JP2021014938A - Outdoor unit for refrigeration cycle device - Google Patents

Outdoor unit for refrigeration cycle device Download PDF

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JP2021014938A
JP2021014938A JP2019128720A JP2019128720A JP2021014938A JP 2021014938 A JP2021014938 A JP 2021014938A JP 2019128720 A JP2019128720 A JP 2019128720A JP 2019128720 A JP2019128720 A JP 2019128720A JP 2021014938 A JP2021014938 A JP 2021014938A
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power supply
semiconductor elements
control circuit
fins
air
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JP7333500B2 (en
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宏文 山脇
Hirofumi Yamawaki
宏文 山脇
一平 二見
Ippei Futami
一平 二見
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Toshiba Carrier Corp
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Toshiba Carrier Corp
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Abstract

To provide an outdoor unit for a refrigeration cycle device improving cooling efficiency of power supply semiconductor elements of a compressor control circuit plate and preventing damage on the power supply semiconductor elements and/or degradation in electrical characteristics.SOLUTION: An indoor unit 1 for a refrigeration cycle device includes: a heat exchanger 5 heat-exchanging air and refrigerant; a blower 13 blowing air passing through the heat exchanger 5 to the outside of a housing 12; a compressor 6 compressing and discharging the refrigerant; a compressor control circuit plate 35 on which a plurality of power supply semiconductor elements 51 driving and controlling the compressor 6; and a first heat sink 55 thermally contact to the plurality of power supply semiconductor elements 51 to cool the plurality of power supply semiconductor elements 51. The first heat sink 55 extends along an air current flowing in the housing 12 and has a plurality of fins 61 arranged in a direction intersecting the air current. The plurality of power supply semiconductor elements 51 are arranged in a line in a direction where the plurality of fins 61 are arranged.SELECTED DRAWING: Figure 5

Description

本発明の実施形態は、冷凍サイクル装置の室外機に関する。 An embodiment of the present invention relates to an outdoor unit of a refrigeration cycle device.

上下に並んで配置される複数の送風機と、送風機を駆動する複数の送風機用インバーター基板と、複数の送風機用インバーター基板を収容する電装品ユニットHと、を備えた冷凍サイクル装置の室外ユニットが知られている。複数の送風機用インバーター基板は、上下に並べて配置されている。 The outdoor unit of the refrigeration cycle device, which includes a plurality of blowers arranged one above the other, a plurality of inverter boards for blowers for driving the blowers, and an electrical component unit H for accommodating a plurality of inverter boards for blowers, is known. Has been done. A plurality of inverter boards for blowers are arranged one above the other.

特開2015−187506号公報JP-A-2015-187506

冷凍サイクル装置の室外機は、冷媒を圧縮する圧縮機と、圧縮機を駆動制御する圧縮機制御回路板と、を備えている。圧縮機制御回路板には、複数の電源用半導体素子が実装されている。一般に、圧縮機を駆動する電動機の方が送風機の電動機よりも出力が大きいため、これら圧縮機制御回路板の電源用半導体素子は、送風機制御回路板の電源用半導体素子よりも発熱量が大きい。 The outdoor unit of the refrigeration cycle device includes a compressor that compresses the refrigerant and a compressor control circuit board that drives and controls the compressor. A plurality of semiconductor elements for power supply are mounted on the compressor control circuit board. In general, since the electric motor that drives the compressor has a larger output than the electric motor of the blower, the power supply semiconductor element of these compressor control circuit boards has a larger heat generation amount than the power supply semiconductor element of the blower control circuit board.

そして、従来の冷凍サイクル装置の室外機は、圧縮機制御回路板の電源用半導体素子を冷却する構造に改善の余地がある。 Further, in the outdoor unit of the conventional refrigeration cycle device, there is room for improvement in the structure for cooling the semiconductor element for power supply of the compressor control circuit board.

そこで、本発明は、圧縮機制御回路板の電源用半導体素子の冷却効率を向上させて、これら電源用半導体素子の損傷や、電気的特性の劣化を防ぐことが可能な冷凍サイクル装置の室外機を提供することを目的とする。 Therefore, the present invention is an outdoor unit of a refrigeration cycle apparatus capable of improving the cooling efficiency of the semiconductor element for power supply of the compressor control circuit board to prevent damage to the semiconductor element for power supply and deterioration of electrical characteristics. The purpose is to provide.

本発明の実施形態に係る冷凍サイクル装置の室外機は、筐体と、前記筐体内に配置されて、空気と内部を流通する冷媒とを熱交換させる熱交換器と、前記筐体の外側から前記空気を吸い込み、前記筐体内に吸い込んだ前記空気を前記熱交換器を通過させ、熱交換された前記空気を前記筐体の外側へ吹き出す送風機と、前記冷媒を圧縮して吐出し、前記熱交換器に流通させる圧縮機と、前記圧縮機を駆動制御する複数の電源用半導体素子が実装される回路板と、前記複数の電源用半導体素子に熱的に接して前記複数の電源用半導体素子を冷却するヒートシンクと、を備え、前記ヒートシンクは、前記筐体内で流動する前記空気の流れに沿って延び、かつ前記空気の流れに交差する方向へ並ぶ複数のフィンを有し、前記複数の電源用半導体素子は、前記複数のフィンが並ぶ方向へ一列に並ぶ、または前記複数のフィンが延びる方向よりも前記複数のフィンが並ぶ方向へ多数、格子状に並んでいる。 The outdoor unit of the refrigeration cycle apparatus according to the embodiment of the present invention is a heat exchanger arranged inside the housing and exchanging heat between air and a refrigerant flowing inside, and from the outside of the housing. The heat is sucked in, the air sucked into the housing is passed through the heat exchanger, and the heat exchanged air is blown out to the outside of the housing by compressing and discharging the refrigerant. A compressor distributed in an exchanger, a circuit board on which a plurality of power supply semiconductor elements for driving and controlling the compressor are mounted, and the plurality of power supply semiconductor elements in thermal contact with the plurality of power supply semiconductor elements. The heat sink comprises a plurality of fins extending along the flow of the air flowing in the housing and lining up in a direction intersecting the flow of the air, and the plurality of power supplies. The semiconductor elements for use are arranged in a line in the direction in which the plurality of fins are arranged, or are arranged in a grid pattern in a direction in which the plurality of fins are arranged rather than in a direction in which the plurality of fins are extended.

