JP2021045838A - Manufacturing method of chip - Google Patents

Abstract

To restrain chipping of an obverse surface and a reverse surface.SOLUTION: A manufacturing method of a chip has a member preparation step ST1 of preparing a support plate and a cover plate, a workpiece unit forming step ST2 of forming a workpiece unit of close-contacting/fixing the support plate by high temperature wax of softening at a first temperature to one surface of a workpiece and close-contacting/fixing the cover plate by low temperature wax of softening at a second temperature to the other surface of the workpiece, a dividing step ST3 of dividing a cutting blade into a plurality of chips by cutting-in up to the middle in the thickness direction of the support plate by holding the support plate by a chuck table, a tape sticking step ST4 of sticking an adhesive tape to the cover plate, a cover plate separation step ST5 of separating the cover plate from a workpiece by heating the workpiece unit to the second temperature and a workpiece separating step ST6 of separating the workpiece from the support plate.SELECTED DRAWING: Figure 2

Description

The present invention relates to a method for manufacturing a chip.

As a processing method for dividing various plate-shaped workpieces such as semiconductor wafers, ceramic plates, and glass plates into individual chips, a method of dividing using a cutting blade made of a cutting grindstone is known (for example, Patent Document 1). And Patent Document 2).

In the above-mentioned processing method, it is common to form a work piece unit in which the work piece is fixed to the opening of the annular frame with a dicing tape so that the work piece can be easily transported even after the insert is divided. Is.

Japanese Unexamined Patent Publication No. 2016-076671 Japanese Unexamined Patent Publication No. 2013-229450

However, when the workpiece is divided into chips with a cutting blade while being fixed with the dicing tape, if the chip size is small, the adhesive strength of the dicing tape is weak and the chips scatter, or the dicing tape is soft. The processing method shown in 1 has a problem that a large chip (also referred to as chipping) is likely to occur on the back surface side through which the cutting blade cuts through.

Therefore, as in the processing method shown in Patent Document 2, a processing method in which the workpiece is closely fixed to a hard support plate such as glass, carbon plate, or plastic plate with wax and cut is used to prevent chipping. The technique of suppressing is also known. In the case of the processing method shown in Patent Document 2, there is an effect that chipping on the back surface side, which is particularly likely to occur, can be suppressed, but there remains a problem that chipping on the front surface side cannot be suppressed.

The present invention has been made in view of such a problem, and an object of the present invention is to provide a method for manufacturing a chip capable of suppressing chipping on the front surface and the back surface.

In order to solve the above-mentioned problems and achieve the object, the method for manufacturing a chip of the present invention is a method for manufacturing a chip in which a plate-shaped workpiece is cut with a cutting blade and divided into chips. A plate-shaped support plate having a flat support surface for supporting the work piece, a member preparation step for preparing a cover plate having a size covering the surface of the work piece and being made of the same material as the work piece, and one of the work pieces. The plate-shaped support plate is closely fixed to a surface with a high-temperature wax that softens at a first temperature, and the plate-shaped support plate is covered with a low-temperature wax that softens at a second temperature lower than the first temperature on the other surface of the workpiece. The work piece unit forming step for forming a work piece unit having at least a three-layer structure in which the plates are closely fixed, and the support plate of the work piece unit are held by a chuck table, and the cutting blade is held on the cover plate side. The work piece is completely cut and divided into a plurality of chips by cutting halfway in the thickness direction of the support plate, and after the division step is performed, the cover plate is fixed to the work piece and divided. After performing the tape sticking step of sticking the adhesive tape and the tape sticking step, the workpiece unit is heated to a temperature higher than the second temperature and lower than the first temperature to soften the low temperature wax. The cover plate peeling step of peeling the cover plate from the work piece by peeling the adhesive tape to which the cover plate is attached from the work piece unit, and the cover plate peeling off. It is characterized by comprising a work piece peeling step in which a work piece unit is heated to a temperature higher than the first temperature or washed with a solvent to peel off the work piece divided into chips from the support plate. ..

