JP2020200980A - Heat controller, cooling system, heating system and electronic product - Google Patents

Abstract

To devise a layout to avoid deterioration of heat quantity transport capacity per unit mounting area of a temperature control unit (heat controller), in a case of providing a plurality of Peltier elements (Peltier effect elements).SOLUTION: A plurality of Peltier modules 11 to 16 having Peltier effect elements whose first surfaces are heat absorption surfaces 11a to 16a and second surfaces are heat dissipation surfaces 11b to 16b, is arranged along a direction orthogonal to a surface direction. Between the heat absorption surfaces 11a to 16a facing each other, heat absorption flow passages 21, 22 are arranged. Between the heat dissipation surfaces 11b to 16b facing each other, heat dissipation flow passages 31, 33 are arranged. The heat absorption flow passages 21, 22 are connected to a heat absorption flow passage connection part 40. The heat dissipation flow passages 31, 33 are connected to the heat dissipation flow passages connection part 50.SELECTED DRAWING: Figure 1

Description

The present invention relates to a heat control device, a cooling system, a heating system, and an electric appliance, and in particular, a heat control device, a cooling system, and a heating system that can be provided in home appliances such as air conditioners, refrigerators, water heaters, and water coolers. , And electrical appliances.

In Patent Document 1, the temperature in the temperature control space of the building can be maintained at an appropriate temperature, the structure is not complicated, the construction does not take time and labor, the cost can be reduced, and the heating and cooling efficiency is improved. A temperature control unit that is excellent and has excellent maintainability is disclosed. This temperature control unit is opposite to the vapor chamber of the vapor chamber, which is arranged so that one surface is in contact with the heat radiating body, the Peltier element which is arranged so that one surface is in contact with the other surface of the vapor chamber, and the vapor chamber of the Peltier element. It is provided with a heat radiating plate portion arranged so as to come into contact with the side surface.
JP-A-2017-203604

However, when a very high heat transfer capacity is required, it is necessary to increase the number of Peltier elements. In this case, the Peltier elements are usually arranged in a plane. Then, since a large mounting area is required and the heat transport capacity of the Peltier element located at the end is relatively low, the improvement of the heat transport capacity per unit mounting area is limited.

Therefore, according to the present invention, when a plurality of Peltier elements (Peltier effect elements) are provided, the layout is devised to avoid a decrease in the heat transfer capacity per unit mounting area of the temperature control unit (heat control device). Make it an issue.

In order to solve the above problems, the thermal control device of the present invention
A plurality of Peltier effect elements having a first surface as an endothermic surface and a second surface as a heat radiating surface are arranged along the direction orthogonal to the surface direction.
The endothermic flow path is arranged between the endothermic surfaces facing each other, and the heat dissipation flow path is arranged between the facing surfaces of the heat radiating surfaces.

As described above, in the thermal control device of the present invention, the Peltier effect elements are structurally laminated and thermally arranged in parallel, so that the Peltier effect elements are located at the ends while keeping the mounting area small. The heat transport capacity of the Peltier element is relatively increased to improve the heat transport capacity per unit mounting area.

It should be noted that the endothermic flow path connecting portion for connecting the endothermic flow paths to each other and the heat dissipation flow path connecting portion for connecting the heat dissipation flow paths to each other may be provided.

Further, at least a part of the endothermic flow path and the heat dissipation flow path may be composed of a vapor chamber.

The cooling system of the present invention
With the above thermal control device
A heat exhaust device that discharges heat from the object to be cooled that has been absorbed by the heat control device,
including.

The heating system of the present invention
With the above thermal control device
A heat source that supplies heat to the heat control device and
including.

Further, the electric appliance of the present invention includes the above-mentioned thermal control device. Examples of the electrification system include air conditioners, refrigerators, water heaters, and water coolers.

Embodiment of the invention

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In each figure, the same parts are designated by the same reference numerals.