本発明の実施形態に係る冷凍サイクル装置の室外機の斜視図。The perspective view of the outdoor unit of the refrigeration cycle apparatus which concerns on embodiment of this invention. 本発明の実施形態に係る冷凍サイクル装置の室外機の正面図。The front view of the outdoor unit of the refrigeration cycle apparatus which concerns on embodiment of this invention. 本発明の実施形態に係る室外機に収容される電気部品箱および制御装置を示す斜視図。The perspective view which shows the electric component box and the control device housed in the outdoor unit which concerns on embodiment of this invention. 本発明の実施形態に係る室外機に収容される電気部品箱および制御装置を示す斜視図。The perspective view which shows the electric component box and the control device housed in the outdoor unit which concerns on embodiment of this invention. 本発明の実施形態に係る室外機の第一ヒートシンクと電源用半導体素子との配置関係を示す概念図。The conceptual diagram which shows the arrangement relation of the 1st heat sink of the outdoor unit which concerns on embodiment of this invention, and the semiconductor element for a power source. 本発明の実施形態に係る室外機の第二部品箱の断面図。The cross-sectional view of the second part box of the outdoor unit which concerns on embodiment of this invention.

本発明に係る冷凍サイクル装置の室外機の実施形態について図1から図6を参照して説明する。なお、複数の図面中、同一または相当する構成には同一の符号を付している。 An embodiment of the outdoor unit of the refrigeration cycle apparatus according to the present invention will be described with reference to FIGS. 1 to 6. In the plurality of drawings, the same or corresponding configurations are designated by the same reference numerals.

図1は、本発明の実施形態に係る冷凍サイクル装置の室外機の斜視図である。 FIG. 1 is a perspective view of an outdoor unit of a refrigeration cycle device according to an embodiment of the present invention.

図2は、本発明の実施形態に係る冷凍サイクル装置の室外機の正面図である。 FIG. 2 is a front view of the outdoor unit of the refrigeration cycle device according to the embodiment of the present invention.

冷凍サイクル装置は、熱源側の熱交換器5と、圧縮機6と、利用側の熱交換器(図示省略)と、膨張弁(図示省略)と、これらの機器に冷媒を流通させる冷媒管(図示省略)と、を有する冷凍サイクル(図示省略)を備えている。冷凍サイクルは、冷凍サイクル装置の冷却運転と加熱運転とを切り替える四方弁(図示省略)を備えていても良い。 The refrigeration cycle device includes a heat exchanger 5 on the heat source side, a compressor 6, a heat exchanger on the user side (not shown), an expansion valve (not shown), and a refrigerant pipe (not shown) for circulating refrigerant through these devices. It includes a refrigeration cycle (not shown) and a refrigeration cycle (not shown). The refrigeration cycle may include a four-way valve (not shown) that switches between a cooling operation and a heating operation of the refrigeration cycle apparatus.

本実施形態に冷凍サイクル装置の室外機1は、冷凍サイクルの熱源側の熱交換器5、圧縮機6、膨張弁、四方弁、および冷媒管の一部を収容している。 In the present embodiment, the outdoor unit 1 of the refrigeration cycle apparatus accommodates a heat exchanger 5, a compressor 6, an expansion valve, a four-way valve, and a part of a refrigerant pipe on the heat source side of the refrigeration cycle.

また、図1に示すように、室外機1は、空気取入口(図示省略)と空気吹出口11とを有する筐体12と、筐体12内に配置されて、空気と内部を流通する冷媒とを熱交換させる熱交換器5と、筐体12の外側から空気を吸い込み、筐体12内に吸い込んだ空気を熱交換器5を通過させ、熱交換された空気を筐体12の外側へ吹き出す送風機13と、冷媒を圧縮して吐出し、熱交換器5に流通させる圧縮機6と、冷凍サイクル装置の運転を制御する制御装置15と、制御装置15を収容する電気部品箱16と、を備えている。 Further, as shown in FIG. 1, the outdoor unit 1 has a housing 12 having an air intake port (not shown) and an air outlet 11 and a refrigerant arranged in the housing 12 and flowing through the air and the inside. Air is sucked from the outside of the housing 12 and the heat exchanger 5 that exchanges heat with each other, the air sucked into the housing 12 is passed through the heat exchanger 5, and the heat exchanged air is sent to the outside of the housing 12. A blower 13 that blows out, a compressor 6 that compresses and discharges the refrigerant and distributes it to the heat exchanger 5, a control device 15 that controls the operation of the refrigeration cycle device, and an electrical component box 16 that houses the control device 15. It has.

熱交換器5、送風機13、圧縮機6、四方弁および電気部品箱16は、筐体12内に収容されている。 The heat exchanger 5, the blower 13, the compressor 6, the four-way valve, and the electric component box 16 are housed in the housing 12.

本実施形態に係る室外機1は、据付状態で上下方向へ並ぶ複数、例えば3つの空気吹出口11を有している。そして、送風機13は、空気吹出口11毎に設けられている。また、熱交換器5は、送風機13毎に送風機13の吸込側に配置されている。つまり、本実施形態に係る室外機1は、3つの空気吹出口11を有する1つの筐体12と、それぞれの空気吹出口11に対応する送風機13および熱交換器5と、を備えている。 The outdoor unit 1 according to the present embodiment has a plurality of, for example, three air outlets 11 arranged in the vertical direction in the installed state. A blower 13 is provided for each air outlet 11. Further, the heat exchanger 5 is arranged on the suction side of the blower 13 for each blower 13. That is, the outdoor unit 1 according to the present embodiment includes one housing 12 having three air outlets 11, and a blower 13 and a heat exchanger 5 corresponding to the respective air outlets 11.

筐体12は、直方体形状を有している。筐体12は、底板(図示省略)と、左側面を覆う左側板21と、右側面を覆う右側板22と、正面を覆う正面板23と、背面に設けられるフィンガード(図示省略)と、天面を覆う天板24と、を備えている。 The housing 12 has a rectangular parallelepiped shape. The housing 12 includes a bottom plate (not shown), a left side plate 21 covering the left side surface, a right side plate 22 covering the right side surface, a front plate 23 covering the front surface, and fingers (not shown) provided on the back surface. It includes a top plate 24 that covers the top surface.

なお、図2において、正面板23の一部が開放されて、筐体12内の熱交換器5、送風機13、および電気部品箱16が、筐体12が見えている。 In FIG. 2, a part of the front plate 23 is opened so that the heat exchanger 5, the blower 13, and the electric component box 16 in the housing 12 can see the housing 12.

