JP2020178089A - Printed circuit board - Google Patents

Abstract

To provide a printed circuit board capable of suppressing a mounting deviation of a chip component without providing an additional land on the board when the size of the chip component is changed.SOLUTION: A printed circuit board 1 includes a base material 2, a pair of component mounting pads 3 arranged to face each other at an interval on one side of the base material 2, and a pair of slip prevention portions 4, facing each other over a distance between the pair of component mounting pads.SELECTED DRAWING: Figure 1

Description

The present invention relates to a printed circuit board having a component mounting pad on a substrate.

Conventionally, when the size of a chip component mounted on a printed circuit board is changed, it has been necessary to redesign the printed circuit board, remanufacture the printed circuit board, and the like. Redesigning and remanufacturing this printed circuit board took additional time and incurred additional costs.

In order to cope with a change in the size of a chip component, a printed circuit board in which a soldering land corresponding to a chip component having a different size is formed is known (see, for example, Patent Document 1). In the printed circuit board described in Patent Document 1, the soldering land for the electrode on one side is soldered to the first land to be soldered to the small electrode of the chip component and to the large electrode of another chip component. It is formed by dividing it into a second land.

Japanese Unexamined Patent Publication No. 6-350243

In the printed circuit board described in Patent Document 1, when the size of the chip component is changed, the chip component of the size corresponding to the first land or the second land can be soldered to a predetermined position. However, if the electrodes of the chip components do not match the positions of the soldering lands, mounting deviation occurs in which the chip components are displaced in the direction of protruding from the pair of lands due to the influence of tension when the solder melts. I was afraid to do it.

The present invention has been made to solve such a problem, and when the size of the chip component is changed, the mounting deviation of the chip component is suppressed without providing an additional land on the base material. It is an object of the present invention to provide a printed circuit board capable of providing a printed circuit board.

In order to solve the above problems, the printed circuit board according to the present invention covers the distance between the base material, the pair of component mounting pads arranged to face each other at a distance on one side of the base material, and the pair of component mounting pads. It is provided with a pair of slip prevention portions arranged so as to face each other.

According to the printed circuit board according to the present invention, when the size of the chip component is changed, the mounting deviation of the chip component can be suppressed without providing an additional land on the base material.

It is a front view which shows the printed circuit board by Embodiment 1 of this invention. It is sectional drawing along the line II-II of FIG. It is sectional drawing along the line III-III of FIG. It is a perspective view of the comparative example which shows the state when the size of a chip part is changed. It is a front view which shows the state which the large chip component is mounted on a printed circuit board. It is sectional drawing along the VI-VI line of FIG. FIG. 5 is a cross-sectional view taken along the line VII-VII of FIG. It is a front view which shows the state which the small chip component is mounted on the printed circuit board. It is sectional drawing along the IX-IX line of FIG. It is sectional drawing along the X-ray line of FIG. It is a front view which shows the state which the medium-sized chip component is mounted on the printed circuit board. It is sectional drawing along the XII-XII line of FIG. It is sectional drawing along the XIII-XIII line of FIG. It is a front view which shows the state which two small chip parts are mounted in series on a printed circuit board. It is sectional drawing along the XV-XV line of FIG. It is sectional drawing along the XVI-XVI line of FIG. It is a front view which shows the printed circuit board by Embodiment 2 of this invention. FIG. 6 is a cross-sectional view taken along the line XVIII-XVIII of FIG. It is sectional drawing along the XIX-XIX line of FIG. It is a front view which shows the printed circuit board by Embodiment 3 of this invention. It is sectional drawing along the XXI-XXI line of FIG. It is sectional drawing along the line XXII-XXII of FIG.

Next, an embodiment of the present invention will be described with reference to the accompanying drawings. In the figure, the same reference numerals indicate the same or corresponding parts.

Embodiment 1.
FIG. 1 is a front view showing a printed circuit board according to the first embodiment of the present invention. Further, FIG. 2 is a cross-sectional view taken along the line II-II of FIG. Further, FIG. 3 is a cross-sectional view taken along the line III-III of FIG. In the figure, the printed circuit board 1 includes a base material 2, a pair of mounting pads 3, and a pair of slip prevention portions 4. The area surrounded by the pair of component mounting pads 3 and the pair of slip prevention portions 4 functions as a slip prevention region 5 for preventing the slip when mounting the chip components.

