JP2020502818A - プリンテッド・エレクトロニクス - Google Patents
プリンテッド・エレクトロニクス Download PDFInfo
- Publication number
- JP2020502818A JP2020502818A JP2019542760A JP2019542760A JP2020502818A JP 2020502818 A JP2020502818 A JP 2020502818A JP 2019542760 A JP2019542760 A JP 2019542760A JP 2019542760 A JP2019542760 A JP 2019542760A JP 2020502818 A JP2020502818 A JP 2020502818A
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- JP
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- Prior art keywords
- electronic device
- printed
- ink
- molecular
- inks
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 37
- 229910052751 metal Inorganic materials 0.000 claims abstract description 36
- 239000002184 metal Substances 0.000 claims abstract description 36
- 229910052709 silver Inorganic materials 0.000 claims abstract description 30
- 239000004332 silver Substances 0.000 claims abstract description 30
- 239000000203 mixture Substances 0.000 claims abstract description 15
- 239000011230 binding agent Substances 0.000 claims abstract description 10
- 239000003960 organic solvent Substances 0.000 claims abstract description 8
- JGZXECQTCVKZSO-UHFFFAOYSA-L C(=O)[O-].[Cu+2].C(C)C(CN)CCCC.C(C)C(CN)CCCC.C(=O)[O-] Chemical compound C(=O)[O-].[Cu+2].C(C)C(CN)CCCC.C(C)C(CN)CCCC.C(=O)[O-] JGZXECQTCVKZSO-UHFFFAOYSA-L 0.000 claims abstract description 7
- DOSNYWSYWHDCAO-UHFFFAOYSA-L C(=O)[O-].[Cu+2].C(CCCCCCC)N.C(CCCCCCC)N.C(=O)[O-] Chemical compound C(=O)[O-].[Cu+2].C(CCCCCCC)N.C(CCCCCCC)N.C(=O)[O-] DOSNYWSYWHDCAO-UHFFFAOYSA-L 0.000 claims abstract description 4
- 239000000758 substrate Substances 0.000 claims description 69
- 238000010438 heat treatment Methods 0.000 claims description 17
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- 239000003990 capacitor Substances 0.000 claims description 8
- IOCRFKFMLPFURK-UHFFFAOYSA-L C(=O)[O-].C(CCCCCCC)N.C(CCCCCCC)N.C(CCCCCCC)N.[Cu+2].C(=O)[O-] Chemical compound C(=O)[O-].C(CCCCCCC)N.C(CCCCCCC)N.C(CCCCCCC)N.[Cu+2].C(=O)[O-] IOCRFKFMLPFURK-UHFFFAOYSA-L 0.000 claims description 6
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- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical group [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 claims description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims description 2
- 229910052744 lithium Inorganic materials 0.000 claims description 2
- -1 tris (octylamine) copper Chemical compound 0.000 abstract description 11
- BDAGIHXWWSANSR-UHFFFAOYSA-M Formate Chemical compound [O-]C=O BDAGIHXWWSANSR-UHFFFAOYSA-M 0.000 abstract description 2
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
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- 229910052782 aluminium Inorganic materials 0.000 description 4
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
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- GGCZERPQGJTIQP-UHFFFAOYSA-N sodium;9,10-dioxoanthracene-2-sulfonic acid Chemical compound [Na+].C1=CC=C2C(=O)C3=CC(S(=O)(=O)O)=CC=C3C(=O)C2=C1 GGCZERPQGJTIQP-UHFFFAOYSA-N 0.000 description 2
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- 239000012691 Cu precursor Substances 0.000 description 1
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- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000003044 adaptive effect Effects 0.000 description 1
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- 150000007942 carboxylates Chemical class 0.000 description 1
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- 239000011370 conductive nanoparticle Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- HFDWIMBEIXDNQS-UHFFFAOYSA-L copper;diformate Chemical compound [Cu+2].[O-]C=O.[O-]C=O HFDWIMBEIXDNQS-UHFFFAOYSA-L 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
