JP2021042401A - Substrate holder, and plating device - Google Patents

Abstract

To provide a substrate holder capable of preventing its support base (body) from swelling in the plane direction orthogonal to the thickness direction thereof when it is immersed in a heated plating solution.SOLUTION: A substrate holder 10 according to the present invention is a substrate holder 10 to be immersed in a plating solution, and comprises a first holding member 11 comprising a plate-shaped body 40, and a second holding member 12 which is constituted to grip a substrate Wf placed on the front side of the body 40 with the first holding member 11, in which the body 40 comprises a bottomed recessed part 200 recessed frontward, on its back side.SELECTED DRAWING: Figure 8

Description

The present invention relates to a substrate holder and a plating apparatus.

Plating equipment is used to form a metal thin film on the surface of a substrate. In the plating apparatus, a substrate holder that holds a substrate such as a semiconductor wafer in a detachable manner may be used. Then, in the plating apparatus, the substrate held in the substrate holder is immersed in the plating solution, and a voltage is applied to the substrate to plate the surface of the substrate.

An example of a substrate holder is described in Patent Document 1. As shown in FIG. 3, Patent Document 1 describes a first holding member having a rectangular flat plate-shaped support base, and a second holding member attached to the first holding member so as to be openable and closable via a hinge. A substrate holder having a holder seal member is disclosed. The substrate holder can hold the substrate detachably by sandwiching the outer peripheral portion of the substrate between the first holding member and the second holding member. Further, when the substrate is held by the substrate holder, the holder seal member comes into contact with the plate surface of the support base of the first holding member to seal between the first holding member and the second holding member. .. This prevents the plating solution from entering the inside of the substrate holder when the substrate holder is immersed in the plating solution.

Japanese Unexamined Patent Publication No. 2013-155405

The substrate holder can be immersed in various plating solutions depending on the type of plating applied to the substrate to be held. For example, when the substrate is gold-plated, the substrate holder is immersed in the gold plating solution. When plating the substrate, the temperature of the gold plating solution is raised to about 65 ° C., so that the substrate holder immersed in the gold plating solution also rises to the same temperature as the gold plating solution. Therefore, the support base undergoes thermal expansion and is deformed in the thickness direction or the plane direction orthogonal to the thickness direction. In particular, when the support base is deformed in the plane direction, the contact surface of the support base with which the holder seal member is in contact is displaced relatively large. When the contact surface is displaced, the holder seal member may be deformed due to the frictional force from the contact surface. The deformation of the holder seal member adversely affects the sealing performance, and in some cases, the plating solution may invade the inside of the substrate holder.

Further, such a problem is not a problem that can occur only in the substrate holder immersed in the gold plating solution. For example, when the substrate holder is immersed in a plating solution whose temperature is higher than the atmospheric temperature, thermal expansion of the support base may occur, and the above-mentioned problems may occur. That is, the above-mentioned problem is a problem that can commonly occur in a substrate holder immersed in a plating solution whose temperature is higher than the atmospheric temperature.

Therefore, in view of the above-mentioned problems, an object of the present invention is to suppress expansion in a plane direction orthogonal to the thickness direction of the support base (body) when immersed in a heated plating solution. And to provide plating equipment.

The substrate holder according to the present invention is a substrate holder immersed in a plating solution, and sandwiches a first holding member having a plate-shaped body and a substrate located on the front side of the body together with the first holding member. The body includes a second holding member configured as described above, and the body has a bottomed recess on the back side that is recessed on the front side.

According to the substrate holder according to the present invention, the body has a recess. Since the recess is configured to be recessed with respect to the adjacent portion surrounding the recess, the plate thickness is thinner than that of the adjacent portion. Therefore, in order for the recess to expand in the plane direction orthogonal to the thickness direction of the body, the recess applies a force to the adjacent portion to displace the adjacent portion in the plane direction. However, since the thickness of the recess is thin, when the recess thermally expands, the recess bends in the thickness direction due to the reaction force from the adjacent portion before applying a sufficient force to the adjacent portion. Mmm. As a result, the volume of the body expanded in the plane direction is converted into the deflection in the thickness direction. As a result, the force applied by the recess to the adjacent portion is reduced as compared with the case where the recess does not bend in the thickness direction. Then, the displacement of the adjacent portion in the plane direction is reduced, and the body is less likely to expand in the plane direction. That is, this substrate holder can suppress the expansion of the body in the plane direction.

It is an overall layout drawing of the plating apparatus which uses the substrate holder which concerns on this embodiment. It is a perspective view of a board holder. It is a back side perspective view of a substrate holder. It is a partial cross-sectional perspective view of a substrate holder. It is the enlarged part side sectional view of the substrate holder. It is the enlarged part side sectional view of the substrate holder. It is a top view which shows the position of the hook ring in the state where the hook ring is not engaged with the hook pin. It is a top view which shows the position of the hook ring in the state where the hook ring is engaged with the hook pin. It is a back side perspective view of a substrate holder. It is sectional drawing of the substrate holder.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the drawings described below, the same or corresponding components are designated by the same reference numerals and duplicate description will be omitted. FIG. 1 is an overall layout view of a plating apparatus using the substrate holder according to the present embodiment. As shown in FIG. 1, the plating apparatus 100 is roughly divided into a load / unload unit 170A for loading the substrate into the substrate holder 10 or unloading the substrate from the substrate holder 10 and a processing unit 170B for processing the substrate. Be done.

The load / unload section 170A is provided with three hoops (Front-Opening Unified Pod: FOUP) 102, an aligner 121, and a spin rinse dryer 120. The hoop 102 stores a plurality of substrates such as semiconductor wafers in multiple stages. The aligner 121 aligns the positions of the orientation flat and the notch of the substrate in a predetermined direction. The spin rinse dryer 120 rotates the plated substrate at high speed to dry it. Near the spin rinse dryer 120, a fixing unit 135 on which the substrate holder 10 is placed and the substrate is attached / detached is provided. At the center of these units 102, 121, 120, and 135, a substrate transfer device 122 including a transfer robot that transfers a substrate between these units is arranged.

