CN114375494A - Electronic component, method for manufacturing electronic component, mounted structure, and method for manufacturing mounted structure - Google Patents

Electronic component, method for manufacturing electronic component, mounted structure, and method for manufacturing mounted structure Download PDF

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Publication number
CN114375494A
CN114375494A CN202080063532.3A CN202080063532A CN114375494A CN 114375494 A CN114375494 A CN 114375494A CN 202080063532 A CN202080063532 A CN 202080063532A CN 114375494 A CN114375494 A CN 114375494A
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CN
China
Prior art keywords
electronic component
solder ball
reinforcing
solder
conductor
Prior art date
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Pending
Application number
CN202080063532.3A
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Chinese (zh)
Inventor
山津繁
山口敦史
真田翔平
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Panasonic Intellectual Property Management Co Ltd
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Panasonic Intellectual Property Management Co Ltd
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Publication of CN114375494A publication Critical patent/CN114375494A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/11011—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature
    • H01L2224/11013—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature for holding or confining the bump connector, e.g. solder flow barrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
    • H01L2224/1401—Structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/81986—Specific sequence of steps, e.g. repetition of manufacturing steps, time sequence

Abstract

The invention provides an electronic component, a method for manufacturing the electronic component, a mounting structure and a method for manufacturing the mounting structure, wherein a concave part is not easy to generate on the surface of a solder ball. The electronic component is provided with an electronic component body (33), conductors (31) formed on the electronic component body (33), a plurality of solder balls (30), and a plurality of reinforcing portions (4). A plurality of solder balls (30) are arranged on the conductors (31), respectively, and are electrically connected to the conductors (31). The plurality of reinforcing portions (4) cover at least a part of the conductors (31) and the bonding portions (20) of the solder balls (30). At least 1 of the plurality of reinforcing portions (4) has a locally different height from the surface of the electronic component body (33).

Description

Electronic component, method for manufacturing electronic component, mounted structure, and method for manufacturing mounted structure
Technical Field
The present disclosure generally relates to an electronic component, a method of manufacturing an electronic component, a mounted structure, and a method of manufacturing a mounted structure. More specifically, the present disclosure relates to an electronic component such as a semiconductor chip, a method for manufacturing the electronic component, a mounted structure having the electronic component mounted thereon, and a method for manufacturing the mounted structure.
Background
Patent document 1 describes a mounting structure. The mounting structure is a mounting structure in which a 1 st mounting substrate to which a semiconductor element is bonded by a 1 st solder having a melting point of 217 ℃ or higher is mounted on a 2 nd substrate. The mounting structure also includes a plurality of joining portions for joining the 1 st mounting substrate to the 2 nd substrate, and reinforcing members formed around the respective joining portions. The joint portion is made of solder, and the reinforcing member is made of resin. Further, it is desired to improve the drop reliability and the temperature cycle characteristics of the mounting structure by reinforcing the joint with the reinforcing member.
Prior art documents
Patent document
Patent document 1: international publication No. 2012/137457
Disclosure of Invention
In the mounting structure of patent document 1, a concave portion may be formed on the surface of a joint portion (solder ball) formed by solder. In this case, when the joint portion is connected to a conductor portion of another member (for example, a circuit board or the like), connection may be difficult.
An object of the present disclosure is to provide an electronic component in which a concave portion is less likely to be generated on a surface of a solder ball.
Another object of the present disclosure is to provide a mounted structure provided with an electronic component, a method for manufacturing the electronic component, and a method for manufacturing the mounted structure.
An electronic component according to an aspect of the present disclosure includes an electronic component body, a conductor formed on the electronic component body, a plurality of solder balls, and a plurality of reinforcing portions. The plurality of solder balls are arranged on the conductor and electrically connected to the conductor. The plurality of reinforcing portions cover at least a part of each joint portion of the conductor and each solder ball. At least 1 of the plurality of reinforcing portions is locally different in height from the surface of the electronic component body.
A method for manufacturing an electronic component according to an aspect of the present disclosure includes a step of bringing a solder ball into contact with a conductor formed on an electronic component body. The method for manufacturing an electronic component according to one aspect of the present disclosure further includes a step of covering at least a part of a contact portion between the solder ball and the conductor and disposing an uncured resin material. The method for manufacturing an electronic component according to one aspect of the present disclosure further includes a step of heating the solder ball and the uncured resin material to melt the solder ball and thermally cure the uncured resin material to form a plurality of reinforcing portions. The solder ball has a melting point lower than a curing start temperature of the uncured resin material. At least 1 of the plurality of reinforcing portions is locally different in height from the surface of the electronic component body.
