JP2020160142A - Imaging apparatus, on-vehicle camera, vehicle, and method for manufacturing imaging apparatus - Google Patents

Abstract

To provide an imaging apparatus that reduces occurrence of defocus of a picked-up image due to a change in at least one of a temperature and humidity.SOLUTION: An imaging apparatus 10 comprises: an imaging optical system 11; a holding member 12; an image pick-up device 13; a first substrate 14; a first adhesive member 15; and a pressing member 16. The imaging optical system 11 includes at least one optical element 21. The holding member 12 holds the imaging optical system 11. The image pick-up device 13 picks up a subject image formed by the imaging optical system 11. The first substrate 14 has the image pick-up device 13 mounted thereon. The first adhesive member 15 fixes a substrate part 23 combining the image pick-up device 13 and the substrate 14 to the holding member 12. The pressing member 16 is fixed to the holding member 12 and regulates a fluctuation of the first substrate 14 in a direction separated from the imaging optical system 11.SELECTED DRAWING: Figure 2

Description

The present disclosure relates to an image pickup device, an in-vehicle camera, a vehicle, and a method for manufacturing the image pickup device.

In an imaging device such as an in-vehicle camera, a method of fixing between an optical unit equipped with an imaging optical system such as a lens and a substrate on which an imaging element is mounted by using an adhesive member such as an adhesive is widely known. (See, for example, Patent Document 1). For example, an ultraviolet curable adhesive is used as the adhesive member, and the adhesive is irradiated with ultraviolet rays to cure the adhesive while positioning between the optical unit and the substrate.

Japanese Unexamined Patent Publication No. 2008-28838

However, when used in various changing environments such as in-vehicle cameras, the adhesive expands or contracts due to changes in environmental conditions such as humidity and temperature, so the positions of the image pickup optical system and the light receiving surface of the image sensor Relationships may change. When the positional relationship between the image pickup optical system and the image sensor changes, even a slight deviation causes the focus of the image pickup optical system and the light receiving surface of the image sensor to shift, resulting in blurring (so-called out-of-focus) of the captured image. ) Can occur.

An object of the present invention is to manufacture an image pickup device, an in-vehicle camera, a vehicle equipped with the image pickup device, and the image pickup device capable of reducing the occurrence of defocusing of the captured image due to a change in at least one of temperature and humidity. To provide a method.

An image pickup device that achieves the above object includes an image pickup optical system, a holding member, an image pickup element, a substrate, an adhesive member, and a pressing member. The imaging optical system includes at least one optical element. The holding member holds the imaging optical system. The image sensor captures a subject image imaged by the image pickup optical system. The substrate mounts the image sensor. The adhesive member fixes the substrate portion that integrates the image pickup element and the substrate to the holding member. The pressing member is fixed to the holding member and regulates the fluctuation of the substrate in the direction away from the imaging optical system.

An in-vehicle camera that achieves the above object is an in-vehicle camera mounted on a vehicle, and includes an image pickup optical system, a holding member, an image pickup element, a substrate, an adhesive member, and a pressing member. The imaging optical system includes at least one optical element. The holding member holds the imaging optical system. The image sensor captures a subject image imaged by the image pickup optical system. The substrate mounts the image sensor. The adhesive member fixes the substrate portion that integrates the image pickup element and the substrate to the holding member. The pressing member is fixed to the holding member and regulates the fluctuation of the substrate in the direction away from the imaging optical system.

A vehicle that achieves the above object is provided with an imaging device. The image pickup apparatus includes an image pickup optical system, a holding member, an image pickup element, a substrate, an adhesive member, and a pressing member. The imaging optical system includes at least one optical element. The holding member holds the imaging optical system. The image sensor captures a subject image imaged by the image pickup optical system. The substrate mounts the image sensor. The adhesive member fixes the substrate portion that integrates the image pickup element and the substrate to the holding member. The pressing member is fixed to the holding member and regulates the fluctuation of the substrate in the direction away from the imaging optical system.

