WO2019004006A1

WO2019004006A1 - Imaging device, method for producing imaging device, and moving body

Info

Publication number: WO2019004006A1
Application number: PCT/JP2018/023271
Authority: WO
Inventors: 敦吉川; 健作志和; 進浅岡
Original assignee: 京セラ株式会社
Priority date: 2017-06-28
Filing date: 2018-06-19
Publication date: 2019-01-03

Abstract

This imaging device is provided with an imaging optical system, an imaging element, a holding member, a substrate and a separation member. The imaging optical system comprises at least one optical element. The imaging element captures a subject image that is formed by the imaging optical system. The holding member comprises a positioning part and a supporting part, and holds the imaging optical system. The imaging element is mounted on the substrate; and the substrate comprises a first bonding part that is bonded with the positioning part by means of a first bonding member and a second bonding part that is bonded with the supporting part by means of a second bonding member. The separation member is positioned between the first bonding part and the second bonding part. The first bonding member is positioned among the first bonding part, the positioning part and the separation member, and is cured in a shorter time than the second bonding member. The second bonding member is positioned among the second bonding part, the supporting part and the separation member, and has a higher bonding strength than the first bonding member.

Description

Imaging device, method of manufacturing imaging device, and movable body

Cross-reference to related applications

This application claims the priority of Japanese patent application 2017-126563 (filed on June 28, 2017), and Japanese patent application 2018-63664 (filed on March 29, 2018). The entire disclosure of that application is incorporated herein by reference.

The present disclosure relates to an imaging device, a method of manufacturing an imaging device, and a movable body.

In an imaging device, when joining the member containing a lens, and the member containing an imaging device, the structure where an ultraviolet curing adhesive and a thermosetting adhesive are used together is known (for example, refer patent document 1).

JP, 2010-263606, A

An imaging apparatus according to an embodiment of the present disclosure includes an imaging optical system including at least one optical element, an imaging element configured to capture an object image formed by the imaging optical system, a holding member, a substrate, and an isolation member. And The holding member holds the imaging optical system and includes a positioning unit and a support unit. The imaging device is mounted on the substrate. The substrate has a first bonding part bonded to the positioning part by a first bonding member. The substrate has a second bonding part bonded to the support part by a second bonding member. The separating member is located between the first bonding unit and the second bonding unit. The first adhesive member is positioned between the first adhesive portion, the positioning portion, and the separating member, and cures in a shorter time than the second adhesive member. The second adhesive member is positioned between the second adhesive part, the support part, and the separating member, and has higher bonding strength than the first adhesive member.

An imaging apparatus according to an embodiment of the present disclosure includes an imaging optical system including at least one optical element;
The image pickup device includes an image pickup element for picking up an object image formed by the image pickup optical system, a holding member, a substrate, and an isolation member. The holding member holds the imaging optical system and includes a positioning unit and a support unit. The substrate has a second bonding unit on which the imaging device is mounted and which is bonded to the support unit by a second bonding member. The separating member is positioned on the substrate and is bonded to the positioning unit with a first bonding member different from the second bonding member. The first adhesive member is positioned between the positioning portion and the separating member, and cures in a shorter time than the second adhesive member. The second adhesive member is positioned between the second adhesive part, the support part, and the separating member, and has higher bonding strength than the first adhesive member.

In a method of manufacturing an imaging device according to an embodiment of the present disclosure, an imaging optical system including at least one optical element, an imaging element for capturing an object image formed by the imaging optical system, a holding member, and a substrate And an isolation member. The holding member holds the imaging optical system and includes a positioning unit and a support unit. The imaging device is mounted on the substrate. The substrate has a first bonding part bonded to the positioning part by a first bonding member. The substrate has a second bonding part bonded to the support part by a second bonding member. The first adhesive member cures in a shorter time than the second adhesive member. The second adhesive member has higher bonding strength than the first adhesive member. The method includes applying a second adhesive member to the support. The manufacturing method includes disposing the substrate such that the first bonding unit corresponds to the positioning unit and the second bonding unit corresponds to the support unit. In the manufacturing method, an isolation member is positioned between the first bonding portion and the second bonding portion, and is located around the second bonding member along with the second bonding portion and the support portion. Including the step of placing. The method includes applying the first adhesive member at a position between the first adhesive part, the positioning part, and the separating member. The manufacturing method includes the step of determining the positional relationship between the holding member and the substrate. The manufacturing method includes the step of curing the first adhesive member. The method includes curing the second adhesive member.

A mobile according to an embodiment of the present disclosure mounts an imaging device. The imaging apparatus includes an imaging optical system including at least one optical element, an imaging element for imaging a subject image formed by the imaging optical system, a holding member, a substrate, and an isolation member. The holding member holds the imaging optical system and includes a positioning unit and a support unit. The imaging device is mounted on the substrate. The substrate has a first bonding part bonded to the positioning part by a first bonding member. The substrate has a second bonding part bonded to the support part by a second bonding member. The separating member is located between the first bonding unit and the second bonding unit. The first adhesive member is positioned between the first adhesive portion, the positioning portion, and the separating member, and cures in a shorter time than the second adhesive member. The second adhesive member is positioned between the second adhesive part, the support part, and the separating member, and has higher bonding strength than the first adhesive member.