空気吹出口11は、筐体12の側面のうち筐体12の正面、つまり正面板23に設けられている。空気吹出口11にはファンガード26が設けられている。ファンガード26は、送風機13を覆い隠している。 The air outlet 11 is provided on the front surface of the housing 12, that is, on the front plate 23 among the side surfaces of the housing 12. A fan guard 26 is provided at the air outlet 11. The fan guard 26 covers the blower 13.

空気取入口は、筐体12の側面のうち筐体12の背面から左側面にかけて設けられている。空気取入口にはフィンガードが設けられている。フィンガードは、熱交換器5を保護する格子である。 The air intake is provided from the back surface to the left side surface of the housing 12 among the side surfaces of the housing 12. Fingered air intakes are provided. The fingered is a grid that protects the heat exchanger 5.

筐体12の内部は、筐体12の左右方向へ2つに仕切られている。一方は送風機13および熱交換器5が収容される熱交換室28である。他方は、圧縮機6、膨張弁、四方弁および電気部品箱16が収容される機械室29である。 The inside of the housing 12 is divided into two in the left-right direction of the housing 12. One is a heat exchange chamber 28 in which the blower 13 and the heat exchanger 5 are housed. The other is the machine room 29, which houses the compressor 6, the expansion valve, the four-way valve, and the electrical component box 16.

送風機13が回転駆動されると、筐体12の空気取入口から筐体12外の空気が筐体12内に吸い込まれる。筐体12内に吸い込まれた空気は、熱交換器5で熱交換器5を流通する冷媒と熱交換する。熱交換器5と熱交換した空気は、送風機13によって空気吹出口11から筐体12外に吹き出される。 When the blower 13 is rotationally driven, the air outside the housing 12 is sucked into the housing 12 from the air intake of the housing 12. The air sucked into the housing 12 exchanges heat with the refrigerant flowing through the heat exchanger 5 at the heat exchanger 5. The air that has exchanged heat with the heat exchanger 5 is blown out of the housing 12 from the air outlet 11 by the blower 13.

なお、室外機1は、空気吹出口11が一つの単段式でも良いし、空気吹出口11が2つ、または4つ以上の多段式であっても良い。 The outdoor unit 1 may be a single-stage type having one air outlet 11 or a multi-stage type having two or four or more air outlets 11.

次いで、電気部品箱16について詳細に説明する。 Next, the electric component box 16 will be described in detail.

図3および図4は、本発明の実施形態に係る室外機に収容される電気部品箱および制御装置を示す斜視図である。 3 and 4 are perspective views showing an electric component box and a control device housed in the outdoor unit according to the embodiment of the present invention.

図3は、電気部品箱16を熱交換室28側から見た図である。図4は、電気部品箱16を機械室29側から見た図である。 FIG. 3 is a view of the electric component box 16 as viewed from the heat exchange chamber 28 side. FIG. 4 is a view of the electric component box 16 as viewed from the machine room 29 side.

図2に加えて図3および図4に示すように、本実施形態に係る室外機1の電気部品箱16は、大きく2つの部位を備えている。第一の部位は、冷凍サイクル装置の運転を総括的に制御する主回路板を収容する第一部品箱31である。第二の部位は、圧縮機6の運転制御を行う圧縮機制御回路板35と、送風機13の運転制御を行う送風機制御回路板36と、を収容する第二部品箱37である。これら第一部品箱31および第二部品箱37は、板金加工品である。 As shown in FIGS. 3 and 4 in addition to FIG. 2, the electric component box 16 of the outdoor unit 1 according to the present embodiment has two major parts. The first part is the first parts box 31 that houses the main circuit board that comprehensively controls the operation of the refrigeration cycle apparatus. The second portion is a second parts box 37 that houses a compressor control circuit board 35 that controls the operation of the compressor 6 and a blower control circuit board 36 that controls the operation of the blower 13. The first parts box 31 and the second parts box 37 are sheet metal processed products.

なお、図4において第二部品箱37は、蓋の図示を省略して機械室29へ開放されているが、実際の搭載状態では、第二部品箱37は蓋で閉じられている。 In FIG. 4, the second parts box 37 is opened to the machine room 29 by omitting the illustration of the lid, but in the actual mounting state, the second parts box 37 is closed by the lid.

第二部品箱37は、筐体12の高さ方向および奥行き方向に大きく、筐体12の幅方向(左右方向)へ扁平な直方体形状の箱体である。第二部品箱37は、筐体12内を熱交換室28と機械室29との二つの空間に仕切る壁の全部、または一部を担う平板部41を備えている。 The second component box 37 is a rectangular parallelepiped box body that is large in the height direction and the depth direction of the housing 12 and is flat in the width direction (left-right direction) of the housing 12. The second parts box 37 includes a flat plate portion 41 that serves all or part of the wall that divides the inside of the housing 12 into two spaces, the heat exchange chamber 28 and the machine chamber 29.

平板部41の一方の面41aは、熱交換室28を臨んでいる。平板部41の他方の面41bは、機械室29を区画する壁の一部、または全部である。平板部41の他方の面41bには、圧縮機制御回路板35、および送風機制御回路板36が設けられている。 One surface 41a of the flat plate portion 41 faces the heat exchange chamber 28. The other surface 41b of the flat plate portion 41 is part or all of the wall that partitions the machine room 29. A compressor control circuit board 35 and a blower control circuit board 36 are provided on the other surface 41b of the flat plate portion 41.

圧縮機制御回路板35、および送風機制御回路板36は、第二部品箱37の上下方向へ並んでいる。平板部41の上部には筐体12の上部2つの送風機13を制御する第一送風機制御回路板45が設けられている。平板部41の下部には筐体12の下部1つの送風機13を制御する第二送風機制御回路板46が設けられている。平板部41の中央には、圧縮機制御回路板35が設けられている。圧縮機制御回路板35は、第一送風機制御回路板45と第二送風機制御回路板46との間に配置されている。 The compressor control circuit board 35 and the blower control circuit board 36 are arranged in the vertical direction of the second component box 37. A first blower control circuit plate 45 for controlling the upper two blowers 13 of the housing 12 is provided above the flat plate portion 41. A second blower control circuit plate 46 for controlling one blower 13 at the lower part of the housing 12 is provided below the flat plate portion 41. A compressor control circuit plate 35 is provided in the center of the flat plate portion 41. The compressor control circuit board 35 is arranged between the first blower control circuit board 45 and the second blower control circuit board 46.

