JP2020152909A - Adhesive tape roll - Google Patents

Abstract

To provide an adhesive tape suppressed in winding deviation while suppressed in blocking, and an adhesive tape roll.SOLUTION: An adhesive tape is a long-sized adhesive tape having a laminate structure including a substrate, an adhesive layer, and a cover film where the length of a protruded part of the adhesive layer protruding from the edge of the substrate is 20 μm or more when pressurizing the adhesive tape by 2 kPa from a main surface direction, the gel fraction of the adhesive layer is 30% or more, and the thickness of the adhesive layer to a total thickness of the substrate and the cover film is 1.3 or less. The adhesive tape roll is constituted by the adhesive tape.SELECTED DRAWING: None

Description

The present invention relates to an adhesive tape roll or the like.

Adhesive tapes are used in various industrial fields because they can be easily joined. In the construction field, temporary fixing of curing sheets, bonding of interior materials, etc., in the automobile field, fixing of interior parts such as seats and sensors, fixing of exterior parts such as side moldings and side visors, etc., in the electrical and electronic field, module assembly, Adhesive tape is used to attach the module to the housing. More specifically, for example, an adhesive tape is widely used as a surface protective tape for temporarily protecting the surface of a member such as an optical device, a metal plate, a painted metal plate, a resin plate, or a glass plate. Further, in the manufacturing process of an electronic device such as a semiconductor device, an adherend is attached to an adhesive tape to protect or temporarily fix it in order to facilitate handling during processing and prevent damage. (For example, Patent Document 1 etc.).

Japanese Unexamined Patent Publication No. 5-32946

The adhesive tape is usually shipped in the form of a roll of adhesive tape wound in a roll shape. However, in this state, the adhesive layer may protrude from the side surface due to winding stress during storage, and the protruding adhesive layers may adhere to each other, making it impossible to stably unwind the winding core side (blocking).

The present inventor has proceeded with research from the viewpoint of suppressing the protrusion of the pressure-sensitive adhesive layer in order to suppress blocking. Then, they have found that if there is no constant protrusion, winding misalignment is likely to occur due to vibration or the like when the adhesive tape roll is transported.

Therefore, an object of the present invention is to provide an adhesive tape and an adhesive tape roll in which blocking is suppressed and winding deviation is also suppressed.

As a result of diligent research, the present inventor is a long adhesive tape containing a base material, an adhesive layer and a cover film, and having a laminated structure in which these are arranged in this order. When the adhesive tape is pressed by 2 kPa from the main surface direction, the length of the protruding portion of the pressure-sensitive adhesive layer protruding from the edge of the base material is 20 μm or more, and the gel content of the pressure-sensitive adhesive layer is 30% or more. Moreover, if the thickness of the adhesive layer is 1.3 or less with respect to the total thickness of the base material and the cover film, the adhesive tape and the adhesive tape roll composed of the adhesive tape solve the above problems. I found out what I could do. As a result of further research based on this finding, the present invention has been completed.

That is, the present invention includes the following aspects.

Item 1. A long adhesive tape containing a base material, an adhesive layer and a cover film, and having a laminated structure in which these are arranged in this order.
When the adhesive tape is pressed by 2 kPa from the main surface direction, the length of the protruding portion of the adhesive layer protruding from the edge of the base material is 20 μm or more.
The gel fraction of the pressure-sensitive adhesive layer is 30% or more, and the thickness of the pressure-sensitive adhesive layer is 1.3 or less with respect to the total thickness of the base material and the cover film.
Adhesive tape.

Item 2. Item 2. The adhesive tape according to Item 1, wherein the coefficient of dynamic frictional force between one surface of the adhesive tape and the other surface is 0.1 or more.

Item 3. Item 2. The adhesive tape according to Item 1 or 2, wherein the storage elastic modulus G'of the pressure-sensitive adhesive layer at 23 ° C. is 5.0 × 10 ³ Pa or more and 2.0 × 10 ⁸ Pa or less.

Item 4. Item 2. The adhesive tape according to any one of Items 1 to 3, wherein the adhesive tape has a width of 50 to 1000 mm.

Item 5. An adhesive tape roll composed of the adhesive tape according to any one of Items 1 to 4.

Item 6. Including the process of winding the adhesive tape in a roll
The adhesive tape is a long adhesive tape containing a base material, an adhesive layer, and a cover film, and having a laminated structure in which these are arranged in this order.
When the adhesive tape is pressed by 2 kPa from the main surface direction, the length of the adhesive layer protruding from the edge of the base material is 20 μm or more.
The gel fraction of the pressure-sensitive adhesive layer is 30% or more, and the thickness of the pressure-sensitive adhesive layer is 1.3 or less with respect to the total thickness of the base material and the cover film.
Item 5. The method for producing an adhesive tape roll according to Item 5.

According to the present invention, it is possible to provide an adhesive tape and an adhesive tape roll in which blocking is suppressed and unwinding is also suppressed.

It is a schematic diagram showing the length of the protruding portion of the pressure-sensitive adhesive layer protruding from the edge of the base material when the pressure-sensitive adhesive tape is pressed by 2 kPa from the main surface direction.

In the present specification, the expressions "contains" and "contains" include the concepts of "contains", "contains", "substantially consists" and "consists of only".

As used herein, "(meth) acrylic" refers to "acrylic" and "methacryl". Thus, for example, (meth) acrylic acid contains acrylic acid and methacrylic acid, and (meth) acrylic acid ester contains acrylic acid ester and methacrylic acid ester. The same applies to other compounds in which "(meth) acrylic" is used.

The present invention is, in one aspect, a long adhesive tape comprising a base material, an adhesive layer and a cover film, and having a laminated structure in which these are arranged in this order. When pressed by 2 kPa from the main surface direction, the length of the protruding portion of the pressure-sensitive adhesive layer protruding from the edge of the base material is 20 μm or more, the gel content of the pressure-sensitive adhesive layer is 30% or more, and the group. An adhesive tape (in the present specification, it may be referred to as "adhesive tape of the present invention") and the present invention, wherein the thickness of the pressure-sensitive adhesive layer with respect to the total thickness of the material and the cover film is 1.3 or less. (In the present specification, it may be referred to as "the adhesive tape roll of the present invention"). These will be described below.

(A) Base material The base material is not particularly limited as long as it contains a resin as a material. The base material may contain components other than the resin as long as the effects of the present invention are not significantly impaired. In that case, the total amount of the resin in the base material is, for example, 80% by mass or more, preferably 90% by mass or more, more preferably 95% by mass or more, still more preferably 99% by mass or more, and usually less than 100% by mass. is there.

