JP2020155736A - Transport device - Google Patents

Abstract

To provide a technology for suppressing an impact and smoothly attaching and detaching a probe card.SOLUTION: A mounting unit has a mounting surface on which a probe card is mounted. A support unit is provided with a first elastic member capable of elastically supporting the weight of the mounting unit and a second elastic member capable of elastically supporting the total weight of the mounting unit and the probe card. The mounting unit is supported via the first elastic member and the second elastic member.SELECTED DRAWING: Figure 5B

Description

The present disclosure relates to a transport device.

Patent Document 1 discloses a technique of transporting a probe card placed on a transport tray using a drive mechanism of a wafer chuck and mounting the probe card on a card clamp mechanism of an inspection device.

Japanese Unexamined Patent Publication No. 2013-191741

The present disclosure provides a technique for smoothly attaching and detaching a probe card while suppressing an impact.

The transport device according to one aspect of the present disclosure has a mounting portion and a supporting portion. The mounting portion has a mounting surface on which the probe card is mounted. The support portion is provided with a first elastic member that can elastically support the weight of the mounting portion and a second elastic member that can elastically support the total weight of the mounting portion and the probe card. The mounting portion is supported via the elastic member 1 and the elastic member 2.

According to the present disclosure, the probe card can be smoothly attached and detached while suppressing an impact.

FIG. 1 is a vertical sectional view showing an example of a schematic configuration of an inspection device according to an embodiment. FIG. 2 is a diagram showing an example of a configuration near an insert ring of the inspection device according to the embodiment. FIG. 3A is a perspective view showing an example of the configuration of the transport device according to the embodiment. FIG. 3B is a perspective view showing an example of a transfer device in a state where the probe card according to the embodiment is placed. FIG. 4 is a cross-sectional view schematically showing an example of the configuration of the first spring portion and the second spring portion according to the embodiment. FIG. 5A is a diagram schematically showing an example of a state of the transport device when the probe card is attached / detached. FIG. 5B is a diagram schematically showing an example of a state of the transport device when the probe card is attached / detached. FIG. 5C is a diagram schematically showing an example of a state of the transport device when the probe card is attached / detached. FIG. 5D is a diagram schematically showing an example of a state of the transport device when the probe card is attached / detached. FIG. 6A is a diagram showing an example of a specific configuration of the transport device according to the embodiment. FIG. 6B is a diagram showing an example of a specific configuration of the transport device according to the embodiment. FIG. 6C is a diagram showing an example of a specific configuration of the transport device according to the embodiment.

Hereinafter, embodiments of the transport device disclosed in the present application will be described in detail with reference to the drawings. It should be noted that the present embodiment does not limit the disclosure device.

In the semiconductor device manufacturing process, an inspection device such as a prober is used for electrical inspection of the semiconductor device formed on the semiconductor wafer. The inspection device drives a wafer chuck on which the semiconductor wafer to be inspected is arranged, and brings the electrode pad on the semiconductor wafer into contact with the probe of the probe card to perform the inspection.

Some inspection devices can replace the probe card by using the drive mechanism of the wafer chuck. Probe cards are expensive and delicate. Therefore, it is preferable that the probe card can be attached and detached smoothly while suppressing the impact.

[Inspection equipment configuration]
First, the configuration of an inspection device that inspects a semiconductor device will be described. FIG. 1 is a vertical sectional view showing an example of a schematic configuration of an inspection device according to an embodiment. The inspection device 1 according to the present embodiment inspects the electrical characteristics of a device (not shown) such as a semiconductor device formed on a substrate (hereinafter, also simply referred to as “wafer”) W such as a semiconductor wafer or a resin substrate. It is a device that performs. The inspection device 1 has a housing 2. A wafer chuck 10 for mounting the wafer W to be inspected is arranged in the housing 2. The wafer chuck 10 has a drive mechanism 11 and is movable in the x, y, z, and θ directions.

The housing 2 located above the wafer chuck 10 is provided with a circular opening, and the insert ring 12 is arranged along the peripheral edge of the circular opening. The probe card 20 can be attached to and detached from the insert ring 12. The detailed configuration around the insert ring 12 will be described later.

The probe card 20 is composed of a wiring board and a plurality of probes (not shown) electrically connected to the wiring board. The probe of the probe card 20 is arranged corresponding to the electrode of the semiconductor device formed on the wafer W.

