JP2020189307A - Joining sheet and method of manufacturing joining body - Google Patents

Joining sheet and method of manufacturing joining body Download PDF

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JP2020189307A
JP2020189307A JP2019094694A JP2019094694A JP2020189307A JP 2020189307 A JP2020189307 A JP 2020189307A JP 2019094694 A JP2019094694 A JP 2019094694A JP 2019094694 A JP2019094694 A JP 2019094694A JP 2020189307 A JP2020189307 A JP 2020189307A
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layer
brazing material
brazing
joining
metal
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佐藤 敏一
Toshiichi Sato
敏一 佐藤
臼井 正則
Masanori Usui
正則 臼井
宏文 伊藤
Hirofumi Ito
宏文 伊藤
智幸 庄司
Tomoyuki Shoji
智幸 庄司
林太郎 淺井
Rintaro Asai
林太郎 淺井
青島 正貴
Masaki Aoshima
正貴 青島
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Toyota Motor Corp
Toyota Central R&D Labs Inc
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Toyota Motor Corp
Toyota Central R&D Labs Inc
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Abstract

To provide a joining sheet that can achieve compatibility of heat conductivity and joinability during brazing.SOLUTION: The present invention is a joining sheet having a metallic layer (30), a first layer (31) composed of a first brazing material formed on a first surface of the first layer, and a second layer (32) composed of a second brazing material formed on a second surface of the metallic layer. The metallic layer is composed of high heat conductive metal having a higher melting point than that of the first brazing material and the second brazing material and having a heat conductivity of 300 W/mk or higher. A thickness of the metallic layer is more than 50% relative to the thickness of the whole joining sheet. At least the first brazing material contains 1-10 mass% of an active metallic element in total. When joining, for example, a graphite plate (first layer side) and a copper plate (second layer side) using this joining sheet, high heat conductivity can be secured in their joining parts without causing peeling or warping.SELECTED DRAWING: Figure 1

Description

本発明は、ろう付けに用いる接合シート等に関する。 The present invention relates to a joining sheet or the like used for brazing.

部材同士の接合方法の一つに、ろう付けがある。ろう付けは、接合される部材の融点よりも低温で溶融する溶加材を用いて接合する点で、はんだ付けと共通する。但し、ろう付けは、溶加材(ろう材)の融点(液相線温度)が450℃以上であり、その融点が450℃未満であるはんだ付けと区別されている。 Brazing is one of the methods for joining members. Brazing is common to soldering in that it is joined using a filler material that melts at a temperature lower than the melting point of the members to be joined. However, brazing is distinguished from soldering in which the melting point (liquidus temperature) of the filler metal (brazing material) is 450 ° C. or higher and the melting point is less than 450 ° C.

ところで、ろう付けを適切に行うためには、被接合面に対する溶融したろう材のぬれ性を確保する必要がある。接合される部材(適宜「被接合部材」という。)が、表面エネルギーの小さい炭素系材料(グラファイト等)やセラミックス等からなる場合、ぬれ性を確保するために、活性金属元素を含むろう材(活性金属ろう)が用いられる。これに関連する記載が、例えば、下記の特許文献にある。 By the way, in order to perform brazing properly, it is necessary to ensure the wettability of the molten brazing material with respect to the surface to be joined. When the member to be joined (appropriately referred to as "member to be joined") is made of a carbon-based material (graphite or the like) or ceramics having a small surface energy, a brazing material containing an active metal element (to ensure wettability) ( Active metal wax) is used. A description related to this is found in, for example, the following patent documents.

特開昭64−87059号公報Japanese Unexamined Patent Publication No. 64-87059

特許文献1は、被接合部材の材質に応じた活性金属量の最適化と、活性金属の活性低下防止を図るため、塊状の活性金属を表層部にだけ埋設したろう材を提案している。 Patent Document 1 proposes a brazing material in which a massive active metal is embedded only in the surface layer portion in order to optimize the amount of active metal according to the material of the member to be joined and prevent the activity of the active metal from decreasing.

しかし、特許文献1のようなろう材を用いて高熱伝導部材(グラファイト等)をろう付けした場合、接合体の熱伝導性が大きく低下することがわかった。これは、活性金属元素が接合層中で固溶または析出して、接合層の熱抵抗を高めるためと考えられる。 However, it has been found that when a high thermal conductive member (graphite or the like) is brazed using a brazing material as in Patent Document 1, the thermal conductivity of the bonded body is significantly reduced. It is considered that this is because the active metal element dissolves or precipitates in the bonding layer to increase the thermal resistance of the bonding layer.

本発明はこのような事情に鑑みて為されたものであり、ろう付けにより形成された接合部の高熱伝導性を確保できる接合シート等を提供することを目的とする。 The present invention has been made in view of such circumstances, and an object of the present invention is to provide a joint sheet or the like capable of ensuring high thermal conductivity of a joint portion formed by brazing.

本発明者はこの課題を解決すべく鋭意研究した結果、高熱伝導金属層とろう材を組合わせた接合シートを用いることにより、接合部の高熱伝導性を確保することに成功した。この成果を発展させることにより、以降に述べる本発明を完成するに至った。 As a result of diligent research to solve this problem, the present inventor has succeeded in ensuring high thermal conductivity of the joint portion by using a bonding sheet in which a high thermal conductive metal layer and a brazing material are combined. By developing this result, the present invention described below has been completed.

