JP2020194883A - Mounting board and electronic component module - Google Patents

Abstract

To prevent the occurrence of a Manhattan phenomenon during the mounting of an electronic component.SOLUTION: An electronic component 2 comprises: a first external connection electrode 23 and a second external connection electrode 24. On a mounting board 1, the shortest distance G1 between a first land 13 and a second land 14 is sorter than the length L2 of a long side of the electronic component 2. The first land 13 includes a first main part 131 and a first wide part 132. The first main part 131 at least partially overlaps the first external connection electrode 23 in plan view. The first wide part 132 extends from the first main part 131 toward the opposite side of the second land 14 and is wider than the first main part 131. The second land 14 includes a second main part 141 and a second wide part 142. The second main part 141 at least partially overlaps the second external connection electrode 24 in plan view. The second wide part 142 extends from the second main part 141 toward the opposite side of the first land 13 and is wider than the second main part 141.SELECTED DRAWING: Figure 1

Description

The present disclosure generally relates to a mounting board and an electronic component module, and more particularly to a mounting board on which an electronic component can be surface-mounted and an electronic component module including the mounting board.

Conventionally, terminal electrodes (external connection electrodes) provided at both ends of a ceramic sintered body (electronic component body) are mounted by soldering on a pair of wiring patterns (lands) of an external circuit board (mounting board). A mounting structure for electronic components is known (Patent Document 1).

Japanese Unexamined Patent Publication No. 11-17308

In a mounting board such as a circuit board, as the chip size of an electronic component becomes smaller, a state in which the electronic component stands up on one of the lands of a pair of lands corresponding to the electronic component during reflow for surface mounting. Manhattan Phenomenon, which is soldered in, is more likely to occur.

An object of the present disclosure is to provide a mounting board and an electronic component module capable of suppressing the occurrence of the Manhattan phenomenon when mounting an electronic component.

In one aspect of the mounting substrate according to the present disclosure, electronic components can be surface-mounted. The electronic component includes an electronic component body, a first external connection electrode, and a second external connection electrode. The electronic component body has a rectangular parallelepiped shape. The first external connection electrode is provided at the first end in the longitudinal direction of the electronic component body. The second external connection electrode is provided at the second end in the longitudinal direction of the electronic component body. The mounting board includes a support, a first land, and a second land. The support has a front surface and a back surface, and has electrical insulation. The first land is provided on the surface of the support. The first external connection electrode is joined to the first land by soldering. The second land is provided on the surface of the support. The second external connection electrode is joined to the second land by soldering. The shortest distance between the first land and the second land is shorter than the length of the long side of the electronic component. The first land includes a first main portion and a first wide portion. The first main portion overlaps at least a part of the first external connection electrode in a plan view. The first wide portion extends from the first main portion to the side opposite to the second land side and is wider than the first main portion. The second land includes a second main portion and a second wide portion. The second main portion overlaps at least a part of the second external connection electrode in a plan view. The second wide portion extends from the second main portion to the side opposite to the first land side and is wider than the second main portion.

One aspect of the electronic component module according to the present disclosure includes the mounting board and the electronic component. The electronic component is surface-mounted on the mounting substrate.

One aspect of the electronic component module according to the present disclosure includes an electronic component and a mounting board. The electronic component is surface-mounted on the mounting substrate. The electronic component includes an electronic component body, a first external connection electrode, and a second external connection electrode. The electronic component body has a rectangular parallelepiped shape. The first external connection electrode is provided at the first end in the longitudinal direction of the electronic component body. The second external connection electrode is provided at the second end in the longitudinal direction of the electronic component body. The mounting board includes a support, a first land, and a second land. The support has a front surface and a back surface, and has electrical insulation. The first land is provided on the surface of the support. The first external connection electrode is joined to the first land by soldering. The second land is provided on the surface of the support. The second external connection electrode is joined to the second land by soldering. The shortest distance between the first land and the second land is shorter than the length of the long side of the electronic component. The first land includes a first main portion and a first wide portion. The first main portion overlaps at least a part of the first external connection electrode in a plan view. The first wide portion extends from the first main portion to the side opposite to the second land side and is wider than the first main portion. The second land includes a second main portion and a second wide portion. The second main portion overlaps at least a part of the second external connection electrode in a plan view. The second wide portion extends from the second main portion to the side opposite to the first land side and is wider than the second main portion. Between the first external connection electrode and the first land, there is a first joint portion containing solder that joins the first external connection electrode and the first land. There is a second joint portion containing solder that joins the second external connection electrode and the second land between the second external connection electrode and the second land.

In the mounting board and the electronic component module of the present disclosure, it is possible to suppress the occurrence of the Manhattan phenomenon when mounting the electronic component.

FIG. 1 is a plan view of an electronic component module including a mounting board according to an embodiment. FIG. 2 is a cross-sectional view of an electronic component module provided with the same mounting board. FIG. 3 is a plan view of the same mounting board. FIG. 4 is a perspective view of an electronic component surface-mounted on the same mounting substrate. FIG. 5 is a plan view of the mounting substrate in which cream solder is printed on the first land and the second land. FIG. 6 is a plan view of a multi-layer board including a plurality of the same mounting boards. FIG. 7 is a plan view of the mounting substrate according to the first modification of the embodiment. FIG. 8 is a plan view of the mounting board according to the second modification of the embodiment.

FIGS. 1 to 8 described in the following embodiments and the like are schematic views, and the ratio of the size and the thickness of each component in the figure does not necessarily reflect the actual dimensional ratio. Absent.

(Embodiment)
Hereinafter, the mounting board 1 of the present embodiment and the electronic component module 3 including the mounting board 1 will be described with reference to FIGS. 1 to 6.

(1) Outline The mounting board 1 can surface mount the electronic component 2. The electronic component module 3 includes a mounting board 1 and an electronic component 2 surface-mounted on the mounting board 1.

As shown in FIGS. 1, 2 and 4, the electronic component 2 includes an electronic component main body 20, a first external connection electrode 23, and a second external connection electrode 24. The electronic component body 20 has a rectangular parallelepiped shape. The first external connection electrode 23 is provided at the first end 21 in the longitudinal direction of the electronic component main body 20. The second external connection electrode 24 is provided at the second end 22 in the longitudinal direction of the electronic component main body 20. The electronic component 2 is, for example, a chip-type electronic component having a long side length L2 of 0.6 mm and a short side length W2 of 0.3 mm. In other words, the electronic component 2 is, for example, a chip-type electronic component having an external size of 0603 (0.6 mm × 0.3 mm) in a plan view. Here, the electronic component 2 is, for example, a chip monolithic ceramic capacitor. In this case, the electronic component body 20 includes a plurality of dielectric layers and a plurality of internal electrodes.