A method of manufacturing an image pickup apparatus that achieves the above object includes applying an adhesive to a holding member that holds an image pickup optical system including at least one optical element, and fixing a substrate on which the image pickup element is mounted. Further, the method of manufacturing the image pickup apparatus includes fixing a pressing member that regulates fluctuation of the substrate in a direction away from the image pickup optical system to the holding member.

According to the embodiment of the present disclosure, it is possible to reduce the occurrence of defocusing of the captured image due to a change in at least one of temperature and humidity.

It is a figure which shows the installation place in the vehicle of an image pickup apparatus. It is sectional drawing which shows the cross section including the optical axis of the image pickup apparatus which concerns on 1st Embodiment. It is sectional drawing which shows the structure of the main part of the image pickup apparatus which concerns on 2nd Embodiment. It is a flowchart which shows the manufacturing method of the image pickup apparatus of FIG. It is a figure explaining the manufacturing process of the image pickup apparatus of FIG. It is a figure explaining the manufacturing process of the image pickup apparatus of FIG. It is a figure explaining the manufacturing process of the image pickup apparatus of FIG. It is a figure explaining the manufacturing process of the image pickup apparatus of FIG.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. The figures used in the following description are schematic. The dimensional ratios on the drawings do not always match the actual ones.

(Arrangement of imaging devices in the vehicle)
The imaging device 10 of the present disclosure can be mounted on a vehicle. FIG. 1 is a layout diagram illustrating a mounting position of the imaging device 10 in the vehicle 1. The image pickup device 10 mounted on the vehicle 1 can be called an in-vehicle camera. The image pickup device 10 can be installed at various locations in the vehicle 1. For example, the image pickup device 10a can be arranged at or near the front bumper as a camera for monitoring the front when the vehicle 1 is traveling. Further, the image pickup device 10b for monitoring the front can be arranged in the vicinity of the rear view mirror in the vehicle interior of the vehicle 1. The image pickup apparatus 10c can be arranged on the dashboard, in the instrument panel, or the like as a camera for monitoring the driving situation of the driver. The image pickup apparatus 10d can be installed at the rear of the vehicle 1 for the rear monitor of the vehicle 1. The image pickup devices 10a and 10b can be called a front camera. The image pickup apparatus 10c can be called an in-camera. The image pickup device 10d can be called a rear camera. The in-vehicle camera is not limited to these, and includes an image pickup device 10 installed at various positions such as a left side camera that images the left rear side and a right side camera that images the right rear side.

The image signal of the image captured by the image pickup device 10 can be output to the information processing device 2 in the vehicle 1, the display device 3, or the like. The information processing device 2 in the vehicle 1 includes a device that recognizes an image and assists the driver in driving. The information processing device 2 includes, but is not limited to, for example, a navigation device, a collision damage mitigation braking device, an inter-vehicle distance control device, a lane departure warning system, and the like. The display device 3 can receive an image signal directly from the image pickup device 10 or via the information processing device 2. The display device 3 may employ, but is not limited to, a liquid crystal display (LCD), an organic EL (Electro-Luminescence) display, and an inorganic EL display. The display device 3 can display to the driver an image signal output from the image pickup device 10 that captures an image at a position that is difficult for the driver to see, such as a rear camera.

(First Embodiment)
The image pickup apparatus 10A of the first embodiment will be described with reference to FIG. In the following, the image pickup devices 10 of the first and second embodiments are distinguished as the image pickup devices 10A and 10B. Further, the imaging devices 10A and 10B may be collectively referred to as the imaging device 10. As shown in FIG. 2, the image pickup apparatus 10A includes an image pickup optical system 11, a holding member 12, an image sensor 13, a first substrate 14 (board), a first adhesive member 15 (adhesive member), a pressing member 16, and a front surface. The case 17 and the rear case 18 are included.

The imaging optical system 11 includes at least one optical element 21. The optical element 21 can include a lens such as a convex lens and a concave lens. The imaging optical system 11 defines the optical axis O. In the following, when viewed in the direction along the optical axis O, the direction from the image pickup apparatus 10A toward the subject is referred to as "forward", and the opposite direction is referred to as "rear". The imaging optical system 11 is designed and formed so as to satisfy desired optical characteristics such as focal length and depth of focus. Specifically, the image pickup optical system 11 is designed so as to form an image of a subject on a light receiving surface of the image pickup element 13.

