JP2020119856A - Manufacturing method of sheet-like conductive member, and sheet-like conductive member - Google Patents

Abstract

To provide a manufacturing method of a sheet-like conductive member capable efficiently preparing a self-standing sheet-like conductive member of sufficiently thin thickness.SOLUTION: A manufacturing method of a sheet-like member 100 includes a step for putting a pseudo sheet structure 2 on which a plurality of conductive filaments 21 are arranged with a space in between on a first film 1 having a process film 12 and a first resin layer 11, a step for attaching a second film 3 having a second resin layer 31 to the first film 1 so that the second resin 31 contacts the pseudo sheet structure 2, and a step for drying or curing at least one of the first resin layer 11 and the second resin layer 31.SELECTED DRAWING: Figure 1

Description

The present invention relates to a method for manufacturing a sheet-shaped conductive member and a sheet-shaped conductive member.

A sheet-shaped conductive member (hereinafter, also referred to as “conductive sheet”) having a pseudo-sheet structure in which a plurality of conductive linear bodies are arranged at intervals is used for a heating element of a heating device, a textile material that generates heat, and a display. There is a possibility that it can be used as a member of various articles such as a protective film (crush prevention film).
For example, Patent Document 1 describes a conductive sheet having a pseudo sheet structure in which a plurality of linear bodies extending in one direction are arranged at intervals.

International Publication No. 2017/086395

This conductive sheet is required to be thin depending on the application. On the other hand, the conductive sheet described in Patent Document 1 forms a pseudo sheet structure on a base material. Further, in the manufacturing process of the conductive sheet, the base material needs to have a certain thickness, so that there is a limit in reducing the thickness.

An object of the present invention is to provide a sheet-shaped conductive member manufacturing method and a sheet-shaped conductive member capable of efficiently manufacturing a sheet-shaped conductive member having a sufficiently thin thickness and self-supporting property.

A method of manufacturing a sheet-shaped conductive member according to an aspect of the present invention includes a step of providing a pseudo sheet structure in which a plurality of conductive linear bodies are arranged at intervals on a first film including a process film and a first resin layer. And a step of attaching a second film having a second resin layer to the first film so that the second resin layer and the pseudo sheet structure are in contact with each other, and the first resin layer and the first film. And a step of drying or curing at least one of the two resin layers.

The method for manufacturing a sheet-shaped conductive member according to an aspect of the present invention preferably further comprises a step of attaching electrodes to the pseudo sheet structure.

In the method for manufacturing a sheet-shaped conductive member according to an aspect of the present invention, it is preferable that the second film further includes a process film.

The method for manufacturing a sheet-shaped conductive member according to an aspect of the present invention further includes a step of peeling a process film from at least one of the first resin layer and the second resin layer after being dried or cured. It is preferable.

In the method for manufacturing a sheet-shaped conductive member according to one aspect of the present invention, it is preferable that the peel strength of the process film is 5 mN/100 mm or more and 2000 mN/100 mm or less.

In the method for manufacturing a sheet-shaped conductive member according to an aspect of the present invention, it is preferable that at least one of the first resin layer and the second resin layer is energy ray curable.

In the method for manufacturing a sheet-shaped conductive member according to an aspect of the present invention, it is preferable that both the first resin layer and the second resin layer are energy ray curable.

In the method for manufacturing a sheet-shaped conductive member according to one aspect of the present invention, the total thickness of the first resin layer and the second resin layer is preferably 7 μm or more and 500 μm or less. ..

A sheet-shaped conductive member according to an aspect of the present invention is provided with a first resin layer, a second resin layer, and between the first resin layer and the second resin layer, and a plurality of conductive linear members are provided. A sheet-shaped conductive member having a pseudo sheet structure arranged at intervals, wherein the sheet-shaped conductive member has a thickness of 7 μm or more and 200 μm or less, and the first resin layer and the second resin layer are The storage elastic modulus at at least one temperature of 25° C. is 5.0×10 ⁷ Pa or more and 5.0×10 ¹⁰ Pa or less.

ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method of the sheet-shaped conductive member and sheet-shaped conductive member which can efficiently manufacture the sheet-shaped conductive member which is sufficiently thin and has self-supporting property can be provided.

It is an explanatory view for explaining the manufacturing method of the sheet-like conductive member concerning a first embodiment of the present invention. It is sectional drawing which shows the II-II cross section of FIG. It is explanatory drawing for demonstrating the manufacturing method of the sheet-shaped conductive member which concerns on 2nd embodiment of this invention. It is explanatory drawing for demonstrating the manufacturing method of the sheet-shaped conductive member which concerns on 3rd embodiment of this invention.

[First embodiment]
Hereinafter, the present invention will be described with reference to the drawings by taking an embodiment as an example. The present invention is not limited to the content of the embodiment. In the drawings, there are some portions that are enlarged or reduced for easy explanation.

The method for manufacturing the sheet-shaped conductive member 100 according to the present embodiment includes a plurality of the first film 1 including the process film 12 and the first resin layer 11 shown in FIG. Of the pseudo sheet structure 2 in which the conductive linear bodies 21 are arranged at intervals (hereinafter, also referred to as “pseudo sheet structure forming step”), and as shown in FIG. A step of attaching the electrode 4 to the body 2 (hereinafter, also referred to as “electrode attaching step”), and as shown in FIG. 1D, a second film 3 including a step film 32 and a second resin layer 31 1 film 1 so that the second resin layer 31 and the pseudo sheet structure 2 are in contact with each other (hereinafter also referred to as “second resin layer bonding step”), and the first resin layer 11 and the second resin layer 31 A step of curing at least one of the resin layers 31 (hereinafter, also referred to as a “curing step”), and as shown in FIG. 1E, of the first resin layer 11 and the second resin layer 31 after being cured. The method includes a step of peeling at least one of the process films 12 and 32 from at least one (hereinafter, also referred to as a “process film peeling step”).

First, the first resin layer 11 and the second resin layer 31, the pseudo sheet structure 2, the process films 12 and 32, and the electrode 4 used in the method for manufacturing the sheet-shaped conductive member 100 according to the present embodiment will be described.

(First resin layer and second resin layer)
The first resin layer 11 and the second resin layer 31 are layers containing a resin. Further, the first resin layer 11 is preferably a layer containing an adhesive. When forming the pseudo sheet structure 2 on the first film 1, the adhesive facilitates the attachment of the conductive linear body 21 to the first resin layer 11.

At least one of the first resin layer 11 and the second resin layer 31 is made of a resin that can be dried or cured. By curing or drying the resin layer, the sheet-shaped conductive member 100 can be provided with self-supporting property. Further, hardness sufficient to protect the pseudo sheet structure 2 is given to the first resin layer 11 and the second resin layer 31, and the first resin layer 11 and the second resin layer 31 also function as a protective film. In addition, the cured or dried first resin layer 11 and the second resin layer 31 have impact resistance, and deformation of the first resin layer 11 and the second resin layer 31 due to impact can be suppressed.

At least one of the first resin layer 11 and the second resin layer 31 is preferably curable with energy rays such as ultraviolet rays, visible energy rays, infrared rays, and electron rays, because it can be easily cured in a short time. .. Note that “energy ray curing” also includes heat curing by heating using energy rays. Further, it is more preferable that both the first resin layer 11 and the second resin layer 31 are energy ray curable.

Examples of the adhesive for the first resin layer 11 and the second resin layer 31 include a thermosetting adhesive that is hardened by heat, a so-called heat seal type adhesive that is adhered by heat, and an adhesive that wets to exhibit adhesiveness. To be However, for ease of application, the first resin layer 11 and the second resin layer 31 are preferably energy ray curable. Examples of the energy ray curable resin include compounds having at least one polymerizable double bond in the molecule, and acrylate compounds having a (meth)acryloyl group are preferable.

