JP2021055046A - Pressure sensitive adhesive tape - Google Patents

Abstract

To provide a pressure sensitive adhesive tape capable of suppressing increase in adhesive strength to an object to be deposited even in high temperature conditions and sufficiently reducing the adhesive strength to the object to be deposited by irradiating an active energy ray to easily detaching the object to be deposited without contaminating.SOLUTION: A pressure sensitive adhesive tape comprises: a sheet-like base material transmitting an active energy ray; and an adhesive layer provided on the surface of the sheet-like base material. The adhesive layer includes: an acrylic adhesiveness polymer having a carbon-carbon double bond and a functional group; a photoinitiator; a thermal polymerization initiator; a crosslinking agent reacting with the functional group; and a filler, and the filler has a strength of 20 MPa or more when generating 30% deformation in a minute compression test.SELECTED DRAWING: None

Description

The present invention relates to an adhesive tape, and more particularly to an adhesive tape for temporarily fixing an electronic member, which is used for adhering an electronic member at the time of processing and attaching / detaching the electronic member after high temperature processing.

In recent years, adhesive tapes are frequently used in the manufacturing process of industrial products. Most of these adhesive tapes for processes are required to be firmly attached during use and easily peeled off after use. In response to such demands, there is known a technique of allowing heat or active energy rays to act on a tape adhesive to cause a chemical reaction after use, facilitating the peeling of the tape. Generally, the active energy ray means non-thermal energy such as light and radiation. Also, in general, the reaction mechanism caused by active energy rays is distinguished from the reaction mechanism caused by heat.

Patent Document 1 describes a radiation-curable adhesive tape used for fixing a wafer when dicing a semiconductor wafer. In this radiation-curable adhesive tape, the pressure-sensitive adhesive layer contains spherical particles of an acrylic resin polymer. As a result, the adhesive strength is sufficiently reduced by irradiation, so that even a large element can be easily picked up without stretching the adhesive tape after irradiation.

Patent Document 2 describes an adhesive composition used for a surface protection film for a display, an optical component, a substrate, or the like, which has both adhesiveness and reworkability at a high level. The pressure-sensitive adhesive composition of this surface protection film contains a hydroxyl group-containing urethane prepolymer, a polyfunctional (meth) acrylate, a thermal radical initiator, a cross-linking agent, and a photoradical initiator. As a result, the adhesive strength does not become excessive, and the adhesive strength at the time of peeling is reduced compared to the adhesive strength in the adhesive state by light irradiation, so that both adhesiveness and reworkability can be achieved at a high level. It is possible to reduce the occurrence of the adhesive layer falling off.

Japanese Unexamined Patent Publication No. 9-8109 JP-A-2019-104870

The adherend to be adhered with the above-mentioned process adhesive tape is often a glass or silicon wafer. Further, in recent years, a micro LED display has been attracting attention as a next-generation display device, and even in the manufacture of such a micro LED display, an LED chip is conveyed to the surface of a display substrate with high accuracy. Transfer techniques using adhesive tapes or adhesive tapes are being studied to ensure alignment. These electronic members may be processed under high temperature conditions of about 160 ° C. or higher. For example, processing such as a solder reflow step (for example, a reflow temperature of 260 ° C.) and a curing step of a sealing resin (for example, a curing temperature of 165 ° C.) in batch sealing can be mentioned.

The radiation-curable adhesive tape of Patent Document 1 once placed under high temperature (for example, 160 ° C. or higher) conditions, the adhesive force of the adhesive layer to the adherend increases, and even if it is irradiated with radiation, it sufficiently adheres. There is a risk that the force will not decrease.

The pressure-sensitive adhesive composition of Patent Document 2 is a urethane-based pressure-sensitive adhesive, and has a small initial adhesive strength. When such an adhesive composition is used for temporary fixing of an electronic member, depending on the size and weight of the electronic member as an adherend, there is a risk that the adhesive composition may deviate from a predetermined position during processing / transportation or, in the worst case, peel off. is there. Further, since the pressure-sensitive adhesive composition of Patent Document 2 contains a low molecular weight polyfunctional (meth) acrylate, there is a risk of contaminating electronic members, and the pressure-sensitive adhesive composition is once placed under high temperature (for example, 160 ° C. or higher) conditions. In this case, the adhesive force of the pressure-sensitive adhesive layer to the adherend is increased, and even if it is irradiated with light, the adhesive force may not be sufficiently lowered.

The present invention solves the above-mentioned problems, and an object of the present invention is to suppress an increase in adhesive force to an adherend even when placed under high temperature conditions, and to irradiate an adherend with active energy rays. It is an object of the present invention to provide an adhesive tape which has a sufficiently reduced adhesive force against an adherend and can be easily attached and detached without contaminating the adherend.

The present invention is an pressure-sensitive adhesive tape having a sheet-like base material that transmits active energy rays and a pressure-sensitive adhesive layer provided on the surface of the sheet-like base material, and the pressure-sensitive adhesive layer is carbon-carbon binary. It contains an acrylic adhesive polymer having a heavy bond and a functional group, a photopolymerization initiator, a thermal polymerization initiator, a cross-linking agent and a filler that react with the functional group, and the filler is subjected to 30% deformation in a microcompression test. Provided is an adhesive tape having a strength of 20 MPa or more.

In the above embodiment, the thermal polymerization initiator is contained in an amount in the range of 0.1 to 31.0 parts by mass with respect to 100 parts by mass of an acrylic adhesive polymer having a carbon-carbon double bond and a functional group. Is preferable.

When the average particle size of the filler is R (μm) and the thickness of the pressure-sensitive adhesive layer is D (μm), the ratio of R to D (R / D) is 0.20 to 1.00. It is preferably in the range.

Further, the average particle size of the filler is preferably in the range of 2 to 30 μm.

Furthermore, the filler is preferably contained in the range of 1.0 to 62.0 parts by mass with respect to 100 parts by mass of the acrylic adhesive polymer having a carbon-carbon double bond and a functional group.

Furthermore, the carbon-carbon double bond content of the acrylic adhesive polymer having a carbon-carbon double bond and a functional group is preferably in the range of 0.40 to 1.85 mmol / g.

Furthermore, the pressure-sensitive adhesive layer preferably contains an oligomer having a carbon-carbon double bond.

Furthermore, the oligomer having a carbon-carbon double bond has two or more carbon-carbon double bonds, has a carbon-carbon double bond equivalent in the range of 250 to 1,400, and has a weight average molecular weight. Is preferably in the range of 1,500 to 4,900.

Furthermore, the oligomer having a carbon-carbon double bond may be contained in an amount of up to 120 parts by mass with respect to 100 parts by mass of the acrylic adhesive polymer having the carbon-carbon double bond and a functional group. preferable.

Furthermore, the adhesive tape is suitable for use as an adhesive tape for temporarily fixing an electronic member.

According to the present invention, there is provided an adhesive tape in which an increase in adhesive force to an adherend is suppressed even when placed under high temperature conditions, and the adhesive force is sufficiently reduced by irradiating with active energy rays. As a result, electronic components such as elements processed under high temperature conditions using the adhesive tape of the present invention can be easily attached to and detached from the adhesive tape after irradiation with active energy rays. That is, after being temporarily fixed to the adhesive tape, the electronic component processed under high temperature conditions can be detached from the adhesive tape without finally being contaminated or damaged.

The adhesive tape of the present invention has a sheet-like base material and an adhesive layer provided on the surface of the sheet-like base material. The pressure-sensitive adhesive layer may be provided on one side of the sheet-like base material, or may be provided on both sides.

[Sheet-like base material]
The sheet-like base material is not particularly limited as long as it is a material that transmits active energy rays such as electron beams and ultraviolet rays and has strength to withstand the usage environment. Specifically, for example, polyethylene, polypropylene, ethylene-propylene copolymer, polybutene-1, poly-4-methylpentene-1, ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, ethylene- Acrylic acid copolymer, α-olefin homopolymer or copolymer such as ionomer, polyvinyl chloride, vinyl chloride-vinyl acetate copolymer, vinyl chloride-based alone such as vinyl chloride-ethylene-vinyl acetate copolymer Fluorines such as polymers or copolymers, vinyl fluoride-ethylene copolymers, vinylidene fluoride-ethylene copolymers, tetrafluoroethylene-hexafluoropropylene copolymers, tetrafluoroethylene-perfluoroalkyl vinyl ether copolymers, etc. Examples thereof include a single polymer, polyethylene terephthalate, polybutylene terephthalate, polycarbonate, engineering plastics such as polymethylmethacrylate, and the like alone or in admixture. Among these, polyethylene terephthalate is preferable from the viewpoint of versatility and heat resistance. The thickness of these sheet-like substrates is generally 5 to 200 μm, preferably 10 to 100 μm.

[Adhesive layer]
An active energy ray-curable pressure-sensitive adhesive is used for the pressure-sensitive adhesive layer. The active energy ray-curable pressure-sensitive adhesive has an appropriate adhesive force capable of sufficiently fixing an adherend under normal conditions, but the pressure-sensitive adhesive is stored by being exposed to active energy rays and causing a three-dimensional cross-linking reaction. As the elastic modulus increases significantly, the glass transition temperature also increases, and the volume of the pressure-sensitive adhesive also shrinks, so that the adhesive force to the adherend is significantly reduced. By doing so, it becomes easy to attach and detach the adherend, and at that time, the adhesive residue is less likely to be generated on the adherend. The active energy ray-curable pressure-sensitive adhesive contains a functional group that is reactive when irradiated with active energy rays such as a carbon-carbon double bond.

The active energy ray-curable pressure-sensitive adhesive used in the present invention contains an acrylic pressure-sensitive adhesive polymer, a photopolymerization initiator, a thermal polymerization initiator, a cross-linking agent and a filler. Generally, the active energy ray-reactive group (carbon-carbon double bond) is contained in the acrylic adhesive polymer.

The pressure-sensitive adhesive layer is formed on the sheet-like substrate by, for example, a coating method. That is, the active energy ray-curable pressure-sensitive adhesive is diluted with an organic solvent such as toluene or ethyl acetate to obtain a pressure-sensitive adhesive layer coating liquid. Next, the obtained pressure-sensitive adhesive layer coating liquid is applied to the surface of the sheet-like substrate, dried, and cured to form a pressure-sensitive adhesive layer. It is preferable to attach a release-treated sheet-like base material to the pressure-sensitive adhesive layer. Further, the pressure-sensitive adhesive layer may be formed by once applying the pressure-sensitive adhesive layer coating liquid to the surface of the release-treated sheet base material, drying it, and then transferring it to the sheet-like base material and curing it. .. The thickness of the pressure-sensitive adhesive layer is not particularly limited, but is generally 5 to 100 μm, preferably 10 to 30 μm, and more preferably 20 to 30 μm.

For the purpose of enhancing the adhesiveness between the pressure-sensitive adhesive layer and the sheet-shaped base material, the surface of the sheet-shaped base material is subjected to corona treatment, plasma treatment, coating of a primer composition, or the like, and then the pressure-sensitive adhesive layer is applied. The coating liquid may be applied to the surface of the sheet-like substrate.

(Acrylic adhesive polymer)
The acrylic adhesive polymer adheres the pressure-sensitive adhesive layer of the adhesive tape to the electronic member during the period when the electronic member, which is an adherend, is processed. As the acrylic adhesive polymer, one having a carbon-carbon double bond in the molecule is used. By irradiating the pressure-sensitive adhesive layer with active energy rays during desorption of the adherend, the carbon-carbon double bond undergoes a radical addition reaction, and the polymer chains are highly cross-linked, so that the storage elasticity of the pressure-sensitive adhesive layer is high. Since the glass transition temperature increases as the rate increases, the deformation efficiency at the time of peeling (desorption) of the adhesive layer decreases. At the same time, the volume also shrinks, so that the effect of reducing the adhesive force of the pressure-sensitive adhesive layer is improved.

The method for producing an acrylic adhesive polymer having a carbon-carbon double bond is not particularly limited, but is usually obtained by copolymerizing a (meth) acrylic acid ester and a functional group-containing unsaturated compound. Examples thereof include a method of obtaining a copolymer and subjecting it to an addition reaction of a functional group capable of an addition reaction with the functional group of the copolymer and a compound having a carbon-carbon double bond.

The functional group referred to here is a thermally reactive functional group capable of coexisting with a carbon-carbon double bond. An example of such a functional group is a functional group that thermally reacts with an active hydrogen group such as a hydroxyl group, a carboxyl group and an amino group, and an active hydrogen group such as a glycidyl group. The active hydrogen group refers to a functional group having an element other than carbon, such as nitrogen, oxygen or sulfur, and hydrogen directly bonded to the element.