The base material 2 which is the base of the printed circuit board 1 has a flat plate shape. The material of the base material 2 may be any material generally used as a printed circuit board.

On one side of the base material 2, a pair of component mounting pads 3 are provided so as to face each other at intervals in the longitudinal direction of the base material 2 (left-right direction with respect to the paper surface of FIG. 1). Each component mounting pad 3 is a rectangular flat plate. The component mounting pad 3 is a flat plate thinner than the base material 2. The long sides of the component mounting pads 3 are arranged so as to face each other. The component mounting pad 3 is made of a material that can be electrically connected to the electrodes of the chip component to be mounted. In this example, the component mounting pad 3 is made of copper foil for soldering.

Here, "arranged facing each other with an interval" means that the component mounting pads 3 are arranged at positions corresponding to the two electrodes of the large chip component 100 described later. This is because if the two electrodes of the chip component are directly soldered to the component mounting pad 3, mounting deviation does not occur.

The figure does not show the wiring pattern of the printed circuit board. That is, the wiring pattern connected to the component mounting pad 3 is omitted. The copper foil for soldering is sometimes called a land.

A pair of slip prevention portions 4 are provided between the pair of component mounting pads 3. That is, the pair of slip prevention portions 4 are arranged so as to face each other over the distance between the pair of component mounting pads 3.

Here, the distance between the pair of mounting pads 3 means that the slip prevention portion 4 is provided over a length that does not cause mounting slippage of the chip components mounted in the slip prevention region 5. To do. That is, the slip prevention portion 4 may be continuously provided over the entire pair of mounting pads 3, or may be divided into a plurality of portions. Further, there may be a gap between one side end of the slip prevention portion 4 and the component mounting pad 3.

Each of the slip prevention portions 4 includes a copper foil 4a attached to one side of the base material 2, a solder resist 4b applied so as to cover the copper foil 4a, and a symbol symbol 4c applied to the surface of the solder resist 4b. It has. The pair of slip prevention portions 4 are arranged in parallel with a space between one side and the other side of the pair of component mounting pads 3.

The distance between the pair of slip prevention portions 4 is a length corresponding to the width of the rectangular parallelepiped large chip component 100 described later. That is, when the large chip component 100 is mounted on the printed circuit board 1, each long side of the large chip component 100 is configured to be located at the symbol symbol 4c of each deviation prevention unit 4.

The distance W1 between the solder resists 4b constituting the pair of slip prevention portions 4 is formed to be substantially the same width as or larger than the width of the small chip component 200 described later, which is smaller than the large chip. Further, the interval W2 between the pair of symbol symbols 4c is formed to be substantially the same width or larger than that of the medium-sized chip component described later, which is smaller than the large-sized chip component and larger than the small-sized chip component. In this example, the distance between the pair of slip prevention portions 4 is two types, but one type or three or more types may be used.

Each slip prevention portion 4 has a thickness of the base material 2 from the surface in two stages. A first step portion 4d is provided on the side surface of the solder resist 4b from the surface of the base material 2. A second step portion 4e is provided on the side surface of the symbol symbol 4c from the upper surface of the solder resist 4b. In this example, each misalignment prevention portion 4 is provided with two step portions, but the number of step portions may be one or three or more.

The area surrounded by the pair of component mounting pads 3 and the pair of slip prevention portions 4 functions as a slip prevention region 5 for preventing the slip when mounting the chip components. The slip prevention area 5 is a rectangular area. That is, the slip prevention region 5 is formed in a shape that matches the shape of the chip component described later.

A solder resist 6 is applied to the base material 2 around each component mounting pad 3 that does not face the slip prevention region 5 and one side portion of each slip prevention portion 4 on the opposite side of the slip prevention region 5. The solder resist 6 is applied to the surface of the base material 2 in order to prevent solder from adhering to a portion that does not require soldering. Therefore, the solder resist 6 is not applied to the slip prevention region 5. That is, in the slip prevention region 5, the surface of the base material 2 is exposed.

