JP2021005187A - Wiring body assembly, and touch sensor - Google Patents

Abstract

To provide a wiring body assembly capable of enhancing connection reliability between a first wiring body and a second wiring body.SOLUTION: A wiring body assembly 4 includes: a first wiring body 5 having a first resin layer 6 and a first terminal 77 provided on the first resin layer 6; a second wiring body 11a having a third terminal 13; and a connection body 15 containing conductive particles and interposed between the first terminal 77 and the third terminal 13 to connect the first wiring body 5 and the second wiring body 11a. The first terminal 77 includes a first conductor layer 751 and a first reinforcement layer 752 laminated on the first conductor layer 751, and a Young's modulus of the first reinforcement layer 752 is higher than a Young's modulus of the first resin layer 6, and is higher than a Young's modulus of the first conductor layer 751.SELECTED DRAWING: Figure 13

Description

The present invention relates to a wiring assembly and a touch sensor.

As a wiring body assembly constituting a touch sensor, one in which a first wiring body and a second wiring body are electrically connected via an heteroconductive material is known (see, for example, Patent Document 1).

International Release 2017/022398

In the above technique, when the first wiring body and the second wiring body are crimped, the first terminal of the first wiring body is deformed by the crimping pressure, and the conductivity in the anisotropic conductive material is formed. The anisotropic conductive material may be cured with insufficient contact between the particles and the first terminal and the contact between the conductive particles and the second terminal. In this case, there is a problem that the connection reliability between the first wiring body and the second wiring body may decrease.

An object to be solved by the present invention is to provide a wiring body assembly capable of improving the connection reliability of the first wiring body and the second wiring body, and a touch sensor provided with the wiring body assembly.

[1] The wiring body assembly according to the present invention has a first wiring body having a support layer and a first terminal provided on the support layer, and a second wiring body having a second terminal. And a connecting body containing conductive particles and interposed between the first terminal and the second terminal to connect the first wiring body and the second wiring body. The terminal 1 includes a conductor layer and a reinforcing layer laminated on the conductor layer, and the Young ratio of the reinforcing layer is higher than the Young ratio of the support layer and more than the Young ratio of the conductor layer. Is also a tall wire assembly.

[2] In the above invention, the reinforcing layer may have conductivity.

[3] In the above invention, the reinforcing layer is provided between the support layer and the conductor layer, one main surface of the reinforcing layer is in contact with the conductor layer, and the other main surface of the reinforcing layer is in contact with the conductor layer. The surface may be in contact with the support layer.

[4] In the above invention, the reinforcing layer may contain carbon.

[5] In the above invention, the conductor layer contains metal particles, the reinforcing layer contains carbon, and the particle size of the metal particles may be larger than the particle size of the carbon.

[6] In the above invention, the reinforcing layer may have a glass transition temperature higher than the glass transition temperature of the support layer.

[7] The touch sensor according to the present invention is a touch sensor provided with the above wiring body assembly.

In the present invention, the first terminal of the first wiring body has a reinforcing layer laminated on the conductor layer. The Young's modulus of the reinforcing layer is higher than the Young's modulus of the support layer of the first wiring body and higher than the Young's modulus of the conductor layer. Since the first terminal has such a reinforcing layer, when the terminal of the first wiring body and the terminal of the second wiring body are crimped via the anisotropic conductive material, the first terminal can be pressed. It is possible to suppress deformation. As a result, the conductive particles in the anisotropic conductive material come into strong contact with the first terminal and the second terminal, so that the connection reliability between the first wiring body and the second wiring body can be improved. ..

FIG. 1 is an exploded perspective view showing a touch sensor according to an embodiment of the present invention. FIG. 2 is a plan view showing the first wiring body according to the embodiment of the present invention. FIG. 3 is a cross-sectional view taken along the line III-III of FIG. FIG. 4 is an enlarged plan view of the IV portion of FIG. FIG. 5 is a cross-sectional view taken along the line VV of FIG. FIG. 6 is an enlarged cross-sectional view of the VI portion of FIG. FIG. 7 is a bottom view showing a second wiring body according to the embodiment of the present invention. FIG. 8 is a cross-sectional view taken along the line VIII-VIII of FIG. FIG. 9 is an enlarged view of the IX portion of FIG. 10 (a) to 10 (g) are cross-sectional views showing a method of manufacturing a touch sensor (No. 1) according to the embodiment of the present invention. 11 (a) to 11 (j) are cross-sectional views showing a method of manufacturing a touch sensor (No. 2) according to the embodiment of the present invention. 12 (a) to 12 (c) are cross-sectional views showing a method of manufacturing a touch sensor (No. 3) according to the embodiment of the present invention. FIG. 13 is a cross-sectional view showing the operation of the wiring body assembly according to the embodiment of the present invention, and is an enlarged view of the XIII portion of FIG.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is an exploded perspective view showing a touch sensor according to an embodiment of the present invention, FIG. 2 is a plan view showing a first wiring body according to an embodiment of the present invention, and FIG. 3 is a line III-III of FIG. FIG. 4 is an enlarged plan view of the IV portion of FIG. 2, FIG. 5 is a sectional view of the IV portion of FIG. 4, and FIG. 6 is an enlarged sectional view of the VI portion of FIG. 7A and 7B are bottom views showing a second wiring body according to an embodiment of the present invention, FIG. 8 is a sectional view taken along the line VIII-VIII of FIG. 1, and FIG. 9 is IX of FIG. It is an enlarged sectional view of a part.

The touch sensor 1 of the present embodiment is a projection type capacitance type touch panel sensor, and is used as an input device (touch panel) having a function of detecting a touch position in combination with a display device (not shown) or the like. Be done. The display device is not particularly limited, and a liquid crystal display, an organic EL display, or the like can be used. The touch sensor 1 has a light-transmitting detection electrode and a drive electrode arranged so as to face each other, and a predetermined voltage is periodically applied between the two electrodes.

In such a touch sensor 1, for example, when an operator's finger (external conductor) approaches the touch sensor 1, a capacitor (capacitance) is formed between the external conductor and the touch sensor 1, and two electrodes are formed. The electrical state between them changes. The touch sensor 1 can detect the operating position of the operator based on the electrical change between the two electrodes.

As shown in FIG. 1, the touch sensor 1 of the present embodiment includes a cover panel 3, a wiring body assembly 4, and a transparent adhesive layer 16 (see FIG. 8). The "wiring body assembly 4" in the present embodiment corresponds to an example of the "wiring body assembly" in the present invention.

