JP2021040129A - Apparatus for thermally and electromagnetically managing electronic module - Google Patents

Abstract

To provide an apparatus for thermally and electromagnetically managing an electronic module.SOLUTION: An apparatus for thermally and electromagnetically managing an electronic module includes an electronic module, a phase change material (PCM) 3, and a chamber 2 intended to receive the phase change material and the electronic module. The phase change material is a metal or a metal alloy, and the electronic module is buried therein. The apparatus includes a protective casing 11 so as to avoid contact between the electronic module and the phase change material. The device is configured to ensure contact of the phase change material with all of the outer surface of the protective casing of the electronic device and further includes a positioning tab 4 for positioning the electronic module in the chamber.SELECTED DRAWING: Figure 1

Description

The present invention relates to the field of electronic devices. It is a field of thermal management of electronic devices that can be placed in dangerous thermal environments, especially in automotive applications for all devices embedded under the hood of a vehicle and controlled by electronic devices such as electronic boards contained in the device. Has a particularly advantageous application in.

Electronic devices generate self-heating, and when they are placed in an environment exposed to high temperature rise, such as in the automotive field, the temperature of the electronic device and / or the temperature of related parts reaches its specified maximum temperature, conventionally about 150 ° C. The risk of exceeding is therefore increased. The system is required to thermally insulate the electronic device while ensuring the dissipation of its own heat.

It is known to absorb thermal power or temperature peaks by melting phase change materials as described in US Pat. No. 7,069,979. This device is used here for solenoids and electric engines. Phase change substances are used to absorb heat.

Moreover, electronic devices take advantage of being electromagnetically protected to ensure operation without conflict or infringement. It is even more important to protect the direct environment of the electronic device from the electromagnetic radiation of the electronic device, with the aim of respecting normative constraints and ensuring the normal operation of coexisting systems in the vicinity.

The Faraday cage principle is known to protect parts electromagnetically from external radiation or to protect the environment from component radiation. A known device is a chamber, the casing of which is made of electromagnetic material.

The Faraday cage principle is associated with thermal insulation as described in patent application FR2713327A1 for building boards for the production of bulkheads.

However, in the field of microelectronics, there is not a sufficient solution to ensure thermal protection as well as electromagnetic shielding of electronic devices.

U.S. Pat. No. 7,069,979 French Patent Application Publication No. 2713327

An object of the present invention is therefore to propose a device for thermally and electromagnetically managing electronic modules.

Other objects, features and advantages of the present invention will become apparent by reviewing the following description and support drawings. It is understood that other benefits can be incorporated.

To this end, the present invention thermally and electromagnetically manages an electronic module, comprising an electronic module, a phase change material (PCM), and a chamber intended to receive the phase change material and the electronic module. Provide a device for doing so. The present apparatus is characterized in that the phase change substance is a metal or a metal alloy, and an electronic module is embedded therein.

Advantageously, the electronic module defines the electronic device, and preferably its connector, and the outer surface of the electronic module so as to encapsulate the electronic device so as to avoid contact of the phase change material with the electronic device. Provide the intended protective casing.

Characteristically, the device provides a system for positioning the electronic module in the chamber, which is configured to ensure contact of the phase change material with all of the outer surface of the electronic module, more specifically the protective casing. Be prepared. Moreover, this centering system ensures a minimum PCM thickness all around the electronic module, making it possible to ensure a heat shield function. Advantageously, it limits any possibility of additional electromagnetic leakage by its material and / or its shape.

The use of the PCM in contact with the electronic module makes it possible to ensure that the temperature of the electronic module remains close to the phase change temperature of the PCM. In fact, the PCM will absorb heat, whether it is the heat of the environment of the electronic module or the heat generated by the electronic module. During that phase change, the PCM accumulates, in particular, a large amount of heat. PCM returns the accumulated heat when the temperature of the environment is below the phase change temperature.

