the coating regions formed on the upper surface of each carrier base material 30 at predetermined intervals are substantially the same.

It is preferable that the size of the coating area of the resin material is equal to the size of the light emitting element array. If the size of the coating area of the resin material is larger than the size of the light emitting element array, the resin also comes into contact with the light emitting element that is not the transfer target, so that the resin remains on the surface of the light emitting element, which affects the subsequent process. However, if the size of the coating area of the resin material is the same as the size of the light emitting element array, the above-mentioned fear does not occur.

Although not particularly limited, when the plane shape of the coating area is rectangular or square, one side of the coating area may be 1 mm to 40 mm, preferably 2 mm to 35 mm, more preferably 2 mm to 35 mm. Is 3 mm to 30 mm, for example 25 mm. Further, although not particularly limited, the thickness of the coating region may be 5 μm to 500 μm, preferably 10 μm to 400 μm, and more preferably 15 μm to 300 μm.

If the thickness of the resin material is too thin, an impact may be applied to the light emitting element 1 when the light emitting element array is arranged on the carrier base material 30, and the light emitting element may be damaged. Further, if the thickness of the resin material is too thick, when the light emitting element array is arranged on the carrier base material 30, the light emitting element array is likely to be displaced in the plane direction, so that the mounting accuracy of the light emitting element array may be lowered.

The position of each coating region shall be adjusted and determined so that a plurality of coating regions are formed separately on each carrier base material 30 from the viewpoint of ease of carrying out the individualization step later. Is preferable.

Regarding the separation arrangement of each coating region, the coating of the resin material M on the upper surface of each carrier base material 30 and the non-coating in which the resin material M is not applied to the upper surface of each carrier base material 30 are alternately repeated. Can be carried out at.

As an example of alternating application and non-coating of the material M, for example, when each coating region is formed in at least one of the row direction and the column direction, a predetermined interval is provided along the at least one direction. The resin material M is applied. This makes it possible to form a plurality of coating regions on the upper surface of each carrier base material 30 at a distance from each other.

From the above, in the coating mode 1, the coating region made of the resin material M is formed under the conditions corresponding to the transfer conditions of the light emitting element array 10α to be transferred to each of the plurality of n carrier base materials 30 described above. .. That is, in the coating mode 1, it has substantially the same shape as the transfer shape of the light emitting element array to be transferred later on each carrier base material 30, has substantially the same size as the transfer size, and is substantially the same as the transfer position. , A coating region made of the resin material M is formed.

As an example, a case where the planar shape of the entire region 10 of the plurality of light emitting elements 1 has a shape in which each corner portion of the rectangular portion is removed is taken as an example (see FIG. 2B).

In this case, the required number of carrier base materials 30 is determined based on the shape of the entire region 10 of the plurality of light emitting elements 1. Specifically, the shape of the entire region 10 of the plurality of light emitting elements 1 and the shape of the entire coated region when the coating regions of the resin material M on each carrier base material 30 are overlapped with each other can be substantially the same. The number of required carrier base materials 30 is determined.

In making such a determination, the coating regions to be coated on each carrier base material 30 are formed at predetermined intervals in consideration of the ease of carrying out the individualization step later, and the plane of the light emitting element array. Consider making the shape substantially the same plane as the shape.

As a result of this determination, in the case of the example shown in FIG. 2B, if the four carrier base materials 30A to 30D shown in FIGS. 3A to 3D are used, the shape of the entire region 10 of the plurality of light emitting elements 1 and the four carrier base materials are used. It can be understood that the shapes of the entire coated regions when the coated regions of the resin material M on 30A to 30D are overlapped with each other can be substantially the same.

Based on such contents, as shown in FIG. 3A, a plurality of coating regions of the resin material M are formed on the first carrier base material 30A at predetermined intervals along the row direction and the column direction. For example, a plurality of coating regions are formed along the row direction and the column direction at intervals of approximately the width of the light emitting element array which is a component of the finally obtained light emitting device. The "predetermined interval" here is, for example, an interval corresponding to the size of the light emitting element array. When the spacing is equal to the size of the light emitting element array, a plurality of resin materials can be formed at a spacing of 3.2 mm in the column direction and 12.8 mm in the row direction.

As shown in FIG. 3B, the position of the coating region is approximately the width of the light emitting element array along the column direction with reference to the position of the coating region (see FIG. 3A) of the resin material M on the first carrier base material 30A. A coating region made of the resin material M is formed on the second carrier base material 30B so as to be displaced.