As shown in FIGS. 1 to 3, the mounting board 1 includes a support 10, a first land (Land) 13, and a second land 14.

The support 10 has a front surface 11 and a back surface 12. The front surface 11 and the back surface 12 are separated in the thickness direction of the mounting substrate 1 and intersect with each other in the thickness direction of the mounting substrate 1. The front surface 11 and the back surface 12 of the support 10 are orthogonal to, for example, the thickness direction of the mounting substrate 1. The support 10 has electrical insulation.

The first land 13 is provided on the surface 11 of the support 10. The first external connection electrode 23 is joined to the first land 13 by soldering. The second land 14 is provided on the surface 11 of the support 10. The second external connection electrode 24 is joined to the second land 14 by soldering.

As shown in FIGS. 1 to 3, the mounting board 1 further includes a first wiring unit 15, a second wiring unit 16, and a resist layer 17. The first wiring portion 15 is connected to the first land 13. The second wiring portion 16 is connected to the second land 14. The resist layer 17 covers a part 152 of the first wiring part 15 and a part 162 of the second wiring part 16 on the surface 11 side of the support 10. In FIGS. 1 and 3, dot hatching is attached to the resist layer 17, but the dot hatching does not represent a cross section. The hatching of the dots includes the resist layer 17 and the components other than the resist layer 17 (support 10, first land 13, second land 14, first wiring portion 15, second wiring portion 16, etc.) in the mounting substrate 1. It is only attached to make it easier to understand the relationship between.

(2) Details of Mounting Board and Electronic Component Module In the following, for convenience of explanation, the thickness direction of the mounting board 1 is set to the first direction D1, and one set of first lands 13 and 1st land used for mounting the electronic component 2 The direction in which the two lands 14 are aligned may be referred to as the second direction D2, and the direction orthogonal to the first direction D1 and the second direction D2 may be described as the third direction D3. When a plurality of electronic components 2 are mounted on the mounting board 1, the mounting board 1 includes a plurality of sets of the first land 13 and the second land 14 so as to correspond to the plurality of electronic components 2. A second direction D2 and a third direction D3 are defined for each set of.

The mounting board 1 is, for example, a printed wiring board, and more specifically, a single-sided printed wiring board. The single-sided printed wiring board is formed by, for example, patterning the copper foil of a single-sided copper-clad laminate that meets the CEM-3 (Composite Epoxy Materials-3) standard, FR-4 standard, FR-5 standard, and the like. ing. The outer size of the mounting substrate 1 in the plan view is larger than the outer size of the electronic component 2 in the plan view. In the present specification, the plan view means the plan view from the thickness direction of the mounting substrate 1, but may also mean the plan view from the thickness direction of the support 10.

The mounting board 1 includes a support 10, a first land 13, and a second land 14.

The support 10 has a flat plate shape and has a front surface 11 and a back surface 12. Further, the support 10 has electrical insulation. The support 10 is composed of an insulating substrate in a printed wiring board. The support 10 contains, for example, a resin. The support 10 contains, for example, a kind of material selected from the group of epoxy resin, phenol resin, polyimide resin and acrylic resin as the resin. Further, in addition to the resin, the support 10 includes, for example, at least one kind of base material selected from the group of paper, glass cloth, glass non-woven fabric and synthetic fiber cloth.

The first land 13 and the second land 14 are made of copper foil on an insulating substrate in a printed wiring board. Therefore, the materials of the first land 13 and the second land 14 include copper. The first land 13 and the second land 14 are conductor portions for connecting the first external connection electrode 23 and the second external connection electrode 24 of the electronic component 2, and have conductivity.

The first land 13 and the second land 14 are provided on the surface 11 of the support 10. As a result, the support 10 supports the first land 13 and the second land 14. The first land 13 and the second land 14 used for mounting one electronic component 2 are mounting areas for mounting the one electronic component 2, and are arranged so as to be arranged in one direction (second direction D2). ing.

In the electronic component module 3 (see FIGS. 1 and 2), the first land 13 faces the first external connection electrode 23 of the electronic component 2 in the thickness direction of the mounting substrate 1. Further, the second land 14 faces the second external connection electrode 24 of the electronic component 2 in the thickness direction of the mounting substrate 1.

The first land 13 and the second land 14 are separated from each other so as to secure a predetermined electrical insulation distance in the second direction D2.

In the mounting board 1, the shortest distance G1 (for example, 0.3 mm) between the first land 13 and the second land 14 is shorter than the length L2 (for example, 0.6 mm) of the long side of the electronic component 2.

The first land 13 includes a first main portion 131 and a first wide portion 132. The first main portion 131 overlaps at least a part of the first external connection electrode 23 in a plan view. The first wide portion 132 extends from the first main portion 131 to the side opposite to the second land 14 side and is wider than the first main portion 131. Here, the width W11 of the first main portion 131 is the width in the third direction D3. Further, the width W12 of the first wide portion 132 is the width in the third direction D3, and is a direction orthogonal to the thickness direction of the mounting substrate 1 and the direction in which the first wide portion 132 extends from the first main portion 131. The width of.

The width W12 of the first wide portion 132 is about twice to 2.5 times the width W11 of the first main portion 131. As an example, in the first land 13, the width W12 is 0.7 mm and the width W11 is 0.35 mm.

The plan view shape of the first main portion 131 is, for example, a square shape. Further, the plan view shape of the first wide portion 132 is, for example, a rectangular shape having the third direction D3 as the longitudinal direction. That is, the first wide portion 132 has a rectangular shape that is long in the width direction. In the first land 13, in a plan view, the central portion of one of the four sides of the first wide portion 132 and one of the four sides of the first main portion 131 are common. Here, the plan view shape of the first land 13 is T-shaped.

The length L11 (for example, 0.35 mm) of the first main portion 131 in the second direction D2 is the same as, for example, the length L12 (for example, 0.35 mm) of the first wide portion 132 in the second direction D2. .. Therefore, the area of the first wide portion 132 in a plan view is larger than the area of the first main portion 131.