In this example, the solder resist 6 applied to the portion that does not require soldering and the solder resist 4b applied to the copper foil 4a of the slip prevention portion 4 are separately configured, but after the copper foil 4a is formed on the base material 2. , Solder resist 4b and solder resist 6 may be applied at the same time. Alternatively, solder resist may be applied to the portion that does not require soldering and the pair of slip prevention portions 4 without providing the copper foil 4a on the base material 2. That is, each slip prevention unit 4 is composed of only the solder resist.

Further, after the solder resist 6 is applied to the entire base material 2, the solder resist 6 in the slip prevention region 5 on which the chip component is mounted, the region of the pair of component mounting pads 3, and the region of the pair of slip prevention portions 4 is removed. You may. After that, a pair of component mounting pads 3 are provided on the surface of the base material 2 exposed by removing the solder resist 6, and a pair of slip prevention portions 4 are provided by applying the solder resist 4b on the surface of the copper foil 4a. May be good.

Next, a procedure for mounting the chip components when the size of the chip components to be mounted on the printed circuit board 1 configured in this manner is changed will be described.

First, a comparative example when the size of the chip component is changed will be described with reference to FIG. FIG. 4 is a perspective view of a comparative example showing a state when the size of the chip component is changed. The printed circuit board of the comparative example is provided with only a pair of component mounting pads 3 on the surface of the base material 2. In this figure, the solder resist applied to the portion that does not require soldering is omitted.

The chip component at the beginning of the design is the large chip component 100 on the left side of the drawing. The large chip component 100 is a rectangular parallelepiped composed of a long side A and a short side B. Electrodes of the large chip component 100 are provided on both sides of the long side A of the rectangular parallelepiped. That is, electrodes are provided on each short side B side. When the large chip component 100 is mounted on the printed circuit board, each electrode of the large chip component 100 is located on each component mounting pad 3. Therefore, when the large chip component 100 is mounted on the printed circuit board, there is no mounting deviation due to soldering.

On the other hand, the small chip component 200 on the right side of the drawing, which is smaller in size than the large chip component 100, is a rectangular parallelepiped composed of a long side C and a short side D. The electrodes of the small chip component 200 are also provided on both sides of the long side C of the rectangular parallelepiped. That is, electrodes are provided on each short side D side.

When the chip component mounted on the printed circuit board is changed from the large chip component 100 to the small chip component 200, the electrodes of the small chip component 200 are not located on the component mounting pad 3. That is, the small chip component 200 is soldered to the region between the pair of component mounting pads 3. If the electrode to be soldered is not located on the component mounting pad 3, the small chip component 200 will be displaced in the direction of protruding from the pair of component mounting pads 3 due to the influence of tension or the like when the solder melts. That is, the small chip component 200 does not reach the component mounting pad 3, and the component mounting deviation occurs.

On the other hand, in the printed circuit board 1 of the first embodiment, the large chip component and the small chip component are mounted on the printed circuit board 1 as follows. FIG. 5 is a front view showing a state in which the large chip component 100 is mounted on the printed circuit board, FIG. 6 is a cross-sectional view taken along the line VI-VI of FIG. 5, and FIG. 7 is the line VII-VII of FIG. It is a cross-sectional view along.

A copper foil is not attached to each of the slip prevention portions 4 of the printed circuit board 1 in this figure. That is, each slip prevention portion 4 is formed by applying the symbol symbol 4c to the surface of the solder resist 6.

The large chip component 100 is a rectangular parallelepiped having a long side and a short side. Electrodes of the large chip component 100 are provided on both sides of the long side of the rectangular parallelepiped. That is, electrodes are provided on each short side. When the large chip component 100 is mounted on the printed circuit board, the solder 7 is applied to the displacement prevention region 5 side of each component mounting pad 3. That is, the large chip component 100 is soldered to the printed circuit board 1 at two places. By soldering, the electrodes of the large chip component 100 and the component mounting pad 3 are electrically connected.

When soldering, the electrodes of the large chip component 100 are located on the component mounting pads 3. The solder 7 is supplied at a position where it overlaps each component mounting pad 3 and each electrode of the large chip component 100. Therefore, when the large chip component 100 is mounted on the printed circuit board, the mounting deviation due to soldering does not occur. Further, each long side of the large chip component 100 is located above the symbol symbol 4c of each corresponding displacement prevention unit 4. Therefore, the large chip component 100 does not shift due to friction with the symbol symbol 4c, and the mounting shift can be prevented more reliably.

