JP2021022638A - Substrate processing apparatus, substrate processing system and substrate processing method - Google Patents

Abstract

To provide a substrate processing apparatus capable of lifting a first lift pin and a second lift pin independently of each other at a low cost.SOLUTION: A substrate processing apparatus 1 includes a substrate holding part 2, a rolling mechanism 3, a push-up member 241 and a rolling mechanism 242. The substrate holding part 2 includes a first lift pin and a second lift pin, a first action member and a second action member connected, respectively, with the first lift pin and the second lift pin. The rolling mechanism 3 rotates the substrate holding part 2 around a revolving shaft J1. The push-up member 241 faces the first action member in a first state where the substrate holding part 2 has stopped at a first relative rotational position, and faces the second action member in a second state where the substrate holding part 2 has stopped at a second relative rotational position. A lifting mechanism 242 raises the first lift pin by raising the push-up member 241 in the first state and pushing up the first action member, and raises the second lift pin by raising the push-up member 241 in the second state and pushing up the second action member.SELECTED DRAWING: Figure 2

Description

The present application relates to a substrate processing apparatus, a substrate processing system and a substrate processing method.

Patent Document 1 describes a processing system for processing a wafer. This processing system includes a plurality of processing devices, a common transport chamber, an intermediate transport chamber, and an introduction side transport chamber. The unprocessed wafer is transported from the introduction side transfer chamber to the common transfer chamber via the intermediate transfer chamber. The wafer is transported from the common transfer chamber to each processing device, and is processed in each processing device. The processed wafer processed in the processing apparatus is transferred from the common transfer chamber to the introduction side transfer chamber via the intermediate transfer chamber.

A support mechanism for supporting the wafer is provided in the intermediate transfer chamber. This support mechanism includes a plurality of first lift pins, a plurality of second lift pins, a first elevating base, a second elevating base, a first elevating actuator, and a second elevating actuator.

The first elevating base and the second elevating base have shapes that do not overlap each other in a plan view (that is, when viewed along the vertical direction). A first lift pin is erected on the upper surface of the first elevating base. The first lift pins are arranged at substantially equal intervals along the circumferential direction with respect to the center of the wafer in a plan view. Similarly, a second lift pin is erected on the upper surface of the second elevating base. The second lift pins are arranged at substantially equal intervals along the circumferential direction in a plan view.

The first lifting actuator raises and lowers the first lift pin by raising and lowering the first lifting base between the upper position and the lower position. The second lifting actuator raises and lowers the second lift pin by raising and lowering the second lifting base between the upper position and the lower position.

In Patent Document 1, when the unprocessed substrate is transported from the introduction side transport chamber to the intermediate transport chamber, the first lifting actuator raises the first lift pin to support the substrate by the first lift pin. After that, the untreated substrate is transported to the common transport chamber. On the other hand, when the processed substrate is transported from the common transport chamber to the intermediate transport chamber, the second lifting actuator raises the second lift pin to support the board with the second lift pin. After that, the processed substrate is transported to the introduction side transport chamber. This prevents the untreated substrate from being contaminated with substances such as thin films or particles.

Japanese Unexamined Patent Publication No. 2003-249536

However, in Patent Document 1, since two elevating actuators are provided, the scale of the support mechanism becomes large and the manufacturing cost thereof becomes high. Further, in Patent Document 1, although the support mechanism is provided in the intermediate transfer chamber, the support mechanism in the processing device is not considered.

Therefore, an object of the present application is to provide a substrate processing apparatus, a substrate processing system, and a substrate processing method capable of raising and lowering the first lift pin and the second lift pin independently of each other at low cost.

A first aspect of the substrate processing apparatus is a chuck portion that holds the substrate in a horizontal position, three or more first lift pins that are vertically movable with respect to the chuck portion and support the substrate, and three or more first lift pins. A second lift pin, a first working member connected to the first lift pin, and a second working member provided at a position different from the first working member in the circumferential direction of the substrate and connected to the second lift pin. A substrate holding portion including, and a rotation mechanism for rotating the substrate holding portion around a rotation axis passing through the central portion of the substrate and along a vertical direction are provided so as to be vertically lower than the substrate holding portion. A first state in which the push-up member and an elevating mechanism for raising and lowering the push-up member with respect to the substrate holding portion are provided, and the substrate holding portion is stopped at a first relative rotation position with respect to the push-up member. In the second state, the substrate holding portion faces the first working member in the vertical direction and stops at the second relative rotation position with respect to the pushing member, and faces the second working member in the vertical direction. The elevating mechanism raises the first lift pin by raising the pushing member in the first state and pushing up the first acting member, and raises the pushing member in the second state to raise the second. By pushing up the working member, the second lift pin is raised.

The second aspect of the substrate processing apparatus is the substrate processing apparatus according to the first aspect, which includes a cleaning processing unit that performs cleaning processing on the substrate held by the substrate holding unit, and the elevating mechanism In the first state, the push-up member is raised to raise three or more of the first lift pins, and the untreated substrate is received from an external transfer device by the three or more first lift pins, and the first lift pin is received. In this state, the push-up member is lowered to hold the untreated substrate in the chuck portion, and the treated substrate treated by the cleaning processing portion is raised by the push-up member in the second state. The second lift pin is raised, and the substrate is received from the chuck portion by three or more second lift pins.

A third aspect of the substrate processing apparatus is the substrate processing apparatus according to the first or second aspect, wherein the first acting member is a lower end portion of each of the first lift pins, and the second acting member. Is the lower end of each of the second lift pins, and the same number of push-up members as the first lift pins or the second lift pins are provided and connected to each other, and the push-up members are in the first state. The push-up member faces the lower end of the second lift pin in the second state, and the elevating mechanism faces the lower end of the second lift pin in the first state and the second state. In each of the states, the push-up member is moved up and down integrally.

A fourth aspect of the substrate processing apparatus is the substrate processing apparatus according to the second aspect, wherein the push-up member can rotate integrally with the substrate holding portion in a state where the first lift pin is pushed up. The push-up member can rotate integrally with the substrate holding portion even when the second lift pin is pushed up.

A fifth aspect of the substrate processing apparatus is the substrate processing apparatus according to the fourth aspect, in which the push-up member pushes up the first lift pin and the push-up member pushes up the second lift pin. The rotation position of the substrate holding portion when the rotating mechanism integrally rotates the substrate holding portion and the pushing member in at least one of the above, and the first lift pin receives the unprocessed substrate from the conveying device. , And the rotational position of the substrate holding portion when the second lift pin delivers the processed substrate to the conveying device is brought close to each other.

A sixth aspect of the substrate processing apparatus is the substrate processing apparatus according to the fourth or fifth aspect, wherein the substrate holding portion is stopped at the first rotation position with respect to the push-up member. The first state of stopping at the relative rotation position is reached, and the substrate holding portion is in the second state of stopping at the second relative rotation position with respect to the pushing member while stopped at the second rotation position. The mechanism raises the first lift pin by raising the push-up member in the first state, receives the untreated substrate by the first lift pin, and lowers the push-up member in the first state to raise the first lift pin. The lift pin is lowered to hold the untreated substrate in the chuck portion, and in the second state, the second lift pin is raised by raising the push-up member to lift the treated substrate from the chuck portion. Received by the second lift pin, the rotation mechanism rotates the substrate holding portion to the first rotation position in a state where the second lift pin lifts the processed substrate.

A seventh aspect of the substrate processing apparatus is the substrate processing apparatus according to the sixth aspect, wherein the rotating mechanism is used when the processed substrate lifted by the second lift pin is carried out by the transport device. In the second state, the substrate holding portion is rotated to the second rotation position, and the elevating mechanism lowers the push-up member in the second state in which the substrate holding portion is stopped at the second rotation position. Lower the lift pin.

An eighth aspect of the substrate processing apparatus is the substrate processing apparatus according to the fourth or fifth aspect, wherein the substrate holding portion is stopped at the first rotation position with respect to the push-up member. The first state of stopping at the relative rotation position is reached, and the substrate holding portion is in the first state of stopping at the second relative rotation position with respect to the push-up member while stopped at the second rotation position. The mechanism is such that the substrate holding portion is rotated to the second rotation position in a state where the elevating mechanism raises the first lift pin in the first state, and the untreated substrate in the second state is said. The substrate holding portion is rotated to the first rotation position in a state where the substrate is received by the first lift pin and the unprocessed substrate is lifted by the first lift pin, and the elevating mechanism is the pushing member in the first state. The first lift pin is lowered by lowering to hold the untreated substrate in the chuck portion, and the second lift pin is raised by raising the push-up member in the second state to raise the processed substrate. It is received from the chuck portion by the second lift pin.

A ninth aspect of the substrate processing apparatus is the substrate processing apparatus according to any one of the fourth to eighth aspects, wherein a movable member connected to the push-up member, a fixing member, and a rotating shaft are provided. A guide for slidably fixing the movable member to the fixing member along the circumferential direction is further provided.

A tenth aspect of the substrate processing apparatus is the substrate processing apparatus according to the second aspect, wherein the elevating mechanism raises the push-up member in the first state to push up the first lift pin, and is untreated. The dummy substrate is received from an external transfer device by the first lift pin, the push-up member is lowered to hold the unprocessed dummy substrate in the chuck portion, and the processed dummy substrate processed by the cleaning processing portion is held. Is raised from the chuck portion by the first lift pin in the first state.

The eleventh aspect of the substrate processing apparatus is the substrate processing apparatus according to any one of the first to tenth aspects, further comprising a rotation sensor for measuring the rotation position of the substrate holding portion.

The mode of the substrate processing system is a substrate processing apparatus according to any one of the first to eleventh aspects, a carry-in unit for carrying in the substrate, and the substrate is received from the carry-in portion and delivered to the substrate processing device. Includes a board delivery section.

The substrate processing method comprises a chuck portion that holds the substrate in a horizontal position, and three or more first lift pins and three or more second lift pins that are vertically movable with respect to the chuck portion and support the substrate. And a first working member connected to the first lift pin, and a second working member provided at a position different from the first working member in the circumferential direction of the substrate and connected to the second lift pin. After the first step of stopping the substrate holding portion at the first relative rotation position with respect to the pushing member with respect to the rotating shaft passing through the central portion of the substrate and along the vertical direction, and after the first step, the substrate holding portion. A push-up member provided vertically below the board and facing the first acting member in the vertical direction in a first state in which the substrate holding portion is stopped at the first rotation position is raised with respect to the substrate holding portion. A second step of raising the first lift pin by pushing up the first working member, a third step of stopping the substrate holding portion at a second relative rotation position with respect to the pushing member, and the third step. After that, in the second state in which the substrate holding portion is stopped at the second relative rotation position, the pushing member that faces the second acting member in the vertical direction is raised with respect to the substrate holding portion to raise the second. It includes a fourth step of raising the second lift pin by pushing up the working member.

According to the first aspect of the substrate processing apparatus, the aspect of the substrate processing system, and the aspect of the substrate processing method, the first lift pin and the second lift pin can be independently raised and lowered by a common push-up member. Therefore, the configuration of the substrate processing device can be simplified as compared with the case where the push-up member for the first lift pin and the push-up member for the second lift pin are provided.

According to the second aspect of the substrate processing apparatus, the first lift pin receives the untreated substrate and the second lift pin lifts the processed substrate. Therefore, for example, even if the untreated substrate is contaminated, it is possible to prevent the contamination from being transferred to the second lift pin. As a result, it is possible to prevent contamination from being transferred from the second lift pin to the treated substrate.

According to the third aspect of the substrate processing apparatus, since the push-up member faces the lower end portion of the first lift pin in the first state, the first lift pin can be pushed up respectively. Similarly, since the push-up member faces the lower end of the second lift pin in the second state, the second lift pin can be pushed up respectively. Moreover, since the push-up members are connected to each other and move up and down integrally, the first lift pin and the second lift pin can be raised and lowered independently with a simple configuration.

According to the fourth aspect of the substrate processing device, the rotating mechanism integrally rotates the substrate holding portion and the push-up member in a state where the elevating mechanism raises the first lift pin by the push-up member and the first lift pin lifts the substrate. be able to. According to this, the substrate can be rotated while the first lift pin lifts the substrate. That is, the orientation of the substrate can be adjusted. Similarly, the rotating mechanism can integrally rotate the substrate holding portion and the pushing member in a state where the lifting mechanism raises the second lift pin by the pushing member and the second lift pin lifts the substrate. According to this, the orientation of the substrate can be adjusted while the second lift pin lifts the substrate. Therefore, the orientation of the substrate at the time of loading and unloading the substrate can be adjusted.

According to the fifth aspect of the substrate processing apparatus, the orientation of the substrate at the time of carrying out to the substrate processing apparatus can be made close to the orientation of the substrate at the time of carrying in from the substrate processing apparatus.

According to the sixth and eighth aspects of the substrate processing apparatus, the same is true when the unprocessed substrate is received from the external transport device by the first lift pin and the processed substrate is taken out from the second lift pin by the external transport device. The substrate can be loaded and unloaded at the rotating position. Therefore, the orientation of the substrate in the transport device can be maintained before and after the processing.

According to the seventh aspect of the substrate processing apparatus, the rotational position of the push-up member can be returned to the initial position.

According to the ninth aspect of the substrate processing apparatus, the push-up member can be rotatably fixed with a simple configuration.

According to the tenth aspect of the substrate processing apparatus, when the dummy substrate is repeatedly processed while being stored for a long period of time, the contamination of the dummy substrate may remain even by the cleaning treatment. However, the second lift pin is not used for the dummy substrate. That is, even if the dummy substrate is contaminated, the contamination of the second lift pin used for a normal processed substrate can be suppressed. As a result, contamination of ordinary substrates can be suppressed.

