JP2021061294A - Cleaning device - Google Patents

Abstract

To provide a cleaning device capable of improving the yield of a wafer by suppressing the bounce of a chemical solution on the wafer.SOLUTION: There is provided a cleaning device according to an embodiment. The cleaning device includes a jig having a support portion extending along a rotation axis and a fixing surface capable of fixing an object to be cleaned and rotating together with the support portion, and a cup having an annular wall surface surrounding the jig at a position separated from the jig, and the inner wall of the wall surface has a plurality of grooves provided in a direction parallel to the fixed surface and a direction intersecting the direction, and the plurality of grooves are provided so as to surround the object to be cleaned.SELECTED DRAWING: Figure 3

Description

The present invention relates to a cleaning device.

When cleaning electronic substrates such as semiconductor wafers and photomasks, physical cleaning such as ultrasonic cleaning and chemical cleaning using a chemical solution are performed. Compared with physical cleaning, chemical cleaning has less load on the electronic substrate, and it is easy to properly dispose of fine dust. Therefore, when cleaning the electronic substrate, chemical cleaning is mainly performed.

For cleaning with a chemical solution, for example, a single-wafer cleaning device is used. In Patent Document 1, it is confirmed that the chemical solution is dropped on the wafer surface in a state where the wafer is stationary or rotated at a low speed, and the way the chemical solution spreads on the wafer surface under the first chemical droplet is non-uniform. Then, a method of uniformly applying the chemical solution by dropping the chemical solution again at a position where the chemical solution has not spread is described.

The chemical solution dropped on the wafer in the single-wafer cleaning device spreads on the wafer by the centrifugal force generated by the rotation of the wafer. Excess chemicals are blown off the edges of the wafer. The blown chemical solution hits the inner wall surface of the cup provided in the device and then is drained. At this time, the chemical solution that hits the inner wall of the cup bounces off the wafer, and impurities may remain on the wafer. Wafers with residual impurities do not meet the required performance and may result in defective products.

Japanese Unexamined Patent Publication No. 2003-45768 Japanese Unexamined Patent Publication No. 62-108520

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a cleaning device capable of improving the yield of a wafer by suppressing the rebound of a chemical solution onto a wafer.

According to one aspect of the present invention, a jig having a support portion extending along a rotation axis and a fixing surface capable of fixing an object to be cleaned and rotating together with the support portion, and the above-mentioned cure. A cup having an annular wall surface surrounding the jig is provided at a position separated from the tool, and the inner wall of the wall surface has a plurality of grooves provided in a direction parallel to the fixed surface and a direction intersecting the fixed surface. A cleaning device is provided which has the plurality of grooves and is provided so as to surround the object to be cleaned.

According to the present invention, it is possible to provide a cleaning device capable of improving the yield of the wafer by suppressing the bounce of the chemical solution on the wafer.

FIG. 5 is a cross-sectional view schematically showing an example of a cleaning device according to an embodiment. FIG. 5 is a cross-sectional view schematically showing a state in which an object to be cleaned is fixed to the cleaning device shown in FIG. FIG. 5 is a cross-sectional view schematically showing another example of the cleaning device according to the embodiment. An enlarged cross-sectional view of part A in FIG. A cross-sectional view schematically showing how the chemical solution is scattered. The figure which typically drew the dimension of the cup provided in the cleaning apparatus which concerns on embodiment. The figure which shows the modification of FIG. FIG. 5 is a cross-sectional view schematically showing an example of a cleaning device according to a reference example. FIG. 5 is a cross-sectional view schematically showing another example of the cleaning device according to the reference example.

Hereinafter, embodiments will be described with reference to the drawings. In addition, the same reference numerals are given to common configurations throughout the embodiment, and duplicate description will be omitted. In addition, each figure is a schematic view for explaining the embodiment and promoting its understanding, and the shape, dimensions, ratio, etc. of the figure are different from those of the actual device. The design can be changed as appropriate by taking into consideration.

As a single-wafer cleaning device for cleaning electronic substrates such as wafers, for example, a cup whose surface roughness is increased by blasting the inner wall of the cup provided in the cleaning device, or an angular gradient is applied to the inner wall of the cup. Attached cups are used.