The second land 14 includes a second main portion 141 and a second wide portion 142. The second main portion 141 overlaps at least a part of the second external connection electrode 24 in a plan view. The second wide portion 142 extends from the second main portion 141 to the side opposite to the first land 13 side, and is wider than the second main portion 141. Here, the width W21 of the second main portion 141 is the width in the third direction D3. Further, the width W22 of the second wide portion 142 is the width in the third direction D3, and is a direction orthogonal to the thickness direction of the mounting substrate 1 and the extending direction of the second wide portion 142 from the second main portion 141. The width of.

The width W22 of the second wide portion 142 is about twice to 2.5 times the width W21 of the second main portion 141. As an example, in the second land 14, the width W22 is 0.7 mm and the width W21 is 0.35 mm.

The plan view shape of the second main portion 141 is, for example, a square shape. The plan view shape of the second wide portion 142 is, for example, a rectangular shape with the third direction D3 as the longitudinal direction. That is, the second wide portion 142 has a rectangular shape that is long in the width direction. In the second land 14, in a plan view, the central portion of one of the four sides of the second wide portion 142 and one of the four sides of the second main portion 141 are common. Here, the plan view shape of the second land 14 is T-shaped.

The length L21 (for example, 0.35 mm) of the second main portion 141 in the second direction D2 is the same as, for example, the length L22 (for example, 0.35 mm) of the second wide portion 142 in the second direction D2. .. Therefore, the area of the second wide portion 142 in a plan view is larger than the area of the second main portion 141.

In the mounting board 1, the first land 13 and the second land 14 are arranged so that the electronic component 2 and the first wide portion 132 and the second wide portion 142 do not overlap.

In the mounting substrate 1, it is preferable that the first land 13 and the second land 14 have the same shape in a plan view from the viewpoint of mounting the electronic component 2 with higher accuracy. Further, in the mounting board 1, from the viewpoint of mounting the electronic component 2 with higher accuracy, the first land 13 and the second land 14 connect the first land 13 and the second land 14 with the shortest distance in a plan view. It is preferable that the line is symmetrical with respect to the perpendicular bisector V1 of one straight line M1. Further, in the mounting substrate 1, from the viewpoint of mounting the electronic component 2 with higher accuracy, the first land 13 and the second land 14 include the one straight line M1 and the first land 13 and the second land 14 in a plan view. It is preferable that the line is symmetrical with respect to the straight line intersecting 14.

In the mounting board 1, the first land has a rotational symmetry twice so that the mounting region including the first land 13 and the second land 14 has a normal rotation center axis passing through the center of the mounting region in a plan view. Land 13 and second land 14 are arranged.

In the mounting board 1, the width W11 of the first main portion 131 is a size corresponding to the width W23 of the first external connection electrode 23 from the viewpoint of mounting the electronic component 2 with higher accuracy, and the width of the second main portion 141. It is preferable that W21 has a size corresponding to the width W24 of the second external connection electrode 24.

The "size corresponding to the width W23 of the first external connection electrode 23" means a length substantially the same as the width W23 of the first external connection electrode 23. Here, the "substantially the same length" means the same length as the width W23 of the first external connection electrode 23, a length slightly shorter than the same length as the width W23 of the first external connection electrode 23, and a slightly longer length. Including length. Here, the "slightly short length" is preferably 80% or more of the width W23 of the first external connection electrode 23, more preferably 90% or more, and 95% or more. It is more preferably the length of. Here, the "slightly long length" is preferably a length of 135% or less of the width W23 of the first external connection electrode 23, and more preferably 120% or less. In the mounting board 1, the width W11 of the first main portion 131 is set to a size corresponding to the width W23 of the first external connection electrode 23, and the width W21 of the second main portion 141 is set to the width W24 of the second external connection electrode 24. By making the size equivalent, it is possible to mount the electronic component 2 with higher accuracy, and it is possible to further suppress the misalignment of the electronic component 2. In the mounting substrate 1, the width W11 of the first main portion 131 is more preferably the same size as the width W23 of the first external connection electrode 23 from the viewpoint of mounting the electronic component 2 with higher accuracy. As a result, the electronic component 2 can be mounted more accurately on the mounting board 1, and the misalignment of the electronic component 2 can be further suppressed.

The "size corresponding to the width W24 of the second external connection electrode 24" means a length substantially the same as the width W24 of the second external connection electrode 24. Here, the "substantially the same length" means the same length as the width W24 of the second external connection electrode 24, a length slightly shorter than the same length as the width W24 of the second external connection electrode 24, and a slightly longer length. Including length. Here, the "slightly short length" is preferably 80% or more of the width W24 of the second external connection electrode 24, more preferably 90% or more, and 95% or more. It is more preferably the length of. Here, the "slightly long length" is preferably a length of 135% or less of the width W24 of the second external connection electrode 24, and more preferably 120% or less. In the mounting substrate 1, the width W21 of the second main portion 141 is more preferably the same size as the width W24 of the second external connection electrode 24 from the viewpoint of mounting the electronic component 2 with higher accuracy.

As described above, the mounting board 1 includes a first wiring unit 15, a second wiring unit 16, and a resist layer 17. The first wiring portion 15, the second wiring portion 16, and the resist layer 17 are supported by the support 10.

The first wiring portion 15 is connected to the first wide portion 132 of the first land 13. As a result, the first wiring portion 15 is electrically connected to the first land 13. The first wiring portion 15 and the first land 13 are integrally formed. In the first wiring portion 15, the wiring width W15 at the end portion 151 connected to the first wide portion 132 is narrower than the width W12 of the first wide portion 132. The wiring width W15 is narrower than the width W11 of the first main portion 131, but is not limited to this, and may be wider than the width W11 of the first main portion 131. The first wiring portion 15 extends from a side of the four sides of the rectangular first wide portion 132 that faces the side connected to the first main portion 131, but is not limited to this, and the first main portion 131 is not limited to this. It may extend from the side adjacent to the side connected to.

The second wiring portion 16 is connected to the second wide portion 142 of the second land 14. As a result, the second wiring portion 16 is electrically connected to the second land 14. The second wiring portion 16 and the second land 14 are integrally formed. In the second wiring portion 16, the wiring width W16 at the end portion 161 connected to the second wide portion 142 is narrower than the width W22 of the second wide portion 142. The wiring width W16 is narrower than the width W21 of the second main portion 141, but is not limited to this, and may be wider than the width W21 of the second main portion 141. The second wiring portion 16 extends from a side of the four sides of the rectangular second wide portion 142 that faces the side connected to the second main portion 141, but is not limited to this, and the second main portion 141 is not limited to this. It may extend from the side adjacent to the side connected to.

