JP2020102646A - Light-emitting device - Google Patents

Abstract

To provide a light emitting device capable of improving the extraction efficiency of light emitted from a light emitting element, achieving miniaturization, increasing light emission efficiency, and providing light emission characteristics with suppressed uneven color and uneven brightness.SOLUTION: A light-emitting device includes a covering member including a light-reflecting material, a light-transmitting member having a light-emitting side surface and a light-incident side surface that faces the surface of the covering member and is disposed in the surface, and a light emitting element and a wavelength conversion member that is coupled to the incident area side of the light emitting element and is excited by the light emitting element in a light source portion partially embedded in the covering member and coupled to an incident area surrounded by an outer reflection area on the light incident side surface of the light-transmitting member.SELECTED DRAWING: Figure 1

Description

The present invention relates to a light emitting device, and more particularly to a light emitting device including a light transmitting member and a covering member for increasing the efficiency of extracting light from a light emitting element.

In recent years, a light emitting device equipped with a semiconductor light emitting element such as a light emitting diode (LED) or a laser diode (LD) as a light source has been used for various illuminations and display devices. In particular, since these semiconductor light emitting devices have low power consumption and long life, they are attracting attention as a light source for next-generation lighting that can replace fluorescent lights, and further improvement in light emission output and light emission efficiency is required.

For example, in the light emitting device proposed in Patent Document 1, a light emitting element chip, which is an LED, is flip-chip mounted on the bottom of a storage recess provided in a package, which is a mounting substrate. Further, the incident surface of a light extraction increasing member having the shape of a plano-convex lens is optically coupled to the emission surface of the light emitting element chip. The light extraction increasing member has a refractive index intermediate between that of the sapphire substrate of the light emitting element chip and air. The emission surface of the light extraction increasing member is a spherical surface, and at all positions on the emission surface, light is emitted in a cone whose normal line is the center line and whose critical angle is the angle formed by the center line and the generatrix. It is formed so as to include the emission surface of the element chip. According to this configuration, since total reflection is not substantially generated on the emission surface of the light extraction increasing member, light can be extracted from the light extraction increasing member without causing attenuation or extinction of light due to multiple reflection. It is said that the utilization efficiency of light can be improved.

JP, 2006-351809, A JP, 2007-019096, A JP, 2006-037097, A JP, 2006-352061, A JP-A-2002-305328 JP, 10-151794, A

However, in the light emitting device described in Patent Document 1, the light emitted from the light emitting element chip to the side thereof passes through the sealing resin and propagates inside the sealing resin and the package. Absorbed and attenuated. Further, since the sealing resin also optically couples to the incident surface of the light extraction increasing member, the light emitting region on the incident surface becomes substantially large, and the light component reflected on the emission surface of the light extraction increasing member increases. For these reasons, it is difficult to sufficiently extract the light emitted from the light emitting element chip to the outside, and it is difficult to further reduce the size of the device while maintaining the light extraction efficiency.

Further, conventionally, a structure is assumed in which LED light is assumed as a light source, and the extraction efficiency thereof is increased, and the extracted LED light is wavelength-converted by a separately provided phosphor or the like. Therefore, the wavelength conversion light as the emitted light of the light emitting device and the LED light added to the wavelength conversion light are reduced in light extraction efficiency due to light scattering and absorption between the separated LED light source section and the wavelength conversion section. The structure is such that the directivity of the emitted light is reduced, the color unevenness and the brightness unevenness are increased, or the emission characteristics of the emitted light of the device are insufficient. There is a case. Further, with such a separation structure of the light source and the conversion unit, it is difficult to downsize the entire device.

