JP2020145010A - Conductor joining jig - Google Patents

Abstract

To provide a conductor joining jig having excellent reliability and economy, which may increase the degree of adhesion between conductors and suppress joint resistance so as to stabilize an operation for low-resistance joint and realize ensuring of mechanical strength and reducing of investment costs.SOLUTION: It comprises a molding block 11 of a flat conductor 3 obtained by molding a multi-core wire into a flat shape, and a joining block 12 of the flat conductor 3 and a flat angle conductor 5. The molding block 11 is provided with an alignment groove 13 for aligning a plurality of wires 2, and the joining block 12 is provided with a joint groove 15 for storing the flat conductor 2, a solder sheet 7, and the flat angle conductor 5 in a laminated state. Further, the joining block 12 is provided with a heater 17 which heats the solder sheet 7 so as to solder the flat conductor 3 and the flat angle conductor 5 in a state where the flat conductor 3, the solder sheet 7, and the flat angle conductor 5 are laminated and stored in the joint groove 15.SELECTED DRAWING: Figure 1

Description

An embodiment of the present invention relates to a conductor joining jig for joining a multi-core wire rod composed of a plurality of wire rods and a flat conductor having a flat joint surface.

As a material in which conductors in an apparatus are joined to each other, a joined conductor in which a multi-core wire composed of a plurality of wires and a flat conductor are joined is known. This multi-core wire generally becomes a loose wire unless it is aligned. Therefore, it is difficult to secure the adhesion with the flat conductor of the bonding partner. A flat conductor is a conductor made of a flat wire having a flat joint surface. Since it is the simplest method for joining these conductors, solder melting by soldering is widely used. Recently, ultrasonic bonding, diffusion bonding, electron beam bonding, and spot welding have also been used.

Japanese Unexamined Patent Publication No. 09-129438

Generally, in a DC large current circuit or the like, it is required to reduce the bonding resistance between the conductors to be bonded as much as possible. In order to reduce the bonding resistance between conductors, it is necessary to strongly adhere the conductors to each other. However, as described above, since the multi-core wire generally becomes a loose wire unless it is aligned, it is difficult to secure the adhesion with the flat conductor of the bonding partner. Therefore, it is difficult to join the multi-core wire rod and the flat conductor while maintaining a high level of adhesion between the conductors, and it is difficult to construct a stable low resistance joint.

Further, in a joint conductor between a flat conductor and a flat conductor, it is required to improve the degree of adhesion between the conductors and to secure the mechanical strength. Further, as a method of bonding a flat conductor and a flat conductor, there are bonding techniques such as ultrasonic bonding and diffusion bonding as described above, but in these bonding technologies, expensive dedicated equipment is indispensable. As a result, the initial investment cost increased, leading to a rise in cost.

The embodiment of the present invention has been made in order to solve the above-mentioned problems, and stabilizes the construction of low resistance bonding by increasing the degree of adhesion between conductors and suppressing the bonding resistance to a low level, and mechanically. An object of the present invention is to provide a conductor joining jig having excellent reliability and economy, which can secure strength and reduce investment cost.

In order to achieve the above object, an embodiment of the present invention is a conductor joining jig for joining a multi-core wire rod composed of a plurality of wire rods and a flat conductor having a flat joint surface, and has the following configuration. It has elements (1) to (3).
(1) A molding block of the flat conductor for molding a flat conductor obtained by molding the multi-core wire into a flat shape, in which an alignment groove for aligning the plurality of the wires is carved to a depth equal to or less than the diameter of the wire. ..
(2) A joining block in which a joining groove for joining the flat conductor and the flat conductor is engraved in a shape in which the flat conductor, a solder material, and the flat conductor are overlapped.
(3) A heater that heats the solder material and solders the flat conductor and the flat conductor in a state where the flat conductor, the solder material, and the flat conductor are overlapped and housed in the joint groove.