According to the eleventh aspect of the substrate processing apparatus, the rotational position of the substrate can be adjusted with high accuracy.

The objectives, features, aspects and advantages of the technology disclosed herein will be further clarified by the detailed description and accompanying drawings set forth below.

It is a top view which shows typically an example of the structure of a substrate processing system. It is a figure which shows typically an example of the structure of a substrate processing apparatus. It is a figure which shows typically an example of the structure of the substrate holding part. It is a figure which shows typically an example of the structure of a chuck pin. It is a top view which shows typically an example of the structure of a chuck pin. It is a top view which shows typically an example of the structure of the lower surface of the facing plate part. It is a top view which shows typically an example of the structure of the lower surface of the facing plate part. It is a top view which shows typically an example of the structure of the pin elevating mechanism. It is a top view which shows typically an example of the structure of the pin elevating mechanism. It is a figure which shows typically an example of the structure of a lift pin. It is a top view which shows an example of the structure of a lift pin schematically. It is a flowchart which shows an example of the operation of a substrate processing apparatus. It is a top view which shows typically an example of the structure of the pin elevating mechanism. It is a top view which shows typically an example of the structure of the pin elevating mechanism. It is a top view which shows roughly another example of the structure of the pin elevating mechanism. It is sectional drawing which shows roughly another example of the structure of the pin elevating mechanism. It is a figure which shows roughly another example of the structure of the substrate processing apparatus. It is sectional drawing which shows roughly another example of the structure of the pin elevating mechanism. It is a figure which shows roughly another example of the structure of the substrate processing apparatus. It is a flowchart which shows another example of operation of a substrate processing apparatus. It is a flowchart which shows another example of operation of a substrate processing apparatus. It is a flowchart which shows another example of operation of a substrate processing apparatus. It is a flowchart which shows another example of operation of a substrate processing apparatus. It is a top view which shows typically an example of the structure of a lift part. It is a top view which shows typically an example of the structure of a lift part.

Hereinafter, embodiments will be described with reference to the attached drawings. It should be noted that the drawings are shown schematically, and for convenience of explanation, the configuration is omitted or the configuration is simplified as appropriate. Further, the interrelationship between the sizes and positions of the configurations shown in the drawings is not always accurately described and can be changed as appropriate.

Further, in the description shown below, similar components are illustrated with the same reference numerals, and their names and functions are also the same. Therefore, detailed description of them may be omitted to avoid duplication.

The first embodiment.
<Outline configuration of board processing system>
FIG. 1 is a plan view schematically showing an example of the configuration of a substrate processing system 100 that functions as a substrate cleaning device. As shown in FIG. 1, the substrate processing system 100 is a single-wafer processing apparatus that can be used, for example, for processing to remove organic dust adhering to the surface of a semiconductor substrate (wafer) 9 as an example of a substrate. Is. Examples of the organic dust include an unnecessary resist remaining on the surface of the substrate 9 after an ion implantation process for injecting impurities into the surface of the substrate 9, or an outer peripheral portion of the surface of the substrate 9. Includes organic dust and the like derived from resists and the like adhering to the vicinity.

The board processing system 100 includes a load port LP as a container holding mechanism for holding a plurality of carriers C as a container, and a plurality of processing units 110 (12 units in this embodiment) for processing the board 9. Including. Specifically, for example, three sets of processing units 110 each composed of four processing units 110 arranged in a plane are arranged so as to be stacked in the vertical direction.

The substrate processing system 100 further includes, for example, an indexer robot IR, a center robot CR, and a control unit 6. The indexer robot IR can, for example, transfer the substrate 9 between the load port LP and the center robot CR. The center robot CR can, for example, convey the substrate 9 between the indexer robot IR and each processing unit 110. The control unit 6 can control, for example, the operation of each unit provided in the substrate processing system 100, the opening and closing of a valve, and the like.

Here, as shown in FIG. 1, the load port LP and each processing unit 110 are arranged at intervals in the horizontal direction. In the load port LP, the plurality of carriers C accommodating the plurality of substrates 9 are arranged along the horizontal arrangement direction D when viewed in a plan view. The load port LP functions as a carry-in unit for carrying in the substrate 9. Here, the indexer robot IR can, for example, transfer a plurality of substrates 9 from the carrier C to the center robot CR one by one, and transfer a plurality of substrates 9 from the center robot CR to the carrier C one by one. can do. Similarly, the center robot CR can, for example, transfer a plurality of substrates 9 from the indexer robot IR to each processing unit 110 one by one, and transfer the plurality of substrates 9 from each processing unit 110 to the indexer robot IR. It can be transported one by one. Further, for example, the center robot CR can transfer the substrate 9 between the plurality of processing units 110 as needed. The indexer robot IR and the center robot CR function as a board delivery unit that receives the substrate 9 from the loading unit (load port LP) and delivers it to the processing unit 110.

In the example of FIG. 1, the indexer robot IR has a U-shaped hand H in a plan view. Here, the indexer robot IR has two hands H. The two hands H are arranged at different heights from each other. Each hand H can support the substrate 9 in a horizontal posture. The indexer robot IR can move the hand H in the horizontal direction and the vertical direction. Further, the indexer robot IR can change the direction of the hand H by rotating (rotating) about an axis along the vertical direction. The indexer robot IR moves along the arrangement direction D in the path passing through the delivery position (the position where the indexer robot IR is drawn in FIG. 1). The delivery position is a position where the indexer robot IR and the center robot CR face each other in a direction orthogonal to the arrangement direction D when viewed in a plan view. The indexer robot IR can face the hand H to any carrier C and center robot CR, respectively. Here, for example, the indexer robot IR can perform a carry-in operation of carrying the substrate 9 into the carrier C and a carry-out operation of carrying out the substrate 9 from the carrier C by moving the hand H. Further, for example, the indexer robot IR can cooperate with the center robot CR to perform a delivery operation of moving the substrate 9 from one of the indexer robot IR and the center robot CR to the other at the delivery position.

In the example of FIG. 1, the center robot CR has a U-shaped hand H in a plan view like the indexer robot IR. Here, the center robot CR has two hands H. The two hands H are arranged at different heights from each other. Each hand H can support the substrate 9 in a horizontal posture. The center robot CR can move each hand H in the horizontal direction and the vertical direction. Further, the center robot CR can change the direction of the hand H by rotating (rotating) about an axis along the vertical direction. The center robot CR is surrounded by a plurality of processing units 110 when viewed in a plan view. The center robot CR can face the hand H to any of the processing unit 110 and the indexer robot IR. Here, for example, by moving the hand H, the center robot CR can perform a carry-in operation of loading the board 9 into each processing unit 110 and a carry-out operation of carrying out the board 9 from each processing unit 110. Further, for example, the center robot CR can perform a delivery operation of moving the substrate 9 from one of the indexer robot IR and the center robot CR to the other in cooperation with the indexer robot IR.

<Board processing equipment>
FIG. 2 is a diagram schematically showing an example of the configuration of the substrate processing device 1 corresponding to one of the processing units 110. The substrate processing device 1 is a single-wafer processing device that processes substrates 9 one by one. The substrate 9 is, for example, a semiconductor substrate and has a substantially disk shape. The substrate 9 has a first main surface 91 which is a device forming surface and a second main surface 92 which is a device non-forming surface. A pattern of a device under manufacturing is formed on the first main surface 91. The substrate processing apparatus 1 holds the substrate 9 with the second main surface 92 on which the device pattern is not formed facing upward, and processes the second main surface 92 with the processing liquid.

The substrate processing device 1 includes a substrate holding unit 2, a substrate rotating mechanism 3, and a processing liquid supply unit 4 which is an example of a cleaning processing unit. The substrate holding portion 2 and the substrate rotating mechanism 3 are housed in a box-shaped chamber (not shown). The chamber forms a substantially enclosed interior space.

The substrate holding portion 2 holds the substrate 9. FIG. 3 is a plan view schematically showing an example of the configuration of the substrate holding portion 2. As shown in FIGS. 2 and 3, the substrate holding portion 2 includes a lift portion 22 and a chuck portion 23. The chuck portion 23 switches between a state in which the substrate 9 is held in a horizontal position and a state in which the substrate 9 is released from holding. The horizontal posture referred to here means a state in which the thickness direction of the substrate 9 is along the vertical direction.

The lift portion 22 includes three or more (three in the example of FIG. 3) first lift pins 221a and three or more (three in the example of FIG. 3) second lift pins 221b. The first lift pin 221a and the second lift pin 221b are provided at positions facing the first main surface 91 of the substrate 9 held by the chuck portion 23 in the vertical direction. For example, the first lift pin 221a and the second lift pin 221b are provided side by side along the peripheral edge of the substrate 9. Further, the first lift pin 221a and the second lift pin 221b are provided so as to be able to move up and down independently of the chuck portion 23. By raising the first lift pin 221a, the first lift pin 221a can support the substrate 9, and by raising the second lift pin 221b, the second lift pin 221b can support the substrate 9. A detailed example of the substrate holding portion 2 will be described in detail later.

The substrate rotation mechanism 3 rotates the substrate holding portion 2 around the rotation shaft J1. The rotation shaft J1 is a shaft that passes through the central portion of the substrate 9 held by the substrate holding portion 2 and extends along the vertical direction. In the example of FIG. 2, the substrate rotation mechanism 3 includes a shaft portion 31 and a motor 32. The shaft portion 31 has a substantially cylindrical shape centered on the rotation shaft J1, and the upper end thereof is the center of the lower surface of the substrate holding portion 2 (specifically, the lower surface 212 of the facing plate portion 21 described later). It is fixed to the part. The motor 32 rotates the shaft portion 31 to rotate the substrate holding portion 2 around the rotation shaft J1. As a result, the substrate 9 held by the substrate holding portion 2 also rotates around the rotation axis J1.

The substrate rotation mechanism 3 can stop the substrate holding portion 2 at a predetermined angle position (hereinafter, referred to as “rotation position”) in the circumferential direction about the rotation axis J1. For example, the motor 32 stops the shaft portion 31 at a predetermined rotation position, so that the substrate holding portion 2 can be stopped at a predetermined rotation position.

The processing liquid supply unit 4 supplies the processing liquid to the second main surface 92 of the substrate 9 held by the substrate holding unit 2. In the example of FIG. 2, the processing liquid supply unit 4 includes a liquid nozzle 41 and a processing liquid supply source 42. The liquid nozzle 41 is supported by the nozzle arm 411 in the chamber. The nozzle arm 411 is connected to a nozzle moving mechanism (not shown). The nozzle moving mechanism moves the liquid nozzle 41 between a discharge position facing the central portion of the second main surface 92 of the substrate 9 and a standby position away from the substrate 9 in a direction perpendicular to the vertical direction. The liquid nozzle 41 is connected to the processing liquid supply source 42 via a valve. When the treatment liquid is supplied from the treatment liquid supply source 42 to the liquid nozzle 41, the treatment liquid is discharged from the liquid nozzle 41 toward the central portion of the second main surface 92. The treatment liquid supply source 42 of FIG. 2 can sequentially switch the treatment liquid such as a chemical liquid, an organic solvent, or pure water (deionized water (DIW)) and supply the treatment liquid to the liquid nozzle 41. Examples of the chemical solution include an ozone-containing hydrofluoric acid solution, dilute hydrofluoric acid (DHF), buffered hydrofluoric acid (BHF) or SC1 (a solution containing NH ₄ OH and H ₂ O ₂ ). An example of the organic solvent is isopropyl alcohol (IPA).

In the example of FIG. 2, the substrate processing device 1 is provided with the inert gas supply unit 5. The inert gas supply unit 5 supplies the inert gas to the first main surface 91 of the substrate 9. In the example of FIG. 2, the inert gas supply unit 5 includes the gas nozzle 51 and the inert gas supply source 52. In the example of FIG. 2, the substrate holding portion 2 and the shaft portion 31 are provided with a hollow portion extending in the vertical direction on the rotation shaft J1, and the gas nozzle 51 is arranged in the hollow portion. The gas nozzle 51 extends in the vertical direction, and the upper end surface of the gas nozzle 51 directly faces the central portion of the first main surface 91 of the substrate 9.

The gas nozzle 51 is connected to the inert gas supply source 52 via a valve. When the inert gas is supplied from the inert gas supply source 52 to the gas nozzle 51, the gas nozzle 51 betweens the first main surface 91 and the substrate holding portion 2 (specifically, the facing plate portion 21 described later). Inert gas is ejected toward the space. The inert gas is typically nitrogen gas. The inert gas may be argon gas, helium gas, clean air with low humidity, or the like.

Next, a detailed example of the configuration of the substrate holding portion 2 will be described. In the examples of FIGS. 2 and 3, the substrate holding portion 2 includes the facing plate portion 21. The facing plate portion 21 has a substantially disk-like shape centered on the rotation axis J1. The substrate holding portion 2 holds the substrate 9 above the facing plate portion 21, and the surface of the facing plate portion 21 facing upward is a facing surface 211 facing the first main surface 91 facing downward of the substrate 9. is there. The facing surface 211 spreads in a direction perpendicular to the rotation axis J1. The outer peripheral edge of the facing surface 211 is located outside the substrate 9. In other words, the outer diameter of the facing surface 211 is larger than the diameter of the substrate 9.

In the examples of FIGS. 2 and 3, the chuck portion 23 includes a plurality of chuck pins 231 and a chuck drive mechanism 25. The plurality of chuck pins 231 are arranged side by side along the peripheral edge portion 94 of the substrate 9. In the example of FIG. 3, the plurality of chuck pins 231 are arranged at substantially equal intervals along a reference circle C1 having a diameter slightly larger than that of the substrate 9. In the example of FIG. 3, six chuck pins 231 are arranged at intervals of 60 degrees in the circumferential direction.