In the method of manufacturing the chip, the cover plate is translucent, and in the dividing step, a street formed on the other surface of the workpiece is detected through the cover plate, and the street is detected along the street. The cutting blade may be cut into the workpiece.

In the method for producing a chip, the cover plate may be thinner than the workpiece.

The present invention has the effect of suppressing chipping on the front and back surfaces.

FIG. 1 is a perspective view showing an example of a work piece to be processed in the method for manufacturing a chip according to the first embodiment. FIG. 2 is a flowchart showing a flow of a chip manufacturing method according to the first embodiment. FIG. 3 is a perspective view of a support plate prepared in the member preparation step of the chip manufacturing method shown in FIG. FIG. 4 is a perspective view of the cover plate prepared in the member preparation step of the chip manufacturing method shown in FIG. FIG. 5 is a perspective view of the workpiece unit formed in the workpiece unit forming step of the chip manufacturing method shown in FIG. FIG. 6 is a perspective view in which the workpiece unit shown in FIG. 5 is supported by an adhesive tape attached to the annular frame at the opening of the annular frame. FIG. 7 is a side view schematically showing a state in which the cutting apparatus is performing alignment in the dividing step of the chip manufacturing method shown in FIG. FIG. 8 is a side view schematically showing a state in which the cutting apparatus is cutting the workpiece in the dividing step of the chip manufacturing method shown in FIG. FIG. 9 is a side view schematically showing the tape application step of the chip manufacturing method shown in FIG. FIG. 10 is a side view schematically showing the cover plate peeling step of the chip manufacturing method shown in FIG. FIG. 11 is a side view schematically showing a work piece peeling step of the chip manufacturing method shown in FIG. FIG. 12 is a side view schematically showing a work piece peeling step of the chip manufacturing method according to the modified example of the first embodiment.

An embodiment (embodiment) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiments. In addition, the components described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Further, the configurations described below can be combined as appropriate. In addition, various omissions, substitutions or changes of the configuration can be made without departing from the gist of the present invention.

[Embodiment 1]
The method for manufacturing a chip according to the first embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing an example of a work piece to be processed in the method for manufacturing a chip according to the first embodiment. FIG. 2 is a flowchart showing a flow of a chip manufacturing method according to the first embodiment.

The chip manufacturing method according to the first embodiment is a method of dividing the workpiece 1 shown in FIG. 1 into individual chips 2. The workpiece 1 to be processed in the chip manufacturing method according to the first embodiment is a glass substrate made of translucent glass. The workpiece 1 is formed in a flat plate shape having a rectangular planar shape. In the workpiece 1, one surface 3 and the other surface 4 on the back side of the one surface 3 are formed flat and parallel to each other. The other surface 4 is the surface of the workpiece 1.

In the first embodiment, the workpiece 1 is a glass substrate, but in the first embodiment, a rectangular package substrate having a plurality of devices sealed with a resin or a ceramics substrate made of ceramics is also available. good. Further, in the present invention, the workpiece 1 may be a wafer such as a disk-shaped semiconductor wafer or an optical device wafer using silicon, sapphire, gallium or the like as a base material.

Further, in the first embodiment, the workpiece 1 has a street 5 shown by a dotted line in FIG. 1 for dividing the workpiece 1 into individual chips 2 on the other surface 4. In the first embodiment, the street 5 is a line virtually set on the other surface 4 of the workpiece 1, and in the first embodiment, the street 5 is set in a grid pattern. The workpiece 1 is divided into individual chips 2 by cutting along the street 5.

As shown in FIG. 2, the chip manufacturing method according to the first embodiment includes a member preparation step ST1, a workpiece unit forming step ST2, a division step ST3, a tape sticking step ST4, and a cover plate peeling step ST5. And the work piece peeling step ST6.

