JP2020142256A - Flux and solder paste - Google Patents

Abstract

To provide a flux which imparts thixotropic properties and is excellent in printability, printing sag suppression capability and heating sag suppression capability, and a solder paste using the flux.SOLUTION: A flux contains a thixotropic agent, and any one or more kinds of a dimer acid, a trimer acid and a hydrogenated product thereof, in which the thixotropic agent is composed of a cyclic amide compound obtained by cyclic polycondensation of a dicarboxylic acid and/or tricarboxylic acid and diamine and/or triamine, and a non-cyclic amide compound obtained by non-cyclic polycondensation of a monocarboxylic acid, a dicarboxylic acid and/or tricarboxylic acid. The cyclic amide compound has the dicarboxylic acid and the tricarboxylic acid having 3 or more and 10 or less carbon atoms, the diamine and the triamine having 2 or more and 54 or less carbon atoms, contains 0.1 wt.% or more and 8.0 wt.% or less of the cyclic amide compound, 0.5 wt.% or more and 8.0 wt.% or less of the non-cyclic amide compound, and has the total amount of the cyclic amide compound and the non-cyclic amide compound of 1.5 wt.% or more and 10.0 wt.% or less.SELECTED DRAWING: None

Description

The present invention relates to a flux used for soldering and a solder paste using this flux.

Generally, the flux used for soldering chemically removes metal oxides present on the metal surface of the solder and the object to be soldered, allowing the movement of metal elements at the boundary between the two. Has the effect of soldering. Therefore, by performing soldering using flux, an intermetallic compound can be formed between the solder and the metal surface of the object to be bonded, and a strong bond can be obtained.

In such a soldering flux and a solder paste containing metal powder, thixotropy is imparted by the thixotropic agent contained in the flux. The thixotropic agent builds a network in the flux and imparts thixotropic properties. If the flux has thixotropic properties, the viscosity of the flux decreases when a shearing force is applied, so that workability such as printability is improved. In addition, by containing the thixotropy, the dripping of the solder paste after printing, which is called printing dripping, and the dripping of the solder paste when melting by heating, which is called heating dripping, are held by the network formed by the thixotropy, so that the flux The sagging is suppressed.

As the thixo agent, an amide-based thixo agent composed of an amide compound obtained by dehydration condensation of a fatty acid and an amine is used from the viewpoint of imparting tixo property, improving printability, and suppressing printing sagging and heating sagging (for example, Patent Documents). 1). Further, as the thixotropy, an ester-based thixotropy made of hydrogenated castor oil is used.

Japanese Patent No. 3350767

In the amide-based thixo agent, hydrogen bonds are easily formed in the molecule and between the molecules by the amide bond, and when it becomes a polymer, the compatibility is poor and uniform dispersion is difficult, so that the printability is not stable. Further, when the amount of the high molecular weight amide compound is increased, the viscosity becomes extremely high, so that the printability deteriorates. Further, even an ester thixotropy cannot sufficiently suppress heating sagging. In addition, the finish after mounting, such as the wettability and the presence or absence of poor wetting (dewetting), may be completely different due to the difference in the heat history at the time of soldering. Therefore, there is a need for a flux that enables stable and good-finished soldering regardless of the thermal history.

The present invention has been made to solve such a problem, and imparts chicivity, and has printability, ability to suppress print sagging, ability to suppress heat sagging, solder wettability, and occurrence of dewetting. It is an object of the present invention to provide a flux and a solder paste using the flux having an excellent ability to suppress the above.

A thixo agent consisting of a cyclic amide compound and a non-cyclic amide compound, and one or two of dimer acid, hydrogenated dimer acid obtained by adding hydrogen to dimer acid, trimer acid, and hydrogenated trimeric acid obtained by adding hydrogen to trimer acid. It has been found that the flux containing the above can improve the thixophilicity, and the solder paste containing the flux and the metal powder can improve the printability and suppress the printing sagging and the heating sagging. It was also found that when soldering is performed using this flux, the solder can be satisfactorily wetted and spread, and the occurrence of dewetting can be suppressed.

Therefore, in the present invention, the reaction product of monocarboxylic acid is dimer acid, which is a dimer, hydrogenated dimer acid obtained by adding hydrogen to dimer acid, and the reaction product of monocarboxylic acid is trimeric acid and trimer acid which are trimeric. Contains any of hydrogenated trimeric acid added to, or two or more of dimer acid, hydrogenated dimer acid, trimer acid, hydrogenated trimeric acid, rosin, thiolic acid, and solvent. , Cyclic amide compound and acyclic amide compound, containing cyclic amide compound in 0.1 wt% or more and 8.0 wt% or less, acyclic amide compound in 0.5 wt% or more and 8.0 wt% or less, and cyclic amide compound. And the total of the acyclic amide compound is 1.5 wt% or more and 10.0 wt% or less, and the cyclic amide compound has a molecular weight of 3000 or less in which dicarboxylic acid and / or tricarboxylic acid and diamine and / or triamine are cyclically polycondensed. The acyclic amide compound is a flux which is an amide compound in which a monocarboxylic acid, a dicarboxylic acid and / or a tricarboxylic acid and a monoamine, a diamine and / or a triamine are acyclically condensed.

The cyclic amide compound preferably has a dicarboxylic acid and a tricarboxylic acid having 3 or more and 10 or less carbon atoms, and the cyclic amide compound more preferably has a dicarboxylic acid and a tricarboxylic acid having 6 or more and 10 or less carbon atoms.

Further, the cyclic amide compound preferably has 2 or more and 54 or less carbon atoms of diamine and triamine, and more preferably the cyclic amide compound has 6 carbon atoms of diamine and triamine.

Further, the cyclic amide compound is preferably an amide compound in which a dicarboxylic acid having 3 or more and 10 or less carbon atoms and a diamine having 2 or more and 54 carbon atoms or less are cyclically polycondensed, and the cyclic amide compound has a carbon number of carbon atoms. More preferably, it is an amide compound in which a dicarboxylic acid having 6 or more and 10 or less and a diamine having 6 carbon atoms are cyclically polycondensed.

The cyclic amide compound has a dicarboxylic acid and a tricarboxylic acid having a carbon number of 3 to 10 and a diamine and a triamine having a carbon number of 2 to 54, and the acyclic amide compound has a monocarboxylic acid, a dicarboxylic acid and a tricarboxylic acid. It is preferable that the number of carbon atoms in the compound is 2 or more and 28 or less, and the number of carbon atoms of monoamine, diamine and triamine is 0 or more and 54 or less.

Further, the thixotropy preferably further contains an ester compound, and the thixotropy more preferably contains a hydrogenated castor oil as an ester compound.

Further, the thixotropy preferably contains 0.5 wt% or more and 1.5 wt% or less of the cyclic amide compound, 0.5 wt% or more and 4.0 wt% or less of the acyclic amide compound, and the thixotropy contains 0 wt% of the ester compound. It is preferable that the content is 8.0 wt% or less.

Further, any one of dimer acid, hydrogenated dimer acid, trimer acid and hydrogenated trimer acid, or two or more kinds of dimer acid, hydrogenated dimer acid, trimer acid and hydrogenated trimer acid are 0.5 wt% or more and 20 wt%. It is preferable to contain rosin in an amount of 30 wt% or more and 60 wt% or less.

Further, organic acids other than dimer acid, hydrogenated dimer acid, trimer acid, and hydrogenated trimer acid are 0 wt% or more and 10 wt% or less, amines are 0 wt% or more and 20 wt%, organic halogen compounds are 0 wt% or more and 5 wt% or less, amine halogens. It is preferable that the hydrohalate is contained in an amount of 0 wt% or more and 2 wt% or less, and the antioxidant is contained in an amount of 0 wt% or more and 5 wt% or less.

Further, the present invention is a solder paste containing the above-mentioned flux and metal powder.

In the thixo agent composed of the cyclic amide compound and the acyclic amide compound, the acyclic amide compound is crosslinked with the low molecular weight cyclic amide compound, and therefore, in the flux of the present invention, the comparison with the case where the thixo agent is composed of the acyclic amide compound. Therefore, the thixo property can be improved and the precipitation of the thixo agent can be suppressed without increasing the content of the acyclic amide compound. Further, dimer acid, hydrogenated dimer acid, trimer acid, and hydrogenated trimer acid have heat resistance in a temperature range expected in soldering and function as an activator at the time of soldering.

In the solder paste using this flux, it is possible to obtain good printability in which bleeding, blurring and the like are suppressed, and it is possible to suppress printing sagging in which the solder paste flows after printing. Further, it is possible to prevent the solder paste from sagging due to heating during soldering. In addition, it can show good wet spread even under a large heat load condition and can suppress the occurrence of dewetting.

It is a schematic diagram which shows the outline of the molecular structure of a dicarboxylic acid. It is a schematic diagram which shows the outline of the molecular structure of a diamine. It is a schematic diagram which shows the outline of the molecular structure of the acyclic amide compound. It is a schematic diagram which shows the outline of the molecular structure of the acyclic amide compound. It is a schematic diagram which shows the outline of the molecular structure of a cyclic amide compound. It is a schematic diagram which shows the outline of the molecular structure which crosslinked a non-cyclic amide compound with a cyclic amide compound.

<Example of flux of this embodiment>
The flux of the present embodiment is a dimer acid which is a dimer of a reaction product of a thixo agent, rosin and a monocarboxylic acid, a hydrogenated dimer acid obtained by adding hydrogen to the dimer acid, and a reaction product of a monocarboxylic acid. It contains any of trimer acid which is a quantity, hydrogenated trimeric acid obtained by adding hydrogen to trimeric acid, or two or more kinds of dimer acid, hydrogenated dimer acid, trimer acid, and hydrogenated trimer acid, and a solvent. The thixotropy comprises a cyclic amide compound and a non-cyclic amide compound.

The cyclic amide compound is a low molecular weight amide compound having a molecular weight of 3000 or less, particularly 1000 or less, in which a dicarboxylic acid and / or a tricarboxylic acid and a diamine and / or a triamine are cyclically polycondensed. The acyclic amide compound is an acyclic amide oligomer having a molecular weight of 3000 or less, which is a non-cyclic polycondensation of a monocarboxylic acid, a dicarboxylic acid and / or a tricarboxylic acid, and a monoamine, a diamine and / or a triamine, and a molecular weight of more than 3000. It is a non-cyclic polymer amide polymer.

FIG. 1 is a schematic diagram showing an outline of the molecular structure of a dicarboxylic acid, FIG. 2 is a schematic diagram showing an outline of the molecular structure of a diamine, and FIG. 3 is a schematic diagram showing an outline of the molecular structure of an acyclic amide compound. .. By polycondensing (dehydrating condensation) the dicarboxylic acid shown in FIG. 1 and the diamine shown in FIG. 2, an acyclic amide compound is synthesized as shown in FIG.

In the thixo agent composed of the acyclic amide compound shown in FIG. 3, the carboxyl group (COOH) of the dicarboxylic acid shown in FIG. 1 and the amino group (NH ₂ ) of the diamine shown in FIG. 2 are amide-bonded by polycondensation to form an amide group. A network is formed by hydrogen bonding of C (= O) -NH hydrogen (H) and oxygen (O) within and between molecules. The amide bond site is indicated by (A), and the hydrogen bond site is indicated by (B).

FIG. 4 is a schematic diagram showing an outline of the molecular structure of the acyclic amide compound. When the acyclic amide compound is polymerized, as shown in FIG. 4, hydrogen bonds (B) proceed in the molecule, so that the solubility (compatibility) in the flux becomes very poor, and the acyclic amide compound becomes coarse in the flux. Precipitation may occur, resulting in poor thixophilicity. Further, in the solder paste in which such a flux and a metal powder are mixed, printability is poor, and printing sagging and heating sagging occur.

Therefore, by using the cyclic amide compound in combination with the acyclic amide compound, the non-cyclic amide compound is crosslinked with the cyclic amide compound by a non-covalent interaction to construct a relatively uniform network of thixotropic agent components. , Suppresses excessive thiox agent precipitation.

FIG. 5 is a schematic diagram showing an outline of the molecular structure of the cyclic amide compound. By polycondensing the dicarboxylic acid shown in FIG. 1 and the diamine shown in FIG. 2, a cyclic amide compound is synthesized as a low molecular weight amide as shown in FIG.

Since the cyclic amide compound has higher symmetry than the acyclic amide compound, it has a property of being easily crystallized as compared with the acyclic low molecular weight amide. On the other hand, since the acyclic low molecular weight amide has a polar terminal group, it is easily compatible with the flux and difficult to crystallize, so that it is difficult to impart thixotropic property due to network formation. On the other hand, since the cyclic amide compound does not have a polar terminal group, it is difficult to be compatible with the flux and it is easy to impart thixotropic property due to network formation.

As a result, in the thixo agent composed of the cyclic amide compound and the acyclic amide compound, the hydrogen bond between the cyclic amide compound and the acyclic amide compound is promoted, and the hydrogen bond in the molecule of the acyclic amide compound is inhibited. It is thought that it will be done.

FIG. 6 is a schematic diagram showing an outline of a molecular structure in which a non-cyclic amide compound is crosslinked with a cyclic amide compound. In the thixo agent composed of the cyclic amide compound and the acyclic amide compound, as shown in FIG. 6, the cyclic amide compound and the acyclic amide compound are hydrogen-bonded (B), so that the cyclic amide compound is a non-cyclic amide compound. It is considered that a network of relatively uniform components bridged by covalent interactions is constructed.

Therefore, in the flux containing the thixotropic agent composed of the cyclic amide compound and the acyclic amide compound, the excessive precipitation of the thixotropic agent is suppressed and the thixotropic property is excellent as compared with the thixotropic agent composed of the cyclic amide compound. Further, the solder paste composed of a flux containing a thixo agent composed of a cyclic amide compound and a non-cyclic amide compound and a metal powder is excellent in printability, suppresses printing sagging, and further suppresses heating sagging.

Cyclic amide compounds and acyclic amide compounds are represented as [n + n] type when the number of carboxylic acids is n and the number of amines is n. The cyclic amide compound is constructed from the [1 + 1] type to the [n + n] type, preferably the [1 + 1] type to the [3 + 3] type, and particularly preferably the [2 + 2] type. FIG. 5 shows an example of a [2 + 2] type in which a dicarboxylic acid and a diamine are polycondensed cyclically, and the cyclic amide compound is preferably a [2 + 2] type in which a dicarboxylic acid and a diamine are polycondensed cyclically.

The cyclic amide compound is a [2 + 2] type in which tricarboxylic acid and diamine are polycondensed cyclically and one of the functional groups of the tricarboxylic acid is unbonded to another compound, and tricarboxylic acid and diamine are contained. Also included are the [2 + 3] type, which is polycondensed cyclically to form a cage-type structure, and the [3 + 2] type, in which dicarboxylic acid and triamine are polycondensed cyclically to form a cage-type structure.

As a result, the cyclic amide compound includes an amide oligomer in which dicarboxylic acid and diamine are cyclically polycondensed, an amide oligomer in which tricarboxylic acid and diamine are cyclically polycondensed, an amide oligomer in which dicarboxylic acid and triamine are cyclically polycondensed, and tricarboxylic acid. An amide oligomer in which triamine is cyclically polycondensed, an amide oligomer in which dicarboxylic acid and tricarboxylic acid and diamine are cyclically polycondensed, an amide oligomer in which dicarboxylic acid and tricarboxylic acid and triamine are cyclically polycondensed, and a dicarboxylic acid and diamine and triamine are cyclic. It may be any of an amide oligomer polycondensed with, an amide oligomer obtained by cyclically polycondensing tricarboxylic acid, diamine and triamine, and an amide oligomer obtained by cyclically polycondensing dicarboxylic acid and tricarboxylic acid with diamine and triamine.

Further, the acyclic amide compound is an amide compound in which a dicarboxylic acid and / or a tricarboxylic acid and a monoamine are acyclically polycondensed when the monocarboxylic acid and diamine and / or triamine are acyclically polycondensed. In some cases, for example, in the case of an amide compound containing a monocarboxylic acid or a monoamine, the monocarboxylic acid and the monoamine function as terminal molecules to form an acyclic amide oligomer having a reduced molecular weight. Further, the acyclic amide compound is an acyclic polymer-based amide polymer when it is an amidation site in which a dicarboxylic acid and / or a tricarboxylic acid and a diamine and / or a triamine are polycondensed in an acyclic manner. Further, the acyclic amide compound also includes an amide compound in which a monocarboxylic acid and a monoamine are polycondensed in a non-cyclic manner.

The reason why an amide compound in which a monocarboxylic acid and a monoamine are acyclically condensed can form a network will be described below.

The molecular structure of the monocarboxylic acid is shown in the following formula (1), the molecular structure of the monoamine is shown in the following formula (2), and the molecular structure of the acyclic amide compound in which the monocarboxylic acid and the monoamine are condensed is shown below. It is shown in equation (3).

The carboxyl group (COOH) of the monocarboxylic acid represented by the chemical formula (1) and the amino group (NH ₂ ) of the monoamine represented by the chemical formula ( ₂ ) are amide-bonded by condensation to form a non-formal compound (3). Cyclic amide compounds are formed. Further, hydrogen (H) and oxygen (O) of the amide group C (= O) -NH of the acyclic amide compound are connected by hydrogen bonding between the molecules. The intramolecular amide bond site of the acyclic amide compound is indicated by (A), and the intermolecular hydrogen bond site of the acyclic amide compound is indicated by (B).

In this way, monoamides (monoamides) having one amide group in the molecule are connected by hydrogen bonds. The aggregate of monoamides formed by hydrogen bonds is treated as a supramolecular. Supramolecules refer to aggregates of molecules constructed from non-covalent interactions such as hydrogen bonds and hydrophobic interactions. Hydrogen bonds show strong interaction and have a stable structure.

Acyclic amide compounds, which are monoamides in which monocarboxylic acids and monoamines are condensed, are linked by hydrogen bond-derived interaction with amide bonds, and in addition, molecular chains linked by hydrogen bond interactions, especially main chain amides. A hydrogen bond derived from the bond and an interaction between molecular chains due to a hydrophobic interaction by a side chain or the like form a bridging site and grow into a three-dimensional network.

As described above, the acyclic amide compound obtained by condensing a monocarboxylic acid and a monoamine has only one amide group, but can form a network by binding by a non-covalent interaction by a hydrogen bond.

Thereby, the acyclic amide compound may include an amide compound in which a monocarboxylic acid and a monoamine are polycondensed acyclically.

The cyclic amide compound contained as a thixo agent is an amide compound in which a dicarboxylic acid and / or a tricarboxylic acid and a diamine and / or a triamine are cyclically polycondensed, and has two or more amide groups.

As a result, when the cyclic amide compound is added to the thixo agent, the non-cyclic amide compound, which is an aggregate of monoamides connected by the interaction by hydrogen bonds, is connected via the cyclic amide compound.

In the solder paste using a flux in which the thixotropy contains a cyclic amide compound and a non-cyclic amide compound, it is considered that thixotropic property is imparted by forming a network of the cyclic amide compound and the acyclic amide compound.

However, if the contents of the cyclic amide compound and the non-cyclic amide compound are too small, a sufficient network cannot be formed, so that thixotropic property is not imparted.

On the other hand, in the case of a thixo agent which does not contain a cyclic amide compound or whose content of the cyclic amide compound is less than the amount specified in the present invention, when the acyclic amide compound becomes excessive, the non-cyclic amide compound is intramolecular or intermolecular. Excessively interacts with each other, and aggregation and precipitation are likely to occur.

As a result, the rheological characteristics of the flux are impaired (printability is poor due to crystal precipitation), and the thixotropic agent density is low in the portion where the aggregate is not formed, so that the thixotropic agent is substantially insufficient as described above. It is thought that it will not be effective.