It is an exploded perspective view showing an example of composition of an imaging device concerning one embodiment. It is a top view showing the example of composition of the imaging device concerning one embodiment. FIG. 3 is a cross-sectional view taken along the line AA of FIG. It is a bottom view of a substrate. It is an enlarged view of the broken-line enclosure part of FIG. FIG. 6 is a cross-sectional view taken along the line BB in FIG. 5; It is a flowchart which shows an example of the manufacturing method of the imaging device which concerns on one Embodiment. It is a sectional view of an imaging device concerning a comparative example. It is sectional drawing which shows the structural example by which a groove is provided in a holding member. It is sectional drawing which shows the structural example by which a groove is provided in a holding member. It is sectional drawing which shows the structural example whose isolation member is a washer shape. FIG. 6 is a cross-sectional view showing a configuration example in which the isolation member has low hardness and the isolation member is disposed in contact with the positioning portion. It is sectional drawing which shows the structural example by which the isolation member is arrange | positioned at the board | substrate upper part, and the cross section of the isolation member made the L shape. It is sectional drawing which shows the structural example which extended a part of isolation member of FIG. 13 to Z-axis direction of a positioning part. FIG. 15 is a cross-sectional view showing a configuration example in which a part of the separating member of FIG. 14 extended in the Z-axis direction is brought close to a positioning part. It is sectional drawing which shows the structural example which made the part which faced the positioning part of the isolation member of FIG. 14 the shape of sawtooth shape. It is sectional drawing which shows the structural example made into the shape which deleted the part which protruded in the Z-axis direction of one part to the board | substrate upper surface of the isolation member of FIG. FIG. 18 is a cross-sectional view showing a configuration example in which a part of the separating member in FIG. 17 extended in the Z-axis direction is brought close to a positioning part. FIG. 18 is a cross-sectional view showing a configuration example in which a portion facing the positioning portion of the separating member in FIG. 17 is made into a sawtooth shape. It is a sectional view showing an example of composition which provided a projection in a part of maintenance member, and arranged an isolation member between a projection and a positioning part. FIG. 21 is a cross-sectional view showing a configuration example in which the separating member of FIG. 20 is provided on the top of the substrate and the cross-section of the separating member is L-shaped. It is sectional drawing which shows the structural example which extended a part of isolation member of FIG. 21 to Z-axis direction of a positioning part. FIG. 23 is a cross-sectional view showing a configuration example in which a part of the separating member of FIG. 22 extended in the Z-axis direction is brought close to a positioning portion. FIG. 23 is a cross-sectional view showing a configuration example in which a portion facing the positioning portion of the separation member in FIG. 22 is made into a sawtooth shape. FIG. 23 is a cross-sectional view showing a configuration example in which a part protruding in the Z-axis direction on the upper surface of the substrate of the separating member of FIG. FIG. 26 is a cross-sectional view showing a configuration example in which a part of the separating member of FIG. 25 extended in the Z-axis direction is brought close to a positioning part. It is sectional drawing which shows the structural example which made the part which faced the positioning part of the isolation member of FIG. 25 the shape of sawtooth shape.

When different types of adhesives are used in combination, curing may be inhibited by mixing the respective adhesives with one another. As a result, bonding strength between members may be reduced. Even when different types of adhesives are used in combination, it is required that the bonding strength between members does not easily decrease.

As shown in FIGS. 1 to 4, the imaging device 1 according to an embodiment includes an imaging optical system 2, a substrate 3 on which an imaging element 30 is mounted, a holding member 4, and an isolation member 5. In FIG. 2 and FIG. 3, the substrate 3 and the imaging device 30 are represented by a phantom line of a two-dot chain line. The substrate 3 is positioned on the positive direction side of the Z axis with respect to the imaging optical system 2. The imaging element 30 is mounted on the surface of the substrate 3 on the side facing the imaging optical system 2 (see FIG. 4). The substrate 3 has a first bonding portion 31 and a second bonding portion 32. The substrate 3 may have a notch 3a. Although the 1st adhesion part 31 shall be located in the side of notch 3a, it may not be restricted to this, and may be located in other parts of substrate 3. The second bonding unit 32 is positioned on the surface of the substrate 3 on the side facing the imaging optical system 2, but is not limited thereto, and may be positioned on another portion of the substrate 3. The substrate 3 is bonded to the holding member 4 via the first bonding member 61, the second bonding member 62, and the separating member 5.

The imaging optical system 2 forms a subject image incident on the imaging device 1 on an imaging surface of the imaging device 30. The imaging optical system 2 is joined to the holding member 4. The imaging optical system 2 includes a first lens 21 and a second lens 22. The first lens 21 and the second lens 22 are collectively referred to as a lens. The number of lenses is not limited to two, and may be one or three or more. At least a part of the lens may be replaced by another element such as a mirror. Lenses or other elements such as mirrors are collectively referred to as optical elements. In other words, the imaging optical system 2 includes at least one optical element. The lens may be joined to the holding member 4 by, for example, a resin such as an adhesive. The lens may be joined to the holding member 4 by a mating structure. The lens may be joined to the holding member 4 by fastening a screw or the like.

The imaging element 30 captures a subject image formed on the imaging surface by the imaging optical system 2. The imaging device 30 may be configured by, for example, a complementary metal oxide semiconductor (CMOS) image sensor, a charge coupled device (CCD), or the like.

