JP2020147715A - Polymer for melt molding, resin composition for melt molding, resin molded product, and method for producing polymer for melt molding and resin molded product - Google Patents

Abstract

To provide a polymer for melt molding and a resin composition for melt molding each excellent in melt moldability and to provide a resin molded product excellent in transparency, scratch resistance and heat resistance.SOLUTION: The polymer for melt molding includes 70 to 97 mol% of (A) a methyl (meth)acrylate unit and 3 to 30 mol% of (B) a vinyl compound monomer unit having an alkoxysilyl group in the side chain. The resin composition for melt molding includes the polymer for melt molding. The resin molded product having a gel fraction of 1.0 mass% or more is produced by subjecting a resin molded body precursor produced by melt molding the polymer for melt molding or the resin composition for melt molding to crosslinking treatment. The method for producing a polymer for melt molding is a production method of the polymer for melt molding which includes the unit (A) and the unit (B) and includes a step of polymerizing a monomer composition containing 70 to 97 mol% of methyl (meth)acrylate and 3 to 30 mol% of a vinyl compound having an alkoxysilyl group in the side chain.SELECTED DRAWING: None

Description

The present invention relates to a polymer for melt molding, a resin composition for melt molding and a resin molded product, and a method for producing a polymer for melt molding and a resin molded product.

Acrylic resins are widely used in various fields such as optical materials, vehicle parts, lighting materials, and building materials because of their excellent transparency and dimensional stability. Recently, it is being used for vehicle members such as interior and exterior materials of vehicles, especially for vehicle lamp covers.

In the above applications, in terms of design, it is required to be transparent and have a low presence when viewed from the viewer, and therefore an acrylic resin having excellent transparency is required.

Further, in applications such as vehicle members and building materials, the product may be scratched by contact with people or objects, so an acrylic resin having excellent scratch resistance is required.

Furthermore, in recent years, the use of acrylic resin in high-temperature environments and outdoors has been studied for applications of vehicle components, especially lamp covers such as tail lamps and headlamps, and acrylic resin with excellent heat resistance is required. Has been done.

A method of introducing a crosslinked structure into an acrylic resin is known in order to improve scratch resistance and heat resistance. However, when a crosslinked structure is introduced into an acrylic resin, there is a problem that melt moldability such as extrusion molding and injection molding is impaired. That is, there is a demand for an acrylic resin that can be melt-molded and has excellent scratch resistance.

In order to improve the heat resistance of the obtained resin molded product while maintaining the transparency of the acrylic resin, for example, Patent Document 1 states that a vinyl compound and a polymerizable silane compound having a hydrolyzing group are not crosslinked. The copolymer is processed (molded) to obtain a desired molded product, and the molded product is post-treated with an acidic or alkaline aqueous solution to crosslink the copolymer in the molded product to obtain a crosslinked polymer molded product. The technology is disclosed.

Japanese Unexamined Patent Publication No. 6-340746

In the technique disclosed in Patent Document 1, since only a small amount of vinyl compound monomer having an alkoxysilyl group in the side chain is introduced into the uncrosslinked copolymer, the resin molded product of the obtained crosslinked polymer is obtained. , The crosslink density was insufficient, and the scratch resistance was inferior. Further, it is necessary to carry out a cross-linking treatment of the resin molded product in strong acid or strong base water, and the transparency of the treated resin molded product is inferior. That is, transparency, scratch resistance, heat resistance and melt moldability could not be achieved at the same time.

An object of the present invention is to solve these problems. That is, an object of the present invention is to provide a melt-molding polymer and a melt-molding resin composition having excellent melt-molding properties, and a resin molded body having excellent transparency, scratch resistance, and heat resistance. ..

The present invention has the following configurations.
The first gist of the present invention is a polymer for melt molding containing a repeating unit (A) derived from methyl (meth) acrylate and a repeating unit (B) derived from a vinyl compound monomer having an alkoxysilyl group in the side chain. Therefore, the unit (A) is 70 mol% or more and 97 mol% or less, and the unit is based on 100 mol% of the total number of moles of the monomer units constituting the melt-molded polymer. It is in a polymer for melt molding containing (B) in an amount of 3 mol% or more and 30 mol% or less.
The second gist of the present invention is a melt molding resin composition containing the melt molding polymer, wherein the melt molding resin composition is 100% by mass of the total mass of the melt molding resin composition. On the other hand, the resin composition for melt molding contains the polymer for melt molding in an amount of 1% by mass or more and less than 100% by mass.
A third gist of the present invention is a resin molded product obtained by cross-linking a resin molded product precursor obtained by melt-molding the melt-molded polymer or the melt-molded resin composition. A resin molded product of a resin molded product has a gel content of 1.0% by mass or more with respect to 100% by mass of the total mass of the resin molded product.
The fourth gist of the present invention is a polymer for melt molding containing a repeating unit (A) derived from methyl (meth) acrylate and a repeating unit (B) derived from a vinyl compound monomer having an alkoxysilyl group in the side chain. The production method includes a step of polymerizing a monomer composition containing 70 mol% or more and 97 mol% or less of methyl (meth) acrylate and 3 mol% or more and 30 mol% or less of a vinyl compound having an alkoxysilyl group in the side chain. It is in the method of producing a polymer for melt molding.
A fifth gist of the present invention includes a step of melt-molding the polymer for melt molding obtained by the above-mentioned production method to obtain a resin molded product precursor, and a step of cross-linking the resin molded product precursor. , A method for manufacturing a resin molded product.

According to the present invention, it is possible to stably provide a melt-molding polymer and a melt-molding resin composition having excellent melt-molding properties.
The resin composition for melt molding of the present invention has excellent melt fluidity and can be applied to injection molding, extrusion molding, pressure molding (press molding), pressure molding and vacuum molding.
Further, the melt-molded polymer and the resin molded product obtained by molding the melt-molded resin assembly are excellent in transparency, scratch resistance and heat resistance.

In the present invention, "(meth) acrylate" means at least one selected from "acrylate" and "methacrylic acid", and "(meth) acrylic acid" is selected from "acrylic acid" and "methacrylic acid". Means at least one species.
In the present invention, the "monomer" means an unpolymerized compound, and the "repeating unit" means a unit derived from the monomer formed by polymerizing the monomer. The repeating unit may be a unit directly formed by a polymerization reaction, or a unit in which a part of the unit is converted into another structure by processing a polymer.
Unless otherwise specified, "% by mass" indicates the content of a specific component contained in 100% by mass of the total amount.
Unless otherwise specified, the numerical range represented by using "-" in the present specification means a range including the numerical values before and after "-" as the lower limit value and the upper limit value, and is "AB". Means that it is A or more and B or less.

