JP2020534699A - How to cool heatsink segments, heatsinks and components - Google Patents

Abstract

The present invention relates to a heat sink segment having a first segment surface and a second segment surface for cooling a component, particularly a power electronics component, when a plurality of heat sink segments are concentrically arranged, all of these heat sink segments. The first segment surface and the second segment surface are aligned with each other so that the segment surfaces of the above are in contact with each other.

Description

Background Techniques The present invention starts with the devices and methods described in the superordinate concepts of the independent claims.

German Patent Application Publication No. 102010017168 discloses a fan redundancy method for cooling a fan redundancy unit and a power electronics component.

Advantages of the Invention In view of this background, the approach described herein will be used to describe methods for cooling heat sink segments, heat sinks and components, especially power electronics components.

A heat sink segment with a first segment surface and a second segment surface for cooling components, especially power electronics components, has a first segment surface and a second segment surface aligned with each other. As a result, when a plurality of heat sink segments are arranged concentrically, all the segment surfaces of these heat sink segments are in contact with each other, which is excellent.

The heat sink segment may mean one of a plurality of segments forming one heat sink. In this case, one segment may mean a larger or higher body, i.e. a part or partial area of the heat sink. In this case, the first segment surface and the second segment surface of the heat sink segment are aligned with each other, so that another first segment surface and another second segment surface of another heat sink segment are aligned with each other. When both heat sink segments are arranged concentrically, they come into contact with the first segment surface and the second segment surface of the first heat sink segment. That is, all the planes on which each segment plane is located intersect along one common line of intersection. This line of intersection extends perpendicular to one common center point, and each heat sink segment is concentrically arranged around the center point.

The heat sink segment may specifically mean a cake segment.

A component may mean a component or subcomponent or individual component of a technical complex, in which case the component is active because it generates or heats up during its operation or during its use. Cooling or heat derivation is required. The power electronics component may mean a power electronics structure for high power, such as used in an inverter of an electric vehicle. In this case, a power semiconductor such as a bipolar transistor having an insulated gate electrode made of silicon carbide or gallium nitride is used. These power semiconductors may be mounted on a metal-coated ceramic substrate having an etched conductor structure, such as Al ₂ O ₃ , Se ₃ N ₄ or Al N containing CU or Al. An appropriate compound may then be poured into the substrate and the semiconductor. Further, the component may mean a power semiconductor or a logic circuit that controls a power component and an intermediate circuit capacitor.

The heat sink segment has the advantage that by arranging the plurality of heat sink segments concentrically, a symmetrical heat sink that can be easily incorporated into an electric machine can be obtained. Further, the configuration consisting of a plurality of heat sink segments is divisible, i.e., the number of heat sink segments forming the heat sink is variable without changing the outer shape or the geometric shape. That is, as the number of heatsink segments increases, so does the number of components that need to be cooled without changing the shape or geometry of the heatsink.

The means described in the dependent claims allow for the advantageous improvement and improvement of the apparatus described in the independent claims.

By forming the first segment surface and / or the second segment surface to accommodate the component to be cooled, the component can be effectively cooled. In particular, since the segment surface of one heat sink segment is in contact with the segment surface of the other heat sink segment, the component can derive heat and thus be cooled through all the segment surfaces in contact with this component.

In addition, the first segment surface and / or the second segment surface has a surface contour that matches the surface contour of the component, which is advantageous if the component is at least partially surrounded by the heat sink segment. is there. In this case, the surface contour may have at least one recess, in which at least one component may be accommodated at least partially. In this case, the recess may be shaped so that at least one component can be completely embedded therein. This allows the component to dissipate its exhaust heat to the heat sink segment not only through the top and bottom surfaces, but also at least partially through the sides, which can be cooled more effectively.

Further, it is convenient to have a cooling structure through which the cooling medium passes inside the heat sink segment. In this case, the cooling medium may mean a liquid or gas cooling medium. As a result, the exhaust heat of the component released to the heat sink segment can be derived more quickly, and more effective and efficient cooling of the component can be achieved.

Further, it is advantageous for the heat sink segment to have an outer surface formed as a flat surface for accommodating another component to be cooled, in which case the outer surfaces are the first segment surface and the first segment surface. The two segment surfaces are connected to each other. This attaches another component to be cooled to the heatsink segment so that it is closer to the component to be cooled, which is located on the segment surface of one or more heatsink segments. This, on the one hand, allows more components to be cooled per heatsink segment, and, on the other hand, reduces the length of the leads between each component on the segment and outer surfaces, thus reducing parasitic inductance. Will be done. Another component to be cooled may mean, for example, a temperature sensitive logical component.