Examples of the acrylate compound include (meth)acrylate containing a chain aliphatic skeleton (dicyclopentadiene diacrylate, trimethylolpropane tri(meth)acrylate, tetramethylolmethane tetra(meth)acrylate, pentaerythritol tri(meth)). Acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol monohydroxypenta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, 1,4-butylene glycol di(meth)acrylate, and 1,6-hexanediol di (Meth)acrylate, etc., cycloaliphatic skeleton-containing (meth)acrylate (dicyclopentanyl di(meth)acrylate etc.), polyalkylene glycol (meth)acrylate (polyethylene glycol di(meth)acrylate etc.), oligoester ( Examples thereof include (meth)acrylate, urethane (meth)acrylate oligomer, epoxy-modified (meth)acrylate, polyether (meth)acrylate other than the above polyalkylene glycol (meth)acrylate, and itaconic acid oligomer.

The weight average molecular weight (Mw) of the energy ray-curable resin is preferably 100 to 30,000, and more preferably 300 to 10,000.

The energy ray-curable resin contained in the adhesive composition may be only one type, or may be two or more types, and in the case of two or more types, their combination and ratio can be arbitrarily selected. Further, it may be combined with a thermoplastic resin described later, and the combination and ratio can be arbitrarily selected.

The first resin layer 11 and the second resin layer 31 may be pressure-sensitive adhesive layers formed from a pressure-sensitive adhesive (pressure-sensitive adhesive). The pressure-sensitive adhesive of the pressure-sensitive adhesive layer is not particularly limited. Examples of the pressure-sensitive adhesive include acrylic pressure-sensitive adhesive, urethane pressure-sensitive adhesive, rubber pressure-sensitive adhesive, polyester pressure-sensitive adhesive, silicone pressure-sensitive adhesive, and polyvinyl ether pressure-sensitive adhesive. Among these, the pressure-sensitive adhesive is preferably at least one selected from the group consisting of acrylic pressure-sensitive adhesives, urethane pressure-sensitive adhesives, and rubber pressure-sensitive adhesives, and more preferably acrylic pressure-sensitive adhesives.

As the acrylic pressure-sensitive adhesive, for example, a polymer containing a structural unit derived from an alkyl(meth)acrylate having a linear alkyl group or a branched alkyl group (that is, a polymer obtained by polymerizing at least an alkyl(meth)acrylate). ), an acrylic polymer containing a structural unit derived from a (meth)acrylate having a cyclic structure (that is, a polymer obtained by polymerizing at least a (meth)acrylate having a cyclic structure), and the like. Here, “(meth)acrylate” is used as a word indicating both “acrylate” and “methacrylate”, and the same applies to other similar terms.

When the acrylic polymer is a copolymer, the form of copolymerization is not particularly limited. The acrylic copolymer may be a block copolymer, a random copolymer, or a graft copolymer.

Among these, the acrylic pressure-sensitive adhesive is derived from an alkyl (meth)acrylate (a1′) having a chain alkyl group having 1 to 20 carbon atoms (hereinafter, also referred to as “monomer component (a1′)”). The acrylic copolymer containing the structural unit (a1) and the structural unit (a2) derived from the functional group-containing monomer (a2′) (hereinafter, also referred to as “monomer component (a2′)”) is preferable.
The acrylic copolymer further contains a structural unit (a3) derived from another monomer component (a3′) other than the monomer component (a1′) and the monomer component (a2′). You can leave.

The number of carbon atoms of the chain alkyl group contained in the monomer component (a1′) is preferably 1 or more and 12 or less, more preferably 4 or more and 8 or less, from the viewpoint of improving adhesive properties. More preferably, it is 6 or less. Examples of the monomer component (a1′) include methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, n-butyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, and lauryl (meth). ) Acrylate, tridecyl (meth)acrylate, and stearyl (meth)acrylate. Among these monomer components (a1'), butyl(meth)acrylate and 2-ethylhexyl(meth)acrylate are preferable, and butyl(meth)acrylate is more preferable.

The content of the structural unit (a1) is preferably 50% by mass or more and 99.5% by mass or less, and 55% by mass or more and 99% by mass, based on all the structural units (100% by mass) of the acrylic copolymer. It is more preferably not more than 60% by mass, further preferably not less than 60% by mass and not more than 97% by mass, particularly preferably not less than 65% by mass and not more than 95% by mass.

Examples of the monomer component (a2′) include a hydroxy group-containing monomer, a carboxy group-containing monomer, an epoxy group-containing monomer, an amino group-containing monomer, a cyano group-containing monomer, a keto group-containing monomer, and an alkoxysilyl group-containing monomer. Are listed. Among these monomer components (a2′), a hydroxy group-containing monomer and a carboxy group-containing monomer are preferable.
Examples of the hydroxy group-containing monomer include 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, 3-hydroxybutyl (meth)acrylate, and 4-hydroxybutyl. Examples thereof include (meth)acrylate, and 2-hydroxyethyl (meth)acrylate is preferable.
Examples of the carboxy group-containing monomer include (meth)acrylic acid, maleic acid, fumaric acid and itaconic acid, and (meth)acrylic acid is preferable.
Examples of the epoxy group-containing monomer include glycidyl (meth)acrylate and the like.
Examples of the amino group-containing monomer include diaminoethyl (meth)acrylate and the like.
Examples of the cyano group-containing monomer include acrylonitrile and the like.

The content of the structural unit (a2) is preferably 0.1% by mass or more and 50% by mass or less, and 0.5% by mass, based on all the structural units (100% by mass) of the acrylic copolymer. It is more preferably 40% by mass or more and 1.0% by mass or more and 30% by mass or less, and particularly preferably 1.5% by mass or more and 20% by mass or less.

Examples of the monomer component (a3′) include (meth)acrylate having a cyclic structure (for example, cyclohexyl (meth)acrylate, benzyl (meth)acrylate, isobornyl (meth)acrylate, dicyclopentanyl (meth)acrylate). , Dicyclopentenyl (meth)acrylate, dicyclopentenyloxyethyl (meth)acrylate, imide (meth)acrylate, and acryloylmorpholine), vinyl acetate, and styrene.

The content of the structural unit (a3) is preferably 0% by mass or more and 40% by mass or less, and 0% by mass or more and 30% by mass, based on all structural units (100% by mass) of the acrylic copolymer. It is more preferably at most 0% by mass and at most 25% by mass, still more preferably at least 0% by mass and at most 20% by mass.

The above-mentioned monomer component (a1′) may be used alone or in combination of two or more kinds, and the above-mentioned monomer component (a2′) is used alone or in combination of two or more kinds. Alternatively, the above-mentioned monomer component (a3′) may be used alone or in combination of two or more kinds.

The acrylic copolymer may be crosslinked with a crosslinking agent. As the cross-linking agent, for example,
Known epoxy crosslinking agents, isocyanate crosslinking agents, aziridine crosslinking agents, metal chelate crosslinking agents and the like can be mentioned. When the acrylic copolymer is crosslinked, the functional group derived from the monomer component (a2′) can be used as a crosslinking point that reacts with the crosslinking agent.

The first resin layer 11 and the second resin layer 31 may further contain an energy ray-curable component in addition to the pressure-sensitive adhesive.
Examples of the energy ray-curable component include compounds having two or more UV-polymerizable functional groups in one molecule, such as a polyfunctional (meth)acrylate compound when the energy ray is UV rays. ..