<Definition of terms>
In the present specification, the resin composition for melt molding means a resin composition containing the polymer for melt molding of the present invention. Details of the resin composition for melt molding will be described later.
In the present specification, the resin molded product is a resin molded product obtained by molding the polymer for melt molding of the present invention or the resin composition for melt molding of the present invention by using the production method of the present invention described later (hereinafter referred to as a resin molded product). , "The obtained resin molded product"). Details of the resin molded product will be described later.

<Polymer for melt molding>
The polymer for melt molding of the present invention can be subjected to known melt molding methods such as extrusion molding method, injection molding method, pressure molding method (press molding), pressure molding method and vacuum molding method. It is a polymer for.
The polymer for melt molding of the present invention is a vinyl compound having a repeating unit (A) derived from methyl (meth) acrylate described later (hereinafter referred to as “unit (A)”) and an alkoxysilyl group described later in the side chain. It is a polymer containing a repeating unit (B) derived from a monomer (hereinafter, referred to as “unit (B)”).
The polymer for melt molding in the present invention is a repeating unit (A) derived from methyl (meth) acrylate with respect to a total number of moles of 100 mol% of the monomer units constituting the polymer for melt molding (hereinafter, "unit"). (A) ”) is a repeating unit (B) derived from a vinyl compound monomer having 70 mol% or more and 97 mol% or less and an alkoxysilyl group in the side chain (hereinafter referred to as“ unit (B) ”). It is a polymer containing 3 mol% or more and 30 mol%.

When the melt-molded polymer contains the unit (A), the melt-moldability of the melt-molded polymer and the melt-molded resin composition and the transparency of the obtained resin molded product are improved.
The lower limit of the content ratio of the unit (A) in the polymer for melt molding is that the polymer for melt molding is used from the viewpoint of excellent melt moldability of the resin composition and transparency of the obtained resin molded product. The total number of moles of the constituent monomer units is 70 mol% or more with respect to 100 mol%. 80 mol% or more is preferable. On the other hand, the upper limit of the content ratio of the unit (A) in the polymer for melt molding is 97 mol% or less from the viewpoint of maintaining good scratch resistance and heat resistance of the obtained resin molded product. 95 mol% or less is preferable, and 90 mol% or less is more preferable.

When the melt molding polymer contains the unit (B), the melt moldability of the resin composition and the scratch resistance and heat resistance of the obtained resin molded body are improved.
The lower limit of the content ratio of the unit (B) in the melt molding polymer is a monomer constituting the melt molding polymer from the viewpoint of excellent scratch resistance and heat resistance of the obtained resin molded product. It is 3 mol% or more with respect to 100 mol% of the total number of moles of a unit. 5 mol% or more is more preferable, and 10 mol% or more is further preferable. On the other hand, the upper limit of the content ratio of the unit (B) constitutes the polymer for melt molding from the viewpoint of maintaining good melt moldability of the resin composition and transparency of the obtained resin molded product. It is 30 mol% or less with respect to the total number of moles of the polymer unit of 100 mol%. 20 mol% or less is more preferable.

The methyl (meth) acrylate constituting the unit (A) is at least one selected from methyl methacrylate or methyl acrylate.

The polymer for melt molding of the present invention may contain a repeating unit (B1) derived from alkoxysilyl (meth) acrylate (hereinafter, referred to as “unit (B1)”) as the unit (B).
By including the unit (B1), the melt moldability of the resin composition for melt molding and the scratch resistance and heat resistance of the obtained resin molded product can be further improved.
The lower limit of the content ratio of the unit (B1) contained in the unit (B) can make the melt moldability of the resin composition for melt molding and the scratch resistance and heat resistance of the obtained resin molded product more excellent. From the viewpoint, 51 mol% or more is preferable, and 90 mol% or more is more preferable with respect to 100 mol% of the total number of moles of the unit (B). On the other hand, the upper limit of the content ratio of the unit (B1) contained in the polymer for melt molding is a viewpoint that the melt moldability of the resin composition for melt molding and the transparency of the obtained resin molded product can be better maintained. Therefore, the unit (B1) can be 100 mol% (unit (B1) alone) or less than 100 mol% with respect to the total number of moles of the unit (B) of 100 mol%.

Examples of the unit (B) and the monomer constituting the unit (B1) include trimethoxysilylvinyl, triethoxylylvinyl, methyldimethoxysilylvinyl, methyldiethoxysilylvinyl, ethyldiethoxysilylvinyl and dimethylmethoxysy. Ekoxysilylvinyl compounds such as silylvinyl, dimethylethoxysilylvinyl, diethylmethoxysilylvinyl, diethylethoxysilylvinyl, or trimethoxysilylpropyl (meth) acrylate, triethoxysilylpropyl (meth) acrylate, methyldimethoxycyclylyl. Propyl (meth) acrylate, methyldiethoxysilylpropyl (meth) acrylate, ethyldiethoxysilylpropyl (meth) acrylate, tripropoxysilylpropyl (meth) acrylate, tributoxysilylpropyl (meth) acrylate, methyldipropoxysilylpropyl (meth) Meta) acrylate, methyldibutoxysilylpropyl (meth) acrylate, dimethylethoxysilylpropyl (meth) acrylate, dimethylmethoxysilylpropyl (meth) acrylate, dimethylpropoxysilylpropyl (meth) acrylate, dimethylbutoxysilylpropyl (meth) acrylate, etc. Examples thereof include alkoxysilyl (meth) acrylate-based compounds. One of these other monomers may be used alone, or two or more thereof may be used in combination.

Further, in the polymer for melt molding of the present invention, the unit (B1) is referred to as a repeating unit (B2) derived from a monomer represented by the following general formula (1) (hereinafter, referred to as "unit (B2)". ) Can be.
By including the unit (B2), the melt moldability of the resin composition and the scratch resistance and heat resistance of the obtained resin molded product can be further improved.
(1)
[In formula (1), X represents H or CH ₃ . a is an integer of 0 to 10, m is an integer of 1 to 10, n is an integer of 0 to 10, p is an integer of 1 to 3, and q is an integer of 0 to 2. ]

Examples of the monomer constituting the unit (B2) include triethoxysilylpropyl (meth) acrylate, methyldiethoxysilylpropyl (meth) acrylate, ethyldiethoxysilylpropyl (meth) acrylate, and tripropoxysilylpropyl (meth). Acrylate, tributoxysilylpropyl (meth) acrylate, methyldipropoxysilylpropyl (meth) acrylate, methyldibutoxysilylpropyl (meth) acrylate, dimethylethoxysilylpropyl (meth) acrylate, dimethylpropoxysilylpropyl (meth) acrylate, dimethyl Butoxysilylpropyl (meth) acrylate can be mentioned. One of these other monomers may be used alone, or two or more thereof may be used in combination.
Among the monomers constituting the above unit (B2), the melt moldability of the resin composition, the scratch resistance and heat resistance of the obtained resin molded product, and the availability and stability during melt kneading. From the viewpoint, triethoxysilylpropyl methacrylate (in the above formula (1), X is CH ₃ , a = 3, m = 1, p = 3, q = 0), ethyldiethoxysilylpropyl methacrylate (in the above formula (1)). In X, CH ₃ , a = 3, m = 1, n = 1, p = 2, q = 1) is preferable, and triethoxysilylpropyl methacrylate is more preferable.

