JP2020191322A - Circuit board, control apparatus and vehicle motor - Google Patents

Abstract

To improve soldering processing to a through-hole.SOLUTION: A circuit board 38 includes: an insulating plate section 44 planarly formed by using an insulating material; and a through-hole 48 cylindrically formed by using a conductive material and formed on the insulating plate section 44 so as to be penetrated into the insulating plate section 44. The circuit board 38 includes: a first probe connection section 50 and a second probe connection section 52 formed by using the conductive material, arranged on one side face of the insulating plate section 44, and to which probes are connected; and heating patterns 56 formed by using the conductive material, connected to the first probe connection section 50 and the second probe connection section 52, and arranged around the through-hole 48 on the other side face 44B of the insulating plate section 44.SELECTED DRAWING: Figure 5

Description

The present invention relates to circuit boards, control devices and vehicle motors.

The following Patent Document 1 discloses a circuit board (printed circuit board) in which mounted parts such as chip parts are joined by soldering. The circuit board described in this document includes a substrate, a land portion arranged on one surface of the substrate, and a heater layer embedded directly below the land portion in the substrate. Then, by energizing the heater layer, it is possible to heat the land portion. As a result, the land portion can be preheated, and the soldering process of the mounted parts to the land portion can be performed satisfactorily.

Japanese Unexamined Patent Publication No. 10-178260

The configuration described in the above patent document is a useful configuration from the viewpoint of improving the soldering process to the land portion on the circuit board, but the soldering process to the through hole provided in the circuit board is described. Not considered.

In consideration of the above facts, an object of the present invention is to obtain a circuit board, a control device, and a vehicle motor capable of improving the soldering process to the through hole.

The circuit board according to claim 1 has an insulating plate portion formed in a plate shape using an insulating material and a tubular portion formed in a tubular shape using a conductive material so as to penetrate the insulating plate portion. A first probe connecting portion and a second probe connecting portion formed by using a through hole provided in the insulating plate portion and a conductive material and provided on one surface of the insulating plate portion to which a probe is connected. And, which is formed by using a conductive material, is connected to the first probe connecting portion and the second probe connecting portion, and is provided around the through hole on the other side surface side of the insulating plate portion. It has a pattern for.

According to the circuit board according to claim 1, a part of the terminal or the electronic component is inserted into the through hole, and the molten solder is guided into the through hole, so that a part of the terminal or the electronic component is made into the through hole. It can be joined via solder. Here, when the probe is connected to the first probe connecting portion and the second probe connecting portion and the heating pattern is energized, the heating pattern generates heat. As a result, the through holes are heated from the other side of the insulating plate portion. As a result, it is possible to improve the solder climbing from one side surface side to the other side surface side of the insulating plate portion in the through hole, and it is possible to improve the soldering process to the through hole.

The circuit board according to claim 2 is the circuit board according to claim 1, wherein a plurality of the through holes are provided in the insulating plate portion, and a conductive material is provided on the other surface of the insulating plate portion. A pattern for power supply and a pattern for ground are provided, which are formed by using the above and are connected to any of the plurality of through holes, respectively, and the pattern for heating is connected to the pattern for power supply. It is provided so as to surround at least one of the through hole and the through hole connected to the pattern for the ground.

By the way, in a configuration in which a power supply pattern or a ground pattern is connected to a through hole, the heat of the through hole is easily taken away by the power supply pattern or the ground pattern. However, according to the circuit board according to claim 2, the heating pattern is provided so as to surround the through hole connected to the power supply pattern and the through hole connected to the ground pattern. As a result, the through hole to which the power supply pattern and the ground pattern are connected can be heated by the heat of the heating pattern. As a result, it is possible to improve the soldering from one side surface side to the other side surface side of the insulating plate portion in the through hole to which the power supply pattern and the ground pattern are connected, and the power supply can be improved. It is possible to improve the soldering process to the through hole to which the pattern for ground and the pattern for ground are connected.

The circuit board according to claim 3 is the circuit board according to claim 2, wherein at least one part of the power supply pattern and the ground pattern is the heating pattern.

