JP2020123745A - Component supply method and component supply system - Google Patents

Abstract

To provide a component supply method that reduces a data processing time on processing of an identification code than before and has excellent robustness.SOLUTION: A component supply method for selectively acquiring one of a component type and a wafer map of a component to be supplied using a component holding tool includes: a first step of storing in a database at least one of mapping between a component type identification code and the component type and mapping between a map acquisition code and the wafer map; a second step of receiving an attribute for selecting the component type identification code for the purpose of acquiring the component type and receiving an attribute for selecting the map acquisition code for the purpose of acquiring the wafer map; a third step of selecting a code agreeing with the purpose by filtering a plurality of codes read from the component holding tool using the received attributes; and a fourth step of collating the selected code with the database to recognize the component type or the wafer map.SELECTED DRAWING: Figure 5

Description

The present specification relates to a component supply method and a component supply system for supplying a component using a component holder to which a plurality of types of identification codes having different purposes of use are attached.

Equipment for producing boards on which a large number of components are mounted include a solder printer, a component mounter, a reflow machine, and a board inspection machine. It has become common to connect these board production facilities to form a board production line. Among them, the component mounter includes a board transfer device, a component supply device, a component transfer device, and a control device. There are various types of component supply devices, such as a system that uses a wafer pallet holding wafer components, a system that uses a tray pallet that mounts relatively large electronic components, and a feeder system that feeds a carrier tape. Component holders such as wafer pallets, tray pallets, and feeder devices are provided with identification codes for identifying the types of components to be supplied and identification codes for identifying individual component holders. Patent Document 1 discloses a technique for reading this type of identification code.

A method of collecting data related to electric components of Patent Document 1 is a step of arranging an identification tag (identification code) in a common direction of a large number of electric component trays and a tray stack in which a plurality of electric component trays are stacked. Forming and placing at the distal end, and collecting identification tags associated with the parts to be picked from the electrical component tray at the distal end. Further, the embodiment discloses a tag reader that is mounted on the front side of the column tower (housing magazine) and reads the identification tag of the tray stack that is pulled out. According to this, the possibility of a component mounting error can be reduced by continuously checking the arrangement of the electric component trays and warning the operator before the wrong components are arranged.

JP, 2006-111445, A

By the way, some identification codes have a purpose of use other than specifying the component type, and there are cases where a plurality of types of identification codes are attached to the component holder. For example, a plurality of types of identification codes attached to the wafer pallet include a manufacturer management code, a component type identification code, and a map acquisition code. The maker management code is an identification code attached by the maker of the wafer component and does not need to be read by the user. On the other hand, the component type identification code and the map acquisition code are identification codes attached by the user to improve the efficiency of use of the wafer pallet. The component type identification code is used for identifying the component type, and the map acquisition code is used for acquiring the wafer map.

On the other hand, in the technique of reading the identification code illustrated in Patent Document 1, the component type cannot be identified simply by reading the identification code and obtaining the code information, and generally, the code information is collated with the component type database. Data processing is required to confirm the component type. Here, when a plurality of types of identification codes are attached to the component holder, the code information is read and collated with the database even for unrelated identification codes having different purposes of use. For this reason, the amount of data processing increases, and the data processing time is prolonged.

Further, if the positions of the plurality of types of identification codes are erroneously attached in reverse, the positions of attachment are varied, or if the plurality of types of identification codes accidentally resemble each other, the robustness deteriorates. That is, there is a possibility that the identification codes may be confused and an incorrect data processing result may be obtained, or the purpose of use of each identification code may become unknown and data processing may not be performed.

Therefore, it is an object of the present specification to provide a component supply method and a component supply system that are excellent in robustness while reducing the data processing time related to the processing of the identification code as compared with the conventional case.

