JP2021052072A - Electronic component, manufacturing method of electronic component, mounting structure, and manufacturing method of mounting structure - Google Patents

Electronic component, manufacturing method of electronic component, mounting structure, and manufacturing method of mounting structure Download PDF

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JP2021052072A
JP2021052072A JP2019173516A JP2019173516A JP2021052072A JP 2021052072 A JP2021052072 A JP 2021052072A JP 2019173516 A JP2019173516 A JP 2019173516A JP 2019173516 A JP2019173516 A JP 2019173516A JP 2021052072 A JP2021052072 A JP 2021052072A
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electronic component
solder ball
conductor
solder
reinforcing
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JP7296582B2 (en
Inventor
繁 山津
Shigeru Yamatsu
繁 山津
山口　敦史
Atsushi Yamaguchi
敦史 山口
翔平 眞田
Shohei SANADA
翔平 眞田
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Panasonic Intellectual Property Management Co Ltd
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Panasonic Intellectual Property Management Co Ltd
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Priority to JP2019173516A priority Critical patent/JP7296582B2/en
Priority to PCT/JP2020/032408 priority patent/WO2021059851A1/en
Priority to CN202080063532.3A priority patent/CN114375494A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/11011—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature
    • H01L2224/11013—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature for holding or confining the bump connector, e.g. solder flow barrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
    • H01L2224/1401—Structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/81986—Specific sequence of steps, e.g. repetition of manufacturing steps, time sequence

Abstract

To provide an electronic component which prevents dents to be made on the surface of a solder ball.SOLUTION: The electronic component includes: an electronic component body 33; an electric conductor 31 formed on the electronic component body 33; multiple solder balls 30; and multiple reinforcement parts 4. Each of the multiple solder balls 30 is placed on the electric conductor 31 and is electrically connected to the electric conductor 31. Each of the multiple reinforcement parts 4 covers at least a part of a joint part 20 between the electric conductor 31 and each solder ball 30. At least one of the multiple reinforcement parts 4 is different partially in height from the surface of the electronic component body 33.SELECTED DRAWING: Figure 1

Description

本開示は、一般に電子部品、電子部品の製造方法、実装構造体及び実装構造体の製造方法に関する。より詳細には、本開示は、半導体チップなどの電子部品、電子部品の製造方法、電子部品を実装した実装構造体及び実装構造体の製造方法に関する。 The present disclosure generally relates to electronic components, methods of manufacturing electronic components, mounting structures and methods of manufacturing mounting structures. More specifically, the present disclosure relates to an electronic component such as a semiconductor chip, a method for manufacturing the electronic component, a mounting structure on which the electronic component is mounted, and a method for manufacturing the mounting structure.

特許文献１には、実装構造体が記載されている。この実装構造体は、半導体素子が２１７℃以上の融点を有する第１のはんだにより接合されている第１の実装基板を第２の基板上に実装した実装構造体である。また、この実装構造体は、第１の実装基板を第２の基板に接合する複数からなる接合部と、各接合部の各々の周囲に形成された補強部材とを備えている。前記接合部は、はんだより構成されており、前記補強部材は、樹脂により構成されている。そして、前記接合部を前記補強部材で補強することにより、実装構造体の落下信頼性及び温度サイクル特性を高くしようとしている。 Patent Document 1 describes a mounting structure. This mounting structure is a mounting structure in which a first mounting substrate in which a semiconductor element is joined by a first solder having a melting point of 217 ° C. or higher is mounted on a second substrate. Further, this mounting structure includes a plurality of joining portions for joining the first mounting substrate to the second substrate, and reinforcing members formed around each of the joining portions. The joint is made of solder, and the reinforcing member is made of resin. Then, by reinforcing the joint portion with the reinforcing member, it is attempted to improve the drop reliability and the temperature cycle characteristics of the mounting structure.

国際公開第２０１２／１３７４５７号International Publication No. 2012/137457

特許文献１のような実装構造体において、はんだで形成される接合部（はんだボール）の表面に凹みが生じることがあった。この場合、接合部を他の部材（例えば、回路基板等）の導体部に接続する際に接続しにくい場合があった。 In a mounting structure as in Patent Document 1, a dent may occur on the surface of a joint (solder ball) formed of solder. In this case, it may be difficult to connect the joint portion to the conductor portion of another member (for example, a circuit board or the like).

本開示は、はんだボールの表面に凹みが生じにくい電子部品を提供することを目的とする。 An object of the present disclosure is to provide an electronic component in which a dent is unlikely to occur on the surface of a solder ball.

また本開示は、電子部品を備える実装構造体、電子部品の製造方法及び実装構造体の製造方法を提供することを目的とする。 Another object of the present disclosure is to provide a mounting structure including electronic components, a method for manufacturing electronic components, and a method for manufacturing the mounting structure.

本開示の一態様に係る電子部品は、電子部品本体と、前記電子部品本体に形成された導体と、複数のはんだボールと、複数の補強部と、を備える。前記複数のはんだボールは、前記導体上に配置され、前記導体と電気的に接続されている。前記複数の補強部は、前記導体と前記各はんだボールとの各々の接合部分の少なくとも一部を覆う。前記複数の補強部のうちの少なくとも１つは、前記電子部品本体の表面からの高さが部分的に異なっている。 The electronic component according to one aspect of the present disclosure includes an electronic component main body, a conductor formed on the electronic component main body, a plurality of solder balls, and a plurality of reinforcing portions. The plurality of solder balls are arranged on the conductor and are electrically connected to the conductor. The plurality of reinforcing portions cover at least a part of each joint portion between the conductor and each of the solder balls. At least one of the plurality of reinforcing portions has a partially different height from the surface of the electronic component main body.

本開示の一態様に係る電子部品の製造方法は、電子部品本体に形成された導体にはんだボールを接触させる工程と、前記はんだボールと前記導体との接触部分の少なくとも一部を覆って未硬化樹脂材料を配置する工程と、を備える。前記はんだボールの融点が前記未硬化樹脂材料の硬化開始温度よりも低い。 The method for manufacturing an electronic component according to one aspect of the present disclosure includes a step of bringing a solder ball into contact with a conductor formed on the main body of the electronic component, and uncured covering at least a part of a contact portion between the solder ball and the conductor. It includes a step of arranging a resin material. The melting point of the solder ball is lower than the curing start temperature of the uncured resin material.

本開示の一態様に係る実装構造体は、前記電子部品を基材に実装している。 In the mounting structure according to one aspect of the present disclosure, the electronic component is mounted on a base material.

本開示の一態様に係る実装構造体の製造方法は、前記電子部品のはんだボールを溶融させて基材に接合する。 In the method for manufacturing a mounting structure according to one aspect of the present disclosure, the solder balls of the electronic component are melted and bonded to the base material.

本開示によれば、はんだボールの表面に凹みが生じにくい、という利点がある。 According to the present disclosure, there is an advantage that the surface of the solder ball is less likely to be dented.

図１は、本開示に係る実装構造体の一実施形態を示す断面図である。FIG. 1 is a cross-sectional view showing an embodiment of the mounting structure according to the present disclosure. 図２は、本開示に係る電子部品の一実施形態を示す一部の断面図である。FIG. 2 is a partial cross-sectional view showing an embodiment of the electronic component according to the present disclosure. 図３Ａ〜Ｃは、本開示に係る電子部品の製造方法の一実施形態を示す一部の断面図である。3A to 3C are partial cross-sectional views showing an embodiment of the method for manufacturing an electronic component according to the present disclosure. 図４は、本開示に係る電子部品の製造方法において、リフロー工程の温度プロファイルと未硬化樹脂材料の粘度変化とを示すグラフである。FIG. 4 is a graph showing a temperature profile of a reflow process and a change in viscosity of an uncured resin material in the method for manufacturing an electronic component according to the present disclosure. 図５は、本開示に係る電子部品の他の一実施形態を示す一部の断面図である。FIG. 5 is a partial cross-sectional view showing another embodiment of the electronic component according to the present disclosure.