The resist layer 17 covers a part 152 of the first wiring part 15 and a part 162 of the second wiring part 16 on the surface 11 side of the support 10. The resist layer 17 is, for example, a solder resist layer. Therefore, in the mounting substrate 1, the solder wettability of the resist layer 17 is lower than the solder wettability of the first land 13 and the second land 14. The material of the resist layer 17 contains a resin. The resist layer 17 has an opening 171 that exposes the first land 13 and the second land 14. The outer peripheral edges of the first land 13 and the second land 14 and the resist layer 17 are separated from each other. As a result, in the mounting board 1, the end portion 151 of the first wiring portion 15 and the end portion 161 of the second wiring portion 16 are exposed.

The opening shape of the opening 171 of the resist layer 17 is a rectangular shape whose longitudinal direction is the direction in which the first land 13 and the second land 14 are arranged (second direction D2). The length L171 of the opening 171 in the second direction D2 includes the length L13 of the first land 13 in the second direction D2, the length L14 of the second land 14 in the second direction D2, and the first land 13 and the first land. The shortest distance G1 between the two lands 14 and the shortest distance G13 between the first land 13 and the resist layer 17 in the second direction D2, and the shortest distance G14 between the second land 14 and the resist layer 17 in the second direction D2. Is equal to the total length of. The length L172 of the opening 171 in the third direction D3 is 2 of the width W12 of the first wide portion 132 in the third direction D3 and the shortest distance G23 between the first wide portion 132 and the resist layer 17 in the third direction D3. Equal to the total length with double the length. Further, the length L172 of the opening 171 in the third direction D3 is the shortest distance G24 between the width W22 of the second wide portion 142 in the third direction D3 and the second wide portion 142 and the resist layer 17 in the third direction D3. Is equal to the total length with twice the length of.

In the electronic component module 3, the first land 13 of the mounting board 1 and the first external connection electrode 23 of the electronic component 2 are joined by soldering. Therefore, in the electronic component module 3, the solder that joins the first external connection electrode 23 and the first land 13 between the first external connection electrode 23 of the electronic component 2 and the first land 13 of the mounting substrate 1. There is a first joint 41 made of.

Further, in the electronic component module 3, the second land 14 of the mounting board 1 and the second external connection electrode 24 of the electronic component 2 are joined by soldering. Therefore, in the electronic component module 3, the solder that joins the second external connection electrode 24 and the second land 14 between the second external connection electrode 24 of the electronic component 2 and the second land 14 of the mounting board 1. There is a second joint 42 made of.

Each of the first joint portion 41 and the second joint portion 42 is formed by solidifying molten cream solder (hereinafter referred to as "molten solder"). The solder is, for example, SnAgCu.

A portion of the first joint portion 41 between the side surface of the first external connection electrode 23 of the electronic component 2 and the first wide portion 132 constitutes a first fillet 411. The first fillet 411 is a solder fillet. Further, a portion of the second joint portion 42 between the side surface of the second external connection electrode 24 of the electronic component 2 and the second wide portion 142 constitutes the second fillet 421. The second fillet 421 is a solder fillet.

Hereinafter, the manufacturing method of the electronic component module 3 will be described with reference to FIG.

When manufacturing the electronic component module 3, as shown in FIG. 5, cream solder (Solder Paste) 51 and 52 are applied (printed) on the entire surface of each of the first land 13 and the second land 14 of the mounting substrate 1. After that, the electronic component 2 is placed at a predetermined position on the mounting board 1 (the first external connection electrode 23 is arranged on the first land 13 via the cream solder 51, and the second external connection electrode 24 is cream soldered. (Placed on the second land 14 via 52). In FIG. 5, dots are hatched in the regions where the cream solders 51 and 52 are applied in the first land 13 and the second land 14, respectively. These hatchings are provided only to make it easier to understand the areas where the cream solders 51 and 52 are applied in the first land 13 and the second land 14, respectively, and are not hatches representing a cross section. The hatched area is determined by the shape of the holes in the metal mask used when applying the cream solder. The metal mask is also called a metal stencil. "Applying cream solder to the entire surface of each of the first land 13 and the second land 14" means that the plan-view shapes of the applied cream solders 51 and 52 are the same as those of the first land 13 and the second land 14. It means that the cream solders 51 and 52 are applied so as to be.

After placing the electronic component 2 on the mounting substrate 1 as described above, for example, the cream solder is melted by passing it through a reflow furnace (reflow tank) to solder the electronic component 2. In short, in the method of manufacturing the electronic component module 3, the electronic component 2 is surface-mounted by reflow soldering. Each of the first joint portion 41 and the second joint portion 42 is formed by solidifying the molten solder. In the method of manufacturing the electronic component module 3, a hot plate may be used instead of the reflow furnace.

In the electronic component module 3, since the first land 13 uses the mounting board 1 including the first wide portion 132 and the second land 14 includes the second wide portion 142, the first land 13 is used when the electronic component module 3 is manufactured. It is possible to more reliably form the first fillet 411 and the second fillet 421 at the joint portion 41 and the second joint portion 42, respectively. As a result, in the electronic component module 3, it is possible to improve the inspection accuracy of the visual inspection of the first joint portion 41 and the second joint portion 42. Here, the visual inspection includes, for example, a visual inspection, a visual inspection using an optical microscope, a visual inspection using an imaging device and an image processing device, and the like.

Further, in the electronic component module 3, since the first land 13 uses the mounting board 1 including the first wide portion 132 and the second land 14 includes the second wide portion 142, the first wide portion 132 and the second land 14 are used. Compared with the case where the wide portion 142 is not provided, the difference between the timing at which the solder on the first land 13 solidifies and the timing at which the molten solder on the second land 14 solidifies can be reduced, and the Manhattan phenomenon occurs when the electronic component 2 is mounted. It is possible to suppress the occurrence. Therefore, in the electronic component module 3, it is possible to improve the manufacturing yield.

