JP2020112522A - Working device, and method for acquiring tool length in working device - Google Patents

Abstract

To suppress an increase in manufacturing costs following loading of a light source when loading the light source for achieving a function of clearly expressing a worked place visually and a function of measuring a tool length.SOLUTION: A tool length of a tool is acquired based on a detection result when a tool is moved in a Z-axis direction in light detection means for detecting visible light emitted from a light source such that visible light emitted from the light source for emitting visible light applied to a worked place when working a workpiece crosses the axis of rotation around the Z axis of the tool.SELECTED DRAWING: Figure 3

Description

The present invention relates to a processing device and a method for acquiring a tool length in the processing device. More specifically, the present invention relates to a processing apparatus equipped with a light source that emits visible light, such as a laser pointer for visually identifying a processing location, and a method for obtaining a tool length in the processing apparatus.

In general, as a processing apparatus, various processing apparatuses such as end mills and cutters that are equipped with a tool for processing a workpiece for cutting or cutting the workpiece are known.

Such a processing apparatus is provided with a variable mechanism capable of changing the relative positional relationship between the tool and the workpiece in the three-dimensional directions (the XYZ directions in the XYZ orthogonal coordinate system). While changing the relative positional relationship with the work piece in the three-dimensional direction, the work piece is processed by a tool to obtain a product having a desired shape.

Here, in the processing apparatus as described above, in order to visually clearly indicate the processing location when processing the workpiece with the tool by a light spot by irradiation of visible light, a so-called laser pointer A device including a light source that emits visible light is known.

Further, in the conventional processing apparatus as described above, in order to obtain high-precision processing accuracy, the length of the tool mounted on the processing apparatus (in the present specification and claims, The length of the tool mounted on the device is referred to as the "tool length" as appropriate.) is equipped with a function to measure using light, and there is also known a technology for processing using the measured tool length. There is.

By the way, conventionally, in a processing device equipped with a light source that emits visible light such as a laser pointer for visually clearly showing a processing location, and a function of measuring a tool length using light, as a light source, It is necessary to mount two light sources such as a laser pointer or other light source that emits visible light for visually indicating the location and a light source that emits light for measuring the tool length, resulting in high manufacturing cost. There was a problem.

The present invention has been made in view of the above problems of the conventional technique, and an object thereof is to realize a function of visually demonstrating a machining location and a function of measuring a tool length. It is intended to provide a processing apparatus and a method for obtaining a tool length in the processing apparatus, which suppresses a high manufacturing cost accompanying the mounting of the light source when mounting the light source.

In order to achieve the above object, the processing apparatus and the method for acquiring the tool length in the processing apparatus according to the present invention measure the function of visually demonstrating the processing location and the tool length by a single light source that emits visible light. It realizes functions and functions.

Therefore, according to the processing apparatus and the method for acquiring the tool length in the processing apparatus according to the present invention, conventionally, two are required to realize the function of visually indicating the processing location and the function of measuring the tool length. Since the number of the light sources can be halved, it is possible to suppress the high manufacturing cost associated with mounting the light sources.

That is, the machining apparatus according to the present invention changes the relative positional relationship between the tool rotating around the Z axis in the XYZ orthogonal coordinate system and the workpiece in the three-dimensional directions, which are the XYZ directions, while the tool performs the machining. In a processing device for processing an object, it emits visible light and fixedly at a preset Z-axis direction position without moving following the movement of the tool rotating around the Z-axis in the Z-axis direction. The tool is disposed so as to be movable in accordance with the movement of the tool in the XY plane direction, and is arranged in a positional relationship where the rotation axis around the Z axis of the tool and the emitted visible light intersect. A light source provided, a light detection means capable of detecting visible light emitted from the light source, and fixedly arranged at a preset position, and a movement of the light source in the XY plane direction. Accordingly, the position of the light source in the XY plane direction when the visible light emitted from the light source is detected by the light detection unit, the position in the XY plane direction where the light detection unit is arranged, and the light source are arranged. An emission angle acquisition unit that acquires an emission angle of the visible light emitted from the light source that is inclined with respect to the Z axis based on the established Z-axis direction position, and when the emission angle acquisition unit acquires the emission angle. At the position of the light source in the XY plane direction, the tool length of the tool is acquired based on the detection result of visible light detected by the light detection means when the tool is moved in the Z-axis direction. And means.