According to the circuit board according to claim 3, at least one part of the pattern for power supply and the pattern for ground is a pattern for heating. As a result, the through hole can be heated from the other side of the insulating plate portion by energizing the power supply pattern and the ground pattern. As a result, it is possible to improve the solder climbing from one side surface side to the other side surface side of the insulating plate portion in the through hole, and it is possible to improve the soldering process to the through hole.

The circuit board according to claim 4 is the circuit board according to any one of claims 1 to 3, wherein the heating pattern is provided so as to seamlessly surround the through hole.

According to the circuit board according to claim 4, the pattern for heating is provided so as to surround the through hole without interruption. As a result, the shielding effect of the pattern for heating the electromagnetic noise emitted from the through hole can be improved.

The circuit board according to claim 5 has an insulating plate portion formed in a plate shape using an insulating material and a tubular portion formed in a tubular shape using a conductive material so as to penetrate the insulating plate portion. A through hole provided in the insulating plate portion and a through hole formed by using a conductive material, provided on one surface of the insulating plate portion, and connected to one surface side of the insulating plate portion in the through hole. The first probe connecting portion to which the probe is connected and the other surface of the insulating plate portion in the through hole, which is formed by using a conductive material and is provided on one surface of the insulating plate portion. It includes a second probe connection that is connected to the side and to which the probe is connected.

According to the circuit board according to claim 5, a part of the terminal or the electronic component is inserted into the through hole, and the molten solder is guided into the through hole, so that a part of the terminal or the electronic component is made into the through hole. It can be joined via solder. Here, when the probe is connected to the first probe connecting portion and the second probe connecting portion and the through hole is energized, the through hole generates heat. As a result, it is possible to improve the solder climbing from one side surface side to the other side surface side of the insulating plate portion in the through hole, and it is possible to improve the soldering process to the through hole.

The circuit board according to claim 6 is the circuit board according to claim 5, wherein a plurality of the through holes are provided in the insulating plate portion, and a conductive material is provided on the other surface of the insulating plate portion. A power supply pattern and a ground pattern are provided and connected to any of the plurality of the through holes, respectively, and the through holes and the ground are connected to the power supply pattern. At least one of the through holes connected to the pattern is an energizing path from the first probe connecting portion to the second probe connecting portion.

By the way, in a configuration in which a power supply pattern or a ground pattern is connected to a through hole, the heat of the through hole is easily taken away by the power supply pattern or the ground pattern. However, according to the circuit board according to claim 6, the through hole to which the power supply pattern and the ground pattern are connected generates heat, so that the power supply pattern and the ground pattern are connected to the through hole. It is possible to improve the solder climbing from one side surface side of the insulating plate portion to the other side surface side in the hole. As a result, it is possible to improve the soldering process to the through hole to which the pattern for power supply and the pattern for ground are connected.

The control device according to claim 7 is configured to include the circuit board according to any one of claims 1 to 6, and a control circuit for controlling a controlled object and the control circuit are arranged inside. It has a case and.

According to the control device according to claim 7, the circuit board according to any one of claims 1 to 6 is included, so that the one side surface side of the insulating plate portion in the through hole is included. It is possible to improve the ascent of solder from the surface to the other side, and it is possible to improve the soldering process to the through hole.

The control device according to claim 8 is the control device according to claim 7, wherein the case is formed in a box shape with one side open, a connector terminal is fixed to the case, and the connector terminal is a through. The circuit board is fixed to the case with the surface inserted through the hole and provided with the first probe connecting portion and the second probe connecting portion facing in the opening direction of the case.

According to the control device according to claim 8, the circuit board is in a state where the connector terminal is inserted into the through hole and the surface provided with the first probe connecting portion and the second probe connecting portion is directed in the opening direction of the case. To the case. Next, when the probe is connected to the first probe connection portion and the second probe connection portion and the heating pattern or through hole is energized, the through hole is on the other side of the insulating plate portion (open end side of the case). It is heated from the opposite side). As a result, it is possible to improve the solder ascending from one side surface side to the other side surface side of the insulating plate portion in the through hole, and it is possible to improve the soldering process to the through hole of the connector terminal. it can.

The vehicle motor according to claim 9 includes a motor main body and the control device according to claim 7 or 8, which controls the rotation of the motor main body.

