JP2016224118A - Display device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a structure suitable for achieving narrow frame of a display device.SOLUTION: A display device includes: a pixel region provided with a first substrate having flexibility, a transistor provided on the first face of the first substrate, a flat layer provided on the transistor, a pixel electrode connected with the transistor on the flat layer electrically, and a bank layer that makes the inside region of the pixel electrode exposed to cover a peripheral section and the outside region of the peripheral section; and a first region on which the flat layer and the bank layer are provided while being extended from the pixel region and having an opening that separates the flat layer and the bank layer along at least one side of the pixel region. The first substrate includes a second region having a thin substrate thickness on a second face opposite to the first face. The second region overlaps with the first region.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a display device. One embodiment of the present invention relates to a structure of a bent portion of a display device using a flexible substrate.

  Flat display panels are incorporated in various electronic devices. For example, a portable electronic device called a smartphone is provided with a display screen on one surface of the main body, and the ratio of the screen to the housing is a factor that affects the impression given to the appearance. The trend of design in such electronic devices is to increase the area where the display screen is exposed on the front surface of the main body, and to narrow the peripheral area (also referred to as “frame area”) surrounding the display screen. In trying to create a smart appearance. Narrowing the peripheral area of the display screen to make it slim is sometimes called “narrowing the frame” of the display panel.

  In the display panel, a pixel region in which a plurality of pixels are arranged is arranged on the center side of the substrate, and a drive circuit is arranged outside the pixel region. Since a portion other than the pixel region in the display panel becomes a non-display region, for example, a region where the drive circuit is arranged is covered with a housing without being exposed to the outer surface. Therefore, narrowing the frame in the display panel means reducing the width of the region other than the pixel region.

  In order to narrow the frame of the display panel, the area occupied by the drive circuit may be reduced, but there is a limit to this. Therefore, a technique for narrowing the frame by bending a region where the drive circuit is disposed is disclosed. For example, a display device is disclosed in which a flexible stainless steel substrate or plastic substrate is used and the substrate is bent at an outer portion of the display region (see Patent Documents 1 to 4). In addition, a flexible display panel is disclosed in which the substrate thickness at a portion where the substrate is bent is reduced to facilitate bending (see Patent Documents 5 and 6).

JP 2011-209405 A JP 2012-128006 A JP 2011-034066 A JP 2014-197181 A JP 2010-256660 A JP 2010-282183 A

  However, as disclosed in Patent Documents 1 to 4, even when a flexible substrate is used, the bending portion is subjected to compressive stress and tensile stress on the front and back of the substrate to accurately control the position of the bending portion. Is difficult. If the position of the bent portion is not fixed in the display panel, there is a problem that the product shape is not stable.

  On the other hand, as disclosed in Patent Documents 5 and 6, it is disclosed to reduce the substrate thickness of the bent portion in the display panel. However, no consideration is given to the elements such as transistors and wirings disposed on the substrate and the internal structure such as the interlayer insulating film. In addition, the display panels disclosed in Patent Documents 5 and 6 do not mention narrow frame.

  In view of such circumstances, an embodiment of the present invention has an object to provide a structure suitable for narrowing the frame of a display device.

  According to an embodiment of the present invention, a flexible first substrate, a transistor provided on the first surface of the first substrate, a planarization layer provided on the transistor, and a planarization layer A pixel region having a pixel electrode electrically connected to the transistor, a bank layer that exposes an inner region of the pixel electrode and covers a peripheral portion and an outer region from the peripheral portion, and a planarization layer and a bank layer extend from the pixel region And a first region having an opening for separating the planarization layer and the bank layer along at least one side of the pixel region, and the first substrate has a second surface opposite to the first surface. The display device includes a second region having a thin substrate thickness, and the second region overlaps the first region.

