CN111095539A - Cooling body segment for a cooling component, cooling body and method - Google Patents
Cooling body segment for a cooling component, cooling body and method Download PDFInfo
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- CN111095539A CN111095539A CN201880060958.6A CN201880060958A CN111095539A CN 111095539 A CN111095539 A CN 111095539A CN 201880060958 A CN201880060958 A CN 201880060958A CN 111095539 A CN111095539 A CN 111095539A
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- 238000001816 cooling Methods 0.000 title claims abstract description 132
- 238000000034 method Methods 0.000 title claims description 14
- 239000002826 coolant Substances 0.000 claims description 19
- 239000003990 capacitor Substances 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 238000002844 melting Methods 0.000 claims description 4
- 230000008018 melting Effects 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 238000010894 electron beam technology Methods 0.000 claims description 2
- 238000002347 injection Methods 0.000 claims description 2
- 239000007924 injection Substances 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 description 16
- 239000000758 substrate Substances 0.000 description 15
- 239000000919 ceramic Substances 0.000 description 14
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 239000002918 waste heat Substances 0.000 description 6
- 230000003071 parasitic effect Effects 0.000 description 4
- 229910010271 silicon carbide Inorganic materials 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 229910052593 corundum Inorganic materials 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 3
- 229910001845 yogo sapphire Inorganic materials 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000000498 cooling water Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 229910002601 GaN Inorganic materials 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000007569 slipcasting Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20254—Cold plates transferring heat from heat source to coolant
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20927—Liquid coolant without phase change
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to a heat sink segment for a cooling component, in particular a power electronics component, having a first segment surface and a second segment surface, wherein the first segment surface and the second segment surface are oriented relative to each other such that, when a plurality of heat sink segments are arranged concentrically, all the segment surfaces of the heat sink segment adjoin each other.
Description
Technical Field
The invention is based on an apparatus and a method of the type described in the independent claims.
Background
DE 102010017168 a1 discloses a redundant fan device and a redundant fan method for cooling power electronic components.
Disclosure of Invention
Against this background, a cooling body segment, a cooling body and a method for cooling a component, in particular a power electronics component, are proposed with the solution proposed here.
A heat sink segment for a cooling component, in particular a power electronics component, having a first segment surface and a second segment surface, characterized in that the first segment surface and the second segment surface are oriented relative to each other such that, when a plurality of heat sink segments are arranged concentrically, all the segment surfaces of the heat sink segment adjoin each other.
The cooling body segment may refer to one segment among a plurality of segments forming one cooling body. A section can be understood here as a larger or higher-order body, i.e. a section or a subsection of the cooling body. The first and second partial surfaces of the cooling body segment are oriented relative to one another such that the further first and second partial surfaces of the further cooling body segment adjoin the first and second partial surfaces of the first cooling body segment with the two cooling body segments arranged concentrically. This means that the planes in which the segment faces lie all intersect along a common line of intersection. This straight line of intersection extends perpendicularly to a common center point, around which the cooling body segments are arranged concentrically.
The cooling body section can be referred to as a cake section.
A component may refer to a technical totality of components or sub-components or parts, wherein the component generates or heats up during its operation or during its use, thus requiring active cooling or heat dissipation of the component. A power electronic component may refer to a power electronic structure for high power, for example, used in an inverter of an electric vehicle. Here, a power semiconductor such as an insulated gate polar (iPolar) transistor made of silicon carbide or gallium nitride is used. The power semiconductor can be applied to a ceramic substrate laminated with metal, such as Al containing CU or Al2O3、Se3N4SiC and/or AlN, the substrate of the ceramic having an etched conductor structure. This substrate can then be cast together with the semiconductor in a suitable casting compound. Furthermore, components are also logic circuits for controlling the power semiconductors or power modules, and intermediate circuit capacitors.
The advantage of the cooling body segment is that a symmetrical cooling body is obtained by the concentric arrangement of a plurality of cooling body segments, which can be integrated into the electric machine in a simple manner. Furthermore, the structure formed by a plurality of cooling body segments can be segmented, i.e. the number of cooling body segments forming the cooling body can be varied without changing the external shape or geometry. This means that, with an increased number of cooling body segments, the number of components to be cooled can also be increased without changing the outer shape or geometry of the cooling body.
