JP2020125367A - Curable silicone composition - Google Patents

Curable silicone composition Download PDF

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JP2020125367A
JP2020125367A JP2019016625A JP2019016625A JP2020125367A JP 2020125367 A JP2020125367 A JP 2020125367A JP 2019016625 A JP2019016625 A JP 2019016625A JP 2019016625 A JP2019016625 A JP 2019016625A JP 2020125367 A JP2020125367 A JP 2020125367A
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curable silicone
silicone composition
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cured product
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JP7021645B2 (en
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利之 小材
Toshiyuki Kozai
利之 小材
大輔 平野
Daisuke Hirano
大輔 平野
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Shin Etsu Chemical Co Ltd
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Abstract

To provide a curable silicone composition that gives a cured product that has excellent transparency and water vapor blocking properties, and resists being discolored and changed in hardness with time.SOLUTION: A curable silicone composition contains (A) a polyorganosiloxane having a cyclic siloxane structure and a phenyl silylene group of 100 pts.mass, and (B) a polymerization initiator 0.0001-10 pts.mass.SELECTED DRAWING: None

Description

本発明は、硬化型シリコーン組成物に関する。 The present invention relates to a curable silicone composition.

硬化型シリコーン組成物は、一般的に縮合反応や付加反応により硬化する。
中でもアルケニル基等の脂肪族不飽和基を含有するポリオルガノシロキサンを含む付加硬化性シリコーン組成物は、ヒドロシリル化反応によって硬化して硬化物を与える。この硬化物は、耐熱性、耐寒性、電気絶縁性に優れるうえに、透明であるため、各種の光学用途に用いられている。
また、光学用途に使用されるシリコーンゴムは、高透明性・高屈折率および高強度が要求されるため、主骨格にジメチルシロキサン・ジフェニルシロキサン共重合体や、ポリメチルフェニルシロキサンが一般に使用されている(特許文献1〜9参照)。
しかし、付加硬化性シリコーン組成物では、硬化触媒である白金触媒による材料の変色や硬さ変化が起こり、大きな問題となっている。
The curable silicone composition is generally cured by a condensation reaction or an addition reaction.
Above all, the addition-curable silicone composition containing a polyorganosiloxane containing an aliphatic unsaturated group such as an alkenyl group is cured by a hydrosilylation reaction to give a cured product. This cured product has excellent heat resistance, cold resistance, and electrical insulation properties, and is transparent, so that it is used for various optical applications.
In addition, since silicone rubber used for optical applications is required to have high transparency, high refractive index and high strength, dimethylsiloxane/diphenylsiloxane copolymer or polymethylphenylsiloxane is generally used for the main skeleton. (See Patent Documents 1 to 9).
However, in the addition-curable silicone composition, discoloration and hardness change of the material occur due to the platinum catalyst as a curing catalyst, which is a big problem.

一方、従来、環状体を分子中に有するオルガノポリシロキサンが知られており、特にシクロトリシロキサンを酸性触媒により開環して硬化型シリコーン組成物を得る方法は一般的に行われている(特許文献10,11)。
しかし、これらのオルガノポリシロキサンを含む組成物から得られた硬化物のシートは脆く、しかも水蒸気遮断性が低いため、光学用途に適した硬化型シリコーン組成物を得ることができなかった。
On the other hand, conventionally, an organopolysiloxane having a cyclic substance in the molecule is known, and in particular, a method for obtaining a curable silicone composition by ring-opening cyclotrisiloxane with an acidic catalyst is generally performed (Patent References 10 and 11).
However, since the sheet of the cured product obtained from the composition containing these organopolysiloxanes is brittle and has a low water vapor barrier property, a curable silicone composition suitable for optical applications cannot be obtained.

特開2005−307015号公報JP, 2005-307015, A 特開2004−143361号公報JP, 2004-143361, A 特開2004−186168号公報JP, 2004-186168, A 特開2004−292807号公報JP, 2004-292807, A 特開2004−359756号公報JP, 2004-359756, A 特開2005−076003号公報JP, 2005-076003, A 特開2005−105217号公報JP, 2005-105217, A 特開2010−132795号公報JP, 2010-132795, A 特開2014−205823号公報JP, 2014-205823, A 特開昭41−011119号公報JP-A-41-011119 特開昭43−014720号公報JP-A-43-014720

