JP2020152820A - Resin composition for the production of resin mold and resin mold - Google Patents

Abstract

To provide a resin composition for the production of a resin mold that can provide a resin mold with new characteristics.SOLUTION: A resin composition for the production of a resin mold contains a curable resin, and a solid-phase phase transition material. The solid-phase phase transition material is, for example, a strongly-correlated electron system transition metal compound and can be, specifically, vanadium dioxide. The curable resin is, for example, a photocurable resin.SELECTED DRAWING: Figure 1

Description

The present invention relates to a resin composition for producing a resin mold and a resin mold.

In resin molding, a resin mold (hereinafter referred to as a resin mold) is used as a new molding mold in place of the metal mold. In recent years, in particular, with the development of 3D printers, it has become possible to design the resin mold into a fine structure, and the applications of resin molding using the resin mold are expanding.

However, in the resin molding using the resin mold, although the reason is unknown, there is a problem that it is difficult to release the resin molded product from the resin mold. Therefore, the surface of the resin mold needs to be treated, for example, by forming a coating film of a mold release agent (Patent Documents 1 and 2).

Republished patent WO2011 / 024700 Japanese Unexamined Patent Publication No. 2011-178155

Further, as a result of research, the present inventor has been able to design the resin mold to have a fine structure, but the resin molded product manufactured using the resin mold has dimensions different from those of the resin mold. It was found that the durability of the resin mold may be reduced by use.

Therefore, an object of the present invention is to provide a resin composition for producing a resin mold, which can provide a resin mold having new characteristics.

In order to achieve the above object, the resin composition for producing a resin mold of the present invention is characterized by containing a curable resin and a solid phase transition substance.

The resin mold of the present invention is characterized by containing a cured product of the resin composition for producing the resin mold of the present invention.

According to the resin composition for producing a resin mold of the present invention, for example, a resin mold that is not easily affected by heat can be produced. Therefore, for example, according to the present invention, a phenomenon that is considered to be caused by the influence of heat on the resin mold can be suppressed.

FIG. 1 is a graph showing the result of temperature rise of the resin plate in Example 1.

In the present invention, hereinafter, the "resin composition for manufacturing a resin mold" is also referred to as a "resin composition". Further, the "resin mold" is also referred to as a "molding mold" because it is a resin mold used for molding a resin, for example.

<Resin composition for resin mold manufacturing>
As described above, the resin composition for producing a resin mold of the present invention is characterized by containing a curable resin and a solid phase transition substance.

As a result of diligent research, the present inventor has found that the heating temperature of the resin to be molded, which is put into the resin mold, affects the characteristics of the resin mold. That is, in the resin molding using the resin mold, the resin to be molded is introduced into the resin mold in a state of being melted at a high temperature. Therefore, for example, the temperature of the resin mold rapidly rises due to the temperature of the introduced resin. It is also possible to heat the resin mold in advance, but for example, when the resin to be introduced is an engineering plastic or the like, the melting point is very high, so even if the resin mold is heated in advance, the resin mold can be heated. The temperature rises due to the introduction of the resin. Then, due to the temperature change of the resin mold due to the introduction of the resin, for example, the resin mold expands and the dimensional accuracy is lowered, the durability of the resin mold is lowered, or the resin mold is released from the resin mold. It was found that it would be difficult to release the resin molded product. Then, based on this finding, in addition to the curable resin, the resin composition for producing the resin mold contains a solid phase transition substance that causes a solid phase transition due to heat absorption, and such a resin composition. The present invention has been completed on the assumption that if a resin mold is produced by curing an object, the resin mold can suppress the influence of a temperature change due to the introduction of the resin as described above. As described above, according to the resin composition of the present invention, for example, a resin mold that is not easily affected by the introduction of a high-temperature resin can be produced. In particular, engineering plastics having a high melting point are used for electronic materials, structural materials for equipment, transportation materials, etc., but even in molding of the engineering plastics, the resin mold is not easily affected by temperature changes. , The resin composition of the present invention can be said to be extremely useful.