On the other hand, a cyclic amide compound obtained by cyclically polycondensing dicarboxylic acid and / or tricarboxylic acid, diamine and / or triamine, monocarboxylic acid, dicarboxylic acid and / or tricarboxylic acid, monoamine, diamine and / or triamine. By using the acyclic amide compound condensed in a non-cyclical manner at the content specified in the present invention, the acyclic amide compound is crosslinked with the cyclic amide compound by a non-covalent interaction, and is relatively uniform. It is possible to construct a network of various tide agent components and suppress excessive tide agent precipitation. The effect of using the cyclic amide compound and the acyclic amide compound in combination is as long as the content of the cyclic amide compound and the acyclic amide compound is within the range specified in the present invention, even if the molecular weight of the acyclic amide compound is 3000 or less. It can be demonstrated even over 3000.

Further, the acyclic amide compound has the maximum molecular weight when the ratio of the total number of moles of the carboxyl groups of the dicarboxylic acid and / or the tricarboxylic acid to the total number of moles of the amino groups of the diamine and / or the triamine is 1: 1. Become. On the other hand, if the ratio of the total number of moles of the carboxyl groups of the dicarboxylic acid and / or the tricarboxylic acid to the total number of moles of the amino groups of the diamine and / or the triamine is 1: m or m: 1 (m> 1). , It becomes an acyclic amide oligomer with a reduced molecular weight. It is preferably 1: 2 to 2: 1.

The cyclic amide compound preferably has a dicarboxylic acid and a tricarboxylic acid having a carbon number of 3 or more and 10 or less, and the dicarboxylic acid and the tricarboxylic acid having a carbon number of 6 or more and 10 or less.

Further, the cyclic amide compound preferably has 2 or more and 54 or less carbon atoms of diamine and triamine, and 6 carbon atoms of diamine and triamine.

Further, the acyclic amide compound preferably has 2 or more and 28 or less carbon atoms of the monocarboxylic acid, dicarboxylic acid and tricarboxylic acid, and more preferably 2 or more carbon atoms of the monocarboxylic acid, dicarboxylic acid and tricarboxylic acid. It is 18 or less, more preferably 2 or more and 10 or less, and even more preferably 6 or more and 10 or less. The acyclic amide compound preferably has a monoamine, diamine, and triamine having 0 or more and 54 or less carbon atoms, and the monoamine, diamine, and triamine have more preferably 0 or more and 18 or less carbon atoms, and further preferably 0 or more and 10 or less carbon atoms. , More preferably 6 or more and 10 or less.

Examples of the dicarboxylic acid in the cyclic amide compound and the non-cyclic amide compound include adipic acid having 6 carbon atoms and sebacic acid having 10 carbon atoms.

The dicarboxylic acids in the cyclic amide compound and the non-cyclic amide compound are malonic acid having 3 carbon atoms, succinic acid having 4 carbon atoms, glutaric acid having 5 carbon atoms, pimelic acid having 7 carbon atoms, and suberic acid having 8 carbon atoms. Examples thereof include aliphatic dicarboxylic acids such as azelaic acid having 9 carbon atoms and cyclohexanedicarboxylic acid having 8 carbon atoms, and aromatic dicarboxylic acids such as phthalic acid having 6 carbon atoms and terephthalic acid having 6 carbon atoms.

Further, examples of the tricarboxylic acid in the cyclic amide compound and the non-cyclic amide compound include cyclohexanetricarboxylic acid having 9 carbon atoms and benzenetricarboxylic acid having 9 carbon atoms.

The monocarboxylic acid in the acyclic amide compound is acetic acid having 2 carbon atoms, palmitic acid having 16 carbon atoms, stearic acid having 18 carbon atoms, 12-hydroxystearic acid having 18 carbon atoms, behenic acid having 22 carbon atoms, and carbon. The number 28, such as montanic acid, can be mentioned.

Examples of the diamine in the cyclic amide compound and the non-cyclic amide compound include 1,6-hexanediamine.

The diamines in the cyclic amide compound and the non-cyclic amide compound are ethylene diamine having 2 carbon atoms, 1,3-diaminopropane having 3 carbon atoms, 1,4-diaminobutane having 4 carbon atoms, dimer diamine having 36 carbon atoms, and carbon. Examples thereof include phenylenediamine having a number of 6, metaxylylenediamine having 8 carbon atoms, paraxylylenediamine having 8 carbon atoms, and 2,4-diaminotoluene having 8 carbon atoms.

Further, examples of the triamine in the cyclic amide compound and the non-cyclic amide compound include triaminocyclohexane having 6 carbon atoms and trimer triamine having 54 carbon atoms.

Examples of the monoamine in the acyclic amide compound include ammonia having 0 carbon atoms, ethylamine having 2 carbon atoms, hexylamine having 6 carbon atoms, octylamine having 8 carbon atoms, and stearylamine having 18 carbon atoms.

Examples of the [1 + 1] type acyclic amide compound obtained by condensing a monocarboxylic acid and a monoamine include stearic acid amide and p-toluamide. Examples of the [1 + 1] type acyclic amide compound obtained by condensing a monocarboxylic acid and a diamine include ethylenediamine monostearic acid amide.

Examples of the [2 + 1] type acyclic amide compound obtained by condensing a monocarboxylic acid and a diamine include ethylenediamine bisstearic acid amide, ethylenediamine bispalmitic acid amide, and metaxylylenediamine bisstearic acid amide.

Examples of the [1 + 2] type acyclic amide compound obtained by condensing a dicarboxylic acid and a monoamine include succinic acid bisstearylamide, adipic acid bisstearylamide, and sebacic acid bisstearylamide.

The acyclic amide compound can be substituted by ring-opening polymerization of lactam, and examples thereof include 6-nylon obtained by ring-opening polymerization of ε-caprolactam and 12-nylon obtained by ring-opening polymerization of lauryl lactam.

The flux of the present embodiment contains the above-mentioned cyclic amide compound as a thixo agent in an amount of 0.1 wt% or more and 8.0 wt% or less, more preferably 0.5 wt% or more and 1.5 wt% or less in an acyclic amide compound. The compound is 0.5 wt% or more and 8.0 wt% or less, more preferably 0.5 wt% or more and 4.0 wt% or less of the acyclic amide compound, and the total of the cyclic amide compound and the acyclic amide compound is 1.5 wt%. % Or more and 10.0 wt% or less.

If the amount of the cyclic amide compound is less than 0.1 wt%, the thixotropic property deteriorates. In addition, printing sagging and heating sagging cannot be suppressed. On the other hand, when the amount of the cyclic amide compound is more than 8.0 wt%, the total amount of the amide thixotropy increases, so that precipitation occurs in the flux and the printability deteriorates. Even if the amount of the cyclic amide compound is 0.1 wt%, if the total of the cyclic amide compound and the non-cyclic amide compound is less than 1.5 wt%, the thixotropic property deteriorates. In addition, printing sagging and heating sagging cannot be suppressed. Even if the amount of the cyclic amide compound is less than 0.1 wt%, if the content of the non-cyclic amide compound increases, thixotropic property, printing sagging, and heating sagging are improved, but precipitation occurs in the flux, and precipitation occurs. Printability deteriorates.

Further, the flux of the present embodiment is any one of dimer acid, hydrogenated dimer acid, trimer acid and hydrogenated trimer acid, or two or more kinds of dimer acid, hydrogenated dimer acid, trimer acid and hydrogenated trimer acid. Is included in an amount of 0.5 wt% or more and 20 wt% or less. Dimeric acid and trimer acid have heat resistance in the temperature range expected in soldering and function as activators during soldering. The content of any one of dimer acid, hydrogenated dimer acid, trimer acid, hydrogenated trimer acid, or two or more of dimer acid, hydrogenated dimer acid, trimer acid and hydrogenated trimer acid is less than 0.5 wt%. If there is, the wettability of the solder and the ability to suppress poor wettability (dewetting) of the solder are deteriorated.

Dimeric acid and trimeric acid are reactants of dimeric acid, which is a reaction product of oleic acid and linoleic acid, trimeric acid, which is a reaction product of oleic acid and linoleic acid, dimer acid, which is a reaction product of acrylic acid, and acrylic acid. Trimmer acid, dimer acid which is a reaction product of methacrylic acid, trimer acid which is a reaction product of methacrylic acid, dimer acid which is a reaction product of acrylic acid and methacrylic acid, trimer acid which is a reaction product of acrylic acid and methacrylic acid, oleic acid Dimeric acid, which is a reaction product of acid, trimeric acid, which is a reaction product of oleic acid, dimer acid, which is a reaction product of linoleic acid, trimeric acid, which is a reaction product of linoleic acid, and dimer acid, linolene, which is a reaction product of linolenic acid. Trimmer acid, which is a reaction product of acid, dimer acid, which is a reaction product of acrylic acid and oleic acid, trimer acid, which is a reaction product of acrylic acid and oleic acid, dimer acid, which is a reaction product of acrylic acid and linoleic acid, acrylic acid. Trimmer acid, which is a reaction product of and linoleic acid, dimer acid, which is a reaction product of acrylic acid and linolenic acid, trimer acid, which is a reaction product of acrylic acid and linolenic acid, and dimer acid, which is a reaction product of methacrylic acid and oleic acid. Trimmer acid, which is a reaction product of methacrylic acid and oleic acid, dimer acid, which is a reaction product of methacrylic acid and linoleic acid, trimer acid, which is a reaction product of methacrylic acid and linoleic acid, and dimer, which is a reaction product of methacrylic acid and linolenic acid. Acid, trimeric acid, which is a reaction product of methacrylic acid and linolenic acid, dimer acid, which is a reaction product of oleic acid and linolenic acid, trimeric acid, which is a reaction product of oleic acid and linolenic acid, and reaction product of linoleic acid and linolenic acid. Certain dimeric acid, trimeric acid which is a reaction product of linoleic acid and linolenic acid, hydrogenated dimeric acid which is a hydrogenated product of each of the above-mentioned dimeric acids, and hydrogenated trimeric acid which is a hydrogenated product of each of the above-mentioned trimeric acids. Can be mentioned. For example, dimeric acid, which is a reaction product of oleic acid and linoleic acid, is a dimer having 36 carbon atoms. Further, trimeric acid, which is a reaction product of oleic acid and linoleic acid, is a trimer having 54 carbon atoms.

The flux of the present embodiment contains rosin in an amount of 30 wt% or more and 60 wt% or less, more preferably rosin in an amount of 35 wt% or more and 60 wt% or less.

The flux of the present embodiment may further contain organic acids other than dimer acid, hydrogenated dimer acid, trimer acid, hydrogenated trimer acid, amines, and halogens, and contains 0 wt% or more and 10 wt% of other organic acids. Hereinafter, more preferably, other organic acids are 0.2 wt% or more and 5 wt% or less, amines are 0 wt% or more and 20 wt% or less, more preferably amines are 0 wt% or more and 5 wt% or less, and organic halogen compounds are 0 wt% as halogens. It contains 5 wt% or more and 0 wt% or more and 2 wt% or less of amine hydrohalide.

The flux of the present embodiment may contain an ester compound as a thixotropic agent, and contains 0 wt% or more and 8.0 wt% or less of the ester compound, and more preferably 0 wt% or more and 4.0 wt% or less of the ester compound.

The flux of the present embodiment may further contain an antioxidant, and contains 0 wt% or more and 5 wt% or less of the antioxidant. The balance of the flux of the present embodiment is a solvent.

Examples of the rosin include raw material rosins such as gum rosin, wood rosin and tall oil rosin, and derivatives obtained from the raw material rosin. Examples of the derivative include purified rosin, hydrogenated rosin, disproportionated rosin, polymerized rosin, acid-modified rosin, phenol-modified rosin and α, β-unsaturated carboxylic acid-modified products (acrylicized rosin, maleated rosin, and fumarized products). (Rosin, etc.), and purified products, hydrides and disproportionated products of the polymerized rosin, and purified products, hydrides and disproportionated products of the α, β unsaturated carboxylic acid modified products, and one of them or Two or more types can be used.

Other organic acids include glutaric acid, adipic acid, azelaic acid, eikosandioic acid, citric acid, glycolic acid, succinic acid, salicylic acid, diglycolic acid, dipicolinic acid, dibutylaniline diglycolic acid, suberic acid, sebacic acid, Thioglycolic acid, terephthalic acid, dodecanedioic acid, parahydroxyphenylacetic acid, picolinic acid, phenylsuccinic acid, phthalic acid, fumaric acid, maleic acid, malonic acid, lauric acid, benzoic acid, tartaric acid, tris isocyanurate (2-carboxy) Ethyl), glycine, 1,3-cyclohexanedicarboxylic acid, 2,2-bis (hydroxymethyl) propionic acid, 2,2-bis (hydroxymethyl) butanoic acid, 2,3-dihydroxybenzoic acid, 2,4-diethyl Examples thereof include glutaric acid, 2-quinolincarboxylic acid, 3-hydroxybenzoic acid, malic acid, p-anisic acid, stearic acid, 12-hydroxystearic acid, oleic acid, linoleic acid and linolenic acid.

Examples of amines include monoethanolamine, diphenylguanidine, ethylamine, triethylamine, ethylenediamine, triethylenetetramine, 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1,2-dimethylimidazole, 2-ethyl-4. -Methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2 − Undecyl imidazole, 1-cyanoethyl-2-ethyl-4-methyl imidazole, 1-cyanoethyl-2-phenyl imidazole, 1-cyanoethyl-2-undecyl imidazolium trimerite, 1-cyanoethyl-2-phenyl imidazolium Trimeritate, 2,4-diamino-6- [2'-methylimidazolyl- (1')]-ethyl-s-triazine, 2,4-diamino-6- [2'-undecylimidazolyl- (1') )]-Ethyl-s-triazine, 2,4-diamino-6- [2'-ethyl-4'-methylimidazolyl- (1')]-ethyl-s-triazine, 2,4-diamino-6- [ 2'-methylimidazolyl- (1')] -ethyl-s-triazine isocyanuric acid adduct, 2-phenylimidazole isocyanuric acid adduct, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl -5-Hydroxymethylimidazole, 2,3-dihydro-1H-pyrrolo [1,2-a] benzimidazole, 1-dodecyl-2-methyl-3-benzylimidazolium chloride, 2-methylimidazoline, 2-phenylimidazoline , 2,4-Diamino-6-vinyl-s-triazine, 2,4-diamino-6-vinyl-s-triazine isocyanuric acid adduct, 2,4-diamino-6-methacryloyloxyethyl-s-triazine, epoxy -Imidazole adduct, 2-methylbenzoimidazole, 2-octylbenzoimidazole, 2-pentylbenzoimidazole, 2- (1-ethylpentyl) benzoimidazole, 2-nonylbenzoimidazole, 2- (4-thiazolyl) benzoimidazole, benzo Imidazole, 2- (2'-hydroxy-5'-methylphenyl) benzotriazole, 2- (2'-hydroxy-3'-tert- Butyl-5'-methylphenyl) -5-chlorobenzotriazole, 2- (2'-hydroxy-3', 5'-di-tert-amylphenyl) benzotriazole, 2- (2'-hydroxy-5'- tert-octylphenyl) benzotriazole, 2,2'-methylenebis [6- (2H-benzotriazole-2-yl) -4-tert-octylphenol], 6- (2-benzotriazolyl) -4-tert- Octyl-6'-tert-butyl-4'-methyl-2,2'-methylenebisphenol, 1,2,3-benzotriazole, 1- [N, N-bis (2-ethylhexyl) aminomethyl] benzotriazole, Carboxybenzotriazole, 1- [N, N-bis (2-ethylhexyl) aminomethyl] methylbenzotriazole, 2,2'-[[(methyl-1H-benzotriazole-1-yl) methyl] imino] bisethanol, 1- (1', 2'-dicarboxyethyl) benzotriazole, 1- (2,3-dicarboxypropyl) benzotriazole, 1-[(2-ethylhexylamino) methyl] benzotriazole, 2,6-bis [ (1H-benzotriazole-1-yl) methyl] -4-methylphenol, 5-methylbenzotriazole, 5-phenyltetrazole and the like can be mentioned.

Examples of the organic halogen compound include trans-2,3-dibromo-1,4-butenediol, triallyl isocyanurate hexabromide, 1-bromo-2-butanol, 1-bromo-2-propanol and 3-bromo-1-. Propanol, 3-bromo-1,2-propanediol, 1,4-dibromo-2-butanol, 1,3-dibromo-2-propanol, 2,3-dibromo-1-propanol, 2,3-dibromo-1 , 4-Butandiol, 2,3-dibromo-2-butene-1,4-diol and the like.

The amine hydrogen halide is a compound obtained by reacting an amine with hydrogen halide, and examples thereof include aniline hydrogen chloride and aniline hydrogen bromide. As the amine of the amine halogenated hydride, the above-mentioned amine can be used, and examples thereof include ethylamine, ethylenediamine, triethylamine, methylimidazole, 2-ethyl-4-methylimidazole, and the hydrogen halide includes chlorine. Examples thereof include bromine, iodine, and hydrides of fluorine (hydrogen chloride, hydrogen bromide, hydrogen iodide, hydrogen fluoride). Further, borofluoride may be contained in place of the amine hydrohalide or in combination with the amine halide hydride, and examples of the borofluoride include borofluoric acid.

Examples of the solvent include water, alcohol solvents, glycol ether solvents, terpineols and the like. As alcohol-based solvents, isopropyl alcohol, 1,2-butanediol, isobornylcyclohexanol, 2,4-diethyl-1,5-pentanediol, 2,2-dimethyl-1,3-propanediol, 2,5 -Diol-2,5-hexanediol, 2,5-dimethyl-3-hexine-2,5-diol, 2,3-dimethyl-2,3-butanediol, 1,1,1-tris (hydroxymethyl) Ethan, 2-ethyl-2-hydroxymethyl-1,3-propanediol, 2,2'-oxybis (methylene) bis (2-ethyl-1,3-propanediol), 2,2-bis (hydroxymethyl) -1,3-propanediol, 1,2,6-trihydroxyhexane, bis [2,2,2-tris (hydroxymethyl) ethyl] ether, 1-ethynyl-1-cyclohexanol, 1,4-cyclohexanediol , 1,4-Cyclohexanedimethanol, erythritol, treitol, guayacol glycerol ether, 3,6-dimethyl-4-octin-3,6-diol, 2,4,7,9-tetramethyl-5-decine-4 , 7-diol and the like. Examples of the glycol ether solvent include hexyl diglycol, diethylene glycol mono-2-ethylhexyl ether, ethylene glycol monophenyl ether, 2-methylpentane-2,4-diol, diethylene glycol dibutyl ether, and triethylene glycol monobutyl ether. Examples of the ester compound as a thixotropy include hydrogenated castor oil. Examples of the antioxidant include a hindered phenolic antioxidant and the like.

<Example of solder paste of this embodiment>
The solder paste of the present embodiment contains the above-mentioned flux and metal powder. The metal powder is a solder powder of Sn alone, Sn-Ag type, Sn-Cu type, Sn-Ag-Cu type, Sn-Bi type, Sn-In type, etc., or Sb, an alloy thereof. It is composed of a powder of a solder alloy to which Bi, In, Cu, Zn, As, Ag, Cd, Fe, Ni, Co, Au, Ge, P, Pb and the like are added.

The solder alloy has As: 25 mass ppm or more and 300 mass ppm or less, Sb: 0 mass ppm or more and 3000 mass ppm or less, Bi: 0 mass ppm or more and 10000 mass ppm or less, and Pb: 0 mass ppm or more and 5100 mass ppm or less. It is preferable to have an alloy composition of at least one type and the balance of Sn. The solder alloy may further contain at least one of Ag: 0% by mass or more and 4% by mass or less and Cu: 0% by mass or more and 0.9% by mass or less.