Not only the imaging device 30 but also a circuit for processing data of an image captured by the imaging device 30 may be mounted on the substrate 3. The substrate 3 may be composed of a printed circuit board or the like.

The holding member 4 holds the imaging optical system 2 and the substrate 3 on which the imaging device 30 is mounted. The holding member 4 may determine the positional relationship between the imaging optical system 2 and the substrate 3 such that the optical axis and focus of the imaging optical system 2 are on the imaging surface of the imaging device 30. The holding member 4 may be configured to include, for example, a material such as a resin. The holding member 4 is not limited to resin, and may be configured to include various materials.

The holding member 4 includes a positioning portion 41 and a support portion 42. The positioning unit 41 extends in the positive direction of the Z axis. In other words, the positioning unit 41 extends in the direction from the imaging optical system 2 toward the imaging device 30. The positioning portion 41 may have a pillar shape extending in the positive direction of the Z axis. The positioning portion 41 may have, for example, a cylindrical shape. The positioning portion 41 is not limited to a cylindrical shape, and may be another pillar shape such as an elliptic cylinder or a prism. The positioning portion 41 may be positioned so as to be inserted into the notch 3 a of the substrate 3. By arranging the notch 3a so as to fit the positioning portion 41, the position of the substrate 3 in the X-axis direction and the Y-axis direction, and the rotation angle of the substrate 3 around the optical axis of the imaging optical system 2 can be defined. .

The support part 42 is comprised by the surface which faces the positive direction of Z-axis. The support portion 42 may go around the optical axis of the imaging optical system 2. The support portion 42 protrudes from the imaging optical system 2 toward the substrate 3. The support portion 42 can define the distance in the Z-axis direction between the imaging optical system 2 and the imaging device 30 by supporting the substrate 3 with a surface facing the positive direction of the Z-axis.

As shown in FIGS. 5 and 6, the first bonding portion 31 of the substrate 3 is bonded to the positioning portion 41 via the first bonding member 61. The second bonding portion 32 of the substrate 3 is bonded to the support portion 42 via the second bonding member 62. The first adhesive member 61 and the second adhesive member 62 are collectively referred to as an adhesive member.

The first adhesive member 61 is an ultraviolet curable adhesive. The first adhesive member 61 is not limited to the ultraviolet curing adhesive, and may be made of a material that can be cured in a relatively short time. The first adhesive member 61 may be made of a material that can be cured in a shorter time than the second adhesive member 62. Since the first bonding member 61 can be cured in a relatively short time, the substrate 3 and the holding member 4 can be temporarily bonded in a short time while the positional relationship between them is determined.

The second adhesive member 62 is a thermosetting adhesive. The second adhesive member 62 is not limited to the thermosetting adhesive, and may be made of a material having higher adhesive strength than the first adhesive member 61. By the second adhesive member 62 having higher adhesive strength, the substrate 3 and the holding member 4 can be joined more firmly than in the case of being adhered only by the first adhesive member 61.

By combining different types of bonding members, temporary bonding by the first bonding member 61 and main bonding by the second bonding member 62 can be separately performed. By doing this, the tact time of the operation of performing positioning and adhesion can be shortened as compared with the case where only the second adhesive member 62 having high adhesive strength adheres. The strong bonding between the substrate 3 and the holding member 4 and the ease of position adjustment can be compatible.

When the positioning portion 41 is in the form of a pillar, it may be bonded to the substrate 3 via the first bonding member 61 on at least a part of the side surface thereof. The position and the rotation angle of the substrate 3 can be adjusted not only by the position of the positioning portion 41 but also by the amount of the first adhesive member 61. The support portion 42 may be bonded to the substrate 3 via the second bonding member 62 on at least a part of the surface facing the positive direction of the Z axis. The position of the substrate 3 in the Z-axis direction can be adjusted not only by the position of the surface of the support portion 42 but also by the amount of the second adhesive member 62. When viewed along the direction in which the positioning portion 41 extends, the dimension of the positioning portion 41 may be longer than the sum of the dimension of the separating member 5 and the dimension of the substrate 3. By doing so, room for adjustment of the position of the substrate 3 can be secured in the direction in which the positioning portion 41 extends.

When the material of the first adhesive member 61 and the material of the second adhesive member 62 are different, their mixing may inhibit each other's curing. The UV curable adhesive may include a photo initiator that initiates polymerization of the resin upon irradiation with UV light. The thermosetting adhesive may include a thermal polymerization initiator which initiates polymerization of the resin by heating. For example, when one of the photopolymerization initiator and the thermal polymerization initiator produces an acid and the other produces a base, the acid and the base are diffused with each other to be neutralized, thereby inhibiting the polymerization of the resin. It can be done.

The separating member 5 is located between the first bonding portion 31 and the second bonding portion 32 and separates the first bonding member 61 and the second bonding member 62. The first bonding member 61 is located between the first bonding portion 31, the positioning portion 41, and the separating member 5. In other words, the first bonding member 61 may be surrounded by the first bonding portion 31, the positioning portion 41, and the separating member 5. The second adhesive member 62 is located between the second adhesive portion 32, the support portion 42, and the separating member 5. In other words, the second bonding member 62 may be surrounded by the second bonding portion 32, the support portion 42, and the separating member 5. In this way, adhesive members made of different types of materials are less likely to be mixed with each other. As a result, even when the adhesive members made of different types of materials are used in combination, the curing of the adhesive members is less likely to be inhibited.