The perspective view of the first embodiment. The main part side view of the 1st embodiment. Top view of the first embodiment. The main part perspective view of the second embodiment. The perspective view of the third embodiment. The perspective view of the 4th embodiment. The perspective view of the fifth embodiment. A side view of a fifth embodiment. Perspective view of another embodiment.

(First Embodiment)
(Constitution)
Hereinafter, the configuration of the first embodiment will be specifically described with reference to FIGS. 1 to 3. The conductor joining jig 1 according to the first embodiment is a jig for joining a flat conductor 3 and a flat conductor 5 having a flat joining surface 4. The flat conductor 3 is a conductor obtained by molding a multi-core wire rod composed of a plurality of wire rods 2 into a flat shape. FIG. 1 is a perspective view of the entire conductor joining jig 1. As shown in FIG. 1, the conductor joining jig 1 includes a molding block 11 and a joining block 12.

(Molding block 11)
The molding block 11 is a thin rectangular parallelepiped block for molding the flat conductor 3. In FIG. 1, when the flat conductor 3 is attached to the molding block 11 and the joining block 12, the wire rod 2 constituting the flat conductor 3 is not shown in order to give priority to visibility.

A linear alignment groove 13 is provided in the center of the molding block 11 along the longitudinal direction of the molding block 11. The alignment groove 13 has a width dimension for aligning a plurality of wire rods 2 in a flat shape. As shown in FIG. 2, the alignment groove 13 is formed by shallow engraving so that its depth dimension a is equal to or less than the diameter b of the wire rod 2 (b ≧ a). However, the depth dimension of the alignment groove 13 is set so deep that the plurality of wire rods 2 do not easily roll out from the alignment groove 13.

In the molding block 11, three fixing brackets 14 are attached at both ends and the center of the alignment groove 13 in the longitudinal direction at right angles to the alignment groove 13. The fixing bracket 14 fixes the wire rod 2 aligned in the alignment groove 13 from above by screwing both ends thereof to the molding block 11. The surface of the wire rod 2 aligned in the alignment groove 13 is divided into a portion covered by the fixing bracket 14 and a portion exposed without being covered by the fixing bracket 14. In the exposed portion of the wire rod 2, soldering portions 6 with a soldering iron are provided at predetermined intervals across all the aligned wire rods 2.

(Join block 12)
The joining block 12 is a thin rectangular parallelepiped block for joining the flat conductor 3 and the flat conductor 5. The joining block 12 is made of a difficult-to-solder material that is difficult to melt, such as aluminum.

At the center of the joint block 12, a linear joint groove 15 is formed over the entire longitudinal direction of the block 12. The joint groove 15 has a concave cross section, and is engraved in a shape in which a flat conductor 3, a solder sheet 7 which is a sheet-like solder material, and a flat conductor 5 are superposed. The width dimension of the joint groove 15 is set to be substantially the same as the width dimension of the flat conductor 3, the flat conductor 5, and the solder sheet 7.

The joint groove 15 is accommodated in a state in which the flat conductor 5, the solder sheet 7, and the flat conductor 3 are stacked in this order from the bottom. When the three members 5, 7, and 3 are housed in the joint groove 15, the depth dimension of the joint groove 15 is such that the upper surface of the flat conductor 3 arranged on the uppermost side slightly exceeds the upper surface of the joint block 12. It is set.

In the joint block 12, three fixing brackets 16 are attached at both ends and the center of the joint groove 15 in the longitudinal direction at right angles to the joint groove 15. The fixing bracket 16 fixes the flat conductor 3, the solder sheet 7, and the flat conductor 5 housed in the joint groove 15 from above by screwing both ends thereof to the joint block 12.

(Heaters 17a to 17c)
As shown in FIG. 3, rectangular heaters 17a to 17c (hereinafter, also referred to as heaters 17) are embedded in the joint block 12 in parallel with each other perpendicular to the longitudinal direction of the joint block 12. The heater 17a is arranged at the center of the joining block 12, the heater 17b is placed near the edge of one short side of the joining block 12 (on the right side in FIG. 3), and the heater 17c is located at the joining block 12. It is arranged near the edge of the other short side (left side in FIG. 3). These heaters 17a to 17c are configured to start heating from the heaters 17a located on the central side, and then to heat the heaters 17b and 17c located on the outer side.