Further, in the electronic component module 3, since the mounting board 1 having the first wide portion 132 and the second wide portion 142 is used, the pins for the continuity test are used in each of the first joint portion 41 and the second joint portion 42. Since the area where the module can be erected can be widened, it is possible to use a pin having a larger diameter as a pin for a continuity test after mounting the electronic component 2. Further, the first wide portion 132 and the second wide portion 142 of the mounting substrate 1 can be used as at least a part of the pin-raising area in the continuity test before mounting the electronic component 2. Therefore, it is possible to use a pin having a larger diameter as a pin for a continuity test of the mounting substrate 1 before mounting the electronic component 2.

In the mounting board 1, the width W12 of the first wide portion 132 and the width W22 of the second wide portion 142 are longer than the length of the short side of the electronic component having an external size of 1005 (1.0 mm × 0.5 mm), and are the first. The shortest distance between the 1 wide portion 132 and the 2nd wide portion 142 is shorter than the length of the long side of the electronic component having an external size of 1005. Therefore, on the mounting substrate 1, it is possible to mount an electronic component having an external size of 1005 instead of the electronic component 2 having an external size of 0603 (0.6 mm × 0.3 mm).

By the way, at the time of manufacturing the electronic component module 3, as shown in FIG. 6, a large number of mounting boards 100 having a plurality of mounting boards 1 and capable of taking a large number of mounting boards 1 are prepared. The multi-layer board 100 shown in FIG. 6 includes three board blocks 101 in which four mounting boards 1 are arranged in a row, and the three board blocks 101 are connected to two selvage portions 103. Separation grooves 105 are provided on the front surface and the back surface of the multi-layer board 100 at the boundary between the adjacent mounting boards 1 in the board block 101 and the boundary between the mounting board 1 located at the end of the board block 101 and the ear portion 103. It is formed.

After preparing the multi-cavity board 100, a plurality of electronic components including the electronic component 2 are mounted on each of the plurality of mounting substrates 1 of the multi-cavity substrate 100. After that, a plurality of electronic component modules 3 are obtained by dividing the multi-layer board 100 along the separation groove 105. Here, in the mounting substrate 1, since the first land 13 and the second land 14 include the first wide portion 132 and the second wide portion 142, respectively, the multi-layer board 100 is divided along the separation groove 105. Occasionally, the stress applied to the electronic component 2 can be reduced as compared with the case where the first land 13 and the second land 14 do not include the first wide portion 132 and the second wide portion 142, respectively. Thereby, for example, when the electronic component 2 is a chip monolithic ceramic capacitor, damage to the internal electrodes can be prevented.

(3) Application Example of Electronic Component Module In the following, as an application example of the electronic component module 3, a smoke detector including the electronic component module 3 will be illustrated, but the electronic component module 3 is also applied to devices other than the smoke detector. it can.

The smoke detector includes a housing for accommodating the electronic component module 3. The smoke detector is a photoelectric smoke detector, and has a smoke sensing space in which smoke from the outside can enter and exit.

The electronic component module 3 includes a mounting board 1 and a plurality of electronic components including the electronic component 2. The plurality of electronic components are mounted on the mounting board 1. The plurality of electronic components include a light emitting element and a light receiving element. The light emitting element emits light into the smoke sensing space. The light receiving element is arranged at a position where the direct light from the light emitting element is not incident and the light (scattered light) emitted from the light emitting element and scattered by the smoke (smoke particles) in the smoke sensing space is incident. As a result, the light receiving element does not receive the light radiated from the light emitting element when there is no smoke in the smoke sensing space, and the light receiving element is radiated from the light emitting element when smoke is present in the smoke sensing space. Receives light scattered by smoke. Therefore, the smoke detector can detect the smoke existing in the smoke sensing space depending on the light receiving state of the light receiving element.

Further, the electronic component module 3 includes a control circuit composed of a group of electronic components among a plurality of electronic components. Here, the group of electronic components includes the electronic component 2. The control circuit is a circuit that controls the light emitting element, the light receiving element, and the like, and at least drives the light emitting element and executes signal processing on the output signal of the light receiving element. In signal processing, the electronic component module 3 determines the presence or absence of smoke in the smoke sensing space by comparing the amount of light received by the light receiving element (magnitude of the output signal) with the threshold value. The amount of light received by the light receiving element varies depending on, for example, the concentration of smoke in the smoke sensing space and the type of smoke (white smoke, black smoke, etc.). Therefore, the electronic component module 3 determines that there is "smoke" when smoke having a certain concentration or higher is present in the smoke sensing space by comparing the magnitude of the output signal of the light receiving element with the threshold value.

(4) Modifications The above embodiment is only one of the various embodiments of the present disclosure. The above-described embodiment can be changed in various ways depending on the design and the like as long as the object of the present disclosure can be achieved.

FIG. 7 is a plan view of the mounting substrate 1a according to the first modification of the embodiment. Regarding the mounting board 1a according to the first modification, the same components as those of the mounting board 1 according to the embodiment are designated by the same reference numerals, and the description thereof will be omitted.

The mounting board 1a according to the first modification includes a first land 13a and a second land 14a in place of the first land 13 and the second land 14 of the mounting board 1 according to the embodiment.

In the mounting substrate 1a according to the first modification, the first land 13a includes the first main portion 131 and the first wide portion 132. In the first land 13a, the first main portion 131 is connected to the first wide portion 132 on one end side (upper end side in FIG. 7) of the first wide portion 132 in the width direction.

Further, in the mounting substrate 1a according to the first modification, the second land 14a includes the second main portion 141 and the second wide portion 142. In the second land 14a, the second main portion 141 is connected to the second wide portion 142 on one end side (upper end side in FIG. 7) of the second wide portion 142 in the width direction.

FIG. 8 is a plan view of the mounting substrate 1b according to the second modification of the embodiment. Regarding the mounting board 1b according to the second modification, the same components as those of the mounting board 1 according to the embodiment are designated by the same reference numerals, and the description thereof will be omitted.

The mounting board 1b according to the second modification includes a first land 13b and a second land 14b instead of the first land 13 and the second land 14 of the mounting board 1 according to the embodiment.

In the mounting substrate 1b according to the second modification, the first land 13b includes the first main portion 131 and the first wide portion 132. In the first land 13b, the first main portion 131 is connected to the first wide portion 132 on one end side (lower end side in FIG. 8) of the first wide portion 132 in the width direction. The first land 13b has the first main portion 131 opposite to the first main portion 131 of the first land 13a of the mounting substrate 1a according to the first modification in the width direction W12 of the first wide portion 132.