Further, it is advantageous that the heat sink segment has at least one end face formed as a flat surface that is substantially perpendicular to the first segment surface and / or the second segment surface. If so, the end face is formed to accommodate another component to be cooled. In this case, at least one end face may form the upper surface of the heat sink segment, and optionally another end face may form the lower surface. This may advantageously place more components to be cooled on the heatsink segment.

Further, it is advantageous that the heat sink segments are manufactured by selective electron beam melting and / or binder jet by generative manufacturing techniques, especially by selective laser melting. Alternatively or additionally, the heat sink segment may be manufactured by extrusion, powder injection molding, turning and / or milling. The heat sink segment may be made in particular from a metal such as copper or aluminum. In one alternative embodiment, the heat sink segments, for example _{Al 2 O 3, Se e N4} , SiC and / or may be fabricated from a ceramic such as AlN, for example, powder injection molding, extrusion, slip casting It can be manufactured by mold and / or generative manufacturing method. This allows the surface contour of the heatsink segment to be very accurately adapted to the requirements of the components to be cooled placed on the heatsink segment. In addition, this may allow complex and / or arbitrary cooling structures to be realized within the heat sink segment. In this case, the outer and / or end faces can be cooled with different strengths, depending on the individual component's requirements for cooling capacity.

Each of the above advantages also applies to heat sinks with at least one first heat sink segment and at least one second heat sink segment based on the above configuration for cooling components, particularly power electronics components. The heat sink is excellent in that the first heat sink segment and the second heat sink segment are concentrically arranged so as to form a heat sink. Such a heat sink has rotational symmetry about at least one axis, in which case the axis of rotation coincides with the line of intersection where the planes of the individual segment planes intersect. This makes the heat sink particularly suitable for incorporation into electromechanical machines.

Further, it is convenient that the component to be cooled is arranged between the two segment surfaces of the two different heat sink segments. This is because the exhaust heat of the component to be cooled can be dissipated to the segment surface and thus to the heat sink on the two sides, thus achieving effective cooling of the component. Moreover, in this way, a large number of components can be placed within the heat sink. Increasing the number of heatsink segments also increases the number of segment faces, which increases the possibility of placing and cooling additional components within the heatsink without causing changes in the size and shape of the heatsink.

Further, it is advantageous that the heat sink is formed in the form of a hollow body, particularly a hollow cylinder. This is because it places at least one other component to be cooled in the recess of the hollow body. Further, the recess can be used to support or hold the heat sink, for example in an electromachine. For example, in the case of a hollow cylinder, which may mean a circular disk with a hole in the center, the individual heat sink segments are advantageously centered when placed concentrically.

The heat sink also has the advantage of being able to cool a large number of components per volume unit and thus having a very compact configuration format. Parasitic inductance is reduced by reducing the spacing between the individual electrical components, especially between the power electronics and logic components.

Furthermore, it is advantageous to have another component placed in the center of the hollow body. In this case, another component may be, for example, a sleeve to assist centering of the heat sink segment. Alternatively or additionally, another component may include, among other things, multiple power electronics components and intermediate circuit capacitors connected via substantially equal length leads. As a result, the heat sink is optimally used, and the configuration form of the power electronics circuit can be configured more compactly. In this case, the intermediate circuit capacitors may be contact-connected via the sleeve.

Further, it is advantageous that the heat sink forms a circular, particularly flat basal plane. This is because it provides a circular, rotationally symmetric heat sink that can be easily incorporated into an electromechanical machine. This is because, based on rotational symmetry, an equal or even weight distribution is achieved over the entire angular range of the heat sink, which is especially advantageous for component units that rotate about their axis of rotation. It turned out that there was.

Further, it is advantageous for the heat sink to form a square, particularly flat basal plane. One such alternative embodiment has the advantage that the sides of the square heat sink can act as additional cooling surfaces for the electrical components to be cooled.

Each of the above advantages also applies to methods of cooling components, especially power electronics components. In this case, the method comprises preparing a first heat sink, particularly based on one of the embodiments described above, as well as actively cooling the heat sink, in which case the heat sink segment of the heat sink. The cooling medium passes through the cooling structure provided inside the heat sink. This method is achievable for heat sinks with a compact configuration form, which, due to its partitionability, can effectively cool a large number of electrical or electronic components or components within a relatively small volume. It has the advantage of.