《接合シート》
(1)本発明は、金属層と、該金属層の第1面上に形成された第1ろう材からなる第1層と、該金属層の第2面上に形成された第2ろう材からなる第2層と、を備える接合シートであって、該金属層は、該第1ろう材および該第2ろう材よりも融点が高いと共に熱伝導率が300W/m・K以上である高熱伝導金属からなり、該金属層の厚さは、該接合シート全体の厚さに対して50%以上あり、該第1ろう材は、該第1ろう材全体に対して、活性金属元素を合計で1〜10質量%含む接合シートである。
《Joint sheet》
(1) In the present invention, a first layer composed of a metal layer, a first brazing material formed on the first surface of the metal layer, and a second brazing material formed on the second surface of the metal layer. A bonding sheet comprising a second layer composed of, wherein the metal layer has a higher melting point than the first brazing material and the second brazing material and a thermal conductivity of 300 W / m · K or more. It is composed of a conductive metal, and the thickness of the metal layer is 50% or more with respect to the thickness of the entire bonded sheet, and the first brazing material is the sum of active metal elements with respect to the entire first brazing material. It is a bonding sheet containing 1 to 10% by mass.

(2)本発明の接合シートは、先ず、第1層を構成する第1ろう材が活性金属を含む。このため、少なくとも第1層側において、炭素系材料やセラミックス等のろう付けが可能となる。 (2) In the bonded sheet of the present invention, first, the first brazing material constituting the first layer contains an active metal. Therefore, brazing of carbon-based materials, ceramics, etc. is possible at least on the first layer side.

次に、本発明の接合シートの大部分は、各ろう材よりも高融点で高熱伝導な金属層が占める。この金属層は、ろう付け(加熱)後も、その殆どが残存する。このため、接合部における熱伝導性は、ほぼ、その残存した金属層の熱伝導性が支配的となり、ろう付け後に形成された接合部は高い熱伝導性を発揮する。換言すると、第1層に含まれていた活性金属元素は、被接合面の界面近傍にある薄い接合層に留められる。このため、接合部全体として観れば、活性金属元素による熱抵抗の上昇が抑制され、高熱伝導性が確保される。 Next, most of the bonded sheet of the present invention is occupied by a metal layer having a higher melting point and higher thermal conductivity than each brazing material. Most of this metal layer remains even after brazing (heating). Therefore, the thermal conductivity of the joint portion is almost dominated by the thermal conductivity of the remaining metal layer, and the joint portion formed after brazing exhibits high thermal conductivity. In other words, the active metal element contained in the first layer is retained in a thin bonding layer near the interface of the surface to be bonded. Therefore, when viewed as a whole, the increase in thermal resistance due to the active metal element is suppressed, and high thermal conductivity is ensured.

ちなみに、金属層を構成する高熱伝導金属は、通常、低ヤング率(高延性)でもある。また、ろう付け後に残存した金属層は十分な厚さを有する。このため、金属層は、ろう付け後の接合部に作用する残留応力や、接合体の使用により生じる熱応力等を緩和し得る。従って、本発明の接合シートを用いると、接合不良の抑止や接合体の耐久性(信頼性)の向上等も期待される。このような金属層による応力緩和性は、特に、熱膨張係数差(CTE(Coefficient of Thermal Expansion)不整合)が大きくて、残留応力や熱応力が作用し易い異種部材をろう付けするときに有効となる。 By the way, the high thermal conductive metal constituting the metal layer usually has a low Young's modulus (high ductility). Further, the metal layer remaining after brazing has a sufficient thickness. Therefore, the metal layer can relieve the residual stress acting on the joint portion after brazing, the thermal stress generated by the use of the joint body, and the like. Therefore, when the bonding sheet of the present invention is used, it is expected that the bonding failure can be suppressed and the durability (reliability) of the bonded body can be improved. Such stress relaxation properties due to the metal layer are particularly effective when brazing dissimilar members having a large difference in coefficient of thermal expansion (CTE (Coefficient of Thermal Expansion)) and where residual stress or thermal stress is likely to act. It becomes.

《接合体の製造方法》
本発明は、上述した接合シートを用いた部材同士の接合方法(接合体の製造方法)としても把握できる。例えば、本発明は、第1部材と第2部材を接合した接合体の製造方法であって、上述した接合シートを介装した該第1部材(第1層側)と該第2部材(第2層側)を、前記金属層の融点未満で、前記第1ろう材および前記第2ろう材が溶融する温度以上で加熱するろう付け工程を備える接合体の製造方法でもよい。なお、第1ろう材は活性金属元素を含むため、接合シートの第1層側には、例えば、被接合面が炭素系材料(グラファイト等)やセラミックスからなる第1部材が接合され得る。
<< Manufacturing method of joint >>
The present invention can also be grasped as a method of joining members (a method of manufacturing a joined body) using the above-mentioned joining sheet. For example, the present invention is a method for manufacturing a joined body in which a first member and a second member are joined, wherein the first member (first layer side) and the second member (first layer side) sandwiching the above-mentioned joining sheet are provided. A method for producing a bonded body including a brazing step of heating the second layer side) at a temperature lower than the melting point of the metal layer and at a temperature higher than the temperature at which the first brazing material and the second brazing material are melted may be used. Since the first brazing material contains an active metal element, for example, a first member whose surface to be bonded is made of a carbon-based material (graphite or the like) or ceramics can be bonded to the first layer side of the bonding sheet.