It is a top view which shows the structure of the display apparatus which concerns on this embodiment. It is sectional drawing which shows the structure of the display apparatus which concerns on this embodiment. It is sectional drawing which shows the structure of the display apparatus which concerns on this embodiment. It is sectional drawing which shows the structure of the display apparatus which concerns on this embodiment. It is sectional drawing which shows the structure of the display apparatus which concerns on this embodiment. It is a perspective view which shows the structure of the display apparatus which concerns on this embodiment. It is sectional drawing which shows the structure of the display apparatus which concerns on this embodiment. It is sectional drawing which shows the structure of the display apparatus which concerns on this embodiment. It is a perspective view which shows the structure of the display apparatus which concerns on this embodiment. It is a perspective view which shows the structure of the display apparatus which concerns on this embodiment.

  Embodiments of the present invention will be described below with reference to the drawings. However, the present invention can be implemented in many different modes and should not be construed as being limited to the description of the embodiments exemplified below. In order to clarify the description, the drawings may be schematically represented with respect to the width, thickness, shape, and the like of each part as compared to actual aspects, but are merely examples and limit the interpretation of the present invention. It is not a thing. In addition, in the present specification and each drawing, elements similar to those described above with reference to the previous drawings are denoted by the same reference numerals, and detailed description may be omitted as appropriate.

  In this specification, when a certain member or region is “on (or below)” another member or region, this is directly above (or directly below) the other member or region unless otherwise specified. Including not only in some cases but also above (or below) other members or regions, that is, when other components are included above (or below) other members or regions .

<Planar configuration of display device>
FIG. 1 is a plan view for explaining the configuration of the display device 100 according to the present embodiment, and shows one mode before the substrate is bent. The display device 100 is provided with a pixel region 106 in which pixels 122 are arranged on a first substrate 102. There is a frame area 108 outside the pixel area 106. The frame region 108 includes a first drive circuit 124, a second drive circuit 126, a first wiring extension region 128, a second wiring extension region 130, and a sealing material 134. A terminal portion 136 is provided at one end of the first substrate 102. The terminal portion 136 is connected to the first drive circuit 124 and the second drive circuit 126 by a circuit and wiring (not shown).

  The pixel region 106 is connected to the first drive circuit 124 and the second drive circuit 126 by wiring. In the pixel region 106, wirings called scanning signal lines and video signal lines are provided in addition to the pixels 122. Each pixel 122 in the pixel region 106 is connected to the first drive circuit 124 and the second drive circuit 126 by these wirings. For example, the first drive circuit 124 is a drive circuit that outputs a scanning signal to the pixel region 106, and the second drive circuit 126 is a drive circuit that outputs a video signal to the pixel region 106. FIG. 1 shows a mode in which a first wiring extending region 128 is provided between the pixel region 106 and the first driving circuit 124, and a second wiring extending region 130 is provided between the pixel region 106 and the second driving circuit 126.

  The display device 100 is provided with a second substrate 104 facing the first substrate 102. The second substrate 104 covers the pixel region 106, the first drive circuit 124, and the first wiring extension region 128, and is provided with a gap from the first substrate 102. A sealing material 134 is provided along the outer periphery of the second substrate 104, and the first substrate 102 and the second substrate 104 are bonded together by the sealing material 134.

  As the first substrate 102 and the second substrate 104, a flexible substrate member is used. For example, a resin material is used as the substrate member. As the resin material, it is preferable to use a polymer material containing an imide bond in the repeating unit. For example, polyimide is used. Specifically, a film substrate in which polyimide is formed into a sheet shape can be used for one or both of the first substrate 102 and the second substrate 104.

  As other substrate members applicable to the first substrate 102 and the second substrate 104, a metal thin plate substrate, a composite substrate obtained by bonding a resin film to a metal thin plate, and a resin film bonded to a glass thin plate substrate. A composite substrate can be applied.