When an acrylic pressure-sensitive adhesive is used as the pressure-sensitive adhesive, a functional group that reacts with a functional group derived from the monomer component (a2′) in the acrylic copolymer and an energy ray-curable component are used as the energy ray-curable component. A compound having a polymerizable functional group in one molecule may be used. By reaction of the functional group of the compound with the functional group derived from the monomer component (a2′) in the acrylic copolymer, the side chain of the acrylic copolymer can be polymerized by irradiation with energy rays. In addition to the acrylic adhesive as the pressure-sensitive adhesive, a component having a side chain having an energy ray-polymerizable property may be used as a copolymer component other than the copolymer serving as the pressure-sensitive adhesive.

When at least one of the first resin layer 11 and the second resin layer 31 is energy ray curable, the adhesive layer may contain a photopolymerization initiator. The photopolymerization initiator can increase the speed at which the pressure-sensitive adhesive layer is cured by irradiation with energy rays.

The thermosetting resin used for the first resin layer 11 and the second resin layer 31 is not particularly limited, and specifically, epoxy resin, phenol resin, melamine resin, urea resin, polyester resin, urethane resin, acrylic resin. Examples thereof include resins, benzoxazine resins, phenoxy resins, amine compounds, acid anhydride compounds and the like. These may be used alone or in combination of two or more. Among these, from the viewpoint of being suitable for curing using an imidazole curing catalyst, it is preferable to use an epoxy resin, a phenol resin, a melamine resin, a urea resin, an amine compound and an acid anhydride compound, and particularly excellent. From the viewpoint of exhibiting curability, at least one selected from the group consisting of an epoxy resin, a phenol resin, a mixture thereof, or an epoxy resin, and a phenol resin, a melamine resin, a urea resin, an amine compound and an acid anhydride compound. Preference is given to using mixtures with seeds.

The moisture-curable resin used for the first resin layer 11 and the second resin layer 31 is not particularly limited, and examples thereof include urethane resin, which is a resin in which an isocyanate group is generated by moisture, and modified silicone resin.

When the energy ray curable resin or the thermosetting resin is used, it is preferable to use a photopolymerization initiator or a thermal polymerization initiator. By using a photopolymerization initiator, a thermal polymerization initiator, or the like, a crosslinked structure is formed and the pseudo sheet structure 2 can be protected more firmly.

As the photopolymerization initiator, benzophenone, acetophenone, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzoin benzoic acid, methyl benzoin benzoate, benzoin dimethyl ketal, 2,4-diethylthioxanthone, 1 -Hydroxycyclohexyl phenyl ketone, benzyl diphenyl sulfide, tetramethyl thiuram monosulfide, azobisisobutyronitrile, 2-chloroanthraquinone, diphenyl(2,4,6-trimethylbenzoyl)phosphine oxide, and bis(2,4,4,4) 6-trimethylbenzoyl)-phenyl-phosphine oxide and the like.

As the thermal polymerization initiator, hydrogen peroxide, peroxodisulfate (ammonium peroxodisulfate, sodium peroxodisulfate, potassium peroxodisulfate, etc.), azo compound (2,2′-azobis(2-amidinopropane)bis Hydrochloride, 4,4'-azobis(4-cyanovaleric acid), 2,2'-azobisisobutyronitrile, 2,2'-azobis(4-methoxy-2,4-dimethylvaleronitrile), etc.) , And organic peroxides (benzoyl peroxide, lauroyl peroxide, peracetic acid, persuccinic acid, di-t-butyl peroxide, t-butyl hydroperoxide, cumene hydroperoxide, etc.) and the like.

These polymerization initiators may be used alone or in combination of two or more.
When using these polymerization initiators to form a crosslinked structure, the amount used should be 0.1 parts by mass or more and 100 parts by mass or less with respect to 100 parts by mass of the energy ray curable resin or the thermosetting resin. Is more preferable and 1 part by mass or more and 100 parts by mass or less is more preferable, and 1 part by mass or more and 10 parts by mass or less is particularly preferable.

The first resin layer 11 and the second resin layer 31 may contain an inorganic filler. By including the inorganic filler, the hardness of the first resin layer 11 and the second resin layer 31 after curing can be further improved. Further, the thermal conductivity of the first resin layer 11 and the second resin layer 31 is improved.

As the inorganic filler, for example, inorganic powder (for example, powder of silica, alumina, talc, calcium carbonate, titanium white, red iron oxide, silicon carbide, boron nitride, etc.), beads obtained by spheroidizing the inorganic powder, single crystal fibers, And glass fiber. Among these, silica filler and alumina filler are preferable as the inorganic filler. The inorganic fillers may be used alone or in combination of two or more.

The first resin layer 11 and the second resin layer 31 may contain other components. Other components include, for example, well-known additions such as organic solvents, flame retardants, tackifiers, ultraviolet absorbers, antioxidants, preservatives, mildew-proofing agents, plasticizers, defoamers, and wettability modifiers. Agents.

The thicknesses of the first resin layer 11 and the second resin layer 31 are appropriately determined according to the application of the sheet-shaped conductive member 100. From the viewpoint that the sheet-shaped conductive member 100 is thinner and has self-supporting property, the total thickness of the first resin layer 11 and the second resin layer 31 is preferably 7 μm or more and 500 μm or less. The thickness is more preferably 10 μm or more and 200 μm or less, further preferably 10 μm or more and 100 μm or less, and particularly preferably 10 μm or more and 50 μm or less.

(Pseudo sheet structure)
The pseudo sheet structure 2 has a structure in which a plurality of conductive linear bodies 21 extending in one direction are arranged at intervals. The conductive linear body 21 is linear or corrugated in a plan view of the sheet-shaped conductive member 100. Specifically, the conductive linear body 21 may have a wave shape such as a sine wave, a rectangular wave, a triangular wave, or a sawtooth wave. That is, the pseudo sheet structure 2 has a structure in which a plurality of conductive linear bodies 21 are arranged at equal intervals in a direction orthogonal to the axial direction of the conductive linear bodies 21.

If the pseudo sheet structure 2 has the above-described structure, it is possible to suppress the cutting of the conductive linear body 21 when the sheet-shaped conductive member 100 is extended in the axial direction of the conductive linear body 21. In addition, even if the sheet-shaped conductive member 100 extends in a direction orthogonal to the axial direction of the conductive linear body 21, the conductive linear body 21 is not cut. Therefore, the sheet-shaped conductive member 100 has sufficient elasticity.

The volume resistivity R of the conductive linear body 21 is preferably 1.0×10 ⁻⁹ Ω·m or more and 1.0×10 ⁻³ Ω·m or less, and 1.0×10 ⁻⁸ Ω· More preferably, it is not less than m and not more than 1.0×10 ⁻⁴ Ω·m. When the volume resistivity R of the conductive linear body 21 is within the above range, the surface resistance of the pseudo sheet structure 2 is likely to be reduced.
The measurement of the volume resistivity R of the conductive linear body 21 is as follows. Silver paste is applied to both ends of the conductive linear body 21, and the resistance of a portion having a length of 40 mm from the end is measured to obtain the resistance value of the conductive linear body 21. Then, the resistance value is multiplied by the cross-sectional area (unit: m ² ) of the conductive linear body 21, and the obtained value is divided by the measured length (0.04 m) to obtain the conductive linear shape. The volume resistivity R of the body 21 is calculated.

