JP2021053686A - Soldering device - Google Patents

Abstract

To provide a soldering device configured so that heat radiation from a melting part that melts solder can be suppressed and heat can be easily transferred intensively to a portion to which soldering is desired to be performed.SOLUTION: A soldering device 10 comprises melting parts 11 and 21 which melt solder H, heating parts 12 that heat the melting parts and suppressing parts 16 provided outside the melting parts, which suppress heat radiation of the melting parts.SELECTED DRAWING: Figure 1

Description

The present disclosure relates to a soldering apparatus.

For example, as disclosed in Patent Document 1, in a soldering apparatus, a member for melting solder, that is, a member called a so-called "iron" is considered to be made of ceramic.

Japanese Unexamined Patent Publication No. 2016-59927

According to the ceramic iron, since its thermal conductivity is high, heat can be transferred quickly and soldering can be performed efficiently. However, with a ceramic iron, its thermal radioactivity is also high. Therefore, there is a problem that the iron, particularly the tip portion thereof, cannot be maintained at an appropriate temperature, and it becomes difficult to intensively transfer heat to the portion of the substrate to be soldered. In particular, when the iron is long, the amount of heat radiation thereof becomes larger, which makes it more difficult to transfer heat to the portion to be soldered. Here, it is conceivable to increase the amount of heat transfer by thickening the iron. However, if the iron is made thicker, there arises a problem that the iron interferes with the land next to the land to be soldered or the mounting parts in the vicinity.

Therefore, the present invention provides a soldering apparatus capable of suppressing heat radiation from a molten portion that melts solder and facilitating concentrated heat transfer to a portion to be soldered.

The soldering apparatus according to the present disclosure is provided with a melting section 11 and 21 for melting the solder H, a heating section 12 for heating the melting section, and a heating section 12 outside the melting section, and suppresses heat radiation of the melting section. A suppression unit 16 is provided.

According to this configuration, heat radiation from the molten portion can be suppressed by the suppressing portion, and heat can be easily transferred to the portion to be soldered in a concentrated manner.

The figure which shows schematic the structural example of the soldering apparatus which concerns on 1st Embodiment The figure which shows schematic the structural example of the soldering apparatus which concerns on 2nd Embodiment The figure which shows schematic the structural example of the soldering apparatus which concerns on 3rd Embodiment The figure which shows schematic the structural example of the soldering apparatus which concerns on 4th Embodiment

Hereinafter, a plurality of embodiments relating to the soldering apparatus will be described with reference to the drawings. In a plurality of embodiments, substantially the same elements are designated by the same reference numerals, and the description thereof will be omitted.

(First Embodiment)
The soldering device 10 illustrated in FIG. 1 is a device for soldering terminals 110 of electronic components into lands 102 provided in through holes 101 of a substrate 100 such as a printed circuit board. In this case, the soldering device 10 is configured as a so-called sleeve soldering device in which the solder is melted and soldered by the tubular sleeve 11.

The soldering device 10 includes a sleeve unit 14 having a sleeve 11, a main heater 12, a solder cutting portion 13, and the like. The soldering device 10 includes a moving mechanism (not shown) that moves the sleeve unit 14 in the vertical direction and the horizontal direction with respect to the substrate 100.

The sleeve 11 is an example of a molten portion. The sleeve 11 is made of, for example, a ceramic made from aluminum nitride, silicon carbide, or the like, and is formed in a long tubular shape in the vertical direction. The inside of the sleeve 11 is hollow. The sleeve 11 made of ceramic has non-adhesiveness to which solder does not easily adhere. The non-adhesiveness referred to here is preferably intended to prevent solder from adhering to the sleeve 11 at all, but allows a small amount of solder to adhere to the sleeve 11. That is, although the non-adhesive sleeve 11 may have a small amount of solder adhered to it, it basically has a property that the solder does not adhere or a property that the solder does not easily adhere. Further, the sleeve 11 has at least higher thermal conductivity than the suppressing member 16 described later.

The main heater 12 is an example of a heating unit. The main heater 12 is provided on the outer surface of the upper part of the sleeve 11, for example, and when it is turned on by a control device (not shown), it generates heat and heats the sleeve 11. In this case, the base end portion of the sleeve 11 is held inside the ceramic holder 15. The main heater 12 is held outside the holder 15. The ceramic constituting the holder 15 may, for example, have the same or different properties as the ceramic constituting the sleeve 11 in properties such as thermal conductivity, thermal radioactivity, and hardness. Further, considering deterioration due to heating of the sleeve 11, the output of the main heater 12 is preferably set to, for example, 600 degrees or less. Depending on the properties such as heat resistance of the sleeve 11, the output of the main heater 12 may be set to a temperature exceeding 600 degrees.