The mounting structure according to one aspect of the present disclosure mounts the electronic component on a substrate.
In the method for manufacturing a mounted structure according to one aspect of the present disclosure, the solder ball of the electronic component is melted and bonded to the base material.
Drawings
Fig. 1 is a sectional view showing an embodiment of a mounting structure according to the present disclosure.
Fig. 2 is a partial cross-sectional view showing an embodiment of an electronic component according to the present disclosure.
Fig. 3A to 3C are partial sectional views showing an embodiment of a method for manufacturing an electronic component according to the present disclosure.
Fig. 4 is a graph showing a temperature profile of a reflow process and a change in viscosity of an uncured resin material in the method for manufacturing an electronic component according to the present disclosure.
Fig. 5 is a partial cross-sectional view showing another embodiment of an electronic component according to the present disclosure.
Detailed Description
(embodiment mode)
(1) Summary of the invention
The electronic component 3 according to the present embodiment includes an electronic component body 33, conductors 31 formed in the electronic component body 33, a plurality of solder balls 30, and a plurality of reinforcing portions 4. The plurality of solder balls 30 are arranged on the conductors 31 and electrically connected to the conductors 31. The plurality of reinforcing portions 4 cover at least a part of each of the bonding portions 20 of the conductors 31 and the solder balls 30. At least 1 of the plurality of reinforcing portions 4 has a locally different height from the surface of the electronic component body 33.
In the electronic component 3 according to the present embodiment, a concave portion is less likely to be generated on the surface of the solder ball 30 at least a part of which is covered with the reinforcing portion 4 having a locally different height from the surface of the electronic component main body 33. That is, the surface of the solder ball 30 at least a part of which is covered with the reinforcing portion 4 having a locally different height from the surface of the electronic component body 33 is likely to be smooth like the surface of a sphere, and there is almost no solder ball 30 having a deformed shape. This is because, when the solder ball 30 melts and is joined to the conductor 31, the force applied from the reinforcing portion 4 to the melted solder ball 30 becomes uneven, and the fluidity of the melted solder ball 30 is improved. That is, if the height of the reinforcing portion 4 is varied, the melted solder ball 30 is easily turned to one side, and is easily spherical. Therefore, the melted solder ball 30 is solidified in a state where a smooth surface is secured by surface tension, and the electronic component 3 having the solder ball 30 with less surface irregularities can be obtained.
In the mounted structure 1 according to the present embodiment, the electronic component 3 as described above is mounted on the substrate 2, and the electronic component 3 has the reinforcing portion 4 having a locally different height from the surface of the electronic component main body 33 and the solder ball 30 having a small number of irregularities on the surface. Therefore, when the solder ball 30 of the electronic component 3 is bonded to the base material 2, connection failure due to the concave portion on the surface of the solder ball 30 can be reduced. Further, the force applied to the melted solder ball 30 from the reinforcing portion 4 having a locally different height from the surface of the electronic component body 33 becomes uneven, and the fluidity of the melted solder ball 30 is improved. Therefore, the mounting structure 1 is improved in connection reliability and heat cycle reliability, and can be suitably used for mobile devices, and can also be suitably used for in-vehicle devices that require higher reliability than mobile devices.
(2) Details of
(2.1) electronic component
As shown in fig. 1, the electronic component 3 according to the present embodiment includes an electronic component body 33, conductors 31 formed on the electronic component body 33, a plurality of solder balls 30, and a plurality of reinforcing portions 4.
As the electronic component main body 33, a semiconductor chip package, an interposer, or the like can be exemplified. When the electronic component main body 33 is a semiconductor chip package, for example, the electronic component main body 33 is a surface-mount type semiconductor chip package. The semiconductor chip package is not particularly limited, but examples thereof include BGA (ball grid array), WLP (wafer level package), and the like. When the electronic component main body 33 is WLP, the electronic component main body 33 includes, for example, a silicon substrate having a rewiring layer provided on a surface of the electronic component main body 33 on the side where mounting is performed. When the electronic component main body 33 is a BGA, the electronic component main body 33 includes a package in which a bare chip mounted on a substrate is sealed with a sealing resin, for example. When the electronic component body 33 is an interposer, the electronic component body 33 is a circuit board such as a printed wiring board.