Examples of the present invention will be illustrated and described in more detail in the following description.

FIG. 5 is a plan view schematically showing a heat sink segment for cooling a component based on one embodiment. FIG. 5 is a plan view schematically showing two segment planes of two heat sink segments in direct contact with each other, based on one another embodiment. FIG. 5 is a plan view schematically showing two segment planes of two heat sink segments that are in direct contact with each other, based on one yet another embodiment. FIG. 5 is a plan view schematically showing a heat sink for cooling a component based on one embodiment. FIG. 5 is a plan view schematically showing a heat sink based on one another embodiment. It is a figure which shows schematic cooling of a heat sink based on the side sectional view of the heat sink based on three examples. FIG. 5 is a plan view schematically showing a heat sink based on one another embodiment. FIG. 5 is a plan view and a side view schematically showing a heat sink based on one another embodiment. It is a flowchart of the method of cooling a component based on one Example.

In the following description of the advantageous embodiments of the present invention, the same or similar reference numerals are used for elements shown in different drawings and having similar actions, in which case the repetition of the description of these elements is omitted. To do.

FIG. 1 shows a schematic plan view of the heat sink segment 10. The heat sink segment 10 has a cake segment-like basal plane. The heat sink segment 10 further has a first segment surface 11a and a second segment surface 11b. The planes on which the first segment surface 11a and the second segment surface 11b are located intersect along one common line of intersection 12 that forms concentric centers in the heat sink formed by the plurality of heat sink segments 10. ing. The heat sink segment 10 further has an upper surface 13 oriented substantially perpendicular to the first segment surface 11a and the second segment surface 11b. Further, the heat sink segment 10 also has a lower surface 14 (not shown due to drawing limitations) oriented substantially perpendicular to the first segment surface 11a and the second segment surface 11b. The heat sink segment 10 further has an outer surface 15 that connects the first segment surface 11a and the second segment surface 11b to each other and extends concentrically around the line of intersection 12. Optionally, the heat sink segment 10 similarly connects the first segment surface 11a and the second segment surface 11b to each other, extends concentrically around the line of intersection 12, and the outer surface 15 with respect to the line of intersection 12. It may have an inner surface 16 that extends closer and concentrically. The heat sink segment 10, for example, a metal or, for example, _Al 2 _O 3 of aluminum or _copper, Se e N4, SiC and / or ceramics may be produced from such AlN. Further, the heat sink segment 10 has a cooling structure 20 that meanders in a tubular shape inside the heat sink segment 10 as a conduit system. A cooling medium for actively cooling the heat sink segment 10 can be pumped or guided through the cooling structure 20.

The first segment surface 11a and / or the second segment surface 11b are provided for mounting components, especially power electronics components, and deriving their exhaust heat via the cooling structure 20. The heat sink segment 10 is illustrated as a body with a quadrant basal plane in this embodiment. In this case, the first segment surface 11a and the second segment surface 11b form an angle of substantially 90 °. In another alternative embodiment, a smaller angle can be formed or a larger angle can be formed between the first segment surface 11a and the second segment surface 11b. ..

FIG. 2 shows a schematic plan view of two adjacent heat sink segments 10, 10b. A component group 30 to be cooled is arranged on the first segment surface 11a of the first heat sink segment 10. The component group 30 includes a plurality of power semiconductors 31 that are strongly heated during operation and thus require a large cooling force. Further, the component group 30 includes a plurality of logical components 32 arranged in the immediate vicinity of the power semiconductor 31. The component group 30 is attached to the ceramic substrate 35, in which case the ceramic substrate 35 is coated on both sides with the metal 36. The individual power semiconductors 31 and the individual logical components 32 are connected to each other via an electrical lead wire 33. The second heat sink segment 10b adjacent to the first heat sink segment 10 also has a segment surface 11c arranged so as to face the first segment surface 11a. The segment surface 11c itself has a plurality of recesses 38, which accommodate the power semiconductor 31 at least partially or completely when the first segment surface 11a is joined to another segment surface 11c. be able to. The recess 38 in the figure mimics the surface contour of the component group 30 so that the first heat sink segment 10 and another heat sink segment 10b can be arranged or joined as close to each other as possible. As a result, the exhaust heat generated during the operation of the power semiconductor 31 is efficiently released to both the first heat sink segment 10 and another heat sink segment 10b, so that the first heat sink segment 10 and the other heat sink segment 10b are efficiently released. Another heat sink segment 10b itself derives exhaust heat via the cooling structure 20.