FIG. 8 is a cross-sectional view showing an example of a cleaning device according to a reference example in which the inner wall of the cup is blasted. FIG. 9 is a cross-sectional view showing an example of a cleaning device according to a reference example in which an angle gradient is provided on the inner wall of the cup.

The cleaning device 100 shown in FIGS. 8 and 9 includes a jig 10 and a cup 2. The cleaning device 100 may further include a cleaning liquid supply nozzle (not shown). The cleaning liquid supply nozzle can supply a chemical solution for cleaning the object to be cleaned.

The jig 10 includes a support portion 11 extending along the rotation shaft 13 and a fixing surface 12 capable of fixing the object to be cleaned 3 and rotating together with the support portion 11. The support portion 11 can rotate about the rotation shaft 13. The support portion 11 rotates at a rotation speed of, for example, 3000 rpm or less. The shape of the support portion 11 is, for example, an axisymmetric shape with the rotation shaft 13 as the axis. The axisymmetric shape means a shape in which the shape does not change in the circumferential direction around the axis, but the shape changes depending only on the distance from the central axis. Examples of the shape of the support portion 11 include a columnar shape such as a cylinder or a prism, and a frustum shape.

The jig 10 shown in FIGS. 8 and 9 includes a turntable 14. The turntable 14 includes a fixing surface 12 on which the object to be cleaned 3 can be fixed. The jig 10 does not have to include the turntable 14. In this case, the support portion 11 includes a fixed surface 12.

When the jig 10 includes the turntable 14, the turntable 14 is connected to the end portion of the support portion 11 in the rotation axis direction. Therefore, the turntable 14 can rotate together with the support portion 11. The shape of the turntable 14 is also an axisymmetric shape with the rotation shaft 13 as the axis, similarly to the shape of the support portion 11.

8 and 9 show, as an example, a case where the support portion 11 and the turntable 14 both have a cylindrical shape. The turntable 14 has two circular bottom surfaces. Of these two bottom surfaces, one bottom surface is connected to the support portion 11. The other bottom surface is a fixed surface 12.

The object to be cleaned 3 can be fixed to the fixing surface 12 by, for example, vacuum suction. The fixed surface 12 intersects the rotating shaft 13 perpendicularly, for example. The fixed surface 12 has, for example, a plurality of holes. These holes are connected to a suction device (not shown) through the turntable 14 and the support portion 11. With the object to be cleaned 3 placed on the fixed surface 12, the object to be cleaned 3 is vacuum-adsorbed to the fixed surface 12 by sucking fluid (for example, air) in a plurality of holes provided on the fixed surface 12. obtain.

The object to be cleaned 3 is, for example, a semiconductor wafer having a circular main surface. The object to be cleaned 3 is not particularly limited as long as it can be fixed to the fixing surface 12. The cup 2 is arranged at a position separated from the jig 10. The cup 2 is a cup having an annular wall surface 21 surrounding the jig 10. The wall surface 21 is, for example, a side wall surface extending in the direction of gravity. The wall surface 21 includes an inner wall 210.

The cup 2 may further include a circular upper wall surface 22 provided at one open end of the wall surface 21. 8 and 9 show a case where the upper wall surface 22 is provided as an example.

When the cup 2 includes an upper wall surface 22, the upper wall surface 22 includes a hole 24 penetrating from one surface to the other. The hole 24 is used, for example, to supply a chemical solution onto the object to be cleaned 3.

In the cup 2 shown in FIG. 8, at least a part of the inner wall 210 included in the wall surface 21 is blasted. The inner wall 210 of the wall surface 21 has a higher surface roughness as compared with the case where the blast treatment is not applied. When the chemical solution scattered from above the object to be cleaned 3 hits the inner wall 210 having a relatively high surface roughness, the chemical solution is unlikely to bounce off at a reflection angle corresponding to the incident angle of the chemical solution. For example, the chemical solution that hits the inner wall 210 splits into a plurality of small droplets, and each droplet bounces off at various angles. As a result, the amount of the chemical solution that bounces off the object to be cleaned 3 can be reduced as compared with the case where the inner wall 210 is not blasted.