圧縮機制御回路板35には、圧縮機6の電動機を駆動制御する制御回路、例えばインバーター回路が実装されている。このインバーター回路は、複数の電源用半導体素子51、例えば、絶縁ゲートバイポーラトランジスター(Insulated Gate Bipolar Transistor、IGBT)、還流ダイオード(Freewheeling Diode、FWD)、を有している。 A control circuit for driving and controlling the electric motor of the compressor 6, for example, an inverter circuit, is mounted on the compressor control circuit board 35. This inverter circuit includes a plurality of power supply semiconductor elements 51, for example, an insulated gate bipolar transistor (IGBT) and a freewheeling diode (FWD).

なお、図4では、複数の電源用半導体素子51が配置されている範囲を破線で示している。この破線の範囲は、複数の電源用半導体素子51を有するモジュール52、例えばインテリジェントパワーモジュール(Intelligent Power Module、IPM)、整流器(Rrectifire)として構成されている。 In FIG. 4, the range in which the plurality of power supply semiconductor elements 51 are arranged is shown by a broken line. The range of the broken line is configured as a module 52 having a plurality of semiconductor elements 51 for power supply, for example, an intelligent power module (IPM) and a rectifier (Rrectifire).

送風機制御回路板36には、送風機13の電動機を駆動制御する制御回路、例えばインバーター回路が実装されている。このインバーター回路は、複数の電源用半導体素子(図示省略)、例えばインテリジェントパワーモジュール(Intelligent Power Module、IPM)、絶縁ゲートバイポーラトランジスター(Insulated Gate Bipolar Transistor、IGBT)、還流ダイオード(Freewheeling Diode、EWD)、整流器(Rrectifire)を有している。第一送風機制御回路板45には、2つの送風機13に対応させて2つのインバーター回路が実装されている。第二送風機制御回路板46には、1つの送風機13に対応させて1つのインバーター回路が実装されている。 A control circuit for driving and controlling the electric motor of the blower 13, for example, an inverter circuit is mounted on the blower control circuit board 36. This inverter circuit includes a plurality of semiconductor elements for power supply (not shown), for example, an Intelligent Power Module (IPM), an Insulated Gate Bipolar Transistor (IGBT), a freewheeling diode (EWD), and the like. It has a rectifier (Rrectifire). Two inverter circuits are mounted on the first blower control circuit board 45 corresponding to the two blowers 13. On the second blower control circuit board 46, one inverter circuit is mounted corresponding to one blower 13.

電源用半導体素子は、動作に伴い発熱する。そこで、電気部品箱16は、圧縮機制御回路板35の電源用半導体素子51を冷却する第一ヒートシンク55と、送風機制御回路板36の電源用半導体素子を冷却する第二ヒートシンク56と、を備えている。第一ヒートシンク55および第二ヒートシンク56は、アルミニウム合金の成形品である。 The semiconductor element for power supply generates heat as it operates. Therefore, the electric component box 16 includes a first heat sink 55 that cools the power supply semiconductor element 51 of the compressor control circuit board 35, and a second heat sink 56 that cools the power supply semiconductor element of the blower control circuit board 36. ing. The first heat sink 55 and the second heat sink 56 are molded products of an aluminum alloy.

ところで、一般に、圧縮機6の電動機は、送風機13の電動機に比べて大電力を消費する。そのため、圧縮機制御回路板35の電源用半導体素子51は、送風機制御回路板36の電源用半導体素子よりも発熱量が大きい。 By the way, in general, the electric motor of the compressor 6 consumes a larger amount of electric power than the electric motor of the blower 13. Therefore, the power supply semiconductor element 51 of the compressor control circuit board 35 generates a larger amount of heat than the power supply semiconductor element of the blower control circuit board 36.

そこで、送風機制御回路板36を冷却する第二ヒートシンク56は、送風機制御回路板36に設けられている、いわゆるオンボードのヒートシンクである。送風機制御回路板36の電源用半導体素子は、オンボードの小型なヒートシンクで十分に冷却可能である。第二ヒートシンク56は、機械室29から第二部品箱37内へ流れ込む空気によって送風機制御回路板36の電源用半導体素子を冷却する。 Therefore, the second heat sink 56 for cooling the blower control circuit board 36 is a so-called on-board heat sink provided on the blower control circuit board 36. The power supply semiconductor element of the blower control circuit board 36 can be sufficiently cooled by a small on-board heat sink. The second heat sink 56 cools the power semiconductor element of the blower control circuit board 36 by the air flowing from the machine room 29 into the second component box 37.

一方、圧縮機制御回路板35を冷却する第一ヒートシンク55は、第二部品箱37の平板部41の一方の面41aに設けられている。第一ヒートシンク55は、第二ヒートシンク56よりも大型であって、圧縮機制御回路板35と同程度の大きさ(面41aにおける広がり)を有している。第一ヒートシンク55と圧縮機制御回路板35の電源用半導体素子とは、熱的に接続されていれば良い。つまり、第一ヒートシンク55と圧縮機制御回路板35の電源用半導体素子とは、第二部品箱37の平板部41に設けられる開口(図示省略)を通じて直接接触していても良いし、第二部品箱37の平板部41を間に挟み、平板部41を介して熱的に接続されていても良い。 On the other hand, the first heat sink 55 for cooling the compressor control circuit board 35 is provided on one surface 41a of the flat plate portion 41 of the second component box 37. The first heat sink 55 is larger than the second heat sink 56, and has the same size (spread on the surface 41a) as the compressor control circuit board 35. The first heat sink 55 and the semiconductor element for power supply of the compressor control circuit board 35 may be thermally connected. That is, the first heat sink 55 and the semiconductor element for power supply of the compressor control circuit board 35 may be in direct contact with each other through an opening (not shown) provided in the flat plate portion 41 of the second component box 37. The flat plate portion 41 of the parts box 37 may be sandwiched between them and thermally connected via the flat plate portion 41.

第一ヒートシンク55は、熱交換室28内を流動する空気によって圧縮機制御回路板35の電源用半導体素子51を冷却する。送風機13が配置されている熱交換室28内の空気の流速は、機械室29内の空気の流速に比べて、より速い。そのため、第一ヒートシンク55は、第二ヒートシンク56よりも冷却されやすい。 The first heat sink 55 cools the power semiconductor element 51 of the compressor control circuit board 35 by the air flowing in the heat exchange chamber 28. The flow velocity of the air in the heat exchange chamber 28 in which the blower 13 is arranged is faster than the flow velocity of the air in the machine chamber 29. Therefore, the first heat sink 55 is more likely to be cooled than the second heat sink 56.