Further, in the mounting substrate 1b according to the second modification, the second land 14b includes the second main portion 141 and the second wide portion 142. In the second land 14b, the second main portion 141 is connected to the second wide portion 142 on one end side (lower end side in FIG. 8) of the second wide portion 142 in the width direction. The second land 14b has a second main portion 141 opposite to that of the first main portion 131 of the second land 14a of the mounting substrate 1a according to the first modification in the width direction W22 of the second wide portion 142.

(5) Other Modifications For example, the method of forming the conductor pattern including the first land 13, the second land 14, the first wiring portion 15 and the second wiring portion 16 on the mounting substrate 1 is a method using a printing method. However, the method is not limited to this, and for example, a method using a photographic method, an additive method, or the like may be used.

Further, the mounting board 1 is not limited to the single-sided printed wiring board, and may be a double-sided printed wiring board. Further, in the mounting board 1, when each of the first land 13, the second land 14, the end portion 151 of the first wiring portion 15, and the end portion 161 of the second wiring portion 16 is composed of only copper plating. Not limited to this, for example, a copper foil and a plating layer on the copper foil may be included. The plating layer is not limited to having a single-layer structure, and may have a multi-layer structure.

Further, in the mounting board 1, the first land 13 and the second land 14 are set as one set, but the present invention is not limited to this, and one set may be a set depending on the number, shape, etc. of the external connection electrodes in the electronic component 2. Lands other than the 1st land 13 and the 2nd land 14 may be further provided.

Further, the resist layer 17 is not limited to the case where the resist layer 17 has an opening 171 that exposes the first land 13 and the second land 14, and for example, from the first opening that exposes the first land 13 and the first opening. It may have a second opening that is separated and exposes the second land 14.

Further, the number of the first wiring portions 15 connected to the first land 13 is not limited to one, and may be a plurality. Further, the number of the second wiring portions 16 connected to the second land 14 is not limited to one, and may be a plurality. Further, the mounting substrate 1 may have a conductor portion other than the first wiring portion 15 as a conductor portion connected to the first land 13 in a plan view. Further, the mounting substrate 1 may have a conductor portion other than the second wiring portion 16 as a conductor portion connected to the second land 14 in a plan view.

Further, in the first wiring portion 15 connected to the first land 13, the wiring width W15 at the end portion 151 connected to the first wide portion 132 may be wider than the width W12 of the first wide portion 132. Further, in the second wiring portion 16 connected to the second land 14, the wiring width W16 at the end portion 161 connected to the second wide portion 142 may be wider than the width W22 of the second wide portion 142.

Further, the first wiring portion 15 connected to the first land 13 may be connected to the first wide portion 132 across a plurality of sides of the first wide portion 132. Further, the second wiring portion 16 connected to the second land 14 may be connected to the second wide portion 142 across a plurality of sides of the second wide portion 142.

Further, the mounting board 1 may be configured so that at least one electronic component 2 can be surface-mounted, and a plurality of electronic components 2 may be surface-mounted.

Further, the mounting board 1 is not limited to the printed wiring board, and may be, for example, a ceramic board. Further, the printed wiring board may be a metal-based printed wiring board.

The external size of the electronic component 2 in a plan view is not limited to 0603 (0.6 mm × 0.3 mm), and is, for example, 0402 (0.4 mm × 0.2 mm) and 1005 (1.0 mm × 0.5 mm). ) Etc. may be used. In the mounting board 1, the dimensions of the first land 13 and the second land 14 may be determined based on the outer size of the electronic component 2.

Further, the electronic component 2 is not limited to the chip multilayer ceramic capacitor, and may be, for example, a chip capacitor other than the chip multilayer ceramic capacitor, a chip resistor, a chip inductor, an LED (Light Emitting Diode), or the like.

Further, the solder supplied on the surfaces of the first land 13 and the second land 14 is not limited to cream solder, and may be, for example, molded pellet-shaped solder. Further, the solder is preferably lead-free solder, and in addition to the above-mentioned SnCuAg, for example, AuSn or the like can be adopted.

Further, in the manufacturing method of the electronic component module 3, when the cream solder is applied to the mounting substrate 1a, even if the cream solder is applied to a region slightly narrower than the entire surface of each of the first land 13 and the second land 14. Good. Here, when the cream solder is applied, the cream solder is applied to the entire surface of the first main portion 131 of the first land 13 and a part of the surface of the first wide portion 132 with respect to the first land 13. Apply. For the second land 14, cream solder is applied to the entire surface of the second main portion 141 of the second land 14 and a part of the surface of the second wide portion 142.

(Aspect)
From the embodiments described above, the following aspects are disclosed in the present specification.

The mounting substrate (1; 1a; 1b) according to the first aspect can surface mount the electronic component (2). The electronic component (2) includes an electronic component main body (20), a first external connection electrode (23), and a second external connection electrode (24). The electronic component body (20) has a rectangular parallelepiped shape. The first external connection electrode (23) is provided at the first end (21) in the longitudinal direction of the electronic component body (20). The second external connection electrode (24) is provided at the second end (22) in the longitudinal direction of the electronic component body (20). The mounting board (1; 1a; 1b) includes a support (10), a first land (13), and a second land (14). The support (10) has a front surface (11) and a back surface (12), and has electrical insulation. The first land (13) is provided on the surface (11) of the support (10). The first external connection electrode (23) is joined to the first land (13) by soldering. The second land (14) is provided on the surface (11) of the support (10). A second external connection electrode (24) is joined to the second land (14) by soldering. The shortest distance between the first land (13) and the second land (14) is shorter than the length (L2) of the long side of the electronic component (2). The first land (13) includes a first main portion (131) and a first wide portion (132). The first main portion (131) overlaps at least a part of the first external connection electrode (23) in a plan view. The first wide portion (132) extends from the first main portion (131) to the side opposite to the second land (14) side and is wider than the first main portion (131). The second land (14) includes a second main portion (141) and a second wide portion (142). The second main portion (141) overlaps at least a part of the second external connection electrode (24) in a plan view. The second wide portion (142) extends from the second main portion (141) to the side opposite to the first land (13) side, and is wider than the second main portion (141).

In the mounting substrate (1; 1a; 1b) according to the first aspect, it is possible to suppress the occurrence of the Manhattan phenomenon when the electronic component (2) is mounted.