The addition reaction includes, for example, a method of reacting a hydroxyl group in the side chain of the copolymer with an isocyanate compound having a (meth) acryloyloxy group (for example, 2-methacryloyloxyethyl isocyanate), the copolymer. There are a method of reacting the carboxyl group in the side chain of the copolymer with glycidyl (meth) acrylate, a method of reacting the glycidyl group in the side chain of the copolymer with (meth) acrylic acid, and the like. When these reactions are carried out, the acrylic adhesive polymer is crosslinked with a cross-linking agent described later to further increase the molecular weight, so that functional groups such as a hydroxyl group, a carboxyl group and a glycidyl group remain. I will do it. In this way, an acrylic adhesive polymer having an active energy ray-reactive group (carbon-carbon double bond) such as a (meth) acryloyloxy group and a functional group can be obtained.

In the above addition reaction, it is preferable to use a polymerization inhibitor so that the active energy ray reactivity of the carbon-carbon double bond is maintained. As such a polymerization inhibitor, a quinone-based polymerization inhibitor such as hydroquinone / monomethyl ether is preferable. The amount of the polymerization inhibitor is not particularly limited, but is usually 0.01 to 0.1 parts by mass with respect to the total amount of the base polymer and the radiation-reactive compound.

The acrylic adhesive polymer preferably has a weight average molecular weight of 100,000 to 2 million, more preferably 300,000 to 1.5 million. When the weight average molecular weight of the acrylic adhesive polymer is less than 100,000, it is difficult to obtain a solution of a highly viscous pressure-sensitive adhesive composition of several thousand to tens of thousands of cP in consideration of coatability and the like, which is preferable. Absent. In addition, the adhesive strength may be reduced, and the adherend may be insufficiently held during processing, or the adherend may be contaminated when the adherend is attached or detached. On the other hand, when the weight average molecular weight exceeds 2 million, there is no particular problem in terms of the characteristics of the adhesive tape, but it is difficult to mass-produce an acrylic adhesive polymer. May gel, which is not preferable. Here, the weight average molecular weight means a standard polystyrene equivalent value measured by gel permeation chromatography.

The acrylic adhesive polymer preferably has a carbon-carbon double bond content of 0.10 to 2.00 mmol / g, more preferably 0.40 to 1.85 mmol / g. When the carbon-carbon double bond content of the acrylic adhesive polymer is less than 0.10 mmol / g, the photoradical cross-linking reaction does not sufficiently occur even when irradiated with active energy rays, resulting in adhesive strength. Can not be sufficiently reduced, and it becomes difficult to attach and detach the adherend. On the other hand, when the carbon-carbon double bond content exceeds 2.00 mmol / g, there is no particular problem in terms of the characteristics of the adhesive tape, but it is practically preferable from the viewpoint of storage stability of the adhesive tape against light. Absent. The carbon-carbon double bond content in the acrylic adhesive polymer can be calculated by measuring the iodine value of the acrylic adhesive polymer.

The main skeleton of the acrylic adhesive polymer is composed of a copolymer containing a (meth) acrylic acid alkyl ester monomer, an active hydrogen group-containing monomer, or a glycidyl group-containing monomer. Examples of the (meth) acrylic acid alkyl ester monomer include hexyl (meth) acrylate having 6 to 18 carbon atoms, n-octyl (meth) acrylate, isooctyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, and nonyl (meth). ) Acrylate, isononyl (meth) acrylate, decyl (meth) acrylate, isodecyl (meth) acrylate, undecyl (meth) acrylate, dodecyl (meth) acrylate, tridecyl (meth) acrylate, tetradecyl (meth) acrylate, pentadecyl (meth) acrylate , Hexadecyl (meth) acrylate, heptadecyl (meth) acrylate, octadecyl (meth) acrylate, or pentyl (meth) acrylate, n-butyl (meth) acrylate, isobutyl (meth) acrylate, which is a monomer having 5 or less carbon atoms. , Ethyl (meth) acrylate, methyl (meth) acrylate and the like. Examples of the active hydrogen group-containing monomer include hydroxyl groups such as 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, and 6-hydroxyhexyl (meth) acrylate. Containing monomer, carboxyl group-containing monomer such as (meth) acrylic acid, itaconic acid, maleic acid, fumaric acid, crotonic acid, isocrotonic acid, acid anhydride group-containing single amount such as maleic anhydride and itaconic anhydride. Body, (meth) acrylamide, N, N-dimethyl (meth) acrylamide, N-butyl (meth) acrylamide, N-methylol (meth) acrylamide, N-methylolpropane (meth) acrylamide, N-methoxymethyl (meth) acrylamide Amid-based monomers such as N-butoxymethyl (meth) acrylamide; amino groups such as aminoethyl (meth) acrylate, N, N-dimethylaminoethyl (meth) acrylate, and t-butylaminoethyl (meth) acrylate. Examples thereof include containing monomers. Examples of the glycidyl group-containing monomer include glycidyl (meth) acrylate. The content of the heat-reactive functional group that can coexist with these carbon-carbon double bonds is not particularly limited, but is preferably in the range of 5 to 50% by mass with respect to the total amount of the copolymerized monomer component.

Specific examples of the copolymer obtained by copolymerizing these include a copolymer of 2-ethylhexyl acrylate and acrylate, a copolymer of 2-ethylhexyl acrylate and 2-hydroxyethyl acrylate, and acrylate. Examples thereof include, but are not limited to, a ternary copolymer of 2-ethylhexyl, methacrylic acid and 2-hydroxyethyl acrylate.

The acrylic adhesive polymer may contain other copolymerized monomer components, if necessary, for the purpose of cohesiveness, heat resistance and the like. Specific examples of such other copolymerization monomer components include cyano group-containing monomers such as (meth) acrylonitrile and olefin-based monomers such as ethylene, propylene, isoprene, butadiene, and isobutylene. , Styrene-based monomers such as styrene, α-methylstyrene, vinyltoluene, vinyl ester-based monomers such as vinyl acetate and vinyl propionate, vinyl ether-based monomers such as methylvinyl ether and ethyl vinyl ether, vinyl chloride, chloride. Halogen atom-containing monomers such as vinylidene, alkoxy group-containing monomers such as (meth) methoxyethyl acrylate, ethoxyethyl (meth) acrylate, N-vinyl-2-pyrrolidone, N-methylvinylpyrrolidone, N- Vinylpyridine, N-vinylpiperidone, N-vinylpyrimidine, N-vinylpiperazine, N-vinylpyrazine, N-vinylpyrrole, N-vinylimidazole, N-vinyloxazole, N-vinylmorpholin, N-vinylcaprolactam, N-( Meta) Examples thereof include monomers having a nitrogen atom-containing ring such as acryloylmorpholine. These other copolymerized monomer components may be used alone or in combination of two or more.

(Crosslinkable oligomer)
The pressure-sensitive adhesive layer preferably contains an oligomer having a carbon-carbon double bond. When the pressure-sensitive adhesive layer is irradiated with active energy rays, this oligomer causes an addition reaction between the oligomers or between the oligomer and the acrylic-based pressure-sensitive adhesive polymer described above in the pressure-sensitive adhesive layer, and is highly cross-linked. As a result, as compared with the case where the pressure-sensitive adhesive layer does not contain the crosslinkable oligomer, the storage elastic modulus and the glass transition temperature of the pressure-sensitive adhesive layer are further increased and the volume is further contracted. The effect of reducing the adhesive strength of the material is improved. Examples of the crosslinkable oligomer include a photopolymerizable polyfunctional oligomer.

The crosslinkable oligomer preferably has two or more carbon-carbon double bonds. The crosslinkable oligomer preferably has a weight average molecular weight of 1,000 to 5,000, more preferably 1,500 to 4,900. If the weight average molecular weight of the crosslinkable oligomer is less than 1,000, the adherend may be contaminated if the amount used is large. In addition, when the amount of carbon-carbon double bonds in the crosslinkable oligomer is small, the adhesive force to the adherend is excessively increased when placed under high temperature conditions, and active energy rays are irradiated at the time of desorption. However, the adhesive strength may not be sufficiently reduced. On the other hand, when the weight average molecular weight of the crosslinkable oligomer exceeds 5,000, when the amount of carbon-carbon double bonds in the crosslinkable oligomer is small, the degree of hardening / shrinkage of the pressure-sensitive adhesive layer is small, and the adhesive strength is small. There is a risk that the further reduction effect of Here, the weight average molecular weight means a standard polystyrene equivalent value measured by gel permeation chromatography.

The crosslinkable oligomer preferably has a double bond equivalent in the range of 150 to 1,500, more preferably in the range of 250 to 1,400, and even more preferably in the range of 250 to 490. If the double bond equivalent of the crosslinkable oligomer is less than 150, the adhesive layer becomes hard due to the effect of increasing the crosslink density of the pressure-sensitive adhesive layer when irradiated with active energy rays, and the flexural modulus becomes too high. When the adherend is pushed up through the tape and peeled off from the adhesive tape, if the mechanical strength of the adherend is small (specifically, a semiconductor chip, thin film glass, etc.), the adherend may crack. Further, when the content of the crosslinkable oligomer is large, the storage stability with respect to light may be deteriorated. On the other hand, if the double bond equivalent of the crosslinkable oligomer exceeds 1,500, the degree of curing / shrinkage of the pressure-sensitive adhesive layer is small, and the effect of further reducing the adhesive force may not be obtained. Here, the double bond equivalent is defined by the formula: double bond equivalent = molecular weight / number of double bonds in the same molecule. The value of the double bond equivalent defined by the above formula is, for example, the amount of double bond in the sample quantified based on the iodine value measured according to JIS K0070: 1992, and the mass or molecular weight of the sample. It can be calculated from. If the sample may contain more than one component, the double bond equivalent may be determined by fractionating each component as needed and measuring the iodine value of the fractionated component.

Preferred crosslinkable oligomers include photopolymerizable polyfunctional oligomers such as polyacrylate oligomers, polyether oligomers, polyester oligomers and polyurethane oligomers. Among these, polyurethane oligomers are preferable from the viewpoint of reducing the seepage of the pressure-sensitive adhesive and adhesion to the adherend at high temperatures, and aliphatic polyurethane oligomers are more preferable from the viewpoint of easy control of reactivity. These photopolymerizable polyfunctional oligomers may be used alone or in combination of two or more.

Examples of the polyacrylate oligomer include hexanediol di (meth) acrylate, neopentyl glycol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, dipentaerythritol hexa (meth) acrylate, epoxy (meth) acrylate, and oligo. Examples thereof include ester (meth) acrylate.

Examples of the polyether oligomer include polyethylene glycol, polypropylene glycol, polybutylene glycol, and a sealed product in which one end or both ends thereof are sealed with a blocking agent such as methyl, phenyl, or (meth) acrylate. Can be mentioned.

Examples of the polyester oligomer include ε-caprolactone and a blockade in which one end or both ends thereof are blocked with a blocking agent such as methyl, phenyl, or (meth) acrylate.

Examples of the polyurethane oligomer include urethane polyols such as reaction products of macropolyols such as polyether polyols, polyester polyols, polycarbonate polyols and polybutadiene polyols and polyisocyanate monomers, such as hydroxyethyl (meth) acrylates and phenylglycidyl ethers. Urethane acrylate such as a reaction product of hydroxy (meth) acrylate monomer such as acrylate, pentaerythritol triacrylate and glycerin dimethacrylate with polyisocyanate monomer such as methylene diisocyanate, tolylene diisocyanate and isophorone diisocyanate, or the above-mentioned urethane polyol. And so on.

When the pressure-sensitive adhesive layer contains a crosslinkable oligomer, the blending ratio of the crosslinkable oligomer is preferably 120 parts by mass or less, and more preferably 11 to 100 parts by mass, per 100 parts by mass of the acrylic adhesive polymer. If the blending ratio of the crosslinkable oligomer exceeds 120 parts by mass, it is not preferable because the adhesion to the adherend cannot be maintained when the adherend is processed at a high temperature. In addition, there is a risk of contaminating the surface of the adherend after desorption.

(Crosslinking agent)
The pressure-sensitive adhesive layer of the present embodiment further contains a cross-linking agent for increasing the molecular weight of the acrylic pressure-sensitive adhesive polymer described above. The cross-linking agent is not particularly limited, and a known cross-linking agent having a functional group capable of reacting with a hydroxyl group, a carboxyl group, a glycidyl group or the like, which are functional groups of the acrylic adhesive polymer, is used. Can be done. Specifically, for example, a polyisocyanate-based cross-linking agent, an epoxy-based cross-linking agent, an aziridine-based cross-linking agent, a melamine resin-based cross-linking agent, a urea resin-based cross-linking agent, an acid anhydride compound-based cross-linking agent, a polyamine-based cross-linking agent, and a carboxyl group-containing Examples include polymer-based cross-linking agents. Among these, it is preferable to use a polyisocyanate-based cross-linking agent from the viewpoint of reactivity and versatility. These cross-linking agents may be used alone or in combination of two or more. The blending amount of the cross-linking agent is preferably in the range of 0.01 to 5.00 parts by mass, and more preferably in the range of 0.10 to 3.00 parts by mass with respect to 100 parts by mass of the acrylic adhesive polymer. If the amount of the cross-linking agent is too large, depending on the type of the acrylic adhesive polymer, the adhesive force when the adhesive tape is attached to the adherend may be lowered, or the uncross-linked component may contaminate the adherend.