The choice of PCM, which is a metal or metal alloy, has good thermal conductivity (30 W / m / K), which facilitates heat transfer, especially during the outward heat return phase (preferably during solidification of the PCM). On the other hand, the conventional organic PCM is around 1 W / m / K). This also makes it possible to better homogenize the temperature of the electronic module and, therefore, better suppress the self-heating of the components it contains, which is a radiator function. In addition, the choice of such PCM makes it possible to ensure that the electromagnetic protection of the electronic module, as well as the shielding, is involved. In addition, metal PCMs, or PCMs composed of metal alloys, have a wide variety of phase change temperatures, allowing them to be adapted to different uses and hence environmental temperature conditions.

Finally, the electronic module must be completely enclosed by PCM to ensure thermal protection and electromagnetic shielding. The positioning system ensures the correct position of the electronic module, especially during the PCM phase change transitioning from solid to liquid state and vice versa, advantageously according to the present invention. In the liquid state, the electronic module tends to rise under the action of gravity, or more generally, to move under the influence of forces, vibrations or accelerations imposed by external conditions of use. The positioning system ensures minimal and sufficient thermal and advantageously electromagnetic protection, especially over the entire outer surface of the electronic module.

Optionally, the invention may further have at least one of the following features:

Advantageously, the PCM is a solid / liquid transition PCM.

Another aspect of the invention relates to the use of such devices as described above for thermally and electromagnetically managing electronic modules configured to control actuators or sensors for road vehicles.

In addition to the objectives and goals of the invention, features and advantages will be better apparent from the detailed description of embodiments of the invention illustrated by the following support drawings.

It is a figure which shows the heat and electromagnetic apparatus which concerns on this invention. It is a figure which shows the possible assembly step for producing the apparatus which concerns on FIG. It is a figure which shows the possible assembly step for producing the apparatus which concerns on FIG. It is a figure which shows the possible assembly step for producing the apparatus which concerns on FIG. It is a figure which shows the possible assembly step for producing the apparatus which concerns on FIG. It is a figure which shows the possible assembly step for producing the apparatus which concerns on FIG. It is a figure which shows the possible assembly step for producing the apparatus which concerns on FIG. It is a figure which shows the dimension by exemplifying the apparatus which concerns on this invention which concerns on FIG.

The drawings are given as an example and do not limit the invention. They constitute a schematic of the principles intended to facilitate the understanding of the present invention and are not necessarily a measure of practical application.

Prior to starting a detailed study of embodiments of the present invention, optional features that may be used in connection with or as an alternative to optional are described below.

Advantageously, the positioning system is metallic so as to maintain the electromagnetic protection of the device.

Advantageously, the protective casing is advantageously an inexpensive material that is easy to mold and supports the temperature of application.

Advantageously, the electronic module is a dielectric fluid or TIM type (thermal interface material) arranged between the protective casing and the electronic module, which is configured to ensure thermal transmission between the electronic device and the protective casing. It is equipped with the thermal interface material of.

Advantageously, the positioning system is fixed to the electronic module, facilitating the mounting method of the system.

Advantageously, the positioning system comprises at least three tabs arranged to prevent contact of the electronic module with the chamber.

Advantageously, the phase change material is a solid / liquid phase change material. The enthalpy of solid / liquid phase changes is of paramount importance and allows for optimal temperature control of electronic devices, and more specifically for optimal thermal protection of electronic modules.

Advantageously, the chamber comprises a system for controlling the expansion of the PCM during the phase change. Advantageously, the chamber is configured to be deformed to absorb PCM volume changes. Therefore, it is advantageous to choose a metal PCM that has low expansion during the phase change.

Advantageously, the phase change material is selected to have a melting temperature contained between 50 ° C and 200 ° C, preferably between 110 ° C and 150 ° C.

Advantageously, the selected phase change material is a binary eutectic containing tin and bismuth, preferably 42% tin and 58% bismuth, and advantageously the melting temperature of the binary eutectic is 138. ℃.

Advantageously, the electronic module comprises electrical connection means through the chamber, which includes a sealed through passage to ensure sealing of the chamber with respect to the PCM. Advantageously, the chamber is made from hot plastic, such as PPS or PBT. This kind of plastic is of very good value for the money. The chamber constitutes an insulator, the thickness of which is a parameter that can make it possible to limit the heat flow that will accumulate in the PCM. The sealed through passage can be advantageously secured, for example, by the sealed crossing of the brand Specite®.

