JP2021059755A5 - - Google Patents
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- JP2021059755A5 JP2021059755A5 JP2019184640A JP2019184640A JP2021059755A5 JP 2021059755 A5 JP2021059755 A5 JP 2021059755A5 JP 2019184640 A JP2019184640 A JP 2019184640A JP 2019184640 A JP2019184640 A JP 2019184640A JP 2021059755 A5 JP2021059755 A5 JP 2021059755A5
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- forming apparatus
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- 239000007788 liquid Substances 0.000 claims description 64
- 230000015572 biosynthetic process Effects 0.000 claims description 28
- 238000000034 method Methods 0.000 claims description 7
- 238000007599 discharging Methods 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 230000008021 deposition Effects 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims 6
- 230000008020 evaporation Effects 0.000 claims 1
- 238000001704 evaporation Methods 0.000 claims 1
- 239000012528 membrane Substances 0.000 claims 1
Description
本発明は以下の構成を採用する。すなわち、
成膜室において被成膜物に成膜を行う成膜装置であって、
前記被成膜物を支持する被成膜物支持部と、
前記被成膜物支持部と接続されて回転する回転部と、前記回転部の周囲に設けられ前記成膜室に固定された固定部と、を有するロータリージョイントと、
を備え、
前記固定部は、液体が供給される供給口と、液体が排出される排出口と、を有し、
前記回転部は、前記供給口から供給された液体を前記被成膜物支持部へ供給する供給流路と、前記被成膜物支持部から排出された液体を前記排出口へ排出する排出流路と、を有し、
前記供給口、前記供給流路、前記被成膜物支持部、前記排出流路、前記排出口の順に液体が流れる液体流路が構成される成膜装置において、
前記排出口から排出された液体を前記供給口に供給する循環経路と、
前記循環経路に配されたポンプおよびバルブと、
前記成膜装置の稼働状態に応じて、前記ポンプおよび前記バルブを制御する制御部と、を備えることを特徴とする成膜装置である。
The present invention employs the following configurations. i.e.
A film forming apparatus for forming a film on a film to be formed in a film forming chamber,
a film-forming object supporting portion that supports the film-forming object;
a rotary joint having a rotating portion that rotates while being connected to the support portion for film formation, and a fixed portion that is provided around the rotating portion and fixed to the film formation chamber;
with
The fixed part has a supply port to which the liquid is supplied and a discharge port to which the liquid is discharged,
The rotating portion includes a supply channel for supplying the liquid supplied from the supply port to the film formation object supporting portion, and a discharge channel for discharging the liquid discharged from the film formation object support portion to the discharge port. having a road and
In a film forming apparatus in which a liquid channel through which a liquid flows in the order of the supply port, the supply channel, the film-forming object supporting portion, the discharge channel, and the discharge port,
a circulation path for supplying the liquid discharged from the discharge port to the supply port;
a pump and a valve arranged in the circulation path;
and a control unit that controls the pump and the valve according to an operating state of the film forming apparatus .
本発明はまた、以下の構成を採用する。すなわち、
成膜装置の成膜室において被成膜物に成膜を行う成膜方法であって、
前記成膜装置は、
前記被成膜物を支持する被成膜物支持部と、
前記被成膜物支持部と接続されて回転する回転部と、前記回転部の周囲に設けられ前記成膜室に固定された固定部と、を有するロータリージョイントと、
を有し、
前記固定部は、液体が供給される供給口と、液体が排出される排出口と、を有し、
前記回転部は、前記供給口から供給された液体を前記被成膜物支持部へ供給する供給流路と、前記被成膜物支持部から排出された液体を前記排出口へ排出する排出流路と、を有し、
前記供給口、前記供給流路、前記被成膜物支持部、前記排出流路、前記排出口の順に前記液体が流れる液体流路が構成されており、
前記成膜装置は、さらに、
前記排出口から排出された液体を前記供給口に供給する循環経路と、
前記循環経路に配されたポンプおよびバルブと、
を有し、
前記成膜装置の稼働状態に応じて、前記ポンプおよび前記バルブを制御する工程を備える
ことを特徴とする成膜方法である。
The present invention also employs the following configurations. i.e.