《接合体》
本発明は、その接合体としても把握できる。例えば、本発明は、第1部材と、該第1部材と接合され得る第2部材と、該第1部材と該第2部材を接合する接合部とを備える接合体であって、該接合部は、金属層と、該金属層と該第1部材をろう付けする第1接合層と、該金属層と該第2部材をろう付けする第2接合層とを有し、該金属層は、該第1接合層および該第2接合層よりも融点が高いと共に熱伝導率が300W/m・K以上である高熱伝導金属からなり、該金属層の厚さは該接合部全体の厚さに対して50%以上あり、該第1接合層は、該第1接合層全体に対して、活性金属元素を合計で1〜10質量%含む接合体でもよい。
《Joint body》
The present invention can also be grasped as the bonded body. For example, the present invention is a joint body including a first member, a second member that can be joined to the first member, and a joint portion that joins the first member and the second member. Has a metal layer, a first bonding layer for brazing the metal layer and the first member, and a second bonding layer for brazing the metal layer and the second member. It is composed of the first joint layer and a high thermal conductive metal having a higher melting point than the second joint layer and a thermal conductivity of 300 W / m · K or more, and the thickness of the metal layer is the thickness of the entire joint. On the other hand, the first bonding layer may be a bonded body containing 1 to 10% by mass of active metal elements in total with respect to the entire first bonding layer.

活性金属元素を含む第1接合層により接合される第1部材は、例えば、炭素系材料(グラファイト等)やセラミックスからなる被接合面を有する。第2接合層が活性金属元素を含まないとき、その第2接合層により接合される第2部材は、例えば、金属からなる被接合面を有する。第2接合層が活性金属元素を含むとき、その第2接合層により接合される第2部材は、第1部材と同様に、例えば、炭素系材料やセラミックスからなる被接合面を有する。 The first member bonded by the first bonding layer containing an active metal element has, for example, a surface to be bonded made of a carbon-based material (graphite or the like) or ceramics. When the second bonding layer does not contain an active metal element, the second member bonded by the second bonding layer has, for example, a surface to be bonded made of metal. When the second bonding layer contains an active metal element, the second member bonded by the second bonding layer has, like the first member, a surface to be bonded made of, for example, a carbon-based material or ceramics.

《その他》
(1)本明細書では、説明の便宜上、第1または第2という呼称を用いている。そして、少なくとも「第1」側が、活性金属元素を含むろう材(適宜「活性金属ろう」という。)により接合される側としている。「第2」側は、「第1」側と同じ構成でもよいし、異なる構成でもよい。
《Others》
(1) In the present specification, the names of the first or the second are used for convenience of explanation. Then, at least the "first" side is the side to be joined by a brazing material containing an active metal element (appropriately referred to as "active metal brazing"). The "second" side may have the same configuration as the "first" side, or may have a different configuration.

(2)特に断らない限り本明細書でいう「x〜y」は下限値xおよび上限値yを含む。本明細書に記載した種々の数値または数値範囲に含まれる任意の数値を、新たな下限値または上限値として「a〜b」のような範囲を新設し得る。また、特に断らない限り、本明細書でいう「x〜yμm」はxμm〜yμmを意味する。他の単位系についても同様である。 (2) Unless otherwise specified, "x to y" in the present specification includes a lower limit value x and an upper limit value y. Any numerical value included in the various numerical values or numerical ranges described in the present specification may be newly established in a range such as "ab" as a new lower limit value or upper limit value. Further, unless otherwise specified, "x to y μm" in the present specification means x μm to y μm. The same applies to other unit systems.

接合シートを用いた接合過程を模式的に示す断面図である。It is sectional drawing which shows typically the joining process using the joining sheet.

本発明の構成要素に、本明細書中から任意に選択した一以上の構成要素を付加し得る。本明細書で説明する内容は、本発明の接合シートや接合体のみならず、それらの製造方法にも該当し得る。「方法」に関する構成要素は「物」に関する構成要素ともなり得る。 One or more components arbitrarily selected from the present specification may be added to the components of the present invention. The contents described in the present specification may apply not only to the bonded sheet and the bonded body of the present invention, but also to the manufacturing method thereof. A component related to "method" can also be a component related to "thing".

《接合シート》
接合シートは、芯材となる金属層と、その各面に形成されたろう材層である第1層および第2層を有する。以下、それらについて詳述する。
《Joint sheet》
The joining sheet has a metal layer serving as a core material, and first and second layers which are brazing material layers formed on the respective surfaces thereof. These will be described in detail below.

(1)金属層
金属層は、ろう付け時の温度(接合温度)よりも高い融点を有し、熱伝導率が300W/m・K以上さらには350W/m・K以上である高熱伝導金属からなるとよい。高熱伝導金属は、例えば、金、銀または銅のいずれかである。これらは純金属であるとよい。なお、本明細書でいう純金属(純銀等)は、純度(質量割合)が98%以上さらには99%以上の金属である。
(1) Metal layer The metal layer is made of a highly thermally conductive metal having a melting point higher than the temperature at the time of brazing (bonding temperature) and having a thermal conductivity of 300 W / m · K or more and further 350 W / m · K or more. It should be. The highly thermally conductive metal is, for example, either gold, silver or copper. These may be pure metals. The pure metal (pure silver, etc.) referred to in the present specification is a metal having a purity (mass ratio) of 98% or more, further 99% or more.