As shown in FIG. 1, the cover panel 3 is provided on the main surface of the wiring body assembly 4. The cover panel 3 is provided from the viewpoint of preventing the wiring body assembly 4 from being soiled, scratched, discolored, or the like. As the material constituting the cover panel 3, for example, a glass material such as soda lime glass or borosilicate glass, or a resin material such as polymethyl methacrylate (PMMA) or polycarbonate (PC) can be used, but 90% or more. A material having the total light transmittance of is preferable.

The cover panel 3 has a transparent portion 31 capable of transmitting visible light and a shielding portion 32 that shields visible light. The shielding portion 32 is formed by applying, for example, black ink to the back surface of the cover panel 3. Further, black ink is not applied to the rectangular region substantially in the center of the back surface of the cover panel 3, whereby a transparent portion 31 that transmits visible light is formed. That is, the shielding portion 32 is formed in a frame shape surrounding the transparent portion 31 in a plan view.

The transparent portion 31 corresponds to the electrodes (detection electrode and drive electrode) of the touch sensor 1 and overlaps the electrodes in a plan view. The shielding portion 32 is formed in a region other than the region corresponding to the electrode of the touch sensor 1, whereby the outlet wiring and the connection terminal of the touch sensor 1 cannot be visually recognized.

The wiring body assembly 4 includes a first wiring body 5, a second wiring body 11, and a connecting body 15 (see FIG. 8).

As shown in FIGS. 2 and 3, the first wiring body 5 includes a first resin layer 6, a first conductor portion 7, a second resin layer 8, a second conductor portion 9, and the like. It has a third resin layer 10 and these are laminated in this order. In FIG. 2, in order to make it easier to understand the structure of the first wiring body 5, the third resin layer 10 is not shown, and the second conductor portion 9 is indicated by a solid line. The "first wiring body 5" in the present embodiment corresponds to an example of the "first wiring body" in the present invention.

The first resin layer 6 is a support layer for holding the first conductor portion 7, and is made of a transparent (translucent) material. Examples of the material constituting the first resin layer 6 include a UV curable resin, a thermosetting resin, a thermoplastic resin, and the like, and more specifically, an epoxy resin, an acrylic resin, and a polyester resin. , Urethane resin, vinyl resin, silicone resin, phenol resin, polyimide resin and the like can be exemplified. The material constituting the support layer is not particularly limited to the resin material. The first resin layer 6 in the present embodiment corresponds to an example of the "support layer" in the present invention.

As shown in FIG. 3, the first resin layer 6 is composed of a flat portion 61 provided with a substantially constant thickness and a support portion 62 formed on the flat portion 61.

The support portion 62 has a contact surface 621 which is an upper surface of the support portion 62. The first resin layer 6 is in contact with the first conductor portion 7 on the contact surface 621. Further, the support portion 62 has two substantially flat side surfaces that are inclined so as to approach each other as the distance from the flat portion 61 increases in a cross-sectional view. The cross section referred to here refers to a cross section along the lateral direction of the conductor wire forming the first conductor portion 7 in contact with the support portion 62.

The first conductor portion 7 is formed on the first resin layer 6. As shown in FIG. 2, the first conductor portion 7 includes a plurality of first electrode patterns 71, a plurality of first lead-out wirings 76, and a plurality of first terminals 77.

The first electrode pattern 71 has a network shape formed by intersecting a plurality of conductive electrode conductor wires 72. In the present embodiment, the first conductor portion 7 has three first electrode patterns 71 extending substantially in parallel along the Y direction, and the plurality of first electrode patterns 71 cover the first electrode patterns 71. It is provided corresponding to the transparent portion 31 of the panel 3.

As shown in FIG. 3, the electrode conductor wire 72 is composed of the first linear body 75 and is formed on the first resin layer 6. Although not particularly limited, the first linear body 75 is also used for the conductor wire constituting the first lead-out wiring 76 described later, and also for the conductor wire constituting the first terminal 77 described later. It is used. The structure of the first linear body 75 will be described in detail later together with the structure of the first terminal 77 described later.

As shown in FIG. 2, the first lead-out wiring 76 is provided corresponding to the first electrode pattern 71, and in the present embodiment, the first three first electrode patterns 71 are provided with respect to the three first electrode patterns 71. Drawer wiring 76 is formed. The first lead-out wiring 76 is drawn out from the −Y direction side in the drawing of the first electrode pattern 71 via the lead-out portion 761. The position where the drawer portion 761 is provided on the outer edge of the first electrode pattern 71 is not particularly limited. Further, in the present embodiment, one end of the first lead-out wiring 76 is connected to the first electrode pattern 71 via the lead-out portion 761, but the present invention is not particularly limited to this, and the first lead-out wiring 76 The first electrode pattern 71 may be directly connected.

The first lead-out wiring 76 is formed in a mesh shape formed by intersecting a plurality of conductive conductor wires. This mesh shape is substantially the same as the mesh shape formed by the terminal conductor wire 78 of the first terminal 77, which will be described later.

As shown in FIG. 2, first terminals 77 (three in total) are formed at the other end of each of the first lead-out wires 76. The first terminal 77 is provided corresponding to the shielding portion 32 of the cover panel 3, and is located near the outer edge of the first wiring body 5 on the −Y direction side. The plurality of first terminals 77 are arranged side by side along the Y direction, and are gathered near the center of the first wiring body 5 in the X direction. The first lead-out wiring 76 is arranged while being bent according to the first terminal 77 to be assembled. The first terminal 77 in the present embodiment corresponds to an example of the "first terminal" in the present invention.

As shown in FIG. 4, the first terminal 77 of the present embodiment is formed in a mesh shape formed by intersecting a plurality of conductive terminal conductor wires 78a and 78b. Each of the first terminals 77 is formed in a mesh shape formed by intersecting a plurality of terminal conductor wires 78a and 78b. In the present specification, "terminal conductor wire 78a" and "terminal conductor wire 78b" are collectively referred to as "terminal conductor wire 78" as necessary.

As shown in FIG. 4, the terminal conductor wire 78a extends linearly along a direction inclined at + 45 ° with respect to the X direction (hereinafter, also simply referred to as “first direction”). The plurality of terminal conductor wires 78a are arranged at equal pitches in a direction substantially orthogonal to the first direction (hereinafter, also simply referred to as a "second direction").

On the other hand, the terminal conductor wires 78b extend linearly along the second direction, and the plurality of terminal conductor wires 78b are arranged at equal pitches in the first direction. Then, the terminal conductor wires 78a and 78b are orthogonal to each other, so that the square (diamond-shaped) openings 79 defined between the terminal conductor wires 78a and 78b are repeatedly arranged.