(Member preparation step)
FIG. 3 is a perspective view of a support plate prepared in the member preparation step of the chip manufacturing method shown in FIG. FIG. 4 is a perspective view of the cover plate prepared in the member preparation step of the chip manufacturing method shown in FIG. The member preparation step ST1 is a step of preparing the support plate 10 shown in FIG. 3 and the cover plate 20 shown in FIG.

In the member preparation step ST1, the support plate 10 shown in FIG. 3 and the cover play shown in FIG. 4 are prepared. The support plate 10 is formed in a flat plate shape having a rectangular planar shape and being larger than the planar shape of the workpiece 1. The support plate 10 is made of a hard material such as glass, carbon, or a plus tip, and the upper surface 11 is a support surface that supports the workpiece 1. The upper surface 11 of the support plate 10 is formed flat. For this purpose, the support plate 10 has an upper surface 11 which is a flat support surface for supporting the workpiece 1 as shown in FIG. Further, in the first embodiment, the lower surface 12 of the support plate 10 is formed flat and parallel to the upper surface 11.

The cover plate 20 has at least a size that covers the other surface 4 of the work piece 1, and more specifically, covers the product area excluding the non-product end material area near the outer circumference, and the work piece 1 and the work piece 1. It is made of the same material. Further, the cover plate 20 preferably has a size that does not protrude from the workpiece 1. This is to avoid the possibility that if the cover plate 20 protrudes from the workpiece 1 and is fixed, the outer circumference of the cover plate 20 floating in the air will be damaged by cutting, and the workpiece 1 will also be damaged. .. In the first embodiment, the cover plate 20 is made of glass and has translucency. In the first embodiment, the cover plate 20 is formed in a flat plate shape having a rectangular planar shape and the same size as the planar shape of the workpiece 1. Further, in the first embodiment, as shown in FIG. 4, the cover plate 20 has both the upper surface 21 and the lower surface 22 formed flat and parallel to each other. In the first embodiment, the cover plate 20 is thinner than the workpiece 1.

(Workpiece unit formation step)
FIG. 5 is a perspective view of the workpiece unit formed in the workpiece unit forming step of the chip manufacturing method shown in FIG. FIG. 6 is a perspective view in which the workpiece unit shown in FIG. 5 is supported by an adhesive tape attached to the annular frame at the opening of the annular frame.

The work piece unit forming step ST2 is a step of forming the work piece unit 30 shown in FIG. As shown in FIG. 5, in the workpiece unit 30, the support plate 10 is closely fixed to one surface 3 of the workpiece 1 with the high temperature wax 6, and the low temperature wax 7 is applied to the other surface 4 of the workpiece 1. The cover plate 20 is closely fixed and formed into at least a three-layer structure. The high-temperature wax 6 and the low-temperature wax 7 are solids that are hard and smooth at room temperature, and are manufactured of a thermoplastic resin or the like. The high temperature wax 6 softens at the first temperature. The cold wax 7 softens at a second temperature, which is lower than the first temperature. In the first embodiment, the first temperature is 130 ° C. and the second temperature is 80 ° C.

In the first embodiment, in the workpiece unit forming step ST2, the support plate 10 is placed on a hot plate set to a first temperature (130 ° C. in the first embodiment) or higher, and the support plate 10 is heated. In the work piece unit forming step ST2, the high temperature wax 6 is applied to the upper surface 11 of the support plate 10, one surface 3 of the work piece 1 is placed on the high temperature wax 6, and air bubbles do not enter the high temperature wax 6. While being careful, the workpiece 1 is brought into close contact with the support plate 10 with the high temperature wax 6. In the work piece unit forming step ST2, the temperature of the hot plate is adjusted to a temperature equal to or higher than the second temperature (80 ° C. in the first embodiment) lower than the first temperature, and the other surface 4 of the work piece 1 is adjusted. Apply low temperature wax 7 to the. In the work piece unit forming step ST2, the lower surface 22 of the cover plate 20 on the low temperature wax 7 is placed, and the cover plate 20 is placed on the work piece 1 with the low temperature wax 7 while being careful not to allow air bubbles to enter the low temperature wax 7. Make them stick together. In the work piece unit forming step ST2, the work piece unit 30 is removed from the hot plate. In this way, in the first embodiment, the workpiece unit 30 shown in FIG. 5 is formed. In the first embodiment, the upper surface 11, the lower surface 12, the one surface 3 of the workpiece 1, the other surface 4, the upper surface 21 and the lower surface 22 of the cover plate 20 are positioned in parallel with each other.