The present invention has been made in view of the above problems, and an object thereof is to improve the extraction efficiency of light emitted from a light emitting element, to be able to downsize, to increase the emission efficiency, color unevenness, and brightness unevenness. It is an object of the present invention to provide a light-emitting device that has a light-emitting characteristic that suppresses

The light emitting device according to the present invention can achieve the above object by the following configurations (1) to (13).
(1) A light transmitting member having a covering member containing a light reflecting material, a light emitting side surface, and a light incident side surface facing the surface of the covering member and disposed in the surface, On the light incident side surface of the light transmissive member, the light emitting element and the incident area side of the light emitting element are coupled to the incident area surrounded by the outer reflective area and partly embedded in the covering member. And a wavelength conversion member that is excited by the light emitting element.
(2) In the light transmitting member, the light emitting side is a convex curved surface, and at least the reflecting region on the light incident side is a substantially flat surface, and the cross sectional width of the incident region is half or less of the light incident side surface. The light emitting device according to (1) above.
(3) Light-transmitting member having a covering member containing a light-reflecting material, a light-emitting side surface of a convex curved surface, and a light-incident side surface facing the surface of the covering member and arranged in the surface. And a light source unit, which is coupled to an inner incident region surrounded by a reflection region of a substantially flat surface on the light incident side surface of the light transmitting member and is partially embedded in the covering member, And a light emitting element provided in the light source unit, wherein a cross-sectional width of the incident region is half or less of a surface of the light incident side.
(4) The light emitting device according to (3), further including a wavelength conversion member that is coupled to the light source unit on the incident region side of the light emitting element and is excited by the light emitting element.
(5) The wavelength conversion member is a plate-shaped body having first and second main surfaces facing each other, and a plurality of the light emitting elements are joined to the second main surface, and the incident area is provided. The light emitting device according to any one of (1), (2), and (4) above, wherein the first main surface is bonded to the.
(6) The light emitting device according to any one of (1) to (5), wherein the reflective region is provided on a surface of the light transmitting member that is separated from a surface of the covering member.
(7) The light emitting device includes a translucent adhesive that adheres a surface of the light transmissive member on a light incident side to a surface of the covering member, and the incident region and the reflective region include the translucent adhesive. The light emitting device according to any one of (1) to (6) above, which is provided at an interface with the agent.
(8) Any of the above (1) to (5), wherein the light transmitting member is provided on the light source section and on the surface of the covering member, and the reflection region is an interface between the light transmitting member and the covering member. The light-emitting device according to any one of the above.
(9) The light-emitting device according to the above (8), wherein the incident area projects toward the light-emitting side from the reflective area.
(10) The light emitting device according to any one of (1) to (9), wherein a surface shape of the light transmitting member on the light emitting side is a spherical shape.
(11) The light emitting device has a mounting substrate on which the light emitting element is mounted, and the light emitting element is electrically connected to the mounting substrate on a mounting surface side facing a surface on the incident region side. The light-emitting device according to any one of (1) to (10) above.
(12) The light source unit of the light emitting device includes a wavelength conversion member that is coupled to a surface of the light emitting element on the incident region side and is excited by the light emitting device, and the covering member is provided from the incident region to the light source unit. The light emitting device according to (11), which is provided so as to cover the side surface of the mounting substrate and extend to the surface of the mounting substrate.
(13) The light emitting device according to (12), wherein the covering member is provided in contact with side surfaces of the light emitting element and the wavelength conversion member, respectively.

The present invention, the light-reflecting coating member, the light-emitting element of the light source section, the wavelength conversion section coupled to it is coated, the light source of the light-emitting element, or the emitted light from the composite light source is extracted in one direction, That is, the light source is used as one light emitting surface, the light emitting window portion of the light emitting device is used as one specific area, and the light transmitting member that encloses the window portion is joined to be covered with the covering member. It is possible to significantly improve the light extraction efficiency and obtain light emission characteristics with suppressed color and luminance unevenness. In particular, since the light component that is coupled to the window portion in a part of the light transmitting member and reflected by the inner surface of the light transmitting member in the other region is reflected by the covering member, the light can be extracted efficiently. That is, even if a light transmitting member having a large amount of light components propagating through the member can be taken out with high efficiency, the light transmitting member occupying a relatively large area and volume can be made small, and the device can be downsized. It is possible to suppress deterioration of characteristics. Further, since the above-mentioned composite light source is used, the light source section can be made small, which also contributes to downsizing of the device.