(Thermal polymerization initiator)
The thermal polymerization initiator is particularly sensitive to the heat generated during high-temperature processing after the adherend is attached to the adhesive tape, and heat is generated in a part of the carbon-carbon double bond of the acrylic adhesive polymer or the crosslinkable oligomer. Since the radical cross-linking reaction is started, the cross-linking of the pressure-sensitive adhesive layer proceeds, and the storage elasticity and the glass transition temperature increase and become harder than in the state before the heat was sensed. As a result, the active energy ray-curable pressure-sensitive adhesive of the present invention containing a thermal polymerization initiator is a phenomenon typically seen in conventional active energy ray-curable pressure-sensitive adhesives that do not contain a thermal polymerization initiator, that is, high temperature conditions. When placed underneath, the pressure-sensitive adhesive layer softens and gets wet with the adherend, so that the phenomenon that the adhesive force to the adherend is excessively increased can be significantly suppressed. Further, depending on the composition, on the contrary, the adhesive force to the adherend can be roughly reduced before the activation energy ray irradiation at the time of desorption. In this state, not all of the carbon-carbon double bonds of the active energy ray-curable pressure-sensitive adhesive are consumed, and some of the carbon-carbon double bonds remain. Therefore, when the active energy ray is irradiated at the time of desorption, the photoradical cross-linking reaction of the remaining carbon-carbon double bond proceeds by the photopolymerization initiator described later, so that the adhesive layer is further cured and shrunk. Finally, the adherend can be easily attached to and detached from the adhesive tape without being contaminated or damaged. Further, since the pressure-sensitive adhesive layer is mainly composed of an acrylic adhesive polymer, even if the radical cross-linking reaction proceeds in a part of the pressure-sensitive adhesive layer as described above, the adherend can be retained during processing under high temperature conditions. Adhesive strength can be maintained.

As the thermal polymerization initiator, a compound that generates a radically active species by heating is preferable, and examples thereof include peroxides, azo compounds, and sulfated salts. Among these, peroxides, which are easy to use according to the processing temperature of the adherend, are preferable.

Specific examples of the peroxide include t-butyl hydroperoxide (10-hour half-life temperature 167 ° C.), cumene hydroperoxide (158 ° C.), diisopropylbenzene hydroperoxide (145 ° C.), and paramentan. Hydroperoxide (128 ° C), di-t-butyl peroxide (124 ° C), di (2-t-butylperoxyisopropyl) benzene (119 ° C), dicumyl peroxide (117 ° C), t-Butylperoxybenzoate (104 ° C), dibenzoyl peroxide (74 ° C), t-butylperoxy-2-ethylhexanoate (72 ° C), t-hexylperoxy-2-ethylhexa Noate (70 ° C.) and the like can be mentioned. These may be used alone or in combination of two or more.

Examples of the azo compound include 1,1-azobis (cyclohexane-1-carbonitrile) (10-hour half-life temperature 88 ° C), 4,4'-azobis (4-cyanovaleric acid) (68 ° C), 2,2. '-Azobis (2-methylbutyronitrile) (67 ° C), dimethyl 2,2'-azobis (2-methylpropionate) (66 ° C), 2,2'-azobis (isobutyronitrile) (65 ° C), 2,2'-azobis dimethylvaleronitrile (52 ° C) 1,1'-azobis (1-acetoxy1-phenylethane) (61 ° C), dimethyl 2,2'-azobis Isobutyrate (67 ° C.), azocusmen, 2- (tert-butylazo) -2-cyanopropane, 2,2'-azobis (2,4,4-trimethylpentane), 2,2'-azobis (2-) Methylpropane) and other compounds can be mentioned. These may be used alone or in combination of two or more.

Examples of the persulfate include potassium persulfate (10-hour half-life temperature 71 ° C.), ammonium persulfate (62 ° C.), sodium persulfate (71 ° C.) and the like. These may be used alone or in combination of two or more.

The 10-hour half-life temperature of the thermal polymerization initiator used may be appropriately selected according to the processing temperature of the adherend. For example, when the processing temperature is 165 to 200 ° C., 10 hours of the thermal polymerization initiator used. The half-life temperature is preferably in the range of 60 to 125 ° C. If the 10-hour half-life temperature is too low with respect to the processing temperature, the adhesive force to the adherend when placed at the processing temperature will be too low, which may affect the processing work (misalignment or dropout of the adherend). is there. On the other hand, if the 10-hour half-life temperature is too high with respect to the processing temperature, the effect of suppressing an increase in the adhesive force to the adherend when placed at the processing temperature is reduced, and adhesion is achieved even if active energy rays are irradiated during desorption. The force may not be reduced sufficiently.

The amount of these thermal polymerization initiators used in the present invention is preferably 0.1 to 31.0 parts by mass, more preferably 1.0 to 20 parts by mass with respect to 100 parts by mass of the acrylic adhesive polymer. It is in the range of 0 parts by mass.

When the amount of the thermal polymerization initiator added is less than 0.1 parts by mass, the adhesive is not sufficiently cured due to insufficient reactivity with heating, and as a result, when it is placed under high temperature conditions. The increase in adhesive strength cannot be sufficiently suppressed, and it may be difficult to peel off the adherend even if the active energy ray is irradiated later. On the other hand, when the amount of the thermal polymerization initiator added exceeds 31.0 parts by mass, the adhesive force to the adherend when placed under high temperature conditions is excessively reduced, which may affect the processing work. In addition, there is a risk of contaminating the adherend.

(Photopolymerization initiator)
The photopolymerization initiator is an acrylic adhesive polymer or a crosslinkable oligomer that remains in the adhesive layer after being placed under high temperature conditions by being sensitive to the irradiation of the adhesive layer with active energy rays during attachment desorption. Initiates the cross-linking reaction of the carbon-carbon double bond possessed by. As a result, the pressure-sensitive adhesive layer is further cured and shrunk under irradiation with active energy rays, so that the adhesive force to the adherend is reduced. As the photopolymerization initiator, a compound that generates a radically active species by ultraviolet rays or the like is preferable. Specifically, benzoin alkyl ether-based initiators such as benzoin methyl ether, benzoin ethyl ether, benzoin propyl ether, benzoin isopropyl ether, and benzoin isobutyl ether; benzophenone, benzoyl benzoic acid, 3,3'-dimethyl-4-methoxybenzophenone. , Benzophenone-based initiators such as polyvinylbenzophenone; α-hydroxycyclohexylphenyl ketone, 4- (2-hydroxyethoxy) phenyl (2-hydroxy-2-propyl) ketone, α-hydroxy-α, α'-dimethylacetophenone, methoxy Initiation of aromatic ketone systems such as acetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxyacetophenone, 2-methyl-1- [4- (methylthio) -phenyl] -2-morpholinopropane-1 Agents: Aromatic ketal-based initiators such as benzyl dimethyl ketal; thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, 2-ethylthioxanthone, 2-isopropylthioxanthone, 2-dodecylthioxanthone, 2,4-dichlorothioxanthone, 2, Thioxantone-based initiators such as 4-dimethylthioxanthone, 2,4-diisopropylthioxanthone, 2,4-diisopropylthioxanthone; benzyl-based initiators such as benzyl; benzoin-based initiators such as benzoin; 2-methyl-2-hydroxypropio Α-Ketole compounds such as phenone; aromatic sulfonyl chloride compounds such as 2-naphthalene sulfonyl chloride; photoactive oxime compounds such as 1-phenone-1,1-propandion-2- (o-ethoxycarbonyl) oxime Examples include benzophenone-based compounds; halogenated ketone-based compounds: acylphosphinoxide-based compounds; acylphosphonate-based compounds. These may be used alone or in combination of two or more.

As the photopolymerization initiator, a commercially available product can also be used. Specifically, for example, 1-hydroxy-cyclohexyl-phenyl-ketone (trade name: Omnirad 184, manufactured by IGM Resins VV), bis (2,4,6-trimethylbenzoyl) -phenylphosphinoxide 1-hydroxy. -Cyclohexyl-ketone (trade name: Omnirad 819, manufactured by IGM Resins VV), 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1 (trade name: Omnirad 369, IGM Resins B.V.) , 2-benzyl-2-dimethylamino-4'-morpholinobtyrophenone (trade name: Omnirad369E, manufactured by IGM Resins VV), 2-dimethylamino-2- (4-methyl-benzyl) -1 -(4-Morphorin-4-yl-phenyl) -butane-1-one (trade name: Omnirad379EG, manufactured by IGM Resins BV) and the like can be mentioned. Among these, it is preferable to use Omnirad369, Omnirad369E, and Omnirad379EG from the viewpoint of heat resistance that radically active species can be sufficiently generated by ultraviolet irradiation or the like even when placed under high temperature conditions.

The amount of these photopolymerization initiators added is preferably 0.1 to 10.0 parts by mass, more preferably 0.5 to 5.0 parts by mass, and even more preferably 100 parts by mass with respect to 100 parts by mass of the acrylic adhesive polymer. It is in the range of 1.0 to 2.0 parts by mass.

When the amount of the photopolymerization initiator added is less than 0.1 parts by mass, the photoreactivity to the active energy ray is not sufficient, so that the adhesive does not cure and shrink sufficiently, and even if it is irradiated with the active energy ray. It may be difficult to peel off the adherend. On the other hand, when the addition amount exceeds 10.0 parts by mass, the effect is saturated and it is not preferable from the viewpoint of economy.

Further, as a sensitizer for such a photopolymerization initiator, a compound such as dimethylaminoethyl methacrylate or isoamyl 4-dimethylaminobenzoate may be added to the pressure-sensitive adhesive.

(Filler)
The filler reduces the contact area of the pressure-sensitive adhesive layer with the adherend when the pressure-sensitive adhesive layer is cross-linked by irradiation with active energy rays and cured and shrunk. As a result, the effect of reducing the adhesive force of the pressure-sensitive adhesive layer on the adherend is further improved.

The filler has a strength of 20 MPa or more, preferably 20 to 70 MPa, and more preferably 29 to 70 MPa at the time of 30% deformation in the microcompression test. If the strength of the filler at 30% deformation is less than 20 MPa, the action of reducing the contact area of the pressure-sensitive adhesive layer with the adherend may be insufficient. As a result, even if it is irradiated with active energy rays after being placed under high temperature conditions, the adhesive strength is not sufficiently lowered, and it may be difficult to peel off the adherend.

The strength at the time of 30% deformation in the micro-compression test of the filler in the present invention is a value measured by using a micro-compression tester "MCT-510" (product name) manufactured by Shimadzu Corporation. Specifically, it is measured by the following method. First, the filler to be used is dispersed in ethanol, and then the dispersion liquid of the filler is applied and dried on the sample table (material: SKS material flat plate) of the microcompression tester to prepare a sample for measurement. Next, one independent filler is selected with an optical microscope of MCT-510, and the particle size (diameter) dn (unit: mm) of the selected filler is measured with the particle size measurement cursor of MCT-510. Next, a pressurizing indenter (a flat diamond indenter having a diameter of 50 μm) is dropped on the apex of the selected filler at a constant load speed (9.6841 mN / sec) to gradually load the filler up to a maximum load of 490 mN. From the load Pn (unit: N) at the time when the particle diameter (diameter) of the filler measured earlier was displaced by 30%, the compressive strength was calculated by the following formula (1) based on JIS R 1639-5: 2007. Find Fn (unit: MPa). Each filler is measured 5 times, and the average value of 3 data excluding the maximum value and the minimum value data is taken as the strength at the time of 30% deformation in the microcompression test. The measurement is performed in an environment of 23 ± 5 ° C. and 50 ± 10% RH. In the present invention, the measurement was carried out in an environment of 23 ° C. and 50% RH.

Fn = 2.48 × Pn / (π · dn ² ) Equation (1)

Since the filler has a predetermined strength (hardness), the pressure-sensitive adhesive layer is crosslinked by irradiation with active energy rays, and when cured and shrunk, the contact area of the pressure-sensitive adhesive layer with respect to the adherend is reduced. It further promotes the effect of reducing the adhesive force of the agent layer to the adherend.

The size of the filler is related to the thickness of the pressure-sensitive adhesive layer. When the average particle size of the filler is R (μm) and the thickness of the pressure-sensitive adhesive layer is D (μm), the ratio of R to D. (R / D) is preferably in the range of 0.20 to 1.00, more preferably 0.40 to 0.80, and even more preferably 0.50 to 0.80. When the ratio of R to D (R / D) is less than 0.20, the action of reducing the contact area of the pressure-sensitive adhesive layer with respect to the adherend may be insufficient. As a result, even if it is irradiated with active energy rays after being placed under high temperature conditions, the adhesive strength is not sufficiently lowered, and it may be difficult to peel off the adherend. On the other hand, when the ratio of R to D (R / D) exceeds 1.00, the adhesiveness between the pressure-sensitive adhesive layer and the sheet-like base material may deteriorate. In addition, the initial adhesive force to the adherend before irradiation with the active energy ray is lowered, and the adherend cannot be sufficiently held, which may affect the processing work (misalignment or dropout of the adherend).