(Embodiment 1)
FIG. 1 is a schematic configuration diagram of the thermal control device 100 according to the first embodiment of the present invention. In FIG. 1, the Peltier modules 11 to 16, the heat absorption channels 21 and 22, the heat dissipation channels 31 and 32, the endothermic flow path connecting portion 40, and the heat dissipation flow path connecting portion 50 are described below. The general shape of the heat control device 100 is a substantially rectangular parallelepiped shape.

FIG. 2 is an exploded view of the heat control device 100 shown in FIG. 1, and is a detailed explanatory view of each portion shown in FIG. In FIG. 2, in addition to the respective parts shown in FIG. 1, the endothermic surfaces (first surface) 11a to 16a, the heat radiating surfaces (second surface) 11b to 16b, and one end side 21a, which will be described below, are shown. , The other end side 21b and the base end portion 21c are shown.

As shown in FIG. 1, each of the Peltier modules 11 to 16 has a flat plate shape. The Peltier modules 11 to 16 are configured by, for example, sandwiching several Peltier effect elements having a size of about 2 mm to 3 mm in length × 2 mm to 3 mm in width × 2 mm to 3 mm in thickness between ceramic plates.

The size of the Peltier modules 11 to 16 itself may be, for example, about 4 cm in length × about 3 cm in width × about 3 mm in thickness. Wiring 11c to 16c for applying an electric current to the Peltier effect element are connected to the Peltier modules 11 to 16.

Although six wirings 11c to 16c are shown in FIG. 1, there are wirings corresponding to the respective wirings 11c to 16c on the back side of the drawing. That is, two wires are connected to each of the Peltier modules 11 to 16.

As shown in FIG. 2, the Peltier modules 11 to 16 include endothermic surfaces (first surface) 11a to 16a and heat radiating surfaces (second surface) 11b to 16b. A plurality of Peltier modules 11 to 16 are arranged along the direction orthogonal to the plane direction.

The Peltier modules 11, 13 and 15 are arranged so that the endothermic surfaces 11a, 13a and 15a face the front right side of FIG. The Peltier modules 12, 14 and 16 are arranged so that the heat radiating surfaces 12b, 14b and 16b face the front right side of FIG. That is, in the present embodiment, for example, the endothermic surfaces of the even-numbered Peltier modules and the odd-numbered Peltier modules are arranged so as to be opposite to each other.

As shown in FIG. 1, the endothermic flow paths 21 and 22 and the heat radiation flow paths 31 and 32 are all U-shaped, for example. The shape is an example, and for example, it may be an E-shape with one more end, or it may be a shape with more ends. The Peltier modules 11 to 16 and the endothermic channels 21 and 22 or the heat dissipation channels 31 and 32 may be connected by, for example, an adhesive having high thermal conductivity, or the Peltier modules 11 to 16 may be connected to the endothermic channels 21. , 22 or may be connected by press-fitting between the heat dissipation channels 31 and 32.

As shown in FIG. 2, the endothermic flow paths 21 and 22 and the heat dissipation flow paths 31 and 32 are described by taking the endothermic flow path 21 as an example, and the one end side 21a and the other end side 21b that are parallel to each other are these. The shape is connected to the base end portion 21c which is an orthogonal plane to the surface.

In this case, the one end side 21a and the other end side 21b are, for example, about 1.2 times to 1.5 times the length of the Peltier module 11 or the like, and 0.7 times the width of the Peltier module 11 or the like. The width is about 1.2 times, and the thickness is about 0.6 to 0.8 times the thickness of the Peltier module 11 and the like. The length of the base end portion 21c on the inner peripheral side is substantially the same as the sum of the thickness of two Peltier modules 11 and the thickness of the one end side 21a.

The endothermic flow path 21 is arranged so that one end side 21a is located between the endothermic surfaces 11a and 12a facing each other and the other end side 21b is located between the endothermic surfaces 13a and 14a facing each other.

The endothermic flow path 22 is arranged so that one end side 22a is located between the endothermic surfaces 15a and 16a facing each other and the other end side 22b is in an open state.