FIG. 1 is a schematic cross-sectional view (a) of a light emitting device according to an embodiment of the present invention and a schematic top view (b) thereof. FIG. 2 is a schematic cross-sectional view illustrating the periphery of the light source unit of the light emitting device of FIG. 1 according to the embodiment of the present invention. It is schematic sectional drawing (A)-(D) which shows the light-emitting device of each calculation model which concerns on this invention. 6 is a graph showing the relationship between the ratio of the diameter of the light transmitting member and the diameter of the incident region and the light extraction efficiency in each calculation model of the present invention. It is a schematic sectional drawing of the light emitting element which concerns on one embodiment of this invention. FIG. 5 is schematic cross-sectional views (A) to (D) showing a method for manufacturing a light emitting device according to an embodiment of the present invention. 1A is a schematic cross-sectional view of a light emitting device according to an embodiment of the present invention, and FIG. 2B is a schematic cross-sectional view illustrating the periphery of a light source unit thereof. It is a schematic sectional drawing explaining the light source part periphery of the light-emitting device which concerns on one embodiment of this invention. It is a schematic sectional drawing (a)-(c) of each light-emitting device which concerns on one embodiment of this invention. It is a schematic sectional drawing of the light-emitting device which concerns on one embodiment of this invention. 6 is a graph showing a relationship between a light transmitting member and light emission efficiency in the light emitting device according to the present invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings as appropriate. However, the light emitting elements and devices described below are for embodying the technical idea of the present invention, and the present invention is not limited to the following. In particular, unless otherwise specified, the dimensions, materials, shapes, relative positions, etc. of the components described below are not intended to limit the scope of the present invention thereto, but are merely illustrative examples. Only. The sizes and positional relationships of members shown in each drawing may be exaggerated for clarity of explanation. Further, each element constituting the present invention may be configured such that a plurality of elements are configured by the same member and one member also serves as a plurality of elements, or conversely, the function of one member is performed by a plurality of members. It can be shared and realized. Further, similarly to each of the embodiments described below, the respective configurations and the like can be appropriately combined and applied unless otherwise specified.

(Embodiment 1)
1 and 2 are schematic diagrams of a light emitting device 100 according to Embodiment 1 of the present invention, and FIG. 1A is a schematic cross-sectional view taken along the line AA in FIG. FIG. 2 is a schematic cross-sectional view around the light source unit. The light emitting device 100 of the example shown in FIGS. 1 and 2 mainly includes a light emitting element 10, a light transmitting member 20, a covering member 30, a wavelength converting member 40, and a mounting substrate 50. The substrate 50 includes a frame body 55 and a wiring 51 on which a plurality (two in the drawing) of the light emitting elements 10 are flip-chip mounted. The wavelength conversion member 40 is plate-shaped and has first and second surfaces facing each other, and the second surface is bonded to the back surface of each light emitting element 10. Then, the covering member 30 containing the light reflecting material 35 is filled inside the frame body 55, and the light emitting element 10 and the wavelength conversion member 40 of the light source unit are covered by the covering member 30 with the first surface as an exposed surface. ing. The covering member 30 continuously covers the side surface, a part of the second surface, and the side surface of the light emitting element 10. Thereby, the light emitted from the light emitting element 10 and/or the wavelength conversion member 40 is reflected and guided to the light emission side by the light reflective coating member 30, and is extracted from the first surface of the wavelength conversion member 40. The surface emitting light source uses the first surface as a main light extraction window, that is, a light emitting surface. With the shape and size of the first surface, it can be used as a light source, and the light transmitting member 20 as an optical element for the light source is bonded to the light incident area 80 of a partial area on the light incident side on the light source. ..