Advantageous refinements and improvements of the device specified in the independent claims are achieved by the measures cited in the dependent claims.
By configuring the first and/or the second section surface for accommodating the component to be cooled, the component can be cooled effectively. In particular, since the section surfaces of the heat sink sections adjoin the section surfaces of the further heat sink sections, the component can be cooled by heat removal via each section surface adjoining the component.
It is also advantageous if the first partial surface and/or the second partial surface has a surface contour which corresponds to the contour of the component surface in such a way that the component is at least partially surrounded by the heat sink segments. The surface contour may have at least one recess in which at least one of the components can be at least partially accommodated. The recess can also be a shape which allows at least one component to be completely embedded therein. The component can therefore have its waste heat removed from the heat sink section not only via the top and bottom sides but also at least partially via the side faces and thus also be cooled effectively.
It is also suitable for the interior of the cooling body section to have a cooling structure through which a coolant flows. The coolant can be a liquid or gaseous cooling medium. The waste heat of the component which is discharged to the cooling body section can thus be discharged more quickly and a more efficient and effective cooling of the component is thereby achieved.
It is also advantageous if the heat sink segment has an outer surface, designed as a planar surface, for receiving a further component to be cooled, wherein the outer surface connects the first segment surface and the second segment surface to one another. In this way, additional components to be cooled can be applied to the heat sink segment, so that the additional components to be cooled are closer to the components to be cooled which are arranged on the segment surfaces of the heat sink segment or segments. This makes it possible, on the one hand, to cool several components per cooling body section and, on the other hand, to reduce the line length between the components on the section side and on the outer side, thus reducing the parasitic inductance. (long sentence). The further component to be cooled can be, for example, a temperature-sensitive logic component.
It is also advantageous if the heat sink segment has at least one end face, which is designed as a planar face and is substantially perpendicular to the first segment face and/or the second segment face, wherein the end face is designed to receive a further component to be cooled. In this case, at least one end face can form the upper side of the heat sink portion and optionally further end faces can form the lower side of the heat sink portion. In this way, even more components to be cooled can be advantageously arranged on the heat sink portion.
It is also suitable for the cooling body section to be produced by a production method, in particular by selective laser melting, by selective electron beam melting and/or adhesive injection. The cooling body segments can alternatively or additionally also be produced by extrusion, powder injection molding, turning and/or milling. The cooling body section can be made in particular of a metal such as copper or aluminum. In an alternative embodiment, the cooling body section can be made of, for example, Al2O3、SeeCeramics such as N4, SiC and/or AlN and manufactured, for example, by powder injection molding, extrusion, slip casting and/or the resulting manufacturing process. This makes it possible to adapt the surface contour of the heat sink section very precisely to the requirements of the component to be cooled, which is arranged on the heat sink section. Furthermore, a complex and/or arbitrary cooling structure inside the cooling body section can be realized thereby. Depending on the requirements for the cooling capacity of the individual components, the segment faces, outer faces and/or end faces can be cooled to different degrees.
The aforementioned advantages apply correspondingly also to a heat sink for cooling components, in particular power electronics components, having at least one first heat sink portion and one second heat sink portion according to any of the embodiments described above. The heat sink is characterized in that the first heat sink portion and the second heat sink portion are arranged concentrically in such a way that the heat sink is formed. Such a cooling body has a rotational symmetry about at least one axis, wherein the axis of rotation coincides with an intersecting straight line along which the planes of the individual segment surfaces intersect. The heat sink is therefore particularly suitable for integration into an electric machine.
It is also suitable for the component to be cooled to be arranged between two segment surfaces of two different cooling body segments. The waste heat of the component to be cooled can thus be dissipated on both sides to the segment surfaces and thus to the cooling body, as a result of which a more effective cooling of the component is achieved. Furthermore, a plurality of components may be arranged in the cooling body in this way. By increasing the number of cooling body segments, the number of segment surfaces can also be increased and thus additional components can be arranged in the cooling body and cooled without causing changes in the size and shape of the cooling body.