Incidentally, the configuration of the first terminal 77 is not particularly limited to the above. For example, in the present embodiment, the pitch of the terminal conductor wire 78a and the pitch of the terminal conductor wire 78b are substantially the same, but the pitch is not particularly limited to this, and the pitch of the terminal conductor wire 78a and the pitch of the terminal conductor wire 78b May be different. Further, the extending direction of the terminal conductor wire 78 is not particularly limited to the above, and may be arbitrary. Further, in the present embodiment, the terminal conductor wire 78 is linear, but is not particularly limited to this, and may be, for example, curved, horseshoe-shaped, zigzag-shaped, or the like.

In the present embodiment, the first terminal 77 forms a quadrangular opening 79 by making the terminal conductor wires 78a and 78b orthogonal to each other, but the first terminal 77 is not particularly limited to this, and various graphic units can be used. It can be used as the shape of the opening 79. For example, the shape of the opening 79 may be an equilateral triangle, an isosceles triangle, a triangle such as a right triangle, a rectangle, a square, a diamond, a parallelogram, a trapezoid, or the like, or a hexagon, an octagon, a twelve, or two. It may be an n-sided shape such as an icosagon, a circle, an ellipse, a star shape, or the like. Further, in the present embodiment, the plurality of openings 79 have the same shape as each other, but the present invention is not particularly limited to this, and openings having different shapes may be mixed depending on the shape and arrangement of the conductor wires.

As shown in FIGS. 5 and 6, the terminal conductor wire 78 is provided on the support portion 62 of the first resin layer 6, and is composed of the above-mentioned first linear body 75. The first linear body 75 includes a first conductor layer 751 and a first reinforcing layer 752. The first conductor layer 751 in the present embodiment corresponds to an example of the "conductor layer" in the present invention, and the first reinforcing layer 752 in the present embodiment corresponds to an example of the "reinforcing layer" in the present invention.

The first conductor layer 751 is provided on the first reinforcing layer 752 described later, and has a tapered shape that becomes narrower as the distance from the first resin layer 6 increases. The first conductor layer 751 has a first contact surface 751a and a second contact surface 751b.

The first contact surface 751a is a curved surface having an uneven shape, and is in contact with the first reinforcing layer 752 described later. The first contact surface 751a projects upward in FIG. 6. More specifically, the distance between the first contact surface 751a in the vertical direction and the contact surface 621 of the first resin layer 6 becomes longer toward the center in the width direction of the first linear body 75. ing.

The shape of the first contact surface 751a is not particularly limited to the above. For example, the first contact surface 751a may be recessed downward in FIG. Alternatively, in FIG. 6, the first contact surface 751a may be inclined so that the distance from the contact surface 621 gradually increases from one end to the other end in the left-right direction.

The second contact surface 751b has a tapered shape that becomes narrower as the distance from the first contact surface 751a increases. The second contact surface 751b has two planes that approach each other as they move away from the first contact surface 751a, and a curved surface that connects the planes.

The shape of the second contact surface 751b is not particularly limited to the above. For example, the second contact surface 751b may have two planes that approach each other as they move away from the first contact surface 751a, and a plane that connects the planes.

The first conductor layer 751 contains a plurality of metal particles P ₁ and a binder resin B ₁ that binds the metal particles P _{1 to} each other. The first conductor layer 751 is formed by printing and curing a conductive paste. As a specific example of the conductive paste, a paste in which the metal particles P ₁ and the binder resin B ₁ are mixed with water, a solvent, and various additives can be exemplified. Metal particles P ₁ in the present embodiment corresponds to an example of "metal particles" in the present invention.

Specific examples of the material constituting the metal particles P ₁ include silver, copper, nickel, tin, bismuth, zinc, indium, palladium and the like. Among these, it is particularly preferable to use silver having a smaller electrical resistivity. Incidentally, as the material constituting the metal particles P _1, may be a metal salt. Specific examples of the metal salt include the above-mentioned metal salt.

Specific examples of the binder resin B ₁ include acrylic resin, polyester resin, epoxy resin, vinyl resin, urethane resin, phenol resin, polyimide resin, silicone resin, fluororesin and the like. Specific examples of the solvent include α-terpineol, butyl carbitol acetate, butyl carbitol, 1-decanol, butyl cell solve, diethylene glycol monoethyl ether acetate, tetradecane and the like.

The first reinforcing layer 752 is provided on the support portion 62 of the first resin layer 6. The first reinforcing layer 752 has a shape protruding toward the first conductor layer 751. The first reinforcing layer 752 has a third contact surface 752a, a fourth contact surface 752b, a first side surface 752c, and a second side surface 752d.

The shape of the first reinforcing layer 752 is not particularly limited to the above. For example, in FIG. 6, either the left or right end of the first reinforcing layer 752 may protrude toward the first conductor layer 751. Alternatively, the first reinforcing layer 752 may have a shape recessed toward the first resin layer 6.

The third contact surface 752a is a curved surface that is convexly curved toward the first conductor layer 751 and is in contact with the first conductor layer 751. The third contact surface 752a has a concave-convex shape complementary to the first contact surface 751a.

The fourth contact surface 752b is in contact with the contact surface 621 of the first resin layer 6. The fourth contact surface 752b is a substantially flat surface that is hardly curved, and has a smaller curvature than the above-mentioned first contact surface 751a. The shape of the second contact surface 751b is not limited to this, and may be a curved surface that is convexly curved toward the first conductor layer 751.

The shape of the fourth contact surface 752b is not particularly limited to the above. For example, the fourth contact surface may be a curved curved surface.

The first side surface 752c and the second side surface 752d are located between the third contact surface 752a and the fourth contact surface 752b and are connected to each other. The first side surface 752c and the second side surface 752d are each smoothly connected to the first conductor layer 751 and form a continuous flat surface.

Further, although not particularly limited, the thickness of the first reinforcing layer 752 is smaller than the thickness of the first conductor layer 751 in the cross section along the width direction of the first conductor layer 751.

The first reinforcing layer 752 contains a plurality of reinforcing particles P _B and a binder resin B _B that binds the reinforcing particles P _{B to} each other. The terminal reinforcing layer 781 is formed by printing and curing a black paste. As a specific example of the black paste, a paste obtained by mixing reinforcing particles P _B and binder resin B _B with water, a solvent, and various additives can be exemplified. It is also possible to omit the binder resin B _B from the first reinforcing layer 752.

The first reinforcing layer 752 is preferably conductive from the viewpoint of suppressing an increase in the resistance of the first linear body 75, but the first reinforcing layer 752 is not conductive. You may. In the present embodiment, as the reinforcing particles P _B , particles having conductivity and having a reflectance smaller than that of the metal particles P ₁ constituting the first conductor layer 751 are used. Specific examples of the reinforcing particles P _B include carbon-based materials. More specifically, examples of carbon-based materials include graphite, carbon black (furness black, acetylene black, and ketjen black), carbon nanotubes, and carbon nanofibers. The reinforcing particles P _B in the present embodiment correspond to an example of "carbon" in the present invention.