The separating member 5 may be positioned along the direction in which the positioning portion 41 extends. The separating member 5 may have a cylindrical shape surrounding the positioning portion 41. The separating member 5 may have a shape in which a part of the cylindrical shape is cut along the direction of the axis of the cylinder. In other words, the separating member 5 may have a shape in which a circular arc is extended in the direction in which the positioning portion 41 extends. The separating member 5 may cover at least a part of the positioning portion 41 along the direction in which the positioning portion 41 extends. By doing so, room for adjustment of the position of the substrate 3 can be secured in the direction in which the positioning portion 41 extends.

There may be no adhesive member between the separating member 5 and the substrate 3. The distance between the separating member 5 and the substrate 3 is relatively narrow, which can prevent the spreading of the bonding member.

The imaging device 1 can be assembled by executing the manufacturing method in accordance with the procedure of the flowchart shown in FIG.

The second adhesive member 62 is applied to the support portion 42 of the holding member 4 (step S1). The second adhesive member 62 may be applied so as to continuously surround the optical axis of the imaging optical system 2 as shown in FIG. 2, for example. When the second adhesive member 62 is applied in this manner, the second adhesive member 62 can continuously surround the periphery of the imaging device 30 on the substrate 3. By doing this, the imaging device 30 can be sealed to the outside of the imaging device 1 by the adhesive member having high bonding strength. The second adhesive members 62 may be discretely applied around the optical axis of the imaging optical system 2. The second adhesive member 62 may not be applied in the vicinity of the positioning unit 41, and may be applied at a position separated from the positioning unit 41 by a predetermined distance or more.

The isolation member 5 and the substrate 3 are disposed on the holding member 4 (step S2). The separating member 5 is disposed between the first bonding portion 31 and the second bonding portion 32 of the substrate 3. The separating member 5 is disposed so as to be located around the second bonding member 62 together with the second bonding portion 32 and the support portion 42. The separating member 5 may be disposed along the direction in which the positioning portion 41 extends. The substrate 3 may be arranged such that the positioning portion 41 is inserted into the notch 3a.

The position of the substrate 3 with respect to the holding member 4 is determined (step S3). The position of the substrate 3 may be determined based on the position of the imaging optical system 2. The position of the substrate 3 may be determined such that the position of the imaging device 30 is aligned with the optical axis of the imaging optical system 2. The rotation angle of the substrate 3 around the optical axis of the imaging optical system 2 may be determined in accordance with the rotation angle of the outer shape of the imaging device 1. The position of the substrate 3 may be determined by a robot arm or the like.

The substrate 3 and the holding member 4 are temporarily held (step S4). By temporary holding, these positional relationships can be maintained until the substrate 3 and the holding member 4 are bonded. The substrate 3 may be temporarily held on the holding member 4 by, for example, attaching a clamp or the like. The substrate 3 may be temporarily held on the holding member 4 while its position is determined by, for example, a robot arm.

The first adhesive member 61 is filled between the substrate 3 and the positioning portion 41 (step S5). By arranging the separating member 5 between the first bonding portion 31 and the second bonding portion 32, the first bonding member 61 is surrounded by the first bonding portion 31, the positioning portion 41 and the separating member 5. It is filled in the space.

The first adhesive member 61 is cured (step S6). When the first adhesive member 61 is an ultraviolet curing adhesive, ultraviolet light is irradiated to the imaging device 1 in which the substrate 3 and the holding member 4 are temporarily held. Thereby, the first bonding member 61 is cured. If the first adhesive member 61 is made of another material, a process of curing the material may be performed.

Temporary holding of the substrate 3 and the holding member 4 is released (step S7). By curing the first adhesive member 61, the positional relationship between the substrate 3 and the holding member 4 can be maintained even if the temporary holding is released.

The second adhesive member 62 is cured (step S8). When the second bonding member 62 is a thermosetting adhesive, heat is applied to the imaging device 1 including the substrate 3 and the holding member 4 bonded via the first bonding member 61. Thereby, the second adhesive member 62 is cured. After step S8, the procedure of the flowchart shown in FIG. 7 ends.

In the procedure of the flowchart of FIG. 7, before the determination of the positional relationship between the substrate 3 and the holding member 4 (step S3), the filling of the first adhesive member 61 (step S5) may be performed. Before temporary holding of the substrate 3 and the holding member 4 (step S4), filling of the first adhesive member 61 (step S5) may be performed. Even if the first adhesive member 61 is filled, the positional relationship between the substrate 3 and the holding member 4 can be adjusted as long as the first adhesive member 61 is not cured.

According to the imaging device 1 and the method of manufacturing the same according to the present embodiment, when different types of adhesives are used in combination for bonding the substrate 3 and the holding member 4, curing of the adhesive is less likely to be inhibited. As a result, the bonding strength between the substrate 3 and the holding member 4 can be improved.