The resin composition of the present invention is characterized in that the curable resin contains the solid phase transition substance, and other conditions and configurations are not limited at all.

In the present invention, the "solid phase transition substance" is a substance that undergoes a primary phase transition in the solid phase state, and specifically, absorbs and absorbs heat equivalent to the transition enthalpy associated with the solid-solid phase transition. It is a substance to be released. Examples of the solid phase transition substance include strongly correlated electron-based substances. A "strongly correlated electron system" is a system in which at least one or more of the spin, orbit, and charge degrees of freedom of an electron are manifested due to a large electron-electron interaction. The manifested spin-orbit and charge degrees of freedom each exhibit a large entropy change with a change in the number of states due to the ordered-disordered phase transition. The product of the amount of change in entropy and the temperature at which the change occurs is the transition enthalpy. Examples of the strongly correlated electron system substance include transition metal compounds. Examples of the transition metal compound include vanadium compounds such as vanadium dioxide (VO ₂ ), V ₂ O ₃ , V ₄ O ₇ , and V ₆ O ₁₁ . Examples of the analog compound with respect to the vanadium compound include an analog compound in which a part of vanadium is replaced with another element, and specific examples thereof include V _(1-x) M _x O ₂ (M = Nb, Mo, Ru, Ta, W, Re, 0 ≤ x ≤ 0.2), complex compounds LiVO ₂ , LiVS _2, etc. can also be mentioned. In addition, for example, LiMn ₂ O ₄ , NaNiO ₂ , LiRh ₂ O ₄ , Ti ₄ O ₇ YAeFe ₂ O ₅ , LnAeFe ₂ O ₅ , YAeCo ₂ O _5.49 , LnAeCo ₂ O _{5.5 + δ} (Ln = lanthanoid element) , Ae = alkaline earth metal element, transition metal oxide ceramics such as -0.1 ≤ δ ≤ 0.1).

In the present invention, the type of the curable resin is not particularly limited as long as it can form a resin mold by curing. As the curable resin, for example, a curable resin other than thermoplastic is preferable, and a photocurable resin is particularly preferable. In the resin composition of the present invention, the curable resin means a state before curing.

The photocurable resin is a resin that can be cured by light irradiation, and the type thereof is not particularly limited. As the photocurable resin, for example, a liquid one may be used or a solid one may be used in the preparation of the resin composition. Examples of the photocurable resin include a photocurable epoxy resin and a photocurable acrylic resin. When the resin composition of the present invention contains the photocurable resin, for example, it may contain only the photocurable epoxy resin, it may contain only the photocurable acrylic resin, or the photocurable epoxy resin. And the photocurable acrylic resin may be contained, and other photocurable resins may be further contained. The photocurable resin preferably contains, for example, the photocurable acrylic resin. In the present invention, the acrylic resin is a general term for resins having at least one of an acryloyl group and a methacryloyl group, and includes both concepts.