The polymer for melt molding contains, if necessary, a structural unit derived from another monomer described later (hereinafter, referred to as "another monomer unit") within a range that does not impair the effects of the present invention. can do. The content ratio of the other monomer unit is not particularly limited as long as the effect of the present invention is not impaired. When it contains other monomer units, it is usually 10 mol% or less with respect to 100 mol% of the total number of moles of the monomer units constituting the melt molding polymer.

The other monomer is not particularly limited as long as it is a monomer copolymerizable with the methyl (meth) acrylate and the vinyl compound monomer having an alkoxysilyl group in the side chain, for example, for example. , The following a) to f) can be mentioned.

a) Ethyl (meth) acrylate, n-butyl (meth) acrylate, isobutyl (meth) acrylate, hexyl (meth) acrylate, heptyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, (meth) ) N-octyl acrylate, n-nonyl (meth) acrylate, isononyl (meth) acrylate, decyl (meth) acrylate, undecyl (meth) acrylate, n-amyl (meth) acrylate, (meth) acrylic Isoamyl acid, lauryl (meth) acrylate, benzyl (meth) acrylate, phenyl (meth) acrylate, cyclohexyl (meth) acrylate, methoxyethyl (meth) acrylate, ethoxyethyl (meth) acrylate, (meth) A (meth) acrylic acid ester monomer other than methyl methacrylate, such as 2-naphthyl acrylate and phenoxymethyl (meth) acrylate.
Among these, alkyl acrylate having 1 to 8 carbon atoms in the alkyl group portion is preferable.
b) Styrene, α-methylstyrene, o-methylstyrene, p-methylstyrene, o-ethylstyrene, p-ethylstyrene, o-chlorostyrene, p-chlorostyrene, p-methoxystyrene, p-acetoxystyrene, α -Aromatic vinyl compounds such as vinylnaphthalene and 2-vinylstyrene.
c) Unsaturated nitrile compounds such as acrylonitrile, α-chloroacrylonitrile, α-methoxyacrylonitrile, methacrylonitrile, and vinylidene cyanide.
d) Ethyl unsaturated ether compounds such as methyl vinyl ether, ethyl vinyl ether, n-propyl vinyl ether, isopropyl vinyl ether, methyl allyl ether and ethyl allyl ether.
e) Vinyl halide compounds such as vinyl chloride, vinylidene chloride, 1,2-dichloroethylene, vinyl bromide, vinylidene bromide, and 1,2-dibromoethylene.
f) 1,3-butadiene, 2-methyl-1,3-butadiene, 2,3-dimethyl-1,3-butadiene, 2-neopentyl-1,3-butadiene, 2-chloro-1,3-butadiene, 1,2 dichloro-1,3-butadiene, 2,3-dichloro-1,3-butadiene, 2-bromo-1,3-butadiene, 2-cyano-1,3-butadiene, substituted linear conjugated pentadienes, An aliphatic conjugated diene compound such as linear and side chain conjugated hexadiene.
One of these other monomers may be used alone, or two or more thereof may be used in combination.

The lower limit of the mass average molecular weight of the polymer for melt molding is preferably 30,000 or more, more preferably 50,000 or more, still more preferably 70,000 or more, from the viewpoint of excellent mechanical properties of the obtained resin molded product. .. On the other hand, the upper limit of the mass average molecular weight is preferably 180,000 or less, more preferably 150,000 or less, and 130,000 or less from the viewpoint of excellent melt fluidity of the melt molding polymer and the melt molding resin composition. More preferred.
In the present specification, the mass average molecular weight is a value measured by using standard polymethylmethacrylate as a standard sample and gel permeation chromatography.

<Resin composition for melt molding>
The resin composition for melt molding of the present invention can be subjected to known melt molding methods such as extrusion molding method, injection molding method, pressure molding method (press molding), pressure molding method and vacuum molding method. It is a resin composition for molding.
The resin composition for melt molding of the present invention is a resin composition for melt molding containing the above-mentioned polymer for melt molding.
By containing the melt-molding polymer, the resin composition for melt molding of the present invention has good melt moldability, and further, the scratch resistance and heat resistance of the obtained resin molded product are good.
The melt-molded resin composition of the present invention contains the melt-molded polymer in an amount of 1% by mass or more and less than 100% by mass with respect to 100% by mass of the total mass of the melt-molded resin composition.

The content ratio of the melt molding polymer contained in the melt molding resin composition is the melt moldability required for the melt molding resin composition and the transparency required for the obtained resin molded body. , A person skilled in the art may appropriately set the heat resistance and the scratch resistance.
For example, in the melt-molding resin composition in which the melt-molding polymer of the present invention and the (meth) acrylic resin are used in combination, the melt-molding is performed with respect to 100% by mass of the total mass of the melt-molding resin composition. A (meth) acrylic resin containing 1% by mass or more and 50% by mass or less of the polymer and 80 mol% or more of the repeating unit derived from methyl methacrylate can be contained in an amount of 50% by mass or more and 99% by mass or less.

<Manufacturing method of polymer for melt molding>
The polymer for melt molding in the present invention is a monomer containing a methyl (meth) acrylate (hereinafter referred to as "monomer (A)") and a vinyl compound having an alkoxysilyl group in the side chain (hereinafter, "monomer (A)"). It is obtained by polymerizing a monomer composition containing "monomer (B)").

As the monomer (A), the same monomer as the monomer constituting the unit (A) described in the column of the polymer for melt molding described above can be used.

As the monomer (B), the same monomer as the monomer constituting the unit (B) described in the column of the polymer for melt molding described above can be used.

The monomer composition can contain an alkoxysilyl (meth) acrylate (hereinafter, referred to as "monomer (B1)") as the monomer (B).
By containing the monomer (B1), the melt moldability of the resin composition for melt molding and the scratch resistance and heat resistance of the obtained resin molded product can be further improved.
As the monomer (B1), the same monomer as the monomer constituting the unit (B1) described in the column of the polymer for melt molding described above can be used.