FIG. 2 is a schematic cross-sectional view for explaining the vicinity of the light source unit of the light emitting device according to the first embodiment. As shown in FIG. 2, the light transmitting member 20 is provided on a part of the covering member 30 that encloses the first surface of the wavelength conversion member 40 on the surface on the light incident side and surrounds the outer surface thereof. A light emitting side surface 21 which is a light emitting surface of the light emitting device is provided so as to face the light incident side surface. The surface on the light incident side faces the first surface of the wavelength conversion member 40, the incident region 80 on which the light from the light emitting element 10 and/or the wavelength conversion member 40 is incident, and the surface of the covering member 30 outside thereof. And a reflection region 90 facing the. The incident area 80 increases the light extraction efficiency from the first surface of the wavelength conversion member 40, and, as shown in FIGS. 1 and 2, reflects the light of the light transmission member 20 in the reflection area 90. .. Here, as shown in the figure, the light transmitting member 20 is a hemispherical lens, the center of which is substantially the center of the incident area on the surface of the light source unit, that is, a light emitting surface 21 having a convex curved surface is provided. It is an optical element. At this time, in the cross section perpendicular to the first surface of the wavelength conversion member 40, the diameter (cross section width) L of the light source section and the incident region 80 is half or less of the radius of curvature r (=R/2) of the light transmission member 20. , L≦(R/2)/2. A part of the light incident from the incident area 80 is emitted to the outside from the light emitting side surface 21, and the remaining light components are reflected to the light incident side on the inner surface of the light emitting side surface 21 and become return light. Most of this return light reaches the reflection region 90 either directly or while repeating multiple reflections on the inner surface of the light transmitting member 20. The return light that has entered the reflection region 90 is reflected by the surface of the light-reflective coating member 30 to change the angle of incidence on the light-emission-side surface 21 of the light-transmissive member 20 and promote its transmission to the outside. To be done. Here, as described later, it is preferable that the covering member is a translucent member including a light-reflecting material because the diffuse reflection effect on the surface thereof is enhanced and the light loss is small.

In addition, as described above, the light incident from the light emitting element 10 or the light source portion including the light emitting element 10 and the wavelength converting member 40 to the light transmitting member 20 causes the light reflecting coating member 30 to be exposed to one of the light source portions. Since the portion is embedded, the light is almost not directly incident on the light transmissive member 20 from the reflective region 90 because it is almost limited to the incident region 80. You can get closer. As a result, it is possible to reduce the light reflection on the surface 21 on the light emitting side of the light transmitting member of the optical element having the convex curved surface, and thus to downsize and thin the entire device while maintaining high light extraction efficiency. Becomes As described above, in the light emitting device of the present invention, on the surface of the light transmitting member 20 on the light incident side, the incident region 80 for highly efficiently coupling the light source unit in the light transmitting member 20 and the light component in the light transmitting member. And a reflection region 90 that reflects the light toward the surface 21 on the light emitting side, and the different action allows the light extraction efficiency to be remarkably corresponding to various shapes of the surface 21 on the light emitting side of the light transmitting member 20. Can be improved.

In particular, in the first embodiment, the light incident side surface of the light transmitting member 20 is directly connected to the light source section, that is, the first surface of the wavelength conversion member 40 and the surface of the covering member 30 outside thereof. That is, they are joined, that is, the incident region 80 is provided at the interface with the first surface, and the reflective region 90 is provided at the interface with the surface of the covering member 30, respectively. Therefore, the return light that reaches the reflection region 90 can be reflected or scattered by the surface of the light-reflective coating member 30, transmitted through the light-emitting side surface 21, and taken out of the device. In particular, as will be described later, when the covering member is a translucent member containing a light-reflecting material, for example, a translucent resin, interface coating with the light transmissive member is possible on the surface of the covering member, and The light that has entered the inside is reflected and scattered by the light-reflecting material, so that the effect of the reflection region 90 is enhanced and the light emitting device has excellent light emitting characteristics. The light emitting device 100 according to the first embodiment is manufactured by manufacturing the surface emitting light source unit as described later and then directly bonding the light transmitting member 20 thereon by various molding techniques to form the light emitting member 20. This is the form that is most suitable for mass production as compared with the light emitting devices of other embodiments described later.

Further, as shown in the figure, the incident area 80 preferably protrudes to the light emitting side from the reflective area 90. As a result, if the surface of the covering member 30 is not shielded from light, and as shown in the drawing, the reflection area 90 is an inclined surface inclined from the reflection area toward the projecting incident area 80, that is, an inclined surface reflecting to the outside, Light emission to the side of the light transmitting member 20 by the reflection region 90, that is, a high angle component from the light emitting device is increased, and a wide orientation is obtained.