The cup 2 shown in FIG. 9 includes an inclined wall surface 23. In the cup 2 shown in FIG. 9, the end portion of the wall surface 21 and the end portion of the upper wall surface 22 are joined via an inclined wall surface 23. The inclination of the inclined wall surface 23 is provided so that the chemical liquid scattered from the object to be cleaned 3 hits the inner wall of the inclined wall surface 23 and bounces off in the direction of gravity. As a result, the amount of the chemical solution that bounces off the object to be cleaned 3 can be reduced as compared with the case where the cup 2 does not have the inclined wall surface 23.

According to the cup 2 shown in FIGS. 8 and 9, it is possible to prevent the chemical solution scattered from the object to be cleaned 3 from bouncing onto the object to be cleaned 3 due to the centrifugal force caused by the rotation of the jig 10. However, the effect is not sufficient.

According to the cleaning device according to the embodiment described below, the rebound of the scattered chemical solution can be sufficiently suppressed. As a result, it is possible to improve the yield of a wafer or the like as an object to be cleaned.

FIG. 1 is a cross-sectional view schematically showing an example of a cleaning device according to an embodiment. FIG. 2 is a cross-sectional view schematically showing a state in which an object to be cleaned is fixed to the cleaning device according to FIG.

The cleaning device 1 shown in FIGS. 1 and 2 includes a jig 10 and a cup 20. The cleaning device 1 may further include a cleaning liquid supply nozzle (not shown). The cleaning liquid supply nozzle can supply a chemical solution for cleaning the object to be cleaned. Details of the cup 20 will be described later with reference to FIGS. 3 to 7.

The jig 10 includes a support portion 11 extending along the rotation shaft 13 and a fixing surface 12 capable of fixing the object to be cleaned 3 and rotating together with the support portion 11. The support portion 11 can rotate about the rotation shaft 13. The support portion 11 rotates at a rotation speed of, for example, 3000 rpm or less. The shape of the support portion 11 is, for example, an axisymmetric shape with the rotation shaft 13 as the axis. The axisymmetric shape means a shape in which the shape does not change in the circumferential direction around the axis, but the shape changes depending only on the distance from the central axis. Examples of the shape of the support portion 11 include a columnar shape such as a cylinder or a prism, and a frustum shape.

The jig 10 shown in FIGS. 1 and 2 includes a turntable 14. The turntable 14 includes a fixing surface 12 on which the object to be cleaned 3 can be fixed. The jig 10 does not have to include the turntable 14. In this case, the support portion 11 includes a fixed surface 12.

When the jig 10 includes the turntable 14, the turntable 14 is connected to the end portion of the support portion 11 in the rotation axis direction. Therefore, the turntable 14 can rotate together with the support portion 11. The shape of the turntable 14 is also an axisymmetric shape with the rotation shaft 13 as the axis, similarly to the shape of the support portion 11.

As an example, FIGS. 1 and 2 show a case where the support portion 11 and the turntable 14 both have a cylindrical shape. The turntable 14 has two circular bottom surfaces. Of these two bottom surfaces, one bottom surface is connected to the support portion 11. The other bottom surface is a fixed surface 12.

The object to be cleaned 3 can be fixed to the fixing surface 12 by, for example, vacuum suction. The fixed surface 12 preferably intersects the rotating shaft 13 perpendicularly. In this case, when the object to be cleaned 3 is cleaned while rotating the jig 10 around the rotating shaft 13, the chemical solution dropped on the object to be cleaned 3 tends to spread uniformly on the main surface of the object to be cleaned 3. .. As a result, the object to be cleaned 3 can be uniformly washed.

The object to be cleaned 3 is, for example, a semiconductor wafer having a circular main surface. The object to be cleaned 3 is not particularly limited as long as it can be fixed to the fixing surface 12.

The cup 20 is arranged at a position separated from the jig 10. The cup 20 is a cup having an annular wall surface 21 surrounding the jig 10. The wall surface 21 is, for example, a side wall surface extending in the direction of gravity. The wall surface 21 includes an inner wall 210 and an outer wall 211. The cup 20 may further include a circular upper wall surface 22 provided at one open end of the wall surface 21. In FIGS. 1 and 2, as an example, a case where the upper wall surface 22 is provided is depicted.