FIG. 3 schematically shows two segment surfaces 11a, 11c of two heat sink segments 10, 10b that should be placed adjacent to each other in one other embodiment. The heat sink segment 10 has a ceramic substrate 35 having a metal coating 36 on both sides on the first segment surface 11a, and in this case, a plurality of power semiconductors 31 are arranged on the ceramic substrate 35.

By effectively cooling the component group 30, particularly the power semiconductor 31, the logic component 32 can be positioned closer to the power semiconductor 31. This also shortens the length of the electrical lead wire 33, which also has a positive effect on the parasitic inductance.

Another heat sink segment 10b arranged to face the first heat sink segment 10 also has a ceramic substrate 35 having a metal coating 36 on both sides thereof on the segment surface 11c. A plurality of logic components 32 are arranged on the ceramic substrate 35, and in this case, recesses 39 are provided between the individual logic components 32. The recess 39 is provided to accommodate the power semiconductor 31 located on the ceramic substrate 35 of the first segment surface 11a when the first heat sink segment 10 and another heat sink segment 10b are joined to each other. .. In this case, the power semiconductor 31 and the logic component 32 may be optionally positioned on the ceramic substrate 35, respectively. In one alternative or additional embodiment, it may be assumed that the ceramic substrate 35 is provided exclusively for the logical components. As a result, for example, a multilayer logic substrate such as an LTCC having a small current capacity but a high dispersion capacity can be used. As a result, after joining the first segment surface 11a and another segment surface 11c, the logic component 32 is thermally better separated from the power semiconductor 31.

FIG. 4 shows a schematic plan view of the heat sink 100 based on one embodiment. The heat sink 100 has four heat sink segments 10, 10b, 10c, and 10d, all of which have a cake segment-like base shape. Symmetrical heat sinks 100 are formed by arranging the heat sink segments 10, 10b, 10c, 10d concentrically about a common center point 12a located on the line of intersection 12. In this case, the heat sink 100 has a cake-like or hollow cylindrical base shape. A component group 30 cooled by the heat sink 100 is arranged between the two segment surfaces 11a, 11c, 11b, and 11d, which are adjacent to each other. The heat sink 100 has a circular notch 110 inside.

After the heat sink segments 10, 10b, 10c, and 10d are joined to form the heat sink 100, a gap 40 is left between the segment surfaces 11a, 11c, 11b, and 11d, and a compound is poured into the gap 40. Can be done. As a result, the gap 40 is filled on the one hand and the heat sink segments 10, 10b, 10c and 10d are joined to each other on the other hand.

FIG. 5 shows a schematic view of the heat sink 100b based on another embodiment. In this case, the heat sink 100b is different from the heat sink 100 only in that the sleeve 115 is arranged in the circular notch 110. The sleeve 115 may have metal and may be used for the contact connection of the component group 30. The sleeve 115 is further used to more precisely align the individual heat sink segments 10, 10b, 10c, 10d with each other or around the center point 12a. Alternatively or additionally, an intermediate circuit capacitor may be arranged in the circular notch 110, which is an electrical connection means equidistant and thus equidistant to each component group 30. have. This significantly reduces the parasitic inductance. The intermediate circuit capacitors may be electrically contact connected via the sleeve 115.

If only the intermediate circuit capacitors are located within the circular notch 110, the intermediate circuit capacitors additionally serve as alignment or centering aids for the individual heat sink segments 10, 10b, 10c, 10d.

FIG. 6 schematically shows the cooling of the heat sink segments 10, 10b, 10c, 10d based on the three embodiments (see brief description of the drawings). In each of the three embodiments, a side surface of the heat sink segment 10 or a half portion of the heat sink 100 cross-sectioned along the gap 40 can be seen. A ceramic substrate 35 having a metal coating 36 can be seen on each segment surface 11. Two power semiconductors 31 are arranged on each metal-coated ceramic substrate 35. Further, a sleeve 115 adjacent to the inner surface 16 and a center point 12a (shown by a broken line) are shown. In the upper embodiment, the inflow of cooling water on the lower surface 14 is suggested by the arrow 150a, and the outflow of cooling water on the upper surface 13 is suggested by another arrow 152a. In the middle example, the inflow of the cooling medium from the bottom surface 14 is suggested by the arrow 150b, and the outflow of the cooling medium from the bottom surface 14 is also suggested by another arrow 152b. In the lower embodiment, the inflow of the cooling medium at two locations on the lower surface 14 is suggested by the arrows 150c, and the outflow of the cooling medium from the lower surface 14 is suggested by the two other arrows 152c. The cooling medium can be arbitrarily guided or guided regardless of the three embodiments by accurately manufacturing or arranging the cooling structure 20 in the heat sink segment 10.