The photocurable epoxy resin is not particularly limited, and examples of the monomer before curing include bisphenol A diglycidyl ether, bisphenol F diglycidyl ether, bisphenol S diglycidyl ether, brominated bisphenol A diglycidyl ether, and brominated bisphenol. F diglycidyl ether, brominated bisphenol S diglycidyl ether, epoxy novolac resin, hydrogenated bisphenol A diglycidyl ether, hydrogenated bisphenol F diglycidyl ether, hydrogenated bisphenol S diglycidyl ether, 3,4-epoxycyclohexylmethyl-3 ', 4'-epoxycyclohexylcarboxylate, 2- (3,4-epoxycyclohexyl-5,5-spiro-3,4-epoxy) cyclohexane-meth-dioxane, bis (3,4-epoxycyclohexylmethyl) adipate, Bis (3,4-epoxy-6-methylcyclohexylmethyl) adipate, 3,4-epoxy-6-methylcyclohexyl-3', 4'-epoxy-6'-methylcyclohexanecarboxylate, ε-caprolactone modified 3,4 -Epoxycyclohexylmethyl-3', 4'-epoxycyclohexanecarboxylate, trimethylcaprolactone modified 3,4-epoxycyclohexylmethyl-3', 4'-epoxycyclohexanecarboxylate, β-methyl-δ-valerolactone modified 3,4 -Epoxycyclohexylmethyl-3', 4'-epoxycyclohexanecarboxylate, methylenebis (3,4-epoxycyclohexane), di (3,4-epoxycyclohexylmethyl) ether, ethylenebis (3,4-epoxycyclohexanecarboxylate) , Epoxycyclohexahydrophthalate dioctyl, epoxycyclohexahydrophthalate di-2-ethylhexyl, 1,4-butanediol diglycidyl ether, 1,6-hexanediol diglycidyl ether, neopentyl glycol diglycidyl ether, tri Methylolpropan triglycidyl ether, polyethylene glycol diglycidyl ether, glycerin triglycidyl ether, polypropylene glycol diglycidyl ethers; aliphatic polyhydric alcohols such as ethylene glycol, propylene glycol and glycerin with one or more alkylene oxides. Polyether polyol epoxy obtained by addition Liglycidyl ethers; Diglycidyl esters of aliphatic long-chain dibasic acids; Monoglycidyl ethers of aliphatic higher alcohols; Monoglycidyl ethers of polyether alcohols obtained by adding phenol, cresol, butylphenol, or alkylene oxide. Examples thereof include epoxy-based monomers such as glycidyl esters of higher fatty acids. The photocurable epoxy resin is not limited to these examples, and known photocurable epoxy resins can be used. In the resin composition, when the photocurable resin contains the photocurable epoxy resin, for example, one type of the photocurable epoxy resin may be used alone, or two or more types may be used in combination. Alternatively, an oligomer or polymer obtained by polymerizing these may be used.

The photocurable acrylic resin is not particularly limited, and examples of the monomer before curing include isobornyl acrylate, isobornyl methacrylate, zincropentanyl acrylate, 2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate, and propylene glycol. Acrylate, diethylene glycol diacrylate, diethylene glycol dimethacrylate, triethylene glycol diacrylate, triethylene glycol dimethacrylate, polyethylene glycol diacrylate, 1,3-butylene glycol diacrylate, 1,3-butylene glycol dimethacrylate, 1,4-butane Didiol diacrylate, 1,4-butanediol dimethacrylate, tripropylene glycol diacrylate, tripropylene glycol dimethacrylate, polypropylene glycol diacrylate, 1,6-hexanediol diacrylate, 1,6-hexanediol dimethacrylate, neopentyl Glycol diacrylate, neopentyl glycol dimethacrylate, diethylene glycol diacrylate, bis (oxymethyl) tricyclo [5.2.1.02,6] decandiacrylate, bis (oxymethyl) tricyclo [5.2.1.102, 6] Decandymethacrylate, bis (oxymethyl) pentacyclo [6.5.1.13, 6.02, 7.09,13] pentadecanedimethacrylate, bis (oxymethyl) pentacyclo [6.5.1.13, 6.02, 7.09,13] Pentadecanedimethacrylate, 2,2-bis (4- (acrylicoxydiethoxy) phenyl) propane, 2,2-bis (4- (methacryloxydiethoxy) phenyl) propane, Tricyclo [5.2.1.02,6] decane-3,8-diyldimethyldiacrylate, tricyclo [5.2.1.02,6] decane-3,8-diyldimethyldimethacrylate, trimethylpropanthry Acrylate, Trimethylol Propane Trimethacrylate, Trimethylol Propaneethoxytriacrylate, Trimethylol Propaneethoxytrimethacrylate, Tetramethylolmethanetriacrylate, Tetramethylolmethanetrimethacrylate, Tetramethylolmethanetetraacrylate, Tetramethylolmethanetetramethacrylate, Pentaerythritol tri Acrylate, pentae Lithritol trimethacrylate, pentaerythritol tetraacrylate, pentaerythritol tetramethacrylate, ditrimethylolpropanetetraacrylate, ditrimethylolpropanetetramethacrylate, dipentaerythritol hexaacrylate, dipentaerythritol hexamethacrylate, tris (2-hydroxyethyl) isocyanate triacrylate, Examples thereof include tris (2-hydroxyethyl) isocyanurate trimethacrylate. The photocurable acrylic resin is not limited to these examples, and known photocurable acrylic resins can be used. When the photocurable resin contains the photocurable acrylic resin in the resin composition, for example, one type of the photocurable acrylic resin may be used alone, or two or more types may be used in combination. Alternatively, an oligomer or polymer obtained by polymerizing these may be used.