The cross-sectional shape of the conductive linear body 21 is not particularly limited, and may be polygonal, flattened, elliptical, circular, or the like, but from the viewpoint of familiarity with the first resin layer 11, etc., It is preferably circular.
When the cross section of the conductive linear body 21 is circular, the diameter D (see FIG. 2) of the conductive linear body 21 is preferably 5 μm or more and 75 μm or less. The diameter D of the conductive linear member 21 is 8 μm or more and 60 μm or less from the viewpoint of suppressing the increase in sheet resistance and improving the heat generation efficiency and the dielectric breakdown resistance when the sheet-shaped conductive member 100 is used as a heating element. It is more preferable that the thickness is 12 μm or more and 40 μm or less.
When the cross section of the conductive linear body 21 is elliptical, the major axis is preferably in the same range as the above diameter D.

Regarding the diameter D of the conductive linear body 21, the conductive linear body 21 of the pseudo sheet structure 2 was observed using a digital microscope, and the diameter of the conductive linear body 21 was randomly selected at five locations. Is measured and used as the average value.

The interval L (see FIG. 2) between the conductive linear members 21 is preferably 0.3 mm or more and 12.0 mm or less, more preferably 0.5 mm or more and 10.0 mm or less, and 0.8 mm or more 7 More preferably, it is 0.0 mm or less.
When the distance between the conductive linear members 21 is within the above range, the conductive linear members are densely packed to some extent, so that the resistance of the pseudo sheet structure is kept low and the sheet-shaped conductive member 100 is used as a heating element. In this case, it is possible to improve the function of the sheet-shaped conductive member 100, such as making the temperature rise distribution uniform.

The distance L between the conductive linear members 21 is measured by observing the conductive linear members 21 of the pseudo sheet structure 2 using a digital microscope and measuring the distance between two adjacent conductive linear members 21.
The interval between two adjacent conductive linear members 21 is the length along the direction in which the conductive linear members 21 are arranged, and the two conductive linear members 21 face each other. It is the length between the parts (see FIG. 2). The interval L is the average value of the intervals between all the adjacent conductive linear members 21 when the conductive linear members 21 are arranged at unequal intervals, but the value of the interval L can be easily controlled. From the viewpoint of the above, the conductive linear members 21 are preferably arranged at substantially equal intervals in the pseudo sheet structure 2, and more preferably arranged at equal intervals.

The conductive linear body 21 is not particularly limited, but may be a linear body containing a metal wire (hereinafter also referred to as “metal wire linear body”). Since the metal wire has high thermal conductivity, high electrical conductivity, high handling property, and versatility, when the metal wire linear body is applied as the conductive linear body 21, the resistance value of the pseudo sheet structure 2 is reduced. At the same time, the light transmittance is easily improved. Further, when the sheet-shaped conductive member 100 (pseudo sheet structure 2) is applied as a heating element, quick heat generation is easily realized. Further, as described above, it is easy to obtain a linear body having a small diameter.
In addition to the metal wire linear body, examples of the conductive linear body 21 include a linear body containing carbon nanotubes and a linear body in which a thread is conductively coated.

The carbon nanotube linear body is, for example, a carbon nanotube forest (a growth body in which a plurality of carbon nanotubes are grown on a substrate so as to be oriented in a direction perpendicular to the substrate, and is called an “array”). The carbon nanotubes can be obtained by pulling out the carbon nanotubes in a sheet shape from the end portion of (also) and bundling the pulled out carbon nanotube sheets, and then twisting the bundle of carbon nanotubes. In such a manufacturing method, when no twist is applied during twisting, a ribbon-shaped carbon nanotube linear body is obtained, and when twisted, a thread-shaped linear body is obtained. The ribbon-shaped carbon nanotube linear body is a linear body that does not have a twisted structure of carbon nanotubes. In addition, the carbon nanotube linear body can be obtained by spinning the carbon nanotube dispersion. The production of carbon nanotube linear bodies by spinning can be carried out, for example, by the method disclosed in U.S. Patent Application Publication No. 2013/0251619 (JP 2012-126635 A). From the viewpoint of obtaining a uniform diameter of the carbon nanotube linear body, it is preferable to use the filamentous carbon nanotube linear body, and from the viewpoint of obtaining a highly pure carbon nanotube linear body, twist the carbon nanotube sheet. Thus, it is preferable to obtain a filamentous carbon nanotube linear body. The carbon nanotube linear body may be a linear body in which two or more carbon nanotube linear bodies are woven together. Further, the carbon nanotube linear body may be a linear body in which carbon nanotubes and another conductive material are composited (hereinafter also referred to as “composite linear body”).

Examples of the composite linear body include (1) a carbon nanotube linear body in which carbon nanotubes are drawn out from an end of a carbon nanotube forest into a sheet shape, the drawn carbon nanotube sheets are bundled, and then the bundle of carbon nanotubes is twisted. In the process of obtaining a carbon nanotube forest, sheet or bundle, or the surface of a twisted linear body, a composite linear body in which a metal simple substance or a metal alloy is carried by vapor deposition, ion plating, sputtering, wet plating, etc. , (2) a linear body of a simple metal or a linear body of a metal alloy or a composite linear body, and a composite linear body in which a bundle of carbon nanotubes is twisted, (3) a linear body of a simple metal or a metal alloy Examples thereof include a composite linear body in which a linear body or a composite linear body and a carbon nanotube linear body or a composite linear body are woven. In addition, in the composite linear body of (2), when twisting the bundle of carbon nanotubes, a metal may be supported on the carbon nanotubes similarly to the composite linear body of (1). Further, the composite linear body of (3) is a composite linear body obtained by knitting two linear bodies, but at least one linear body of a simple metal or a linear body of a metal alloy or a composite body. As long as the linear body is included, three or more of the carbon nanotube linear body, the metal linear body, the metal alloy linear body, or the composite linear body may be knitted together.
Examples of the metal of the composite linear body include simple metals such as gold, silver, copper, iron, aluminum, nickel, chromium, tin, and zinc, and alloys containing at least one of these simple metals (copper-nickel-phosphorus). Alloys and copper-iron-phosphorus-zinc alloys).

The conductive linear body 21 may be a linear body in which a thread is coated with a conductive coating. Examples of the yarn include yarn spun from a resin such as nylon or polyester. Examples of the conductive coating include coatings of metals, conductive polymers, carbon materials and the like. The conductive coating can be formed by plating or vapor deposition. A linear body in which a conductive coating is applied to the yarn can improve the conductivity of the linear body while maintaining the flexibility of the yarn. That is, it becomes easy to reduce the resistance of the pseudo sheet structure 2.

The conductive linear body 21 may be a linear body including a metal wire. The linear body including the metal wire may be a linear body composed of one metal wire or a linear body obtained by twisting a plurality of metal wires.
Examples of the metal wire include metals such as copper, aluminum, tungsten, iron, molybdenum, nickel, titanium, silver and gold, or alloys containing two or more kinds of metals (for example, steel such as stainless steel and carbon steel, brass and phosphorus). Examples of the wire include bronze, zirconium copper alloy, beryllium copper, iron nickel, nichrome, nickel titanium, canthal, hastelloy, and rhenium tungsten. The metal wire may be plated with tin, zinc, silver, nickel, chromium, nickel-chromium alloy, solder or the like, and the surface thereof is coated with a carbon material or polymer described later. May be. In particular, a wire containing one or more metals selected from tungsten and molybdenum and alloys containing these is preferable from the viewpoint of forming the conductive linear body 21 having a low volume resistivity.
Examples of the metal wire also include a metal wire coated with a carbon material. When the metal wire is coated with the carbon material, the metallic luster is reduced, and it becomes easy to make the presence of the metal wire inconspicuous. Further, when the metal wire is covered with the carbon material, metal corrosion is also suppressed.
Examples of the carbon material for coating the metal wire include amorphous carbon (for example, carbon black, activated carbon, hard carbon, soft carbon, mesoporous carbon, carbon fiber and the like), graphite, fullerene, graphene and carbon nanotube.