Advantageously, the device comprises a system for folding the connecting means, which is arranged in the chamber so as to fold the connecting means between the through passage and the electronic module. The system for folding the connecting means is advantageously made of metal to ensure continuity of electromagnetic shielding. Since the electrical connection wire is metallic, direct contact with the PCM is unlikely to be desirable, and an insulating sleeve should be required, thus creating an unavoidable opening in the electromagnetic shielding. By bypassing the connecting line, the effect of this through-passage on shielding effectiveness is that disruption passes through this opening at the expense of multiple reflections and hence the weakening of the disruption. Is limited only by enabling.

Advantageously, the electronic device of the electronic module comprises an electronic substrate configured to control an EGR (exhaust gas recirculation) valve for a combustion engine.

By electronic devices, this means any kind of device made by microelectronic means. These devices include, in particular, optical or optoelectronic devices (MOEMS, etc.) as well as micromechanical or electromechanical devices (MEMS, NEMS, etc.), in addition to purely electronic purpose devices.

The device according to the present invention includes an electronic module 1. The electronic module 1 includes, in particular, at least one electronic device that can be an electronic board with a printed circuit 10 and electronic components 5. The electronic module 1 advantageously includes an electronic component 5. The electronic module 1 preferably includes a protective casing 11 that surrounds the electronic device. The electronic device is considered to be encapsulated by the protective casing 11. In its absence, the protective casing defines the outer surface of the electronic module 1, which is optionally defined by the surface of the electronic device. According to this embodiment, the electronic module 1 is a dielectric fluid to allow heat conduction from the electronic module 1 to the outside, in particular to the PCM3 described below, by the self-heating of the electronic device. , Or a TIM (Thermal Interface Material) type thermal interface material. As an example, the dielectric fluid or TIM type thermal interface material is selected from thermal oil, thermal fat, silicon thermal interface material or solid space filler.

The device according to the invention comprises a chamber 2 intended to accommodate at least one electronic module 1. Although described with reference to one electronic module 1 in chamber 2, the invention may also relate to chamber 2 containing several electronic modules 1. Chamber 2 defines a closed internal volume. The chamber 2 includes a base 12 and a cover 9 that closes the base 12, as illustrated in FIG. The base 12 includes a bottom 13 and an end 14. Chamber 2 is advantageously liquid-tight (liquid and gas). The chamber 2 is advantageously made of a temperature-resistant material for using the electronic module. As an example, the chamber 2 is a polyphenylene sulfide (PPS) or polyester semi-crystalline thermoplastic, which is a high-performance semi-crystalline technical plastic with mechanical properties at high temperatures and extremely high chemical resistance. Made from plastic materials such as poly (ethylene terephthalate) known under the abbreviation PBT.

Advantageously, in order to maintain electromagnetic shielding, the chamber 2 does not have an opening larger than the value of the shortest wavelength that is desired to be protected.

The chamber 2 has a thickness that affects the heat flow that needs to be accumulated by the apparatus according to the present invention. As an example, the thickness, the walls of the chamber are included between 0.5 and 3 mm, more specifically on the scale of 1 mm.

The apparatus according to the present invention includes a phase change substance 3 (PCM). PCM3 is included in chamber 2. The electronic module 1 is embedded in the PCM 3. By "embedding", this means that the PCM3 covers the electronic module 1 advantageously over all its surfaces, preferably except for the points of contact with the positioning system. The electronic module 1 is advantageously covered with PCM3 in all directions. All of the outer surface of the electronic module 1, especially the protective casing 11, is in contact with the PCM 3. The device according to the present invention is configured such that the electronic module 1 is surrounded by the PCM3.

According to the present invention, the PCM3 is a metal or a metal alloy. By "metal alloy", this means that the PCM3 contains several metal PCMs. In the following description, the reference to PCM3 is not limited. PCM3 formed from a metal alloy is eutectic. The PCM3 is configured to ensure the continuity of the metal volume around the electronic module 1. Advantageously, the inclusion of PCM3 or the optional end cap is metal.