  In FIG. 1, a bent portion 120 where the display device 100 is bent is indicated by an A1-B1 line and an A2-B2 line. The bent portion 120 is provided along one side of the pixel region 106. The bent portion 120 is located in the first wiring extension region 128 between the pixel region 106 and the first drive circuit 124. Since the first substrate 102 and the second substrate 104 are bonded by the sealing material 134, the first substrate and the second substrate 104 bend in the same direction at the bent portion 120. 1 shows two of the A1-B1 line and the A2-B2 line as the bent portion 120, but only one of them may be provided. Further, the bent portion may be located in the second wiring extension region 130 between the pixel region 106 and the second drive circuit 126.

  As shown in FIG. 1, by arranging the bent portion 120 in a region overlapping with the wiring extension region, a portion where the substrate is bent is limited to the wiring extension region. Therefore, even if the first substrate 102 and the second substrate 104 are bent, the pixel region 106, the first driver circuit 124, and the second driver circuit 126 can be prevented from being affected by stress. That is, bending stress can be prevented from acting directly on elements such as transistors included in the pixel region 106, the first drive circuit 124, and the second drive circuit 126.

  Next, details of the display device 100 according to the present embodiment will be described with reference to a schematic cross-sectional view taken along line CD in FIG.

<Cross-sectional structure of display device>
FIG. 2 is a cross-sectional view of the display device 100. FIG. 3 is a cross-sectional view illustrating details of the pixel 122 in the pixel region 106. The following description will be given with reference to FIGS. 2 and 3 as appropriate.

  As illustrated in FIG. 2, the display device 100 includes a sealing region 110, a drive circuit region 112, a first wiring extension region 128, and a pixel region 106 from the ends of the first substrate 102 and the second substrate 104. Among these, the sealing region 110, the drive circuit region 112, and the first wiring extension region 128 correspond to the frame region 108.

  In the pixel region 106, a transistor 138, a light emitting element 140, a first capacitor element 142, and a second capacitor element 144 are provided on one surface (hereinafter, also referred to as “first surface”) of the first substrate 102. Yes. Details of these elements are shown in FIG.

  As shown in FIG. 3, the light emitting element 140 is connected to the transistor 138. The transistor 138 controls light emission of the light emitting element 140. The first capacitor element 142 holds the gate potential of the transistor 138, and the second capacitor element 144 is provided to adjust the amount of current flowing through the light emitting element 140.

  The transistor 138 has a structure in which a semiconductor layer 146, a gate insulating layer 148, and a gate electrode 150 are stacked. The semiconductor layer 146 is formed using amorphous or polycrystalline silicon, an oxide semiconductor, or the like. The source / drain electrodes 156 are provided on the upper layer of the gate electrode 150 with the first insulating layer 154 interposed therebetween. A second insulating layer 158 as a planarizing layer is provided on the source / drain electrode 156. A light emitting element 140 is provided on the upper surface of the second insulating layer 158. The second insulating layer 158 buryes the unevenness of the first insulating layer 154 in accordance with the shapes of the source / drain electrodes 156 and the contact holes provided in the first insulating layer 154, the gate electrode 150 and the semiconductor layer 146, and is substantially flat Has a good surface. The second insulating layer 158 is coated and deposited with a flat surface formed by etching or chemical mechanical polishing on the surface of the inorganic insulating layer, or a composition containing a precursor such as acrylic or polyimide, and is leveled. It may have a flat surface.

  The first capacitor element 142 includes a gate insulating layer 148 as a dielectric layer, a region where the semiconductor layer 146 and the first capacitor electrode 152 overlap, and a source / drain electrode 156 and a first capacitor as the first insulating layer 154 as a dielectric layer. It is formed in a region where the electrode 152 is sandwiched.