The present specification holds a plurality of components, and includes at least one of a component type identification code that identifies the component type of the retained component and a map acquisition code that identifies the wafer map of the retained component. Is a component supply method for selectively acquiring one of the component type and the wafer map of the component to be supplied using the component holder provided with the code of the component type identification code and the component type. A first step of storing at least one of the correspondence and the correspondence between the map acquisition code and the wafer map in a database; and for the purpose of acquiring the part type of the held part, the part type identification code is used. A second step of receiving the notification of the attribute for selecting the map acquisition code for the purpose of acquiring the wafer map of the held component while receiving the notification of the attribute for selecting, and using the received attribute Then, by filtering a plurality of the codes read by the one code reading unit from the component holder, the third step of selecting the code that matches the purpose and the selected code are collated with the database. And a fourth step of recognizing the component type or the wafer map, a component supply method is disclosed.
Further, the present specification holds a component holding sheet to which a plurality of wafer components are adhered, and identifies a component type identification code that identifies the component type of the retained component and a wafer map of the retained component. A plurality of cords including at least one of the map acquisition cords are separately attached to a plurality of attachment areas on the upper surface, and a plurality of the wafer component holders are accommodated so that they can be selectively withdrawn from an outlet. And a carrying section for pulling out one of the wafer component holders in the containing magazine section and carrying it to a component supply position, and positioning the carried wafer component holder at the component supply position. A feed unit that pushes up the component holding sheet to feed the wafer component, and a top face of the wafer component holder that is arranged downward at a position above the outlet of the storage magazine unit and that is pulled out by the transport unit. A code reading unit capable of reading the plurality of codes of the plurality of attachment areas arranged in the direction, and a specific attachment area corresponding to the difference in the purpose of acquiring the component type or the wafer map. A component supply system including a code selection and use unit that receives a notification and controls the code reading unit to read only the code attached to the specific attachment area is disclosed.
Furthermore, the present specification holds a component holding sheet to which a plurality of wafer components are attached, and a wafer component holder provided with a plurality of types of identification codes for different purposes of use, and a plurality of the wafer component holders. A storage magazine part for selectively pulling out the wafer from the outlet, a transport part for pulling out any of the wafer component holders in the storage magazine part and transporting it to a component supply position; A component supply method for supplying the wafer component by using a component supply device having a code reading unit attached to the wafer component holder that is pulled out and capable of reading the identification code when the wafer component holder is pulled out. Then, the plurality of identification codes are separately attached to a plurality of attachment areas lined up in the transport direction on the upper surface of the wafer component holder, and the code reading unit is provided with the specific attachment corresponding to the purpose of use. Disclosed is a component supply method for reading only the identification code attached to an area.

In the disclosed component supply method, it is possible to select and use a code that matches the purpose based on the attributes assigned to the plurality of codes attached to the component holder. Therefore, data processing for collating another code that does not match the purpose with the database becomes unnecessary, and the data processing time can be reduced as compared with the conventional case. Also, even if the positions of multiple codes are incorrect, the attachment positions vary, or even if multiple codes accidentally resemble each other, the code that matches the purpose can be reliably selected due to the difference in attributes. Therefore, it has excellent robustness.
Further, in the disclosed component supply system and the second component supply method, the attributes given to the plurality of codes are the attachment area of the wafer component holder, and are attached to the specific attachment area corresponding to the purpose. You only need to read the code that you have. According to this, since it is not necessary to select and read the code and read all of the plurality of codes, the effect of reducing the data processing time becomes more remarkable.

It is a side view which shows typically the whole structure of the component mounting machine with which the component supply system of 1st Embodiment was incorporated. It is a block diagram showing a control configuration of a component mounter. It is the perspective view which showed the principal part of the wafer component supply apparatus. It is a top view which illustrates the structure of a wafer pallet. It is a figure showing operation of a parts supply system of a 1st embodiment. It is the figure which showed the operation|movement of the component supply system of a prior art. It is a top view of a wafer pallet explaining an attachment area. It is a figure showing operation of a parts supply system of a 2nd embodiment.

(1. Configuration of component mounter 1 and component supply system of the first embodiment)
The component supply system according to the first embodiment of the present invention will be described with reference to FIGS. The component supply system according to the first embodiment is built in the component mounter 1. First, the overall configuration of the component mounter 1 will be described. FIG. 1 is a side view schematically showing the overall configuration of a component mounter 1 incorporating the component supply system of the first embodiment. FIG. 2 is a block diagram showing a control configuration of the component mounter 1. The component mounter 1 is configured by assembling a substrate transfer device 2, a wafer component supply device 3, a component transfer device 5, a component camera 6, a control device 7 and the like on a machine base 9. The right side of FIG. 1 is the front side of the component mounter 1, and the left side is the rear side of the component mounter 1.