ちなみに、金は、融点:1064℃、熱伝導率:319W/m・K、ヤング率:78GPaである。銀は、融点:962℃、熱伝導率:428W/m・K、ヤング率:83GPaである。銅は、融点:1085℃、熱伝導率:408W/m・K、ヤング率:130GPaである。特に(純)銀は、熱伝導率が非常に大きく、軟質(低ヤング率、高延性)であり、熱伝導性および応力緩和性に優れる。 By the way, gold has a melting point: 1064 ° C., a thermal conductivity: 319 W / m · K, and a Young's modulus: 78 GPa. Silver has a melting point: 962 ° C., a thermal conductivity: 428 W / m · K, and a Young's modulus: 83 GPa. Copper has a melting point of 1085 ° C., a thermal conductivity of 408 W / m · K, and a Young's modulus of 130 GPa. In particular, (pure) silver has a very high thermal conductivity, is soft (low Young's modulus, high ductility), and is excellent in thermal conductivity and stress relaxation.

金属層の厚さは、接合シート全体の厚さに対して50%以上、70%以上さらには85%以上あるとよい。接合シート全体(または接合部全体)に対する金属層の厚さ比率を高めることにより、相対的にろう材層(接合層)が薄くなり、接合部の熱伝導性が高まる。また、金属層が厚くなるほど、金属層による応力緩和性も高まるが、その分、接合部の熱伝導性は低下する。そこで金属層の厚さは、例えば、10〜500μm、30〜400μmさらには50〜300μmとするとよい。 The thickness of the metal layer is preferably 50% or more, 70% or more, and further 85% or more with respect to the thickness of the entire bonded sheet. By increasing the thickness ratio of the metal layer to the entire joint sheet (or the entire joint portion), the brazing material layer (joint layer) becomes relatively thin, and the thermal conductivity of the joint portion increases. Further, as the metal layer becomes thicker, the stress relaxation property due to the metal layer also increases, but the thermal conductivity of the joint portion decreases accordingly. Therefore, the thickness of the metal layer may be, for example, 10 to 500 μm, 30 to 400 μm, or even 50 to 300 μm.

金属箔により金属層を形成すると、接合シートを効率的に製造できる。金属箔は、例えば、金箔、銀箔または銅箔のいずれかである。金、銀または銅は展延性に優れるため、所望厚さの金属箔が得られる。 When the metal layer is formed from the metal foil, the bonded sheet can be efficiently manufactured. The metal foil is, for example, either gold foil, silver foil or copper foil. Since gold, silver or copper has excellent malleability, a metal foil having a desired thickness can be obtained.

(2)ろう材層(第1層、第2層)
ろう材の種類(組成)、厚さ等は、被接合部材に応じて選択され得る。このため、第1層と第2層は、材質や形態(厚さ等)が同じでも異なっていてもよい。
(2) Wax layer (first layer, second layer)
The type (composition), thickness, etc. of the brazing material can be selected according to the member to be joined. Therefore, the first layer and the second layer may be the same or different in material and form (thickness, etc.).

ろう材には、銀ろう、金ろう、銅ろう、黄銅ろう、アルミニウムろう、ニッケルろう等がある。被接合部材の材質に応じて選択される。いずれのろう材も、共晶合金系とすることにより、融点(ろう付け温度)を低下させることができる。 The brazing material includes silver brazing, gold brazing, copper brazing, brass brazing, aluminum brazing, nickel brazing and the like. It is selected according to the material of the member to be joined. By using a eutectic alloy system for any of the brazing materials, the melting point (brazing temperature) can be lowered.

銀ろうは、炭素系材料(グラファイト等)やセラミックス等の接合にも、多くの金属材料の接合にも利用され、熱伝導性も良好である。銀ろうは、主成分(残部)であるAgに加えて、通常、Cuを含む銀合金(主にAg−Cu系共晶合金)からなる。銀ろうは、Zn、Sn、Niのいずれかを一種以上を含んでもよい。各層のろう材全体を100質量%として、例えば、Cu:20〜35質量%、Zn:0〜20質量%、Sn:0〜10質量%、Ni:0〜5質量%とするとよい。なお、Zn、SnおよびNiのいずれか一種以上が含まれるとき、その下限値は1質量%とするとよい。 Silver wax is used for joining carbon-based materials (graphite, etc.), ceramics, etc., as well as for joining many metal materials, and has good thermal conductivity. Silver wax is usually composed of a silver alloy containing Cu (mainly an Ag-Cu eutectic alloy) in addition to Ag, which is the main component (remaining portion). The silver wax may contain one or more of Zn, Sn, and Ni. It is preferable that the entire brazing material of each layer is 100% by mass, for example, Cu: 20 to 35% by mass, Zn: 0 to 20% by mass, Sn: 0 to 10% by mass, and Ni: 0 to 5% by mass. When any one or more of Zn, Sn and Ni are contained, the lower limit value may be 1% by mass.