When the cup 20 includes an upper wall surface 22, the upper wall surface 22 includes a hole 24 penetrating from one surface to the other. The hole 24 is used, for example, to supply a chemical solution onto the object to be cleaned 3.

The inner wall 210 has a plurality of grooves provided in a direction parallel to the fixed surface 12 and a direction intersecting the direction. The orientation of the plurality of grooves may be, for example, a direction orthogonal to the direction parallel to the fixed surface 12, or a direction intersecting the direction parallel to the fixed surface 12 at an angle of 45 °. A plurality of grooves provided on the inner wall 210 are provided so as to surround the object to be cleaned 3. That is, the height of the surface on the object to be cleaned 3 on which the chemical solution is dropped and the height of the plurality of grooves provided on the inner wall 210 are substantially the same.

When the inner wall 210 of the cup 20 has the above-mentioned plurality of grooves, most of the chemicals scattered from the object to be cleaned 3 by centrifugal force when the object to be cleaned 3 is cleaned by using the cleaning device 1 will be generated. Go into multiple grooves. The chemical solution that has entered these grooves rebounds in the groove a plurality of times, so that its kinetic energy becomes small and falls in the direction of gravity. That is, among the chemicals scattered from the object 3 to be cleaned by centrifugal force, the amount of the chemicals that hit the inner wall 210 of the cup 20 and bounce off the object 3 to be cleaned is small. Therefore, according to the cleaning apparatus according to the embodiment, it is possible to suppress the rebound of the chemical solution to the object to be cleaned 3, and as a result, the yield of the wafer can be improved.

An example of the cup 20 will be described with reference to FIGS. 3 and 4.
FIG. 3 is a cross-sectional view schematically showing an example of the cup according to the embodiment. FIG. 4 is an enlarged view of a portion A of the cup shown in FIG. FIG. 3 shows a case where the cleaning device according to the embodiment is observed from the direction of the rotation axis of the jig.

The cup 20 includes a wall surface 21 including an inner wall 210 and an outer wall 211. The cup 20 has, for example, a plurality of grooves 4 and a plurality of protrusions 5 that separate the plurality of grooves 4. The wall surface 21 of the cup 20 is provided concentrically with the rotation shaft (not shown) of the jig 10. As shown in FIGS. 3 and 4, the plurality of grooves 4 and the plurality of protrusions 5 are alternately provided along the circumferential direction of the cup 20.

At least one of the plurality of protrusions 5 is inclined so that, for example, the widest surface of the plurality of surfaces of the protrusions 5 facing the groove 4 faces the jig 10. 3 and 4 show a case where all of the plurality of protrusions 5 are inclined so that the widest surface of the plurality of surfaces of the protrusions 5 facing the groove 4 faces the jig 10. ing. The inclination direction of the plurality of protrusions 5 is preferably a direction orthogonal to the rotation axis.

The jig 10 preferably rotates in a direction opposite to the direction in which the plurality of protrusions 5 are inclined. For example, the plurality of protrusions 5 shown in FIG. 3 are inclined clockwise (clockwise). In this case, it is preferable that the jig 10 is configured to rotate counterclockwise (counterclockwise).

When the jig 10 rotates in the direction opposite to the direction in which the plurality of protrusions 5 are inclined, the chemical solution scattered by the centrifugal force generated by the rotation of the jig 10 when cleaning the object to be cleaned with the chemical solution. Is difficult to bounce out of the groove 4 after entering the groove 4 between the plurality of protrusions 5. This will be described with reference to FIG.

FIG. 5 is a diagram schematically showing an example of how the chemical solution scattered from the object to be cleaned enters the groove of the cup. The cleaning device shown in FIG. 5 has the same structure as the cleaning device described with reference to FIGS. 3 and 4 except that the object to be cleaned 3 is fixed on the fixed surface 12 of the jig 10. doing.