As shown in FIG. 3C, the position of the coating region is approximately the width of the light emitting element array along the row direction with reference to the position of the coating region (see FIG. 3A) of the resin material M on the first carrier base material 30A. A coating region made of the resin material M is formed on the third carrier base material 30C so as to be displaced.

Finally, as shown in FIG. 3D, the position of the coating region emits light along the row direction and the column direction with reference to the position of the coating region (see FIG. 3A) of the resin material M on the first carrier base material 30A. A coating region made of the resin material M is formed on the fourth carrier base material 30D so as to be displaced by approximately the width of the element array. Regarding the formation pattern of the coating region on the fourth carrier base material 30D, the position of the coating region on the third carrier base material 30C is used as a reference, and the width of the light emitting element array is further along the column direction. Form so as to shift.

As described above, the coating mode 2 is not limited to the coating mode 1, and the coating mode 2 in which the resin material M is continuously coated on the upper surface of the carrier base material 30 may be applied.

2) Bonding of Carrier Base Material with Resin Material and Light Emitting Element FIG. 4A is a schematic cross-sectional view showing a bonding mode of the carrier base material with a resin material and the light emitting element. FIG. 4B is a schematic plan view showing a bonding mode between the carrier base material with the resin material and the light emitting element. In FIG. 4B, the base material 20 is omitted in order to make it easier to determine the position of the light emitting element 1.

As shown in FIGS. 4A and 4B, the carrier base material 30 with the resin material M and the light emitting element 1 are bonded together.

Specifically, the light emitting element mounting base material 100 is positioned on the carrier base material 30 so that the light emitting surface 1a of the light emitting element 1 constituting the light emitting element array and the resin material M on each carrier base material 30 are in contact with each other. Although not particularly limited, as an example, the plane shape and plane size of the base material 20 (sapphire base material, etc.) and the plane shape and plane size of the carrier base material 30 may be substantially the same.

As a coating mode of the resin material M directly facing the light emitting surface 1a of the light emitting element 1 constituting the light emitting element array, as shown in FIGS. 4A and 4B, the above coating mode 1 (predetermined on the upper surface of the carrier base material 30). A mode in which the resin material M is applied at intervals) can be used. The application mode 2 may be used without being limited to this.

In particular, as compared with the coating mode 2, in the coating mode 1, the formation position, shape and size of the coating region are determined in advance, and the resin material M is applied onto the carrier base material 30 at predetermined intervals to form the coating region. Form. Therefore, the position of the light emitting element mounting base material 100 on the carrier base material 30 so that the light emitting surface 1a of the light emitting element 1 which is a component of the light emitting element array to be transferred later and the resin material M on the carrier base material are in contact with each other. It is preferable to match.

3) Transfer of the light emitting element array FIG. 5 is a schematic cross-sectional view showing a mode of transferring the light emitting element onto a carrier base material with a resin material. FIG. 6A is a schematic view of the light emitting element mounting base material after the light emitting element is transferred onto the carrier base material with the resin material. FIG. 6B is a schematic view of the carrier base material after the transfer of the light emitting element onto the carrier base material with the resin material.

Next, the light emitting element array is transferred. That is, the light emitting element is transferred. The light emitting element array is transferred to a predetermined position on the upper surface of each carrier base material 30 according to the information regarding the transfer position, transfer shape, and transfer size of the light emitting element array determined in advance.

In the present embodiment, each of the plurality of light emitting elements 1 of the light emitting element mounting base material 100 is based on the shape of the entire region 10 of the plurality of light emitting element 1 arranged on the light emitting element mounting base material 100 “before transfer”. It is classified into a plurality of n groups composed of at least one light emitting element array 10α, and the light emitting element array 10α included in each group is transferred to a carrier base material 30 with a different resin material for each group.

As an example, a case where the planar shape of the entire region 10 of the plurality of light emitting elements 1 has a shape in which each corner portion of the rectangular portion is removed is taken as an example (see FIG. 2B). In this case, as described above, if the four carrier base materials 30 are used, the shapes of the entire region 10 of the plurality of light emitting elements 1 and the coating regions of the resin material M on the four carrier base materials 30 are overlapped with each other. The shape of the entire coated area can be substantially the same. On the premise of such contents, the transfer position, transfer shape, and transfer size of the light emitting element array 10α in each carrier base material 30 are determined in advance.

Then, as shown in FIGS. 1B, 5, 6A, and 6B, in accordance with predetermined information on the transfer position, transfer shape, and transfer size of the light emitting element array 10α, the carriers are placed at predetermined positions on the upper surface of each carrier base material 30. The light emitting element array is transferred.