Further, in the first embodiment, in the workpiece unit forming step ST2, as shown in FIG. 6, the outer peripheral edge of the disk-shaped adhesive tape 8 having a larger planar shape than the support plate 10 is attached to the annular frame 9. At the same time, the lower surface 12 of the support plate 10 of the workpiece unit 30 is attached to the central portion of the adhesive tape 8. In the present invention, in the division step ST3, the workpiece unit 30 may be vacuum-fixed directly to the chuck table 41 without using the adhesive tape 8.

(Split step)
FIG. 7 is a side view schematically showing a state in which the cutting apparatus is performing alignment in the dividing step of the chip manufacturing method shown in FIG. FIG. 8 is a side view schematically showing a state in which the cutting apparatus is cutting the workpiece in the dividing step of the chip manufacturing method shown in FIG.

In the division step ST3, the support plate 10 of the workpiece unit 30 is sucked and held by the chuck table 41 of the cutting device 40 shown in FIG. 7, and the cutting blade 42 shown in FIG. 8 is sucked and held from the cover plate 20 side in the thickness direction of the support plate 10. This is a step of completely cutting the workpiece 1 and dividing it into a plurality of chips 2 by cutting halfway. In the division step ST3, the cutting device 40 sucks and holds the lower surface 12 side of the support plate 10 on the holding surface 43 of the chuck table 41 via the adhesive tape 8.

In the division step ST3, as shown in FIG. 7, the cutting apparatus 40 images the workpiece 1 through the cover plate 20 with the image pickup unit 44, and based on the image obtained by the image pickup unit 44. Street 5 is detected and alignment is performed to align the street 5 with the cutting blade 42. Since the cover plate 20 has translucency in the first embodiment, the street 5 is detected through the cover plate 20 in the division step ST3. In the present invention, the image pickup unit 44 may be a camera that captures visible light or an infrared camera.

In the split step ST3, as shown in FIG. 8, the cutting apparatus 40 covers the cutting blade 42 along each street 5 while relatively moving the workpiece 1 and the cutting blade 42 along the street 5. The workpiece 1 is cut until it reaches the support plate 10, and the workpiece 1 is divided into individual chips 2. In the division step ST3, the cutting device 40 cuts the cutting blade 42 into the workpiece 1 along all the streets 5, cuts the workpiece 1 with the cutting blade 42 along the street 5, and individually. It is divided into chips 2.

(Tape application step)
FIG. 9 is a side view schematically showing the tape application step of the chip manufacturing method shown in FIG. The tape sticking step ST4 is a step of sticking the adhesive tape 50 to the cover plate 20 fixed and divided to the workpiece 1 after the division step ST3 is performed.

In the first embodiment, in the tape attachment step ST4, the adhesive tape 50 having a larger planar shape than the cover plate 20 is attached to the cover plate 20 of the workpiece unit 30, and the adhesive tape 8 supports the workpiece unit 30. It is peeled off from the plate 10. In the first embodiment, in the tape sticking step ST4, as shown in FIG. 9, the lower surface 12 side of the support plate 10 of the workpiece unit 30 is placed on the heater 51.