It is also advantageous if the cooling body is designed in the form of a hollow body, in particular a hollow cylinder. At least one further component to be cooled is therefore arranged in the recess of the heat sink. Furthermore, the recess can be used to support or hold the cooling body in, for example, an electric machine. In the case of hollow columns (hollow columns mean, for example, circular disks with centering bores therein), the individual cooling body segments themselves are advantageously oriented in a concentric arrangement.
Inserting: the heat sink also has the advantage that it can cool a very large number of components per volume unit and therefore has a very compact design. By shortening the distance between the individual electrical components, in particular between the power electronics component and the logic assembly, the parasitic inductance can be reduced. And finishing the insertion.
It is also advantageous if a further component is arranged in the center of the hollow body. The further component can be, for example, a centering sleeve for supporting the cooling body segment. The further component may alternatively or additionally comprise an intermediate circuit capacitor, which is connected to the power electronics component, in particular via a substantially equally long line. The heat sink is thus used in an optimal manner and the design of the power electronics circuit can also be made more compact. The intermediate circuit capacitor can be contacted here by the sleeve. (consider the position of the sentence).
It is also advantageous if the heat sink has a round, in particular flat, base surface. Since a circular, rotationally symmetrical cooling body is thereby achieved, which can be integrated into the electric machine in a simple manner. Since a substantially identical or regular weight distribution over the entire angular range of the heat sink is achieved by means of the rotational symmetry, this has proven to be advantageous in particular in component arrangements which rotate about their axis of rotation.
It is also advantageous if the heat sink has a square, in particular flat, base surface. An advantage of this alternative embodiment is that the side faces of the square cooling body can serve as additional cooling surfaces for the electrical component to be cooled.
The previously described advantages apply correspondingly also to the method for cooling components, in particular power electronics components. The method comprises the steps of providing a first heat sink, in particular according to any of the preceding embodiments, and actively cooling the heat sink, wherein the cooling structure is traversed by a coolant in the interior of the heat sink portion of the heat sink. The advantage of this method is that a cooling body can be realized in a compact design and by means of which a large number of electrical or electronic components or components can be cooled effectively in a defined manner in a small volume.
Embodiments of the invention are illustrated in the drawings and are explained in detail in the following description.
Drawings
In the drawings:
FIG. 1 schematically illustrates a cooling body segment for a cooling component in a top view according to an embodiment;
fig. 2 shows schematically in a top view two segment surfaces of two heat sink segments directly adjoining one another according to a further exemplary embodiment;
fig. 3 shows schematically in a top view two segment surfaces of two heat sink segments directly adjoining one another according to a further exemplary embodiment;
FIG. 4 schematically illustrates a cooling body for cooling a component in a top view according to one embodiment;
fig. 5 schematically shows a cooling body according to a further exemplary embodiment in a top view;
fig. 6 shows schematically the cooling of a cooling body by means of a side view of a section of the cooling body according to three embodiments;
fig. 7 schematically shows a cooling body according to a further exemplary embodiment in a top view;
fig. 8 schematically shows a cooling body in a top view and in a side view according to a further embodiment; and
FIG. 9 illustrates a flow diagram of a method for cooling a component, according to one embodiment.
Detailed Description
In the following description of advantageous embodiments of the invention, the same or similar reference numerals are used for elements which are shown in different figures and which function similarly, wherein repeated descriptions of these elements are omitted.