また、第一ヒートシンク55は、第二部品箱37の平板部41の面41aから熱交換室28内へ突出する複数のフィン61を備えている。複数のフィン61は、筐体12内で流動する空気の流れfに沿って延びている(実線矢印E)。複数のフィン61は、空気の流れfに交差する方向へ並んでいる(実線矢印L)。複数のフィン61は、櫛状に並んでいる。それぞれのフィン61の根元は、板状の基部に繋がっている。そのため、第一ヒートシンク55は、フィン61の延び方向へ容易に押出成形することができる。 Further, the first heat sink 55 includes a plurality of fins 61 protruding into the heat exchange chamber 28 from the surface 41a of the flat plate portion 41 of the second parts box 37. The plurality of fins 61 extend along the flow f of the air flowing in the housing 12 (solid arrow E). The plurality of fins 61 are arranged in a direction intersecting the air flow f (solid arrow L). The plurality of fins 61 are arranged in a comb shape. The base of each fin 61 is connected to a plate-shaped base. Therefore, the first heat sink 55 can be easily extruded in the extending direction of the fin 61.

なお、空気の流れfを示す矢印は、空気の流れの上流から下流へ向かって図示されている。 The arrow indicating the air flow f is shown from the upstream to the downstream of the air flow.

複数のフィン61は、空気の流れfに沿って、突出高さの異なる複数の部位を有している。突出高さが高い部位は、空気の流れfにおいて突出高さが低い部位よりも上流側に配置されている。つまり、突出高さが低い部位は、空気の流れfにおいて突出高さが高い部位よりも下流側に配置されている。換言すると、複数のフィン61の高さは、空気の流れfにおける下流側部位62よりも上流側部位63の方が高い。 The plurality of fins 61 have a plurality of portions having different protrusion heights along the air flow f. The portion having a high protrusion height is arranged on the upstream side of the portion having a low protrusion height in the air flow f. That is, the portion having a low protrusion height is arranged on the downstream side of the portion having a high protrusion height in the air flow f. In other words, the height of the plurality of fins 61 is higher in the upstream portion 63 than in the downstream portion 62 in the air flow f.

圧縮機制御回路板35の電源用半導体素子は、複数のフィン61の突出高さが高い方の上流側部位63において、第一ヒートシンク55に熱的に接続されている。複数のフィン61の突出方向から見ると、送風機制御回路板36の電源用半導体素子は、上流側部位63が占有する領域の内側に配置されている。 The power semiconductor element of the compressor control circuit board 35 is thermally connected to the first heat sink 55 at the upstream portion 63 of the plurality of fins 61 having a higher protruding height. When viewed from the protruding directions of the plurality of fins 61, the power supply semiconductor element of the blower control circuit board 36 is arranged inside the region occupied by the upstream side portion 63.

図5は、本発明の実施形態に係る室外機の第一ヒートシンクと電源用半導体素子との配置関係を示す概念図である。 FIG. 5 is a conceptual diagram showing the arrangement relationship between the first heat sink of the outdoor unit and the semiconductor element for power supply according to the embodiment of the present invention.

図5に示すように、圧縮機制御回路板35の複数の電源用半導体素子51が一列に並んでいる場合には、複数の電源用半導体素子51は、複数のフィン61が並ぶ方向(実線矢印L)へ一列に並べられて圧縮機制御回路板35に実装される。換言すると、複数の電源用半導体素子51は、複数のフィン61の延びの方向に交差する方向へ一列に並べられて圧縮機制御回路板35に実装される。複数の電源用半導体素子51は、複数のフィン61の延びの方向に直交する方向へ一列に並べられていることが好ましい。 As shown in FIG. 5, when a plurality of power supply semiconductor elements 51 of the compressor control circuit board 35 are arranged in a row, the plurality of power supply semiconductor elements 51 are arranged in the direction in which the plurality of fins 61 are arranged (solid arrow). They are arranged in a row to L) and mounted on the compressor control circuit board 35. In other words, the plurality of power supply semiconductor elements 51 are arranged in a row in a direction intersecting the extending directions of the plurality of fins 61 and mounted on the compressor control circuit board 35. It is preferable that the plurality of semiconductor elements 51 for power supply are arranged in a line in a direction orthogonal to the extending direction of the plurality of fins 61.

また、圧縮機制御回路板35の複数の電源用半導体素子51が複数行複数列、つまり格子状に並んでいる場合には、複数の電源用半導体素子51は、複数のフィン61が延びる方向(実線矢印E)よりも複数のフィン61が並ぶ方向(実線矢印L)へ多数、格子状に並べられて圧縮機制御回路板35に実装される。換言すると、複数のフィン61が並ぶ方向に並ぶ電源用半導体素子51の個数は、複数のフィン61が延びる方向に並ぶ電源用半導体素子51の個数よりも多い。図6に示すように、2行3列の格子状に並べる場合には、複数の電源用半導体素子51は、複数のフィン61が延びる方向へ行を沿わせ、複数のフィン61が並ぶ方向へ列を沿わせて並べられる。つまり、複数のフィン61が並ぶ方向へ3つの電源用半導体素子51が並べられ、複数のフィン61が延びる方向へ2つの電源用半導体素子51が並べられる。 Further, when a plurality of power supply semiconductor elements 51 of the compressor control circuit board 35 are arranged in a plurality of rows and a plurality of columns, that is, in a grid pattern, the plurality of power supply semiconductor elements 51 are arranged in a direction in which the plurality of fins 61 extend. A large number of fins 61 are arranged in a grid pattern in the direction in which the plurality of fins 61 are arranged (solid arrow L) rather than the solid line arrow E), and are mounted on the compressor control circuit board 35. In other words, the number of power supply semiconductor elements 51 arranged in the direction in which the plurality of fins 61 are arranged is larger than the number of power supply semiconductor elements 51 arranged in the direction in which the plurality of fins 61 extend. As shown in FIG. 6, when arranging in a grid pattern of 2 rows and 3 columns, the plurality of power supply semiconductor elements 51 are aligned in the direction in which the plurality of fins 61 extend, and in the direction in which the plurality of fins 61 are arranged. They are lined up along the line. That is, the three power supply semiconductor elements 51 are arranged in the direction in which the plurality of fins 61 are arranged, and the two power supply semiconductor elements 51 are arranged in the direction in which the plurality of fins 61 extend.