As shown in FIG. 8, the imaging device 9 according to the comparative example does not include the separating member 5. The first adhesive member 61 and the second adhesive member 62 easily spread on the surface of the substrate 3 or the holding member 4. In the imaging device 9 according to the comparative example, the first adhesive member 61 and the second adhesive member 62 are not separated by the separating member 5 and are easily mixed with each other. The first adhesive member 61 and the second adhesive member 62 need to be applied to positions separated from each other on the holding member 4 based on the extent to which each can spread.

The range in which the bonding member can extend can be determined based on the characteristics such as the viscosity of the bonding member or the environmental conditions such as temperature or humidity. When various environmental conditions are assumed, the first adhesive member 61 and the second adhesive member 62 need to be applied farther apart.

When the viscosity of the adhesive is high, the adhesive does not spread easily on the substrate 3. In this case, the first adhesive member 61 and the second adhesive member 62 can be applied relatively close to each other. An adhesive having a high viscosity is less likely to be filled between the substrate 3 and the positioning portion 41. Also, an adhesive having a high viscosity can be discharged from the coating nozzle by applying a relatively high pressure. As a result, the adhesive application device can be large. In the application nozzle, when the diameter of the hole for discharging the adhesive is increased, the pressure for discharging the adhesive can be reduced even when the adhesive has a high viscosity. In this case, by increasing the size of the coating nozzle, the accuracy of the position where the adhesive is applied may be reduced.

That is, in the imaging device 9 according to the comparative example, disadvantages such as limitation of the area to which the adhesive member can be applied or increase in size of the adhesive application device may occur. On the other hand, according to the imaging device 1 according to the present embodiment, the positions where the different types of adhesive members are applied are compared by the separation member 5 isolating the first adhesive member 61 and the second adhesive member 62 from each other. It can be closer to each other than the example. In this way, the second bonding portion 32 can be applied only to a smaller area near the end of the substrate 3. As a result, the area in which components can be mounted on the substrate 3 can be increased. The need for upsizing of the adhesive application device can be reduced.

In the imaging device 1 according to the present embodiment, the distance between the positioning portion 41 and the substrate 3 and the distance between the positioning portion 41 and the separating member 5 are appropriately set based on the viscosity of the first adhesive member 61 to be filled. May be done. In other words, the viscosity of the first adhesive member 61 may be appropriately selected based on the distance between the positioning portion 41 and the substrate 3 and the distance between the positioning portion 41 and the separating member 5.

As shown in FIG. 9, the holding member 4 may have a groove 43 between the positioning portion 41 and the support portion 42. In other words, the holding member 4 may have the groove 43 around the positioning portion 41. The second adhesive member 62 may also be applied to the inside of the groove 43. The positioning portion 41 may extend from the bottom of the groove 43 in the positive direction of the Z axis. At least a portion of the separating member 5 may be located inside the groove 43. The first adhesive member 61 may also be applied to the inside of the groove 43. By the holding member 4 having the groove 43, the area to which the adhesive member is applied can be increased. As a result, the bonding strength between the substrate 3 and the holding member 4 can be increased.

In the imaging device 1 shown in FIG. 10, the isolation member 5 may have a portion projecting inward toward the positioning portion 41 in a part along the Z-axis direction. The portion of the isolation member 5 that protrudes inward is also referred to as a protrusion 51. In other words, the distance between the positioning portion 41 and the separating member 5 may be narrowed at the projecting portion 51. By providing the projecting portion 51 in the separating member 5, the first adhesive member 61 and the second adhesive member 62 are further less likely to be mixed with each other. The components shown in FIG. 10 other than the separating member 5 may be configured the same as or similar to the components shown in FIG.

As shown in FIG. 11, the separating member 5 may have a washer shape whose dimension in the Z-axis direction is short, or a shape in which a part of the washer shape is cut. In this case, the isolation member 5 may be configured such that the inner shape of the isolation member 5 in the shape of a washer corresponds to the outer shape of the positioning portion 41. By the inner shape of the separating member 5 corresponding to the outer shape of the positioning portion 41, the gap between the positioning portion 41 and the separating member 5 can be reduced. By doing so, even if the dimension of the separating member 5 in the Z-axis direction is short, the first adhesive member 61 and the second adhesive member 62 are less likely to be mixed with each other. By shortening the dimension of the separating member 5 in the Z-axis direction, the distance between the support portion 42 and the substrate 3 can be shortened. As a result, the amount of adhesive applied may be reduced. Also, relatively low viscosity adhesives may be used.

If the separating member 5 is in the form of a washer, it may be arranged to float on the already applied second adhesive member 62 in step S2 of the flowchart of FIG.

As shown in FIG. 12, the separating member 5 is disposed between the holding member 4 and the substrate 3. In this case, the isolation member 5 may be disposed on the upper side of the support portion 42 and may be disposed in a circular arc shape in contact with the periphery of the cylindrical positioning portion 41. That is, the inner periphery of the separating member 5 may be in contact with the outer periphery of the positioning portion 41.

The length in the Y-axis direction from the center of the positioning portion 41 of the separating member 5 may be longer than the distance between the positioning portion 41 and the first bonding portion 31 of the substrate 3. By doing this, the second bonding portion 32 of the substrate 3 and the separating member 5 can be in contact with each other. In other words, in the embodiment of FIG. 12, the first adhesive member 61 and the second adhesive member 62 are isolated by the isolation member 5 and the substrate 3.