Fig. 1 schematically shows a heat sink segment 10 in a top view. The cooling body section 10 has a cake-like, segmented base surface. The heat sink portion 10 also has a first portion surface 11a and a second portion surface 11 b. The planes in which the first section plane 11a and the second section plane 11b lie intersect along a common line of intersection 12 which forms a concentric center point in the cooling body formed by the plurality of cooling body sections 10. The heat sink portion 10 also has an upper side 13, which is oriented substantially perpendicularly to the first portion plane 11a and perpendicularly to the second portion plane 11 b. The heat sink portion 10 also has a lower side 14, which cannot be seen in the illustration, which is likewise formed substantially perpendicularly to the first and second portion surfaces 11a, 11 b. The heat sink segment 10 also has an outer face 15 which connects the first segment face 11a and the second segment face 11b to one another and extends concentrically around the intersecting straight line 12. The heat sink segment 10 can optionally have an inner face 16 which likewise connects the first segment face 11a and the second segment face 11b to one another and runs concentrically around the intersecting straight line 12 and concentrically along the intersecting straight line 12 closer than the outer face 15. The heat sink segment 10 can be made of a metal, such as aluminum or copper, or of a metal, such as Al2O3、SeeN4, SiC and/or AlN. The heat sink portion 10 also has a cooling structure 20, which meanders in the form of a tube in a path through the interior of the heat sink portion 10 as a pipe system. A coolant for actively cooling the heat sink portion 10 can be pumped or guided through the cooling structure 20.
The first partial surface 11a and/or the second partial surface 11b are provided for receiving components, in particular power electronic components, and for removing their waste heat via the cooling structure 20. The heat sink segment 10 is shown in this exemplary embodiment as a body with a base surface of a quarter circle shape. The first partial surface 11a and the second partial surface 11b enclose an angle of substantially 90 °. In further alternative embodiments, both smaller and larger angles can be included between the first and second segment surfaces 11a, 11 b.
Fig. 2 shows schematically two adjacent heat sink segments 10, 10b in a plan view. A component group 30 to be cooled is arranged on the first section surface 11a of the first heat sink section 10. The component group 30 comprises power semiconductors 31, which heat up strongly during operation and therefore require a high cooling power. Furthermore, the component group 30 comprises a logic component 32, which is arranged in the immediate vicinity of the power semiconductor 31. The component group 30 is mounted on a ceramic substrate 35, wherein the ceramic substrate 35 is laminated with metal 36 on both sides. The respective power semiconductors 31 and the respective logic components 32 are connected to each other by wires 33. The second heat sink portion 10b adjoining the first heat sink portion 10 likewise has a portion surface 11c, which is arranged opposite the first portion surface 11 a. The segment faces 11c themselves have recesses 38 which can at least partially or completely accommodate the power semiconductors 31 when the first segment face 11a is attached to the further segment face 11 c. The recesses 38 are shown such that they follow the surface contour of the component group 30 in such a way that the first heat sink segment 10 and the further heat sink segment 10b are arranged or attached as close as possible to one another. The waste heat accumulated during operation of the power semiconductor 31 is thus effectively discharged both to the first heat sink portion 10 and to the further heat sink portion 10b, which itself discharges the waste heat via the cooling structure 20.
Fig. 3 schematically shows two segment surfaces 11a, 11c of two adjacent cooling body segments 10, 10b in a further exemplary embodiment. The heat sink portion 10 has a ceramic substrate 35 on its first portion surface 11a, which is provided on both sides with a metal laminate structure 36, wherein the power semiconductor 31 is arranged on the ceramic substrate 35.
Inserting: by actively cooling the component group 30, in particular the power semiconductor 31, the logic component 32 can be positioned closer to the power semiconductor 31. The length of the wire 33 is thereby shortened, which in turn has a positive effect on the parasitic inductance. And finishing the insertion.
The further heat sink segment 10b, which is arranged opposite the first heat sink segment 10, likewise has a ceramic substrate 35 on its further segment surface 11c, which is provided on both sides with metal laminate structures 36. On the ceramic substrate 35, logic modules 32 are arranged, wherein recesses 39 are provided between the individual logic modules 32. The recess 39 is provided for receiving the power semiconductor 31 on the ceramic substrate 35 of the first section surface 11a when the first heat sink section 10 and the further heat sink section 10b are joined to one another. (syntax). The power semiconductor 31 and the logic component 32 can be positioned arbitrarily here on the respective ceramic substrate 35. In an alternative or additional embodiment, it can be provided that the ceramic substrate 35 is provided only for logic components. Thus, a multi-layer logic substrate can be used, such as an LTCC with very low conductivity but very high dispersion capability. This also allows the logic module 32 to be thermally decoupled from the power semiconductor 31 even better after the first section plane 11a has been joined to the further section plane 11 c.