When the chemical solution for cleaning is dropped onto the object to be cleaned 3 rotating counterclockwise, the excess chemical solution 6 scatters as shown in FIG. 5, for example. The surplus chemical solution 6 is scattered along the tangential direction 7 of the outer circumference of the object to be cleaned 3, for example. The scattered chemical solution 6 enters any of the plurality of grooves 4 provided in the inner wall 210 of the cup 20. The chemical solution 6 that has entered the groove 4 hits the protrusion 5 and bounces off, and hits the protrusion 5 adjacent to the protrusion 5. In this way, the kinetic energy of the scattered chemical solution 6 becomes small, and the scattered chemical solution 6 is confined in the groove 4. Therefore, the frequency of contact between the scattered chemical solutions 6 can be reduced. As a result, the chemical solution 6 falls in the direction of gravity and is drained, so that the amount of the chemical solution that bounces upward on the object to be cleaned 3 can be reduced.

The behavior of all the chemical solutions 6 scattered from the object to be cleaned 3 does not always show the above-mentioned behavior. However, since at least a part of the scattered chemical solution 6 exhibits the above-mentioned behavior, the chemical solution 6 scattered from the object to be cleaned 3 and hitting the inner wall 210 does not bounce off the object to be cleaned 3, so that the solution 6 is not repelled on the object to be cleaned 3. The amount of impurities in the above can be reduced. Therefore, according to the cleaning apparatus according to the embodiment, it is possible to improve the yield of the object to be cleaned, for example, the wafer.

The cup provided in the cleaning device according to the embodiment will be described in more detail with reference to FIGS. 6 and 7. FIG. 6 is an enlarged cross-sectional view showing a part of the cup included in the cleaning device according to the embodiment in an enlarged manner.

The cup 20 shown in FIG. 6 has a structure similar to that described with reference to FIG.

As described with reference to FIGS. 3 and 4, the wall surface 21 of the cup 20 is provided concentrically with the rotation shaft of a jig (not shown).

The distance L between the plurality of grooves 4 corresponds to an inscribed angle within the range of 1 ° to 30 ° on a concentric circle centered on the rotation axis. In other words, the distance L between the grooves 4 means the length of the circumference connecting the deepest position of a certain groove to the deepest position of the groove adjacent to this groove. If the distance L between the grooves 4 is too large, when the scattered chemical solution enters the groove, the amount of the chemical solution that bounces off the object to be cleaned tends to increase.

Each of the plurality of protrusions 5 has a plurality of surfaces. The protrusion 5 has, for example, a first surface 51 having a large surface area facing the groove 4 and a second surface 52 having a small surface area facing the other groove 4. The first surface 51 having a large surface area of the plurality of protrusions 5 faces the jig 10. The second surface 52, which has a small surface area, does not face the jig 10.

The first surface 51 may or may not be curved. The first surface 51 is preferably curved so that the surface 51 is recessed. By doing so, it is possible to reduce the amount of the chemical solution that rebounds in the direction of the object to be cleaned when the scattered chemical solution enters the groove 4 and hits the first surface 51. Further, the second surface 52 may or may not be curved. In FIG. 6, the second surface 52 shows a case where the surface 52 is curved so as to protrude.

FIG. 7 is an enlarged cross-sectional view showing a modified example of FIG. The cup 20 shown in FIG. 7 has the same configuration as that of FIG. 6 except for the matters described below.

That is, in the cup 20 shown in FIG. 7, the second surface 52 is curved so as to be recessed. This is preferable because it is possible to reduce the amount of the chemical solution scattered to the outside of the groove 4 when the chemical solution that bounces off the first surface 51 hits the second surface 52.

As shown in FIG. 6, when the second surface 52 is curved so as to protrude, there is an advantage that the cup 20 can be easily manufactured. However, from the viewpoint of improving the yield, as shown in FIG. 7, it is preferable that the second surface 52 is curved so as to be recessed.

The two protrusions 5 adjacent to each other with the groove 4 in between have two surfaces facing each other, and the angle formed by these two surfaces is, for example, in the range of 1 ° to 90 °, preferably 5 °. It is within the range of ~ 30 °. The two surfaces facing each other are composed of, for example, a first surface 51 of a certain protrusion 5 and a second surface 52 of a protrusion 5 adjacent to the protrusion 5. These two surfaces can also be referred to as the two surfaces forming the groove 4.

The two-dimensional dimensions of the protrusion 5 shown in FIG. 6 will be described.

Each of the plurality of protrusions 5 includes a long side 510 and a short side 520. In the cup 20, the circumscribed circle connecting the deepest positions of the plurality of grooves 4 to each other is referred to as the circumscribed circle X.