As is an element capable of suppressing the change in viscosity of the solder paste with time. It is presumed that As has low reactivity with flux and is a noble element for Sn, so that it can exert an effect of suppressing thickening. The lower limit of the As content is, for example, 25 mass ppm or more, preferably 50 mass ppm or more, and more preferably 100 mass ppm or more. On the other hand, if the amount of As is too large, the wettability of the solder alloy deteriorates. The upper limit of the As content is, for example, 300 mass ppm or less, preferably 250 mass ppm or less, and more preferably 200 mass ppm or less.

Sb is an element that has low reactivity with flux and exhibits an effect of suppressing thickening. When the solder alloy contains Sb, the lower limit of the Sb content is, for example, more than 0 mass ppm, preferably 25 mass ppm or more, more preferably 50 mass ppm or more, still more preferably 100 mass ppm or more. It is particularly preferably 300 mass ppm or more. On the other hand, if the Sb content is too large, the wettability deteriorates, so it is necessary to set the content to an appropriate level. The upper limit of the Sb content is, for example, 3000 mass ppm or less, preferably 1150 mass ppm or less, and more preferably 500 mass ppm or less.

Like Sb, Bi and Pb are elements that have low reactivity with flux and exhibit an effect of suppressing thickening. Further, Bi and Pb are elements that can suppress deterioration of wettability due to As because the liquidus temperature of the solder alloy is lowered and the viscosity of the molten solder is reduced.

If at least one element of Sb, Bi and Pb is present, deterioration of wettability due to As can be suppressed. When the solder alloy contains Bi, the lower limit of the Bi content is, for example, more than 0 mass ppm, preferably 25 mass ppm or more, more preferably 50 mass ppm or more, still more preferably 75 mass ppm or more. It is particularly preferably 100 mass ppm or more, and most preferably 250 mass ppm or more. When the solder alloy contains Pb, the lower limit of the Pb content is more than 0 mass ppm, preferably 25 mass ppm or more, more preferably 50 mass ppm or more, and further preferably 75 mass ppm or more. , Especially preferably 100 mass ppm or more, and most preferably 250 mass ppm or more.

On the other hand, if the content of these elements is too large, the solidus temperature is remarkably lowered, so that ΔT, which is the temperature difference between the liquidus temperature and the solidus temperature, becomes too wide. If ΔT is too wide, the liquid phase Bi and Pb will be concentrated because a high melting point crystal phase having a low content of Bi and Pb is precipitated in the solidification process of the molten solder. After that, when the temperature of the molten solder is further lowered, the low melting point crystal phase having a high concentration of Bi and Pb is segregated. Therefore, the mechanical strength and the like of the solder alloy are deteriorated, and the reliability is deteriorated. In particular, since the crystal phase having a high Bi concentration is hard and brittle, segregation in the solder alloy significantly lowers the reliability.

From this point of view, when the solder alloy contains Bi, the upper limit of the Bi content is, for example, 10000 mass ppm or less, preferably 1000 mass ppm or less, more preferably 600 mass ppm or less, and further. It is preferably 500 mass ppm or less. When the solder alloy contains Pb, the upper limit of the Pb content is, for example, 5100 mass ppm or less, preferably 5000 mass ppm or less, more preferably 1000 mass ppm or less, and further preferably 850 mass ppm or less. It is particularly preferably 500 mass ppm or less.

The solder alloy preferably satisfies the following equation (1).

275≤2As + Sb + Bi + Pb ... (1)
In the above formula (1), As, Sb, Bi, and Pb each represent the content (mass ppm) in the alloy composition.

As, Sb, Bi and Pb are all elements that have an effect of suppressing thickening. The total of these is preferably 275 mass ppm or more. The reason why the As content is doubled in the formula (1) is that As has a higher effect of suppressing thickening than Sb, Bi and Pb.

The lower limit of the equation (1) is preferably 350 or more, more preferably 1200 or more. On the other hand, the upper limit of (1) is not particularly limited from the viewpoint of the thickening suppressing effect, but is preferably 25200 or less, more preferably 10200 or less, from the viewpoint of setting ΔT in a suitable range. It is more preferably 5300 or less, and particularly preferably 3800 or less.

The following equations (1a) and (1b) are those in which the upper limit and the lower limit are appropriately selected from the above preferred embodiments.

275 ≦ 2As + Sb + Bi + Pb ≦ 25200 ... (1a)
275 ≦ 2As + Sb + Bi + Pb ≦ 5300 ... (1b)
In the above equations (1a) and (1b), As, Sb, Bi, and Pb each represent the content (mass ppm) in the alloy composition.

The solder alloy preferably satisfies the following equation (2).

0.01 ≦ (2As + Sb) / (Bi + Pb) ≦ 10.00 ... (2)
In the above equation (2), As, Sb, Bi, and Pb each represent the content (mass ppm) in the alloy composition.

If the contents of As and Sb are large, the wettability of the solder alloy deteriorates. On the other hand, Bi and Pb suppress the deterioration of wettability due to the inclusion of As, but if the content is too large, ΔT increases. In particular, in an alloy composition containing Bi and Pb at the same time, ΔT tends to increase. In view of these, if the contents of Bi and Pb are increased to excessively improve the wettability, ΔT will spread. On the other hand, if the content of As and Sb is increased to improve the effect of suppressing thickening, the wettability is deteriorated. Therefore, it is divided into As and Sb groups, Bi and Pb groups, and when the total amount of both groups is within an appropriate predetermined range, the thickening suppressing effect, the narrowing of ΔT, and the wettability are all simultaneously. It will be satisfied.

If the number (2) is less than 0.01, the total content of Bi and Pb is relatively large as compared with the total content of As and Pb, so that ΔT spreads. The lower limit of the equation (2) is preferably 0.02 or more, more preferably 0.41 or more, further preferably 0.90 or more, particularly preferably 1.00 or more, and most preferably. Is 1.40 or more. On the other hand, when the equation (2) exceeds 10.00, the total content of As and Sb becomes relatively larger than the total content of Bi and Pb, so that the wettability deteriorates. The upper limit of (2) is preferably 5.33 or less, more preferably 4.50 or less, still more preferably 2.67 or less, and particularly preferably 2.30 or less.

The denominator of the number (2) is "Bi + Pb", and the number (2) cannot be established unless these are included. Therefore, the solder alloy preferably contains at least one of Bi and Pb. The alloy composition containing no Bi and Pb is inferior in wettability as described above.

The following equation (2a) is obtained by appropriately selecting the upper limit and the lower limit from the above preferred embodiments.

0.31 ≦ (2As + Sb) / (Bi + Pb) ≦ 10.00 ... (2a)
In the above formula (2a), As, Sb, Bi and Pb each represent the content (mass ppm) in the alloy composition.

Ag is an optional element capable of forming Ag3Sn at the crystal interface to improve the reliability of the solder alloy. In addition, Ag is an element whose ionization coefficient is noble with respect to Sn, and when it coexists with As, Pb, and Bi, it promotes the effect of suppressing thickening of these elements. The Ag content is preferably 0% by mass or more and 4% by mass or less, more preferably 0.5% by mass or more and 3.5% by mass or less, and further preferably 1.0% by mass or more and 3.0% by mass or less. Is.

Cu is an optional element that can improve the joint strength of solder joints. Further, Cu is an element whose ionization coefficient is noble with respect to Sn, and when it coexists with As, Pb, and Bi, it promotes the effect of suppressing thickening of these elements. The Cu content is preferably 0% by mass or more and 0.9% by mass or less, more preferably 0.1% by mass or more and 0.8% by mass or less, and further preferably 0.2% by mass or more and 0.7% by mass. % Or less.

The balance of the solder alloy is preferably Sn. The solder alloy may contain unavoidable impurities in addition to the above-mentioned elements. Even if it contains unavoidable impurities, it does not affect the above-mentioned effects. If the content of In is too large, ΔT spreads, and therefore, if it is 1000 mass ppm or less, it does not affect the above-mentioned effect.

<Example of action and effect of flux and solder paste of this embodiment>
Tixo agent and any one of dimer acid, hydrogenated dimer acid, trimer acid, hydrogenated trimer acid, or two or more kinds of dimer acid, hydrogenated dimer acid, trimer acid, hydrogenated trimer acid, rosin and solvent. In the flux in which the thixo agent is composed of a cyclic amide compound and an acyclic amide compound, the thixo property is improved without increasing the content of the acyclic amide compound as compared with the case where the thixo agent is composed of a non-cyclic amide compound. It can be improved and the precipitation of the thixo agent can be suppressed. In the solder paste using this flux, it is possible to obtain good printability in which bleeding, blurring and the like are suppressed, and it is possible to suppress printing sagging in which the solder paste flows after printing. Further, it is possible to prevent the solder paste from sagging due to heating during soldering.

Further, dimer acid, hydrogenated dimer acid, trimer acid, and hydrogenated trimer acid have heat resistance in a temperature range expected in soldering and function as an activator at the time of soldering. As a result, a flux containing any one or more of dimer acid, hydrogenated dimer acid, trimer acid, and hydrogenated trimer acid, and a solder paste using this flux can be used even under reflow conditions with a large heat load. The solder can be satisfactorily wetted and spread, and the occurrence of poor wetting (dewetting) of the solder can be suppressed.

An aromatic organic acid can be mentioned as an organic acid having heat resistance. However, although the aromatic organic acid has heat resistance, its activity as a flux is originally weak, so that the amount added is naturally large. Then, it tends to remain as a residue, resulting in problems such as poor detergency and precipitation.

On the other hand, if dimer acid, trimer acid, and water additives thereof are used, both heat resistance and activity can be achieved, and the amount added as an activator can be reduced, so that the residue is reduced and the detergency is improved. Can be made to.

The fluxes of Examples and Comparative Examples are blended with the compositions shown in Tables 1, 2 and 3 below, and the solder paste is blended using this flux to suppress the chicosis of the flux and the printing sagging of the solder paste. The ability, printability, ability to suppress heating sagging, ability to spread solder wettability, and ability to suppress poor wetting (dewetting) of solder were verified. The composition ratios in Tables 1, 2 and 3 are wt (weight)% when the total amount of flux is 100.

The solder paste has a flux of 11.0 wt% and a metal powder of 89.0 wt%. Further, the metal powder in the solder paste is a Sn-Ag-Cu based solder alloy in which Ag is 3.0% by mass, Cu is 0.5% by mass, and the balance is Sn, when the total amount of the metal powder is 100. The average particle size of the metal powder is φ20 μm.

<Evaluation of thixotropy of flux>
(1) Verification method The evaluation of thixotropic property was carried out in accordance with JIS Z3284-3 4.2 using a spiral viscometer. The rotation speed of the viscometer was set to 3 rpm and 30 rpm, and the viscosity after rotation for a predetermined time was read to calculate the thixotropy.

(2) Judgment criteria 〇 〇: Thixotropy ratio is 0.60 or more 〇: Thixotropy ratio is 0.30 or more and less than 0.60 ×: Thixotropy ratio is less than 0.30

<Evaluation of solder paste's ability to suppress printing sagging>
(1) Verification method The evaluation of the printing sagging suppression ability of the solder paste conforms to JIS Z3284-3 4.3, and the solder is used on a copper plate using a stainless metal mask in which the solder paste printing portion is formed in a predetermined pattern. After printing the paste and removing the metal mask, store it at room temperature 25 ± 5 ° C. and relative humidity 50 ± 10% for 10 to 20 minutes, and among the printed patterns, not all the printed solder pastes are integrated. The minimum interval was visually confirmed. The thickness of the metal mask is 0.2 mm, the solder paste printing portion has a quadrangular opening, and the size is 3.0 × 1.5 mm. In the solder paste printing section, multiple openings of the same size are lined up at different intervals, and the opening interval L is 0.2-0.3-0.4-0.5-0.6-0.7-. It is 0.8-0.9-1.0-1.1-1.2 mm.

(2) Judgment criteria 〇: The minimum distance that does not become one after printing is 0.2 mm or less ×: The minimum distance that does not become one after printing exceeds 0.2 mm

<Evaluation of printability of solder paste>
(1) Verification method The printability of the solder paste is evaluated in accordance with JIS Z3284-3 4.1, and the solder paste is applied to the copper plate using a stainless metal mask in which the solder paste printing portion is formed in a predetermined pattern. After printing, it was visually confirmed that there was no bleeding or blurring at the initial stage of printing and during continuous printing.

(2) Judgment criteria 〇: No bleeding or blurring after printing ×: There is bleeding or blurring after printing

<Evaluation of the ability of solder paste to suppress heating sagging>
(1) Verification method The evaluation of the ability to suppress heating sagging of solder paste conforms to JIS Z3284-3 4.4, and the solder is used on a copper plate using a stainless metal mask in which a solder paste printing portion is formed in a predetermined pattern. After printing the paste and removing the metal mask, the paste was heated at 150 ± 10 ° C. for 10 minutes, and the minimum interval at which all the printed solder pastes were not integrated was visually confirmed among the printed patterns. The thickness of the metal mask is 0.2 mm, the solder paste printing portion has a quadrangular opening, and the size is 3.0 × 1.5 mm. In the solder paste printing section, multiple openings of the same size are lined up at different intervals, and the opening interval L is 0.2-0.3-0.4-0.5-0.6-0.7-. It is 0.8-0.9-1.0-1.1-1.2 mm.

(2) Judgment criteria 〇: Minimum distance not integrated is 1.0 mm or less ×: Minimum distance not integrated is more than 1.0 mm

<Evaluation of wet spread of solder>
(1) Verification method In the evaluation test of the wet spread of the solder, a solder paste in which the flux described in each Example and each Comparative Example and the above-mentioned metal powder are mixed is used in a predetermined pattern described in JIS Z 3284-3. Using a stainless steel mask on which a printing portion of solder paste is formed, printing is performed on a Barre-Cu plate having a length of 50 mm, a width of 50 mm, and a thickness of 0.5 mm.

The printed portion provided on the mask has a quadrangular opening, and the size is 3.0 mm × 1.5 mm. In the printing section, multiple openings of the same size are lined up at different intervals, and the intervals between the openings are 0.2-0.3-0.4-0.5-0.6-0.7-0.8. It is -0.9-1.0-1.1-1.2 mm.

After printing the solder paste, the mask is removed, and before the reflow, it is confirmed that the solder paste is not in contact at the minimum interval of 0.2 mm between the parallel printing portions, and the reflow is performed. The conditions for reflow are that after preheating at 190 ° C. for 120 sec in an air atmosphere, the temperature is raised from 190 ° C. to 260 ° C. at a heating rate of 1 ° C./sec to perform the main heating.

(2) Judgment Criteria Check the intervals between the points where the solder paste printed at the above-mentioned predetermined intervals wets and spreads after reflowing and comes into contact with each other and fused. At N = 4, 〇: All locations where the interval L is 0.8 mm or less are fused.
X: Not fused at a location where the interval L is 0.8 mm or less even at one location.

<Evaluation of solder dewetting suppression>
(1) Verification method In the evaluation test of solder dewetting suppression, a solder paste in which the flux described in each Example and each Comparative Example and the above-mentioned metal powder are mixed is mixed with Cu having a length of 0.8 mm and a width of 0.8 mm. -Printed on OSP land and reflowed. The print thickness of the solder paste is 0.12 mm. The conditions for reflow are that after preheating at 190 ° C. for 120 sec in an air atmosphere, the temperature is raised from 190 ° C. to 260 ° C. at a heating rate of 1 ° C./sec to perform the main heating.

(2) Judgment Criteria It was observed using an optical microscope whether or not dewet Dw was generated after the reflow. At N = 12, ◯: All the portions coated with the solder composition are in a state of being wet with solder.
X: Most of the portion coated with the solder composition is in a wet state with solder (including dewetting), and poor wetting occurs. Alternatively, the solder does not appear to be wet, and the molten solder is in a state of one or more solder balls (non-wetting).

<Comprehensive evaluation>
〇: Evaluation of the texotic property of the flux is 〇 〇 or 〇, and evaluation of the ability to suppress printing sagging of solder paste, evaluation of printability of solder paste, evaluation of ability to suppress heating dripping of solder paste, evaluation of wet spread of solder , All of the evaluations of solder dewetting suppression were 〇: Evaluation of flux chicosis, evaluation of solder paste print sagging suppression ability, evaluation of solder paste printability, solder paste heating sagging suppression ability Any or all of the evaluation, the evaluation of the wet spread of the solder, and the evaluation of the dewetting suppression of the solder were x.

In Examples 1 to 4, dimer acid and trimer acid were changed. In Example 1, hydrogenated dimer acid was added as dimer acid and trimer acid in an amount of 5.0 wt% within the range specified in the present invention. It contains, as rosin, polymerized rosin in an amount of 45.0 wt% within the range specified in the present invention. Further, as a thixo agent, a cyclic amide compound obtained by cyclically polycondensing sebacic acid, which is a dicarboxylic acid having 10 carbon atoms, and 1,6-hexanediamine, which is a diamine having 6 carbon atoms, is defined in the present invention. This acyclic amide compound is an acyclic polycondensation of sebacic acid, which is a dicarboxylic acid having 2.0 wt% and 10 carbon atoms, and 1,6-hexanediamine, which is a diamine having 6 carbon atoms. It contains 4.0 wt% within the range specified in the invention. The total content of the cyclic amide compound and the non-cyclic amide compound is 6.0 wt%, which is within the range specified in the present invention. Further, the present invention contains 2-phenylimidazole as an amine in an amount of 2.0 wt% within the range specified in the present invention, and trans-2,3-dibromo-2-butene-1,4-diol as an organic halogen compound. It contains 1.0 wt% within the range specified in the present invention, and contains 41.0 wt% of tetraethylene glycol monomethyl ether using the balance as a solvent within the range specified in the present invention.

In Example 1, the thixotropy ratio was 0.60 or more, the thixotropy of the flux could be improved, a sufficient effect on the thixotropy was obtained, and the precipitation of the thixotropy could be suppressed. Further, in the solder paste using this flux, the minimum interval that does not become integrated after printing is 0.2 mm or less, and it is possible to suppress the printing sagging of the solder paste flowing after printing, and to suppress the printing sagging of the solder paste. A sufficient effect was obtained for Noh. Further, after printing, no bleeding or blurring was observed, and good printability with suppressed bleeding, blurring, etc. could be obtained, and a sufficient effect on printability was obtained. In addition, the minimum interval that does not become one after heating is 1.0 mm or less, and it is possible to suppress the heating sagging of the solder paste due to heating during soldering, and a sufficient effect on the ability to suppress the heating sagging can be obtained. Soldering. Further, after the reflow, all the places where the interval L was 0.8 mm or less were fused, and a sufficient effect on the wettability was obtained. In addition, all the portions coated with the solder composition were in a wet state with solder, and a sufficient effect on the dewetting suppressing ability was obtained.

In Example 2, dimer acid and dimer acid as trimer acid are contained in an amount of 5.0 wt% within the range specified in the present invention. Others are the same as in Example 1, and the polymerized rosin is contained as the rosin in an amount of 45.0 wt% within the range specified in the present invention. Further, as a thixo agent, a cyclic amide compound obtained by cyclically polycondensing sebacic acid and 1,6-hexanediamine is contained in an amount of 2.0 wt% within the range specified in the present invention, and sebacic acid and 1,6-hexanediamine are contained. Contains 4.0 wt% of the acyclic amide compound polycondensed in an acyclic manner within the range specified in the present invention. The total amount of the cyclic amide compound and the acyclic amide compound is 6.0 wt%, which is within the range specified in the present invention. Further, the present invention contains 2-phenylimidazole as an amine in an amount of 2.0 wt% within the range specified in the present invention, and trans-2,3-dibromo-2-butene-1,4-diol as an organic halogen compound. It contains 1.0 wt% within the range specified in the present invention, and contains 41.0 wt% of tetraethylene glycol monomethyl ether using the balance as a solvent within the range specified in the present invention.