  The light-emitting element 140 has a structure in which a pixel electrode 164 electrically connected to the transistor 138, an organic layer 166, and a counter electrode 168 are stacked. The light-emitting element 140 is a two-terminal element, and light emission is controlled by controlling the potential between the pixel electrode 164 and the counter electrode 168. Further, a bank layer 170 is provided in the pixel region 106 so as to cover the peripheral portion of the pixel electrode 164 and expose the inner region. The counter electrode 168 is provided on the upper surface of the organic layer 166, and is provided from the pixel electrode 164 to the upper surface portion of the bank layer 170. Note that the bank layer 170 is formed of an organic resin material so as to cover the periphery of the pixel electrode 164 and to form a smooth step at the end of the pixel electrode 164. As the organic resin material, acrylic, polyimide, or the like is used.

  The organic layer 166 is a layer including a light emitting material such as an organic electroluminescent material. The organic layer 166 is formed using a low molecular weight or high molecular weight organic material. In the case of using a low molecular weight organic material, the organic layer 166 is not only a light emitting layer containing a light emitting organic material, but also a hole injection layer, an electron injection layer, a hole transport layer, and an electron transport so as to sandwich the light emitting layer. You may be comprised including a layer etc. For example, the organic layer 166 can have a structure in which a light emitting layer is sandwiched between a hole injection layer and an electron injection layer. In addition to the hole injection layer and the electron injection layer, the organic layer 166 may include a hole transport layer, an electron transport layer, a hole block layer, an electron block layer, and the like as appropriate.

  In the present embodiment, the light emitting element 140 exemplifies a so-called top emission type structure in which light emitted from the organic layer 166 is emitted to the counter electrode 168 side. When the organic layer 166 is laminated in the order of a hole injection layer, a light emitting layer, and an electron injection layer, the pixel electrode 164 is made of ITO (Indium Tin Oxide) or IZO (Indium Zinc Oxide) which has excellent hole injection properties. Zinc) is preferably used. ITO is a kind of translucent conductive material, and has high transmittance in the visible light band, but has extremely low reflectance. Therefore, in order to add a function of reflecting light to the pixel electrode 164, it is preferable to stack a metal layer such as aluminum (Al) or silver (Ag). Alternatively, as shown in FIG. 3, a third insulating layer 162 and a second capacitor electrode 160 are provided under a pixel electrode 164 made of ITO or the like to form a second capacitor 144, and the second capacitor electrode 160 is made of a metal material. It may be formed by combining the function of a reflector.

  Since the counter electrode 168 transmits light emitted from the organic layer 166, the transparent electrode such as ITO (tin oxide-added indium oxide) or IZO (indium oxide / zinc oxide) having translucency and conductivity is used. It is preferable that it is formed.

  A sealing layer 172 is provided over the light-emitting element 140. The sealing layer 172 covers the light emitting element 140 and is provided to prevent entry of moisture and the like. The sealing layer 172 preferably has a light-transmitting property with a film such as silicon nitride or aluminum oxide. In addition, a filler may be provided between the second substrate 104 and the upper portion of the sealing layer 172. The second substrate 104 is provided with a light shielding layer 182 and a color filter layer 184. By providing the color filter layer 184 when white light is emitted from the light emitting element 140, the display device 100 can perform color display.

  In FIG. 2, the first wiring extension region 128 is provided with a wiring 176. The first wiring extension region 128 is provided with an opening 174 that penetrates the second insulating layer 158, and a third insulating layer 162 is provided along the opening. The opening 174 is provided along at least one side of the pixel region 106 and separates the second insulating layer 158 into a region on the pixel region 106 side and a region on the driver circuit region 112 side. Further, the bank layer 170 is similarly divided by the opening 174. The counter electrode 168 provided so as to cover the upper surface of the bank layer 170 extends from the pixel region 106, is provided along the opening 174, and includes a region continuous over the drive circuit region 112. Further, a sealing layer 172 is provided so as to cover the entire surface of the counter electrode 168.