A film forming method for forming a film on a film to be formed in a film forming chamber of a film forming apparatus,
The film forming apparatus is
a film-forming object supporting portion that supports the film-forming object;
a rotary joint having a rotating portion that rotates while being connected to the support portion for film formation, and a fixed portion that is provided around the rotating portion and fixed to the film formation chamber;
has
The fixed part has a supply port to which the liquid is supplied and a discharge port to which the liquid is discharged,
The rotating portion includes a supply channel for supplying the liquid supplied from the supply port to the film formation object supporting portion, and a discharge channel for discharging the liquid discharged from the film formation object support portion to the discharge port. having a road and
A liquid channel through which the liquid flows is configured in the order of the supply port, the supply channel, the film-forming object supporting portion, the discharge channel, and the discharge port,
The film forming apparatus further includes
a circulation path for supplying the liquid discharged from the discharge port to the supply port;
a pump and a valve arranged in the circulation path;
has
A step of controlling the pump and the valve according to the operating state of the film forming apparatus
This film forming method is characterized by:
本発明はまた、以下の構成を採用する。すなわち、
成膜装置の成膜室において被成膜物に成膜材料が成膜される、電子デバイスの製造方法であって、
前記成膜装置は、
前記被成膜物を支持する被成膜物支持部と、
前記被成膜物支持部と接続されて回転する回転部と、前記回転部の周囲に設けられ前記成膜室に固定された固定部と、を有するロータリージョイントと、
を備え、
前記固定部は、液体が供給される供給口と、液体が排出される排出口と、を有し、
前記回転部は、前記供給口から供給された液体を前記被成膜物支持部へ供給する供給流路と、前記被成膜物支持部から排出された液体を前記排出口へ排出する排出流路と、を有し、
前記供給口、前記供給流路、前記被成膜物支持部、前記排出流路、前記排出口の順に前
記液体が流れる液体流路が構成されており、
前記成膜装置は、さらに、
前記排出口から排出された液体を前記供給口に供給する循環経路と、
前記循環経路に配されたポンプおよびバルブと、
を有し、
前記成膜装置の稼働状態に応じて、前記ポンプおよび前記バルブを制御する工程を備える
ことを特徴とする電子デバイスの製造方法である。
The present invention also employs the following configurations. i.e.
A method for manufacturing an electronic device, in which a film of a film-forming material is formed on a film-forming object in a film-forming chamber of a film-forming apparatus,
The film forming apparatus is
a film-forming object supporting portion that supports the film-forming object;
a rotary joint having a rotating portion that rotates while being connected to the support portion for film formation, and a fixed portion that is provided around the rotating portion and fixed to the film formation chamber;
with
The fixed part has a supply port to which the liquid is supplied and a discharge port to which the liquid is discharged,
The rotating portion includes a supply channel for supplying the liquid supplied from the supply port to the film formation object supporting portion, and a discharge channel for discharging the liquid discharged from the film formation object support portion to the discharge port. having a road and
The supply port, the supply channel, the deposition target supporting portion, the discharge channel, and the discharge port are arranged in this order.