As a result, even when a relatively low viscosity adhesive is selected as the first adhesive member 61 and the second adhesive member 62, the first adhesive member 61 and the second adhesive member 62 are sufficiently isolated. sell. The particles of the filler contained in the first adhesive member 61 and the second adhesive member 62 can be made the same as or similar to the above case.

In the present embodiment, a low hardness material such as a foam or a rubber member may be used as the material of the separating member 5. By doing this, the position adjustment of the substrate 3 is less likely to be hindered by the separating member 5. As a result, the range of adjustment can be increased. Since the separating member 5 is plastically deformable or elastically deformable in accordance with the shape of the outer periphery of the positioning portion 41, the excess first adhesive member 61 is less likely to flow between the separating member 5 and the positioning portion 41. As a result, the amount of use of the first adhesive member 61 can be reduced, and the risk of mixing with the second adhesive member 62 can be reduced by the first adhesive member 61 coming around unnecessary points.

In the imaging device 1 shown in FIG. 13, the isolation member 5 may have a shape including an arc having an L-shaped cross section. That is, the isolation member 5 may have a shape in which the periphery protrudes in the positive direction of the Z axis. The separating member 5 may be fixed to the upper surface of the substrate 3 around the positioning portion 41. That is, the separating member 5 may be located on the upper surface of the substrate 3 around the positioning portion 41. In the present embodiment, the first adhesive member 61 may be applied to the top of the separating member 5. By applying the first adhesive member 61 to the upper surface of the substrate 3, the first adhesive member 61 and the second adhesive member 62 are applied at mutually separated positions. As a result, the first adhesive member 61 and the second adhesive member 62 become even less likely to be mixed. In the present embodiment, when the first adhesive member 61 includes a photopolymerization initiator or the like by applying the first adhesive member 61 to the upper portion of the separating member 5, in step S6 shown in FIG. The first adhesive member 61 can be cured in a shorter time. By doing this, it is possible to shorten the tact time when performing the procedures of step S6 and step S7 shown in FIG.

As shown in FIG. 14, the separating member 5 may have a shape that extends in the negative direction of the Z axis along the first bonding portion 31.

As shown in FIG. 15, the separating member 5 shown in FIG. 14 may have a portion projecting inward toward the positioning portion 41 in a portion along the Z-axis direction. The portion of the isolation member 5 that protrudes inward is also referred to as a protrusion 51. In other words, the distance between the positioning portion 41 and the separating member 5 may be narrowed at the projecting portion 51. By providing the projecting portion 51 in the separating member 5, the first adhesive member 61 and the second adhesive member 62 are further less likely to be mixed with each other. As shown in FIG. 15, the separating member 5 has a shape in which the circumference of the arc protrudes in the positive direction of the Z axis, and a shape extending in the negative direction of the Z axis along the first bonding portion 31. You may have it together.

As shown in FIG. 16, the separating member 5 may have a sawtooth shape in a portion facing the positioning portion 41 as compared with the shape shown in FIG. 15. The sawtoothed portion of the separating member 5 facing the positioning portion 41 can increase the area to be bonded by the first bonding member 61. As a result, the bonding strength between the substrate 3 and the holding member 4 can be increased.

As shown in FIG. 17, the separating member 5 does not have to extend in the positive direction of the Z axis at a portion located on the upper surface of the substrate 3. In other words, the part of the separating member 5 that covers a part of the upper surface of the substrate 3 may have a shape that does not extend in the positive direction of the Z axis.

As shown in FIG. 18, the isolation member 5 has a portion projecting inward toward the positioning portion 41 in a portion along the Z-axis direction as compared with the shape shown in FIG. 17. You may The portion of the isolation member 5 that protrudes inward is also referred to as a protrusion 51. In other words, the distance between the positioning portion 41 and the separating member 5 may be narrowed at the projecting portion 51.

As shown in FIG. 19, the isolation member 5 may have a sawtooth shape in the portion facing the positioning portion 41 as compared to the shape shown in FIG. 17. The sawtoothed portion of the separating member 5 facing the positioning portion 41 can increase the area to be bonded by the first bonding member 61. As a result, the bonding strength between the substrate 3 and the holding member 4 can be increased.

The components other than the isolation member 5 shown in FIGS. 14, 15, 16, 17, 18 and 19 may be configured the same as or similar to the components shown in FIG.

In the imaging device 1 shown in FIG. 20, a projecting portion 44 may be provided between the positioning portion 41 and the support portion 42. In other words, the holding member 4 may have the protrusion 44 around the positioning portion 41. The protrusion 44 may extend from the support portion 42 in the positive direction of the Z-axis until it approaches or contacts the lower surface of the substrate 3. The separating member 5 may be fixed on the lower surface side of the substrate 3 so as to face the second bonding portion 32, and may extend in the negative direction of the Z axis so as not to contact the support portion 42. That is, the separating member 5 may be positioned facing the second bonding portion 32. The first adhesive member 61 and the second adhesive member 62 are further less likely to be mixed by the protrusion 44 and the separating member 5.