(Cover plate peeling step)
FIG. 10 is a side view schematically showing the cover plate peeling step of the chip manufacturing method shown in FIG. In the cover plate peeling step ST5, after the tape sticking step ST4 is performed, the workpiece unit 30 is heated to a temperature equal to or higher than the second temperature and lower than the first temperature to soften the low temperature wax 7, and then the cover plate is peeled off. This is a step of peeling the cover plate 20 from the work piece 1 by peeling the adhesive tape 50 attached to the work piece 20 from the work piece unit 30.

In the cover plate peeling step ST5, the heating heater 51 is heated to a temperature equal to or higher than the second temperature and lower than the first temperature, and the workpiece unit 30 is heated to a temperature equal to or higher than the second temperature and lower than the first temperature via the support plate 10. Heat to a temperature below the temperature of. In the first embodiment, in the cover plate peeling step ST5, the heating heater 51 is heated to a second temperature of 80 ° C. Then, in the cover plate peeling step ST5, the low temperature wax 7 softens. In the cover plate peeling step ST5, after the low-temperature wax 7 is softened, the adhesive tape 50 is peeled from the workpiece unit 30 as shown in FIG. Then, in the cover plate peeling step ST5, the cover plate 20 is peeled from the work piece 1 together with the adhesive tape 50 while the work piece 1 is fixed to the support plate 10.

(Workpiece peeling step)
FIG. 11 is a side view schematically showing a work piece peeling step of the chip manufacturing method shown in FIG. The work piece peeling step ST6 is a step of washing the work piece unit 30 from which the cover plate 20 has been peeled off with the solvent 60 shown in FIG. 11 and peeling off the work piece 1 divided into chips 2 from the support plate 10. is there.

In the first embodiment, in the work piece peeling step ST6, as shown in FIG. 11, the work piece unit 30 is immersed in the solvent 60 in the solvent tank 61. In the first embodiment, in the work piece peeling step ST6, the work piece unit 30 is immersed in the solvent 60 by positioning the support plate 10 downward. In the first embodiment, the solvent 60 is a liquid that dissolves the high temperature wax 6 and the low temperature wax 7, and is, for example, acetone. In the first embodiment, when the workpiece unit 30 is immersed in the solvent 60 for a predetermined time, the waxes 6 and 7 are melted and the outer surface of the chip 2 is washed. Then, the washed tip 2 and the support plate 10 are taken out from the solvent tank 61.

As described above, the method for manufacturing a chip according to the first embodiment is a method in which the workpiece 1 is cut by a cutting blade 42 and divided into chips 2. Further, in the method for manufacturing a chip according to the first embodiment, one surface 3 and the other of the workpiece 1 are cut by cutting the cutting blade 42 with the support plate 10 and the cover plate 20 which are adhered to the workpiece 1 with waxes 6 and 7. The occurrence of chipping (hereinafter referred to as chipping) of the surface 4 of the surface 4 is suppressed.

As described above, in the method for manufacturing a chip according to the first embodiment, the support plate 10 is closely fixed to one surface 3 of the workpiece 1 with high temperature wax 6 and covered with low temperature wax 7 on the other surface 4. A cover plate 20 made of the same material as the work piece 1 is closely fixed, and the work piece unit 30 formed in a so-called three-layer structure is divided into individual chips 2 by a cutting blade 42. As a result, the method for manufacturing the chip 2 has the effect that not only the chipping of one surface 3 but also the chipping of the other surface 4 can be suppressed, and the chipping of the front surface and the back surface of the workpiece 1 can be suppressed.

Further, in the chip manufacturing method, the support plate 10 and the cover plate 20 are fixed with waxes 6 and 7 that soften in different temperature zones, so that they can be individually peeled off. Therefore, a wax that softens in the same temperature zone is used. When it is used, it is necessary to sort the cover plate 20 and the chip 2 which are divided into a plurality of parts, which has the effect of eliminating the need for such sorting work.

[Modification example]
A method for manufacturing a chip according to a modified example of the first embodiment of the present invention will be described with reference to the drawings. FIG. 12 is a side view schematically showing a work piece peeling step of the chip manufacturing method according to the modified example of the first embodiment. In FIG. 12, the same parts as those in the first embodiment are designated by the same reference numerals, and the description thereof will be omitted.