Above the probe card 20, as shown by the dotted line in the middle of FIG. 1, a test head connected to a tester for sending an inspection signal and detecting a signal from the semiconductor device to inspect the state of the semiconductor device. 40 is arranged.

When the inspection device 1 is used to electrically inspect the semiconductor device formed on the wafer W, the wafer W on which the semiconductor device to be inspected is formed is placed on the wafer chuck 10. The inspection device 1 raises the wafer chuck 10 on which the wafer W is placed to a position corresponding to the probe card 20 by the drive mechanism 11. Then, the inspection device 1 electrically conducts the semiconductor device and the probe card 20 by bringing each electrode of the semiconductor device formed on the wafer W into contact with the corresponding probe of the probe card 20. In the inspection device 1, the tester sends a signal for inspection to the semiconductor device via the test head 40 and the probe card 20, and detects the signal from the semiconductor device to inspect the state of the semiconductor device.

On one side wall of the housing 2, or on the side wall on the front side (right side in FIG. 1) in the present embodiment, there is a carry-in / carry-out port 2a for carrying in / out the probe card 20 from the outside of the housing 2 into the housing 2. It is arranged. Further, an arm 16 constituting a probe card exchange mechanism is arranged below the carry-in / carry-out outlet 2a. As shown by the arrows in the figure, the arm 16 is rotatable in the vertical direction around a support shaft arranged on the wall surface portion of the housing 2. FIG. 1 shows a state in which the arm 16 is rotated (jumped up) upward and fixed.

On the arm 16, as shown by an arrow in FIG. 1, a slide mechanism 17 that is movable in the horizontal direction is arranged. The slide mechanism 17 has a bifurcated fork shape on the tip side (left side in FIG. 1), and the transport device 30 can be supported on the fork-shaped portion on the tip side. The probe card 20 can be mounted on the upper surface of the transport device 30, and when the probe card 20 is transported and carried out, the probe card 20 is mounted and transported on the transport device 30.

The slide mechanism 17 carries the transport device 30 on which the probe card 20 is placed from the carry-in / carry-out outlet 2a to the delivery position in the housing 2. Further, the transfer device 30 is raised to the probe card mounting position near the lower surface of the insert ring 12 by the drive mechanism of the arm 16, and the probe card 20 on the transfer device 30 is fixed to the insert ring 12.

FIG. 2 is a diagram showing an example of a configuration near an insert ring of the inspection device according to the embodiment. A pogo block mounting hole 42 having a diameter slightly smaller than that of the probe card 20 is formed in the center of the insert ring 12. A substantially cylindrical pogo block 46 that holds a large number of pogo pins 44 is detachably inserted into the pogo block mounting hole 42.

A large number of probes are attached to the probe card 20 in a predetermined arrangement pattern. The tip of each probe projects from the lower surface of the probe card 20 and is arranged so as to face each corresponding electrode pad provided on the semiconductor device formed on the wafer W on the wafer chuck 10.

The test head 40 is provided with a motherboard 41 on the lower surface facing the insert ring 12. The motherboard 41 is provided with electrodes corresponding to each pogo pin 44. A gap 50 is formed between the insert ring 12 and the motherboard 41 via an annular spacer 48. The gap 50 is divided in the radial direction by an annular seal member 52 arranged around the pogo block mounting area. Further, even between the insert ring 12 and the probe card 20, the gap 56 between the two is divided in the radial direction by the annular seal member 54 arranged around the pogo block mounting area. As a result, a sealable suction space 58 surrounded by the motherboard 41, the probe card 20, and the sealing members 52 and 54 is formed.

The suction space 58 is connected to the probe card holding vacuum mechanism 64 via the gas flow path 60 and the external pipe 62 formed in the peripheral portion of the insert ring 12. The vacuum mechanism 64 has a vacuum source such as a vacuum pump, decompresses the suction space 58 to a predetermined negative pressure, and constantly maintains the depressurized state. As a result, the tip (lower end) of each pogo pin 44 elastically pressurizes and contacts each corresponding electrode on the upper surface of the probe card 20 by the vacuum suction force acting on the probe card 20 and the insert ring 12. Also, each pogo pin 44 has its top (upper end) pressed against each corresponding electrode on the motherboard 41. Further, the probe card 20 located at the probe card mounting position receives an upward force due to the differential pressure between the pressure (negative pressure) of the suction space 58 and the ambient pressure, and is attracted to and fixed to the insert ring 12. The inspection device 1 can bring the test head 40 and the probe card 20 into pressure contact with the insert ring 12 and the pogo block 46 at an appropriate pressure by adjusting the pressure to be reduced by the vacuum mechanism 64.