Fig. 4 schematically shows a heat sink 100 in a top view according to an embodiment. The heat sink 100 has four heat sink segments 10, 10b, 10c, 10d, which all have the basic shape of a cake-like segment. A symmetrical heat sink 100 is formed by the concentric arrangement of the heat sink segments 10, 10b, 10c, 10d about a common center point 12a on the intersecting line 12. The heat sink 100 has the basic shape of a cake or a hollow cylinder. Between the two segment surfaces 11a, 11c, 11b, 11d, which are respectively adjacent to one another, a component group 30 is arranged, which is cooled by a cooling body 100. The cooling body 100 has a circular recess 110 in its interior.
Inserting: after the cooling body 100 has been assembled from the cooling body segments 10, 10b, 10c, 10d, gaps 40 remain between the segment surfaces 11a, 11c, 11b, 11d, which gaps can be cast with a casting compound. This results in filling the gap 40 on the one hand and joining the heat sink segments 10, 10b, 10c, 10d to one another on the other hand.
Fig. 5 schematically shows a heat sink 100b according to a further embodiment. The heat sink 100b differs from the heat sink 100 only in that a sleeve 115 is arranged in the circular recess 110. The sleeve 115 can be of metal and can therefore be used for contacting the component group 30. The sleeve 115 also serves to orient the individual heat sink segments 10, 10b, 10c, 10d relatively precisely with respect to one another or concentrically around the center point 12 a. In the circular recess 110, an intermediate circuit capacitor can alternatively or additionally be arranged, which has the same distance from each of the component groups 30 and therefore also has equally long electrical connections. Thereby further reducing parasitic inductance. The intermediate circuit capacitor can be electrically contacted via the sleeve 115.
In the case of an arrangement of only the intermediate circuit capacitors in the circular recesses 110, the intermediate circuit capacitors additionally serve as orientation or centering aids for the individual heat sink segments 10, 10b, 10c, 10 d.
Fig. 6 schematically shows the cooling of the heat sink segments 10, 10b, 10c, 10d by means of three exemplary embodiments. (see brief description of the figures) in each of the three embodiments, a side view of the cooling body segment 10 or half of the cross section of the cooling body 10 along the gap 40 can be seen. On each of the sectional surfaces 11, a ceramic substrate 35 with a metallic laminate structure 36 can be seen. Two power semiconductors 31 are disposed on each of the metal-laminated ceramic substrates 35. Also shown is sleeve 115 abutting inner face 16 and midpoint 12a shown by dashed lines. In the upper exemplary embodiment, the inflow of cooling water on the lower side 14 is illustrated by an arrow 150a and the outflow of cooling water on the upper side 13 is illustrated by a further arrow 152 a. In the middle exemplary embodiment, the coolant inflow from the underside 14 is illustrated by an arrow 150b and the coolant outflow likewise on the underside 14 is illustrated by a further arrow 152 b. In the lower embodiment, the coolant inflow at two points on the underside 14 is illustrated by the arrow 150c and the coolant outflow from the underside 14 is illustrated by two further arrows 152 c. Regardless of the three embodiments, the coolant can be guided or guided at will by the targeted production or arrangement of the cooling structure 20 within the heat sink segment 10.
In an alternative embodiment, provision can be made for the inlet and/or outlet for the coolant to be attached to the lower side 14 and/or to the upper side 13, for example by soldering or welding.
In an alternative embodiment, the cooling structure 20 may be designed such that it is formed by a straight drill hole parallel to the first and/or second section plane. The upper side 14 and/or the lower side 13 can be closed off here, for example, by a steel plate, wherein connections for the inlet and outlet of the coolant can be provided on the upper side 13 and/or on the lower side 14.