（実施形態）
（１）概要
本実施形態に係る電子部品３は、電子部品本体３３と、電子部品本体３３に形成された導体３１と、複数のはんだボール３０と、複数の補強部４と、を備える。複数のはんだボール３０は、導体３１上に配置され、導体３１と電気的に接続されている。複数の補強部４は、導体３１と各はんだボール３０との各々の接合部分２０の少なくとも一部を覆う。複数の補強部４のうちの少なくとも１つは、電子部品本体３３の表面からの高さが部分的に異なっている。 (Embodiment)
(1) Outline The electronic component 3 according to the present embodiment includes an electronic component main body 33, a conductor 31 formed on the electronic component main body 33, a plurality of solder balls 30, and a plurality of reinforcing portions 4. The plurality of solder balls 30 are arranged on the conductor 31 and are electrically connected to the conductor 31. The plurality of reinforcing portions 4 cover at least a part of each joint portion 20 between the conductor 31 and each solder ball 30. At least one of the plurality of reinforcing portions 4 has a partially different height from the surface of the electronic component main body 33.

本実施形態に係る電子部品３は、電子部品本体３３の表面からの高さが部分的に異なっている補強部４で少なくとも一部が覆われているはんだボール３０の表面に凹みが生じにくい。すなわち、電子部品本体３３の表面からの高さが部分的に異なっている補強部４で少なくとも一部が覆われているはんだボール３０の表面が、球体の表面のように、滑らかになりやすく、歪な形状のはんだボール３０がほとんど無くなる。これは、はんだボール３０が溶融して導体３１に接合する際に、補強部４から溶融したはんだボール３０にかかる力が不均一となり、溶融したはんだボール３０の流動性が向上する。つまり、補強部４に高さに差を生じさせると、溶融したはんだボール３０が片側に回りやすくなって球形になりやすい。したがって、溶融したはんだボール３０が表面張力で滑らかな面を保った状態で固化することになり、表面に凹凸が少ないはんだボール３０を有する電子部品３が得ることができる。 In the electronic component 3 according to the present embodiment, dents are unlikely to occur on the surface of the solder ball 30 which is at least partially covered with the reinforcing portion 4 whose height from the surface of the electronic component main body 33 is partially different. That is, the surface of the solder ball 30, which is at least partially covered with the reinforcing portion 4 whose height from the surface of the electronic component main body 33 is partially different, tends to be smooth like the surface of a sphere. The distorted shape of the solder balls 30 is almost eliminated. This is because when the solder balls 30 are melted and joined to the conductor 31, the force applied to the melted solder balls 30 from the reinforcing portion 4 becomes non-uniform, and the fluidity of the melted solder balls 30 is improved. That is, if the reinforcing portion 4 has a difference in height, the molten solder balls 30 tend to rotate to one side and become spherical. Therefore, the molten solder balls 30 are solidified while maintaining a smooth surface due to surface tension, and an electronic component 3 having the solder balls 30 having less unevenness on the surface can be obtained.

そして、本実施形態に係る実装構造体１は、電子部品本体３３の表面からの高さが部分的に異なっている補強部４を有し、表面に凹凸が少ないはんだボール３０を有する上記のような電子部品３を基材２に実装している。したがって、電子部品３のはんだボール３０を基材２に接合するにあたって、はんだボール３０の表面の凹みによる接続不良を少なくすることができる。また電子部品本体３３の表面からの高さが部分的に異なっている補強部４から溶融したはんだボール３０にかかる力が不均一となり、溶融したはんだボール３０の流動性が向上する。よって、実装構造体１は、接続信頼性及びヒートサイクル信頼性が向上し、モバイル機器に好適に使用することができ、モバイル機器よりも高信頼性が要求される車載用機器にも適用することができる。 The mounting structure 1 according to the present embodiment has a reinforcing portion 4 having a partially different height from the surface of the electronic component main body 33, and has a solder ball 30 having less unevenness on the surface as described above. Electronic components 3 are mounted on the base material 2. Therefore, when joining the solder balls 30 of the electronic component 3 to the base material 2, it is possible to reduce connection defects due to dents on the surface of the solder balls 30. Further, the force applied to the molten solder balls 30 from the reinforcing portion 4 whose height from the surface of the electronic component main body 33 is partially different becomes non-uniform, and the fluidity of the molten solder balls 30 is improved. Therefore, the mounting structure 1 has improved connection reliability and heat cycle reliability, can be suitably used for mobile devices, and is also applicable to in-vehicle devices that require higher reliability than mobile devices. Can be done.

（２）詳細
（２．１）電子部品
図１に示すように、本実施形態に係る電子部品３は、電子部品本体３３と、電子部品本体３３に形成された導体３１と、複数のはんだボール３０と、複数の補強部４と、を備える。 (2) Details (2.1) Electronic component As shown in FIG. 1, the electronic component 3 according to the present embodiment includes an electronic component main body 33, a conductor 31 formed on the electronic component main body 33, and a plurality of solder balls. 30 and a plurality of reinforcing portions 4 are provided.

電子部品３としては、半導体チップ又はインターポーザーなどを例示することができる。電子部品３が半導体チップの場合は、例えば、表面実装型の半導体チップである。半導体チップは、特に限定されないが、例えば、ＢＧＡ（ボール・グリッド・アレイ）、ＷＬＰ（ウェハーレベルパッケージ）等である。電子部品３がＷＬＰである場合には、電子部品本体３３は、例えば、再配線層が設けられたシリコン基板を含む。電子部品３がＢＧＡである場合には、電子部品本体３３は、例えば、基板上に実装されたダイを封止樹脂で封止して構成されるパッケージを含む。電子部品３がインターポーザーの場合は、電子部品本体３３はプリント配線板等の回路基板である。 Examples of the electronic component 3 include a semiconductor chip and an interposer. When the electronic component 3 is a semiconductor chip, it is, for example, a surface mount type semiconductor chip. The semiconductor chip is not particularly limited, and is, for example, BGA (ball grid array), WLP (wafer level package), or the like. When the electronic component 3 is a WLP, the electronic component body 33 includes, for example, a silicon substrate provided with a rewiring layer. When the electronic component 3 is a BGA, the electronic component main body 33 includes, for example, a package configured by sealing a die mounted on a substrate with a sealing resin. When the electronic component 3 is an interposer, the electronic component main body 33 is a circuit board such as a printed wiring board.

導体３１は、電子部品本体３３の表面に形成されており、このため導体３１は、電子部品本体３３の表面で外部に露出している。導体３１は、例えば、電子部品３がＷＬＰである場合には、再配線層と電気的に接続されたピラーである。導体３１は、例えば、電子部品３がＢＧＡである場合には、ダイと電気的に接続された電極パッドである。電子部品本体３３及び導体３１の構造は前記に限られず、電子部品３の種類に応じた適宜の構造であればよい。 The conductor 31 is formed on the surface of the electronic component main body 33, and therefore the conductor 31 is exposed to the outside on the surface of the electronic component main body 33. The conductor 31 is, for example, a pillar electrically connected to the rewiring layer when the electronic component 3 is a WLP. The conductor 31 is, for example, an electrode pad electrically connected to the die when the electronic component 3 is a BGA. The structure of the electronic component main body 33 and the conductor 31 is not limited to the above, and may be an appropriate structure according to the type of the electronic component 3.