In the heat radiation flow path 31, the outer peripheral side surface of the one end side 31a is in an open state, the inner peripheral side surface of the one end side 31a faces the heat radiation surface 11b, and the inner peripheral side surface of the other end side 31b is the heat radiation surface 12b. The outer peripheral side surface of the other end side 31b is arranged so as to face the heat radiation surface 13b.

In the heat radiation flow path 32, the outer peripheral side surface of the one end side 32a faces the heat radiation surface 14b, the inner peripheral side surface of the one end side 32a faces the heat radiation surface 15b, and the inner peripheral side surface of the other end side 32b It is arranged so as to face the heat radiating surface 16b and the outer peripheral side surface of the other end side 32b is in an open state.

As shown in FIG. 1, the endothermic flow path connecting portion 40 connects the base end portions 21c and 22c of the endothermic flow paths 21 and 22 to each other. The heat radiation flow path connecting portion 50 connects the base end portions 31c, 32c of the heat radiation flow paths 31 and 32 to each other. The sizes of the endothermic flow path connecting portion 40 and the heat dissipation flow path connecting portion 50 correspond to the sizes of the base end portions 21c, 22c, 31c, and 32c.

When the endothermic flow paths 21 and 22 and the heat dissipation channels 31 and 32, and the endothermic flow path connecting portion 40 and the heat dissipation flow path connecting portion 50 are manufactured of a material having high thermal conductivity such as copper, stainless steel, and titanium. Good. Explaining the endothermic flow path connecting portion 40 side as an example, the connection between the endothermic flow path connecting portion 40 and the heat absorbing flow paths 21 and 22 may be realized by an adhesive having high thermal conductivity or the like, and further. , These may be integrated rather than separate parts. Further, in order to increase the heat transfer efficiency, a vapor chamber having these materials as a housing can also be adopted. When a vapor chamber is adopted, a desired wick may be formed on the inner wall.

Note that FIG. 1 illustrates a thermal control device 100 including six Peltier modules 11 to 16, but the number of Peltier modules may be larger or smaller than this. Then, depending on the number of Peltier modules, the numbers 31 and 32 of the heat absorbing flow path and the heat radiating flow path, and the sizes of the endothermic flow path connecting portion 40 and the heat radiating flow path connecting portion 50 may be appropriately determined.

(Embodiment 2)
FIG. 3 is a schematic configuration diagram of the thermal control device 100 according to the second embodiment of the present invention, and corresponds to FIG. FIG. 4 is an exploded view of the heat control device 100 shown in FIG. 3, and corresponds to FIG. In the first embodiment, the even-numbered Peltier modules and the odd-numbered Peltier modules are arranged so as to be opposite to each other. However, in the present embodiment, for example, all the Peltier modules are arranged. The heat absorbing surfaces are arranged so that they are oriented in the same direction.

The heat control device 100 of the present embodiment is slightly larger in size than the heat control device 100 of the first embodiment, or in order to avoid this, as shown in FIGS. 3 and 4, the Peltier module We need to reduce the number. Nevertheless, there is still the advantage that the three-dimensional thermal control device 100 can be realized.

(Embodiment 3)
FIG. 5 is a schematic configuration diagram of the thermal control device 100 according to the third embodiment of the present invention, and corresponds to FIG. The heat control device 100 shown in FIG. 5 is different from the heat control device 100 in which the general shape shown in FIG. 1 is a substantially rectangular parallelepiped shape in that the general shape is laid out so as to have a substantially cubic shape.

As a specific difference, first, in the heat control device 100 shown in FIG. 1, the endothermic channels 21 and 22 and the heat dissipation channels 31 and 32 are arranged in the same plane, but FIG. In the heat control device 100 shown, the heat absorbing flow path 23 and the heat absorbing flow path 24 have an orthogonal relationship, and the heat radiating flow path 33 and the heat radiating flow path 34 have an orthogonal relationship.

