JP2021007139A - Electronic component mounting structure, its mounting method, led display panel, and led chip mounting method - Google Patents

Abstract

To improve mounting yield of an electronic component.SOLUTION: In an electronic component mounting structure for mounting a plurality of LED chips 3 on a wiring board 1, the wiring board 1 is provided with a guide member 2 made of elastically deformable resin in a mounting region of the plurality of LED chips 3 that accepts the LED chips 3 to guide the LED chips 3 so as to be able to electrically connect the electrode 8 of the LED chips 3 with a bump electrode 4 provided on the wiring substrate 1.SELECTED DRAWING: Figure 1

Description

The present invention relates to an electronic component mounting structure, and more particularly to an electronic component mounting structure that can improve the mounting yield of electronic components, a mounting method thereof, an LED display panel, and an LED chip mounting method.

Conventional LED display panels are provided on an array of micro LED devices that emit blue (eg, 450 nm to 495 nm) or dark blue (eg, 420 nm to 450 nm) light and an array of micro LED devices. It was provided with an array of wavelength conversion layers (fluorescent light emitting layers) that absorb blue light emission or dark blue light emission from the device and convert the emission wavelength into red, green, and blue light, respectively. (See, for example, Patent Document 1).

Special Table 2016-523450

However, in such a conventional LED display panel, after the LED chip is positioned in the flat LED chip mounting area on the wiring board, the wiring board and the LED chip are relatively moved and bonded to each other, and the electrodes of the wiring board are attached. Since the LED chip and the electrode of the LED chip are brought into electrical contact with each other, there is a risk that the LED will not light due to the misalignment of the electrodes during bonding. Therefore, this problem has been an impediment to the improvement of the mounting yield of the LED chip on the wiring board.

Such electrode misalignment is caused by relative slippage or rotational misalignment caused by the parallelism (for example, warpage or inclination) of the bonding surface of the wiring board and the LED chip, or the pressurizing shaft of the pressurizing mechanism. This is due to the relative slippage and rotational deviation of both bonded surfaces caused by the running accuracy.

Therefore, an object of the present invention is to provide an electronic component mounting structure, a mounting method thereof, an LED display panel, and an LED chip mounting method that can improve the mounting yield of electronic components by dealing with such a problem. To do.

In order to achieve the above object, the first invention is a component mounting structure for mounting a plurality of chip-type electronic components on a wiring board, and the wiring board is provided in a mounting region for the plurality of electronic components. , An elastically deformable resin guide member is provided to guide the electronic component so that the electronic component can be received and the electrode of the electronic component and the electrode provided on the wiring board can be electrically contacted with each other. Is what you are doing.

The second invention is an electronic component mounting method for mounting a plurality of chip-type electronic components on a wiring board, in which at least the wiring is provided in a plurality of mounting regions on the wiring board on which the electronic components are mounted. A step of patterning and forming an elastically deformable resin guide member having an opening corresponding to an electrode of a substrate, a step of positioning each of the plurality of electronic components in the mounting region of the wiring board, and the electron. A step of pressurizing the component relative to the wiring board and guiding the component through the opening of the guide member to electrically contact the electrode of the electronic component and the electrode of the wiring board, and the electronic component. It includes a step of maintaining the conductive state of the wiring board and adhering and fixing the electronic component to the wiring board.

Further, the third invention is an LED display panel in which a plurality of LED chips are mounted on a wiring board, and the LED chips are mounted on the wiring board in an LED chip mounting area on which the plurality of LED chips are mounted. An elastically deformable resin guide member is provided to guide the LED chip so that the LED chip can be received and the electrode of the LED chip and the electrode provided on the wiring substrate can be electrically contacted with each other. ..

A fourth invention is an LED chip mounting method for mounting a plurality of LED chips on a wiring board for an LED display panel, in a plurality of LED chip mounting regions on the wiring board on which the LED chips are mounted. A step of forming an elastically deformable guide member having an opening corresponding to at least the electrode of the wiring substrate by patterning a photosensitive resin, and the plurality of LED chips provided on one surface of the carrier substrate. The step of positioning the LED chip and the wiring board in the LED chip mounting region of the wiring board, and the LED chip and the wiring board are moved relatively close to each other and guided by the opening of the guide member to guide the LED chip electrode and the wiring. A step of electrically contacting the electrodes of the substrate, a step of maintaining the conduction state between the LED chip and the wiring substrate and adhering and fixing the LED chip to the wiring substrate, and a step of adhering the LED chip to the wiring substrate from the carrier substrate. The peeling step and the execution of.