The conductor 31 is disposed on the surface of the electronic component body 33 on the mounting side. The surface of the electronic component main body 33 on the mounting side is a surface facing a surface of another member (for example, an upper surface of the substrate 2) when the electronic component 3 is mounted on the other member (for example, the substrate 2). That is, the surface of the electronic component body 33 on the mounting side refers to the surface of the electronic component body 33 facing the other members on which the electronic component 3 is mounted when viewed from the electronic component body 33. Since the conductor 31 is formed on the lower surface of the electronic component body 33, for example, the conductor 31 is exposed to the outside on the lower surface of the electronic component body 33. For example, when the electronic component 3 is WLP, the conductor 31 is a post electrically connected to the rewiring layer. For example, when the electronic component 3 is a BGA, the conductor 31 is an electrode pad electrically connected to a die. The structure of the electronic component body 33 and the conductor 31 is not limited to the above structure, and may be any structure suitable for the type of the electronic component 3.
The solder balls 30 are arranged on the conductors 31, respectively, and are electrically connected to the conductors 31. Thus, a joint portion (joint) 20 is formed between the solder ball 30 and the conductor 31. The solder ball 30 is not particularly limited, but may be made of SAC solder or tin-bismuth (Sn — Bi) solder, for example. The Sn — Bi based solder may contain at least one material selected from the group consisting of Ag, Ni, Fe, Ge, Cu, and In addition to Sn and Bi. In order to improve the mechanical properties of the Sn — Bi based solder, the Sn — Bi based solder preferably contains at least one material selected from the group consisting of Ag, Ni, Fe, and Ge.
The plurality of reinforcing portions (fillets) 4 respectively cover the conductors 31 and at least a part of the joint portion 20 of each solder ball 30. That is, the plurality of reinforcing portions 4 are provided in one-to-one correspondence with the solder balls 30. Further, each reinforcing portion 4 covers at least a part of the joint portion 20 of the corresponding solder ball 30 and conductor 31. Therefore, the reinforcing portion 4 can reinforce the joint portion 20 between the solder ball 30 and the conductor 31, and the connection reliability of the electronic component 3 can be improved. Here, only a part of the bonding portion 20 of the conductor 31 and each solder ball 30 may be covered, but it is preferable to cover the whole of the bonding portion 20 of the conductor 31 and each solder ball 30. Thereby, the joint portion 20 of the solder ball 30 and the conductor 31 is easily reinforced. The joint portion 20 is exposed over the entire circumference of the solder ball 30 around the center 35 of the solder ball 30 and the axis perpendicular to the surface of the electronic component body 33. Therefore, a part or the whole of the exposed portion of the joint portion 20 is covered with the reinforcement portion 4.
At least 1 of the plurality of reinforcing portions 4 has a locally different height from the surface of the electronic component body 33. Here, regarding the height of the reinforcing portion 4, a cross section passing through the tops (tip portions) 431 and 441 of the reinforcing portion 4 and the center of the solder ball 30 is assumed to be the length of a line perpendicular to the surface of the electronic component body 33 in the cross section. Therefore, the reinforcing portion 4 has a high portion and a low portion, and is not fixed in height in the circumferential direction of the solder ball 30 about the direction passing through the center of the solder ball 30 and perpendicular to the surface of the electronic component body 33.
In the electronic component 3 according to the present embodiment, the height of the reinforcing portion 4, which is locally different in height from the surface of the electronic component body 33, is 5% or more and 80% or less of the height of the solder ball 30. If the height of the reinforcing portion 4 is less than 5% of the height of the solder ball 30, the reinforcement of the joint portion 20 may be lowered. If the height of the reinforcing portion 4 exceeds 80% of the height of the solder ball 30, the reinforcing portion 4 may hit the surface of another member and be difficult to mount when the electronic component 3 is mounted on the other member by the solder ball 30. The height of the reinforcing portion 4 is preferably 10% or more and 70% or less of the height of the solder ball 30, and more preferably 20% or more and 60% or less of the height of the solder ball 30.