(Optical element and light source)
The relationship between the diameter W of the light transmitting member 20, that is, the optical element, the radius of curvature r of the convex curved surface, and the diameter L of the incident region 80 in the present invention will be described in detail below. FIG. 3 is a schematic cross-sectional view showing the structure of each light emitting device of the theoretical calculation model studied here. The light-emitting device 110 illustrated in FIG. 3A includes a light source portion 16 that is a rectangular parallelepiped (plate-like) having a square shape with one side length L and a thickness of 100 μm. Further, the light source section exposes only its upper surface and covers the side surface and the bottom surface thereof with the covering member 31, and the covering member 31 has a reflectance of 100%. Then, a hemispherical light transmitting member 20a having a diameter R whose center of curvature is the center of the upper surface of the light source portion indicated by a black circle in the figure is provided on the same surface of the light source portion and the covering member. The diameter R and the diameter W of the light transmitting member are 4 mm (the radius of curvature is 2 mm), and the refractive index is 1.537. This light emitting device 110 is assumed to be the light emitting device 100 of the above-described first embodiment. Further, in the light emitting device 120 shown in FIG. 3B, a gap 86 is provided between the light transmitting member 20b and the surface of the covering member 32, and both surfaces are separated from each other. Similar to device 110. More specifically, there is an inclined surface 94 that is inclined downward from the upper surface of the light source section, facing the flat surface (reflection area) of the light transmitting member 20b outside the light source section 16, and the refractive index of the air in the void 86. Is 1.000. This light emitting device 120 is assumed to be a light emitting device 200 according to a second embodiment described later.

A light emitting device 130 shown in FIG. 3C is similar to the above light emitting device 110 except that the light source section 16 is provided on the surface of the covering member 33, and the light source section is embedded in the light transmitting member 20c. Therefore, the center of curvature is located at the center of the bottom surface of the light source unit 16 as indicated by the black circle in the figure. Further, in the light emitting device 140 shown in FIG. 3D, the surface on which the light transmitting member is provided includes the covering member 34 and the base material 35 having a low reflectance outside the covering member 34, and the light transmitting member 20d is changed. Other than that, the light emitting device 110 is the same as the light emitting device 110. In detail, the covering member 34 has a reflectance of 100% like other devices, is a square having a side of 2.7 mm in a top view, and the base material 35 has a reflectance of 90%. It constitutes the entire region of the light transmitting member. The light transmitting member 20d is a spherical surface having a radius of curvature of 3 mm and having a center of curvature at a position 2 mm away from the center of the upper surface of the light source unit, and has a diameter W of about 4.472 mm. Therefore, in the light emitting device 140, on the light incident side surface of the light transmitting member, a region having a reflectance of 100% by the covering member 34 outside the incident region and a region having a reflectance of 90% on the base material 35 further outside thereof. And, and the surface on the light source side is a hemispherical flat surface.

Based on the above-described light emitting devices 110, 120, 130, 140, the ratio (L) of the radius of curvature r (R/2) or diameter (cross section width) W of the light transmitting member to the diameter (cross section width) L of the incident region. /R, L/W) and the light extraction efficiency are analyzed by theoretical calculation for each model. FIG. 4 shows the analysis results. Models A to C are the devices 110 to 130, and model AD is a model in which the covering member 31 of the device 110 is replaced with the covering member 34 and the base material 35 of the device 140, models DD and DD. -W is the device 140 and its L/W ratio, and models DA and DA-W are models in which the covering member 34 and the base material 35 of the device 140 are replaced by the covering member 31 of the device 110 and the model L and L. /W ratio, and the diameter L of the light source unit 16 is changed. As shown in FIG. 4, in the models A to C and the AD, DD-W, and DA-W light emitting devices, the L/R ratio (the models DD-W and DA-W are L/W ratio) is 0.5. When it becomes larger, the light extraction efficiency starts to decrease, which becomes remarkable especially in the models A to C and AD. This shows that in the range of 0.5 or less, the light extraction efficiency of the light source unit is close to that of a point light source with respect to the light emitting side surface of the light transmitting member having a hemispherical surface or a convex curved surface. Further, comparing the models A to C, the models A and B have a large reduction in the light extraction efficiency even in the region where L/R is large, as compared with the model C of the comparative example, and the models of the light source unit 16 are suppressed. It can be seen that the structure in which a part is covered with the light-reflecting covering member has an advantage in downsizing the device while maintaining high luminous efficiency. Further, in the model AD of the comparative example, the efficiency is lower than the models A to C even in the region where the light source is small, and the L/R sharply decreases at 0.5 or more. It is necessary to make the size sufficiently small and the size of the light transmitting member large enough, and it is necessary to increase the size of the device for high efficiency.