The processing apparatus according to the present invention is the processing apparatus according to the present invention, further including: the emission angle acquired by the emission angle acquisition unit, the tool length acquired by the tool length acquisition unit, and the workpiece. On the basis of the height position in the Z-axis direction of the workpiece, the positional relationship between the irradiation position of the visible light emitted from the light source on the workpiece and the tip of the tool is acquired, and the workpiece is processed. And a control means for controlling the movement of the tool to the irradiation position on the object.

Further, in the processing apparatus according to the present invention, in the processing apparatus according to the present invention, the control means sets the tool length acquired by the tool length acquisition means and the height position of the workpiece in the Z-axis direction. Based on the above, the tool controls the processing depth for processing the workpiece.

Further, in the processing apparatus according to the present invention, in the processing apparatus according to the present invention, the emission angle acquisition unit is provided with the position in the XY plane direction of the light source from the coordinate value with respect to the origin position and the optical inspection unit. And the position in the XY plane direction are acquired.

The processing apparatus according to the present invention is the processing apparatus according to the above-mentioned present invention, wherein the light source is a laser light source and the light detecting means is a photodiode.

The processing apparatus according to the present invention is the processing apparatus according to the above-mentioned present invention, wherein the laser light source is a laser pointer.

Further, the method for acquiring the tool length in the processing apparatus according to the present invention is such that the relative positional relationship between the tool rotating around the Z axis in the XYZ orthogonal coordinate system and the workpiece is changed in the three-dimensional directions that are the XYZ directions. In the method of acquiring the tool length in a processing device that processes the workpiece with the tool, visible light emitted from a light source that emits visible light that illuminates a processing portion when processing the workpiece is the tool. Based on the detection result when the tool is moved in the Z-axis direction in the light detecting means for detecting the visible light emitted from the light source so as to intersect the rotation axis around the Z-axis of The tool length of is acquired.

The method for acquiring the tool length in the processing apparatus according to the present invention is the method for acquiring the tool length in the processing apparatus according to the present invention, in which the light source is a laser light source and the light detecting means is a photodiode. It is the one.

The method for acquiring the tool length in the processing apparatus according to the present invention is the method for acquiring the tool length in the processing apparatus according to the present invention, wherein the laser light source is a laser pointer.

INDUSTRIAL APPLICABILITY Since the present invention is configured as described above, when mounting a light source that realizes a function of visually demonstrating a processed portion and a function of measuring a tool length, a high manufacturing cost associated with mounting the light source is required. It has an excellent effect that it can be suppressed.

FIG. 1 is a schematic configuration perspective explanatory view schematically showing a configuration of a processing apparatus according to an example of an embodiment of the present invention. FIG. 2 is a schematic configuration explanatory diagram as viewed in the direction of arrow A, schematically showing the configuration of the processing apparatus shown in FIG. 1 in a state where the front cover member is opened. FIG. 3 is a schematic explanatory view showing an arrangement of respective constituent members such as a laser light source as a visible light source mounted on the processing apparatus shown in FIGS. 1 and 2. FIG. 4 is a block configuration explanatory diagram showing a functional configuration of a microcomputer related to the implementation of the present invention. FIG. 5 is a flowchart showing the processing routine of the main routine executed by the microcomputer in connection with the implementation of the present invention. FIG. 6 is a flowchart showing a tool length measurement mode processing routine which is a subroutine of a processing routine of a main routine executed by the microcomputer in connection with the implementation of the present invention. FIG. 7 is an explanatory diagram of a method of acquiring the emission angle of light (visible laser light) emitted from a laser pointer that is visible light. FIG. 8 is an explanatory diagram of a method of acquiring the tool length of the tool. FIG. 9 is an explanatory diagram showing a method of acquiring the positional relationship between the position of the light spot on the work emitted from the laser pointer and the tip of the tool.

Hereinafter, an example of an embodiment of a processing apparatus and a tool length acquisition method in the processing apparatus according to the present invention will be described in detail with reference to the accompanying drawings.

Here, FIG. 1 shows a schematic configuration perspective explanatory view schematically showing a configuration of a processing apparatus according to an example of an embodiment of the present invention.

In addition, FIG. 2 shows a schematic configuration explanatory view as seen from an arrow A, which schematically shows the configuration of the processing apparatus shown in FIG. 1 in a state where the front cover member is opened.