When the thickness of the pressure-sensitive adhesive layer described above is, for example, a preferable range of 10 to 30 μm, the average particle size of the filler is preferably in the range of 2 to 30 μm, more preferably 4 to 24 μm, and further preferably 5 to 24 μm. Is. When the average particle size of the filler is in the above range, the effect of reducing the contact area of the pressure-sensitive adhesive layer with respect to the adherend can be exhibited more remarkably. The average particle size referred to in the present invention is a medium in which a filler is not dissolved or swollen by using a laser scattering particle size distribution meter (for example, a particle size distribution measuring device “model number LA-920” manufactured by Horiba Seisakusho Co., Ltd.). _{, Filler and dispersant are added and ultrasonically dispersed, and then the 50% diameter value (D 50%} ) and median diameter in the volume-based integrated fraction when the integrated volume is obtained from particles with a small particle size distribution measured. means.

The filler is preferably 1.0 to 62.0 parts by mass, more preferably 1.5 to 50.0 parts by mass, and further preferably 2.0 to 10.0 parts by mass with respect to 100 parts by mass of the acrylic adhesive polymer. It is contained in the range of parts by mass. If the content of the filler is less than 1.0 part by mass, the action of reducing the contact area of the pressure-sensitive adhesive layer with the adherend may be insufficient. As a result, it may be difficult to exfoliate the adherend even if it is irradiated with active energy rays after being placed under high temperature conditions. On the other hand, when the content of the filler exceeds 62.0 parts by mass, the adhesiveness between the pressure-sensitive adhesive layer and the sheet-like base material may deteriorate. In addition, the initial adhesive force to the adherend before irradiation with the active energy ray is lowered, and the adherend cannot be sufficiently held, which may affect the processing work (misalignment or dropout of the adherend). When the filler is contained in this range, the effect of reducing the contact area of the pressure-sensitive adhesive layer with respect to the adherend can be more remarkably exhibited.

In certain embodiments, crosslinked particles of an acrylic polymer widely used in various applications such as toner component applications, paint additive applications, optical material applications, cosmetic applications, and molding resin applications are used as fillers. can do. As a method for producing crosslinked particles of an acrylic polymer, a polymer is produced in a homogeneous reaction system, and the polymer is pulverized and classified. The monomer is finely dispersed in a reaction solvent that does not substantially dissolve the monomer, such as an aqueous medium. A method for producing an acrylic polymer by polymerizing an acrylic monomer finely dispersed in an aqueous medium in the form of fine oil, and when polymerizing an acrylic monomer in this heterogeneous system, the same kind of acrylic polymer fine A method of adding particles (seed particles), impregnating the acrylic polymer fine particles with an acrylic monomer, and reacting the acrylic monomer on the acrylic polymer fine particles so that the acrylic polymer fine particles grow. Can be mentioned.

Specifically, for example, acrylic monomers such as methyl methacrylate, methyl acrylate, butyl acrylate, and butyl methacrylate are polymerized into a three-dimensional structure by emulsion polymerization alone or in combination in the presence of a cross-linking agent. The acrylic resin polymer is synthesized, dehydrated, and then jet pulverized to produce the product. As the cross-linking agent, a polyfunctional vinyl compound such as divinylbenzene, ethylene glycol dimethacrylate, and trimethylolpropane triacrylate is used. The acrylic resin polymer thus obtained is spherical particles having a weight average molecular weight of about 20,000 to 1,000,000. In order to exert the effect of reducing the contact area of the pressure-sensitive adhesive layer on the adherend more remarkably, the aspect ratio of the filler is preferably about 0.8 to 1.2.

The filler is not particularly limited in terms of material, shape, cross-linking, non-cross-linking, etc. as long as the strength at 30% deformation in the microcompression test is 20 MPa or more, and can be used as a filler other than the cross-linked particles of the acrylic polymer described above, for example. , Cross-linked methyl (meth) acrylate-styrene copolymer particles, cross-linked polystyrene particles, cross-linked butyl (meth) acrylate-styrene copolymer particles, resin particles such as silicone resin particles, or inorganic particles such as alumina and silica. You may use it. The active energy ray-curable pressure-sensitive adhesive used in the present invention is 30 in the micro-compression test, in addition to the filler having a strength at 30% deformation of 20 MPa or more in the micro-compression test, as long as the effect of the present invention is not impaired. A small amount of filler having a strength of less than 20 MPa at the time of% deformation may be contained.

The present invention will be described in more detail with reference to the following examples, but the present invention is not limited thereto.

1. 1. Preparation of Adhesive Tape (Example 1)
<Sheet-like base material>
A 100 μm-thick PET film (trade name: E5100) manufactured by Toyobo Co., Ltd. was prepared as a sheet-like substrate. The surface of the sheet-like base material on the side where the pressure-sensitive adhesive layer is formed was subjected to corona treatment in order to enhance the adhesive force.

<Release film>
As a release film, a release film (trade name: HY-S06) having a thickness of 50 μm manufactured by Higashiyama Film Co., Ltd. was prepared.

<Preparation of acrylic adhesive polymer A>
2-Ethylhexyl acrylate (2-EHA), 2-hydroxyethyl acrylate (2-HEA), and methacrylic acid (MAA) were prepared as copolymerization monomer components. These copolymerization monomer components are mixed so as to have a copolymerization ratio of 2-EHA / 2-HEA / MAA = 73% by mass / 25% by mass / 2% by mass, and ethyl acetate is used as a solvent by solution radical polymerization. A base polymer was synthesized. Next, with respect to 100 parts by mass of the solid content of this base polymer, 15 parts by mass of 2-isocyanate ethyl methacrylate (MOI) having an isocyanate group and an active energy ray-reactive carbon-carbon double bond as an active energy ray-reactive compound. Was compounded and reacted with a part of the hydroxyl groups of 2-HEA to synthesize an acrylic adhesive polymer A (solid content concentration: 30% by mass) having a carbon-carbon double bond in the side chain. In the above reaction, 0.05 parts by mass of hydroquinone / monomethyl ether was used as a polymerization inhibitor. The weight average molecular weight of the synthesized acrylic adhesive polymer A was measured by gel permeation chromatography (GPC, solvent: tetrahydrofuran) and found to be 800,000. The carbon-carbon double bond content was 0.84 mmol / g.

<Preparation of adhesive solution (adhesive composition)>
Crosslinked acrylic filler A manufactured by Soken Kagaku Co., Ltd. (trade name: Chemisnow MX-2000, average particles) with respect to 333.3 parts by mass (100 parts by mass in terms of solid content) of the solution of the acrylic adhesive polymer A prepared above. Diameter: 20 μm, degree of cross-linking: standard, strength at 30% deformation in microcompression test: 55 MPa) was blended at a ratio of 3.0 parts by mass, and after uniform stirring, it was manufactured by Nichiyu Co., Ltd. as a thermal polymerization initiator. Diacyl peroxide-based peroxide A (trade name: Niper BMT-K40, solid content concentration: 40% by mass, 10-hour half-life temperature: 73.1 ° C.) in 9.0 parts by mass (3.6% by mass in terms of solid content). Part), IGM Resins B. as a photopolymerization initiator. V. 1.5 parts by mass of α-aminoalkylphenone-based photopolymerization initiator A (trade name: Omnirad 369) manufactured by Toso Co., Ltd., and isocyanate-based cross-linking agent A (trade name: Coronate L, solid content concentration) manufactured by Toso Co., Ltd. as a cross-linking agent. : 75% by mass) was blended at a ratio of 0.53 parts by mass (0.4 parts by mass in terms of solid content), diluted with ethyl acetate, and stirred to prepare a pressure-sensitive adhesive solution having a solid content concentration of 30% by mass. ..

<Making adhesive tape>
Next, the pressure-sensitive adhesive solution prepared above was applied onto the corona-treated surface of the PET film described above so that the dry thickness of the pressure-sensitive adhesive layer was 30 μm, dried, and the release film was attached to the pressure-sensitive adhesive layer. It was wound to make an adhesive tape.
After forming the pressure-sensitive adhesive layer on the sheet-like substrate, it was aged for 120 hours in an environment of 40 ° C., and the acrylic pressure-sensitive adhesive polymer was crosslinked with a cross-linking agent to be thermally cured to prepare an evaluation pressure-sensitive adhesive tape.

(Example 2)
An adhesive tape was prepared in the same manner as in Example 1 except that the preparation of the pressure-sensitive adhesive solution was changed to the following.

<Preparation of adhesive solution (adhesive composition)>
Urethane acrylate-based oligomer A (trade name: Art Resin UN-3320HA, weight) manufactured by Negami Kogyo Co., Ltd. with respect to 333.3 parts by mass (100 parts by mass in terms of solid content) of the solution of the acrylic adhesive polymer A prepared above. Average molecular weight: 1,500, number of functional groups: 6, double bond equivalent: 250) by 42.7 parts by mass, crosslinked acrylic filler A manufactured by Soken Kagaku Co., Ltd. (trade name: Chemisnow MX-2000, average particle size: 20 μm) , Crosslinkability: Standard, Strength at 30% deformation in microcompression test: 55 MPa) was blended at a ratio of 3.0 parts by mass, and after uniform stirring, diacyl peroxide manufactured by Nichiyu Co., Ltd. was used as a thermal polymerization initiator. Polymer peroxide A (trade name: Niper BMT-K40, solid content concentration: 40% by mass, 10-hour half-life temperature: 73.1 ° C.) was 3.0 parts by mass (1.2 parts by mass in terms of solid content). As a photopolymerization initiator, IGM Resins B.I. V. 1.5 parts by mass of α-aminoalkylphenone-based photopolymerization initiator A (trade name: Omnirad 369) manufactured by Toso Co., Ltd., and isocyanate-based cross-linking agent A (trade name: Coronate L, solid content concentration) manufactured by Toso Co., Ltd. as a cross-linking agent. : 75% by mass) was blended at a ratio of 0.53 parts by mass (0.4 parts by mass in terms of solid content), diluted with ethyl acetate, and stirred to prepare a pressure-sensitive adhesive solution having a solid content concentration of 30% by mass. ..

(Example 3)
The following acrylic adhesive polymer B was used as the acrylic adhesive polymer, and an adhesive tape was prepared in the same manner as in Example 1 except that the preparation of the pressure-sensitive adhesive solution was changed to the following.

<Preparation of acrylic adhesive polymer B>
2-Ethylhexyl acrylate (2-EHA) and 2-hydroxyethyl acrylate (2-HEA) were prepared as copolymerization monomer components. These copolymerization monomer components were mixed so as to have a copolymerization ratio of 2-EHA / 2-HEA = 75% by mass / 25% by mass, and a base polymer was synthesized by solution radical polymerization using ethyl acetate as a solvent. Next, with respect to 100 parts by mass of the solid content of this base polymer, 15 parts by mass of 2-isocyanate ethyl methacrylate (MOI) having an isocyanate group and an active energy ray-reactive carbon-carbon double bond as an active energy ray-reactive compound. Was compounded and reacted with a part of the hydroxyl groups of 2-HEA to synthesize an acrylic adhesive polymer B (solid content concentration: 30% by mass) having a carbon-carbon double bond in the side chain. In the above reaction, 0.05 parts by mass of hydroquinone / monomethyl ether was used as a polymerization inhibitor. The weight average molecular weight of the synthesized acrylic adhesive polymer B was measured by gel permeation chromatography (GPC, solvent: tetrahydrofuran) and found to be 800,000. The carbon-carbon double bond content was 0.84 mmol / g.

<Preparation of adhesive solution (adhesive composition)>
Crosslinked acrylic filler A (trade name: Chemisnow MX-2000, average particle) manufactured by Soken Kagaku Co., Ltd. with respect to 333.3 parts by mass (100 parts by mass in terms of solid content) of the solution of the acrylic adhesive polymer B prepared above. Diameter: 20 μm, degree of cross-linking: standard, strength at 30% deformation in microcompression test: 55 MPa) was blended at a ratio of 3.0 parts by mass, and after uniform stirring, it was manufactured by Nichiyu Co., Ltd. as a thermal polymerization initiator. Diacyl peroxide-based peroxide A (trade name: Niper BMT-K40, solid content concentration: 40% by mass, 10-hour half-life temperature: 73.1 ° C.) is 3.0 parts by mass (1.2% by mass in terms of solid content). Part), IGM Resins B. as a photopolymerization initiator. V. 1.5 parts by mass of α-aminoalkylphenone-based photopolymerization initiator A (trade name: Omnirad 369) manufactured by Toso Co., Ltd., and isocyanate-based cross-linking agent A (trade name: Coronate L, solid content concentration) manufactured by Toso Co., Ltd. as a cross-linking agent. : 75% by mass) was blended at a ratio of 0.53 parts by mass (0.4 parts by mass in terms of solid content), diluted with ethyl acetate, and stirred to prepare a pressure-sensitive adhesive solution having a solid content concentration of 30% by mass. ..