複数のはんだボール３０は、各々、導体３１上に配置され、導体３１と電気的に接続されている。このため、はんだボール３０と導体３１との間には接合部分（継目）２０が形成されている。はんだボール３０は、特に限定されないが、例えばＳＡＣはんだ製であってもよく、錫ビスマス系（Ｓｎ−Ｂｉ系）のはんだ製であってもよい。Ｓｎ−Ｂｉ系のはんだは、Ｓｎ及びＢｉに加えて、Ａｇ、Ｎｉ、Ｆｅ、Ｇｅ、Ｃｕ及びＩｎよりなる群から選択される少なくとも１種の材料を含有してもよい。Ｓｎ−Ｂｉ系はんだの機械的な性能向上のためには、Ｓｎ−Ｂｉ系はんだは、Ａｇ、Ｎｉ、Ｆｅ及びＧｅからなる群から選択される少なくとも一種の材料を含有することが好ましい。 Each of the plurality of solder balls 30 is arranged on the conductor 31 and is electrically connected to the conductor 31. Therefore, a joint portion (seam) 20 is formed between the solder ball 30 and the conductor 31. The solder ball 30 is not particularly limited, but may be made of, for example, SAC solder or tin bismuth-based (Sn-Bi-based) solder. In addition to Sn and Bi, the Sn—Bi-based solder may contain at least one material selected from the group consisting of Ag, Ni, Fe, Ge, Cu and In. In order to improve the mechanical performance of the Sn-Bi-based solder, the Sn-Bi-based solder preferably contains at least one material selected from the group consisting of Ag, Ni, Fe and Ge.

複数の補強部（フィレット）４は、各々、導体３１と各はんだボール３０との接合部分２０の少なくとも一部を覆う。すなわち、複数の補強部４は、各々、はんだボール３０の一つずつに対応して設けられている。また各補強部４は、対応する各はんだボール３０と導体３１との接合部分２０の少なくとも一部を覆っている。そのため、補強部４によって、はんだボール３０と導体３１との接合部分２０を補強することができ、電子部品３の接続信頼性を向上させることができる。ここで、導体３１と各はんだボール３０との接合部分２０の一部を覆うだけでもよいが、導体３１と各はんだボール３０との接合部分２０の全部を覆うことが好ましい。これにより、はんだボール３０と導体３１との接合部分２０を補強しやすい。接合部分２０は、はんだボール３０の中心３５を通り、電子部品本体３３の表面に垂直な方向を軸とするはんだボール３０の周方向において、全周にわたって露出している。したがって、接合部分２０の露出部分の一部又は全部が補強部４によって覆われている。 Each of the plurality of reinforcing portions (fillets) 4 covers at least a part of the joint portion 20 between the conductor 31 and each solder ball 30. That is, each of the plurality of reinforcing portions 4 is provided corresponding to each of the solder balls 30. Further, each reinforcing portion 4 covers at least a part of the joint portion 20 between the corresponding solder balls 30 and the conductor 31. Therefore, the reinforcing portion 4 can reinforce the joint portion 20 between the solder ball 30 and the conductor 31, and can improve the connection reliability of the electronic component 3. Here, it is sufficient to cover only a part of the joint portion 20 between the conductor 31 and each solder ball 30, but it is preferable to cover the entire joint portion 20 between the conductor 31 and each solder ball 30. As a result, the joint portion 20 between the solder ball 30 and the conductor 31 can be easily reinforced. The joint portion 20 passes through the center 35 of the solder ball 30 and is exposed over the entire circumference in the circumferential direction of the solder ball 30 about the direction perpendicular to the surface of the electronic component main body 33. Therefore, a part or all of the exposed portion of the joint portion 20 is covered by the reinforcing portion 4.

複数の補強部４のうちの少なくとも１つは、電子部品本体３３の表面からの高さが部分的に異なっている。ここで、補強部４の高さは、補強部４の頂部（先端部）４３１，４４１と、はんだボール３０の中心を通る断面を想定し、この断面において、電子部品本体３３の表面に対して垂直な線の長さである。したがって、補強部４は、はんだボール３０の中心を通り、電子部品本体３３の表面に垂直な方向を軸とするはんだボール３０の周方向において、高さが一定はなく、高い部分と低い部分とを有している。 At least one of the plurality of reinforcing portions 4 has a partially different height from the surface of the electronic component main body 33. Here, the height of the reinforcing portion 4 assumes a cross section passing through the top (tip portion) 431, 441 of the reinforcing portion 4 and the center of the solder ball 30, and in this cross section, with respect to the surface of the electronic component main body 33. The length of the vertical line. Therefore, the reinforcing portion 4 passes through the center of the solder ball 30 and has a non-constant height in the circumferential direction of the solder ball 30 about the direction perpendicular to the surface of the electronic component main body 33. have.

本実施形態に係る電子部品３は、電子部品本体３３の表面からの高さが部分的に異なっている補強部４の高さは、はんだボール３０の高さの５％以上８０％以下である。補強部４の高さが、はんだボール３０の高さの５％未満であると、接合部分２０の補強が低下する可能性がある。補強部４の高さが、はんだボール３０の高さの８０％を超えると、電子部品３をはんだボール３０により他部材に実装する際に、補強部４が他部材の表面にあたってしにくい場合がある。補強部４の高さは、はんだボール３０の高さの１０％以上７０％以下であることが好ましく、更に好ましくは、はんだボール３０の高さの２０％以上６０％以下である。 The height of the electronic component 3 according to the present embodiment is partially different from the surface of the electronic component main body 33. The height of the reinforcing portion 4 is 5% or more and 80% or less of the height of the solder ball 30. .. If the height of the reinforcing portion 4 is less than 5% of the height of the solder ball 30, the reinforcement of the joint portion 20 may be reduced. If the height of the reinforcing portion 4 exceeds 80% of the height of the solder ball 30, it may be difficult for the reinforcing portion 4 to come into contact with the surface of the other member when the electronic component 3 is mounted on the other member by the solder ball 30. is there. The height of the reinforcing portion 4 is preferably 10% or more and 70% or less of the height of the solder balls 30, and more preferably 20% or more and 60% or less of the height of the solder balls 30.

本実施形態に係る電子部品３は、補強部４の最も高い部分４３と最も低い部分４４との差が、はんだボール３０の高さの２％以上７５％以下である。補強部４の最も高い部分４３と最も低い部分４４との差が、はんだボール３０の高さの２％未満であると、溶融したはんだボール３０の流動性が低下し、表面に凹凸が少ないはんだボール３０を得にくくなる。補強部４の最も高い部分４３と最も低い部分４４との差が、はんだボール３０の高さの７５％を超えると、最も高い部分４３が高すぎたり、又は最も低い部分４４が低すぎたりして、接合部分２０の補強性能が低下したり、又は電子部品３を他部材へ実装しにくくなったりすることがある。なお、図３Ｃに示すように、はんだボール３０の高さＨＢは、はんだボール３０の頂部と、はんだボール３０の中心３５を通る断面を想定し、この断面において、電子部品本体３３の表面に対して垂直な線の長さである。補強部４の最も高い部分４３の高さＨＨは、補強部４の最も高い部分４３の頂部４３１とはんだボール３０の中心３５を通る断面を想定し、この断面において、電子部品本体３３の表面に対して垂直な線の長さである。また補強部４の最も低い部分４４の高さＨＬは、補強部４の最も低い部分４４の頂部４４１とはんだボール３０の中心３５を通る断面を想定し、この断面において、電子部品本体３３の表面に対して垂直な線の長さである。 In the electronic component 3 according to the present embodiment, the difference between the highest portion 43 and the lowest portion 44 of the reinforcing portion 4 is 2% or more and 75% or less of the height of the solder ball 30. If the difference between the highest portion 43 and the lowest portion 44 of the reinforcing portion 4 is less than 2% of the height of the solder balls 30, the fluidity of the molten solder balls 30 is reduced, and the surface of the solder has less unevenness. It becomes difficult to obtain the ball 30. When the difference between the highest portion 43 and the lowest portion 44 of the reinforcing portion 4 exceeds 75% of the height of the solder ball 30, the highest portion 43 is too high or the lowest portion 44 is too low. Therefore, the reinforcing performance of the joint portion 20 may be deteriorated, or it may be difficult to mount the electronic component 3 on another member. As shown in FIG. 3C, the height HB of the solder ball 30 assumes a cross section passing through the top of the solder ball 30 and the center 35 of the solder ball 30, and in this cross section, with respect to the surface of the electronic component main body 33. The length of the vertical line. The height HH of the highest portion 43 of the reinforcing portion 4 assumes a cross section passing through the top portion 431 of the highest portion 43 of the reinforcing portion 4 and the center 35 of the solder ball 30, and in this cross section, on the surface of the electronic component main body 33. The length of the line perpendicular to it. Further, the height HL of the lowest portion 44 of the reinforcing portion 4 assumes a cross section passing through the top portion 441 of the lowest portion 44 of the reinforcing portion 4 and the center 35 of the solder ball 30, and in this cross section, the surface of the electronic component main body 33. The length of the line perpendicular to.