The fixing unit 135 is configured so that two substrate holders 10 can be mounted on the fixing unit 135. In the fixing unit 135, the substrate is delivered between one substrate holder 10 and the substrate transfer device 122, and then the substrate is delivered between the other substrate holder 10 and the substrate transfer device 122.

The processing unit 170B of the plating apparatus 100 includes a stocker 124, a pre-wet tank 126, a pre-soak tank 128, a first cleaning tank 130a, a blow tank 132, a second cleaning tank 130b, and a plating tank 150. .. In the stocker 124, the substrate holder 10 is stored and temporarily placed. In the pre-wet tank 126, the substrate is immersed in pure water. In the pre-soak tank 128, the oxide film on the surface of the conductive layer such as the seed layer formed on the surface of the substrate is removed by etching. In the first cleaning tank 130a, the substrate after pre-soaking is cleaned together with the substrate holder 10 with a cleaning liquid (pure water or the like). In the blow tank 132, the substrate is drained after cleaning. In the second cleaning tank 130b, the plated substrate is cleaned together with the substrate holder 10 with a cleaning liquid. The stocker 124, the pre-wet tank 126, the pre-soak tank 128, the first cleaning tank 130a, the blow tank 132, the second cleaning tank 130b, and the plating tank 150 are arranged in this order.

The plating tank 150 has, for example, a plurality of plating cells 134 including an overflow tank. Each plating cell 134 houses the substrate holder 10 holding the substrate in a vertically oriented posture, and immerses the substrate in the plating solution. Further, the plating cell 134 has been heated to a temperature higher than the atmospheric temperature of the plating solution. By applying a voltage between the substrate and the anode in the plating cell 134, the surface of the substrate is plated with copper plating, gold plating, or the like.

The plating device 100 is located on the side of each of these devices, and has a board holder transfer device 140 that transports the substrate holder 10 together with the substrate between these devices, for example, by adopting a linear motor method. The substrate holder transfer device 140 has a first transporter 142 and a second transporter 144. The first transporter 142 is configured to transport the substrate between the fixing unit 135, the stocker 124, the pre-wet tank 126, the pre-soak tank 128, the first cleaning tank 130a, and the blow tank 132. The second transporter 144 is configured to transport the substrate between the first cleaning tank 130a, the second cleaning tank 130b, the blow tank 132, and the plating tank 150. Specifically, the first transporter 142 and the second transporter 144 convey the substrate holder 10 in a state where the in-plane direction of the held substrate faces the vertical direction. In other words, the first transporter 142 and the second transporter 144 convey the substrate holder 10 holding the substrate in a vertically oriented state.

In another embodiment, the plating apparatus 100 comprises only one of the first transporter 142 and the second transporter 144, and one of the transporters is the fixing unit 135, the stocker 124, and the pre-wet tank 126. , The substrate may be transported between the pre-soak tank 128, the first cleaning tank 130a, the second cleaning tank 130b, the blow tank 132, and the plating tank 150.

Next, the substrate holder 10 shown in FIG. 1 will be described in detail. FIG. 2 is a perspective view of the substrate holder 10. As shown in FIG. 2, the substrate holder 10 has a plate-shaped first holding member 11 and a second holding member 12 configured to sandwich the substrate together with the first holding member 11. The first holding member 11 has, for example, a plate-shaped body 40 made of PTFE (polytetrafluoroethylene) from the viewpoint of chemical resistance. The body 40 serves as a housing that constitutes the outer surface of the first holding member 11. The substrate Wf is placed in the substantially central portion of the first holding member 11 of the substrate holder 10. The side where the substrate Wf is exposed is the front side of the substrate holder 10. In other words, the substrate Wf is located on the front side of the body 40.

A pair of hands 15 serving as support portions for suspending the substrate holder 10 from the plating tank 150 or the like are connected to the end portion of the first holding member 11 of the substrate holder 10. Stocker 1 shown in FIG.
In 24, the substrate holder 10 is vertically suspended and supported by hooking the hand 15 on the upper surface of the peripheral wall of the stocker 124. Further, the first holding member 11 has a pair of openings 16 for gripping the substrate holder transport device 140 when transporting the substrate holder 10.

Further, one of the hands 15 is provided with an external contact portion 18 that is electrically connected to an external power source (not shown). The external contact portion 18 is electrically connected to a base plate 42 and a hook ring 45 (see FIG. 3), which will be described later. The external contact portion 18 comes into contact with the power supply terminal provided on the plating tank 150 side when the substrate holder 10 is suspended and supported by the plating tank 150. Note that FIG. 2 shows a part of the rod member 60, which will be described later.

FIG. 3 is a perspective view of the back surface side of the substrate holder 10. In FIG. 3, the body 40 of the first holding member 11 is shown transparently. As shown in FIG. 3, the first holding member 11 includes a bus bar 41, a base plate 42, a substrate mounting base 43, and a hook ring 45.

The bus bar 41 is configured to electrically connect the external contact portion 18 and the base plate 42.

The base plate 42 is a disk made of a conductor such as SUS (stainless steel). The base plate 42 has a plurality of substantially fan-shaped openings along the circumferential direction and is electrically connected to the bus bar 41. The base plate 42 is configured to radiate the current supplied from the bus bar 41 toward the outer periphery of the base plate 42 and supply the current to the hook ring 45. The board mounting table 43 is located on the front side of the body 40 and supports the board Wf.

The hook ring 45 is provided between the body 40 and the base plate 42, and as will be described later, the second holding member 12 is fixed to the first holding member 11 by engaging the hook pin 26 (see FIG. 5A). It is configured to do. Further, the hook ring 45 is formed of a conductor such as SUS, and is configured to allow a current supplied from the base plate 42 to flow through the hook pin 26.