The substrate transfer device 2 is arranged on the upper surface of the machine base 9. The board transfer device 2 includes a pair of guide rails 21, a pair of conveyor belts 22, a backup device 23, a transfer control unit 29, and the like. The pair of endless annular conveyor belts 22 rolls along the guide rails 21 in a state where the substrate K is placed on the conveyor conveyance surface, and carries the substrate K into and out of the mounting execution position. The backup device 23 disposed below the mounting execution position positions the substrate K at the mounting execution position by pushing up the backup pin 24. The transport control unit 29 controls the operations of the conveyor belt 22 and the backup device 23.

The wafer component supply device 3 supplies the wafer components to the component transfer device 5 using the wafer pallet 31. FIG. 3 is a perspective view showing a main part of the wafer component supply device 3. The wafer component supply device 3 is transported by using a carriage (not shown), and is detachably mounted on the front side of the upper surface of the machine base 9. The wafer component supply device 3 includes a plurality of wafer pallets 31, a housing magazine unit 32, a transfer unit 33, a supply unit 34, a code reading unit 35, a supply control unit 39, and the like.

The storage magazine portion 32 is formed in a substantially vertically long box shape, and a plurality of storage shelves are provided inside the storage magazine portion 32 so as to be vertically movable. A wafer pallet 31 is stored in each storage rack. A drawer port 321 is provided at a substantially intermediate height on the rear side of the storage magazine portion 32. The wafer pallet 31 is pulled out to the rear side from the pull-out port 321 after the height of the storage rack is adjusted.

The transport unit 33 includes a transport table 331 and a transport mechanism 332. The transport table 331 extends rearward from the vicinity of the outlet 321 of the storage magazine unit 32. The transport mechanism 332 is arranged on the upper surface of the transport table 331 and moves in the front-rear direction. The transfer mechanism 332 holds the wafer pallet 31 adjusted to the height of the outlet 321 of the storage magazine 32 with the holding portion 333. Next, the transfer mechanism 332 transfers the held wafer pallet 31 to the component supply position shown by the broken line in FIG. Further, the transfer mechanism 332 returns the used wafer pallet 31 to the storage magazine section 32.

The supply unit 34 is arranged below the component supply position. The supply unit 34 positions the conveyed wafer pallet 31 at a component supply position and pushes up a component holding sheet 313 (also referred to as a dicing sheet) to supply a wafer component. The supply unit 34 may have a known configuration including a push-up pot and a push-up pin, but is not limited to this.

FIG. 4 is a plan view illustrating the structure of the wafer pallet 31. The wafer pallet 31 is configured such that the outer circumference of the component holding sheet 313 (in FIG. 4, hatched for convenience) is held between the lower ring 311 and the upper ring 312. As illustrated, the outer diameter of the lower ring 311 is larger than the outer diameter of the upper ring 312. Grasped portions 313 and 314 to be grasped by the grasping portion 333 are formed at two locations on the outer periphery of the lower ring 311. The wafer pallet 31 is transported in the vertical direction of FIG. On the upper surface of the component holding sheet 313, a plurality of wafer components produced by dicing a semiconductor wafer are attached. The wafer pallet 31 is an embodiment of the component holder and the wafer component holder of the present invention.

A maker management bar code 41, which is a first identification code, is attached between two gripped portions 313 and 314 on the upper surface of the lower ring 311. The manufacturer management bar code 41 is an identification code provided by the manufacturer of the wafer component and does not need to be read by the user. Further, a bar code 42 for identifying a component type, which is a second identification code, is attached to a position near the manufacturer management barcode 41 on the upper surface of the upper ring 312. The code information represented by the component type identification barcode 42 represents the component type of the wafer component attached to the component holding sheet 313.

Further, a map acquisition barcode 43, which is a third identification code, is attached to the upper surface of the upper ring 312 at a position opposite to the component type identification barcode 42. The code information indicated by the map acquisition barcode 43 identifies the wafer map of the wafer component attached to the component holding sheet 313. The wafer map shows a reference component among the plurality of wafer components two-dimensionally arranged on the component holding sheet 313, and also shows the arrangement position of the unusable wafer component. The component type identification barcode 42 and the map acquisition barcode 43 are attached by the user of the wafer component supply apparatus 3. An example of the attachment method is a method of attaching a label on which the barcodes 42 and 43 are printed, and the attachment method is not limited to this. The three types of barcodes 41 to 43 are arranged on the center line CL of the wafer pallet 31 along the carrying direction for convenience of reading.

