JP2021006641A5 - - Google Patents

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JP2021006641A5
JP2021006641A5 JP2020163238A JP2020163238A JP2021006641A5 JP 2021006641 A5 JP2021006641 A5 JP 2021006641A5 JP 2020163238 A JP2020163238 A JP 2020163238A JP 2020163238 A JP2020163238 A JP 2020163238A JP 2021006641 A5 JP2021006641 A5 JP 2021006641A5
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resin composition
molded product
polyimide
polyimide resin
product according
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JP2020163238A
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JP7115524B2 (en
JP2021006641A (en
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Priority to JP2022118339A priority patent/JP2022160509A/en
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Claims (10)

ポリエーテルイミド樹脂（Ａ）、及び、テトラカルボン酸成分（ｂ−１）と脂肪族ジアミン成分（ｂ−２）とを含有する結晶性ポリイミド樹脂（Ｂ）を含有するポリイミド系樹脂組成物であって、前記ポリエーテルイミド樹脂（Ａ）と前記結晶性ポリイミド樹脂（Ｂ）の含有割合が（Ａ）：（Ｂ）＝６０：４０〜９９：１質量％であることを特徴とする成形体用ポリイミド系樹脂組成物（但し、ポリエステルとポリエーテルイミドを含有する二軸配向フィルム用樹脂組成物であって、ポリエーテルイミドとナノ相溶する結晶性ポリイミド樹脂を１重量％以上、４０重量％以下の含有率で含み、樹脂組成物全体に対するポリエステルの割合が４０重量％以上の二軸配向フィルム用樹脂組成物、を除く）。 A polyimide resin composition containing a polyetherimide resin (A) and a crystalline polyimide resin (B) containing a tetracarboxylic acid component (b-1) and an aliphatic diamine component (b-2). Te, the content of the polyether imide resin (a) and the crystalline polyimide resin (B) is (a) :( B) = 60 : 40~99: molded body, characterized in that 1% by mass Polyimide-based resin composition (However, a resin composition for a biaxially oriented film containing polyester and polyetherimide, which comprises 1% by weight or more and 40% by weight or less of a crystalline polyimide resin nanocompatible with polyetherimide. (Excluding resin compositions for biaxially oriented films in which the ratio of polyimide to the entire resin composition is 40% by weight or more ). 前記脂肪族ジアミン成分（ｂ−２）が、少なくとも炭素数４〜１２の直鎖状脂肪族ジアミンを含むことを特徴とする請求項１に記載の成形体用ポリイミド系樹脂組成物。 The polyimide resin composition for a molded body according to claim 1, wherein the aliphatic diamine component (b-2) contains at least a linear aliphatic diamine having 4 to 12 carbon atoms. 前記脂肪族ジアミン成分（ｂ−２）が、少なくとも脂環族ジアミンを含むことを特徴とする請求項１又は２に記載の成形体用ポリイミド系樹脂組成物。 The polyimide resin composition for a molded product according to claim 1 or 2, wherein the aliphatic diamine component (b-2) contains at least an alicyclic diamine. 前記脂環族ジアミンが、１，３−ビス（アミノメチル）シクロヘキサンであることを特徴とする請求項３に記載の成形体用ポリイミド系樹脂組成物。 The polyimide resin composition for a molded product according to claim 3, wherein the alicyclic diamine is 1,3-bis (aminomethyl) cyclohexane. ＪＩＳ Ｋ７２４４−４に記載の動的粘弾性の温度分散測定により、歪み０．１％、周波数１０Ｈｚ、昇温速度３℃／分にて測定した損失正接（ｔａｎδ）のピーク値が一つ存在することを特徴とする請求項１〜４のいずれか１項に記載の成形体用ポリイミド系樹脂組成物。 According to the temperature dispersion measurement of dynamic viscoelasticity described in JIS K7244-4, there is one peak value of loss tangent (tan δ) measured at strain 0.1%, frequency 10 Hz, and heating rate 3 ° C./min. The polyimide-based resin composition for a molded body according to any one of claims 1 to 4, wherein the polyimide-based resin composition for a molded body is characterized. 前記損失正接（ｔａｎδ）のピーク値が示す温度（Ｔｇ）が１５０℃以上、３００℃以下であることを特徴とする請求項５に記載の成形体用ポリイミド系樹脂組成物。 The polyimide resin composition for a molded product according to claim 5, wherein the temperature (Tg) indicated by the peak value of the loss tangent (tan δ) is 150 ° C. or higher and 300 ° C. or lower. ＪＩＳ Ｋ７１２７に準拠して測定した引張弾性率が２２００ＭＰａ以上、３１００ＭＰａ以下であることを特徴とする請求項１〜６のいずれか１項に記載の成形体用ポリイミド系樹脂組成物。 The polyimide resin composition for a molded product according to any one of claims 1 to 6, wherein the tensile elastic modulus measured in accordance with JIS K7127 is 2200 MPa or more and 3100 MPa or less. ＪＩＳ Ｋ７１２７に準拠して測定した引張破断伸度が１３０％以上であることを特徴とする請求項１〜７のいずれか１項に記載の成形体用ポリイミド系樹脂組成物。 The polyimide resin composition for a molded product according to any one of claims 1 to 7, wherein the tensile elongation at break measured in accordance with JIS K7127 is 130% or more. 請求項１〜８のいずれか１項に記載の成形体用ポリイミド系樹脂組成物を用いて成形されてなる成形体。 A molded product formed by using the polyimide resin composition for a molded product according to any one of claims 1 to 8. 前記成形体がフィルムであることを特徴とする請求項９に記載の成形体。 The molded product according to claim 9, wherein the molded product is a film.
JP2020163238A 2020-09-29 2020-09-29 polyimide resin composition Active JP7115524B2 (en)

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JP2020163238A JP7115524B2 (en) 2020-09-29 2020-09-29 polyimide resin composition
JP2022118339A JP2022160509A (en) 2020-09-29 2022-07-26 polyimide resin composition

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JP2021006641A JP2021006641A (en) 2021-01-21
JP2021006641A5 true JP2021006641A5 (en) 2021-11-04
JP7115524B2 JP7115524B2 (en) 2022-08-09

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3676603B2 (en) * 1992-04-02 2005-07-27 三井化学株式会社 Polyimide resin composition
JPH07188554A (en) * 1993-11-22 1995-07-25 Mitsui Toatsu Chem Inc Heat shrinkable polyimide-based molding
JP4565800B2 (en) * 2002-10-01 2010-10-20 東レ株式会社 Biaxially oriented film
JP2009173847A (en) * 2007-12-27 2009-08-06 Toray Ind Inc Thermoplastic resin composition and molded article
WO2013118704A1 (en) * 2012-02-08 2013-08-15 三菱瓦斯化学株式会社 Crystalline thermoplastic polyimide resin
WO2015020020A1 (en) * 2013-08-06 2015-02-12 三菱瓦斯化学株式会社 Polyimide resin composition, and (polyimide resin)-fiber composite material
JP2015166852A (en) * 2014-02-12 2015-09-24 株式会社リコー Conductive resin belt, manufacturing method thereof, and image forming apparatus including the same
CN106715534B (en) * 2015-03-19 2018-10-19 三菱瓦斯化学株式会社 Polyimide resin
KR101744009B1 (en) * 2015-03-19 2017-06-07 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 Polyimide resin

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