Furthermore, the light extraction efficiency of the models DA and DD using the light transmitting member 20d of the light emitting device 140 is higher than that of the models A to C and AD using the light transmitting members 20a to 20c of the other light emitting devices 110 to 130. , Its initial value and maximum value are significantly lower. From the viewpoint of light extraction efficiency, it is most preferable that the surface of the light transmitting member on the light emitting side is a hemispherical surface, but the size of the device becomes large. On the other hand, in the light emitting device 140 (models DA and DD) of the semi-spherical flat member 20d, the light reflection component on the inner surface of the light transmitting member 20d increases and the efficiency decreases, but the device is excellent in downsizing and thinning. .. Even if the models DA and DD are compared, the efficiency of the model DA tends to be superior to that of the model DD (device 140) of the comparative example, and the present invention provides a highly efficient device even in miniaturization and thinning. I see that it can be realized. Further, like the light emitting device 140, the models AD and DD having the regions 35 having a low reflectance on the outer edge of the surface of the light transmitting member 20 on the light incident side are comparative examples, and such regions are, for example, the substrate 50 and wiring. It is assumed that a member in the apparatus lower than the covering member such as 51 is exposed. Therefore, in this model, due to the downsizing of the device and the large area of the light source part, the light reflection on the inner surface increases, the amount of light reaching the low reflectance region forming the outer edge of this ring increases, and the light extraction efficiency is further improved. Will be reduced. The light transmitting member of the present invention has a flat shape from a hemispherical surface, a flat convex surface with a different curvature, or various optical lens shapes as shown in FIGS. 9B and 9C. Even with the structure in which the inner surface reflection of the light transmitting member is large, the device has high luminous efficiency, and the device can be miniaturized and thinned while maintaining high efficiency.

Next, each component and structure of the light emitting device of the present invention will be described in detail below.

(Light emitting element)
As the light emitting element 10, a known light emitting element, specifically, a semiconductor light emitting element can be used, and in particular, a GaN-based semiconductor is preferable because it can emit visible light or ultraviolet light having a short wavelength that can efficiently excite a fluorescent substance. The specific emission peak wavelength is 240 nm or more and 560 nm or less, preferably 380 nm or more and 470 nm or less. In addition to this, a ZnSe-based, InGaAs-based, or AlInGaP-based semiconductor light emitting element may be used.

(Light emitting device structure)
As shown in FIG. 5, the light emitting device structure 11 made of a semiconductor layer is composed of at least a first conductivity type (n-type) layer 2 and a second conductivity type (p-type) layer 3, and an active layer 3 between them. The structure having is preferred. Further, the electrode structure is preferably the same-surface-side electrode structure in which the electrodes 6 and 7 of the first conductivity type and the second conductivity type are provided on one principal surface side, but the electrode structure is opposed to each principal surface of the semiconductor layer. It may be a counter electrode structure in which each is provided. Also in the mounting form of the light emitting element 10, for example, in the above-mentioned same-side electrode structure, flip-chip mounting in which the electrode forming surface is the mounting surface and the substrate 1 side facing the electrode forming surface is the main emitting surface is the emitting surface and the light transmitting member. It is preferable in terms of optical connection with 20. In addition, the electrode forming surface side is used as a main emitting surface, and a translucent member, a wavelength conversion member is mounted thereon, face-up mounting, a translucent member having a wiring structure, and a flip to the wavelength conversion member. It is possible to perform chip mounting and connect to the light transmitting member and the mounting substrate with the above-mentioned counter electrode structure, and it is preferable to mount the embodiment in which the light emitting element and the light transmitting member and the wavelength converting member are not provided with wiring and electrodes. The growth substrate 1 of the semiconductor layer 11 may be removed when the light emitting device structure is not formed, and the support substrate, for example, a conductive substrate or another transparent substrate may be added to the semiconductor layer from which the growth substrate has been removed. It is also possible to adopt a structure in which members and substrates are bonded. A transparent member and a wavelength conversion member 20 may be used for this support substrate, or an element having a structure in which a semiconductor layer is adhered/covered by a transparent member such as glass or resin may be used. The growth substrate can be removed by, for example, mounting or holding it on a support, a device, or a submount, and peeling, polishing, or LLO (Laser Lift Off). The light emitting element 10 may have a light reflecting structure. Specifically, of the two main surfaces of the semiconductor layer 11 that face each other, the other main surface that faces the light extraction side (emission surface side) is The light-reflecting side (the lower side in FIG. 1) can be provided, and a light-reflecting structure can be provided in the semiconductor layer on the light-reflecting side or in the electrode. As an example of the light reflection structure, a structure in which a multilayer film reflection layer is provided in the semiconductor layer, or an electrode having a metal film having high light reflectivity such as Ag and Al or a dielectric multilayer film and a reflection layer are provided on the semiconductor layer. There is a different structure.