The resin constituting the base material is not particularly limited, and is, for example, a polyolefin resin, a polyester resin, an ethylene-vinyl acetate copolymer, a modified olefin resin, a polyvinyl chloride resin, a polyurethane resin, or a cycloolefin polymer resin. , Acrylic resin, polycarbonate, ABS (acrylonitrile-butadiene-styrene) resin, polyamide, polyurethane, polyimide and the like. Examples of the polyolefin resin include polyethylene and polypropylene. Examples of the polyester-based resin include polyethylene terephthalate (PET) and polyethylene naphthalate (PEN). Examples of the modified olefin resin include ethylene-acrylic acid ester copolymers. Among these, polyester-based resin is preferable, and polyethylene terephthalate is more preferable.

The resin constituting the base material may be one kind alone or a combination of two or more kinds.

The layer structure of the base material is not particularly limited. The base material may be composed of one type of base material alone, or may be a combination of two or more types of base materials.

The thickness of the base material is not particularly limited as long as it satisfies the ratio of the thickness of the pressure-sensitive adhesive layer to the total thickness of the base material and the cover film described later, but is, for example, 10 μm or more and 250 μm or less. The thickness is preferably 15 μm or more, more preferably 20 μm or more, still more preferably 25 μm or more, and particularly preferably 30 μm or more, from the viewpoint of suppressing blocking, suppressing unwinding, improving adhesive properties, and the like. It is preferably 200 μm or less, more preferably 150 μm or less, even more preferably 100 μm or less, and particularly preferably 80 μm or less.

The base material may be one that has been subjected to various surface treatments. Examples of the surface treatment include corona discharge treatment, flame treatment, ultraviolet treatment, high frequency treatment, glow discharge treatment, active plasma treatment, surface activation treatment such as laser treatment, and the like. The surface treatment of the base material may be performed on the side facing the adhesive polymer layer, or on the opposite side.

(B) Adhesive layer The adhesive layer is not particularly limited as long as it contains an adhesive and satisfies the gel fraction described later.

The adhesive is not particularly limited, and for example, acrylic adhesive, urethane adhesive, polyolefin adhesive, polyester adhesive, vinyl alkyl ether adhesive, polyamide adhesive, rubber adhesive, silicone adhesive. Examples include adhesives and fluorine-based adhesives. Among these, an acrylic pressure-sensitive adhesive is preferable from the viewpoint that the adhesiveness can be easily adjusted after the pressure-sensitive adhesive layer is formed.

The acrylic pressure-sensitive adhesive is obtained by polymerizing a monomer in a pressure-sensitive adhesive composition containing a (mono) acrylic acid ester as a main component monomer to obtain a (meth) acrylic copolymer.

The pressure-sensitive adhesive composition contains (meth) acrylic acid ester (A) and a functional group-containing monomer (B) as monomer components.

The (meth) acrylic acid ester (A) is the main component of the monomer constituting the base polymer in the acrylic pressure-sensitive adhesive, and only one type may be used, or two or more types of (meth) acrylic acid esters may be combined. Can also be used. The ratio of each (meth) acrylic acid ester when the (meth) acrylic acid ester is combined can be arbitrarily selected. The (meth) acrylic acid ester is preferably a (meth) acrylic acid ester having a hydrocarbon group having 1 to 15 carbon atoms.

Examples of the (meth) acrylic acid ester (A) include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, isopropyl (meth) acrylate, butyl (meth) acrylate, and isobutyl (meth) acrylate. s-butyl (meth) acrylate, t-butyl (meth) acrylate, pentyl (meth) acrylate, hexyl (meth) acrylate, heptyl (meth) acrylate, octyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, isooctyl ( Meta) acrylate, Nonyl (meth) acrylate, Isononyl (meth) acrylate, Decyl (meth) acrylate, Isodecyl (meth) acrylate, Undecyl (meth) acrylate, Dodecyl (meth) acrylate, Tridecyl (meth) acrylate, Tetradecyl (meth) Alkyl ester (meth) acrylates such as acrylates, pentadecyl (meth) acrylates and hexadecyl (meth) acrylates; alicyclic hydrocarbons such as isobornyl (meth) acrylates, cyclohexyl (meth) acrylates and dicyclopentanyl (meth) acrylates. Group-containing (meth) acrylic acid ester; (meth) acrylic acid ester having an aromatic hydrocarbon group such as phenyl (meth) acrylate, benzyl (meth) acrylate, phenoxyethyl (meth) acrylate, and phenoxydiethylene glycol (meth) acrylate. ; And so on.

Among the (meth) acrylic acid esters (A), alkyl ester (meth) acrylates are preferable from the viewpoint of exhibiting preferable adhesive properties as a semiconductor temporary fixing material, and the alkyl group (preferably a branched alkyl group) has 2 carbon atoms. Alkyl ester (meth) acrylates of ~ 12 (preferably 4-10, more preferably 6-10) are more preferred.

The content of the (meth) acrylic acid ester (A) is preferably 70 to 99% by mass, more preferably 75 to 95% by mass, based on 100% by mass of the total amount of the monomer components of the (meth) acrylic copolymer. , More preferably 80 to 90% by mass.

Examples of the functional group-containing monomer (B) include carboxyl group-containing (meth) acrylates such as (meth) acrylic acid; hydroxy group-containing (meth) acrylates; epoxy group-containing monomers such as glycidyl acrylate and glycidyl methacrylate; acrylic acid. Isocyanate group-containing monomers such as isocyanate ethyl and isocyanate ethyl methacrylate; amino group-containing monomers such as aminoethyl acrylate and aminoethyl methacrylate can be mentioned. Among these, acrylic acid, hydroxy group-containing (meth) acrylate and the like are preferable from the viewpoint of stably developing adhesiveness.

Examples of the hydroxy group-containing (meth) acrylate include hydroxyalkyls such as 2-hydroxyethyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, and 6-hydroxyhexyl (meth) acrylate. Examples include (meth) acrylate. From the viewpoint of stably expressing the adhesiveness, the alkyl of the hydroxyalkyl (meth) acrylate preferably has 2 to 6 carbon atoms, and more preferably 2 to 3 carbon atoms.

As the functional group-containing monomer (B), only one type may be used, or two or more types may be used in combination.

