JP2021067688A - 高感度温度センサ及びその製造方法 - Google Patents
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 47
- 239000010410 layer Substances 0.000 claims abstract description 133
- 239000013110 organic ligand Substances 0.000 claims abstract description 119
- 239000000758 substrate Substances 0.000 claims abstract description 112
- 239000002105 nanoparticle Substances 0.000 claims abstract description 96
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 47
- 239000003446 ligand Substances 0.000 claims abstract description 42
- 239000011241 protective layer Substances 0.000 claims abstract description 13
- 239000011370 conductive nanoparticle Substances 0.000 claims description 72
- 238000000034 method Methods 0.000 claims description 51
- -1 (3-aminopropanol) triethoxysilane Chemical compound 0.000 claims description 26
- 239000000126 substance Substances 0.000 claims description 24
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 claims description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 11
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 claims description 9
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 9
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 claims description 7
- QGLWBTPVKHMVHM-KTKRTIGZSA-N (z)-octadec-9-en-1-amine Chemical compound CCCCCCCC\C=C/CCCCCCCCN QGLWBTPVKHMVHM-KTKRTIGZSA-N 0.000 claims description 7
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 claims description 7
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 claims description 7
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 claims description 7
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 claims description 7
- 239000005642 Oleic acid Substances 0.000 claims description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 7
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 claims description 7
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 claims description 7
- 229910052709 silver Inorganic materials 0.000 claims description 7
- 239000004332 silver Substances 0.000 claims description 7
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 claims description 6
- ZMZDMBWJUHKJPS-UHFFFAOYSA-M Thiocyanate anion Chemical compound [S-]C#N ZMZDMBWJUHKJPS-UHFFFAOYSA-M 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 239000010931 gold Substances 0.000 claims description 6
- GLDOVTGHNKAZLK-UHFFFAOYSA-N octadecan-1-ol Chemical compound CCCCCCCCCCCCCCCCCCO GLDOVTGHNKAZLK-UHFFFAOYSA-N 0.000 claims description 6
- ZMBHCYHQLYEYDV-UHFFFAOYSA-N trioctylphosphine oxide Chemical compound CCCCCCCCP(=O)(CCCCCCCC)CCCCCCCC ZMBHCYHQLYEYDV-UHFFFAOYSA-N 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- DKIDEFUBRARXTE-UHFFFAOYSA-N 3-mercaptopropanoic acid Chemical compound OC(=O)CCS DKIDEFUBRARXTE-UHFFFAOYSA-N 0.000 claims description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 239000000460 chlorine Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- XMBWDFGMSWQBCA-UHFFFAOYSA-M iodide Chemical compound [I-] XMBWDFGMSWQBCA-UHFFFAOYSA-M 0.000 claims description 3
- 229910052697 platinum Inorganic materials 0.000 claims description 3
- 229910052717 sulfur Inorganic materials 0.000 claims description 3
- 239000011593 sulfur Substances 0.000 claims description 3
- 229910052714 tellurium Inorganic materials 0.000 claims description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 3
- 229910052721 tungsten Inorganic materials 0.000 claims description 3
- 239000010937 tungsten Substances 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 2
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 claims description 2
- 230000008859 change Effects 0.000 abstract description 45
- 239000010409 thin film Substances 0.000 description 37
- 239000011248 coating agent Substances 0.000 description 27
- 238000000576 coating method Methods 0.000 description 27
- 230000000052 comparative effect Effects 0.000 description 16
- 230000008569 process Effects 0.000 description 11
- 238000005229 chemical vapour deposition Methods 0.000 description 10
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 9
