JP2020155707A - 研磨用組成物、研磨用組成物の製造方法、研磨方法、および半導体基板の製造方法 - Google Patents
研磨用組成物、研磨用組成物の製造方法、研磨方法、および半導体基板の製造方法 Download PDFInfo
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- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- RMIODHQZRUFFFF-UHFFFAOYSA-N methoxyacetic acid Chemical compound COCC(O)=O RMIODHQZRUFFFF-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 125000004170 methylsulfonyl group Chemical group [H]C([H])([H])S(*)(=O)=O 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
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- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- RJCRUVXAWQRZKQ-UHFFFAOYSA-N oxosilicon;silicon Chemical compound [Si].[Si]=O RJCRUVXAWQRZKQ-UHFFFAOYSA-N 0.000 description 1
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 1
- 125000006340 pentafluoro ethyl group Chemical group FC(F)(F)C(F)(F)* 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 description 1
- ABLZXFCXXLZCGV-UHFFFAOYSA-N phosphonic acid group Chemical group P(O)(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 description 1
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000005360 phosphosilicate glass Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- XAEFZNCEHLXOMS-UHFFFAOYSA-M potassium benzoate Chemical compound [K+].[O-]C(=O)C1=CC=CC=C1 XAEFZNCEHLXOMS-UHFFFAOYSA-M 0.000 description 1
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- DVUVKWLUHXXIHK-UHFFFAOYSA-N tetraazanium;tetrahydroxide Chemical compound [NH4+].[NH4+].[NH4+].[NH4+].[OH-].[OH-].[OH-].[OH-] DVUVKWLUHXXIHK-UHFFFAOYSA-N 0.000 description 1
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- 229910001428 transition metal ion Inorganic materials 0.000 description 1
- NBXZNTLFQLUFES-UHFFFAOYSA-N triethoxy(propyl)silane Chemical compound CCC[Si](OCC)(OCC)OCC NBXZNTLFQLUFES-UHFFFAOYSA-N 0.000 description 1
- 125000004205 trifluoroethyl group Chemical group [H]C([H])(*)C(F)(F)F 0.000 description 1
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- 229910021642 ultra pure water Inorganic materials 0.000 description 1
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- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
本発明に係る研磨対象物に含まれる材料としては特に制限されず、例えば、酸化ケイ素窒化ケイ素、炭窒化ケイ素(SiCN)、多結晶シリコン(ポリシリコン)、非晶質シリコン(アモルファスシリコン)、金属、SiGe等が挙げられる。
本発明の研磨用組成物に使用される砥粒の種類としては、特に制限されず、例えば、シリカ、アルミナ、ジルコニア、チタニア等の酸化物が挙げられる。該砥粒は、単独でもまたは2種以上組み合わせても用いることができる。該砥粒は、それぞれ市販品を用いてもよいし合成品を用いてもよい。
本発明の一実施形態による研磨用組成物は、一分子中に電子求引部と電子供与部とを有する化合物(以下、単に「化合物」、または「本発明に係る化合物」とも称する)を含む。
