JP2020522134A5 - - Google Patents
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- Publication number
- JP2020522134A5 JP2020522134A5 JP2019564990A JP2019564990A JP2020522134A5 JP 2020522134 A5 JP2020522134 A5 JP 2020522134A5 JP 2019564990 A JP2019564990 A JP 2019564990A JP 2019564990 A JP2019564990 A JP 2019564990A JP 2020522134 A5 JP2020522134 A5 JP 2020522134A5
- Authority
- JP
- Japan
- Prior art keywords
- edge coupling
- coupling ring
- processing system
- edge
- substrate processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000008878 coupling Effects 0.000 claims description 139
- 238000010168 coupling process Methods 0.000 claims description 139
- 238000005859 coupling reaction Methods 0.000 claims description 139
- 239000000758 substrate Substances 0.000 claims description 66
- 238000000034 method Methods 0.000 claims description 25
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 24
- 230000003628 erosive effect Effects 0.000 claims description 4
- 239000007789 gas Substances 0.000 claims description 4
- 238000009434 installation Methods 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000012159 carrier gas Substances 0.000 claims description 2
- 238000001514 detection method Methods 0.000 claims description 2
- 210000002304 esc Anatomy 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022100927A JP7483795B2 (ja) | 2017-05-31 | 2022-06-23 | 調整可能／交換可能なエッジ結合リングのための検出システム |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15/609,570 | 2017-05-31 | ||
| US15/609,570 US20170263478A1 (en) | 2015-01-16 | 2017-05-31 | Detection System for Tunable/Replaceable Edge Coupling Ring |
| PCT/US2018/033656 WO2018222430A2 (en) | 2017-05-31 | 2018-05-21 | Detection system for tunable/replaceable edge coupling ring |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022100927A Division JP7483795B2 (ja) | 2017-05-31 | 2022-06-23 | 調整可能／交換可能なエッジ結合リングのための検出システム |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2020522134A JP2020522134A (ja) | 2020-07-27 |
| JP2020522134A5 true JP2020522134A5 (enExample) | 2021-07-26 |
| JP7096271B2 JP7096271B2 (ja) | 2022-07-05 |
Family
ID=64455600
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019564990A Active JP7096271B2 (ja) | 2017-05-31 | 2018-05-21 | 調整可能／交換可能なエッジ結合リングのための検出システム |
| JP2022100927A Active JP7483795B2 (ja) | 2017-05-31 | 2022-06-23 | 調整可能／交換可能なエッジ結合リングのための検出システム |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022100927A Active JP7483795B2 (ja) | 2017-05-31 | 2022-06-23 | 調整可能／交換可能なエッジ結合リングのための検出システム |
Country Status (5)
| Country | Link |
|---|---|
| JP (2) | JP7096271B2 (enExample) |
| KR (2) | KR102529764B1 (enExample) |
| CN (2) | CN110692130B (enExample) |
| TW (2) | TWI860581B (enExample) |
| WO (1) | WO2018222430A2 (enExample) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114450780A (zh) * | 2019-07-29 | 2022-05-06 | 朗姆研究公司 | 用于衬底处理系统的自动化控制及检测的集成式硬件-软件计算机视觉系统 |
| CN113130284B (zh) * | 2019-12-31 | 2023-01-24 | 中微半导体设备(上海)股份有限公司 | 等离子体刻蚀设备 |
| JP7443163B2 (ja) | 2020-05-27 | 2024-03-05 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理方法および基板処理装置 |
| JP6989980B2 (ja) * | 2020-06-15 | 2022-01-12 | アダプティブ プラズマ テクノロジー コーポレーション | 半導体工程のための部品整列装置及びこれによる部品整列方法 |
| CN113830700B (zh) * | 2020-06-24 | 2025-08-01 | 拓荆科技股份有限公司 | 水平自动调整的升降系统及方法 |
| JP7455012B2 (ja) | 2020-07-07 | 2024-03-25 | 東京エレクトロン株式会社 | プラズマ処理装置およびプラズマ処理装置の載置台 |
| US20220108908A1 (en) * | 2020-10-06 | 2022-04-07 | Applied Materials, Inc. | Shadow ring kit for plasma etch wafer singulation process |