Fig. 7 schematically shows a heat sink 100c according to a further exemplary embodiment. The heat sink 100c differs from the heat sink 100b of the exemplary embodiment of fig. 5 in that the outer surface 15a is not concentric and extends in the center point 12a, but forms a planar surface. A cooling body 100c with a square base surface is thus formed when the cooling body segments 10, 10b, 10c, 10d are arranged concentrically around the center point 12 a. Further components to be cooled, for example a printed circuit board 34, can be arranged on the heat sink segments 10, 10b, 10c, 10d via the flat outer surface 15a and thus be cooled by the heat sink 100 c.
Fig. 8 shows a schematic illustration of a heat sink 100d in a top view and in a side view in cross section according to a further exemplary embodiment. The heat sink 100d has a structure similar to that of the heat sink 100b of the embodiment of fig. 5. The heat sink 100d has heat sink segments 10, 10b, 10c, 10d, which are arranged concentrically about the center 12a and which have component groups 30 between the segment surfaces 11. Furthermore, at least one heat sink portion 10 has a further component group 30 and/or a printed circuit board 34 on the upper side 13, which is arranged there for cooling purposes. Furthermore, a cooling structure 20 in the form of a line section 21 is shown in the cooling body section. The line section 21 extends substantially from the lower side 14 of the heat sink portion 10, 10b, 10c, 10d towards the upper side 13, wherein the line section 21 does not penetrate the lower side 14 and the upper side 13. The line sections 21 have a transverse connection 22 near the upper side 13 and the lower side 14, which connects the line sections 21 to one another in such a way that only one inlet opening 23 and outlet opening 24, for example on the lower side 14, is sufficient for conducting the coolant through the cooling structure 20.
On the left side of the exemplary embodiment, a cross section 17 of the heat sink segment 10d is indicated by the letter a in the heat sink segment 10 d. The relevant sectional view is shown again on the right side of the embodiment. The heat sink portion 10d can be seen here in the cross section 17 perpendicular to the upper side 13 and the lower side 14. Inside the heat sink portion 10d, a cooling structure 20 in the form of a line section 21 and a transverse connecting structure 22 between the line sections 21 is shown. The cooling structure 20 has an inlet opening 23, through which the coolant is conveyed to the cooling body section 10d, indicated by the arrow 150. Furthermore, the heat sink portion 10d has outlet openings 24 on its underside 14, through which the coolant is discharged from the heat sink portion 10d, as indicated by further arrows 152. Productive manufacturing techniques are suitable for realizing an almost arbitrary course of the cooling structure 20 or the line section 21 and the transverse connecting structure 23 disposed therebetween.
Fig. 9 shows a flow chart of a method 200 for cooling a component, in particular a power electronics component. In a first method step 201, a heat sink 100, in particular according to one of the preceding exemplary embodiments, is provided. In a second method step 202, the heat sink 100 is actively cooled in such a way that the cooling structure 20 is flowed through by the coolant in the interior of the heat sink sections 10, 10b, 10c, 10d of the heat sink 100.
Inserting: the flow direction 23 of the coolant is indicated by an arrow in the line section 21. And finishing the insertion.
Claims (13)
1. Cooling body segment (10, 10b, 10c, 10 d) for a cooling component (30, 34), in particular for cooling power electronics components, having a first segment surface (11, 11a, 11b, 11c, 11 d) and a second segment surface (11, 11a, 11b, 11c, 11 d), characterized in that the first segment surface (11, 11a, 11b, 11c, 11 d) and the second segment surface (11, 11a, 11b, 11c, 11 d) are oriented relative to one another in such a way that, when a plurality of cooling body segments (10, 10b, 10c, 10 d) are arranged concentrically, all segment surfaces (11, 11a, 11b, 11c, 11 d) of the cooling body segments (10, 10b, 10c, 10 d) adjoin one another.
2. The heat sink segment (10, 10b, 10c, 10 d) according to claim 1, characterized in that the first segment surface (11, 11a, 11b, 11c, 11 d) and/or the second segment surface (11, 11a, 11b, 11c, 11 d) is designed to accommodate a component (30, 34) to be cooled.