Examples of the oligomer or polymer obtained by polymerizing the monomer include urethane acrylate-based, epoxy acrylate-based, polyester acrylate-based, and acrylic acrylate-based.

Since the photocurable resin is a resin that is cured by light irradiation, the resin composition of the present invention may further contain, for example, a photopolymerization initiator when the photocurable resin is contained. The type of the photopolymerization initiator is not particularly limited, and is, for example, a compound that absorbs light to generate a polymerization initiator, and the polymerization initiator is, for example, a radical, a cation, or the like. Specific examples of the photopolymerization initiator are not particularly limited, and for example, carbonyl compounds such as aromatic ketones, acylphosphine oxide compounds, aromatic onium salt compounds, thio compounds, oxime ester compounds, alkylamine compounds, and onium salts. , Sulfonium salt, phosphonium salt, pyridinium salt and the like. The photopolymerization initiator is not limited to these examples, and known compounds can be used. As the photopolymerization initiator, for example, one type may be used alone, or two or more types may be used in combination. The type of the photopolymerization initiator is not particularly limited, and can be appropriately set depending on, for example, the type of the photocurable resin.

The resin composition of the present invention may further contain, for example, a thermal polymerization initiator. When the resin composition of the present invention contains the photocurable resin as the curable resin, and further contains the thermosetting initiator, for example, not only a curing reaction by light irradiation but also a curing reaction by heating It will be possible. Therefore, for example, when the resin composition of the present invention contains the photocurable resin and the thermal polymerization initiator, the resin mold produced by using the resin composition can be more sufficiently cured. Therefore, the tensile strength, elastic coefficient, etc. can be further improved.

The type of the thermal polymerization initiator is not particularly limited, and is, for example, a compound that produces a polymerization initiator by heat, and the polymerization initiator is, for example, a radical, a cation, or the like. Examples of the thermal polymerization initiator include thermal radical polymerization initiators and thermal cationic polymerization initiators. Examples of the thermal radical polymerization initiator include thermal decomposition type radical generators that decompose by heat to generate radicals. Examples of the thermal radical polymerization initiator include peroxides, azo compounds, triazine compounds having a trihalomethyl group, azide compounds, quinonediazide, triarylmonoalkylborate compounds and the like, and peroxides and azo compounds are preferable. Examples of the peroxide include benzoyl peroxide, tert-butyl peroxide and the like. Examples of the azo compound include azobisisobutyronitrile. Examples of the thermal cationic polymerization initiator include benzylsulfonium salt, thiophenium salt, thiolanium salt, benzylammonium, pyridinium salt, hydrazinium salt, carboxylic acid ester, sulfonic acid ester, amineimide and the like. The thermal polymerization initiator is not limited to these examples, and known compounds can be used. As the thermal polymerization initiator, for example, one type may be used alone, or two or more types may be used in combination.

The type of the thermosetting initiator is not particularly limited, and can be appropriately set depending on, for example, the type of the photocurable resin. As a specific example, the combination of the photocurable resin and the thermal polymerization initiator is, for example, a combination of the photocurable acrylic resin and the thermal radical polymerization initiator, the photocurable epoxy resin and the thermal cationic polymerization. Examples include a combination with an initiator.

The resin composition of the present invention is preferably in a liquid state because it is suitable for use in, for example, a 3D printer. Therefore, the resin composition of the present invention may contain, for example, a solvent, and the solvent may be, for example, a solvent contained in the curable resin to be used when the curable resin is in a liquid state. However, when the curable resin is in a solid state, a solvent added separately from the curable resin may be used. The type of the solvent is not particularly limited, and can be appropriately set depending on, for example, the type of the curable resin.