The PCM3 according to the present invention is a solid / liquid transition PCM. Different metal PCMs can be used. The PCM3 used for application to electronic devices, for example electronic substrates, will have a melting temperature of about 50 to 200 ° C., more specifically 110 to 150 ° C. Preferably, the PCM3 will have a good heat capacity and the highest possible thermal conductivity.

As an example, PCM is a metal alloy containing tin and bismuth. Preferably, bismuth is present in 58% by weight of the total weight of the alloy and tin is present in 42% by weight. This eutectic PCM has a melting temperature of 138 ° C.

PCM3 is a two-phase, preferably solid and liquid material, and the transition between these two phases stores or releases energy. Preferably, the transition from the first phase to the second phase will therefore require the heat stored in the PCM of that second phase. Conversely, the transition from the second phase to the first phase is exothermic and releases the accumulated heat. The phase change enthalpy is relatively significant compared to the sensitive energy fluctuation of the substance. As a result, systems with PCM are useful because the amount of energy stored per unit of volume (and mass) is greater than that obtained by a sensitive system (better storage density). This reduces the accumulated volume and material and lowers the price of the system.

The PCM3 will accumulate the amount of heat in its environment. In the apparatus according to the present invention, the PCM stores not only the amount of heat generated by the electronic module 1 due to self-heating, but also the amount of heat of the combustion engine in the case of application in the external environment, for example, in the field of automobiles. The PCM3 accumulates heat by accumulating sensible heat until it reaches its melting temperature. At this moment, the phase change of the PCM3 is very endothermic, accumulating the amount of heat by accumulating latent heat, making it possible to keep the electronic module at a temperature below its maximum operating temperature. Beyond that melting temperature, the PCM3 can continue to accumulate heat by accumulating sensible heat.

The PCM3 redistributes the accumulated heat when the temperature of the external environment will be less than its own temperature. The PCM3 therefore changes phase by exothermic transformation. When the temperature of the electronic module 1 is lower than the temperature of the PCM, the PCM 3 redistributes the accumulated heat amount toward the electronic module 1, but advantageously redistributes the accumulated heat toward the electronic module 1. This makes it possible to avoid temperature fluctuations that are too large and / or too rapid at the level of the electronic module 1 and thus allows thermal management of the electronic module.

The PCM3 thus makes it possible to ensure thermal control of the electronic module 1. In addition, the selection of the metal PCM3 makes it possible to ensure the electromagnetic protection of the electronic module 1 at the same time.

The solid / liquid phase change of PCM3 is accompanied by a change in volume of PCM3. This volume variation is advantageously low for the metal PCM3 (especially for the alloy of choice, the variation is almost zero due to the presence of bismuth, and the volume variation of bismuth is of most substances (water and others). The opposite, offsetting tin fluctuations).

According to one embodiment of the invention, the device comprises a system for controlling the expansion of the PCM3. According to the first preferred possibility, the chamber 2 is configured to receive the deformation corresponding to the volume expansion of the PCM3. According to the second possibility, the chamber 2 contains a gas atmosphere configured to be compressed during the volume expansion of the PCM3 so that the chamber 2 receives this increase in pressure within its internal volume. It is composed. The gas atmosphere is advantageously configured so as not to degrade the PCM3. According to a third possibility, the chamber 2 comprises one or more openings in the gas atmosphere and the level of its cover 9. According to one embodiment, one or more apertures are small, preferably less than the wavelength value that needs to be blocked by electromagnetic shielding. The opening allows the gas atmosphere to be released without increasing the pressure of the internal volume of the chamber 2. Only this third possibility can be considered if the device according to the invention is intended to remain horizontal at all times to avoid leakage of the PCM3.

According to the present invention, the device comprises a system for positioning the electronic module 1 in the chamber 2. The positioning system makes it possible to secure a fixed position of the electronic module 1 in the chamber 2 to ensure thermal and electromagnetic protection, regardless of the state of the PCM3. In fact, when the PCM3 is in a liquid state, the positioning system implants the electronic module 1 in the PCM3 without risking that the electronic module 1 comes into contact with the chamber 2 to reduce thermal and electromagnetic protection and even destroy it. Allows you to keep it.