本発明は、このような事情に鑑みてなされたものであり、透明性および水蒸気遮断性に優れ、経時による変色や硬さ変化の少ない硬化物を与える硬化型シリコーン組成物を提供することを目的とする。 The present invention has been made in view of the above circumstances, and an object thereof is to provide a curable silicone composition that is excellent in transparency and water vapor barrier properties, and that provides a cured product with little discoloration or hardness change over time. And

本発明者らは、上記目的を達成するため鋭意検討を重ねた結果、シルフェニレン基を主鎖に有する環状構造を有するオルガノポリシロキサンを含む組成物が、透明性および水蒸気遮断性に優れ、経時による変色や硬さ変化の少ない硬化物を与えることを見出し、本発明を完成した。 The inventors of the present invention have conducted extensive studies to achieve the above object, and as a result, a composition containing an organopolysiloxane having a cyclic structure having a silphenylene group in its main chain is excellent in transparency and water vapor barrier property, and The present invention has been completed by finding that a cured product with less discoloration and hardness change due to is provided.

すなわち、本発明は、
1. (A)下記一般式(1)および(2)

Figure 2020125367
〔式中、Rは、それぞれ独立して非置換または置換の1価炭化水素基を表し、nは、1〜5の整数を表し、
1は、それぞれ独立して非置換または置換の1価炭化水素基を表し、mは、0〜3の整数を表し、
Xは、それぞれ独立して、下記一般式(3)
Figure 2020125367
(式中、R2は、それぞれ独立して、炭素原子数1〜10の2価の有機基またはシロキサン骨格を含有する2価の有機基を表し、lは、1または2を表す。)
で表される基を表す。〕
で表されるポリオルガノシロキサンから選ばれる少なくとも一方 100質量部、および
(B)重合開始剤 0.0001〜10質量部
を含有することを特徴とする硬化型シリコーン組成物、
2. 前記(A)成分のオルガノポリシロキサンの屈折率が、1.49以上である1の硬化型シリコーン組成物、
3. 1または2の硬化型シリコーン組成物の硬化物で封止された光学素子
を提供する。 That is, the present invention is
1. (A) The following general formulas (1) and (2)
Figure 2020125367
[In formula, R represents an unsubstituted or substituted monovalent hydrocarbon group each independently, n represents the integer of 1-5,
R 1 independently represents an unsubstituted or substituted monovalent hydrocarbon group, m represents an integer of 0 to 3,
X is independently the following general formula (3)
Figure 2020125367
(In the formula, each R 2 independently represents a divalent organic group having 1 to 10 carbon atoms or a divalent organic group containing a siloxane skeleton, and 1 represents 1 or 2.)
Represents a group represented by. ]
A curable silicone composition containing at least one 100 parts by mass of a polyorganosiloxane represented by, and (B) a polymerization initiator of 0.0001 to 10 parts by mass.
2. 1. A curable silicone composition having a refractive index of the organopolysiloxane of the component (A) of 1.49 or more,
3. An optical element sealed with a cured product of the curable silicone composition of 1 or 2.

本発明の硬化型シリコーン組成物は、シルフェニレン基を主鎖に有する環状構造を有するオルガノポリシロキサンを含んでいるため、硬化により耐熱性、耐変色性、水蒸気遮断性に優れ、弾性のある透明硬化物を与える。
このような特徴を有する本発明の組成物は、発光ダイオード(LED)素子の保護(封止)、接着、波長変更・調整材料、レンズ材料等の発光ダイオード素子用シリコーン樹脂組成物として有用である。
Since the curable silicone composition of the present invention contains an organopolysiloxane having a cyclic structure having a silphenylene group in its main chain, it is excellent in heat resistance, discoloration resistance, water vapor barrier property, and elastic and transparent when cured. Give a cured product.
The composition of the present invention having such characteristics is useful as a silicone resin composition for light emitting diode elements such as protection (sealing) of light emitting diode (LED) elements, adhesion, wavelength changing/adjusting material, and lens material. ..

以下、本発明についてさらに詳しく説明する。
本発明に係る硬化型シリコーン組成物では、(A)成分として、一般式(1)および(2)で表されるポリオルガノシロキサンから選ばれる少なくとも一方が用いられる。
Hereinafter, the present invention will be described in more detail.
In the curable silicone composition according to the present invention, as the component (A), at least one selected from the polyorganosiloxanes represented by the general formulas (1) and (2) is used.

