JP2020178077A - Electrostatic chuck device and method for manufacturing the same - Google Patents

Abstract

To provide an electrostatic chuck device which alleviates stress caused by a difference in thermal expansion coefficients between a laminate including insulating organic films and internal electrodes and ceramic layers on an interface therebetween, and can suppress generation of cracking on the interface, and a method for manufacturing the same.SOLUTION: An electrostatic chuck device 1 includes a plurality of internal electrodes 20, insulating organic films 40 provided on both sides of the internal electrodes 20 in the thickness direction, and ceramic layers 60 layered on an upper surface 2a of a laminate 2 including at least the internal electrodes 20 and the insulating organic films 40 in the thickness direction through an adhesive layer 50, and is provided with a resin layer 70 connected to a surface on the side of the laminate 2 in the adhesive layer 50 and a side face 2b of the laminate 2 in the thickness direction, in which on the side face 2b of the laminate 2 in the thickness direction, the ceramic layers 60 are joined to at least the internal electrodes 20 and the insulating organic films 40 in the laminate 2 through the resin layer 70.SELECTED DRAWING: Figure 1

Description

The present invention relates to an electrostatic chuck device and a method for manufacturing the same.

When manufacturing a semiconductor integrated circuit using a semiconductor wafer, or when manufacturing a liquid crystal panel using an insulating substrate such as a glass substrate or a film, a base material such as a semiconductor wafer, a glass substrate, or an insulating substrate is used. It is necessary to adsorb and hold it at a predetermined site. Therefore, in order to adsorb and hold those base materials, a mechanical chuck, a vacuum chuck, or the like by a mechanical method has been used. However, these holding methods have problems such as difficulty in uniformly holding the base material (adsorbed body), inability to use in vacuum, and excessive rise in the temperature of the sample surface. Therefore, in recent years, an electrostatic chuck device capable of solving these problems has been used for holding the adsorbed body.

The electrostatic chuck device includes, as a main part, a conductive support member serving as an internal electrode and a dielectric layer made of a dielectric material covering the conductive support member. The object to be adsorbed can be adsorbed by this main part. When a voltage is applied to the internal electrodes in the electrostatic chuck device to generate a potential difference between the object to be adsorbed and the conductive support member, an electrostatic attraction force is generated between the dielectric layers. As a result, the adsorbed body is supported substantially flatly with respect to the conductive support member.

As a conventional electrostatic chuck device, it is known that the entire side peripheral surface of the electrostatic chuck device is coated with an adhesive in order to improve plasma resistance (see, for example, Patent Documents 1 and 2).

JP-A-2002-299425 International Publication No. 2004/084298

When the entire side peripheral surface of the electrostatic chuck device is coated with an adhesive as described in Patent Documents 1 and 2, these are formed at the interface between the laminate including the insulating organic film and the internal electrode and the ceramic layer. Cracks could occur due to the stress caused by the difference in the coefficient of thermal expansion of the materials. When cracks occur at such an interface, the ceramic layer may peel off.

The present invention has been made in view of the above circumstances, and alleviates stress caused by a difference in the coefficient of thermal expansion of these materials at the interface between a laminate including an insulating organic film and an internal electrode and a ceramic layer. An object of the present invention is to provide an electrostatic chuck device capable of suppressing the occurrence of cracks at the interface and a method for manufacturing the same.