[Conveyor configuration]
Next, the configuration of the transport device 30 used for transporting the probe card 20 will be described. FIG. 3A is a perspective view showing an example of the configuration of the transport device according to the embodiment.

The transport device 30 has a first support portion 71, a second support portion 72, and a mounting portion 73.

The mounting portion 73 has a flat annular shape larger than the diameter of the probe card 20, and a circular opening smaller than the diameter of the probe card 20 is formed in the center. The upper surface of the mounting portion 73 shown in FIG. 3A is a mounting surface on which the probe card 20 is mounted. FIG. 3B is a perspective view showing an example of a transfer device in a state where the probe card according to the embodiment is placed. The mounting portion 73 supports the outer peripheral portion of the mounted probe card 20. The mounting portion 73 and the probe card 20 may be provided with positioning mechanisms such as positioning pins and holes for positioning the probe card 20 at a predetermined position on the mounting portion 73.

The tip end side of the first support portion 71 is bifurcated fork-shaped, and the second support portion 72 is provided at the fork-shaped portion on the tip end side. The second support portion 72 is provided inside the fork-shaped bifurcation of the first support portion 71, and is fixed to the first support portion 71 with a screw (not shown) or the like. The second support portion 72 supports the mounting portion 73 from two opposite directions. In the present embodiment, in order to use the parts for general purposes, the second support portion 72 is fixed to the fork-shaped first support portion 71 that is generally used, but the first support portion 71 and the first support portion 72 2 A support portion having a shape in which the support portion 72 is integrated may be used.

The mounting portion 73 is provided with a support pin 75 for supporting the probe card 20 and a sensor 76 capable of detecting the presence or absence of the probe card 20 on the mounting surface portion. A plurality of support pins 75 and sensors 76 are arranged along the circumferential direction on the mounting surface portion so that the probe card 20 can be stably supported. In the present embodiment, one support pin 75 and one sensor 76 are arranged along the circumferential direction on one side of the two directions supported by the second support portion 72 of the mounting portion 73 in two directions. On the other side of the above, three support pins 75 and one sensor 76 are arranged along the circumferential direction. The mounting portion 73 supports the mounted probe card 20 by the support pin 75 and the sensor 76. The mounting portion 73 may support the probe card 20 on the upper surface without providing the support pin 75 and the sensor 76.

The second support portion 72 includes a first elastic member that can elastically support the weight of the mounting portion 73, and a second elastic member that can elastically support the total weight of the mounting portion 73 and the probe card 20. Is provided. In the present embodiment, as the first elastic member, a total of four first spring portions 80 are provided on the second support portion 72 at intervals of two each. Further, as the second elastic member, a total of four second spring portions 81 are provided on the second support portion 72 at intervals of two each.

FIG. 4 is a cross-sectional view schematically showing an example of the configuration of the first spring portion and the second spring portion according to the embodiment. A spring 83a is provided in the first spring portion 80. A spring 83b is provided in the second spring portion 81. A recess 84a is formed at the position of the spring 83a, and a recess 84b is formed at the position of the spring 83b in the second support portion 72. Further, in the mounting portion 73, a through hole 85a is formed at the position of the spring 83a, and a through hole 85b is formed at the position of the spring 83b.

The through hole 85a is formed with a diameter smaller than the diameter of the spring 83a. A pin 86a is arranged along the axis of the spring 83a. The pin 86a penetrates the through hole 85a, and a flat head portion 87a having a diameter larger than the diameter of the through hole 85a is formed at the upper portion. The upper portion of the spring 83a comes into contact with the periphery of the lower surface of the through hole 85a, and the mounting portion 73 is urged from below.

The diameter of the through hole 85b is changed, the diameter on the lower side is larger than the diameter on the upper side, and a step is formed in the middle. A pin 86b is arranged along the axis of the spring 83b. The pin 86b has a flat head portion 87b having a diameter smaller than the diameter above the through hole 85b formed at the upper portion. Further, the pin 86b is provided with a ring member 88. The ring member 88 is a stepped ring, has an upper diameter slightly smaller than the upper diameter of the through hole 85b, a lower diameter larger than the upper diameter of the through hole 85b, and a lower diameter of the through hole 85b. It is formed slightly smaller than. The ring member 88 is movable along the pin 86b, but its movement to the upper part is restricted by contacting the head portion 87b. The upper portion of the spring 83b is in contact with the ring member 88, and the ring member 88 is urged from below. The ring member 88 limits the length at which the spring 83b extends by the thickness of the ring member 88. The ring member 88 does not urge the mounting portion 73 when it is not engaged with the step of the through hole 85b, and the mounting portion 73 is moved from below by the spring 83b when it is engaged with the step of the through hole 85b. Encourage.