Next, a mounting example will be described when the size of the chip component is changed, that is, when the size is changed from the large chip component 100 to the small chip component 200 smaller than the large chip component 100. 8 is a front view showing a state in which a small chip component 200 is mounted on a printed circuit board, FIG. 9 is a cross-sectional view taken along the line IX-IX of FIG. 8, and FIG. 10 is a line XX of FIG. It is a cross-sectional view along.

The electrodes of the small chip component 200 are not located above the component mounting pads 3. However, the displacement prevention region 5 is formed in a rectangular region that matches the shape of the small chip component 200. In this example, the solder resist 6 constituting the slip prevention portion 4 is provided along the long side of the small chip component 200. Therefore, even if the small chip component 200 that does not reach the component mounting pad 3 is soldered to the printed circuit board 1 with the solder 7 in a half-finished state, the small chip component 200 is mounted by the first stage portion 4d of the slip prevention portion 4. Misalignment is prevented. That is, according to the printed circuit board of the first embodiment, it is possible to cope with the change in the size of the chip component without changing the design of the printed circuit board, remanufacturing, or the like.

When mounting the small chip component 200 in the slip prevention region 5 where the base material 2 is exposed, the small chip component 200 is pushed until it comes into contact with the surface of the base material 2. By pushing the small chip component 200 to the surface of the base material 2, the small chip component 200 can be reliably mounted in the displacement prevention region 5. Therefore, it is possible to prevent the mounting deviation of the small chip component 200 at the time of mounting.

The electrodes of the small chip component 200 are electrically connected to the component mounting pad 3 via the solder 7. That is, the solder 7 is supplied from the component mounting pad 3 to a position where it overlaps with the electrodes of the small chip component 200.

Next, a case where a medium-sized chip component 150 having a chip component size smaller than that of the large-sized chip component 100 and larger than that of the small-sized chip component 200 is mounted will be described. FIG. 11 is a front view showing a state in which a medium-sized chip component is mounted on a printed circuit board, FIG. 12 is a sectional view taken along line XII-XII of FIG. 11, and FIG. 13 is a view taken along line XIII-XIII of FIG. It is a cross-sectional view along.

The electrodes of the medium-sized chip component 150 are not located above the component mounting pads 3. However, the slip prevention region 5 is formed in a rectangular region that matches the shape of the medium-sized chip component 150. In this example, the symbol symbol 4c constituting the slip prevention portion 4 is provided along the long side of the medium-sized chip component 150. Therefore, even if the medium-sized chip component 150 that does not reach the component mounting pad 3 is soldered to the printed circuit board 1 with the solder 7 in a half-finished state, the medium-sized chip component 150 is mounted by the second stage portion 4e of the slip prevention portion 4. Misalignment is prevented. That is, according to the printed circuit board of the first embodiment, it is possible to cope with the change in the size of the chip component without changing the design of the printed circuit board, remanufacturing, or the like.

The electrodes of the medium-sized chip component 150 are electrically connected to the component mounting pad 3 via the solder 7. That is, the solder 7 is supplied from the component mounting pad 3 to a position overlapping the electrodes of the medium-sized chip component 150.

As described above, the printed circuit board of the first embodiment has the base material 2 and the pair of component mounting pads 3 and the pair of component mounting pads 3 arranged to face each other at intervals on one side of the base material 2. It is provided with a pair of slip prevention portions 4 which are arranged to face each other over the interval of. Therefore, even if the size of the chip component mounted on the printed circuit board 1 is changed, the mounting deviation can be prevented without changing the existing printed circuit board.

Further, the displacement prevention area 5 surrounded by the pair of component mounting pads 3 and the pair of displacement prevention portions 4 is a rectangular area. Therefore, even if the electrodes of the chip component mounted on the printed circuit board do not reach the component mounting pad 3, each long side of the chip component is arranged along each deviation prevention portion 4, and the mounting deviation can be further prevented. it can.