  The first wiring extension region 128 has an opening 174 that divides the second insulating layer 158 and the bank layer 170 formed of an organic resin material, and is formed of an inorganic material so as to cover the side surface and the bottom surface thereof. By providing the three insulating layers and the counter electrode 168, a sealing structure is provided. The third insulating layer 162 and the counter electrode 168 are provided in close contact with each other at the bottom of the opening 174 formed in the second insulating layer 158 and the bank layer 170. By interposing the second insulating layer or the bank layer 170 formed of an organic resin material in this manner with an inorganic material layer, intrusion of moisture or the like from the sealing region 110 side to the pixel region 106 can be prevented. That is, with this sealing structure, moisture or the like can be prevented from entering the pixel region 106 through the second insulating layer 158 or the bank layer 170 formed of an organic resin material.

  In the present embodiment, a region provided with the opening 174 that separates the second insulating layer 158 and the bank layer 170 is also referred to as a “first region 114”. Further, the stacked structure of the opening 174 that divides the second insulating layer and the bank layer 170 and the counter electrode 168 and the sealing layer 172 provided along the opening 174 prevents moisture from entering the organic layer 166. Therefore, it is also referred to as “moisture blocking region” or “moisture blocking structure”.

  The first wiring extension region 128 is provided between the pixel region 106 and the drive circuit region 112. However, as another form, the first wiring extension region 128 is provided in a part of the drive circuit region 112. It may be.

  The first substrate 102 has a region (hereinafter, this region is also referred to as a “second region 116”) having a substrate thickness different from a surface opposite to the first surface (hereinafter also referred to as a “second surface”). ) Is included. The second region 116 is provided so as to at least partially overlap the first region. For example, the second region 116 may be provided wider than the first region 114. In the first substrate 102, the second region 116 is thinner than the other regions. That is, the substrate thickness of the second region 116 is smaller than the substrate thickness of the pixel region 106 of the first substrate 102.

  The second region 116 may have a concave groove provided on the second surface of the first substrate 102. In the second region 116, the concave groove has a depth that does not penetrate the first substrate 102. For example, the plate thickness in the second region 116 may be thinned at a rate of 20% to 80% with respect to the plate thickness in the other region of the first substrate 102. For example, the plate thickness in the second region 116 may be 0.5 times the thickness of the other region of the first substrate 102.

  In the driver circuit region 112, a transistor 138 is provided to form a circuit. A contact portion 180 in which the counter electrode 168 is electrically connected to the lower wiring 178 may be included. The counter electrode 168 is controlled to a constant potential by being connected to the wiring 178. In the driver circuit region 112, a signal processing circuit is formed using a transistor having the same structure as the transistor 138 provided in the pixel region 106.

  A sealing material 134 is provided in the sealing region 110. The sealing material 134 bonds the first substrate 102 and the second substrate 104. A region between the first substrate 102 and the second substrate 104 is blocked from the atmosphere by the sealing material 134, and the pixel region 106 is sealed therein.

  The second substrate 104 is disposed to face the first substrate 102 and is provided so as to cover the sealing region 110, the drive circuit region 112, the first wiring extension region 128, and the pixel region 106. A color filter layer 184 and a light shielding layer 182 may be provided on a surface (hereinafter, also referred to as “third surface”) of the second substrate 104 facing the first surface of the first substrate 102.

  In addition, the second substrate 104 has a surface (hereinafter, also referred to as “fourth surface”) opposite to the third surface and a region having a different substrate thickness (hereinafter, referred to as “third region 118”). Say.) The third region 118 is provided so as to at least partially overlap the first region. In other words, the third region 118 is provided so as to overlap the second region. In the second substrate 104, the third region 118 has a smaller substrate thickness than other regions. That is, the substrate thickness of the third region 118 is smaller than the substrate thickness of the pixel region 106 of the second substrate 104.

  In the present embodiment, the display device 100 is provided with a concave groove having a thin substrate thickness in the second region of the first substrate 102 and the third region of the second substrate 104. Since the second region 116 and the third region 118 are regions for intentionally adjusting the thickness of the substrate, they are also referred to as “substrate thickness adjusting regions” in the present invention. FIG. 2 shows a mode in which this substrate thickness adjustment region is provided on both the first substrate 102 and the second substrate 104. However, the present invention is not limited to this, and the substrate thickness adjustment region may be provided on one of the first substrate 102 and the second substrate 104.