In the present embodiment, the weight of the mounting portion 73 can be elastically supported by the four first spring portions 80, and the total weight of the mounting portion 73 and the probe card 20 is supported by the four second spring portions 81. Can be elastically supported. For example, the spring 83a is a spring having a spring constant that can support the weight of the mounting portion 73 within a contraction range up to a height at which the four springs 83a engage the ring member 88 and the step of the through hole 85b. There is. The spring 83b is a spring with a spring constant that can support the total weight of the mounting portion 73 and the probe card 20 in cooperation with the spring 83a within the contraction range until the four springs 83b contract most. In the present embodiment, the spring constants of the spring 83a and the spring 83b are different, and the spring constant of the spring 83a is larger than the spring constant of the spring 83b.

The height of the second support portion 72 at which the spring 83a starts elastic contraction due to the load from the mounting portion 73 is set to be higher than the height at which the spring 83b starts elastic contraction. In the present embodiment, the height at which the spring 83a urges and balances the mounting portion 73 from below is set to a position higher than the height at which the step of the ring member 88 and the through hole 85b engages. As a result, the height at which the spring 83a starts elastic contraction due to the load from the mounting portion 73 becomes a position higher than the height at which the spring 83b starts elastic contraction.

When the second support portion 72 supports only the mounting portion 73, the second supporting portion 72 supports the mounting portion 73 by the spring 83a. In the example of FIG. 4, the spring 83a urges the mounting portion 73 from below. However, the ring member 88 is not engaged with the step of the through hole 85b, and the spring 83b does not urge the mounting portion 73. Therefore, the mounting portion 73 is supported by the spring 83a.

Next, the state of the transport device 30 will be described along with the flow when the probe card 20 is attached and detached. The transport device 30 receives the probe card 20 on the mounting surface at a designated position, and transports the mounted probe card 20 to the probe card mounting position of the inspection device 1. Further, the transport device 30 receives the probe card 20 from the probe card mounting position of the inspection device 1 on the mounting surface, and transports the probe card 20 to the designated position.

5A to 5D are diagrams schematically showing an example of the state of the transport device when the probe card is attached and detached. FIG. 5A shows the state of the transfer device 30 when the probe card 20 is not mounted. When the probe card 20 is not mounted, the mounting portion 73 is supported by the spring 83a.

When the probe card 20 is attached, the inspection device 1 is in a state where the arm 16 is rotated upward and fixed by the probe card exchange mechanism. The transport device 30 is placed on the arm 16. A probe card 20 to be mounted on the inspection device 1 is placed on the transfer device 30.

FIG. 5B shows the state of the transport device 30 when the probe card 20 is placed. By placing the probe card 20, the spring 83a contracts and balances at a height at which the ring member 88 and the step of the through hole 85b engage with each other. In FIG. 5B, the mounting portion 73 is supported by the springs 83a and 83b.

The transfer device 30 on which the probe card 20 is mounted is conveyed to the probe card mounting position near the lower surface of the insert ring 12 by driving the slide mechanism 17 and the arm 16.

FIG. 5C shows the state of the transport device 30 at the probe card mounting position. At the probe card mounting position, the seal member 54 provided on the insert ring 12 comes into contact with the probe card 20, and the seal member 54 presses the probe card 20. As a result, the load from the probe card 20 increases, the springs 83a and 83b contract more, and the springs 83a and 83b urge the mounting portion 73. As a result, the probe card 20 can be strongly and evenly pressed against the seal member 54.

The inspection device 1 performs suction by the vacuum mechanism 64, and reduces the suction space 58 to a predetermined negative pressure. As a result, the probe card 20 receives an upward force due to the differential pressure between the pressure in the suction space 58 and the ambient pressure, and is attracted to and fixed to the insert ring 12.