A liquid channel through which the liquid flows is configured,
The film forming apparatus further includes
a circulation path for supplying the liquid discharged from the discharge port to the supply port;
a pump and a valve arranged in the circulation path;
has
A step of controlling the pump and the valve according to the operating state of the film forming apparatus
A method of manufacturing an electronic device characterized by:
Claims (13)
前記被成膜物を支持する被成膜物支持部と、
前記被成膜物支持部と接続されて回転する回転部と、前記回転部の周囲に設けられ前記成膜室に固定された固定部と、を有するロータリージョイントと、
を備え、
前記固定部は、液体が供給される供給口と、液体が排出される排出口と、を有し、
前記回転部は、前記供給口から供給された液体を前記被成膜物支持部へ供給する供給流路と、前記被成膜物支持部から排出された液体を前記排出口へ排出する排出流路と、を有し、
前記供給口、前記供給流路、前記被成膜物支持部、前記排出流路、前記排出口の順に液体が流れる液体流路が構成される成膜装置において、
前記排出口から排出された液体を前記供給口に供給する循環経路と、
前記循環経路に配されたポンプおよびバルブと、
前記成膜装置の稼働状態に応じて、前記ポンプおよび前記バルブを制御する制御部と、を備えることを特徴とする成膜装置。 A film forming apparatus for forming a film on a film to be formed in a film forming chamber,
a film-forming object supporting portion that supports the film-forming object;
a rotary joint having a rotating portion that rotates while being connected to the support portion for film formation, and a fixed portion that is provided around the rotating portion and fixed to the film formation chamber;
with
The fixed part has a supply port to which the liquid is supplied and a discharge port to which the liquid is discharged,
The rotating portion includes a supply channel for supplying the liquid supplied from the supply port to the film formation object supporting portion, and a discharge channel for discharging the liquid discharged from the film formation object support portion to the discharge port. having a road and
In a film forming apparatus in which a liquid channel through which a liquid flows in the order of the supply port, the supply channel, the film-forming object supporting portion, the discharge channel, and the discharge port,
a circulation path for supplying the liquid discharged from the discharge port to the supply port;
a pump and a valve arranged in the circulation path;
and a control unit that controls the pump and the valve according to an operating state of the film forming apparatus.
ことを特徴とする請求項1に記載の成膜装置。The film forming apparatus according to claim 1, characterized in that:
ことを特徴とする請求項1に記載の成膜装置。 The control unit controls at least one of the flow rate and pressure of the liquid supplied to the supply port when the object to be film-formed is carried out from the film-forming chamber so that the object to be film-formed in the film-forming chamber is At least one of the flow rate and pressure of the liquid supplied to the supply port is controlled so as to be lower than at least one of the flow rate and pressure of the liquid supplied to the supply port when it is carried in. The film forming apparatus according to claim 1.
前記供給口に供給される前記液体の流量および圧力の少なくとも一方よりも減少するように、前記供給口に供給される前記液体の流量および圧力の少なくとも一方を制御する
ことを特徴とする請求項1に記載の成膜装置。 The control unit adjusts at least one of the flow rate and pressure of the liquid supplied to the supply port when the film formation of the film formation target is not performed. at least one of the flow rate and pressure of the liquid supplied to the supply port is controlled so as to be lower than at least one of the flow rate and pressure of the liquid supplied to the supply port when the The film forming apparatus according to claim 1 .
前記制御部は、前記加熱部による加熱が行われていないときに前記供給口に供給される前記液体の流量および圧力の少なくとも一方が、前記加熱部による加熱が行われているときに前記供給口に供給される前記液体の流量および圧力の少なくとも一方よりも減少するように、前記供給口に供給される前記液体の流量および圧力の少なくとも一方を制御することを特徴とする請求項1に記載の成膜装置。 A heating unit provided in the film formation chamber for heating the evaporation source,
The control unit adjusts at least one of the flow rate and pressure of the liquid supplied to the supply port when the heating unit is not heating the liquid to the supply port when the heating unit is heating the liquid. 2. The method according to claim 1, wherein at least one of the flow rate and pressure of the liquid supplied to the supply port is controlled so as to be lower than at least one of the flow rate and pressure of the liquid supplied to the Deposition equipment.
ことを特徴とする請求項1に記載の成膜装置。 The control unit controls at least one of flow rate and pressure of the liquid supplied to the supply port when the rotation unit is not rotating to be supplied to the supply port when the rotation of the rotation unit is started. 2. The film formation according to claim 1, wherein at least one of the flow rate and pressure of the liquid supplied to the supply port is controlled so as to be lower than at least one of the flow rate and pressure of the liquid supplied to the supply port. Device.