The positioning system is advantageously metallic so as to allow electromagnetic shielding. As an example, the positioning system is made of steel. According to an embodiment illustrated in the figure, the positioning system has three metal tabs 4 arranged between the chamber 2 and the electronic module 1 so as to maintain a space between the electronic module 1 and the chamber 2. Be prepared. The positioning system can include at least one of a blade, a spring, a block, a rigid wire, a bar, or a combination of two or more of these elements. Possibly, the tab 4 is fixed only to the electronic module 1. Since the tab 4 is not fixed to the chamber 2, it makes it possible to facilitate the management of expansion of the PCM3, especially by the chamber 2.

In the apparatus according to the present invention, the electronic module 1 advantageously comprises electrical connection means 6 for connecting it to another member, particularly a member controlled by the electronic module. The electrical connection means 6 includes at least one electric wire or electric cable. Wires or electrical cables are advantageously flexible. As a preferred example, the connecting means 6 has a diameter of 0.1 to 3 mm. The chamber 2 is advantageously configured to allow the passage of connecting means 6 between its internal volume and the external environment. The chamber 2 preferably includes a through passage 8. The features of the through passage 8 and the connecting wire are selected to maintain the length specific to the insulator (the plastic sleeve around the connecting wire that insulates the PCM from the connecting wire) below the wavelength. The through passage 8 is formed in the cover 9 or the base 12 of the chamber. Preferably, the through passage 8 is liquidtight, especially with respect to the PCM3, especially when the through passage 8 is formed in the base 12 of the chamber 2. Encapsulation can be ensured specifically by encapsulating crossing of the brand Specite® or by gluing.

The device according to the present invention advantageously comprises a system for folding the connecting means 6 on its own. The folding system is located in the chamber 2 between the through passage 8 and the electronic module 1 and provides connecting means 6 to maintain electromagnetic shielding by limiting the transmission of waves and even blocking them. It is possible to fold and maintain a curved shape between the through passage 8 and the electronic module 1, eg, itself, especially in a chicane shape. In fact, the curved shape limits the transmission of electromagnetic waves through the gap between the PCM and the conduction connection line, the insulating sleeve. The folding system is advantageously of the same type as the positioning system. Folding systems are advantageously made from metals such as steel. A tab for fixing the connecting means 6 or crimping can be provided.

In particular, according to the preferred embodiments exemplified in FIGS. 1 and 3, the PCM3 surrounds the electronic module 1 by a constant PCM thickness ep1 in all its dimensions, eg ep1 is about 1 to 10 mm, more. In detail, it is about 3 mm. According to a preferred possibility, the thickness of the PCM3 is greater at the level of the system for folding the connecting means 6 to ensure that the connecting means 6 is embedded in the PCM3. As an example, this thickness ep2 is 5 mm. To limit the additional cost, the folding system is advantageously located at the end 14 of the chamber 2.

The present invention also relates to a method for assembling the device according to the present invention as described below. The assembly method includes the following steps, exemplified and described below, from FIGS. 2A to 2F.

The chamber 2 illustrated in FIG. 2A is formed by a base 12 having a bottom 13 and an end 14. The chamber comprises a wall defining the internal volume. Chamber 2 is advantageously molded or machined from one single block.

An advantageously sealed through passage 8 is mounted in chamber 2, eg, at the end 14, as illustrated in FIG. 2B. The through passage 8 allows the connecting means 6 to pass through the chamber 2. Thus, an opening is advantageously formed in one of the ends 14 of the chamber 2, and advantageously a crossing sealed in the opening is implemented by passing it through the connecting means 6.

A positioning system is implemented. Advantageously, the tab 4 of the positioning system is fixed to the electronic module 1 by welding in particular. A system for folding the connecting means 6 is also implemented. Preferably, the fixing tab 7 is fixed to the electronic module 1 as illustrated in FIG. 2C.

The connecting means 6 is folded over the electronic module 1. Advantageously, the connector of the wire is welded to the electronic device as illustrated in FIG. 2C, or to the protective casing 11 if present.