The processing apparatus 10 according to an example of the embodiment of the present invention shown in FIGS. 1 and 2 is mounted on a table 14 serving as a reference surface fixed on a bottom plate 12 (which is a bottom plate of a housing 26 described later). The processing 16 output from a host computer (not shown) such as a personal computer to the placed workpiece 16 by the control of a processing operation mode processing unit 18c (described later) of the microcomputer 18. In response to a signal for indicating the range, a laser pointer 32 (described later) irradiates the work 16 with visible laser light as light (visible light) to indicate a processing range, or a host computer such as a personal computer. The workpiece 16 is processed by the tool 22 attached to the spindle 20 according to the processing function (the cutting function or the cutting function) of the tool 22 according to the signal of the processing data output from (not shown). To do.

The processing apparatus 10 has a main body 28 including various mechanisms including the above-described table 14 in a work area 26a of a housing 26 having a front cover member 24 that can be opened and closed.

An operation panel 30 is provided at one end of the housing 26 of the processing device 10.

The main body 28 disposes the spindle 20 to which the tool 22 is attached so as to be movable in the vertical direction (the vertical direction which is the Z-axis direction in the XYZ orthogonal coordinate system shown by the arrow Z in FIGS. 1 and 2), and also the laser. The head unit 34 in which the pointer 32 is fixedly arranged in the XYZ rectangular coordinate system is moved in the main scanning direction which is the first direction (the left-right direction which is the X-axis direction in the XYZ rectangular coordinate system shown by the arrow X in FIGS. 1 and 2). The guide rail 36 serves as a guide when moving to (1).

The head unit 34 is moved via a wire (not shown) by driving a motor (not shown) along a guide rail 36 extending in the main scanning direction.

The laser pointer 32 is the only light source that emits visible light mounted on the processing device 10. The laser pointer 32 is a light spot that irradiates visible light (visible laser light) at the processing point when the work piece 16 is processed by the tool 22. It is a laser light source that is visually specified.

That is, the processing apparatus 10 includes, as a single light source that emits visible light, a laser pointer 32 that emits visible laser light that visually indicates a processing point when processing the work 16 by a light spot. In the present embodiment, the laser pointer 32 is arranged on the left side of the spindle 20.

The guide rail 36 is arranged in a sub-scanning direction (arrow Y in FIG. 1) which is a second direction orthogonal to the main scanning direction with respect to the left side wall portion 26L and the right side boundary wall portion 26R of the housing 26. The guide rail 36 is moved in the sub-scanning direction by driving a motor (not shown).

In the processing apparatus 10, a photodetector 38 such as a photodiode for detecting visible light (visible laser light) emitted from the laser pointer 32 is arranged on the table 14 serving as a reference surface. In the present embodiment, the photodetector 38 is arranged at the right end of the table 14.

In the main body portion 28, the head unit 34 moves in the main scanning direction (X axis direction), the guide rail 36 moves in the sub scanning direction (Y axis direction), and the spindle 20 with the tool 22 attached A variable mechanism capable of changing the relative positional relationship between the tool 22 and the work 16 in the three-dimensional directions (XYZ directions) is constructed by the mechanism that moves in the vertical direction (Z-axis direction).

Further, in this variable mechanism, the spindle 20 to which the tool 22 is attached moves in the vertical direction (X-axis direction), so that the tool 22 moves in the vertical direction (X-axis direction) and is fixed at the Z-axis direction position. The positional relationship between the visible laser light L emitted from the laser pointer 32 and the tool 22 arranged in a vertical direction changes in the vertical direction (Z-axis direction) (see FIGS. 3 and 8).

Further, in this variable mechanism, the head unit 34 moves in the main scanning direction (X axis direction) and the guide rail 36 moves in the sub scanning direction (Y axis direction), so that the visible light emitted from the laser pointer 32 is visible. The positional relationship between the light (visible laser light) L and the photodetector 38 changes in the XY plane direction which is the two-dimensional direction parallel to the reference plane (see FIGS. 3 and 7).

On the operation panel 30, in addition to the display unit 30a for displaying the operation state, a tool length measurement mode selection operator 30b for selecting and starting the tool length measurement mode as an operation mode, and a laser pointer 32 as an operation mode. For instructing various operations including an operation indicating a processing range for the work 16 and a processing operation mode selection operator 30c for selecting and starting a processing operation mode in which the tool 22 performs the processing operation for the work 16. Operators and the like are provided.