According to the present invention, the electronic component is received and guided through the opening of the guide member provided in the mounting area of the electronic component of the wiring board, and the electrode of the electronic component and the electrode of the wiring board are electrically connected. Therefore, it is possible to prevent relative slippage and rotation deviation between the wiring board and the electronic component. Therefore, the mounting yield of electronic components can be improved.

It is a figure which shows the schematic structure of one Embodiment of the LED display panel by this invention, (a) is a plan view, (b) is an enlarged sectional view of a main part. It is sectional drawing which shows one structural example of the guide member provided in the LED chip mounting area. It is a top view which shows the patterning example of the said guide member. It is sectional drawing which shows the side surface shape of the said opening. It is explanatory drawing which shows the first half part of the mounting process of the LED chip. It is a graph which shows the relationship between the viscosity and elastic modulus with respect to the temperature of a photosensitive thermosetting adhesive. It is explanatory drawing which shows the latter part of the mounting process of the LED chip. It is explanatory drawing which shows the defect example of the LED chip mounting in the prior art. It is explanatory drawing which shows the elastic deformation of the guide member at the time of mounting an LED chip. It is explanatory drawing which shows the elastic deformation of another guide member at the time of mounting an LED chip. It is explanatory drawing which shows the elastic deformation of the other guide member at the time of mounting an LED chip. It is a front view which shows the schematic structure of the mounting apparatus used in the LED chip mounting method according to the present invention. It is explanatory drawing which shows the LED chip mounting process on the transfer stage in the LED chip mounting method using the said mounting apparatus. It is explanatory drawing which shows the transfer process of the LED chip from the transfer stage to the pickup stage in the LED chip mounting method using the said mounting apparatus. It is explanatory drawing which shows the wiring board mounting process on the transfer stage in the LED chip mounting method using the said mounting apparatus. It is explanatory drawing which shows the prebonding process of an LED chip and a guide member in the LED chip mounting method using the said mounting apparatus. It is explanatory drawing which shows the bonding process of the LED chip and a wiring board performed while maintaining the conduction state in the LED chip mounting method using the above-mentioned mounting device. It is explanatory drawing which shows the position of the transfer stage after the bonding | bonding of the LED chip and a wiring board is completed in the LED chip mounting method using the said mounting apparatus. It is explanatory drawing which shows the peeling process of a carrier film when the LED chip is transferred to the carrier substrate in the LED chip mounting method using the said mounting apparatus.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. 1A and 1B are views showing a schematic configuration of an embodiment of an LED display panel according to the present invention, where FIG. 1A is a plan view and FIG. 1B is an enlarged cross-sectional view of a main part. This LED display panel is for lighting an LED to display an image, and is configured to include a wiring board 1, a guide member 2, and a micro LED chip (hereinafter, simply referred to as "LED chip") 3. ing.

The wiring board 1 is a flexible substrate made of a glass substrate, polyimide, or the like, and is provided with scanning wiring and data wiring connected to an external drive device intersecting vertically and horizontally. Further, a thin film transistor (TFT) for driving the LED chip 3 on and off is provided at the intersection of the scanning wiring and the data wiring.

At the intersection of the scanning wiring and the data wiring, as shown in the cross section in FIG. 2, the LED chip 3 is received and provided on the electrode of the LED chip 3 and the wiring board 1 at the time of mounting the LED chip in the LED chip mounting region. A guide member 2 made of elastically deformable resin is provided to guide the LED chip 3 so that the bump electrode 4 can be brought into electrical contact with the bump electrode 4. In FIG. 1B, reference numeral 8 is an electrode of the LED chip 3, and reference numeral 9 is wiring provided on the wiring board 1.