(Example 4)
An adhesive tape was prepared in the same manner as in Example 3 except that the preparation of the pressure-sensitive adhesive solution was changed to the following.

<Preparation of adhesive solution (adhesive composition)>
Urethane acrylate-based oligomer A (trade name: Art Resin UN-3320HA, weight) manufactured by Negami Kogyo Co., Ltd. with respect to 333.3 parts by mass (100 parts by mass in terms of solid content) of the solution of the acrylic adhesive polymer B prepared above. Average molecular weight: 1,500, number of functional groups: 6, double bond equivalent: 250) by 11.2 parts by mass, crosslinked acrylic filler A manufactured by Soken Kagaku Co., Ltd. (trade name: Chemisnow MX-2000, average particle size: 20 μm) , Crosslinkability: Standard, Strength at 30% deformation in microcompression test: 55 MPa) was blended at a ratio of 3.0 parts by mass, and after uniform stirring, diacyl peroxide manufactured by Nichiyu Co., Ltd. was used as a thermal polymerization initiator. Polymer peroxide A (trade name: Niper BMT-K40, solid content concentration: 40% by mass, 10-hour half-life temperature: 73.1 ° C.) was 3.0 parts by mass (1.2 parts by mass in terms of solid content). As a photopolymerization initiator, IGM Resins B.I. V. 1.5 parts by mass of α-aminoalkylphenone-based photopolymerization initiator A (trade name: Omnirad 369) manufactured by Toso Co., Ltd., and isocyanate-based cross-linking agent A (trade name: Coronate L, solid content concentration) manufactured by Toso Co., Ltd. as a cross-linking agent. : 75% by mass) was blended at a ratio of 0.53 parts by mass (0.4 parts by mass in terms of solid content), diluted with ethyl acetate, and stirred to prepare a pressure-sensitive adhesive solution having a solid content concentration of 30% by mass. ..

(Example 5)
The blending amount of urethane acrylate-based oligomer A (trade name: Artresin UN-3320HA, weight average molecular weight: 1500, number of functional groups: 6, double bond equivalent: 250) manufactured by Negami Kogyo Co., Ltd. was changed to 42.7 parts by mass. An adhesive tape was produced in the same manner as in Example 4 except for the above.

(Example 6)
The blending amount of urethane acrylate-based oligomer A (trade name: Art Resin UN-3320HA, weight average molecular weight: 1500, number of functional groups: 6, double bond equivalent: 250) manufactured by Negami Kogyo Co., Ltd. was changed to 100.0 parts by mass. , Soken Kagaku Co., Ltd.'s cross-linked acrylic filler A (trade name: Chemisnow MX-2000, average particle size: 20 μm, cross-linking degree: standard, strength at 30% deformation in microcompression test: 55 MPa). An adhesive tape was produced in the same manner as in Example 4 except that it was changed to 5 parts by mass.

(Example 7)
The blending amount of urethane acrylate-based oligomer A (trade name: Artresin UN-3320HA, weight average molecular weight: 1500, number of functional groups: 6, double bond equivalent: 250) manufactured by Negami Kogyo Co., Ltd. was changed to 120.0 parts by mass. An adhesive tape was produced in the same manner as in Example 6 except for the above.

(Example 8)
An adhesive tape was produced in the same manner as in Example 1 except that the following acrylic adhesive polymer C was used as the acrylic adhesive polymer.

<Preparation of acrylic adhesive polymer C>
2-Ethylhexyl acrylate (2-EHA) and 2-hydroxyethyl acrylate (2-HEA) were prepared as copolymerization monomer components. These copolymerization monomer components were mixed so as to have a copolymerization ratio of 2-EHA / 2-HEA = 75% by mass / 25% by mass, and a base polymer was synthesized by solution radical polymerization using ethyl acetate as a solvent. Next, with respect to 100 parts by mass of the solid content of this base polymer, 10 parts by mass of 2-isocyanate ethyl methacrylate (MOI) having an isocyanate group and an active energy ray-reactive carbon-carbon double bond as an active energy ray-reactive compound. Was compounded and reacted with a part of the hydroxyl groups of 2-HEA to synthesize an acrylic adhesive polymer C (solid content concentration: 30% by mass) having a carbon-carbon double bond in the side chain. In the above reaction, 0.05 parts by mass of hydroquinone / monomethyl ether was used as a polymerization inhibitor. The weight average molecular weight of the synthesized acrylic adhesive polymer C was measured by gel permeation chromatography (GPC, solvent: tetrahydrofuran) and found to be 800,000. The carbon-carbon double bond content was 0.58 mmol / g.

(Example 9)
An adhesive tape was prepared in the same manner as in Example 8 except that the preparation of the pressure-sensitive adhesive solution was changed to the following.

<Preparation of adhesive solution (adhesive composition)>
Urethane acrylate-based oligomer A (trade name: Art Resin UN-3320HA, weight) manufactured by Negami Kogyo Co., Ltd. with respect to 333.3 parts by mass (100 parts by mass in terms of solid content) of the solution of the acrylic adhesive polymer C prepared above. Average molecular weight: 1,500, number of functional groups: 6, double bond equivalent: 250) by 42.7 parts by mass, crosslinked acrylic filler A manufactured by Soken Kagaku Co., Ltd. (trade name: Chemisnow MX-2000, average particle size: 20 μm) , Crosslinkability: Standard, Strength at 30% deformation in microcompression test: 55 MPa) was blended at a ratio of 3.0 parts by mass, and after uniform stirring, diacyl peroxide manufactured by Nichiyu Co., Ltd. was used as a thermal polymerization initiator. Polymer peroxide A (trade name: Niper BMT-K40, solid content concentration: 40% by mass, 10-hour half-life temperature: 73.1 ° C.) was 3.0 parts by mass (1.2 parts by mass in terms of solid content). As a photopolymerization initiator, IGM Resins B.I. V. 1.5 parts by mass of α-aminoalkylphenone-based photopolymerization initiator A (trade name: Omnirad 369) manufactured by Toso Co., Ltd., and isocyanate-based cross-linking agent A (trade name: Coronate L, solid content concentration) manufactured by Toso Co., Ltd. as a cross-linking agent. : 75% by mass) was blended at a ratio of 0.53 parts by mass (0.4 parts by mass in terms of solid content), diluted with ethyl acetate, and stirred to prepare a pressure-sensitive adhesive solution having a solid content concentration of 30% by mass. ..

(Example 10)
The following acrylic adhesive polymer D was used as the acrylic adhesive polymer, and an adhesive tape was prepared in the same manner as in Example 1 except that the preparation of the pressure-sensitive adhesive solution was changed to the following.

<Preparation of acrylic adhesive polymer D>
2-Ethylhexyl acrylate (2-EHA) and 2-hydroxyethyl acrylate (2-HEA) were prepared as copolymerization monomer components. These copolymerization monomer components were mixed so as to have a copolymerization ratio of 2-EHA / 2-HEA = 55% by mass / 45% by mass, and a base polymer was synthesized by solution radical polymerization using ethyl acetate as a solvent. Next, 35 parts by mass of 2-isocyanate ethyl acrylate (AOI) having an isocyanate group and an active energy ray-reactive carbon-carbon double bond as an active energy ray-reactive compound with respect to 100 parts by mass of the solid content of this base polymer. Was reacted with a part of the hydroxyl groups of 2-HEA to synthesize an acrylic adhesive polymer D (solid content concentration: 30% by mass) having a carbon-carbon double bond in the side chain. In the above reaction, 0.05 parts by mass of hydroquinone / monomethyl ether was used as a polymerization inhibitor. The weight average molecular weight of the synthesized acrylic adhesive polymer D was measured by gel permeation chromatography (GPC, solvent: tetrahydrofuran) and found to be 700,000. The carbon-carbon double bond content was 1.83 mmol / g.

<Preparation of adhesive solution>
Crosslinked acrylic filler A (trade name: Chemisnow MX-2000, average particle) manufactured by Soken Kagaku Co., Ltd. with respect to 333.3 parts by mass (100 parts by mass in terms of solid content) of the solution of the acrylic adhesive polymer D prepared above. Diameter: 20 μm, degree of cross-linking: standard, strength at 30% deformation in microcompression test: 55 MPa) was blended at a ratio of 3.0 parts by mass, and after uniform stirring, it was manufactured by Nichiyu Co., Ltd. as a thermal polymerization initiator. Diacyl peroxide-based peroxide A (trade name: Niper BMT-K40, solid content concentration: 40% by mass, 10-hour half-life temperature: 73.1 ° C.) is 0.3 parts by mass (solid content equivalent 0.12 mass). Part), IGM Resins B. as a photopolymerization initiator. V. 1.5 parts by mass of α-aminoalkylphenone-based photopolymerization initiator A (trade name: Omnirad 369) manufactured by Toso Co., Ltd., and isocyanate-based cross-linking agent A (trade name: Coronate L, solid content concentration) manufactured by Toso Co., Ltd. as a cross-linking agent. : 75% by mass) was blended at a ratio of 0.53 parts by mass (0.4 parts by mass in terms of solid content), diluted with ethyl acetate, and stirred to prepare a pressure-sensitive adhesive solution having a solid content concentration of 30% by mass. ..

(Example 11)
An adhesive tape was prepared in the same manner as in Example 10 except that the preparation of the pressure-sensitive adhesive solution was changed to the following.

<Preparation of adhesive solution (adhesive composition)>
Urethane acrylate-based oligomer A (trade name: Art Resin UN-3320HA, weight) manufactured by Negami Kogyo Co., Ltd. with respect to 333.3 parts by mass (100 parts by mass in terms of solid content) of the solution of the acrylic adhesive polymer D prepared above. Average molecular weight: 1,500, number of functional groups: 6, double bond equivalent: 250) by 42.7 parts by mass, crosslinked acrylic filler A manufactured by Soken Kagaku Co., Ltd. (trade name: Chemisnow MX-2000, average particle size: 20 μm) , Crosslinkability: Standard, Strength at 30% deformation in microcompression test: 55 MPa) was blended at a ratio of 3.0 parts by mass, and after uniform stirring, diacyl peroxide manufactured by Nichiyu Co., Ltd. was used as a thermal polymerization initiator. Polymer peroxide A (trade name: Niper BMT-K40, solid content concentration: 40% by mass, 10-hour half-life temperature: 73.1 ° C.) was 3.0 parts by mass (1.2 parts by mass in terms of solid content). As a photopolymerization initiator, IGM Resins B.I. V. 1.5 parts by mass of α-aminoalkylphenone-based photopolymerization initiator A (trade name: Omnirad 369) manufactured by Toso Co., Ltd., and isocyanate-based cross-linking agent A (trade name: Coronate L, solid content concentration) manufactured by Toso Co., Ltd. as a cross-linking agent. : 75% by mass) was blended at a ratio of 0.53 parts by mass (0.4 parts by mass in terms of solid content), diluted with ethyl acetate, and stirred to prepare a pressure-sensitive adhesive solution having a solid content concentration of 30% by mass. ..

(Example 12)
The following acrylic adhesive polymer E was used as the acrylic adhesive polymer, and an adhesive tape was prepared in the same manner as in Example 1 except that the preparation of the pressure-sensitive adhesive solution was changed to the following.

<Preparation of acrylic adhesive polymer E>
2-Ethylhexyl acrylate (2-EHA) and 2-hydroxyethyl acrylate (2-HEA) were prepared as copolymerization monomer components. These copolymerization monomer components were mixed so as to have a copolymerization ratio of 2-EHA / 2-HEA = 78% by mass / 22% by mass, and a base polymer was synthesized by solution radical polymerization using ethyl acetate as a solvent. Next, with respect to 100 parts by mass of the solid content of this base polymer, 7 parts by mass of 2-isocyanate ethyl methacrylate (MOI) having an isocyanate group and an active energy ray-reactive carbon-carbon double bond as an active energy ray-reactive compound. Was compounded and reacted with a part of the hydroxyl groups of 2-HEA to synthesize an acrylic adhesive polymer E (solid content concentration: 30% by mass) having a carbon-carbon double bond in the side chain. In the above reaction, 0.05 parts by mass of hydroquinone / monomethyl ether was used as a polymerization inhibitor. The weight average molecular weight of the synthesized acrylic adhesive polymer E was measured by gel permeation chromatography (GPC, solvent: tetrahydrofuran) and found to be 800,000. The carbon-carbon double bond content was 0.41 mmol / g.