Next, a case where two small chip components 200 are mounted in series in the slip prevention region 5 will be described. 14 is a front view showing a state in which two small chip components are mounted in series on a printed circuit board, FIG. 15 is a sectional view taken along the line XV-XV of FIG. 14, and FIG. 16 is an XVI of FIG. It is sectional drawing along the-XVI line.

When mounting two small chip components 200 in series, the solder 7 is placed in two places in a half-scale state between each component mounting pad 3 and each small chip component 200, and two small chip components. It is applied in one place on the exposed surface of the base material 2 between 200. That is, there are three places to apply the solder 7.

The two small chip components 200 arranged in series are arranged in the slip prevention region 5. Since the slip prevention region 5 is rectangular, the long sides of each small chip component 200 are arranged along the slip prevention portion 4. Therefore, even if two small chip components 200 are mounted in series, mounting deviation can be prevented.

Further, the portion where the two small chip components 200 are soldered is a portion where the surface of the base material 2 is exposed, and no additional component mounting pad is provided. That is, it is possible to connect only with the solder 7 without providing a common component mounting pad between the two small chip components 200. Therefore, it is possible to prevent mounting misalignment of the chip components without providing an additional component mounting pad on the base material 2.

Further, by making the wetting conditions of the solder 7 at the three locations common, it is possible to further prevent the mounting deviation of the small chip component 200. Even when two small chip parts 200 are mounted in series, the small chip parts 200 are pushed in until they come into contact with the surface of the base material 2. As a result, the two small chip components 200 can be reliably mounted in the slip prevention region 5. Therefore, it is possible to further prevent mounting deviation when mounting the small chip component 200.

In the printed circuit board 1 of the first embodiment, not only when the size of the component is changed from the large chip component 100 to the small chip component 200 or the medium-sized chip component 150, but also when two small chip components 200 are mounted in series. However, it is possible to mount small chip components without changing the design of the printed circuit board 1.

As described above, the combinations of chip parts that can change one large chip part into two small chip parts are as follows.
For each long side A, short side B, long side C, and short side D, refer to FIG.
Large chip parts Small chip parts
Long side A: Short side B Long side C: Short side D
Combination 1 6.4mm: 3.2mm 3.2mm: 1.6mm
Combination 2 3.2mm: 1.6mm 1.6mm: 0.8mm
Combination 3 2.0mm: 1.25mm 1.0mm: 0.5mm
Combination 4 1.6mm: 0.8mm 0.6mm: 0.3mm
Combination 5 1.0mm: 0.5mm 0.4mm: 0.2mm

If the distance between the pair of component mounting pads 3 of the printed circuit board 1 and the distance between the pair of slip prevention portions 4 are created according to the sizes of the long side A and the short side B of the large chip parts of the above combinations 1 to 5. Two small chip components of each combination can be mounted in series in the slip prevention region 5. That is, since the printed circuit board 1 is designed as a structure in which one large chip component or two small chip components can be mounted, even if the size of the chip component to be mounted is changed, the printed circuit board is not remanufactured. Chip components can be mounted.

The combinations of the large chip parts and the small chip parts are as described in combinations 1 to 5 above. When the length of the long side C of the small chip component is A × 1/2 or less with respect to the length of the long side A of the large chip component, two small chip components can be mounted. Further, when the length of the long side C of the small chip component is larger than A × 1/2 and smaller than A with respect to the length of the long side A of the large chip component, that is, in the case of the medium chip component, the medium size By changing the amount of solder supplied between the chip component and the component mounting pad, one medium-sized chip component can be mounted.

Embodiment 2.
17 is a front view showing a printed circuit board according to a second embodiment of the present invention, FIG. 18 is a sectional view taken along line XVIII-XVIII of FIG. 17, and FIG. 19 is taken along line XIX-XIX of FIG. It is a sectional view.

In the figure, the position of the pair of slip prevention portions of the printed circuit board according to the second embodiment is different from that of the pair of slip prevention portions of the first embodiment. Since other configurations are the same as those of the printed circuit board of the first embodiment, the description thereof will be omitted. Each slip prevention portion of the printed circuit board is composed of a copper foil 4a, a solder resist 4b, and a symbol symbol 4c.