The content of the functional group-containing monomer (B) is preferably 1 to 30% by mass, more preferably 5 to 25% by mass, still more preferably 10 with respect to 100% by mass of the total amount of the monomer components of the (meth) acrylic copolymer. ~ 20% by mass.

In order to copolymerize a monomer mixture containing the above-mentioned monomer to obtain a (meth) acrylic copolymer, an additive such as a polymerization modifier is added to the monomer mixture as necessary, and a radical is added in the presence of a polymerization initiator. You just have to react. A conventionally known method is used as a method for radically reacting a monomer mixture, that is, a polymerization method, and examples thereof include solution polymerization (boiling point polymerization or constant temperature polymerization), emulsion polymerization, suspension polymerization, and bulk polymerization. The polymerization initiator is not particularly limited, and examples thereof include organic peroxides and azo compounds. Examples of organic peroxides include 1,1-bis (t-hexylperoxy) -3,3,5-trimethylcyclohexane, t-hexylperoxypivalate, t-butylperoxypivalate, 2,5-. Dimethyl-2,5-bis (2-ethylhexanoylperoxy) hexane, t-hexylperoxy-2-ethylhexanoate, t-butylperoxy-2-ethylhexanoate, t-butylperoxyiso Butylate, t-butylperoxy-3,5,5-trimethylhexanoate, t-butylperoxylaurate and the like can be mentioned. Examples of the azo compound include azobisisobutyronitrile and azobiscyclohexanecarbonitrile. These polymerization initiators may be used alone or in combination of two or more.

The pressure-sensitive adhesive layer may consist of only the pressure-sensitive adhesive, but may contain other components. The other components are not particularly limited, and examples thereof include a photopolymerization initiator, a thermal polymerization initiator, a gas generator, a radically polymerizable polyfunctional oligomer or monomer, a silicone compound, an inorganic filler, and a tackifier.

Examples of the photopolymerization initiator include those that are activated by irradiating with light having a wavelength of 250 to 800 nm. Examples of such photopolymerization initiators include acetophenone derivative compounds such as methoxyacetophenone, benzoin ether compounds such as benzoin propyl ether and benzoin isobutyl ether, ketal derivative compounds such as benzyl dimethyl ketal and acetophenone diethyl ketal, and the like. Examples include phosphine oxide derivative compounds. Further, bis (η5-cyclopentadienyl) titanosen derivative compound, benzophenone, Michler ketone, chlorothioxanthone, dodecylthioxanthone, dimethylthioxanthone, diethylthioxanthone, α-hydroxycyclohexylphenylketone, 2-hydroxymethylphenylpropane and the like can also be mentioned. These photopolymerization initiators may be used alone or in combination of two or more.

Examples of the thermal polymerization initiator include those that generate active radicals that are decomposed by heat and initiate polymerization curing. Specifically, for example, dicumyl peroxide, di-t-butyl peroxide, t-butylperoxybenzoale, t-butylhydroperoxide, benzoyl peroxide, cumene hydroperoxide, diisopropylbenzene hydroperoxide, etc. Examples thereof include paramentan hydroperoxide and di-t-butyl peroxide. Of these thermal polymerization initiators, those commercially available are not particularly limited, but for example, perbutyl D, perbutyl H, perbutyl P, perpenta H (all of which are manufactured by NOF CORPORATION) and the like are suitable. These thermal polymerization initiators may be used alone or in combination of two or more.

The polyfunctional oligomer or monomer is not particularly limited as long as it is radically polymerizable. By blending this, photocurability and thermosetting can be improved. The polyfunctional oligomer or monomer preferably has a molecular weight of 10,000 or less, and more preferably has a molecular weight of 5000 or less so that the pressure-sensitive adhesive layer can be efficiently reticulated by heating or irradiation with light. The number of radically polymerizable unsaturated bonds in the molecule is 2 to 20. Examples of the polyfunctional oligomer or monomer include trimethylolpropane triacrylate, tetramethylolmethane tetraacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol monohydroxypentaacrylate, dipentaerythritol hexaacrylate, or the same methacrylate as described above. Kind and the like. Other examples include 1,4-butylene glycol diacrylate, 1,6-hexanediol diacrylate, polyethylene glycol diacrylate, commercially available oligoester acrylate, and the same methacrylates as described above. These polyfunctional oligomers or monomers may be used alone or in combination of two or more.

The gas generating agent is not particularly limited as long as it generates a gas by irradiation with light or heating. When the pressure-sensitive adhesive layer containing such a gas generating agent is irradiated or heated with light, the pressure-sensitive adhesive component is cross-linked and cured to increase the elastic coefficient of the entire pressure-sensitive adhesive, and the gas generated in such a hard pressure-sensitive adhesive is adhered. Since it is released from the agent to the adhesive interface and peels off at least a part of the adhesive surface, the peeling can be facilitated. From the viewpoint that the adhesive tape can exhibit heat resistance when the adhesive tape is used in the method for manufacturing an electronic device including a heating step, the gas generating agent is preferably one that generates a gas by irradiating with light. The gas generating agent is not particularly limited, and examples thereof include azide compounds, azo compounds, ketoprofen, and tetrazole compounds. Of these, ketoprofen and tetrazole compounds having excellent heat resistance are preferable.

Since the silicone compound has excellent heat resistance, it prevents the adhesive from being burnt even when placed in a high temperature environment of 200 ° C. or higher, and bleeds out to the interface of the adherend at the time of peeling to facilitate peeling. Can be done. In a preferred embodiment of the present invention, the silicone compound preferably has a functional group crosslinkable with the pressure-sensitive adhesive, in which case it is incorporated into the pressure-sensitive adhesive by chemically reacting with the pressure-sensitive adhesive by irradiation with light or heating. Therefore, the silicone compound adheres to the adherend and is not easily contaminated. Further, by blending a silicone compound, particularly a silicone compound having a functional group crosslinkable with the pressure-sensitive adhesive, into the pressure-sensitive adhesive layer, the effect of preventing adhesive residue on the adherend can be exhibited.

Examples of the inorganic filler include fumed silica and the like. By blending an inorganic filler, it is possible to increase the cohesive force of the pressure-sensitive adhesive layer.

The pressure-sensitive adhesive layer may appropriately contain various polyfunctional compounds to be blended in general pressure-sensitive adhesives such as isocyanate compounds, melamine compounds, and epoxy compounds, if desired, for the purpose of adjusting the cohesive force as the pressure-sensitive adhesive. Good. In addition, the pressure-sensitive adhesive layer may contain known additives such as antistatic agents, plasticizers, resins, surfactants, waxes, and fine particle fillers. These components may be used alone or in combination of two or more.

