JP2020190727A - Semiconductor device - Google Patents

Abstract

To suppress the decrease in reliability due to a defect such as a crack even if a flexible substrate in a semiconductor device is curved.SOLUTION: A semiconductor device includes a first substrate with flexibility, a plurality of thin film transistors provided to a first surface of the first substrate, and a terminal part provided to the first surface of the first substrate and receiving the input of a signal for controlling the thin film transistors. The first substrate includes a curved part between the thin film transistors and the terminal part. In the curved part, an organic film covering the first surface of the first substrate and a side surface of the first substrate is provided.SELECTED DRAWING: Figure 4

Description

One embodiment of the present invention relates to a substrate structure of a flexible display device.

A display device has been developed in which an organic electroluminescence element or a liquid crystal element is used as a display element in each pixel and a circuit for driving the display element is formed by a thin film transistor. As one form of a display device, a display device that can be bent or curved using a flexible substrate is disclosed (see, for example, Patent Document 1).

JP 2015-169711

The display device has circuit elements such as thin film transistors and capacitive elements on a substrate, and a wiring portion for connecting the circuit elements, and is provided on an organic insulating film and an inorganic insulating film that fill the layers thereof, for example, various electrodes. An inorganic insulating film is provided on substantially the entire surface of the substrate. Here, when the flexible substrate is curved, stress acts on the thin film provided on the substrate, causing defects such as cracks. That is, even if the substrate has flexibility, the thin film such as the inorganic insulating film provided on the substrate does not necessarily have the same flexibility. Therefore, by bending the flexible substrate, Defects such as cracks occur in the thin film. For example, when a defect such as a crack occurs in the inorganic insulating film or the like on the flexible substrate, moisture infiltrates from the defect and causes deterioration of the display element in the pixel region.

Therefore, in one embodiment of the present invention, in a display device using a flexible substrate, it is possible to prevent the reliability from being lowered due to defects such as cracks even when the substrate is curved. It is one of the purposes.

According to one embodiment of the present invention, the first substrate has a flexible first substrate, a pixel portion and a drive circuit portion provided on the first surface of the first substrate, and the first substrate is bendable. Provided is a display device including a curved portion and provided with an organic film covering at least the first surface of the substrate in the curved portion.

It is a top view which shows the structure of the display device which concerns on this embodiment. It is sectional drawing which shows the structure of the display device which concerns on this Embodiment, and is the figure which shows the structure along line AB shown in FIG. It is sectional drawing which shows the structure of the display device which concerns on this Embodiment, and is the figure which shows the structure along the line CD shown in FIG. It is sectional drawing which shows the structure of the display device which concerns on this Embodiment, and is the figure which shows the state which the substrate was bent in the structure along the line AB shown in FIG. It is sectional drawing which shows the structure of the display device which concerns on this Embodiment, and is the figure which shows the state which the substrate was bent in the structure along the line AB shown in FIG. It is sectional drawing which shows the structure of the display device which concerns on this Embodiment, and is the figure which shows the structure along the line CD shown in FIG.

Hereinafter, embodiments of the present invention will be described with reference to drawings and the like. However, the present invention can be implemented in many different modes and is not construed as being limited to the description of the embodiments illustrated below. In order to clarify the explanation, the drawings may schematically represent the width, thickness, shape, etc. of each part as compared with the actual embodiment, but this is merely an example and limits the interpretation of the present invention. It's not a thing. Further, in the present specification and each figure, the same elements as those described above with respect to the above-mentioned figures may be designated by the same reference numerals, and detailed description thereof may be omitted as appropriate.

In the present specification, when a member or region is "above (or below)" another member or region, it is directly above (or directly below) the other member or region unless otherwise specified. Not only in some cases, but also in the case of being above (or below) the other member or region, that is, including the case where another component is included above (or below) the other member or region. ..

FIG. 1 shows the configuration of a display device 100 according to an embodiment of the present invention. Further, in the display device 100 shown in FIG. 1, the cross-sectional structure along the line AB is shown in FIG. 2, and the cross-sectional structure along the line CD is shown in FIG. These drawings are referred to in the following description.