In the electronic component 3 according to the present embodiment, the difference between the highest portion 43 and the lowest portion 44 of the reinforcing portion 4 is 2% to 75% of the height of the solder ball 30. If the difference between the highest portion 43 and the lowest portion 44 of the reinforcing portion 4 is less than 2% of the height of the solder ball 30, the fluidity of the molten solder ball 30 is lowered, and it becomes difficult to obtain a solder ball 30 having less unevenness on the surface. If the difference between the highest portion 43 and the lowest portion 44 of the reinforcing portion 4 exceeds 75% of the height of the solder ball 30, the highest portion 43 becomes too high or the lowest portion 44 becomes too low, and the reinforcing performance of the joint portion 20 may be degraded or it may be difficult to mount the electronic component 3 on another member. As shown in fig. 3C, the height HB of the solder ball 30 is a cross section passing through the top of the solder ball 30 and the center 35 of the solder ball 30, and is a length of a line perpendicular to the surface of the electronic component body 33 in the cross section. Regarding the height HH of the highest portion 43 of the reinforcing portion 4, a cross section passing through the top 431 of the highest portion 43 of the reinforcing portion 4 and the center 35 of the solder ball 30 is assumed to be the length of a line perpendicular to the surface of the electronic component body 33 in this cross section. Further, regarding the height HL of the lowermost portion 44 of the reinforcing part 4, a cross section passing through the top 441 of the lowermost portion 44 of the reinforcing part 4 and the center 35 of the solder ball 30 is assumed to be the length of a line perpendicular to the surface of the electronic component body 33 in this cross section.
The reinforcing portion 4 is a cured product of an uncured resin material containing a resin. The resin may include a thermosetting resin or a photocurable resin. For example, the uncured resin material can comprise epoxy resins, phenolic resins, and benzoxazine compounds. Preferably, the uncured resin material further comprises an active agent.
As shown in fig. 2, in the electronic component 3 according to the present embodiment, the plurality of solder balls 30 includes a first solder ball 301 and a second solder ball 302. For example, the electronic component body 33 is formed in a rectangular shape when viewed from a direction perpendicular to the surface thereof, and the plurality of solder balls 30 are arranged in a direction parallel to each side of the electronic component body 33. The first solder ball 301 is located closer to the end 331 side of the electronic component body 33 than the second solder ball 302 is, as viewed from the center of the electronic component body 33. That is, the first solder ball 301 is located at a position closer to the outer side than the second solder ball 302. On the contrary, the second solder ball 302 is positioned closer to the direction (inner side) of the center of the electronic component body 33 than the first solder ball 301.
In the electronic component 3 according to the present embodiment, the plurality of reinforcing portions 4 include the first reinforcing portion 41 and the second reinforcing portion 42. That is, the first reinforcing portion 41 is provided corresponding to the first solder ball 301. The second reinforcing portions 42 are provided corresponding to the second solder balls 302. Further, the first reinforcing portion 41 covers the conductor 31 and at least a part of the joint portion 20 of the first solder ball 301. That is, a part or all of the conductor 31 and the exposed portion of the joint portion 20 of the first solder ball 301 are covered with the first reinforcing portion 41. Further, the second reinforcing portion 42 covers the conductor 31 and at least a part of the joint portion 20 of the second solder ball 302. That is, the conductor 31 and a part or all of the exposed portion of the joint portion 20 of the second solder ball 302 are covered with the second reinforcing portion 42. Therefore, in the electronic component 3 according to the present embodiment, the first reinforcing part 41 is located closer to the end 331 of the electronic component main body 33 than the second reinforcing part 42 is, as viewed from the center of the electronic component main body 33.
In the electronic component 3 according to the present embodiment, the first reinforcing portion 41 has a portion higher than the second reinforcing portion 42. Thus, the solder ball 30(301) on the side (outer side) of the end portion 331 of the electronic component main body 33 is less likely to have irregularities on the surface of the solder ball 30.
(2.2) method for producing electronic component
Fig. 3A to 3C illustrate a method for manufacturing the electronic component 3 according to the present embodiment. The method for manufacturing the electronic component 3 according to the present embodiment includes a step of bringing the solder ball 30 into contact with the conductor 31 formed on the electronic component main body 33. The method for manufacturing the electronic component 3 according to the present embodiment includes a step of covering at least a part of a contact portion between the solder ball 30 and the conductor 31 and disposing the uncured resin material 45. The method for manufacturing the electronic component 3 according to the present embodiment includes a step of heating the solder ball 30 and the uncured resin material 45 to melt the solder ball 30 and heat-cure the uncured resin material 45 to form the plurality of reinforcing portions 4.