The long side 510 is a line segment connecting the apex of the protrusion 5 to the deepest position of the groove 4 with a straight line distance. The length M of the long side 510 is, for example, in the range of 3 mm to 100 mm.

As shown in FIG. 6, when the cross-sectional shape of the second surface 52 of the protrusion 5 is an arc shape, the line segment connecting both ends of the arc shape is defined as the short side 520. That is, the arc and the short side 520 intersect at two points on the apex of the protrusion 5 and on the circumscribed circle X. The length N of the short side 520 is, for example, in the range of 3 mm to 60 mm.

The ratio N / M of the length N of the short side 520 to the length M of the long side 510 is, for example, in the range of 0.33 to 0.85, preferably in the range of 0.42 to 0.7. .. If this ratio is close to 1, the effect of suppressing the rebound of the scattered chemical solution may not be sufficiently exhibited. If this ratio is too small, the chemical solution that hits the protrusion 5 is not trapped in the groove 4, and there is a high possibility that it will bounce toward the outside of the groove 4.

The angle P of the long side 510 is an angle formed by the tangent line of the circumscribed circle X at the deepest position of the groove 4 and the long side 510. The angle P of the long side 510 is, for example, in the range of 10 ° to 90 °.

The angle Q of the short side 520 is an angle formed by the tangent line of the circumscribed circle X at the point where the short side 520 intersects the circumscribed circle X and the short side 520. The angle Q of the short side 520 is, for example, in the range of 10 ° to 90 °.

The height H of the protrusion 5 is the distance of a perpendicular line drawn from the apex of the protrusion 5 to the circumscribed circle X. The ratio of the height H of at least one protrusion 5 to the inner diameter of the cup 20 is, for example, in the range of 0.6% to 25%, preferably in the range of 1% to 15%. The inner diameter of the cup 20 is the diameter of the circumscribed circle X. If the height H of the protrusion 5 is excessively low, it becomes difficult for the scattered chemical solution to enter the groove 4, and the rebound of the chemical solution to the object to be cleaned may not be sufficiently suppressed. If the height H of the protrusion 5 is excessively high, the chemical solution that hits the protrusion 5 and bounces off tends to easily adhere to the object to be cleaned.

As shown in FIGS. 3 to 7, the plurality of protrusions 5 preferably have sharp tips. That is, it is preferable that at least one of the plurality of protrusions 5 has a frustum shape rather than a frustum shape. In other words, it is preferable that at least one of the plurality of protrusions 5 has a smaller tip area than the base area of the protrusion 5. In this case, the amount of the chemical solution that hits the tip of the protrusion 5 is reduced, and the amount of the chemical solution that enters the groove 4 is increased, so that the amount of the chemical solution that bounces toward the object to be cleaned can be reduced.
It is preferable that all of the plurality of protrusions 5 have a cone shape.

The cup 20 is made of, for example, a fluororesin. The example of the fluororesin constituting the cup 20 is at least one selected from the group consisting of polytetrafluoroethylene (PTFE), perfluoroalkoxy alkane (PFA) and polyvinylidene fluoride (PVDF). When the cup 20 is made of fluororesin, corrosion of the cup 20 by the chemical solution can be suppressed. The wall surface 21 of the cup 20 and the plurality of protrusions 5 are preferably made of the same material. The cup 20 is preferably made of PTFE.

The chemical solution used for cleaning an object to be cleaned such as a wafer is, for example, hydrofluoric acid, sulfuric acid, hydrochloric acid, or the like.

The cleaning device cup according to the embodiment is preferably manufactured by preparing a lump of fluororesin and cutting it. According to the cutting process, it is possible to manufacture a cup having a highly accurate shape, so that it is possible to enhance the effect of suppressing the excess chemical solution from bouncing back to the object to be cleaned. As a result, the yield of the object to be cleaned such as a wafer can be further increased.

It is also possible to manufacture a cup by welding a fluororesin. For example, the protrusions can be welded to the inner wall of the cup. However, in this case, since the cup is deformed by welding heat or the like, the accuracy of the cup dimensions is deteriorated, and the effect of suppressing the rebound of the chemical solution tends to be inferior.

[Example]
Examples will be described below, but the embodiments are not limited to the examples described below.