The display device 100 has a pixel portion 104 in which the pixels 106 are arranged on the first surface 10 of the first substrate 102. The display device 100 has a drive circuit unit that drives the pixels 106 in a region (peripheral region) outside the pixel unit 104 on the first substrate 102. The drive circuit unit includes a first drive circuit 108 that outputs a scanning signal, and a second drive circuit 110 that outputs a video signal in synchronization with the scanning signal. The second drive circuit 110 is, for example, a driver IC mounted on the first substrate 102. Further, a terminal portion 112 for inputting a signal is provided in the region outside the first substrate 102. The terminal portion 112 includes a terminal into which a video signal is input. The terminal portion 112 is electrically connected to the wiring board 118. The above-mentioned driver IC, that is, the second drive circuit 110 may be mounted on the wiring board 118.

The first drive circuit 108 and the second drive circuit 110 and the pixel unit 104 are connected by wiring. This connection region includes wiring formed by the conductive film and an insulating layer in which the wiring is embedded. In the present specification, this connection area in the area between the pixel unit and the drive circuit unit is referred to as a wiring unit. The display device 100 has a first wiring unit 114 between the pixel unit 104 and the first drive circuit 108, and a second wiring unit 116 between the pixel unit 104 and the second drive circuit 110.

In the present embodiment, the first substrate 102 has flexibility. A resin material is used as the material for the flexible first substrate 102. As the resin material, it is preferable to use a polymer material containing an imide bond as a repeating unit, and for example, polyimide is used. Specifically, as the first substrate 102, a film substrate obtained by molding polyimide into a sheet is used. Further, as another form of the first substrate 102, a metal thin plate substrate, a composite substrate in which a resin film is bonded to a metal thin plate, or a composite substrate in which a resin film is bonded to a glass thin plate substrate may be used.

The display device 100 is provided with a sealing material 126 facing the first substrate 102. It can be said that the sealing material 126 is a second substrate facing the first substrate 102. The pixel portion 104 is covered with a sealing material 126. The sealing material 126 is composed of a film made of a resin material or a sheet-like member.

The display device 100 includes a curved portion 120 at least in part. That is, since the first substrate 102 has flexibility, the display device 100 may include a state in which at least a part is bent. The curved portion 120 is a region where the first substrate 102 is bent or curved. When the first substrate 102 is curved, at least a portion of the pixel portion, the drive circuit portion, and the wiring portion that overlaps with the curved portion 120 is curved together with the first substrate 102.

In the display device 100, the support member 122 is provided on the second surface 20 facing the first surface 10 of the first substrate 102. The support member 122 is arranged so as to cover substantially the entire surface of the first substrate 102, but includes a notch portion 124 at least in a part thereof. The support member 122 arranged in close contact with the first substrate 102 has substantially the same effect as increasing the thickness of the substrate. That is, the support member 122 suppresses the bending of the first substrate 102. On the other hand, since the thickness of the first substrate 102 is maintained in the cutout portion 124 of the support member 122, it is in a state of being easily bent as compared with the region where the support member 122 is provided. In the first substrate 102, the region corresponding to the notch portion 124 of the support member 122 is the curved portion 120.

The support member 122 is formed of the same resin material as the first substrate 102 or a member harder than the first substrate 102. As the support member 122, a resin film made of silicone resin or the like, or a thin plate material such as an acrylic plate is used. The support member 122 is not an essential structure in the present embodiment, but is a structural material that can be used as appropriate. However, as described above, the support member 122 can be used to suppress the bending of the first substrate 102, and the notch portion 124 can be provided to set the position of the curved portion 120 of the display device 100. it can.

The notch 124 of the support member 122 can be provided at an arbitrary position and with an arbitrary width. FIG. 2 shows an embodiment in which the notch portion 124 of the display device 100 is provided between the pixel portion 104 and the second drive circuit 110. In other words, in the display device 100 shown in FIG. 2, the region overlapping the second wiring portion 116 is the curved portion 120.

As shown in FIGS. 2 and 3, the display device 100 has the organic film 128 in the region including the curved portion 120. The organic film 128 is provided so as to cover the upper surface of the second wiring portion 116 on the first surface 10 of the first substrate 102. In other words, the organic film 128 is provided in the region between the pixel unit 104 and the second drive circuit unit 110. The second wiring portion 116 is covered and protected by the organic film 128. The organic film 128 is also provided on the side of the second surface 20 of the first substrate 102. Further, the organic film 128 is provided so as to cover a region between the first surface and the second surface of the first substrate 102, that is, a side surface portion of the first substrate 102. By providing the organic film 128 on the first substrate 102 in this way, it can be used as a protective film for the curved portion 120. Since the organic film 128 is continuously provided on the first surface 10, the second surface 20, and the side surface of the first substrate 102, stress is concentrated on a part of the curved portion 120, for example, on the second wiring portion 116. Even if a defect such as a crack occurs, the defect can be prevented from being exposed to the atmosphere.