As illustrated in FIG. 3, on the facing surface 211 of the facing plate portion 21, each of the first lift pin 221a and the second lift pin 221b are also arranged at substantially equal intervals in the circumferential direction. The first lift pin 221a constitutes the first lift pin group, and the second lift pin 221b constitutes the second lift pin group. In the following, when the first lift pin 221a and the second lift pin 221b are not distinguished, they are collectively referred to as a lift pin 221.

In the example of FIG. 3, the first lift pin 221a and the second lift pin 221b are arranged side by side along the reference circle C1 in the same manner as the chuck pin 231. More specifically, the six lift pins 221 and the six chuck pins 231 are alternately arranged at 30 degree intervals in the reference circle C1. Further, in the example of FIG. 3, the three first lift pins 221a are arranged at intervals of 120 degrees in the circumferential direction, and the three second lift pins 221b are also arranged at intervals of 120 degrees in the circumferential direction. That is, focusing only on the lift pins 221 the first lift pins 221a and the second lift pins 221b are alternately arranged at intervals of 60 degrees in the circumferential direction.

The facing surface 211 is provided with a plurality of hole portions 213 and a plurality of hole portions 215. The cross-sectional shapes of the hole 213 and the hole 215 that are perpendicular to the vertical direction are substantially circular. The plurality of lift pins 221 are inserted into the plurality of holes 215, and the plurality of chuck pins 231 are inserted into the plurality of holes 213, respectively. The cross-sectional shape of the hole 215 of the lift pin 221 is also substantially circular, and the cross-sectional shape of the hole 213 of the chuck pin 231 is also substantially circular. In the example of FIG. 3, the diameter of the lift pin 221 is smaller than the diameter of the chuck pin 231. The diameter of each hole 215 takes a value matched to the lift pin 221 and the diameter of each hole 213 takes a value matched to the chuck pin 231.

As shown in FIG. 2, a bearing 214 is provided in the hole 213, and the chuck pin 231 is rotatably supported by the bearing 214 around the rotation shaft J2 of the hole 213. In the following description, the rotating shaft J2 is referred to as a "chuck rotating shaft J2". In an example of the substrate holding portion 2, the range in which the chuck pin 231 can be rotated by a locking member (not shown) provided in the hole portion 213 is a predetermined angle range (an angle range including a holding position and an opening position described later). ) Is restricted.

FIG. 4 is a diagram schematically showing an example of the configuration of the chuck pin 231 viewed along the circumferential direction of the rotation axis J1, and FIG. 5 is a plan view schematically showing an example of the configuration of the chuck pin 231. Is. 4 and 5 show the chuck pin 231 whose angular position is the holding position.

In the examples of FIGS. 4 and 5, each chuck pin 231 includes a support 2311 and a protrusion 230. The support 2311 is connected to the bearing 214 inside the hole 213. On the upper surface of the support 2311, a protruding portion 230 projecting upward is provided. In the example of FIG. 5, two protrusions 230 are provided. The two protrusions 230 are arranged at positions deviated from the chuck rotation shaft J2 in the circumferential direction with respect to the rotation shaft J1. Further, the two protrusions 230 are separated from each other in the circumferential direction with respect to the rotation axis J1. By providing a gap between the two protrusions 230 in this way, the processing liquid supplied to the second main surface 92 during the processing of the substrate 9, which will be described later, passes through the gap to the second main surface. It is discharged from 92. When viewed along the circumferential direction, the two protrusions 230 have substantially the same outer shape.

Each protrusion 230 has a chuck contact surface 232. The chuck contact surface 232 is a side surface of the protrusion 230 facing the rotation axis J1 side (right side in FIG. 4). As described above, the protruding portion 230 is arranged at a position deviated from the chuck rotation shaft J2 in the circumferential direction, and the chuck contact surface 232 can be moved in the horizontal direction by the rotation of the chuck pin 231. In the example of FIG. 4, the chuck contact surface 232 has an upper contact surface 233, a curved contact surface 234, and a lower contact surface 235. In the chuck pin 231 stopped at the holding position, the upper contact surface 233 is a plane facing the rotation axis J1 side and downward, and approaches the rotation axis J1 as it goes upward. That is, the upper contact surface 233 is inclined upward toward the rotation shaft J1 side. For example, the upper contact surface 233 is orthogonal to the surface F2 (shown by the alternate long and short dash line in FIG. 5) including the rotation axis J1 and along the radial direction. The upper end of the upper contact surface 233 is continuous with the upper end surface of the protrusion 230. FIG. 4 shows the surface F2 only for one protrusion 230, but a similar surface can be set for the other protrusion 230.

The lower contact surface 235 is a plane facing upward on the rotation axis J1 side, and is arranged below the upper contact surface 233. The lower contact surface 235 is inclined downward toward the rotation shaft J1 side. For example, the lower contact surface 235 is orthogonal to the surface F2. On the surface F2, the inclination angle θ4 (see FIG. 4) of the lower contact surface 235 with respect to the facing surface 211 (horizontal plane) is substantially the same as the angle formed by the upper contact surface 233 and the facing surface 211 (horizontal plane). ..

The curved contact surface 234 is a curved surface facing the rotation axis J1 side, and is arranged between the upper contact surface 233 and the lower contact surface 235. The curved contact surface 234 is directly continuous with the upper contact surface 233 and the lower contact surface 235. For example, the curved contact surface 234 is orthogonal to the surface F2. The shape of the curved contact surface 234 on the surface F2 substantially matches the shape of the end surface 93 of the substrate 9. In the chuck contact surface 232, the center of the curved contact surface 234 in the vertical direction is the position farthest from the rotation axis J1. In the example of FIG. 4, in the chuck pin 231 stopped at the holding position, the distance between the center of the curved contact surface 234 and the rotation axis J1 substantially coincides with the radius of the substrate 9. Therefore, in the example of FIG. 4, the curved contact surface 234 of the plurality of chuck pins 231 abuts on the end surface 93 of the substrate 9 in a state where the plurality of chuck pins 231 are stopped at their respective holding positions. Actually, the vicinity of the upper side and the lower side of the end surface 93 of the substrate 9 (the upper connection portion and the lower connection portion described later) also abut on the chuck contact surface 232, and the peripheral edge portion 94 of the substrate 9 faces the rotation axis J1. And is pushed upwards and downwards. As a result, the chuck portion 23 can firmly hold the substrate 9.

Here, the peripheral edge portion 94 of the substrate 9 includes an upper connecting portion that connects the end surface 93 and the second main surface 92, a lower connecting portion that connects the end surface 93 and the first main surface 91, and the end surface 93. It is a bevel part including. When the diameter of the substrate 9 is 300 mm, the peripheral edge portion 94 of the substrate 9 includes, for example, an annular region having a width of 2 mm from the end face 93 toward the rotation axis J1 side.

As described above, each chuck contact surface 232 is arranged at a position deviated from the chuck rotation shaft J2, and as shown by the alternate long and short dash line in FIG. 5, each of the chuck pins 231 stopped at the open position. In the protruding portion 230, the distance between the chuck contact surface 232 and the rotating shaft J1 is larger than the distance in the state of being stopped at the holding position. That is, in the chuck pin 231 stopped at the open position, the distance between the center of the curved contact surface 234 and the rotation axis J1 is larger than the radius of the substrate 9. Therefore, when the plurality of chuck pins 231 are stopped at the respective open positions, the curved contact surface 234 of the plurality of chuck pins 231 is separated from the end surface 93 of the substrate 9, and the holding of the substrate 9 is released.

The chuck drive mechanism 25 moves the protrusion 230 between the holding position and the opening position by rotating the chuck pin 231 around the chuck rotation shaft J2. The chuck drive mechanism 25 moves all the protruding portions 30 of the chuck pins 231 to their respective holding positions, so that the plurality of chuck pins 231 hold the substrate 9. The chuck drive mechanism 25 moves all the protruding portions 30 of the chuck pins 231 to their respective open positions, so that the holding of the substrate 9 by the plurality of chuck pins 231 is released.

Here, as an example, the chuck drive mechanism 25 uses magnetic force to drive the chuck pin 231. FIG. 6 is a diagram schematically showing an example of the lower surface 212 of the facing plate portion 21. As shown in FIGS. 2 and 6, the chuck drive mechanism 25 includes a plurality of rotating magnets 251 and a plurality of closing magnets 252. The rotating magnet 251 and the closing magnet 252 are, for example, permanent magnets. Actually, the rotating magnet 251 and the closing magnet 252 are housed in a dedicated holding member, but the holding member is not shown in FIGS. 2 and 6. The same applies to the open magnet 253 described later.

The lower ends of the plurality of chuck pins 231 (more specifically, the support 2311) project downward from the lower surface 212 of the facing plate portion 21, and the rotating magnets 251 are respectively at the lower ends of the plurality of chuck pins 231. It is attached. The direction (magnetism direction) of the magnetic poles of the rotating magnet 251 is, for example, perpendicular to the rotating shaft J1 and the chuck rotating shaft J2.

On the lower surface 212 of the facing plate portion 21, the closing magnet 252 is fixed in the vicinity of the plurality of rotating magnets 251. In a state where the open magnet 253, which will be described later, is not located near the rotating magnet 251, for example, the north pole of the rotating magnet 251 becomes the rotating shaft J1 due to the magnetic attraction between the rotating magnet 251 and the closing magnet 252. It is located on the opposite side, and the S pole is located on the rotation axis J1 side. As a result, in the chuck pin 231 to which the rotating magnet 251 is attached, the angular position centered on the chuck rotating shaft J2 becomes the holding position shown in FIG. In FIG. 6, hatching is attached to a portion of each magnet on the north pole side (the same applies to FIG. 7 described later). In the present embodiment, the magnetic attraction force between the magnets is used, but of course, the magnetic repulsion force may be used.

With reference to FIG. 2, the chuck drive mechanism 25 further includes an open magnet 253 and a magnet elevating mechanism 254. The open magnet 253 is, for example, a permanent magnet. The open magnet 253 is provided below the facing plate portion 21 and independently of the facing plate portion 21. The open magnet 253 has, for example, a substantially annular shape centered on the rotation axis J1.

The direction (magnetism direction) of the magnetic poles of the open magnet 253 is along the radial direction centered on the rotation axis J1. For example, the north pole of the open magnet 253 is arranged on the rotation axis J1 side, and the south pole is arranged on the side opposite to the rotation axis J1.

When the facing plate portion 21 is viewed along the vertical direction, the open magnet 253 is arranged near the rotation axis J1 side of the plurality of rotation magnets 251. In the state of FIG. 2, the open magnet 253 is stopped at a position sufficiently distant from the lower surface 212 of the facing plate portion 21 (hereinafter, referred to as “separation position”). The open magnet 253 stopped at the separated position has almost no magnetic effect on the rotating magnet 251.

The magnet elevating mechanism 254 is provided below the facing plate portion 21. The magnet elevating mechanism 254 has, for example, an air cylinder, and an open magnet 253 is attached to the tip of the piston rod of the air cylinder. As shown by the alternate long and short dash line in FIG. 2, the magnet elevating mechanism 254 raises the piston rod, so that the open magnet 253 is close to the lower surface 212 of the facing plate portion 21 (hereinafter, referred to as “proximity position”). Ascend to. As a result, as shown in FIG. 2, the open magnet 253 moves to the vicinity of the rotation shaft J1 side of the plurality of rotation magnets 251.

FIG. 7 is a diagram schematically showing an example of the lower surface 212 of the facing plate portion 21, and shows a state in which the open magnet 253 is stopped at a close position. In the state of FIG. 7, the magnetic attraction force between the rotating magnet 251 and the open magnet 253 is larger than the magnetic attraction force between the rotating magnet 251 and the closing magnet 252. As a result, the rotating magnet 251 rotates around the chuck rotating shaft J2, the north pole of the rotating magnet 251 is located on the rotating shaft J1 side, and the S pole is located on the opposite side of the rotating shaft J1. As a result, in the chuck pin 231 to which the rotating magnet 251 is attached, the angular position centered on the chuck rotating shaft J2 becomes the open position shown in FIG.

When the magnet elevating mechanism 254 lowers the piston rod, the open magnet 253 is separated downward from the rotating magnet 251 and the angular position on the chuck pin 231 is returned to the holding position. The magnet elevating mechanism 254 may be a mechanism for elevating and lowering the open magnet 253 using a motor or the like (for example, a ball screw mechanism).

In the processing of the substrate 9 with the processing liquid described later, the chuck drive mechanism 25 stops the opening magnet 253 at a close position and the opening magnet 253 at a separated position under the control of the control unit 6. Switch. As a result, the state in which the substrate 9 is held by the plurality of chuck pins 231 and the state in which the substrate 9 is released by the plurality of chuck pins 231 can be switched.

Next, an example of the lift unit 22 will be described in detail. Each lift pin 221 is provided so as to be able to move up and down in the hole portion 215 of the facing plate portion 21. Each hole 215 penetrates the facing plate 21 in the vertical direction. The facing plate portion 21 is provided with a stopper (not shown) for preventing the lift pin 221 from falling. For example, the diameter of the hole 215 on the lower surface 212 of the facing plate 21 may be set smaller than the diameter of the lower end surface of the lift pin 221. As a result, the peripheral edge of the lower end surface of the lift pin 221 comes into contact with the bottom surface of the hole 215 of the facing plate 21. Therefore, it is possible to avoid the lift pin 221 from falling. Hereinafter, the position where each lift pin 221 abuts on the stopper is referred to as a lower position.

An urging member (for example, a spring) that presses the lift pin 221 downward may be provided in each hole 215 of the facing plate portion 21. As a result, the lift pin 221 can be pressed downward and stopped at the lower position.