The resin composition of the present invention may further contain, for example, a filler. By including the filler, the resin composition of the present invention can further improve the strength, durability, rigidity, heat resistance, etc. of the resin mold of the present invention produced by using the resin composition, for example. The dimensional accuracy when manufacturing the resin mold by a 3D printer can be further improved. Examples of the filler include inorganic or organic fillers, and the form thereof is, for example, granular or fibrous. The granular filler may be, for example, mineral particles (eg, talc, mica, calcined siliceous soil, kaolin, sericite, bentonite, smectite, clay, silica, quartz powder, glass beads, glass powder, glass flakes, etc.). , Boron-containing compounds (eg, boron nitride, boron carbide, titanium boride, etc.), metal carbonates (eg, magnesium carbonate, heavy calcium carbonate, light calcium carbonate, etc.), metal silicates (eg, calcium silicate, aluminum silicate, etc.) , Magnesium silicate, magnesium aluminosilicate, etc.), metal oxides (eg, magnesium oxide, etc.), metal hydroxides (eg, aluminum hydroxide, calcium hydroxide, magnesium hydroxide, etc.), metal sulfates (eg, calcium sulfate). , Barium sulfate, etc.), metal carbides (for example, silicon carbide, aluminum carbide, titanium carbide, etc.), metal nitrides (for example, aluminum nitride, silicon nitride, titanium nitride, etc.), white carbon, various metal foils, and the like. The fibrous filler includes, for example, organic fibers (for example, natural fibers, papers, etc.), inorganic fibers (for example, glass fibers, asbestos fibers, silica fibers, silica / alumina fibers, wollastonite, zirconia fibers, titanium). (Potassium acid fiber, etc.), metal fiber, etc. can be mentioned. As the filler, for example, any one type may be used alone, or two or more types may be used in combination.

The resin composition of the present invention may contain, for example, various additives, if necessary. The additives include, for example, sensitizers, dispersants, antisettling agents, antifoaming agents, leveling agents, surfactants, light stabilizers, ultraviolet absorbers, near-infrared absorbers, antistatic agents, antioxidants, etc. Examples thereof include lubricants, solvents, plasticizers, mold release agents, polymerization inhibitors, pigments, and dyes.

In the resin composition of the present invention, the content of the solid phase transition substance is not particularly limited, and can be appropriately set, for example, according to the type and content of the curable resin. The lower limit of the content of the solid phase transition substance in the resin composition is, for example, 5% by mass or more and 10% by mass or more, and the upper limit is, for example, 70% by mass or less and 50% by mass or less. .. In the resin composition of the present invention, the lower limit of the ratio of the solid phase transition substance to the total mass of the curable resin and the solid phase transition substance is, for example, 5% by mass or more and 10% by mass or more. Yes, the upper limit is, for example, 70% by mass or less and 50% by mass or less.

When the resin composition of the present invention contains the photopolymerization initiator, the content of the photopolymerization initiator is not particularly limited and can be appropriately set according to, for example, the type and content of the photocurable resin. .. The lower limit of the content of the photopolymerization initiator in the resin composition is, for example, 0.1% by weight or more and 0.3% by weight or more, and the upper limit is, for example, 10% by weight or less and 3% by weight or more. It is as follows. The addition ratio of the photopolymerization initiator to the photocurable resin is not particularly limited, and can be appropriately set according to, for example, the type of the photocurable resin.

When the resin composition of the present invention contains the thermal polymerization initiator, the content of the thermal polymerization initiator is not particularly limited, and is appropriately set according to, for example, the type and content of the photocurable resin. it can. The lower limit of the content of the thermal polymerization initiator in the resin composition is, for example, 0.1% by weight or more and 0.3% by weight or more, and the upper limit is, for example, 10% by weight or less and 3% by weight or more. It is as follows. The ratio of the thermal polymerization initiator added to the photocurable resin is not particularly limited.