The solder cutting section 13 cuts a thread-like solder supplied from a solder supply section (not shown) to a predetermined length by a cutter (not shown) to form a solder piece H. The solder piece H formed by the solder cutting portion 13 falls into the inside of the sleeve 11 and is supplied. Then, the solder piece H supplied to the inside of the sleeve 11 is melted by coming into contact with the inner peripheral surface of the sleeve 11 heated by the main heater 12, and is thereby inserted into the land 102 of the substrate 100. The terminal 110 of the electronic component is soldered by the molten solder piece H.

Further, the soldering device 10 further includes a restraining member 16. The restraining member 16 is an example of a restraining portion. The restraining member 16 is provided on the outside of the sleeve 11. In this case, the restraining member 16 is provided so as to cover not the entire side peripheral surface of the sleeve 11 but the portion of the side peripheral surface of the tubular sleeve 11 excluding the base end portion held by the holder 15. There is. In this case, the restraining member 16 is made of, for example, a felt-like flexible material made of an inorganic fiber material having a lower thermal conductivity than the sleeve 11 described above. Therefore, the restraining member 16 has at least a lower thermal conductivity than the sleeve 11 described above. The suppressing member 16 configured in this way suppresses heat radiation due to radiation from the sleeve 11 existing inside the suppressing member 16.

The thermal conductivity of the suppressing member 16 can be appropriately changed as long as the thermal conductivity is lower than that of the sleeve 11. Further, the tip portion of the restraining member 16 may be provided with an offset of a predetermined length with respect to the tip portion of the sleeve 11. That is, it is preferable to slightly provide a portion not covered by the restraining member 16 on the outer peripheral surface of the tip portion of the sleeve 11. The offset portion should be secured at least 1 mm or more from the tip of the sleeve 11. By providing such an offset region at the tip of the sleeve 11, the effect of avoiding the adhesion of foreign matter such as flux can be expected.

The thickness of the suppressing member 16 is preferably as thin as possible, preferably 1 mm or less, and more preferably 0.5 mm or less. Further, the thermal conductivity of the suppressing member 16 is preferably at least 1/100 or less of the thermal conductivity of the sleeve 11. Further, the suppressing member 16 preferably has heat resistance to withstand heat of at least 500 degrees or higher. Further, it is preferable that the restraining member 16 is hard to be damaged and is hard to generate fine pieces even when an external force such as vibration or impact generated by the soldering operation is applied.

Regarding the soldering device 10 described above, the overall operation of the soldering device 10 including the drive of each part such as the drive of the solder cutting part 13 and the drive of the sleeve unit 14 is a control device (not shown) mainly composed of a microcomputer, for example. It is supposed to be done by.

According to the soldering device 10 configured as described above, the heat radiation from the sleeve 11 can be suppressed by the suppressing member 16, and the temperature drop of the sleeve 11 can be avoided. Therefore, the sleeve 11 can be maintained in a preferably heated state. As a result, it is possible to facilitate concentrated heat transfer to the portion of the substrate 100 to be soldered, in this case, specifically to the land 102 portion, and it is possible to improve the soldering performance.

In particular, when the length of the protruding portion of the sleeve 11, in other words, the portion of the sleeve 11 protruding from the holder 15, exceeds a predetermined length, for example, 10 mm, the temperature of the sleeve 11 drops due to heat radiation, particularly. The temperature drop at the tip of the sleeve 11 away from the main heater 12 becomes noticeable. Therefore, in the soldering apparatus 10 having a long protruding portion of the sleeve 11 as described above, by providing the suppressing member 16 as described above, the effect of suppressing heat radiation from the sleeve 11 by the suppressing member 16 is effective. Can be used for.

According to the soldering apparatus 10, since the sleeve 11 is made of ceramic, the temperature of the sleeve 11 is unlikely to drop to a temperature that can be touched by a human. Therefore, for example, when the sleeve 11 is replaced during maintenance, it takes a long time until the temperature of the heated sleeve 11 drops, that is, until the temperature of the sleeve 11 drops to the extent that the replacement work is possible. There is a problem. However, according to the soldering apparatus 10, a restraining member 16 having a lower thermal conductivity than the sleeve 11 is provided on the outside of the sleeve 11 where the temperature does not easily drop. Therefore, the surface of the restraining member 16 can be kept lower than the surface of the sleeve 11, and therefore, the sleeve 11 can be replaced by handling the sleeve 11 together with the restraining member 16 without waiting for the temperature of the sleeve 11 to drop. It is possible to proceed with the work.