Figure 2020125367
Figure 2020125367

一般式(1)において、RおよびR1は、いずれもそれぞれ独立して非置換または置換の1価炭化水素基を表す。
上記RおよびR1の1価炭化水素基の炭素原子数としては、特に限定されるものではないが、1〜10が好ましく、1〜8がより好ましい。
この1価炭化水素基は、直鎖、分岐、環状のいずれでもよく、その具体例としては、メチル、エチル、n−プロピル、イソプロピル、n−ブチル、イソブチル、tert−ブチル、n−ペンチル、ネオペンチル、n−ヘキシル、シクロヘキシル、n−オクチル、n−ノニル、n−デシル基等のアルキル基;フェニル、トリル、キシリル、ナフチル基等のアリール基;ベンジル、フェニルエチル、フェニルプロピル基等のアラルキル基;ビニル、アリル、プロペニル、イソプロペニル、ブテニル、ヘキセニル、シクロヘキセニル、オクテニル基等のアルケニル基などが挙げられる。
また、これらの炭化水素基の水素原子の一部または全部は、フッ素、臭素、塩素等のハロゲン原子、シアノ基等で置換されていてもよく、そのような置換炭化水素基の具体例としては、クロロメチル、クロロプロピル、ブロモエチル、トリフロロプロピル基等のハロゲン置換アルキル基;シアノエチル基等が挙げられる。
さらに、これらの置換または非置換の炭化水素基は、炭化水素鎖の一部にエーテル結合(エーテル性酸素原子)、アミド結合などを含んでいてもよい。
In the general formula (1), R and R 1 each independently represent an unsubstituted or substituted monovalent hydrocarbon group.
The number of carbon atoms of the monovalent hydrocarbon group of R and R 1 is not particularly limited, but is preferably 1 to 10 and more preferably 1 to 8.
The monovalent hydrocarbon group may be linear, branched or cyclic, and specific examples thereof include methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, tert-butyl, n-pentyl and neopentyl. , Alkyl groups such as n-hexyl, cyclohexyl, n-octyl, n-nonyl and n-decyl groups; aryl groups such as phenyl, tolyl, xylyl and naphthyl groups; aralkyl groups such as benzyl, phenylethyl and phenylpropyl groups; Examples thereof include alkenyl groups such as vinyl, allyl, propenyl, isopropenyl, butenyl, hexenyl, cyclohexenyl and octenyl groups.
Further, some or all of the hydrogen atoms of these hydrocarbon groups may be substituted with a halogen atom such as fluorine, bromine or chlorine, or a cyano group, and specific examples of such a substituted hydrocarbon group include , Halogen-substituted alkyl groups such as chloromethyl, chloropropyl, bromoethyl, and trifluoropropyl groups; and cyanoethyl groups.
Furthermore, these substituted or unsubstituted hydrocarbon groups may contain an ether bond (etheric oxygen atom), an amide bond or the like in a part of the hydrocarbon chain.

これらの中でも、Rとしては、炭素原子数1〜5のアルキル基、アリール基が好ましく、メチル基またはフェニル基がより好ましい。
また、R1としては、炭素原子数1〜5のアルキル基、アリール基が好ましく、フェニル基がより好ましい。
Among these, R is preferably an alkyl group having 1 to 5 carbon atoms or an aryl group, and more preferably a methyl group or a phenyl group.
R 1 is preferably an alkyl group having 1 to 5 carbon atoms or an aryl group, more preferably a phenyl group.

また、上記一般式(1)および(2)において、Xは、それぞれ独立して一般式(3)で表される基である。 In the general formulas (1) and (2), X is independently a group represented by the general formula (3).