Alternatively, metal oxide particles may be used as the reinforcing particles P _B instead of the carbon-based material. As a specific example of the metal oxide, for example, titanium oxide or the like can be used.

Particle size of the reinforcing particles P _B (average particle diameter) is preferably smaller than the particle size of the metal particles P ₁ (average particle diameter). Since the particle size of the reinforcing particles P _B is relatively small, the density of the reinforcing particles P _B can be increased in the first reinforcing layer 752. As a result, the strength of the first reinforcing layer 752 can be increased.

Note that the particle size of the reinforcing particles P _B and the metal particles P _1, refers to a plurality of reinforcing particles P _B and an arithmetic mean value of the diameters of the metal particles P ₁ (average particle diameter). The average particle size of the reinforcing particles P _B is measured as follows. That is, a plurality (at least 10) using a scanning electron microscope (SEM) to measure the particle size of the reinforcing particles P _B of finding the arithmetic mean value. In this case, if the shape of the reinforcing particles P _B is an ellipsoidal shape having a minor axis and a major axis, a rod shape, or a shape including the concept of aspect ratio, the side in the longitudinal direction as the diameter of the reinforcing particles P _B. (Or diameter) is measured. In the measurement of the diameter of the reinforcing particles P _B are those of the condition in which the particles are being aggregated, for what strain outline of the granules is excluded from the measurement target. Incidentally, the state in which the reinforcing particles P _B are aggregated means, for example, a state in which the reinforcing particles P _B are fixed to each other to form flakes. The average particle size of the metal particles P ₁ can also be calculated by the same method as the average particle size of the reinforcing particles P _B.

As the binder resin B _B , it is preferable to use a resin material that cures at substantially the same temperature as the binder resin B ₁ contained in the first conductor layer 751. As a specific example, for example, polyester resin, epoxy resin, phenol resin and the like can be used. Specific examples of the solvent include α-terpineol, butyl carbitol acetate, butyl carbitol, 1-decanol, butyl cell solve, diethylene glycol monoethyl ether acetate, tetradecane and the like.

Further, in the present embodiment, the first reinforcing layer 752 contains the reinforcing particles P _B , but the present invention is not limited to this. For example, by forming the first reinforcing layer 752 using black ink instead of the above-mentioned black paste, the first reinforcing layer 752 contains a black pigment instead of the reinforcing particles P _B. May be good. In this case, the black pigment corresponds to an example of the reinforcing particles P _B in the present invention. Further, the first reinforcing layer 752 may further contain a black pigment in addition to the reinforcing particles P _B.

Further, in the present embodiment, the Young's modulus of the first reinforcing layer 752 is higher than the Young's modulus of the first resin layer 6 and higher than the Young's modulus of the first conductor layer 751. As a result, it is possible to prevent the first terminal 77 from being deformed in the step of connecting the first wiring body 5 and the second wiring body 11 by thermocompression bonding via the connecting body 15 described later. As a result, the connection reliability of the first wiring body 5 and the second wiring body 11 can be improved.

Although not particularly limited, when the Young's modulus of the first resin layer 6 is 5 MPa to 2000 MPa and the Young's modulus of the first conductor layer 751 is 1000 MPa to 20000 MPa, the Young's modulus of the first reinforcing layer 752 is determined. It is preferably 5000 MPa to 30,000 MPa. In particular, it is more preferable that the Young's modulus at the thermocompression bonding temperature (130 to 160 ° C.) satisfies the above range.

Further, the glass transition temperature of the first reinforcing layer 752 is preferably higher than the glass transition temperature of the first resin layer 6. Since the glass transition temperature of the first reinforcing layer 752 is higher than the glass transition temperature of the first resin layer 6, the first reinforcing layer 752 is higher than the first resin layer 6 in the thermocompression bonding step described later. Hard to soften. Therefore, it is possible to suppress the deformation of the first terminal 77, and it is possible to further improve the connection reliability between the first wiring body 5 and the second wiring body 11.

Although not particularly limited, when the glass transition temperature of the first resin layer 6 is 60 ° C to 80 ° C, the glass transition temperature of the first reinforcing layer 752 is preferably 100 ° C to 200 ° C.

As shown in FIG. 3, the second resin layer 8 is formed on the first resin layer 6 so as to cover the first conductor portion 7. The second resin layer 8 is interposed between the first conductor portion 7 and the second conductor portion 9, and has a function of ensuring the insulation thereof. In the touch sensor 1, the second resin layer 8 interposed between the detection electrode and the driving electrode (that is, the first electrode pattern 71 and the second electrode pattern 91) acts as a dielectric material, and the second resin layer 8 acts as a dielectric. The sensitivity of the touch sensor 1 is adjusted according to the thickness of the resin layer 8 of the above.

The second resin layer 8 is composed of a main portion 81 that covers the first conductor portion 7 and a support portion 82 formed on the main portion 81. The support portion 82 is formed between the main portion 81 and the second conductor portion 9, and is formed so as to project in a direction away from the first resin layer 6. As the material constituting the second resin layer 8, the same material as the material constituting the first resin layer 6 can be exemplified.

As shown in FIG. 2, the second resin layer 8 is formed with a notch 83 in the second resin layer 8. In the notch 83, the second resin layer 8 is cut to a size that exposes the plurality of first terminals 77. By exposing the first terminal 77 from the second resin layer 8 in the notch 83, the detection signal detected in the first electrode pattern 71 is taken out to the outside.

The second conductor portion 9 is provided on the support portion 82 of the second resin layer 8. As shown in FIG. 2, the second conductor portion 9 includes a plurality of second electrode patterns 91, a plurality of second lead-out wires 96, and a plurality of second terminals 97.

The plurality of second electrode patterns 91 extend substantially in parallel along the X direction, and are provided corresponding to the transparent portion 31 of the cover panel 3.

As shown in FIG. 2, the plurality of second lead-out wires 96 are provided corresponding to the second electrode pattern 91. In the present embodiment, four second lead-out wires 96 are formed for the four second electrode patterns 91. One end of the second lead-out wiring 96 is drawn out from the second electrode pattern 91 via the lead-out portion 961. The connection between the second electrode pattern 91 and the second lead-out wiring 96 is not limited to the above. One end of the second lead-out wiring 96 and the second electrode pattern 91 may be directly connected.

As shown in FIG. 2, a second terminal 97 is formed at the other end of each of the second lead-out wiring 96. The plurality of second terminals 97 are provided corresponding to the shielding portion 32 of the cover panel 3. The first and second terminals 77 and 97 are arranged side by side in the X direction in a plan view, but in the Z direction, the second terminals 77 and 97 are arranged according to the thickness of the second resin layer 8. Terminal 97 is arranged so as to be offset above the first terminal 77 (see FIG. 8).