The content of the components other than the above-mentioned pressure-sensitive adhesive is, for example, 0 to 70% by mass, particularly 0 to 50% by mass, particularly 0 to 30% by mass, and still 0 to 10% by weight with respect to 100% by mass of the pressure-sensitive adhesive layer. %.

In the adhesive tape of the present invention, the gel fraction of the pressure-sensitive adhesive layer is 30% or more from the viewpoint of suppressing blocking, suppressing unwinding, and exhibiting adhesive properties as a temporary fixing material. The gel fraction is preferably 40% or more, more preferably 50% or more, still more preferably 55%, from the viewpoint of suppressing blocking, suppressing unwinding, exhibiting adhesive properties as a temporary fixing material, and the like. Above, even more preferably 60% or more. From the same viewpoint, the gel fraction is preferably 97% or less, more preferably 95% or less, still more preferably 92% or less, still more preferably 90% or less. From the same viewpoint, the gel fraction is preferably 40 to 97%, more preferably 50 to 95%, still more preferably 55 to 92%, still more preferably 60 to 90%.

The method for measuring the gel fraction is as follows. Only 0.1 g of the pressure-sensitive adhesive layer is scraped off from the obtained adhesive tape, immersed in 50 mL of ethyl acetate, and shaken with a shaker at a temperature of 23 ° C. and 200 rpm for 24 hours. After shaking, a metal mesh (opening # 200 mesh) is used to absorb ethyl acetate and ethyl acetate and separate the swollen pressure-sensitive adhesive layer. The adhesive layer after separation is dried under the condition of 110 ° C. for 1 hour. The weight of the pressure-sensitive adhesive layer containing the metal mesh after drying is measured, and the gel fraction is calculated using the following formula.

Gel fraction (% by weight) = 100 x (W _1- W ₂ ) / W ₀
(W ₀ : initial pressure-sensitive adhesive layer weight, W ₁ : pressure-sensitive adhesive layer weight including the dried metal mesh, W ₂ : initial weight of the metal mesh).

In the adhesive tape of the present invention, the storage elastic modulus G'of the pressure-sensitive adhesive layer at 23 ° C. is preferably from the viewpoint of suppressing blocking, suppressing unwinding, exhibiting adhesive properties as a temporary fixing material, and the like. 5.0 × 10 ³ Pa or more and 2.0 × 10 ⁸ Pa or less, more preferably 5.0 × 10 ⁴ Pa or more and 1.0 × 10 ⁷ Pa or less, still more preferably 1.0 × 10 ⁵ Pa or more. And it is 1.0 × 10 ⁶ Pa or less.

The method for measuring the storage elastic modulus is as follows. The dynamic viscoelastic spectrum of the pressure-sensitive adhesive layer was measured by shear deformation using a dynamic viscoelasticity measuring device (DVA-200, manufactured by IT) under the condition of a measurement frequency of 10 Hz, and the pressure-sensitive adhesive layer was stored at 23 ° C. Obtain the elastic modulus G'.

The layer structure of the pressure-sensitive adhesive layer is not particularly limited. The pressure-sensitive adhesive layer may be composed of one type of pressure-sensitive adhesive layer alone, or may be a combination of two or more types of pressure-sensitive adhesive layers.

The thickness of the pressure-sensitive adhesive layer is not particularly limited as long as it satisfies the thickness of the pressure-sensitive adhesive layer with respect to the total thickness of the base material and the cover film described later, but is, for example, 10 to 500 μm. The thickness is preferably 20 to 400 μm, more preferably 30 to 300 μm, still more preferably 40 to 200 μm, from the viewpoint of suppressing blocking, suppressing unwinding, and exhibiting adhesive properties as a temporary fixing material. Even more preferably, it is 40 to 150 μm, and particularly preferably 40 to 120 μm.

(C) Cover film The cover film is not particularly limited as long as it contains a resin as a material. The cover film may contain components other than the resin as long as the effects of the present invention are not significantly impaired. In that case, the total amount of the resin in the cover film is, for example, 80% by mass or more, preferably 90% by mass or more, more preferably 95% by mass or more, still more preferably 99% by mass or more, and usually less than 100% by mass. is there.

The resin constituting the cover film is not particularly limited, and for example, a polyolefin resin, a polyester resin, an ethylene-vinyl acetate copolymer, a modified olefin resin, a polyvinyl chloride resin, a polyurethane resin, and a cycloolefin polymer resin. , Acrylic resin, polycarbonate, ABS (acrylonitrile-butadiene-styrene) resin, polyamide, polyurethane, polyimide and the like. Examples of the polyolefin resin include polyethylene and polypropylene. Examples of the polyester-based resin include polyethylene terephthalate (PET) and polyethylene naphthalate (PEN). Examples of the modified olefin resin include ethylene-acrylic acid ester copolymers. Among these, polyester-based resin is preferable, and polyethylene terephthalate is more preferable.

The resin constituting the cover film may be one kind alone or a combination of two or more kinds.

The layer structure of the cover film is not particularly limited. The cover film may be composed of one type of cover film alone, or may be a combination of two or more types of cover films.

The thickness of the cover film is not particularly limited as long as it satisfies the thickness of the pressure-sensitive adhesive layer with respect to the total thickness of the base material and the cover film described later, but is, for example, 10 μm or more and 250 μm or less. The thickness is preferably 12 μm or more, more preferably 15 μm or more, further preferably 20 μm or more, still more preferably 25 μm or more, particularly preferably 25 μm or more, from the viewpoint of suppressing blocking, suppressing unwinding, and handling during the process. Is 30 μm or more, preferably 200 μm or less, more preferably 175 μm or less, still more preferably 150 μm or less, still more preferably 125 μm or less, and particularly preferably 100 μm or less.

The cover film may be one that has been subjected to various surface treatments. Examples of the surface treatment include corona discharge treatment, flame treatment, ultraviolet treatment, high frequency treatment, glow discharge treatment, active plasma treatment, surface activation treatment such as laser treatment, and the like. In addition, the cover film can be released from the mold if necessary.

(D) Structure of Adhesive Tape The adhesive tape of the present invention contains the above-mentioned base material, pressure-sensitive adhesive layer and cover film, and a laminated structure (layer structure: base material / pressure-sensitive adhesive layer) in which these are arranged in this order. / Cover film).