Here, the transfer device 30 according to the present embodiment is provided with a plurality of first spring portions 80 and second spring portions 81 on the second support portion 72 to support the probe card 20. As a result, the probe card 20 can be pressed against the seal member 54 without a gap even when the probe card 20 is tilted with respect to the insert ring 12. As a result, the transfer device 30 according to the present embodiment can stably attract the probe card 20 to the insert ring 12.

FIG. 5D shows the state of the transport device 30 when the probe card 20 is sucked. Since the mounting portion 73 is urged by the spring 83a and the spring 83b, the mounting portion 73 rises as the probe card 20 is lifted by suction. Then, even after the mounting portion 73 rises to a height at which the ring member 88 engages with the step of the through hole 85b, the mounting portion 73 is urged by the spring 83a. As a result, even if the probe card 20 is dropped during suction, the mounting portion 73 and the spring 83a can suppress the impact of the drop and smoothly receive the probe card 20.

When removing the probe card 20 from the insert ring 12, the procedure reverse to the procedure for mounting the probe card 20 shown in FIGS. 5A to 5D on the insert ring 12 is performed. For example, as shown in FIG. 5D, the inspection device 1 brings the mounting portion 73 of the transfer device 30 into contact with the probe card 20. Then, the inspection device 1 ends the suction by the vacuum mechanism 64, and raises the pressure of the suction space 58 to the same level as the ambient pressure. As a result, the attraction force of the probe card 20 to the insert ring 12 is reduced, and the probe card 20 is lowered as shown in FIG. 5C. Even in this case, since the mounting portion 73 is urged by the spring 83a, the probe card 20 can be smoothly received by suppressing the impact of dropping.

As described above, the transfer device 30 according to the present embodiment can smoothly attach / detach the probe card 20 while suppressing the impact.

By the way, the inspection device 1 may perform a plurality of types of inspections by one unit by individually mounting a plurality of types of probe cards 20 having different thicknesses. The plurality of types of probe cards 20 have the same shape except for the thickness, and the weight increases according to the thickness. Therefore, the transfer device 30 can be used for mounting a plurality of types of probe cards 20 by appropriately determining the spring constants of the springs 83a and 83b.

An example will be described using two types of probe cards 20a and 20b. It is assumed that the two types of probe cards 20a and 20b have the following thickness and weight.

・ Probe card 20a
Thickness: 4.0 mm
Weight: 1.3 kg
・ Probe card 20b
Thickness: 9.5 mm
Weight: 3.5 kg

The transport device 30 has a configuration as shown in FIG. 4, and has four springs 83a and 83b each to support the mounting portion 73 and the probe card 20a or the probe card 20b. FIG. 6A is a diagram showing a specific example of the transport device according to the embodiment. For example, the mounting portion 73 has a weight of 0.77 kg. In this case, as shown in FIG. 6A, the spring 83a has a natural length of 30 mm and a spring constant of 0.05 kg / mm. The spring 83b has a natural length of 30 mm and a spring constant of 0.03 kg / mm. Further, the spring 83b is restricted by the ring member 88 so that it can extend only up to 19.5 mm. In this case, as shown in FIG. 6A, the length of the spring 83a contracts and balances to 25.9 mm, and the mounting portion 73 is supported by the spring 83a. The steps of the ring member 88 and the through hole 85b are configured to engage when the length of the spring 83a is 24.5 mm. In FIG. 6A, the ring member 88 and the step of the through hole 85b are not engaged. FIG. 6B is a diagram showing a specific example of the transport device according to the embodiment. FIG. 6B shows a case where the probe card 20a having a weight of 1.3 kg is mounted on the mounting portion 73. In FIG. 6B, the length of the spring 83a contracts to 24.5 mm, the ring member 88 and the step of the through hole 85b are engaged, and the mounting portion 73 is supported by the springs 83a and 83b. FIG. 6C is a diagram showing a specific example of the transport device according to the embodiment. FIG. 6C shows a case where the probe card 20b having a weight of 3.5 kg is mounted on the mounting portion 73. In FIG. 6C, the length of the spring 83a is contracted to 18.5 mm, and the mounting portion 73 is supported by the springs 83a and 83b. The spring 83a is 24.5 mm when supporting the probe card 20a, 18.5 mm when supporting the probe card 20b, and the difference is 6 mm. The difference in thickness between the probe card 20a and the probe card 20b is 5.5 mm. Therefore, the transfer device 30 shown in FIGS. 6A to 6C can adjust the upper surfaces of the probe card 20a and the probe card 20b to the same height, and can be used for mounting both the probe card 20a and the probe card 20b.