(Process film)
The process films 12 and 32 are films that are required at the time of manufacturing the sheet-shaped conductive member 100, but are films that are unnecessary and can be peeled off after the sheet-shaped conductive member 100 is manufactured. The process films 12 and 32 usually include a release base material and a release layer.
Examples of the release substrate include a paper substrate, a laminated paper obtained by laminating a thermoplastic resin (for example, polyethylene) on a paper substrate, and a plastic film. Examples of the paper base material include glassine paper, coated paper, cast coated paper and the like. Examples of plastic films include polyester films (eg, polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, etc.), polyolefin films (eg, polypropylene, polyethylene, etc.), and the like. Examples of the release agent include olefin-based resins, rubber-based elastomers (eg, butadiene-based resins and isoprene-based resins), long-chain alkyl-based resins, alkyd-based resins, fluorine-based resins, and silicone-based resins. ..
The release layer is not particularly limited. For example, from the viewpoint of easy handling, the release layer preferably includes a release base material and a release layer formed by applying a release agent on the release base material. Moreover, the release layer may be provided with the release layer only on one surface of the release substrate, or may be provided with the release layer on both surfaces of the release substrate.

When a plastic film is used as the release substrate, the thickness of the plastic film is preferably 4 μm or more and 200 μm or less, and more preferably 10 μm or more and 125 μm or less.
The thickness of the release layer is not particularly limited. When the release layer is formed by applying a solution containing a release agent, the thickness of the release layer is preferably 0.01 μm or more and 2.0 μm or less, and more preferably 0.03 μm or more and 1.0 μm or less. preferable.

(electrode)
The electrode 4 is used to supply a current to the conductive linear body 21. The electrodes 4 are arranged so as to be electrically connected to both ends of the conductive linear body 21.
Even if the diameter of the conductive linear body 21 is small, it is preferable that the electrode is strip-shaped because a good contact area with the conductive linear body 21 can be secured. A conductive foil or plate can be used as the electrode. A through hole is preferably formed in the electrode made of a conductive foil or plate. By forming the through hole, the adhesion between the first resin layer and the second resin layer is improved, and the connection of the electrodes of the conductive linear body 21 is improved. The through holes can be provided by an expanding or punching process.
As the electrode 4, specifically, for example, a metal foil or plate such as gold, silver, copper, nickel, iron, aluminum, tungsten, molybdenum, and titanium is applied. In addition, the electrodes include stainless steel, carbon steel, brass, phosphor bronze, zirconium copper alloy, beryllium copper, iron nickel, nichrome, nickel titanium, canthal, hastelloy, and rhenium containing the above metals and other metals, non-metal elements. A foil or plate of an alloy such as tungsten may be applied, or a band-shaped body containing a carbon material such as carbon nanotube, carbon nanofiber, or graphene may be used. Further, it may be a laminated body laminated with a plastic film.
In addition, the electrode 4 is an electrode obtained by solidifying a liquid conductive material (that is, an electrode made of a solidified material of the liquid conductive material) from the viewpoint of ensuring a good connection between the conductive linear body 21 and the electrode 4. It may be. A typical example of the liquid conductive material is a conductive paste. As the conductive paste, for example, a paste in which metal particles or carbon particles are dispersed in a binder resin and/or an organic solvent can be applied. Examples of the metal particles include particles of metals such as gold, silver, copper, and nickel. Examples of the binder resin include well-known resins such as polyester resin, polyurethane resin, epoxy resin, and phenol resin.
In addition to the conductive paste, for example, solder, conductive ink, or the like may be applied as the liquid conductive material.
For the electrode 4, a conductive foil or plate and a liquid conductive material may be used in combination. A conductive foil or plate may be attached after applying the liquid conductive material to the pseudo sheet structure 2, or the liquid conductive material may be attached after the conductive foil or plate having the through holes is attached. May be applied.
By using a conductive foil or plate in combination with a liquid conductive material, the connection of the electrodes becomes better.
In addition, as the electrode 4, the conductive linear bodies 21 densely arranged may be used as the electrode.

The ratio of the resistance values of the electrode 4 and the pseudo sheet structure 2 is preferably 0.0001 or more and 0.3 or less, and more preferably 0.0005 or more and 0.1 or less. The ratio of the resistance value of the electrode and the resistance value of the pseudo sheet structure 2 can be obtained by “the resistance value of the electrode 4/the resistance value of the pseudo sheet structure 2”. Within this range, when the sheet-shaped conductive member 100 is used as a heating element, abnormal heat generation in the electrode portion is suppressed. When the pseudo sheet structure 2 is used as a film heater, only the pseudo sheet structure 2 generates heat, and a film heater with good heat generation efficiency can be obtained.
The resistance values of the electrode 4 and the pseudo sheet structure 2 can be measured using a tester. First, the resistance value of the electrode 4 is measured, and then the resistance value of the pseudo sheet structure 2 to which the electrode 4 is attached is measured. Then, the resistance value of each of the electrode 4 and the pseudo sheet structure 2 is calculated by subtracting the measured value of the electrode 4 from the resistance value of the pseudo sheet structure 2 to which the electrode is attached.

The thickness of the electrode 4 is preferably 2 μm or more and 200 μm or less, more preferably 2 μm or more and 120 μm or less, and particularly preferably 10 μm or more and 100 μm or less. When the thickness of the electrode is within the above range, the electric conductivity is high and the resistance is low, so that the resistance value with the pseudo sheet structure can be suppressed low. Moreover, sufficient strength as an electrode can be obtained.

(Pseudo sheet structure forming process)
In the pseudo sheet structure forming process, first, the first film 1 including the process film 12 and the first resin layer 11 shown in FIG. 1A is prepared.
As the first film 1, it is preferable to prepare a film including the process film 12 and the first resin layer 11 in advance. The 1st film 1 can be produced by apply|coating the resin composition used as the raw material of the 1st resin layer 11 on the process film 12, for example.

In the pseudo sheet structure forming step, next, a pseudo sheet structure 2 in which a plurality of conductive linear bodies 21 as shown in FIG. 1B are arranged at intervals is provided on the first film 1.
The method for providing the pseudo sheet structure 2 is not particularly limited, and a known method can be appropriately adopted. For example, in a state where the first resin layer 11 of the first film 1 is arranged on the outer peripheral surface of a drum member (not shown), the conductive linear body 21 is spirally formed on the first resin layer 11 while rotating the drum member. Wrap it in a shape. Then, the bundle of the conductive linear bodies 21 wound in a spiral shape is cut along the axial direction of the drum member. As a result, the pseudo sheet structure 2 is formed and arranged on the first resin layer 11 of the first film 1. Then, the first film 1 on which the pseudo sheet structure 2 is formed is taken out from the drum member. According to this method, for example, while rotating the drum member, the feeding portion of the conductive linear member 21 is moved along the direction parallel to the axis of the drum member, so that the adjacent conductive members in the pseudo sheet structure 2 are moved. It is easy to adjust the interval L between the linear members 21.

(Electrode mounting process)
In the electrode attaching step, as shown in FIG. 1C, the electrode 4 is attached to the pseudo sheet structure 2.
The method of attaching the electrode 4 is not particularly limited, and a known method can be adopted as appropriate. For example, the electrode 4 is arranged on the first resin layer 11 of the first film 1 so that the conductive linear body 21 and the electrode 4 are in contact with each other. Then, the electrode 4 can be attached to the pseudo sheet structure 2 by thermocompression-bonding the electrode 4 to the first film 1.
The conditions for thermocompression bonding are not particularly limited, and can be set appropriately according to the type of the first resin layer 11.