Further, in the monomer composition, the monomer (B1) is referred to as a monomer (B2) represented by the following general formula (2) (hereinafter, referred to as "monomer (B2)"). can do.
By containing the monomer (B2), the melt moldability of the resin composition and the scratch resistance and heat resistance of the obtained resin molded product can be further improved.
(2)
[In formula (2), X represents H or CH ₃ . a is an integer of 0 to 10, m is an integer of 1 to 10, n is an integer of 0 to 10, p is an integer of 1 to 3, and q is an integer of 0 to 2. ]
As the monomer (B2), the same monomer as the monomer constituting the unit (B2) described in the column of the polymer for melt molding described above can be used.

The lower limit of the content ratio of the monomer (A) contained in the monomer composition is the monomer from the viewpoint of excellent melt moldability of the resin composition and transparency of the obtained resin molded product. The total number of moles of the monomers constituting the composition is 70 mol% or more with respect to 100 mol%. 80 mol% or more is more preferable. On the other hand, the upper limit of the content ratio of the monomer (A) is the total amount of the monomers constituting the monomer composition from the viewpoint of maintaining good scratch resistance and heat resistance of the obtained resin molded product. It is 97 mol% or less with respect to 100 mol% of the number of moles. 95 mol% or less is more preferable, and 90 mol% or less is further preferable.

Further, the lower limit of the content ratio of the monomer (B) contained in the monomer composition is the composition of the monomer composition from the viewpoint of excellent scratch resistance and heat resistance of the obtained resin molded product. It is 3 mol% or more with respect to 100 mol% of the total number of moles of the monomer. 5 mol% or more is more preferable, and 10 mol% or more is further preferable. On the other hand, the upper limit of the content ratio of the monomer (B) is the upper limit of the content ratio of the monomer (B) of the monomer constituting the monomer composition from the viewpoint of excellent melt moldability of the resin composition and transparency of the obtained resin molded product. It is 30 mol% or less with respect to the total number of moles of 100 mol%. 20 mol% or less is more preferable.

Examples of the polymerization method of the monomer composition include bulk polymerization, suspension polymerization, emulsion polymerization, solution polymerization and the like. Among these polymerization methods, bulk polymerization or suspension polymerization is preferable, and suspension polymerization is more preferable, from the viewpoint that the polymer for melt molding after polymerization can be easily recovered and the obtained resin composition is excellent in transparency. ..
The polymerization temperature, the type of the polymerization initiator, and the amount of the polymerization initiator added in the polymerization of the monomer composition may be appropriately set according to the polymerization method used and the polymer for melt molding to be obtained.

A chain transfer agent may be used when polymerizing the monomer composition in order to adjust the mass average molecular weight of the resin composition. Examples of the chain transfer agent include known mercaptan compounds, α-methylstyrene dimers, and known terpinolene compounds. One of these chain transfer agents may be used alone, or two or more thereof may be used in combination.

The amount of the chain transfer agent used is preferably 0.05 parts by mass or more and 2 parts by mass or less, and more preferably 0.07 parts by mass or more and 1.5 parts by mass or less with respect to 100 parts by mass of the monomer raw material. When the amount of the chain transfer agent used is 0.05 parts by mass or more, the melt fluidity of the resin composition is excellent. Further, when the amount of the chain transfer agent used is 1.5 parts by mass or less, the mechanical strength of the resin composition and the obtained resin molded product is excellent.

When the resin composition is obtained by suspension polymerization, the monomer (A) and the monomer (B) are polymerized in water with vigorous stirring, and then the water is separated by a known means. Beads of the resin composition can be obtained.
Suspension polymerization is carried out under the conditions of a polymerization temperature of 5 to 100 ° C., preferably 40 to 95 ° C., a polymerization time of about 0.1 to 24 hours, preferably about 0.5 to 12 hours, and more preferably about 1 to 6 hours. Will be done. The method of adding the monomer to the reactor may be batch, divided, continuous addition, or a combination thereof. As for the ratio of water to the monomer composition, when water is 100 parts by mass, the monomer composition is preferably carried out in the range of 10 to 100 parts by mass. After separating the water, the beads of the resin composition are preferably dried. The beads are dried under the conditions of a drying temperature of 20 to 100 ° C., preferably 40 to 90 ° C., a drying time of about 1 to 72 hours, preferably about 3 to 48 hours, and more preferably about 5 to 24 hours.
The resin composition of the present invention is processed into pellets by heating the particles of the resin composition obtained by the above method or the like with an extruder or a kneader and melt-kneading the particles.
The resin composition obtained after melt-kneading is preferably excellent in thermal stability during melt-kneading, especially when applied to injection molding.
When the resin composition of the present invention is processed into a pellet-shaped molding material, the resin composition is blended with a known thermoplastic resin or a known polymer in an arbitrary ratio according to the required performance. Can also be used.

<Manufacturing method of resin molded product>
The resin molded product of the present invention can be obtained through the following steps.
The resin molded product of the present invention can be obtained by melt-molding the polymer for melt molding of the present invention to obtain a resin molded product precursor, and cross-linking the obtained resin molded product precursor. ..
Examples of the melt molding method for obtaining the resin molded body precursor of the present invention include injection molding, extrusion molding, pressure molding (press molding), pressure molding, vacuum molding and the like.
Further, the obtained resin molded body precursor may be further secondarily molded by using a known molding method such as a compressed air molding method or a vacuum forming method. Molding conditions such as molding temperature and molding pressure may be appropriately set.

Examples of the method for cross-linking the resin molded product precursor include a method in which the alkoxysilyl groups in the resin molded product precursor are condensed by a dealcohol reaction with water to introduce a cross-linked structure. Specifically, a known method can be used, such as a wet heat treatment method in which the resin molded product precursor is made to absorb moisture in a moist heat environment, or a hot water treatment in which the resin molded product precursor is immersed in warm water to absorb water. The wet heat treatment method or the hot water treatment method is preferable, and the wet heat treatment method is more preferable.