補強部４は、樹脂を含む未硬化樹脂材料の硬化物である。樹脂としては熱硬化性樹脂又は光硬化性樹脂を含んでいてもよい。例えば、未硬化樹脂材料は、エポキシ樹脂と、フェノール樹脂と、ベンゾオキサジン化合物とを含むことができる。さらに未硬化樹脂材料は、活性剤を含むことが好ましい。 The reinforcing portion 4 is a cured product of an uncured resin material containing a resin. The resin may include a thermosetting resin or a photocurable resin. For example, the uncured resin material can include an epoxy resin, a phenol resin, and a benzoxazine compound. Further, the uncured resin material preferably contains an activator.

図２に示すように、本実施形態に係る電子部品３において、複数のはんだボール３０は、第一のはんだボール３０１と、第二のはんだボール３０２と、を含む。例えば、電子部品本体３３はその表面と垂直な方向から見て、四角形状に形成されており、複数のはんだボール３０は、電子部品本体３３の各辺と平行な方向に並べて設けられている。第一のはんだボール３０１は、電子部品本体３３の中心から見て、第二のはんだボール３０２よりも電子部品本体３３の端部３３１側に位置している。すなわち、第一のはんだボール３０１は、第二のはんだボール３０２よりも外側に位置している。逆に、第二のはんだボール３０２は、第一のはんだボール３０１よりも電子部品本体３３の中心の方（内側）に位置している。 As shown in FIG. 2, in the electronic component 3 according to the present embodiment, the plurality of solder balls 30 include a first solder ball 301 and a second solder ball 302. For example, the electronic component main body 33 is formed in a quadrangular shape when viewed from a direction perpendicular to the surface thereof, and a plurality of solder balls 30 are provided side by side in a direction parallel to each side of the electronic component main body 33. The first solder ball 301 is located closer to the end portion 331 of the electronic component body 33 than the second solder ball 302 when viewed from the center of the electronic component body 33. That is, the first solder ball 301 is located outside the second solder ball 302. On the contrary, the second solder ball 302 is located closer to the center (inside) of the electronic component main body 33 than the first solder ball 301.

本実施形態に係る電子部品３において、複数の補強部４は、第一の補強部４１と、第二の補強部４２と、を含む。つまり、第一の補強部４１は第一のはんだボール３０１に対応して設けられている。第二の補強部４２は第二のはんだボール３０２に対応して設けられている。そして、第一の補強部４１は、導体３１と第一のはんだボール３０１との接合部分２０の少なくとも一部を覆っている。つまり、導体３１と第一のはんだボール３０１との接合部分２０の露出部分の一部又は全部が第一の補強部４１によって覆われている。また第二の補強部４２は、導体３１と第二のはんだボール３０２との接合部分２０の少なくとも一部を覆っている。つまり、導体３１と第二のはんだボール３０２との接合部分２０の露出部分の一部又は全部が第二の補強部４２によって覆われている。したがって、本実施形態に係る電子部品３は、電子部品本体３３の中心から見て、第一の補強部４１は、第二の補強部４２よりも電子部品本体３３の端部３３１側に位置している。 In the electronic component 3 according to the present embodiment, the plurality of reinforcing portions 4 include a first reinforcing portion 41 and a second reinforcing portion 42. That is, the first reinforcing portion 41 is provided corresponding to the first solder ball 301. The second reinforcing portion 42 is provided corresponding to the second solder ball 302. The first reinforcing portion 41 covers at least a part of the joint portion 20 between the conductor 31 and the first solder ball 301. That is, a part or all of the exposed portion of the joint portion 20 between the conductor 31 and the first solder ball 301 is covered by the first reinforcing portion 41. Further, the second reinforcing portion 42 covers at least a part of the joint portion 20 between the conductor 31 and the second solder ball 302. That is, a part or all of the exposed portion of the joint portion 20 between the conductor 31 and the second solder ball 302 is covered by the second reinforcing portion 42. Therefore, in the electronic component 3 according to the present embodiment, the first reinforcing portion 41 is located closer to the end portion 331 of the electronic component main body 33 than the second reinforcing portion 42 when viewed from the center of the electronic component main body 33. ing.

そして、本実施形態に係る電子部品３において、第一の補強部４１は、第二の補強部４２よりも高い部分を有している。これにより、電子部品本体３３の端部３３１側（外側）に近いはんだボール３０（３０１）ほど、はんだボール３０の表面に凹凸が生じにくい。 Then, in the electronic component 3 according to the present embodiment, the first reinforcing portion 41 has a portion higher than the second reinforcing portion 42. As a result, the solder balls 30 (301) closer to the end 331 side (outside) of the electronic component main body 33 are less likely to have irregularities on the surface of the solder balls 30.

（２．２）電子部品の製造方法
図３Ａ〜Ｃに本実施形態に係る電子部品３の製造方法を示す。本実施形態に係る電子部品３の製造方法は、電子部品本体３３に形成された導体３１にはんだボール３０を接触させる工程を備える。また本実施形態に係る電子部品３の製造方法は、はんだボール３０と導体３１との接触部分の少なくとも一部を覆って未硬化樹脂材料４５を配置する工程を備える。 (2.2) Manufacturing Method of Electronic Component Figures 3A to 3C show the manufacturing method of the electronic component 3 according to the present embodiment. The method for manufacturing the electronic component 3 according to the present embodiment includes a step of bringing the solder ball 30 into contact with the conductor 31 formed on the electronic component main body 33. Further, the method for manufacturing the electronic component 3 according to the present embodiment includes a step of arranging the uncured resin material 45 so as to cover at least a part of the contact portion between the solder ball 30 and the conductor 31.

まず、導体３１を備える電子部品本体３３を用意して、導体３１を覆うように未硬化樹脂材料４５を配置する（図３Ａ参照）。未硬化樹脂材料４５を配置する方法は、特に限定されないが、例えば、インクジェット法等の印刷法、転写等の方法によって行うことができる。 First, the electronic component main body 33 including the conductor 31 is prepared, and the uncured resin material 45 is arranged so as to cover the conductor 31 (see FIG. 3A). The method of arranging the uncured resin material 45 is not particularly limited, but can be performed by, for example, a printing method such as an inkjet method or a method such as transfer.

次に、はんだボール３０が未硬化樹脂材料４５と接するように、導体３１の上方にはんだボール３０を配置する（図３Ｂ参照）。次に、図３Ｂに示す状態で、はんだボール３０及び未硬化樹脂材料４５を加熱する。加熱方法は特に限定されないが、例えばリフロー炉による加熱を採用することができる。この場合、例えば図４に示すようなリフロープロファイルに沿って、はんだボール３０及び未硬化樹脂材料４５を加熱することができる。 Next, the solder balls 30 are arranged above the conductor 31 so that the solder balls 30 are in contact with the uncured resin material 45 (see FIG. 3B). Next, the solder balls 30 and the uncured resin material 45 are heated in the state shown in FIG. 3B. The heating method is not particularly limited, but for example, heating by a reflow furnace can be adopted. In this case, the solder balls 30 and the uncured resin material 45 can be heated, for example, along the reflow profile as shown in FIG.