As shown in FIGS. 3 (a), (b), (c), and (d), the guide member 2 uses a photosensitive thermosetting adhesive that can be patterned by photolithography and is thermosetting. Therefore, patterning is formed in a form in which an opening 5 is provided at least corresponding to the bump electrode 4 of the wiring board 1. Here, FIG. 3A exemplifies an opening 5 having a rectangular shape in a plan view provided corresponding to the bump electrode 4, and FIGS. 3B and 3C have different sizes of circular shapes in a plan view. The opening 5 is illustrated. And FIG. 3D exemplifies the opening 5 corresponding to the outer shape of the LED chip 3.

As shown in FIG. 4A, the opening 5 corresponding to the outer shape of the LED chip 3 shown in FIG. 3D has an inner side surface 5a standing substantially vertically from the bottom surface toward the opening surface. It may be, as shown in FIG. 4 (b), the inner side surface 5a may be inclined so as to spread from the bottom surface toward the opening surface, or as shown in FIG. 4 (c). The inner side surface 5a may be inclined so as to narrow from the bottom surface toward the opening surface. Further, the guide member 2 may have any form as long as it comes into contact with a part of the outer surface of the LED chip 3 to regulate the misalignment.

In the LED chip mounting region of the wiring board 1, the LED chip 3 is provided in the opening 5 of the guide member 2 in a state where the continuity with the bump electrode 4 of the wiring board 1 is maintained. The LED chip 3 is three types of LEDs that emit light corresponding to the three primary color lights of red, green, and blue. Alternatively, all the LED chips 3 may emit light in the ultraviolet or blue wavelength band. In this case, a fluorescent light emitting layer of the corresponding color is provided on the light emitting surface side of each LED chip 3 corresponding to the pixels of the three primary color lights.

Next, an LED chip mounting method for mounting a plurality of LED chips 3 on the wiring board 1 for the LED display panel configured in this way will be described.
First, as shown in FIG. 5A, the photosensitive thermosetting adhesive 6 is uniformly applied on the wiring board 1 to a predetermined thickness by using, for example, a spray device or a spinner.

The photosensitive thermosetting adhesive 6 can be patterned by a photolithography technique, and has a viscosity / elastic modulus temperature characteristic as shown in FIG. 6 after photocuring. In this case, the region I has a reversible property and the region II has an irreversible property with the temperature T1 in FIG. 6 as a boundary. In the present embodiment, the photosensitive heat-curable adhesive 6 has an elastic modulus of 0.05 MPa to 0.1 MPa at the above temperature T1 (for example, 110 ° C.), and is deformed according to the shape of the LED chip 3 and is also deformed. The LED chip 3 can be molded by the elastic gripping force.

Next, as shown in FIG. 5B, the photosensitive thermosetting adhesive 6 is patterned by a photolithography technique, and at least the wiring board 1 is placed in a plurality of LED chip mounting regions on which the LED chips 3 are mounted. A guide member 2 having an opening 5 corresponding to the bump electrode 4 of the above is formed. Note that FIG. 5B shows a case where the opening 5 has a shape corresponding to the outer shape of the LED chip 3.

Next, as shown in FIG. 5C, a plurality of LED chips 3 formed on one surface of the sapphire substrate 7 as the carrier substrate are respectively positioned on the guide member 2 in the LED chip mounting region of the wiring board 1. Specifically, in this positioning, the alignment mark provided on the wiring board 1 and the alignment mark provided on the sapphire board 7 are photographed by an alignment camera so that the two alignment marks match or form a predetermined positional relationship. Aligned and executed. Alignment may be performed by using a part of the LED chip 3 and the wiring pattern of the wiring board 1, or by using the TEG (Test Element Group) of the wiring board 1 and the TEG on the LED side. Known techniques can be applied.

Subsequently, as shown in FIG. 5D, the LED chip 3 and the wiring board 1 are moved relatively close to each other to prebond the LED chip 3 to the guide member 2, and then the guide member 2 is shown in FIG. As shown in FIG. 5 (e), the LED chip 3 is wired to the electrode 8 of the LED chip 3 by relatively pressurizing in the direction of the arrow in the figure while maintaining the temperature range of T1 (for example, 110 ° C.) to have low elasticity. The bump electrode 4 of the substrate 1 is electrically contacted.

Next, as shown in FIG. 7A, the photosensitive thermosetting adhesive 6 is heat-cured to bond and fix the LED chip 3 to the wiring substrate 1. Specifically, while maintaining the conductive state and holding the LED chip 3, the photosensitive heat-curable adhesive 6 is applied at 180 ° C. for 90 minutes, at 200 ° C. for 60 minutes, or at 230 ° C. for 30 minutes. The LED chip 3 is adhesively fixed to the wiring board 1 by heating and curing with.