With reference to FIG. 2, the lift portion 22 further includes a pin elevating mechanism 24. The pin elevating mechanism 24 is provided below the facing plate portion 21 of the substrate holding portion 2 and raises and lowers the lift pin 221. The pin elevating mechanism 24 includes a push-up member 241 and a member elevating mechanism 242. The push-up member 241 is provided so as to be able to move up and down with respect to the substrate holding portion 2 below the facing plate portion 21 of the substrate holding portion 2. The member elevating mechanism 242 raises and lowers the push-up member 241. The member elevating mechanism 242 includes, for example, an air cylinder, and the tip of the piston rod of the air cylinder is connected to the push-up member 241. The member elevating mechanism 242 may be a mechanism for elevating and lowering the push-up member 241 using a motor or the like.

FIG. 8 is a plan view schematically showing an example of the configuration of the pin elevating mechanism 24. The push-up members 241 are arranged on the reference circle C1 in a plan view. In other words, the push-up member 241 is provided on the virtual reference circle C1 in which the lift pins 221 are lined up. In the example of FIG. 8, three push-up members 241 are provided in the same number as the first lift pin 221a or the second lift pin 221b. The three push-up members 241 are arranged at intervals of 120 degrees in the circumferential direction, similarly to the first lift pin 221a and the second lift pin 221b. In the example of FIG. 2, each push-up member 241 has a rod-like shape (for example, a cylindrical shape) extending along the vertical direction.

The three push-up members 241 face each of the three first lift pins 221a in the vertical direction in the first state in which the substrate holding portion 2 is stopped at the first rotation position. The rotation position of the substrate holding portion 2 is, for example, an absolute rotation position of the substrate processing device 1 with respect to the floor surface. Here, a rotation position (hereinafter, referred to as a relative rotation position) relative to the push-up member 241 of the substrate holding portion 2 is also introduced. In the first state in which the substrate holding portion 2 is stopped at the first relative rotation position, the push-up member 241 faces the first lift pin 221a in the vertical direction. In the first embodiment, since the push-up member 241 does not rotate around the rotation axis J1, the relative rotation position is equal to the rotation position (absolute rotation position).

In FIG. 8, the first lift pin 221a and the second lift pin 221b are also schematically shown. In the example of FIG. 8, in a plan view, the three first lift pins 221a each overlap with the three push-up members 241. That is, in FIG. 8, the positions of the first lift pin 221a and the second lift pin 221b in the first state in which the substrate holding portion 2 is stopped at the first rotation position (first relative rotation position) are shown.

Further, the three push-up members 241 face each other in the vertical direction with the three second lift pins 221b in the second state in which the substrate holding portion 2 is stopped at the second rotation position. Explaining in terms of the relative rotation position with respect to the push-up member 241, the push-up member 241 faces the second lift pin 221b in the vertical direction in the second state in which the substrate holding portion 2 is stopped at the second relative rotation position. As described above, since the relative rotation position is equal to the rotation position in the first embodiment, the rotation position will be mainly described below. Here, since the first lift pin 221a and the second lift pin 221b are alternately arranged at intervals of 60 degrees in the circumferential direction, the second rotation position is rotated by 60 · n (n is a natural number) degrees from the first rotation position. It is an angular position obtained by

FIG. 9 is a plan view schematically showing an example of the configuration of the pin elevating mechanism 24. However, in FIG. 9, the first lift pin 221a and the second lift pin 221b in the second state in which the substrate holding portion 2 is stopped at the second rotation position are schematically shown. In the example of FIG. 9, in a plan view, the three second lift pins 221b each overlap the three push-up members 241.

The member elevating mechanism 242 raises and lowers the push-up member 241. In the illustrated example, the three push-up members 241 are connected to each other by a connecting member 243. The connecting member 243 has, for example, a substantially annular plate-like shape centered on the rotation shaft J1. The lower ends of the three push-up members 241 are connected to the upper surface of the connecting member 243. In other words, each push-up member 241 extends upward from the upper surface of the connecting member 243. The member elevating mechanism 242 integrally raises and lowers the three push-up members 241 and the connecting member 243. The push-up members 241 do not necessarily have to be connected to each other, and a member elevating mechanism 242 may be provided for each of the three push-up members 241.

The upper end portion of the push-up member 241 has an area smaller than the hole portion 215 of the facing plate portion 21 in a cross section perpendicular to the vertical direction, and can be freely inserted into the hole portion 215 from below.

The member elevating mechanism 242 raises the three push-up members 241 in the first state (see FIG. 8) in which the substrate holding portion 2 is stopped at the first rotation position. As a result, the upper ends of the three push-up members 241 each come into contact with the lower surfaces of the three first lift pins 221a. The member elevating mechanism 242 further raises the three push-up members 241 so that the three push-up members 241 each push up the three first lift pins 221a upward. As a result, the three first lift pins 221a are raised. At this time, the upper end portion of the push-up member 241 is loosely inserted into the hole portion 215 of the facing plate portion 21. The member elevating mechanism 242 raises the pushing member 241 to a predetermined position, so that the first lift pin 221a is raised to a predetermined upper position. In this upper position, the tip of the first lift pin 221a is located above the upper end of the chuck pin 231.

Further, the member elevating mechanism 242 lowers the three push-up members 241 from this state. As a result, the three first lift pins 221a supported by the three push-up members 241 descend from the upper position. The member lifting mechanism 242 lowers the pushing member 241 until the upper end of the pushing member 241 is located below the lower surface 212 of the facing plate portion 21. As a result, the three first lift pins 221a stop at the lower position.

Further, the member elevating mechanism 242 raises the three push-up members 241 in the second state (see FIG. 9) in which the substrate holding portion 2 is stopped at the second rotation position. As a result, the upper ends of the three push-up members 241 each come into contact with the lower surfaces of the three second lift pins 221b. The member elevating mechanism 242 further raises the three push-up members 241 so that the three push-up members 241 each push up the three second lift pins 221b. As a result, the three second lift pins 221b are raised. At this time, the upper end portion of the push-up member 241 is loosely inserted into the hole portion 215 of the facing plate portion 21. The member elevating mechanism 242 raises the second lift pin 221b to a predetermined upper position by raising the pushing member 241 to a predetermined position. In this upper position, the tip of the second lift pin 221b is located above the upper end of the chuck pin 231. The upper position of the second lift pin 221b is substantially equal to, for example, the upper position of the first lift pin 221a.

Further, the member elevating mechanism 242 lowers the three push-up members 241 from this state. As a result, the three second lift pins 221b supported by the three push-up members 241 are lowered. The member lifting mechanism 242 lowers the pushing member 241 until the upper end of the pushing member 241 is located below the lower surface 212 of the facing plate portion 21. As a result, the three second lift pins 221b stop at the lower position.

When the member pressed by the push-up member 241 when raising the first lift pin 221a is called a first acting member, in the above example, this first acting member corresponds to the lower end portion of the first lift pin 221a. Further, when the member pressed by the pushing member 241 when the second lift pin 221b is raised is called a second acting member, in the above example, the second acting member corresponds to the lower end portion of the second lift pin 221b.

FIG. 10 is a diagram schematically showing an example of the configuration of the lift pin 221 viewed along the circumferential direction of the rotation axis J1, and FIG. 11 is a plan view schematically showing an example of the configuration of the lift pin 221 as viewed along the circumferential direction. .. In the examples of FIGS. 10 and 11, each lift pin 221 includes a support 2211 and a protrusion 220. The cross-sectional shape of the support 2211 perpendicular to the vertical direction is, for example, substantially circular. On the upper surface of the support 2211, a protruding portion 220 projecting upward is provided. For example, the protrusion 220 includes the rotation axis J1 and has a symmetrical shape with respect to the radial surface F1 (shown by the alternate long and short dash line in FIG. 11). The protrusion 220 has a lift support surface 222, a lift guide surface 224, and a lift auxiliary guide surface 226.

The lift support surface 222 is a surface that faces substantially upward, and approaches the facing surface 211 toward the rotation axis J1 side (right side of FIGS. 10 and 11). That is, the lift support surface 222 inclines downward toward the rotation shaft J1 side. Further, the lift support surface 222 has two surfaces 2221 that incline downward from the surface F1 toward both sides in the circumferential direction (approximately vertical direction in FIG. 11). The two surfaces 2221 intersect each other at an obtuse angle on the surface F1. That is, the lift support surface 222 has a corner portion 223 where the two surfaces 2221 intersect. The corner portion 223 is inclined downward toward the rotation axis J1 side. As will be described later, when the plurality of lift pins 221 support the substrate 9, the corner portions 223 of the lift pins 221 typically make substantially point contact with the lower surface side portion of the peripheral edge portion 94 of the substrate 9. Further, the inclination angle θ1 of the lift support surface 222 with respect to the facing surface 211 (horizontal plane) is smaller than the inclination angle θ4 (see FIG. 4) of the lower contact surface 235 of the chuck pin 231. That is, the slope of the lower contact surface 235 is larger than that of the lift support surface 222.

The lift guide surface 224 is a surface that faces the rotation shaft J1 side, and is continuous with the lift support surface 222 on the side opposite to the rotation shaft J1. The lift guide surface 224 also inclines downward toward the rotation axis J1 side. The lift guide surface 224 has two surfaces 2241 extending from the surface F1 toward both sides in the circumferential direction. The two surfaces 2241 intersect each other at an obtuse angle on the surface F1. That is, the lift guide surface 224 has a corner portion 225 where the two surfaces 2241 intersect. The corner portion 225 is inclined downward toward the rotation axis J1 side. On the surface F1, the inclination angle θ2 of the lift guide surface 224 with respect to the facing surface 211 (horizontal plane) (see the lift pin 221 indicated by the alternate long and short dash line in FIG. 10) is larger than the inclination angle θ1 of the lift support surface 222. In other words, the slope of the lift guide surface 224 is greater than that of the lift support surface 222. On the surface F1, the distance between the lower end of the lift guide surface 224 and the rotation axis J1 is slightly larger than the radius of the substrate 9.

The lift auxiliary guide surface 226 is a surface facing upward on the rotation shaft J1 side, and is continuous with the lift guide surface 224 on the side opposite to the rotation shaft J1. The lift auxiliary guide surface 226 also inclines downward toward the rotation shaft J1 side. The lift auxiliary guide surface 226 has two surfaces 2261 extending from the surface F1 toward both sides in the circumferential direction. The two surfaces 2261 intersect each other at an obtuse angle on the surface F1. That is, the lift auxiliary guide surface 226 has a corner portion 227 where the two surfaces 2261 intersect. The corner portion 227 is inclined downward toward the rotation axis J1 side. On the surface F1, the inclination angle θ3 of the lift auxiliary guide surface 226 with respect to the facing surface 211 (horizontal plane) (see the lift pin 221 indicated by the alternate long and short dash line in FIG. 10) is smaller than the inclination angle θ2 of the lift guide surface 224. It is larger than the inclination angle θ1 of the lift support surface 222. In other words, the lift auxiliary guide surface 226 has a smaller slope than the lift guide surface 224 and a larger slope than the lift support surface 222.

When the lift pin 221 is stopped at the lower position, the upper surface of the support 2211 of the lift pin 221 is located at the same height as the facing surface 211 or slightly above the facing surface 211. Therefore, during the treatment with the treatment liquid described later, the treatment liquid hardly collects on the upper surface of the support 2211 of the lift pin 221. Further, two drainage grooves 228 are formed in the vicinity of the lift guide surface 224 on the lift support surface 222. The two drainage grooves 228 are arranged on both sides in the circumferential direction with respect to the corner portion 223 of the lift support surface 222. Each drainage groove 228 is continuous in the circumferential direction from the vicinity of the corner portion 223 to the edge of the surface 2221. The bottom surface of the drainage groove 228 inclines downward as the distance from the corner portion 223 increases. During the treatment with the treatment liquid, the treatment liquid that has entered between the substrate 9 and the lift support surface 222 is appropriately discharged by the drainage groove 228.

As described above, the lift pin 221 is pushed up by the push-up member 241 and rises to the upper position (two-dot chain line in FIG. 10). Further, the lift pin 221 descends as the push-up member 241 descends, and descends to a lower position (solid line in FIG. 10).

The control unit 6 can control the operation of each unit of the substrate processing device 1. Specifically, the control unit 6 includes the motor 32 of the substrate rotation mechanism 3, the valve of the processing liquid supply unit 4, the valve of the inert gas supply unit 5, the nozzle movement mechanism, the member elevating mechanism 242 of the pin elevating mechanism 24, and the chuck. The magnet elevating mechanism 254 of the drive mechanism 25 can be controlled.

The control unit 6 is an electronic circuit, and may include, for example, a data processing device and a storage medium. The data processing device may be, for example, an arithmetic processing unit such as a CPU (Central Processor Unit). The storage medium may include a non-temporary storage medium (eg, ROM (Read Only Memory) or hard disk) and a temporary storage medium (eg, RAM (Random Access Memory)). For example, a program that defines the processing executed by the control unit 6 may be stored in the non-temporary storage medium. When the processing device executes this program, the control unit 6 can execute the processing specified in the program. Of course, a part or all of the processing executed by the control unit 6 may be executed by the hardware.

In the example of FIG. 2, the substrate processing device 1 is provided with the rotation sensor 7. The rotation sensor 7 is, for example, an encoder, and measures the rotation position of the substrate holding portion 2. The rotation sensor 7 outputs a measurement signal indicating the measured rotation position to the control unit 6. The control unit 6 controls the substrate rotation mechanism 3 based on the measurement signal from the rotation sensor 7. As a result, the substrate rotation mechanism 3 can control the rotation position of the substrate holding portion 2 with high accuracy. Further, the substrate rotation mechanism 3 can also control the rotation speed of the substrate holding portion 2 with high accuracy.