なお、図5のような複数の電源用半導体素子51の配列は、複数のフィン61の突出方向から見ると、上流側部位63が占有する領域の内側に位置している。 The arrangement of the plurality of power supply semiconductor elements 51 as shown in FIG. 5 is located inside the region occupied by the upstream side portion 63 when viewed from the protruding directions of the plurality of fins 61.

図6は、図3のVI−VI線における、本発明の実施形態に係る室外機の第二部品箱の断面図である。 FIG. 6 is a cross-sectional view of the second parts box of the outdoor unit according to the embodiment of the present invention in the VI-VI line of FIG.

図6に示すように、本実施形態に係る室外機1の第二部品箱37は、送風機制御回路板36および圧縮機制御回路板35を直接的に冷却する空気の通風路として機能する。 As shown in FIG. 6, the second component box 37 of the outdoor unit 1 according to the present embodiment functions as a ventilation path for air that directly cools the blower control circuit board 36 and the compressor control circuit board 35.

第二部品箱37は、送風機13が筐体12内に発生させる吸い込み圧によって、機械室29内の空気を熱交換室28へ流通させて送風機制御回路板36および圧縮機制御回路板35を直接的に冷却する。 In the second parts box 37, the air in the machine room 29 is circulated to the heat exchange chamber 28 by the suction pressure generated by the blower 13 in the housing 12, and the blower control circuit board 36 and the compressor control circuit board 35 are directly connected to each other. Cool down.

第二部品箱37の蓋部65には、機械室29から第二部品箱37内へ空気を流入させる吸込口66が設けられている。吸込口66は、圧縮機制御回路板35および、下方に配置される第二送風機制御回路板46に対面する蓋部65の一部に設けられる複数の孔である。つまり、蓋部65は、いわゆるパンチングメタルである。 The lid portion 65 of the second parts box 37 is provided with a suction port 66 for allowing air to flow from the machine room 29 into the second parts box 37. The suction port 66 is a plurality of holes provided in a part of the compressor control circuit plate 35 and the lid portion 65 facing the second blower control circuit plate 46 arranged below. That is, the lid portion 65 is a so-called punching metal.

第二部品箱37の平板部41には、第二部品箱37内から熱交換室28へ空気を流出させる吹出口67が設けられている。吹出口67は、上方に配置される第一送風機制御回路板45に対面する平板部41の一部に設けられる複数の細隙である。それぞれの細隙には、ルーバー状の風向板が設けられている。この風向板は、平板部41に細隙を形成する際に折り曲げられる平板部41の一部である。 The flat plate portion 41 of the second parts box 37 is provided with an outlet 67 for allowing air to flow out from the inside of the second parts box 37 to the heat exchange chamber 28. The air outlet 67 is a plurality of gaps provided in a part of the flat plate portion 41 facing the first blower control circuit plate 45 arranged above. A louver-shaped wind direction plate is provided in each of the gaps. This wind direction plate is a part of the flat plate portion 41 that is bent when forming a gap in the flat plate portion 41.

ところで、第二部品箱37の吸込口66は蓋部65に設けられ、第二部品箱37の吹出口67は平板部41に設けられている。そのため、吸込口66から第二部品箱37内へ流れ込む空気は、圧縮機制御回路板35および第二送風機制御回路板46に直接吹き掛かって吹出口67へ向かう。この空気の流れは、圧縮機制御回路板35および第二送風機制御回路板46を確実に冷却する。 By the way, the suction port 66 of the second parts box 37 is provided in the lid portion 65, and the outlet 67 of the second parts box 37 is provided in the flat plate portion 41. Therefore, the air flowing from the suction port 66 into the second parts box 37 is directly blown onto the compressor control circuit board 35 and the second blower control circuit board 46 and heads toward the outlet 67. This air flow reliably cools the compressor control circuit board 35 and the second blower control circuit board 46.

しかしながら、圧縮機制御回路板35および第二送風機制御回路板46に吹き掛かった空気は、第一送風機制御回路板45と平板部41との隙間を通じて吹出口67へ流出しようとするため、第一送風機制御回路板45の冷却が不足する虞がある。 However, the air blown on the compressor control circuit board 35 and the second blower control circuit board 46 tends to flow out to the outlet 67 through the gap between the first blower control circuit board 45 and the flat plate portion 41. There is a risk that the cooling of the blower control circuit plate 45 will be insufficient.

そこで、第二部品箱37は、吹出口67に覆い被さる第一送風機制御回路板45よりも上流側、つまり吸込口66に近い側に、吹出口67を有する平板部41から突出する箱内風向板68を備えている。 Therefore, the second parts box 37 has an in-box wind direction protruding from the flat plate portion 41 having the air outlet 67 on the upstream side of the first blower control circuit plate 45 that covers the air outlet 67, that is, on the side closer to the suction port 66. It is equipped with a plate 68.

箱内風向板68は、第一送風機制御回路板45と平板部41との隙間を確実に塞ぐことができるように、第一送風機制御回路板45よりも幅広く、第一送風機制御回路板45よりも平板部41から突出していることが好ましい。箱内風向板68は、図6の風向矢印Aのように、第一送風機制御回路板45と平板部41との隙間へ向かおうとする空気の流れを第一送風機制御回路板45の表側(平板部41を臨む面を裏面、平板部41に対面していない面を表面とする)へ導いて、第一送風機制御回路板45の冷却を促進させる。 The in-box wind direction plate 68 is wider than the first blower control circuit plate 45 and more than the first blower control circuit plate 45 so that the gap between the first blower control circuit plate 45 and the flat plate portion 41 can be reliably closed. Also preferably protrudes from the flat plate portion 41. As shown by the wind direction arrow A in FIG. 6, the air direction plate 68 in the box directs the air flow toward the gap between the first blower control circuit plate 45 and the flat plate portion 41 on the front side of the first blower control circuit plate 45 ( The surface facing the flat plate portion 41 is the back surface, and the surface not facing the flat plate portion 41 is the front surface) to promote cooling of the first blower control circuit plate 45.