ことを特徴とする請求項1から7の何れか一項に記載の成膜装置。 The control unit controls at least one of flow rate and pressure of the liquid supplied to the supply port by controlling the opening degree of the valve according to the operating state of the film forming apparatus. The film forming apparatus according to any one of claims 1 to 7 .
前記第1の循環経路と前記バイパス経路との接続位置に三方弁が設けられ、
前記制御部は、前記成膜装置の稼働状態に応じて前記三方弁の開度を制御することにより前記供給口に供給される前記液体の流量および圧力の少なくとも一方を制御する
ことを特徴とする請求項1から7の何れか一項に記載の成膜装置。 The circulation path includes a first circulation path connected to the supply port, a second circulation path connected to the discharge port, and between the first circulation path and the second circulation path. a bypass path for sending the liquid flowing through the first circulation path to the second circulation path;
A three-way valve is provided at a connection position between the first circulation route and the bypass route,
The control unit controls at least one of the flow rate and pressure of the liquid supplied to the supply port by controlling the degree of opening of the three-way valve according to the operating state of the film forming apparatus. The film forming apparatus according to any one of claims 1 to 7 .
ことを特徴する請求項1から7の何れか一項に記載の成膜装置。The film forming apparatus according to any one of claims 1 to 7, characterized in that:
ことを特徴とする請求項1から7の何れか一項に記載の成膜装置。 3. The control unit controls at least one of the flow rate and pressure of the liquid supplied to the supply port by controlling the output of the pump according to the operating state of the film forming apparatus. 8. The film forming apparatus according to any one of 1 to 7 .
前記成膜装置は、
前記被成膜物を支持する被成膜物支持部と、
前記被成膜物支持部と接続されて回転する回転部と、前記回転部の周囲に設けられ前記成膜室に固定された固定部と、を有するロータリージョイントと、
を有し、
前記固定部は、液体が供給される供給口と、液体が排出される排出口と、を有し、
前記回転部は、前記供給口から供給された液体を前記被成膜物支持部へ供給する供給流路と、前記被成膜物支持部から排出された液体を前記排出口へ排出する排出流路と、を有し、
前記供給口、前記供給流路、前記被成膜物支持部、前記排出流路、前記排出口の順に前記液体が流れる液体流路が構成されており、
前記成膜装置は、さらに、
前記排出口から排出された液体を前記供給口に供給する循環経路と、
前記循環経路に配されたポンプおよびバルブと、
を有し、
前記成膜装置の稼働状態に応じて、前記ポンプおよび前記バルブを制御する工程を備える
ことを特徴とする成膜方法。 A film forming method for forming a film on a film to be formed in a film forming chamber of a film forming apparatus,
The film forming apparatus is
a film-forming object supporting portion that supports the film-forming object;
a rotary joint having a rotating portion that rotates while being connected to the support portion for film formation, and a fixed portion that is provided around the rotating portion and fixed to the film formation chamber;
has
The fixed part has a supply port to which the liquid is supplied and a discharge port to which the liquid is discharged,
The rotating portion includes a supply channel for supplying the liquid supplied from the supply port to the film formation object supporting portion, and a discharge channel for discharging the liquid discharged from the film formation object support portion to the discharge port. having a road and
A liquid channel through which the liquid flows is configured in the order of the supply port, the supply channel, the film-forming object supporting portion, the discharge channel, and the discharge port,
The film forming apparatus further includes
a circulation path for supplying the liquid discharged from the discharge port to the supply port;
a pump and a valve arranged in the circulation path;
has
A film forming method, comprising: controlling the pump and the valve according to the operating state of the film forming apparatus.