The holding member 12 holds the imaging optical system 11. The holding member 12 can be a tubular housing that holds the optical element 21 that constitutes the imaging optical system 11. The holding member 12 transmits at least a luminous flux along the optical axis O. The holding member 12 can be configured in various shapes. The cross section of the holding member 12 orthogonal to the optical axis O may have a shape close to a circle in the front along the outer peripheral shape of the optical element 21, and a shape close to a square or a rectangle in the rear, which is the shape of the image sensor 13. .. The imaging optical system 11 and the holding member 12 form an optical unit 22. The optical unit 22 can be incorporated in the front case 17.

The image sensor 13 is an element that converts an image of a subject imaged on the light receiving surface of the image sensor 13 into an electric signal and outputs the image. As the image sensor 13, a CCD image sensor (Charge-Coupled Device Image Sensor), a CMOS image sensor (Complementary MOS Image Sensor), or the like can be used. The light receiving surface of a typical image sensor 13 is square or rectangular. The light receiving surface of the image sensor 13 is arranged so as to be orthogonal to the optical axis O and to pass the optical axis O substantially at the center.

The first substrate 14 (substrate) mounts the image sensor 13 on a surface facing forward. The normal direction of the surface of the first substrate 14 on which the image sensor 13 is arranged substantially coincides with the direction of the optical axis O. The first substrate 14 can be a printed circuit board (PCB). The first substrate 14 may have various shapes, but in the present embodiment, it may have a square or rectangular shape similar to that of the image sensor 13. The image pickup element 13 may be arranged so that each side of the first substrate 14 and each side of the light receiving surface of the image pickup element 13 are parallel to each other. Electronic components other than the image sensor 13 can be mounted on the first substrate 14. However, only the image sensor 13 may be mounted on the first substrate 14. The one in which the image sensor 13 and the first substrate 14 are integrated is called a substrate portion 23.

The first adhesive member 15 is arranged between the first substrate 14 and the holding member 12, and fixes the substrate portion 23 to the holding member 12. Therefore, the holding member 12 has a surface facing at least a part of the outer peripheral portion of the front-facing surface of the first substrate 14. For example, as shown in FIG. 2, the holding member 12 has an inner flange portion 24 and an outer flange portion 25 protruding inward and outward, respectively, at least a part of the rear end portion of the tubular housing. The rear surface of the inner flange portion 24 and the outer flange portion 25 is a flat surface substantially orthogonal to the direction of the optical axis O. The rear surface of the inner flange portion 24 faces, for example, an outer peripheral portion along two sides of the front surface of the first substrate 14, and the rear surface of the inner flange portion 24 and the front surface of the first substrate 14 The first adhesive member 15 is arranged linearly with the outer peripheral portion of the surface. The position where the first adhesive member 15 is arranged is not limited to the above. The first adhesive member 15 may be arranged along four sides of the front surface of the first substrate 14. Alternatively, the first adhesive member 15 may be arranged at a point-like distance along a plurality of sides of the front surface of the first substrate 14.

Various adhesives can be used as the first adhesive member 15. For example, the first adhesive member 15 can be used with either an ultraviolet curable adhesive or a thermosetting adhesive, or a combination thereof. When a UV-curable adhesive and a thermosetting adhesive are used in combination, for example, the position of the substrate portion 23 is determined and the first-stage fixing is performed using the UV-curable adhesive. After that, a thermosetting adhesive is applied around it and heated to perform the fixing in the second stage, whereby the substrate portion 23 can be firmly fixed to the optical unit 22. By doing so, the accuracy of positioning and the stability of adhesion can be ensured. The first adhesive member 15 is cured in a state of being positioned with high accuracy in the 6-axis direction so that the light receiving surface of the image pickup element 13 is located at the imaging position of the image pickup optical system 11.