As described above, the resin composition of the present invention is suitable for use in a 3D printer. When the resin composition of the present invention is used for a 3D printer, its viscosity is, for example, 10,000 mPa · s or less and 5000 mPa · s or less.

The method for preparing the resin composition of the present invention is not particularly limited, and can be prepared, for example, by mixing each component simultaneously or separately. When the curable resin is in a liquid state, for example, the solid phase transition substance and optional components (for example, the thermal polymerization initiator, the photopolymerization initiator, other components, etc.) are mixed with the curable resin. This makes it possible to prepare the resin composition.

As described above, the resin composition of the present invention is suitable for use in, for example, a 3D printer, but is not limited thereto, and can be used in other molding methods for producing a resin mold.

<Resin type>
As described above, the resin mold of the present invention is characterized by containing a cured product of the resin composition for producing the resin mold of the present invention. Since the resin mold of the present invention contains a cured product obtained by curing the resin composition of the present invention, it is not easily affected by temperature changes even when a resin having a high melting point such as super engineering plastic is introduced. Therefore, according to the resin mold of the present invention, for example, it is possible to prevent a decrease in the dimensional accuracy to be set, a decrease in durability due to use in manufacturing the resin molded body, and the resin mold of the molded resin molded body. It is also easy to release from the mold.

The method for producing the resin mold of the present invention is not particularly limited, and the resin composition of the present invention may be used. For example, a curing method according to the type of the curable resin contained in the resin composition may be used. The resin composition may be cured into a desired resin mold shape.

The method for producing a resin mold using the resin composition of the present invention is not particularly limited, and for example, a curing treatment may be performed according to the type of the curable resin.

When the curable resin is the photocurable resin, for example, a 3D printer that utilizes light irradiation can be used. The method of the 3D printer is not particularly limited, and examples thereof include a stereolithography method and an inkjet method.

The conditions for light irradiation are not particularly limited, and can be appropriately determined, for example, depending on the type of the photocurable resin. The type of light to be irradiated with the light is not particularly limited, and is, for example, ultraviolet rays, visible light, and the like. The wavelength of ultraviolet or visible light is preferably 300 to 500 nm. Examples of the light source of ultraviolet rays or visible rays include a semiconductor-pumped solid-state laser, a carbon arc lamp, a mercury lamp, a metal halide lamp, a xenon lamp, a chemical lamp, and a white LED. From the viewpoint of molding accuracy and curability, for example, The use of a laser is preferred. The light irradiation may be, for example, surface irradiation by a projector or irradiation by scanning a laser.

The resin mold of the present invention is used for molding various resins, and is particularly suitable for use in molding of the super engineering plastic for the reasons described above. The superempura is, for example, PEEK (polyetheretherketone), PPS (polyphenylene sulfide), PSU (polysulfone), PES (polyethersulfone), polyarylate resin, liquid crystal polymer, aromatic polyester resin, PI (polyimide). , PAI (polyamideimide), PEI (polyetherimide), aramid resin and the like.

The resin mold of the present invention can also be used for molding engineering plastics (engineering plastics). Examples of the empra include polyester resins such as PC (polycarbonate); POM (polyacetal); PET (polyethylene terephthalate), PBT (polybutylene terephthalate), PCT (polycyclohexylene methyl terephthalate); PPE (polyphenylene ether); polyphenylene. Oxide; polyamide resin such as PA6 (nylon 6), PA66 (nylon 66), aromatic polyamide; syndiotactic polystyrene; ultrahigh molecular weight polyethylene and the like.

The method for producing a resin molded product using the resin mold of the present invention is not particularly limited. The resin molded product can be manufactured, for example, as follows. First, the resin mold is heated in advance. The heating temperature can be set, for example, according to the temperature of the resin to be molded to be introduced into the resin mold. Then, the resin to be molded is heated to melt it, and the resin is introduced into the heated resin mold. The temperature of the resin to be molded is not particularly limited and can be appropriately set according to the melting temperature thereof. Then, for example, by cooling the resin to be molded introduced into the resin mold, a molded product can be molded in the resin mold. After the molded body is solidified in the resin mold, the molded body may be released from the resin mold.