| CN114388425A (zh) | 2020-10-19 | 2022-04-22 | 东京毅力科创株式会社 | 载置台和基片处理装置 |
| CN112397366B (zh) * | 2020-11-05 | 2023-07-14 | 北京北方华创微电子装备有限公司 | 一种承载装置及半导体反应腔室 |
| CN114639582B (zh) * | 2020-12-15 | 2025-02-14 | 中微半导体设备(上海)股份有限公司 | 一种边缘环高度测量装置及方法 |
| KR102822787B1 (ko) * | 2022-11-09 | 2025-06-23 | 세메스 주식회사 | 기판 처리 장치 및 기판 처리 방법 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001230239A (ja) | 2000-02-15 | 2001-08-24 | Tokyo Electron Ltd | 処理装置及び処理方法 |
| US6805952B2 (en) * | 2000-12-29 | 2004-10-19 | Lam Research Corporation | Low contamination plasma chamber components and methods for making the same |
| US20030019428A1 (en) * | 2001-04-28 | 2003-01-30 | Applied Materials, Inc. | Chemical vapor deposition chamber |
| JP3795820B2 (ja) * | 2002-03-27 | 2006-07-12 | 株式会社東芝 | 基板のアライメント装置 |
| JP2006173223A (ja) * | 2004-12-14 | 2006-06-29 | Toshiba Corp | プラズマエッチング装置およびそれを用いたプラズマエッチング方法 |
| US20070224709A1 (en) * | 2006-03-23 | 2007-09-27 | Tokyo Electron Limited | Plasma processing method and apparatus, control program and storage medium |
| JP2010034416A (ja) | 2008-07-30 | 2010-02-12 | Hitachi High-Technologies Corp | プラズマ処理装置およびプラズマ処理方法 |
| US8034723B2 (en) * | 2009-12-25 | 2011-10-11 | Tokyo Electron Limited | Film deposition apparatus and film deposition method |
| US20120237682A1 (en) * | 2011-03-18 | 2012-09-20 | Applied Materials, Inc. | In-situ mask alignment for deposition tools |
| US9006633B2 (en) * | 2012-11-02 | 2015-04-14 | The United States Of America As Represented By The Secretary Of The Army | Passive imaging correction system using feedback including a variable aperture with plural settings and method thereof |
| US8902429B1 (en) * | 2012-12-05 | 2014-12-02 | Kla-Tencor Corporation | Focusing detector of an interferometry system |
| KR102104018B1 (ko) * | 2013-03-12 | 2020-04-23 | 어플라이드 머티어리얼스, 인코포레이티드 | 방위각 및 방사상 분배 제어되는 다중-구역 가스 주입 조립체 |
| US9543225B2 (en) * | 2014-04-29 | 2017-01-10 | Lam Research Corporation | Systems and methods for detecting endpoint for through-silicon via reveal applications |
| US9026244B1 (en) * | 2014-05-22 | 2015-05-05 | Applied Materials, Inc. | Presence sensing and position correction for wafer on a carrier ring |
| US9959610B2 (en) * | 2014-10-30 | 2018-05-01 | Applied Materials, Inc. | System and method to detect substrate and/or substrate support misalignment using imaging |
| US10658222B2 (en) * | 2015-01-16 | 2020-05-19 | Lam Research Corporation | Moveable edge coupling ring for edge process control during semiconductor wafer processing |
| US10041868B2 (en) | 2015-01-28 | 2018-08-07 | Lam Research Corporation | Estimation of lifetime remaining for a consumable-part in a semiconductor manufacturing chamber |
| TWI574334B (zh) * | 2015-03-17 | 2017-03-11 | 陳勇吉 | 檢測晶圓的方法 |
| JP6880364B2 (ja) * | 2015-08-18 | 2021-06-02 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理装置および基板処理方法 |
-
2018
- 2018-05-21 CN CN201880035873.2A patent/CN110692130B/zh active Active
- 2018-05-21 KR KR1020197038881A patent/KR102529764B1/ko active Active
- 2018-05-21 JP JP2019564990A patent/JP7096271B2/ja active Active
- 2018-05-21 CN CN202410097347.6A patent/CN118197892A/zh active Pending
- 2018-05-21 KR KR1020237014975A patent/KR102658105B1/ko active Active
- 2018-05-21 WO PCT/US2018/033656 patent/WO2018222430A2/en not_active Ceased
- 2018-05-28 TW TW111144724A patent/TWI860581B/zh active
- 2018-05-28 TW TW107118101A patent/TWI788356B/zh active
-
2022
- 2022-06-23 JP JP2022100927A patent/JP7483795B2/ja active Active
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