(Action)
A method of joining the flat conductor 3 and the flat conductor 5 using the conductor joining jig 1 will be described with reference to FIGS. 1 to 3. First, a plurality of wire rods 2 are arranged in parallel in the alignment groove 13 and aligned in a flat shape (see FIG. 2). Then, by uniformly tightening the three fixing brackets 14, the flat state of the wire rod 2 is ensured (see the upper part of FIG. 1). In the molding block 11, the wire rods 2 aligned in the alignment groove 13 are soldered to each other by a plurality of soldering portions 6 with a soldering iron. As a result, in the molding block 11, the flat conductor 3 in which the aligned wire rods 2 are in close contact with each other is molded. After molding the flat conductor 3, the flat conductor 3 is taken out from the alignment groove 13 of the molding block 11.

Next, the molded flat conductor 3, the solder sheet 7, and the flat conductor 5 are sequentially superposed and accommodated in the joint groove 15 of the joint block 12 (see the middle stage of FIG. 1). Then, the three fixing brackets 16 are uniformly tightened to fix the flat conductor 3, the solder sheet 7, and the flat conductor 5 to the joint groove 15 (see the lower part of FIG. 1).

Subsequently, the solder sheet 7 housed in the joint groove 15 is heated by the heater 17, the solder sheet 7 is melted, and the flat conductor 3 and the flat conductor 5 are soldered (see FIG. 3). At this time, heating is started from the central portion of the flat conductor 3 and the flat conductor 5, that is, the heater 17a at the center of the joint block 12, and then the heaters 17b and 17c arranged near both edges of the joint block 12 are heated. ..

Therefore, the solder sheet 7 is heated in the horizontal direction from the central portion side of the joining block 12 toward the outside. As described above, the flat conductor 3 and the flat conductor 5 are solder-bonded to obtain a bonded conductor between the flat conductor 3 and the flat conductor 5. The arrows in the left-right direction in FIG. 3 indicate the heat transfer direction by the heater 17.

(effect)
The effects of the first embodiment are as follows. The conductor joining jig 1 according to the first embodiment includes a molding block 11 of a flat conductor 3 for molding a flat conductor 3 obtained by molding a multi-core wire rod composed of a plurality of wire rods 2 into a flat shape, and a flat conductor 3. A joint block 12 of a flat conductor 5 is provided, and an alignment groove 13 for aligning a plurality of wire rods 2 in a flat shape is formed in the molded block 11, and the flat conductor 3, a solder sheet 7, and a flat conductor 5 are formed in the joint block 12. The solder sheet 7 is heated with the flat conductor 3, the solder sheet 7, and the flat conductor 5 housed in the joint groove 15 in the joint block 12 to form the joint groove 15 on which the two are overlapped. A heater 17 for soldering the flat conductor 5 is provided.

In such a first embodiment, since the alignment groove 13 is engraved in the molding block 11 to a depth equal to or less than the diameter of the wire rod 2, the entire wire rod 2 is not completely buried in the alignment groove 13. , There is no concern that the wire rods 2 overlap in the vertical direction in the alignment groove 13. Therefore, the alignment groove 13 can easily align the wire rods 2 in a flat shape.

Further, in the molding block 11, while tightening the fixing metal fitting 14, the wire rods 2 arranged in a flat shape can be soldered at the soldering portion 6 while being in close contact with each other. Therefore, the molded flat conductor 3 has a high degree of adhesion between the wire rods 2, and the resistance value in the soldered portion 6 can be suppressed to a low level. Therefore, conventionally, if the multi-core wire is not aligned, it becomes a loose wire and it is difficult to secure the adhesion with the flat conductor 5. However, according to the molded block 11 according to the present embodiment, the multi-core wire is It is possible to reliably form a flat multi-core wire rod by performing an alignment treatment on the surface, and it is possible to secure adhesion with the flat conductor 5 of the bonding partner.