FIG. 12 is a flowchart showing an example of the operation of the substrate processing device 1. Initially, the chuck drive mechanism 25 drives the chuck pins 231 so that the angular positions of the plurality of chuck pins 231 are open positions. To explain in accordance with the above example, the magnet elevating mechanism 254 initially stops the open magnet 253 at a close position. In addition, the pin elevating mechanism 24 initially stops the first lift pin 221a and the second lift pin 221b at lower positions.

First, the substrate rotation mechanism 3 stops the substrate holding portion 2 at the first rotation position (step S1). In this state, the three push-up members 241 face each of the three first lift pins 221a in the vertical direction (see FIG. 8). Next, the member elevating mechanism 242 raises the push-up member 241 (step S2). As a result, the push-up member 241 pushes up the first lift pin 221a and raises the first lift pin 221a to the upper position (see also the alternate long and short dash line in FIG. 10).

Next, the center robot (conveyor) CR places the unprocessed substrate 9 on the three first lift pins 221a (step S3). Specifically, in the center robot CR, the substrate 9 is placed on the hand H with the first main surface 91 facing downward and the second main surface 92 facing upward. The center robot CR moves the hand H above the substrate holding portion 2 and then lowers the hand H. During this descent, the substrate 9 is handed over from the hand H onto the three first lift pins 221a. As a result, the substrate 9 is supported in a horizontal position by the three first lift pins 221a. Specifically, the peripheral edge portion 94 of the substrate 9 is supported from below by the lift support surfaces 222 of the three first lift pins 221a. Typically, the three first lift pins 221a come into contact only with the peripheral edge 94 of the substrate 9. Preferably, the corner portion 223 of each lift support surface 222 makes substantially point contact with the peripheral edge portion 94.

When the substrate 9 is handed over from the hand H to the first lift pin 221a, even if the center of the substrate 9 on the hand H is deviated from the rotation axis J1, the end surface 93 of the substrate 9 is the lift guide of the first lift pin 221a. By abutting against the surface 224, the center of the substrate 9 is brought closer to the rotation axis J1. That is, the eccentricity of the substrate 9 is adjusted. At this time, the end surface 93 comes into contact with, for example, the corner portion 225 of the lift guide surface 224. Here, regardless of the direction in which the center of the substrate 9 is perpendicular to the rotation axis J1 with respect to the rotation axis J1, the substrate 9 is provided by the three first lift pins 221a arranged at equal intervals in the circumferential direction. It is possible to accurately bring the center of the axis closer to the rotation axis J1. After the substrate 9 is delivered to the first lift pin 221a, the center robot CR retracts the hand H from the substrate processing device 1.

Next, the member elevating mechanism 242 lowers the push-up member 241 to lower the first lift pin 221a to a lower position (step S4). As a result, the substrate 9 supported by the first lift pin 221a is also lowered. The chuck portion 23 holds the lowered substrate 9. Specifically, the magnet elevating mechanism 254 lowers the open magnet 253 from the close position to the separate position, so that the plurality of chuck pins 231 move (rotate) from the open position to the holding position. In the movement from the open position to the holding position of each chuck pin 231, first, the peripheral edge portion 94 of the substrate 9 supported by the plurality of lift support surfaces 222 is brought to the lower contact surface 235 of the chuck pin 231 shown in FIG. The substrate 9 is slightly moved upward by being guided by the lower contact surface 235 toward the rotation shaft J1 side. Then, the end surface 93 of the substrate 9 comes into contact with the curved contact surface 234 located above the lift support surface 222. As a result, the substrate 9 is horizontally held by the plurality of chuck pins 231 in a state where the substrate 9 is separated upward from all of the plurality of lift support surfaces 222. Typically, the plurality of chuck pins 231 come into contact with only the peripheral edge portion 94 of the substrate 9.

Next, the substrate processing apparatus 1 performs processing on the substrate 9 (step S5). For example, the inert gas supply unit 5 shown in FIG. 2 starts supplying the inert gas to the space between the first main surface 91 of the substrate 9 and the facing surface 211 of the facing plate portion 21. Further, the substrate rotation mechanism 3 starts the rotation of the substrate 9 at the liquid processing rotation speed (rotation speed). The substrate 9 rotates together with the substrate holding portion 2 in a horizontal posture. The liquid processing rotation speed is, for example, 300 to 1500 rpm.

Subsequently, the processing liquid supply unit 4 starts supplying the processing liquid to the second main surface 92 of the substrate 9. On the second main surface 92, the treatment liquid spreads toward the peripheral edge portion 94 of the substrate 9 due to the centrifugal force due to the rotation of the substrate 9, and the treatment liquid is supplied to the entire second main surface 92. While the treatment liquid is being supplied to the substrate 9, the supply of the inert gas to the first main surface 91 side is continued. In the treatment liquid supply unit 4, for example, a predetermined chemical liquid is supplied to the second main surface 92, and then pure water is supplied (cleaning treatment). In this treatment, a treatment using a brush or the like may be performed in addition to the treatment liquid. Further, in the treatment liquid supply unit 4, the chemical liquid and the pure water may be discharged from different liquid nozzles.

When the supply of the treatment liquid is stopped, the substrate rotation mechanism 3 makes the rotation speed of the substrate 9 higher than the liquid treatment rotation speed, so that the substrate 9 is dried (spin-dried). By drying the substrate 9, the processing on the substrate 9 is substantially completed.

Next, the substrate rotation mechanism 3 stops the substrate holding portion 2 at the second rotation position (step S6). In this state, the three push-up members 241 face each of the three second lift pins 221b in the vertical direction (see FIG. 9).

Next, the member elevating mechanism 242 raises the push-up member 241 while the chuck portion 23 releases the holding of the substrate 9 (step S7). Specifically, first, the magnet elevating mechanism 254 raises the open magnet 253 from the open position to the close position. As a result, the chuck pin 231 moves (rotates) from the holding position to the open position, and the holding of the substrate 9 is released. In the movement from the holding position to the open position of each chuck pin 231, the chuck contact surface 232 shown in FIG. 4 faces the side opposite to the rotation axis J1, so that the peripheral portion of the substrate 9 is attached to the lower contact surface 235. With the 94 in contact, the substrate 9 moves slightly downward. Then, in this state, the member elevating mechanism 242 raises the push-up member 241 so that the push-up member 241 pushes up the second lift pin 221b and raises the second lift pin 221b to the upper position. As a result, the second lift pin 221b receives the substrate 9 from the chuck portion 23 and supports and lifts the peripheral portion 94 of the substrate 9. At this time, the peripheral edge portion 94 of the substrate 9 is supported from below by the lift support surfaces 222 of the three second lift pins 221b. Typically, the three second lift pins 221b come into contact only with the peripheral edge 94 of the substrate 9. Preferably, the corner portion 223 of each lift support surface 222 makes substantially point contact with the peripheral edge portion 94.

Next, the center robot CR takes out the processed substrate 9 from the second lift pin 221b (step S8). Specifically, the center robot CR causes the hand H to enter between the first main surface 91 of the substrate 9 and the facing plate portion 21, and then raises the hand H to lift the substrate 9 into the second lift pin 221b. Lift from. The center robot CR retracts the hand H on which the substrate 9 is placed from the substrate processing device 1. As a result, the substrate 9 is carried out of the substrate processing device 1.

Next, the member elevating mechanism 242 lowers the push-up member 241 to lower the second lift pin 221b to the lower position (step S9). As described above, the processing of the substrate 9 in the substrate processing apparatus 1 is completed.

As described above, according to the substrate processing apparatus 1, the unprocessed substrate 9 is received by the first lift pin 221a instead of the second lift pin 221b (step S3). That is, the first lift pin 221a is used when the untreated substrate 9 is carried in, whereas the second lift pin 221b is not used when the untreated substrate 9 is brought in. Therefore, even if the untreated substrate 9 is contaminated, the contamination can be transferred to the first lift pin 221a but not to the second lift pin 221b. Therefore, the second lift pin 221b is cleaner than the first lift pin 221a.

Further, according to the substrate processing apparatus 1, the cleaned substrate 9 that has been cleaned is supported by the second lift pin 221b instead of the first lift pin 221a (step S7). That is, the second lift pin 221b having a low degree of contamination is used when carrying out the treated clean substrate 9, whereas the first lift pin 221a having a high degree of contamination is not used when carrying out the treated clean substrate 9. .. Therefore, transfer of contamination from the first lift pin 221a to the treated substrate 9 can be avoided. Since the second lift pin 221b is cleaner than the first lift pin 221a, it is possible to suppress contamination of the treated substrate 9 by the second lift pin 221b.

Moreover, according to the substrate processing device 1, the first lift pin 221a and the second lift pin 221b are raised and lowered independently of each other by the common push-up member 241 (steps S2 and S7). That is, the push-up member 241 is commonly used for both the first lift pin 221a and the second lift pin 221b. Therefore, the structure of the substrate processing device 1 is simplified as compared with the structure in which both the lifting actuator dedicated to the first lift pin 221a and the lifting actuator dedicated to the second lift pin 221b are provided as in Patent Document 1. it can. As a result, the manufacturing cost of the substrate processing apparatus 1 can be reduced.

Further, according to the substrate processing device 1, the rotation of the substrate holding portion 2 by the substrate rotation mechanism 3 allows the push-up member 241 to face the first lift pin 221a and the push-up member 241 to face the second lift pin 221b. (Step S1 and step S6). That is, the substrate rotation mechanism 3 required for processing the substrate 9 is used to align the push-up member 241 with respect to the substrate holding portion 2. Therefore, the configuration of the substrate processing device 1 can be simplified and the manufacturing cost can be reduced as compared with the case where a rotation mechanism for integrally rotating the push-up member 241 and the connecting member 243 around the rotation shaft J1 is newly provided. can do.

In the above example, since the first main surface 91 facing downward of the substrate 9 is the device forming surface, the lift pin 221 supports the peripheral edge portion 94 of the substrate 9. That is, the peripheral edge portion 94 of the substrate 9 is supported so that the lift pin 221 does not come into contact with the pattern formed on the first main surface 91. However, the substrate 9 may be held by the substrate holding portion 2 with the second main surface 92, which is a device non-forming surface, facing downward. In this case, the lift pin 221 may be provided at a position closer to the rotation axis J1. In other words, the lift pin 221 may be provided at a position closer to the rotation axis J1 than the chuck pin 231. At this time, the lift pin 221 supports the second main surface 92 of the substrate 9 at a position closer to the rotation axis J1. In this case, the lift pin 221 may have a tapered shape and may make substantially point contact with the second main surface of the substrate 9.

Further, in the above example, the three first lift pins 221a are arranged at substantially equal intervals in the circumferential direction, the three second lift pins 221b are arranged at substantially equal intervals in the circumferential direction, and the three push-up members 241 are arranged at substantially equal intervals in the circumferential direction. They were arranged at approximately equal intervals in the direction. However, in the first state in which the substrate holding portion 2 is stopped at the first rotation position, the three push-up members 241 face each of the three first lift pins 221a, and the substrate holding portion 2 is stopped at the second rotation position. The arrangement of the first lift pin 221a, the second lift pin 221b, and the push-up member 241 is not limited to the above as long as the three push-up members 241 face each of the three second lift pins 221b in the second state.

The second embodiment.
A notch may be formed on the peripheral edge of the substrate 9. The notch is a recess formed on the peripheral edge of the substrate 9, and is recessed toward the center of the substrate 9 in a plan view. For example, the notch is formed in a substantially V shape in a plan view. This notch can indicate the orientation of the substrate 9. In the carrier C of FIG. 1, the substrates 9 are aligned so that the positions of the notches in the circumferential direction are equal to each other. Since the indexer robot IR and the center robot CR convey the substrate 9 while maintaining the position of the notch of the substrate 9 in the circumferential direction with respect to the hand H, the substrate 9 is conveyed in the circumferential direction of the notch when the substrate 9 is carried into the substrate processing device 1. The position is predetermined.

In the first embodiment, the substrate holding portion 2 is stopped at the first rotation position when the substrate 9 is carried in, and the substrate holding portion 2 is stopped at the second rotation position when the substrate 9 is carried out. Therefore, the position of the notch in the circumferential direction when the substrate 9 is carried out is different from the position in the circumferential direction of the notch when the board 9 is carried in. Hereinafter, a specific description will be given.

13 and 14 are views showing an example of the configuration of the pin elevating mechanism 24. In FIG. 13, the substrate 9 and the lift pin 221 at the time of carrying in are shown by the alternate long and short dash line, and in FIG. 14, the substrate 9 and the lift pin 221 at the time of carrying out are indicated by the alternate long and short dash line. As shown in FIGS. 13 and 14, a notch 95 is formed on the peripheral edge of the substrate 9.

When the board 9 is carried in, the board rotation mechanism 3 stops the board holding portion 2 at the first rotation position as described above. In this state, the push-up member 241 faces the first lift pin 221a in the vertical direction. Then, in this state, the center robot CR places the substrate 9 on the first lift pin 221a. In the example of FIG. 13, the notch 95 is located on the upper right side of the rotation axis J1 when the substrate 9 is carried in.

As described above, the substrate processing apparatus 1 lowers the first lift pin 221a to hold the substrate 9 by the chuck portion 23, and processes the substrate 9. Then, in order to carry out the processed substrate 9, the substrate rotation mechanism 3 stops the substrate holding portion 2 at a second rotation position different from the first rotation position (see FIG. 14). Then, the push-up member 241 raises the second lift pin 221b, and the second lift pin 221b lifts the substrate 9.