これようにして第二部品箱37内を流動する空気は、第二ヒートシンク56を通じて送風機制御回路板36の電源用半導体素子を冷却する。そのため、第二ヒートシンク56は、第二部品箱37内へ突出する複数のフィン71を備えている。複数のフィン71は、第二部品箱37内で流動する空気の流れに沿って延びている。複数のフィン71は、空気の流れに交差する方向へ並んでいる。複数のフィン71は、櫛状に並んでいる。それぞれのフィン61の根元は、板状の基部に繋がっている。 The air flowing in the second component box 37 in this way cools the power semiconductor element of the blower control circuit board 36 through the second heat sink 56. Therefore, the second heat sink 56 includes a plurality of fins 71 projecting into the second parts box 37. The plurality of fins 71 extend along the flow of air flowing in the second parts box 37. The plurality of fins 71 are arranged in a direction intersecting the air flow. The plurality of fins 71 are arranged in a comb shape. The base of each fin 61 is connected to a plate-shaped base.

そして、図2および図6に示すように、フィン61の突出高さが低い第一ヒートシンク55の下流側部位62(実線矢印H2)は、送風機13のプロペラファン72の外縁73に近接している。図6に示すように、第一ヒートシンク55を送風機13の回転中心線方向から見ると、プロペラファン72の外縁73は、フィン61の突出高さが高い(実線矢印H1)第一ヒートシンク55の上流側部位63に重なっている。つまり、第一ヒートシンク55は、フィン61の突出高さが低い下流側部位62をプロペラファン72の外周縁に近接させて配置されている。そして、圧縮機制御回路板35の電源用半導体素子51は、送風機13の回転中心線方向視においてプロペラファン72に最も近い部位に配置されている。つまり、第一ヒートシンク55を冷却する空気の流れの方向に見ると、フィン61の下流側部位62のうちプロペラファン72に最も近い部位62aは、圧縮機制御回路板35の電源用半導体素子51が配置されている部位に重なっている。 Then, as shown in FIGS. 2 and 6, the downstream portion 62 (solid arrow H2) of the first heat sink 55 having a low protruding height of the fin 61 is close to the outer edge 73 of the propeller fan 72 of the blower 13. .. As shown in FIG. 6, when the first heat sink 55 is viewed from the direction of the rotation center line of the blower 13, the outer edge 73 of the propeller fan 72 has a high protrusion height of the fin 61 (solid arrow H1) and is upstream of the first heat sink 55. It overlaps the side portion 63. That is, the first heat sink 55 is arranged so that the downstream portion 62 where the protruding height of the fin 61 is low is close to the outer peripheral edge of the propeller fan 72. The power supply semiconductor element 51 of the compressor control circuit board 35 is arranged at a portion closest to the propeller fan 72 in the direction of the rotation center line of the blower 13. That is, when viewed in the direction of the air flow for cooling the first heat sink 55, the power supply semiconductor element 51 of the compressor control circuit board 35 is located at the portion 62a closest to the propeller fan 72 among the downstream portions 62 of the fin 61. It overlaps the part where it is placed.

以上のように、本実施形態に係る室外機1は、圧縮機6を駆動制御する複数の電源用半導体素子51が実装される圧縮機制御回路板35と、筐体12内で流動する空気の流れに沿って延び、かつ空気の流れに交差する方向へ並ぶ複数のフィン61を有する第一ヒートシンク55と、を備えている。そして、複数の電源用半導体素子51は、複数のフィン61が並ぶ方向へ一列に並ぶ、または複数のフィン61が延びる方向よりも複数のフィン61が並ぶ方向へ多数、格子状に並ぶ。そのため、室外機1は、複数の電源用半導体素子51の間での熱的な影響を低下させて、それぞれの電源用半導体素子51の冷却効率を向上できる。 As described above, the outdoor unit 1 according to the present embodiment includes the compressor control circuit board 35 on which a plurality of power supply semiconductor elements 51 for driving and controlling the compressor 6 are mounted, and the air flowing in the housing 12. It comprises a first heat sink 55 having a plurality of fins 61 extending along the flow and lining up in a direction intersecting the flow of air. The plurality of semiconductor elements 51 for power supply are arranged in a line in the direction in which the plurality of fins 61 are arranged, or are arranged in a grid pattern in a direction in which the plurality of fins 61 are arranged rather than in a direction in which the plurality of fins 61 extend. Therefore, the outdoor unit 1 can reduce the thermal influence between the plurality of power supply semiconductor elements 51 and improve the cooling efficiency of each power supply semiconductor element 51.

また、本実施形態に係る室外機1は、空気の流れにおける下流側部位62よりも上流側部位63の方が高い複数のフィン61を有している。そして、複数の電源用半導体素子51は、上流側部位63で第一ヒートシンク55に接している。そのため、室外機1は、それぞれの電源用半導体素子51の冷却効率をより向上できる。 Further, the outdoor unit 1 according to the present embodiment has a plurality of fins 61 in which the upstream side portion 63 is higher than the downstream side portion 62 in the air flow. The plurality of power supply semiconductor elements 51 are in contact with the first heat sink 55 at the upstream side portion 63. Therefore, the outdoor unit 1 can further improve the cooling efficiency of each power supply semiconductor element 51.

さらに、本実施形態に係る室外機1の下流側部位62は、送風機13の羽根車を臨み、複数の電源用半導体素子51は、送風機13の回転中心線方向視において羽根車に最も近い部位に配置されている。そのため、室外機1は、それぞれの電源用半導体素子51の冷却効率をさらに向上できる。 Further, the downstream portion 62 of the outdoor unit 1 according to the present embodiment faces the impeller of the blower 13, and the plurality of semiconductor elements 51 for power supply are located closest to the impeller in the direction of the rotation center line of the blower 13. Have been placed. Therefore, the outdoor unit 1 can further improve the cooling efficiency of each power supply semiconductor element 51.

したがって、本実施形態に係る室外機1によれば、圧縮機制御回路板35の電源用半導体素子51の冷却効率を向上させて、これら電源用半導体素子51の損傷や、電気的特性の劣化を防ぐことができる。 Therefore, according to the outdoor unit 1 according to the present embodiment, the cooling efficiency of the power supply semiconductor element 51 of the compressor control circuit board 35 is improved, and the power supply semiconductor element 51 is damaged or the electrical characteristics are deteriorated. Can be prevented.