According to the vehicle motor according to claim 9, the control circuit according to claim 7 or 8 is included, so that the vehicle motor is soldered to the through hole of the connector terminal at the time of manufacturing the vehicle motor. The processing can be improved.

The circuit board, control device, and vehicle motor according to the present invention have an excellent effect that the soldering process to the through hole can be improved.

It is an exploded perspective view which shows the motor for a vehicle disassembled. It is a perspective view which shows the control device which controls a motor main body. It is a perspective view which looked at the control circuit from one side of the circuit board. It is a perspective view which looked at the control circuit from the other side of the circuit board. FIG. 5 is an enlarged cross-sectional view showing a part of a circuit board and a terminal cut along the 5-5 line shown in FIG. 2 in an enlarged manner. It is a top view which looked at the pattern part of the 1st layer, the through hole and the like from the surface side of one side of a circuit board. It is a top view which looked at the pattern part of the 2nd layer, the through hole and the like from the surface side of one side of a circuit board. It is a top view which looked at the pattern part of the 3rd layer, the through hole and the like from the surface side of one side of a circuit board. It is a top view which looked at the pattern part of the 4th layer, the through hole and the like from the surface side of one side of a circuit board. It is a top view which shows the heating pattern of the 1st modification. It is a top view which shows the heating pattern of the 2nd modification. It is a top view which shows the heating pattern of the 3rd modification. It is a top view which looked at the pattern part of the 1st layer of the circuit board which a part of the pattern for grounds became a heating pattern, the through hole, etc. from one side of the circuit board. It is a top view which looked at the pattern part of the 4th layer of the circuit board which made a part of the pattern for grounds into a heating pattern, the through hole, etc. from one side of the circuit board. It is a top view which looked at the pattern part of the 1st layer of the circuit board which heats | heat | through hole, the through hole, etc. from one side of the circuit board. It is a top view which looked at the pattern part of the 4th layer of the circuit board which heats | heat | through hole, the through hole, etc. from one side of the circuit board. It is an enlarged cross-sectional view which shows the cross section of the circuit board cut along the line 17-17 shown in FIG.

The vehicle motor 10 according to the embodiment of the present invention will be described with reference to FIGS. 1 to 9. The arrow Z direction, arrow R direction, and arrow C direction, which are appropriately shown in the drawing, indicate one side of the output shaft 12 of the vehicle motor 10 in the rotation axis direction, the outside in the rotation radial direction, and one side in the rotation circumferential direction, respectively. To do. In addition, when simply indicating the axial direction, the radial direction, and the circumferential direction, unless otherwise specified, the rotation axis direction, the rotation radial direction, and the rotation circumferential direction of the output shaft 12 are indicated.

As shown in FIG. 1, the vehicle motor 10 of this embodiment is used as a vehicle wiper motor. The vehicle motor 10 includes a motor body 14, a speed reducer 16 that reduces and transmits the rotation of the motor body 14 to an output shaft 12, and a motor housing 18 in which the motor body 14 is supported and the speed reducer 16 is housed. And have. Further, the vehicle motor 10 includes a control device 20 that controls the rotation of the output shaft 12.

The motor body 14 includes a stator 24 having a yoke housing 22 formed in a bottomed cylindrical shape with the motor housing 18 side open, and a rotor (not shown) rotatably supported inside the yoke housing 22. It is composed of. Further, the speed reducer 16 of the present embodiment is a worm wheel 28 that can rotate integrally with the worm gear 26 fixed to the rotating shaft of the rotor and the output shaft 12. Then, the rotation of the rotor is decelerated by the worm gear 26 and the worm wheel 28 and transmitted to the output shaft 12, so that the output shaft 12 rotates.

The motor housing 18 is formed of an aluminum alloy or the like. The motor housing 18 is provided with a speed reducer housing recess 18A in which the speed reducer 16 is housed while the other side in the axial direction is open. Further, a motor body fixing portion 18B for fixing the motor body 14 is provided in a portion of the motor housing 18 adjacent to the speed reducer accommodating recess 18A in which the speed reducer 16 is accommodated.