The pair of slip prevention portions 4 are arranged unevenly on one side of the pair of component mounting pads 3 while maintaining parallelism with the longitudinal sides of the base material 2. In this example, the pair of slip prevention portions 4 are translated to the lower side of the drawing. That is, one of the slip prevention portions 4 is located on a line connecting the centers of the pair of component mounting pads 3. The other slip prevention portion 4 is located outside the line connecting the ends on one side of the pair of component mounting pads 3. The distance between the pair of slip prevention portions 4 is the same as the distance between the pair of slip prevention portions according to the first embodiment.

Therefore, the position of the rectangular displacement prevention region 5 surrounded by the pair of component mounting pads 3 and the pair of displacement prevention portions 4 is biased to one side of the component mounting pads 3. That is, the rectangular displacement prevention region 5 is moved to any one side of the component mounting pads 3 instead of the center position connecting the centers of the pair of component mounting pads 3. By moving the position of the displacement prevention region 5 to one side of the component mounting pad 3, the component arrangement of the chip component and the component mounting pad on the wiring path of the electric signal can be made small. Therefore, for this reason, the signal impedance in the printed circuit board can be lowered.

As described above, the rectangular displacement prevention region 5 of the printed circuit board 1 of the second embodiment is unevenly arranged on one side of the pair of component mounting pads 3. Therefore, the signal impedance on the printed circuit board can be lowered.

Embodiment 3.
20 is a front view showing the printed circuit board according to the third embodiment of the present invention, FIG. 21 is a sectional view taken along the line XXII-XXI of FIG. 20, and FIG. 22 is taken along the line XXII-XXII of FIG. It is a sectional view.

In the figure, the printed circuit board according to the third embodiment is different from the first embodiment in that a split slip prevention portion 4B is provided between the pair of slip prevention portions 4A. Since other configurations are the same as those of the printed circuit board of the first embodiment, the description thereof will be omitted. A copper foil is not attached to each of the slip prevention portions of the printed circuit board. That is, each slip prevention portion is formed by applying a symbol symbol to the surface of the solder resist 6.

The split slip prevention portions 4B are arranged between the pair of slip prevention portions 4A and in parallel with the pair of slip prevention portions 4A over the distance between the pair of component mounting pads 3. The division deviation prevention portion 4B is located on a line connecting the center positions of the pair of component mounting pads 3. The slip prevention portion 4A on one side of the two slip prevention portions located on the outside is located outside the line connecting the ends on one side of the pair of component mounting pads. The slip prevention portion 4A on the other side of the two slip prevention portions is located outside the line connecting the other end portions of the pair of component mounting pads. The misalignment prevention region 5 is divided into a plurality of rows by the division misalignment prevention unit 4B. In this example, the slip prevention region 5 is divided into two rows. That is, two rows of slip prevention regions 5 are formed between the pair of component mounting pads 3.

One or two small chip components 200 can be mounted in each deviation prevention region 5. Therefore, up to four small chip components 200 can be mounted on the printed circuit board 1.

As described above, according to the printed circuit board 1 of the third embodiment, it is possible to change the size and the number of chip parts. The printed circuit board 1 can mount two or more chip components. Therefore, it is possible to increase the options for the circuit configuration of the printed circuit board.

1 Printed circuit board, 2 base materials, 3 component mounting pads, 4, 4A slip prevention part, 4B split slip prevention part, 4a copper foil, 4b solder resist, 4c symbol symbol, 4d first step, 4e second step, 5 Anti-slip area, 6 Solder resist, 7 Solder, 100 Large chip parts, 150 Medium chip parts, 200 Small chip parts

Claims (4)

With the base material
A pair of component mounting pads arranged opposite to each other on one side of the base material,
A pair of slip prevention portions arranged to face each other over the distance between the pair of component mounting pads.
Printed circuit board with. The printed circuit board according to claim 1, wherein the area surrounded by the pair of component mounting pads and the pair of slip prevention portions is a rectangular area. The printed circuit board according to claim 2, wherein the rectangular area is unevenly arranged on one side of the pair of component mounting pads. A split misalignment prevention portion is further provided between the pair of misalignment prevention portions and in parallel with the pair of misalignment prevention portions.
The printed circuit board according to claim 2, wherein the rectangular area is divided into a plurality of rows by the division deviation prevention unit.

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