Secondly, the shape of the endothermic flow path connecting portion 40 and the heat radiating flow path connecting portion 50 is substantially L-shaped having a slightly rounded corner portion 40A and a corner portion 50A. The endothermic flow path connecting portion 40 and the heat radiating flow path connecting portion 50 are arranged so as to be point-symmetrical with respect to the center point of the heat control device 100.

Third, in the heat control device 100 shown in FIG. 1, the endothermic flow path connecting portion 40 and the heat radiating flow path connecting portion 50 each have endothermic flow paths 21 and 22, and heat radiating flow paths 31 and 32, respectively. The base end portions 21c and 22c and the base end portions 31c and 32d are connected. In the heat control device 100 shown in FIG. 5, the endothermic flow path connecting portion 40 and the heat dissipation flow path connecting portion 50 are connected to the endothermic flow path. The 23 and the heat radiating flow path 33 are connected by the base end portions 23c and 33c, except that the endothermic flow path 24 and the heat radiating flow path 34 are connected by the one end portions 24a and 34a.

In the heat control device 100 shown in FIG. 5, for example, when the heat absorption channels 21 and 22 and the heat dissipation channels 31 and 32 are configured by the vapor chamber, there is a limit to the bending process of the vapor chamber, so that the allowable bending radius is large. Suitable for large cases.

(Embodiment 4)
FIG. 6 is a schematic configuration diagram of the thermal control device 100 according to the fourth embodiment of the present invention, and corresponds to FIG. The heat control device 100 shown in FIG. 6 has the same configuration as the heat control device 100 shown in FIG. 5, but the shapes of the corners of the endothermic flow path connecting portion 40 and the heat dissipation flow path connecting portion 50 are different.

When the size of the heat control device 100 is relatively large, the shapes of the corner portions 40A and 50A of the endothermic flow path connecting portion 40 and the heat dissipation flow path connecting portion 50 as shown in the heat control device 100 shown in FIG. Can be rounded. On the other hand, when the size of the heat control device 100 is relatively small, it may be difficult to process the corner portions 40A and 50A. Therefore, as shown in FIG. 6, the corner portions 40B and 50B having a chamfered shape are used. It is preferable to use a substantially L-shaped connecting portion 40 for an endothermic flow path and a connecting portion 50 for a heat radiation flow path.

(Embodiment 5)
FIG. 7 is a schematic configuration diagram of the thermal control device 100 according to the fifth embodiment of the present invention, and corresponds to FIG. FIG. 7A shows an overall perspective view of the heat control device 100, and FIG. 7B shows a cross-sectional view of the heat control device 100 at the end face position of the heat dissipation flow path connecting portion 50. 7 (c) shows an enlarged view of the Peltier effect element 10 located between the endothermic flow path connecting portion 40 and the heat radiating flow path connecting portion 50.

As shown in FIG. 7A, the thermal control device 100 of the present embodiment has a substantially cylindrical shape. The shapes of the endothermic flow path connecting portion 40 and the heat radiating flow path connecting portion 50 are both spiral in shape, and are significantly different from the heat control device 100 shown in FIG.

Further, as shown in FIG. 7B, the thermal control device 100 replaces the Peltier modules 11 to 16 with a Peltier effect element 10 including an N-type semiconductor element N and a P-type semiconductor element P, which are not modularized. It differs from the thermal control device 100 shown in FIG. 1 in that it employs a connecting portion 20 made of copper or the like that connects the N-type semiconductor element N and the P-type semiconductor element P. The N-type semiconductor element N and the P-type semiconductor element P may have, for example, a rectangular parallelepiped or cubic shape of about 0.5 mm to 2.0 mm, or a columnar or prismatic shape having a size corresponding to these, respectively.

In addition, in FIG. 7A, a plurality of Peltier effect elements 10 are arranged in four directions orthogonal to each other so as to divide the heat control device 100 into four equal parts with respect to the circumferential direction. Although the state is shown, it is an example that the number of sequences is 4 columns, which may be 6 columns or 8 columns, for example. Furthermore, the arrangement itself is not essential, and for example, the Peltier effect element 10 may be arranged as appropriate.