次に、図３Ｃに示すように、未硬化樹脂材料４５が熱硬化することにより、補強部４が形成される。また溶融したはんだボール３０が導体３１に接触した状態で導体３１に接触し、この後、溶融したはんだボール３０が固化して導体３１に接合される。 Next, as shown in FIG. 3C, the uncured resin material 45 is thermally cured to form the reinforcing portion 4. Further, the molten solder balls 30 come into contact with the conductor 31 in a state of being in contact with the conductor 31, and then the molten solder balls 30 are solidified and joined to the conductor 31.

本実施形態に係る電子部品３の製造方法において、はんだボール３０の融点が未硬化樹脂材料４５の硬化開始温度よりも低い。すなわち、はんだボール３０が溶融するまでは、未硬化樹脂材料４５が低粘度で維持される。またはんだボール３０の溶融が開始されても、すぐには未硬化樹脂材料４５の粘度が上がらず、しばらくしてから粘度が急上昇する。このため、導体３１とはんだボール３０との接合部分２０を、未硬化樹脂材料４５で覆ってから、未硬化樹脂材料４５を硬化させることができる。それにより、導体３１とはんだボール３０とが良好に接続することができる。そのため、導体３１とはんだボール３０との導通不良を抑制することができる。また、導体３１とはんだボール３０との接合部分２０を未硬化樹脂材料４５の硬化物（補強部４）で覆うことができる。そのため、導体３１とはんだボール３０との接合部分２０を補強部４で補強することができる。 In the method for manufacturing the electronic component 3 according to the present embodiment, the melting point of the solder balls 30 is lower than the curing start temperature of the uncured resin material 45. That is, the uncured resin material 45 is maintained at a low viscosity until the solder balls 30 are melted. Further, even if the melting of the solder balls 30 is started, the viscosity of the uncured resin material 45 does not increase immediately, and the viscosity rapidly increases after a while. Therefore, the joint portion 20 between the conductor 31 and the solder ball 30 can be covered with the uncured resin material 45, and then the uncured resin material 45 can be cured. As a result, the conductor 31 and the solder ball 30 can be satisfactorily connected. Therefore, it is possible to suppress poor continuity between the conductor 31 and the solder ball 30. Further, the joint portion 20 between the conductor 31 and the solder ball 30 can be covered with a cured product (reinforcing portion 4) of the uncured resin material 45. Therefore, the joint portion 20 between the conductor 31 and the solder ball 30 can be reinforced by the reinforcing portion 4.

図４に、本実施形態に係る電子部品３の製造方法における、リフロー工程の温度プロファイルと未硬化樹脂材料の粘度変化とを示している。図４のグラフにおいて、実線は加熱温度を示し、破線は未硬化樹脂材料４５の粘度を示す。図中の点Ｘは、未硬化樹脂材料４５の硬化反応開始であり、SAC半田融点以上（≧220℃）である。図中の点Ｙは、硬化完了SAC半田融点以上（≦220℃）である。「Zone1」では、未硬化樹脂材料４５は低粘度を保ち、はんだボール３０が溶けるまでは増粘しない。また「Zone2」では、はんだボール３０には、迅速な酸化膜除去が生じて、セルフアライメントを阻害しない程度の低粘度になる。そして、「Zone3」では、はんだボール３０の融点以下で迅速に硬化反応が進む。 FIG. 4 shows the temperature profile of the reflow process and the change in viscosity of the uncured resin material in the method for manufacturing the electronic component 3 according to the present embodiment. In the graph of FIG. 4, the solid line indicates the heating temperature, and the broken line indicates the viscosity of the uncured resin material 45. Point X in the figure is the start of the curing reaction of the uncured resin material 45, which is equal to or higher than the melting point of the SAC solder (≧ 220 ° C.). Point Y in the figure is equal to or higher than the melting point of the cured SAC solder (≦ 220 ° C.). In "Zone 1", the uncured resin material 45 maintains a low viscosity and does not thicken until the solder balls 30 are melted. Further, in "Zone 2", the solder ball 30 has a low viscosity that does not hinder self-alignment due to rapid removal of the oxide film. Then, in "Zone3", the curing reaction proceeds rapidly below the melting point of the solder ball 30.

未硬化樹脂材料４５は、エポキシ樹脂と、フェノール樹脂と、ベンゾオキサジン化合物とを含むことができる。さらに未硬化樹脂材料は、活性剤を含むことが好ましい。 The uncured resin material 45 can include an epoxy resin, a phenol resin, and a benzoxazine compound. Further, the uncured resin material preferably contains an activator.

エポキシ樹脂は、常温で液状であることが好ましい。この場合、未硬化樹脂材料４５において、エポキシ樹脂と、他の成分とを混合しやすくすることができる。なお、常温で液状であるとは、大気圧下、かつ、周囲の温度が５℃以上２８℃以下（特に２０℃前後）の状態において、流動性を有することを意味する。エポキシ樹脂が常温で液状であるためには、エポキシ樹脂に常温で液状の成分のみが含まれていてもよく、エポキシ樹脂に常温で液状の成分と常温で液状でない成分とが含まれていてもよく、反応性希釈剤、溶剤等によってエポキシ樹脂が常温で液状となっていてもよい。 The epoxy resin is preferably liquid at room temperature. In this case, in the uncured resin material 45, the epoxy resin and other components can be easily mixed. In addition, being liquid at room temperature means having fluidity under atmospheric pressure and in a state where the ambient temperature is 5 ° C. or higher and 28 ° C. or lower (particularly around 20 ° C.). In order for the epoxy resin to be liquid at room temperature, the epoxy resin may contain only a liquid component at room temperature, or the epoxy resin may contain a liquid component at room temperature and a non-liquid component at room temperature. Often, the epoxy resin may be liquid at room temperature due to a reactive diluent, solvent or the like.

フェノール樹脂は、フェノール性水酸基を有する化合物である。このフェノール性水酸基は、エポキシ樹脂のエポキシ基と反応することができる。 The phenol resin is a compound having a phenolic hydroxyl group. This phenolic hydroxyl group can react with the epoxy group of the epoxy resin.

ベンゾオキサジン化合物は、ジヒドロベンゾオキサジン環を含有する化合物である。ベンゾオキサジン化合物は、原材料の種類によって、種々の構造を有する。ベンゾオキサジン化合物は、例えば、各種のフェノール、アミンおよびホルムアルデヒド等から合成することができる。 The benzoxazine compound is a compound containing a dihydrobenzoxazine ring. The benzoxazine compound has various structures depending on the type of raw material. The benzoxazine compound can be synthesized from, for example, various phenols, amines, formaldehyde and the like.

活性剤は、融点が１３０℃以上２２０℃以下である有機酸、及び融点が１３０℃以上２２０℃以下であるアミンのうち少なくとも一方を含むことが好ましい。この場合、活性剤によってエポキシ樹脂の硬化反応が促進されにくくすることができる。また、融点が２００℃付近または２００℃以上であるはんだを使用する場合であっても、はんだを溶融させる前に、はんだボールの酸化皮膜を除去することができる。また、はんだボールの溶融前に有機酸又はアミンが溶融されることで、はんだ溶融前において、未硬化樹脂材料４５を低粘度化することができ、未硬化樹脂材料４５の濡れ性を向上させることができる。 The activator preferably contains at least one of an organic acid having a melting point of 130 ° C. or higher and 220 ° C. or lower and an amine having a melting point of 130 ° C. or higher and 220 ° C. or lower. In this case, the activator can make it difficult for the curing reaction of the epoxy resin to be promoted. Further, even when solder having a melting point of around 200 ° C. or 200 ° C. or higher is used, the oxide film of the solder balls can be removed before the solder is melted. Further, since the organic acid or amine is melted before the solder balls are melted, the viscosity of the uncured resin material 45 can be reduced before the solder melts, and the wettability of the uncured resin material 45 can be improved. Can be done.