Also in Example 2, a sufficient effect on thixotropic property was obtained. Further, in the solder paste using this flux, a sufficient effect was obtained on the ability of the solder paste to suppress printing sagging. Further, a sufficient effect on printability was obtained. In addition, a sufficient effect was obtained on the ability to suppress heating sagging. Further, a sufficient effect on wettability was obtained. In addition, a sufficient effect was obtained on the ability to suppress dewet.

In Example 3, hydrogenated trimeric acid is contained as dimer acid and trimer acid in an amount of 5.0 wt% within the range specified in the present invention. Others are the same as in Example 1, and the polymerized rosin is contained as the rosin in an amount of 45.0 wt% within the range specified in the present invention. Further, as a thixo agent, a cyclic amide compound obtained by cyclically polycondensing sebacic acid and 1,6-hexanediamine is contained in an amount of 2.0 wt% within the range specified in the present invention, and sebacic acid and 1,6-hexanediamine are contained. Contains 4.0 wt% of the acyclic amide compound polycondensed in an acyclic manner within the range specified in the present invention. The total amount of the cyclic amide compound and the acyclic amide compound is 6.0 wt%, which is within the range specified in the present invention. Further, the present invention contains 2-phenylimidazole as an amine in an amount of 2.0 wt% within the range specified in the present invention, and trans-2,3-dibromo-2-butene-1,4-diol as an organic halogen compound. It contains 1.0 wt% within the range specified in the present invention, and contains 41.0 wt% of tetraethylene glycol monomethyl ether using the balance as a solvent within the range specified in the present invention.

Also in Example 3, a sufficient effect on thixotropic property was obtained. Further, in the solder paste using this flux, a sufficient effect was obtained on the ability of the solder paste to suppress printing sagging. Further, a sufficient effect on printability was obtained. In addition, a sufficient effect was obtained on the ability to suppress heating sagging. Further, a sufficient effect on wettability was obtained. In addition, a sufficient effect was obtained on the ability to suppress dewet.

In Example 4, dimer acid and trimer acid as trimer acid are contained in an amount of 5.0 wt% within the range specified in the present invention. Others are the same as in Example 1, and the polymerized rosin is contained as the rosin in an amount of 45.0 wt% within the range specified in the present invention. Further, as a thixo agent, a cyclic amide compound obtained by cyclically polycondensing sebacic acid and 1,6-hexanediamine is contained in an amount of 2.0 wt% within the range specified in the present invention, and sebacic acid and 1,6-hexanediamine are contained. Contains 4.0 wt% of the acyclic amide compound polycondensed in an acyclic manner within the range specified in the present invention. The total amount of the cyclic amide compound and the acyclic amide compound is 6.0 wt%, which is within the range specified in the present invention. Further, the present invention contains 2-phenylimidazole as an amine in an amount of 2.0 wt% within the range specified in the present invention, and trans-2,3-dibromo-2-butene-1,4-diol as an organic halogen compound. It contains 1.0 wt% within the range specified in the present invention, and contains 41.0 wt% of tetraethylene glycol monomethyl ether using the balance as a solvent within the range specified in the present invention.

Also in Example 4, a sufficient effect on thixotropic property was obtained. Further, in the solder paste using this flux, a sufficient effect was obtained on the ability of the solder paste to suppress printing sagging. Further, a sufficient effect on printability was obtained. In addition, a sufficient effect was obtained on the ability to suppress heating sagging. Further, a sufficient effect on wettability was obtained. In addition, a sufficient effect was obtained on the ability to suppress dewet.

In Example 5, dimer acid and trimer acid were added in combination, and hydrogenated dimer acid was added in an amount of 1.25 wt% within the range specified in the present invention, and dimer acid was added in the range specified in the present invention. It contains 1.25 wt%, hydrogenated trimer acid in the range specified in the present invention of 1.25 wt%, and trimer acid in the range specified in the present invention of 1.25 wt%. The total amount of two or more dimer acids and trimer acids is also within the range specified in the present invention. Others are the same as in Example 1, and the polymerized rosin is contained as the rosin in an amount of 45.0 wt% within the range specified in the present invention. Further, as a thixo agent, a cyclic amide compound obtained by cyclically polycondensing sebacic acid and 1,6-hexanediamine is contained in an amount of 2.0 wt% within the range specified in the present invention, and sebacic acid and 1,6-hexanediamine are contained. Contains 4.0 wt% of the acyclic amide compound polycondensed in an acyclic manner within the range specified in the present invention. The total amount of the cyclic amide compound and the acyclic amide compound is 6.0 wt%, which is within the range specified in the present invention. Further, the present invention contains 2-phenylimidazole as an amine in an amount of 2.0 wt% within the range specified in the present invention, and trans-2,3-dibromo-2-butene-1,4-diol as an organic halogen compound. It contains 1.0 wt% within the range specified in the present invention, and contains 41.0 wt% of tetraethylene glycol monomethyl ether using the balance as a solvent within the range specified in the present invention.

Also in Example 5, a sufficient effect on thixotropic property was obtained. Further, in the solder paste using this flux, a sufficient effect was obtained on the ability of the solder paste to suppress printing sagging. Further, a sufficient effect on printability was obtained. In addition, a sufficient effect was obtained on the ability to suppress heating sagging. Further, a sufficient effect on wettability was obtained. In addition, a sufficient effect was obtained on the ability to suppress dewet.

In Examples 6 to 9, the amounts of dimer acid and trimer acid added were changed. In Example 6, hydrogenated dimer acid was used as dimer acid and trimer acid within the range specified in the present invention. It contains 0.0 wt% and contains polymerized rosin as rosin at 45.0 wt% within the range specified in the present invention. Further, as a thixo agent, a cyclic amide compound obtained by cyclically polycondensing sebacic acid and 1,6-hexanediamine is contained in an amount of 2.0 wt% within the range specified in the present invention, and sebacic acid and 1,6-hexanediamine are contained. Contains 4.0 wt% of the acyclic amide compound polycondensed in an acyclic manner within the range specified in the present invention. The total amount of the cyclic amide compound and the acyclic amide compound is 6.0 wt%, which is within the range specified in the present invention. Further, the present invention contains 2-phenylimidazole as an amine in an amount of 2.0 wt% within the range specified in the present invention, and trans-2,3-dibromo-2-butene-1,4-diol as an organic halogen compound. It contains 1.0 wt% within the range specified in the present invention, and contains 26.0 wt% of tetraethylene glycol monomethyl ether using the balance as a solvent within the range specified in the present invention.

Also in Example 6, a sufficient effect on thixotropic property was obtained. Further, in the solder paste using this flux, a sufficient effect was obtained on the ability of the solder paste to suppress printing sagging. Further, a sufficient effect on printability was obtained. In addition, a sufficient effect was obtained on the ability to suppress heating sagging. Further, a sufficient effect on wettability was obtained. In addition, a sufficient effect was obtained on the ability to suppress dewet.

In Example 7, hydrogenated dimer acid as dimer acid and trimer acid is contained in 10.0 wt% within the range specified in the present invention, and polymerized rosin as rosin is contained in the range specified in the present invention at 45.0 wt%. Including%. Further, as a thixo agent, a cyclic amide compound obtained by cyclically polycondensing sebacic acid and 1,6-hexanediamine is contained in an amount of 2.0 wt% within the range specified in the present invention, and sebacic acid and 1,6-hexanediamine are contained. Contains 4.0 wt% of the acyclic amide compound polycondensed in an acyclic manner within the range specified in the present invention. The total amount of the cyclic amide compound and the acyclic amide compound is 6.0 wt%, which is within the range specified in the present invention. Further, the present invention contains 2-phenylimidazole as an amine in an amount of 2.0 wt% within the range specified in the present invention, and trans-2,3-dibromo-2-butene-1,4-diol as an organic halogen compound. It contains 1.0 wt% within the range specified in the present invention, and contains 36.0 wt% of tetraethylene glycol monomethyl ether using the balance as a solvent within the range specified in the present invention.

Also in Example 7, a sufficient effect on thixotropic property was obtained. Further, in the solder paste using this flux, a sufficient effect was obtained on the ability of the solder paste to suppress printing sagging. Further, a sufficient effect on printability was obtained. In addition, a sufficient effect was obtained on the ability to suppress heating sagging. Further, a sufficient effect on wettability was obtained. In addition, a sufficient effect was obtained on the ability to suppress dewet.

In Example 8, hydrogenated dimer acid as dimer acid and trimer acid is contained in an amount of 3.0 wt% within the range specified in the present invention, and polymerized rosin as a rosin is contained in the range specified in the present invention at 45.0 wt%. Including%. Further, as a thixo agent, a cyclic amide compound obtained by cyclically polycondensing sebacic acid and 1,6-hexanediamine is contained in an amount of 2.0 wt% within the range specified in the present invention, and sebacic acid and 1,6-hexanediamine are contained. Contains 4.0 wt% of the acyclic amide compound polycondensed in an acyclic manner within the range specified in the present invention. The total amount of the cyclic amide compound and the acyclic amide compound is 6.0 wt%, which is within the range specified in the present invention. Further, the present invention contains 2-phenylimidazole as an amine in an amount of 2.0 wt% within the range specified in the present invention, and trans-2,3-dibromo-2-butene-1,4-diol as an organic halogen compound. It contains 1.0 wt% within the range specified in the present invention, and contains 43.0 wt% of tetraethylene glycol monomethyl ether using the balance as a solvent within the range specified in the present invention.

Also in Example 8, a sufficient effect on thixotropic property was obtained. Further, in the solder paste using this flux, a sufficient effect was obtained on the ability of the solder paste to suppress printing sagging. Further, a sufficient effect on printability was obtained. In addition, a sufficient effect was obtained on the ability to suppress heating sagging. Further, a sufficient effect on wettability was obtained. In addition, a sufficient effect was obtained on the ability to suppress dewet.

In Example 9, hydrogenated dimer acid as dimer acid and trimer acid is contained in an amount of 0.5 wt% within the range specified in the present invention, and polymerized rosin as rosin is contained in the range specified in the present invention at 45.0 wt%. Including%. Further, as a thixo agent, a cyclic amide compound obtained by cyclically polycondensing sebacic acid and 1,6-hexanediamine is contained in an amount of 2.0 wt% within the range specified in the present invention, and sebacic acid and 1,6-hexanediamine are contained. Contains 4.0 wt% of the acyclic amide compound polycondensed in an acyclic manner within the range specified in the present invention. The total amount of the cyclic amide compound and the acyclic amide compound is 6.0 wt%, which is within the range specified in the present invention. Further, the present invention contains 2-phenylimidazole as an amine in an amount of 2.0 wt% within the range specified in the present invention, and trans-2,3-dibromo-2-butene-1,4-diol as an organic halogen compound. It contains 1.0 wt% within the range specified in the present invention, and contains 45.5 wt% of tetraethylene glycol monomethyl ether using the balance as a solvent within the range specified in the present invention.

Also in Example 9, a sufficient effect on thixotropic property was obtained. Further, in the solder paste using this flux, a sufficient effect was obtained on the ability of the solder paste to suppress printing sagging. Further, a sufficient effect on printability was obtained. In addition, a sufficient effect was obtained on the ability to suppress heating sagging. Further, a sufficient effect on wettability was obtained. In addition, a sufficient effect was obtained on the ability to suppress dewet.

Example 10 is obtained by adding another organic acid, containing 5.0 wt% of hydrogenated dimer acid as dimer acid and trimer acid within the range specified in the present invention, and glutaric acid as other organic acid. , 3.0 wt% is contained within the range specified by the present invention, and polymerized rosin is contained as the rosin within the range specified by the present invention at 45.0 wt%. Further, as a thixo agent, a cyclic amide compound obtained by cyclically polycondensing sebacic acid and 1,6-hexanediamine is contained in an amount of 2.0 wt% within the range specified in the present invention, and sebacic acid and 1,6-hexanediamine are contained. Contains 4.0 wt% of the acyclic amide compound polycondensed in an acyclic manner within the range specified in the present invention. The total amount of the cyclic amide compound and the acyclic amide compound is 6.0 wt%, which is within the range specified in the present invention. Further, the present invention contains 2-phenylimidazole as an amine in an amount of 2.0 wt% within the range specified in the present invention, and trans-2,3-dibromo-2-butene-1,4-diol as an organic halogen compound. It contains 1.0 wt% within the range specified in the present invention, and contains 38.0 wt% of tetraethylene glycol monomethyl ether using the balance as a solvent within the range specified in the present invention.

Also in Example 10, a sufficient effect on thixotropic property was obtained. Further, in the solder paste using this flux, a sufficient effect was obtained on the ability of the solder paste to suppress printing sagging. Further, a sufficient effect on printability was obtained. In addition, a sufficient effect was obtained on the ability to suppress heating sagging. Further, a sufficient effect on wettability was obtained. In addition, a sufficient effect was obtained on the ability to suppress dewet.

In Examples 11 and 12, the addition amounts of the cyclic amide compound and the non-cyclic amide compound were changed. In Example 11, the dimer acid and the hydrogenated dimer acid as the trimer acid were used in the range specified in the present invention. Contains 5.0 wt% as other organic acid, 3.0 wt% as other organic acid within the range specified in the present invention, and polymerized rosin as the rosin, 45.0 wt% within the range specified in the present invention. % Including. Further, as a thixo agent, a cyclic amide compound obtained by cyclically polycondensing sebacic acid and 1,6-hexanediamine is contained in an amount of 0.5 wt% within the range specified in the present invention, and sebacic acid and 1,6-hexanediamine are contained. Contains 8.0 wt% of the acyclic amide compound polycondensed in an acyclic manner within the range specified in the present invention. The total amount of the cyclic amide compound and the acyclic amide compound is 8.5 wt%, which is within the range specified in the present invention. Further, the present invention contains 2-phenylimidazole as an amine in an amount of 2.0 wt% within the range specified in the present invention, and trans-2,3-dibromo-2-butene-1,4-diol as an organic halogen compound. It contains 1.0 wt% within the range specified in the present invention, and contains 35.5 wt% of tetraethylene glycol monomethyl ether using the balance as a solvent within the range specified in the present invention.

In Example 11, by containing 0.5 wt% of the cyclic amide compound, even if 8 wt% of the acyclic amide compound was contained, a sufficient effect on thixotropic property was obtained. Further, in the solder paste using this flux, a sufficient effect was obtained on the ability of the solder paste to suppress printing sagging. Further, a sufficient effect on printability was obtained. In addition, a sufficient effect was obtained on the ability to suppress heating sagging. Further, a sufficient effect on wettability was obtained. In addition, a sufficient effect was obtained on the ability to suppress dewet.

In Example 12, hydrogenated dimer acid as dimer acid and trimer acid is contained in an amount of 5.0 wt% within the range specified in the present invention, and glutaric acid is contained as another organic acid within the range specified in the present invention. It contains 3.0 wt% and contains polymerized rosin as rosin in an amount of 45.0 wt% within the range specified in the present invention. Further, as a thixo agent, a cyclic amide compound obtained by cyclically polycondensing sebacic acid and 1,6-hexanediamine is contained in an amount of 8.0 wt% within the range specified in the present invention, and sebacic acid and 1,6-hexanediamine are contained. Contains 2.0 wt% of the acyclic amide compound polycondensed in an acyclic manner within the range specified in the present invention. The total amount of the cyclic amide compound and the non-cyclic amide compound is 10.0 wt%, which is within the range specified in the present invention. Further, the present invention contains 2-phenylimidazole as an amine in an amount of 2.0 wt% within the range specified in the present invention, and trans-2,3-dibromo-2-butene-1,4-diol as an organic halogen compound. It contains 1.0 wt% within the range specified in the present invention, and contains 34.0 wt% of tetraethylene glycol monomethyl ether using the balance as a solvent within the range specified in the present invention.

Also in Example 12, a sufficient effect on thixotropic property was obtained. Further, in the solder paste using this flux, a sufficient effect was obtained on the ability of the solder paste to suppress printing sagging. Further, a sufficient effect on printability was obtained. In addition, a sufficient effect was obtained on the ability to suppress heating sagging. Further, a sufficient effect on wettability was obtained. In addition, a sufficient effect was obtained on the ability to suppress dewet. As described above, in Example 12, even if the cyclic amide compound is contained in an amount of 8.0 wt%, the thixotropy of the flux, the ability to suppress the printing sagging of the solder paste, the printing property, the ability to suppress the heating sagging, the wet spreading property, and the dewetting property are suppressed. The ability was not impaired, and a sufficient effect was obtained for these. As a result, any one of dimer acid, hydrogenated dimer acid, trimer acid, hydrogenated trimer acid, or two or more kinds, and a dicarboxylic acid having 10 carbon atoms and a diamine having 6 carbon atoms were cyclically polycondensed. By including the cyclic amide compound and the acyclic amide compound in which a dicarboxylic acid having 10 carbon atoms and a diamine having 6 carbon atoms are acyclically polycondensed within the range specified in the present invention, the flux property can be increased. Sufficient effects were obtained on the ability to suppress printing sagging, printability, heat sagging suppressing ability, wet spreading property, and dewetting suppressing ability of solder paste.

In Example 13, the types of the cyclic amide compound and the non-cyclic amide compound were changed, and the dimer acid and hydrogenated dimer acid as the trimer acid were contained in an amount of 5.0 wt% within the range specified in the present invention, and other It contains 3.0 wt% of glutaric acid as an organic acid within the range specified in the present invention and 45.0 wt% of polymerized rosin as a rosin within the range specified in the present invention. Further, as a thixo agent, 2.0 wt% of adipic acid, which is a dicarboxylic acid having 6 carbon atoms, and a cyclic amide compound, which is a cyclic polycondensation of 1,6-hexanediamine, which is a diamine having 6 carbon atoms, is contained, and carbon is contained. It contains 4.0 wt% of adipic acid, which is a dicarboxylic acid having 6 numbers, and an acyclic amide compound, which is acyclic polycondensation of 1,6-hexanediamine, which is a diamine having 6 carbon atoms. The total amount of the cyclic amide compound and the acyclic amide compound is 6.0 wt%, which is within the range specified in the present invention. Further, the present invention contains 2-phenylimidazole as an amine in an amount of 2.0 wt% within the range specified in the present invention, and trans-2,3-dibromo-2-butene-1,4-diol as an organic halogen compound. It contains 1.0 wt% within the range specified in the present invention, and contains 38.0 wt% of tetraethylene glycol monomethyl ether using the balance as a solvent within the range specified in the present invention.

Also in Example 13, a sufficient effect on thixotropic property was obtained. Further, in the solder paste using this flux, a sufficient effect was obtained on the ability of the solder paste to suppress printing sagging. Further, a sufficient effect on printability was obtained. In addition, a sufficient effect was obtained on the ability to suppress heating sagging. Further, a sufficient effect on wettability was obtained. In addition, a sufficient effect was obtained on the ability to suppress dewet. As described above, in Example 13, as the thixo agent, a cyclic amide compound in which adipic acid and 1,6-hexanediamine are cyclically polycondensed, and a non-cyclic amide compound in which adipic acid and 1,6-hexanediamine are polycondensed cyclically. Even if the cyclic amide compound is contained within the range specified in the present invention, the thixo property of the flux, the printing sagging suppressing ability of the solder paste, the printing property, the heating sagging suppressing ability, the wet spreading property, and the dewetting suppressing ability are inhibited. However, a sufficient effect was obtained for these. As a result, any one of dimer acid, hydrogenated dimer acid, trimer acid, hydrogenated trimer acid, or two or more kinds, and a dicarboxylic acid having 6 carbon atoms and a diamine having 6 carbon atoms were cyclically polycondensed. A cyclic amide compound and a non-cyclic amide compound in which a dicarboxylic acid having 6 carbon atoms and a diamine having 6 carbon atoms are cyclically polycondensed can also be contained within the range specified in the present invention to provide flux. Sufficient effects were obtained on the ability to suppress printing sagging, printability, heat sagging suppressing ability, wet spreading property, and dewetting suppressing ability of solder paste.