The treatment temperature of the wet heat treatment is preferably in the range of 0 to 100 ° C, more preferably in the range of 20 to 100 ° C, and even more preferably in the range of 40 to 90 ° C. When the treatment temperature is 20 ° C. or higher, the alkoxysilyl groups can be condensed by a dealcohol reaction, so that a crosslinked structure can be introduced. Further, when the treatment temperature is 100 ° C. or lower, it is possible to prevent the resin molded product from being colored due to thermal deterioration. During the treatment time, the treatment temperature is preferably kept as constant as possible, preferably within ± 5 ° C, more preferably within ± 3 ° C, and even more preferably within ± 1 ° C.
The relative humidity of the moist heat treatment is preferably in the range of 10 to 100% RH, more preferably in the range of 40 to 100% RH, and even more preferably in the range of 60 to 100% RH. When the relative humidity of the wet heat treatment is 10% RH or more, the alkoxysilyl groups can be condensed by a dealcohol reaction, so that a crosslinked structure can be introduced.
The treatment time of the moist heat treatment is preferably in the range of 0.5 to 720 hours, more preferably in the range of 1 to 480 hours, and further preferably in the range of 4 to 360 hours. When the treatment time is 0.5 hours or more, the cross-linking treatment can be performed to such an extent that the scratch resistance and heat resistance of the obtained resin molded product become good. Further, when the processing time is 720 hours or less, the productivity of the resin molded product is excellent.
The treatment temperature, relative humidity and treatment time of the above wet heat treatment can be arbitrarily combined.
Alternatively, in the method for producing a resin molded product of the present invention, the resin molded product precursor is subjected to a wet heat treatment under the conditions of a temperature of 0 to 100 ° C. and a relative humidity of 10 to 100% RH for 0.5 to 720 hours. can do. Further, it is more preferable that the resin molded precursor is subjected to a wet heat treatment under the conditions of 0.5 to 720 hours in a moist heat environment having a temperature of 20 to 100 ° C. and a relative humidity of 40 to 100% RH.

The method of performing the moist heat treatment is not particularly limited as long as the conditions of temperature, relative humidity and time are adjusted as described above, but for example, an oven, a constant temperature and humidity controller, etc. are installed in the production line of the resin molded product. Examples thereof include a method of treating the resin molded product precursor and a method of treating the resin molded product precursor by putting it in an oven, a constant temperature and humidity chamber, and the like.

The treatment temperature of the hot water treatment is preferably in the range of 40 to 100 ° C, more preferably in the range of 60 to 100 ° C. During the treatment time, the treatment temperature is preferably kept as constant as possible, preferably within ± 5 ° C, more preferably within ± 3 ° C, and even more preferably within ± 1 ° C.
The treatment time of the hot water treatment is preferably in the range of 0.5 to 10 hours, more preferably in the range of 1 to 7 hours.
The treatment temperature and treatment time of the above hot water treatment can be arbitrarily combined.
Alternatively, in the method for producing a resin molded product of the present invention, the resin molded product precursor can be subjected to a wet heat treatment at a temperature of 40 to 100 ° C. under the condition of 0.5 to 10 hours.

The method of hot water treatment is not particularly limited as long as the temperature and time conditions are adjusted as described above, but for example, a method of installing a water tank or the like in the production line of the resin molded product for treatment, or resin molding Examples thereof include a method of treating the body precursor by putting it in a water tank or the like. In the hot water treatment, it is preferable to bring the resin molded precursor into direct contact with water controlled in the above temperature range.
In the present specification, hot water means water whose temperature is controlled within the above temperature range (40 to 100 ° C.).

In the method for producing a resin molded product of the present invention, after performing a cross-linking treatment such as a wet heat treatment or a hot water treatment, a drying treatment for removing water from the resin molded product may be performed. The temperature range of the drying treatment is preferably 40 to 300 ° C, more preferably 80 to 250 ° C, and even more preferably 100 to 200 ° C. The drying time range is preferably 0.1 to 72 hours, more preferably 0.5 to 48 hours, even more preferably 1 to 24 hours.

<Resin molded product>
The resin molded product of the present invention is a resin molded product obtained by cross-linking a resin molded product precursor obtained by melt molding the above-mentioned melt molding polymer or the above-mentioned melt molding resin composition.
Further, the resin molded product of the present invention has a gel fraction of 1.0% by mass or more with respect to 100% by mass of the total mass of the resin molded product. The gel fraction in the present invention is the content ratio (unit: mass%) of the insoluble component in tetrahydrofuran contained in the resin molded product.
The lower limit of the gel content of the resin molded body is 1.0% by mass with respect to 100% by mass of the total mass of the resin molded body from the viewpoint of improving the scratch resistance and heat resistance of the obtained resin molded body. The above is preferable, 10% by mass or more is more preferable, 50% by mass or more is further preferable, and 90 parts by mass or more is particularly preferable. On the other hand, the upper limit of the gel fraction is not particularly limited, and the larger the gel fraction value, the better the scratch resistance and heat resistance of the obtained resin molded product. It may be 100% by mass or less than 100% by mass with respect to 100% by mass of the total mass of the resin molded product. From the viewpoint of maintaining good transparency of the obtained resin molded product, it can be 99.0% by mass or less.
The gel content of the resin molded product can be controlled by adjusting the content ratio of the unit (B) in the resin composition for melt molding, the conditions for cross-linking the resin molded product precursor, and the like. A specific method for measuring the gel fraction will be described later.

In the resin molded product of the present invention, the upper limit of the molecular weight between the cross-linking points is preferably 20,000 or less, more preferably 15,000 or less, from the viewpoint of improving the scratch resistance and heat resistance of the obtained resin molded product. 10,000 or less is more preferable, and 5,000 or less is particularly preferable. On the other hand, the lower limit of the molecular weight between the cross-linking points is not particularly limited, but from the viewpoint of maintaining good transparency of the obtained resin molded product, 10 or more is preferable, 100 or more is more preferable, 300 or more is further preferable, and 500 or more. The above is particularly preferable.
The molecular weight between the cross-linking points of the resin molded product can be controlled by adjusting the content ratio of the unit (B) in the resin composition for melt molding, the conditions for cross-linking the resin molded product precursor, and the like. A specific method for measuring the molecular weight between cross-linking points will be described later.

As one of the methods for improving the scratch resistance of the resin molded product, a method of introducing a crosslinked structure on the surface of the resin molded product has been known. However, since the resin having the crosslinked structure cannot be melt-molded, the productivity of the resin molded body is insufficient. However, the resin molded product of the present invention is obtained by first melt-molding the polymer for melt molding of the present invention and the resin composition for melt molding of the present invention to obtain a resin molded product precursor, and then the resin molded product precursor. Since it can be manufactured by introducing a crosslinked structure into the body, the productivity of the resin molded body is excellent.
Further, the scratch resistance of the resin molded product generally tends to decrease as the melt moldability of the melt molding polymer is improved, which is a so-called trade-off relationship with the melt moldability. That is, the resin molded product of the present invention is a resin molded product having a remarkable property of having both scratch resistance and melt moldability, which are contradictory properties.