そして、本実施形態に係る電子部品３のように、複数の補強部４のうちの少なくとも１つは、電子部品本体３３の表面からの高さが部分的に異なっているが、このような補強部４を形成するにあたっては、電子部品本体３０を部分的に反らせたり又は電子部品本体３０全体を傾けたりして未硬化樹脂材料４５の流れをコントロールする。これにより、未硬化樹脂材料４５が部分的に偏った状態で硬化し、電子部品本体３３の表面からの高さが部分的に異なる補強部４を形成することができる。したがって、第一の補強部４１も、電子部品本体３０を部分的に反らせたり又は電子部品本体３０全体を傾けたりして未硬化樹脂材料４５の流れをコントロールして形成することができる。電子部品本体３０を部分的に反らせる場合、電子部品本体３０の真ん中を凸にしたり凹にしたりすることができる。 Then, as in the electronic component 3 according to the present embodiment, at least one of the plurality of reinforcing portions 4 has a partially different height from the surface of the electronic component main body 33, but such reinforcement In forming the portion 4, the flow of the uncured resin material 45 is controlled by partially warping the electronic component main body 30 or tilting the entire electronic component main body 30. As a result, the uncured resin material 45 is cured in a partially biased state, and the reinforcing portion 4 having a partially different height from the surface of the electronic component main body 33 can be formed. Therefore, the first reinforcing portion 41 can also be formed by partially bending the electronic component main body 30 or tilting the entire electronic component main body 30 to control the flow of the uncured resin material 45. When the electronic component body 30 is partially warped, the center of the electronic component body 30 can be made convex or concave.

（２．３）実装構造体
図１に示すように、本実施形態に係る実装構造体１は、電子部品３を基材２に実装している。基材２は、表面に導体２１を有している。この導体２１の表面に電子部品３のはんだボール３０が接合されている。基材２は、回路基板等であって、例えば、マザー基板、パッケージ基板又はインターポーザー基板である。回路基板は、例えば、ガラスエポキシ製、ポリイミド製、ポリエステル製、セラミック製などの絶縁基板である。電子部品３は、本実施形態に係る電子部品であって、例えば、半導体チップである。より具体的には、電子部品３は、例えばＢＧＡ（ボール・グリッド・アレイ）、ＬＧＡ（ランド・グリッド・アレイ）、又はＣＳＰ（チップ・サイズ・パッケージ）などの、フリップチップ型のチップである。電子部品３は、ＰｏＰ（パッケージ・オン・パッケージ）型のチップであってもよい。したがって、実装構造体１は、半導体パッケージなどとして形成されている。 (2.3) Mounting Structure As shown in FIG. 1, in the mounting structure 1 according to the present embodiment, the electronic component 3 is mounted on the base material 2. The base material 2 has a conductor 21 on its surface. The solder balls 30 of the electronic component 3 are bonded to the surface of the conductor 21. The base material 2 is a circuit board or the like, for example, a mother board, a package board, or an interposer board. The circuit board is, for example, an insulating substrate made of glass epoxy, polyimide, polyester, ceramic, or the like. The electronic component 3 is an electronic component according to the present embodiment, and is, for example, a semiconductor chip. More specifically, the electronic component 3 is a flip-chip type chip such as a BGA (ball grid array), an LGA (land grid array), or a CSP (chip size package). The electronic component 3 may be a PoP (package on package) type chip. Therefore, the mounting structure 1 is formed as a semiconductor package or the like.

（２．４）実装構造体の製造方法
本実施形態に係る実装構造体１の製造方法は、電子部品３のはんだボール３０を溶融させて基材２に接合する。すなわち、まず、導体２１を備える基材２を用意する。次に、はんだボール３０を備える電子部品３を用意する。そして、はんだボール３０を導体２１に接触させた状態で、はんだボール３０を加熱する。加熱方法は特に限定されないが、例えば、リフロー炉による加熱を採用することができる。これにより、電子部品３のはんだボール３０を溶融させて基材２に接触させ、その後、冷却してはんだボール３０を固化することによって、導体２１とはんだボール３０とを接合する。 (2.4) Manufacturing Method of Mounting Structure In the manufacturing method of the mounting structure 1 according to the present embodiment, the solder balls 30 of the electronic component 3 are melted and bonded to the base material 2. That is, first, the base material 2 provided with the conductor 21 is prepared. Next, the electronic component 3 including the solder ball 30 is prepared. Then, the solder balls 30 are heated in a state where the solder balls 30 are in contact with the conductor 21. The heating method is not particularly limited, but for example, heating by a reflow furnace can be adopted. As a result, the solder balls 30 of the electronic component 3 are melted and brought into contact with the base material 2, and then cooled to solidify the solder balls 30 to join the conductor 21 and the solder balls 30.

（３）変形例
実施形態は、本開示の様々な実施形態の一つに過ぎない。実施形態は、本開示の目的を達成できれば、設計等に応じて種々の変更が可能である。 (3) Modified Example The embodiment is only one of the various embodiments of the present disclosure. The embodiment can be changed in various ways depending on the design and the like as long as the object of the present disclosure can be achieved.

上記実施形態では、第一の補強部４１の外側の部分（電子部品本体３３の端部３３１側の部分）が高さの高い部分４３として形成したが、これに限られない。例えば、図５に示すように、第一の補強部４１の内側の部分（電子部品本体３３の中心側の部分）が高さの高い部分４３として形成してもよい。この場合、第一の補強部４１の外側の部分が高さの低い部分４４として形成される。 In the above embodiment, the outer portion of the first reinforcing portion 41 (the portion on the end portion 331 side of the electronic component main body 33) is formed as a high-height portion 43, but the present invention is not limited to this. For example, as shown in FIG. 5, the inner portion (the portion on the center side of the electronic component main body 33) of the first reinforcing portion 41 may be formed as a high-height portion 43. In this case, the outer portion of the first reinforcing portion 41 is formed as a low-height portion 44.

１．未硬化樹脂材料の調製
以下の成分を使用して未硬化樹脂材料を調整した。
・エポキシ樹脂（ＥＰＩＣＬＯＮ８３５ＬＶ）：２５℃で液状のビスフェノールＦ型エポキシ樹脂、エポキシ当量１６０〜１７０、２５℃での粘度２０００〜２５００ｍＰａ・ｓ、ＤＩＣ株式会社製、品名ＥＰＩＣＬＯＮ８３５ＬＶ。
・フェノール樹脂（ＭＥＨ８０００Ｈ）：２５℃で液状のフェノール樹脂、２５℃の粘度１５００〜３５００ｍＰａ・ｓ、明和化成株式会社製、品番ＭＥＨ−８０００Ｈ。
・ベンゾオキサジン化合物（Ｐ−ｄ）：ｐ−ｄ型ベンゾオキサジン化合物、四国化成株式会社製。
・活性剤（アジピン酸）：アジピン酸、融点１５２〜１５５℃、東京化成工業株式会社製。 1. 1. Preparation of uncured resin material The uncured resin material was prepared using the following components.
Epoxy resin (EPICLON 835LV): Bisphenol F type epoxy resin liquid at 25 ° C, epoxy equivalent 160-170, viscosity 2000-2500 mPa · s at 25 ° C, manufactured by DIC Corporation, product name EPICLON 835LV.
-Phenol resin (MEH8000H): Phenol resin liquid at 25 ° C, viscosity 1500-3500 mPa · s at 25 ° C, manufactured by Meiwa Kasei Co., Ltd., product number MEH-8000H.
-Benzooxazine compound (Pd): pd-type benzoxazine compound, manufactured by Shikoku Kasei Co., Ltd.
-Activator (adipic acid): Adipic acid, melting point 152-155 ° C, manufactured by Tokyo Chemical Industry Co., Ltd.