In the Peltier effect element 10, as shown in FIG. 7B, the N-type semiconductor element N and the P-type semiconductor element P alternate in both the circumferential direction and the cylindrical direction. It is designed to be arranged, but it is not limited to this. However, if they are arranged as shown in FIG. 7B, uniform temperature control is possible as a whole.

Further, although the thermal control device 100 using the Peltier effect element has been described for the first time in the present embodiment, it is not essential to use the Peltier modules 11 to 16 and the like also in the thermal control devices 100 of the first to fourth embodiments. Instead of these, the Peltier effect element 10 can also be used in the thermal control devices 100 of the first to fourth embodiments.

To give a supplementary explanation about the endothermic flow path connecting portion 40 and the heat dissipation flow path connecting portion 50, these may be formed by rounding a flat plate. Further, the endothermic flow path connecting portion 40 and the heat dissipation flow path connecting portion 50 may be formed with through holes serving as air passages at positions where the Peltier effect element 10 is not arranged.

(Embodiment 6)
FIG. 8 is a schematic configuration diagram of the thermal control device 100 according to the sixth embodiment of the present invention, and corresponds to FIG. The thermal control device 100 shown in FIG. 8 has a pair of support plates 61 and 62 having openings formed at four corners and a cylinder aligned with each of the openings in order to define a distance between the support plates 61 and 62. It has four spacers 63 in the shape, four bolts 64 passed through each opening and each spacer 63, and eight nuts 65 connected to both ends of each bolt 64.

In the case of the heat control device 100 shown in FIG. 6, the members were connected to each other by an adhesive or press-fitting, but in the case of the heat control device 100 shown in FIG. 8, support plates 61, 62 and the like were used. To connect the members to each other. This eliminates the need to select a desired adhesive and enables more reliable connection between members than press-fitting. In the case of the thermal control device 100 shown in FIG. 5, as shown in FIG. 8, the members may be connected to each other by using the support plates 61, 62 and the like.

(Embodiment 7)
FIG. 9 is a block diagram showing a schematic configuration seen from the side surface of the refrigerator 1000 including the heat control device 100 shown in FIG. 1 and the like. In FIG. 9, in addition to the heat control device 100, the heat from the refrigerating room 200 in which the room is refrigerated by the heat control device 100 and the refrigerating room 200 absorbed by the heat control device 100 is discharged outside the refrigerating room 200. The heat exhaust device 300 is shown.

In the heat control device 100, the size of the refrigerator chamber 200 and the size of the heat control device 100 in the refrigerator 1000 are usually in a trade-off relationship. That is, if the heat control device 100 can be miniaturized, the size of the refrigerator compartment 200 will increase. Since the refrigerator 1000 includes a small heat control device 100, it can be a relatively large size refrigerating room 200.

(Embodiment 8)
FIG. 10 is a block diagram showing a schematic internal configuration of a water heater 2000 including the heat control device 100 shown in FIG. 1 and the like. FIG. 10 shows, in addition to the heat control device 100, a heat source 400 that supplies heat to the heat control device 100, and a meandering flow path 500 through which water heated by the heat control device 100 passes. There is.

In the water heater 2000, the heat control device 100 is also usually arranged in the region where the flow path 500 is arranged. Therefore, if the heat control device 100 can be miniaturized, the water heater 2000 itself can be miniaturized.

(Embodiment 9)
FIG. 11 is a block diagram showing a schematic internal configuration of an indoor unit 3000 of an air conditioner including the heat control device 100 shown in FIG. 1 and the like. The indoor unit 3000 shown in FIG. 11 includes a processing chamber 3100 in which the heat exchanger 3110 and the fan 3120 are arranged, and a control chamber 3200 in which the control box 3210 and the like for controlling the rotation of the fan 3120 and the like are arranged. ..