(Second Embodiment)
The soldering apparatus 10 illustrated in FIG. 2 includes a sleeve 21 in place of the sleeve 11 having a uniform overall diameter dimension described above. The sleeve 21 is an example of a molten portion, and has a main body portion 21A and a tip portion 21B. The main body 21A is the main body of the sleeve 21, and its base end is held inside the holder 15. The tip portion 21B constitutes the tip of the sleeve 21, and in this case, the diameter is smaller than that of the main body portion 21A. The sleeve 21 configured in this way has a structure in which the tip portion thereof is thinner than the base end portion side, which is the main heater 12 side. That is, the sleeve 21 has a configuration in which the diameter dimension differs depending on the portion.

Then, in this case, the restraining member 16 covers not the entire side peripheral surface of the sleeve 21 but the portion of the side peripheral surface of the main body 21A of the sleeve 21 except for the base end portion held by the holder 15. It is provided. Further, the side peripheral surface of the tip portion 21B of the sleeve 21 is not covered by the restraining member 16 and is in an exposed state.

According to the soldering apparatus of the second embodiment, since the tip of the sleeve 21 is thin, soldering is performed on the land 102 located next to the land 102 to be soldered on the substrate 100 or on the substrate 100. It is possible to prevent the sleeve 21 from interfering with the mounting parts and the like existing in the vicinity of the land 102 to be performed. Therefore, heat can be transferred accurately and efficiently to the portion of the substrate 100 to be soldered.

The soldering device 10 may also be configured to include the restraining member 16 on the side peripheral surface of the tip portion 21B of the sleeve 21. According to this configuration, it is possible to suppress a temperature drop at the tip of the sleeve 21, and it is possible to transfer heat to the portion of the substrate 100 to be soldered more accurately and more efficiently.

(Third Embodiment)
The soldering device 10 illustrated in FIG. 3 further includes an auxiliary heater 17. The auxiliary heater 17 is an example of a promoting unit and a heat generating unit. In this case, the auxiliary heater 17 is configured as a sheet-shaped heater containing a material such as nichrome wire, and is sandwiched between the outer peripheral surface of the main body 21A of the sleeve 21 and the inner peripheral surface of the restraining member 16. It is arranged as. When the auxiliary heater 17 is turned on by a control device (not shown), it generates heat by itself and heats the sleeve 21. As a result, the auxiliary heater 17 promotes the heating of the sleeve 21. That is, the sleeve 21 is heated by both the main heater 12 and the auxiliary heater 17, and the heating is promoted as compared with the case where the sleeve 21 is heated only by the main heater 12.

According to the soldering apparatus 10 of the third embodiment, the heating of the sleeve 21 can be promoted by heating the sleeve 21 by both the main heater 12 and the auxiliary heater 17. Further, the heat radiation from the sleeve 21 in which heating is promoted can be suppressed by the suppressing member 16. Therefore, the sleeve 21 can be efficiently heated, and the sleeve 21 can be maintained in a suitably heated state. Therefore, it is possible to make it easier to transfer heat to the portion of the substrate 100 to be soldered.

In the third embodiment, the auxiliary heater 17 may be further provided on the outer peripheral surface of the tip portion 21B of the sleeve 21. According to this configuration, heating of the tip portion of the sleeve 21 can be further promoted, and heat can be more easily transferred to the portion of the substrate 100 to be soldered.

(Fourth Embodiment)
The soldering device 10 illustrated in FIG. 4 further includes a heat guiding member 18. The heat induction member 18 is an example of a promotion unit and an induction unit. In this case, the heat guiding member 18 is a sheet-like member made of a material such as copper foil, and is sandwiched between the outer peripheral surface of the main body 21A of the sleeve 21 and the inner peripheral surface of the suppressing member 16. It is arranged as. The heat guiding member 18 is located between the main heater 12 and the tip of the sleeve 21 on the outer peripheral surface of the sleeve 21, and guides the heat generated by the main heater 12 to the tip of the sleeve 21. As a result, the heat induction member 18 promotes the heating of the sleeve 21. That is, the heat guiding member 18 guides the heat generated by the main heater 12 toward the tip end side of the sleeve 21, whereby the heating of the sleeve 21 is promoted.

According to the soldering apparatus 10 of the fourth embodiment, the heat generated by the main heater 12 is guided by the heat guiding member 18 to the tip end side of the sleeve 21, in other words, to the side opposite to the main heater 12. Therefore, heat can be efficiently transferred to the tip end side, which is the portion of the sleeve 21 opposite to the main heater 12, and the heating of the sleeve 21 can be promoted. Further, the heat radiation from the sleeve 21 in which heating is promoted can be suppressed by the suppressing member 16. Therefore, the sleeve 21 can be efficiently heated, and the sleeve 21 can be maintained in a suitably heated state. Therefore, it is possible to make it easier to transfer heat to the portion of the substrate 100 to be soldered.