The laminated structure may include other layers. The other layer is not particularly limited as long as the effect of the present invention is not significantly impaired, and examples thereof include an anchor layer and the like. The anchor layer can exert the effect of enhancing the adhesion between the layers (for example, between the base material and the pressure-sensitive adhesive layer).

The adhesive tape of the present invention may be composed of only a laminated structure (single-sided pressure-sensitive adhesive layer structure), or may include other laminated structures in addition to the laminated structure. As a typical example of the latter case, the pressure-sensitive adhesive tape of the present invention includes a double-sided pressure-sensitive adhesive layer structure, that is, a layer structure (optionally a cover film /) pressure-sensitive adhesive layer / base material / pressure-sensitive adhesive layer / cover film. The adhesive tape of the present invention preferably has a single-sided pressure-sensitive adhesive layer structure, that is, a base material / pressure-sensitive adhesive layer / cover film.

The adhesive tape of the present invention is a long adhesive tape. Here, the long shape refers to a shape having a long side long enough to form a roll shape or a shape rewound from the roll shape. The short side of the adhesive tape of the present invention is the "width" of the adhesive tape.

The width of the adhesive tape of the present invention is preferably 50 mm or more, more preferably 70 mm or more, further preferably 100 mm or more, still more preferably 200 mm or more, and particularly preferably 250 mm or more, from the viewpoint of facilitating handling during the process. It is particularly preferably 300 mm or more, preferably 1000 mm or less, more preferably 800 mm or less, still more preferably 700 mm or less, still more preferably 600 mm or less, particularly preferably 500 mm or less, and particularly preferably 400 mm or less.
In the adhesive tape of the present invention, it is preferable that at least the width of the base material and the cover film are the same and the edges are aligned.

In the adhesive tape of the present invention, the thickness of the adhesive layer relative to the total thickness of the base material and the cover film is determined from the viewpoint of suppressing blocking, suppressing unwinding, exhibiting adhesive properties as a temporary fixing material, and the like. It is 1.3 or less. When the thickness of the pressure-sensitive adhesive layer is in the above ratio with respect to the total thickness of the base material and the cover film, it is possible to suppress blocking by sufficiently separating the pressure-sensitive adhesive layers from each other when they are rolled. it can. The thickness of the pressure-sensitive adhesive layer with respect to the total thickness of the base material and the cover film is preferably 0.1 or more and 1.3 or less, more preferably 0.3 or more and 1.3 or less, and further preferably 0.5 or more and 1.3. Below, it is even more preferably 0.8 or more and 1.3 or less.

(E) Characteristics of Adhesive Tape The adhesive tape of the present invention has the following characteristics: Adhesive tape from the main surface direction, from the viewpoint of suppressing blocking, suppressing unwinding, and adhering glue to the line during the process. When pressed at 2 kPa, the pressure-sensitive adhesive layer that protrudes from the edge of the base material has a characteristic that the length of the protruding portion is 20 μm or more. The length of the protruding portion is preferably 20 μm or more and 250 μm or less, more preferably 20 μm or more and 150 μm or less, still more preferably 20 μm or more and 100 μm or less, still more preferably 20 μm or more and 60 μm or less, from the viewpoint of suppressing blocking, suppressing unwinding, and the like. Particularly preferably, it is 20 μm or more and 40 μm or less.

The method for measuring the length of the protruding portion is as follows. Cut the adhesive tape to make a 10 cm square sample. The sample is placed between two 10 cm square copper plates (thickness 1 mm), a weight of 20 N is placed in the direction of the main surface of the sample via the copper plates, and the entire sample is pressurized (pressurization of 2 kPa). In this state, it is left at 23 ° C. and 50% RH for 24 hours. Then, the pressure is observed with an optical microscope in a pressurized state, and the length of the protruding portion of the pressure-sensitive adhesive layer protruding from the edge of the base material (see FIG. 1) is measured. The measurement is performed at the central portion of each side (each of the four sides), and the maximum value is defined as the protruding portion length of the adhesive layer.
In the case of an adhesive tape roll, if the length of the protruding portion is at least one end, the effect of suppressing unwinding is excellent.

The adhesive tape of the present invention preferably has the following characteristics: dynamic friction force between one surface of the adhesive tape and the other surface, from the viewpoint of suppressing blocking, suppressing unwinding, ease of feeding the tape, and the like. It has the characteristic that the coefficient is 0.05 or more. The "one surface and the other surface" are, for example, the surface of the base material and the surface of the cover film when the adhesive tape of the present invention has a single-sided adhesive layer structure, and 2 when the adhesive tape has a double-sided adhesive layer structure. The surfaces of the two cover films. The dynamic friction force coefficient is preferably 0.1 or more, more preferably 0.15 or more and 0.8 or less, still more preferably 0, from the viewpoint of suppressing blocking, suppressing unwinding, ease of tape feeding, and the like. .2 or more and 0.7 or less, more preferably 0.25 or more and 0.6 or less, still more preferably 0.3 or more and 0.5 or less, and particularly preferably 0.35 or more and 0.45 or less.
The coefficient of dynamic friction force can be adjusted by the resin constituting the base material and the cover film, the surface treatment, and the like.

The method for measuring the coefficient of dynamic friction is as follows. Using the precision universal testing machine Autograph AG-ISSHIMADZU, a dynamic friction test can be performed at a test speed of 100 mm / min according to JIS7125.

(F) Method for producing adhesive tape The method for producing an adhesive tape of the present invention is not particularly limited. In the adhesive tape of the present invention, for example, a mixture (adhesive composition) of each component such as an adhesive (or monomer component) of the adhesive layer and a diluent added as needed is applied onto a cover film. Then, the obtained laminated sheet can be produced by a method including a step of sticking the obtained laminated sheet on one side or both sides of another sheet including a base material via the pressure-sensitive adhesive layer.

The diluent is not particularly limited, and for example, esters such as methyl acetate, ethyl acetate, butyl acetate, isobutyl acetate, amyl acetate, ethyl butyrate; hexane, heptane, octane, toluene, xylene, ethylbenzene, cyclohexane, methylcyclohexane and the like. Hydrocarbons; Halogenized hydrocarbons such as dichloromethane, trichloroethane, trichloroethylene, tetrachloroethylene, dichloropropane; alcohols such as methanol, ethanol, propanol, isopropyl alcohol, butanol, isobutyl alcohol, diacetone alcohol; diethyl ether, diisopropyl ether , Dioxane, tetrahydrofuran and other ethers; acetone, methyl ethyl ketone, methyl isobutyl ketone, isophorone, cyclohexanone and other ethers; ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monomethyl ether acetate, propylene glycol monomethyl ether, propylene glycol Examples thereof include polyols such as monoethyl ether and propylene glycol monomethyl ether acetate, and derivatives thereof. The diluent may be used alone or in combination of two or more.