Specifically, a plurality of light emitting element arrays are transferred onto the first carrier base material 30A at predetermined intervals along the row direction and the column direction. For example, a plurality of light emitting element arrays are transferred along the row direction and the column direction at intervals of approximately the width of the light emitting element array which is a component of the finally obtained light emitting device. The embodiment shown in FIGS. 5, 6A, and 6B is, for example, an embodiment in which a plurality of light emitting element arrays are transferred onto the first carrier substrate at predetermined intervals.

Similarly, with reference to the position of the transfer region of the light emitting element array 10α on the first carrier base material 30A, the position of the transfer region is shifted along the column direction by approximately the width of the light emitting element array. A plurality of light emitting element arrays 10α are transferred onto the base material 30B at predetermined intervals (see FIG. 1B).

Similarly, with reference to the position of the transfer region of the light emitting element array 10α on the first carrier base material 30A, the position of the transfer region is shifted along the row direction by approximately the width of the light emitting element array. A plurality of light emitting element arrays 10α are transferred onto the base material 30C at predetermined intervals (see FIG. 1B).

Finally, with reference to the position of the transfer region of the light emitting element array 10α on the first carrier base material 30A, the position of the transfer region is shifted along the row direction and the column direction by approximately the width of the light emitting element array. A transfer region of the light emitting device array 10α is formed on the carrier base material 30D of No. 4. Regarding the formation pattern of the transfer region on the fourth carrier base material 30D, the position of the transfer region on the third carrier base material 30C is used as a reference, and the width of the light emitting element array is further along the column direction. Form so as to shift.

As a result, for example, in the case where the planar shape of the entire region 10 of the plurality of light emitting elements 1 is the shape shown in FIG. 2B, the transfer of the light emitting element array 10α to each of the above four carrier base materials 30 results in the transfer of the light emitting element array 10α. It is possible to form the carrier base material 200 (200A to 200D) on which four light emitting elements are mounted.

As a result, according to a predetermined transfer method of the light emitting element array 10α to each carrier base material 30, substantially all of the plurality of light emitting elements 1 arranged on the light emitting element mounting base material 100 are four carrier base materials. It is possible to transfer up to 30. Therefore, it is possible to suppress the generation of an unused light emitting element 1.

Examples of the transfer method include known ones. For example, the light emitting element can be transferred to the carrier base material 30 of the transfer destination by irradiating the transfer target portion with ultraviolet light or laser light.

(B) Step of Fabricating Carrier Base Material Unit Mounted with Light-emitting Element FIG. 7 is a schematic cross-sectional view showing a cleaning process of the electrode surface side of the light-emitting element. FIG. 8A is a schematic cross-sectional view showing an aspect at the time of completion of the individualization step. FIG. 8B is a schematic view showing an aspect in which the individualization step is being carried out. FIG. 8C is a schematic plan view showing an aspect when the individualization step is completed.

As described above, for example, in the case where the planar shape of the entire region 10 of the plurality of light emitting elements 1 is the shape shown in FIG. 2B, by going through the steps of (a) producing the carrier base material on which the light emitting element is mounted, 4 It is possible to form the carrier base material 200 (200A to 200D) on which one light emitting element is mounted.

As shown in FIG. 8B, each of the four light-emitting element-mounted carrier base materials 200 obtained has a plurality of light-emitting element arrays 10α arranged on the carrier base material 30 and the carrier base material 30 at predetermined intervals. Consists of having. In such a state, as shown in FIG. 7, a cleaning process is performed so that the electrode 1c located on the electrode surface 1d side of the light emitting element 1 of each light emitting element-mounted carrier base material 200 is exposed. Then, as shown in FIGS. 1C, 8A, and 8C, the carrier base material 30 is separated into individual pieces by cutting the carrier base material 30 in the matrix direction using, for example, a dicing blade.

As described above, it is possible to manufacture a plurality of m light emitting element-mounted carrier base material units 200α having the individualized carrier base material 30α and the light emitting element array 10α arranged on the carrier base material 30α. it can.

The light emitting element-mounted carrier base material 200 obtained in accordance with the above coating mode 1 has a predetermined interval after determining the formation position, shape and size of the coating region on the upper surface of the carrier base material 30 which is a component thereof. It has a coating region composed of the resin material M formed by the above.

Therefore, in the step (b), when the carrier base material 30 is cut in order to obtain the light emitting element-mounted carrier base material unit 200α, the carrier base material 30 is cut, while the cutting of the resin material M is avoided. Is possible. As a result, the generation of resin waste is suppressed, and as a result, the yield can be improved. Further, since the target to be cut is the carrier base material 30 alone, the effect that the manufacturing process of the carrier base material unit 200α on which the light emitting element is mounted can be easily performed can be obtained as compared with the case where the target is two or more.