The processing apparatus 10 controls the overall operation of the processing apparatus 10 in order to perform operations according to instructions from various operators such as the tool length measurement mode selection operator 30b and the processing operation mode selection operator 30c. A microcomputer 18 is installed.

FIG. 3 is a schematic explanatory view showing the arrangement of each component such as the laser pointer 32 which is a laser light source mounted on the processing apparatus 10 shown in FIGS. 1 and 2. With reference to FIG. 3, the arrangement relationship of the above-mentioned respective constituent members will be described in detail.

First, the laser pointer 32 and the photodetector 38 obtain the emission angle (inclination in the Z-axis direction) α of the visible laser light L emitted from the laser pointer 32 by a tool length measurement mode process (described later). The laser pointer 32 is fixed to the position indicated by the preset design value in the head unit 34, and the photodetector 38 is moved to the position indicated by the preset design value on the table 14 which is the reference plane. It is fixed.

Further, the laser pointer 32 and the tool 22 are emitted from the laser pointer 32 in order to detect the position of the tip end portion (lower end portion in the Z-axis direction) 22a of the tool 22 by a tool length measurement mode process (described later). The visible laser light L is fixed at a position indicated by a preset design value so that the visible laser light L crosses the rotation axis (tool rotation axis) B of the tool 22 above the work 16 in the work area 26a. There is.

In other words, a design in which the distance L1 (the length in the X-axis direction) between the laser light emission position (light emission point) 32a of the laser pointer 32 and the tool rotation axis B is set with reference to the preset origin position. The laser pointer 32 and the spindle 20 to which the tool 22 is attached are fixed to the head unit 34 at the positions indicated by the preset design values so that the values are constant. Therefore, the distance L1 is a known distance (design value).

Here, since the laser pointer 32 is fixed to the head unit 34, the laser pointer 32 does not follow the movement of the tool 22 attached to the spindle 20 that moves in the vertical direction (Z-axis direction), and the tool 22 Only follows the movement in the XY plane direction.

Further, in the photodetector 38, the distance L2 in the XY plane between the photodetector 38a and the light emitting point 32a of the laser pointer 32 is set to a constant value shown in a preset design value with reference to a preset origin position. Therefore, it is fixed at a position indicated by a preset design value on the table 14 as a reference surface. Further, the distance L7 in the Z-axis direction between the light detection unit 38a and the table 14 serving as the reference surface is the same as the distance from the ground surface of the light detection unit 38 to the table 14 to the light detection unit 38a. It is the set design value. Therefore, the distance L2 and the distance L7 are known distances (design values).

Further, from the above, the distance L3 in the Z-axis direction between the light detecting portion 38a of the light detector 38 and the light emitting point 32a of the laser pointer 32, the light emitting point 32a of the laser pointer 32, and the upper end portion of the tool 22 ( It is the upper end in the Z-axis direction and the boundary position with the lower end of the spindle 20.) The distance L4 between the upper end and the lower end of the spindle 20 is the laser pointer 32 and the spindle 20 described above with reference to a preset origin position. And are design values preset according to the fixed position. Therefore, the distance L3 and the distance L4 are known distances (design values).

Next, FIG. 4 shows a block configuration explanatory view showing a functional configuration of the microcomputer 18 related to the implementation of the present invention.

The microcomputer 18 has an operation mode monitoring determination unit 18a, a tool length measurement mode processing unit 18b, and a processing operation mode processing unit 18c as a functional configuration related to the implementation of the present invention.

The operation mode monitoring determination unit 18a monitors which of the tool length measurement mode selection operator 30b and the machining operation mode selection operator 30c has been operated, and which of the tool length measurement mode and the machining operation mode is the operation mode. Is selected.

The tool length measurement mode processing unit 18b is constructed by including an emission angle acquisition unit 18b-1 and a tool length acquisition unit 18b-2, and a tool length measurement mode process described later with reference to the flowchart shown in FIG. According to the routine, the output angle α is acquired by the control of the output angle acquisition unit 18b-1, and the tool length β (see FIG. 3) is acquired by the control of the tool length acquisition unit 18b-2. The operation of the entire processing device 10 is controlled.