As described above, the transport device 30 according to the present embodiment has a mounting portion 73 and a support portion (first support portion 71, second support portion 72). The mounting portion 73 has a mounting surface on which the probe card 20 is mounted. The support portion has a first elastic member (spring 83a) that can elastically support the weight of the mounting portion 73, and a second elastic member that can elastically support the total weight of the mounting portion 73 and the probe card 20. An elastic member (spring 83b) is provided, and the mounting portion 73 is supported via the first elastic member and the second elastic member. As a result, the transfer device 30 can smoothly attach / detach the probe card 20 while suppressing the impact.

Further, the support portion is set at a position where the height at which the first elastic member starts elastic contraction due to the load from the mounting portion 73 is higher than the height at which the second elastic member starts elastic contraction. When the support portion supports only the mounting portion 73, the mounting portion 73 is supported by the first elastic member, and when the probe card 20 is mounted on the mounting portion 73, the first elastic member and the first elastic member The mounting portion 73 is supported by the elastic member of 2. As a result, when the probe card 20 is mounted, the transport device 30 can support the mounting portion 73 by the first elastic member and the second elastic member. Further, when the probe card 20 is mounted on the mounting portion 73 and when the probe card 20 is taken out from the mounting portion 73, the transfer device 30 uses the probe card by the first elastic member via the mounting portion 73. Since 20 can be assisted, it is possible to suppress an impact from being applied to the probe card 20.

Further, the support portion is provided with a plurality of first elastic members and a second elastic member on the surface corresponding to the mounting portion 73 so that the mounting portion 73 can be held. As a result, the transfer device 30 can appropriately make the probe card 20 correspond to the mounting surface even when the probe card 20 is tilted with respect to the mounting surface of the probe card 20.

Although the embodiments have been described above, it should be considered that the embodiments disclosed this time are exemplary in all respects and not restrictive. Indeed, the above embodiments can be embodied in a variety of forms. Moreover, the above-described embodiment may be omitted, replaced, or changed in various forms without departing from the scope of claims and the gist thereof.

For example, in the above embodiment, the case where four first spring portions 80 and four second spring portions 81 are arranged has been described as an example, but the present invention is not limited to this. Any number of the first spring portion 80 and the second spring portion 81 may be arranged as long as they are three or more. Further, the number of the first spring portion 80 and the second spring portion 81 to be arranged may be the same or different. It is preferable that the first spring portion 80 and the second spring portion 81 are evenly arranged with respect to the circumferential direction of the probe card 20 from the viewpoint of supporting the probe card 20 in a well-balanced manner.

Further, in the above embodiment, the case where the spring 83a is used as the first elastic member and the spring 83b is used as the second elastic member has been described as an example, but the present invention is not limited to this. As the first elastic member and the second elastic member, an elastic member other than the spring may be used.

1 Inspection device 12 Insert ring 20 Probe card 30 Conveyor device 54 Sealing member 71 First support part 72 Second support part 73 Mounting part 80 First spring part 81 Second spring part 83a, 83b Spring 86a, 86b Pin 88 Ring member

Claims (5)

A mounting portion having a mounting surface on which the probe card is mounted,
A first elastic member capable of elastically supporting the weight of the above-mentioned place and a second elastic member capable of elastically supporting the total weight of the above-mentioned place and the probe card are provided. A support portion that supports the mounting portion via the elastic member 1 and the second elastic member, and
Conveyor device with. The support portion is set at a position where the height at which the first elastic member starts elastic contraction due to the load from the above-mentioned resting portion is higher than the height at which the second elastic member starts elastic contraction. When only the description placement portion is supported, the front description placement portion is supported by the first elastic member, and when the probe card is placed on the front description placement portion, the first elastic member and the second elastic member The transport device according to claim 1, wherein the above-described resting portion is supported by an elastic member. The transport device according to claim 1 or 2, wherein the first elastic member and the second elastic member are springs having different spring constants. The claim is characterized in that a plurality of the first elastic member and the second elastic member are provided on a surface corresponding to the previously described placing portion so that the previously described placing portion can be held. Item 4. The transport device according to any one of Items 1 to 3. The above-mentioned rest is formed in an annular shape.
The support portion is characterized in that three or more of the first elastic member and the second elastic member are provided on the surface corresponding to the previously described placing portion along the circumferential direction of the previously described placing portion. The transport device according to any one of claims 1 to 4.

Images