An example of code information of each barcode 41 to 43 is shown below. That is, the code information of the manufacturer management barcode 41 is made up of 10 characters, for example, "WOF21_9433". The code information of the component type identification barcode 42 consists of 13 characters and is, for example, "WID_YUF198312". The first four characters “WID_” of the code information of the component type identification barcode 42 is a specific keyword indicating that the purpose of use of the code information is to identify the component type. The code information of the map acquisition barcode 43 consists of 14 characters, and is, for example, "1420LFJIWID_Ff". The four characters “LFJI” in the middle of the code information of the map acquisition barcode 43 are specific keywords indicating that the purpose of use of the code information is to acquire a wafer map. The above-mentioned keyword is an example of an attribute given to each of a plurality of types of identification codes.

As shown in FIGS. 1 and 3, the code reading unit 35 is arranged downward at a position above the outlet 321 of the storage magazine unit 32. As the code reading unit 35, a separation detection type bar code reader can be used. The code reading unit 35 reads the three types of barcodes 41 to 43 attached to the upper surface of the wafer pallet 31 to be pulled out, and acquires the code information that the barcodes 41 to 43 mean. The code information of each barcode 41 to 43 is notified to the control device 7 via the supply control unit 39.

The readable range R of the code reading unit 35 shown in FIG. 4 is set wide on both sides of the center line CL of the wafer pallet 31. Therefore, even if the barcodes 41 to 43 are provided offset from the center line CL, they can be read by the code reading unit 35. Further, even if the barcodes 41 to 43 are attached to be inclined with respect to the center line CL, the reading by the code reading unit 35 is possible.

The supply control unit 39 shown in FIG. 2 controls the operations of the storage magazine unit 32, the transport unit 33, the supply unit 34, and the code reading unit 35.

The component transfer device 5 is arranged from above the substrate transfer device 2 to above the wafer component supply device 3. The component transfer device 5 includes a mounting nozzle 51, a mounting head 52, a head drive mechanism 54, a transfer control unit 59, and the like. The mounting nozzle 51 moves up and down to collect a wafer component from the wafer component supply device 3 and mount it on the substrate K. The mounting head 52 holds the mounting nozzle 51 so that it can be raised and lowered, and is driven in two horizontal directions by a head drive mechanism 54. The transfer control unit 59 controls the operations of the mounting nozzle 51 and the head drive mechanism 54.

The component camera 6 is provided upward between the substrate transfer device 2 on the upper surface of the machine base 9 and the wafer component supply device 3. The component camera 6 images and detects the state of the wafer component collected at the lower end of the mounting nozzle 51 while the mounting head 52 moves from the wafer component supply device 3 to the substrate K. When the component camera 6 detects an error in the suction position of the wafer component, a shift in the rotation angle, etc., the control device 7 finely adjusts the component mounting operation as necessary. The operation of the component camera 6 is controlled by the camera control unit 69.

The control device 7 is a computer device having a CPU and operating by software. As shown in FIG. 2, the control device 7 is communicatively connected to the transport control unit 29, the supply control unit 39, the transfer control unit 59, and the camera control unit 69. The control device 7 issues a command while appropriately exchanging information with these control units 29, 39, 59, 69 to control the overall operation of the component mounter 1.

Further, the control device 7 is communicatively connected to a host computer 8 arranged apart from the component mounter 1. The host computer 8 is a higher-level control device that controls not only the component mounter 1 but also the board production equipment on the upstream side and the downstream side of the component mounter 1. The host computer 8 has a component type database 82 and a map database 83 in the storage device 81. The component type database 82 stores the code information of the component type identification barcode 42 and the component type of the wafer component in association with each other. The map database 83 stores the code information of the map acquisition bar code 43 and the wafer map unique to each wafer pallet 31 in association with each other.

The supply control unit 39 of the wafer component supply device 3 has a function corresponding to the code selection/use unit 36 of the present invention. Furthermore, the code selection/use unit 36 includes a function corresponding to the keyword selection unit 37 of the present invention. The code selection use unit 36 and the keyword selection unit 37 are realized by software. The code selection use unit 36 and the keyword selection unit 37 exchange information with the control device 7 as necessary. Detailed functions and operations of the code selection/use unit 36 and the keyword selection unit 37 will be described later.

The component supply system according to the first embodiment includes the wafer component supply device 3 as hardware, and the code selection/use unit 36 and the keyword selection unit 37 of the supply control unit 39 as software.