Figure 2020125367
Figure 2020125367

一般式(3)において、R2は、それぞれ独立して、炭素原子数1〜10、好ましくは炭素原子数1〜5の2価の有機基またはシロキサン骨格を含有する2価の有機基を表す。
2の炭素原子数1〜10の2価の有機基としては、直鎖、分岐、環状のいずれでもよく、その具体例としては、メチレン、エチレン、トリメチレン基等のアルキレン基;フェニレン基等のアリーレン基などの2価の炭化水素基などが挙げられる。
また、これらの炭化水素基の水素原子の一部または全部は、フッ素、臭素、塩素等のハロゲン原子、シアノ基等で置換されていてもよく、さらに、これらの炭化水素鎖中にエーテル結合、アミド結合等を含んでいてもよい。
一方、シロキサン骨格を有する2価の有機基の具体例としては、ジメチルポリシロキサン等のジアルキルポリシロキサン単位からなる2価の基、ジフェニルポリシロキサン等のジアリールポリシロキサン単位からなる2価の基、フェニルメチルポリシロキサン等のアリールアルキルポリシロキサン単位からなる2価の基、これらの2価の基と上記アルキレン基等が連結した2価の基などが挙げられる。
In the general formula (3), each R 2 independently represents a divalent organic group having 1 to 10 carbon atoms, preferably 1 to 5 carbon atoms or a divalent organic group containing a siloxane skeleton. ..
The divalent organic group having 1 to 10 carbon atoms of R 2 may be linear, branched or cyclic, and specific examples thereof include alkylene groups such as methylene, ethylene and trimethylene groups; phenylene groups and the like. Examples thereof include divalent hydrocarbon groups such as arylene groups.
Further, some or all of the hydrogen atoms of these hydrocarbon groups may be substituted with a halogen atom such as fluorine, bromine and chlorine, and a cyano group, and further, an ether bond in these hydrocarbon chains, It may contain an amide bond or the like.
On the other hand, specific examples of the divalent organic group having a siloxane skeleton include a divalent group composed of a dialkylpolysiloxane unit such as dimethylpolysiloxane, a divalent group composed of a diarylpolysiloxane unit such as diphenylpolysiloxane, and phenyl. Examples thereof include a divalent group composed of an arylalkylpolysiloxane unit such as methylpolysiloxane, and a divalent group in which these divalent groups and the above alkylene group are linked.

これらの中でも、R2は、炭素原子数1〜5のアルキレン基が好ましく、エチレン基、がより好ましい。 Among these, R 2 is preferably an alkylene group having 1 to 5 carbon atoms, and more preferably an ethylene group.

上記一般式(1)において、nは、1〜5の整数を表すが、1〜3の整数が好ましい。
上記一般式(2)において、mは、0〜3の整数を表すが、2または3が好ましい。
上記一般式(3)において、lは、0または1を表すが、1が好ましい。
In the said General formula (1), n represents the integer of 1-5, but the integer of 1-3 is preferable.
In the general formula (2), m represents an integer of 0 to 3, but 2 or 3 is preferable.
In the general formula (3), l represents 0 or 1, but 1 is preferable.

また、本発明で用いるオルガノポリシロキサンは、屈折率が1.49以上であることが好ましく、1.50以上であることがより好ましく、1.52以上であることがより一層好ましい。
なお、本発明における屈折率は、波長589.3nmで測定した値である。
The organopolysiloxane used in the present invention preferably has a refractive index of 1.49 or more, more preferably 1.50 or more, and even more preferably 1.52 or more.
The refractive index in the present invention is a value measured at a wavelength of 589.3 nm.

上記一般式(1)で表されるオルガノポリシロキサンの具体例としては、下記で例示するものが挙げられるが、これらに限定されるものではない。 Specific examples of the organopolysiloxane represented by the general formula (1) include those exemplified below, but the invention is not limited thereto.

Figure 2020125367
Figure 2020125367

上記一般式(2)で表されるオルガノポリシロキサンの具体例としては、下記で例示するものが挙げられるが、これらに限定されるものではない。 Specific examples of the organopolysiloxane represented by the general formula (2) include those exemplified below, but the invention is not limited thereto.

Figure 2020125367
(式中、Meは、メチル基を意味する。以下同様。)
Figure 2020125367
(In the formula, Me means a methyl group. The same applies hereinafter.)

上述した(A)成分のオルガノポリシロキサンは、例えば、下記化合物(a)と化合物(b)とを、白金等の付加反応触媒存在下で付加反応させ、さらに化合物(c)を付加反応させて得ることができる。 The above-mentioned organopolysiloxane of the component (A) is obtained by, for example, subjecting the following compound (a) and compound (b) to an addition reaction in the presence of an addition reaction catalyst such as platinum, and further subjecting the compound (c) to an addition reaction. Obtainable.