The first holding member 11 further has an internal passage 49 for a rod inside. In the present specification, the internal space of the substrate holder 10 is the inside of the substrate holder 10 formed by the substrate-side sealing member 21 and the holder-side sealing member 22 (see FIG. 4) of the second holding member 12, which will be described later. Refers to the closed space of.

FIG. 4 is a partial cross-sectional perspective view of the substrate holder 10. In the illustrated example, the substrate Wf is omitted. As shown in FIG. 4, the second holding member 12 has a seal ring holder 20, a substrate-side seal member 21, a holder-side seal member 22, an inner ring 23, and a contact 24. The seal ring holder 20 is a substantially plate-shaped ring. The seal ring holder 20 is a member that is exposed when the second holding member 12 is attached to the first holding member 11, and is formed of, for example, PEEK (polyetheretherketone) from the viewpoint of a plating resistant liquid.

The inner ring 23 is a ring-shaped member attached to the seal ring holder 20 of the second holding member 12 by a fixing member (not shown). A plurality of contacts 24 are fixed to the inner surface of the inner ring 23 in the radial direction by screws 25. The inner ring 23 is formed of a conductor such as SUS in order to energize the contact 24. The plurality of contacts 24 are configured to come into contact with the substrate Wf along the peripheral edge of the substrate Wf when the second holding member 12 is attached to the first holding member 11.

When the second holding member 12 is attached to the first holding member 11, the substrate side sealing member 21 is attached.
It is configured to be in contact with the substrate Wf along the peripheral edge of the substrate Wf, and seals between the substrate Wf and the second holding member 12. The holder-side seal member 22 is configured to come into contact with the body 40 of the first holding member 11 when the second holding member 12 is attached to the first holding member 11, and the body 40 and the second holding member 12 are connected to each other. Seal between. Both the substrate-side seal member 21 and the holder-side seal member 22 are formed in a substantially annular shape, and are tightly fixed to the inner peripheral side and the outer peripheral side of the seal ring holder 20 by sandwiching them between the seal ring holder 20 and the inner ring 23, respectively. To. As a result, the substrate-side sealing member 21 and the holder-side sealing member 22 come into contact with the substrate Wf and the body 40, respectively, to form a closed space (internal space) inside the substrate holder 10. The portion of the annular body 40 with which the holder-side seal member 22 contacts can be referred to as the contact surface 81. In other words, the body 40 has an annular contact surface 81.

The body 40 of the first holding member 11 has an annular groove 57 for accommodating the hook ring 45. The hook ring 45 is configured to be movable along the groove 57 in the circumferential direction of the hook ring 45.

Next, the process of fixing the second holding member 12 to the first holding member 11 will be described. 5A and 5B are sectional views on the enlarged portion side of the substrate holder 10. Specifically, FIG. 5A is a diagram showing a state in which the first holding member 11 and the second holding member 12 are not fixed to each other. FIG. 5B is a diagram showing a locked state in which the first holding member 11 and the second holding member 12 are fixed to each other, and the substrate side sealing member 21 and the holder side sealing member 22 are in contact with the substrate Wf and the body 40, respectively.

As shown in FIG. 5A, the second holding member 12 has a hook pin 26 configured to be engageable with the hook ring 45. The hook pin 26 is formed of a conductor such as SUS in order to allow the current supplied from the hook ring 45 to flow through the inner ring 23. One end of the hook pin 26 is fixed to the inner ring 23. Further, a large diameter portion 26a for locking is formed at the other end of the hook pin 26.

The base plate 42 of the first holding member 11 has an opening 42b through which the pin 26 can pass. Further, the body 40 has a hole 40a through which the large diameter portion 26a for locking the pin 26 can pass. As shown in FIG. 5A, the hook ring 45 has a through hole 45a through which the large diameter locking portion 26a of the hook pin 26 can pass.

When the substrate Wf is held by the substrate holder 10, the fixing unit 135 shown in FIG. 1 presses the second holding member 12 against the first holding member 11. At this time, the large diameter portion 26a for locking the hook pin 26 passes through the opening 42b and the through hole 45a of the hook ring 45, and is located in the hole 40a of the body 40. Further, as shown in FIG. 5B, the substrate-side sealing member 21 contacts the surface of the substrate Wf, and the holder-side sealing member 22 contacts the body 40. As a result, the substrate-side sealing member 21 can appropriately seal between the substrate Wf surface and the second holding member 12, and the holder-side sealing member 22 can appropriately seal between the body 40 and the second holding member 12. Can be sealed.

As shown in FIG. 5B, the hook ring 45 has a through hole 45b through which the large diameter locking portion 26a of the hook pin 26 cannot pass. The through hole 45a and the through hole 45b communicate with each other and are continuously formed as shown in FIGS. 6A and 6B described later. In the fixing unit 135 shown in FIG. 1, the hook ring 45 is moved in the circumferential direction in a state where the large diameter portion 26a for locking has passed through the through hole 45a of the hook ring 45.

As a result, as shown in FIG. 5B, the large diameter portion 26a for locking of the hook pin 26 engages with the through hole 45b of the hook ring 45, and the large diameter portion 26a for locking comes out of the through hole 45b of the hook ring 45. It disappears. In this way, the substrate holder 10 can hold the substrate Wf by bringing the substrate-side sealing member 21 and the holder-side sealing member 22 into contact with the substrate Wf and the body 40, respectively. In the present embodiment, as shown in FIG. 5B, the substrate-side sealing member 21 contacts the substrate Wf, the holder-side sealing member 22 contacts the first holding member 11, and the first holding member 11 and the second holding member 11 come into contact with each other. The state in which the 12 and the 12 are fixed to each other is called a locked state.