<Preparation of adhesive solution>
Urethane acrylate-based oligomer A (trade name: Art Resin UN-3320HA, weight) manufactured by Negami Kogyo Co., Ltd. with respect to 333.3 parts by mass (100 parts by mass in terms of solid content) of the solution of the acrylic adhesive polymer E prepared above. Average molecular weight: 1,500, number of functional groups: 6, double bond equivalent: 250) by 50.0 parts by mass, crosslinked acrylic filler A manufactured by Soken Kagaku Co., Ltd. (trade name: Chemisnow MX-2000, average particle size: 20 μm) , Crosslinkability: Standard, Strength at 30% deformation in microcompression test: 55 MPa) was blended at a ratio of 3.0 parts by mass, and after uniform stirring, diacyl peroxide manufactured by Nichiyu Co., Ltd. was used as a thermal polymerization initiator. Polymer peroxide A (trade name: Niper BMT-K40, solid content concentration: 40% by mass, 10-hour half-life temperature: 73.1 ° C.) was 3.0 parts by mass (1.2 parts by mass in terms of solid content). As a photopolymerization initiator, IGM Resins B.I. V. 1.5 parts by mass of α-aminoalkylphenone-based photopolymerization initiator A (trade name: Omnirad 369) manufactured by Toso Co., Ltd., and isocyanate-based cross-linking agent A (trade name: Coronate L, solid content concentration) manufactured by Toso Co., Ltd. as a cross-linking agent. : 75% by mass) was blended at a ratio of 0.53 parts by mass (0.4 parts by mass in terms of solid content), diluted with ethyl acetate, and stirred to prepare a pressure-sensitive adhesive solution having a solid content concentration of 30% by mass. ..

(Example 13)
An adhesive tape was prepared in the same manner as in Example 5 except that 1.5 parts by mass of a hindered phenolic antioxidant A (trade name: Irganox1010) manufactured by BASF Japan was added to the pressure-sensitive adhesive solution. did.

(Example 14)
The amount of cross-linked acrylic filler A manufactured by Soken Kagaku Co., Ltd. (trade name: Chemisnow MX-2000, average particle size: 20 μm, degree of cross-linking: standard, strength at 30% deformation in microcompression test: 55 MPa) is 1.5. An adhesive tape was produced in the same manner as in Example 5 except that it was changed to the mass part.

(Example 15)
The amount of cross-linked acrylic filler A manufactured by Soken Kagaku Co., Ltd. (trade name: Chemisnow MX-2000, average particle size: 20 μm, degree of cross-linking: standard, strength at 30% deformation in microcompression test: 55 MPa) is 50.0. An adhesive tape was produced in the same manner as in Example 5 except that it was changed to the mass part.

(Example 16)
The amount of cross-linked acrylic filler A manufactured by Soken Kagaku Co., Ltd. (trade name: Chemisnow MX-2000, average particle size: 20 μm, degree of cross-linking: standard, strength at 30% deformation in microcompression test: 55 MPa) is 61.2. An adhesive tape was produced in the same manner as in Example 5 except that it was changed to the mass part.

(Example 17)
Cross-linked acrylic filler A manufactured by Soken Kagaku Co., Ltd. (trade name: Chemisnow MX-2000, average particle size: 20 μm, cross-linking degree: standard, strength at 30% deformation in microcompression test: 55 MPa) made by Soken Kagaku Co., Ltd. Adhesive tape was applied in the same manner as in Example 5 except that it was changed to the system filler B (trade name: MX-1000, average particle size: 10 μm, degree of cross-linking: standard, strength at 30% deformation in microcompression test: 56 MPa). Made.

(Example 18)
Cross-linked acrylic filler A manufactured by Soken Kagaku Co., Ltd. (trade name: Chemisnow MX-2000, average particle size: 20 μm, cross-linking degree: standard, strength at 30% deformation in microcompression test: 55 MPa) made by Soken Kagaku Co., Ltd. Change to system filler C (trade name: Chemisnow MX-500, average particle size: 5 μm, degree of cross-linking: standard, strength at 30% deformation in microcompression test: 56 MPa), and change the thickness of the adhesive layer to 25 μm. An adhesive tape was produced in the same manner as in Example 5 except for the above.

(Example 19)
An adhesive tape was produced in the same manner as in Example 5 except that the dry thickness of the adhesive layer was changed to 25 μm.

(Example 20)
0.3 parts by mass of the amount of diacyl peroxide-based peroxide A (trade name: Niper BMT-K40, solid content concentration: 40% by mass, 10-hour half-life temperature: 73.1 ° C.) manufactured by Nichiyu Co., Ltd. An adhesive tape was produced in the same manner as in Example 5 except that it was changed to (0.12 parts by mass in terms of solid content).

(Example 21)
50.0 parts by mass of diacyl peroxide-based peroxide A (trade name: Niper BMT-K40, solid content concentration: 40% by mass, 10-hour half-life temperature: 73.1 ° C.) manufactured by Nichiyu Co., Ltd. An adhesive tape was produced in the same manner as in Example 5 except that it was changed to (20.0 parts by mass in terms of solid content).

(Example 22)
75.8 parts by mass of diacyl peroxide-based peroxide A (trade name: Niper BMT-K40, solid content concentration: 40% by mass, 10-hour half-life temperature: 73.1 ° C.) manufactured by Nichiyu Co., Ltd. An adhesive tape was produced in the same manner as in Example 4 except that it was changed to (30.3 parts by mass in terms of solid content).

(Example 23)
Diacyl peroxide-based peroxide A manufactured by Nichiyu Co., Ltd. (trade name: Niper BMT-K40, solid content concentration: 40% by mass, 10-hour half-life temperature: 73.1 ° C.) is used as a peroxyester manufactured by Nichiyu Co., Ltd. Examples except that the system peroxide B (trade name: perbutyl O, solid content concentration: 100% by mass, 10-hour half-life temperature: 72.1 ° C.) was changed and the blending amount was 1.2 parts by mass. An adhesive tape was produced in the same manner as in 5.

(Example 24)
Diacyl peroxide-based peroxide A manufactured by Nichiyu Co., Ltd. (trade name: Niper BMT-K40, solid content concentration: 40% by mass, 10-hour half-life temperature: 73.1 ° C.) Examples except that the system peroxide C (trade name: perbutyl D, solid content concentration: 100% by mass, 10-hour half-life temperature: 123.7 ° C.) was changed and the blending amount was 1.2 parts by mass. An adhesive tape was produced in the same manner as in 5.

(Example 25)
Diacyl peroxide-based peroxide A (trade name: Niper BMT-K40, solid content concentration: 40% by mass, 10-hour half-life temperature: 73.1 ° C.) manufactured by Nichiyu Co., Ltd. is non-cyan-based polymerization manufactured by Otsuka Chemical Co., Ltd. Same as Example 4 except that the initiator A (trade name: OTAZO-15, solid content concentration: 100% by mass, 10-hour half-life temperature: 61 ° C.) was changed and the blending amount was 0.6 parts by mass. To prepare an adhesive tape.

(Example 26)
Azo-based polymerization of diacyl peroxide-based peroxide A (trade name: Niper BMT-K40, solid content concentration: 40% by mass, 10-hour half-life temperature: 73.1 ° C.) manufactured by Nichiyu Co., Ltd. The same as in Example 4 except that the initiator B (trade name: AIBN, solid content concentration: 100% by mass, 10-hour half-life temperature: 65 ° C.) was changed and the blending amount was 0.6 parts by mass. An adhesive tape was prepared.

(Example 27)
IGM Resins B. V. The α-aminoalkylphenone-based photopolymerization initiator A (trade name: Omnirad 369) manufactured by IGM Resins B.I. V. An adhesive tape was produced in the same manner as in Example 5 except that the α-hydroxyalkylphenone-based photopolymerization initiator B (trade name: Omnirad 184) manufactured by the same company was used.

(Example 28)
IGM Resins B. V. The α-aminoalkylphenone-based photopolymerization initiator A (trade name: Omnirad 369) manufactured by IGM Resins B.I. V. An adhesive tape was produced in the same manner as in Example 5 except that the bisacylphosphine oxide-based photopolymerization initiator C (trade name: Omnirad 819) manufactured by the same company was used.

(Example 29)
Urethane acrylate-based oligomer A manufactured by Negami Kogyo Co., Ltd. (trade name: Art Resin UN-3320HA, weight average molecular weight: 1,500, number of functional groups: 6, double bond equivalent: 250) is used with urethane acrylate-based oligomer manufactured by Negami Kogyo Co., Ltd. An adhesive tape was produced in the same manner as in Example 24 except that it was changed to B (trade name: Art Resin UN-904, weight average molecular weight: 4,900, number of functional groups: 10, double bond equivalent: 490).

(Example 30)
Urethane acrylate-based oligomer A manufactured by Negami Kogyo Co., Ltd. (trade name: Art Resin UN-3320HA, weight average molecular weight: 1,500, number of functional groups: 6, double bond equivalent: 250) is a urethane acrylate-based oligomer manufactured by Mitsubishi Chemical Co., Ltd. Changed to C (trade name: Shikou UV-7000B, weight average molecular weight: 3,500, number of functional groups: 2.5, double bond equivalent: 1,400), and diacyl peroxide-based peroxide manufactured by Nichiyu Co., Ltd. Changed the blending amount of A (trade name: Niper BMT-K40, solid content concentration: 40% by mass, 10-hour half-life temperature: 73.1 ° C.) to 9.0 parts by mass (3.6 parts by mass in terms of solid content). An adhesive tape was produced in the same manner as in Example 5 except for the above.

(Example 31)
An adhesive tape was produced in the same manner as in Example 5 except that the acrylic adhesive polymer F in which the weight average molecular weight of the acrylic adhesive polymer B was adjusted to 300,000 by controlling the initiator concentration was used. The carbon-carbon double bond content of the acrylic adhesive polymer F was 0.84 mmol / g.

(Example 32)
An adhesive tape was produced in the same manner as in Example 5 except that the acrylic adhesive polymer G in which the weight average molecular weight of the acrylic adhesive polymer B was adjusted to 1.5 million by controlling the initiator concentration and the polymerization time was used. The carbon-carbon double bond content of the acrylic adhesive polymer G was 0.82 mmol / g.

(Example 33)
Cross-linked acrylic filler A manufactured by Soken Kagaku Co., Ltd. (trade name: Chemisnow MX-2000, average particle size: 20 μm, cross-linking degree: standard, strength at 30% deformation in microcompression test: 55 MPa) manufactured by Sekisui Kasei Kogyo Co., Ltd. Adhesive tape was prepared in the same manner as in Example 5 except that the crosslinked acrylic filler G (trade name: Techpolymer BM30X-12, average particle size 12 μm, strength at 30% deformation in microcompression test: 29 MPa) was changed. did.

(Example 34)
Cross-linked acrylic filler A manufactured by Soken Kagaku Co., Ltd. (trade name: Chemisnow MX-2000, average particle size: 20 μm, degree of cross-linking: standard, strength at 30% deformation in microcompression test: 55 MPa) cross-linked by Negami Kogyo Co., Ltd. Change to acrylic filler D (trade name: Artpearl J-4P, average particle size: 2.2 μm, degree of cross-linking: low, strength at 30% deformation in microcompression test: 70 MPa), and dry thickness of the adhesive layer. An adhesive tape was produced in the same manner as in Example 5 except that the thickness was changed to 10 μm.

(Comparative Example 1)
Cross-linked acrylic filler A manufactured by Soken Kagaku Co., Ltd. (trade name: Chemisnow MX-2000, average particle size: 20 μm, cross-linking degree: standard, strength at 30% deformation in microcompression test: 55 MPa) and diacyl manufactured by Nichiyu Co., Ltd. Adhesion in the same manner as in Example 2 except that a peroxide-based peroxide A (trade name: Niper BMT-K40, solid content concentration: 40% by mass, 10-hour half-life temperature: 73.1 ° C.) was not blended. A tape was made.

(Comparative Example 2)
Cross-linked acrylic filler A manufactured by Soken Kagaku Co., Ltd. (trade name: Chemisnow MX-2000, average particle size: 20 μm, cross-linking degree: standard, strength at 30% deformation in microcompression test: 55 MPa) and diacyl manufactured by Nichiyu Co., Ltd. Adhesion in the same manner as in Example 5 except that a peroxide-based peroxide A (trade name: Niper BMT-K40, solid content concentration: 40% by mass, 10-hour half-life temperature: 73.1 ° C.) was not blended. A tape was made.

(Comparative Example 3)
An adhesive tape was produced in the same manner as in Example 5 except that the acrylic adhesive polymer H having no carbon-carbon double bond described below was used as the acrylic adhesive polymer.