Further, in the first embodiment, the joint groove 15 is engraved in the joint block 12 in a shape in which the flat conductor 3, the solder sheet 7, and the flat conductor 5 are superposed. Therefore, these members can be smoothly accommodated in the joint groove 15 while the flat conductor 3, the solder sheet 7, and the flat conductor 5 are superposed, and the work efficiency is high.

Moreover, since the shape of the joint groove 15 and the shape of the flat conductor 3, the solder sheet 7, and the flat conductor 5 overlapped with each other are formed so as to coincide with each other, the flat conductor 3 housed in the joint groove 15 The solder sheet 7 and the flat conductor 5 do not shift in the joint groove 15. Therefore, there is no concern that the degree of adhesion of the flat conductor 3, the solder sheet 7, and the flat conductor 5 will decrease, and low resistance bonding can be realized at the solder bonding portion of the solder sheet 7. As a result, the construction of low resistance bonding can be stabilized.

Further, in the first embodiment, the flat conductor 3, the solder sheet 7, and the flat conductor 5 are accommodated in the joint groove 15, and then the three fixing brackets 16 are fastened. At this time, the depth dimension of the joint groove 15 is set so that the upper surface of the flat conductor 3 arranged on the uppermost side slightly exceeds the upper surface of the joint block 12. Therefore, by tightening the fixing bracket 16 to the joint block 12, a strong adhesion force can be given to the flat conductor 3, the solder sheet 7, and the flat conductor 5.

Then, in the joint block 12, the solder sheet 7 is heated by the heater 17 in a state where the flat conductor 3, the solder sheet 7, and the flat conductor 5 are superposed and accommodated in the joint groove 15, and the flat conductor 3 and the flat conductor 5 are heated. Solder with. Therefore, the flat conductor 3, the solder sheet 7, and the flat conductor 5 can be soldered while maintaining a high level of adhesion, and stable low-resistance joining can be performed.

Moreover, in the first embodiment, heating is started from the heater 17a at the center of the joining block 12, and then the heaters 17b and 17c arranged near the short sides of the joining block 12 are heated. Therefore, the central portion side of the joining block 12 is heated first, and the solder sheet 7 is gradually heated outward in the horizontal direction.

Therefore, even if there is air in the gap between the solder sheet 7 and the flat conductors 3 and the flat conductors 5 located above and below the solder sheet 7, the heat transfer direction by the heater 17 and the air escape direction are the same (FIG. FIG. See arrow 3). Therefore, during the soldering work on the joining block 12, air can be efficiently released from the center side to the outside. As a result, there is no possibility that a gap is generated around the solder sheet 7, and the degree of adhesion between the solder sheet 7 and the flat conductors 3 and the flat conductors 5 located above and below the solder sheet 7 can be maintained. As a result, the resistance value at the solder joint portion can be suppressed to a low level, and the construction of the low resistance joint can be carried out more stably.

Further, in the first embodiment, since the flat conductor 3 and the flat conductor 5 are joined with the solder sheet 7 interposed therebetween, the three sheet-like members are overlapped with each other, and it is easy to secure the mechanical strength. .. Further, according to the first embodiment, it is not necessary to use bonding techniques such as ultrasonic bonding, diffusion bonding, electron beam bonding, and spot welding. Therefore, expensive dedicated equipment is not required, investment cost is low, and it is economically advantageous. Further, since the joining block 12 is made of aluminum which is hard to be soldered, there is no possibility that the flat conductor 3 and the flat conductor 5 are soldered to the joining block 12, and the soldering work efficiency can be improved.