Next, the path of the current in the locked state shown in FIG. 5B will be described. A current flows from a power source (not shown) to the base plate 42 via a bus bar 41 (see FIG. 3) connected to the external contact portion 18. In the locked state shown in FIG. 5B, since the hook ring 45 and the hook pin 26 are in contact with each other, a current is applied to the contact 24 in contact with the substrate Wf through the base plate 42, the hook ring 45, the hook pin 26, and the inner ring 23. Flows.

Next, the moving mechanism of the hook ring 45 will be described. FIG. 6A is a plan view showing the position of the hook ring 45 in a state where the hook ring 45 is not engaged with the hook pin 26. FIG. 6B is a plan view showing the position of the hook ring 45 in a state where the hook ring 45 is engaged with the hook pin 26. As shown in the figure, the through hole 45a of the hook ring 45 is substantially circular, the through hole 45b has an elongated slit shape, and the through hole 45a and the through hole 45b communicate with each other to form one through hole. The shapes of the through hole 45a and the through hole 45b are arbitrary. Further, in the present embodiment, the hook ring 45 has a through hole 45a and a through hole 45b, but instead of these, a notch that exhibits the same function may be provided.

Further, the substrate holder 10 has a rod member 60 extending into the rod internal passage 49 shown in FIG. 3 and an intermediate member 61 connected to the hook ring 45. One end of the rod member 60 is located outside the substrate holder 10 as shown in FIGS. 2 and 3, and the other end is pivotally coupled to one end of the intermediate member 61 as shown in FIGS. 6A and 6B. The rod member 60 is configured to be movable in the axial direction. Specifically, the fixing unit 135 shown in FIG. 1 can operate the rod member 60 located outside the substrate holder 10 to move the rod member 60 in the axial direction.

The intermediate member 61 is, for example, an elongated plate-shaped member, one end of which is pivotally coupled to the rod member 60 and the other end of which is pivotally coupled to the hook ring 45. In the present embodiment, the rod member 60 and the intermediate member 61 are directly connected, but the rod is not limited to this, and another member is interposed between the rod member 60 and the intermediate member 61 to make the rod. The member 60 and the intermediate member 61 may be indirectly connected. Both the rod member 60 and the intermediate member 61 form a link mechanism for moving the hook ring 45 in the circumferential direction.

When engaging the hook pin 26 with the hook ring 45, first, the hook pin 26 is inserted into the through hole 45a of the hook ring 45 as shown in FIG. 6A. Specifically, when the substrate holder 10 is in the locked state shown in FIG. 5B, the large diameter portion 26a for locking of the hook pin 26 is passed through the through hole 45a.

Subsequently, the fixing unit 135 moves the rod member 60 downward from the state shown in FIG. 6A. As a result, the axial movement of the rod member 60 is converted into the circumferential movement of the hook ring 45 via the intermediate member 61. Specifically, the hook ring 45 is guided by the groove 57 formed in the body 40 and moves in the circumferential direction. As a result, as shown in FIG. 6B, the hook pin 26 inserted into the through hole 45a is located in the through hole 45b. Specifically, the large diameter portion 26a for locking cannot be pulled out from the through hole 45b of the hook ring 45. As described above, the substrate holder 10 can move the hook ring 45 in the circumferential direction from the outside of the substrate holder 10 by the link mechanism shown in FIGS. 6A and 6B.

FIG. 7 is a perspective view of the substrate holder 10 as viewed from the back side. Further, FIG. 8 is a cross-sectional view of the substrate holder 10. Note that FIG. 8 is also a cross-sectional view when the substrate holder 10 is cut by a virtual plane described later. The substrate holder 10 according to the present embodiment can be immersed in a gold plating solution or various other heated plating solutions depending on the substrate Wf to be held. For example, since the gold plating solution is heated to about 65 ° C., the substrate holder 10 can also be heated by the gold plating solution. Therefore, when the substrate holder 10 is immersed in the gold plating solution, the body 40 constituting the outer surface of the first holding member 11 undergoes thermal expansion. More specifically, the thermal expansion of the body 40 involves deformation in the thickness direction (arrow 901 direction in FIG. 8) and plane direction orthogonal to the thickness direction 901 (arrow 902 direction in FIG. 8). Includes variants. Here, when the body 40 is deformed in the plane direction 902, the contact surface 81 of the body 40 in contact with the holder-side seal member 22 is displaced as compared with the case where the body 40 is displaced in the thickness direction 901. When the contact surface 81 is displaced, the holder-side seal member 22 may be deformed due to the frictional force from the contact surface 81. Then, the deformation of the holder-side sealing member 22 adversely affects the sealing performance, and there is a risk that the plating solution may invade the inside of the substrate holder 10.

Therefore, in the present embodiment, as shown in FIG. 7, the body 40 has a bottomed recess 200 recessed on the front side on the back side. Since the recess 200 is configured to be recessed with respect to the adjacent portion 202 surrounding the recess 200, the plate thickness is thinner than that of the adjacent portion 202 (see FIG. 8). Therefore, in order for the recess 200 to expand in the plane direction 902 of the body 40, the recess 200 applies a force to the adjacent portion 202 to displace the adjacent portion 202 in the plane direction 902. However, since the plate thickness of the recess 200 is thin, when the recess 200 thermally expands, the recess 200 receives a reaction force from the adjacent portion 202 before applying a sufficient force to the adjacent portion 202, so that the recess 200 is subjected to a reaction force in the thickness direction 901. It bends so as to warp. As a result, the volume of the body 40 expanded in the plane direction 902 is converted into the flexure in the thickness direction 901. As a result, the force applied by the recess 200 to the adjacent portion 202 is smaller than when the recess 200 does not bend in the thickness direction 901. Then, the displacement of the adjacent portion 202 in the plane direction 902 is reduced, and the body 40 is less likely to expand in the plane direction 902. That is, the substrate holder 10 can suppress the expansion of the body 40 in the plane direction 902. As the deflection of the recess 200 in the thickness direction 901 increases, the volume of the body 40 expanded in the plane direction 902 due to thermal expansion is converted more into the deflection in the thickness direction 901. That is, as this deflection increases, the thermal expansion of the body 40 in the plane direction 902 decreases.