<Preparation of acrylic adhesive polymer H>
2-Ethylhexyl acrylate (2-EHA), 2-hydroxyethyl acrylate (2-HEA), methyl acrylate (MA), and methacrylic acid (MAA) were prepared as copolymerization monomer components. These copolymerization monomer components are mixed so as to have a copolymerization ratio of 2-EHA / 2-HEA / MA / MAA = 10% by mass / 10% by mass / 78% by mass / 2% by mass, and ethyl acetate is used as a solvent. Acrylic adhesive polymer H (solid content concentration: 35% by mass) was synthesized by solution radical polymerization using the above. In the above reaction, 0.05 parts by mass of hydroquinone / monomethyl ether was used as a polymerization inhibitor. The weight average molecular weight of the synthesized acrylic adhesive polymer H was measured by gel permeation chromatography (GPC, solvent: tetrahydrofuran) and found to be 800,000.

(Comparative Example 4)
Except that the cross-linked acrylic filler A manufactured by Soken Chemical Co., Ltd. (trade name: Chemisnow MX-2000, average particle size: 20 μm, cross-linking degree: standard, strength at 30% deformation in microcompression test: 55 MPa) was not blended. An adhesive tape was produced in the same manner as in Example 5.

(Comparative Example 5)
Cross-linked acrylic filler A manufactured by Soken Kagaku Co., Ltd. (trade name: Chemisnow MX-2000, average particle size: 20 μm, degree of cross-linking: standard, strength at 30% deformation in microcompression test: 55 MPa) cross-linked by Negami Kogyo Co., Ltd. An adhesive tape was prepared in the same manner as in Example 5 except that it was changed to urethane-based filler A (trade name: JB-400CB, average particle size: 15 μm, strength at 30% deformation in microcompression test: 8.5 MPa). ..

(Comparative Example 6)
Examples except that the diacyl peroxide-based peroxide A (trade name: Niper BMT-K40, solid content concentration: 40% by mass, 10-hour half-life temperature: 73.1 ° C.) manufactured by NOF Corporation was not blended. An adhesive tape was produced in the same manner as in 27.

(Comparative Example 7)
Using the acrylic adhesive polymer I having no carbon-carbon double bond as the acrylic adhesive polymer, an adhesive tape was prepared in the same manner as in Example 1 except that the preparation of the pressure-sensitive adhesive solution was changed to the following. did.

<Preparation of acrylic adhesive polymer I>
2-Ethylhexyl acrylate (2-EHA), n-butyl acrylate (BA), and 2-hydroxyethyl acrylate (2-HEA) were prepared as copolymerization monomer components. These copolymerization monomer components are mixed so as to have a copolymerization ratio of 2-EHA / BA / 2-HEA = 20% by mass / 75% by mass / 5% by mass, and ethyl acetate is used as a solvent by solution radical polymerization. Acrylic adhesive polymer I (solid content concentration: 35% by mass) was synthesized. In the above reaction, 0.05 parts by mass of hydroquinone / monomethyl ether was used as a polymerization inhibitor. The weight average molecular weight of the synthesized acrylic adhesive polymer I was measured by gel permeation chromatography (GPC, solvent: tetrahydrofuran) and found to be 800,000.

<Preparation of adhesive solution>
Polyfunctional acrylate A (ethoxylated isocyanuric acid triacrylate, trade name) manufactured by Shin-Nakamura Chemical Industry Co., Ltd. with respect to 303.0 parts by mass (100 parts by mass in terms of solid content) of the solution of the acrylic adhesive polymer I prepared above. : A-9300, molecular weight: 423, number of functional groups: 3, double bond equivalent: 141) by 100 parts by mass, crosslinked acrylic filler D manufactured by Negami Kogyo Co., Ltd. (trade name: Artpearl J-4P, average particle size: 2.2 μm, degree of cross-linking: low, strength at 30% deformation in microcompression test: 70 MPa) was blended at a ratio of 2.0 parts by mass, and after uniform stirring, IGM Resins B.I. V. 1.0 part by mass of α-hydroxyalkylphenone-based photopolymerization initiator D (trade name: Omnirad 184) manufactured by Toso Co., Ltd., and isocyanate-based cross-linking agent B (trade name: Coronate L, solid content concentration) manufactured by Toso Co., Ltd. as a cross-linking agent. : 75% by mass) was blended at a ratio of 4.0 parts by mass (3.0 parts by mass in terms of solid content), diluted with ethyl acetate, and stirred to prepare a pressure-sensitive adhesive solution having a solid content concentration of 33% by mass. ..

(Comparative Example 8)
Cross-linked acrylic filler D manufactured by Negami Kogyo Co., Ltd. (trade name: Artpearl J-4P, average particle size: 2.2 μm, cross-linking degree: low, strength at 30% deformation in microcompression test: 70 MPa) Cross-linked acrylic filler E (trade name: Artpearl J-7P, average particle size: 6 μm, degree of cross-linking: low, strength at 30% deformation in microcompression test: 69 MPa), and the blending amount was 20. An adhesive tape was produced in the same manner as in Comparative Example 7 except that the parts by mass were used.

(Comparative Example 9)
60 mass of crosslinked acrylic filler E (trade name: Artpearl J-7P, average particle size: 6 μm, degree of crosslink: low, strength at 30% deformation in microcompression test: 69 MPa) manufactured by Negami Kogyo Co., Ltd. An adhesive tape was produced in the same manner as in Comparative Example 8 except that the parts were used.

(Comparative Example 10)
Cross-linked acrylic filler E manufactured by Negami Kogyo Co., Ltd. (trade name: Art Pearl J-7P, average particle size: 6 μm, cross-linking degree: low, strength at 30% deformation in microcompression test: 69 MPa) manufactured by Negami Kogyo Co., Ltd. Same as Comparative Example 9 except that it was changed to crosslinked acrylic filler F (trade name: Artpearl GR-600 transparent, average particle size: 10 μm, degree of crosslink: medium, strength at 30% deformation in microcompression test: 60 MPa). To make an adhesive tape.

(Comparative Example 11)
The amount of crosslinked acrylic filler F (trade name: Artpearl GR-600 transparent, average particle size: 10 μm, degree of crosslink: medium, strength at 30% deformation in microcompression test: 60 MPa) manufactured by Negami Kogyo Co., Ltd. is 80. An adhesive tape was produced in the same manner as in Comparative Example 10 except that it was changed to the mass part.

(Comparative Example 12)
An adhesive tape was prepared in the same manner as in Example 1 except that the preparation of the pressure-sensitive adhesive solution was changed to the following without using an acrylic adhesive polymer.

<Preparation of adhesive solution>
Urethane-based prepolymer A manufactured by Toyochem Co., Ltd. (trade name: Siavine SH-101, hydroxyl value: 18 mgKOH / g, solid content concentration: 60% by mass) 167 parts by mass (100 parts by mass in terms of solid content), Shin-Nakamura Polyfunctional acrylate B manufactured by Kagaku Kogyo Co., Ltd. (dipentaerythritol polyacrylate [mixture of pentafunctional and hexafunctional acrylates], trade name: A-9550, hydroxyl value: 53 mgKOH / g, double bond equivalent [double bond 1 mol] [Mass of prepolymer per]: 110 g / mol) was blended in a ratio of 75 parts by mass, and after uniformly stirring, a peroxydicarbonate peroxide D (trade name) manufactured by Nichiyu Co., Ltd. was used as a thermal polymerization initiator. : Parloyl TCP, solid content concentration: 100% by mass, 10-hour half-life temperature: 40.8 ° C.) in 1.5 parts by mass, as a photopolymerization initiator, IGM Resins B.I. V. 2.0 parts by mass of acylphosphine oxide-based photopolymerization initiator E (trade name: Omnirad TPO H) manufactured by the company, and ionic liquid antistatic agent A (trade name: FC4400) manufactured by 3M Japan as an antioxidant. 5.0 parts by mass, and an isocyanate-based cross-linking agent B (trade name: Coronate L-45E, solid content concentration: 45% by mass) manufactured by Toso Co., Ltd. as a cross-linking agent was 32.9 parts by mass (14.8 mass by mass in terms of solid content). Part), diluted with ethyl acetate, and stirred to prepare a pressure-sensitive adhesive solution having a solid content concentration of 33% by mass.

(Comparative Example 13)
10.0 parts by mass of peroxydicarbonate peroxide D (trade name: parloyl TCP, solid content concentration: 100% by mass, 10-hour half-life temperature: 40.8 ° C.) manufactured by Nichiyu Co., Ltd. Comparative Example 12 except that the isocyanate-based cross-linking agent B (trade name: Coronate L-45E, solid content concentration: 45% by mass) manufactured by Tosoh Co., Ltd. was changed to 49.3 parts by mass (22.2 parts by mass in terms of solid content). An adhesive tape was produced in the same manner as in the above.

(Comparative Example 14)
An adhesive tape was prepared in the same manner as in Example 1 except that the preparation of the pressure-sensitive adhesive solution was changed to the following without using an acrylic adhesive polymer.

<Preparation of adhesive solution>
Polyfunctional acrylate C manufactured by Sartomer Co., Ltd. with respect to 156.3 parts by mass (100 parts by mass in terms of solid content) of urethane-based prepolymer B (trade name: Siavine SH-109, solid content concentration 64% by mass) manufactured by Toyochem Co., Ltd. (Pentaerythritol tetraacrylate, trade name: SR295, molecular weight: 352, number of functional groups: 4, double bond equivalent: 88) was blended in a ratio of 75 parts by mass, and after uniformly stirring, Nikko oil was used as a thermal polymerization initiator. Diacyl peroxide-based peroxide A (trade name: Niper BMT-K40, solid content concentration: 40% by mass, 10-hour half-life temperature: 73.1 ° C.) manufactured by the company is 9.38 parts by mass (solid content conversion 3). .75 parts by mass), as a photopolymerization initiator, IGM Resins B.I. V. 2 parts by mass of acylphosphine oxide-based photopolymerization initiator E (trade name: Omnirad TPO H) manufactured by Toso Co., Ltd., and isocyanate-based cross-linking agent B (trade name: Coronate L-45E, solid content concentration) manufactured by Toso Co., Ltd. as a cross-linking agent. : 45% by mass) was blended at a ratio of 32.9 parts by mass (14.8 parts by mass in terms of solid content), diluted with ethyl acetate and stirred to prepare a pressure-sensitive adhesive solution having a solid content concentration of 33% by mass. ..

(Comparative Example 15)
Comparative Example 14 except that the isocyanate-based cross-linking agent B (trade name: Coronate L-45E, solid content concentration: 45% by mass) manufactured by Tosoh Corporation was changed to 49.3 parts by mass (22.2 parts by mass in terms of solid content). An adhesive tape was produced in the same manner as in the above.

(Comparative Example 16)
Cross-linked acrylic filler A manufactured by Soken Kagaku Co., Ltd. (trade name: Chemisnow MX-2000, average particle size: 20 μm, degree of cross-linking: standard, strength at 30% deformation in microcompression test: 55 MPa ) Was blended in an amount of 2.0 parts by mass, and an adhesive tape was produced in the same manner as in Comparative Example 15.

2. Evaluation Method of Adhesive Tape The adhesive tapes produced in Examples 1 to 34 and Comparative Examples 1 to 16 were cut into 25 mm widths, and these were used as test pieces.

2.1 Initial measurement of adhesive strength For each test piece of the above adhesive tape, in accordance with the method described in the adhesive tape / adhesive sheet test method (JIS Z 0237 (2009)), in the normal state with respect to the glass plate ( The adhesive strength test (peeling adhesive strength test) before the heat treatment was performed.

Specifically, the release film of the adhesive tape was peeled off, and the adhesive tape was attached to a well-cleaned glass plate so that air bubbles did not enter, and then a roller having a mass of 2000 g was reciprocated once at a speed of 5 mm / sec and crimped. Then, it was left for 20 minutes in an environment of a temperature of 23 ° C. and a humidity of 50% RH to prepare a measurement sample. Subsequently, using a tensile tester, the glass plate was peeled off at a speed of 300 mm / min in the 90 ° direction, and the initial adhesive force to the glass plate was measured. The environment at the time of pasting and measurement was a temperature of 23 ° C. and a humidity of 50% RH.

The initial adhesive strength in the normal state is not particularly limited, but is preferably 0.5 N / 10 mm or more from the viewpoint of easy attachment of the adherend and retention of the adherend during processing. Further, considering the phenomenon of increase in adhesive strength when placed under high temperature conditions, it is more preferable to set the range in the range of 0.5N / 10mm to 3.5N / 10mm.

The initial adhesive strength under normal conditions was evaluated according to the following criteria, and an evaluation of 〇 was passed.

〇: 0.5N / 10mm or more ×: Less than 0.5N / 10mm

2.2 Measurement of Adhesive Strength after Heat Treatment For each test piece of the above adhesive tape, the initial adhesive strength is determined in accordance with the method described in the Adhesive Tape / Adhesive Sheet Test Method (JIS Z 0237 (2009)). Similar to the measurement, an adhesive strength test (peeling adhesive strength test) after heat treatment on the glass plate was performed.