Similar to the first conductor portion 7, the second electrode pattern 91, the second lead-out wiring 96, and the second terminal 97 are formed in a mesh shape formed by intersecting a plurality of conductive conductor wires. There is. In the present embodiment, the network structure constituting the first conductor portion 7 and the network structure constituting the second conductor portion 9 have substantially the same embodiment (that is, the shape of the conductor wire constituting them and the shape of the conductor wire constituting them). The arrangement is substantially the same).

The relationship between the network structure constituting the first conductor portion 7 and the network structure constituting the second conductor portion 9 is not particularly limited to the above. That is, the mesh structure of the first conductor portion 7 and the mesh structure of the second conductor portion 9 may be different. For example, the mesh of the first conductor portion 7 and the mesh of the second conductor portion 9 may be different. May be coarse. Alternatively, the mesh in the second conductor portion 9 may be finer than the mesh in the first conductor portion 7. The adjustment of the density of the mesh in the first and second conductor portions 7 and 9 is the shape of the conductor wires constituting them (for example, the width of the conductor wires) and the arrangement of a plurality of conductor wires (for example, adjacent to each other). This can be done by changing the pitch between the conductor wires.

The second terminal 97 has a plurality of terminal conductor wires 98 arranged in a mesh pattern, and a plurality of openings 99 are defined by intersecting the plurality of terminal conductor wires 98 with each other. However, the basic configuration is the same as that of the first terminal 77, although there are some differences in shape. Therefore, in the present specification, FIGS. 4 and 5 show the first lead-out wiring 76 and the first terminal 77 of the first conductor portion 7, and the second lead-out wiring 96 and the second lead-out wiring of the second conductor portion 9. The terminal 97 of No. 2 is not shown by adding a corresponding reference numeral in parentheses.

The conductor wire constituting the second electrode pattern 91, the second lead-out wiring 96, and the second terminal 97 is composed of the second linear body 95. As shown in FIGS. 3 and 5, the second linear body 95 includes a second conductor layer 951 and a second reinforcing layer 952. Further, the cross-sectional shape of the second linear body 95 is basically the same as that of the first linear body 75 (see FIG. 6).

As the material constituting the second conductor layer 951, the same material as the material constituting the first conductor layer 751 can be used. Further, as the material constituting the second reinforcing layer 952, the same material as the material constituting the first reinforcing layer 752 can be used.

In the present embodiment, the Young's modulus of the second reinforcing layer 952 is higher than the Young's modulus of the second resin layer 8 and higher than the Young's modulus of the second conductor layer 951. As a result, it is possible to prevent the second terminal 97 from being deformed in the step of connecting the first wiring body 5 and the second wiring body 11 via the connection body 15 described later. As a result, the connection reliability of the first wiring body 5 and the second wiring body 11 can be improved.

Further, the glass transition temperature of the second reinforcing layer 952 is preferably higher than the glass transition temperature of the second resin layer 8. As a result, the second reinforcing layer 952 is less likely to be softer than the second resin layer 8. Although the details will be described later, this makes it possible to prevent the second terminal 97 from being deformed when the second wiring body 11 is pressed against the first wiring body and crimped, so that the first wiring can be prevented from being deformed. The connection reliability between the body 5 and the second wiring body 11 can be further improved.

As shown in FIG. 3, the third resin layer 10 is formed on the second resin layer 8 so that the second conductor portion 9 is interposed between the third resin layer 10. By covering the second conductor portion 9 with the third resin layer 10, it is possible to suppress the occurrence of light scattering or the like on the surface of the first wiring body 5. Such a third resin layer 10 can be made of the same material as the first resin layer 6.

In the present embodiment, the third resin layer 10 is formed substantially uniformly including the upper part of the connection portion between the first wiring body 5 and the second wiring body 11, but is not particularly limited thereto. .. For example, a notch may be formed in a part of the third resin layer 10 so that the second wiring body 11 is exposed. Further, a resin layer different from the third resin layer 10 may be further provided to cover the exposed second wiring body 11 from above.

As shown in FIG. 1, the second wiring bodies 11a, 11b, and 11c are flexible printed circuit boards for electrically connecting the first wiring body 5 and an external circuit (not shown). In the present embodiment, the second wiring body 11a is electrically connected to the first conductor portion 7, and the second wiring bodies 11b and 11c are electrically connected to the second conductor portion 9. In the following description, when the second wiring body is generically referred to, it is simply referred to as "second wiring body 11", and when distinguishing individual second wiring bodies, each second wiring body is used. It is represented by a code indicating the body. The second wiring body 11a in the present embodiment corresponds to an example of the "second wiring body" in the present invention.

As shown in FIG. 7, the second wiring body 11 is a wiring that is electrically connected to the base material 12, the third terminal 13 provided on the base material 12, and the third terminal 13. 14 and. The base material 12 is a strip-shaped member, and is made of, for example, a film material such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyimide resin (PI), and polyetherimide resin (PEI).

The third terminal 13 is provided corresponding to the first terminal 77 and the second terminal 97. The second wiring body 11a is provided with three third terminals 13a paired with each of the three first terminals 77. On the other hand, the second wiring body 11b is provided with two third terminals 13b paired with each of the two second terminals 97, and the second wiring body 11c is provided with two second terminals. Two third terminals 13c paired with each of the 97 are provided. The above-mentioned "third terminal 13" is a general term for "third terminal 13a", "third terminal 13b", and "third terminal 13c". The third terminal 13a in the present embodiment corresponds to an example of the "second terminal" in the present invention.

The wiring 14 is electrically connected to the third terminal 13 on one end side and electrically connected to an external circuit (not shown) on the other end side. The third terminal 13 and the wiring 14 may be integrally formed or may be formed with different compositions. As such a third terminal 13 and wiring 14, for example, electrolytic copper foil, rolled copper foil, or the like can be used. The third terminal 13 and the wiring 14 may be configured by using the same material as the material constituting the first conductor portion 7 described above. In FIG. 7, "wiring 14a", "wiring 14b", and "wiring 14c" are shown, but "wiring 14" is a general term for these.

As shown in FIG. 8, the connecting body 15 has a function of joining the first and second wiring bodies 5 and 11 and electrically connecting them. As such a connecting body 15, an anisotropic conductive material in which conductive particles 152 are dispersed in a resin material 151 (binder resin) can be used. Specific examples of the anisotropic conductive material include an anisotropic conductive film (ACF) and an anisotropic conductive paste (ACP). The connecting body 15 in the present embodiment corresponds to an example of the "connecting body" in the present invention.