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- VIKNJXKGJWUCNN-XGXHKTLJSA-N norethisterone Chemical compound O=C1CC[C@@H]2[C@H]3CC[C@](C)([C@](CC4)(O)C#C)[C@@H]4[C@@H]3CCC2=C1 VIKNJXKGJWUCNN-XGXHKTLJSA-N 0.000 description 1
- IOQPZZOEVPZRBK-UHFFFAOYSA-N octan-1-amine Chemical compound CCCCCCCCN IOQPZZOEVPZRBK-UHFFFAOYSA-N 0.000 description 1
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- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
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- 229910052710 silicon Inorganic materials 0.000 description 1
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
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- C09D11/52—Electrically conductive inks
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B64—AIRCRAFT; AVIATION; COSMONAUTICS
- B64D—EQUIPMENT FOR FITTING IN OR TO AIRCRAFT; FLIGHT SUITS; PARACHUTES; ARRANGEMENT OR MOUNTING OF POWER PLANTS OR PROPULSION TRANSMISSIONS IN AIRCRAFT
- B64D15/00—De-icing or preventing icing on exterior surfaces of aircraft
- B64D15/12—De-icing or preventing icing on exterior surfaces of aircraft by electric heating
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
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- C09D11/10—Printing inks based on artificial resins
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
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- H—ELECTRICITY
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- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
- H01L23/49883—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials the conductive materials containing organic materials or pastes, e.g. for thick films
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022466—Electrodes made of transparent conductive layers, e.g. TCO, ITO layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/05—Accumulators with non-aqueous electrolyte
- H01M10/052—Li-accumulators
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/61—Types of temperature control
- H01M10/615—Heating or keeping warm
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- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
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- H01M10/60—Heating or cooling; Temperature control
- H01M10/62—Heating or cooling; Temperature control specially adapted for specific applications
- H01M10/625—Vehicles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/06—Electrode terminals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/0283—Stretchable printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
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- G—PHYSICS
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- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04102—Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
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- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
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- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
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- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/045—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using resistive elements, e.g. a single continuous surface or two parallel surfaces put in contact
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M2220/00—Batteries for particular applications
- H01M2220/20—Batteries in motive systems, e.g. vehicle, ship, plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10113—Lamp