Then, as shown in FIG. 7B, the LED chip 3 is laser lifted off from the sapphire substrate 7 by irradiating the interface between the sapphire substrate 7 and the LED chip 3 with an ultraviolet laser beam L from the sapphire substrate 7 side. In this case, each LED chip 3 may be individually irradiated with the laser beam L for peeling, and the plurality of LED chips 3 may be separated while moving the line-shaped laser beam L in the direction intersecting the long axis thereof. May be peeled off together. As a result, as shown in FIG. 7C, the step of mounting the LED chip 3 on the wiring board 1 is completed.

In this case, when the LED chip mounting area of the wiring board 1 does not have the guide member 2 as in the prior art, after positioning the LED chip 3 in the LED chip mounting area as shown in FIG. 8A, after positioning the LED chip 3 in the LED chip mounting area, Even if the LED chip 3 is pressed to bring the electrode 8 of the LED chip 3 into contact with the electrode 10 of the wiring substrate 1, the running accuracy of the pressurizing mechanism shaft and the warp or inclination of the sticking surface cause FIG. As shown in b), the LED chip 3 may be rotated and an open defect may occur, or as shown in FIG. 8C, slippage may occur and a short defect may occur.

On the other hand, in the present invention, the LED chip 3 is guided by the opening 5 of the guide member 2 and penetrates into the opening 5 of the guide member 2, and the electrode 8 of the LED chip 3 and the bump electrode 4 of the wiring board 1 Are electrically contacted.

Specifically, the guide member 2 is elastically deformed so as to expand the opening 5 in the direction of arrow A as shown in FIGS. 9 (b), 10 (b), and 11 (b). Finally, the LED chip 3 is in a conductive state with the wiring board 1 due to the return force in the arrow B direction as shown in FIGS. 9 (c), 10 (c), and 11 (c) of the guide member 2. It is molded while maintaining the above, and slippage and rotation during pressurization are suppressed, and misalignment is suppressed.

In the above embodiment, the case where the LED chip 3 is formed on the sapphire substrate 7 has been described, but the present invention is not limited to this, and the LED chip 3 includes a film, glass, and sapphire as a carrier substrate. It may be transferred to a transparent base material such as, etc. via at least one of an adhesive, an adhesive, an adhesive film, and the like. In this case, the LED chip peeling step shown in FIG. 7B is executed by peeling the LED chip 3 from the carrier substrate.

The LED chip mounting method is performed using the following mounting device. As shown in FIG. 12, this mounting device includes a transport stage 11, a pickup stage 12, a heating device 13, and first and second alignment cameras 14, 15.

In the transfer stage 11, a sapphire substrate 7 or a wiring substrate 1 formed by arranging a plurality of LED chips 3 in a matrix is placed on a mounting surface to attract and hold the sapphire substrate 7 in an XY plane parallel to the mounting surface. It is configured to move and move up and down in the Z-axis direction orthogonal to the X-axis and the Y-axis. Further, it is adapted to rotate (θ) about the central axis of the mounting surface parallel to the Z axis. Then, the transfer stage 11 rotates the X stage 11a that moves in the X direction, the Y stage 11b that moves in the Y direction, an electric stage that moves the stage in the Z direction, a Z-axis mechanism such as an air cylinder 16, and a stage. It includes a Zθ stage 11c configured to include a θ mechanism for causing the stage to tilt, a tilt mechanism for tilting the stage, a suction mechanism for sucking and holding the work, and the like.

A pickup stage 12 is arranged to face each other above the transport stage 11. The pickup stage 12 sucks and holds the sapphire substrate 7, forms a plurality of suction holes on the smooth suction surface 12a, and connects the other end of the suction holes to a vacuum pump (not shown) for suction. You can do it. It also includes a θ stage 12b that rotates (θ) about a central axis parallel to the Z axis of the suction surface 12a.