本発明の研磨用組成物は、研磨用組成物を構成する各成分の分散のために分散媒が用いられる。分散媒としては、有機溶媒、水が挙げられるが、その中でも水を含むことが好ましい。
本発明の研磨用組成物のpHは、特に制限されないが、7未満であることが好ましい。pHが7以上であると、研磨対象物の研磨速度が低下する場合がある。該pHは、好ましくは6.5以下であり、より好ましくは6以下であり、さらに好ましくは5.5以下であり、よりさらに好ましくは4.5以下である。また、該pHの下限は、好ましくは1以上であり、より好ましくは1.5以上であり、さらに好ましくは2以上であり、よりさらに好ましくは2.5以上である。
本発明に係る研磨用組成物は、pHを上記範囲内に調整する目的で、pH調整剤をさらに含んでいてもよい。
本発明の研磨用組成物は、本発明の効果を損なわない範囲において、キレート剤、増粘剤、酸化剤、分散剤、表面保護剤、濡れ剤、界面活性剤、防錆剤、防腐剤、防カビ剤等の公知の添加剤をさらに含有してもよい。上記添加剤の含有量は、その添加目的に応じて適宜設定すればよい。
本発明の研磨用組成物の製造方法は、特に制限されず、例えば、砥粒、本発明に係る化合物、および必要に応じて他の添加剤を、分散媒中で攪拌混合することにより得ることができる。各成分の詳細は上述した通りである。したがって、本発明は、砥粒と、一分子中に電子求引部および電子供与部を有する化合物と、分散媒と、を混合することを有する、研磨用組成物の製造方法を提供する。
本発明は、本発明の一実施形態に係る研磨用組成物を用いて研磨対象物を研磨する工程と、を含む研磨方法を提供する。また、本発明は、上記研磨方法を有する、半導体基板の製造方法を提供する。
(実施例1)
砥粒としてコロイダルシリカ(平均一次粒子径35nm、平均二次粒子径70nm、平均会合度2.0)を、研磨用組成物の総質量を100質量%として1質量%の濃度となるように水に加えた。さらに、pH調整剤として乳酸を、pHが3となるように添加した。その後、室温(25℃)で30分攪拌混合し、研磨用組成物を調製した。
電子求引部および電子供与部を有する化合物の種類および添加量、ならびにpHを下記表4のように変更したこと以外は、実施例1と同様にして、各研磨用組成物を調製した。
研磨対象物として、表面に厚さ10000ÅのTEOS膜を形成したシリコンウェーハ(200mm、ブランケットウェーハ、アドバンテック株式会社製)を準備した。それぞれのシリコンウェーハを60mm×60mmのチップに切断したクーポンを試験片とし、上記で得られた各研磨用組成物を用いて、基板を以下の研磨条件で研磨した。
研磨機としてEJ−380IN−CH(日本エンギス株式会社製)を、研磨パッドとして硬質ポリウレタンパッドIC1000(ロームアンドハース社製)を、それぞれ用いた。研磨圧力3.05psi(21.0kPa)、定盤回転数60rpm、キャリア回転数60rpm、研磨用組成物の供給速度100ml/minの条件で、研磨時間は60秒で研磨を実施した。
研磨レート(Removal Rate;RR、研磨速度)は、以下の式により計算した。
Claims (14)
- 砥粒と、
一分子中に電子求引部および電子供与部を有する化合物と、
分散媒と、
を含む、研磨用組成物。 - 前記電子求引部は、−NO2基、−SO2CH3基、−CN基、−CnF2n+1基(nは1〜8の整数)、−Cm+1F3m構造を有する基(mは1〜8の整数)、−COCH3基、−CHO基、−F基、−Cl基、および−Br基からなる群より選択される少なくとも1種である、請求項1に記載の研磨用組成物。
- 前記電子供与部は、−N(CH3)2基、−NH2基、−OH基、−OCH3基、−CH3基、および−C6H5基からなる群より選択される少なくとも1種である、請求項1または2に記載の研磨用組成物。
- 前記化合物が有する前記電子求引部および前記電子供与部の組み合わせは、下記表1の(1)〜(66)に示す組み合わせの少なくとも1つである、請求項1〜3のいずれか1項に記載の研磨用組成物。
- 前記化合物が有する前記電子求引部および前記電子供与部の組み合わせは、下記表2の(1)〜(41)、(43)〜(47)、(49)〜(52)、(55)〜(58)、および(61)〜(64)に示す組み合わせの少なくとも1つである、請求項4に記載の研磨用組成物。
- 前記化合物が有する前記電子求引部および前記電子供与部の組み合わせは、下記表3の(1)〜(4)、(7)〜(10)、(13)〜(16)、(19)〜(22)、(25)〜(28)、(31)〜(34)、および(37)〜(40)に示す組み合わせの少なくとも1つである、請求項4または5に記載の研磨用組成物。
- 前記化合物は、ハロゲン化アルコールである、請求項1〜6のいずれか1項に記載の研磨用組成物。
- 前記化合物の含有量は、1mM以上50mM以下である、請求項1〜7のいずれか1項に記載の研磨用組成物。
- pHが7未満である、請求項1〜8のいずれか1項に記載の研磨用組成物。
- 前記砥粒は、コロイダルシリカを含む、請求項1〜9のいずれか1項に記載の研磨用組成物。
- 酸化ケイ素を含む研磨対象物を研磨する用途で用いられる、請求項1〜10のいずれか1項に記載の研磨用組成物。
- 砥粒と、一分子中に電子求引部および電子供与部を有する化合物と、分散媒と、を混合することを含む、研磨用組成物の製造方法。
- 請求項1〜11のいずれか1項に記載の研磨用組成物を用いて、研磨対象物を研磨する工程を含む、研磨方法。
- 請求項13に記載の研磨方法を有する、半導体基板の製造方法。
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