Therefore, the circumferential position of the notch 95 when the substrate 9 is carried out is different from the circumferential position of the notch 95 when the substrate 9 is carried in (see FIGS. 13 and 14). Specifically, the difference (angle) in the circumferential position of the notch 95 substantially coincides with the angle (here, 60 degrees) between the first rotation position and the second rotation position. As described above, it may not be preferable that the circumferential positions of the notches 95 at the time of loading and unloading the substrate processing apparatus 1 are different from each other.

Therefore, in the second embodiment, it is intended that the circumferential position of the notch 95 at the time of carrying out the substrate 9 is brought close to the circumferential position of the notch 95 at the time of carrying in the substrate 9, and preferably coincident.

The substrate processing device 1 according to the second embodiment has the same configuration as that of the first embodiment except for the configuration of the pin elevating mechanism 24. FIG. 15 is a plan view schematically showing an example of the configuration of the pin elevating mechanism 24 according to the second embodiment, and FIG. 16 is an example of the configuration of the pin elevating mechanism 24 according to the second embodiment. It is sectional drawing which shows schematicly.

The push-up member 241 of the pin elevating mechanism 24 is provided so as to be rotatable (orbiting) around the rotation shaft J1. The rotation angle range of the push-up member 241 is set to be equal to or greater than the angle between the first rotation position and the second rotation position. In the above example, since the angle between the first rotation position and the second rotation position is 60 degrees, the push-up member 241 is rotatably provided in an angle range of 60 degrees or more.

In the examples of FIGS. 15 and 16, the pin elevating mechanism 24 further includes a push-up member 241, a fixing member 244, a movable member 245, and a guide 246. In the example of FIG. 15, the movable member 245 has a substantially annular shape centered on the rotation axis J1. The movable member 245 has, for example, a rectangular shape having one side along the horizontal plane in a cross section along the radial direction of the rotation axis J1 (see FIG. 16). The lower end of the push-up member 241 is connected to the upper surface of the movable member 245. In other words, the push-up member 241 extends upward from the upper surface of the movable member 245. In the example of FIG. 15, three push-up members 241 are connected to each other by a movable member 245.

The fixing member 244 is fixed in the chamber of the substrate processing device 1. The fixing member 244 has, for example, a substantially annular shape centered on the rotation axis J1 and faces the movable member 245 at a distance in the vertical direction. The fixing member 244 has, for example, a rectangular shape with one side along the horizontal plane in a cross section along the radial direction (see FIG. 16). The fixing member 244 is fixed to the chamber.

The guide 246 connects the movable member 245 to the fixing member 244 so as to be slidable in the circumferential direction. In the illustrated example, the guide 246 is provided between the movable member 245 and the fixing member 244. The guide 246 includes a rail 2461 and a movable plate 2462. The rail 2461 has a substantially arcuate shape centered on the rotation axis J1 and is provided on the upper surface of the fixing member 244 in the example of FIG. The movable plate 2462 is slidably connected to the rail 2461 in the circumferential direction with respect to the rotation axis J1. For example, recesses (not shown) extending in the circumferential direction are formed on both side surfaces of the rail 2461, and the movable plate 2462 covers the upper surface of the rail 2461 and fits into the recesses. A rolling element (for example, a sphere) (not shown) is provided between the side surface of the rail 2461 and the side portion of the movable plate 2462, and the movable plate 2462 rotates with respect to the rail 2461 as the rolling element rotates. Slide in the direction. The upper surface of the movable plate 2462 is fixed to the lower surface of the movable member 245.

In the example of FIG. 15, a plurality of guides 246 (three in the illustrated example) are provided side by side at intervals in the circumferential direction. The three guides 246 are arranged at substantially equal intervals in the circumferential direction. The length of the rail 2461 is set so that the movable range of each guide 246 in the circumferential direction is equal to or larger than the angle between the first rotation position and the second rotation position.

The member elevating mechanism 242 integrally raises and lowers the push-up member 241 and the fixing member 244, the movable member 245, and the guide 246. For example, when the member elevating mechanism 242 includes an air cylinder, the tip of the piston rod of the air cylinder is connected to the fixing member 244. According to this, the member elevating mechanism 242 can raise the piston rod to integrally raise the pushing member 241 and the fixing member 244, the movable member 245, and the guide 246.

In the example of FIG. 15, the lift pin 221 in a state where the substrate holding portion 2 is stopped at the second rotation position is schematically shown, and the substrate 9 is also shown. In FIG. 15, the push-up member 241 faces the second lift pin 221b. That is, the substrate holding portion 2 is stopped at the second relative rotation position with respect to the push-up member 241. As illustrated in FIG. 15, in this state, the notch 95 of the substrate 9 is located substantially to the right of the rotation axis J1, which is different from the position of the notch 95 of the substrate 9 at the time of loading.

In this state, the member elevating mechanism 242 raises the push-up member 241 so that the push-up member 241 pushes up the second lift pin 221b and the second lift pin 221b lifts the substrate 9.

FIG. 17 is a side view showing an example of a schematic configuration of the substrate processing device 1. In the example of FIG. 17, the substrate holding portion 2 is stopped at the second rotation position (second relative rotation position). The push-up member 241 pushes up the second lift pin 221b, and the second lift pin 221b lifts and supports the substrate 9.

In this state, the upper end portion of the push-up member 241 is inserted into the hole portion 215 of the facing plate portion 21. Moreover, the push-up member 241 can rotate (orbit) around the rotation shaft J1. Therefore, the substrate holding portion 2 and the push-up member 241 can rotate integrally within a predetermined angle range. That is, when the substrate rotation mechanism 3 rotates the substrate holding portion 2, the facing plate portion 21 pushes the upper end portion of the push-up member 241 in the rotation direction to rotate the push-up member 241 around the rotation shaft J1. In other words, the substrate holding portion 2 can rotate around the rotation axis J1 while maintaining the second relative rotation position.

In short, the substrate holding portion 2 includes a member (opposing plate portion 21 in the illustrated example) that faces the push-up member 241 that stops at the upper position in the circumferential direction, and the member is moved as the substrate holding portion 2 rotates. The push-up member 241 is pressed in the rotational direction. As a result, the push-up member 241 rotates integrally with the substrate holding portion 2.

The substrate rotation mechanism 3 rotates the substrate holding portion 2 to the first rotation position in a state where the second lift pin 221b is pushed up by the push-up member 241 to lift the substrate 9 (FIGS. 15 and 17). As a specific example, the substrate rotation mechanism 3 rotates the substrate holding portion 2 by 60 degrees counterclockwise in FIG. Along with this rotation, the facing plate portion 21 pushes the upper end portion of the push-up member 241 in the rotation direction (counterclockwise) to integrally rotate the push-up member 241 and the movable member 245 around the rotation shaft J1. As a result, the push-up member 241 and the movable member 245 rotate integrally in the rotation direction. Further, since the substrate 9 is supported by the second lift pin 221b, the substrate 9 is also rotated by 60 degrees by the rotation of the substrate holding portion 2.

FIG. 18 schematically shows an example of the configuration of the pin elevating mechanism 24 when the substrate holding portion 2 is rotated from the second rotation position and stopped at the first rotation position while the second lift pin 221b supports the substrate 9. FIG. 19 is a diagram showing an example of a schematic configuration of the substrate processing apparatus 1. In the examples of FIGS. 18 and 19, the second lift pin 221b and the push-up member 241 are rotated (orbiting) 60 degrees counterclockwise as compared with FIGS. 15 and 17, and the substrate 9 is also counterclockwise. Rotate by 60 degrees. As a result, the circumferential position of the notch 95 of the substrate 9 can be substantially matched with the circumferential position of the notch 95 when the substrate 9 is carried in (see also FIG. 13).

Next, an example of the operation of the substrate processing apparatus 1 according to the second embodiment will be described. FIG. 20 is a flowchart showing an example of the operation of the substrate processing device 1. Initially, the chuck drive mechanism 25 drives the chuck pins 231 so that the angular positions of the plurality of chuck pins 231 are open positions. In the above example, the magnet elevating mechanism 254 initially stops the open magnet 253 at a close position. In addition, the pin elevating mechanism 24 initially stops the first lift pin 221a and the second lift pin 221b at lower positions.

First, similarly to step S1, the substrate rotation mechanism 3 stops the substrate holding portion 2 at the first rotation position (step S11). At this time, the push-up member 241 faces the first lift pin 221a in the vertical direction. That is, the substrate holding portion 2 stops at the first relative rotation position with respect to the push-up member 241. Next, similarly to step S2, the member elevating mechanism 242 raises the push-up member 241 and raises the first lift pin 221a to the upper position (step S12). Next, as in step S3, the center robot CR places the unprocessed substrate 9 on the first lift pin 221a (step S13). For example, a notch 95 is formed on the peripheral edge of the substrate 9. The circumferential position (initial position) of the notch 95 of the substrate 9 mounted on the first lift pin 221a is predetermined.

Next, as in step S4, the member elevating mechanism 242 lowers the push-up member 241 to lower the first lift pin 221a, and the chuck portion 23 holds the substrate 9 (step S14). Next, in the same manner as in step S5, the substrate processing apparatus 1 performs processing on the substrate 9 (step S15). Next, as in step S6, the substrate rotation mechanism 3 stops the substrate holding portion 2 at the second rotation position (step S16). At this time, the push-up member 241 faces the second lift pin 221b in the vertical direction. That is, the substrate holding portion 2 stops at the second relative rotation position with respect to the push-up member 241. Next, in the same manner as in step S7, the member elevating mechanism 242 raises the push-up member 241 while the chuck portion 23 releases the holding of the substrate 9, and the substrate 9 is lifted by the second lift pin 221b (step S17).

Next, the substrate rotation mechanism 3 rotates the substrate holding portion 2 to the first rotation position and stops at the first rotation position (step S18). Due to this rotation, the facing plate portion 21 pushes the three push-up members 241 toward the rotation direction, so that the three push-up members 241 and the movable member 245 rotate around the rotation shaft J1 integrally with the substrate holding portion 2. That is, the substrate holding portion 2 rotates to the first rotation position while maintaining the second relative rotation position. Further, the processed substrate 9 rotates in a state of being supported by the second lift pin 221b. Therefore, the circumferential position of the notch 95 of the substrate 9 can be substantially returned to the initial position.

Next, as in step S8, the center robot CR receives the processed substrate 9 from the second lift pin 221b (step S19). Next, the substrate rotation mechanism 3 rotates the substrate holding portion 2 from the first rotation position to the second rotation position in the opposite direction. That is, the substrate holding portion 2 rotates to the second rotation position while maintaining the second relative rotation position. As a result, the substrate holding portion 2, the push-up member 241 and the movable member 245 rotate integrally, and the circumferential position of the push-up member 241 can be returned to the original position (initial position). Next, in the same manner as in step S9, the member elevating mechanism 242 lowers the push-up member 241 to lower the second lift pin 221b to the lower position (step S21).

As described above, the substrate processing apparatus 1 also supports the unprocessed substrate 9 with the first lift pin 221a (steps S11 to S14) and the processed substrate 9 with the second lift pin 221b (step S16). From step S19). Therefore, contamination of the treated substrate 9 can be suppressed.

Further, the substrate processing device 1 also raises and lowers the first lift pin 221a and the second lift pin 221b by the push-up member 241 (steps S12 and S17). Therefore, the structure of the substrate processing device 1 is simplified as compared with the structure in which both the dedicated push-up member is provided on the first lift pin 221a and the dedicated push-up member is provided on the second lift pin 221b as in Patent Document 1. it can. As a result, the manufacturing cost of the substrate processing apparatus 1 can be reduced.

Moreover, according to the substrate processing device 1, the push-up member 241 can rotate integrally with the substrate holding portion 2 in a state where the second lift pin 221b is pushed up. Therefore, the substrate holding portion 2 can be rotated from the first rotation position to the second rotation position while the processed substrate 9 is lifted by the second lift pin 221b. Therefore, the circumferential position of the notch 95 of the substrate 9 can be substantially returned to the initial position (step S18). As a result, the center robot CR can carry in and out the substrate 9 while the substrate holding portion 2 is stopped at the same first rotation position. Therefore, the center robot CR can take out the processed substrate 9 in the orientation when it is carried into the substrate processing apparatus 1. That is, the orientation of the substrate 9 in the hand H of the center robot CR can be maintained before and after the substrate processing device 1.

In the above example, the substrate rotation mechanism 3 integrally rotates the push-up member 241 and the second lift pin 221b in a state where the push-up member 241 pushes up the second lift pin 221b and the second lift pin 221b supports the substrate 9. However, this is not always the case. The substrate rotation mechanism 3 can also rotate the substrate 9 by integrally rotating the substrate holding portion 2 and the push-up member 241 in a state where the push-up member 241 pushes up the first lift pin 221a and the first lift pin 221a supports the substrate 9. The circumferential position of the notch 95 can be adjusted. An example of a specific operation will be described below.

FIG. 21 is a flowchart showing another example of the operation of the substrate processing device 1. Initially, the chuck drive mechanism 25 drives the chuck pins 231 so that the angular positions of the plurality of chuck pins 231 are open positions. In the above example, the magnet elevating mechanism 254 initially stops the open magnet 253 at a close position. In addition, the pin elevating mechanism 24 initially stops the first lift pin 221a and the second lift pin 221b at lower positions.

First, similarly to step S1, the substrate rotation mechanism 3 stops the substrate holding portion 2 at the first rotation position (step S41). At this time, the push-up member 241 faces the first lift pin 221a in the vertical direction. That is, the substrate holding portion 2 stops at the first relative rotation position with respect to the push-up member 241. Next, as in step S2, the member elevating mechanism 242 raises the push-up member 241 and raises the first lift pin 221a to the upper position (step S42).

