JP2021016225A5 - - Google Patents

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Publication number
JP2021016225A5
JP2021016225A5 JP2019128706A JP2019128706A JP2021016225A5 JP 2021016225 A5 JP2021016225 A5 JP 2021016225A5 JP 2019128706 A JP2019128706 A JP 2019128706A JP 2019128706 A JP2019128706 A JP 2019128706A JP 2021016225 A5 JP2021016225 A5 JP 2021016225A5
Authority
JP
Japan
Prior art keywords
cover
electronic device
cover body
direction perpendicular
end portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2019128706A
Other languages
English (en)
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JP2021016225A (ja
JP7288363B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2019128706A priority Critical patent/JP7288363B2/ja
Priority claimed from JP2019128706A external-priority patent/JP7288363B2/ja
Priority to EP20157664.2A priority patent/EP3764761A1/en
Priority to US16/826,836 priority patent/US11558967B2/en
Priority to CN202010255665.2A priority patent/CN112218483B/zh
Publication of JP2021016225A publication Critical patent/JP2021016225A/ja
Publication of JP2021016225A5 publication Critical patent/JP2021016225A5/ja
Application granted granted Critical
Publication of JP7288363B2 publication Critical patent/JP7288363B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Claims (1)

  1. 請求項２に記載の電子機器であって、
    前記カバーは、
    前記カバー本体の下端部から前記カバー本体に対して垂直方向に拡がるカバー底面部
    をさらに有する、電子機器。
JP2019128706A 2019-07-10 2019-07-10 電子機器および電子制御装置 Active JP7288363B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2019128706A JP7288363B2 (ja) 2019-07-10 2019-07-10 電子機器および電子制御装置
EP20157664.2A EP3764761A1 (en) 2019-07-10 2020-02-17 Electronic equipment and electronic control device
US16/826,836 US11558967B2 (en) 2019-07-10 2020-03-23 Electronic equipment and electronic control device
CN202010255665.2A CN112218483B (zh) 2019-07-10 2020-04-02 电子设备和电子控制装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019128706A JP7288363B2 (ja) 2019-07-10 2019-07-10 電子機器および電子制御装置

Publications (3)

Publication Number Publication Date
JP2021016225A JP2021016225A (ja) 2021-02-12
JP2021016225A5 true JP2021016225A5 (ja) 2022-06-01
JP7288363B2 JP7288363B2 (ja) 2023-06-07

Family

ID=69650522

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019128706A Active JP7288363B2 (ja) 2019-07-10 2019-07-10 電子機器および電子制御装置

Country Status (4)

Country Link
US (1) US11558967B2 (ja)
EP (1) EP3764761A1 (ja)
JP (1) JP7288363B2 (ja)
CN (1) CN112218483B (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4307850A3 (en) * 2019-11-18 2024-04-17 Huawei Digital Power Technologies Co., Ltd. Electronic component with enclosure frame, circuit board with electronic component, and electronic device
WO2021186935A1 (ja) * 2020-03-19 2021-09-23 富士電機株式会社 電力変換装置

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4563725A (en) * 1983-01-06 1986-01-07 Welwyn Electronics Limited Electrical assembly
US4972294A (en) * 1989-04-03 1990-11-20 Motorola, Inc. Heat sink clip assembly
US5274193A (en) * 1992-04-24 1993-12-28 Chrysler Corporation Heat sink spring and wedge assembly
US5450284A (en) * 1994-02-17 1995-09-12 Spacelabs Medical, Inc. Heat sink and transistor retaining assembly
JPH10107189A (ja) * 1996-09-25 1998-04-24 Sony Corp 放熱装置
US6043981A (en) * 1997-11-13 2000-03-28 Chrysler Corporation Heat sink assembly for electrical components
JP3790225B2 (ja) * 2003-03-25 2006-06-28 東芝キヤリア株式会社 放熱装置
JP4154325B2 (ja) * 2003-12-19 2008-09-24 株式会社日立産機システム 電気回路モジュール
US20050264998A1 (en) 2004-05-25 2005-12-01 3M Innovative Properties Company Heat sink assembly
KR100686029B1 (ko) * 2005-02-25 2007-02-22 엘지전자 주식회사 전기레인지의 히트싱크의 반도체칩 고정구조
TW200846881A (en) * 2007-05-18 2008-12-01 Acbel Polytech Inc Mounting device for chips and heat dissipating fins
AT507352B1 (de) * 2008-10-01 2013-04-15 Siemens Ag Kühlanordnung
JPWO2010119546A1 (ja) * 2009-04-16 2012-10-22 三菱電機株式会社 発熱部品固定金具
KR200484015Y1 (ko) 2013-09-12 2017-07-20 엘에스산전 주식회사 전력 변환 장치
JP5954305B2 (ja) 2013-12-17 2016-07-20 Tdk株式会社 固定金具
JP6552327B2 (ja) 2015-08-10 2019-07-31 ダイヤモンド電機株式会社 電力変換装置

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