3. The heat sink segment (10, 10b, 10c, 10 d) according to claim 2, characterized in that the first segment surface (11, 11a, 11b, 11c, 11 d) and/or the second segment surface (11, 11a, 11b, 11c, 11 d) has a surface contour (38) which corresponds to the contour of the component surface in such a way that the component (30, 34) is at least partially surrounded by the heat sink segment (10, 10b, 10c, 10 d).
4. The cooling body segment (10, 10b, 10c, 10 d) according to one of claims 1 to 3, characterized in that the interior of the cooling body segment (10, 10b, 10c, 10 d) has a cooling structure (20, 21, 22) through which a coolant flows.
5. The cooling body segment (10, 10b, 10c, 10 d) according to one of the preceding claims, characterized in that the cooling body segment (10, 10b, 10c, 10 d) has an outer face (15) configured as a flat face for accommodating a further component (30, 34) to be cooled, wherein the outer face (15) connects the first segment face (11, 11a, 11b, 11c, 11 d) and the second segment face (11, 11a, 11b, 11c, 11 d) to one another.
6. The cooling body segment (10, 10b, 10c, 10 d) according to one of the preceding claims, characterized in that the cooling body segment (10, 10b, 10c, 10 d) has at least one end face (13, 14) which is designed as a planar face and is substantially perpendicular to the first segment face (11, 11a, 11b, 11c, 11 d) and/or the second segment face (11, 11a, 11b, 11c, 11 d), wherein the end face (13, 14) is designed to receive a further component (30, 34) to be cooled.
7. Cooling body segment (10, 10b, 10c, 10 d) according to one of the preceding claims, characterized in that the cooling body segment (10, 10b, 10c, 10 d) is produced by a generative production method, in particular by selective laser melting, by selective electron beam melting and/or adhesive injection.
8. Cooling body (100, 100b, 100c, 100 d) for cooling a component (30, 34), in particular for cooling power electronics components, having at least one first cooling body section (10, 10b, 10c, 10 d) and a second cooling body section (10, 10b, 10c, 10 d) according to one of the preceding claims, characterized in that the first cooling body section (10, 10b, 10c, 10 d) and the second cooling body section (10, 10b, 10c, 10 d) are arranged concentrically in such a way that a cooling body (100, 100b, 100c, 100 d) is formed.
9. The heat sink (100, 100b, 100c, 100 d) according to claim 8, characterized in that a component (30, 34) to be cooled is arranged between the two section surfaces (11, 11a, 11b, 11c, 11 d) of two different heat sink sections (10, 10b, 10c, 10 d).
10. The heat sink (100, 100b, 100c, 100 d) according to claim 8 or 9, characterized in that the heat sink (100, 100b, 100c, 100 d) is designed in the form of a hollow body, in particular a hollow cylinder.
11. Cooling body (100, 100b, 100c, 100 d) according to claim 10, characterized in that further components, in particular a sleeve (115) and/or an intermediate circuit capacitor, are arranged in the center of the hollow body.
12. The heat sink (100, 100b, 100c, 100 d) according to claims 8 to 11, characterized in that the heat sink (100, 100b, 100c, 100 d) is designed as a circular or square base surface.
13. Method (200) for cooling a component (30, 34), in particular a power electronic component, with the following steps:
-providing (201) a cooling body (100, 100b, 100c, 100 d), in particular according to any of claims 8 to 12; and is
-actively cooling (202) the heat sink (100, 100b, 100c, 100 d), wherein a cooling structure (20, 21, 22) is traversed by a coolant inside a heat sink section (10, 10b, 10c, 10 d) of the heat sink (100, 100b, 100c, 100 d).