The pressing member 16 is a member fixed to the holding member 12 and mechanically regulates the fluctuation of the first substrate 14 in the direction away from the imaging optical system 11. The presser member 16 is made of various materials such as metal, ceramics or resin. It is desirable that the pressing member 16 is made of a material having a relatively high hardness with respect to the material of the first adhesive member 15. The pressing member 16 includes a first portion 26 that presses the first substrate 14 and a second portion 27 that is fastened to the holding member 12. In the example of FIG. 2, a step is provided between the first portion 26 and the second portion 27 in the direction along the optical axis O, and the first portion 26 is compared with the second portion 27. Located behind.

The first portion 26 of the pressing member 16 is a portion that regulates the fluctuation of the first substrate 14 of the pressing member 16. The first portion 26 is located on the side opposite to the side on which the first adhesive member 15 of the first substrate 14 is arranged, that is, rearward, and extends along the outer peripheral portion of the first substrate 14. The front surface of the first portion 26 abuts on the surface of the first substrate 14 opposite to the surface facing the imaging optical system 11 (that is, the rear surface). The inner flange portion 24 of the holding member 12 and the first portion 26 of the pressing member 16 sandwich and hold the first substrate 14 and the first adhesive member 15 from the front and the rear.

The second portion 27 of the pressing member 16 extends along the outer flange portion 25 of the holding member 12, and abuts on the outer flange portion 25 in a state of being fastened to the outer flange portion 25. The second portion 27 of the pressing member 16 and the outer flange portion 25 of the holding member 12 are fastened by a fastening mechanism. The fastening mechanism includes, for example, a screw hole provided at a position opposite to the second portion 27 of the pressing member 16 and the outer flange portion 25 of the holding member 12, and the second portion 27 and the outside inserted into the screw hole. A fastening screw 28 that fixes the flange portion 25 to each other. By fixing the pressing member 16 to the holding member 12 with the fastening screw 28, the first portion 26 of the pressing member 16 regulates the rearward displacement of the first substrate 14. The fastening mechanism is not limited to the one using the fastening screw 28, and for example, the fastening mechanism may be configured to sandwich the outer flange portion 25 of the holding member 12 and the second portion 27 of the pressing member 16 from the front and the rear.

The front case 17 is located on the front side of the image pickup device 13 and has an opening 31 on the front side along the optical axis O. The front case 17 accommodates the optical unit 22 so that the light from the subject passing through the opening 31 enters the imaging optical system 11. The front case 17 can hold the optical unit 22 by various holding methods including screwing, bonding, fitting, and the like. In order to seal the internal space of the front case 17 and the rear case 18 from the outside, the front case 17 and the optical unit 22 may be sealed by a sealing member such as an O-ring. Further, the front case 17 may be configured integrally with the optical unit 22. When the front case 17 is integrally formed with the optical unit 22, the inner flange portion 24 and the outer flange portion 25 of the holding member 12 are formed as internal structures of the front case 17.

The rear case 18 is located on the rear side of the image sensor 13, and together with the front case 17, accommodates the optical unit 22, the substrate unit 23, and other components of the image sensor 10A. The front case 17 and the rear case 18 can be fixed to each other by various methods such as adhesion, screwing, and ultrasonic welding. The rear case 18 is provided with a signal connection unit 33 having a plurality of terminals 32 for transmitting an image signal of a subject image imaged by the image sensor 13 to the outside of the image pickup device 10A. The signal connection unit 33 can be electrically connected to the input terminal of the information processing device 2 or the display device 3 in the vehicle 1 to output an image signal. The first substrate 14 and the signal connecting portion 33 are electrically connected by a flexible substrate 34 or any kind of signal line.

If necessary, a second substrate 35 can be provided in the rear case 18. The second substrate 35 can be supported inside the rear case 18 in any way. Various electronic components for processing the image signal output by the image sensor 13 can be mounted on the second substrate 35. The second substrate 35 is electrically connected to the first substrate 14 and the signal connecting portion 33 by a flexible substrate 34 or any kind of signal line.