(2. Operation of the component supply system according to the first embodiment)
Next, the operation of the component supply system of the first embodiment will be described in comparison with the conventional technique. FIG. 5 is a diagram showing the operation of the component supply system of the first embodiment. Further, FIG. 6 is a diagram showing the operation of the conventional component supply system. On the left side of FIG. 5, the operation of the supply control unit 39 is shown in time series from top to bottom. Similarly, the operation of the control device 7 is shown in the center of FIG. 5, and the operation of the host computer 8 is shown on the right side of FIG. In addition, the horizontal arrows represent information notifications and commands between the supply control unit 39 and the control device 7, and between the control device 7 and the host computer 8.

In step S1 of FIG. 5, the host computer 8 notifies the control device 7 of a specific keyword corresponding to a desired purpose of use. In the example of FIG. 5, the desired purpose of use is to identify the component type of the wafer component, and “WID_*” is notified as the keyword. The "*" added to the initial keyword indicates a wild card, which means that any character string may be concatenated after "WID_". In the next step S2, the control device 7 transfers the notified keyword to the supply control unit 39. In the next step S3, the code selection/use unit 36 of the supply control unit 39 stores the notified keyword.

In the next step S4, control device 7 issues a command to carry wafer pallet 31 to the component supply position and a command to read bar codes 41 to 43 to supply control unit 39. In the next step S5, the supply controller 39 controls the carrier 33 to pull out the wafer pallet 31. At the same time, the code selection/use unit 36 controls the code reading unit 35 to read the bar codes 41 to 43 from the wafer pallet 31. The read code information is three pieces of "WOF21_9433", "WID_YUF198312", and "1420LFJIWID_Ff".

In the next step S6, the keyword selecting section 37 in the code selecting and using section 36 filters the three pieces of code information using the keyword "WID_*". As a result of the filtering, only one piece of code information “WID_YUF198312” corresponding to the keyword “WID_*” is selected. The code information “1420LFJIWID_Ff” includes “WID_”, but is not selected because it is included in the middle instead of at the beginning. In the next step S7, the code selection/use unit 36 notifies the control device 7 only of the selected code information "WID_YUF198312".

In the next step S8, the control device 7 transfers the notified code information "WID_YUF198312" to the host computer 8. In the next step S9, the host computer 8 collates the transferred code information "WID_YUF198312" with the component type database 82 to identify the component type of the wafer component. In the next step S10, the host computer 8 notifies the control device 7 of the information on the component type acquired by the collation. As a result, the control device 7 can recognize the component type of the wafer component supplied from the wafer component supply device 3.

When the desired purpose of use is acquisition of a wafer map, the operation of the component supply system of the first embodiment changes as follows. That is, in step S1 and step S2, "*LFJI*" is notified and transferred as a keyword. The two "*" added to the initial keyword "LFJI" indicate a wild card, which means that an arbitrary character string may be connected before and after "LFJI". In step S6, the keyword selection unit 37 filters the three pieces of code information using the keyword “*LFJI*”. In step S7, the control device 7 is notified of only one piece of code information "1420LFJIWID_Ff" corresponding to the keyword "*LFJI*".

In step S9, the host computer 8 searches the map database 83 using the transferred one piece of code information "1420LFJIWID_Ff" and acquires the wafer map. In step S10, the host computer 8 notifies the controller 7 of the wafer map information acquired by the search. Accordingly, the control device 7 can recognize the wafer map regarding the wafer component on the component holding sheet 313.

In the modification of the first embodiment, the code length may be used instead of the keyword as the attribute assigned to each of the plurality of types of identification codes. The code length means the number of characters of code information. The code selection/use unit 36 includes a code length selection unit 38 instead of the keyword selection unit 37. The code length selection unit 38 filters a plurality of types of code information using a specific code length corresponding to a desired purpose of use, and selects code information having a specific code length.

In the case of the modification, in step S1, the host computer 8 notifies the information of “13 characters” or “14 characters” instead of the keyword “WID_*” or “*LFJI*”. Then, in step S2, the information “13 characters” or “14 characters” is transferred to the code length selection unit 38. As a result, the code length selection unit 38 can select the same piece of code information as the keyword selection unit 37 based on the difference in the number of characters.