In one alternative embodiment, it may be assumed that the inflow and / or outflow for the cooling medium is attached to the bottom 14 and / or top 13 by, for example, brazing or welding. ..

In one alternative embodiment, the cooling structure 20 is configured to be formed from a plurality of linear holes parallel to the first segment plane and / or the second segment plane. You may be. In this case, the upper surface 13 and / or the lower surface 14 may be closed by, for example, a thin steel plate, and the connecting portion to the inflow portion and the outflow portion of the cooling medium may be provided on the upper surface 13 and / or the lower surface 14.

FIG. 7 shows a schematic diagram of the heat sink 100c based on one another embodiment. The heat sink 100c differs from the heat sink 100b of the embodiment shown in FIG. 5 in that the outer surface 15a does not extend concentrically with respect to the center point 12a but forms a flat surface. There is. As a result, when the heat sink segments 10, 10b, 10c, and 10d are arranged concentrically around the center point 12a of the heat sink 100c, the heat sink 100c having a square basal plane is formed. Based on the flat outer surface 15a, another component to be cooled, in particular such as a printed circuit board 34, can be placed on the heat sink segments 10, 10b, 10c, 10d and thus cooled via the heat sink 100c.

FIG. 8 shows a schematic plan view and a schematic side sectional view of the heat sink 100d based on another embodiment. The heat sink 100d has a configuration similar to that of the heat sink 100b of the embodiment shown in FIG. The heat sink 100d has heat sink segments 10, 10b, 10c, 10d arranged concentrically about the center point 12a, and the heat sink segments 10, 10b, 10c, 10d are arranged between the respective segment surfaces 11. It has a component group 30. Further, at least one heat sink segment 10 has another component group 30 and / or a printed circuit board 34 on the upper surface 13, and the other component group 30 and / or the printed circuit board 34 is arranged so as to be cooled there. ing. Further within the heat sink segment, the cooling structure 20 is suggested in the form of a plurality of conduit portions 21. The conduit portion 21 substantially extends from the lower surface 14 of the heat sink segments 10, 10b, 10c, 10d toward the upper surface 13, in which case the conduit portion 21 does not penetrate the lower surface 14 and the upper surface 13. .. The conduit portion 21 has a lateral connection portion 22 near the upper surface 13 and the lower surface 14, and the lateral connection portion 22 is one on the lower surface 14, for example, in order to guide the cooling medium through the cooling structure 20. The conduit portions 21 are connected to each other so that only the inflow opening 23 and one outflow opening 24 are sufficient.

On the left side of this embodiment is a cross section 17 of the heat sink segment 10d suggested by letter A in the heat sink segment 10d. Further, a corresponding cross-sectional view is shown on the right side of this embodiment. In this case, the cross section 17 of the heat sink segment 10d perpendicular to the upper surface 13 and the lower surface 14 is visible. Inside the heat sink segment 10d, a cooling structure 20 is shown in the form of a lateral connection 22 between the conduit section 21 and the conduit section 21. The cooling structure 20 has an inflow opening 23 (indicated by arrow 150) in which the cooling medium is supplied to the heat sink segment 10d. Further, the heat sink segment 10d has an outflow opening 24 on its lower surface 14 from which the cooling medium is derived from the heat sink segment 10d (indicated by another arrow 152). In this case, generative manufacturing techniques are particularly suitable for achieving any extension of the nearly arbitrary cooling structure 20 or conduit portion 21 and the lateral connecting portion 22 located between them.

FIG. 9 shows a flowchart of a method 200 for cooling a component, particularly a power electronics component. In this case, in step 201 of the first method, a heat sink 100 based on one of the above-described embodiments is prepared. In the second method step 202, the heat sink 100 is actively cooled by passing a cooling medium through the cooling structure 20 inside the heat sink segments 10, 10b, 10c, 10d of the heat sink 100.

The flow direction 23 of the cooling medium is indicated by an arrow at the conduit portion 21.