First, an electronic component main body 33 including a plurality of conductors 31 is prepared, and an uncured resin material 45 having thermosetting property is disposed at a plurality of places so as to cover the conductors 31 (see fig. 3A). The method of disposing the uncured resin material 45 at a plurality of positions is not particularly limited, but can be performed by a printing method such as an ink jet method, a transfer method, or the like.
Then, the solder balls 30 are arranged above the conductors 31 so that the plurality of solder balls 30 are in contact with the uncured resin material 45, respectively (see fig. 3B). Next, in the state shown in fig. 3B, the plurality of solder balls 30 and the uncured resin material 45 at a plurality of positions are heated. The heating method is not particularly limited, but heating in a reflow furnace can be used, for example. In this case, for example, the plurality of solder balls 30 and the uncured resin material 45 at a plurality of positions can be heated along a reflow curve as shown in fig. 4.
Then, as shown in fig. 3C, heat curing is performed by the plurality of uncured resin materials 45, thereby forming a plurality of reinforcing portions 4. The molten solder balls 30 are brought into contact with the conductors 31 in a state of being brought into contact with the conductors 31, and then the molten solder balls 30 are solidified by heat dissipation to be joined to the conductors 31.
In the method of manufacturing the electronic component 3 according to the present embodiment, the melting point of the solder ball 30 is lower than the curing start temperature of the uncured resin material 45. That is, the uncured resin material 45 is maintained at a low viscosity until the solder ball 30 melts. Further, even if the solder ball 30 starts to melt, the viscosity of the uncured resin material 45 does not rise immediately, but after a while, the viscosity rises sharply. Thus, it is possible to cure the uncured resin material 45 after covering the conductor 31 and the joint portion 20 of the solder ball 30 with the uncured resin material 45. Thereby, the conductor 31 and the solder ball 30 can be connected well. Therefore, conduction failure between the conductor 31 and the solder ball 30 can be suppressed. Further, the joint portion 20 of the conductor 31 and the solder ball 30 can be covered with the cured product (the reinforcing portion 4) of the uncured resin material 45. Thus, the joint portion 20 of the conductor 31 and the solder ball 30 can be reinforced by the reinforcing portion 4.
Fig. 4 shows a temperature profile in the reflow step and a change in viscosity of the uncured resin material in the method for manufacturing the electronic component 3 according to the present embodiment. In the graph of fig. 4, the solid line indicates the heating temperature, and the broken line indicates the viscosity of the uncured resin material 45. The point X in the figure indicates the start of the curing reaction of the uncured resin material 45 and is not less than the melting point of the SAC solder (. gtoreq.220 ℃). The point Y in the figure is the completion of solidification and is above the melting point of the SAC solder (220 ℃ C.). In the "region 1", the uncured resin material 45 maintains a low viscosity until the solder ball 30 melts without thickening. In the "region 2", the oxide film is rapidly removed from the solder ball 30, and the viscosity is low enough not to inhibit the self-alignment. Further, in the "region 3", the curing reaction rapidly progresses below the melting point of the solder ball 30.
The uncured resin material 45 can include epoxy resins, phenolic resins, and benzoxazine compounds. Preferably, the uncured resin material further comprises an active agent.
The epoxy resin is preferably liquid at ordinary temperature. In this case, the epoxy resin and other components can be easily mixed in the uncured resin material 45. The term "liquid at ordinary temperature" means that the liquid has fluidity under atmospheric pressure and at an ambient temperature of 5 ℃ to 28 ℃ (particularly, about 20 ℃). In order to make the epoxy resin liquid at room temperature, the epoxy resin may contain only a component liquid at room temperature, or the epoxy resin may contain a component liquid at room temperature and a component not liquid at room temperature, or the epoxy resin may be made liquid at room temperature by a reactive diluent, a solvent, or the like.
Phenolic resins are compounds having phenolic hydroxyl groups. The phenolic hydroxyl groups are capable of reacting with the epoxy groups of the epoxy resin.
Benzoxazine compounds are compounds containing a dihydrobenzoxazine ring. The benzoxazine compound has various configurations according to the kind of raw materials. The benzoxazine compound can be synthesized from various phenolics, amines, formaldehyde, and the like, for example.
The active agent preferably contains at least one of an organic acid having a melting point of 130 ℃ or higher and 220 ℃ or lower and an amine having a melting point of 130 ℃ or higher and 220 ℃ or lower. In this case, the curing reaction of the epoxy resin can be made less likely to be promoted by the activator. Even when a solder having a melting point of about 200 ℃ or more is used, the oxide film of the solder ball can be removed before melting the solder. Further, the organic acid or the amine is melted before the solder ball is melted, so that the viscosity of the uncured resin material 45 can be lowered before the solder is melted, and the wettability of the uncured resin material 45 can be improved.