As shown in FIGS. 1 and 2, the vehicle motor 10 of the present embodiment controls the rotation speed, rotation direction, rotation range, etc. of the output shaft 12 by controlling the rotation of the rotor of the motor body 14. The control device 20 is provided. The control device 20 includes a control circuit 30 for controlling the rotation of the motor main body 14 as a control target, and a speed reducer of the motor housing 18 when the control circuit 30 is arranged inside and attached to the motor housing 18. A cover case 32 as a case for closing the open end side of the accommodating recess 18A is provided.

The cover case 32 is formed in a box shape in which the motor housing 18 side is opened by using a highly insulating resin material. The cover case 32 includes a bottom wall portion 32A arranged to face the circuit board 38 described later, and a side wall portion 32B that bends and extends from the outer peripheral end of the bottom wall portion 32A toward the motor housing 18. .. Then, the cover case 32 is attached to the motor housing 18 by screwing the screw 34 (see FIG. 1) inserted through a part of the cover case 32 into the motor housing 18.

Further, the cover case 32 includes a connector 32C that projects outward in the radial direction from the side wall portion 32B. Inside the connector 32C, four connector terminals 36 with which the external connector side terminals provided on the external connector are engaged are provided. The four connector terminals 36 are supported by the cover case 32 in a state where a part thereof is embedded in the cover case 32 (connector 32C). Further, the ends of the four connector terminals 36 on the side to be soldered to the circuit board 38, which will be described later, project from the bottom wall portion 32A side of the cover case 32 toward the circuit board 38 side.

As shown in FIGS. 1 to 4, the control circuit 30 includes a circuit board 38 and a plurality of circuit elements 40 and the like attached to the circuit board 38. The circuit board 38 is arranged between the motor housing 18 and the cover case 32 so as to face the speed reducer 16 in the axial direction. Then, by energizing the control circuit 30, the rotation of the motor body 14 (rotor) is controlled so that the rotation speed, rotation direction, rotation range, etc. of the output shaft 12 become a predetermined rotation speed or the like. It has become. The rotation speed of the output shaft 12 and the like are detected by a sensor magnet 42 attached to the other end of the output shaft 12 in the axial direction.

Next, a schematic configuration of the circuit board 38 and a configuration of a portion of the circuit board 38 to which the connector terminal 36 is connected will be described.

As shown in FIGS. 2, 5 and 9, the circuit board 38 includes an insulating plate portion 44 formed in a plate shape using an insulating material. Here, the circuit board 38 of the present embodiment is a four-layer circuit board having various patterns 46 for forming wiring on the inner layer 44C in addition to the one side surface 44A and the other side surface 44B of the insulating plate portion 44. Is. Further, the circuit board 38 is fixed to the cover case 32 in a state where one side surface 44A side of the insulating plate portion 44 is directed to the opening direction side (one side in the axial direction) of the cover case 32.

As shown in FIG. 5, four through holes 48 formed in a tubular shape using a conductive material are provided in a portion of the circuit board 38 to which the four connector terminals 36 are connected. These four through holes 48 are embedded in the insulating plate portion 44 in a state of penetrating the insulating plate portion 44 in the thickness direction thereof.

Then, in the direction in which the four through holes 48 are arranged (arrow A direction), the through holes 48 arranged on the base end side (the end opposite to the arrow A direction) in the arrangement direction are for power supply. It is a through hole 48A for power supply that is joined by soldering with the connector terminal 36A inserted.

Further, in the direction in which the four through holes 48 are arranged (arrow A direction), the through holes 48 arranged on the terminal side (the end on the arrow A direction side) in the arrangement direction are inserted through the ground connector terminal 36D. It is a through hole 48D for the ground that is joined by soldering in the state of being soldered.

Further, of the four through holes 48, the two through holes 48 between the through hole 48A for power supply and the through hole 48D for ground are soldered with the signal connector terminals 36B and 36C inserted. Through holes 48B and 48C for signals joined by.

Further, as shown in FIGS. 5 and 6, a first probe connection formed by using a conductive material is formed around a through hole 48A for power supply on one side surface 44A of the insulating plate portion 44. A unit 50 is provided. The first probe connecting portion 50 includes a first probe connecting portion main body 50A extending along one side surface 44A of the insulating plate portion 44, and a connecting protrusion 50B protruding from the first probe connecting portion main body 50A. It is composed of.