In Examples 14 and 15, the types of other organic acids were changed. In Example 14, hydrogenated dimer acid was used as dimer acid and trimer acid within the range specified in the present invention (5.0 wt). %, Succinic acid as another organic acid is contained in 3.0 wt% within the range specified in the present invention, and polymerized rosin as rosin is contained in 45.0 wt% in the range specified in the present invention. Further, as a thixo agent, a cyclic amide compound obtained by cyclically polycondensing sebacic acid and 1,6-hexanediamine is contained in an amount of 2.0 wt% within the range specified in the present invention, and sebacic acid and 1,6-hexanediamine are contained. Contains 4.0 wt% of the acyclic amide compound polycondensed in an acyclic manner within the range specified in the present invention. The total amount of the cyclic amide compound and the acyclic amide compound is 6.0 wt%, which is within the range specified in the present invention. Further, the present invention contains 2-phenylimidazole as an amine in an amount of 2.0 wt% within the range specified in the present invention, and trans-2,3-dibromo-2-butene-1,4-diol as an organic halogen compound. It contains 1.0 wt% within the range specified in the present invention, and contains 38.0 wt% of tetraethylene glycol monomethyl ether using the balance as a solvent within the range specified in the present invention.

Also in Example 14, a sufficient effect on thixotropic property was obtained. Further, in the solder paste using this flux, a sufficient effect was obtained on the ability of the solder paste to suppress printing sagging. Further, a sufficient effect on printability was obtained. In addition, a sufficient effect was obtained on the ability to suppress heating sagging. Further, a sufficient effect on wettability was obtained. In addition, a sufficient effect was obtained on the ability to suppress dewet.

In Example 15, hydrogenated dimer acid was contained as dimer acid and trimer acid in an amount of 5.0 wt% within the range specified in the present invention, and adipic acid was contained as another organic acid within the range specified in the present invention. It contains 3.0 wt% and contains polymerized rosin as rosin at 45.0 wt% within the range specified in the present invention. Further, as a thixo agent, a cyclic amide compound obtained by cyclically polycondensing sebacic acid and 1,6-hexanediamine is contained in an amount of 2.0 wt% within the range specified in the present invention, and sebacic acid and 1,6-hexanediamine are contained. Contains 4.0 wt% of the acyclic amide compound polycondensed in an acyclic manner within the range specified in the present invention. The total amount of the cyclic amide compound and the acyclic amide compound is 6.0 wt%, which is within the range specified in the present invention. Further, the present invention contains 2-phenylimidazole as an amine in an amount of 2.0 wt% within the range specified in the present invention, and trans-2,3-dibromo-2-butene-1,4-diol as an organic halogen compound. It contains 1.0 wt% within the range specified in the present invention, and contains 38.0 wt% of tetraethylene glycol monomethyl ether using the balance as a solvent within the range specified in the present invention.

Also in Example 15, a sufficient effect on thixotropic property was obtained. Further, in the solder paste using this flux, a sufficient effect was obtained on the ability of the solder paste to suppress printing sagging. Further, a sufficient effect on printability was obtained. In addition, a sufficient effect was obtained on the ability to suppress heating sagging. Further, a sufficient effect on wettability was obtained. In addition, a sufficient effect was obtained on the ability to suppress dewet.

Example 16 is a compound addition of another organic acid, which contains 5.0 wt% of dimer acid and hydrogenated dimer acid as trimer acid within the range specified in the present invention, and succinic acid as another organic acid. Is contained in 1.0 wt% within the range specified in the present invention, and glutaric acid is contained in 1.0 wt% within the range specified in the present invention. The total amount of two or more other organic acids is also within the range specified in the present invention. Further, in the present invention, a cyclic amide compound containing 45.0 wt% of polymerized rosin as rosin within the range specified in the present invention and in which sebacic acid and 1,6-hexanediamine are cyclically polycondensed as a thixo agent. It contains 2.0 wt% within the specified range, and contains 4.0 wt% of the acyclic amide compound obtained by polycondensing sebacic acid and 1,6-hexanediamine in an acyclic manner within the range specified in the present invention. The total amount of the cyclic amide compound and the acyclic amide compound is 6.0 wt%, which is within the range specified in the present invention. Further, the present invention contains 2-phenylimidazole as an amine in an amount of 2.0 wt% within the range specified in the present invention, and trans-2,3-dibromo-2-butene-1,4-diol as an organic halogen compound. It contains 1.0 wt% within the range specified in the present invention, and contains 39.0 wt% of tetraethylene glycol monomethyl ether using the balance as a solvent within the range specified in the present invention.

Also in Example 16, a sufficient effect on thixotropic property was obtained. Further, in the solder paste using this flux, a sufficient effect was obtained on the ability of the solder paste to suppress printing sagging. Further, a sufficient effect on printability was obtained. In addition, a sufficient effect was obtained on the ability to suppress heating sagging. Further, a sufficient effect on wettability was obtained. In addition, a sufficient effect was obtained on the ability to suppress dewet.

In Example 17, the amount of the other organic acid added was changed, and the dimer acid and hydrogenated dimer acid as the trimer acid were contained in an amount of 5.0 wt% within the range specified in the present invention as the other organic acid. Glutaric acid is contained in an amount of 2.0 wt% within the range specified in the present invention, and polymerized rosin as a rosin is contained in an amount of 45.0 wt% in the range specified in the present invention. Further, as a thixo agent, a cyclic amide compound obtained by cyclically polycondensing sebacic acid and 1,6-hexanediamine is contained in an amount of 2.0 wt% within the range specified in the present invention, and sebacic acid and 1,6-hexanediamine are contained. Contains 4.0 wt% of the acyclic amide compound polycondensed in an acyclic manner within the range specified in the present invention. The total amount of the cyclic amide compound and the acyclic amide compound is 6.0 wt%, which is within the range specified in the present invention. Further, the present invention contains 2-phenylimidazole as an amine in an amount of 2.0 wt% within the range specified in the present invention, and trans-2,3-dibromo-2-butene-1,4-diol as an organic halogen compound. It contains 1.0 wt% within the range specified in the present invention, and contains 39.0 wt% of tetraethylene glycol monomethyl ether using the balance as a solvent within the range specified in the present invention.

Also in Example 17, a sufficient effect on thixotropic property was obtained. Further, in the solder paste using this flux, a sufficient effect was obtained on the ability of the solder paste to suppress printing sagging. Further, a sufficient effect on printability was obtained. In addition, a sufficient effect was obtained on the ability to suppress heating sagging. Further, a sufficient effect on wettability was obtained. In addition, a sufficient effect was obtained on the ability to suppress dewet.

As shown in Examples 14 to 17, any one or more of dimer acid, hydrogenated dimer acid, trimer acid, hydrogenated trimer acid, and cyclic amide compound and acyclic amide compound as thixo agents. By including within the range specified in the present invention, the type of other organic acid can be changed within the range specified in the present invention, multiple types of other organic acids can be combined, and the amount of other organic acid can be adjusted. Even by changing the changes, sufficient effects were obtained on the tixo property of the flux, the printing sagging suppressing ability of the solder paste, the printing property, the heating sagging suppressing ability, the wet spreading property, and the dewetting suppressing ability.

Example 18 is a compound addition of rosin, which contains 5.0 wt% of hydrogenated dimer acid as dimer acid and trimer acid within the range specified in the present invention, and glutaric acid as another organic acid. It contains 3.0 wt% within the range specified in the invention. In addition, polymerized rosin as rosin, 15.0 wt% within the range specified in the present invention, acrylic acid-modified hydrogenated rosin, 10.0 wt% within the range specified in the present invention, hydrogenated rosin, It contains 10.0 wt% within the range specified in the present invention and 10.0 wt% within the range specified in the present invention. The total amount of two or more rosins is also within the range specified in the present invention. Further, as a thixo agent, a cyclic amide compound obtained by cyclically polycondensing sebacic acid and 1,6-hexanediamine is contained in an amount of 2.0 wt% within the range specified in the present invention, and sebacic acid and 1,6-hexanediamine are contained. Contains 4.0 wt% of the acyclic amide compound polycondensed in an acyclic manner within the range specified in the present invention. The total amount of the cyclic amide compound and the acyclic amide compound is 6.0 wt%, which is within the range specified in the present invention. Further, the present invention contains 2-phenylimidazole as an amine in an amount of 2.0 wt% within the range specified in the present invention, and trans-2,3-dibromo-2-butene-1,4-diol as an organic halogen compound. It contains 1.0 wt% within the range specified in the present invention, and contains 38.0 wt% of tetraethylene glycol monomethyl ether using the balance as a solvent within the range specified in the present invention.

Also in Example 18, a sufficient effect on thixotropic property was obtained. Further, in the solder paste using this flux, a sufficient effect was obtained on the ability of the solder paste to suppress printing sagging. Further, a sufficient effect on printability was obtained. In addition, a sufficient effect was obtained on the ability to suppress heating sagging. Further, a sufficient effect on wettability was obtained. In addition, a sufficient effect was obtained on the ability to suppress dewet.

As shown in Example 18, any one or more of dimer acid, hydrogenated dimer acid, trimer acid, hydrogenated trimer acid, and cyclic amide compound and acyclic amide compound as thixo agents are used in the present invention. By including within the range specified in the present invention, even if a plurality of types of rosins are combined within the range specified in the present invention, the flux property, the solder paste's ability to suppress printing sagging, printability, ability to suppress heating sagging, and wetting Sufficient effect was obtained on spreadability and ability to suppress dewet.

In Example 19, the amount of amine added was changed, and hydrogenated dimer acid was contained as dimer acid and trimer acid in an amount of 5.0 wt% within the range specified in the present invention, and glutaric acid was used as another organic acid. , 3.0 wt% is contained within the range specified by the present invention, and polymerized rosin is contained as the rosin within the range specified by the present invention at 45.0 wt%. Further, as a thixo agent, a cyclic amide compound obtained by cyclically polycondensing sebacic acid and 1,6-hexanediamine is contained in an amount of 2.0 wt% within the range specified in the present invention, and sebacic acid and 1,6-hexanediamine are contained. Contains 4.0 wt% of the acyclic amide compound polycondensed in an acyclic manner within the range specified in the present invention. The total amount of the cyclic amide compound and the acyclic amide compound is 6.0 wt%, which is within the range specified in the present invention. Further, 2-phenylimidazole as an amine is contained in an amount of 5.0 wt% within the range specified in the present invention. It does not contain halogen and contains 36.0 wt% of tetraethylene glycol monomethyl ether with the balance as a solvent within the range specified in the present invention.

Also in Example 19, a sufficient effect on thixotropic property was obtained. Further, in the solder paste using this flux, a sufficient effect was obtained on the ability of the solder paste to suppress printing sagging. Further, a sufficient effect on printability was obtained. In addition, a sufficient effect was obtained on the ability to suppress heating sagging. Further, a sufficient effect on wettability was obtained. In addition, a sufficient effect was obtained on the ability to suppress dewet.

In Example 20, the type of amine was changed, and hydrogenated dimer acid was contained as dimer acid and trimer acid in an amount of 5.0 wt% within the range specified in the present invention, and glutaric acid was contained as another organic acid. It contains 3.0 wt% within the range specified in the present invention and contains 45.0 wt% polymerized rosin as the rosin within the range specified in the present invention. Further, as a thixo agent, a cyclic amide compound obtained by cyclically polycondensing sebacic acid and 1,6-hexanediamine is contained in an amount of 2.0 wt% within the range specified in the present invention, and sebacic acid and 1,6-hexanediamine are contained. Contains 4.0 wt% of the acyclic amide compound polycondensed in an acyclic manner within the range specified in the present invention. The total amount of the cyclic amide compound and the acyclic amide compound is 6.0 wt%, which is within the range specified in the present invention. Further, 2-phenyl-4-methylimidazole as an amine is contained in an amount of 5.0 wt% within the range specified in the present invention. It does not contain halogen and contains 36.0 wt% of tetraethylene glycol monomethyl ether with the balance as a solvent within the range specified in the present invention.

Also in Example 20, a sufficient effect on thixotropic property was obtained. Further, in the solder paste using this flux, a sufficient effect was obtained on the ability of the solder paste to suppress printing sagging. Further, a sufficient effect on printability was obtained. In addition, a sufficient effect was obtained on the ability to suppress heating sagging. Further, a sufficient effect on wettability was obtained. In addition, a sufficient effect was obtained on the ability to suppress dewet.

As shown in Examples 19 to 20, any one or more of dimer acid, hydrogenated dimer acid, trimer acid, and hydrogenated trimer acid, and cyclic amide compounds and acyclic amide compounds as thixo agents. By including the above in the range specified in the present invention, even if the amine is contained in the range specified in the present invention, the thiox property of the flux, the ability to suppress the printing sagging of the solder paste, the printability, and the ability to suppress the heating sagging Sufficient effect was obtained on wet spreadability and dewet suppression ability.

In Example 21, the type of halogen was changed, and hydrogenated dimer acid was contained as dimer acid and trimer acid in an amount of 5.0 wt% within the range specified in the present invention, and glutaric acid was contained as another organic acid. It contains 3.0 wt% within the range specified in the present invention, and contains polymerized rosin as rosin in an amount of 45.0 wt% within the range specified in the present invention. Further, as a thixo agent, a cyclic amide compound obtained by cyclically polycondensing sebacic acid and 1,6-hexanediamine is contained in an amount of 2.0 wt% within the range specified in the present invention, and sebacic acid and 1,6-hexanediamine are contained. Contains 4.0 wt% of the acyclic amide compound polycondensed in an acyclic manner within the range specified in the present invention. The total amount of the cyclic amide compound and the acyclic amide compound is 6.0 wt%, which is within the range specified in the present invention. Further, amine-free, diphenylguanidine / HBr as an amine hydrogen halide is contained in an amount of 2.0 wt% within the range specified in the present invention, and tetraethylene glycol monomethyl ether is specified in the present invention with the balance as a solvent. Includes 39.0 wt% within the specified range.

Also in Example 21, a sufficient effect on thixotropic property was obtained. Further, in the solder paste using this flux, a sufficient effect was obtained on the ability of the solder paste to suppress printing sagging. Further, a sufficient effect on printability was obtained. In addition, a sufficient effect was obtained on the ability to suppress heating sagging. Further, a sufficient effect on wettability was obtained. In addition, a sufficient effect was obtained on the ability to suppress dewet.

In Example 22, the amount of halogen added was changed, and the amount of dimer acid and hydrogenated dimer acid as trimer acid was 5.0 wt% within the range specified in the present invention, and glutaric acid was used as another organic acid. , 3.0 wt% is contained within the range specified by the present invention, and polymerized rosin is contained as the rosin within the range specified by the present invention at 45.0 wt%. Further, as a thixo agent, a cyclic amide compound obtained by cyclically polycondensing sebacic acid and 1,6-hexanediamine is contained in an amount of 2.0 wt% within the range specified in the present invention, and sebacic acid and 1,6-hexanediamine are contained. Contains 4.0 wt% of the acyclic amide compound polycondensed in an acyclic manner within the range specified in the present invention. The total amount of the cyclic amide compound and the acyclic amide compound is 6.0 wt%, which is within the range specified in the present invention. Further, it does not contain amine and contains 5.0 wt% of trans-2,3-dibromo-2-butene-1,4-diol as an organic halogen compound within the range specified in the present invention, and the balance is tetra as a solvent. It contains 36.0 wt% of ethylene glycol monomethyl ether within the range specified in the present invention.

Also in Example 22, a sufficient effect on thixotropic property was obtained. Further, in the solder paste using this flux, a sufficient effect was obtained on the ability of the solder paste to suppress printing sagging. Further, a sufficient effect on printability was obtained. In addition, a sufficient effect was obtained on the ability to suppress heating sagging. Further, a sufficient effect on wettability was obtained. In addition, a sufficient effect was obtained on the ability to suppress dewet.

As shown in Examples 21 to 22, any one or more of dimer acid, hydrogenated dimer acid, trimer acid, and hydrogenated trimer acid, and cyclic amide compounds and acyclic amide compounds as thixo agents. By including the above in the range specified in the present invention, even if the halogen is contained in the range specified in the present invention, the flux property, the ability to suppress the printing sagging of the solder paste, the printability, and the ability to suppress the heating sagging. Sufficient effect was obtained on wet spreadability and dewet suppression ability.

In Example 23, an antioxidant was added, and hydrogenated dimer acid was contained as dimer acid and trimer acid in an amount of 5.0 wt% within the range specified in the present invention, and glutaric acid was used as another organic acid. It contains 3.0 wt% within the range specified in the present invention and contains 45.0 wt% polymerized rosin as the rosin within the range specified in the present invention. Further, as a thixo agent, a cyclic amide compound obtained by cyclically polycondensing sebacic acid and 1,6-hexanediamine is contained in an amount of 2.0 wt% within the range specified in the present invention, and sebacic acid and 1,6-hexanediamine are contained. Contains 4.0 wt% of the acyclic amide compound polycondensed in an acyclic manner within the range specified in the present invention. The total amount of the cyclic amide compound and the acyclic amide compound is 6.0 wt%, which is within the range specified in the present invention. Further, the present invention contains a hindered phenol-based antioxidant as an antioxidant, which does not contain amines and halogens, in an amount of 5.0 wt% within the range specified in the present invention, and tetraethylene glycol monomethyl ether using the balance as a solvent. Includes 36.0 wt% within the range specified in.

Also in Example 23, a sufficient effect on thixotropic property was obtained. Further, in the solder paste using this flux, a sufficient effect was obtained on the ability of the solder paste to suppress printing sagging. Further, a sufficient effect on printability was obtained. In addition, a sufficient effect was obtained on the ability to suppress heating sagging. Further, a sufficient effect on wettability was obtained. In addition, a sufficient effect was obtained on the ability to suppress dewet.

As shown in Example 23, the present invention comprises one or more of dimer acid, hydrogenated dimer acid, trimer acid, and hydrogenated trimer acid, and cyclic amide compounds and acyclic amide compounds as thixo agents. By including within the range specified in the present invention, even if the antioxidant is contained within the range specified in the present invention, the flux property, the ability to suppress the printing sagging of the solder paste, the printability, the ability to suppress the heating sagging, and the wetness A sufficient effect was obtained on the spreadability and the ability to suppress dewet.

In Example 24, amine, halogen, and antioxidant were added, and hydrogenated dimer acid as dimer acid and trimer acid was contained in an amount of 5.0 wt% within the range specified in the present invention as other organic acids. It contains 0.2 wt% of succinic acid within the range specified in the present invention, and contains 45.0 wt% of polymerized rosin as the rosin within the range specified in the present invention. Further, as a thixo agent, a cyclic amide compound obtained by cyclically polycondensing sebacic acid and 1,6-hexanediamine is contained in an amount of 2.0 wt% within the range specified in the present invention, and sebacic acid and 1,6-hexanediamine are contained. Contains 4.0 wt% of the acyclic amide compound polycondensed in an acyclic manner within the range specified in the present invention. The total amount of the cyclic amide compound and the acyclic amide compound is 6.0 wt%, which is within the range specified in the present invention. Further, 2-phenylimidazole as an amine is contained in an amount of 5.0 wt% within the range specified in the present invention, and diphenylguanidine / HBr as an amine hydrohalide is 1.0 wt% in the range specified in the present invention. %, And contains 3.0 wt% of trans-2,3-dibromo-2-butene-1,4-diol as an organic halogen compound within the range specified in the present invention, and hindered phenolic oxidation as an antioxidant. The inhibitor is contained in an amount of 3.0 wt% within the range specified in the present invention, and the balance is a solvent containing tetraethylene glycol monomethyl ether in an amount of 31.8 wt% within the range specified in the present invention.