Further, as described above, the body 40 has a contact surface 81 with the annular holder-side seal member 22. The recess 200 is located at the position of the back surface of the region of the body 40 surrounded by the annular contact surface 81. Therefore, when the body 40 is thermally expanded, the recess 200 suppresses the deformation of the region surrounded by the annular contact surface 81 in the plane direction 902 due to the thermal expansion. As a result, the contact surface 81 is less likely to be displaced, the holder-side seal member 22 in contact with the contact surface 81 is deformed, and the above-mentioned problem in which the plating solution enters the inside of the substrate holder 10 is less likely to occur.

Further, when the recess 200 bends in the thickness direction 901, if the recess 200 bends so that the substrate holder 10 swells (the recess 200 bends from the front side to the back side), the substrate holder 10 is transported. For example, the recess 200 of the substrate holder 10 may interfere with other members of the plating apparatus 100. Therefore, in the substrate holder 10, the recess 200 is formed so as to be recessed from the back surface side to the front surface side. Further, when the substrate holder 10 is immersed in the plating solution, the recess 200 receives the hydraulic pressure of the plating solution from the back surface side. Therefore, when the recess 200 bends, it tends to bend so as to warp from the back side to the front side. That is, when the recess 200 bends, the recess 200 tends to bend inside the substrate holder 10. That is, the substrate holder 10 can prevent interference with other members of the plating apparatus 100 during transportation even when the recess 200 is bent.

Further, as shown in FIG. 7, the recess 200 has a flat bottom surface 204 and an inclined surface 206 that surrounds the bottom surface 204 and is inclined with respect to the bottom surface 204. Then, the plate thickness of the inclined surface 206 portion of the body 40 becomes thicker as the distance from the bottom surface 204 increases.

When the body 40 thermally expands, the portion of the inclined surface 206 of the body 40 thermally expands in the extending direction of the inclined surface 206. Therefore, the portion of the inclined surface 206 of the body 40 applies a force acting in the extending direction of the inclined surface 206 to the portion of the bottom surface 204 of the body 40. This force includes a force directed toward the thickness direction 901 of the body 40 and a force directed toward the plane direction 902. Then, the force toward the thickness direction 901 is transmitted from the portion of the inclined surface 206 to the portion of the bottom surface 204, and the portion of the bottom surface 204 is bent in the thickness direction 901. At this time, by acting a force toward the plane direction 902, the force toward the thickness direction 901 is transmitted to a wider portion of the bottom surface 204, and the deflection increases.

Here, as the angle α formed by the bottom surface 204 and the inclined surface 206 approaches 90 degrees, the component of the force applied by the portion of the inclined surface 206 to the portion of the bottom surface 204 in the plane direction decreases. In particular, when the recess 200 is stepped, there is no force in the plane direction 902. In this case, the force in the thickness direction 901 is not transmitted to the wide portion of the bottom surface 204, and the bending is reduced. That is, the substrate holder 10 can increase the deflection of the recess 200 as compared with the stepped substrate holder when the body 40 thermally expands.

Further, it is preferable that the recess 200 is configured so that the angle α formed by the bottom surface 204 and the inclined surface 206 is 45 degrees or less. As a result, the component of the force applied by the portion of the inclined surface 206 in the plane direction 902 increases as compared with the case where the angle α formed is close to 90 degrees. Therefore, the force that the portion of the inclined surface 206 pushes the portion of the bottom surface 204 in the thickness direction 901 is transmitted to a wider portion of the bottom surface 204 by the force acting in the plane direction 902. As a result, the entire bottom surface 204 tends to bend so as to warp in the thickness direction 901. Therefore, the substrate holder 10 can bend the portion of the bottom surface 204 more by setting the angle α formed by the bottom surface 204 and the inclined surface 206 to 45 degrees or less.

The angle α formed by the bottom surface 204 and the inclined surface 206 is the cross section of the bottom surface 204 and the inclined surface 206 when the substrate holder 10 is cut in a direction orthogonal to the bottom surface 204, as shown in FIG. It means the angle between and. Further, as shown in FIG. 8, when the inclined surface 206 includes the straight portion 226 and the curved portion 224, the angle formed by the bottom surface 204 and the straight portion 226 is the angle formed by the bottom surface 204 and the inclined surface 206. It becomes α.

Further, in the substrate holder 10, it is preferable that the recess 200 is formed so that the thickness of the bottom surface 204 of the body 40 is 3 mm or less. In this case, since the plate thickness of the bottom surface 204 portion of the body 40 is relatively thin, the bottom surface 204 portion is likely to bend. As a result, the substrate holder 10 can bend the portion of the bottom surface 204 more.

Further, the body 40 is formed with a first fixing hole 208 and a second fixing hole 210 located so as to sandwich the recess 200 in the plane direction 902 of the body 40. Further, the first fixing hole 208 and the second fixing hole 210 are located inside the hook ring 45. Then, the base plate 42 is fixed by the fastener 228 at the position where the first fixing hole 208 and the second fixing hole 210 are formed. Further, as described above, the body 40 is made of PTFE, and the base plate 42 is made of SUS or the like. Here, since PTFE has a larger coefficient of thermal expansion than SUS, the base plate 42 is less likely to expand thermally than the body 40 when immersed in a heated plating solution such as a gold plating solution. Therefore, the base plate 42 regulates the expansion of the body 40 in the direction in which the first fixing hole 208 and the second fixing hole 210 are separated from each other. As a result, the body 40 is less likely to expand in the plane direction 902.