(Nitride semiconductor light emitting device)
As an example of the light emitting element 10, in the nitride semiconductor light emitting element 10 of FIG. 5, an n-type semiconductor layer that is the first nitride semiconductor layer 2 and an active layer 3 are provided on the C-plane sapphire substrate that is the growth substrate 1. And the p-type semiconductor layer which is the second nitride semiconductor layer 4 are sequentially epitaxially grown. Then, a part of the n-type layer 2 is exposed to form an n-type pad electrode which is the first electrode 7, and the translucent conductive layer 5 such as ITO and the second electrode are formed on almost the entire surface of the p-type layer 4. A p-type pad electrode of No. 6 is formed. Further, a protective film 8 is provided by exposing the surfaces of the n-type and p-type pad electrodes 6, 7 and covering the semiconductor layer. The n-type pad electrode 7 may be formed via a translucent conductive layer like the p-type. The growth substrate 1 is, in addition to C-plane sapphire, R-plane and A-plane, an insulating substrate such as spinel (MgAl ₂ O ₄ ), silicon carbide (6H, 4H, 3C), Si, ZnS, ZnO, GaAs. , GaN, AlN, and other semiconductor conductive substrates. Examples of the nitride semiconductor, the general formula _{In x Al y Ga 1-xy} N (0 ≦ x, 0 ≦ y, x + y ≦ 1) of the other, B and P, it may be mixed with As. The n-type and p-type semiconductor layers 2 and 4 are not particularly limited to a single layer or a multilayer, and the active layer 3 preferably has a single (SQW) or multiple quantum well structure (MQW). As an example of the blue-light-emitting device structure 11, an n-type semiconductor layer such as Si-doped GaN is formed on a sapphire substrate via a nitride semiconductor underlayer such as a buffer layer, for example, a low-temperature grown thin film GaN and a GaN layer. N-type contact layer and a GaN/InGaN n-type multilayer film layer are laminated, then an InGaN/GaN MQW active layer and a p-type semiconductor layer, for example, Mg-doped InGaN/AlGaN p-type multilayer film layer. And a p-type contact layer of Mg-doped GaN are laminated.

(Wavelength conversion member)
The light emitting device 100 of FIG. 1 includes a wavelength conversion member 40, which is excited by light from the light emitting element 10 in the light source unit and is capable of wavelength conversion of at least a part of the incident light. The light source unit may have a structure in which a light emitting element or a translucent member joined to the light emitting element is added, and a wavelength conversion member is preferably used for the translucent member. Even when described simply as a wavelength conversion member in the present specification, it can be applied by being replaced with a translucent member when it does not depend on the wavelength conversion function. Thereby, the primary light emitted from the light emitting element 10 in the light source section is excited by the wavelength conversion member 40, whereby secondary light having a wavelength different from the emission wavelength of the light emitting element 10 is obtained, and the primary light and By mixing the wavelength-converted secondary light, a composite light source that can realize emitted light having a desired hue is obtained. In addition, a light source unit that emits a secondary light excited by the primary light or a form that transmits substantially only the secondary light, for example, converted light of an ultraviolet light emitting LED (monochromatic or mixed color light), It may be a light emitting device provided with.