In the mounting substrate (1; 1a; 1b) according to the second aspect, in the first aspect, the width (W11) of the first main portion (131) is the width (W23) of the first external connection electrode (23). It is a size equivalent to. The width (W21) of the second main portion (141) is a size corresponding to the width (W24) of the second external connection electrode (24).

On the mounting substrate (1; 1a; 1b) according to the second aspect, the electronic component (2) can be mounted more accurately.

In the mounting substrate (1; 1a; 1b) according to the third aspect, in the second aspect, the width (W11) of the first main portion (131) is the width (W23) of the first external connection electrode (23). Is the same size as. The width (W21) of the second main portion (141) is the same size as the width (W24) of the second external connection electrode (24).

On the mounting substrate (1; 1a; 1b) according to the third aspect, the electronic component (2) can be mounted with higher accuracy.

The mounting substrate (1; 1a; 1b) according to the fourth aspect has the first land (13) and the second land (14) in any one of the first to third aspects in a plan view. It is axisymmetric with respect to the perpendicular bisector (V1) of one straight line (M1) connecting the first land (13) and the second land (14) at the shortest distance.

On the mounting substrate (1; 1a; 1b) according to the fourth aspect, the electronic component (2) can be mounted with high accuracy.

In the mounting substrate (1; 1a; 1b) according to the fifth aspect, in the fourth aspect, the first land (13) and the second land (14) have the same shape in a plan view.

In the mounting substrate (1; 1a; 1b) according to the fifth aspect, it becomes easier to suppress the occurrence of the Manhattan phenomenon when the electronic component (2) is mounted, and the electronic component (2) is mounted more accurately. Is possible.

In the mounting substrate (1; 1a; 1b) according to the sixth aspect, in the fourth or fifth aspect, in the plan view, the first land (13) and the second land (14) are one straight line (M1). ) Is included and is line symmetric with respect to the straight line intersecting the first land (13) and the second land (14).

The mounting board (1; 1a; 1b) according to the sixth aspect can mount the electronic component (2) with higher accuracy.

In the mounting substrate (1; 1a; 1b) according to the seventh aspect, in any one of the first to sixth aspects, the first wiring portion (15), the second wiring portion (16), and the resist layer (17) and is further provided. The first wiring portion (15) is connected to the first wide portion (132) of the first land (13). The second wiring portion (16) is connected to the second wide portion (142) of the second land (14). The resist layer (17) covers a part of each of the first wiring portion (15) and the second wiring portion (16) on the surface (11) side of the support (10). The resist layer (17) has an opening (171) that exposes the first land (13) and the second land (14). The outer peripheral edges of the first land (13) and the second land (14) are separated from the resist layer (17).

In the seventh aspect, the mounting substrate (1; 1a; 1b) according to the eighth aspect has a rectangular shape in which each of the first wide portion (132) and the second wide portion (142) is long in the width direction. .. The opening shape of the opening (171) is a rectangle whose longitudinal direction is the direction in which the first land (13) and the second land (14) are lined up.

In the mounting substrate (1; 1a; 1b) according to the eighth aspect, the resist layer (17) is separated from the first opening and the second land (13) to expose the first land (13). It is easy to shorten the shortest distance between the first land (13) and the second land (14) as compared with the case where the second opening for exposing 14) is provided.

In the mounting substrate (1; 1a; 1b) according to the ninth aspect, in the seventh or eighth aspect, in the first wiring portion (15), the end portion (151) connected to the first wide portion (132). The wiring width (W15) in the above is narrower than the width (W12) of the first wide portion (132). In the second wiring portion (16), the wiring width (W16) at the end portion (161) connected to the second wide portion (142) is narrower than the width (W22) of the second wide portion (142).

In the mounting substrate (1; 1a; 1b) according to the ninth aspect, it is possible to prevent the molten solder on the first land (13) and the second land (14) from spreading too much at the time of reflow. It becomes possible, between the side surface of the first external connection electrode (23) and the first land (13) of the electronic component (2), and between the side surface of the second external connection electrode (24) and the second land (14). It is possible to more reliably form fillets (411,421) in each of the spaces.

In the mounting substrate (1; 1a; 1b) according to the tenth aspect, in any one of the first to ninth aspects, the surface (11) of the support (10) has the first land (13) and the first land (13). A conductor pattern including 2 lands (14) is provided, and no conductor pattern is provided on the back surface (12) of the support (10).

Since the mounting board (1; 1a; 1b) according to the tenth aspect can be composed of, for example, a single-sided printed wiring board, the cost can be reduced as compared with the case of the double-sided printed wiring board.

In the mounting substrate (1; 1a; 1b) according to the eleventh aspect, in any one of the first to tenth aspects, the electronic component (2) has a long side length (L2) of 0.6 mm. It is a chip-type electronic component having a short side length (W2) of 0.3 mm.

In the mounting substrate (1; 1a; 1b) according to the eleventh aspect, the occurrence of the Manhattan phenomenon can be suppressed when mounting a chip-type electronic component having an outer size of 0603 (0.6 mm × 0.3 mm).

The configuration according to the second to eleventh aspects is not an essential configuration for the mounting substrate (1; 1a; 1b) and can be omitted as appropriate.

The electronic component module (3) according to the twelfth aspect is surface-mounted on the mounting substrate (1; 1a; 1b) of any one of the first to eleventh aspects and the mounting substrate (1; 1a; 1b). It includes an electronic component (2).

In the electronic component module (3) according to the twelfth aspect, it is possible to suppress the occurrence of the Manhattan phenomenon when the electronic component (2) is mounted.

The electronic component module (3) according to the thirteenth aspect includes an electronic component (2) and a mounting board (1; 1a; 1b). The electronic component (2) is surface-mounted on the mounting substrate (1; 1a; 1b). The electronic component (2) includes an electronic component main body (20), a first external connection electrode (23), and a second external connection electrode (24). The electronic component body (20) has a rectangular parallelepiped shape. The first external connection electrode (23) is provided at the first end (21) in the longitudinal direction of the electronic component body (20). The second external connection electrode (24) is provided at the second end (22) in the longitudinal direction of the electronic component body (20). The mounting board (1; 1a; 1b) includes a support (10), a first land (13), and a second land (14). The support (10) has a front surface (11) and a back surface (12), and has electrical insulation. The first land (13) is provided on the surface (11) of the support) 10). The first external connection electrode (23) is joined to the first land (13) by soldering. The second land (14) is provided on the surface (11) of the support (10). A second external connection electrode (24) is joined to the second land (14) by soldering. The shortest distance (G1) between the first land (13) and the second land (14) is shorter than the length (L2) of the long side of the electronic component (2). The first land (13) includes a first main portion (131) and a first wide portion (132). The first main portion (131) overlaps at least a part of the first external connection electrode (23) in a plan view. The first wide portion (132) extends from the first main portion (131) to the side opposite to the second land (14) side and is wider than the first main portion (131). The second land (14) includes a second main portion (141) and a second wide portion (142). The second main portion (141) overlaps at least a part of the second external connection electrode (24) in a plan view. The second wide portion (142) extends from the second main portion (141) to the side opposite to the first land (13) side, and is wider than the second main portion (141). A first joint (41) containing solder that joins the first external connection electrode (23) and the first land (13) between the first external connection electrode (23) and the first land (13). Exists. A second joint (42) containing solder that joins the second external connection electrode (24) and the second land (14) between the second external connection electrode (24) and the second land (14). Exists.