アルミニウムやその合金からなる部材を接合するときは、アルミニウムろうを用いるとよい。アルミニウムろうは、アルミニウム合金からなり、主成分(残部)であるAlに加えて、通常、Siを含むアルミニウム合金(主にAl−Si系共晶合金)からなる。アルミニウムろうは、その全体を100質量%として、例えば、Si:5〜20質量%を含む。アルミニウムろうは、さらに、MgまたはBiのいずれかを一種以上を含んでもよい。 When joining members made of aluminum or its alloys, aluminum brazing may be used. Aluminum wax is made of an aluminum alloy, and is usually made of an aluminum alloy containing Si (mainly an Al—Si eutectic alloy) in addition to Al which is the main component (remaining part). Aluminum wax contains, for example, Si: 5 to 20% by mass, with the total amount being 100% by mass. The aluminum wax may further contain one or more of either Mg or Bi.

炭素系材料やセラミックス等からなる部材のろう付けは、活性金属法によると、メタライズ法で必要な前処理を省略でき、効率的である。活性金属法で用いるろう材は、例えば、上述した組成範囲に加えて、活性金属元素を合計で1〜10質量%さらには3〜8質量%含むとよい。活性金属元素が過少では、ぬれ性が不十分となり、接合が困難となる。活性金属元素が過多になると、接合層の熱抵抗が増す。 According to the active metal method, brazing of members made of carbon-based materials, ceramics, etc. is efficient because the pretreatment required for the metallizing method can be omitted. The brazing material used in the active metal method may contain, for example, 1 to 10% by mass and further 3 to 8% by mass of active metal elements in total, in addition to the composition range described above. If the amount of active metal element is too small, the wettability becomes insufficient and bonding becomes difficult. When the amount of active metal element is excessive, the thermal resistance of the bonding layer increases.

活性金属元素は、例えば、Ti、Zr、Hf、Ta等である。特に、活性金属元素は、TiとZrの少なくとも一方を含むとよい。 The active metal element is, for example, Ti, Zr, Hf, Ta and the like. In particular, the active metal element may contain at least one of Ti and Zr.

第1層と第2層は、例えば、厚さが1〜50μmさらには2〜10μmとするとよい。その厚さが過小では、接合強度の確保に必要となる反応層の形成が不十分となる。その厚さが過大になると、接合層の熱伝導性が低下する。 The thickness of the first layer and the second layer may be, for example, 1 to 50 μm and further 2 to 10 μm. If the thickness is too small, the formation of the reaction layer required to secure the bonding strength becomes insufficient. If the thickness becomes excessive, the thermal conductivity of the bonding layer decreases.

第1層と第2層とで、ろう材の種類または組成が異なるとき、ろう付けを安定的、効率的に行うため、両材の融点差は、例えば、±20℃さらには±10℃であるとよい。 When the type or composition of the brazing material is different between the first layer and the second layer, the melting point difference between the two materials is, for example, ± 20 ° C. or ± 10 ° C. in order to perform brazing stably and efficiently. It would be nice to have it.

(3)製法
接合シートは、金属層の各面に、第1層と第2層(各層を単に「ろう材層」ともいう。)を積層して得られる。積層方法には、圧延等の機械的な積層法、スパッタリング等の物理的な堆積法、めっき等の化学的な堆積法等がある。例えば、金属層となる高熱伝導金属箔とろう材層となるろう材(合金)の箔とを重ねて、熱間圧延またはクラッド等すると、接合シート(原反)が得られる。
(3) Manufacturing Method The bonded sheet is obtained by laminating a first layer and a second layer (each layer is also simply referred to as a "wax layer") on each surface of a metal layer. Laminating methods include mechanical laminating methods such as rolling, physical deposition methods such as sputtering, and chemical deposition methods such as plating. For example, a bonded sheet (raw fabric) can be obtained by superimposing a high thermal conductive metal foil as a metal layer and a brazing material (alloy) foil as a brazing material layer and hot rolling or clading or the like.

高熱伝導金属箔上に、ろう材(合金)をスパッタリングや真空蒸着等で堆積させて、ろう材層を形成してもよい。またろう材層は、例えば、ろう材の微粒子からなるペーストを金属箔上に塗布(スクリーン印刷)しても形成され得る。 A brazing material layer may be formed by depositing a brazing material (alloy) on a high thermal conductive metal foil by sputtering, vacuum deposition, or the like. The brazing material layer can also be formed by applying (screen printing) a paste composed of fine particles of the brazing material on the metal foil, for example.

《被接合部材》
接合シートによりろう付け接合される部材やその組合せは種々あり得る。本発明の接合シートは、高熱伝導性部材の接合に用いられるとよい。高熱伝導性部材の一例として、炭素系材料からなるシート材、板材等がある。炭素系材料は、例えば、グラファイト(黒鉛)、ダイヤモンド、カーボンナノチューブ等である。これらの熱伝導率は非常に大きく、例えば、500〜5500W/m・Kである。なお、グラファイトからなるシート材や板材等は、熱伝導率が大きいa−b面(グラファイトのc軸に垂直な面)を被接合面とするとよい。
<< Member to be joined >>
There may be various members and combinations thereof that are brazed and joined by the joining sheet. The bonding sheet of the present invention may be used for bonding high thermal conductive members. Examples of high thermal conductive members include sheet materials and plate materials made of carbon-based materials. The carbon-based material is, for example, graphite, diamond, carbon nanotube, or the like. These thermal conductivitys are very high, for example, 500-5500 W / m · K. For a sheet material or plate material made of graphite, the ab surface having a high thermal conductivity (the surface perpendicular to the c-axis of graphite) may be the surface to be joined.