A heating device 13 is provided on at least one of the transfer stage 11 and the pickup stage 12. The heating device 13 is for heating the guide member 2 made of the photosensitive thermosetting adhesive 6 provided in the LED chip mounting region of the wiring substrate 1, and is maintained in the temperature region of T1 shown in FIG. The LED chip 3 is easily invaded into the opening 5 of the guide member 2, or the guide member 2 is heat-cured, and the LED chip 3 held by the guide member 2 is combined with the LED chip 3 and the wiring board 1. It is an electric heater, for example, which maintains the conduction state of the above and adheres and fixes it to the wiring substrate 1. Although FIG. 12 shows a case where the heating device 13 is provided on both the transport stage 11 and the pickup stage 12, either one may be used.

Above the transfer stage 11, a first alignment camera 14 is provided so that a pair of alignment marks provided on the sapphire substrate 7 or the wiring substrate 1 mounted on the mounting surface can be simultaneously photographed. The first alignment camera 14 photographs a pair of alignment marks of the sapphire substrate 7 or the wiring substrate 1, positions and mounts the sapphire substrate 7 or the wiring substrate 1 at a predetermined position on the transport stage 11, and mounts the sapphire substrate 7 or the wiring substrate 1. This is for adjusting the orientation of the sapphire substrate 7 or the wiring substrate 1 so as to be constant, for example, a CCD camera or a CMOS camera.

Second alignment cameras 15 are provided on both sides of the pickup stage 12 in between. The second alignment camera 15 photographs a pair of alignment marks of the sapphire substrate 7 attracted and held by the pickup stage 12 and a pair of alignment marks provided on the wiring board 1 so that both alignment marks match. , Or for alignment so as to form a certain positional relationship, for example, a CCD camera or a CMOS camera. The interval between the second alignment cameras 15 is arranged so as to be equal to the interval between the first alignment cameras 14.

Next, a mounting method of the LED chip 3 performed by using the mounting device configured as described above will be described with reference to FIGS. 13 to 19.
First, as shown in FIG. 13, at the start position where either one of the sapphire substrate 7 and the wiring board 1 is mounted, the sapphire substrate 7 is placed on the transport stage 11 so that the LED chip 3 is on the mounting surface side. Place it.

At this time, while simultaneously photographing a pair of alignment marks provided in advance on the sapphire substrate 7 by the first alignment camera 14, the transfer stage 11 is finely moved in the XY directions and rotated around the central axis of the mounting surface. By moving, both alignment marks are adjusted so as to match the center of the field of view of the first alignment camera 14. As a result, the sapphire substrate 7 is positioned and placed at a predetermined position on the transport stage 11, and is adjusted so that, for example, a pair of alignment marks are aligned parallel to the X axis and have a constant orientation.

Next, as shown in FIG. 14, after the transfer stage 11 is moved parallel to the XY plane to the opposite position directly below the pickup stage 12, it is raised parallel to the Z axis by the electric Z-axis mechanism. Then, the sapphire substrate 7 is attracted and held by the pickup stage 12 and received from the transport stage 11. At this time, the transfer stage 11 rises at a high speed to a predetermined height by the electric Z-axis mechanism, and then the rising speed is controlled so that the sapphire substrate 7 rises at a low speed until it comes into contact with the suction surface 12a of the pickup stage 12. ..

Next, as shown in FIG. 15, after the transfer stage 11 is returned to the start position, the wiring board 1 is placed on the transfer stage 11 with the bump electrode 4 facing up. At this time, in the same manner as described above, the transfer stage 11 is finely moved in the XY direction while simultaneously photographing the pair of alignment marks provided in advance on the wiring board 1 by the first alignment camera 14, and the mounting surface By rotating around the central axis, both alignment marks are adjusted so as to match the center of the field of view of the first alignment camera 14. As a result, the wiring board 1 is positioned and placed at a predetermined position on the transport stage 11, and is adjusted so that, for example, a pair of alignment marks are aligned in parallel with the X axis and have a constant orientation.

As shown in FIGS. 3A to 3D, at least the bump electrode 4 of the wiring board 1 corresponds to a plurality of LED chip mounting areas on which the LED chip 3 is mounted on the wiring board 1. The elastically deformable guide member 2 provided with the opening 5 corresponding to the above is formed by patterning the photosensitive thermosetting adhesive 6.