そして、エポキシ樹脂２０重量部と、フェノール樹脂３５重量部と、ベンゾオキサジン化合物３５重量部と、活性剤１０重量部とを配合して未硬化樹脂材料を調整した。 Then, 20 parts by weight of the epoxy resin, 35 parts by weight of the phenol resin, 35 parts by weight of the benzoxazine compound, and 10 parts by weight of the activator were blended to prepare an uncured resin material.

また電子部品本体３３の導体３１にはんだボール３０を接合し、上記未硬化樹脂材料４５からなる補強部４を形成して半導体チップ（電子部品３）を作成した。 Further, a solder ball 30 was joined to the conductor 31 of the electronic component main body 33 to form a reinforcing portion 4 made of the uncured resin material 45, and a semiconductor chip (electronic component 3) was created.

２．評価
（１）はんだボール形状
はんだボール形状を電子顕微鏡等で確認した。そして、以下の評価をした。
〇：凹みの深さが２μｍ以下のもの。
△：凹みの深さが５.０μｍ以上１０μｍ未満のもの
×：凹みの深さが１０μｍ以上のもの。 2. Evaluation (1) Solder ball shape The solder ball shape was confirmed with an electron microscope or the like. Then, the following evaluation was made.
〇: The depth of the dent is 2 μm or less.
Δ: The depth of the dent is 5.0 μm or more and less than 10 μm ×: The depth of the dent is 10 μm or more.

（２）２次実装性
半導体チップを基板に実装したときの電気的な抵抗値を測定した。そして、以下の評価をした。
〇：抵抗値が５Ω未満のもの。
△：抵抗値が５Ω以上１０Ω未満のもの。
×：抵抗値が１０Ω以上のもの。 (2) Secondary mountability The electrical resistance value when the semiconductor chip was mounted on the substrate was measured. Then, the following evaluation was made.
〇: The resistance value is less than 5Ω.
Δ: The resistance value is 5Ω or more and less than 10Ω.
X: The resistance value is 10Ω or more.

（３）実装後信頼性
上記未硬化樹脂材料の代わりに、フラックスを用いてはんだボール３０を接合した場合とヒートサイクル試験の結果を比較した。そして、以下の評価をした。
◎：フラックスと比較して２倍以上のもの。
〇：フラックスと比較して信頼性が３０％以上良化したもの。
△：フラックスと同等のもの。
×：フラックスよりも悪化したもの。 (3) Reliability after mounting The results of the heat cycle test were compared with the case where the solder balls 30 were joined using flux instead of the above-mentioned uncured resin material. Then, the following evaluation was made.
⊚: More than twice as much as flux.
〇: The reliability is improved by 30% or more compared to the flux.
Δ: Equivalent to flux.
×: Worse than flux.

（４）総合判定
〇：上記（１）〜（３）のすべて〇のもの。
△：上記（１）〜（３）の１個でも△があるもの。
×：上記（１）〜（３）の１個でも×があるもの。 (4) Comprehensive judgment 〇: All of the above (1) to (3) 〇.
Δ: Even one of the above (1) to (3) has a Δ.
X: Even one of the above (1) to (3) has x.

Figure 2021052072
Figure 2021052072

（まとめ）
以上説明したように、第１の態様に係る電子部品（３）は、電子部品本体（３３）と、電子部品本体（３３）に形成された導体（３１）と、複数のはんだボール（３０）と、複数の補強部（４）と、を備える。複数のはんだボール（３０）は、導体（３１）上に配置され、導体（３１）と電気的に接続されている。複数の補強部（４）は、導体（３１）と各はんだボール（３０）との接合部分（２０）の少なくとも一部を覆う。複数の補強部（４）のうちの少なくとも１つは、電子部品本体（３３）の表面からの高さが部分的に異なっている。 (Summary)
As described above, the electronic component (3) according to the first aspect includes an electronic component body (33), a conductor (31) formed on the electronic component body (33), and a plurality of solder balls (30). And a plurality of reinforcing portions (4). The plurality of solder balls (30) are arranged on the conductor (31) and are electrically connected to the conductor (31). The plurality of reinforcing portions (4) cover at least a part of the joint portion (20) between the conductor (31) and each solder ball (30). At least one of the plurality of reinforcing portions (4) has a partially different height from the surface of the electronic component main body (33).

第１の態様によれば、溶融したはんだボール（３０）の流動性が良好となり、固化後のはんだボール（３０）の表面に凹みが生じにくい、という利点がある。 According to the first aspect, there is an advantage that the fluidity of the molten solder ball (30) is improved and the surface of the solidified solder ball (30) is less likely to be dented.

第２の態様に係る電子部品（３）は、第１の態様において、複数のはんだボール（３０）は、第一のはんだボール（３０１）と、第二のはんだボール（３０２）と、を含む。複数の補強部（４）は、導体（３１）と第一のはんだボール（３０１）との接合部分（２０）の少なくとも一部を覆う第一の補強部（４１）と、導体（３１）と第二のはんだボール（３０２）との接合部分（２０）の少なくとも一部を覆う第二の補強部（４２）と、を含む。第一の補強部（４１）は、第二の補強部（４２）よりも高い部分を有している。 The electronic component (3) according to the second aspect includes, in the first aspect, a plurality of solder balls (30), a first solder ball (301) and a second solder ball (302). .. The plurality of reinforcing portions (4) include a first reinforcing portion (41) that covers at least a part of a joint portion (20) between the conductor (31) and the first solder ball (301), and a conductor (31). It includes a second reinforcing portion (42) that covers at least a part of the joint portion (20) with the second solder ball (302). The first reinforcing portion (41) has a higher portion than the second reinforcing portion (42).

第２の態様によれば、第一の補強部（４１）の第二の補強部（４２）よりも高い部分により、溶融した第一のはんだボール（３０１）の流動性が良好となり、固化後の第一のはんだボール（３０１）の表面に凹みが生じにくい、という利点がある。 According to the second aspect, the fluidity of the molten first solder ball (301) is improved by the portion of the first reinforcing portion (41) higher than the second reinforcing portion (42), and after solidification. There is an advantage that the surface of the first solder ball (301) is less likely to be dented.

第３の態様に係る電子部品（３）は、第２の態様において、電子部品本体（３３）の中心から見て、第一の補強部（４１）は、第二の補強部（４２）よりも電子部品（３）の端部（３３１）側に位置している。 In the second aspect, the electronic component (3) according to the third aspect has the first reinforcing portion (41) from the second reinforcing portion (42) when viewed from the center of the electronic component main body (33). Is also located on the end (331) side of the electronic component (3).

第３の態様によれば、電子部品（３）の端部（３３１）側に位置する第一のはんだボール（３０１）の表面に凹みが生じにくい、という利点がある。 According to the third aspect, there is an advantage that the surface of the first solder ball (301) located on the end portion (331) side of the electronic component (3) is less likely to be dented.

第４の態様に係る電子部品（３）は、第１〜３のいずれか１つの態様において、電子部品本体（３３）の表面からの高さが部分的に異なっている補強部（４）の高さは、はんだボール（３０）の高さの５％以上８０％以下である。補強部（４）の最も高い部分（４３）と最も低い部分（４４）との差が、はんだボール（３０）の高さの２％以上７５％以下である。 The electronic component (3) according to the fourth aspect is the reinforcing portion (4) having a partially different height from the surface of the electronic component body (33) in any one of the first to third aspects. The height is 5% or more and 80% or less of the height of the solder ball (30). The difference between the highest portion (43) and the lowest portion (44) of the reinforcing portion (4) is 2% or more and 75% or less of the height of the solder ball (30).