Further, as in the electronic component 3 according to the present embodiment, the heights of at least 1 of the plurality of reinforcing portions 4 from the surface of the electronic component main body 33 are locally different, and when such a reinforcing portion 4 is formed, the electronic component main body 33 is locally warped or the electronic component main body 30 is entirely tilted, thereby controlling the flow of the uncured resin material 45. As a result, the uncured resin material 45 is cured in a locally unbalanced state, and the reinforcing portion 4 having a locally different height from the surface of the electronic component body 33 can be formed. Therefore, the first reinforcing part 41 can be formed by locally warping the electronic component main body 33 or tilting the electronic component main body 33 as a whole to control the flow of the uncured resin material 45. When the electronic component main body 33 is locally warped, the midpoint of the electronic component main body 33 can be convex or concave.
(2.3) mounting Structure
As shown in fig. 1, a mounting structure 1 according to the present embodiment has an electronic component 3 mounted on a substrate 2. The substrate 2 has a plurality of conductors 21 on the surface. The plurality of conductors 21 are formed on the surface of the substrate 2 on the side where the electronic component 3 is mounted. That is, the surface on which the plurality of conductors 21 are formed is a surface facing the surface on the side where the electronic component body 33 is mounted. A plurality of solder balls 30 of the electronic component 3 are bonded to the surfaces of the plurality of conductors 21, respectively.
The base material 2 is a circuit board or the like, and is, for example, a mother board, a package board, or a package board. The circuit board is an insulating board made of glass epoxy, polyimide, polyester, ceramic, or the like. The electronic component 3 is an electronic component according to the present embodiment, and is, for example, a semiconductor chip package. More specifically, the electronic component 3 is, for example, a flip-chip type chip such as BGA (ball grid array), LGA (land grid array), or CSP (chip size package). The electronic component 3 may be a chip of a PoP (package on package) type. Therefore, the mounting structure 1 is formed as a semiconductor package or the like.
(2.4) method for producing mounting Structure
In the method of manufacturing the mounted structure 1 according to the present embodiment, the solder balls 30 of the electronic component 3 are melted and joined to the base material 2. That is, first, the base material 2 including the plurality of conductors 21 is prepared. Then, the electronic component 3 provided with the plurality of solder balls 30 is prepared. Then, the plurality of solder balls 30 are heated in a state where the solder balls 30 are brought into contact with the conductors 21, respectively. The heating method is not particularly limited, but heating in a reflow furnace can be used, for example. Thus, the plurality of solder balls 30 of the electronic component 3 are melted to be in contact with the base 2, and then cooled to solidify the plurality of solder balls 30, thereby bonding the conductors 21 and the solder balls 30, respectively.
(3) Modification example
The embodiment is merely one of various embodiments of the present disclosure. The embodiment can be variously modified according to design or the like as long as the object of the present disclosure can be achieved.
In the above embodiment, the portion outside the first reinforcing part 41 (the portion on the end 331 side of the electronic component main body 33) is formed as the high portion 43, but the present invention is not limited thereto. For example, as shown in fig. 5, the inner portion of the first reinforcing portion 41 (the central portion of the electronic component main body 33) may be formed as a high portion 43. In this case, the outer portion of the first reinforcing portion 41 is formed as a low-height portion 44.
Examples
1. Compounding of uncured resin materials
An uncured resin material was prepared using the following ingredients.
Epoxy resin (EPICLON835 LV): a bisphenol F-type epoxy resin which is liquid at 25 ℃ and has an epoxy equivalent of 160 to 170 and a viscosity of 2000 to 2500 mPa.s at 25 ℃ and is available under the product name EPICLON835LV from DIC.
Phenol resin (MEH 8000H): a phenolic resin which is liquid at 25 ℃ and has a viscosity of 1500 to 3500 mPas at 25 ℃, and a product number of MEH-8000H manufactured by Kogyo Kabushiki Kaisha.
Benzoxazine compound (P-d): a p-d type benzoxazine compound available from Shikoku Kabushiki Kaisha.
Active agent (adipic acid): adipic acid having a melting point of 152 to 155 ℃ and available from Tokyo chemical industries, Ltd.