Also in Example 24, a sufficient effect on thixotropic property was obtained. Further, in the solder paste using this flux, a sufficient effect was obtained on the ability of the solder paste to suppress printing sagging. Further, a sufficient effect on printability was obtained. In addition, a sufficient effect was obtained on the ability to suppress heating sagging. Further, a sufficient effect on wettability was obtained. In addition, a sufficient effect was obtained on the ability to suppress dewet.

As shown in Example 24, the present invention comprises one or more of dimer acid, hydrogenated dimer acid, trimer acid, and hydrogenated trimer acid, and cyclic amide compounds and acyclic amide compounds as thixo agents. By including within the range specified in the present invention, even if amines, halogens, and antioxidants are contained within the range specified in the present invention, the thixophilicity of the flux, the ability to suppress printing sagging of solder paste, printability, and heating sagging Sufficient effects were obtained on the inhibitory ability, wet spreadability, and dewet inhibitory ability.

In Examples 25 to 43, an ester compound was further added as a thyxo agent, and in Example 25, dimer acid and hydrogenated dimer acid as trimer acid were added as 5.0 wt within the range specified in the present invention. %, Succinic acid as another organic acid is contained in 3.0 wt% within the range specified in the present invention, and polymerized rosin as rosin is contained in 45.0 wt% in the range specified in the present invention. Further, as a thixo agent, a cyclic amide compound obtained by cyclically polycondensing sebacic acid and 1,6-hexanediamine is contained in an amount of 1.5 wt% within the range specified in the present invention, and sebacic acid and 1,6-hexanediamine are contained. Contains 2.5 wt% of acyclic amide compound polycondensed in an acyclic manner within the range specified in the present invention, and sebacic acid hardening oil as an ester compound as a thixo agent within the range specified in the present invention. Includes 0.0 wt%. The total amount of the cyclic amide compound and the non-cyclic amide compound is 4.0 wt%, which is within the range specified in the present invention. Further, the present invention contains 2-phenylimidazole as an amine in an amount of 2.0 wt% within the range specified in the present invention, and trans-2,3-dibromo-2-butene-1,4-diol as an organic halogen compound. It contains 1.0 wt% within the range specified in the present invention, and contains 38.0 wt% of tetraethylene glycol monomethyl ether using the balance as a solvent within the range specified in the present invention.

Also in Example 25, a sufficient effect on thixotropic property was obtained. Further, in the solder paste using this flux, a sufficient effect was obtained on the ability of the solder paste to suppress printing sagging. Further, a sufficient effect on printability was obtained. In addition, a sufficient effect was obtained on the ability to suppress heating sagging. Further, a sufficient effect on wettability was obtained. In addition, a sufficient effect was obtained on the ability to suppress dewet.

Example 26 contains 5.0 wt% of hydrogenated dimer acid as dimer acid and trimer acid within the range specified in the present invention, and adipic acid as another organic acid within the range specified in the present invention. It contains 3.0 wt% and contains polymerized rosin as rosin at 45.0 wt% within the range specified in the present invention. Further, as a thixo agent, a cyclic amide compound obtained by cyclically polycondensing sebacic acid and 1,6-hexanediamine is contained in an amount of 1.5 wt% within the range specified in the present invention, and sebacic acid and 1,6-hexanediamine are contained. Contains 2.5 wt% of acyclic amide compound polycondensed in an acyclic manner within the range specified in the present invention, and sebacic acid hardening oil as an ester compound as a thixo agent within the range specified in the present invention. Includes 0.0 wt%. The total amount of the cyclic amide compound and the non-cyclic amide compound is 4.0 wt%, which is within the range specified in the present invention. Further, the present invention contains 2-phenylimidazole as an amine in an amount of 2.0 wt% within the range specified in the present invention, and trans-2,3-dibromo-2-butene-1,4-diol as an organic halogen compound. It contains 1.0 wt% within the range specified in the present invention, and contains 38.0 wt% of tetraethylene glycol monomethyl ether using the balance as a solvent within the range specified in the present invention.

Also in Example 26, a sufficient effect on thixotropic property was obtained. Further, in the solder paste using this flux, a sufficient effect was obtained on the ability of the solder paste to suppress printing sagging. Further, a sufficient effect on printability was obtained. In addition, a sufficient effect was obtained on the ability to suppress heating sagging. Further, a sufficient effect on wettability was obtained. In addition, a sufficient effect was obtained on the ability to suppress dewet.

Example 27 contains 5.0 wt% of hydrogenated dimer acid as dimer acid and trimer acid within the range specified in the present invention, does not contain other organic acids, and defines polymerized rosin as rosin in the present invention. It contains 45.0 wt% within the specified range. Further, as a thixo agent, a cyclic amide compound obtained by cyclically polycondensing sebacic acid and 1,6-hexanediamine is contained in an amount of 1.5 wt% within the range specified in the present invention, and sebacic acid and 1,6-hexanediamine are contained. Contains 2.5 wt% of acyclic amide compound polycondensed in an acyclic manner within the range specified in the present invention, and sebacic acid hardening oil as an ester compound as a thixo agent within the range specified in the present invention. Includes 0.0 wt%. The total amount of the cyclic amide compound and the non-cyclic amide compound is 4.0 wt%, which is within the range specified in the present invention. Further, the present invention contains 2-phenylimidazole as an amine in an amount of 2.0 wt% within the range specified in the present invention, and trans-2,3-dibromo-2-butene-1,4-diol as an organic halogen compound. It contains 1.0 wt% within the range specified in the present invention, and contains 41.0 wt% of tetraethylene glycol monomethyl ether using the balance as a solvent within the range specified in the present invention.

Also in Example 27, a sufficient effect on thixotropic property was obtained. Further, in the solder paste using this flux, a sufficient effect was obtained on the ability of the solder paste to suppress printing sagging. Further, a sufficient effect on printability was obtained. In addition, a sufficient effect was obtained on the ability to suppress heating sagging. Further, a sufficient effect on wettability was obtained. In addition, a sufficient effect was obtained on the ability to suppress dewet.

Example 28 contains 5.0 wt% of hydrogenated dimer acid as dimer acid and trimer acid within the range specified in the present invention, and succinic acid as another organic acid within the range specified in the present invention. It contains 1.0 wt% and contains 1.0 wt% glutaric acid within the range specified in the present invention. The total amount of the two or more other organic acids added is also within the range specified in the present invention. Further, polymerized rosin is contained as rosin in an amount of 45.0 wt% within the range specified in the present invention. Further, as a thixo agent, a cyclic amide compound obtained by cyclically polycondensing sebacic acid and 1,6-hexanediamine is contained in an amount of 1.5 wt% within the range specified in the present invention, and sebacic acid and 1,6-hexanediamine are contained. Contains 2.5 wt% of acyclic amide compound polycondensed in an acyclic manner within the range specified in the present invention, and sebacic acid hardening oil as an ester compound as a thixo agent within the range specified in the present invention. Includes 0.0 wt%. The total amount of the cyclic amide compound and the non-cyclic amide compound is 4.0 wt%, which is within the range specified in the present invention. Further, the present invention contains 2-phenylimidazole as an amine in an amount of 2.0 wt% within the range specified in the present invention, and trans-2,3-dibromo-2-butene-1,4-diol as an organic halogen compound. It contains 1.0 wt% within the range specified in the present invention, and contains 39.0 wt% of tetraethylene glycol monomethyl ether using the balance as a solvent within the range specified in the present invention.

Also in Example 28, a sufficient effect on thixotropic property was obtained. Further, in the solder paste using this flux, a sufficient effect was obtained on the ability of the solder paste to suppress printing sagging. Further, a sufficient effect on printability was obtained. In addition, a sufficient effect was obtained on the ability to suppress heating sagging. Further, a sufficient effect on wettability was obtained. In addition, a sufficient effect was obtained on the ability to suppress dewet.

Example 29 contains a hydrogenated dimer acid as a dimer acid and a trimer acid in an amount of 8.0 wt% within the range specified in the present invention, and glutaric acid as another organic acid within the range specified in the present invention. It contains 2.0 wt% and contains 45.0 wt% polymerized rosin as the rosin within the range specified in the present invention. Further, as a thixo agent, a cyclic amide compound obtained by cyclically polycondensing sebacic acid and 1,6-hexanediamine is contained in an amount of 1.5 wt% within the range specified in the present invention, and sebacic acid and 1,6-hexanediamine are contained. Contains 2.5 wt% of acyclic amide compound polycondensed in an acyclic manner within the range specified in the present invention, and sebacic acid hardening oil as an ester compound as a thixo agent within the range specified in the present invention. Includes 0.0 wt%. The total amount of the cyclic amide compound and the non-cyclic amide compound is 4.0 wt%, which is within the range specified in the present invention. Further, the present invention contains 2-phenylimidazole as an amine in an amount of 2.0 wt% within the range specified in the present invention, and trans-2,3-dibromo-2-butene-1,4-diol as an organic halogen compound. It contains 1.0 wt% within the range specified in the present invention, and contains 36.0 wt% of tetraethylene glycol monomethyl ether using the balance as a solvent within the range specified in the present invention.

Also in Example 29, a sufficient effect on thixotropic property was obtained. Further, in the solder paste using this flux, a sufficient effect was obtained on the ability of the solder paste to suppress printing sagging. Further, a sufficient effect on printability was obtained. In addition, a sufficient effect was obtained on the ability to suppress heating sagging. Further, a sufficient effect on wettability was obtained. In addition, a sufficient effect was obtained on the ability to suppress dewet.

As shown in Examples 25 to 29, any one or more of dimer acid, hydrogenated dimer acid, trimer acid, and hydrogenated trimer acid, and cyclic amide compounds and acyclic amide compounds as thixo agents. Is included within the range specified in the present invention, thereby containing other organic acids within the range assumed in the present invention, and further containing an ester compound as a thixo agent within the range specified in the present invention. As a result, sufficient effects were obtained on the thixophilicity of the flux, the printing sagging suppressing ability of the solder paste, the printing property, the heating sagging suppressing ability, the wet spreading property, and the dewetting suppressing ability.

Example 30 contains 5.0 wt% of hydrogenated dimer acid as dimer acid and trimer acid within the range specified in the present invention, and glutaric acid as another organic acid within the range specified in the present invention. It contains 3.0 wt% and contains polymerized rosin as rosin in an amount of 45.0 wt% within the range specified in the present invention. Further, as a thixo agent, a cyclic amide compound obtained by cyclically polycondensing sebacic acid and 1,6-hexanediamine is contained in an amount of 1.5 wt% within the range specified in the present invention, and sebacic acid and 1,6-hexanediamine are contained. Contains 2.5 wt% of acyclic amide compound polycondensed in an acyclic manner within the range specified in the present invention, and sebacic acid hardening oil as an ester compound as a thixo agent within the range specified in the present invention. Includes 0.0 wt%. The total amount of the cyclic amide compound and the non-cyclic amide compound is 4.0 wt%, which is within the range specified in the present invention. Further, 2-phenylimidazole as an amine is contained in an amount of 5.0 wt% within the range specified in the present invention. It does not contain halogen and contains 36.0 wt% of tetraethylene glycol monomethyl ether with the balance as a solvent within the range specified in the present invention.

Also in Example 30, a sufficient effect on thixotropic property was obtained. Further, in the solder paste using this flux, a sufficient effect was obtained on the ability of the solder paste to suppress printing sagging. Further, a sufficient effect on printability was obtained. In addition, a sufficient effect was obtained on the ability to suppress heating sagging. Further, a sufficient effect on wettability was obtained. In addition, a sufficient effect was obtained on the ability to suppress dewet.

Example 31 contains 5.0 wt% of hydrogenated dimer acid as dimer acid and trimer acid within the range specified in the present invention, and glutaric acid as another organic acid within the range specified in the present invention. It contains 3.0 wt% and contains polymerized rosin as rosin in an amount of 45.0 wt% within the range specified in the present invention. Further, as a thixo agent, a cyclic amide compound obtained by cyclically polycondensing sebacic acid and 1,6-hexanediamine is contained in an amount of 1.5 wt% within the range specified in the present invention, and sebacic acid and 1,6-hexanediamine are contained. Contains 2.5 wt% of acyclic amide compound polycondensed in an acyclic manner within the range specified in the present invention, and sebacic acid hardening oil as an ester compound as a thixo agent within the range specified in the present invention. Includes 0.0 wt%. The total amount of the cyclic amide compound and the non-cyclic amide compound is 4.0 wt%, which is within the range specified in the present invention. Further, 2-phenyl-4-methylimidazole as an amine is contained in an amount of 5.0 wt% within the range specified in the present invention. It does not contain halogen and contains 36.0 wt% of tetraethylene glycol monomethyl ether with the balance as a solvent within the range specified in the present invention.

Also in Example 31, a sufficient effect on thixotropic property was obtained. Further, in the solder paste using this flux, a sufficient effect was obtained on the ability of the solder paste to suppress printing sagging. Further, a sufficient effect on printability was obtained. In addition, a sufficient effect was obtained on the ability to suppress heating sagging. Further, a sufficient effect on wettability was obtained. In addition, a sufficient effect was obtained on the ability to suppress dewet.

As shown in Examples 30 to 31, one or more of dimer acid, hydrogenated dimer acid, trimer acid, and hydrogenated trimer acid, and cyclic amide compounds and acyclic amide compounds as thixo agents. Is contained within the range specified by the present invention, the amine is contained within the range specified by the present invention, and the ester compound is further contained as a thixo agent within the range specified by the present invention. Sufficient effects were obtained on the thiox property, the ability to suppress printing sagging of solder paste, the printing property, the ability to suppress heating sagging, the ability to spread wet, and the ability to suppress dewet.

Example 32 contains 5.0 wt% of hydrogenated dimer acid as dimer acid and trimer acid within the range specified in the present invention, and glutaric acid as another organic acid within the range specified in the present invention. It contains 3.0 wt% and contains polymerized rosin as rosin in an amount of 45.0 wt% within the range specified in the present invention. Further, as a thixo agent, a cyclic amide compound obtained by cyclically polycondensing sebacic acid and 1,6-hexanediamine is contained in an amount of 1.5 wt% within the range specified in the present invention, and sebacic acid and 1,6-hexanediamine are contained. Contains 2.5 wt% of acyclic amide compound polycondensed in an acyclic manner within the range specified in the present invention, and sebacic acid hardening oil as an ester compound as a thixo agent within the range specified in the present invention. Includes 0.0 wt%. The total amount of the cyclic amide compound and the non-cyclic amide compound is 4.0 wt%, which is within the range specified in the present invention. Further, amine-free, diphenylguanidine / HBr as an amine hydrogen halide is contained in an amount of 2.0 wt% within the range specified in the present invention, and tetraethylene glycol monomethyl ether is specified in the present invention with the balance as a solvent. Includes 39.0 wt% within the specified range.

Also in Example 32, a sufficient effect on thixotropic property was obtained. Further, in the solder paste using this flux, a sufficient effect was obtained on the ability of the solder paste to suppress printing sagging. Further, a sufficient effect on printability was obtained. In addition, a sufficient effect was obtained on the ability to suppress heating sagging. Further, a sufficient effect on wettability was obtained. In addition, a sufficient effect was obtained on the ability to suppress dewet.

Example 33 contains 5.0 wt% of hydrogenated dimer acid as dimer acid and trimer acid within the range specified in the present invention, and glutaric acid as another organic acid within the range specified in the present invention. It contains 3.0 wt% and contains polymerized rosin as rosin in an amount of 45.0 wt% within the range specified in the present invention. Further, as a thixo agent, a cyclic amide compound obtained by cyclically polycondensing sebacic acid and 1,6-hexanediamine is contained in an amount of 1.5 wt% within the range specified in the present invention, and sebacic acid and 1,6-hexanediamine are contained. Contains 2.5 wt% of acyclic amide compound polycondensed in an acyclic manner within the range specified in the present invention, and sebacic acid hardening oil as an ester compound as a thixo agent within the range specified in the present invention. Includes 0.0 wt%. The total amount of the cyclic amide compound and the non-cyclic amide compound is 4.0 wt%, which is within the range specified in the present invention. Further, it does not contain amine and contains 5.0 wt% of trans-2,3-dibromo-2-butene-1,4-diol as an organic halogen compound within the range specified in the present invention, and the balance is tetra as a solvent. It contains 36.0 wt% of ethylene glycol monomethyl ether within the range specified in the present invention.

Also in Example 33, a sufficient effect on thixotropic property was obtained. Further, in the solder paste using this flux, a sufficient effect was obtained on the ability of the solder paste to suppress printing sagging. Further, a sufficient effect on printability was obtained. In addition, a sufficient effect was obtained on the ability to suppress heating sagging. Further, a sufficient effect on wettability was obtained. In addition, a sufficient effect was obtained on the ability to suppress dewet.

As shown in Examples 32 to 33, any one or more of dimer acid, hydrogenated dimer acid, trimer acid, and hydrogenated trimer acid, and cyclic amide compounds and acyclic amide compounds as thixo agents. By including the above in the range specified in the present invention, the halogen is contained in the range specified in the present invention, and the ester compound is further contained as a thixo agent in the range specified in the present invention. Sufficient effects were obtained on the thiox property, the ability to suppress printing dripping of solder paste, the printing property, the ability to suppress heating dripping, the ability to spread wet, and the ability to suppress dewet.

Example 34 contains 5.0 wt% of hydrogenated dimer acid as dimer acid and trimer acid within the range specified in the present invention, and glutaric acid as another organic acid within the range specified in the present invention. It contains 3.0 wt% and contains polymerized rosin as rosin in an amount of 45.0 wt% within the range specified in the present invention. Further, as a thixo agent, a cyclic amide compound obtained by cyclically polycondensing sebacic acid and 1,6-hexanediamine is contained in an amount of 1.5 wt% within the range specified in the present invention, and sebacic acid and 1,6-hexanediamine are contained. Contains 2.5 wt% of acyclic amide compound polycondensed in an acyclic manner within the range specified in the present invention, and sebacic acid hardening oil as an ester compound as a thixo agent within the range specified in the present invention. Includes 0.0 wt%. The total amount of the cyclic amide compound and the non-cyclic amide compound is 4.0 wt%, which is within the range specified in the present invention. Further, the present invention contains a hindered phenol-based antioxidant as an antioxidant, which does not contain amines and halogens, in an amount of 5.0 wt% within the range specified in the present invention, and tetraethylene glycol monomethyl ether using the balance as a solvent. Includes 36.0 wt% within the range specified in.

Also in Example 34, a sufficient effect on thixotropic property was obtained. Further, in the solder paste using this flux, a sufficient effect was obtained on the ability of the solder paste to suppress printing sagging. Further, a sufficient effect on printability was obtained. In addition, a sufficient effect was obtained on the ability to suppress heating sagging. Further, a sufficient effect on wettability was obtained. In addition, a sufficient effect was obtained on the ability to suppress dewet.