(Step of attaching second resin layer)
In the second resin layer attaching step, first, the second film 3 including the process film 32 and the second resin layer 31 shown in FIG. 1(D) is prepared.
As the second film 3, it is preferable to previously prepare one including the process film 32 and the second resin layer 31. The second film 3 can be manufactured by the same method as the first film 1.
In the second resin layer attaching step, next, as shown in FIG. 1D, the second film 3 is attached to the first film 1 so that the second resin layer 31 and the pseudo sheet structure 2 are in contact with each other. And paste.
At this time, if at least one of the first resin layer 11 and the second resin layer 31 is a layer containing an adhesive, the second film 3 can be easily attached to the first film 1.

(Curing process)
In the curing step, at least one of the first resin layer 11 and the second resin layer 31 is cured.
The curing conditions are not particularly limited and can be appropriately selected according to the type of resin composition. For example, a case where at least one of the first resin layer 11 and the second resin layer 31 is energy ray curable will be described as an example, as follows. Conditions of curing by energy ray varies depending on the energy ray to be used, for example, when cured by ultraviolet irradiation, irradiation amount of ultraviolet rays is preferably at 10 mJ / cm ² or more 3,000 mJ / cm ² or less, the irradiation time Is preferably 1 second or more and 180 seconds or less.

(Process film peeling process)
In the process film peeling process, as shown in FIG. 1(E), at least one of the process films 12 and 32 is peeled from at least one of the cured first resin layer 11 and the second resin layer 31. In this manner, the first resin layer 11, the second resin layer 31, and the pseudo sheet structure 2 provided between the first resin layer 11 and the second resin layer 31 shown in FIG. 2 are provided. The sheet-shaped conductive member 100 can be manufactured.
The method of peeling the process films 12 and 32 is not particularly limited, and a known method can be appropriately adopted.
At this time, the peeling force between the process films 12 and 32 and the resin layer in contact therewith is preferably 5 mN/100 mm or more and 2000 mN/100 mm or less, and more preferably 20 mN/100 mm or more and 1250 mN/100 mm or less.
The peeling force of the process films 12 and 32 is, for example, a sample (width: 100 mm, length: 100 mm) including the process films 12 and 32 and the first resin layer 11 or the second resin layer 31 is fixed, and a tensile tester is used. The peeling force at the interface between the process film 12, 32 and the first resin layer 11 or the second resin layer 31 is measured by pulling the process film 12, 32 in the 180° direction at a speed of 300 mm/min using It is possible (unit: mN/100 mm).
It is preferable to provide a difference between the peeling force between the process film 12 and the first resin layer 11 and the peeling force between the process film 32 and the second resin layer 31. By providing the difference, only one of the process films can be easily peeled off. The difference in peeling force is 20 mN/25 mm or more, more preferably 40 mN/25 mm or more, and further preferably 80 mN/25 mm or more.

(Sheet-like conductive member)
As shown in FIG. 2, the sheet-shaped conductive member 100 according to the present embodiment is provided with a first resin layer 11, a second resin layer 31, and between the first resin layer 11 and the second resin layer 31, A sheet-shaped conductive member 100 comprising: a pseudo sheet structure 2 in which a plurality of conductive linear bodies 21 are arranged at intervals, wherein the sheet-shaped conductive member 100 has a thickness of 7 μm or more and 200 μm or less, The storage elastic modulus of the conductive member 100 at a temperature of 25° C. is 5.0×10 ⁷ Pa or more and 5.0×10 ¹⁰ Pa or less.
The sheet-shaped conductive member 100 can be manufactured by the method for manufacturing a sheet-shaped conductive member according to the present embodiment.
According to the method for manufacturing a sheet-shaped conductive member according to the present embodiment, the sheet-shaped conductive member 100 having a sufficiently thin thickness and self-supporting property can be efficiently manufactured. That is, according to the method for manufacturing a sheet-shaped conductive member according to the present embodiment, the thickness of the sheet-shaped conductive member 100 is 7 μm or more and 200 μm or less (more preferably 10 μm or more and 100 μm or less, particularly preferably 10 μm or more and 50 μm). And the storage elastic modulus at 25° C. of at least one of the first resin layer 11 and the second resin layer 31 is 5.0×10 ⁷ Pa or more and 5.0×10 ¹⁰ Pa or less (more preferably, The sheet-shaped conductive member 100 having a thickness of 1.0×10 ⁸ Pa or more and 1.0×10 ¹⁰ Pa or less) can be efficiently produced. The storage elastic modulus of the sheet-shaped conductive member 100 after being dried or cured is measured by the tensile mode.
Further, when the storage elastic modulus is within the above range, the adhesion (resistance stability) to the electrode of the sheet-shaped conductive member, heat resistance and impact resistance can be improved.
The storage elastic modulus at a temperature of 25° C. before drying or curing of at least one of the first resin layer 11 and the second resin layer 31 is 1.0×10 ³ Pa or more and 2.5×10 ⁵ Pa or less. Is preferred. The storage elastic modulus before drying or curing is measured by the torsion shear method.
Details of the method for measuring the storage elastic modulus at 25° C. are described in the section of Examples.

(Operation and effect of the first embodiment)
According to this embodiment, the following operational effects can be achieved.
(1) In the present embodiment, the sheet-like conductive material having a thickness of 7 μm or more and 200 μm or less and a storage elastic modulus at a temperature of 25° C. of 5.0×10 ⁷ Pa or more and 5.0×10 ¹⁰ Pa or less. The member 100 is obtained.
(2) In the present embodiment, the electrode 4 is provided so as to be sandwiched between the first resin layer 11 and the second resin layer 31. Therefore, in the sheet-shaped conductive member 100, the adhesion between the conductive linear body 21 and the electrode 4 can be improved.
(3) By adjusting the thickness of the first resin layer 11 and the second resin layer 31, the position of the pseudo sheet structure 2 in the sheet-shaped conductive member 100 can be adjusted. For example, if the first resin layer 11 and the second resin layer 31 have the same thickness, the position of the pseudo sheet structure 2 can be adjusted to the center.
(4) Since the pseudo sheet structure 2 is covered with the first resin layer 11 and the second resin layer 31, electric leakage can be prevented.
(5) The conductive linear body 21 can be protected by curing at least one of the first resin layer 11 and the second resin layer 31. When one of the first resin layer 11 and the second resin layer 31 is cured, the other can be used as an adhesive layer and attached to an adherend.

[Second embodiment]
Next, a second embodiment of the present invention will be described based on the drawings.
In addition, in the present embodiment, the first resin layer 11 and the second resin layer 31 are non-curable layers and have the same configuration as the first embodiment except that a drying step is performed instead of the curing step. The first resin layer 11, the second resin layer 31, and the drying step will be described, and the other points common to the previous description will be omitted.
FIG. 3A to FIG. 3E are views for explaining the method of manufacturing the sheet-shaped conductive member according to the present embodiment.

The first resin layer 11 and the second resin layer 31 used in the present embodiment may not be curable and may be layers made of a thermoplastic resin composition, for example. And a thermoplastic resin layer can be softened by making a solvent contain in a thermoplastic resin composition. Thereby, when forming the pseudo sheet structure 2 on the first film 1, the conductive linear body 21 can be easily attached to the first resin layer 11. On the other hand, by volatilizing the solvent in the thermoplastic resin composition, the thermoplastic resin layer can be dried and solidified. Thereby, the sheet-shaped conductive member 100 can be provided with self-supporting property.
Either one of the first resin layer 11 and the second resin layer 31 may be the same as the first resin layer 11 and the second resin layer 31 used in the first embodiment.