On the other hand, in the prior art, the code selection/use unit 36 is not provided, and filtering based on keywords or code lengths is not performed. In step S31 of FIG. 6 showing the conventional technique, the control device 7 issues a command for loading the wafer pallet 31 to the component supply position and a command for reading each bar code 41 to 43 to the supply control unit 39. In the next step S32, the supply control unit 39 controls the carrying unit 33 and the code reading unit 35 to read the bar codes 41 to 43 from the wafer pallet 31 that is pulled out. In the next step S33, the supply control unit 39 notifies the control device 7 of the read three pieces of code information “WOF21_9433”, “WID_YUF198312”, and “1420LFJIWID_Ff”.

In the next step S34, the control device 7 notifies the host computer 8 of all the read code information. In the next step S35, the host computer 8 collates all the code information with the component type database 82 to identify the component type of the wafer component. In the next step S36, the host computer 8 notifies the control device 7 of the information on the component type acquired by the collation.

In contrast to the point that all code information is collated with the component type database 82 in step S35 of the conventional technique, only one piece of code information needs to be collated with the component type database 82 in step S9 of the first embodiment. Therefore, according to the first embodiment, the data processing time required for the matching operation can be reduced as compared with the related art. Further, in contrast to the point of notifying all the read code information in steps S33 and S34 of the conventional technique, only one piece of code information needs to be notified and transferred in steps S7 and S8 of the first embodiment. .. Therefore, according to the first embodiment, the data communication time required for notifying and transferring the code information can be reduced as compared with the related art.

(3. Aspects and Effects of Component Supply System of First Embodiment)
The component supply system according to the first embodiment holds a plurality of components and also has a plurality of types of identification codes for different purposes (manufacturer management barcode 41, component type identification barcode 42, map acquisition barcode 43). A component supply system for supplying a component by using a component holder (wafer pallet 31) attached with, based on the attributes assigned to a plurality of types of identification codes and different for each purpose of use. A code selecting/using unit 36 for selecting and using an identification code that matches a desired purpose of use is provided.

In the component supply system of the first embodiment, the code selection/use unit 36 selects the identification code that matches the desired purpose of use, based on the attributes assigned to the plurality of types of identification codes attached to the component holder. To use. Therefore, data processing for collating other identification codes that do not match the purpose of use with the database (component type database 82, map database 83) becomes unnecessary, and the data processing time can be reduced as compared with the conventional case. In addition, even if the positions of multiple types of identification codes are incorrect, the attachment positions vary, or even if multiple types of identification codes accidentally resemble each other, identification that matches the intended use due to the difference in attributes Robustness is ensured because the cord can be selected with certainty.

In addition, the supply control unit 39, the control device 7, and the host computer 8 are communicatively connected, and all the code information read by the prior art is notified, whereas in the first embodiment, the selection is selected. Only one piece of code information is notified. Therefore, the data communication time required for notifying and transferring the code information can be reduced as compared with the related art.

Further, in the component supply system of the first embodiment, the attributes are of a plurality of types which are represented by a plurality of types of identification codes (manufacturer management barcode 41, component type identification barcode 42, map acquisition barcode 43). It is a keyword (“WID_”, “LFJI”) embedded in a part of the code information, and the code selection/use unit 36 filters a plurality of types of code information using a specific keyword corresponding to a desired purpose of use. , A keyword selection unit 37 for selecting code information in which a specific keyword is incorporated. According to this, by using the keyword, the identification code that matches the desired purpose of use can be reliably selected.

Furthermore, in the modification of the component supply system of the first embodiment, the attributes mean a plurality of types of identification codes (manufacturer management barcode 41, component type identification barcode 42, map acquisition barcode 43). The code length is the code length (the number of characters of the code information) included in the plurality of types of code information, and the code selection/use unit 36 filters the plurality of types of code information using a specific code length corresponding to the desired purpose of use. , A code length selection unit 38 for selecting code information having a specific code length. According to this, by using the code length, the identification code that matches the desired purpose of use can be reliably selected.

Further, the component holder holds the component holding sheet 313 to which the wafer component is attached, and also has a plurality of types of identification codes (manufacturer management barcode 41, component type identification barcode 42, map acquisition barcode 43). ) Is a wafer component holder (wafer pallet 31) attached to the upper surface, and the component supply system of the first embodiment is a storage magazine for storing a plurality of wafer component holders so that they can be selectively withdrawn from the outlet 321. The part 32 and one of the wafer component holders in the accommodating magazine part 32 is pulled out and conveyed to the component supply position, and the conveyed wafer component holder is positioned at the component supply position while holding the component. A supply unit 34 that pushes up the sheet 313 to supply the wafer component and a downwardly arranged position above the drawer opening 321 of the accommodation magazine unit 32, and reads the identification code attached to the upper surface of the wafer component holder that is pulled out, A code reading unit 35 that acquires code information that the identification code means is further provided.