本発明のいくつかの実施形態を説明したが、これらの実施形態は例として提示したものであり、発明の範囲を限定することは意図していない。これら新規な実施形態は、その他の様々な形態で実施されることが可能であり、発明の要旨を逸脱しない範囲で、種々の省略、置き換え、変更を行うことができる。これら実施形態やその変形は、発明の範囲や要旨に含まれるとともに、特許請求の範囲に記載された発明とその均等の範囲に含まれる。 Although some embodiments of the present invention have been described, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other embodiments, and various omissions, replacements, and changes can be made without departing from the gist of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are also included in the scope of the invention described in the claims and the equivalent scope thereof.

1…室外機、5…熱交換器、6…圧縮機、11…空気吹出口、12…筐体、13…送風機、15…制御装置、16…電気部品箱、21…左側板、22…右側板、23…正面板、24…天板、26…ファンガード、28…熱交換室、29…機械室、31…第一部品箱、35…圧縮機制御回路板、36…送風機制御回路板、37…第二部品箱、41…平板部、41a…平板部の熱交換室側の面、41b…平板部の機械室側の面、45…第一送風機制御回路板、46…第二送風機制御回路板、51…電源用半導体素子、52…モジュール、55…第一ヒートシンク、56…第二ヒートシンク、61…フィン、62…下流側部位、62a…フィンの下流側部位のうちプロペラファンに最も近い部位、63…上流側部位、65…蓋部、66…吸込口、67…吹出口、68…箱内風向板、71…フィン、72…プロペラファン、73…外縁。 1 ... Outdoor unit, 5 ... Heat exchanger, 6 ... Compressor, 11 ... Air outlet, 12 ... Housing, 13 ... Blower, 15 ... Control device, 16 ... Electrical component box, 21 ... Left plate, 22 ... Right side Plate, 23 ... Front plate, 24 ... Top plate, 26 ... Fan guard, 28 ... Heat exchange room, 29 ... Machine room, 31 ... First parts box, 35 ... Compressor control circuit board, 36 ... Blower control circuit board, 37 ... Second component box, 41 ... Flat plate, 41a ... Heat exchange chamber side surface of flat plate, 41b ... Machine room side surface of flat plate, 45 ... First blower control circuit board, 46 ... Second blower control Circuit board, 51 ... Semiconductor element for power supply, 52 ... Module, 55 ... First heat sink, 56 ... Second heat sink, 61 ... Fin, 62 ... Downstream part, 62a ... Downstream part of fin, closest to propeller fan Parts, 63 ... upstream parts, 65 ... lids, 66 ... suction ports, 67 ... air outlets, 68 ... box heat sinks, 71 ... fins, 72 ... propeller fans, 73 ... outer edges.

Claims (3)

筐体と、
前記筐体内に配置されて、空気と内部を流通する冷媒とを熱交換させる熱交換器と、
前記筐体の外側から前記空気を吸い込み、前記筐体内に吸い込んだ前記空気を前記熱交換器を通過させて熱交換された前記空気を前記筐体の外側へ吹き出す送風機と、
前記冷媒を圧縮して吐出し、前記熱交換器に流通させる圧縮機と、
前記圧縮機を駆動制御する複数の電源用半導体素子が実装される回路板と、
前記複数の電源用半導体素子に熱的に接して前記複数の電源用半導体素子を冷却するヒートシンクと、を備え、
前記ヒートシンクは、前記筐体内で流動する前記空気の流れに沿って延び、かつ前記空気の流れに交差する方向へ並ぶ複数のフィンを有し、
前記複数の電源用半導体素子は、前記複数のフィンが並ぶ方向へ一列に並ぶ、または前記複数のフィンが延びる方向よりも前記複数のフィンが並ぶ方向へ多数、格子状に並ぶ冷凍サイクル装置の室外機。
With the housing
A heat exchanger, which is arranged in the housing and exchanges heat between air and a refrigerant flowing inside.
A blower that sucks the air from the outside of the housing, passes the air sucked into the housing through the heat exchanger, and blows out the heat-exchanged air to the outside of the housing.
A compressor that compresses and discharges the refrigerant and distributes it to the heat exchanger.
A circuit board on which a plurality of semiconductor elements for power supply that drive and control the compressor are mounted, and
A heat sink that is thermally contacted with the plurality of power supply semiconductor elements to cool the plurality of power supply semiconductor elements is provided.
The heat sink has a plurality of fins that extend along the flow of air flowing in the housing and are aligned in a direction intersecting the flow of air.
The plurality of semiconductor elements for power supply are arranged in a row in the direction in which the plurality of fins are arranged, or a large number of the plurality of fins are arranged in a direction in which the plurality of fins are arranged rather than in a direction in which the plurality of fins are arranged. Machine.
前記複数のフィンの高さは、前記空気の流れにおける下流側部位よりも上流側部位の方が高く、
前記複数の電源用半導体素子は、前記上流側部位で前記ヒートシンクに接している請求項1に記載の冷凍サイクル装置の室外機。
The height of the plurality of fins is higher in the upstream portion than in the downstream portion in the air flow.
The outdoor unit of the refrigeration cycle apparatus according to claim 1, wherein the plurality of semiconductor elements for power supply are in contact with the heat sink at the upstream portion.
前記下流側部位は、前記送風機の羽根車を臨み、
前記複数の電源用半導体素子は、前記送風機の回転中心線方向視において前記羽根車に最も近い部位に配置されている請求項2に記載の冷凍サイクル装置の室外機。
The downstream part faces the impeller of the blower.
The outdoor unit of the refrigeration cycle apparatus according to claim 2, wherein the plurality of semiconductor elements for power supply are arranged at a portion closest to the impeller in the direction of the rotation center line of the blower.
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0412559A (en) * 1990-05-01 1992-01-17 Fujitsu Ltd Cooling structure of electronic device
JP2000164773A (en) * 1998-11-30 2000-06-16 Matsushita Electric Works Ltd Radiator
WO2018062170A1 (en) * 2016-09-27 2018-04-05 三菱電機株式会社 Outdoor unit for air conditioner, and air conditioner
CN208025696U (en) * 2018-01-25 2018-10-30 珠海格力电器股份有限公司 A kind of air-conditioner outdoor unit

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0412559A (en) * 1990-05-01 1992-01-17 Fujitsu Ltd Cooling structure of electronic device
JP2000164773A (en) * 1998-11-30 2000-06-16 Matsushita Electric Works Ltd Radiator
WO2018062170A1 (en) * 2016-09-27 2018-04-05 三菱電機株式会社 Outdoor unit for air conditioner, and air conditioner
CN208025696U (en) * 2018-01-25 2018-10-30 珠海格力电器股份有限公司 A kind of air-conditioner outdoor unit

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