Further, when the body 40 is thermally expanded, the base plate 42 receives a force in a direction in which the first fixing hole 208 and the second fixing hole 210 are separated from each other through the first fixing hole 208 and the second fixing hole 210. It will be. Here, in the substrate holder 10, the first fixing hole 208 and the second fixing hole 210 are formed so as to sandwich the recess 200. Therefore, when the body 40 thermally expands, the recess 200 also thermally expands in the direction in which the first fixing hole 208 and the second fixing hole 210 are separated from each other. However, since the thickness of the recess 200 is thin, when the recess 200 is thermally expanded, it bends in the thickness direction 901 due to the reaction force from the base plate 42. As a result, the volume of the body 40 in which the first fixing hole 208 and the second fixing hole 210 expand in the direction away from each other is converted into the bending in the thickness direction 901. As a result, the force applied to the base plate 42 by the recess 200 is reduced and the force transmitted by the body 40 to the base plate 42 is reduced as compared with the case where the recess 200 does not bend in the thickness direction 901.

Further, in the substrate holder 10, a space R is formed between the body 40 and the base plate 42 between the first fixing hole 208 and the second fixing hole 210.

If a space R is not formed between the body 40 and the base plate 42, the body 40 abuts on the base plate 42 and cannot bend toward the base plate 42 when the body 40 thermally expands. On the other hand, in the substrate holder 10, a space R is formed. Therefore, the recess 200 of the body 40 can be bent so as to warp toward the space R between the body 40 and the base plate 42. That is, the substrate holder 10 can release the volume of the body 40 increased by thermal expansion to the space R.

Further, FIG. 8 is a cross-sectional view when the substrate holder 10 is cut by a virtual plane as described above. Here, in the present specification, the virtual plane means a plane passing through the first central axis 209 of the first fixing hole 208 and the second central axis 211 of the second fixing hole 210. On the premise of the above, referring to FIG. 8, in the virtual plane, the space R extends at least from the back side of one inclined surface 206 to the back side of the other inclined surface 206. Specifically, in the virtual plane, the base plate 42 has a first contact point 212 and a second contact point 214 that come into contact with the body 40. The first contact point 212 and the second contact point 214 are points located at the inner (center axis L side) end portions of the contact surface of the base plate 42 with the body 40 in the virtual plane, respectively. Further, the recess 200 has a first connection point 216 and a second connection point 218 in a virtual plane. The first connection point 216 is a point where the inclined surface 206 closer to the first central axis 209 than the second central axis 211 and the bottom surface 204 intersect, and the second connection point 218 is from the first central axis 209. Is also a point where the inclined surface 206 near the second central axis 211 and the bottom surface 204 intersect. A space R is formed in a portion surrounded by the first contact point 212, the second contact point 214, the base plate 42, and the body 40. Further, the first contact point 212 is located between the first central axis 209 and the first boundary line 220 that is parallel to the first central axis 209 and passes through the first connection point 216. On the other hand, the second contact point 214 is located between the second central shaft 211 and the second boundary line 222 which is parallel to the second central shaft 211 and passes through the second connection point 218.

Since the substrate holder 10 has the above-described configuration, a space R is formed at a position where the inclined surface 206 extends. Further, as described above, when the body 40 undergoes thermal expansion, the portion of the inclined surface 206 applies a force in the direction in which the inclined surface 206 extends with respect to the portion of the bottom surface 204 of the body 40. Therefore, the space R exists on the back surface side of the portion of the bottom surface 204 to which the force is applied from the portion of the inclined surface 206. As a result, the position where the force directly transmitted from the inclined surface 206 to the thickness direction 901 can be bent in the thickness direction 901, and the space R does not exist on the back surface side of the position where the force is directly transmitted. Also, the entire bottom surface 204 can be bent in the thickness direction 901.

[Additional Notes]
Some or all of the above embodiments may also be described, but not limited to:

(Appendix 1)
The substrate holder according to Appendix 1 is a substrate holder immersed in a plating solution, and sandwiches a first holding member having a plate-shaped body and a substrate located on the front side of the body together with the first holding member. The body includes a second holding member configured as described above, and the body has a bottomed recess on the back side that is recessed on the front side.

According to the substrate holder according to Appendix 1, the body has a recess. Since the recess is configured to be recessed with respect to the adjacent portion surrounding the recess, the plate thickness is thinner than that of the adjacent portion. Therefore, in order for the recess to expand in the plane direction orthogonal to the thickness direction of the body, the recess applies a force to the adjacent portion to displace the adjacent portion in the plane direction. However, since the thickness of the recess is thin, when the recess thermally expands, the recess bends in the thickness direction due to the reaction force from the adjacent portion before applying a sufficient force to the adjacent portion. Mmm. As a result, the expanded volume of the body expanded in the plane direction is converted into the deflection in the thickness direction. As a result, the force applied by the recess to the adjacent portion is reduced as compared with the case where the recess does not bend in the thickness direction. Then, the displacement of the adjacent portion in the plane direction is reduced, and the body is less likely to expand in the plane direction. That is, this substrate holder can suppress the expansion of the body in the plane direction.

(Appendix 2)
The substrate holder according to Appendix 2 is an annular holder-side seal for contacting the body and the second holding member and sealing between the body and the second holding member in the substrate holder according to Appendix 1. Further members are provided.

According to the substrate holder according to Appendix 2, the holder-side sealing member can seal between the body and the second holding member.

(Appendix 3)
According to the substrate holder according to the appendix 3, in the substrate holder according to the appendix 2, the recess is located at a position on the back surface of the region of the body surrounded by the contact surface of the body with the holder-side seal member. doing.