The processing operation mode processing unit 18c irradiates the visible laser light from the laser pointer 32 to indicate the processing range for the work 16, and the output angle α acquired in the above processing and the Z-axis which is the vertical height of the work 16. By the distance (work height) L5 (measurement value) in the direction, the tool rotation axis B and the light point C (irradiation point of the laser pointer 32 on the work 16) on the work 16 to which light is irradiated from the laser pointer 32 The processing of obtaining the distance γ is performed, and the operation of the entire processing apparatus 10 is controlled so that the tool 22 performs the processing operation on the light point C irradiated with light from the laser pointer 32 on the work 16.

With the above configuration, the operation of the processing apparatus 10 relating to the implementation of the present invention will be described with reference to the flowchart shown in FIG.

Here, FIG. 5 is a flowchart showing the processing routine of the main routine executed by the microcomputer in connection with the implementation of the present invention.

When the power of the processing apparatus 10 is turned on, the processing routine shown in the flowchart of FIG. 5 is started, and in the processing of step S502, the tool length measurement mode selection operator 30b and the processing operation are controlled by the operation mode monitoring determination unit 18a. Which of the mode selection operators 30c has been operated is monitored to determine which of the tool length measurement mode and the machining operation mode has been selected as the operation mode.

When it is determined in the process of step S502 that the tool length measurement mode is selected as the operation mode, the process proceeds to step S504, and the tool length measurement mode process is performed by the control of the tool length measurement mode processing unit 18b. When the tool length measurement mode process of step S504 ends, the operation of the main routine ends.

Here, FIG. 6 is a flowchart showing a tool length measurement mode processing routine which is a subroutine of a processing routine of a main routine executed by the microcomputer in connection with the implementation of the present invention.

Further, FIG. 7 shows an explanatory diagram of a method of acquiring the emission angle α of the visible laser light L emitted from the laser pointer 32.

Further, FIG. 8 shows an explanatory diagram of a method of acquiring the tool length β of the tool 22.

Furthermore, in FIG. 9, the distance γ which is the distance (XY distance) in the XY plane direction between the light point C on the work 16 irradiated with the light from the laser Ponter 32 and the tool rotation axis B and the tip of the tool 22. An explanatory view of a method of acquiring a distance δ which is a distance (Z distance) in the Z-axis direction between the portion 22a and the upper surface of the work 16 is shown.

In this tool length measurement mode processing routine, the head unit 34 is moved on the XY plane under the control of the emission angle acquisition unit 18b-1, and the intensity of light that can be detected by the light detection unit 38a of the photodetector 38 is the highest. Using the position (coordinate value) of the light emitting point 32a of the laser pointer 32 at the larger position (detection position), the position (coordinate value) of the photodetector 38a in the photodetector 38, and the distance L3, the laser pointer 32 The emission angle α of the visible laser light emitted from is obtained by calculation.

In the tool length measurement mode processing routine, the light that can be detected by the photodetector 38a of the photodetector 38 according to the movement of the tool 22 in the Z-axis direction at the above-described detection position is controlled by the tool length acquisition unit 18b-2. The tool length β of the tool 22 is obtained by calculation using the distance L8, which can detect the change in the light amount of, the distance L1, the distance L4, and the emission angle α.

In addition, the distance L5 in the Z-axis direction, which is the vertical height of the work 16, is measured by an operator using a caliper or the like, or after the work 16 is set on the table 14 which is the reference surface, The measured value is a known distance measured by using a known technique for measuring the vertical distance L5 in the Z-axis direction of the workpiece 16 mounted on the machining apparatus.

In this tool length measurement mode processing routine, the light point C where the light is irradiated from the laser pointer 32 onto the work 16 and the tool rotation axis are used by using the distance L1, the distance L3, the distance L5, the distance L7 and the emission angle α. A distance γ, which is an XY distance from B, is obtained by calculation.

The distance δ to the upper surface of the work 16 at the tip 22a of the tool 22 is obtained by calculation using the distance L3, the distance L4, the distance L5, the distance L7, and the tool length β.

Further, when acquiring the position (coordinate value) associated with the movement of the tool 22, the origin position on the XY plane of the table 14, which is the reference surface, is set by a known technique mounted on a conventional processing apparatus ( For example, the coordinate value (0, 0, 0) in the XYZ orthogonal coordinate system is set as the origin position, and the position (coordinate value) may be acquired with the origin position as a reference.