- 238000000206 photolithography Methods 0.000 description 9
- 238000005507 spraying Methods 0.000 description 8
- FOIXSVOLVBLSDH-UHFFFAOYSA-N Silver ion Chemical compound [Ag+] FOIXSVOLVBLSDH-UHFFFAOYSA-N 0.000 description 7
- 238000007641 inkjet printing Methods 0.000 description 7
- 230000035945 sensitivity Effects 0.000 description 7
- 238000012546 transfer Methods 0.000 description 7
- 238000007740 vapor deposition Methods 0.000 description 7
- 238000003618 dip coating Methods 0.000 description 6
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 6
- 239000002094 self assembled monolayer Substances 0.000 description 6
- 239000013545 self-assembled monolayer Substances 0.000 description 6
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 6
- 238000004088 simulation Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 238000010422 painting Methods 0.000 description 5
- 238000004528 spin coating Methods 0.000 description 5
- 238000004544 sputter deposition Methods 0.000 description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- 238000001523 electrospinning Methods 0.000 description 4
- 238000007756 gravure coating Methods 0.000 description 4
- 230000007246 mechanism Effects 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- 238000007764 slot die coating Methods 0.000 description 4
- 238000001771 vacuum deposition Methods 0.000 description 4
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 125000003277 amino group Chemical group 0.000 description 3
- 238000010549 co-Evaporation Methods 0.000 description 3
- 238000007872 degassing Methods 0.000 description 3
- 238000000313 electron-beam-induced deposition Methods 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 3
- 238000000059 patterning Methods 0.000 description 3
- 238000001552 radio frequency sputter deposition Methods 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- 229910001961 silver nitrate Inorganic materials 0.000 description 3
- VYMPLPIFKRHAAC-UHFFFAOYSA-N 1,2-ethanedithiol Chemical compound SCCS VYMPLPIFKRHAAC-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 101710134784 Agnoprotein Proteins 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 150000001450 anions Chemical class 0.000 description 2
- 238000009529 body temperature measurement Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000004205 dimethyl polysiloxane Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 229920005839 ecoflex® Polymers 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 238000001755 magnetron sputter deposition Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000012798 spherical particle Substances 0.000 description 2
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- BWGNESOTFCXPMA-UHFFFAOYSA-N Dihydrogen disulfide Chemical compound SS BWGNESOTFCXPMA-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 206010040844 Skin exfoliation Diseases 0.000 description 1
- 235000009754 Vitis X bourquina Nutrition 0.000 description 1
- 235000012333 Vitis X labruscana Nutrition 0.000 description 1
- 240000006365 Vitis vinifera Species 0.000 description 1
- 235000014787 Vitis vinifera Nutrition 0.000 description 1
- 239000013543 active substance Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000009530 blood pressure measurement Methods 0.000 description 1
- 238000005119 centrifugation Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 239000000017 hydrogel Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 229940006461 iodide ion Drugs 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011859 microparticle Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 239000012454 non-polar solvent Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- ULWHHBHJGPPBCO-UHFFFAOYSA-N propane-1,1-diol Chemical compound CCC(O)O ULWHHBHJGPPBCO-UHFFFAOYSA-N 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- GUGNSJAORJLKGP-UHFFFAOYSA-K sodium 8-methoxypyrene-1,3,6-trisulfonate Chemical compound [Na+].[Na+].[Na+].C1=C2C(OC)=CC(S([O-])(=O)=O)=C(C=C3)C2=C2C3=C(S([O-])(=O)=O)C=C(S([O-])(=O)=O)C2=C1 GUGNSJAORJLKGP-UHFFFAOYSA-K 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- DZLFLBLQUQXARW-UHFFFAOYSA-N tetrabutylammonium Chemical compound CCCC[N+](CCCC)(CCCC)CCCC DZLFLBLQUQXARW-UHFFFAOYSA-N 0.000 description 1