If the contact surface where the holder seal member is in contact with the body is displaced, the holder seal member may be deformed due to the frictional force from the contact surface. Then, the deformation of the holder seal member adversely affects the seal performance, and there is a risk that the plating solution may invade the inside of the substrate holder. However, according to the substrate holder according to Appendix 3, the recess is located on the back surface of the body region surrounded by the contact surface with the holder-side sealing member. Therefore, when the body is thermally expanded, deformation in the plane direction due to thermal expansion of the region surrounded by the contact surface with the holder-side seal member is suppressed by the recess. As a result, the contact surface of the body with the holder-side seal member is less likely to be displaced, and the holder-side seal member in contact with the contact surface is less likely to be deformed to cause a problem that the plating solution invades the inside of the substrate holder.

(Appendix 4)
According to the substrate holder according to the appendix 4, in the substrate holder according to any one of the appendices 1 to 3, the recess has a flat bottom surface and an inclination that surrounds the bottom surface and is inclined with respect to the bottom surface. It has a surface, and the plate thickness of the inclined surface portion of the body becomes thicker as the distance from the bottom surface increases.

According to the substrate holder according to Appendix 4, the recess has an inclined surface. When the body thermally expands, the portion of the inclined surface of the body thermally expands in the direction in which the inclined surface extends. Therefore, the inclined surface portion of the body applies a force acting in the extending direction of the inclined surface to the bottom surface portion of the body. This force includes a force directed in the thickness direction of the body and a force directed in the plane direction. Then, the force directed in the thickness direction is transmitted from the inclined surface portion to the bottom surface portion, and the bottom surface portion is bent in the thickness direction. At this time, the force directed in the plane direction acts, so that the force directed in the thickness direction is transmitted to a wider portion of the bottom surface, and the bending increases.

Here, as the angle formed by the bottom surface and the inclined surface approaches 90 degrees, the component of the force applied by the inclined surface portion to the bottom surface portion in the plane direction decreases. In particular, when the recess is stepped, there is no force in the plane direction. In this case, the force in the thickness direction is not transmitted to the wide portion of the bottom surface, and the bending is reduced. That is, when the body expands thermally, the substrate holder can increase the deflection of the recess as compared with the substrate holder having a stepped recess.

(Appendix 5)
According to the substrate holder according to the appendix 5, in the substrate holder according to the appendix 4, the angle formed by the bottom surface and the inclined surface is 45 degrees or less.

According to the substrate holder according to Appendix 5, since the angle formed by the bottom surface and the inclined surface is 45 degrees or less, the component in the plane direction of the force applied by the inclined surface portion forms more than when the angle formed is close to 90 degrees. To increase. Therefore, the force that the inclined surface portion pushes the bottom surface portion in the thickness direction is transmitted to a wider range portion of the bottom surface by the force acting in the plane direction. As a result, the entire bottom surface tends to bend so as to warp in the thickness direction. Therefore, in this substrate holder, the bottom surface portion can be bent more by setting the angle formed by the bottom surface and the inclined surface to 45 degrees or less.

(Appendix 6)
According to the substrate holder according to the appendix 6, in the substrate holder according to the appendix 4 or 5, the plate thickness of the bottom surface portion of the body is 3 mm or less.

According to the substrate holder according to Appendix 6, since the thickness of the bottom surface portion of the body is relatively thin, the bottom surface portion is likely to bend. As a result, the substrate holder can bend the bottom portion more.

(Appendix 7)
According to the substrate holder according to the appendix 7, in the substrate holder according to any one of the appendices 1 to 6, the body is made of polytetrafluoroethylene.

In the substrate holder according to Appendix 7, the body is made of polytetrafluoroethylene, which has excellent chemical resistance. Therefore, this substrate holder can suppress deterioration of the body even if it is immersed in various liquids at the time of plating the substrate.

(Appendix 8)
According to the substrate holder according to the appendix 8, in the substrate holder according to any one of the appendices 1 to 7, the body is positioned so as to sandwich the recess in the plane direction orthogonal to the thickness direction of the body. A first fixing hole and a second fixing hole are formed, and the first holding member further includes a base plate fixed at a position where the first fixing hole and the second fixing hole are formed.

According to the substrate holder according to Appendix 8, the base plate is fixed at the position where the first fixing hole and the second fixing hole are formed. Therefore, the expansion of the body in the direction in which the first fixing hole and the second fixing hole are separated from each other is restricted by the base plate, and the body is less likely to expand in the plane direction. That is, this substrate holder can suppress expansion in the plane direction.

Further, when the body is thermally expanded, the base plate receives a force in the direction in which the first fixing hole and the second fixing hole are separated from each other through the first fixing hole and the second fixing hole. Here, in the substrate holder, the first fixing hole and the second fixing hole are formed so as to sandwich the concave portion. Therefore, when the body thermally expands, the recess also thermally expands in the direction in which the first fixing hole and the second fixing hole are separated from each other. However, since the thickness of the recess is thin, when the recess thermally expands, it bends in the thickness direction due to the reaction force from the base plate. As a result, the volume of the body expanded in the direction in which the first fixing hole and the second fixing hole are separated from each other is converted into the bending in the thickness direction. As a result, the force applied by the recess to the base plate is reduced and the force transmitted by the body to the base plate is reduced as compared with the case where the recess does not bend in the thickness direction.

(Appendix 9)
According to the substrate holder according to the appendix 9, in the substrate holder according to the appendix 8, a space is formed between the body and the base plate between the first fixing hole and the second fixing hole. ..

If no space is formed between the body and the base plate, the body cannot abut on the base plate and bend toward the base plate when the body thermally expands. On the other hand, according to the substrate holder according to Appendix 9, a space is formed between the body and the base plate. Therefore, the recess of the body can be bent so as to warp toward the space between the body and the base plate. That is, this substrate holder can release the volume of the body increased by thermal expansion to this space.