As described above, the heating temperature of the resin mold of the present invention is not particularly limited, but the lower limit thereof is, for example, 25 ° C. and 30 ° C., and the upper limit thereof is, for example, 250 ° C. and 200 ° C. The temperature of the resin to be molded to be introduced into the resin mold of the present invention is not particularly limited, but the lower limit thereof is, for example, 100 ° C. and 120 ° C., and the upper limit thereof is, for example, 450 ° C. and 400 ° C. is there.

[Example 1]
A resin plate was produced using the resin composition for producing a resin mold of the present invention, and the properties of the resin plate were confirmed.

As the curable resin, a photocurable acrylic resin (trade name: HighTemp, manufactured by Formlabs) was used. The acrylic resin is a liquid resin containing a photoradical polymerization initiator. As the solid phase transition material, powdered vanadium dioxide (manufactured by Sigma-Aldrich) was used. Then, the acrylic resin and the solid phase transition substance were mixed so as to have a weight ratio of 80:20 to obtain the resin composition of Example 1. On the other hand, only the same acrylic resin was used as the resin composition of Comparative Example 1 except that the solid phase transition substance was not added.

Using each of the resin compositions, two resin plates of the example and two resin plates of the comparative example were prepared as follows. The liquid resin composition was applied onto a glass plate so as to have a thickness of 1 mm. Then, the coated material on the glass plate was irradiated with light from a high-pressure mercury lamp (UV-800, ORC Manufacturing Co., Ltd.) to cure the resin of the resin composition to obtain a resin plate. The size of the resin plate was 10 cm in length × 10 cm in width × 1 mm in thickness.

Each of the resin plates was placed on a hot plate heated to 120 ° C., and the surface temperature of the resin plate was confirmed over time. The surface temperature of the resin plate was measured by photographing the resin plate on the hot plate from above the hot plate using infrared thermography (FLIR C3) and reading the temperature from the image. These results are shown in FIG. FIG. 1 shows the results of the average temperatures of the resin plates of Examples and the resin plates of Comparative Examples, where the X-axis shows time and the Y-axis shows temperature.

As shown in FIG. 1, the resin plate of the example containing vanadium dioxide was able to maintain a lower temperature at all times than the resin plate of the comparative example containing no vanadium dioxide. From this, it can be said that a resin composition containing a solid phase transition substance such as vanadium dioxide can produce a resin mold in which the influence of heating is suppressed. According to the resin mold in which the influence of heating is suppressed, for example, it can be said that the decrease in dimensional accuracy is suppressed, the decrease in durability is suppressed, and the releasability is also improved.

Although the present invention has been described above with reference to the embodiments and examples, the present invention can be modified in various ways that can be understood by those skilled in the art within the scope of the above invention. In addition, all the contents described in documents such as patent documents and academic documents cited in this specification shall be incorporated into this specification by citation.

According to the resin composition for producing a resin mold of the present invention, for example, a resin mold that is not easily affected by heat can be produced. Therefore, for example, according to the present invention, a phenomenon that is considered to be caused by the influence of heat on the resin mold can be suppressed.

Claims (8)

A resin composition for producing a resin mold, which comprises a curable resin and a solid phase transition substance. The resin composition for producing a resin mold according to claim 1, wherein the solid phase transition substance is a strongly correlated electron-based transition metal compound. The resin composition for producing a resin mold according to claim 1 or 2, wherein the solid phase transition substance is vanadium dioxide. The resin composition for manufacturing a resin mold according to any one of claims 1 to 3, wherein the curable resin is a photocurable resin. The resin composition for manufacturing a resin mold according to claim 4, wherein the photocurable resin is a photocurable acrylic resin. The resin composition for producing a resin mold according to claim 4 or 5, further comprising a photopolymerization initiator. The resin mold production according to any one of claims 1 to 6, wherein the ratio of the solid phase transition substance to the total mass of the curable resin and the solid phase transition substance is 5 to 70% by mass. Resin composition for. A resin mold comprising a cured product of the resin composition for producing a resin mold according to any one of claims 1 to 7.