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10143—Solar cell
-
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Abstract
Description
開示された主題は、一般にプリンテッド・エレクトロニクスに関する。より具体的には、開示された主題は、分子インク又はフレークインクを用いたプリンテッド・エレクトロニクスの応用に関する。
分子インク又はフレークインクといった、プリントされるインクに特定の特性を付与するように設計されたインクが存在する。
フレークインク
分子インク
プリンテッド・エレクトロニクスに基づく電装部品
分子インクで作製された回路
分子インク及び他のインクを用いたプリンテッド・エレクトロニクスの応用
−受動又は能動の、リジッド又はフレキシブルなプリント電子部品
−フレキシブル又はリジッドなプリント回路板
−はんだ付け可能なプリント回路板
−プリントされたフレキシブルな発熱体、例えば、航空宇宙用途用
−プリントされたコプレーナ導波路、RFアンテナ、RFフィルタ及びハイブリッドRFデバイス
−選択的周波数での、プリントされたRFエンジニア加工フィルタリング又は反射又は配向の面
−プリントされたフレキシブル又はリジッドな太陽電池
−プリントされた半導体デバイス
−プリントされた微細ワイヤフレキシブル又はリジッドなタッチインターフェイス
−プリントされたフレキシブル又はリジッドな透明電極
−プリントされた容量性又は抵抗性のフレキシブル又はリジッドなインターフェイス
−プリントされたフレキシブルな電界発光ランプ
−フレキシブル基板上にプリントされたウェアラブル電子装置
−プリントされた物理化学的及び電気機械的センサ
RF用途
航空宇宙用途
太陽電池
導電膜及びタッチインターフェイス
ディスクリートアクティブスイッチのハイブリッド統合
CPW線路及びフィルタ
微細ワイヤ
熱成形高温銀分子インク
の、導電性トレースシートの抵抗率値を生じることができる。光焼結は、熱処理法では数十分かかるのとは対照的に、ミリ秒でのトレースの処理を可能とするため有意義である。光焼結は、ポリエチレンテレフタラート、ポリエチレンナフタレート、ポリカーボネート及びグリコール変性ポリエチレンテレフタラート(PETG)等の低温の基板上での分子インクの処理を可能とすることが実証されている。PETG上でインクを処理するのにIPLを使用できることは、インモールド電子回路を生成する独特な方法を検討する可能性を開くことになるので価値がある。インモールド電子装置の生成に分子インク及び光焼結の組み合わせを使用することの潜在的な利点は、トレースが導電性トレースに変換され、次いで光子エネルギーを用いて導電性3Dトレースに変換される前に、トレースを成型できるという事実にある。このことは銀フレークインクでは不可能であり、分子インクを用いてのみ実行可能な他に類を見ないプロセスである。
Claims (33)
- 上部に分子インクのトレースを有するプリント基板を含む電子デバイスであって、
前記分子インクは、焼結されて、前記電子デバイスを形成する導電性金属トレースを形成し、前記分子インクが:
a)30〜60重量%のC8〜C12カルボン酸銀、0.1〜10重量%の高分子バインダー及び少なくとも一種の有機溶媒の残部で構成されるフレーク非含有のプリント可能な組成物、ここで、全ての重量は前記組成物の総重量に基づく;或いは、
b)5〜75重量%のビス(2−エチル−1−ヘキシルアミン)銅(II)ホルマート、ビス(オクチルアミン)銅(II)ホルマート又はトリス(オクチルアミン)銅(II)ホルマート、0.25〜10重量%の高分子バインダー及び少なくとも一種の有機溶媒の残部で構成されるフレーク非含有のプリント可能な組成物、ここで、全ての重量は前記組成物の総重量に基づく;
から選択される、電子デバイス。 - 前記分子インクが伸縮可能且つ熱成形可能である、請求項1に記載の電子デバイス。
- 前記基板が柔軟性を有する、請求項1に記載の電子デバイス。
- 前記電子デバイスが電子部品としてプリントされる、請求項1〜3のいずれか一項に記載の電子デバイス。
- 前記電子デバイスが金属−絶縁体−金属(MIM)デバイスとしてプリントされる、請求項1に記載の電子デバイス。
- 前記インクのトレースが前記電子デバイスの絶縁体上にある、請求項1に記載の電子デバイス。
- 前記電子デバイスがインダクタを含む、請求項1に記載の電子デバイス。
- 前記電子デバイスがキャパシタを含む、請求項1に記載の電子デバイス。
- 前記電子デバイスが電子フィルタを含む、請求項1に記載の電子デバイス。
- 前記電子デバイスがはんだ付け可能なプリント回路板としてプリントされる、請求項1に記載の電子デバイス。
- 前記電子デバイスが、コプレーナ導波路、極超短波RFアンテナ、極超短波RFフィルタ及びハイブリッドRFデバイス:のうちの一つとしてプリントされる、請求項1に記載の電子デバイス。
- 前記電子デバイスが、周波数選択性RFフィルタリング、反射又は配向用のエンジニア加工面としてプリントされる、請求項1に記載の電子デバイス。
- 前記電子デバイスが太陽電池としてプリントされる、請求項1に記載の電子デバイス。
- 前記電子デバイスが半導体デバイスとしてプリントされる、請求項1に記載の電子デバイス。
- 前記電子デバイスが透明電極としてプリントされる、請求項1に記載の電子デバイス。
- 前記電子デバイスが電界発光ランプとしてプリントされる、請求項1に記載の電子デバイス。
- 前記電子デバイスが、ウェアラブル電子デバイス又はインモールド電子デバイスとしてプリントされる、請求項1〜3のいずれか一項に記載の電子デバイス。
- 前記電子デバイスが、物理化学的及び電気機械的センサのうちの一つとしてプリントされる、請求項1に記載の電子デバイス。
- 電子デバイスを含む加熱装置であって、
前記電子デバイスが、上部にインクのトレースを有するプリント基板を含み、
前記インクは、焼結されて、前記電子デバイスを形成する導電性金属トレースを形成し、前記インクが:
a)分子インク;又は、
b)フレークインク;
から選択される、加熱装置。 - 前記分子インクが伸縮可能且つ熱成形可能である、請求項19に記載の電子デバイス。
- 前記基板が柔軟性を有する、請求項19に記載の電子デバイス。
- 前記電子デバイスが抵抗性電気回路としてプリントされる、請求項19に記載の電子デバイス。
- 前記電子デバイスが航空機の一部内に覆われる、請求項22に記載の電子デバイス。
- 前記電子デバイスが航空機の翼内に取り付けられて前記翼を加熱する、請求項23に記載の電子デバイス。
- 前記電子デバイスが、航空機、緊急システム、電気自動車、照明システム又はビルディングオートメーションシステムの性能を維持するために使用される、請求項24に記載の電子デバイス。
- 前記電子デバイスが電池に取り付けられて前記電池を加熱する、請求項19〜22のいずれか一項に記載の電子デバイス。
- 前記電池がリチウム電池である、請求項26に記載の電子デバイス。
- 上部に分子インクのトレースを有するプリント基板を含むタッチインターフェイスであって、
前記分子インクは、焼結されて、透明導電膜を形成する導電性金属トレースを形成する、タッチインターフェイス。 - プリント容量性又は抵抗性素子を更に含む、請求項28に記載のタッチインターフェイス。
- 容量性微細ワイヤを更に含む、請求項28に記載のタッチインターフェイス。
- 前記容量性微細ワイヤが、プリント銀電極のグリッド又はパターンを含み、前記基板が柔軟性を有する、請求項29に記載のタッチインターフェイス。
- 前記導電性金属トレースをレーザートリミングすることにより前記容量性微細ワイヤが作製され、これにより前記微細ワイヤが容量性を有する、請求項30に記載のタッチインターフェイス。
- 前記導電性金属トレースの選択的焼結を行うことにより前記容量性微細ワイヤが作製される、請求項30に記載のタッチインターフェイス。
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