On the other hand, the light emitting element-mounted carrier base material 200 obtained according to the above coating mode 2 has a coating region composed of a continuously formed resin material M on the upper surface of the carrier base material 30 which is a component thereof. Consists of.

In the coating mode 2, the light emitting element 1 can be aligned with the positioning mark provided on the carrier substrate 30. Since it is not necessary to align the resin material M and the carrier base material 30 as described in the coating mode 1, the alignment of the light emitting element mounting base material 100 becomes easy. As a result, it is possible to smoothly and at low cost the process from the transfer to form the light emitting element-mounted carrier base material 200 to the cutting of the light emitting element-mounted carrier base material 200.

(C) Step of mounting the light emitting element on the wiring base material FIG. 9 is a schematic cross-sectional view showing a mounting mode of the light emitting element mounting carrier base material unit on the wiring base material. FIG. 10 is a schematic partial cross-sectional view showing a peeling mode of the resin material carrier base material. FIG. 11 is a schematic plan view showing a plurality of light emitting element arrays mounted on the wiring base material at predetermined intervals. FIG. 12 is a schematic perspective view showing an individualized light emitting device.

After forming the carrier base material unit 200α on which the light emitting element is mounted, as shown in FIG. 9, the electrode 1c provided on the electrode surface 1d side of the light emitting element 1 and the wiring portion 41 which is a component of the wiring base material 40 come into contact with each other. As described above, the light emitting element-mounted carrier base material unit 200α provided with the carrier base material 30α is mounted on the wiring base material 40. As the wiring base material 40, for example, one made of a silicon substrate provided with an IC circuit can be used.

Then, as shown in FIG. 10, the carrier base material 30α of the light emitting element-mounted carrier base material unit 200α is peeled off from the light emitting element 1. Specifically, the individualized carrier base material 30α is peeled from the light emitting element 1 so that the light emitting surface 1a of the light emitting element 1 and the resin material M are separated from each other. As a method for peeling the carrier base material 30α, a known method can be used.

Note that FIGS. 9 and 10 show an embodiment in which a single light emitting element-mounted carrier base material unit 200α is mounted on the wiring base material 40. However, the embodiments shown in FIGS. 9 and 10 are merely examples, and as shown in FIG. 11, a plurality of light emitting element-mounted carrier base material units are located at a position where a single wiring base material 40 can be preferably electrically connected. 200α can be arranged at predetermined intervals, and then the individualized carrier base material 30α can be peeled off in the same manner as in FIG.

After the individualized carrier base material 30α is peeled off, each light emitting element array 10α is cut so as to be individualized in a plan view using, for example, a dicing blade.

As described above, as shown in FIGS. 1D and 12, the embodiment of the present invention includes the individualized wiring base material 40α and the light emitting element array 10α arranged on the wiring base material 40α. Such a light emitting device 300α can be obtained.

After obtaining the light emitting device 300α, a light reflecting member may be provided so as to surround the side surface of the light emitting element from the viewpoint of facilitating guiding the light emitted from the light emitting element which is a component of the light emitting element array 10α in a predetermined direction. preferable. As the light-reflecting member, for example, a white resin obtained by adding light-reflecting white powder or the like to a transparent resin can be used. The light reflecting member may be a silicone resin containing an inorganic white powder such as titanium oxide. From the viewpoint of preferably reflecting the light emitted from the light emitting element, the light reflecting member may be a white resin having a reflectance of, for example, 60% or more, preferably white having a reflectance of 90% or more. It is a resin. In addition to titanium oxide, zirconia, alumina, or the like may be contained.

A translucent member may be provided between the side surface of the light emitting element and the light reflecting member and / or on the light emitting surface of the light emitting element. Examples of the material of the translucent member include silicone-based resin, epoxy resin, and acrylic-based resin.

Further, a wavelength conversion member capable of absorbing light emitted from the light emitting element and converting it into light having a different wavelength may be provided on the light emitting surface side of the light emitting element. The wavelength conversion member includes a wavelength conversion material such as a phosphor. Examples of the phosphor include a YAG phosphor ((Y, Lu, Gd) ₃ (Al, Ga) ₅ O ₁₂ : Ce) that emits yellowish light, a β-sialone phosphor that emits greenish light, and a reddish one. Fluoride-based phosphors (for example, K ₂ (Si, Ti, Ge) F ₆ : Mn, etc.), nitride-based phosphors (for example, Sr, Ca), AlSiN ₃ : Eu), etc., which emit light of the above can be mentioned. The wavelength conversion member may include a single type of wavelength conversion material, or may include a plurality of wavelength conversion materials.