Further, a second probe connecting portion 52 formed by using a conductive material is provided around the through hole 48D for the ground on the one side surface 44A of the insulating plate portion 44. Like the first probe connecting portion 50, the second probe connecting portion 52 is connected to the second probe connecting portion main body 52A extending along one side surface 44A of the insulating plate portion 44 and the second probe connecting portion main body 52A. It is configured to include a protruding connecting protrusion 52B. Further, a pattern 46D for ground is provided on the surface 44A on one side of the insulating plate portion 44. The ground pattern 46D is connected to a ground through hole 48D.

An insulating mask layer 54 is formed on one side surface 44A of the insulating plate portion 44 along the one side surface 44A of the insulating plate portion 44, but the connection protrusion of the first probe connecting portion 50. The connection protrusion 52B of the portion 50B and the second probe connection portion 52 is exposed from the mask layer 54.

As shown in FIGS. 5 and 9, around the four through holes 48A, 48B, 48C, and 48D on the other side surface 44B of the insulating plate portion 44, for heating formed using a conductive material. Pattern 56 is provided. The shape of the pattern 56 for heating of the present embodiment is the four through holes 48A, 48B, 48C, 48D along the direction in which the four through holes 48A, 48B, 48C, 48D are arranged (arrow A direction). It is shaped to draw a wavy trajectory that meanders and avoids. Further, in the heating pattern 56, each portion 56A adjacent to the four through holes 48A, 48B, 48C, 48D is curved so as to surround the through holes 48A, 48B, 48C, 48D by about 180 degrees. The heating pattern 56 may be provided in the inner layer of the insulating plate portion 44 with respect to the surface 44B on the other side of the insulating plate portion 44.

Further, as shown in FIGS. 5 to 9, the end portion 56B on the power supply through hole 48A side in the heating pattern 56 is conductive to the first probe connecting portion main body 50A of the first probe connecting portion 50. They are connected via a pair of vias 58 formed using the materials of.

Further, the end 56C on the ground through hole 48D side in the heating pattern 56 is a pair of vias 58 formed on the second probe connecting portion main body 52A of the second probe connecting portion 52 using a conductive material. It is connected via.

As shown in FIG. 9, a pattern 46A for power supply and a pattern 46D for grounding are provided on the surface 44B on the other side of the insulating plate portion 44. The power supply pattern 46A and the ground pattern 46D are connected to the power supply through hole 48A and the ground through hole 48D, respectively.

An insulating mask layer 54 is formed on the other side surface 44B of the insulating plate portion 44 along the other side surface 44B of the insulating plate portion 44. As a result, the heating pattern 56 and the like are covered with the mask layer 54.

(Action and effect of this embodiment)
Next, the operation and effect of this embodiment will be described.

As shown in FIG. 1, according to the vehicle motor 10 of the present embodiment described above, power is supplied from the external connector connected to the connector 32C to the control circuit 30 via the connector terminal 36, and a predetermined signal is supplied. Is input, the rotation of the rotor of the motor body 14 is controlled. As a result, the rotation speed, rotation direction, rotation range, etc. of the output shaft 12 are controlled to be a predetermined rotation speed, etc.

Here, in the assembly process of the vehicle motor 10 of the present embodiment, the control circuit 30 is covered with the cover case 32.
There is a process to attach to. As shown in FIGS. 2 and 5, the control circuit 30 is covered with the cover case 32.
In the step of attaching to the cover case 32, the four connector terminals 36A, 36B, 36C, and 36D are respectively, with the surfaces provided with the first probe connecting portion 50 and the second probe connecting portion 52 facing in the opening direction of the cover case 32. It is inserted through the through holes 48A, 48B, 48C, and 48D of the circuit board 38. At this time, the circuit board 38 is supported (fixed) to the cover case 32 by a snap-fit structure or the like.