Subsequently, as shown in FIG. 16, the transport stage 11 is moved parallel to the XY plane to the opposite position directly below the pickup stage 12, and then ascended parallel to the Z axis by the electric Z-axis mechanism. Then, the transfer stage 11 is finely moved in the XY directions while the alignment marks provided on the sapphire substrate 7 held by the pickup stage 12 and the wiring board 1 held by the transfer stage 11 are photographed by the second alignment camera 15. At the same time, the pickup stage 12 and the transport stage 11 are rotated relative to each other about an axis parallel to the Z axis so that the alignment marks of the sapphire substrate 7 and the wiring board 1 match each other or form a certain positional relationship. Align to.

After that, the transfer stage 11 slowly rises, and as shown in FIG. 9A, the plurality of LED chips 3 provided on the sapphire substrate 7 come into contact with the plurality of guide members 2 provided on the wiring board 1. Prebonded.

Next, as shown in FIG. 17, the guide member 2 is heated to, for example, about 110 ° C. (T1 temperature region) by the heating device 13 to reduce the viscosity and the elastic modulus while driving the air cylinder 16. Then, a further ascending force is applied to the transfer stage 11, and a pressing force is applied between the wiring board 1 and the sapphire board 7. As a result, the LED chip 3 prebonded to the guide member 2 is guided by the opening 5 of the guide member 2 as shown in FIGS. 9 (b) and 9 (c), and penetrates into the opening 5 to enter the LED. The electrode 8 of the chip 3 and the bump electrode 4 of the wiring board 1 are in electrical contact with each other. At this time, the elastic restoring force of the guide member 2 acts on the LED chip 3, and the LED chip 3 is molded by the guide member 2.

Further, while maintaining the conductive state between the LED chip 3 and the wiring board 1, the guide member 2 is heated and cured by the heating device 13 for, for example, 180 ° C./90 minutes, 200 ° C./60 minutes, or 230 ° C./30 minutes. , The LED chip 3 is adhesively fixed to the wiring board 1.

Next, after the heating device 13 is air-cooled, the suction of the sapphire substrate 7 by the pickup stage 12 is released, and the transfer stage 11 is returned to the start position, as shown in FIG.

After that, the wiring board 1 is installed in an ultraviolet laser irradiation device (not shown). Then, as shown in FIG. 7B, the laser beam L is irradiated from the sapphire substrate 7 side, and the LED chip 3 is laser lifted off from the sapphire substrate 7. As a result, as shown in FIG. 7C, the step of mounting the LED chip 3 on the wiring board 1 is completed.

When the LED chip 3 is transferred to a transparent carrier substrate 17 such as a film, glass, or sapphire via at least one of an adhesive, an adhesive, an adhesive tape, and the like, the figure shows. After the bonding step shown in 17 is completed and the heating device 13 is air-cooled, the LED chip is lowered when the transport stage 11 is lowered without releasing the adsorption of the carrier substrate 17 by the pickup stage 12 as shown in FIG. 3 is peeled off from the carrier substrate 17, and the process of mounting the LED chip 3 on the wiring board 1 is completed.

In the above embodiment, the case where the guide member 2 is formed of a photosensitive thermosetting adhesive 6 which can be patterned by photolithography and can be heat-cured and adhered has been described, but the present invention has been described. Not limited to this, the guide member 2 does not have to have an adhesive function as long as it is a photosensitive resin. In this case, the LED chip 3 and the wiring board 1 may be bonded by forming both electrodes with gold to form a eutectic bond, or by soldering using a solder bump.

In the above description, the case where the electronic component is the LED chip 3 has been described, but the present invention is not limited to this, and the electronic component may be any chip-shaped electronic component such as an IC chip. ..

1 ... Wiring board 2 ... Guide member 3 ... LED chip (electronic component)
4 ... Bump electrode of wiring board 5 ... Opening 6 ... Photosensitive heat-curable adhesive 7 ... Sapphire board (carrier board)
8 ... LED chip electrode 17 ... Carrier substrate

Claims (16)