  FIG. 4 shows an example in which the first substrate 102 and the second substrate 104 are bent at the bent portion 120 toward the second surface side of the first substrate 102. By bending the first substrate 102 and the second substrate 104, the drive circuit region 112 is disposed on the back side of the pixel region 106. The first substrate 102 and the second substrate 104 are bent at the bent portion 120. However, an element such as a transistor is not provided in the bent portion 120, and a wiring 176 is provided. The wiring 176 is formed of a metal material such as aluminum and has plasticity, so that the conductivity is not lowered even when the substrate is bent.

  Since the second region 116 of the first substrate 102 is thinned and the third region 118 of the second substrate 104 is thinned, the stress on the substrate is relieved even if it is bent about 180 degrees. The angle at which the first substrate 102 and the second substrate 104 are bent is arbitrary, and may be approximately 180 degrees, or may be bent at an angle of 90 degrees, for example.

  In the display device 100, when the light emission direction from the light emitting element 140 is on the second substrate 104 side (in the case of a top emission type), the drive circuit region 112 is placed on the first substrate 102 side in the bent portion 120. When the light emission direction from the light emitting element 140 is the first substrate 102 side (in the case of a bottom emission type), the drive circuit region 112 may be bent to the second substrate 104 side at the bent portion 120. In any case, as shown in FIG. 4, the display device 100 can be narrowed by bending the drive circuit region 112 so as to be on the back side of the pixel region 106.

  As shown in FIG. 5, a plurality of concave grooves provided in the second region 116 and the third region 118 as the substrate thickness adjustment region may be provided. By providing a plurality of concave grooves, the bending stress generated in the bent portion 120 can be dispersed. Further, the width of the second region 116 and the third region 118 (the length connecting the pixel region 106 and the drive circuit region 112) can be adjusted by the length of the first wiring extension region 128. For example, the widths of the second region 116 and the third region 118 may be adjusted according to the radii of curvature for bending the first substrate 102 and the second substrate 104.

  Since the second region 116 of the first substrate 102 is thinner than the other regions, the rigidity of the substrate is relatively lowered. The same applies to the third region 118 of the second substrate. Since the display device 100 includes such a substrate thickness adjustment region, the display device 100 can be easily bent at that portion. In other words, a region where the first substrate 102 and the second substrate 104 are bent can be designated with the substrate thickness adjustment region as a bent portion.

  In the case where the substrate thickness adjustment region is provided on both the first substrate 102 and the second substrate 104, the widths of the regions may be the same. Further, the width of the substrate thickness adjustment region of the substrate located outside when the substrate is bent may be set wider than the width of the substrate thickness adjustment region relative to the substrate located inside. As described above, the stress can be more effectively reduced by setting the width of the substrate thickness adjustment region of the substrate located on the outer side to be wider than that on the inner side.

  Further, the first region 114 has a structure in which the second insulating layer 158 and the bank layer 170 are removed, and a part of the layers is omitted in the internal structure of the display device 100. The second region 116 is provided so as to at least partially overlap the first region 114. The same applies to the third region 118 that overlaps the second region 116. As described above, by providing the second region 116 and the third region 118 so as to overlap the first region 114, the superimposed region is a region whose rigidity is lower than that of the other regions of the display device 100. It can be. In other words, it is possible to bend the display device 100 by using a region where the second region 116 or the third region 118 overlaps the first region 114 as a bent portion. In this case, although the wiring 176 is present in the first region 114, no element such as a transistor is present, so that a decrease in reliability due to bending stress can be prevented.