Figure 2020125367
Figure 2020125367

また、本発明の組成物は、(B)成分として重合開始剤を含む。
重合開始剤としては、環状体が開環する際に使用される公知のものをいずれも使用することができ、その具体例としては、水酸化カリウム、水酸化ナトリウム、水酸化リチウム、水酸化セシウム、テトラ−n−ブチルホスホニウムハイドロキシド等の水酸化化合物;硫酸、メタンスルホン酸、トリフルオロメタンスルホン酸等の硫黄酸化物;水酸化テトラメチルアンモニウム等のアンモニウム塩;オクチル酸鉄、オクチル酸亜鉛、オクチル酸錫等のカルボン酸金属塩;テトラブトキシチタン、ビス−2,4−ペンタンジオナートチタニウムジイソプロポキシド等のチタン化合物;ジブチル錫ジラウレート、ジブチル錫ジオクテート等の有機錫化合物などが挙げられる。
Further, the composition of the present invention contains a polymerization initiator as the component (B).
As the polymerization initiator, any of the known ones used when the ring is opened can be used, and specific examples thereof include potassium hydroxide, sodium hydroxide, lithium hydroxide and cesium hydroxide. Hydroxide compounds such as tetra-n-butylphosphonium hydroxide; Sulfur oxides such as sulfuric acid, methanesulfonic acid and trifluoromethanesulfonic acid; Ammonium salts such as tetramethylammonium hydroxide; Iron octylate, zinc octylate, octyl Carboxylic acid metal salts such as tin acid; titanium compounds such as tetrabutoxytitanium and bis-2,4-pentanedionate titanium diisopropoxide; organic tin compounds such as dibutyltin dilaurate and dibutyltin dioctate.

重合開始剤の配合量は、通常、(A)成分100質量部に対して0.0001〜10質量部であるが、好ましくは0.001〜1質量部である。 The amount of the polymerization initiator compounded is usually 0.0001 to 10 parts by mass, preferably 0.001 to 1 part by mass, relative to 100 parts by mass of the component (A).

本発明の組成物には、必要に応じて、本発明の目的、効果を害さない範囲で、接着付与剤や無機充填剤等のその他の成分を配合することができる。
接着付与剤は、特定の用途において所望されるような接着性を付与させる成分であり、その具体例としては、(メタ)アクリロキシプロピルトリメトキシシラン、トリアルキル−またはトリアリル−イソシアヌレート、グリシドキシプロピルトリメトキシシラン、ビニルトリメトキシシラン等が挙げられる。
接着付与剤の添加量は、特に限定されるものではないが、0.1〜約5質量%程度とすることが好ましい。
If necessary, the composition of the present invention may contain other components such as an adhesion promoter and an inorganic filler within a range that does not impair the objects and effects of the present invention.
The adhesion-imparting agent is a component that imparts the adhesiveness desired in a specific application, and specific examples thereof include (meth)acryloxypropyltrimethoxysilane, trialkyl- or triallyl-isocyanurate, and glycid. Examples include xypropyltrimethoxysilane and vinyltrimethoxysilane.
The amount of the adhesion-imparting agent added is not particularly limited, but is preferably about 0.1 to about 5% by mass.

無機充填剤の具体例としては、ヒュームドシリカ、結晶性シリカ、溶融シリカ等の補強用シリカ類;酸化アルミ、酸化チタン、酸化亜鉛等の金属酸化物;炭酸カルシウム、炭酸亜鉛等の炭酸塩などが挙げられる。なお、補強用シリカ類は、未処理のまま(親水性)でも、処理して疎水性にしたものでもよい。
無機充填剤の添加量は、本発明の組成物が目的とする透明性および強度を失わない量であれば特に制限はない。
Specific examples of the inorganic filler include reinforcing silicas such as fumed silica, crystalline silica and fused silica; metal oxides such as aluminum oxide, titanium oxide and zinc oxide; carbonates such as calcium carbonate and zinc carbonate. Is mentioned. The reinforcing silicas may be untreated (hydrophilic) or treated to be hydrophobic.
The amount of the inorganic filler added is not particularly limited as long as the composition of the present invention does not lose the intended transparency and strength.

本発明の硬化型シリコーン組成物は、上述した(A)成分および(B)成分、並びに必要に応じて用いられるその他の成分を任意の順序で、または一括して混合することで調製することができる。
また、本発明の硬化型シリコーン組成物は、公知の硬化条件下で公知の硬化方法により硬化させることができる。
具体的には、通常、80〜200℃、好ましくは100〜160℃の加熱温度、かつ、0.5分〜5時間程度、好ましくは1分〜3時間程度の加熱時間で硬化させることができる。なお、LED封止用等の精度が要求される用途においては、硬化時間を長めにすることが好ましい。
The curable silicone composition of the present invention can be prepared by mixing the above-mentioned components (A) and (B), and other components used as necessary, in any order or in a lump. it can.
Moreover, the curable silicone composition of the present invention can be cured by a known curing method under known curing conditions.
Specifically, it can be cured usually at a heating temperature of 80 to 200° C., preferably 100 to 160° C., and a heating time of about 0.5 minutes to 5 hours, preferably about 1 minute to 3 hours. .. It should be noted that the curing time is preferably set longer in applications where precision such as LED sealing is required.