It is an electronic component mounting structure in which a plurality of chip-type electronic components are mounted on a wiring board.
In the wiring board, the electronic component is placed in a mounting area of the plurality of electronic components so that the electronic component can be received and the electrode of the electronic component and the electrode provided on the wiring board can be electrically contacted with each other. An electronic component mounting structure characterized in that a guide member made of elastically deformable resin is provided to guide the electronic component. The guide member can be patterned by photolithography, and is patterned and formed in a form in which an opening is provided at least corresponding to the electrode of the wiring board by using a thermosetting photosensitive thermosetting adhesive. The electronic component mounting structure according to claim 1, wherein the electronic component mounting structure is provided. The electronic component mounting structure according to claim 2, wherein the guide member has an opening corresponding to the outer shape of the electronic component. The electronic component mounting structure according to any one of claims 1 to 3, wherein the electronic component is an LED chip. It is an electronic component mounting method that mounts multiple chip-type electronic components on a wiring board.
A step of patterning and forming an elastically deformable resin guide member having an opening corresponding to at least an electrode of the wiring board in a plurality of mounting regions on the wiring board on which the electronic component is mounted.
A step of positioning the plurality of electronic components in the mounting area of the wiring board, respectively.
A step of pressurizing the electronic component relative to the wiring board and guiding the electronic component through the opening of the guide member to electrically contact the electrode of the electronic component and the electrode of the wiring board.
A step of maintaining the conduction state between the electronic component and the wiring board and adhering and fixing the electronic component to the wiring board.
A method for mounting an electronic component, which comprises. The method for mounting an electronic component according to claim 5, wherein the guide member has an opening corresponding to the outer shape of the electronic component. The guide member can be patterned by photolithography and is patterned and formed using a thermosetting photosensitive thermosetting adhesive, and is heat-cured to bond and fix the electronic component to the wiring board. The electronic component mounting method according to claim 5 or 6, characterized in that. An LED display panel with multiple LED chips mounted on a wiring board.
In the wiring board, the LED chip can be received in the LED chip mounting area on which the plurality of LED chips are mounted so that the electrode of the LED chip and the electrode provided on the wiring board can be electrically contacted with each other. An LED display panel characterized in that an elastically deformable resin guide member for guiding the LED chip is provided. The guide member can be patterned by photolithography, and is patterned and formed in a form in which an opening is provided at least corresponding to the electrode of the wiring board by using a photosensitive thermosetting adhesive that is heat-cured. The LED display panel according to claim 8, wherein the LED display panel is provided. The LED chip emits light in the ultraviolet or blue wavelength band.
The LED display panel according to claim 8 or 9, wherein a fluorescent light emitting layer of a corresponding color is provided on the light emitting surface side of each of the LED chips corresponding to the pixels of the three primary colors. The LED display panel according to claim 8 or 9, wherein the LED chip is three types of LEDs that emit light corresponding to the three primary color lights. This is an LED chip mounting method in which a plurality of LED chips are mounted on a wiring board for an LED display panel.
An elastically deformable guide member having at least an opening corresponding to an electrode of the wiring board in a plurality of LED chip mounting regions on the wiring board on which the LED chip is mounted is patterned with a photosensitive resin. Steps to form and
A step of positioning the plurality of LED chips provided on one surface of the carrier board in the LED chip mounting area of the wiring board, respectively.
A step of moving the LED chip and the wiring board relatively close to each other and guiding them through the opening of the guide member to electrically bring the electrodes of the LED chip and the electrodes of the wiring board into contact with each other.
A step of maintaining the conduction state between the LED chip and the wiring board and adhering and fixing the LED chip to the wiring board.
The step of peeling the LED chip from the carrier substrate,
LED chip mounting method characterized by executing. The LED chip mounting method according to claim 12, wherein the guide member has an opening corresponding to the outer shape of the LED chip. The guide member can be patterned by photolithography and is patterned and formed by using a heat-curable photosensitive thermosetting adhesive, and is heat-cured to bond and fix the LED chip to the wiring substrate. The LED chip mounting method according to claim 12 or 13, wherein the LED chip is mounted. The LED chip mounting method according to any one of claims 12 to 14, wherein the carrier substrate is a sapphire substrate, and the peeling step of the LED chip laser lifts off the LED chip from the sapphire substrate. The carrier substrate is a film or a transparent base material provided with at least one of an adhesive, an adhesive, and an adhesive film on the surface, and the peeling step of the LED chip is performed by adhering the adhesive to the carrier substrate. The LED chip mounting method according to any one of claims 12 to 14, wherein the LED chip transferred via an agent or an adhesive film is peeled off from the carrier substrate.