FIG. 4 shows a state in which the first substrate 102 is curved at the curved portion 120 of such a display device 100. The first substrate 102 is bent so that the second drive circuit 110 is arranged on the back side of the pixel portion 104. Bending stress acts on the curved portion 120 of the first substrate 102. For example, bending stress acts on the second wiring portion 116 by bending the first substrate 102. That is, bending stress acts on the wiring included in the second wiring portion 116 and the insulating layer in which the wiring is embedded. In this case, the metal film forming the wiring has plasticity, but at least the inorganic insulating layer among the insulating layers in which the wiring is embedded is brittle, and defects such as cracks occur. Defects such as cracks generated in the second wiring portion 116 proceed (grow) toward the pixel portion 104. If a defect such as a crack in the second wiring portion 116 is exposed to the atmosphere, moisture or the like will infiltrate into the pixel portion 104, which will affect the reliability of the display device 100, which is a problem.

The display device 100 according to the present embodiment is provided with an organic film 128 that covers the second wiring portion 116. As shown in FIGS. 3 and 4, the organic film 128 is not provided in the entire area of the display device 100, but is provided in at least a part of the display device 100 including the curved portion 120. In the part thereof, the organic film 128 is continuously provided on the first surface 10, the second surface 20, and the side surfaces intersecting both the first surface 10 and the second surface 20. In other words, the organic film 128 is provided over the entire circumference of the part thereof. Since the organic film 128 has the same flexibility as the flexible first substrate 102, it has high resistance to bending and is less likely to cause defects such as cracks. The organic film 128 is also provided on the curved portion 120 along the curved surface of the first substrate 102. Therefore, even if a defect such as a crack occurs in the insulating layer of the second wiring portion 116, the defect is not exposed on the outer surface. Further, the display device 100 has a portion (non-curved portion) different from that of the curved portion 120, and the non-curved portion has a region in which the organic film 128 is not formed. That is, the organic film 128 is continuously provided on the entire surface of the display device 100, the first surface 10, the second surface 20, and the side surfaces intersecting both the first surface 10 and the second surface 20. Does not have.

Further, by using a film having low moisture permeability (non-moisture permeability (gas barrier property) or high moisture resistance) as the organic film 128, it is reliable even if a defect such as a crack occurs in the second wiring portion 116. Sex can be maintained. That is, as the organic film 128, it is desired to use a material having excellent non-moisture permeability (gas barrier property) and mechanical properties (resistance to bending).

As such an organic film 128, it is preferable to use polychloroparaxylylene and to include polychloroparaxylylene. As for polychloroparaxylylene, a plurality of species having different molecular structures such as parylene C, parylene N, and parylene D are known. As the organic film 128, any of parylene C, parylene N and parylene D can be used, but among these, parylene C having high moisture resistance is preferably used.

The polychloroparaxylylene thin film as the organic film 128 can be produced by a vacuum vapor deposition method. The polychloroparaxylylene thin film produced by the vacuum deposition method grows on a molecular basis. Therefore, regardless of the shape of the surface to be deposited, the polychloroparaxylylene thin film can be uniformly formed even in minute gaps. The polychloroparaxylylene thin film can form a film having a thickness of several micrometers to several tens of micrometers by a vacuum vapor deposition method, and can exhibit sealing performance even with such a thickness. .. In order to provide the organic film 128 on the curved portion 120, a shadow mask having an opening corresponding to the curved portion 120 of the first substrate 102 may be used when the polychloroparaxylylene thin film is formed. By the film formation using the shadow mask, the organic film 128 is not formed in other regions such as the pixel portion 104, and the thin film of polychloroparaxylylene can be selectively grown on the curved portion 120.

As described above, according to one embodiment of the present invention, in a display device using a flexible substrate, even when the substrate is curved, the reliability is lowered due to defects such as cracks. Can be prevented.