(Appendix 10)
According to the substrate holder according to the appendix 10, in the appendix 9 subordinate to the appendix 4, the base plate is formed in a virtual plane passing through the first central axis of the first fixing hole and the second central axis of the second fixing hole. The first contact point, the second contact point, the base plate, and the portion surrounded by the body, which have a first contact point and a second contact point in contact with the body, are the space and the virtual. In a plane, the recess has a first connection point at the intersection of the inclined surface closer to the first central axis than the second central axis and the bottom surface, and is more than the first central axis. A second connection point is provided at a portion where the inclined surface close to the second central axis and the bottom surface intersect, and the first contact point is parallel to the first central axis and the first central axis. Located between the first boundary line passing through one connection point, the second contact point is the second central axis and the second boundary line parallel to the second central axis and passing through the second connection point. It is located between.

In the substrate holder according to Appendix 10, the first contact point is located between the first central axis and the first boundary line, and the second contact point is located between the second central axis and the second boundary line. doing. Therefore, in the virtual plane, the space extends from the back side of at least one inclined surface to the back side of the other inclined surface. That is, a space is formed at the position where the inclined surface extends. Further, as described above, when the body expands thermally, the inclined surface portion applies a force in the direction in which the inclined surface extends with respect to the bottom surface portion of the body. Therefore, there is a space on the back surface side of the bottom surface portion where the force is applied from the inclined surface portion. As a result, the position where the force is directly transmitted from the inclined surface portion in the thickness direction can be bent in the thickness direction, and the bottom surface is more than the case where there is no space on the back surface side of the position where the force is directly transmitted. The whole can bend in the thickness direction.

(Appendix 11)
The substrate holder according to the appendix 11 is the substrate holder according to any one of the appendices 8 to 10, and the base plate is made of stainless steel.

In the substrate holder according to Appendix 7, a base plate is fixed to the body, and a stainless steel base plate having relatively high rigidity is fixed to the body. Therefore, when the body thermally expands, the base plate can regulate the expansion of the body in the plane direction.

(Appendix 12)
The plating apparatus according to Supplementary Note 12 includes a plating tank configured to accommodate the substrate holder described in any one of Supplementary notes 1 to 11, the substrate held by the substrate holder, and the anode. To be equipped.

The plating apparatus according to Appendix 12 can perform the plating process by using a substrate holder capable of suppressing expansion in the plane direction orthogonal to the thickness direction of the body.

Although only some embodiments according to the present invention have been described above, various changes or improvements can be made to the illustrated embodiments without substantially deviating from the novel teachings and advantages of the present invention. That will be easily understood by those skilled in the art. Therefore, it is intended that such modified or improved forms are also included in the technical scope of the present invention. Moreover, the above-described embodiment may be arbitrarily combined.

10: Substrate holder 11: First holding member 12: Second holding member 21: Substrate side sealing member 22: Holder side sealing member 40: Body 42: Base plate 150: Plating tank 200: Recessed 202: Adjacent portion 204: Bottom surface 206: Inclined surface 208: 1st fixing hole 209: 1st central shaft 210: 2nd fixing hole 211: 2nd central shaft 212: 1st contact point 214: 2nd contact point 216: 1st connection point 218: 2nd connection point 220: First boundary line 222: Second boundary line 901: Thickness direction 902: Plane direction R: Space Wf: Substrate

Claims (12)

A substrate holder that is immersed in the plating solution.
The first holding member having a plate-shaped body and
A second holding member configured to sandwich the substrate located on the front side of the body together with the first holding member.
With
The body has a bottomed recess on the back side that is recessed on the front side.
Board holder. In the substrate holder according to claim 1,
An annular holder-side sealing member for contacting the body and the second holding member and sealing between the body and the second holding member is further provided.
Board holder. In the substrate holder according to claim 2,
The recess is located at a position on the back surface of the region of the body surrounded by the contact surface of the body with the holder-side seal member.
Board holder. In the substrate holder according to any one of claims 1 to 3.
The recess has a flat bottom surface and an inclined surface that surrounds the bottom surface and is inclined with respect to the bottom surface.
The thickness of the inclined surface portion of the body becomes thicker as the distance from the bottom surface increases.
Board holder. In the substrate holder according to claim 4,
The angle between the bottom surface and the inclined surface is 45 degrees or less.
Board holder. In the substrate holder according to claim 4 or 5.
The thickness of the bottom surface portion of the body is 3 mm or less.
Board holder. In the substrate holder according to any one of claims 1 to 6.
The body is composed of polytetrafluoroethylene.
Board holder. In the substrate holder according to any one of claims 1 to 7.
The body is formed with a first fixing hole and a second fixing hole located so as to sandwich the recess in a plane direction orthogonal to the thickness direction of the body.
The first holding member further includes a base plate fixed at a position where the first fixing hole and the second fixing hole are formed.
Board holder. In the substrate holder according to claim 8,
A space is formed between the body and the base plate between the first fixing hole and the second fixing hole.
Board holder. In claim 9, which is subordinate to claim 4.
In a virtual plane passing through the first central axis of the first fixing hole and the second central axis of the second fixing hole, the base plate has a first contact point and a second contact point in contact with the body.
The first contact point, the second contact point, the base plate, and the portion surrounded by the body are the spaces.
In the virtual plane, the recess has a first connection point at the intersection of the inclined surface closer to the first central axis than the second central axis and the bottom surface, and is from the first central axis. Also has a second connection point at the intersection of the inclined surface near the second central axis and the bottom surface.
The first contact point is located between the first central axis and a first boundary line that is parallel to the first central axis and passes through the first connection point.
The second contact point is located between the second central axis and a second boundary line that is parallel to the second central axis and passes through the second connection point.
Board holder. In the substrate holder according to any one of claims 8 to 10.
The base plate is made of stainless steel.
Board holder. The board holder according to any one of claims 1 to 11.
A substrate held in the substrate holder, a plating tank configured to accommodate the anode, and the like are provided.
Plating equipment.

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