Further, the resin molded body of the present invention has excellent transparency with a total light transmittance of 88.0% or more and a diffusion transmittance before and after the scratch treatment in which # 0000 steel wool is reciprocated 11 times under the condition of a load of 14 kPa. A resin molded body satisfying excellent scratch resistance with a change amount ΔTd of (Td) of 28.0% or less and excellent heat resistance with a Vicat softening temperature of 120 ° C. or more can be obtained. That is, the resin molded body has good transparency, heat resistance, and scratch resistance, which are contradictory characteristics, and in particular, the amount of change ΔTd in the diffusion transmittance (Td) before and after the scratch treatment is remarkable as 28.0% or less. It is a resin molded body having scratch resistance and remarkable heat resistance having a Vicat softening temperature of 120 ° C. or higher. Such a resin molded product can be produced by using the melt molding polymer of the present invention or the melt molding resin composition of the present invention. Furthermore, by manufacturing using the method for manufacturing a resin molded product of the present invention, transparency, heat resistance, and scratch resistance can be further improved.

When the resin molded product of the present invention has a plate shape having a thickness of 3 mm, the total light transmittance of the molded product measured in accordance with ISO 13468-1 is preferably 88.0% or more, preferably 90. It is more preferably 0.0% or more, further preferably 91.0% or more, and particularly preferably 91.5% or more.
Further, in the resin molded product of the present invention, the diffusion transmittance before and after the scratch treatment in which # 0000 steel wool is reciprocated 11 times on the surface of the molded product having a thickness of 3 mm in the form of a plate under a load of 14 kPa ( The amount of change ΔTd of Td) is preferably 28.0% or less, more preferably 20.0% or less, further preferably 15.0% or less, and 12.0% or less. Is particularly preferable.
When the resin molded product of the present invention has a rod shape having a thickness of 4 mm, the Vicat softening temperature measured in accordance with the A50 method of ISO306 is preferably 120 ° C. or higher, more preferably 130 ° C. or higher. preferable.

The resin molded product of the present invention may contain other additives in addition to the resin molded product. Examples of other additives include ultraviolet absorbers, antioxidants, plasticizers, light diffusing agents, matting agents, lubricants, mold release agents, antistatic agents, colorants such as pigments, and the like. One of these other additives may be used alone, or two or more thereof may be used in combination.

Hereinafter, the present invention will be specifically described with reference to Examples, but the present invention is not limited to these Examples.

<Measurement method>
Evaluation in Examples and Comparative Examples was carried out by the following method.

(Mass average molecular weight)
10 mg of the melt-molding polymers (polymers (P1) to (P5)) obtained in the production example was dissolved in 10 ml of tetrahydrofuran and filtered through a 0.5 μm membrane filter to obtain a sample solution. The mass average molecular weight of the sample solution was measured using gel permeation chromatography (model name "HLC-8320 GPC Eco SEC", manufactured by Toso Co., Ltd.). As a separation column, "TSKgel SuperHZM-H" (trade name). , Tosoh Co., Ltd., inner diameter 4.6 mm x length 15 cm) in series, tetrahydrofuran as the solvent, differential refraction meter as the detector, standard polymethylmethacrylate as the standard sample, flow rate 0.6 ml / The conditions were min, the measurement temperature was 40 ° C., and the injection volume was 0.1 ml.

(Melting stability)
As an index of the melt moldability of the polymer for melt molding, the melt stability was evaluated by the following procedure. The polymer for melt molding obtained in the production example was subjected to a laboplast mill (Toyo Seiki), and melt-kneaded in a mixer test mode at a temperature of 220 ° C. and a mixer speed of 30 rpm for 20 minutes. Compare the torque value (T ₅ ) (unit: Nm) 5 minutes after the start of melt kneading with the torque value (T ₂₀ ) (unit: Nm) after 20 minutes, and melt according to the following criteria. Stability was evaluated.
A: T ₂₀ and T ₅ satisfy the following equation (a).
T ₂₀ / T ₅ <2.0 (a)
B: T ₂₀ and T ₅ satisfy the following equation (b).
T ₂₀ / T ₅ ≧ 2.0 (b)
When condition A is satisfied, during melt molding, the alkoxysilyl groups contained in the unit (B) do not react with each other due to heat and do not form a crosslinked structure, so that the melt stability is excellent and injection molding is possible. there were.
When the condition B is satisfied, the alkoxysilyl groups contained in the unit (B) react with each other due to heat during melt molding to form a crosslinked structure, so that the melt stability is not excellent and injection molding cannot be performed. It was.

(Preparation of resin molded precursor)
The melt molding polymers (polymers (P1) to (P5) obtained in the production example are supplied to an injection molding machine (model name: IS-100, manufactured by Toshiba Machine Co., Ltd.) and injection molded to form a plate. Resin molded product precursor (width 50 mm, length 100 mm, thickness 3 mm) and rod-shaped resin molded product precursor (width 8 mm, length 80 mm, thickness 4 mm) were obtained.

(Crosslinking)
The above plate-shaped and rod-shaped resin molded precursors are subjected to cross-linking treatment under the following conditions, and then dried in a dryer at 120 ° C. for 1 hour to obtain plate-shaped and rod-shaped resin molded products. These were used as test pieces for evaluation.
Condition (1): Treatment for 24 hours in a constant temperature and humidity environment with a temperature of 80 degrees and a relative humidity of 90%.
Conditions (2) Treatment for 96 hours in a constant temperature and humidity environment with a temperature of 80 degrees and a relative humidity of 90%.
Conditions (3) Treatment for 148 hours in a constant temperature and humidity environment with a temperature of 80 degrees and a relative humidity of 90%.
Conditions (4) Treatment for 148 hours in a constant temperature and humidity environment with a temperature of 60 degrees and a relative humidity of 90%.
Condition (5) Treatment in warm water at a temperature of 80 degrees for 1 hour.
Condition (6) Treatment in warm water at a temperature of 80 degrees for 3 hours.
Condition (7) Treatment in warm water at a temperature of 80 degrees for 5 hours.