The present invention has the following aspects.
[1] A plurality of internal electrodes, a first insulating organic film and a second insulating organic film provided on both sides in the thickness direction of the internal electrodes, at least the internal electrodes, and the first insulation. A ceramic layer laminated on the upper surface of the laminated body containing the organic film and the second insulating organic film in the thickness direction via an adhesive layer is provided, and the surface of the adhesive layer on the laminated body side and the laminate are provided. A resin layer connected to the side surface in the thickness direction of the body is provided, and at least the internal electrode in the laminate and the first insulating organic substance are provided on the side surface in the thickness direction of the laminate via the resin layer. An electrostatic chuck device characterized in that the ceramic layer is bonded to a film and the second insulating organic film.
[2] A step of forming an internal electrode on the upper surface of the first insulating organic film in the thickness direction, and a second insulating organic on the surface of the internal electrode opposite to the first insulating organic film. The first insulating organic film, the said, so that the step of attaching the film and the surface of the first insulating organic film opposite to the internal electrode is the upper surface side in the thickness direction of the substrate. At least the internal electrode and the first insulation in the step of joining the laminate containing the internal electrode and the second insulating organic film to one surface of the substrate and on the side surface in the thickness direction of the laminate. The step of forming the first ceramic base layer on the sex organic film and the second insulating organic film, and filling the gap between the side surface in the thickness direction of the laminate and the first ceramic base layer with resin. In contact with the step of forming the resin layer, the upper surface of the second insulating organic film in the thickness direction, the side surface of the resin layer in the thickness direction of the laminate, and the first ceramic base layer. A step of forming an adhesion layer so as to cover a non-contact surface, a step of forming a second ceramic base layer so as to cover the upper surface of the adhesion layer in the thickness direction, and a thickness of the second ceramic base layer. A method for manufacturing an electrostatic chuck device, comprising:

According to the present invention, at the interface between the laminate including the insulating organic film and the internal electrode and the ceramic layer, the stress caused by the difference in the coefficient of thermal expansion of these materials is relaxed, and cracks occur at the interface. It is possible to provide an electrostatic chuck device capable of suppressing the above and a method for manufacturing the same.

The schematic configuration of the electrostatic chuck device of this invention is shown, and it is sectional drawing along the height direction of the electrostatic chuck device.

Hereinafter, an electrostatic chuck device according to an embodiment to which the present invention is applied and a method for manufacturing the same will be described. In the drawings used in the following description, the dimensional ratios and the like of each component are not always the same as the actual ones.
It should be noted that the present embodiment is specifically described in order to better understand the gist of the invention, and is not limited to the present invention unless otherwise specified.

[Electrostatic chuck device]
FIG. 1 shows a schematic configuration of the electrostatic chuck device of the present embodiment, and is a cross-sectional view taken along the height direction of the electrostatic chuck device.
As shown in FIG. 1, the electrostatic chuck device 1 of the present embodiment includes a substrate 10, a plurality of internal electrodes 20, an adhesive layer 30, an insulating organic film 40, an adhesion layer 50, and a ceramic layer 60. And a resin layer 70. Specifically, as shown in FIG. 1, the electrostatic chuck device 1 of the present embodiment includes a substrate 10, a first internal electrode 21, a second internal electrode 22, and a first adhesive layer 31. A second adhesive layer 32, a first insulating organic film 41, a second insulating organic film 42, an adhesion layer 50, a ceramics layer 60, and a resin layer 70 are provided.

In the electrostatic chuck device 1 of the present embodiment, on the surface of the substrate 10 (upper surface in the thickness direction of the substrate 10) 10a, the first adhesive layer 31, the first insulating organic film 41, and the first The internal electrode 21 and the second internal electrode 22, the second adhesive layer 32, the second insulating organic film 42, the adhesion layer 50, and the ceramics layer 60 are laminated in this order.

Insulating organic films 40 are provided on both sides of the internal electrode 20 in the thickness direction (upper surface 20a in the thickness direction of the internal electrode 20 and lower surface 20b in the thickness direction of the internal electrode 20), respectively. Specifically, the second insulating organic film 42 is provided on the upper surface 21a side in the thickness direction of the first internal electrode 21 and the upper surface 22a side in the thickness direction of the second internal electrode 22. Further, the first insulating organic film 41 is provided on the lower surface 21b side in the thickness direction of the first internal electrode 21 and the lower surface 22b side in the thickness direction of the second internal electrode 22.

The ceramic layer 60 is laminated on the upper surface 2a (upper surface 42a of the second insulating organic film 42) in the thickness direction of the laminate 2 including at least the internal electrode 20 and the insulating organic film 40 via the adhesion layer 50. There is.