Examples of the thermoplastic resin include polyethylene, polypropylene, polyvinyl chloride, polystyrene, polyvinyl acetate, polyurethane, polyether, polyether sulfone, polyimide and acrylic resin.
Examples of the solvent include alcohol solvents, ketone solvents, ester solvents, ether solvents, hydrocarbon solvents, alkyl halide solvents and water.
In addition, the first resin layer 11 and the second resin layer 31 used in the present embodiment contain other components such as an inorganic filler as in the first resin layer 11 and the second resin layer 31 used in the first embodiment. May be included.

In this embodiment, as shown in FIGS. 3A and 3B, the pseudo sheet structure forming step is performed. This pseudo sheet structure forming step is the same as the pseudo sheet structure forming step of the first embodiment except that the above-mentioned non-curable layer is used as the first resin layer 11.
In this embodiment, next, as shown in FIG. 3C, an electrode attaching step is performed. This electrode attaching step is the same as the electrode attaching step of the first embodiment.

In the present embodiment, next, as shown in FIG. 3D, a second resin layer attaching step is performed. This second resin layer attaching step is the same as the second resin layer attaching step of the first embodiment except that the second film 3 made of the second resin layer 31 is attached.

In this embodiment, a drying process is performed after the second resin layer attaching process. This drying step is a step performed instead of the curing step of the first embodiment. In this drying step, at least one of the first resin layer 11 and the second resin layer 31 is dried. In this embodiment, since there is no film or the like covering the second resin layer 31, the drying step can dry at least one of the first resin layer 11 and the second resin layer 31.
The drying condition is not particularly limited and can be appropriately selected depending on the types of the resin composition and the solvent.

In the present embodiment, next, as illustrated in FIG. 3E, the process film 12 is peeled from the dried first resin layer 11. The method of peeling the process film 12 is the same as the process film peeling process of the first embodiment.
In this way, the sheet-shaped conductive member 100A can be manufactured.

(Operation and effect of the second embodiment)
According to the present embodiment, the same operational effects as the operational effects (1) to (4) in the first embodiment and the following operational effect (5′) can be exhibited.
(5′) The conductive linear body 21 can be protected by drying at least one of the first resin layer 11 and the second resin layer 31. When one of the first resin layer 11 and the second resin layer 31 is dried, the other can be used as an adhesive layer to be adhered to an adherend.

[Third embodiment]
Next, a third embodiment of the present invention will be described based on the drawings.
The present embodiment has the same configuration as the first embodiment except that the electrode attaching step is performed as a step subsequent to the second resin layer attaching step. Therefore, the second resin layer attaching step and the electrode attaching step will be described. However, other points that are common to the previous description are omitted.
4(A) to 4(E) are views for explaining the method for manufacturing the sheet-shaped conductive member according to the present embodiment.

In this embodiment, as shown in FIGS. 4A and 4B, the pseudo sheet structure forming step is performed. This pseudo sheet structure forming step is the same as the pseudo sheet structure forming step of the first embodiment.

In the present embodiment, next, as shown in FIG. 4C, a second resin layer attaching step is performed. In the second resin layer attaching step, as shown in FIG. 4C, the second film 3 is attached to the first film 1 so that both ends of the conductive linear body 21 in the axial direction are not covered. .. Therefore, part 1A of the first film 1 is not covered with the second film 3.
In the present embodiment, the curing step is performed after the second resin layer attaching step. This curing process is the same as the curing process of the first embodiment.

In the present embodiment, next, as shown in FIG. 4D, an electrode attaching step is performed. In this electrode attaching step, the electrode 4 is attached to the part 1A of the first film 1 which is not covered with the second film 3. The method of attaching the electrode 4 is the same as the electrode attaching step of the first embodiment.

In the present embodiment, next, as shown in FIG. 4E, a process film peeling process is performed. This process film peeling process is the same as the process film peeling process of the first embodiment.
In this way, the sheet-shaped conductive member 100B can be manufactured.

(Operation and effect of the third embodiment)
According to the present embodiment, the same operational effects as the operational effects (1) and (3) to (5) in the first embodiment, and the following operational effect (6) can be exhibited.
(6) The electrode 4 can be provided after attaching the first resin layer 11 and the second resin layer 31. Therefore, when the sheet-shaped conductive member 100B is manufactured, the timing at which the electrode 4 is provided is not limited, and the degree of freedom in design can be increased.

[Modification of Embodiment]
The present invention is not limited to the above-described embodiments, but includes modifications and improvements as long as the object of the present invention can be achieved.
For example, in the above-described embodiment, the electrode 4 is attached to the first film 1, but the present invention is not limited to this. For example, the sheet-shaped conductive member 100 may not include the electrode 4. The electrode 4 may be provided in advance in an article to which the sheet-shaped conductive member is attached, and the sheet-shaped conductive member 100 may be attached so that the pseudo sheet structure 2 contacts the electrode 4.
In the above-described embodiment, the step film peeling step is performed in the method for manufacturing the sheet-shaped conductive member 100, but the present invention is not limited to this. For example, the person who uses the sheet-shaped conductive member 100 may perform the step film peeling step at the time of use.

(Application of sheet-shaped conductive member)
When the sheet-shaped conductive member 100 is used as a heating element (film heater), examples of applications of the heating element include a defogger and a deicer. In this case, the adherends include, for example, mirrors of bathrooms, windows of transportation devices (passenger cars, railways, ships, aircrafts, etc.), windows/wallpapers of buildings, eyewear, lighting surfaces of traffic lights, and signs. Are listed. In recent years, heaters have been used for temperature control of batteries of electric vehicles, and thin heaters are suitable for individual temperature control of laminated cells. It can also be used as a flat cable for wiring electrical signals.

Hereinafter, the present invention will be described more specifically with reference to Examples. However, each of these examples does not limit the present invention. In addition, the curable monomer, the polymerization initiator, and the like used in Examples and the like are all described on the basis of solid content.