Next, the details of the display device 100 according to the present embodiment will be described with reference to FIGS. 5 and 6. The cross-sectional structure corresponding to the line AB shown in FIG. 1 is shown in FIG. 5, and the cross-sectional structure corresponding to the line CD is shown in FIG. That is, FIG. 5 shows a state in which the display device 100 is bent by the curved portion 120, and FIG. 6 shows a cross-sectional view of the curved portion 120.

In the display device 100, the first substrate 102 is bent at the curved portion 120, and the second drive circuit 110 and the terminal portion 112 are arranged on the back side of the pixel portion 104. A second wiring unit 116 is provided between the pixel unit 104 and the second drive circuit 110. The second wiring portion 116 is provided along the curved surface of the curved portion 120.

A pixel portion 104 is provided on the first surface 10 of the first substrate 102. An example shown in FIG. 5 shows an embodiment in which the pixel 106 includes a transistor 130, a light emitting element 132, a first capacitance element 134, and a second capacitance element 136. The light emitting element 132 is electrically connected to the transistor 130. The first capacitance element 134 holds the gate potential of the transistor 130, and the second capacitance element 136 is additionally provided to adjust the amount of current flowing through the light emitting element 132. Note that the pixel 106 shown in FIG. 5 is an example, and the pixel may be configured by adding a transistor and a light emitting element, or a transistor, a light emitting element and a first capacitance element, or another element.

The transistor 130 has a structure in which a semiconductor film 138, a gate insulating film 140, and a gate electrode 142 are laminated. The source / drain electrode 152 is provided on the upper surface of the first insulating film 144. The source / drain electrode 152 comes into contact with the source region or the region corresponding to the drain region of the semiconductor film 138, and electrical conduction is achieved. A second insulating film 146 as a flattening layer is provided on the upper layer of the source / drain electrode 152. Then, the light emitting element 132 is provided on the upper surface of the second insulating film 146. As the structure of the pixel portion 104, the first insulating film 144 is formed of an inorganic insulating material, and the second insulating film 146 is formed of an organic insulating material. The first capacitance element 134 has a region in which the semiconductor film 138 and the first capacitance electrode 154 overlap each other with the gate insulating film 140 as the dielectric film, and the source / drain electrodes 152 and the first with the first insulating film 144 as the dielectric film. It is formed in a region sandwiched between the capacitive electrode 154 and the capacitance electrode 154. The second capacitance element 136 is formed in a region where the first electrode 158 and the second capacitance electrode 156 overlap each other, using the third insulating film 148 provided on the upper layer of the second insulating film 146 as a dielectric film. The third insulating film 148 is formed of an inorganic insulating film such as silicon oxide, silicon nitride, or silicon nitride.

The light emitting element 132 has a structure in which a first electrode 158 (pixel electrode) electrically connected to the transistor 130, a light emitting layer 160, and a second electrode 162 (common electrode) are laminated. The light emitting element 132 controls light emission by controlling the potential between the first electrode 158 and the second electrode 162. The pixel portion 104 includes a bank layer 164 that covers the peripheral edge portion of the first electrode 158 and exposes the inner region. The light emitting layer 160 is provided from the upper surface of the first electrode 158 to the bank layer 164. The second electrode 162 covers the upper surface of the light emitting layer 160 and is provided over substantially the entire surface of the pixel portion 104.

The light emitting layer 160 is a layer containing an organic electroluminescence material as a light emitting material. The light emitting layer 160 is formed by using a low molecular weight or high molecular weight organic material. When a low molecular weight organic material is used, the light emitting layer 160 includes a light emitting layer containing a light emitting organic material, a hole injection layer or an electron injection layer, and a hole transport layer or an electron transport so as to sandwich the light emitting layer. It may be configured to include layers and the like. Since the light emitting layer 160 is said to be deteriorated by moisture, a fourth insulating film 150 is provided on the upper layer of the second electrode 162. The fourth insulating film 150 is provided on substantially the entire surface of the pixel portion 104.

As the fourth insulating film 150, a single layer or a laminate of inorganic insulating films such as silicon nitride, silicon oxide, and aluminum oxide is applied. A further insulating film, for example, a laminate of an organic insulating film and an inorganic insulating film, may be arranged on the fourth insulating film 150. A sealing material 126 is provided on the upper surface side of the fourth insulating film 150. FIG. 5 shows a case where the sealing material 126 is a sheet-shaped plate material. In this case, the sealing material 126 is fixed to the first substrate 102 by the sealing material 172 that surrounds the outer periphery of the pixel portion 104. There is a gap between the fourth insulating film 150 and the sealing material 126, and a filler may be provided in this gap. A resin material is used as the filler.