Next, the substrate rotation mechanism 3 rotates the substrate holding portion 2 to the second rotation position and stops at the second rotation position (step S43). Due to this rotation, the facing plate portion 21 pushes the three push-up members 241 toward the rotation direction, so that the three push-up members 241 and the movable member 245 rotate around the rotation shaft J1 integrally with the substrate holding portion 2. That is, the substrate holding portion 2 rotates to the second rotation position while maintaining the first relative rotation position.

Next, as in step S3, the center robot CR places the unprocessed substrate 9 on the first lift pin 221a (step S44). For example, a notch 95 is formed on the peripheral edge of the substrate 9. The circumferential position (initial position) of the notch 95 of the substrate 9 mounted on the first lift pin 221a is predetermined.

In this way, the unprocessed substrate 9 is carried into the substrate processing apparatus 1 with the substrate holding portion 2 stopped at the second rotation position.

Next, the substrate rotation mechanism 3 rotates the substrate holding portion 2 in the opposite direction to the first rotation position and stops at the first rotation position (step S45). Due to this rotation, the facing plate portion 21 pushes the three push-up members 241 in opposite directions, so that the three push-up members 241 and the movable member 245 rotate in the opposite direction around the rotation shaft J1 integrally with the substrate holding portion 2. To do. That is, the substrate holding portion 2 rotates to the first rotation position while maintaining the first relative rotation position. As a result, the circumferential position of the push-up member 241 can be substantially returned to the original position (initial position).

Next, as in step S4, the member elevating mechanism 242 lowers the push-up member 241 to lower the first lift pin 221a, and the chuck portion 23 holds the substrate 9 (step S46). Next, similarly to step S5, the substrate processing apparatus 1 performs processing on the substrate 9 (step S47).

Next, as in step S6, the substrate rotation mechanism 3 stops the substrate holding portion 2 at the second rotation position (step S48). At this time, the push-up member 241 faces the second lift pin 221b in the vertical direction. That is, the substrate holding portion 2 stops at the second relative rotation position with respect to the push-up member 241. The circumferential position of the notch 95 of the substrate 9 in step S48 substantially coincides with the circumferential position of the notch 95 when the substrate 9 is carried in. This is because the substrate 9 is carried in with the substrate holding portion 2 stopped at the second rotation position (step S43 and step S44).

Next, in the same manner as in step S7, the member elevating mechanism 242 raises the pushing member 241 while the chuck portion 23 releases the holding of the substrate 9, and the substrate 9 is lifted by the second lift pin 221b (step S49). Next, as in step S8, the center robot CR receives the processed substrate 9 from the second lift pin 221b (step S50). Next, in the same manner as in step S9, the member elevating mechanism 242 lowers the push-up member 241 to lower the second lift pin 221b to the lower position (step S51).

As described above, according to this operation, the center robot CR can carry in and out the substrate 9 in a state where the substrate holding portion 2 is stopped at the same second rotation position (step S43, step S44, step). From S48 to step S50). Therefore, the center robot CR can take out the processed substrate 9 in the orientation when it is carried into the substrate processing apparatus 1. That is, the orientation of the substrate 9 in the hand H of the center robot CR can be maintained before and after the substrate processing device 1.

FIG. 22 is a flowchart showing another example of the operation of the substrate processing device 1. Initially, the chuck drive mechanism 25 drives the chuck pins 231 so that the angular positions of the plurality of chuck pins 231 are open positions. In the above example, the magnet elevating mechanism 254 initially stops the open magnet 253 at a close position. In addition, the pin elevating mechanism 24 initially stops the first lift pin 221a and the second lift pin 221b at lower positions.

First, similarly to step S1, the substrate rotation mechanism 3 stops the substrate holding portion 2 at the first rotation position (step S61). At this time, the push-up member 241 faces the first lift pin 221a in the vertical direction. That is, the substrate holding portion 2 stops at the first relative rotation position with respect to the push-up member 241. Next, similarly to step S2, the member elevating mechanism 242 raises the push-up member 241 and raises the first lift pin 221a to the upper position (step S62).

Next, the substrate rotation mechanism 3 rotates the substrate holding portion 2 to the second rotation position and stops at the second rotation position (step S63). Due to this rotation, the facing plate portion 21 pushes the three push-up members 241 toward the rotation direction, so that the three push-up members 241 and the movable member 245 rotate around the rotation shaft J1 integrally with the substrate holding portion 2. That is, the substrate holding portion 2 rotates to the second rotation position while maintaining the first relative rotation position.

Next, as in step S3, the center robot CR places the unprocessed substrate 9 on the first lift pin 221a (step S64). For example, a notch 95 is formed on the peripheral edge of the substrate 9. The circumferential position (initial position) of the notch 95 of the substrate 9 mounted on the first lift pin 221a is predetermined.

In this way, the unprocessed substrate 9 is carried into the substrate processing apparatus 1 with the substrate holding portion 2 stopped at the second rotation position.

Next, as in step S4, the member elevating mechanism 242 lowers the push-up member 241 to lower the first lift pin 221a, and the chuck portion 23 holds the substrate 9 (step S65). Since the push-up member 241 lowers the first lift pin 221a in the state where the substrate holding portion 2 is stopped at the second rotation position, thereafter, the push-up member 241 is the second with the board holding portion 2 stopped at the first rotation position. It faces the lift pin 221b in the vertical direction, and faces the first lift pin 221a in the vertical direction with the substrate holding portion 2 stopped at the second rotation position. That is, the substrate holding portion 2 stops at the second rotation position with respect to the push-up member 241 by stopping at the first rotation position, and stops at the second rotation position with respect to the push-up member 241. Stop at the relative rotation position.

Next, as in step S5, the substrate processing apparatus 1 performs processing on the substrate 9 (step S66).

Next, the substrate rotation mechanism 3 stops the substrate holding portion 2 at the first rotation position (step S67). As a result, the push-up member 241 faces the second lift pin 221b in the vertical direction. Next, in the same manner as in step S7, the member elevating mechanism 242 raises the pushing member 241 while the chuck portion 23 releases the holding of the substrate 9, and the substrate 9 is lifted by the second lift pin 221b (step S68).

Next, the substrate rotation mechanism 3 rotates the substrate holding portion 2 to the second rotation position and stops at the second rotation position (step S69). Due to this rotation, the facing plate portion 21 pushes the three push-up members 241 toward the rotation direction, so that the three push-up members 241 and the movable member 245 rotate around the rotation shaft J1 integrally with the substrate holding portion 2. That is, the substrate holding portion 2 rotates to the second rotation position while maintaining the second relative position.

The circumferential position of the notch 95 of the substrate 9 in step S69 substantially coincides with the circumferential position of the notch 95 when the substrate 9 is carried in. This is because the substrate 9 is carried in with the substrate holding portion 2 stopped at the second rotation position (step S63 and step S64).

Next, as in step S8, the center robot CR receives the processed substrate 9 from the second lift pin 221b (step S70). Next, in the same manner as in step S9, the member elevating mechanism 242 lowers the push-up member 241 to lower the second lift pin 221b to the lower position (step S71).

As described above, also by this operation, the center robot CR can carry in and out the substrate 9 in a state where the substrate holding portion 2 is stopped at the same second rotation position (step S63, step S64, step S68). From step S70). Therefore, the center robot CR can take out the processed substrate 9 in the orientation when it is carried into the substrate processing apparatus 1. That is, the orientation of the substrate 9 in the hand H of the center robot CR can be maintained before and after the substrate processing device 1.

In short, the substrate rotation mechanism 3 holds the substrate holding portion 2 and the push-up member 241 in at least one of a state in which the push-up member 241 pushes up the first lift pin 221a and a state in which the push-up member 241 pushes up the second lift pin 221b. By integrally rotating, the rotation position of the substrate holding portion 2 when the first lift pin 221a receives the unprocessed substrate 9 from the center robot CR, and the substrate 9 processed by the second lift pin 221b become the center robot CR. The rotation positions of the substrate holding portions 2 at the time of delivery may be brought close to each other. More specifically, the substrate rotation mechanism 3 may make the difference between these rotation positions smaller than the angle between the first rotation position and the second rotation position (60 degrees in the above example), which is more preferable. Should match these rotation positions with each other.

In the above example, although three guides 246 provided apart from each other are provided, the present invention is not necessarily limited to this. For example, the rail 2461 may have a substantially annular shape centered on the rotation axis J1. In this case, the movable member 245 can rotate with respect to the fixed member 244 as many times as possible. In this case, the substrate holding portion 2 may be rotatable around the rotation axis J1 in only one direction. This is because the substrate holding portion 2 and the push-up member 241 can be integrally rotated from the first rotation position to the second rotation position by the rotation in one direction, and the substrate holding portion 2 and the push-up member 241 can be rotated in the second rotation. This is because it can be integrally rotated from the position to the first rotation position.

A third embodiment.
The configuration of the substrate processing apparatus 1 according to the third embodiment is the same as that of the substrate processing apparatus 1 according to the first or second embodiment. In the third embodiment, the processing of the dummy substrate will be described. The dummy substrate is, for example, a substrate for testing, and is a substrate for confirming whether the substrate processing device 1 operates correctly. Although the dummy substrate has substantially the same shape as the substrate 9, it is not always necessary to form a pattern for the device.

The substrate processing apparatus 1 processes a dummy substrate at predetermined time intervals (for example, every day). Since this dummy substrate is used repeatedly, it is stored in a predetermined storage position after the processing is completed. Due to this long-term storage, contamination can accumulate on the dummy substrate. Such a dummy substrate may not be completely cleaned even by the cleaning treatment, and the degree of contamination of the treated dummy substrate may be higher than that of the treated substrate 9.

Alternatively, the dummy substrate may be a substrate 9 for inspection. When a pattern is formed on the first main surface 91 of the substrate 9, it may be confirmed whether or not the pattern is correctly formed. In this case, the substrate 9 may be delivered to the substrate holding portion 2 so that the first main surface 91 of the substrate 9 faces upward in order to process the first main surface 91 of the substrate 9. In this case, the lift pin 221 supports the second main surface 92 (for example, the peripheral edge thereof) of the substrate 9. Since the second main surface 92 of the substrate 9 is a device non-forming surface, the degree of contamination may be higher than that of the first main surface 91.

Therefore, the substrate processing device 1 uses the first lift pin 221a both when the dummy substrate is carried in and when the dummy substrate is carried out. In other words, the second lift pin 221b is not used for the dummy substrate.

FIG. 23 is a flowchart showing an example of the operation of the substrate processing device 1. Initially, the chuck drive mechanism 25 drives the chuck pins 231 so that the angular positions of the plurality of chuck pins 231 are open positions. In the above example, the magnet elevating mechanism 254 initially stops the open magnet 253 at a close position. In addition, the pin elevating mechanism 24 initially stops the first lift pin 221a and the second lift pin 221b at lower positions.

First, similarly to step S1, the substrate rotation mechanism 3 stops the substrate holding portion 2 at the first rotation position (first relative rotation position) (step S31). Next, as in step S2, the member elevating mechanism 242 raises the push-up member 241 (step S32). As a result, the push-up member 241 pushes up the first lift pin 221a and raises the first lift pin 221a to the upper position.

Next, as in step S3, the center robot CR places the unprocessed dummy substrate on the first lift pin 221a (step S33). Next, similarly to step S4, the member elevating mechanism 242 lowers the push-up member 241 to lower the first lift pin 221a (step S34). As a result, the dummy substrate supported by the first lift pin 221a is also lowered. Then, the chuck portion 23 holds the lowered dummy substrate. Next, in the same manner as in step S5, the substrate processing apparatus 1 performs processing on the dummy substrate (step S35).

Next, the substrate rotation mechanism 3 stops the substrate holding portion 2 at the first rotation position (first relative rotation position) (step S36). In this state, the three push-up members 241 face each of the three first lift pins 221a in the vertical direction. Next, the member elevating mechanism 242 raises the push-up member 241 while the chuck portion 23 releases the holding of the substrate 9 (step S37). As a result, the push-up member 241 raises the first lift pin 221a, and the first lift pin 221a receives the dummy substrate from the chuck portion 23 and lifts the dummy substrate.

Next, as in step S8, the center robot CR takes out the processed dummy substrate from the first lift pin 221a (step S38). Next, the member elevating mechanism 242 lowers the push-up member 241 to lower the first lift pin 221a to a lower position (step 39). As described above, the processing of the dummy substrate in the substrate processing apparatus 1 is completed.

As described above, in the substrate processing apparatus 1, the first lift pin 221a is used both when the dummy substrate is carried in and when the dummy substrate is carried out. In other words, the second lift pin 221b is not used for the dummy substrate. Therefore, it is possible to prevent the contamination of the dummy substrate from being transferred to the second lift pin 221b. Therefore, when the substrate processing apparatus 1 processes the substrate 9, it is possible to prevent the contamination of the dummy substrate from being transferred to the treated clean substrate 9 via the lift pin 221.

Modification example.
The substrate processing device 1 according to the modified example has the same configuration as that of the first to third embodiments except for the configuration of the lift portion 22.

FIG. 24 is a plan view schematically showing an example of the configuration of the lift portion 22 according to the modified example. In the example of FIG. 24, the three first lift pins 221a are provided at positions closer to the rotation axis J1 than the chuck pin 231 and on a reference circle centered on the rotation axis J1. Further, in the example of FIG. 24, the three second lift pins 221b are provided at positions closer to the rotation axis J1 than the first lift pin 221a and on a reference circle centered on the rotation axis J1.

In the example of FIG. 24, the three first lift pins 221a are connected to each other by a connecting member 222a. The connecting member 222a has a substantially annular shape centered on the rotation axis J1. Further, the connecting member 222a includes a protruding portion protruding toward the rotation shaft J1 side. Hereinafter, this protruding portion will be referred to as a first acting member 223a.