得られる硬化物の形態は特に制限されず、例えば、ゲル硬化物、エラストマー硬化物および樹脂硬化物のいずれであってもよい。
本発明の硬化型シリコーン組成物から得られる硬化物の物理特性は、一般式(1)の反応性シリコーンの分子量、使用する硬化方法に依存する。一般的に、反応性シリコーンの分子量が大きいほど、より軟質の硬化反応生成物を与える。
The form of the obtained cured product is not particularly limited, and may be, for example, a gel cured product, an elastomer cured product, or a resin cured product.
The physical properties of the cured product obtained from the curable silicone composition of the present invention depend on the molecular weight of the reactive silicone of the general formula (1) and the curing method used. In general, the higher molecular weight of the reactive silicone gives a softer cured reaction product.

以下、合成例、実施例および比較例を挙げて、本発明をより具体的に説明するが、本発明は下記の実施例に制限されるものではない。 Hereinafter, the present invention will be described more specifically with reference to Synthesis Examples, Examples, and Comparative Examples, but the present invention is not limited to the following Examples.

[合成例1]オルガノポリシロキサン[1]の合成

Figure 2020125367
[Synthesis Example 1] Synthesis of organopolysiloxane [1]
Figure 2020125367

撹拌機、還流装置および温度計を兼ね備えた500mlの4つ口フラスコに、メタ−ジメチルシリルベンゼン48.6g(0.25mol)を入れ、85℃まで昇温した。昇温後、塩化白金酸の2−エチルヘキサノール溶液(白金濃度:0.5%)0.07gを投入し、その中に、下記式で表されるビニル基含有ジフェニルポリシロキサン100g(0.23mol)を滴下した。滴下後、85〜95℃で3時間熟成した。熟成終了後、ペンタメチルビニルトリシクロシロキサン85g(0.36mol)を滴下した。滴下終了後、85〜95℃で3時間熟成した。熟成終了後、150℃/5mmHgで3時間濃縮して目的のオルガノポリシロキサン[1]209gを得た(粘度:37Pa・s、不揮発分:99.7%)。 To a 500 ml four-necked flask equipped with a stirrer, a reflux device and a thermometer, 48.6 g (0.25 mol) of meta-dimethylsilylbenzene was placed and heated to 85°C. After the temperature was raised, 0.07 g of a 2-ethylhexanol solution of chloroplatinic acid (platinum concentration: 0.5%) was added, and 100 g (0.23 mol of a vinyl group-containing diphenylpolysiloxane represented by the following formula was added thereto. ) Was added dropwise. After the dropping, the mixture was aged at 85 to 95°C for 3 hours. After the aging was completed, 85 g (0.36 mol) of pentamethylvinyltricyclosiloxane was added dropwise. After completion of dropping, the mixture was aged at 85 to 95°C for 3 hours. After completion of the aging, the product was concentrated at 150° C./5 mmHg for 3 hours to obtain 209 g of the target organopolysiloxane [1] (viscosity: 37 Pa·s, nonvolatile content: 99.7%).

Figure 2020125367
Figure 2020125367

[合成例2]オルガノポリシロキサン[2]の合成

Figure 2020125367
[Synthesis Example 2] Synthesis of organopolysiloxane [2]
Figure 2020125367