As shown in Example 34, the present invention comprises one or more of dimer acid, hydrogenated dimer acid, trimer acid, hydrogenated trimer acid, and cyclic amide compounds and acyclic amide compounds as thixo agents. By including within the range specified in the present invention, an antioxidant is contained within the range specified in the present invention, and an ester compound is further contained as a thixo agent within the range specified in the present invention. Sufficient effects were obtained on the properties, the ability to suppress print sagging of solder paste, the printability, the ability to suppress heat sagging, the ability to spread wet, and the ability to suppress dewet.

Example 35 contains 5.0 wt% of hydrogenated dimer acid as dimer acid and trimer acid within the range specified in the present invention, and succinic acid as another organic acid within the range specified in the present invention. It contains 0.2 wt% and contains 45.0 wt% of polymerized rosin as rosin within the range specified in the present invention. Further, as a thixo agent, a cyclic amide compound obtained by cyclically polycondensing sebacic acid and 1,6-hexanediamine is contained in an amount of 1.5 wt% within the range specified in the present invention, and sebacic acid and 1,6-hexanediamine are contained. Contains 2.5 wt% of acyclic amide compound polycondensed in an acyclic manner within the range specified in the present invention, and sebacic acid hardening oil as an ester compound as a thixo agent within the range specified in the present invention. Includes 0.0 wt%. The total amount of the cyclic amide compound and the non-cyclic amide compound is 4.0 wt%, which is within the range specified in the present invention. Further, 2-phenylimidazole as an amine is contained in an amount of 5.0 wt% within the range specified in the present invention, and diphenylguanidine / HBr as an amine hydrohalide is 1.0 wt% in the range specified in the present invention. %, And contains 3.0 wt% of trans-2,3-dibromo-2-butene-1,4-diol as an organic halogen compound within the range specified in the present invention, and hindered phenolic oxidation as an antioxidant. The inhibitor is contained in an amount of 43.0 wt% within the range specified in the present invention, and the balance is a solvent containing tetraethylene glycol monomethyl ether in an amount of 31.8 wt% within the range specified in the present invention.

Also in Example 35, a sufficient effect on thixotropic property was obtained. Further, in the solder paste using this flux, a sufficient effect was obtained on the ability of the solder paste to suppress printing sagging. Further, a sufficient effect on printability was obtained. In addition, a sufficient effect was obtained on the ability to suppress heating sagging. Further, a sufficient effect on wettability was obtained. In addition, a sufficient effect was obtained on the ability to suppress dewet.

As shown in Example 35, any one or more of dimer acid, hydrogenated dimer acid, trimer acid, hydrogenated trimer acid, and cyclic amide compound and acyclic amide compound as thixo agents are used in the present invention. By including within the range specified in the present invention, amines, halogens and antioxidants may be contained within the range specified in the present invention, and further ester compounds as thixo agents may be contained within the range specified in the present invention. Sufficient effects were obtained on the thixophilicity of the flux, the printing sagging suppressing ability of the solder paste, the printing property, the heating sagging suppressing ability, the wet spreading property, and the dewetting suppressing ability.

Example 36 contains 5.0 wt% of hydrogenated dimer acid as dimer acid and trimer acid within the range specified in the present invention, and glutaric acid as another organic acid within the range specified in the present invention. It contains 3.0 wt% and contains polymerized rosin as rosin at 35.0 wt% within the range specified in the present invention. Further, as a thixo agent, a cyclic amide compound obtained by cyclically polycondensing sebacic acid and 1,6-hexanediamine is contained in an amount of 1.5 wt% within the range specified in the present invention, and sebacic acid and 1,6-hexanediamine are contained. Contains 2.5 wt% of acyclic amide compound polycondensed in an acyclic manner within the range specified in the present invention, and sebacic acid hardening oil as an ester compound as a thixo agent within the range specified in the present invention. Includes 0.0 wt%. The total amount of the cyclic amide compound and the non-cyclic amide compound is 4.0 wt%, which is within the range specified in the present invention. Further, the present invention contains 2-phenylimidazole as an amine in an amount of 2.0 wt% within the range specified in the present invention, and trans-2,3-dibromo-2-butene-1,4-diol as an organic halogen compound. It contains 1.0 wt% within the range specified in the present invention, and contains 48.0 wt% of tetraethylene glycol monomethyl ether using the balance as a solvent within the range specified in the present invention.

Also in Example 36, a sufficient effect on thixotropic property was obtained. Further, in the solder paste using this flux, a sufficient effect was obtained on the ability of the solder paste to suppress printing sagging. Further, a sufficient effect on printability was obtained. In addition, a sufficient effect was obtained on the ability to suppress heating sagging. Further, a sufficient effect on wettability was obtained. In addition, a sufficient effect was obtained on the ability to suppress dewet.

Example 37 contains 5.0 wt% of hydrogenated dimer acid as dimer acid and trimer acid within the range specified in the present invention, and glutaric acid as another organic acid within the range specified in the present invention. It contains 3.0 wt% and contains polymerized rosin as rosin at 60.0 wt% within the range specified in the present invention. Further, as a thixo agent, a cyclic amide compound obtained by cyclically polycondensing sebacic acid and 1,6-hexanediamine is contained in an amount of 1.5 wt% within the range specified in the present invention, and sebacic acid and 1,6-hexanediamine are contained. Contains 2.5 wt% of acyclic amide compound polycondensed in an acyclic manner within the range specified in the present invention, and sebacic acid hardening oil as an ester compound as a thixo agent within the range specified in the present invention. Includes 0.0 wt%. The total amount of the cyclic amide compound and the non-cyclic amide compound is 4.0 wt%, which is within the range specified in the present invention. Further, the present invention contains 2-phenylimidazole as an amine in an amount of 2.0 wt% within the range specified in the present invention, and trans-2,3-dibromo-2-butene-1,4-diol as an organic halogen compound. It contains 1.0 wt% within the range specified in the present invention, and contains 23.0 wt% of tetraethylene glycol monomethyl ether using the balance as a solvent within the range specified in the present invention.

Also in Example 37, a sufficient effect on thixotropic property was obtained. Further, in the solder paste using this flux, a sufficient effect was obtained on the ability of the solder paste to suppress printing sagging. Further, a sufficient effect on printability was obtained. In addition, a sufficient effect was obtained on the ability to suppress heating sagging. Further, a sufficient effect on wettability was obtained. In addition, a sufficient effect was obtained on the ability to suppress dewet.

Example 38 contains 5.0 wt% of hydrogenated dimer acid as dimer acid and trimer acid within the range specified in the present invention, and glutaric acid as another organic acid within the range specified in the present invention. It contains 3.0 wt% and contains polymerized rosin as rosin in an amount of 45.0 wt% within the range specified in the present invention. Further, as a thixo agent, a cyclic amide compound obtained by cyclically polycondensing sebacic acid and 1,6-hexanediamine is contained in an amount of 2.0 wt% within the range specified in the present invention, and sebacic acid and 1,6-hexanediamine are contained. Contains 4.0 wt% of the acyclic amide compound polycondensed in a non-cyclical manner within the range specified in the present invention, and 0 as a ester compound as a thixo agent in hardened sebacic acid within the range specified in the present invention. Includes .5 wt%. The total amount of the cyclic amide compound and the acyclic amide compound is 6.0 wt%, which is within the range specified in the present invention. Further, the present invention contains 2-phenylimidazole as an amine in an amount of 2.0 wt% within the range specified in the present invention, and trans-2,3-dibromo-2-butene-1,4-diol as an organic halogen compound. It contains 1.0 wt% within the range specified in the present invention, and contains 37.5 wt% of tetraethylene glycol monomethyl ether using the balance as a solvent within the range specified in the present invention.

Also in Example 38, a sufficient effect on thixotropic property was obtained. Further, in the solder paste using this flux, a sufficient effect was obtained on the ability of the solder paste to suppress printing sagging. Further, a sufficient effect on printability was obtained. In addition, a sufficient effect was obtained on the ability to suppress heating sagging. Further, a sufficient effect on wettability was obtained. In addition, a sufficient effect was obtained on the ability to suppress dewet.

Example 39 contains 5.0 wt% of hydrogenated dimer acid as dimer acid and trimer acid within the range specified in the present invention, and glutaric acid as another organic acid within the range specified in the present invention. It contains 3.0 wt% and contains polymerized rosin as rosin in an amount of 45.0 wt% within the range specified in the present invention. Further, as a thixo agent, a cyclic amide compound obtained by cyclically polycondensing sebacic acid and 1,6-hexanediamine is contained in an amount of 0.5 wt% within the range specified in the present invention, and sebacic acid and 1,6-hexanediamine are contained. Contains 1.0 wt% of acyclic amide compound polycondensed in an acyclic manner within the range specified in the present invention, and sebacic acid hardening oil as an ester compound as a thixo agent within the range specified in the present invention. Includes 0.0 wt%. The total amount of the cyclic amide compound and the non-cyclic amide compound is 1.5 wt%, which is within the range specified in the present invention. Further, the present invention contains 2-phenylimidazole as an amine in an amount of 2.0 wt% within the range specified in the present invention, and trans-2,3-dibromo-2-butene-1,4-diol as an organic halogen compound. It contains 1.0 wt% within the range specified in the present invention, and contains 38.5 wt% of tetraethylene glycol monomethyl ether using the balance as a solvent within the range specified in the present invention.

Also in Example 39, the thixotropy ratio was 0.30 or more and less than 0.60, and a sufficient effect on thixotropic property was obtained. Further, in the solder paste using this flux, a sufficient effect was obtained on the ability of the solder paste to suppress printing sagging. Further, a sufficient effect on printability was obtained. In addition, a sufficient effect was obtained on the ability to suppress heating sagging. Further, a sufficient effect on wettability was obtained. In addition, a sufficient effect was obtained on the ability to suppress dewet.

Example 40 contains 5.0 wt% of hydrogenated dimer acid as dimer acid and trimer acid within the range specified in the present invention, and glutaric acid as another organic acid within the range specified in the present invention. It contains 3.0 wt% and contains polymerized rosin as rosin in an amount of 45.0 wt% within the range specified in the present invention. Further, as a thixo agent, a cyclic amide compound obtained by cyclically polycondensing sebacic acid and 1,6-hexanediamine is contained in an amount of 1.5 wt% within the range specified in the present invention, and sebacic acid and 1,6-hexanediamine are contained. Contains 0.5 wt% of acyclic amide compound polycondensed in an acyclic manner within the range specified in the present invention, and sebacic acid hardening oil as an ester compound as a thixo agent within the range specified in the present invention. Includes 0.0 wt%. The total amount of the cyclic amide compound and the non-cyclic amide compound is 2.0 wt%, which is within the range specified in the present invention. Further, the present invention contains 2-phenylimidazole as an amine in an amount of 2.0 wt% within the range specified in the present invention, and trans-2,3-dibromo-2-butene-1,4-diol as an organic halogen compound. It contains 1.0 wt% within the range specified in the present invention, and contains 38.0 wt% of tetraethylene glycol monomethyl ether using the balance as a solvent within the range specified in the present invention.

Also in Example 40, the thixotropy ratio was 0.30 or more and less than 0.60, and a sufficient effect on thixotropy was obtained. Further, in the solder paste using this flux, a sufficient effect was obtained on the ability of the solder paste to suppress printing sagging. Further, a sufficient effect on printability was obtained. In addition, a sufficient effect was obtained on the ability to suppress heating sagging. Further, a sufficient effect on wettability was obtained. In addition, a sufficient effect was obtained on the ability to suppress dewet.

Example 41 contains 5.0 wt% of hydrogenated dimer acid as dimer acid and trimer acid within the range specified in the present invention, and glutaric acid as another organic acid within the range specified in the present invention. It contains 3.0 wt% and contains polymerized rosin as rosin in an amount of 45.0 wt% within the range specified in the present invention. Further, as a thixo agent, a cyclic amide compound obtained by cyclically polycondensing sebacic acid and 1,6-hexanediamine is contained in an amount of 0.5 wt% within the range specified in the present invention, and sebacic acid and 1,6-hexanediamine are contained. Contains 1.5 wt% of acyclic amide compound polycondensed in an acyclic manner within the range specified in the present invention, and sebacic acid hardening oil as an ester compound as a thixo agent within the range specified in the present invention. Includes 0.0 wt%. The total amount of the cyclic amide compound and the non-cyclic amide compound is 2.0 wt%, which is within the range specified in the present invention. Further, the present invention contains 2-phenylimidazole as an amine in an amount of 2.0 wt% within the range specified in the present invention, and trans-2,3-dibromo-2-butene-1,4-diol as an organic halogen compound. It contains 1.0 wt% within the range specified in the present invention, and contains 38.0 wt% of tetraethylene glycol monomethyl ether using the balance as a solvent within the range specified in the present invention.

Also in Example 41, the thixotropy ratio was 0.30 or more and less than 0.60, and a sufficient effect on thixotropic property was obtained. Further, in the solder paste using this flux, a sufficient effect was obtained on the ability of the solder paste to suppress printing sagging. Further, a sufficient effect on printability was obtained. In addition, a sufficient effect was obtained on the ability to suppress heating sagging. Further, a sufficient effect on wettability was obtained. In addition, a sufficient effect was obtained on the ability to suppress dewet.

Example 42 contains 5.0 wt% of hydrogenated dimer acid as dimer acid and trimer acid within the range specified in the present invention, and glutaric acid as another organic acid within the range specified in the present invention. It contains 3.0 wt% and contains polymerized rosin as rosin in an amount of 45.0 wt% within the range specified in the present invention. Further, as a thixo agent, a cyclic amide compound obtained by cyclically polycondensing sebacic acid and 1,6-hexanediamine is contained in an amount of 0.1 wt% within the range specified in the present invention, and sebacic acid and 1,6-hexanediamine are contained. Contains 2.5 wt% of acyclic amide compound polycondensed in an acyclic manner within the range specified in the present invention, and sebacic acid hardening oil as an ester compound as a thixo agent within the range specified in the present invention. Includes 0.0 wt%. The total amount of the cyclic amide compound and the acyclic amide compound is 2.6 wt%, which is within the range specified in the present invention. Further, the present invention contains 2-phenylimidazole as an amine in an amount of 2.0 wt% within the range specified in the present invention, and trans-2,3-dibromo-2-butene-1,4-diol as an organic halogen compound. It contains 1.0 wt% within the range specified in the present invention, and contains 37.4 wt% of tetraethylene glycol monomethyl ether using the balance as a solvent within the range specified in the present invention.

Also in Example 42, the thixotropy ratio was 0.30 or more and less than 0.60, and a sufficient effect on thixotropic property was obtained. Further, in the solder paste using this flux, a sufficient effect was obtained on the ability of the solder paste to suppress printing sagging. Further, a sufficient effect on printability was obtained. In addition, a sufficient effect was obtained on the ability to suppress heating sagging. Further, a sufficient effect on wettability was obtained. In addition, a sufficient effect was obtained on the ability to suppress dewet.

Example 43 contains 5.0 wt% of hydrogenated dimer acid as dimer acid and trimer acid within the range specified in the present invention, and glutaric acid as another organic acid within the range specified in the present invention. It contains 3.0 wt% and contains polymerized rosin as rosin in an amount of 45.0 wt% within the range specified in the present invention. Further, as a thixo agent, a cyclic amide compound obtained by cyclically polycondensing sebacic acid and 1,6-hexanediamine is contained in an amount of 0.3 wt% within the range specified in the present invention, and sebacic acid and 1,6-hexanediamine are contained. Contains 2.5 wt% of acyclic amide compound polycondensed in an acyclic manner within the range specified in the present invention, and sebacic acid hardening oil as an ester compound as a thixo agent within the range specified in the present invention. Includes 0.0 wt%. The total amount of the cyclic amide compound and the acyclic amide compound is 2.8 wt%, which is within the range specified in the present invention. Further, the present invention contains 2-phenylimidazole as an amine in an amount of 2.0 wt% within the range specified in the present invention, and trans-2,3-dibromo-2-butene-1,4-diol as an organic halogen compound. It contains 1.0 wt% within the range specified in the present invention, and contains 38.2 wt% of tetraethylene glycol monomethyl ether using the balance as a solvent within the range specified in the present invention.

Also in Example 43, the thixotropy ratio was 0.30 or more and less than 0.60, and a sufficient effect on thixotropic property was obtained. Further, in the solder paste using this flux, a sufficient effect was obtained on the ability of the solder paste to suppress printing sagging. Further, a sufficient effect on printability was obtained. In addition, a sufficient effect was obtained on the ability to suppress heating sagging. Further, a sufficient effect on wettability was obtained. In addition, a sufficient effect was obtained on the ability to suppress dewet.

In Example 44, the addition amounts of the cyclic amide compound and the non-cyclic amide compound were changed, and the dimer acid and hydrogenated dimer acid as the trimer acid were contained in an amount of 5.0 wt% within the range specified in the present invention. Glutalic acid is contained as the organic acid of the above in an amount of 3.0 wt% within the range specified in the present invention, and polymerized rosin is contained as a rosin in the range specified in the present invention in an amount of 45.0 wt%. Further, as a thixo agent, a cyclic amide compound obtained by cyclically polycondensing sebacic acid and 1,6-hexanediamine is contained in an amount of 0.3 wt% within the range specified in the present invention, and sebacic acid and 1,6-hexanediamine are contained. Contains 8.0 wt% of the acyclic amide compound polycondensed in an acyclic manner within the range specified in the present invention. The total amount of the cyclic amide compound and the non-cyclic amide compound is 8.3 wt%, which is within the range specified in the present invention. Further, the present invention contains 2-phenylimidazole as an amine in an amount of 2.0 wt% within the range specified in the present invention, and trans-2,3-dibromo-2-butene-1,4-diol as an organic halogen compound. It contains 1.0 wt% within the range specified in the present invention, and contains 35.7 wt% of tetraethylene glycol monomethyl ether using the balance as a solvent within the range specified in the present invention.

In Example 44, by containing 0.3 wt% of the cyclic amide compound, even if 8 wt% of the acyclic amide compound was contained, a sufficient effect on thixotropic property was obtained. Further, in the solder paste using this flux, a sufficient effect was obtained on the ability of the solder paste to suppress printing sagging. Further, a sufficient effect on printability was obtained. In addition, a sufficient effect was obtained on the ability to suppress heating sagging. Further, a sufficient effect on wettability was obtained. In addition, a sufficient effect was obtained on the ability to suppress dewet.

On the other hand, Comparative Example 1 contains 5.0 wt% of hydrogenated dimer acid as dimer acid and trimer acid within the range specified in the present invention, and glutaric acid as another organic acid is specified in the present invention. It contains 3.0 wt% within the above range and contains 45.0 wt% of polymerized rosin as the rosin within the range specified in the present invention. Further, as a thixo agent, a cyclic amide compound obtained by cyclically polycondensing sebacic acid and 1,6-hexanediamine is contained in an amount of 0.1 wt% within the range specified in the present invention, and sebacic acid and 1,6-hexanediamine are contained. Contains 0.1 wt% of the acyclic amide compound polycondensed in an acyclic manner outside the range specified in the present invention. The total amount of the cyclic amide compound and the non-cyclic amide compound is 0.2 wt%, which is outside the range specified in the present invention. Further, the present invention contains 2-phenylimidazole as an amine in an amount of 2.0 wt% within the range specified in the present invention, and trans-2,3-dibromo-2-butene-1,4-diol as an organic halogen compound. It contains 1.0 wt% within the range specified in the present invention, and contains tetraethylene glycol monomethyl ether with the balance as a solvent in an amount of 43.8 wt% within the range specified in the present invention.

Even if the content of the cyclic amide compound is within the range specified in the present invention, the content of the acyclic amide compound is less than the range specified in the present invention, and the cyclic amide compound and the acyclic amide compound In Comparative Example 1 in which the total amount was less than the range specified in the present invention, no effect was obtained on the thixo property of the flux, the printing sagging suppressing ability of the solder paste, the printing property, and the heating sagging suppressing ability.