Then, 20 parts by weight of an epoxy resin, 35 parts by weight of a phenol resin, 35 parts by weight of a benzoxazine compound and 10 parts by weight of an activator were mixed to prepare an uncured resin material.
Further, the solder ball 30 is bonded to the conductor 31 formed on the surface of the electronic component main body 33, and the reinforcing portion 4 made of the uncured resin material 45 is formed, thereby manufacturing a semiconductor chip (electronic component 3).
2. Evaluation of
(1) Spherical shape of solder
The shape of the solder ball was confirmed by an electron microscope or the like. Then, the following evaluation was performed.
A: the depth of the recess is 2 μm or less.
B: the depth of the recess is 5.0 μm or more and less than 10 μm.
C: the depth of the recess is 10 μm or more.
(2) 2-time installation performance
The electrical resistance value when the semiconductor chip was mounted on the substrate was measured. Then, the following evaluation was performed.
A: the resistance value is less than 5 omega.
B: the resistance value is 5 Ω or more and less than 10 Ω.
C: the resistance value is 10 omega or more.
(3) Post-installation reliability
The case where the solder balls 30 were bonded using a flux instead of the above-described uncured resin material and the results of the thermal cycle test were compared. Then, the following evaluation was performed.
S: compared with the flux, the ratio is more than 2 times.
A: compared with the welding flux, the reliability is better by more than 30 percent.
B: the same level as flux.
C: inferior to solder.
(4) Comprehensive judgment
A: all of the above (1) to (3) are A or S.
B: in the above (1) to (3), 1 is B.
C: in the above (1) to (3), 1 is C.
[ Table 1]
Figure BDA0003538287950000111
Figure BDA0003538287950000112
(conclusion)
As described above, the electronic component (3) according to claim 1 includes the electronic component main body (33), the conductor (31) formed on the electronic component main body (33), the plurality of solder balls (30), and the plurality of reinforcing portions (4). A plurality of solder balls (30) are arranged on the conductors (31) and are electrically connected to the conductors (31). The plurality of reinforcing portions (4) cover at least a part of the conductors (31) and the joint portions (20) of the solder balls (30). At least 1 of the plurality of reinforcing portions (4) has a locally different height from the surface of the electronic component body (33).
According to the first aspect, the molten solder ball (30) has good fluidity, and a concave portion is less likely to be formed on the surface of the solidified solder ball (30).
In the electronic component (3) according to claim 2, in the case of claim 1, the surface of the electronic component body (33) is a surface of the electronic component body (33) on a side where the electronic component body is mounted.
According to the second aspect, the molten solder ball (30) has good fluidity, and a concave portion is less likely to be formed on the surface of the solidified solder ball (30).
In the electronic component (3) according to claim 3, in the 1 st or 2 nd aspect, the plurality of solder balls (30) include a first solder ball (301) and a second solder ball (302). The plurality of reinforcing portions (4) include a first reinforcing portion (41) that covers at least a part of a joint portion (20) between the conductor (31) and the first solder ball (301), and a second reinforcing portion (42) that covers at least a part of a joint portion (20) between the conductor (31) and the second solder ball (302). The first reinforcement part (41) has a portion higher than the second reinforcement part (42).
According to the 3 rd aspect, the first solder ball (301) that has melted has good fluidity due to the portion of the first reinforcing portion (41) that is higher than the second reinforcing portion (42), and there is an advantage in that a concave portion is less likely to occur on the surface of the first solder ball (301) after solidification.
In the electronic component (3) according to claim 4, in the electronic component (3), the first reinforcing portion (41) is located closer to the end portion (331) side of the electronic component (3) than the second reinforcing portion (42) as viewed from the center of the electronic component main body (33).
According to the 4 th aspect, there is an advantage that a concave portion is less likely to be generated on the surface of the first solder ball (301) located on the end portion (331) side of the electronic component (3).
An electronic component (3) according to claim 5 is characterized in that, in any one of the aspects 1 to 4, the height of the reinforcing portion (4) having a locally different height from the surface of the electronic component body (33) is 5% or more and 80% or less of the height of the solder ball (30). The difference between the highest portion (43) and the lowest portion (44) of the reinforcing portion (4) is 2% to 75% of the height of the solder ball (30).
According to the aspect 5, there is an advantage that the reinforcing performance of the reinforcing portion 4 to the solder ball 30 and the mountability of the electronic component 3 can be prevented from being damaged.