Hereinafter, as the connection structure of the first and second wiring bodies 5 and 11, the connection between the first terminal 77 and the third terminal 13a will be described in detail as an example. In the present embodiment, the first and second wiring bodies 5 and 11 are thermocompression-bonded and connected, and as shown in FIG. 9, the connecting body is connected between the first terminal 77 and the third terminal 13a. These wiring bodies 5 and 11 are fixed in a state where the 15 is interposed. In this case, the resin material 151 enters between the plurality of terminal conductor wires 78 and is in contact with the first resin layer 6, and is also in contact with the base material 12a and the third terminal 13a, so that the first and second terminals are in contact with each other. Wiring bodies 5 and 11 are joined. On the other hand, the conductive particles 152 are sandwiched between the first and third terminals 77 and 13a, and are in contact with both terminals 77 and 13a to electrically connect them. The insulated state is maintained in the unpressurized portion.

As the resin material 151 constituting the connecting body 15, a thermosetting resin, a thermoplastic resin, a thermosetting / thermoplastic mixed resin or the like can be used, and specifically, an epoxy resin, a phenol resin, a urethane resin or the like can be used. Resin materials such as resins, acrylic resins, silicone resins, polyester resins, and polyamide resins can be exemplified. As the conductive particles 152 constituting the connecting body 15, metal fine particles such as silver, copper and nickel, resin fine particles coated with these metals (resin core), carbon and the like can be used. As the resin core, an acrylic resin, a styrene resin, or the like can be used.

From the viewpoint of improving the connection reliability between the first wiring body 5 and the second wiring body 11, the diameter of the conductive particles 152 is larger than the inner diameter of the opening 79 of the first terminal 77. There is. Further, the diameter of the conductive particles 152 is larger than the inner diameter of the opening 99 of the second terminal 97.

In the above description, the connection structure of the first terminal 77 and the third terminal 13a has been described, but there is a slight difference in shape between the connection structures of the second terminal 97 and the third terminal 13b (13c). However, the basic configuration is the same. Therefore, the first terminal 77 and the third terminal 13a are shown in FIG. 9, and the second terminal 97 and the third terminal 13b (13c) are not shown by adding the corresponding reference numerals in parentheses. ..

As shown in FIG. 8, the transparent adhesive layer 16 is interposed between the cover panel 3 and the third resin layer 10. The transparent adhesive layer 16 is used for attaching the first wiring body 5 to the cover panel 3. As the transparent adhesive layer 16, known adhesives such as an acrylic resin-based adhesive, a urethane resin-based adhesive, and a polyester resin-based adhesive can be used.

Next, regarding the manufacturing method of the touch sensor 1 in the present embodiment, FIGS. 10 (a) to 10 (g), FIGS. 11 (a) to 11 (j), and FIGS. 12 (a) to 12 (c). ) Will be explained in detail.

First, as shown in FIG. 10A, the intaglio 400 in which the recess 401 is formed is prepared. Examples of the material constituting the concave plate 400 include nickel, silicon, glass, organic silica, glassy carbon, thermoplastic resin, photocurable resin and the like. In order to improve the releasability, a releasing layer (not shown) made of a carbon-based material, a silicone-based material, a fluorine-based material, a ceramic-based material, an aluminum-based material, or the like is formed in advance on the surface of the recess 401. It is preferable to keep it.

Next, the recess 401 of the intaglio 400 is filled with the conductive material 410, which is a precursor of the first conductor layer 751. As the conductive material 410 filled in the recess 101, the above-mentioned conductive paste is used. Examples of the filling method of the conductive material 410 include a dispensing method, an inkjet method, and a screen printing method. Alternatively, as a filling method of the conductive material 410, after coating by the slit coating method, the bar coating method, the blade coating method, the dip coating method, the spray coating method, or the spin coating method, the conductive material is applied to other than the recess 401. Methods of wiping, scraping, sucking, pasting, rinsing, or blowing off the sex material 410 can also be mentioned.

Next, as shown in FIG. 10B, the conductive material 410 is dried or heated. The drying or heating conditions of the conductive material 410 can be appropriately set according to the composition of the conductive material 410 and the like. Due to this drying or heating condition, the conductive material 410 is volume-shrinked to form the first conductor layer 751 and the uneven first contact surface 751a of the first conductor layer 751. The method for treating the conductive material 410 is not limited to heating. It may be irradiated with energy rays such as infrared rays, ultraviolet rays, and laser light, or it may be dried only. Moreover, you may combine these two or more kinds of processing methods.

Next, as shown in FIG. 10C, the conductive material 410 in the recess 401 is filled with the black material 411, which is a precursor of the first reinforcing layer 752. As the black material 411 filled in the recess 401, the above-mentioned black paste is used. As the filling method of the black material 411, the same method as the filling method of the conductive material 410 described above can be used.

Next, as shown in FIG. 10D, the black material 411 in the recess 401 is cured. At this time, the conductive material 410 may be cured at the same time. By this hardening treatment, the black material 411 is volume-shrinked to form the first reinforcing layer 752 and the fourth contact surface 752b of the first reinforcing layer 752.

Next, as shown in FIG. 10E, the resin material 420 for forming the first resin layer 6 is applied onto the intaglio 400. As such a resin material 420, the same material as the material constituting the first resin layer 6 described above is used. Examples of the coating method of the resin material 420 include a screen printing method, a spray coating method, a bar coating method, a dip method, and an inkjet method. By this coating, the resin material 420 enters the recess 401 in which the first conductor portion 7 (the first electrode pattern 71, the first lead-out wiring 76, and the first terminal 77) is formed.

Next, as shown in FIG. 10 (f), the base material 430 is placed on the resin material 420. This arrangement is preferably performed under vacuum in order to prevent air bubbles from entering between the resin material 420 and the base material 430. Then, the resin material 420 is cured to form the first resin layer 6. Examples of the method for curing the resin material 420 include energy ray irradiation such as ultraviolet rays and infrared laser light, heating, heating and cooling, and drying.

In the present embodiment, the resin material 420 is applied to the intaglio 400 and then the base material 430 is laminated, but the present invention is not particularly limited to this. For example, the resin material 420 may be applied to the base material 430 in advance, and the base material 430 may be placed on the intaglio plate 400.

Next, as shown in FIG. 10 (g), the base material 430, the first resin layer 6, and the first conductor portion 7 are released from the intaglio 400. Thereby, the first intermediate 440 can be obtained.

Next, as shown in FIG. 11A, the resin material 450 forming the second resin layer 8 is applied onto the first intermediate body 440. As the resin material 450, the same material as the resin material 420 described above is used. As a method of applying the resin material 450, the same method as that of the resin material 420 described above can be exemplified.