An opening 168 that divides the second insulating film 146 and the bank layer 164 is provided between the end portion of the pixel portion 104 (the region in contact with the sealing material 172) and the pixel 106. A third insulating film 148 and a second electrode 162 formed of an inorganic material are provided so as to cover the side surface and the bottom surface of the opening 168. In other words, the third insulating film 148 and the second electrode 162 have a region in contact with each other in the opening 168. With such a structure, the light emitting layer 160 is substantially surrounded and sealed by the third insulating film 148 and the second electrode 162. That is, such a sealing structure prevents water and the like from entering the light emitting layer 160 through the second insulating film 146 and the bank layer 164 formed of the organic resin material. Further, the pixel portion 104 is provided with a connecting portion 170 in which the second electrode 162 is electrically connected to the wiring in the lower layer.

In the first substrate 102, the first wiring 166 extends from the pixel portion 104 to the second drive circuit 110. The region where the first wiring 166 extends is also a region corresponding to the curved portion 120. The first wiring 166 is formed of, for example, the same layer as the source / drain electrode 152. For example, the first wiring 166 has a structure formed of an aluminum (Al) film and having a melting point metal film such as titanium (Ti) or molybdenum (Mo) laminated on the upper layer side and the lower layer side thereof. A third insulating film 148 and a fourth insulating film 150 extending from the pixel portion 104 are laminated on the upper layer of the first wiring 166. The curved portion 120 exists in the outer region of the sealing material 126, but the first wiring 166 is not directly exposed to the atmosphere due to the provision of the third insulating film 148 and the fourth insulating film 150. Protected by an insulating film.

An organic film 128 is provided on the curved portion 120. That is, the organic film 128 is provided in the outer region of the sealing material 126. The organic film 128 is preferably provided as the outermost layer in the curved portion 120. FIG. 5 has a structure in which the gate insulating film 140, the first insulating film 144, the first wiring 166, the third insulating film 148, and the fourth insulating film 150 are laminated on the first substrate 102 in the curved portion 120. Further, an organic film 128 is provided on the upper layer of the fourth insulating film 150.

When the first substrate 102 is curved, bending stress acts on the second wiring portion 116. At this time, since the first wiring 166 is a metal film, it is plastic and can be deformed according to the bending of the substrate, but the third insulating film 148 and the fourth insulating film 150 are formed of an inorganic material. Therefore, defects such as cracks occur by bending the first substrate 102 due to brittleness. When defects such as cracks generated in these inorganic insulating films spread toward the pixel portion 104, moisture in the atmosphere or the like infiltrates the pixel portion 104 from there. For example, when the first substrate 102 is repeatedly bent by the curved portion 120, the stress on the second wiring portion 116 also acts repeatedly, so that defects such as cracks generated in the inorganic insulating film grow.

Since the display device 100 employs a moisture blocking structure in which the third insulating film 148 and the second electrode 162 are in close contact with each other at the opening 168, it is possible to prevent moisture from entering the light emitting layer 160 to some extent. However, the pixel 106 is provided with a contact hole that electrically connects the first electrode 158 and the source / drain electrode 152. This contact hole is formed in the first insulating film 144 and the second insulating film 146. Moisture or the like that penetrates into the pixel portion 104 from the outside has a path that penetrates into the region where the light emitting layer 160 is provided through the contact hole that penetrates the first insulating film 144 and the second insulating film 146. As a result, the light emitting element 132 is deteriorated in the pixel portion 104 after the production of the display device 100, and the display quality is deteriorated.

However, in the present embodiment, in the curved portion 120, the organic film 128 covers the upper layer of the fourth insulating film 150. Therefore, even if a defect such as a crack occurs in any of the gate insulating film 140, the first insulating film 144, the third insulating film 148, and the fourth insulating film 150, which are the inorganic insulating films, the defective portion is exposed to the atmosphere. You can prevent it from happening.