As shown in FIG. 1, the ceramic layer 60 has an outer surface (upper surface 2a of the laminated body 2, a side surface (a surface along the thickness direction of the laminated body 2, a first adhesive layer) of the laminated body 2 via the adhesive layer 50. It is preferable to cover the entire surface of 2b (the side surface of 31, the side surface of the second adhesive layer 32, the side surface of the first insulating organic film 41, and the side surface of the second insulating organic film 42).

As shown in FIG. 1, a resin layer 70 is provided in which the surface (lower surface) 50b on the side of the laminated body 2 and the side surface 2b of the laminated body 2 in the thickness direction are connected to each other, and the resin layer 70 is provided in the thickness direction of the laminated body 2. On the side surface 2b, the ceramic layer 60 is bonded to at least the internal electrodes 20, the first insulating organic film 41, and the second insulating organic film 42 in the laminate 2 via the resin layer 70.

As shown in FIG. 1, the ceramic layer 60 includes a ceramic base layer 61 and a ceramic surface layer 62 formed on the upper surface of the ceramic base layer 61 (upper surface in the thickness direction of the ceramic base layer 61) 61a and having irregularities. It is preferable to have.
The ceramic base layer 61 has a first ceramic base layer 61A joined to the side surface 2a in the thickness direction of the laminate 2 via the resin layer 70, and the ceramic base layer 61 in the thickness direction of the laminate 2 via the adhesion layer 50. It is composed of a second ceramic base layer 61B laminated on the upper surface 2a.

The first internal electrode 21 and the second internal electrode 22 may be in contact with the first insulating organic film 41 or the second insulating organic film 42. Further, the first internal electrode 21 and the second internal electrode 22 may be formed inside the second adhesive layer 32 as shown in FIG. The arrangement of the first internal electrode 21 and the second internal electrode 22 can be appropriately designed.

Since the first internal electrode 21 and the second internal electrode 22 are independent of each other, not only voltages having the same polarity but also voltages having different polarities can be applied. The electrode pattern and shape of the first internal electrode 21 and the second internal electrode 22 are not particularly limited as long as they can adsorb an object to be adsorbed such as a conductor, a semiconductor, and an insulator. Further, only the first internal electrode 21 may be provided as a single electrode.

The substrate 10 is not particularly limited, and examples thereof include a ceramic substrate, a silicon carbide substrate, and a metal substrate made of aluminum, stainless steel, or the like.

The internal electrode 20 is not particularly limited as long as it is made of a conductive substance capable of exhibiting an electrostatic adsorption force when a voltage is applied. As the internal electrode 20, for example, a thin film made of a metal such as copper, aluminum, gold, silver, platinum, chromium, nickel, or tungsten, and a thin film made of at least two metals selected from the above metals are preferably used. Be done. Examples of such a metal thin film include those formed by vapor deposition, plating, sputtering, etc., those formed by applying and drying a conductive paste, and specifically, metal foils such as copper foil. Be done.

The thickness of the internal electrode 20 is not particularly limited as long as the thickness of the second adhesive layer 32 is larger than the thickness of the internal electrode 20. The thickness of the internal electrode 20 is preferably 20 μm or less. When the thickness of the internal electrode 20 is 20 μm or less, unevenness is unlikely to occur on the upper surface 42a of the second insulating organic film 42 when it is formed. As a result, defects are unlikely to occur when the ceramic layer 60 is formed on the second insulating organic film 42 or when the ceramic layer 60 is polished.

The thickness of the internal electrode 20 is preferably 1 μm or more. When the thickness of the internal electrode 20 is 1 μm or more, sufficient bonding strength can be obtained when the internal electrode 20 is bonded to the first insulating organic film 41 or the second insulating organic film 42.

When voltages having different polarities are applied to the first internal electrode 21 and the second internal electrode 22, the distance between the adjacent first internal electrode 21 and the second internal electrode 22 (in the thickness direction of the internal electrode 20). The distance in the vertical direction) is preferably 2 mm or less. If the distance between the first internal electrode 21 and the second internal electrode 22 is 2 mm or less, a sufficient electrostatic force is generated between the first internal electrode 21 and the second internal electrode 22, and a sufficient adsorption force is generated. Occurs.