The three second lift pins 221b are connected to each other by a connecting member 222b. The connecting member 222b has a substantially annular shape centered on the rotation axis J1. Specifically, in the example of FIG. 24, the connecting member 222b has an arcuate shape centered on the rotation axis J1 in a region in the circumferential direction different from that of the first acting member 223a, and is in the vicinity of the first acting member 223a. Then, it is recessed toward the rotating shaft J1 so as to avoid the first acting member 223a. The connecting member 222b includes a second acting member 223b that is aligned with the first acting member 223a in the circumferential direction with respect to the rotation axis J1. In the example of FIG. 24, a part of the arc portion centered on the rotation axis J1 of the connecting member 222b corresponds to the second acting member 223b.

An annular space for accommodating the connecting member 222a and the connecting member 222b is formed inside the facing plate portion 21 of the substrate holding portion 2, and the annular space is formed in each of the first acting member 223a and the second acting member 223b. At a position facing the surface, the lower surface 212 of the facing plate portion 21 opens. That is, a hole (opening) communicating with the lower surface of the first acting member 223a is formed on the lower surface 212 of the facing plate portion 21, and a hole (opening) communicating with the lower surface of the second acting member 223b is formed. Is formed.

In the example of FIG. 24, the push-up member 241 is shown by a broken line. In the example of FIG. 24, one push-up member 241 is provided, unlike the specific examples of the first to third embodiments. In the first state in which the substrate holding portion 2 is stopped at the first relative rotation position, the push-up member 241 faces the first acting member 223a in the vertical direction. When the member elevating mechanism 242 raises the pushing member 241, the upper end of the pushing member 241 comes into contact with the lower surface of the first acting member 223a. When the member elevating mechanism 242 further raises the pushing member 241, the pushing member 241 pushes up the first acting member 223a. As a result, the three first lift pins 221a connected to the first working member 223a are raised. Further, the member elevating mechanism 242 can lower the three first lift pins 221a integrally by lowering the push-up member 241 from this state.

FIG. 25 is a diagram schematically showing an example of the configuration of the lift portion 22 in the second state in which the substrate holding portion 2 is stopped at the second relative rotation position. As shown in FIG. 25, in the second state in which the substrate holding portion 2 is stopped at the second relative rotation position, the push-up member 241 faces the second acting member 223b in the vertical direction. When the member elevating mechanism 242 raises the pushing member 241, the upper end of the pushing member 241 comes into contact with the lower surface of the second acting member 223b. When the member elevating mechanism 242 further raises the pushing member 241, the pushing member 241 pushes up the second acting member 223b. As a result, the second lift pin 221b connected to the second acting member 223b rises. Further, the member elevating mechanism 242 can lower the three second lift pins 221b integrally by lowering the push-up member 241 from this state.

The substrate processing device 1 according to the modified example also allows the push-up member 241 to raise and lower the first lift pin 221a and the second lift pin 221b independently of each other.

In the examples of FIGS. 24 and 25, although the positions of the first lift pin 221a, the second lift pin 221b, and the chuck pin 231 in the radial direction are different, they may be provided on the same reference circle. Even in this state, the first lift pins 221a are connected to each other by a predetermined first connecting member, and the second lift pins 221b are connected to each other by a second connecting member having a shape that does not overlap with the first connecting member in a plan view. It is good to connect. Then, the first acting member and the second acting member arranged in the circumferential direction of the rotation shaft J1 may be provided on the first connecting member and the second connecting member, respectively. The push-up member 241 is provided on a reference circle centered on the rotation axis J1 in which the first acting member and the second acting member are lined up in a plan view. As a result, by rotating the substrate holding portion 2, the push-up member 241 can be made to face each of the first acting member and the second acting member in the vertical direction.

Although the embodiment has been described above, the substrate processing apparatus 1 can make various changes other than those described above as long as it does not deviate from the purpose. Within the scope of its disclosure, the present embodiment can be freely combined with each embodiment, modified any component of each embodiment, or can omit any component in each embodiment. is there.

The substrate processing device 1 can be modified in various ways. For example, in the above embodiment, three first lift pins 221a and three second lift pins 221b are provided, but from the viewpoint of supporting the substrate 9 from below, the number of the first lift pins 221a and the second lift pins 221b is four. It may be the above. Further, as described above, the lift guide surfaces 224 of the plurality of lift pins 221 bring the center of the substrate 9 closer to the rotation axis J1 when the substrate 9 is delivered to and from the center robot CR. In this case, from the viewpoint of accurately bringing the center of the substrate 9 closer to the rotation axis J1 in various directions perpendicular to the rotation axis J1, the lift portion 22 is the first of four or more arranged at equal intervals in the circumferential direction. It is preferable to include a lift pin 221a and four or more second lift pins 221b.

Further, in the above example, six chuck pins 231 are provided, but from the viewpoint of holding the peripheral edge portion 94 of the substrate 9, the number of chuck pins 231 may be 3 or more. Further, although the chuck drive mechanism 25 drives the chuck pin 231 by a magnet, the chuck pin 231 may be driven by, for example, a motor. Further, in the above example, although the plurality of chuck pins 231 are integrally driven, at least one of them may be driven independently of the other at least one. According to this, during the processing of the substrate 9, the chuck pins 231 holding the substrate 9 can be sequentially switched, and processing defects at the holding position of the chuck pins 231 can be suppressed.

The shapes of the lift support surface 222 and the lift guide surface 224 shown in FIGS. 10 and 11 and the shapes of the chuck contact surface 232 shown in FIGS. 4 and 5 are merely examples and may be changed as appropriate.

Further, the chuck portion 23 does not necessarily have to include the chuck pin 231. The chuck portion 23 may attract the lower surface of the substrate 9 to hold the substrate 9. For example, the chuck portion 23 may include a plurality of suction holes formed on the facing surface 211 of the facing plate portion 21, and a suction mechanism for sucking gas from the plurality of suction holes. As a result, the substrate 9 can be attracted to the facing surface 211 of the facing plate portion 21. Alternatively, the chuck portion 23 may include a plurality of electrodes on the facing surface 211 side of the facing plate portion 21, and a power source for generating static electricity on the plurality of electrodes. As a result, the substrate 9 can be electrostatically chucked.

1 Board processing device 2 Board holding part 3 Rotation mechanism (board rotation mechanism)
4 Cleaning processing unit (processing liquid supply unit)
7 Rotation sensor 23 Chuck part 221a 1st lift pin 221b 2nd lift pin 231a 1st working member 231b 1st working member 241 Push-up member 242 Lifting mechanism (member lifting mechanism)
244 Fixed member 245 Movable member 246 Guide CR transport device (center robot)

Claims (13)

A chuck portion that holds the substrate in a horizontal position, three or more first lift pins and three or more second lift pins that are provided so as to be able to move up and down with respect to the chuck portion and support the substrate, and the first lift pin. A substrate holding portion including a first acting member to be connected and a second acting member provided at a position different from that of the first acting member in the circumferential direction of the substrate and connected to the second lift pin.
A rotation mechanism that rotates the substrate holding portion around a rotation axis that passes through the central portion of the substrate and runs in the vertical direction.
A push-up member provided so as to be able to move up and down vertically below the substrate holding portion.
A lifting mechanism for raising and lowering the push-up member with respect to the substrate holding portion is provided.
The push-up member faces the first acting member in the vertical direction in the first state in which the substrate holding portion is stopped at the first relative rotation position with respect to the pushing-up member, and the substrate holding portion is attached to the pushing-up member. On the other hand, in the second state stopped at the second relative rotation position, the second working member faces the second working member in the vertical direction.
The elevating mechanism raises the first lift pin by raising the pushing member in the first state and pushing up the first acting member, and raises the pushing member in the second state to push up the second working member. A substrate processing device that raises the second lift pin by pushing up an operating member. The substrate processing apparatus according to claim 1.
A cleaning processing unit that performs cleaning processing on the substrate held by the substrate holding unit is provided.
The elevating mechanism
In the first state, the push-up member is raised to raise three or more of the first lift pins, and the untreated substrate is received from an external transfer device by the three or more first lift pins.
In the first state, the push-up member is lowered to hold the untreated substrate in the chuck portion.
The processed substrate treated by the cleaning processing unit is lifted by the pushing member in the second state to raise three or more of the second lift pins, and the substrate is lifted from the chuck portion by three or more of the above. A board processing device that is received by the second lift pin. The substrate processing apparatus according to claim 1 or 2.
The first working member is the lower end of each of the first lift pins.
The second working member is the lower end of each of the second lift pins.
The push-up members are provided in the same number as the first lift pin or the second lift pin, and are connected to each other.
The push-up member faces the lower end of the first lift pin in the first state, respectively.
The push-up member faces the lower end of the second lift pin in the second state, respectively.
The elevating mechanism is a substrate processing device that integrally elevates and elevates the push-up member in each of the first state and the second state. The substrate processing apparatus according to claim 2.
The push-up member can rotate integrally with the substrate holding portion in a state where the first lift pin is pushed up.
A substrate processing device in which the push-up member can rotate integrally with the substrate holding portion even when the second lift pin is pushed up. The substrate processing apparatus according to claim 4.
The rotating mechanism integrally rotates the substrate holding portion and the pushing member in at least one of a state in which the pushing member pushes up the first lift pin and a state in which the pushing member pushes up the second lift pin. The rotational position of the substrate holding portion when the first lift pin receives the unprocessed substrate from the transfer device, and the said when the second lift pin delivers the processed substrate to the transfer device. A board processing device that brings the rotation positions of the board holders closer to each other. The substrate processing apparatus according to claim 4 or 5.
The substrate holding portion is in the first state of stopping at the first relative rotation position with respect to the push-up member while stopped at the first rotation position.
The substrate holding portion is in the second state of being stopped at the second relative rotation position with respect to the pushing member while being stopped at the second rotation position.
The elevating mechanism
In the first state, the first lift pin is raised by raising the push-up member, and the untreated substrate is received by the first lift pin.
In the first state, the first lift pin is lowered by lowering the push-up member to hold the unprocessed substrate in the chuck portion.
In the second state, the second lift pin is raised by raising the push-up member, and the processed substrate is received from the chuck portion by the second lift pin.
The rotation mechanism is a substrate processing device that rotates the substrate holding portion to the first rotation position while the substrate that has been processed by the second lift pin is lifted. The substrate processing apparatus according to claim 6.
The rotation mechanism rotates the substrate holding portion to the second rotation position when the processed substrate lifted by the second lift pin is carried out by the transfer device.
The elevating mechanism is a substrate processing device that lowers the push-up member to lower the second lift pin in the second state in which the substrate holding portion is stopped at the second rotation position. The substrate processing apparatus according to claim 4 or 5.
The substrate holding portion is in the first state of stopping at the first relative rotation position with respect to the push-up member while stopped at the first rotation position.
The substrate holding portion is in the second state of being stopped at the second relative rotation position with respect to the pushing member while being stopped at the second rotation position.
The rotation mechanism
With the first lift pin raised by the elevating mechanism in the first state, the substrate holding portion is rotated to the second rotation position, and the substrate untreated in the second state is lifted by the first lift pin. Received at
With the untreated substrate lifted by the first lift pin, the substrate holding portion is rotated to the first rotation position.
The elevating mechanism
In the first state, the first lift pin is lowered by lowering the push-up member to hold the unprocessed substrate in the chuck portion.
A substrate processing apparatus that raises the second lift pin by raising the push-up member in the second state, and receives the processed substrate from the chuck portion by the second lift pin. The substrate processing apparatus according to any one of claims 4 to 8.
A movable member connected to the push-up member and
Fixing member and
A substrate processing apparatus further comprising a guide for slidably fixing the movable member to the fixing member along the circumferential direction of the rotation axis. The substrate processing apparatus according to claim 2.
The elevating mechanism
In the first state, the push-up member is raised to push up the first lift pin, an unprocessed dummy substrate is received by the first lift pin from an external transfer device, and the push-up member is lowered to push up the unprocessed dummy substrate. Is held by the chuck portion,
A substrate processing apparatus that receives the processed dummy substrate processed by the cleaning processing unit from the chuck unit by raising the push-up member in the first state by the first lift pin. The substrate processing apparatus according to any one of claims 1 to 10.
A substrate processing apparatus further comprising a rotation sensor for measuring the rotation position of the substrate holding portion. The board processing apparatus according to any one of claims 1 to 11, a carry-in section for carrying in the board, and a board delivery section for receiving the board from the carry-in section and delivering it to the board processing device. Including substrate processing system. A chuck portion that holds the substrate in a horizontal position, three or more first lift pins and three or more second lift pins that are vertically movable with respect to the chuck portion and support the substrate, and the first lift pin. A substrate holding portion including a first acting member to be connected and a second acting member provided at a position different from that of the first acting member in the circumferential direction of the substrate and connected to the second lift pin is provided on the substrate. The first step of stopping the rotation axis along the vertical direction through the central portion of the above member at the first relative rotation position with respect to the pushing member.
After the first step, a push-up member provided vertically below the substrate holding portion and facing the first acting member in the vertical direction in a first state in which the substrate holding portion is stopped at the first relative rotation position. In the second step of raising the first lift pin by raising the first working member with respect to the substrate holding portion.
The third step of stopping the substrate holding portion at the second relative rotation position with respect to the pushing member, and
After the third step, in the second state where the substrate holding portion is stopped at the second relative rotation position, the pushing member which faces the second acting member in the vertical direction is raised with respect to the substrate holding portion. A substrate processing method comprising a fourth step of raising the second lift pin by pushing up the second working member.

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