(Second Embodiment)
(Constitution)
As shown in FIG. 4, in the second embodiment, the Belleville spring 18 is attached to the fixing bracket 16 of the joining block 12. The Belleville spring 18 is a pressure member that applies a fixing force to the flat conductor 3, the solder sheet 7, and the flat conductor 5 stacked in the joint groove 15.

(Action and effect)
According to the second embodiment having the above configuration, since the Belleville spring 18 is attached to the fixing bracket 16 of the joining block 12, it is possible to apply a fixing force to the flat conductor 3, the solder sheet 7, and the flat conductor 5. The degree of adhesion between the flat conductor 3 and the flat conductor 5 can be further improved. Therefore, the resistance value can be further suppressed, and the stabilization of the construction of the low resistance joint can be further promoted.

(Third Embodiment)
(Constitution)
As shown in FIG. 5, the joining block 12 according to the third embodiment is provided with thermocouples 19a to 19c for measuring the temperature of the joining block 12 in the vicinity of the heaters 17a to 17c. The thermocouples 19a to 19c measure the temperature of the bonding block 12. A controller 20 that gives a control signal to the heaters 17a to 17c is connected to the thermocouples 19a to 19c. The controller 20 is a portion that controls the heaters 17a to 17c based on the measured values of the thermocouples 19a to 19c.

(Action and effect)
In the third embodiment, the temperature of the bonding block 12 is measured by the thermocouples 19a to 19c, and the controller 20 controls the heaters 17a to 17c based on the measured values of the thermocouples 19a to 19c. That is, by measuring the temperature of the joining block 12 and feeding back the measured value to the controller 20, it is possible to control the heating by the heaters 17a to 17c with high quality. Therefore, the melting temperature of the solder sheet 7 and its holding time can be accurately controlled, and the solder sheet 7 can be stably melted. This makes it possible to carry out low-resistance joining more stably.

(Fourth Embodiment)
(Constitution)
As shown in FIG. 6, in the fourth embodiment, the joint groove 21 is formed in the center of the joint block 12. In the joint groove 21 according to the fourth embodiment, the flat conductor 3 is superposed on the upper surface of the flat conductor 5 with the solder sheet 7 sandwiched therein, and the reinforcing copper plate 8 is superposed on the upper surface of the flat conductor 3 with the solder sheet 7 sandwiched therein. It is engraved in a matching shape. The width dimension of the joint groove 21 is set to be substantially the same as the width dimension of the flat conductor 3, the flat conductor 5, the solder sheet 7, and the reinforcing copper plate 8.

The joint groove 21 is accommodated in a state in which five members are stacked in the order of a flat conductor 5, a solder sheet 7, a flat conductor 3, a solder sheet 7, and a reinforcing copper plate 8 from the bottom. When the five members 5, 7, 3, 7, 8 are housed in the joint groove 21, the upper surface of the reinforcing copper plate 8 arranged on the uppermost side slightly exceeds the upper surface of the joint block 12. Depth dimension is set.

(Action and effect)
In the fourth embodiment, since the flat conductor 3 and the reinforcing copper plate 8 are joined with the solder sheet 7 interposed therebetween, there is an advantage that the mechanical strength is further improved. Further, since the joining groove 21 of the joining block 12 is engraved in a shape in which five members of a flat conductor 5, a solder sheet 7, a flat conductor 3, a solder sheet 7, and a reinforcing copper plate 8 are superposed, five pieces are formed. The members can be smoothly accommodated in the joint groove 21 in the state of being superposed, and excellent work efficiency can be obtained as in the first embodiment.

Further, since the shape of the joint groove 21 matches the shape of the flat conductor 3, the solder sheet 7, the flat conductor 5, and the reinforcing copper plate 8 overlapped with each other, the five members may be displaced in the joint groove 21. Instead, the reinforcing copper plate 8 can improve the mechanical strength and suppress the decrease in the degree of adhesion between the members, so that low resistance bonding can be reliably realized.