In the fourth embodiment, the heat guiding member 18 may be further provided on the outer peripheral surface of the tip portion 21B of the sleeve 21. According to this configuration, heating of the tip portion of the sleeve 21 can be further promoted, and heat can be more easily transferred to the portion of the substrate 100 to be soldered.

(Other embodiments)
The soldering apparatus according to the present disclosure is not limited to the soldering apparatus 10 according to the plurality of embodiments described above, and various changes and extensions can be made without departing from the gist. For example, the soldering apparatus can be configured by appropriately combining the plurality of embodiments described above. Further, the soldering device does not have to be a sleeve soldering device, and can be applied to various soldering devices such as a soldering device that solders with a solid iron.

Further, the restraining member 16 may have a structure in which a plate-shaped or sheet-shaped member is arranged outside the melting portion, or a linear member may be wound around the outside of the melting portion. Further, the soldering apparatus may be provided with a plurality of restraining members 16 on the outside of the molten portion. In this case, the plurality of restraining members 16 may be divided into a plurality of layers along the longitudinal direction of the molten portion, or may have a multi-layer structure in which a plurality of layers are stacked along the radial direction of the fused portion. Further, when a plurality of restraining members 16 are provided, the materials of the respective restraining members 16 may be the same or different.

Further, it is preferable that the outer peripheral surface of the molten portion is covered with the suppressing member 16 as wide as possible, but there may be a portion of the outer peripheral surface of the fused portion that is not covered by the suppressing member 16. ..

Further, the suppressing member 16 may be made of a material having high heat reflectivity such as aluminum. That is, according to the suppressing member having high heat reflectivity, the heat released from the molten portion can be reflected to the molten portion side, whereby the heat radiation from the molten portion can be sufficiently suppressed. .. Further, the restraining member 16 may be configured by, for example, applying a heat insulating paint to the outer peripheral surface of the molten portion. With this configuration as well, heat radiation from the molten portion can be sufficiently suppressed.

Further, the suppressing portion may be integrally provided on the outer peripheral portion of the melting portion. That is, the suppressing portion may be realized by altering the outer peripheral surface of the molten portion or by making the structure of the outer peripheral surface of the fused portion different from the internal structure. Specifically, the suppressing portion can be realized by providing a large number of holes on the outer peripheral surface of the melting portion. Such a structure can be formed, for example, by using a 3D printer. It is also conceivable that the restraining portion can be formed by applying a special surface treatment to the outer peripheral surface of the molten portion.

Further, the shape and size of the molten portion can be appropriately changed. That is, the shape of the molten portion is not limited to a circular tubular shape, and may be, for example, a polygon such as a triangle, a quadrangle, or a pentagon. It may have a complicated shape depending on the situation. Further, the shape, size, thickness, etc. of the restraining portion can be appropriately changed according to the shape, size, etc. of the molten portion.

Further, when the tip portion of the molten portion is formed to be thin, it may be formed to be gradually thinned in multiple stages of two or more steps, or it may be formed in a tapered shape gradually becoming thinner toward the tip. Further, a chamfered portion such as a C surface or an R surface may be provided at the tip of the fused portion.

Although the present disclosure has been described in accordance with the examples, it is understood that the present disclosure is not limited to the examples and the structure. The present disclosure also includes various modifications and modifications within an equal range. In addition, various combinations and forms, as well as other combinations and forms that include only one element, more, or less, are also within the scope of the present disclosure.

In the drawing, 10 is a soldering device, 11 and 21 are sleeves (melting parts), 12 is a main heater (heating part), 16 is a suppressing member (suppressing part), 17 is an auxiliary heater (promoting part, heat generating part), 18 Indicates a heat guiding member (promoting part, guiding part).

Claims (6)

Melting parts (11, 21) that melt the solder (H),
A heating unit (12) that heats the molten unit,
A suppressing portion (16) provided on the outside of the melting portion and suppressing heat radiation of the melting portion,
Soldering equipment equipped with. The soldering apparatus according to claim 1, wherein the molten portion has non-adhesiveness to which solder does not easily adhere and has higher thermal conductivity than the restraining portion. The soldering apparatus according to claim 1 or 2, further comprising an accelerating portion (17, 18) for accelerating the heating of the molten portion. The soldering apparatus according to claim 3, further comprising a heat generating portion (17) that generates heat by itself as the promoting portion. The soldering apparatus according to claim 3, further comprising an guiding portion (18) as the promoting portion, which guides the heat generated by the heating portion to the tip end portion of the melting portion. The soldering apparatus according to any one of claims 1 to 5, wherein the tip end portion of the melting portion (21) is thinner than the base end portion side, which is the heating portion side.

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