In the imaging device 1 shown in FIG. 21, the isolation member 5 may have a shape including an arc having an L-shaped cross section as compared to the shape shown in FIG. That is, the isolation member 5 may have a shape in which the periphery protrudes in the positive direction of the Z axis. The separating member 5 may be fixed to the upper surface of the substrate 3 around the positioning portion 41. That is, the separating member 5 may be located on the upper surface of the substrate 3 around the positioning portion 41. In the present embodiment, the first adhesive member 61 may be applied to the top of the separating member 5. By applying the first adhesive member 61 to the upper surface of the substrate 3, the first adhesive member 61 and the second adhesive member 62 are applied at mutually separated positions. As a result, the first adhesive member 61 and the second adhesive member 62 become even less likely to be mixed. In the present embodiment, when the first adhesive member 61 includes a photopolymerization initiator or the like by applying the first adhesive member 61 to the upper portion of the separating member 5, the first adhesive member 61 can be shortened in a shorter time. It can cure. By doing this, it is possible to shorten the tact time when executing the procedures of step S6 and step S7 shown in FIG.

As shown in FIG. 22, the separating member 5 may have a shape extending in the negative direction of the Z axis along the first bonding portion 31 as compared to the shape shown in FIG. .

As shown in FIG. 23, the separating member 5 has a portion projecting inward toward the positioning portion 41 in a portion along the Z-axis direction as compared with the shape shown in FIG. You may The portion of the isolation member 5 that protrudes inward is also referred to as a protrusion 51. In other words, the distance between the positioning portion 41 and the separating member 5 may be narrowed at the projecting portion 51. By providing the projecting portion 51 in the separating member 5, the first adhesive member 61 and the second adhesive member 62 become even more difficult to cross each other.

As shown in FIG. 24, the separating member 5 may be serrated in a portion facing the positioning portion 41, as compared with the shapes shown in FIGS. The sawtoothed portion of the separating member 5 facing the positioning portion 41 can increase the area to be bonded by the first bonding member 61. As a result, the bonding strength between the substrate 3 and the holding member 4 can be increased.

As shown in FIG. 25, the separating member 5 does not have to extend in the positive direction of the Z axis at a portion located on the upper surface of the substrate 3. In other words, the part of the separating member 5 that covers a part of the upper surface of the substrate 3 may have a shape that does not extend in the positive direction of the Z axis.

As shown in FIG. 26, the isolation member 5 has a portion projecting inward toward the positioning portion 41 in a portion along the Z-axis direction as compared with the shape shown in FIG. You may The portion of the isolation member 5 that protrudes inward is also referred to as a protrusion 51. In other words, the distance between the positioning portion 41 and the separating member 5 may be narrowed at the projecting portion 51.

As shown in FIG. 27, the isolation member 5 may have a sawtooth shape in the portion facing the positioning portion 41 as compared to the shapes shown in FIGS. 25 and 26. The sawtoothed portion of the separating member 5 facing the positioning portion 41 can increase the area to be bonded by the first bonding member 61. As a result, the bonding strength between the substrate 3 and the holding member 4 can be increased.

Each component other than the separating member 5 shown in FIGS. 21, 22, 23, 24, 25, 26, and 27 may be configured the same as or similar to each component shown in FIG. .

The imaging device 1 according to the present disclosure may be mounted on a mobile body. The "mobile" in the present disclosure includes vehicles, ships, and aircraft. The "vehicle" in the present disclosure includes, but is not limited to, a car and an industrial vehicle, and may include a railway vehicle and a living vehicle, and a fixed wing aircraft traveling on a runway. Automobiles include but are not limited to passenger cars, trucks, buses, motorcycles, trolley buses, etc., and may include other vehicles traveling on the road. Industrial vehicles include industrial vehicles for agriculture and construction. Industrial vehicles include, but are not limited to, forklifts and golf carts. Industrial vehicles for agriculture include, but are not limited to, tractors, cultivators, transplanters, binders, combine harvesters, and lawn mowers. Industrial vehicles for construction include, but are not limited to, bulldozers, scrapers, excavators, cranes, dump trucks, and road rollers. Vehicles include those that travel by human power. The classification of vehicles is not limited to the above. For example, a car may include an industrial vehicle capable of traveling on a road, and a plurality of classifications may include the same vehicle. The vessels in the present disclosure include marine jets, boats, and tankers. The aircraft in the present disclosure includes fixed wing aircraft and rotary wing aircraft.

The figures describing the embodiments according to the present disclosure are schematic. The dimensional ratios and the like in the drawings do not necessarily match the actual ones.

Although the embodiments according to the present disclosure have been described based on the drawings and examples, it should be noted that those skilled in the art can easily make various changes or modifications based on the present disclosure. Therefore, it should be noted that these variations or modifications are included in the scope of the present disclosure. For example, functions or the like included in each component or each step can be rearranged so as not to be logically contradictory, and a plurality of components or steps can be combined or divided into one. It is. Although the embodiment according to the present disclosure has been described focusing on the apparatus, the embodiment according to the present disclosure can also be realized as a method including steps performed by each component of the apparatus. Embodiments according to the present disclosure can also be realized as a method, a program, or a storage medium storing a program, which is executed by a processor included in the device. It should be understood that these are also included in the scope of the present disclosure.