The distance from the internal electrode 20 to the object to be adsorbed, that is, the distance from the upper surface 21a of the first internal electrode 21 and the upper surface 22a of the second internal electrode 22 to the object to be adsorbed on the ceramic surface layer 62 (first). A second adhesive layer 32, a second insulating organic film 42, an adhesion layer 50, a ceramic base layer 61, and a ceramic surface layer existing on the upper surface 21a of the internal electrode 21 and the upper surface 22a of the second internal electrode 22. The total thickness of 62) is preferably 0.05 mm or more and 0.15 mm or less. If the distance from the internal electrode 20 to the object to be adsorbed is 0.05 mm or more, it is composed of a second adhesive layer 32, a second insulating organic film 42, an adhesion layer 50, a ceramic base layer 61, and a ceramic surface layer 62. The insulation of the laminate can be ensured. On the other hand, if the distance from the internal electrode 20 to the object to be adsorbed is 0.15 mm or less, a sufficient adsorption force is generated.

Examples of the adhesive constituting the adhesive layer 30 include epoxy resin, phenol resin, styrene block copolymer, polyamide resin, acrylonitrile-butadiene copolymer, polyester resin, polyimide resin, silicone resin, amine compound, and bismaleimide compound. An adhesive containing one or more kinds of resins as a main component selected from the above is used.

Examples of the epoxy resin include bisphenol type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, glycidyl ether type epoxy resin, glycidyl ester type epoxy resin, glycidylamine type epoxy resin, trihydroxyphenylmethane type epoxy resin, and tetraglycidyl. Examples thereof include bifunctional groups such as phenol alkane type epoxy resin, naphthalene type epoxy resin, diglycidyl diphenylmethane type epoxy resin, and diglycidyl biphenyl type epoxy resin, or polyfunctional epoxy resin. Among these, bisphenol type epoxy resin is preferable. Among the bisphenol type epoxy resins, the bisphenol A type epoxy resin is particularly preferable. When the epoxy resin is the main component, if necessary, a curing agent for epoxy resins such as imidazoles, tertiary amines, phenols, dicyandiamides, aromatic diamines, and organic peroxides, and curing acceleration. Agents can also be added.

Examples of the phenol resin include novolak phenol resins such as alkylphenol resins, p-phenylphenol resins and bisphenol A type phenol resins, resolphenol resins, polyphenylparaphenol resins and the like.

Examples of the styrene-based block copolymer include styrene-butadiene-styrene block copolymer (SBS), styrene-isoprene-styrene block copolymer (SIS), and styrene-ethylene-propylene-styrene copolymer (SEPS). Can be mentioned.

The material constituting the insulating organic film 40 is not particularly limited, and for example, polyesters such as polyethylene terephthalate, polyolefins such as polyethylene, polyimide, polyamide, polyamideimide, polyether sulfone, polyphenylene sulfide, and polyetherketone. , Polyetherimide, triacetyl cellulose, silicone rubber, polytetrafluoroethylene and the like are used. Among these, polyesters, polyolefins, polyimides, silicone rubbers, polyetherimides, polyethersulfone, and polytetrafluoroethylene are preferable, and polyimides are more preferable because of their excellent insulating properties. As the polyimide film, for example, Kapton (trade name) manufactured by Toray DuPont, Upirex (trade name) manufactured by Ube Industries, etc. are used.

The thickness of the insulating organic film 40 is not particularly limited, but is preferably 10 μm or more and 100 μm or less, and more preferably 25 μm or more and 50 μm or less. If the thickness of the insulating organic film 40 is 10 μm or more, the insulating property can be ensured. On the other hand, if the thickness of the insulating organic film 40 is 100 μm or less, sufficient adsorption force is generated.

The adhesion layer 50 is composed of, for example, a resin composition containing polysilazane and an inorganic filler.

Examples of the polysilazane contained in the resin composition include those known in the art. The polysilazane may be an organic polysilazane or an inorganic polysilazane. One of these materials may be used alone, or two or more of these materials may be mixed and used.