The electronic module 1 is mounted in chamber 2, particularly in the internal volume defined by the base 12 of chamber 2. The positioning tab 4 is advantageously in contact with the chamber 2 as illustrated in FIG. 2D.

The PCM3, preferably in liquid phase, is introduced into chamber 2 as illustrated in FIG. 2E.

The cover 9 of the chamber 2 is implemented to close the chamber 2. The cover 9 is advantageously heat welded to the base 12 of the chamber 2.

(Example)
According to one embodiment, the application example selected is an actuator that operates in a circulating atmosphere between 110 ° C and 150 ° C, where the DC motor generates self-heating of 2 to 4 W and 1 ° C to 5 ° C. ..

Such actuators are, for example, EGR valve actuators for combustion engines. The actuator incorporates an electronic control board whose temperature must not locally exceed 150 ° C. This substrate undergoes three thermal stresses:
-Atmosphere outside the actuator (under the hood of the vehicle, near the combustion engine), its temperature fluctuates between 110 ° C and 150 ° C according to the engine system (150 ° C temperature is generally reached when climbing a slope). In a sizing-type profile, it reaches 150 ° C with an input rise time of 110 ° C for 30 minutes, then 15 minutes, then holds at 150 ° C for 30 minutes, and finally drops to 110 ° C over 15 minutes. Think about the cycle. This type of circulation is unique to the use of PCM because it leaves the range of solidification (releases heat from the PCM) between two thermal clipping needs.
A DC motor that generates power of about −0 to 50 W, a part of which heats the electronic substrate.
-Self-heating of the electronic board (self-heating power of 0 to 10W per component of the electronic board).

PCM of choice: It must be possible to absorb heat when the combustion engine is at 150 ° C and so that it does not exceed 150 ° C on the electronic substrate when the DC machine operates. , When the combustion engine reaches 110 ° C., it will be released from the device. The selected PCM3 must therefore have a melting temperature contained between 110 ° C and 150 ° C.

PCM3 is a eutectic containing 42% Sn-58% Bi, which has the following main characteristics:
-Melting temperature: 138 ° C.
-Mass melting enthalpy: 44.8 J / g.
-Density: 8560 kg / m ³
-Accumulation density: 106.5 kW. h / m ³ , in fact a very good PCM from this point of view.
− Volume expansion during phase change <1%.
-Thermal conductivity: 30 W / m / K. In the case of self-heating of the electronic module, a useful heat dissipation function can be enabled.
-Electrical resistivity: σ = 1.25E-6 Siemens / m (that is, the specific electrical resistivity of σr = 0.021).
-Permeability: μr = 1. Eutectic 42% Sn58% Bi is very close to the characteristics of stainless steel in terms of specific electrical resistivity and specific magnetic permeability, and is a very satisfactory electromagnetic shielding material.

Detailed Sizing of the Device According to the Invention The electronic module 1 in this application has the following dimensions (if it is desired to avoid contact with its components and the PCM3 / electronic components 5, the optional protective casing 11 is provided. Including):
-Height Hm 10mm
-Length Lm 50mm
− Width lm 50mm

From a geometric point of view, the electronic substrate receives thermal energy, which is "stressed" by heat from all directions: on the top and sides it is very close to the local atmosphere under the hood, and on the back side it is a DC machine. Receive the flow. The placement of all PCM3s around the electronic board allows protection in all directions.

Advantageously, the selected PCM thickness ep1 is 3 mm on all sides. Preferably, the side containing the connecting means 6 has a larger PCM thickness ep2, preferably 5 mm. The electric wire of the connecting means 6 has a wire ^{passing cross section of 0.75 mm 2} , that is, a wire diameter including a sleeve close to 1 mm, and is flexible.

The positioning tab 4 and the fixing tab 7 of the connecting means 6 are iron cylinders having a diameter of 2 mm. Chamber 2 is made from PPS.

The chamber is believed to be flexible enough to absorb 1% of the volume expansion of the PCM3 during phase change.