<Appearance of display device>
FIG. 6 shows a perspective view of the display device 100 described in FIG. In the display device 100, the first surface of the first substrate 102 and the third surface of the second substrate 104 are arranged to face each other, and the pixel region 106 is provided therebetween. In the pixel region 106, a plurality of pixels are arranged to form a display screen. On the second surface of the first substrate 102, there is a second region 116 formed so that the thickness of the substrate is reduced. The second region 116 extends from one end of the first substrate 102 to the other end along one side of the pixel region 106. FIG. 6 shows a mode in which the second region 116 is provided on one side of the pixel region 106 and another side extending opposite and parallel to the one side in the first substrate 102.

  Further, the third surface of the second substrate 104 has a third region 118 formed so that the thickness of the substrate is reduced. The third region 118 extends from one end of the second substrate 104 to the other end along one side of the pixel region 106. FIG. 6 shows a mode in which the third region 118 is provided on one side of the pixel region 106 and the other side extending opposite to and parallel to the one side in the second substrate 104.

  In the second region 116 and the third region 118, the thin region is provided as a slit-like groove. However, the present invention is not limited to such an embodiment, and in the second region 116 and the third region 118, the concave groove regions may be arranged discontinuously and spaced apart in a row. For example, a region in which a plurality of fine small holes are provided may be provided in a band shape. Further, the second region 116 and the third region 118 may be provided with a plurality of slit-shaped grooves.

  FIG. 7 shows a cross-sectional structure corresponding to the line E-F shown in FIG. The display device 100 includes a pixel region 106, a first wiring extension region 128, and a drive circuit region 112. The first substrate 102 is formed in the second region 116 such that the thickness of the substrate is thinner than other regions. In addition, the second substrate 104 is formed in the third region 118 so that the thickness of the substrate is thinner than other regions. The second region 116 and the third region 118 are provided so as to overlap. As described above, the substrate thickness adjustment region in which the first substrate 102 and the second substrate 104 are partially thinned is arranged so as to be included in the first wiring extension region 128.

  FIG. 8 shows a mode in which the first substrate 102 and the second substrate 104 are bent in this substrate thickness adjustment region. FIG. 8 shows a mode in which the drive circuit region 112 is bent to a surface (back surface side) opposite to the display screen formed by the pixel region 106 in the display device 100. Accordingly, the drive circuit region 112 is disposed on the back side of the display screen, and the display device 100 can be narrowed. That is, according to the present embodiment, the substrate thickness adjustment region can be bent with priority, and the pixel region 106 and the drive circuit region 112 can be prevented from bending. Therefore, bending stress can be prevented from acting on the pixel region 106 and the drive circuit region 112. In addition, since the position where the display device 100 is bent is specified, the product shape can be stabilized.

  In the present embodiment, the direction in which the second region 116 and the third region 118 as the substrate thickness adjustment region are extended is not limited to one direction. As shown in FIG. 9, in addition to providing the second region 116a and the third region 118a between the pixel region 106 and the first drive circuit 124, the second region 116b and the third region 118b intersect with each other. May be provided. Similarly, the second region 116b and the third region 118b can function as substrate thickness adjustment regions.

  As shown in FIG. 6, the second region 116 provided on the first substrate 102 and the third region 118 provided on the second substrate 104 are processed to reduce the thickness of the substrate. Such a shape can be formed by laser processing, polishing processing, or etching processing of the substrate. Further, the substrate may be molded from the beginning so that the thin plate region is included. Further, as shown in FIG. 10, the first substrate 102 having a constant thickness is reinforced so that the region other than the second region 116 and the region other than the third region 118 in the second substrate 104 are thicker. A member 186a and a reinforcing member 186b may be provided. As shown in FIG. 10, the substrate thickness adjustment region may be provided by providing a reinforcing member on the first substrate 102 or the second substrate 104. For example, a reinforcing member 186a can be provided in a region other than the second region 116 with respect to the flexible first substrate 102 so that the second region 116 becomes a bent portion. As the reinforcing member 186a, a plate-like member made of glass, metal, plastic or the like and harder than the first substrate 102 can be used. In the second substrate 104 as well, by providing the reinforcing member 186c in a region other than the third region 118, the bent portion can be similarly specified. Although FIG. 10 shows a mode in which the bent portion is provided in one direction, as shown in FIG. 9, the bent portion may be provided in one direction and in a direction intersecting with this.