撹拌機、還流装置および温度計を兼ね備えた500mlの4つ口フラスコに、メタ−ジメチルシリルベンゼン77.8g(0.4mol)を入れ、85℃まで昇温した。昇温後、塩化白金酸の2−エチルヘキサノール溶液(白金濃度:0.5%)0.07gを投入し、その中に、ビス(ジメチルビニルシロキシ)ジフェニルシラン80g(0.4mol)を滴下した。滴下終了後、85〜95℃で3時間熟成する。熟成終了後、ペンタメチルビニルトリシクロシロキサン140g(0.6mol)を滴下した。滴下終了後、85〜95℃で3時間熟成した。熟成終了後、150℃/5mmHgで3時間濃縮して目的のオルガノポリシロキサン[2]199gを得た(粘度:1600mPa・s、不揮発分:99.6%)。 77.8 g (0.4 mol) of meta-dimethylsilylbenzene was placed in a 500 ml four-necked flask equipped with a stirrer, a reflux device and a thermometer, and the temperature was raised to 85°C. After the temperature was raised, 0.07 g of a 2-ethylhexanol solution of chloroplatinic acid (platinum concentration: 0.5%) was added, and 80 g (0.4 mol) of bis(dimethylvinylsiloxy)diphenylsilane was added dropwise thereto. .. After completion of dropping, aging is performed at 85 to 95° C. for 3 hours. After the aging was completed, 140 g (0.6 mol) of pentamethylvinyltricyclosiloxane was added dropwise. After completion of dropping, the mixture was aged at 85 to 95°C for 3 hours. After completion of the aging, the product was concentrated at 150° C./5 mmHg for 3 hours to obtain 199 g of the target organopolysiloxane [2] (viscosity: 1600 mPa·s, nonvolatile content: 99.6%).

[実施例1,2および比較例1〜3]
下記(A)〜(D)成分を、表1に示す割合で配合し、各実施例および比較例のシリコーン組成物を調製した。
得られた各組成物を、150℃で3時間加熱して硬化させ、厚み2mmの硬化物を得た。得られた硬化物について、硬さ、切断時伸び、引張強さ、および光透過率を下記方法で評価した。
また、これとは別に、得られた各組成物を上記と同様の条件で硬化させ、1mmの硬化物を作製した。得られた硬化物について、下記手法により、水蒸気透過度を測定した。これらの結果を併せて表1に示す。
[Examples 1 and 2 and Comparative Examples 1 to 3]
The following components (A) to (D) were blended in the proportions shown in Table 1 to prepare the silicone compositions of Examples and Comparative Examples.
Each of the obtained compositions was cured by heating at 150° C. for 3 hours to obtain a cured product having a thickness of 2 mm. The hardness, elongation at break, tensile strength, and light transmittance of the obtained cured product were evaluated by the following methods.
Separately from this, each of the obtained compositions was cured under the same conditions as above to prepare a cured product of 1 mm. The water vapor permeability of the obtained cured product was measured by the following method. The results are shown together in Table 1.

(1)硬さ
JIS6249の規定に順じて、(株)島津製作所製デュロメータタイプAにより測定した。
(2)切断時伸びおよび引張強さ
JIK6253の規定に準じて、モンサント社製テンソーメーター(モデルT−10)により測定した。
(3)光透過率
作製した硬化物の光透過率を分光光度計((株)日立製作所製U−3310)を用いて400nmの波長で測定し、初期値とした。次に耐熱試験としてその試料を180℃の乾燥機内に暴露した状態で500時間処理後の光透過率を測定した。
(4)水蒸気透過度
LYSSY社製L80−5000型水蒸気透過度測定装置にて測定した。
(5)屈折率
(株)アタゴ社製デジタル屈折率計RX−9000αにて589.3nmの波長で測定した。
(1) Hardness According to JIS 6249, the hardness was measured with a durometer type A manufactured by Shimadzu Corporation.
(2) Elongation at Break and Tensile Strength It was measured with a Tensor meter (Model T-10) manufactured by Monsanto in accordance with the regulations of JIK6253.
(3) Light transmittance The light transmittance of the prepared cured product was measured at a wavelength of 400 nm using a spectrophotometer (U-3310 manufactured by Hitachi, Ltd.), and set as an initial value. Next, as a heat resistance test, the sample was exposed to a dryer at 180° C., and the light transmittance after 500 hours of treatment was measured.
(4) Water vapor permeability It was measured with a L80-5000 type water vapor permeability measuring device manufactured by LYSSY.
(5) Refractive index The refractive index was measured with a digital refractometer RX-9000α manufactured by Atago Co., Ltd. at a wavelength of 589.3 nm.