Although one embodiment of the present invention has been described above, it merely illustrates a typical example of the scope of application of the present invention. Therefore, those skilled in the art will easily understand that the present invention is not limited to this, and various modifications can be made.

The light emitting device according to the present embodiment can be suitably used for automobile headlights, projectors and the like.

1 Light emitting element 1a Light emitting surface of light emitting element 1b Side surface of light emitting element 1c Electrode 1d Electrode plane of light emitting element 10 Overall area of a plurality of light emitting elements arranged on a base material mounted on a light emitting element 10 α Light emitting element array 20 Base material 30 Carrier base material 30α Fragmented carrier base material 30A First carrier base material 30B Second carrier base material 30C Third carrier base material 30D Fourth carrier base material 40 Wiring base material 40α Fragmented wiring base material 41 Wiring part 42 Base material 100 Light emitting element mounted base material 200 Light emitting element mounted carrier base material 200α Light emitting element mounted carrier base material unit 200A First light emitting element mounted carrier base material 200B Second light emitting element mounted carrier base material 200C Third Light-emitting element-mounted carrier base material 200D Fourth light-emitting element-mounted carrier base material 300α Light-emitting device M Resin material

Claims (12)

A light emitting device including mounting on a wiring base material for each light emitting element array including one or two or more light emitting elements among a plurality of light emitting elements from a light emitting element mounting base material on which a plurality of light emitting elements are mounted. It is a manufacturing method of
The plurality of light emitting elements of the light emitting element mounting base material are classified into a plurality of n groups each composed of at least one light emitting element array, and the light emitting element arrays included in each group are provided with different resin materials for each group. A step of producing a plurality of n light-emitting element-mounted carrier base materials on which the light-emitting element arrays included in each group are transferred by transferring to a carrier base material, and
The plurality of n light-emitting element-mounted carrier base materials are individually separated so as to include the at least one light-emitting element array, and a plurality of m light-emitting element-mounted carrier base material units are formed from each light-emitting element-mounted carrier base material. The process of making and
A method for manufacturing a light emitting device, which comprises a step of mounting the light emitting element included in the light emitting element array of the light emitting element mounting carrier base material unit on a wiring base material. The shape of the entire region of the plurality of light emitting elements arranged on the base material on which the light emitting element is mounted and the shape of the entire region of transfer when the transfer regions of the light emitting element array on each carrier base material are overlapped with each other are approximately abbreviated. The manufacturing method according to claim 1, wherein the light emitting element array is transferred to each carrier base material so as to be the same. The manufacturing method according to claim 1 or 2, wherein the transfer of the light emitting element array to each carrier base material and the non-transfer of the light emitting element array to each carrier base material are alternately repeated. The manufacturing method according to claim 3, wherein the light emitting element array is transferred at a predetermined interval along at least one of the row direction and the column direction. Prior to transfer of the light emitting element array, each carrier base material is coated with a resin material for joining the light emitting element array and the carrier base material, and is arranged on the light emitting element mounting base material. Claims 1 to 4, wherein the coating position of the resin material on each carrier base material is determined based on the shape of the entire region of the plurality of light emitting elements, and the resin material is applied to each carrier base material according to the determined coating position. The manufacturing method according to any one. The production method according to claim 5, wherein the resin material is applied onto each carrier base material at a predetermined interval along at least one of the row direction and the column direction. The manufacturing method according to claim 5 or 6, wherein the planar shape and the planar size of the coating region of the resin material are matched with the planar shape and the planar size of the light emitting element array. The production method according to claim 7, wherein the resin material is coated on the carrier substrate so that the planar shapes of the coating regions formed on the carrier substrates at predetermined intervals are substantially the same. Using the four carrier base materials, the position of the coating region is the light emission along the row direction, the column direction, and the matrix direction with reference to the position of the coating region of the resin material on the first carrier base material. Any of claims 5 to 8, wherein the resin material is applied to the second carrier base material, the third carrier base material, and the fourth carrier base material so as to be displaced by approximately the width of the element array. The manufacturing method described in Crab. The claim that the light emitting element mounting base material is aligned on the carrier base material so that the light emitting surface of the light emitting element constituting the light emitting element array and the resin material on the carrier base material are in contact with each other. The production method according to any one of 5 to 9. The production according to any one of claims 1 to 4, wherein the resin material is continuously applied to each carrier base material, and the resin material is continuously applied to each carrier base material before the transfer of the light emitting element array. Method. The manufacturing method according to any one of claims 1 to 11, wherein as the light emitting element array, an array composed of 10,000 to 30,000 light emitting elements arranged densely in a matrix is used.

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