(Gel fraction)
Approximately 0.1 g was cut out from the test piece, and the mass of the test piece was precisely weighed to the value of the last four digits using a precision electronic balance to obtain W ₁ (g). Next, the cut out test piece was immersed in 20 mL of tetrahydrofuran, placed in a constant temperature water bath at 50 ° C., and heated for 24 hours. After 24 hours, the mixture was taken out, suction-filtered, and the funnel-shaped filter was recovered as an insoluble component in tetrahydrofuran and dried in a vacuum dryer at 80 ° C. for 24 hours. The mass of the filtrate after drying for 24 hours was precisely weighed to the last four digits using a precision electronic balance to obtain W ₂ (g). The gel fraction was calculated using the following formula.
Gel fraction (%) = W ₂ / W ₁ x 100
Furthermore, the judgment was made using the following criteria.
AA: 95% or more A: 50% or more and less than 95% B: 1.0% or more and less than 50% BB: less than 1.0%

(Molecular weight between cross-linking points)
Using DMS (device name: EXSTAR DMS6100, SII Nanotechnology), the molecular weight between cross-linking points was measured by the following method. Using a rod-shaped test piece, measure the dynamic storage elastic modulus (E') in a three-point bending test under the conditions of a measurement temperature of 30 to 200 ° C., a temperature rise rate of 2 ° C./min, and a measurement frequency of 1 Hz under a nitrogen atmosphere. did. As the value of the dynamic storage elastic modulus (E'), the dynamic storage elastic modulus at a measurement temperature of 175 ° C. was adopted, which was judged that the viscoelastic behavior of the object to be measured entered the rubber elastic region. The molecular weight between the cross-linking points was determined using the following formula.
Molecular weight between cross-linking points (cm ³ / mol) = 1 / (E'/ RT)
E': Dynamic storage modulus (Pa)
R: Gas constant (J / K · mol)
T: Absolute temperature (K)
Furthermore, the judgment was made using the following criteria.
AA: Less than 10,000 A: 10,000 or more and less than 20,000 B: 20,000 or more

(Total light transmittance)
Using a haze meter (model name "NDH-2000", manufactured by Nippon Denshoku Kogyo Co., Ltd.) as an index of the transparency of the resin molded product, the total light transmittance of the test piece is measured in accordance with ISO13468-1. did. Measurement was performed once for each test piece using three plate-shaped test pieces, and the average value was taken as the total light transmittance. Furthermore, the judgment was made using the following criteria.
AA: Total light transmittance is 91.5% or more A: Total light transmittance is 88% or more and less than 91.5% B: Total light transmittance is less than 88%

(Scratch resistance test)
As an index of scratch resistance of the resin molded product, the amount of change in diffusion transmittance (ΔTd) before and after the scratch treatment was measured according to the following method.
For the plate-shaped test piece, the total light transmittance T ₁ (%) measured in accordance with ISO 13468-1 using a haze meter (model name "NDH-2000", manufactured by Nippon Denshoku Kogyo Co., Ltd.) the value obtained by dividing 100 by multiplying the haze value was measured in accordance with ISO14782 _H 1 (%), and diffuse transmittance of the resin molded body before mar testing and _{(Td 1 = T 1 × H} 1/100) ..
A plate-shaped test piece was set in a Bencot scratch tester (model name: HEIDON TYPE30, manufactured by Shinto Kagaku Co., Ltd.), a weight was set so that a pressure of 14 kPa was applied, and the # 0000 steel wool set on the weight Is subjected to scratch treatment by reciprocating a sweep distance of 30 mm 11 times at a sweep speed of 3000 mm / min so as to pass through the central portion of the surface of the test piece under a load of 14 kPa. Formed. The total light transmittance (T ₂ (%)) and haze value (H ₂ (%)) of the friction and wear treated portion of the test piece after the scratch treatment were measured, and the diffusion transmittance of the resin molded product after the scratch resistance test was performed. It was calculated _{(Td 2 = T 2 × H} 2/100). As an index of scratch resistance, the amount of change in diffusion transmittance (ΔTd) before and after the scratch treatment was calculated using the following formula.
ΔTd = Td ₂ -Td ₁
The measurement was performed once for each test piece using three test pieces, and the average value was defined as ΔTd. Furthermore, the judgment was made using the following criteria.
AA: ΔTd is 15% or less A: ΔTd is more than 15% and 28% or less B: ΔTd is more than 28%

(Heat resistance evaluation)
As an index of heat resistance of the resin molded product, an HDT / VICAT tester (model name "No. 148-HAD Heat Destruction Tester", manufactured by Yasuda Seiki Seisakusho Co., Ltd.) is used, and Bicut conforms to the A50 method of ISO306. A softening temperature test was performed to measure the Vicat softening temperature.
The Vicat softening temperature test was performed once for each test piece using three rod-shaped test pieces, and the average value was taken as the Vicat softening temperature. Furthermore, the judgment was made using the following criteria.
A: Vicat softening point temperature is 120 ° C or higher B: Vicat softening point temperature is less than 120 ° C

(raw materials)
The abbreviations of the compounds used in Examples and Comparative Examples are as follows.
MMA: Methyl Methacrylate (Product Name: Acriester (registered trademark) M, manufactured by Mitsubishi Chemical Corporation)
MA: Methyl acrylate (manufactured by Mitsubishi Chemical Corporation)
TEPM: Triethoxysilylpropyl methacrylate (trade name: KBE-503, manufactured by Shin-Etsu Chemical Co., Ltd.)
TMPM: Triethoxysilylpropyl methacrylate (trade name: KBM-503, manufactured by Shin-Etsu Chemical Co., Ltd.)
AMBN: 2,2'-azobis-2-methylbutyronitrile (trade name: V-59, manufactured by Wako Pure Chemical Industries, Ltd.)
nOcSH: n-octyl mercaptan dispersant (1): Dispersant polymer produced in Production Example 1 Polymer (P1): Resin composition for melt molding produced in Production Example 1 Polymer (P2): Melt molding produced in Production Example 2 Resin composition for use Polymer (P3): Resin composition for melt molding prepared in Production Example 3 Polymer (P4): Resin composition for melt molding prepared in Production Example 4 Polymer (P5): Melt prepared in Production Example 5 Resin composition for molding

[Production Example 1: Production of Dispersant (1)]
900 parts by mass of deionized water, 60 parts by mass of 2-sulfoethyl sodium methacrylate, 10 parts by mass of potassium methacrylate and 12 parts by mass of MMA were supplied to a flask equipped with a stirrer, a thermometer and a cooling tube, and nitrogen was discharged. However, the flask was heated so that the internal temperature of the flask was 50 ° C. Then, 0.08 parts by mass of 2,2'-azobis (2-methylpropionamidine) dihydrochloride salt was supplied, and the flask was heated so that the internal temperature of the flask was 60 ° C. Then, using a dropping pump, MMA was dropped at a rate of 0.24 parts by mass / min for 75 minutes. Then, it held for 6 hours, and the dispersant (1) (solid content 10% by mass) was obtained.