The content of polysilazane in the resin composition is preferably 90% by mass or more and 100% by mass or less, and more preferably 95% by mass or more and 100% by mass or less.

The inorganic filler is preferably at least one selected from the group consisting of, for example, silica, quartz powder, alumina, calcium carbonate, magnesium oxide, diamond powder, mica, fluororesin powder and zircon powder. One of these materials may be used alone, or two or more of these materials may be mixed and used.
When the inorganic filler is the above-mentioned material, the plasma resistance and voltage resistance of the adhesion layer 50 can be improved.

The inorganic filler is preferably at least one of a spherical powder and an amorphous powder. Spherical powder refers to a sphere with rounded corners of powder particles. Further, the amorphous powder means a powder having a non-constant shape such as a crushed piece, a plate, a scale, and a needle.

Since the inorganic filler is at least one of spherical powder and amorphous powder, it is possible to design the composition so that the filling state in the resin in the resin composition is uniformly dispersed or close-packed, and further in the resin. By designing so that a part of the inorganic filler is exposed, it is possible to enhance the anchor effect due to the surface protrusions and improve the adhesion to the material constituting the ceramic layer 60.

The average particle size of the inorganic filler is preferably 1 μm or more and 10 μm or less, and more preferably 3 μm or more and 6 μm or less.
When the inorganic filler is a spherical powder, its diameter (outer diameter) is defined as the particle diameter, and when the inorganic filler is an amorphous powder, the longest portion of the shape is defined as the particle diameter.

The content of the inorganic filler in the resin composition is preferably 100 parts by mass or more and 300 parts by mass or less, and more preferably 150 parts by mass or more and 250 parts by mass or less with respect to 100 parts by mass of polysilazane.

The resin composition may contain only polysilazane and an inorganic filler, or may contain components other than polysilazane and an inorganic filler (sometimes referred to as "other components" in the present specification). Good.
The other components are not particularly limited and can be arbitrarily selected depending on the intended purpose.
Other components include, for example, fibrous fillers. The fibrous filler is preferably at least one selected from the group consisting of plant fibers, inorganic fibers and fibrous organic resins. Examples of plant fibers include pulp and the like. Examples of the inorganic fiber include fibers made of alumina and the like. Examples of the fibrous organic resin include fibers made of aramid, Teflon (registered trademark), and the like.

The total content of the inorganic filler and the fibrous filler with respect to the entire resin composition (100% by volume) is preferably 10% by volume or more and 80% by volume or less.

The thickness of the adhesion layer 50 is preferably 1 μm or more and 40 μm or less, and more preferably 5 μm or more and 20 μm or less. When the thickness of the adhesion layer 50 is 1 μm or more, the adhesion layer 50 does not become thin locally, and the ceramic layer 60 can be uniformly formed on the adhesion layer 50 by thermal spraying. On the other hand, if the thickness of the adhesive layer 50 is 40 μm or less, sufficient adsorption force is generated.

The material constituting the ceramic layer 60 is not particularly limited, and for example, boron nitride, aluminum nitride, zirconium oxide, silicon oxide, tin oxide, indium oxide, quartz glass, soda glass, lead glass, borosilicate glass, and zirconium nitride. , Titanium oxide and the like are used. One of these materials may be used alone, or two or more of these materials may be mixed and used.
These materials are preferably powders having an average particle size of 1 μm or more and 25 μm or less. By using such powder, the voids in the ceramic layer 60 can be reduced and the withstand voltage of the ceramic layer 60 can be improved.

The thickness of the ceramic base layer 61 is preferably 10 μm or more and 80 μm or less, and more preferably 25 μm or more and 50 μm or less. When the thickness of the ceramic base layer 61 is 10 μm or more, sufficient plasma resistance and withstand voltage resistance are exhibited. On the other hand, if the thickness of the ceramic base layer 61 is 80 μm or less, sufficient adsorption force is generated.