第４の態様によれば、補強部（４）によるはんだボール（３０）の補強性能と、電子部品（３）の実装性とを損なわないようにすることができる、という利点がある。 According to the fourth aspect, there is an advantage that the reinforcing performance of the solder ball (30) by the reinforcing portion (4) and the mountability of the electronic component (3) can be not impaired.

第５の態様に係る電子部品（３）の製造方法は、電子部品本体（３３）に形成された導体（３１）にはんだボール（３０）を接触させる工程と、はんだボール（３０）と導体（３１）との接触部分の少なくとも一部を覆って未硬化樹脂材料（４５）を配置する工程と、を備える。はんだボール（３０）の融点が未硬化樹脂材料（４５）の硬化開始温度よりも低い。 The method for manufacturing the electronic component (3) according to the fifth aspect includes a step of bringing the solder ball (30) into contact with the conductor (31) formed on the electronic component body (33), and the solder ball (30) and the conductor ( A step of arranging the uncured resin material (45) so as to cover at least a part of the contact portion with 31) is provided. The melting point of the solder ball (30) is lower than the curing start temperature of the uncured resin material (45).

第５の態様によれば、溶融したはんだボール（３０）の流動性が良好となり、固化後のはんだボール（３０）の表面に凹みが生じにくい、という利点がある。 According to the fifth aspect, there is an advantage that the fluidity of the molten solder ball (30) is improved and the surface of the solidified solder ball (30) is less likely to be dented.

第６の態様に係る実装構造体（１）は、第１〜４のいずれか１つの態様の電子部品（３）を基材（２）に実装している。 In the mounting structure (1) according to the sixth aspect, the electronic component (3) of any one of the first to fourth aspects is mounted on the base material (2).

第６の態様によれば、電子部品（３）と基材（２）との接続信頼性を向上させることができる、という利点がある。 According to the sixth aspect, there is an advantage that the connection reliability between the electronic component (3) and the base material (2) can be improved.

第７の態様に係る実装構造体（１）の製造方法は、第１〜４のいずれか１つの態様の電子部品（３）のはんだボール（３０）を溶融させて基材（２）に接合する。 In the method for manufacturing the mounting structure (1) according to the seventh aspect, the solder balls (30) of the electronic component (3) according to any one of the first to fourth aspects are melted and bonded to the base material (2). To do.

第７の態様によれば、電子部品（３）と基材（２）との接続信頼性を向上させることができる、という利点がある。 According to the seventh aspect, there is an advantage that the connection reliability between the electronic component (3) and the base material (2) can be improved.

１ 実装構造体
２ 基材
３ 電子部品
３０ はんだボール
３０１ 第一のはんだボール
３０２ 第二のはんだボール
３１ 導体
３３ 電子部品本体
４ 補強部
４１ 第一の補強部
４２ 第二の補強部
４３ 最も高い部分
４４ 最も低い部分
４５ 未硬化樹脂材料 1 Mounting structure 2 Base material 3 Electronic component 30 Solder ball 301 First solder ball 302 Second solder ball 31 Conductor 33 Electronic component body 4 Reinforcement part 41 First reinforcement part 42 Second reinforcement part 43 Highest part 44 lowest part 45 uncured resin material

Claims (7)

電子部品本体と、
前記電子部品本体に形成された導体と、
前記導体上に配置され、前記導体と電気的に接続されている、複数のはんだボールと、
前記導体と前記各はんだボールとの接合部分の少なくとも一部を覆う複数の補強部と、を備え、
前記複数の補強部のうちの少なくとも１つは、前記電子部品本体の表面からの高さが部分的に異なっている、
電子部品。 Electronic component body and
The conductor formed on the electronic component body and
A plurality of solder balls arranged on the conductor and electrically connected to the conductor,
A plurality of reinforcing portions covering at least a part of the joint portion between the conductor and the solder balls are provided.
At least one of the plurality of reinforcing portions has a partially different height from the surface of the electronic component body.
Electronic components. 前記複数のはんだボールは、第一のはんだボールと、第二のはんだボールと、を含み、
前記複数の補強部は、前記導体と前記第一のはんだボールとの接合部分の少なくとも一部を覆う第一の補強部と、前記導体と前記第二のはんだボールとの接合部分の少なくとも一部を覆う第二の補強部と、を含み、
前記第一の補強部は、前記第二の補強部よりも高い部分を有している、
請求項１に記載の電子部品。 The plurality of solder balls include a first solder ball and a second solder ball.
The plurality of reinforcing portions include a first reinforcing portion that covers at least a part of the joint portion between the conductor and the first solder ball, and at least a part of the joint portion between the conductor and the second solder ball. Includes a second reinforcement, which covers the
The first reinforcing portion has a portion higher than the second reinforcing portion.
The electronic component according to claim 1. 前記電子部品本体の中心から見て、前記第一の補強部は、前記第二の補強部よりも前記電子部品本体の端部側に位置している、
請求項２に記載の電子部品。 The first reinforcing portion is located closer to the end portion of the electronic component main body than the second reinforcing portion when viewed from the center of the electronic component main body.
The electronic component according to claim 2. 前記電子部品本体の表面からの高さが部分的に異なっている補強部の高さは、前記はんだボールの高さの５％以上８０％以下であり、
前記補強部の最も高い部分と最も低い部分との差が、前記はんだボールの高さの２％以上７５％以下である、
請求項１〜３のいずれか１項に記載の電子部品。 The height of the reinforcing portion whose height from the surface of the electronic component body is partially different is 5% or more and 80% or less of the height of the solder ball.
The difference between the highest portion and the lowest portion of the reinforcing portion is 2% or more and 75% or less of the height of the solder ball.
The electronic component according to any one of claims 1 to 3. 電子部品本体に形成された導体にはんだボールを接触させる工程と、
前記はんだボールと前記導体との接触部分の少なくとも一部を覆って未硬化樹脂材料を配置する工程と、を備え、
前記はんだボールの融点が前記未硬化樹脂材料の硬化開始温度よりも低い、
電子部品の製造方法。 The process of bringing the solder balls into contact with the conductor formed on the body of the electronic component,
A step of arranging the uncured resin material so as to cover at least a part of the contact portion between the solder ball and the conductor is provided.
The melting point of the solder ball is lower than the curing start temperature of the uncured resin material.
Manufacturing method of electronic parts. 請求項１〜４のいずれか１項に記載の電子部品を基材に実装している、
実装構造体。 The electronic component according to any one of claims 1 to 4 is mounted on a base material.
Mounting structure. 請求項１〜４のいずれか１項に記載の電子部品の前記はんだボールを溶融させて基材に接合する、
実装構造体の製造方法。 The solder balls of the electronic component according to any one of claims 1 to 4 are melted and bonded to a base material.
Manufacturing method of mounting structure.
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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004288785A (en) * 2003-03-20 2004-10-14 Sony Corp Joint structure and joining method of electric conduction projection
WO2016016916A1 (en) * 2014-07-29 2016-02-04 パナソニックＩｐマネジメント株式会社 Semiconductor component, semiconductor mounting component using same, and semiconductor mounting component manufacturing method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004288785A (en) * 2003-03-20 2004-10-14 Sony Corp Joint structure and joining method of electric conduction projection
WO2016016916A1 (en) * 2014-07-29 2016-02-04 パナソニックＩｐマネジメント株式会社 Semiconductor component, semiconductor mounting component using same, and semiconductor mounting component manufacturing method

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