Claims (13)

First segment surface (11,11a, 11b, 11c, 11d) and second segment surface (11,11a, 11b, 11c, 11d) for cooling components (30,34), especially power electronics components. In the heat sink segment (10, 10b, 10c, 10d) provided with
When a plurality of the heat sink segments (10, 10b, 10c, 10d) are arranged concentrically, all the segment surfaces (11, 11a, 11b, 11c, 11d) of the heat sink segments (10, 10b, 10c, 10d) are concentrically arranged. The first segment surface (11, 11a, 11b, 11c, 11d) and the second segment surface (11, 11a, 11b, 11c, 11d) are aligned with each other so as to be in contact with each other. Heat sink segments (10, 10b, 10c, 10d). The first segment surface (11,11a, 11b, 11c, 11d) and / or the second segment surface (11,11a, 11b, 11c, 11d) contains components (30,34) to be cooled. The heat sink segment (10, 10b, 10c, 10d) of claim 1, which is formed to accommodate. The first segment surface (11, 11a, 11b, 11c, 11d) and / or the second segment surface (11, 11a, 11b, 11c, 11d) is at least partially composed of the component (30, 34). The heat sink segment (10, 10b, 10d) according to claim 2, which has a surface contour (38) that matches the surface contour of the component so as to be surrounded by the heat sink segments (10, 10b, 10c, 10d). 10c, 10d). The invention according to any one of claims 1 to 3, wherein the inside of the heat sink segment (10, 10b, 10c, 10d) has a cooling structure (20, 21, 22) through which a cooling medium passes. Heat sink segments (10, 10b, 10c, 10d). The heat sink segment (10, 10b, 10c, 10d) has an outer surface (15) formed as a flat surface for accommodating another component (30, 34) to be cooled. A claim that the outer surface (15) connects the first segment surface (11, 11a, 11b, 11c, 11d) and the second segment surface (11, 11a, 11b, 11c, 11d) to each other. The heat sink segment (10, 10b, 10c, 10d) according to any one of items 1 to 4. The heat sink segments (10, 10b, 10c, 10d) are the first segment surfaces (11, 11a, 11b, 11c, 11d) and / or the second segment surfaces (11, 11a, 11b, 11c, 11d). ) Has at least one end face (13, 14) formed as a flat surface that is substantially perpendicular to), the end face (13, 14) being another component (30, 14) to be cooled. , 34) The heat sink segment (10, 10b, 10c, 10d) according to any one of claims 1 to 5, which is formed to accommodate the heat sink segment (10, 10b, 10c, 10d). Any of claims 1 to 6, wherein the heat sink segments (10, 10b, 10c, 10d) are manufactured by generative manufacturing techniques, particularly by selective laser melting, and / or by selective electron beam melting and / or binder jet. The heat sink segment (10, 10b, 10c, 10d) according to item 1. At least one first heat sink segment (10, 10b, 10c, 10d) according to any one of claims 1 to 7 and at least one for cooling the components (30, 34), particularly the power electronics component. In a heat sink (100, 100b, 100c, 100d) with two second heat sink segments (10, 10b, 10c, 10d).
The first heat sink segment (10, 10b, 10c, 10d) and the second heat sink segment (10, 10b, 10c, 10d) are concentric so as to form the heat sink (100, 100b, 100c, 100d). Heat sinks (100, 100b, 100c, 100d), characterized in that they are arranged in. The components (30, 34) to be cooled are arranged between the two segment planes (11, 11a, 11b, 11c, 11d) of the two different heat sink segments (10, 10b, 10c, 10d). The heat sink according to claim 8 (100, 100b, 100c, 100d). The heat sink (100, 100b, 100c, 100d) according to claim 8 or 9, wherein the heat sink (100, 100b, 100c, 100d) is formed in the form of a hollow body, particularly a hollow cylinder. The heat sink (100, 100b, 100c, 100d) according to claim 10, wherein another component, particularly a sleeve (115) and / or an intermediate circuit capacitor, is arranged in the center of the hollow body. The heat sink (100, 100b, 100c, 100d) according to any one of claims 8 to 11, wherein the heat sink (100, 100b, 100c, 100d) forms a circular or square basal plane. A method of cooling components (30, 34), especially power electronics components.
In particular, the step (201) of preparing the heat sink (100, 100b, 100c, 100d) according to any one of claims 8 to 12 and the step (201).
In the step (202) of actively cooling the heat sink (100, 100b, 100c, 100d), the inside of the heat sink segment (10, 10b, 10c, 10d) of the heat sink (100, 100b, 100c, 100d). In step (202), the cooling medium is passed through the cooling structure (20,21,22) of the above.
The method of having.

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