Comparative Example 2 contains 5.0 wt% of hydrogenated dimer acid as dimer acid and trimer acid within the range specified in the present invention, and glutaric acid as another organic acid within the range specified in the present invention. It contains 3.0 wt% and contains polymerized rosin as rosin in an amount of 45.0 wt% within the range specified in the present invention. Further, as a thixo agent, a cyclic amide compound obtained by cyclically polycondensing sebacic acid and 1,6-hexanediamine is contained in an amount of 0.1 wt% within the range specified in the present invention, and sebacic acid and 1,6-hexanediamine are contained. Contains 0.5 wt% of the acyclic amide compound polycondensed in an acyclic manner within the range specified in the present invention. However, the total amount of the cyclic amide compound and the non-cyclic amide compound is 0.6 wt%, which is outside the range specified in the present invention. Further, the present invention contains 2-phenylimidazole as an amine in an amount of 2.0 wt% within the range specified in the present invention, and trans-2,3-dibromo-2-butene-1,4-diol as an organic halogen compound. It contains 1.0 wt% within the range specified in the present invention, and contains tetraethylene glycol monomethyl ether as a solvent in the balance of 43.4 wt% within the range specified in the present invention.

Comparison in which the total amount of the cyclic amide compound and the acyclic amide compound is less than the range specified in the present invention even if the contents of the cyclic amide compound and the acyclic amide compound are within the range specified in the present invention. In Example 2, no effect was obtained on the thixo property of the flux, the printing sagging suppressing ability of the solder paste, the printing property, and the heating sagging suppressing ability.

Comparative Example 3 contains 5.0 wt% of hydrogenated dimer acid as dimer acid and trimer acid within the range specified in the present invention, and glutaric acid as another organic acid within the range specified in the present invention. It contains 3.0 wt% and contains polymerized rosin as rosin in an amount of 45.0 wt% within the range specified in the present invention. Further, as the thixotropy, 15.0 wt% of acyclic amide compound in which sebacic acid and 1,6-hexanediamine are polycondensed in an acyclic manner is contained outside the range specified in the present invention without containing a cyclic amide compound. Further, the present invention contains 2-phenylimidazole as an amine in an amount of 2.0 wt% within the range specified in the present invention, and trans-2,3-dibromo-2-butene-1,4-diol as an organic halogen compound. It contains 1.0 wt% within the range specified in the present invention, and contains 29.0 wt% of tetraethylene glycol monomethyl ether using the balance as a solvent within the range specified in the present invention.

In Comparative Example 3 containing no cyclic amide compound, by increasing the amount of the acyclic amide compound added beyond the range specified in the present invention, the flux property, the solder paste printing sagging ability, and the heating sagging suppressing ability were suppressed. An effect was obtained on the ability, but no effect was obtained on the printability of the solder paste.

Comparative Example 4 contains 5.0 wt% of hydrogenated dimer acid as dimer acid and trimer acid within the range specified in the present invention, and glutaric acid as another organic acid within the range specified in the present invention. It contains 3.0 wt% and contains polymerized rosin as rosin in an amount of 45.0 wt% within the range specified in the present invention. Further, the thixotropy does not contain a cyclic amide compound or a non-cyclic amide compound, and contains 5.0 wt% of hydrogenated castor oil as an ester compound within the range specified in the present invention. Further, the present invention contains 2-phenylimidazole as an amine in an amount of 2.0 wt% within the range specified in the present invention, and trans-2,3-dibromo-2-butene-1,4-diol as an organic halogen compound. It contains 1.0 wt% within the range specified in the present invention, and contains 39.0 wt% of tetraethylene glycol monomethyl ether using the balance as a solvent within the range specified in the present invention.

In Comparative Example 4 which does not contain the cyclic amide compound and the non-cyclic amide compound, by containing the ester compound as the thixo agent within the range specified in the present invention, the tyxo property of the flux, the ability to suppress printing sagging of the solder paste, and printing An effect was obtained on the sex, but no effect was obtained on the ability of the solder paste to suppress heating sagging.

Comparative Example 5 does not contain dimer acid and trimer acid, contains glutaric acid as another organic acid in an amount of 3.0 wt% within the range specified in the present invention, and contains polymerized rosin as a rosin in the present invention. Includes 50.0 wt% within the range. Further, as a thixo agent, a cyclic amide compound obtained by cyclically polycondensing sebacic acid and 1,6-hexanediamine is contained in an amount of 2.0 wt% within the range specified in the present invention, and sebacic acid and 1,6-hexanediamine are contained. Contains 4.0 wt% of the acyclic amide compound polycondensed in an acyclic manner within the range specified in the present invention. The total amount of the cyclic amide compound and the acyclic amide compound is 6.0 wt%, which is within the range specified in the present invention. Further, the present invention contains 2-phenylimidazole as an amine in an amount of 2.0 wt% within the range specified in the present invention, and trans-2,3-dibromo-2-butene-1,4-diol as an organic halogen compound. It contains 1.0 wt% within the range specified in the present invention, and contains 38.0 wt% of tetraethylene glycol monomethyl ether using the balance as a solvent within the range specified in the present invention.

In Comparative Example 5 containing no dimer acid or trimer acid, no effect was obtained on the wettability and the ability to suppress dewetting.

The thixo agent contains a cyclic amide compound and a non-cyclic amide compound using malonic acid, succinic acid, glutaric acid, pimelic acid, suberic acid, azelaic acid, cyclohexanedicarboxylic acid, phthalic acid, terephthalic acid and the like as dicarboxylic acids. In particular, sufficient effects were obtained on the pimelic acidity of the flux, the printing sagging suppressing ability of the solder paste, the printing property, and the heating sagging suppressing ability.

Further, when the thixo agent contains a cyclic amide compound or a non-cyclic amide compound using cyclohexanetricarboxylic acid, benzenetricarboxylic acid or the like as the tricarboxylic acid, the thixo property of the flux, the ability to suppress printing sagging of the solder paste, the printability, and the heating A sufficient effect was obtained on the ability to suppress sagging.

Further, as the thixo agent, ethylenediamine, 1,3-diaminopropane, 1,4-diaminobutane, dimer diamine, phenylenediamine, m-xylylenediamine, paraxylylenediamine, 2,4-diaminotoluene and the like were used as diamines. Even when the cyclic amide compound and the non-cyclic amide compound were contained, sufficient effects were obtained on the thixo property of the flux, the print sagging suppressing ability of the solder paste, the printability, and the heating sagging suppressing ability.

Further, even if the thixotropy contains a cyclic amide compound or a non-cyclic amide compound using triaminocyclohexane, trimertriamine or the like as the triamine, the thixotropy of the flux, the ability to suppress the printing sagging of the solder paste, the printability, and the suppression of the heating sagging A sufficient effect was obtained on the ability.

Further, the thixo agent also contains an acyclic amide compound using acetic acid, palmitic acid, stearic acid, 12-hydroxystearic acid, behenic acid, montanic acid, etc. as the monocarboxylic acid, which makes the flux thixo property and solder paste. Sufficient effects were obtained on the ability to suppress print sagging, printability, and ability to suppress heat sagging.

Further, even if the thixo agent contains an acyclic amide compound using ammonia, ethylamine, hexylamine, octylamine, stearylamine or the like as the monoamine, the thixo property of the flux, the ability to suppress the printing sagging of the solder paste, the printability, and the heating A sufficient effect was obtained on the ability to suppress sagging.

Furthermore, even if the thixotropy contains a non-cyclic amide compound obtained by ring-opening polymerization of lactam, sufficient effects can be obtained on the thixotropic property of the flux, the printing sagging suppressing ability of the solder paste, the printing property, and the heating sagging suppressing ability. It was.

<Evaluation of the thickening inhibitory effect of solder paste>
The effect of suppressing thickening of the solder paste prepared by using the flux of each of the above-mentioned examples and the solder alloy having the composition shown in Table 4 below was also verified.

(1) Verification method The obtained solder paste was rotated using a rotational viscometer (PCU-205, manufactured by Malcolm Co., Ltd.) according to the method described in "4.2 Viscosity Characteristics Test" of JIS Z 3284-3. The viscosity was continuously measured for 12 hours at a number: 10 rpm and a measurement temperature: 25 ° C. Then, the initial viscosity (viscosity after 30 minutes of stirring) and the viscosity after 12 hours were compared, and the thickening suppressing effect was evaluated based on the following criteria.
(2) Judgment criteria 〇: Viscosity after 13 hours ≤ Initial viscosity × 1.2: Viscosity increase over time is small and good ×: Viscosity after 13 hours> Initial viscosity × 1.2: Viscosity increase over time is large Bad

In the solder paste using the flux of each example shown in Tables 1 to 3 and the solder alloy of each example shown in Table 4 satisfying the above equations (1) and (2), the solder paste is printed. In addition to the ability to suppress dripping, printability, suppressing dripping by heating, spreading wetness, and suppressing dewetting, a sufficient effect on the thickening suppressing effect was obtained.

On the other hand, in the solder paste using the flux of each example shown in Tables 1 to 3 and the solder alloy of each comparative example shown in Table 4 which does not satisfy the above equations (1) and (2). , The effect was obtained on the printing sagging suppressing ability, the printing property, the heating sagging suppressing ability, the wetting spreading property, and the dewetting suppressing ability of the solder paste, but the effect was not obtained on the thickening suppressing effect.

From the above, any one or more of dimer acid, hydrogenated dimer acid, trimer acid, and hydrogenated trimer acid, a thixo agent, a rosin, and a solvent are contained, and the thixo agent is a dicarboxylic acid and /. Alternatively, a cyclic amide compound in which tricarboxylic acid and diamine and / or triamine are cyclically polycondensed, and a cyclic amide compound in which monocarboxylic acid, dicarboxylic acid and / or tricarboxylic acid and monoamine, diamine and / or triamine are cyclically polycondensed. Or, it is composed of a non-cyclic amide compound obtained by ring-opening polymerization of lactam, and the cyclic amide compound has 3 or more and 10 or less carbon atoms of dicarboxylic acid and tricarboxylic acid, and 2 or more and 54 or less carbon atoms of diamine and triamine. The cyclic amide compound has a monocarboxylic acid, a dicarboxylic acid and a tricarboxylic acid having a carbon number of 2 or more and 28 or less, a monoamine, a diamine and a triamine having a carbon number of 0 or more and 54 or less, and the cyclic amide compound is 0.1 wt% or more and 8. 0 wt% or less, more preferably 0.5 wt% or more and 1.5 wt% or less of the cyclic amide compound, 0.5 wt% or more and 8.0 wt% or less of the acyclic amide compound, more preferably 0 wt% or less of the acyclic amide compound. In the flux according to the present invention, which contains 5 wt% or more and 4.0 wt% or less and the total of the cyclic amide compound and the acyclic amide compound is 1.5 wt% or more and 10.0 wt% or less, the thixo agent is derived from the acyclic amide compound. As compared with the case of, the thixo property could be improved without increasing the content of the acyclic amide compound, and the precipitation of the thixo agent could be suppressed.

With the solder paste using this flux, it was possible to obtain good printability in which bleeding, blurring, etc. were suppressed, and it was possible to suppress printing sagging in which the solder paste flows after printing. Furthermore, it was possible to suppress the heating sagging of the solder paste due to heating during soldering.

Further, by containing any one of dimer acid, hydrogenated dimer acid, trimer acid, and hydrogenated trimer acid, or two or more kinds of 0.5 wt% or more and 20 wt% or less, good wet spread spreads even under a large heat load condition. It was found that the occurrence of dewetting can be suppressed, and it was possible to provide a flux that enables stable and good-finished soldering regardless of the thermal history.

Further, the flux according to the present invention contains 0 wt% or more and 8.0 wt% or less of the ester compound as a thiox agent, more preferably 0 wt% or more and 4.0 wt% or less of the ester compound, and 30.0 wt% or more and 60.0 wt% of the rosin. % Or less, more preferably 35.0 wt% or more and 60.0 wt% or less of rosin, 0 wt% or more and 10.0 wt% or less of other organic acids, and more preferably 0.2 wt% or more of other organic acids. 0 wt% or less, amine 0 wt% or more and 20.0 wt% or less, more preferably amine 0 wt% or more and 5.0 wt% or less, organic halogen compound 0 wt% or more and 5.0 wt% or less, amine halide hydride. It contains 0 wt% or more and 2.0 wt% or less, an antioxidant in 0 wt% or more and 5.0 wt% or less, and the balance is a solvent. With such a composition, the thixo agent contains a cyclic amide compound and a non-cyclic amide compound, so that the flux has a thixo property, a solder paste has a printing sagging ability, a printing property, a heating sagging suppressing ability, a dimer acid, and water. The wet spreading property and the ability to suppress dewetting were not inhibited by containing any one of the added dimer acid, trimer acid, and hydrogenated trimer acid, or two or more kinds, and a sufficient effect was obtained for these.

Further, this flux and As: 25 mass ppm or more and 300 mass ppm or less, Sb: 0 mass ppm or more and 3000 mass ppm or less, Bi: 0 mass ppm or more and 10000 mass ppm or less, and Pb: 0 mass ppm or more and 5100 mass ppm or less. At least one of the following, Ag: 0% by mass or more and 4% by mass or less, Cu: 0% by mass or more and 0.9% by mass or less, and the balance consisting of Sn, and the above equation (1) and number (2). ) In the solder paste using a solder alloy satisfying the formula, the texos property of the flux due to the inclusion of the cyclic amide compound and the non-cyclic amide compound in the thixo agent, the ability to suppress the printing sagging of the solder paste, the printability, the ability to suppress the heating sagging, The wet spreadability and the ability to suppress dewetting are not inhibited by containing any one or more of dimer acid, hydrogenated dimer acid, trimer acid, and hydrogenated trimer acid, which is sufficient for the thickening suppressing effect. The effect was obtained.

Therefore, in the present invention, a dimer acid which is a reaction product of a monocarboxylic acid and is a dimer acid, a hydrogenated dimer acid obtained by adding hydrogen to a dimer acid, and a trimeric acid and a trimer acid which are a trimer of a reaction product of a monocarboxylic acid. Dimeric acid, which contains one of hydrogenated trimeric acids, or two or more of dimeric acid, hydrogenated dimeric acid, trimeric acid, hydrogenated trimeric acid, rosin, thixo agent, and solvent . A thixo agent containing 0.5 wt% or more and 20 wt% or less of any one of hydrogenated dimer acid, trimer acid, and hydrogenated trimer acid, or two or more kinds of dimer acid, hydrogenated dimer acid, trimer acid, and hydrogenated trimer acid. Consists of a cyclic amide compound and an acyclic amide compound, containing a cyclic amide compound in an amount of 0.1 wt% or more and 8.0 wt% or less, a non-cyclic amide compound in an amount of 0.5 wt% or more and 8.0 wt% or less, and a cyclic amide. The total of the compound and the acyclic amide compound is 1.5 wt% or more and 10.0 wt% or less, and the cyclic amide compound has a molecular weight of 3000 in which dicarboxylic acid and / or tricarboxylic acid and diamine and / or triamine are cyclically polycondensed. The following amide compounds, the acyclic amide compound is a flux which is an amide compound in which a monocarboxylic acid, a dicarboxylic acid and / or a tricarboxylic acid and a monoamine, a diamine and / or a triamine are acyclically condensed.

It is also preferred to include a rosin less 30 wt% or more 60 wt%.

Claims (16)

Dimeric acid, which is a reaction product of monocarboxylic acid, dimer acid which is a dimer, hydrogenated dimer acid which is hydrogenated dimer acid, trimeric acid which is a trimer acid which is a reactant of monocarboxylic acid, and water which is hydrogenated to trimer acid. Contains any of the added trimer acids, or two or more of dimer acid, hydrogenated dimer acid, trimer acid, hydrogenated trimer acid, rosin, thixo agent, and solvent.
The thixo agent is composed of a cyclic amide compound and an acyclic amide compound, and contains a cyclic amide compound in an amount of 0.1 wt% or more and 8.0 wt% or less and an acyclic amide compound in an amount of 0.5 wt% or more and 8.0 wt% or less. The total of the cyclic amide compound and the non-cyclic amide compound is 1.5 wt% or more and 10.0 wt% or less.
The cyclic amide compound is an amide compound having a molecular weight of 3000 or less in which a dicarboxylic acid and / or a tricarboxylic acid and a diamine and / or a triamine are cyclically polycondensed.
The acyclic amide compound is a flux characterized by being an amide compound in which a monocarboxylic acid, a dicarboxylic acid and / or a tricarboxylic acid and a monoamine, a diamine and / or a triamine are acyclically condensed. The flux according to claim 1, wherein the cyclic amide compound has a dicarboxylic acid and a tricarboxylic acid having 3 or more and 10 or less carbon atoms. The flux according to claim 1, wherein the cyclic amide compound has 6 or more and 10 or less carbon atoms of the dicarboxylic acid and the tricarboxylic acid. The flux according to claim 2 or 3, wherein the cyclic amide compound has 2 or more and 54 or less carbon atoms of diamine and triamine. The flux according to claim 2 or 3, wherein the cyclic amide compound has 6 carbon atoms in the diamine and the triamine. The flux according to claim 1, wherein the cyclic amide compound is an amide compound in which a dicarboxylic acid having 3 or more and 10 or less carbon atoms and a diamine having 2 or more and 54 carbon atoms or less are cyclically polycondensed. The flux according to claim 1, wherein the cyclic amide compound is an amide compound in which a dicarboxylic acid having 6 or more and 10 or less carbon atoms and a diamine having 6 carbon atoms are cyclically polycondensed. The cyclic amide compound has a dicarboxylic acid and a tricarboxylic acid having a carbon number of 3 or more and 10 or less, and a diamine and a triamine having a carbon number of 2 or more and 54 or less.
The non-cyclic amide compound according to claim 1, wherein the monocarboxylic acid, the dicarboxylic acid and the tricarboxylic acid have 2 or more and 28 or less carbon atoms, and the monoamine, diamine and triamine have 0 or more and 54 or less carbon atoms. flux. The flux according to any one of claims 1 to 8, wherein the thixotropy further contains an ester compound. The flux according to claim 9, wherein the thixotropy contains hydrogenated castor oil as an ester compound. The flux according to claim 1, wherein the thixotropy contains 0.5 wt% or more and 1.5 wt% or less of the cyclic amide compound and 0.5 wt% or more and 4.0 wt% or less of the acyclic amide compound. The flux according to claim 9 or 10, wherein the thixotropy contains 0 wt% or more and 8.0 wt% or less of the ester compound. Contains 0.5 wt% or more and 20 wt% or less of any one of dimer acid, hydrogenated dimer acid, trimer acid, hydrogenated trimer acid, or two or more kinds of dimer acid, hydrogenated dimer acid, trimer acid and hydrogenated trimer acid. The flux according to any one of claims 1 to 12, wherein the flux is characterized by the above. The flux according to any one of claims 1 to 13, wherein the flux contains rosin in an amount of 30 wt% or more and 60 wt% or less. Furthermore, organic acids other than dimer acid, hydrogenated dimer acid, trimer acid, and hydrogenated trimer acid are added in an amount of 0 wt% or more and 10 wt% or less.
Amine is 0 wt% or more and 20 wt%,
Organic halogen compounds 0 wt% or more and 5 wt% or less,
Amine halide hydrohydrate from 0 wt% to 2 wt%,
The flux according to any one of claims 1 to 14, wherein the flux contains 0 wt% or more and 5 wt% or less of an antioxidant. A solder paste comprising the flux according to any one of claims 1 to 15 and a metal powder.

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