The PCM volume (42% Sn-58% Bi) surrounding the electronic module 1 is 27 cm ³ , that is, 336 g of PCM 3, that is, the energy absorption capacity at the time of phase change of 10.5 kJ (3 W.h).

FLUENT calculations and experimental measurements made with other PCMs show that this level of energy absorption is exposed to the power emitted by the DC motor (however, self-heating is not represented) in addition to the circulation of ambient temperature. It was shown to be sufficient to significantly improve the heat load.

Moreover, the shielding obtained at this 3 mm thickness of eutectic 42% Sn-58% Bi is calculated as follows:

hypothesis:
− Far-field infinite plane wave − Ignore the influence of connecting lines (because of chicane)
-Ignore multiple reflections (true for shielding thickness greater than skin thickness)

Absorption term:
− Skin thickness:

− Decibel reduction:

e is the PCM thickness in mm.

Reflection term:
-Effects of reflection at decibels:

Overall, the reductions obtained according to frequency are as follows:

The reduction is for all ultra-high frequencies, and the electromagnetic shielding function is recognized as effective.

The present invention is not limited to the above-described embodiments, but extends to all embodiments included in the claims.

1 Electronic module 2 Chamber 3 Phase change material 4 Positioning tab 5 Electronic component 6 Connection line 7 Connection line fixing tab 8 Sealed passage 9 Cover 10 Print circuit 11 Protective casing 12 Base 13 Bottom 14 End Hm Electronic module height Lm Electronic module length lm Electronic module width He Chamber height Le Chamber length le Chamber width ep1 PCM thickness ep2 PCM thickness

Claims (12)

A thermal electronic module comprising an electronic module (1), a phase change material (3) (PCM), and a chamber (2) intended to receive the phase change material (3) and the electronic module (1). And a device for electromagnetic management
The phase change substance (3) is a metal or a metal alloy, and the electronic module (1) is embedded therein.
The electronic module (1) is intended to define the electronic device and the outer surface of the electronic module and encapsulate the electronic device so as to avoid contact of the phase changing substance (3) with the electronic device. With a protective casing (11)
To position the electronic module within the chamber, the thermal and electromagnetic control device is configured to ensure contact of the phase change material (3) with all of the outer surface of the electronic module (1). System (4)
A device characterized by that. The device according to claim 1, wherein the positioning system (4) is metallic. Between the protective casing (11) and the electronic module (1), the electronic module (1) is configured to ensure thermal transmission between the electronic device and the protective casing (11). The apparatus according to claim 1 or 2, comprising a dielectric fluid to be arranged or a thermal interface material (TIM) type. The device according to any one of claims 1 to 3, wherein the positioning system (4) is fixed to the electronic module (1). 10. The aspect of any one of claims 1 to 4, wherein the positioning system comprises at least three tabs (4) arranged to prevent contact of the electronic module (1) with the chamber (2). Equipment. The apparatus according to any one of claims 1 to 5, wherein the chamber (2) comprises a system for controlling the expansion of the PCM (3) during a phase change. Any one of claims 1 to 6, wherein the phase change material (3) is selected to have a melting temperature contained between 50 and 200 ° C., more particularly between 110 ° C. and 150 ° C. The device described in the section. The selected phase change material (3) is a binary eutectic containing tin and bismuth, preferably 42% tin and 58% bismuth, preferably having a melting temperature of 138 ° C. The device according to any one of claims 1 to 7. The electronic module comprises an electrical connection means (6) that passes through the chamber (2), through which the chamber (2) is sealed to ensure sealing of the chamber with respect to the PCM (3). The device according to any one of claims 1 to 8, which includes a passage (8). The connecting means (6) is arranged in the chamber (2) so as to fold the connecting means (6) between the through passage (8) and the electronic module (1), and the connecting means (6) is folded over itself. 9. The apparatus according to claim 9, further comprising a system (7) for the purpose. The apparatus according to any one of claims 1 to 10, wherein the electronic module (1) comprises an electronic substrate configured to control an EGR valve (exhaust gas recirculation) for a combustion engine. Use of the device according to any one of claims 1 to 10 for thermally and electromagnetically managing an electronic module (1) configured to control an actuator or sensor for a road vehicle.

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