A method for manufacturing an electronic component (3) according to claim 6 includes a step of bringing a solder ball (30) into contact with a conductor (31) formed on an electronic component body (33). The method for manufacturing an electronic component (3) according to claim 6 includes a step of covering at least a part of a contact portion between the solder ball (30) and the conductor (31) and disposing an uncured resin material (45). The method for manufacturing an electronic component (3) according to claim 6 includes a step of heating the solder ball (30) and the uncured resin material (45) to melt the solder ball (30), and heat-curing the uncured resin material (45) to form a plurality of reinforcing portions (4). The solder ball (30) has a melting point lower than the curing start temperature of the uncured resin material (45). At least 1 of the plurality of reinforcing portions (4) has a locally different height from the surface of the electronic component body (33).
According to the 6 th aspect, the molten solder ball (30) has good fluidity, and a concave portion is less likely to be formed on the surface of the solidified solder ball (30).
The mounting structure (1) according to claim 7 is a mounting structure in which the electronic component (3) according to any one of claims 1 to 5 is mounted on a base material (2).
According to the 7 th aspect, there is an advantage that the reliability of connection between the electronic component (3) and the substrate (2) can be improved.
A method for manufacturing a mounted structure (1) according to claim 8 is a method for melting a solder ball (30) of an electronic component (3) according to any one of claims 1 to 5 and bonding the solder ball to a base material (2).
According to the 8 th aspect, there is an advantage that the reliability of connection between the electronic component (3) and the substrate (2) can be improved.
Description of the symbols
1 mounting a structure;
2, a base material;
3 an electronic component;
30 solder balls;
301 a first solder ball;
302 a second solder ball;
31 a conductor;
33 an electronic component body;
4 a reinforcing part;
41 a first reinforcement;
42 a second reinforcement;
43 highest portion;
44 the lowest portion;
45 of uncured resin material.

Claims (8)

1. An electronic component includes:
an electronic component body;
a conductor formed on the electronic component body;
a plurality of solder balls disposed on the conductors and electrically connected to the conductors; and
a plurality of reinforcing portions covering at least a part of the joining portion of the conductor and each of the solder balls,
at least 1 of the plurality of reinforcing portions is locally different in height from the surface of the electronic component body.
2. The electronic component of claim 1, wherein,
the surface of the electronic component body is a surface of the electronic component body on a side where mounting is performed.
3. The electronic component according to claim 1 or 2,
the plurality of solder balls includes a first solder ball and a second solder ball,
the plurality of reinforcing portions include a first reinforcing portion that covers at least a part of a joined portion of the conductor and the first solder ball, and a second reinforcing portion that covers at least a part of a joined portion of the conductor and the second solder ball,
the first reinforcement portion has a portion higher than the second reinforcement portion.
4. The electronic component of claim 3, wherein,
the first reinforcing portion is located closer to an end portion side of the electronic component body than the second reinforcing portion is, as viewed from a center of the electronic component body.
5. The electronic component according to any one of claims 1 to 4,
the height of the reinforcing portion locally different from the height of the surface of the electronic component body is 5% or more and 80% or less of the height of the solder ball,
the difference between the highest portion and the lowest portion of the reinforcing portion is 2% or more and 75% or less of the height of the solder ball.
6. A method of manufacturing an electronic component, comprising:
a step of bringing a solder ball into contact with a conductor formed on an electronic component body;
a step of disposing an uncured resin material so as to cover at least a part of a contact portion between the solder ball and the conductor; and
a step of forming a plurality of reinforcing portions by heating the solder ball and the uncured resin material to melt the solder ball and thermally curing the uncured resin material,
the melting point of the solder ball is lower than the curing start temperature of the uncured resin material,
at least 1 of the plurality of reinforcing portions is locally different in height from the surface of the electronic component body.
7. A mounting structure in which the electronic component according to any one of claims 1 to 5 is mounted on a base material.
8. A method for manufacturing a mounted structure, wherein the solder ball of the electronic component according to any one of claims 1 to 5 is melted and bonded to a base material.
CN202080063532.3A 2019-09-24 2020-08-27 Electronic component, method for manufacturing electronic component, mounted structure, and method for manufacturing mounted structure Pending CN114375494A (en)

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JP2019-173516 2019-09-24
PCT/JP2020/032408 WO2021059851A1 (en) 2019-09-24 2020-08-27 Electronic component, manufacturing method of electronic component, mounting structure, and manufacturing method of mounting structure

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