高熱伝導性部材の具体例は、例えば、半導体装置(モジュール)の放熱部材(ヒートシンク、ヒートスプレッター、冷却板、筐体等を含む)である。 A specific example of the high thermal conductive member is, for example, a heat radiating member (including a heat sink, a heat spreader, a cooling plate, a housing, etc.) of a semiconductor device (module).

接合される部材は、同種材でも異種材でもよい。熱膨張係数差が大きい異種部材を本発明の接合シートで接合すると、熱伝導性と共に応力緩和性も確保された接合体が得られる。 The members to be joined may be of the same type or different materials. When dissimilar members having a large difference in coefficient of thermal expansion are joined by the joining sheet of the present invention, a joined body in which not only thermal conductivity but also stress relaxation property is ensured can be obtained.

接合シートを用いた部材の接合例を示しつつ、本発明をさらに詳しく説明する。 The present invention will be described in more detail while showing an example of joining members using a joining sheet.

《概要》
第1部材1と第2部材2とを、接合シート3を用いてろう付けした接合体Mの製造過程を図1に示した。
"Overview"
FIG. 1 shows a manufacturing process of a bonded body M in which the first member 1 and the second member 2 are brazed using the bonding sheet 3.

接合シート3は、芯材(金属箔)からなる金属層30と、その第1面上に積層された第1ろう材からなる第1層31と、その第2面上に積層された第2ろう材からなる第2層32とを有する。この接合シート3を介装した第1部材1と第2部材2を加熱(ろう付け工程)すると、第1部材1と第2部材2は接合部4により接合された接合体Mとなる。 The bonding sheet 3 has a metal layer 30 made of a core material (metal foil), a first layer 31 made of a first brazing material laminated on the first surface thereof, and a second layer 31 laminated on the second surface thereof. It has a second layer 32 made of a brazing material. When the first member 1 and the second member 2 sandwiching the joining sheet 3 are heated (brazing step), the first member 1 and the second member 2 become a joined body M joined by the joining portion 4.

接合部4は、金属層40、第1接合層41および第2接合層42からなる。金属層40は、ろう付け時の加熱により、金属層30が第1層31および第2層32と反応して形成される。同様に、第1接合層41は、第1層31が第1部材1の被接合面および金属層30と反応して形成される。第2接合層42は、第2層32が第2部材2の被接合面および金属層30と反応して形成される。なお、各界面には、薄い反応層(図略)が形成される。また、金属層30は、第1ろう材および第2ろう材よりも高融点な金属からなるため、反応層を除いて、ろう付け後も、ほぼそのまま金属層40として残存する。 The joint portion 4 is composed of a metal layer 40, a first joint layer 41, and a second joint layer 42. The metal layer 40 is formed by reacting the metal layer 30 with the first layer 31 and the second layer 32 by heating during brazing. Similarly, the first bonding layer 41 is formed by reacting the first layer 31 with the bonded surface of the first member 1 and the metal layer 30. The second bonding layer 42 is formed by reacting the second layer 32 with the bonded surface of the second member 2 and the metal layer 30. A thin reaction layer (not shown) is formed at each interface. Further, since the metal layer 30 is made of a metal having a melting point higher than that of the first brazing material and the second brazing material, the metal layer 30 remains as the metal layer 40 almost as it is even after brazing except for the reaction layer.

《具体例》
[試料1]
(1)芯材である銀箔(純度:99.98%、厚さ:20μm)の両面に、ろう材である銀合金(Ag−27%Cu−5%Ti/単位:質量%、以下同様)を高周波マグネトロンスパッタ法により積層した。ろう材層の厚さはいずれも3μmとした。こうして得られた積層シートを10mm角に成形(切断)して、接合シートとした。
"Concrete example"
[Sample 1]
(1) Silver alloy as a brazing material (Ag-27% Cu-5% Ti / unit: mass%, the same applies hereinafter) on both sides of a silver foil (purity: 99.98%, thickness: 20 μm) as a core material. Was laminated by the high frequency magnetron sputtering method. The thickness of the brazing filler metal layer was 3 μm. The laminated sheet thus obtained was formed (cut) into a 10 mm square to obtain a bonded sheet.

被接合部材である2枚のグラファイトa面板(10mm□×t1mm/株式会社サーモグラフィティクス製)で、その接合シートを挟持した。このとき、被接合面間には30MPaを印加した。それらを放電プラズマ焼結装置を用いて、真空雰囲気(5Pa未満)中で30分間加熱した。装置上の設定温度は700℃とした。但し、事前に接合部に相当する部位に挿入した熱電対で測定したところ、試料温度は約830℃となっていた。こうして、2枚のグラファイト板がろう付けされた接合体を得た。 The joint sheet was sandwiched between two graphite a face plates (10 mm □ × t1 mm / manufactured by Thermographics Co., Ltd.), which are members to be joined. At this time, 30 MPa was applied between the surfaces to be joined. They were heated in a vacuum atmosphere (less than 5 Pa) for 30 minutes using a discharge plasma sintering apparatus. The set temperature on the device was 700 ° C. However, when measured with a thermocouple inserted in the portion corresponding to the joint portion in advance, the sample temperature was about 830 ° C. In this way, a bonded body in which two graphite plates were brazed was obtained.