In the present embodiment, in the step of applying the resin material 450, a portion corresponding to the notch 83 is formed. Specifically, the resin material 450 is applied by patterning so that the notch 83 is formed. Not particularly limited to the above, the notch 83 may be formed by forming a uniform resin layer in which a portion corresponding to the notch 83 is not formed and then partially scraping off the resin layer. ..

Next, as shown in FIG. 11B, an intaglio 460 in which the recess 461 is formed is prepared. The recess 461 has a shape corresponding to the shape of the second conductor portion 9. As the material constituting the intaglio 460, the same material as the material constituting the intaglio 400 described above can be used.

Next, the recess 461 of the intaglio 460 is filled with the conductive material 470, which is a precursor of the second conductor layer 951. As the conductive material 470, the same material as the above-mentioned conductive material 410 can be used. Further, as a method of filling the concave portion 461 of the conductive material 470, the same method as the method of filling the concave portion 401 of the intaglio 400 can be used.

The conductive material 470 is then dried or heated, as shown in FIG. 11 (c). The drying or heating conditions of the conductive material 470 can be appropriately set according to the composition of the conductive material 470 and the like. Due to this drying or heating condition, the conductive material 470 is volume-shrinked to form a second conductor layer 951.

Next, as shown in FIG. 11D, the conductive material 470 in the recess 461 is filled with the black material 471 which is the precursor of the second reinforcing layer 952. As the black material 471 filled in the recess 461, the above-mentioned black paste is used. As the filling method of the black material 471, the same method as the filling method of the conductive material 410 described above can be used.

Next, as shown in FIG. 11E, the black material 471 in the recess 461 is cured. At this time, the conductive material 470 may be cured at the same time. By this hardening treatment, the black material 471 is volume-shrinked to form a second reinforcing layer 952.

Next, as shown in FIG. 11 (f), the first intermediate 440 is arranged on the intaglio 460 so that the resin material 450 enters the recess 461 of the intaglio 460, and the first intermediate 440 is placed on the intaglio 460. Press on. Then, the resin material 450 is cured to form the second resin layer 8.

Next, as shown in FIG. 11 (g), the second resin layer 8, the second conductor portion 9, and the first intermediate body 440 are integrally released from the intaglio 460. Hereinafter, the one in which the second resin layer 8, the second conductor portion 9, and the first intermediate body 440 are integrated is also referred to as a second intermediate body 480.

Then, as shown in FIG. 11 (h), in the second intermediate body 480, the ACF 490 is placed on the three first terminals 77, and on each of the two assembled second terminals 97. ACF490 is placed. The ACF490 is made of the same material as the material constituting the connecting body 15 described above.

Then, the second wiring body 11a is arranged via the ACF490 so as to correspond to the plurality of assembled first terminals 77, and the ACF490 is arranged so as to correspond to the plurality of assembled second terminals 97. The second wiring bodies 11b and 11c are arranged therethrough. In the present embodiment, the ACF 490 is divided and arranged corresponding to the first and second terminals 77 and 97, but the present invention is not particularly limited to this, and the first and second terminals 77 and 97 are above. ACF formed uniformly may be arranged.

Next, as shown in FIG. 11 (i), with the ACF 490 interposed between the second intermediate 480 and the second wiring body 11, the second wiring body is heated while applying heat to the ACF 490. 11 is pressed toward the second intermediate body 480 to perform thermocompression bonding. The second intermediate body 480 and the second wiring body 11a are thermocompression-bonded, the second intermediate body 480 and the second wiring body 11b are thermocompression-bonded, and the second intermediate body 480 is thermocompression-bonded. The thermocompression bonding of the second wiring body 11c and the second wiring body 11c is performed independently of each other.

The temperature conditions and pressure conditions at the time of thermocompression bonding described above are appropriately set according to the composition of the second intermediate body 480 and the second wiring body 11. After thermocompression bonding, the ACF490 is cured to form the connector 15. The connection body 15 joins the second intermediate body 480 and the second wiring body 11, and also between the first terminal 77 and the third terminal 13a, and between the second terminal 97 and the third terminal 13b ( 13c) is electrically connected.

Next, as shown in FIG. 11 (j), the resin material 500 is applied onto the second conductor portion 9. As such a resin material 500, a material constituting the above-mentioned third resin layer 10 is used. Examples of the method for applying the resin material 500 include a screen printing method, a spray coating method, a bar coating method, a dip method, an inkjet method, and a casting method.

When the resin material 500 is applied, the tip of the second wiring body 11 is embedded in the resin material 500. Further, the applied resin material 500 flows into the notch 83. Then, the resin material 500 is cured to form the third resin layer 10. Examples of the method for curing the resin material 500 include energy ray irradiation such as ultraviolet rays and infrared laser light, heating, heating and cooling, and drying.

Next, as shown in FIG. 12A, the transparent adhesive layer 16 is formed on the cover panel 3 prepared in advance. At this time, the transparent adhesive layer 16 may be formed by applying and curing a fluid adhesive material on the cover panel 3, or a sheet-like adhesive material may be attached onto the cover panel 3 to be transparent. The adhesive layer 16 may be formed. When a fluid adhesive material is used as the transparent adhesive layer 16, it can be applied by a screen printing method, a spray coating method, a bar coating method, a dip method, an inkjet method, a casting method or the like. When it is necessary to cure the transparent adhesive layer 16, energy ray irradiation such as ultraviolet rays and infrared laser light, heating, heating and cooling, drying and the like may be performed.

Next, as shown in FIG. 12B, one exposed surface of the first wiring body 5 is pressed against the cover panel 3 with the transparent adhesive layer 16 interposed therebetween to bond them. Next, as shown in FIG. 12 (c), the base material 430 provided on the other surface of the first wiring body 5 is peeled off. As a result, the touch sensor 1 can be obtained.

The touch sensor 1 in this embodiment has the following effects.

FIG. 13 is a cross-sectional view showing the operation of the wiring body assembly according to the present embodiment, and is an enlarged cross-sectional view of the XIII portion of FIG.

In the present embodiment, as shown in FIG. 13, when the second wiring body 11 is pressed against the first wiring body 5, the force transmitted through the third terminal 13a is transmitted through the first and third terminals 13a. It acts to deform (elastically deform) the conductive particles 152 sandwiched between the terminals 77 and 13a of the above. As a result, the contact area between the first terminal 77 and the conductive particles 152 increases, and the contact area between the third terminal 13 and the conductive particles 152 increases. Further, the repulsive force that the deformed conductive particles 152 try to restore to the original shape acts on the first and third terminals 77 and 13a (the conductive particles 152 in the no-load state are indicated by the alternate long and short dash line). As a result, a strong connection state can be maintained, and the connection reliability between the first wiring body 5 and the second wiring body 11 can be improved.