The component supply system of the first embodiment is configured in the component mounter 1 equipped with the wafer component supply device 3, and the effect of reducing the data processing time and the effect of excellent robustness become remarkable. ..

(4. Parts supply system of the second embodiment)
Next, the parts supply system of the second embodiment will be described mainly on the points different from the first embodiment. In the second embodiment, the entire configuration itself of the component mounter 1 is the same as that of the first embodiment, and the code selection/use unit 36 includes an attached area selection unit instead of the keyword selection unit 37 and the code length selection unit 38. including. The attached area selection unit selects an identification code attached to a specific attached area corresponding to a desired purpose of use. Detailed functions and operations of the attached area selection unit will be described later.

In the second embodiment, the attachment area of the wafer pallet 31 to which the identification code is attached is used as the attribute assigned to each of the plurality of types of identification codes. FIG. 7 is a plan view of the wafer pallet 31 for explaining the attachment area. As illustrated, the length of the upper ring 312 in the transport direction is divided into three equal parts, and a front area AF, a central area AM, and a rear area AR are set. The manufacturer management barcode 41 is not attached in the three areas AF, AM, and AR. The component type identification barcode 42 is attached to the front area AF, and the map identification barcode 423 is attached to the rear area AR.

Here, the supply control unit 39 controls both the transport unit 33 and the code reading unit 35. Therefore, when the wafer pallet 31 is pulled out by the transport unit 33, the supply control unit 39 can always grasp the area where the field of view of the code reading unit 35 is facing.

Next, the operation of the component supply system of the second embodiment will be described. FIG. 8 is a diagram showing the operation of the component supply system of the second embodiment. In step S11 of FIG. 8, the host computer 8 notifies the control device 7 of a specific attachment area corresponding to a desired purpose of use. In the example of FIG. 8, the desired purpose of use is to identify the component type of the wafer component, and the front area AF is notified as the specific attachment area. In next step S12, control device 7 issues a command to supply controller 39 to carry wafer pallet 31 into the component supply position. At the same time, the control device 7 issues a command to the attached area selection unit to read the barcode attached to the front area AF.

In the next step S13, the supply controller 39 controls the carrier 33 to pull out the wafer pallet 31. At the same time, the attached area selection unit controls the code reading unit 35 to read the component type identification barcode 42 attached to the front area AF of the wafer pallet 31. In the next step S14, the code selection/use unit 36 notifies the control device 7 of the read piece of code information "WID_YUF198312". In the next step S15, the control device 7 transfers the relevant code information “WID_YUF198312” to the host computer 8. In the next step S16, the host computer 8 collates the transferred code information "WID_YUF198312" with the component type database 82 to identify the component type of the wafer component. In the next step S17, the host computer 8 notifies the control device 7 of the information on the component type acquired by the collation. As a result, the control device 7 can recognize the component type of the wafer component supplied from the wafer component supply device 3.

When the desired purpose of use is acquisition of a wafer map, the operation of the component supply system of the second embodiment changes as follows. That is, in step S11, the host computer 8 notifies the rear area AR as a specific attached area. Then, in step S12, the information of the rear area AR is transferred to the attached area selection unit. As a result, in step S13, the attached area selection unit reads the map identification barcode 43 attached to the rear area AR of the wafer pallet 31. In the subsequent steps, only the code information “1420LFJIWID_Ff” of the map identification barcode 43 is the target of data processing.

In the component supply system according to the second embodiment, the attributes assigned to the plurality of types of identification codes are the attachment areas (front area AF, central area AM, rear area AR) of the wafer pallet 31, and the code selection/use unit 36. Includes an attached area selection unit that selects an identification code attached to a specific attached area corresponding to a desired purpose of use. According to this, since it is not necessary to select and read the identification code and read all of the plurality of types of identification codes, the effect of reducing the data processing time becomes more remarkable.