The thickness of the ceramic surface layer 62 is preferably 5 μm or more and 20 μm or less. When the thickness of the ceramic surface layer 62 is 5 μm or more, unevenness can be formed over the entire area of the ceramic surface layer 62. On the other hand, if the thickness of the ceramic surface layer 62 is 20 μm or less, sufficient adsorption force is generated.

By polishing the surface of the ceramic surface layer 62, its adsorption force can be improved, and the unevenness of the surface can be adjusted as the surface roughness Ra.
Here, the surface roughness Ra means a value measured by the method specified in JIS B0601-1994.

The surface roughness Ra of the ceramic surface layer 62 is preferably 0.05 μm or more and 0.5 μm or less. When the surface roughness Ra of the ceramic surface layer 62 is within the above range, the adsorbed body can be adsorbed satisfactorily. When the surface roughness Ra of the ceramic surface layer 62 is increased, the contact area between the object to be adsorbed and the ceramic surface layer 62 is reduced, so that the adsorption force is also reduced.

The resin constituting the resin layer 70 includes epoxy resin, phenol resin, styrene block copolymer, polyamide resin, acrylonitrile-butadiene copolymer, polyester resin, polyimide resin, silicone resin, amine compound, bismaleimide compound and the like. An adhesive containing one or more selected resins as a main component is used.

As the epoxy resin, bisphenol type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, glycidyl ether type epoxy resin, glycidyl ester type epoxy resin, glycidylamine type epoxy resin, trihydroxyphenylmethane type epoxy resin, tetraglycidyl Examples thereof include bifunctional groups such as phenol alkane type epoxy resin, naphthalene type epoxy resin, diglycidyl diphenylmethane type epoxy resin, and diglycidyl biphenyl type epoxy resin, or polyfunctional epoxy resin. Among these, bisphenol type epoxy resin is preferable. Among the bisphenol type epoxy resins, the bisphenol A type epoxy resin is particularly preferable. When the epoxy resin is the main component, if necessary, a curing agent for epoxy resins such as imidazoles, tertiary amines, phenols, dicyandiamides, aromatic diamines, and organic peroxides, and curing acceleration. Agents can also be added.

The thickness of the resin layer 70, that is, the thickness in the direction perpendicular to the side surface 2b in the thickness direction of the laminate 2, is preferably 10 μm or more, and more preferably 100 μm or more. When the thickness of the resin layer 70 is 10 μm or more, the stress at the interface between the laminate 2 and the ceramic layer 60 can be sufficiently relaxed.

In the electrostatic chuck device 1 of the present embodiment described above, on the upper surface 2a in the thickness direction of the laminate 2 including at least the internal electrode 20, the first insulating organic film 41 and the second insulating organic film 42. A ceramic layer 60 laminated via the adhesion layer 50 is provided, and a resin layer 70 is provided in which the surface of the adhesion layer 50 on the side of the laminate 2 and the side surface 2b of the laminate 2 in the thickness direction are connected to each other. On the side surface 2b in the thickness direction, the ceramic layer 60 is bonded to at least the internal electrode 20, the first insulating organic film 41, and the second insulating organic film 42 in the laminate 2 via the resin layer 70. There is. Therefore, at the interface between the laminate 2 and the ceramic layer 60, the stress caused by the difference in the coefficient of thermal expansion of these materials can be relaxed, and the occurrence of cracks at the interface can be suppressed. As a result, it is possible to prevent the ceramic layer 60 from peeling off.

[Manufacturing method of electrostatic chuck]
The manufacturing method of the electrostatic chuck device 1 of this embodiment will be described with reference to FIG.
A metal such as copper is vapor-deposited on the surface of the first insulating organic film 41 (the upper surface of the first insulating organic film 41 in the thickness direction) 41a to form a thin metal film. After that, etching is performed to pattern the metal thin film into a predetermined shape to form the first internal electrode 21 and the second internal electrode 22.

Next, a second insulating property is provided on the upper surface (the surface of the internal electrode 20 opposite to the first insulating organic film 41) 20a in the thickness direction of the internal electrode 20 via the second adhesive layer 32. The organic film 42 is attached.