In general, adhesives expand or contract depending on environmental conditions such as temperature and humidity. For example, a general adhesive expands with either a temperature rise or a humidity rise, and the expansion becomes particularly large under high temperature and high humidity conditions. If the temperature and humidity are high without the pressing member 16, there is a concern that the first adhesive member 15 will expand and the light receiving surface of the image sensor 13 will be displaced in the direction opposite to the image pickup optical system 11 (rearward). .. When the light receiving surface of the image sensor 13 is displaced, the image captured by the image sensor 13 is out of focus due to defocus.

On the other hand, the image pickup apparatus 10A of the present embodiment has the above-described configuration, and even under the condition that the first adhesive member 15 expands, the image pickup apparatus 10A of the first substrate 14 moves away from the image pickup optical system 11 (that is, backward). The displacement is suppressed by the first portion 26 of the presser member 16. According to the experiments by the present inventors, the displacement of the position of the image sensor 13 in the optical axis O direction under the same environmental change condition is about 5 microns in the configuration without the presser member 16, whereas the presser is about 5 microns. It was confirmed that by providing the member 16, the size can be suppressed to about 2 microns.

As described above, according to the present embodiment, it is possible to reduce the occurrence of defocusing of the captured image due to a change in at least one of temperature and humidity. As a result, it is possible to suppress the occurrence of out-of-focus of the captured image.

(Second Embodiment)
The image pickup apparatus 10B according to the second embodiment will be described with reference to FIG. FIG. 3 illustrates only the main part of the image pickup apparatus 10B, excluding the front case 17, the rear case 18, and the like. In the image pickup device 10A of the first embodiment, the image pickup device 10B does not directly contact the outer peripheral portion of the first substrate 14 with the first portion 26 of the pressing member 16, but rather the outer peripheral portion of the first substrate 14. A second adhesive member 36 is arranged between the pressing member 16 and the first portion 26 of the pressing member 16. Since other configurations are the same as those of the image pickup apparatus 10A of the first embodiment, the same components are designated by the same reference numerals and the description thereof will be omitted.

According to the present embodiment, since the pressing member 16 regulates the fluctuation of the pressing member 16 in the direction away from the imaging optical system 11 of the first substrate 14 via the second adhesive member 36, imaging with changes in temperature and humidity is performed. It is possible to reduce the occurrence of out-of-focus of the image. Further, in the image pickup apparatus 10A of the first embodiment, in order to accurately align the light receiving surface of the image pickup device 13 with the image formation position of the image pickup optical system 11, a slight difference in focal length due to individual differences in the image pickup optical system 11 is required. Correspondingly, it may be necessary to prepare a plurality of types of pressing members 16. In the imaging device 10B of the present embodiment, since the thickness of the second adhesive member 36 can be changed, it is not necessary to prepare a plurality of pressing members 16 according to the imaging position of the imaging optical system 11.

Further, in the image pickup apparatus 10B, the second adhesive member 36 has substantially the same expansion rate against heat and humidity as the first adhesive member 15, and the thickness of the image pickup optical system 11 in the optical axis O direction is substantially the same. Can be arranged as such. As a result, even when the humidity and temperature change, the first adhesive member 15 and the second adhesive member 36 try to expand substantially equally, and the first substrate 14 is viewed from the front surface and the rear surface. Press with approximately equal pressure. As a result, the first substrate 14 is not displaced in the direction of the optical axis O. This makes it possible to further reduce the occurrence of defocusing of the captured image due to changes in temperature and humidity.

On the other hand, the focal length of the imaging optical system 11 may change as the temperature of the environment changes. In such a case, in the image pickup device 10B, the expansion ratio of the first adhesive member 15 and the second adhesive member 36 against heat or the thickness in the optical axis O direction is made different, and the focal length of the image pickup optical system 11 changes. The position of the image pickup device 13 with respect to the image pickup optical system 11 can be displaced in the following direction. For example, when the focal length of the image pickup optical system 11 becomes longer as the temperature rises, the temperature rises by using the second adhesive member 36 having a coefficient of thermal expansion smaller than the coefficient of thermal expansion of the first adhesive member 15. At the same time, the image sensor 13 may be displaced rearward. By doing so, it is possible to cancel the influence of the change in the focal length of the imaging optical system 11 due to the temperature change and maintain a good imaging state. For example, 30% or more, more preferably 50% or more of the distance at which the focal point of the image pickup optical system 11 is displaced due to a temperature change is an image pickup element due to expansion or contraction of the first adhesive member 15 and the second adhesive member 36. It can be designed to be compensated for by the displacement of 13.