  As described above, according to an embodiment of the present invention, by providing a region in which the substrate thickness is adjusted in a part of the display device, it is easy to specify the position where the substrate is bent, and the product shape is stabilized. be able to. In addition, a difference in stress between the front and back surfaces of the substrate at the bent portion of the substrate can be reduced, and a reduction in the reliability of the display device can be prevented.

DESCRIPTION OF SYMBOLS 100 ... Display apparatus, 102 ... 1st board | substrate, 104 ... 2nd board | substrate, 106 ... Pixel area, 108 ... Frame area, 110 ... Sealing area, 112 ... Drive Circuit area 114... First area 116... Second area 118. Third area 120. Bending portion 122. ... Second drive circuit, 128 ... first wiring extension region, 130 ... second wiring extension region, 134 ... seal material, 136 ... terminal portion, 138 ... transistor, 140. ..Light emitting element, 142... First capacitor element, 144... Second capacitor element, 146... Semiconductor layer, 148... Gate insulating layer, 150. 1 capacitor electrode, 154... First insulating layer, 156... Source / drain Pole, 158 ... second insulating layer, 160 ... second capacitor electrode, 162 ... third insulating layer, 164 ... pixel electrode, 166 ... organic layer, 168 ... counter electrode, 170 ... bank layer, 172 ... sealing layer, 174 ... opening, 176 ... wiring, 178 ... wiring, 180 ... contact part, 182 ... light shielding layer, 184 ... ..Color filter layers, 186 ... reinforcing members

Claims (15)

A flexible first substrate;
A transistor provided on the first surface of the first substrate; a planarization layer provided on the transistor; a pixel electrode electrically connected to the transistor on the planarization layer; A pixel region having an inner region exposed and a bank layer covering a peripheral portion and an outer region from the peripheral portion; and
A first region having an opening for separating the planarization layer and the bank layer along at least one side of the pixel region, the planarization layer and the bank layer extending from the pixel region;
Have
The display device according to claim 1, wherein the first substrate has a second region having a thin substrate thickness on a second surface opposite to the first surface, and the second region overlaps the first region.   The display device according to claim 1, wherein the pixel region includes an organic layer including a light emitting material provided on the pixel electrode, and a counter electrode provided on the organic layer. A second flexible substrate disposed opposite to the first surface of the first substrate and having a gap;
2. The second substrate according to claim 1, wherein the second substrate has a third region having a thin substrate thickness on a surface opposite to the surface facing the first substrate, and the third region overlaps the second region. Display device.   The display device according to claim 3, wherein the second substrate is provided with a color filter layer corresponding to the pixel electrode on a surface facing the first surface of the first substrate.   The display device according to claim 3, further comprising a filler between the first substrate and the second substrate.   2. The display device according to claim 1, wherein the second region is provided from one end side of the first substrate to another opposite end side, and the first substrate is bent along the second region. .   The third region is provided from one end side of the second substrate to another end side facing the second substrate, and the first substrate and the second substrate are bent along the third region. The display device described in 1.   The display device according to claim 1, wherein the second region includes a concave groove.   The display device according to claim 1, wherein the second region includes a plurality of concave grooves.   The display device according to claim 1, wherein the second region is provided with recessed grooves.   The display device according to claim 3, wherein the third region includes a concave groove.   The display device according to claim 3, wherein the third region includes a plurality of concave grooves.   The display device according to claim 3, wherein in the third region, recessed grooves are provided apart from each other.   The display device according to claim 1, wherein the first substrate includes a drive circuit in an outer region of the second region.   The display device according to claim 1, wherein the first substrate includes a sealing region in an outer region of the second region.

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