Here, as described above, the laser pointer 32 does not follow the movement in the vertical direction (Z-axis direction) of the tool 22 attached to the spindle 20 that moves in the vertical direction (Z-axis direction), Since the tool 22 follows only the movement of the tool 22 in the XY plane direction, when the tool 22 is at the origin position, the XYZ spatial position of the light emitting point 32a of the laser pointer 32 and the photodetector 38a of the photodetector 38 is unique. It has been decided.

Further, as described above, the laser light emitted from the laser pointer 32 is set to have a positional relationship that intersects with the tool rotation axis B, and the light emitting point 32a of the laser pointer 32 and the tool rotation axis B are set. The distance L1 is uniquely determined.

Under the above-described premise, in the tool length measurement mode processing routine, first, as the processing of step S602, the emission angle α of the laser light emitted from the laser pointer 32 is acquired by the control of the emission angle acquisition unit 18b-1.

More specifically, by moving the head unit 34 on the XY plane, as shown in FIG. 7, the intensity of the visible laser light L emitted from the laser pointer 32 that can be detected by the photodetector 38a of the photodetector 38 is increased. The coordinate value X1 of the light emitting point 32a of the laser pointer 32 and the coordinate value X2 of the light detection unit 38a at the largest position (detection position) are acquired, and then the distance L6 between the coordinate value X1 and the coordinate value X2 is calculated. Acquire (distance L6=coordinate value X2-coordinate value X1).

Next, using the distance L6 and the distance L3,
Output angle α=tan ⁻¹ (distance L6/distance L3) Equation 1
The emission angle α is acquired by.

When the process of step S602 ends, the process proceeds to step S604, and the tool 22 is moved in the Z-axis direction at the detection position acquired in the process of step S602 by the control of the tool length acquisition unit 18b-2, The tool length β of the tool 22 is obtained by calculation by detecting a change in the amount of light that can be detected by the light detection unit 38a.

More specifically, as shown in FIG. 8, when the spindle 20 is moved downward in the Z-axis direction at the detection position described above, the tip 22a of the tool 22 is also moved downward as the spindle 20 is moved downward in the Z-axis direction. And the tip 22a of the tool 22 blocks the visible laser light L.

When the tip 22a of the tool 22 blocks the visible laser light L, the amount of light that can be detected by the photodetector 38a changes, and based on this change in the amount of light, the tip 22a of the tool 22 blocks the visible laser light L. Then, the distance L8 between the position coordinate Z2 in the Z-axis direction and the position coordinate Z1 at the start of movement is acquired (distance L8=position coordinate Z2-position coordinate Z1).

Next, using the distance L1, the distance L4, the distance L8 and the emission angle α,
Tool length β=(L1/tanα)−(L4+L8)...Equation 2
To obtain the tool length β of the tool 22 by calculation

When the processing of step S604 is completed, this tool length measurement mode processing routine is completed and the process returns to the main routine.

As described above, since the emission angle α and the tool length β are acquired by the tool length measurement mode process, as will be described later in the process of step S506, the emission angle α and the distance L5 which is the height of the workpiece are calculated. , Γ which is an XY distance between the position of the light spot C on the work 16 irradiated by the laser pointer 32 and the tool rotation axis B of the tool 22, and the distance δ between the tip 22a of the tool 22 and the upper surface of the work 16. Is calculated.

More specifically, as shown in FIG. 9, using the distance L1, the distance L3, the distance L5, the distance L7 and the emission angle α,
Distance γ=tan α×(L3−(L5+L7))−L1 Equation 3
Thus, the distance γ which is the XY distance between the light spot C on the work 16 irradiated by the laser pointer 32 and the tool rotation axis B of the tool 22 is obtained by calculation.

Since it is possible to obtain at which coordinate value the light point C on the work 16 is obtained from the laser pointer 32 by the distance γ, the processing range can be clearly indicated on the work 16 by the laser pointer 32.

Further, using the distance L3, the distance L4, the distance L5, the distance L7 and the tool length β,
Distance δ=L3+L7−(L4+L5+β) Equation 4
Thus, the distance δ, which is the Z distance between the tip portion 22a of the tool 22 and the upper surface of the work 16, can be obtained by calculation.

It is possible to set the processing depth to the work 16 by the distance δ and perform the processing.

In the process of step S502, when it is determined that the processing operation mode is selected as the operation mode, the process proceeds to step S506, and the visible laser light is emitted from the laser pointer 32 under the control of the processing operation mode processing unit 18c. When the machining operation mode process for machining the work 16 by the tool 22 is performed and the machining operation mode process of step S506 is completed, the operation of the main routine is completed.