However, in the above-mentioned conventional connection structure without the reinforcing layer, since the Young's modulus of the first resin layer supporting the first terminal is low, the first terminal is deformed before the conductive particles are deformed. Therefore, the effect of improving the connection reliability due to the deformation of the conductive particles may not be sufficiently exhibited. In particular, when the first terminal has a mesh shape, the first terminal is more easily deformed.

On the other hand, in the present embodiment, the first linear body 75 constituting the first terminal 77 has a Young's modulus higher than the Young's modulus of the first conductor layer 751 and the Young's modulus of the first resin layer 6. The first reinforcing layer 752 is provided. Since the strength of the terminal conductor wire 78 constituting the first terminal 77 is increased by the first reinforcing layer 752, when the second wiring body 11 is pressed against the first wiring body 5 and crimped, the second wiring body 11 is pressed and crimped. It is possible to prevent the entire first terminal 77 from being deformed before the conductive particles 152 are deformed.

As a result, the conductive particles 152 sandwiched between the first and third terminals 77 and 13a are easily deformed, so that the connection reliability between the first wiring body 5 and the second wiring body 11 is further improved. Is planned.

Although the connection structure of the first terminal 77 and the third terminal 13a has been described above, the same effect can be obtained with the connection structure of the second terminal 97 and the third terminal 13b (13c). That is, the second reinforcing layer 95 in which the second linear body 95 constituting the second terminal 97 has a Young's modulus higher than the Young's modulus of the second conductor layer 951 and the Young's modulus of the second resin layer 8. It has 952. As a result, the strength of the terminal conductor wire 98 constituting the second terminal 97 is increased, so that the conductive particles 152 are deformed when the second wiring body 11 is pressed against the first wiring body 5 and crimped. It is possible to prevent the second terminal 97 from being deformed before the operation.

In this case, the second resin layer 8 in the present embodiment corresponds to an example of the "support layer" in the present invention, and the second terminal 97 in the present embodiment is an example of the "first terminal" in the present invention. The second conductor layer 951 in the present embodiment corresponds to an example of the "conductor layer" in the present invention, and the second reinforcing layer 952 in the present embodiment corresponds to an example of the "reinforcing layer" in the present invention. However, the third terminals 13b and 13c in the present embodiment correspond to an example of the "second terminal" in the present invention.

As a result, the conductive particles 152 sandwiched between the second and third terminals 97 and 13b are easily deformed, so that the connection reliability between the first wiring body 5 and the second wiring body 11 is further improved. Is planned. Note that FIG. 13 shows the first terminal 77 and the third terminal 13a, and the second terminal 97 and the third terminal 13b (13c) are not shown by adding corresponding reference numerals in parentheses. ..

It should be noted that the embodiments described above are described for facilitating the understanding of the present invention, and are not described for limiting the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.

For example, for the first conductor portion 7 in the present embodiment, in addition to the first terminal 77, the first electrode pattern 71 and the first lead-out wiring 76 also include the first reinforcing layer 752. Not limited to. In the first conductor portion 7, the first electrode pattern 71 and the first lead-out wiring 76 do not include the first reinforcing layer 752, and only the first terminal 77 includes the first reinforcing layer 752. You may.

Further, regarding the second conductor portion 9 in the present embodiment, in addition to the second terminal 97, the second electrode pattern 91 and the second lead-out wiring 96 also include the second reinforcing layer 952. Not limited to. In the second conductor portion 9, the second electrode pattern 91 and the second lead-out wiring 96 do not have the second reinforcing layer 952, and only the second terminal 97 has the second reinforcing layer 952. You may.

1 ... Touch sensor 3 ... Cover panel 31 ... Transparent part 32 ... Shielding part 4 ... Wiring body assembly 5 ... First wiring body 6 ... First resin layer 61 ... Flat part 62 ... Support part
621 ... Contact surface 7 ... First conductor portion 71 ... First electrode pattern
72 ... Electrode conductor wire 75 ... First linear body
751 ... First conductor layer
752 ... 1st reinforcing layer 76 ... 1st lead-out wiring
761 ... Drawer 77 ... First terminal
78, 78a, 78b ... Terminal conductor wire 79 ... Opening 8 ... Second resin layer 81 ... Main part 82 ... Support part 83 ... Notch 9 ... Second conductor part 91 ... Second electrode pattern 95 ... Second electrode pattern Striatum
951 ... Second conductor layer
952 ... Second reinforcing layer 96 ... Second lead wiring
961 ... Drawer 97 ... Second terminal
98 ... Terminal conductor wire 99 ... Opening 10 ... Third resin layer 11, 11a, 11b, 11c ... Second wiring body 12, 12a, 12b, 12c ... Base material 13, 13a, 13b, 13c ... Terminal 14, 14a , 14b, 14c ... Wiring 15 ... Connector 151 ... Resin material 152 ... Conductive particles 16 ... Transparent adhesive layer 400 ... Recessed plate 401 ... Recessed 410 ... Conductive material (first conductor portion)
411 ... Black material (first reinforcing layer)
420 ... Resin material (first resin layer)
430 ... Base material 440 ... First intermediate 450 ... Resin material (second resin layer)
460 ... Intaglio 461 ... Recess 470 ... Conductive material (second conductor part)
471 ... Black material (second reinforcing layer)
480 ... Second Intermediate 490 ... ACF
500 ... Resin material (third resin layer)

Claims (7)

A first wiring body having a support layer and a first terminal provided on the support layer, and
A second wiring body having a second terminal and
A connecting body containing conductive particles, interposed between the first terminal and the second terminal, and connecting the first wiring body and the second wiring body.
The first terminal is
With the conductor layer
Including a reinforcing layer laminated on the conductor layer,
A wiring assembly in which the Young's modulus of the reinforcing layer is higher than the Young's modulus of the support layer and higher than the Young's modulus of the conductor layer. The wiring assembly according to claim 1.
The reinforcing layer is a conductive wiring body assembly. The wiring assembly according to claim 1 or 2.
The reinforcing layer is provided between the support layer and the conductor layer.
One main surface of the reinforcing layer is in contact with the conductor layer.
The other main surface of the reinforcing layer is a wiring assembly that is in contact with the support layer. The wiring assembly according to any one of claims 1 to 3.
The reinforcing layer is a wiring assembly containing carbon. The wiring assembly according to any one of claims 1 to 4.
The conductor layer contains metal particles and contains
The reinforcing layer contains carbon and contains carbon.
A wiring assembly in which the particle size of the metal particles is larger than the particle size of the carbon. The wiring assembly according to any one of claims 1 to 5.
The reinforcing layer is a wiring assembly having a glass transition temperature higher than the glass transition temperature of the support layer. A touch sensor comprising the wiring body assembly according to any one of claims 1 to 6.

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