When a diluent is added, the mixing ratio thereof is not particularly limited. From the viewpoint of coatability and the like, the blending ratio is such that the solid content concentration of the pressure-sensitive adhesive composition is, for example, 15 to 40% by mass, preferably 25 to 35% by mass.

The method of applying the pressure-sensitive adhesive composition is not particularly limited. For example, it can be applied using a conventional coater (gravure roll coater, reverse roll coater, kiss roll coater, dip roll coater, bar coater, knife coater, spray coater, etc.).

After application, it is preferable to dry. The drying temperature is, for example, 30 to 200 ° C., preferably 60 to 160 ° C., more preferably 80 to 120 ° C. The drying time may vary depending on the drying temperature, but is, for example, 30 seconds to 15 minutes, preferably 1 minute to 10 minutes, and more preferably 3 minutes to 7 minutes.

(G) Adhesive Tape Roll The adhesive tape roll of the present invention can be obtained by winding the adhesive tape of the present invention in a roll shape.

The width of the adhesive tape roll of the present invention is, for example, 50 mm or more and 1000 mm or less. The width is preferably 100 mm or more, more preferably 200 mm or more, still more preferably 300 mm or more, preferably 700 mm or less, more preferably 700 mm or less, from the viewpoint of the wafer size and substrate size used as a general semiconductor temporary fixing material. Is 500 mm or less, more preferably 400 mm or less.

(H) Applications The adhesive tape of the present invention constituting the adhesive tape roll of the present invention is not particularly limited in its use and can be used in various fields. In particular, it can be suitably used as a protective tape for electronic components for protecting electronic components such as semiconductor wafers (preferably, surfaces having irregularities such as bumps).

The adhesive tape of the present invention can also be used for high temperature treatment such as fixing a wafer to a support plate in the manufacturing process of TSV and temporarily fixing the wafer or chip to the support plate or the like when passing it through a reflow furnace. it can.

The adhesive tape of the present invention is a tape for fixing a support plate during high-temperature treatment, a fixing tape for both high-temperature treatment and backgrinding, a fixing tape for both high-temperature treatment and dicing, and an individualized semiconductor chip for further high-temperature treatment. It is suitable for a tape for temporarily fixing a semiconductor chip used for dicing.

The adhesive tape of the present invention is suitable as an adhesive tape for fixing the wafer to the support plate in order to facilitate the handling of the wafer and prevent it from being damaged during the processing of the wafer including the high temperature processing process. A support plate fixing step of fixing the wafer to the support plate via the adhesive tape of the present invention, a wafer processing step of subjecting the surface of the wafer fixed to the support plate with heating of 200 ° C. or higher, and after the above treatment. A method for processing a wafer, which comprises a support plate peeling step of irradiating the wafer with light to cure the pressure-sensitive adhesive layer and peeling the support plate from the wafer, is also one of the present inventions.

The support plate is not particularly limited, and examples thereof include a glass plate, a quartz glass plate, and a stainless steel plate. The treatment that involves heating the surface of the wafer fixed to the support plate at 200 ° C. or higher is not particularly limited, and examples thereof include chemical vapor deposition (CVD), reflow, and reactive ion etching (RIE).

Hereinafter, the present invention will be described in detail based on Examples, but the present invention is not limited to these Examples.

(1) Preparation of adhesive tape
(1-1) Example 1
(Preparation of resin)
A reactor equipped with a thermometer, a stirrer, and a cooling tube is prepared, and 85 parts by weight of 2-ethylhexyl acrylate as the (meth) acrylic acid alkyl ester and 10 parts by weight of hydroxyethyl methacrylate as the functional group-containing monomer are prepared in the reactor. , 5 parts by weight of acrylic acid, 0.01 part by weight of lauryl mercaptan, and 80 parts by weight of ethyl acetate were added. The reactor was heated to initiate reflux. Subsequently, 0.01 part by weight of 1,1-bis (t-hexylperoxy) -3,3,5-trimethylcyclohexane was added as a polymerization initiator into the reactor, and the polymerization was started under reflux. It was. Next, 1,1-bis (t) 1 hour and 2 hours after the start of polymerization
-Hexylperoxy) -3,3,5-trimethylcyclohexane was added in an amount of 0.01 part by weight, and then 0.05 part by weight of t-hexylperoxypivalate was added 4 hours after the start of the polymerization to carry out the polymerization reaction. Was continued. Then, 8 hours after the start of the polymerization, an ethyl acetate solution of a functional group-containing (meth) acrylic polymer having a solid content of 30% by weight and a weight average molecular weight of 900,000 was obtained.

(Making adhesive tape)
0.2 parts by weight of photopolymerization initiator (Esacure One, manufactured by Nihon Shibel Hegner) and 0 parts of cross-linking agent (Coronate L-45, manufactured by Toso) with respect to 100 parts by weight of the resin solid content of the obtained resin in ethyl acetate solution. .2 parts by weight, polyfunctional acrylate (manufactured by Negami Kogyo Co., Ltd., UN5500), 10 parts by weight, silicone compound (manufactured by Daicel Ornex, EBECRYL350), 20 parts by weight, and inorganic filler (manufactured by Tokuyama, MT-10) by 5 parts by weight In addition, it was mixed well to obtain a pressure-sensitive adhesive composition. The ethyl acetate solution of the obtained pressure-sensitive adhesive composition was placed on the release-treated surface of a polyethylene terephthalate film (cover film, thickness 50 μm) having a thickness of 50 μm and subjected to double-sided release treatment, and the thickness of the dry film was 100 μm. It was applied with a comma coater and dried at 110 ° C. for 5 minutes to form an adhesive layer. Next, a transparent polyethylene terephthalate film (base material) having a thickness of 50 μm and an adhesive layer were bonded together. Then, it was statically cured at 40 ° C. for 2 days to obtain an adhesive tape composed of a base material / adhesive layer / cover film.

As the polyethylene terephthalate film that has been mold-released on both sides, NS-50-C (single-sided mold release treatment, thickness: 50 μm) manufactured by Nakamoto Pax Co., Ltd. has a surface that has not been mold-released and the other surface. The one subjected to the same mold release treatment as above was used.