(Production method)
Next, a method of manufacturing the image pickup apparatus 10B of the second embodiment will be described with reference to FIGS. 4 to 8.

First, the optical unit 22 and the substrate portion 23 are prepared. The first adhesive member 15 is applied to the inner flange portion 24 of the holding member 12 of the optical unit 22 (step S01).

When the adhesive is applied to the inner flange portion 24, the substrate portion 23 is fixed to the optical unit 22 via the first adhesive member 15 as shown in FIG. 5 (step S02). The substrate portion 23 is fixed in a state in which the position of the substrate portion 23 is adjusted by 6 axes with high accuracy so that the imaging position of the image pickup optical system 11 is aligned with the light receiving surface of the image pickup element 13. As the first adhesive member 15, either an ultraviolet curable adhesive or a thermosetting adhesive, or a combination thereof can be used. In that case, for example, first apply an ultraviolet curable adhesive, irradiate it with ultraviolet rays to cure it and determine the position to fix it, and then fill it with a thermosetting adhesive and heat it to cure it. Can be done.

Next, as shown in FIG. 6, the second adhesive member 36 is applied to the rear surface of the first substrate 14 (step S03). Similar to the first adhesive member 15, the second adhesive member 36 can be used with either an ultraviolet curable adhesive or a thermosetting adhesive, or a combination thereof.

When the second adhesive member 36 is applied, as shown in FIG. 7, the pressing member so that the front surface of the second portion 27 abuts on the rear surface of the outer flange portion 25 of the holding member 12. 16 is arranged (step S04). In this state, the second adhesive member 36 is positioned so as to be in contact with both the front surface of the first portion 26 of the pressing member 16 and the rear surface of the first substrate 14.

After the pressing member 16 is arranged, as shown in FIG. 8, the fastening screw 28 fastens the second portion 27 of the pressing member 16 and the outer flange portion 25 of the holding member 12 of the optical unit 22 (step). S05).

Further, the second adhesive member 36 is cured in a state where the pressing member 16 and the optical unit 22 are fastened (step S06). The curing of the second adhesive member 36 is performed by an appropriate method depending on the adhesive used. As described above, the main part of the image pickup apparatus 10B is assembled.

In the above description of the manufacturing method, the first adhesive member 15 is assumed to be cured in step S02. However, the curing of the first adhesive member 15 does not have to be performed in step S02. In this case, in step S02, the optical unit 22 of the substrate portion 23 is positioned and the adhesive is applied, and the first adhesive member 15 is maintained in a highly accurate 6-axis adjusted state without being cured. The first adhesive member 15 is cured at the same time as the second adhesive member 36 in step S06.

The method of manufacturing the image pickup apparatus 10A of the first embodiment does not include the steps of steps S03 and S06, and the first portion 26 of the pressing member 16 comes into direct contact with the outer peripheral portion of the first substrate 14. It is different from the manufacturing method of the image pickup apparatus 10B. However, the manufacturing method of the imaging device 10A of the first embodiment is the same as or similar to the manufacturing method of the imaging device 10B shown in FIG. 4 in other respects.

The above-described embodiment has been described as a representative example. It will be apparent to those skilled in the art that many modifications and substitutions can be made within the spirit and scope of the present invention. Therefore, the present invention should not be construed as being limited by the above-described embodiments and examples, and various modifications and modifications can be made without departing from the scope of claims.