[Example 1]
As a polymer component, 100 parts by mass of a pellet of polyimide resin (PI) (Kawamura Sangyo Co., Ltd., trade name “KPI-MX300F”, Tg=354° C.) was used as a solvent (methyl ethyl ketone:MEK and toluene weight ratio 1:1). 15% by mass of PI to prepare a 15% by mass solution of PI. Next, to this solution, 220 parts by mass of dicyclopentadiene diacrylate (manufactured by Shin-Nakamura Chemical Co., Ltd., trade name "A-DCP") as a curable monomer, and bis(2,4,6) as a polymerization initiator. -Trimethylbenzoyl)-phenyl-phosphine oxide (manufactured by BASF, trade name "Irgacure819") 4.4 parts by mass was added and mixed to prepare a curable resin composition.
Next, the curable resin composition is applied to a process film (manufactured by Lintec Co., Ltd., trade name “SP-PET382150”), and the obtained coating film is heated at 90° C. for 3 minutes to dry the coating film, The first resin layer was formed. A release film (manufactured by Lintec Co., Ltd., trade name “SP-PET381130”) was attached to the formed resin layer side to obtain a first film having a resin layer thickness of 10 μm. A second resin layer was formed in the same manner as the first film to produce a second film.
A tungsten wire (diameter 14 μm, manufacturer name: manufactured by Tokusai Co., Ltd., product name: TGW-CS, hereinafter referred to as “wire”) was prepared as a conductive linear body.
Next, the first film was wound around a drum member having an outer peripheral surface made of rubber so that the release film was on the outer side without wrinkles, and then both ends of the first film in the circumferential direction were fixed with double-sided tape. Then, the release film is peeled off to expose the first resin layer, and the wire wound around the bobbin is attached to the surface of the first resin layer located near the end of the drum member, and then the wire member is fed while the drum member is being unwound. Then, the drum member was gradually moved in a direction parallel to the drum axis, and the wire was wound around the drum member while drawing a spiral at equal intervals.
In this way, a plurality of wires were provided on the surface of the first resin layer while keeping the distance between the adjacent wires constant, and the first film with a wire was formed. The wires were provided at equal intervals, and the intervals were 2.5 mm. The first film with a wire was cut in parallel with the drum axis to produce a first film with a pseudo sheet structure. Next, as an electrode, a copper foil (thickness 10 μm, width 10 mm) was placed on both ends of the wire in a direction orthogonal to the extending direction of the wire, the electrodes were attached, and a first film with an electrode was obtained. After that, the second film from which the release film was peeled off was attached to the surface of the first film with electrodes on which the wires were arranged.
Further, using a belt conveyor type ultraviolet irradiation device (manufactured by Eye Graphics, product name: ECS-401GX), a high-pressure mercury lamp (manufactured by Eye Graphics, product name: H04-L41), an ultraviolet lamp height of 100 mm, Curing reaction is performed under the conditions that the ultraviolet lamp output is 3 kW, the illuminance at a light wavelength of 365 nm is 400 mW/cm ² , and the light amount is 800 mJ/cm ² (measured by UV light meter UV-351 manufactured by Oak Manufacturing Co., Ltd.), and then the process The film was peeled off to prepare a sheet-shaped conductive member. The peeling force of the process film at this time was 50 mN/100 mm. Further, the thickness of the obtained sheet-shaped conductive member is 22 μm.

[Resistance value]
A tester was applied to the electrode portion of the sheet-shaped conductive member to measure the resistance value. Immediately after the production (after thermosetting), a resistance value was measured after applying a voltage of 10 V and energizing for 1 hour, and a change rate (%) of the resistance value was obtained based on the following formula.
Rate of change in resistance value (%)={(resistance value of test piece after energization)-(resistance value of test piece immediately after fabrication)}/(resistance value of test piece immediately after fabrication)×100
Then, the resistance value was evaluated according to the following criteria. The results obtained are shown in Table 1. Note that the smaller the rate of change of the resistance value, the harder the sheet-shaped conductive member is and the higher the self-sustaining property, and thus the electrically conductive linear body and the electrode are electrically well connected.
-Judgment criteria-
A: Resistance change rate is less than 10% B: Resistance change rate is 10% or more

[Storage elastic modulus at 25° C. before drying or curing]
A test piece A having a diameter of 8 mm and a thickness of 1 mm was formed by applying the same composition as the composition forming the layer to be measured under the same conditions as in Examples and the like. The shear storage modulus G′ of the test piece A was measured by the torsion shearing method under the measurement conditions shown below, and the obtained value was defined as the storage modulus at 25° C. (unit: MPa). The results obtained are shown in Table 1.

-Measurement conditions-
・Measuring device: viscoelasticity measuring device (manufactured by Anton Paar, device name "MCR300")
・Test start temperature: -20°C
・Test end temperature: 150℃
・Raising rate: 3℃/min ・Frequency: 1Hz ・Measuring temperature: 25℃

[Storage elastic modulus at 25° C. after drying or curing]
A test piece B having a width of 5 mm, a length of 10 mm, and a thickness of 0.1 mm was formed by curing the same composition as the composition forming the layer to be measured under the same conditions as in Examples and the like. Under the measurement conditions shown below, the shear storage elastic modulus G′ of the test piece B was measured by the measurement in the tensile mode, and the obtained value was defined as the storage elastic modulus at 25° C. (unit: MPa). The results obtained are shown in Table 1.

-Measurement conditions-
・Measuring device: manufactured by TA Instruments, dynamic elastic modulus measuring device "DMA Q800"
・Test start temperature: 0℃
・Test end temperature: 150℃
・Rate of heating: 3℃/min ・Frequency: 1Hz
・Amplitude: 5 μm
・Measuring temperature: 25℃

[Breaking stress]
The sheet-shaped conductive member was cut into a test piece having a width of 15 mm and a length of 150 mm (the longitudinal direction was parallel to the wire), and the distance between chucks was set to 100 mm by a tensile tester (manufactured by Shimadzu Corporation, Autograph). Then, a tensile test was performed at a speed of 200 mm/min to measure the breaking stress [N].
The results obtained are shown in Table 1.

As shown in the results shown in Table 1, it was confirmed that the film heater obtained in Example 1 had a small change rate of the resistance value and had the self-sustaining property despite the thin thickness of 22 μm. It was also confirmed that when the storage elastic modulus of the resin layer was high as in Example 1, the breaking stress was also high.

DESCRIPTION OF SYMBOLS 1... 1st film, 11... 1st resin layer, 12... Process film, 2... Pseudo sheet structure, 21... Conductive linear body, 3... 2nd film, 31... 2nd resin layer, 32... Process film 4,... Electrodes, 100, 100A, 100B... Sheet-shaped conductive members.

Claims (9)

A step of providing a pseudo sheet structure in which a plurality of conductive linear bodies are arranged at intervals on a first film including a process film and a first resin layer;
A step of attaching a second film having a second resin layer to the first film so that the second resin layer and the pseudo sheet structure are in contact with each other;
And a step of drying or curing at least one of the first resin layer and the second resin layer,
A method for manufacturing a sheet-shaped conductive member. The method for manufacturing a sheet-shaped conductive member according to claim 1,
Further comprising the step of attaching an electrode to the pseudo sheet structure,
A method for manufacturing a sheet-shaped conductive member. The method for manufacturing a sheet-shaped conductive member according to claim 1 or 2,
The second film further includes a process film,
A method for manufacturing a sheet-shaped conductive member. The method for manufacturing a sheet-shaped conductive member according to any one of claims 1 to 3,
Further comprising a step of peeling the step film from at least one of the first resin layer and the second resin layer after being dried or cured.
A method for manufacturing a sheet-shaped conductive member. The method for manufacturing a sheet-shaped conductive member according to claim 4,
The peeling force of the process film is 5 mN/100 mm or more and 2000 mN/100 mm or less,
A method for manufacturing a sheet-shaped conductive member. The method for manufacturing a sheet-shaped conductive member according to any one of claims 1 to 5,
At least one of the first resin layer and the second resin layer is energy ray curable,
A method for manufacturing a sheet-shaped conductive member. The method for manufacturing a sheet-shaped conductive member according to any one of claims 1 to 5,
Both the first resin layer and the second resin layer are energy ray curable,
A method for manufacturing a sheet-shaped conductive member. The method for manufacturing a sheet-shaped conductive member according to any one of claims 1 to 7,
The total thickness of the first resin layer and the second resin layer is 7 μm or more and 500 μm or less,
A method for manufacturing a sheet-shaped conductive member. A first resin layer, a second resin layer, and a pseudo sheet structure provided between the first resin layer and the second resin layer and having a plurality of conductive linear bodies arranged at intervals. A sheet-shaped conductive member,
The thickness of the sheet-shaped conductive member is 7 μm or more and 200 μm or less,
The storage elastic modulus at a temperature of 25° C. of at least one of the first resin layer and the second resin layer is 5×10 ⁷ Pa or more and 5.0×10 ¹⁰ Pa or less.
Sheet-shaped conductive member.

Images