- 238000000427 thin-film deposition Methods 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
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- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
- G01K7/18—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer
- G01K7/186—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer using microstructures
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- G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
- G01N27/12—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluid; of a solid body in dependence upon reaction with a fluid, for detecting components in the fluid
- G01N27/125—Composition of the body, e.g. the composition of its sensitive layer
- G01N27/127—Composition of the body, e.g. the composition of its sensitive layer comprising nanoparticles
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Abstract
Description
硝酸銀(AgNO3、99.9+%)は、アルファエイサー社(Alfa Aeser,Co.)から購入した。
[実施例1]
1.銀ナノ粒子の合成
硝酸銀3.4g、オレイルアミン10.0mL及びオレイン酸90.0mLを200mLの3口フラスコに入れ、混合した後、70℃で1時間脱気させた。
PDMS基板を30分間紫外線−オゾン処理して洗浄し、表面にヒドロキシ基(−OH)を形成した。
合成した銀ナノ粒子溶液を、1000rpmで30秒間、PDMS基板上にスピンコーティングした。
PDMS基板の代わりにガラス基板を使用した以外は、前記実施例1と同様の方法でナノ粒子薄膜を製造した。
前記実施例1に係るナノ粒子薄膜である第1ナノ粒子層上にフォトレジストを塗布した後、フォトリソグラフィ工程を通じてフォトレジストの一部をエッチングした。
図4は、本発明の実施例に係るEDT(1,2−ethanedithiol)で置換されてクラックを含むナノ粒子薄膜のFEM(finite element method)シミュレーションを示したイメージである。
110 膨張基板
120 第1ナノ粒子層
121 第1温度感知層
130 フォトレジスト
131 第1温度感知層が露出した領域
132 フォトレジストが残留した領域
133 残留したフォトレジスト
140 第2ナノ粒子層
141 電極層
151 第1電極
152 第2電極
160 第1温度感知部
170 第3ナノ粒子層
171 第2温度感知層
180 第2温度感知部
190 保護層
210 伝導性ナノ粒子
220 第2有機リガンド
230 無機リガンド
Claims (15)
- 膨張基板上に、第1有機リガンドで取り囲まれた伝導性ナノ粒子を含む第1ナノ粒子層を形成するステップと、
前記第1ナノ粒子層の第1有機リガンドを第2有機リガンドで置換して、クラックを含む第1温度感知層を形成するステップと、
前記第1温度感知層上にフォトレジストを塗布及びエッチングして、前記第1温度感知層が露出した領域及び前記フォトレジストが残留した領域を形成するステップと、
前記第1温度感知層上に、前記第1有機リガンドで取り囲まれた伝導性ナノ粒子を含む第2ナノ粒子層を形成するステップと、
前記第2ナノ粒子層の第1有機リガンドを無機リガンドで置換して電極層を形成するステップと、
前記第1温度感知層上の前記フォトレジストが残留した領域を除去して、電極及び第1温度感知部を形成するステップと、
前記電極及び前記第1温度感知部上に、第1有機リガンドで取り囲まれた伝導性ナノ粒子を含む第3ナノ粒子層を形成するステップと、
前記第3ナノ粒子層の第1有機リガンドを前記第2有機リガンドで置換して、クラックを含む第2温度感知層及び第2温度感知部を形成するステップと、
前記第2温度感知部上に保護層を形成するステップと、を含むことを特徴とする、高感度温度センサの製造方法。 - 前記フォトレジストは、前記第2有機リガンドと化学結合を形成して前記第1温度感知層上に塗布されることを特徴とする、請求項1に記載の高感度温度センサの製造方法。
- 前記膨張基板は、外部温度の増加に伴って熱膨張し、
前記第1温度感知部及び前記第2温度感知部は、前記クラックの間隔が増加して前記高感度温度センサの抵抗の増加を感知することを特徴とする、請求項1に記載の高感度温度センサの製造方法。 - 前記膨張基板はPDMS(polydimethylsiloxane)を含むことを特徴とする、請求項1に記載の高感度温度センサの製造方法。
- 前記膨張基板は、紫外線−オゾン(UV−ozone)及びAPTES((3−aminopropyl)triethoxysilane)処理されることを特徴とする、請求項1に記載の高感度温度センサの製造方法。
- 前記膨張基板の熱膨張係数は、1.0×10−4K−1〜1.0×10−3K−1であることを特徴とする、請求項1に記載の高感度温度センサの製造方法。
- 前記伝導性ナノ粒子は、金(Au)、銀(Ag)、銅(Cu)、アルミニウム(Al)、白金(Pt)、ニッケル(Ni)、タングステン(W)、及び鉄(Fe)のうちの少なくともいずれか1つを含むことを特徴とする、請求項1に記載の高感度温度センサの製造方法。
- 前記第1有機リガンドは、TOPO(trioctylphosphineoxide)、オクタデカノール(octadecanol)、オレイン酸(oleic acid)及びオレイルアミン(oleylamine)のうちの少なくともいずれか1つを含むことを特徴とする、請求項1に記載の高感度温度センサの製造方法。
- 前記第2有機リガンドは、MPA(3−mercaptopropionic acid)、EDT(1,2−ethanedithiol)、EDA(ethylenediamine)、BDT(benzenedithiol)、ピリジン(pyridine)、TGA(methanethiosulfonyl−galactoside)及びPDT(propanedithiol)のうちの少なくともいずれか1つを含むことを特徴とする、請求項1に記載の高感度温度センサの製造方法。
- 前記無機リガンドは、硫黄イオン(S2−)、塩素イオン(Cl−)、臭素イオン(Br−)、チオシアン酸イオン(SCN−)、ヨウ素イオン(I−)、二硫化物イオン(HS−)、テルルイオン(Te2−)、水酸化イオン(OH−)、四フッ化ホウ酸イオン(BF4 −)及び六フッ化リン酸イオン(PF6 −)のうちの少なくともいずれか1つを含むことを特徴とする、請求項1に記載の高感度温度センサの製造方法。
- 膨張基板と、
前記膨張基板上に形成され、第2有機リガンドで取り囲まれた伝導性ナノ粒子によってクラックが形成される第1温度感知部を含む第1温度感知層と、
前記第1温度感知層上に互いに離隔して形成され、無機リガンドで取り囲まれた伝導性ナノ粒子を含む第1電極及び第2電極と、
前記第1電極と第2電極との間に形成され、前記第2有機リガンドで取り囲まれた伝導性ナノ粒子によってクラックが形成される第2温度感知部と、
前記第1電極及び前記第2電極上に形成され、前記第2有機リガンドで取り囲まれた伝導性ナノ粒子によってクラックが形成される第2温度感知層と、
前記第2温度感知部上に形成される保護層と、を含むことを特徴とする、高感度温度センサ。 - 前記膨張基板は、外部温度の増加に伴って熱膨張し、
前記第1温度感知部及び前記第2温度感知部は、前記クラックの間隔が増加して前記高感度温度センサの抵抗の増加を感知することを特徴とする、請求項11に記載の高感度温度センサ。 - 前記膨張基板はPDMS(polydimethylsiloxane)を含むことを特徴とする、請求項11に記載の高感度温度センサ。
- 前記膨張基板の熱膨張係数は、1.0×10−4K−1〜1.0×10−3K−1であることを特徴とする、請求項11に記載の高感度温度センサ。
- 前記第1温度感知部及び前記第2温度感知部の温度−抵抗係数(temperature coefficient of resistance、TCR)は、0.05K−1〜0.6K−1であることを特徴とする、請求項11に記載の高感度温度センサ。
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