(2)その接合体を超音波顕微鏡で観察したところ、接合部に欠陥は確認されなかった。また、目視上、その接合体に反り等も見られなかった。レーザーフラッシュ法で測定した接合部の平均熱伝導率は270W/m・Kであった。なお、ここでいう「平均」は、同一の接合体内で、異なる5点の測定位置で得られた熱伝導率の平均という意味である(以下同様)。 (2) When the joint was observed with an ultrasonic microscope, no defect was confirmed in the joint. In addition, no warpage was observed in the joint visually. The average thermal conductivity of the joint measured by the laser flash method was 270 W / m · K. The "average" here means the average of the thermal conductivity obtained at five different measurement positions in the same junction (the same applies hereinafter).

[試料2]
(1)試料1の接合シートに対して、その一方のろう材層(第2層)を、別な銀合金(Ag−28%Cu)とした接合シートを製作した。この接合シートを用いて、前述したグラファイトa面板(第1部材)と、無酸素銅板(JIS C1020/第2部材)とをろう付けした。このとき、接合シートの第2層(Ag−28%Cu)を無酸素銅板に対面させた。その他は、試料1と同じ条件でろう付けした。こうして、グラファイト板と銅板がろう付けされた接合体を得た。
[Sample 2]
(1) A bonding sheet was produced in which one of the brazing material layers (second layer) of the bonding sheet of Sample 1 was made of another silver alloy (Ag-28% Cu). Using this bonded sheet, the graphite a face plate (first member) and the oxygen-free copper plate (JIS C1020 / second member) described above were brazed. At this time, the second layer (Ag-28% Cu) of the bonding sheet was made to face the oxygen-free copper plate. Others were brazed under the same conditions as sample 1. In this way, a bonded body in which a graphite plate and a copper plate were brazed was obtained.

(2)その接合体を超音波顕微鏡で観察したところ、接合部に欠陥は確認されなかった。また、目視上、その接合体に反り等も見られなかった。レーザーフラッシュ法で測定した接合部の平均熱伝導率は280W/m・Kであった。 (2) When the joint was observed with an ultrasonic microscope, no defect was confirmed in the joint. In addition, no warpage was observed in the joint visually. The average thermal conductivity of the joint measured by the laser flash method was 280 W / m · K.

[試料C1]
(1)試料1の接合シートを、市販の活性金属ろう材箔(Ag−28%Cu−2%Ti−5%Sn/10mm□×t0.1mm/田中貴金属工業株式会社製)に替えた。その他は、試料1と同じ条件でろう付けした。こうして、2枚のグラファイト板がろう付けされた接合体を得た。
[Sample C1]
(1) The bonding sheet of Sample 1 was replaced with a commercially available active metal brazing foil (Ag-28% Cu-2% Ti-5% Sn / 10 mm □ × t0.1 mm / manufactured by Tanaka Kikinzoku Kogyo Co., Ltd.). Others were brazed under the same conditions as sample 1. In this way, a bonded body in which two graphite plates were brazed was obtained.

(2)その接合体を超音波顕微鏡で観察したところ、接合部に欠陥は確認されなかった。また、目視上、その接合体に反り等も見られなかった。レーザーフラッシュ法で測定した接合部の平均熱伝導率は110W/m・Kであった。 (2) When the joint was observed with an ultrasonic microscope, no defect was confirmed in the joint. In addition, no warpage was observed in the joint visually. The average thermal conductivity of the joint measured by the laser flash method was 110 W / m · K.

[試料C2]
(1)試料2の接合シートを、上記の活性金属ろう材箔(Ag−28%Cu−2%Ti−5%Sn)に替えて、グラファイト板と銅板を試料1と同条件でろう付けした。こうして、グラファイト板と銅板がろう付けされた接合体を得た。
[Sample C2]
(1) The bonding sheet of Sample 2 was replaced with the above-mentioned active metal brazing material foil (Ag-28% Cu-2% Ti-5% Sn), and a graphite plate and a copper plate were brazed under the same conditions as Sample 1. .. In this way, a bonded body in which a graphite plate and a copper plate were brazed was obtained.

(2)その接合体を超音波顕微鏡で観察したところ、接合部に欠陥は確認されなかった。しかし、その接合体に反りが見られた。また、レーザーフラッシュ法で測定した接合部の平均熱伝導率は90W/m・Kであった。 (2) When the joint was observed with an ultrasonic microscope, no defect was confirmed in the joint. However, the joint was warped. The average thermal conductivity of the joint measured by the laser flash method was 90 W / m · K.