Next, the probe 60 is connected (contacted) to the connecting protrusion 50B of the first probe connecting portion 50 and the connecting protrusion 52B of the second probe connecting portion 52, and the first probe connecting portion 50 to the second probe are brought into contact with each other. Energize the connection 52 side. As a result, when the heating pattern 56 is energized, the heating pattern 56 generates heat, and the through holes 48A, 48B, 48C, and 48D are on the other side surface 44B side (cover case 32) of the insulating plate portion 44. It is heated from the bottom wall portion 32A side). As a result, it is possible to improve the ascent of the solder 62 from the one side surface 44A side of the insulating plate portion 44 to the other side surface 44B side in the through holes 48A, 48B, 48C, 48D, and the connector terminals 36A, 36B. , 36C, 36D through holes 48A, 48B, 48C, 48D can be soldered well.

Further, in the configuration in which the pattern 46A for power supply and the pattern 46D for ground are connected to the through holes 48A and 48D as in the present embodiment, the heat of the through holes 48A and 48D is used for the pattern 46A and ground for power supply. It is easy to be robbed by the pattern 46D. However, since the heating pattern 56 is provided so as to surround the through hole 48A connected to the power supply pattern 46A and the through hole 48D connected to the ground pattern 46D, it is used for power supply. Through holes 48A and 48D to which the pattern 46A and the pattern 46D for the ground are connected can be heated by the heat of the pattern 56 for heating. As a result, the solder ascending from one side surface 44A side of the insulating plate portion 44 to the other side surface 44B side in the through holes 48A and 48D to which the power supply pattern 46A and the ground pattern 46D are connected is good. It is possible to improve the soldering process to the through holes 48A and 48D to which the pattern 46A for power supply and the pattern 46D for ground are connected.

Here, as shown in FIG. 10, the pattern 56 for heating may be provided so as to surround the through holes 48A, 48B, 48C, and 48D without interruption. In this configuration, the shielding effect of the pattern 56 for heating the electromagnetic noise emitted from each of the through holes 48A, 48B, 48C, and 48D can be improved.

Further, as shown in FIG. 11, the through hole 48A for power supply and the through hole for ground can be quickly warmed so that the through hole 48A for power supply and the through hole 48D for ground can be quickly heated. The pattern 56 for heating may have a curved portion 56A that surrounds only 48D. As shown in FIG. 12, the curved portion 56A surrounding the through hole 48 is provided from the viewpoint of promptly warming the through hole 48A for power supply and the through hole 48D for the ground where heat is easily taken away. , It is preferable to form 120 degrees or more around the through hole 48.

(Example in which the heating pattern 56 is a part of the ground pattern 46D)
13 and 14 show plan views corresponding to FIGS. 6 and 9, respectively, which were used in the description of the vehicle motor 10 described above. As shown in this figure, in this example, the heating pattern 56 is configured to be part of the ground pattern 46D. In FIGS. 13 and 14, the parts corresponding to the respective parts of the circuit board 38 are designated by the same reference numerals as those of the parts, and the description thereof is omitted.

In the configuration described above, it is possible to eliminate the need to provide a dedicated heating pattern 56 for heating the through holes 48. The heating pattern 56 may be configured to be a part of the power supply pattern 46A.

(Example of generating heat through the through hole 48)
15 and 16 show plan views corresponding to FIGS. 6 and 9, respectively, which were used in the description of the vehicle motor 10 described above, and FIG. 17 shows 17-17 shown in FIG. A cross section of the circuit board 38 cut along the line is shown. As shown in these figures, in this example, the first probe connecting portion 50 is connected to the one side surface 44A side of the insulating plate portion 44 in the through hole 48, and the second probe connecting portion 52 is connected. , Is connected to the other side surface 44B side of the insulating plate portion 44 in the through hole 48. As a result, the through hole 48D for ground and the through hole 48A for power supply generate heat, respectively. In FIGS. 15 to 17, the parts corresponding to the respective parts of the circuit board 38 are designated by the same reference numerals as those of the parts, and detailed description thereof will be omitted.

In the configuration described above, when the through hole 48D for the ground is heated, the connection protrusion 50B of the first probe connection portion 50 and the connection protrusion 52B of the second probe connection portion 52 corresponding to the through hole 48D for the ground are generated. The probe 60 is connected (contacted) to the first probe connecting portion 50 to energize the second probe connecting portion 52 side. As a result, the ground through hole 48D, which is the path of the current, generates heat. As a result, it is possible to improve the solder climbing from the one side surface 44A side to the other side surface 44B side of the insulating plate portion 44 in the through hole 48D to which the ground pattern 46D is connected, and for the ground. The soldering process to the through hole 48D to which the pattern 46D is connected can be improved.