Defects such as cracks that occur in the second wiring portion 116 are also likely to occur at the end of the first substrate 102 where stress is likely to be concentrated. However, as shown in FIG. 6, by providing the organic film 128 so as to cover the entire circumference of the first substrate 102, even if a defect such as a crack occurs at the end of the first substrate 102, the defect is in the atmosphere. It can be prevented from being exposed to.

Further, as shown in FIG. 6, the second wiring portion 116 is placed on the first substrate 102 from the first substrate 102 side with the gate insulating film 140, the first insulating film 144, the first wiring 166, and the third insulating film. The region in which the 148 and the fourth insulating film 150 are laminated and the region in which the gate insulating film 140, the first insulating film 144, the third insulating film 148, and the fourth insulating film 150 are laminated are mixed. At the boundary between these two regions, stress is concentrated by bending the first substrate 102 due to the difference in the laminated structure. For example, it is conceivable that stress is concentrated on the third insulating film 148 that covers the first wiring 166. Even in this case, since the organic film 128 is provided on the outer layer, even if a defect is generated in the third insulating film 148, it is possible to prevent the defective portion from being exposed to the atmosphere.

In the present embodiment, the aspect in which the curved portion 120 of the display device 100 is provided in the region overlapping the second wiring portion 116 has been shown, but the present invention is not limited thereto. For example, the curved portion 120 may be provided so as to overlap the first wiring portion 114. Further, the curved portion 120 may be provided so as to intersect the pixel portion 104. In any case, since the organic film 128 is provided as the outer skin layer in the curved portion 120 in which the first substrate 102 is bent, the resistance to bending the first substrate 102 can be enhanced.

In the present embodiment, the pixel unit 104 is provided with the light emitting element 132 as a display element, but it can also be applied to a display device in which pixels are formed by other display elements. For example, the configuration shown in the present embodiment can be applied to a liquid crystal display device using a liquid crystal element that utilizes the electro-optical effect of the liquid crystal as the display element.

10 ... 1st surface, 20 ... 2nd surface, 100 ... Display device, 102 ... 1st substrate, 104 ... Pixel part, 106 ... Pixel, 108 ... 1st Drive circuit, 110 ... 2nd drive circuit, 112 ... Terminal part, 114 ... 1st wiring part, 116 ... 2nd wiring part, 118 ... Wiring board, 120 ... Curved part , 122 ... Support member, 124 ... Notch, 126 ... Encapsulant, 128 ... Organic film, 130 ... Transistor, 132 ... Light emitting element, 134 ... First Capacitive element, 136 ... 2nd capacitive element, 138 ... semiconductor film, 140 ... gate insulating film, 142 ... gate electrode, 144 ... 1st insulating film, 146 ... second insulation Film, 148 ... 3rd insulating film, 150 ... 4th insulating film, 152 ... Source / drain electrode, 154 ... 1st capacitance electrode, 156 ... 2nd capacitance electrode, 158 ... 1st electrode, 160 ... light emitting layer, 162 ... 2nd electrode, 164 ... bank layer, 166 ... 1st wiring, 168 ... opening, 170 ... connection part, 172・ ・ ・ Sealing material

Claims (6)

A flexible first substrate and
A plurality of thin film transistors provided on the first surface of the first substrate,
It has a terminal portion provided on the first surface of the first substrate and for inputting a signal for controlling the plurality of thin film transistors.
The first substrate includes a curved portion between the plurality of thin film transistors and the terminal portion.
A semiconductor device characterized in that, in the curved portion, an organic film that covers a first surface of the first substrate and a side surface of the first substrate is provided. The first substrate further has a second surface facing the first surface.
The semiconductor device according to claim 1, wherein an organic film that covers the second surface of the first substrate is further provided in the curved portion. The semiconductor device according to claim 1, further comprising a region on the first surface of the first substrate, which is different from the curved portion, where the organic film is not provided. In the curved portion, wiring extending in the direction from the terminal portion to the plurality of thin film transistors is provided.
The semiconductor device according to claim 1, wherein the organic film covers the wiring. Further having a sealing material for sealing the plurality of thin film transistors,
The semiconductor device according to claim 4, wherein the wiring has a region not covered with the sealing material, and the organic film covers a region not covered with the sealing material. The first substrate further has a support member provided on the second surface side facing the first surface.
The support member is provided in a region where it overlaps with the plurality of thin film transistors in a plan view.
The semiconductor device according to claim 1, wherein the curved portion has a region in which the support member is not provided.

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