For example, "vehicles" in the present disclosure include, but are not limited to, automobiles, track vehicles, industrial vehicles, and domestic vehicles. For example, the vehicle may include an airplane traveling on the runway. Automobiles include, but are not limited to, passenger cars, trucks, buses, motorcycles, trolley buses and the like, and may include other vehicles traveling on the road. Track vehicles include, but are not limited to, locomotives, freight cars, passenger cars, trams, guided track railroads, ropeways, cable cars, maglev trains, and monorails, and may include other vehicles traveling along the track. Industrial vehicles include industrial vehicles for agriculture and construction. Industrial vehicles include, but are not limited to, forklifts and golf carts. Industrial vehicles for agriculture include, but are not limited to, tractors, cultivators, transplanters, binders, combines, and lawnmowers. Industrial vehicles for construction include, but are not limited to, bulldozers, scrapers, excavators, cranes, dump trucks, and road rollers. Living vehicles include, but are not limited to, bicycles, wheelchairs, prams, wheelbarrows, and electric standing two-wheeled vehicles. Vehicle power engines include, but are not limited to, diesel engines, gasoline engines, internal combustion engines including hydrogen engines, and electric engines including motors. Vehicles include those that run manually. The classification of vehicles is not limited to the above. For example, an automobile may include an industrial vehicle that can travel on the road and may include the same vehicle in multiple categories.

Further, the imaging device 10 of the present disclosure can be used not only for vehicles but also for various purposes. For example, the imaging device 10 of the present disclosure can be applied to a surveillance camera installed indoors or outdoors, or an imaging device mounted on a moving body other than a vehicle. Other moving objects include ships, aircraft, unmanned flying objects such as so-called drones, and the like.

1 Vehicle 2 Information processing device 3 Display device 10, 10A, 10B Image pickup device 11 Image pickup optical system 12 Holding member 13 Image pickup element 14 First substrate 15 First adhesive member 16 Presser member 17 Front case 18 Rear case 21 Optical element 22 Optical unit 23 Board part 24 Inner flange part 25 Outer flange part 26 First part 27 Second part 28 Fastening screw 31 Opening 32 Terminal 33 Signal connection part 34 Flexible board 35 Second board 36 Second adhesive member

Claims (8)

An imaging optical system including at least one optical element,
A holding member that holds the imaging optical system and
An image sensor that captures a subject image imaged by the imaging optical system,
A substrate on which the image sensor is mounted and
An adhesive member that fixes a substrate portion that integrates the image sensor and the substrate to the holding member,
A pressing member fixed to the holding member and restricting fluctuation of the substrate in a direction away from the imaging optical system,
An imaging device comprising. The imaging device according to claim 1, wherein the portion that regulates the fluctuation of the pressing member is located so as to abut on the surface of the substrate opposite to the surface facing the imaging optical system. The adhesive member is used as the first adhesive member.
The imaging device according to claim 1, wherein a second adhesive member is located between the substrate and a portion that regulates fluctuation of the pressing member. The imaging device according to claim 3, wherein the first adhesive member and the second adhesive member have substantially the same expansion rate against heat and humidity, and the thickness of the imaging optical system in the optical axis direction is substantially the same. When the temperature of the environment changes, the first adhesive member and the second adhesive member perform the imaging with respect to the imaging optical system in a direction that follows the change in the focal length of the imaging optical system due to the temperature change. The imaging device according to claim 3, wherein the position of the element is displaced. An on-board camera mounted on a vehicle
An imaging optical system including at least one optical element,
A holding member that holds the imaging optical system and
An image sensor that captures a subject image imaged by the imaging optical system,
A substrate on which the image sensor is mounted and
An adhesive member that fixes a substrate portion that integrates the image sensor and the substrate to the holding member,
A pressing member fixed to the holding member and restricting fluctuation of the substrate in a direction away from the imaging optical system,
In-vehicle camera equipped with. An imaging optical system including at least one optical element, a holding member holding the imaging optical system, an imaging element for capturing a subject image imaged by the imaging optical system, a substrate on which the imaging element is mounted, the imaging element and the above. An image pickup device including an adhesive member that fixes a substrate portion integrally with a substrate to the holding member, and a pressing member that is fixed to the holding member and regulates fluctuation of the substrate in a direction away from the imaging optical system. Vehicle to prepare. An adhesive is applied to a holding member that holds an image pickup optical system including at least one optical element, and a substrate on which the image pickup element is mounted is fixed.
A pressing member that regulates fluctuation of the substrate in a direction away from the imaging optical system is fixed to the holding member.
Manufacturing method of imaging device.

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