(Example)
A cup for a single-wafer cleaning device was manufactured by cutting from a resin block made of PTFE. The manufactured cup had substantially the same shape as the cup 20 described with reference to FIGS. 1 to 7.

The dimensions of the cups manufactured were as follows. For the following dimensions, each dimension is measured at 10 points, and the average value obtained by averaging them is described.
(1) Distance (pitch) between a plurality of protrusions: 15 °
(2) Angle formed by the two surfaces forming the groove: 17 °
(3) Length of the long side of the protrusion: 50 mm
(4) Length of the short side of the protrusion: 35 mm
(5) Angle of the long side of the protrusion: 50 °
(6) Angle of the short side of the protrusion: 70 °
(7) Height of protrusion: 30 mm
(8) Cup diameter: 220 mm

(Comparison example)
A cup in which the inner wall of the cup was blasted, which was described with reference to FIG. 8, was prepared. That is, the plurality of protrusions described in the embodiment do not exist on the inner wall of this cup.

When the cup according to the embodiment is used as the cup of the cleaning device, the rebound of the chemical solution onto the object to be cleaned is suppressed and an excellent yield can be achieved as compared with the case where the cup according to the comparative example is used. did it.

As described above, the cleaning device provided with the cup according to the embodiment can suppress the rebound of the chemical solution to the wafer when cleaning the wafer with the chemical solution, so that an excellent yield can be achieved. Can be done.

The present invention is not limited to the above-described embodiment, and can be variously modified at the implementation stage without departing from the gist thereof. In addition, each embodiment may be carried out in combination as appropriate, and in that case, the combined effect can be obtained. Further, the above-described embodiment includes various inventions, and various inventions can be extracted by a combination selected from a plurality of disclosed constituent requirements. For example, even if some constituent requirements are deleted from all the constituent requirements shown in the embodiment, if the problem can be solved and the effect is obtained, the configuration in which the constituent requirements are deleted can be extracted as an invention.

1 ... cleaning device, 2 ... cup, 3 ... object to be cleaned, 4 ... groove, 5 ... protrusion, 6 ... chemical solution, 7 ... tangential direction, 10 ... jig, 11 ... support part, 12 ... fixed surface, 13 ... rotation Shaft, 14 ... turntable, 20 ... cup, 21 ... wall surface, 22 ... upper wall surface, 23 ... inclined wall surface, 24 ... hole, 51 ... first surface, 52 ... second surface, 100 ... cleaning device, 210 ... inner wall , 211 ... outer wall, 510 ... long side, 520 ... short side, H ... height of protrusion, L ... distance between grooves (pitch), M ... long side length, N ... short side length, P ... The angle of the long side, Q ... the angle of the short side, X ... the tangent circle.

Claims (6)

A jig having a support portion extending along a rotation axis and a fixing surface capable of fixing an object to be cleaned and rotating together with the support portion.
A cup having an annular wall surface surrounding the jig is provided at a position separated from the jig.
The inner wall of the wall surface has a plurality of grooves provided in a direction parallel to the fixed surface and a direction intersecting the direction, and the plurality of grooves are a cleaning device provided so as to surround the object to be cleaned. The inner wall further has a plurality of protrusions that separate the plurality of grooves, and the plurality of grooves and the plurality of protrusions are provided alternately.
The cleaning device according to claim 1, wherein at least one of the plurality of protrusions is the widest surface of the plurality of surfaces of the protrusions facing the groove, which is inclined so as to face the jig. .. The second aspect of the present invention, wherein the two protrusions adjacent to each other across the groove have two surfaces facing each other, and the angle formed by the two surfaces is in the range of 1 ° to 90 °. Cleaning equipment. The wall surface is provided concentrically with the rotation shaft.
The cleaning device according to claim 2 or 3, wherein the distance between the two grooves adjacent to each other across the protrusion corresponds to an inscribed angle within the range of 1 ° to 30 ° on a concentric circle of the rotation axis. The cleaning device according to any one of claims 2 to 4, wherein the ratio of the height of the plurality of protrusions to the inner diameter of the cup is in the range of 0.6% to 25%. The cleaning device according to any one of claims 2 to 5, wherein at least one of the plurality of protrusions has a cone shape.

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