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102017216665.7A DE102017216665A1 (en) | 2017-09-20 | 2017-09-20 | Heat sink segment, heat sink and method for cooling components |
| DE102017216665.7 | 2017-09-20 | ||
| PCT/EP2018/072418 WO2019057416A1 (en) | 2017-09-20 | 2018-08-20 | Heat sink segment, heat sink and method for cooling components |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111095539A true CN111095539A (en) | 2020-05-01 |
Family
ID=63350514
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201880060958.6A Pending CN111095539A (en) | 2017-09-20 | 2018-08-20 | Cooling body segment for a cooling component, cooling body and method |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP3685435A1 (en) |
| JP (1) | JP6945730B2 (en) |
| KR (1) | KR20200054982A (en) |
| CN (1) | CN111095539A (en) |
| DE (1) | DE102017216665A1 (en) |
| WO (1) | WO2019057416A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3719975A1 (en) * | 2019-04-04 | 2020-10-07 | Siemens Aktiengesellschaft | Electric machine |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003100974A (en) * | 2001-09-25 | 2003-04-04 | Tdk Corp | Air-cooling semiconductor heat sink |
| JP2008218561A (en) * | 2007-03-01 | 2008-09-18 | Rohm Co Ltd | Semiconductor device and manufacturing method therefor |
| US20100059213A1 (en) * | 2008-09-08 | 2010-03-11 | Mitac Techonology Corp. | Heat dissipating structure and method of forming the same |
| DE202009018077U1 (en) * | 2009-08-06 | 2010-12-16 | Siemens Aktiengesellschaft | Power electronics arrangement |
| JP2013131779A (en) * | 2013-03-30 | 2013-07-04 | Ryosan Co Ltd | Heat sink and manufacturing method thereof |
| EP3113221A1 (en) * | 2015-07-02 | 2017-01-04 | Rohde & Schwarz GmbH & Co. KG | Passive cooling module |
| JP2017517878A (en) * | 2014-04-16 | 2017-06-29 | レイセオン カンパニー | Monolithic multi-module electronics enclosure with multi-planar with embedded fluid cooling channels |
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|---|---|---|---|---|
| JP2004179463A (en) * | 2002-11-28 | 2004-06-24 | Hitachi Kokusai Electric Inc | Substrate packaging structure |
| JP2006229180A (en) * | 2005-01-24 | 2006-08-31 | Toyota Motor Corp | Semiconductor module and device |
| DE102010017168B4 (en) | 2010-05-31 | 2014-04-10 | Refusol Gmbh | Arrangement with method for cooling heat-generating components |
-
2017
- 2017-09-20 DE DE102017216665.7A patent/DE102017216665A1/en active Pending
-
2018
- 2018-08-20 WO PCT/EP2018/072418 patent/WO2019057416A1/en unknown
- 2018-08-20 CN CN201880060958.6A patent/CN111095539A/en active Pending
- 2018-08-20 KR KR1020207008039A patent/KR20200054982A/en not_active Application Discontinuation
- 2018-08-20 EP EP18759077.3A patent/EP3685435A1/en not_active Withdrawn
- 2018-08-20 JP JP2020516605A patent/JP6945730B2/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003100974A (en) * | 2001-09-25 | 2003-04-04 | Tdk Corp | Air-cooling semiconductor heat sink |
| JP2008218561A (en) * | 2007-03-01 | 2008-09-18 | Rohm Co Ltd | Semiconductor device and manufacturing method therefor |
| US20100059213A1 (en) * | 2008-09-08 | 2010-03-11 | Mitac Techonology Corp. | Heat dissipating structure and method of forming the same |
| DE202009018077U1 (en) * | 2009-08-06 | 2010-12-16 | Siemens Aktiengesellschaft | Power electronics arrangement |
| JP2013131779A (en) * | 2013-03-30 | 2013-07-04 | Ryosan Co Ltd | Heat sink and manufacturing method thereof |
| JP2017517878A (en) * | 2014-04-16 | 2017-06-29 | レイセオン カンパニー | Monolithic multi-module electronics enclosure with multi-planar with embedded fluid cooling channels |
| EP3113221A1 (en) * | 2015-07-02 | 2017-01-04 | Rohde & Schwarz GmbH & Co. KG | Passive cooling module |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2019057416A1 (en) | 2019-03-28 |
| JP2020534699A (en) | 2020-11-26 |
| EP3685435A1 (en) | 2020-07-29 |
| JP6945730B2 (en) | 2021-10-06 |
| DE102017216665A1 (en) | 2019-03-21 |
| KR20200054982A (en) | 2020-05-20 |
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