Next, the lower surface of the first insulating organic film 41 in the thickness direction (the surface of the first insulating organic film 41 opposite to the internal electrode 20) 41b is the surface of the substrate 10 (in the thickness direction of the substrate 10). The laminate 2 containing the first insulating organic film 41, the internal electrode 20, the second adhesive layer 32, and the second insulating organic film 42 is attached to the first adhesive so as to be on the upper surface) 10a side. It is bonded to the surface 10a of the substrate 10 via the layer 31.

Next, the first ceramic base layer 61A is formed on at least the internal electrode 20, the first insulating organic film 41, and the second insulating organic film 42 on the side surface 2b in the thickness direction of the laminated body 2.
In the method of forming the first ceramic base layer 61A, for example, a slurry containing the material constituting the first ceramic base layer 61A is applied to the side surface 2b in the thickness direction of the laminate 2 and sintered to form the first ceramic base layer 61A. A method for forming the ceramic base layer 61A, the material constituting the first ceramic base layer 61A is sprayed into the vicinity of the side surface 2b or the side surface 2b in the thickness direction of the laminate 2 to form the first ceramic base layer 61A. The method and the like can be mentioned.
Here, thermal spraying is a method of forming a film by heating and melting a material to be a coating film (in this embodiment, the first ceramic base layer 61A) and then injecting it into an object to be treated using a compressed gas. is there.
When the first ceramic base layer 61A is formed, a portion where the side surface 2b of the laminate 2 in the thickness direction and the first ceramic base layer 61A do not adhere to each other may occur, and the portion may become a gap 80. Further, a gap 80 is formed between the first ceramic base layer 61A formed in the vicinity of the side surface 2b in the thickness direction of the laminated body 2 and the side surface 2b.

Next, the gap 80 between the side surface 2b in the thickness direction of the laminate 2 and the first ceramic base layer 61A is filled with resin to form the resin layer 70.
The resin filled in the gap 80 is the resin constituting the resin layer 70.

Next, the thickness of the upper surface (the surface of the second insulating organic film 42 opposite to the internal electrode 20) 42a in the thickness direction of the second insulating organic film 42 and the thickness of the laminate 2 in the resin layer 70. The adhesion layer 50 is formed so as to cover the side surface 2b in the direction and the surface 70b that is not in contact with the first ceramic base layer 61A.
The method of forming the adhesion layer 50 is to use the upper surface 42a of the second insulating organic film 42 in the thickness direction, the side surface 2b of the laminate 2 in the resin layer 70 in the thickness direction, and the first ceramic base layer 61A. The adhesion layer 50 is not particularly limited as long as it can be formed so as to cover the non-contact surface 70b. Examples of the method for forming the adhesion layer 50 include a bar coating method, a spin coating method, and a spray coating method.

Next, the second ceramic base layer 61B is formed so as to cover the upper surface (the surface of the adhesion layer 50 opposite to the laminated body 2) 50a in the thickness direction of the adhesion layer 50.
In the method of forming the second ceramic base layer 61B, for example, a slurry containing the material constituting the second ceramic base layer 61B is applied to the entire outer surface of the adhesion layer 50 and sintered to form the second ceramic base layer 61B. Examples thereof include a method of forming the 61B, a method of spraying the material constituting the second ceramic base layer 61B on the entire outer surface of the adhesion layer 50 to form the second ceramic base layer 61B, and the like.
Here, thermal spraying is a method of forming a film by heating and melting a material to be a coating film (in this embodiment, the second ceramic base layer 61B) and then injecting it into an object to be treated using a compressed gas. is there.

Next, the ceramic surface layer 62 is formed on the upper surface 61a of the ceramic base layer 61 in the thickness direction.
The method of forming the ceramic surface layer 62 is, for example, to mask the upper surface 61a of the ceramic base layer 61 in the thickness direction with a predetermined shape, and then apply the material constituting the ceramic surface layer 62 in the thickness direction of the ceramic base layer 61. A method of forming the ceramic surface layer 62 by spraying on the upper surface 61a of the above, the material constituting the ceramic surface layer 62 is sprayed on the entire surface of the upper surface 61a in the thickness direction of the ceramic base layer 61 to form the ceramic surface layer 62, and then the ceramic surface layer 62 is formed. Examples thereof include a method in which the ceramic surface layer 62 is formed into an uneven shape by scraping the 62 by a blast treatment.