Here, in the machining operation mode processing, the distance L5 in the Z-axis direction, which is the height in the vertical direction of the work 16, is acquired by the above-described processing, and the tool angle measurement mode processing routine outputs the emission angle α and the tool length β of the tool 22. Therefore, if the machining depth of the tool 22 on the work 16 is set in advance, the movement distance of the tool 22 in the Z-axis direction can be automatically calculated and obtained by the microcomputer 18.

Further, the coordinate value of the light emitting point 32a of the laser pointer 32 on the XY plane is a known value acquired from the above design values, and the emission angle α of the laser pointer is acquired by the tool length measurement mode processing routine. Therefore, where on the work 16 the laser light emitted from the laser pointer 32 is irradiated, that is, the coordinate value of the light point of the laser light emitted from the laser pointer 32 on the work 16 is automatically detected by the microcomputer 18. Can be calculated and obtained.

Therefore, it suffices to move the tip end portion 22a of the tool 22 to the coordinate value of the light point C of the laser light acquired as described above. It can be visually indicated by the light spot C due to the irradiation of the laser light.

It should be noted that, as for the processing of processing the work 16 in accordance with the signal of the processing data other than the above processing, the tool 22 may be moved by applying a conventionally known technique, and thus detailed description thereof will be omitted. ..

As described above, according to the processing apparatus 10 of the present invention, the function of the light source used for measuring the tool length and the function of the light source used for visually confirming the processing location are set as visible light. Since it can be realized by the laser pointer 32 that is a single light source that emits light, it is possible to significantly reduce the manufacturing cost associated with mounting the light source as compared with the conventional technique.

The above-described embodiment is merely an example, and the present invention can be implemented in various other modes. That is, the present invention is not limited to the above-described embodiments, and various omissions, replacements, and changes can be made without departing from the scope of the present invention.

For example, the above-described embodiment may be modified as shown in the following (1) to (5).

(1) In the above embodiments, the case where the laser pointer 32 is used as a light source that emits visible light has been described, but the light source that emits visible light is not limited to what is called a laser pointer. As long as the device is capable of emitting visible light, a light source of an appropriate device may be used depending on design conditions and the like. Further, it goes without saying that the light source is not limited to the laser light source, and various light sources such as a lamp and a light emitting diode can be appropriately used according to design conditions and the like.

(2) In the above-described embodiment, detailed description of the emission color of visible laser light (visible light) emitted from the laser pointer 32 is omitted, but the emission color may be red or blue depending on design conditions or the like. Therefore, an appropriate emission color may be selected. As a light source that emits visible light, such as the laser pointer 32, one that can emit light of the selected emission color may be appropriately selected.

(3) Although detailed description of the tool 22 is omitted in the above-described embodiment, various tools such as an end mill and a cutter can be used interchangeably as the tool 22. Therefore, the present invention can be applied to a processing apparatus having an automatic tool changer function that can use a plurality of tools.

(4) In the above-described embodiment, the head unit 34 moves in the main scanning direction (X axis direction), the guide rail 36 moves in the sub scanning direction (Y axis direction), and the spindle 20 having the tool 22 attached thereto A variable mechanism capable of changing the relative positional relationship between the tool 22 and the work 16 in a three-dimensional direction is constructed by a mechanism in which the tool moves in the vertical direction (Z-axis direction), but this is not the only option. Of course, it is not a thing. For example, the head unit 34 moves in the main scanning direction (X-axis direction), the table 14 moves in the sub-scanning direction (Y-axis direction), and the spindle 20 with the tool 22 moves in the vertical direction (Z-axis direction). A variable mechanism that can change the relative positional relationship between the tool 22 and the work 16 in the three-dimensional direction may be constructed by the mechanism. In short, the movable member may be any member as long as the relative positional relationship between the tool 22 and the work 16 can be changed in the three-dimensional direction.

(5) Of course, the above-described embodiment and the various modifications described in (1) to (4) may be combined as appropriate.

INDUSTRIAL APPLICABILITY The present invention can be used in a processing device such as an end mill or a cutter, which is equipped with a tool for processing a workpiece for cutting or cutting the workpiece.