(1-2) Example 2
An adhesive tape (adhesive layer thickness 100 μm, total thickness of the base material and cover film 100 μm) was obtained in the same manner as in Example 1 except that the amount of the cross-linking agent used was 0.6 parts by weight.

(1-3) Example 3
An adhesive tape (adhesive layer thickness 100 μm, total thickness of the base material and cover film 100 μm) was obtained in the same manner as in Example 1 except that the amount of the cross-linking agent used was 2 parts by weight.

(1-4) Example 4
Adhesive tape (adhesive layer thickness 100 μm, base material and cover film) in the same manner as in Example 1 except that a cover film (NS-50-C manufactured by Nakamoto Pax Co., Ltd.) that has undergone single-sided release treatment is used. A total thickness of 100 μm) was obtained.

(1-5) Example 5
Adhesive tape (adhesive layer thickness 100 μm, base material and cover film) in the same manner as in Example 2 except that a cover film (NS-50-C manufactured by Nakamoto Pax Co., Ltd.) that has undergone single-sided release treatment is used. A total thickness of 100 μm) was obtained.

(1-6) Example 6
An adhesive tape (adhesive layer thickness 100 μm, total thickness of the base material and cover film 100 μm) was obtained in the same manner as in Examples except that the cover film subjected to the single-sided release treatment was used.

(1-7) Example 7
Adhesive tape (adhesive layer thickness 50 μm, total thickness of base material and cover film 150 μm) in the same manner as in Example 4 except that the thickness of the dry film is 50 μm and the thickness of the base material is 100 μm.
Got

(1-8) Example 8
An adhesive tape (adhesive layer thickness 50 μm, total thickness 150 μm of the base material and the cover film) was obtained in the same manner as in Example 3 except that the thickness of the dry film was 50 μm and the thickness of the base material was 100 μm.

(1-9) Example 9
An adhesive tape (adhesive layer thickness 50 μm, total thickness of the base material and the cover film 150 μm) was obtained in the same manner as in Example 4 except that the thickness of the dry film was 50 μm and the thickness of the base material was 100 μm.

(1-10) Example 10
An adhesive tape (adhesive layer thickness 50 μm, total thickness of the base material and cover film 150 μm) was obtained in the same manner as in Example 6 except that the thickness of the dry film was 50 μm and the thickness of the base material was 100 μm.

(1-11) Example 11
An adhesive tape (adhesive layer thickness 200 μm, total thickness 150 μm of the base material and the cover film) was obtained in the same manner as in Example 2 except that the thickness of the dry film was 200 μm and the thickness of the base material was 100 μm.

(1-12) Example 12
Adhesive tape (adhesive layer thickness 250 μm, base material and cover) is the same as in Example 3 except that the thickness of the dry film is 250 μm, the thickness of the base material is 125 μm, and the thickness of the cover film is 125 μm. The total thickness of the film was 250 μm).

(1-13) Example 13
Adhesive tape (adhesive layer thickness 300 μm, base material and cover film, except that the thickness of the dry film is 300 μm, the thickness of the base material is 125 μm, and the thickness of the cover film is 125 μm are the same as in Example 2. A total thickness of 250 μm) was obtained.

(1-14) Example 14
An adhesive tape (adhesive layer thickness 100 μm, total thickness of the base material and cover film 100 μm) was obtained in the same manner as in Example 1 except that the inorganic filler was made to 0 parts by weight.

(1-15) Example 15
An adhesive tape (tape width 100 mm, adhesive layer thickness 100 μm, total thickness of the base material and cover film 100 μm) was obtained in the same manner as in Example 1. Then, light irradiation was performed with a high-pressure mercury lamp so that the wavelength of 365 nm was 500 mJ / cm ² .

(1-16) Example 16
A base material (NS-50-C, manufactured by Nakamoto Pax Co., Ltd.) having a mold release treatment on the opposite surface to the pressure-sensitive adhesive layer was used, and the pressure-sensitive adhesive composition had a protruding portion length a of 60 μm. An adhesive tape (tape width 100 mm, adhesive layer thickness 100 μm, total thickness of the base material and cover film 100 μm) was obtained in the same manner as in Example 2 except that the ethyl acetate solution was applied.

(1-17) Example 17
Except for the fact that the surface opposite to the pressure-sensitive adhesive layer of the base material was coated (NK350: manufactured by Nippon Catalyst Co., Ltd.) and that the ethyl acetate solution of the pressure-sensitive adhesive composition was applied so that the protruding portion length a was 20 μm. An adhesive tape (tape width 100 mm, adhesive layer thickness 100 μm, total thickness of the base material and cover film 100 μm) was obtained in the same manner as in Example 2.

(1-18) Example 18
Adhesive tape (tape width 100 mm, adhesive layer) in the same manner as in Example 2 except that a base material (NS-50-MA, manufactured by Nakamoto Pax Co., Ltd.) having a mold release treatment on the opposite surface to the adhesive layer is used. A thickness of 100 μm and a total thickness of the base material and the cover film of 100 μm) were obtained.

(1-19) Comparative Example 1
An adhesive tape (tape width 100 mm, adhesive layer thickness 100 μm, total thickness of the base material and cover film 100 μm) was obtained in the same manner as in Example 1 except that the amount of the cross-linking agent used was 0.05 parts by weight.

(1-20) Comparative Example 2
0.2 parts by weight of photopolymerization initiator (Esacure One, manufactured by Nihon Shibel Hegner) and 0 parts of cross-linking agent (Coronate L-45, manufactured by Tosoh) with respect to 100 parts by weight of the resin solid content of the obtained resin in ethyl acetate solution. . Add 2 parts by weight, mix well, and apply an adhesive tape (adhesive layer thickness 100 μm, total thickness of substrate and cover film 100 μm) in the same manner as in Example 1 except that the pressure-sensitive adhesive composition was used. Obtained. Then, light was irradiated with a high-pressure mercury lamp so that the wavelength of 365 nm was 500 mJ / cm ² .

(1-21) Comparative Example 3
Adhesive tape (tape width 100 mm, adhesive layer thickness 100 μm, total thickness of base material and cover film 100 μm) in the same manner as in Example 1 except that the thickness of the base material is 12 μm and the thickness of the cover film is 12 μm. Got

(1-22) Comparative Example 4
Adhesive tape (tape width 100 mm, adhesive layer thickness 100 μm, total thickness of base material and cover film 24 μm) in the same manner as in Example 3 except that the thickness of the base material is 12 μm and the thickness of the cover film is 12 μm. Got

(1-23) Comparative Example 5
Adhesive tape (tape width 100 mm, adhesive layer thickness 100 μm, base material and cover) in the same manner as in Example 1 except that the thickness of the base material is 12 μm and the thickness of the one-sided stripped cover film is 12 μm. The total thickness of the film was 24 μm).