(5. Application and modification of the embodiment)
The present invention can also be applied to a component holder other than the wafer pallet 31 described in the embodiment, for example, a tray pallet or a feeder device provided with a plurality of types of identification codes. Further, in the first embodiment and its modification, the code selecting/using unit 36, the keyword selecting unit 37, and the code length selecting unit 38 can be realized by software of the control device 7. Furthermore, an attached area smaller than the three areas AF, AM, and AR described in the second embodiment may be set, or an area setting method using a coordinate system on the wafer pallet 31 may be adopted. The present invention can be applied and modified in various ways.

1: Component mounter 2: Substrate transfer device 3: Wafer component supply device 31: Wafer pallet (component holder, wafer component holder)
311: Lower ring 312: Upper ring 313: Component holding sheet 32: Storage magazine section 321: Drawout port 33: Conveying section 34: Supply section 35: Code reading section 36: Code selection using section 37: Keyword selecting section 38: Code Length selection unit 39: Supply control unit 41: Manufacturer management bar code (identification code)
42: Bar code for component type identification (identification code)
43: Bar code for map acquisition (identification code)
5: Component transfer device 6: Component camera 7: Control device 8: Host computer 82: Component type database 83: Map database

Claims (5)

While holding a plurality of components, a plurality of codes including at least one of a component type identification code that identifies the component type of the retained component and a map acquisition code that identifies the wafer map of the retained component are attached. A component supply method for selectively acquiring one of the component type and the wafer map of the component to be supplied using the component holder,
A first step of storing at least one of the correspondence between the component type identification code and the component type, and the correspondence between the map acquisition code and the wafer map,
While accepting the notification of the attribute for selecting the component type identification code for the purpose of acquiring the component type of the retained component, the map acquisition code is used for the purpose of acquiring the wafer map of the retained component. A second step of receiving notification of an attribute for selecting,
A third step of selecting the code that matches the purpose by filtering a plurality of the codes read by one code reading unit from the component holder using the received attribute;
A fourth step of recognizing the selected component code or the wafer map by collating the selected code with the database;
A method of supplying parts. The attribute is a keyword incorporated in a part of a plurality of code information that each of the codes means,
In the third step, a plurality of the code information is filtered using the specific keyword corresponding to the purpose, and the code information including the specific keyword is selected.
The component supply method according to claim 1. The attribute is a code length included in a plurality of code information that each of the plurality of identification codes means,
In the third step, a plurality of the code information is filtered using the specific code length corresponding to the purpose, and the code information having the specific code length is selected.
The component supply method according to claim 1. At least a component type identification code that retains a component holding sheet to which a plurality of wafer components are attached and that identifies a component type of the retained component, and a map acquisition code that identifies a wafer map of the retained components A wafer component holder in which a plurality of cords including one is separately attached to a plurality of attachment areas on the upper surface,
An accommodating magazine part for accommodating a plurality of the wafer component holders so that the wafer component holders can be selectively withdrawn from the outlet,
A transport unit that pulls out any of the wafer component holders in the storage magazine unit and transports it to a component supply position,
While positioning the conveyed wafer component holder at the component supply position, a supply unit that pushes up the component holding sheet to supply the wafer component,
A code that is arranged downward above the drawer opening of the storage magazine section and that can read a plurality of the codes of a plurality of the attachment areas arranged in the carrying direction on the upper surface of the wafer component holder that is drawn by the carrying section. A reading unit,
Accepts a notification of the specific attachment area corresponding to the difference in purpose of acquiring the component type or acquiring the wafer map, controls the code reading unit, and is attached to the specific attachment area. And a code selection and use section for reading only the code,
Parts supply system equipped with. While holding a component holding sheet to which a plurality of wafer components are attached, a wafer component holder provided with a plurality of types of identification codes for different purposes of use,
An accommodating magazine part that accommodates a plurality of the wafer component holders so that they can be selectively withdrawn from the withdrawal opening,
A transport unit that pulls out any of the wafer component holders in the storage magazine unit and transports it to a component supply position,
When the wafer component holder is pulled out from the accommodating magazine part, a code reading unit that can read the identification code attached to the wafer component holder that is pulled out is used to load the wafer component using a component supply device. A method of supplying components,
The plurality of identification codes are separately attached to a plurality of attachment areas lined up in the transport direction on the upper surface of the wafer component holder,
The code reading unit reads only the identification code attached to the specific attachment area corresponding to the purpose of use,
Parts supply method.

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