前記成膜装置は、
前記被成膜物を支持する被成膜物支持部と、
前記被成膜物支持部と接続されて回転する回転部と、前記回転部の周囲に設けられ前記成膜室に固定された固定部と、を有するロータリージョイントと、
を備え、
前記固定部は、液体が供給される供給口と、液体が排出される排出口と、を有し、
前記回転部は、前記供給口から供給された液体を前記被成膜物支持部へ供給する供給流路と、前記被成膜物支持部から排出された液体を前記排出口へ排出する排出流路と、を有し、
前記供給口、前記供給流路、前記被成膜物支持部、前記排出流路、前記排出口の順に前記液体が流れる液体流路が構成されており、
前記成膜装置は、さらに、
前記排出口から排出された液体を前記供給口に供給する循環経路と、
前記循環経路に配されたポンプおよびバルブと、
を有し、
前記成膜装置の稼働状態に応じて、前記ポンプおよび前記バルブを制御する工程を備える
ことを特徴とする電子デバイスの製造方法。 A method for manufacturing an electronic device, in which a film of a film-forming material is formed on a film-forming object in a film-forming chamber of a film-forming apparatus,
The film forming apparatus is
a film-forming object supporting portion that supports the film-forming object;
a rotary joint having a rotating portion that rotates while being connected to the support portion for film formation, and a fixed portion that is provided around the rotating portion and fixed to the film formation chamber;
with
The fixed part has a supply port to which the liquid is supplied and a discharge port to which the liquid is discharged,
The rotating portion includes a supply channel for supplying the liquid supplied from the supply port to the film formation object supporting portion, and a discharge channel for discharging the liquid discharged from the film formation object support portion to the discharge port. having a road and
A liquid channel through which the liquid flows is configured in the order of the supply port, the supply channel, the film-forming object supporting portion, the discharge channel, and the discharge port,
The film forming apparatus further includes
a circulation path for supplying the liquid discharged from the discharge port to the supply port;
a pump and a valve arranged in the circulation path;
has
A method of manufacturing an electronic device, comprising: controlling the pump and the valve according to the operating state of the film forming apparatus.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019184640A JP7304261B2 (en) | 2019-10-07 | 2019-10-07 | Film forming apparatus, film forming method, and electronic device manufacturing method |
KR1020200045994A KR20210041475A (en) | 2019-10-07 | 2020-04-16 | Film formation apparatus, film formation method, and manufacturing method of electronic device |
CN202011059003.4A CN112695276B (en) | 2019-10-07 | 2020-09-30 | Film forming apparatus, film forming method, and method for manufacturing electronic device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019184640A JP7304261B2 (en) | 2019-10-07 | 2019-10-07 | Film forming apparatus, film forming method, and electronic device manufacturing method |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2021059755A JP2021059755A (en) | 2021-04-15 |
JP2021059755A5 true JP2021059755A5 (en) | 2022-08-04 |
JP7304261B2 JP7304261B2 (en) | 2023-07-06 |
Family
ID=75379699
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019184640A Active JP7304261B2 (en) | 2019-10-07 | 2019-10-07 | Film forming apparatus, film forming method, and electronic device manufacturing method |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP7304261B2 (en) |
KR (1) | KR20210041475A (en) |
CN (1) | CN112695276B (en) |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58194241A (en) * | 1982-05-10 | 1983-11-12 | Nisshin Haiboruteeji Kk | Target cooling device for ion implanting device |
JP3971603B2 (en) * | 2001-12-04 | 2007-09-05 | キヤノンアネルバ株式会社 | Insulating film etching apparatus and insulating film etching method |
JP2006322016A (en) * | 2005-05-17 | 2006-11-30 | Konica Minolta Holdings Inc | Vacuum vapor deposition method, and vacuum vapor deposition apparatus |
JP4646066B2 (en) * | 2005-05-31 | 2011-03-09 | キヤノンアネルバ株式会社 | Vacuum processing equipment |
JPWO2008120445A1 (en) * | 2007-03-29 | 2010-07-15 | 新明和工業株式会社 | Sensor mounting structure and vacuum deposition system |
JP5570359B2 (en) | 2010-09-10 | 2014-08-13 | キヤノンアネルバ株式会社 | Rotary joint and sputtering apparatus |
-
2019
- 2019-10-07 JP JP2019184640A patent/JP7304261B2/en active Active
-
2020
- 2020-04-16 KR KR1020200045994A patent/KR20210041475A/en unknown
- 2020-09-30 CN CN202011059003.4A patent/CN112695276B/en active Active
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