(1-24) Comparative Example 6
Adhesive tape (tape width 100 mm, adhesive layer thickness 100 μm, base material and cover) in the same manner as in Example 3 except that the thickness of the base material is 12 μm and the thickness of the one-sided stripped cover film is 12 μm. The total thickness of the film was 24 μm).

(2) Evaluation
(2-1) Measurement of storage elastic modulus The dynamic viscoelastic spectrum of the pressure-sensitive adhesive layer was measured by shear deformation using a dynamic viscoelasticity measuring device (DVA-200, manufactured by IT) under the condition of a measurement frequency of 10 Hz. The storage elastic modulus G'of the pressure-sensitive adhesive layer at 23 ° C. was determined.

(2-2) Gel fraction measurement Only 0.1 g of the adhesive layer was scraped off from the obtained adhesive tape, immersed in 50 ml of ethyl acetate, and shaken with a shaker at a temperature of 23 ° C. and 200 rpm for 24 hours. I'm sorry. After shaking, a metal mesh (opening # 200 mesh) was used to absorb ethyl acetate and ethyl acetate and separate the swollen pressure-sensitive adhesive layer. The adhesive layer after separation was dried under the condition of 110 ° C. for 1 hour. The weight of the pressure-sensitive adhesive layer containing the metal mesh after drying was measured, and the gel fraction was calculated using the following formula.

Gel fraction (% by weight) = 100 x (W _1- W ₂ ) / W ₀
(W ₀ : initial pressure-sensitive adhesive layer weight, W ₁ : pressure-sensitive adhesive layer weight including the dried metal mesh, W ₂ : initial weight of the metal mesh).

(2-3) Measurement of dynamic friction force coefficient With the precision universal testing machine Autograph AG-IS (SHIMADZU), the test speed is 100 mm / min, the total mass of the slip piece is 200 g (1.96 N), and the test piece size is 80 x 200 mm. The contact area between the slip piece and the test piece was 40 cm ^2, and the measurement was performed in an environment of 23 ° C. The average load from the start of the relative displacement motion between the contact surfaces to 60 mm was defined as the dynamic friction force.
Dynamic friction coefficient μ ₀ = (F ₀ ) / F _p
(Μ ₀ : dynamic friction coefficient, F ₀ : dynamic friction force (N), F _p : normal force generated by the mass of the slip piece (= 1.96 N)).

(2-4) Measurement of protruding portion length An adhesive tape was cut to prepare a 10 cm square sample. The sample was placed between two 10 cm square copper plates (thickness 1 mm), and a weight of 20 N was placed on the sample in the main surface direction via the copper plates and pressurized (pressurization of 2 kPa). In this state, it was left at 23 ° C. and 50% RH for 24 hours. After being left to stand, it was observed with an optical microscope in a pressurized state, and the length of the protruding portion of the pressure-sensitive adhesive layer protruding from the edge of the base material (see FIG. 1) was measured. The measurement was performed at the central portion of each side (each of the four sides), and the maximum value was taken as the protruding portion length of the adhesive layer.

(2-5) Evaluation of Blocking The adhesive tape was cut to prepare a 10 cm square sample. On a rigid plate, the two samples were superposed so that the cover film of one sample and the base material of the other sample faced each other. Another rigid plate was placed on top of it, a weight of 20 N was placed on it (pressurization of 2 kPa), and the plate was left at 23 ° C. and 50% RH for 24 hours. After being left to stand, the presence or absence and degree of stringing when the two samples were peeled off were visually observed, and blocking was evaluated according to the following criteria.
A: It peels off cleanly without pulling on the cut sample.
B: Slight pulling occurs when peeling the cut sample (glue does not transfer).
C: The sample is pulled and the glue adheres to the side surface of the tape (transfer of glue).

(2-6) Evaluation of Unwinding The adhesive tape was cut to prepare a sample having a width of 10 cm and a width of 50 cm. The sample was wound around a 3-inch ABS core with a deviation of less than 0.5 mm to obtain a roll of adhesive tape. The roll was dropped from a height of 30 cm with the sides sideways. For the roll after being dropped, the deviation of the winding position was measured, and the deviation was evaluated according to the following criteria.
A: The length of deviation is less than 1 mm.
B: The length of deviation is 1.0 mm or more and less than 1.5 mm.
C: The length of deviation is 1.5 or more and less than 2.0 mm.
D: The length of deviation is 2 mm or more.

The results are shown in Tables 1 and 2.

Claims (6)

A long adhesive tape containing a base material, an adhesive layer and a cover film, and having a laminated structure in which these are arranged in this order.
When the adhesive tape is pressed by 2 kPa from the main surface direction, the length of the protruding portion of the adhesive layer protruding from the edge of the base material is 20 μm or more.
The gel fraction of the pressure-sensitive adhesive layer is 30% or more, and the thickness of the pressure-sensitive adhesive layer is 1.3 or less with respect to the total thickness of the base material and the cover film.
Adhesive tape. The adhesive tape according to claim 1, wherein the coefficient of dynamic friction force between one surface of the adhesive tape and the other surface is 0.1 or more. The adhesive tape according to claim 1 or 2, wherein the storage elastic modulus G'at 23 ° C. of the pressure-sensitive adhesive layer is 5.0 × 10 ³ Pa or more and 2.0 × 10 ⁸ Pa or less. The adhesive tape according to any one of claims 1 to 3, wherein the width of the adhesive tape is 50 to 1000 mm. An adhesive tape roll composed of the adhesive tape according to any one of claims 1 to 4. Including the process of winding the adhesive tape in a roll
The adhesive tape is a long adhesive tape containing a base material, an adhesive layer, and a cover film, and having a laminated structure in which these are arranged in this order.
When the adhesive tape is pressed by 2 kPa from the main surface direction, the length of the adhesive layer protruding from the edge of the base material is 20 μm or more.
The gel fraction of the pressure-sensitive adhesive layer is 30% or more, and the thickness of the pressure-sensitive adhesive layer is 1.3 or less with respect to the total thickness of the base material and the cover film.
The method for producing an adhesive tape roll according to claim 5.