《評価》
試料1および試料2の結果から明らかなように、高熱伝導金属からなる厚い金属層(厚さ比率:約77%)を有する接合シートを用いると、同種部材間でも異種部材間でも、接合欠陥や反り等を生じさせることなく、ろう付けできることがわかった。また、その接合部は、熱抵抗が小さく、高い熱伝導性が確保されていることもわかった。
《Evaluation》
As is clear from the results of Sample 1 and Sample 2, when a bonding sheet having a thick metal layer (thickness ratio: about 77%) made of a highly thermally conductive metal is used, bonding defects can be caused between members of the same type or members of different types. It was found that brazing can be performed without causing warpage. It was also found that the joint has low thermal resistance and high thermal conductivity is ensured.

試料C1および試料C2の結果から明らかなように、従来のろう材箔を用いた場合、接合部の熱伝導性が大きく低下することがわかった。また、異種部材をろう付けすると、反り等の接合不良を生じることもわかった。 As is clear from the results of Sample C1 and Sample C2, it was found that the thermal conductivity of the joint portion was significantly reduced when the conventional brazing material foil was used. It was also found that brazing of dissimilar members causes poor joining such as warpage.

以上から、本発明の接合シートを用いれば、接合性と熱伝導性を高次元で両立したろう付けが可能となることが確認された。 From the above, it was confirmed that by using the bonding sheet of the present invention, brazing capable of achieving both bondability and thermal conductivity at a high level is possible.

M 接合体
1 第1部材
2 第2部材
3 接合シート
30 金属層
31 第1層
32 第2層
M Joined body 1 First member 2 Second member 3 Joined sheet 30 Metal layer 31 First layer 32 Second layer

Claims (9)

金属層と、
該金属層の第1面上に形成された第1ろう材からなる第1層と、
該金属層の第2面上に形成された第2ろう材からなる第2層と、
を備える接合シートであって、
該金属層は、該第1ろう材および該第2ろう材よりも融点が高いと共に熱伝導率が300W/m・K以上である高熱伝導金属からなり、
該金属層の厚さは、該接合シート全体の厚さに対して50%以上あり、
該第1ろう材は、該第1ろう材全体に対して、活性金属元素を合計で1〜10質量%含む接合シート。
With a metal layer
A first layer made of a first brazing material formed on the first surface of the metal layer, and
A second layer made of a second brazing material formed on the second surface of the metal layer, and
It is a joining sheet provided with
The metal layer is made of a high thermal conductive metal having a melting point higher than that of the first brazing material and the second brazing material and having a thermal conductivity of 300 W / m · K or more.
The thickness of the metal layer is 50% or more with respect to the thickness of the entire bonded sheet.
The first brazing material is a bonding sheet containing 1 to 10% by mass of active metal elements in total with respect to the entire first brazing material.
前記高熱伝導金属は、金、銀または銅のいずれかである請求項1に記載の接合シート。 The bonding sheet according to claim 1, wherein the high thermal conductive metal is either gold, silver or copper. 前記第1ろう材は、銀ろうからなる請求項1または2に記載の接合シート。 The joining sheet according to claim 1 or 2, wherein the first brazing material is made of silver brazing. 前記活性金属元素は、TiとZrの少なくとも一方を含む請求項1〜3のいずれかに記載の接合シート。 The bonding sheet according to any one of claims 1 to 3, wherein the active metal element contains at least one of Ti and Zr. 前記金属層は、厚さが10〜500μmである請求項1〜4のいずれかに記載の接合シート。 The bonding sheet according to any one of claims 1 to 4, wherein the metal layer has a thickness of 10 to 500 μm. 前記第1層と前記第2層は、厚さが1〜50μmである請求項1〜5のいずれかに記載の接合シート。 The bonding sheet according to any one of claims 1 to 5, wherein the first layer and the second layer have a thickness of 1 to 50 μm. 前記第1層は、グラファイトからなる被接合面のろう付けに用いられる請求項1〜6のいずれかに記載の接合シート。 The bonding sheet according to any one of claims 1 to 6, wherein the first layer is used for brazing a surface to be bonded made of graphite. 第1部材と第2部材を接合した接合体の製造方法であって、
請求項1〜6のいずれかに記載の接合シートを介装した該第1部材と該第2部材を、前記金属層の融点未満で、前記第1ろう材および前記第2ろう材が溶融する温度以上で加熱するろう付け工程を備える接合体の製造方法。
A method for manufacturing a joined body in which a first member and a second member are joined.
The first brazing material and the second brazing material are melted at a temperature lower than the melting point of the metal layer in the first member and the second member sandwiched by the joining sheet according to any one of claims 1 to 6. A method for manufacturing a bonded body including a brazing step of heating above a temperature.
前記接合シートの第1層は、前記第1部材の被接合面に対面しており、
該第1部材の被接合面は、グラファイトからなる請求項8に記載の接合体の製造方法。
The first layer of the joining sheet faces the surface to be joined of the first member.
The method for manufacturing a bonded body according to claim 8, wherein the surface to be bonded of the first member is made of graphite.
JP2019094694A 2019-05-20 2019-05-20 Joining sheet and method of manufacturing joining body Pending JP2020189307A (en)

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JP2022191175A (en) * 2021-06-15 2022-12-27 薩摩亞商隆揚國際股▲分▼有限公司台灣分公司 Graphite composite lamination heat discharge structure and manufacturing method for the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022191175A (en) * 2021-06-15 2022-12-27 薩摩亞商隆揚國際股▲分▼有限公司台灣分公司 Graphite composite lamination heat discharge structure and manufacturing method for the same

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