The control box 3210 is provided with a substrate 3220 on which circuit elements 3230 such as a CPU, a capacitor, a relay, and a switching transformer are mounted. The thermal control device 100 is provided at a position corresponding to the circuit element 3230 on the substrate 3220. In this way, the circuit element 3230, which is a heat source, can be efficiently cooled.

That is, since the circuit element 3230 is not completely arranged with respect to the substrate 3220 but is partially arranged, the circuit becomes a pinpoint heat source rather than cooling the substrate 3220 as a whole. Cooling the element 3230 enhances the cooling effect. In the case of this embodiment, such measures are possible.

In the present embodiment, as examples of the electric appliances provided with the heat control device 100, home appliances such as the refrigerator 1000 shown in FIG. 9, the water heater shown in FIG. 10, and the indoor unit 3000 of the air conditioner shown in FIG. 11 are mentioned. However, in addition to these, any device that requires temperature control, such as a server computer and an electric appliance such as a water cooler, can be applied.

Further, as is known, the Peltier element can generate a temperature difference between the front and back surfaces by applying a voltage, but on the contrary, it generates electricity by applying a temperature difference to the front and back surfaces. be able to. Therefore, the heat control device 100 of the present embodiment can also be used as a generator.

It is a schematic block diagram of the thermal control device 100 of Embodiment 1 of this invention. It is an exploded view of the heat control device 100 shown in FIG. It is a schematic block diagram of the thermal control device 100 of Embodiment 2 of this invention. It is an exploded view of the heat control device 100 shown in FIG. It is a schematic block diagram of the thermal control device 100 of Embodiment 3 of this invention. It is a schematic block diagram of the thermal control device 100 of Embodiment 4 of this invention. It is a schematic block diagram of the thermal control device 100 of Embodiment 5 of this invention. It is a schematic block diagram of the thermal control device 100 of Embodiment 6 of this invention. It is a block diagram which shows the typical structure seen from the side direction of the refrigerator 1000 which includes the heat control device 100 shown in FIG. It is a block diagram which shows the typical internal structure of the water heater 2000 including the heat control device 100 shown in FIG. FIG. 3 is a block diagram showing a schematic internal configuration of an indoor unit 3000 of an air conditioner including the heat control device 100 shown in FIG. 1 and the like.

11-16 Peltier module 11a-16a Endothermic surface (first surface)
11b-16b Heat dissipation surface (second surface)
21,22 Endothermic flow path 21a One end side 21b Other end side 21c Base end 31, 32 Heat dissipation flow path 40 Heat absorption flow path connection part 50 Heat dissipation flow path connection part 100 Heat control device 200 Cooling room 300 Heat exhaust device 400 Heat source 500 Flow path 1000 Refrigerator 2000 Water heater 3000 Indoor unit 3100 Processing room 3110 Heat exchanger 3120 Fan 3200 Control room 3210 Control box 3220 Board 3230 Circuit element

Claims (7)

A plurality of Peltier effect elements having a first surface as an endothermic surface and a second surface as a heat radiating surface are arranged along the direction orthogonal to the surface direction.
A heat control device in which an endothermic flow path is arranged between the endothermic surfaces facing each other, and a heat radiation flow path is arranged between the endothermic surfaces facing each other. A connecting portion for an endothermic flow path that connects the endothermic flow paths to each other,
A heat radiating flow path connecting portion that connects the heat radiating flow paths to each other,
The thermal control device according to claim 1. The heat control device according to claim 1, wherein at least a part of the endothermic flow path and the heat dissipation flow path is formed of a vapor chamber. The thermal control device according to claim 1 and
A heat exhaust device that discharges heat from the object to be cooled that has been absorbed by the heat control device,
Cooling system including. The thermal control device according to claim 1 and
A heat source that supplies heat to the heat control device and
Including heating system. An electric appliance including the thermal control device according to claim 1. The electric appliance according to claim 6, which is any one of an air conditioner, a refrigerator, a water heater, and a water cooler.