In the fourth embodiment, the flat conductor 3, the solder sheet 7, the flat conductor 5, and the reinforcing copper plate 8 are housed in the joint groove 21, and then the three fixing brackets 16 are fastened. At this time, the depth dimension of the joint groove 21 is set so that the upper surface of the reinforcing copper plate 8 arranged on the uppermost side slightly exceeds the upper surface of the joint block 12.

Therefore, by tightening the fixing bracket 16 to the joint block 12, a strong adhesive force can be given to the flat conductor 3, the solder sheet 7, the flat conductor 5, and the reinforcing copper plate 8. Therefore, the degree of adhesion of the flat conductor 3, the solder sheet 7, and the flat conductor 5 can be further improved.

(Fifth Embodiment)
(Constitution)
As shown in FIG. 7, in the fifth embodiment, the joint groove 22 is formed in the center of the joint block 12. In the joint groove 22 according to the fifth embodiment, the flat conductor 3 is superposed on the upper surface and the lower surface of the flat conductor 5 with the solder sheet 7 sandwiched therein, and the reinforcing copper plate 8 is superposed on the lower side of the lower flat conductor 3. It is engraved in a shape in which a reinforcing copper plate 8 is superposed on the upper side of the flat conductor 3 on the upper side. The width dimension of the joint groove 22 is set to be substantially the same as the width dimension of the flat conductor 3, the flat conductor 5, the solder sheet 7, and the reinforcing copper plate 8.

As shown in FIG. 8, in the joint groove 22, the reinforcing copper plate 8, the flat conductor 3, the solder sheet 7, the flat conductor 5, the solder sheet 7, the flat conductor 3, and the reinforcing copper plate 8 are arranged in this order from the bottom. The seven members are housed in a superposed state. That is, the solder sheet 7, the flat conductor 3, and the reinforcing copper plate 8 are superposed vertically symmetrically with respect to the flat conductor 5 in order from the side closest to the flat conductor 5. When the seven members 8, 3, 7, 5, 7, 3, and 8 are housed in the joint groove 22, the upper surface of the reinforcing copper plate 8 arranged on the uppermost side is slightly the upper surface of the joint block 12. The depth dimension of the joint groove 22 is set to the extent that it exceeds.

(Action and effect)
In the fifth embodiment, by arranging the flat conductors 3 on both sides of the flat conductor 5, the surface area of the flat conductor 5 is maximized, and a large amount of the flat conductor 3 is efficiently adhered to the flat conductor 5. It can be joined and low resistance joining can be realized. Moreover, in the fifth embodiment, the solder sheet 7 is sandwiched between the two flat conductors 3, and the reinforcing copper plate 8 is joined to the outside of each flat conductor 3. That is, seven members, a reinforcing copper plate 8, a flat conductor 3, a solder sheet 7, a flat conductor 5, a solder sheet 7, a flat conductor 3, and a reinforcing copper plate 8, are superposed. Therefore, the mechanical strength is further improved.

In the fifth embodiment, the joint groove 22 of the joint block 12 has seven members: a reinforcing copper plate 8, a flat conductor 3, a solder sheet 7, a flat conductor 5, a solder sheet 7, a flat conductor 3, and a reinforcing copper plate 8. Is engraved in a superposed shape. Therefore, the seven members can be smoothly accommodated in the joint groove 22 while the seven members are superposed, and excellent work efficiency can be obtained.

Further, in the fifth embodiment, the shape of the joint groove 22 and the shape in which the reinforcing copper plate 8, the flat conductor 3, the solder sheet 7, the flat conductor 5, the solder sheet 7, the flat conductor 3 and the reinforcing copper plate 8 are superposed. Since the two members are in agreement with each other, the seven members do not shift from each other in the joint groove 22. Therefore, there is no concern that the degree of mutual adhesion between the flat conductor 3, the solder sheet 7, the flat conductor 5, and the reinforcing copper plate 8 will decrease, and low resistance bonding can be performed more stably.