In the modified example, in the work piece peeling step ST6, the work piece unit 30 from which the cover plate 20 has been peeled off is heated to a temperature equal to or higher than the first temperature, and the work piece 1 divided into chips 2 is peeled off from the support plate 10. It is a step to do. In the modified example, in the work piece peeling step ST6, after the cover plate peeling step ST5, the heating heater 51 shown in FIG. 11 is heated to a temperature equal to or higher than the first temperature, and the work piece unit 30 is moved through the support plate 10. Heat to a temperature above the first temperature.

In the modified example, in the work piece peeling step ST6, the heating heater 51 is heated to the first temperature of 130 ° C. Then, in the work piece peeling step ST6, the high temperature wax 6 is softened. In the work piece peeling step ST6, after the high temperature wax 6 is softened, the chips 2 are sequentially picked up from the support plate 10 with a well-known picker, and the work piece 1 is peeled off from the support plate 10. Then, the waxes 6 and 7 on the surface of the chip 2 are washed and removed in the solvent tank 61.

In the method of manufacturing the chip according to the modified example, the support plate 10 is closely fixed to one surface 3 of the workpiece 1 with high temperature wax 6 and the cover of the same material as the workpiece 1 is fixed to the other surface 4 with low temperature wax 7. Since the work piece unit 30 formed in a so-called three-layer structure by closely fixing the plate 20 is divided into individual chips 2 by the cutting blade 42, chipping on the front surface and the back surface of the work piece 1 is performed as in the first embodiment. It has the effect of being able to be suppressed.

The present invention is not limited to the above embodiment. That is, it can be modified in various ways without departing from the gist of the present invention.

1 Work piece 2 Chip 3 One side 4 The other side (surface)
5 Street 6 High temperature wax 7 Low temperature wax 10 Support plate 11 Top surface (support surface)
20 Cover plate 30 Work piece unit 41 Chuck table 42 Cutting blade 50 Adhesive tape ST1 Member preparation step ST2 Work piece unit formation step ST3 Division step ST4 Tape attachment step ST5 Cover plate peeling step ST6 Work piece peeling step

Claims (3)

It is a method of manufacturing a chip that cuts a plate-shaped workpiece with a cutting blade and divides it into chips.
A plate-shaped support plate having a flat support surface for supporting the work piece, a member preparation step for preparing a cover plate having a size covering the surface of the work piece and made of the same material as the work piece,
The plate-shaped support plate is closely fixed to one surface of the workpiece with a high-temperature wax that softens at the first temperature, and softens to the other surface of the workpiece at a second temperature lower than the first temperature. A work unit forming step of forming a work unit having at least a three-layer structure in which the cover plate is closely fixed with a low-temperature wax.
The support plate of the work piece unit is held by a chuck table, and the work piece is completely cut and divided into a plurality of chips by cutting the cutting blade from the cover plate side to the middle in the thickness direction of the support plate. Split step and
After performing the division step, a tape attachment step of attaching an adhesive tape to the divided cover plate fixed to the work piece and
After performing the tape sticking step, the workpiece unit is heated to a temperature above the second temperature and below the first temperature to soften the low temperature wax, and then the cover plate is stuck. A cover plate peeling step of peeling the cover plate from the work piece by peeling the adhesive tape from the work piece unit,
A work piece peeling step in which the work piece unit from which the cover plate has been peeled off is heated to a temperature higher than the first temperature or washed with a solvent to peel off the work piece divided into chips from the support plate. A method of manufacturing a chip comprising. The cover plate is translucent, and in the dividing step, a street formed on the other surface of the work piece is detected through the cover plate, and the cutting blade is placed along the street along the work piece. The method for manufacturing a chip according to claim 1, wherein the chip is cut into. The method for producing a chip according to claim 1 or 2, wherein the cover plate is thinner than the workpiece.

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