In the present disclosure, the descriptions such as “first” and “second” are identifiers for distinguishing the configurations. The configurations distinguished in the description of “first”, “second” and the like in the present disclosure can exchange the numbers in the configurations. For example, the first lens can exchange the second lens with the identifiers "first" and "second". The exchange of identifiers takes place simultaneously. The configuration is also distinguished after the exchange of identifiers. Identifiers may be deleted. The configuration from which the identifier is deleted is distinguished by a code. The interpretation of the order of the configuration and the basis for the existence of the small-numbered identifiers should not be used based on only the descriptions of the "first" and "second" identifiers etc. in the present disclosure.

In the present disclosure, the X-axis, the Y-axis, and the Z-axis are provided for convenience of description and may be interchanged with each other. The configuration according to the present disclosure has been described using an orthogonal coordinate system configured by the X axis, the Y axis, and the Z axis. The positional relationship of each configuration according to the present disclosure is not limited to the orthogonal relationship.

Reference Signs List 1 and 9 imaging device 2 imaging optical system 21 first lens 22 second lens 3 substrate 3a notch 30 imaging element 31 first bonding portion 32 second bonding portion 4 holding member 41 positioning portion 42 support portion 43 groove portion 5 isolation member 51 protrusion Part 61 first adhesive member 62 second adhesive member

Claims

An imaging optical system including at least one optical element;
An imaging device for capturing an object image formed by the imaging optical system;
A holding member holding the imaging optical system and having a positioning portion and a support portion;
A substrate having a first adhesive unit on which the imaging element is mounted and adhered to the positioning unit by a first adhesive member, and a second adhesive unit adhered to the support unit by a second adhesive member;
An isolation member positioned between the first bonding portion and the second bonding portion;
The first adhesive member is positioned between the first adhesive portion, the positioning portion, and the separating member, and cures in a shorter time than the second adhesive member.
The second adhesive member is located between the second adhesive part, the support part, and the separating member, and has higher bonding strength than the first adhesive member.
Imaging device.
An imaging optical system including at least one optical element;
An imaging device for capturing an object image formed by the imaging optical system;
A holding member holding the imaging optical system and having a positioning portion and a support portion;
A substrate having a second adhesive unit on which the imaging element is mounted and adhered to the support unit by a second adhesive member;
An isolation member located on the substrate and adhered to the positioning portion with a first adhesive member different from the second adhesive member;
The first adhesive member is located between the positioning portion and the separating member, and cures in a shorter time than the second adhesive member.
The second adhesive member is located between the second adhesive part, the support part, and the separating member, and has higher bonding strength than the first adhesive member.
Imaging device.
The imaging device according to claim 1, wherein the isolation member is plastically deformable or elastically deformable.
The imaging device according to any one of claims 1 to 3, wherein an inner periphery of the isolation member is in contact with an outer periphery of the positioning unit.
The imaging device according to any one of claims 1 to 4, wherein the second adhesive member continuously surrounds the periphery of the imaging device on the substrate.
The positioning unit extends in a direction from the imaging optical system toward the imaging device.
The imaging device according to any one of claims 1 to 5, wherein the separation member covers at least a part of the positioning portion along a direction in which the positioning portion extends.
The imaging device according to claim 6, wherein in the direction in which the positioning portion extends, the dimension of the positioning portion is longer than the sum of the dimension of the separating member and the dimension of the substrate.
The imaging device according to any one of claims 1 to 7, wherein the isolation member has a washer shape.
The holding member has a groove around the positioning portion,
The imaging device according to any one of claims 1 to 8, wherein at least a part of the second adhesive member is located in the groove.
The imaging device according to any one of claims 1 to 9, wherein the first adhesive member is an ultraviolet curable adhesive, and the second adhesive member is a thermosetting adhesive.
An imaging optical system including at least one optical element;
An imaging device for capturing an object image formed by the imaging optical system;
A holding member holding the imaging optical system and having a positioning portion and a support portion;
A substrate having a first adhesive unit on which the imaging element is mounted and adhered to the positioning unit by a first adhesive member, and a second adhesive unit adhered to the support unit by a second adhesive member;
Equipped with an isolation member,
The method of manufacturing an imaging device, wherein the first adhesive member is cured in a shorter time than the second adhesive member, and the second adhesive member has a higher bonding strength than the first adhesive member.
Applying a second adhesive member to the support portion;
Placing the substrate such that the first adhesive portion corresponds to the positioning portion and the second adhesive portion corresponds to the support portion;
Disposing an isolation member positioned between the first adhesive portion and the second adhesive portion and positioned around the second adhesive member together with the second adhesive portion and the support portion;
Applying the first adhesive member at a position between the first adhesive portion, the positioning portion and the separating member;
Determining the positional relationship between the holding member and the substrate;
Curing the first adhesive member;
Curing the second adhesive member.
An imaging optical system including at least one optical element;
An imaging device for capturing an object image formed by the imaging optical system;
A holding member holding the imaging optical system and having a positioning portion and a support portion;
A substrate having a first adhesive unit on which the imaging element is mounted and adhered to the positioning unit by a first adhesive member, and a second adhesive unit adhered to the support unit by a second adhesive member;
An isolation member positioned between the first bonding portion and the second bonding portion;
The first adhesive member is positioned between the first adhesive portion, the positioning portion, and the separating member, and cures in a shorter time than the second adhesive member.
The second adhesive member is located between the second adhesive part, the support part, and the separating member, and has higher bonding strength than the first adhesive member.
Mobile body equipped with an imaging device.