Further, when the through hole 48A for power supply generates heat, the probe is formed on the connection protrusion 50B of the first probe connection portion 50 and the connection protrusion 52B of the second probe connection portion 52 corresponding to the through hole 48A for power supply. 60 is connected (contacted) and energized from the first probe connecting portion 50 to the second probe connecting portion 52 side. As a result, the through hole 48A for power supply, which is the path of the current, generates heat. As a result, in the through hole 48D to which the pattern 46A for power supply is connected, it is possible to improve the solder going up from the one side surface 44A side of the insulating plate portion 44 to the other side surface 44B side, and the power supply can be performed. The soldering process to the through hole 48A to which the pattern 46A is connected can be improved.

The configuration of each circuit board 38 described above can be applied to various electronic devices and control circuits.

Although one embodiment of the present invention has been described above, the present invention is not limited to the above, and can be modified in various ways other than the above within a range not deviating from the gist thereof. Of course.

10 ... Vehicle motor, 14 ... Motor body (control target), 20 ... Control device, 30 ... Control circuit, 32 ... Cover case, 38 ... Circuit board, 44 ... Insulation plate, 46A ... Power supply pattern, 46D ... pattern for ground, 48 ... through hole, 48A ... through hole, 48B ... through hole, 48C ... through hole, 48D ... through hole, 50 ... first probe connection part, 52 ... second probe connection part, 56 ... heating Pattern, 60 ... probe

Claims (9)

Insulating plate part formed in plate shape using insulating material,
Through-holes formed in a tubular shape using a conductive material and provided in the insulating plate portion so as to penetrate the insulating plate portion, and
A first probe connecting portion and a second probe connecting portion formed by using a conductive material, provided on one surface of the insulating plate portion, and to which a probe is connected, and
For heating, which is formed by using a conductive material, is connected to the first probe connecting portion and the second probe connecting portion, and is provided around the through hole on the other side surface side of the insulating plate portion. Patterns and
Circuit board with. A plurality of the through holes are provided in the insulating plate portion.
On the other surface of the insulating plate portion, a power supply pattern and a ground pattern formed by using a conductive material and connected to any of the plurality of through holes are provided.
The circuit board according to claim 1, wherein the heating pattern is provided so as to surround at least one of the through hole connected to the power supply pattern and the through hole connected to the ground pattern. .. The circuit board according to claim 2, wherein at least a part of the pattern for power supply and the pattern for ground is the pattern for heating. The circuit board according to any one of claims 1 to 3, wherein the heating pattern is provided so as to surround the through hole without interruption. Insulating plate part formed in plate shape using insulating material,
Through-holes formed in a tubular shape using a conductive material and provided in the insulating plate portion so as to penetrate the insulating plate portion, and
A first probe connection formed of a conductive material, provided on one surface of the insulating plate, connected to one surface of the insulating plate in the through hole, and connected to a probe. Department and
A second probe connection formed of a conductive material, provided on one surface of the insulating plate, connected to the other surface of the insulating plate in the through hole, and to which the probe is connected. Department and
Circuit board with. A plurality of the through holes are provided in the insulating plate portion.
On the other surface of the insulating plate portion, a power supply pattern and a ground pattern formed by using a conductive material and connected to any of the plurality of through holes are provided.
At least one of the through hole connected to the power supply pattern and the through hole connected to the ground pattern serves as an energization path from the first probe connection portion to the second probe connection portion. The circuit board according to claim 5. A control circuit including the circuit board according to any one of claims 1 to 6 to control a control target, and a control circuit.
The case where the control circuit is arranged inside and
Control device equipped with. The case is formed in a box shape with one side open.
A connector terminal is fixed to the case,
The circuit board is fixed to the case with the connector terminal inserted through the through hole and the surface provided with the first probe connecting portion and the second probe connecting portion facing in the opening direction of the case. The control device according to claim 7. With the motor body
The control device according to claim 7 or 8, which controls the rotation of the motor body.
Vehicle motor equipped with.