[Production Example 2: Production of Polymer (P1)]
200 parts by mass of deionized water and 0.42 parts by mass of sodium sulfate were supplied to a separable flask equipped with a stirrer, a thermometer, a cooling tube and a nitrogen gas introduction tube, and stirred at a stirring rate of 320 rpm for 15 minutes. Then, the monomer composition was made into a total of 100 parts by mass (a mixture of MMA 94 mol%, MA 1 mol% and TEPM 5 mol% with respect to 100 mol% of the total number of moles of the monomers constituting the monomer composition), and polymerization was started. 0.28 parts by mass of AMBN as an agent and 0.30 parts by mass of nOcSH as a chain transfer agent were supplied to a separable flask and stirred for 5 minutes. Then, 0.67 parts by mass of the dispersant (1) produced in Production Example 1 was supplied to the separable flask and stirred to disperse the monomer mixture in the separable flask in water. Then, nitrogen gas was discharged for 15 minutes.
Then, the temperature of the separable flask was heated to 75 ° C., and the temperature was maintained until the peak of heat generation of polymerization was observed. After the polymerization exotherm peak was observed, the temperature of the separable flask was heated to 90 ° C. and held for 60 minutes to complete the polymerization. Then, the mixture in the separable flask was cooled to room temperature and then filtered, and the filtrate was washed with deionized water and dried at 80 ° C. for 24 hours to obtain a bead-shaped polymer for melt molding.
The obtained polymer for melt molding was dried and then melt-kneaded using a twin-screw kneading extruder to obtain a pellet-shaped polymer for melt molding, which was used as a polymer (P1). Table 1 shows the evaluation results of the obtained polymer for melt molding.

[Production Examples 3 to 6: Production of Polymers (P2) to (P5)]
Pellet-shaped resin compositions were obtained in the same manner as in Production Example 1 except that the composition of the monomer composition was as shown in Table 1, and the polymers (P2) to (P5) were used, respectively. The evaluation results of the obtained resin composition are shown in Table 1.

[Example 1]
After injection molding the polymer (P1) to obtain a resin molded product precursor, a cross-linking treatment was carried out based on the condition (1) to obtain a resin molded product. Table 2 shows the evaluation results of the obtained resin molded product.

[Comparative Example 1]
A resin molded product was obtained in the same manner as in Example 1 except that a resin molded product precursor was obtained using the polymer (P3). Table 2 shows the evaluation results of the obtained resin molded product.

[Examples 2 to 10, Comparative Examples 2 to 5]
A resin molded product was obtained in the same manner as in Example 1 except that the type of the resin composition for melt molding used or the conditions for the crosslinking treatment were as shown in Table 2. Table 2 shows the evaluation results of the obtained resin molded product.

The resin molded products of Examples 1 to 10 had good transparency, scratch resistance, and heat resistance.

Since the resin molded products of Comparative Examples 1 to 3 have a small content ratio of the unit (B) in the polymer (P3) which is the resin composition for melt molding, the scratch resistance and heat resistance of the resin molded products are insufficient. there were.
The resin composition for melt molding of Comparative Example 4 has a small content ratio of the unit (B) in the polymer (P4), and TMPM is used as the monomer forming the unit (B), so that the melt stability Although it was used in an injection molding machine, it was not possible to stably obtain a resin molded precursor.
In the resin molded product of Comparative Example 5, since the polymer (P5) which is the resin composition for melt molding does not contain the unit (B), the crosslinked structure is not formed even if the crosslinking treatment is performed, and the resistance of the resin molded article The scratch resistance and heat resistance were insufficient.

The resin molded body of the present invention is excellent in transparency, scratch resistance and heat resistance, and can be used for optical materials, vehicle parts, lighting materials, building materials, etc., and is particularly suitable for vehicle parts. Among them, it can be suitably used for lamp covers such as tail lamps and head lamps.
Other vehicle parts include, for example, optical members inside rear lamps, inner lenses for headlights (sometimes called projector lenses or PES lenses), meter covers, door mirror housings, pillar covers (sash covers), etc. Licensed garnish, front grille, fog garnish, emblem, etc.

Claims (12)

A polymer for melt molding containing a repeating unit (A) derived from methyl (meth) acrylate and a repeating unit (B) derived from a vinyl compound monomer having an alkoxysilyl group in the side chain.
The unit (A) is 70 mol% or more and 97 mol% or less, and the unit (B), based on 100 mol% of the total number of moles of the monomer units constituting the melt-molded polymer. A polymer for melt molding containing 3 mol% or more and 30 mol% or less. The polymer for melt molding according to claim 1, wherein the polymer for melt molding has a mass average molecular weight of 30,000 or more and 180,000 or less. Claim 1 or 2 in which the unit (B) contains a repeating unit (B1) derived from an alkoxysilyl (meth) acrylate in an amount of 51 mol% or more and 100 mol% or less based on 100 mol% of the total number of moles of the unit (B). The polymer for melt molding according to. The polymer for melt molding according to claim 3, wherein the unit (B1) is a repeating unit (B2) derived from a monomer represented by the following general formula (1).
(1)
[In formula (1), X represents H or CH ₃ . a is an integer of 0 to 10, m is an integer of 1 to 10, n is an integer of 0 to 10, p is an integer of 1 to 3, and q is an integer of 0 to 2. ] A resin composition for melt molding containing the polymer for melt molding according to any one of claims 1 to 4.
The melt-molded resin composition contains 1% by mass or more and less than 100% by mass of the melt-molded polymer with respect to 100% by mass of the total mass of the melt-molded resin composition. .. A resin obtained by cross-linking a resin molded product precursor obtained by melt molding the melt molding polymer according to any one of claims 1 to 4 or the melt molding resin composition according to claim 5. It is a molded product
A resin molded product having a gel fraction of 1.0% by mass or more based on 100% by mass of the total mass of the resin molded product. The resin molded product according to claim 6, wherein the gel content of the resin molded product is 90% by mass or more with respect to 100% by mass of the total mass of the resin molded product. The resin molded product according to claim 6 or 7, wherein the resin molded product has a molecular weight between cross-linking points of 20,000 or less. A method for producing a polymer for melt molding, which comprises a repeating unit (A) derived from methyl (meth) acrylate and a repeating unit (B) derived from a vinyl compound monomer having an alkoxysilyl group in a side chain.
A polymer for melt molding, which comprises a step of polymerizing a monomer composition containing 70 mol% or more and 97 mol% or less of methyl (meth) acrylate and 3 mol% or more and 30 mol% or less of a vinyl compound having an alkoxysilyl group in a side chain. Production method. The method for producing a polymer for melt molding according to claim 9, wherein the polymerization of the monomer composition is carried out by suspension polymerization. A step of melt-molding the polymer for melt molding obtained by the production method according to claim 9 or 10 to obtain a resin molded product precursor, and a step of cross-linking the resin molded product precursor.
A method for manufacturing a resin molded product. The cross-linking process
A step of treating the resin molded product precursor in warm water at a temperature of 40 to 100 ° C. for 0.5 to 10 hours, or a moist heat environment in which the resin molded product precursor is treated at a temperature of 0 to 100 ° C. and a relative humidity of 10 to 100% RH. Including the step of processing for 0.5 to 720 hours in the
The method for producing a resin molded product according to claim 11.