(A)成分
(A−1)合成例1で得られたオルガノポリシロキサン[1](屈折率:1.5301)
(A−2)合成例2で得られたオルガノポリシロキサン[2](屈折率:1.4952)
(A) Component (A-1) Organopolysiloxane [1] obtained in Synthesis Example 1 (refractive index: 1.5301)
(A-2) Organopolysiloxane [2] obtained in Synthesis Example 2 (refractive index: 1.4952)

(A−3)

Figure 2020125367
(A-3)
Figure 2020125367

(A−4)

Figure 2020125367
(A-4)
Figure 2020125367

(A−5)

Figure 2020125367
(A-5)
Figure 2020125367

(B)成分
(B−1)テトラメチルアンモニウムハイドロキシド 10質量%水溶液
(B−2)白金の1,3−ジビニル−1,1,3,3−テトラメチルジシロキサン錯体の白金濃度0.5質量%のトルエン溶液
(B) Component (B-1) Tetramethylammonium hydroxide 10% by mass aqueous solution (B-2) Platinum concentration of platinum 1,3-divinyl-1,1,3,3-tetramethyldisiloxane complex 0.5 Mass% toluene solution

(C)成分
エチニルシクロヘキサノール
(C) component ethynylcyclohexanol

(D)成分
下記構造のSiH含有ポリオルガノシロキサン

Figure 2020125367
Component (D) SiH-containing polyorganosiloxane having the following structure
Figure 2020125367

Figure 2020125367
Figure 2020125367

表1に示されるように、シルフェニレン基を主鎖に持つ環状構造を有するオルガノポリシロキサンと重合触媒を含む実施例1,2のシリコーン組成物は、引張強さが大きく、水蒸気遮断性に優れ、さらに耐熱後の光透過率にも優れた硬化物を与えることがわかる。 As shown in Table 1, the silicone compositions of Examples 1 and 2 containing the organopolysiloxane having a cyclic structure having a silphenylene group in the main chain and the polymerization catalyst have high tensile strength and excellent water vapor barrier properties. Further, it can be seen that a cured product having excellent light transmittance after heat resistance is provided.

Claims (3)

(A)下記一般式(1)および(2)
Figure 2020125367
〔式中、Rは、それぞれ独立して非置換または置換の1価炭化水素基を表し、nは、1〜5の整数を表し、
1は、それぞれ独立して非置換または置換の1価炭化水素基を表し、mは、0〜3の整数を表し、
Xは、それぞれ独立して、下記一般式(3)
Figure 2020125367
(式中、R2は、それぞれ独立して、炭素原子数1〜10の2価の有機基またはシロキサン骨格を含有する2価の有機基を表し、lは、1または2を表す。)
で表される基を表す。〕
で表されるポリオルガノシロキサンから選ばれる少なくとも一方 100質量部、および
(B)重合開始剤 0.0001〜10質量部
を含有することを特徴とする硬化型シリコーン組成物。
(A) The following general formulas (1) and (2)
Figure 2020125367
[In formula, R represents an unsubstituted or substituted monovalent hydrocarbon group each independently, n represents the integer of 1-5,
R 1 independently represents an unsubstituted or substituted monovalent hydrocarbon group, m represents an integer of 0 to 3,
X is independently the following general formula (3)
Figure 2020125367
(In the formula, each R 2 independently represents a divalent organic group having 1 to 10 carbon atoms or a divalent organic group containing a siloxane skeleton, and 1 represents 1 or 2.)
Represents a group represented by. ]
A curable silicone composition comprising 100 parts by mass of at least one selected from the polyorganosiloxanes represented by and (B) a polymerization initiator of 0.0001 to 10 parts by mass.
前記(A)成分のオルガノポリシロキサンの屈折率が、1.49以上である請求項1記載の硬化型シリコーン組成物。 The curable silicone composition according to claim 1, wherein the organopolysiloxane as the component (A) has a refractive index of 1.49 or more. 請求項1または2記載の硬化型シリコーン組成物の硬化物で封止された光学素子。 An optical element encapsulated with the cured product of the curable silicone composition according to claim 1.
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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH083450A (en) * 1994-06-15 1996-01-09 Shin Etsu Chem Co Ltd Curable silicone composition
JPH11130865A (en) * 1997-08-29 1999-05-18 Dow Corning Toray Silicone Co Ltd Silphenylene compound containing hydroxyphenyl group, silphenylene-modified organic resin

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH083450A (en) * 1994-06-15 1996-01-09 Shin Etsu Chem Co Ltd Curable silicone composition
US5700899A (en) * 1994-06-15 1997-12-23 Shin-Etsu Chemical Co., Ltd. Curable silicone compositions
JPH11130865A (en) * 1997-08-29 1999-05-18 Dow Corning Toray Silicone Co Ltd Silphenylene compound containing hydroxyphenyl group, silphenylene-modified organic resin

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