By the above steps, the electrostatic chuck device 1 of the present embodiment can be manufactured.

In the method for manufacturing the electrostatic chuck device of the present embodiment described above, the side surface in the thickness direction of the laminate 2 including at least the internal electrode 20, the first insulating organic film 41 and the second insulating organic film 42. It has a step of filling the gap 80 between 2b and the first ceramic base layer 61A with a resin to form the resin layer 70. Therefore, at the interface between the laminate 2 and the ceramic layer 60, the stress caused by the difference in the coefficient of thermal expansion of these materials can be relaxed, and the occurrence of cracks at the interface can be suppressed. As a result, it is possible to prevent the ceramic layer 60 from peeling off.

According to the electrostatic chuck device of the present invention, at least on the side surface in the thickness direction of the laminate including the internal electrode, the first insulating organic film and the second insulating organic film, the laminate is interposed through the resin layer. By bonding the ceramic layer to at least the internal electrode, the first insulating organic film and the second insulating organic film in the above, the difference in the thermal expansion coefficient of these materials at the interface between the laminate and the ceramic layer The resulting stress can be relaxed, cracks can be suppressed from occurring at the interface, and peeling of the ceramic layer can be suppressed. Therefore, according to the electrostatic chuck device of the present invention, a conductor or a semiconductor such as a wafer for a dry etching device in a semiconductor manufacturing process can be stably electrostatically attracted and held.

1 Electrostatic chuck device 2 Laminated body 10 Substrate 20 Internal electrode 21 First internal electrode 22 Second internal electrode 30 Adhesive layer 31 First adhesive layer 32 Second adhesive layer 40 Insulating organic film 41 First 1 Insulating Organic Film 42 Second Insulating Organic Film 50 Adhesive Layer 60 Ceramic Layer 61 Ceramic Underlayer 61A First Ceramic Underlayer 61B Second Ceramic Underlayer 62 Ceramic Surface 70 Resin Layer 80 Gap

Claims (2)

A plurality of internal electrodes, a first insulating organic film and a second insulating organic film provided on both sides in the thickness direction of the internal electrodes, at least the internal electrodes, and the first insulating organic film. And a ceramic layer laminated on the upper surface of the laminate containing the second insulating organic film in the thickness direction via an adhesion layer.
A resin layer is provided in which the surface of the adhesion layer on the side of the laminate and the side surface of the laminate in the thickness direction are connected to each other, and on the side surface of the laminate in the thickness direction of the laminate, the resin layer is used in the laminate. An electrostatic chuck device characterized in that the ceramic layer is bonded to at least the internal electrode, the first insulating organic film, and the second insulating organic film. The process of forming an internal electrode on the upper surface of the first insulating organic film in the thickness direction, and
A step of attaching the second insulating organic film to the surface of the internal electrode opposite to the first insulating organic film, and
The first insulating organic film, the internal electrode, and the second insulation so that the surface of the first insulating organic film opposite to the internal electrode is the upper surface side in the thickness direction of the substrate. A step of joining a laminate containing an organic film to one surface of the substrate, and
A step of forming a first ceramic base layer on at least the internal electrode, the first insulating organic film, and the second insulating organic film on the side surface in the thickness direction of the laminate.
A step of filling a gap between a side surface in the thickness direction of the laminate and the first ceramic base layer with a resin to form a resin layer,
An adhesive layer is provided so as to cover the upper surface of the second insulating organic film in the thickness direction, the side surface of the resin layer in the thickness direction of the laminate, and the surface not in contact with the first ceramic base layer. The process of forming and
A step of forming a second ceramic base layer so as to cover the upper surface of the adhesion layer in the thickness direction, and
A method for manufacturing an electrostatic chuck device, which comprises a step of forming a ceramic surface layer on the upper surface of the second ceramic base layer in the thickness direction.

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