(Other embodiments)
The embodiments described above are presented as an example of embodiments of the present invention, and are not intended to limit the scope of the invention. The embodiment of the present invention can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the gist of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, as well as in the invention described in the claims and the equivalent scope thereof.

For example, the solder material is not limited to the above-mentioned solder sheet 7, and may be a small-diameter ball-shaped or powder-shaped solder material. In a solder material having a small diameter in the form of balls or powder, since there is a distance between the solder materials, air at the solder joint portion easily escapes. Therefore, the voids in the solder joint portion can be reduced, and the degree of adhesion between the flat conductor 3 and the flat conductor 5 is further improved.

Only one alignment groove 13 and joint grooves 15, 21 and 22 according to the above embodiment are formed in the molding block 11 and the joint block 12, respectively, but the alignment groove 13 and the joint grooves 15, 21 and 22 are each formed. A plurality of blocks 11 and 12 may be formed. Further, in the joining block 12, the joining grooves 15, 21, and 22 are grooves having only a straight portion, but may be a joining groove 23 having a curved portion 23a, for example, as shown in FIG. Further, in the above embodiment, the molding block 11 and the joining block 12 are rectangular parallelepiped, but the present invention is not limited to this, and may be, for example, a disk-shaped member, which is aligned around the disk. The groove 13 and the joint groove 15 may be formed.

1 ... Conductor joining jig 2 ... Wire 3 ... Flat conductor 4 ... Joining surface 5 ... Flat conductor 6 ... Soldering part 7 ... Soldering sheet 8 ... Reinforcing copper plate 11 ... Molding block 12 ... Joining block 13 ... Alignment grooves 14, 16 ... Fixing metal fittings 15, 21, 22, 23 ... Joint grooves 17a to 17c ... Heater 18 ... Soldering springs 19a to 19c ... Thermocouple 20 ... Controller

Claims (9)

A conductor joining jig for joining a multi-core wire consisting of a plurality of wires and a flat conductor having a flat joining surface.
An alignment groove for aligning the plurality of the wire rods is engraved to a depth equal to or less than the diameter of the wire rod, and a flat conductor molding block for molding the flat conductor obtained by molding the multi-core wire rod into a flat shape, and
A joining block in which the flat conductor and the joining groove for joining the flat conductor are engraved in a shape in which the flat conductor, the solder material, and the flat conductor are superposed.
A heater that heats the solder material and solders the flat conductor and the flat conductor in a state where the flat conductor, the solder material, and the flat conductor are overlapped and accommodated in the joint groove.
Conductor joining jig equipped with. The conductor joining jig according to claim 1, wherein a pressure member for applying a fixing force to the flat conductor, the solder material, and the flat conductor, which are superposed in the joining groove, is attached to the joining block. With the thermocouple installed in the joint block,
The conductor joining jig according to claim 1 or 2, further comprising a heater control unit that controls the heater based on the measured value of the thermocouple. The conductor joining jig according to any one of claims 1 to 3, wherein the joining groove includes a straight portion or a curved portion. The conductor joining jig according to any one of claims 1 to 4, wherein the joining block is made of a soldering material that is difficult to melt. The conductor joining jig according to any one of claims 1 to 5, wherein the joining groove is a groove carved into a shape in which a reinforcing copper plate is superposed on the flat conductor or the flat conductor with the solder material sandwiched therein. .. The conductor joining jig according to any one of claims 1 to 6, wherein the joining groove is a groove in which the flat conductor is superposed on both sides of the joining surface of the flat conductor with the solder material sandwiched therein. Ingredients. The conductor joining jig according to any one of claims 1 to 7, wherein the solder material is made of any of sheet-shaped, ball-shaped, and powder-shaped members. The joint block is provided with the joint groove in the center of the joint block.
A plurality of the heaters are provided horizontally from the central portion of the joint block toward the outside, and heating is started from the heater located on the central portion side, and the heaters located on the outer side are gradually heated. Item 4. The conductor joining jig according to any one of Items 1 to 8.

Images