Specifically, after peeling off the release film of the adhesive tape and sticking it on a glass plate whose sticking surface has been thoroughly washed so that air bubbles do not enter, a roller with a mass of 2000 g is reciprocated once at a speed of 5 mm / sec to crimp. did. Subsequently, the glass plate to which the adhesive tape was attached was stored and taken out under the following three heat treatment conditions, and then left to stand in an environment of a temperature of 23 ° C. and a humidity of 50% RH for 2 hours or more to prepare a measurement sample. Subsequently, using a tensile tester, the glass plate was peeled off in the 90 ° direction at a speed of 300 mm / min, and the adhesive force to the glass plate after the heat treatment was measured. The environment at the time of pasting and measurement was a temperature of 23 ° C. and a humidity of 50% RH.

Heat treatment condition (1): Store at 165 ° C for 1 hour Heat treatment condition (2): Store at 165 ° C for 3 hours Heat treatment condition (3): Store at 200 ° C for 1 hour

The adhesive strength after the heat treatment is preferably 0.5 N / 10 mm or more from the viewpoint of retaining the adherend during processing under high temperature conditions. Further, considering the effect of reducing the adhesive force by the subsequent irradiation with active energy rays, the range is more preferably 0.5 N / 10 mm to 2.5 N / 10 mm.

The adhesive strength after the heat treatment was evaluated according to the following criteria, and the evaluation of 〇 was passed.

〇: 0.5N / 10mm or more ×: Less than 0.5N / 10mm

2.3 Measurement of adhesive strength after irradiation with ultraviolet rays (UV) Using the measurement sample prepared in 2.1 above (before heat treatment: normal) and the measurement sample prepared in 2.2 (after heat treatment: 3 conditions), For each test piece of the above adhesive tape, in accordance with the method described in the adhesive tape / adhesive sheet test method (JIS Z 0237 (2009)), ultraviolet rays (UV) to the glass plate are obtained in the same manner as in the measurement of the initial adhesive strength. ) A post-irradiation adhesive strength test (peeling adhesive strength test) was performed.

Specifically, for the measurement sample prepared in 2.1 (before heat treatment) and the measurement sample prepared in 2.2 (after heat treatment), a high-pressure mercury lamp manufactured by Eye Graphics Co., Ltd. (model H04-L21). Was used to irradiate ultraviolet rays (UV) from the surface side to which the adhesive tape was attached so that the integrated light amount was 500 mJ / cm ^2. Subsequently, using a tensile tester, the glass plate was peeled off at a speed of 300 mm / min in the 90 ° direction, and the adhesive strength of the glass plate after irradiation with ultraviolet rays (UV) was measured. The environment at the time of pasting and measurement was a temperature of 23 ° C. and a humidity of 50% RH.

In the normal state before the heat treatment, the adhesive strength after irradiation with ultraviolet rays (UV) is preferably as small as possible in consideration of the phenomenon of increase in the adhesive strength when placed under high temperature conditions. Specifically, it is preferably 0.10 N / 10 mm or less, and more preferably 0.05 N / 10 mm or less.

The adhesive strength after irradiation with ultraviolet rays (UV) in the normal state before the heat treatment was evaluated according to the following criteria, and the evaluation of ◯ was passed.

〇: 0.10N / 10mm or less ×: More than 0.10N / 10mm

Further, after the heat treatment, the adhesive strength after irradiation with ultraviolet rays (UV) is 0.25 N / 10 mm or less (lower limit:) in consideration of the level at which the adherend can be easily attached and detached (peeled) without contaminating or damaging the adherend. It is preferably 0 N / 10 mm), and more preferably 0.10 N / 10 mm or less.

The adhesive strength after irradiation with ultraviolet rays (UV) after the heat treatment was evaluated according to the following criteria, and the evaluation of ◯ was passed.

〇: 0.25N / 10mm or less ×: More than 0.25N / 10mm

2.4 Evaluation of the contaminating property of the surface of the glass plate When the adhesive force after irradiation with ultraviolet rays was measured in 2.3 above, the contaminating property of the surface of the glass plate after peeling off each adhesive tape was evaluated.

Specifically, the surface of the glass plate was visually and microscopically observed, and the state of the area of the residue of the pressure-sensitive adhesive composition with respect to the area where the pressure-sensitive adhesive tape was attached was evaluated according to the following criteria. In addition, the evaluation of ◎ or 〇 was accepted.

⊚: Total area of residue with respect to adhesive tape sticking area is less than 1% 〇: Total area of residue with respect to adhesive tape sticking area is 1% or more and less than 5% Δ: Total residue with respect to adhesive tape sticking area Area is 5% or more and less than 25% ×: Total area of residue with respect to adhesive tape application area is 25% or more

3. 3. Comprehensive evaluation of adhesive tape The comprehensive evaluation of adhesive tape was evaluated according to the following criteria. The evaluation of A or B was judged to be at a level that can be used as an adhesive tape for temporarily fixing electronic members, and was passed.

A: When all the evaluations of adhesive strength are 〇 and all the evaluations of contamination are ◎ B: When all the evaluations of adhesive strength are 〇 and the evaluation of contamination includes 〇 at the passing level C: When the evaluation of adhesive strength is all 〇 and the evaluation of contaminability includes △, or when the evaluation of adhesive strength includes × and the evaluation of contaminatedness is △ to ◎ D: For evaluation of adhesive strength Regardless, if the pollution rating includes x

Tables 1 to 6 show the composition of the pressure-sensitive adhesive layer of the pressure-sensitive adhesive tape. Tables 7 to 12 show the characteristics and evaluation results of the pressure-sensitive adhesive layer of the pressure-sensitive adhesive tape.

As shown in Tables 7-10, the pressure-sensitive adhesive layer contains an acrylic pressure-sensitive adhesive polymer having a carbon-carbon double bond and a functional group, a photopolymerization initiator, a thermal polymerization initiator, a cross-linking agent, and 30% in the microcompression test. In the adhesive tapes of Examples 1 to 34 containing a filler having a deformation strength of 20 MPa or more, the initial adhesive strength, the adhesive strength after irradiation with ultraviolet rays (UV), and the glass after desorption under all conditions. It was confirmed that favorable results were obtained in all the evaluation items of the contamination state of the plate surface. From this, it can be seen that the adhesive tape of the present embodiment is useful as, for example, a temporary fixing adhesive tape for an electronic member that requires processing under a high temperature condition of about 165 to 200 ° C.

On the other hand, as shown in Tables 11 to 12, in the adhesive tapes of Comparative Examples 1 to 16 in which the adhesive layer does not satisfy the present embodiment, the initial adhesive strength, the adhesive strength after irradiation with ultraviolet rays (UV), and the desorption. In the later evaluation items of the contamination state of the glass plate surface, it was confirmed that any of the evaluation results was inferior to that of the adhesive tapes of Examples 1 to 34.

Specifically, the adhesive tapes of Comparative Examples 1 and 2 in which the pressure-sensitive adhesive layer does not contain a filler and a thermal polymerization initiator are heated under more severe heat treatment conditions 2 and 3 as compared with Examples 2 and 5. Since the adhesive strength increased significantly during the treatment, the adhesive strength did not decrease sufficiently even when irradiated with ultraviolet rays (UV) later. Further, in the adhesive tape of Comparative Example 1, contamination was clearly observed on the surface of the glass plate.

In the adhesive tape of Comparative Example 3 in which an acrylic adhesive polymer having no carbon-carbon double bond was used as the acrylic adhesive polymer in the adhesive layer, Examples 2, 5, 9, 11, 31 and 32 In comparison, under any of the heat treatment conditions, the adhesive strength was significantly increased during the heat treatment, so that the adhesive strength was not sufficiently reduced even when irradiated with ultraviolet rays (UV) later. In addition, contamination was clearly observed on the surface of the glass plate.

In the adhesive tape of Comparative Example 4 in which the pressure-sensitive adhesive layer does not contain a filler, the adhesive strength is sufficiently reduced even when irradiated with ultraviolet rays (UV) under stricter heat treatment conditions 2 and 3 as compared with Example 5. I didn't. In addition, a little more contamination was observed on the surface of the glass plate.

The adhesive tape of Comparative Example 5 using a crosslinked urethane-based filler having a strength at 30% deformation of 8.5 MPa, which is less than 20 MPa in the microcompression test, as a filler in the adhesive layer is stricter than that of Example 5. Under the heat treatment conditions 2 and 3, the adhesive strength did not sufficiently decrease even when irradiated with ultraviolet rays (UV).

In the pressure-sensitive adhesive tape of Comparative Example 6 in which the pressure-sensitive adhesive layer did not contain a thermal polymerization initiator, the adhesive strength increased during the heat treatment under the stricter heat treatment conditions 2 and 3 as compared with Example 5, and therefore, ultraviolet rays ( The adhesive strength did not decrease sufficiently even when irradiated with UV). Further, under the heat treatment condition 3, a little more contamination was observed on the surface of the glass plate.

Although the pressure-sensitive adhesive layer contains a filler, an acrylic-based adhesive polymer that does not have a carbon-carbon double bond is used as the acrylic-based adhesive polymer, and a polyfunctional acrylate is used instead of the urethane acrylate-based oligomer. In the adhesive tapes of Comparative Examples 7 to 11 containing no polymerization initiator, the adhesive strength was significantly increased during the heat treatment under any of the heat treatment conditions as compared with the examples, so that the adhesive tape was later irradiated with ultraviolet rays (UV). However, the adhesive strength did not decrease sufficiently. In addition, contamination was clearly observed on the surface of the glass plate.

Adhesives of Comparative Examples 12 to 15 in which a thermal polymerization initiator is contained in the pressure-sensitive adhesive layer, but a urethane-based prepolymer and a polyfunctional acrylate are used instead of the acrylic-based pressure-sensitive polymer and the urethane acrylate-based oligomer, and no filler is contained. In the tape, contamination was clearly observed on the surface of the glass plate under all the heat treatment conditions as compared with the examples. In addition, there were cases where the adhesive strength did not sufficiently decrease even when irradiated with ultraviolet rays (UV) later. Further, in the adhesive tapes of Comparative Examples 13 to 15, the initial adhesive strength was low under all the heat treatment conditions.

In the adhesive tape of Comparative Example 16 containing a filler as compared with Comparative Example 15, the adhesive strength after irradiation with ultraviolet rays (UV) was at a passing level under all heat treatment conditions, but the initial adhesive strength was low, and further, glass. Contamination was clearly observed on the board surface.

Claims (10)

An adhesive tape having a sheet-like base material that transmits active energy rays and an adhesive layer provided on the surface of the sheet-like base material.
The pressure-sensitive adhesive layer contains an acrylic pressure-sensitive adhesive polymer having a carbon-carbon double bond and a functional group, a photopolymerization initiator, a thermal polymerization initiator, a cross-linking agent that reacts with the functional group, and a filler.
The filler is an adhesive tape having a strength of 20 MPa or more at the time of 30% deformation in a microcompression test. The first aspect of claim 1, wherein the thermal polymerization initiator is contained in an amount in the range of 0.1 to 31.0 parts by mass with respect to 100 parts by mass of an acrylic adhesive polymer having a carbon-carbon double bond and a functional group. Adhesive tape. When the average particle size of the filler is R (μm) and the thickness of the pressure-sensitive adhesive layer is D (μm), the ratio of R to D (R / D) is in the range of 0.20 to 1.00. The adhesive tape according to any one of claims 1 and 2. The adhesive tape according to any one of claims 1 to 3, wherein the average particle size of the filler is in the range of 2 to 30 μm. Any one of claims 1 to 4 contained in the filler in the range of 1.0 to 62.0 parts by mass with respect to 100 parts by mass of an acrylic adhesive polymer having a carbon-carbon double bond and a functional group. Adhesive tape as described in the section. The carbon-carbon double bond content of the acrylic adhesive polymer having a carbon-carbon double bond and a functional group is any one of claims 1 to 5 in the range of 0.40 to 1.85 mmol / g. Adhesive tape as described in the section. The pressure-sensitive adhesive tape according to any one of claims 1 to 6, wherein the pressure-sensitive adhesive layer contains an oligomer having a carbon-carbon double bond. The oligomer having a carbon-carbon double bond has two or more carbon-carbon double bonds, has a carbon-carbon double bond equivalent in the range of 250 to 1,400, and has a weight average molecular weight of 1,. The adhesive tape according to claim 7, which is in the range of 500 to 4,900. Claim 7 or 8 that the oligomer having a carbon-carbon double bond is contained in an amount of up to 120 parts by mass with respect to 100 parts by mass of the acrylic adhesive polymer having the carbon-carbon double bond and a functional group. The adhesive tape according to any one of the above. The adhesive tape according to any one of claims 1 to 9, wherein the adhesive tape is an adhesive tape for temporarily fixing an electronic member.