In the electronic component module (3) according to the thirteenth aspect, it is possible to suppress the occurrence of the Manhattan phenomenon when the electronic component (2) is mounted.

1, 1a, 1b Mounting board 10 Support 11 Front surface 12 Back surface 13, 13a, 13b 1st land 131 1st main part 132 1st wide part 14, 14a, 14b 2nd land 141 2nd main part 142 2nd wide part 15 1st wiring part 152 Part of 1st wiring part 16 2nd wiring part 162 Part of 2nd wiring part 17 Resist layer 171 Opening 2 Electronic component 20 Electronic component body 21 1st end 22 2nd end 23 1st External connection electrode 24 2nd external connection electrode 3 Electronic component module 41 1st junction 42 2nd junction G1 Shortest distance L2 Length of long side of electronic component M1 Straight line V1 Vertical bisection line W2 Short of electronic component Side length W11 Width of the first main part W12 Width of the first wide part W15 Wiring width of the end part in the first wiring part W16 Wiring width of the end part in the second wiring part W21 Width of the second main part W22 Second Wide part width W23 Width of the first external connection electrode W24 Width of the second external connection electrode

Claims (13)

A rectangular parallelepiped electronic component body, a first external connection electrode provided at the first end in the longitudinal direction of the electronic component body, and a second terminal provided at the second end in the longitudinal direction of the electronic component body. A mounting board on which an electronic component including an external connection electrode can be surface-mounted.
A support that has front and back surfaces and is electrically insulating,
A first land, which is provided on the surface of the support and to which the first external connection electrode is bonded by solder,
A second land, which is provided on the surface of the support and to which the second external connection electrode is bonded by solder, is provided.
The shortest distance between the first land and the second land is shorter than the length of the long side of the electronic component.
The first land is
In plan view, the first main portion that overlaps at least a part of the first external connection electrode and
Includes a first wide portion that extends from the first main portion to the side opposite to the second land side and is wider than the first main portion.
The second land is
A second main portion that at least partially overlaps the second external connection electrode in a plan view,
A second wide portion extending from the second main portion to the side opposite to the first land side and wider than the second main portion is included.
Mounting board. The width of the first main portion is a size corresponding to the width of the first external connection electrode.
The width of the second main portion is a size corresponding to the width of the second external connection electrode.
The mounting board according to claim 1. The width of the first main portion is the same size as the width of the first external connection electrode.
The width of the second main portion is the same size as the width of the second external connection electrode.
The mounting board according to claim 2. In a plan view, the first land and the second land are line-symmetric with respect to the perpendicular bisector of one straight line connecting the first land and the second land at the shortest distance.
The mounting board according to any one of claims 1 to 3. In a plan view, the first land and the second land have the same shape.
The mounting board according to claim 4. In a plan view, the first land and the second land are line-symmetric with respect to a straight line including the one straight line and intersecting the first land and the second land.
The mounting board according to claim 4 or 5. The first wiring portion connected to the first wide portion of the first land and
A second wiring portion connected to the second wide portion of the second land, and
A resist layer that covers a part of each of the first wiring portion and the second wiring portion on the surface side of the support and has an opening that exposes the first land and the second land is further provided. Prepare,
The outer peripheral edges of the first land and the second land are separated from each other by the resist layer.
The mounting board according to any one of claims 1 to 6. Each of the first wide portion and the second wide portion has a rectangular shape long in the width direction.
The opening shape of the opening is a rectangle whose longitudinal direction is the direction in which the first land and the second land are lined up.
The mounting board according to claim 7. In the first wiring portion, the wiring width at the end connected to the first wide portion is narrower than the width of the first wide portion.
In the second wiring portion, the wiring width at the end connected to the second wide portion is narrower than the width of the second wide portion.
The mounting board according to claim 7 or 8. A conductor pattern including the first land and the second land is provided on the surface of the support.
No conductor pattern is provided on the back surface of the support.
The mounting board according to any one of claims 1 to 9. The electronic component is a chip-type electronic component having a long side length of 0.6 mm and a short side length of 0.3 mm.
The mounting board according to any one of claims 1 to 10. The mounting substrate according to any one of claims 1 to 11 and the electronic component surface-mounted on the mounting substrate are provided.
Electronic component module. An electronic component and a mounting board on which the electronic component is surface-mounted are provided.
The electronic component is
The rectangular parallelepiped electronic component body and
A first external connection electrode provided at the first end in the longitudinal direction of the electronic component body,
A second external connection electrode provided at the second end in the longitudinal direction of the electronic component body is provided.
The mounting board is
A support that has front and back surfaces and is electrically insulating,
A first land, which is provided on the surface of the support and to which the first external connection electrode is bonded by solder,
A second land, which is provided on the surface of the support and to which the second external connection electrode is bonded by solder, is provided.
The shortest distance between the first land and the second land is shorter than the length of the long side of the electronic component.
The first land is
In plan view, the first main portion that overlaps at least a part of the first external connection electrode and
Includes a first wide portion that extends from the first main portion to the side opposite to the second land side and is wider than the first main portion.
The second land is
A second main portion that at least partially overlaps the second external connection electrode in a plan view,
A second wide portion extending from the second main portion to the side opposite to the first land side and wider than the second main portion is included.
There is a first joint portion containing solder that joins the first external connection electrode and the first land between the first external connection electrode and the first land.
There is a second joint portion containing solder that joins the second external connection electrode and the second land between the second external connection electrode and the second land.
Electronic component module.

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