10 Processing device 12 Bottom plate 14 Table (reference plane)
16 Workpiece
18 Microcomputer (control means)
18a Operation mode monitoring determination unit 18b Tool length measurement mode processing unit (emission angle acquisition means, emission angle acquisition means)
18b-1 Emission angle acquisition unit (emission angle acquisition means)
18-b2 Tool length acquisition unit (tool length acquisition means)
18c Processing operation mode processing unit (control means)
20 spindles (control means)
22 tool 22a tip part 22b upper end part 24 front cover member 26 housing 26a work area 26L side wall part 26R boundary wall part 28 main body part 30 operation panel 30a display part 30b tool length measurement mode selection operator 30c machining operation mode selection operator 32 Laser pointer (light source)
32a Light emitting point (light source)
34 Head unit (control means)
36 Guide rail (control means)
38 Photodetector (light detection means)
38a Photodetector (photodetector)
α Emission angle β Tool length γ XY distance between laser pointer irradiation point (light spot C) on the work and tool rotation axis δ Z distance between the tip of the tool and the work surface L Visible laser light (visible light)
B Tool rotation axis C Light spot

Claims (9)

In a processing device that processes the workpiece by the tool while changing the relative positional relationship between the tool rotating around the Z axis in the XYZ orthogonal coordinate system and the workpiece in a three-dimensional direction that is the XYZ direction,
The tool emits visible light and is fixedly arranged at a preset Z-axis direction position without moving in the Z-axis direction of the tool rotating around the Z-axis, and the tool is A light source that is arranged so as to be movable in accordance with the movement in the XY plane direction, and that is arranged in a positional relationship in which the rotation axis around the Z axis of the tool intersects with the emitted visible light.
Visible light emitted from the light source can be detected, and light detection means fixedly arranged at a preset position,
Along with the movement of the light source in the XY plane direction, the position in the XY plane direction of the light source when the light detection unit detects the visible light emitted from the light source, and the XY in which the light detection unit is arranged. An emission angle acquisition unit that acquires an emission angle of the visible light emitted from the light source that is tilted with respect to the Z axis, based on a position in the plane direction and a Z-axis direction position where the light source is disposed,
Based on the detection result of visible light detected by the light detection unit when the tool is moved in the Z-axis direction at the position in the XY plane direction of the light source when the emission angle acquisition unit acquires the emission angle. And a tool length acquisition means for acquiring the tool length of the tool. The processing apparatus according to claim 1, further comprising:
Based on the emission angle acquired by the emission angle acquisition unit, the tool length acquired by the tool length acquisition unit, and the height position of the workpiece in the Z-axis direction, the above-mentioned workpiece on the workpiece. Control means for acquiring the positional relationship between the irradiation position where the visible light emitted from the light source is irradiated and the tip of the tool, and controlling the movement of the tool to the irradiation position on the workpiece. A processing device characterized by the above. The processing apparatus according to any one of claims 1 and 2,
The control means controls a processing depth for processing the workpiece by the tool based on the tool length acquired by the tool length acquisition means and the height position of the workpiece in the Z-axis direction. A processing device characterized by: The processing apparatus according to any one of claims 1, 2 and 3,
The processing apparatus, wherein the emission angle acquisition unit acquires a position in the XY plane direction of the light source and a position in the XY plane direction where the light detection unit is arranged, from the coordinate value with respect to the origin position. The processing apparatus according to claim 1, 2, 3, or 4,
The light source is a laser light source,
The processing device, wherein the light detecting means is a photodiode. The processing apparatus according to claim 5,
The processing apparatus, wherein the laser light source is a laser pointer. A tool length in a processing apparatus that processes the workpiece by the tool while changing the relative positional relationship between the tool rotating around the Z axis in the XYZ orthogonal coordinate system and the workpiece in the three-dimensional directions that are the XYZ directions. In the acquisition method of
Visible light emitted from a light source that emits visible light for irradiating a processing point when processing the workpiece is arranged so as to intersect the rotation axis around the Z axis of the tool,
In a processing apparatus, the tool length of the tool is acquired based on a detection result when the tool is moved in the Z-axis direction in a light detection unit that detects visible light emitted from the light source. How to get the tool length. The method for acquiring the tool length in the processing apparatus according to claim 7,
The light source is a laser light source,
The method for acquiring a tool length in a processing apparatus, wherein the light detection means is a photodiode. The method for acquiring the tool length in the processing device according to claim 8,
The laser light source is a laser pointer. A method for obtaining a tool length in a processing apparatus.

Images