Further, the wavelength conversion member 40 of FIG. 1 is configured to include the light emitting element 10 in a plan view from the first surface side. In other words, as shown in FIG. 1, the side surface of the wavelength conversion member 40 projects outside the side surface of the light emitting element 10. Thereby, the light emitted from the light emitting element 10 is directly coupled by the light receiving surface wider than the upper surface of the light emitting element 10, so that the loss of the light flux is small. The protrusion amount of the side surface of the wavelength conversion member 40 with respect to the side surface of the light emitting element 10 is, for example, 3% or more and 30% or less, specifically, 5% or more and 15% or less, as compared with the size of the light emitting element 10. is there. As an example, in the light emitting device of Example 2 below, the wavelength conversion member 40 is projected at the terminal end with a width of about 50 μm.

The shape of the wavelength conversion member 40 is not particularly limited, but it is a plate-like body in the first embodiment, has a good coupling efficiency with the emission surface of the planar light emitting element 10, and can be easily aligned so as to be substantially parallel to each other. preferable. In addition, by making the thickness substantially constant, it is possible to stabilize the ratio of color mixing and suppress color unevenness in the incident area 80 on the surface of the light source unit. In addition, it is easy to join a plurality of light emitting elements 10 to one wavelength conversion member 40, and the distribution of brightness and chromaticity on the emission surface of the light source section depends on the arrangement of the light emitting elements, but this can be suppressed. The thickness of the wavelength conversion member 40 is preferably 10 μm or more and 500 μm or less, more preferably 50 μm or more and 300 μm or less in terms of light emission efficiency and chromaticity adjustment. Further, the number of the light emitting elements 10 bonded to one light transmissive member or the wavelength conversion member 40 is not particularly limited, and if a plurality of light emitting elements 10 are mounted, the luminous flux amount can be increased and the brightness of the light emitted from the light source unit can be increased. preferable. Examples of the arrangement in the case of a plurality include arrangement in a line, arrangement at equal intervals in a lattice position, and the like.

Here, as the material of the translucent member used for the light source section and serving as the base material of the wavelength conversion member 40, the same material as the covering member 30 described below can be used, and examples thereof include resin, glass, and inorganic materials. Can be used. Further, a molded body or a crystal body of the following phosphor may be used. Specifically, examples of the wavelength conversion member 40 include a glass plate provided with the wavelength conversion member, or a single crystal body, a polycrystal body, an amorphous body, a ceramic body having a phosphor crystal or a phase thereof. In addition, a sintered body, an aggregate, and a porous body of phosphor crystal particles and a translucent member that is appropriately added, and a light transmissive member such as a translucent resin mixed and impregnated therein, or It is composed of a light transmitting member containing phosphor particles, for example, a molded body of a light transmitting resin.

The wavelength conversion member can be suitably combined with a blue light emitting element to emit white light, and a typical phosphor used for the wavelength conversion member is a YAG phosphor (yttrium.aluminum. garnet) and LAG-based phosphor (lutetium aluminum garnet) can be mentioned, in particular, at the time of high luminance and long-term use _{(Re 1-x Sm x)} 3 (Al 1-y Ga y) 5 O 12 : Ce (0≦x<1, 0≦y≦1, where Re is at least one element selected from the group consisting of Y, Gd, La, and Lu) and the like are preferable. Also, a phosphor containing at least one selected from the group consisting of YAG, LAG, BAM, BAM:Mn, (Zn, Cd)Zn:Cu, CCA, SCA, SCESN, SESN, CESN, CASBN and CaAlSiN ₃ :Eu. Can be used. The wavelength conversion member may be provided, for example, in the light transmissive member, between the light transmissive member and the light emitting element, in the adhesive material interposed therebetween, or between the light emitting element and the covering member, in addition to the light transmissive member. Can also It is also possible to increase the reddish component by using a nitride-based phosphor or the like that emits yellow to red light, and realize an illumination having a high average color rendering index Ra, a light bulb color LED, or the like. Specifically, by adjusting and containing the amount of phosphors having different chromaticity points on the CIE chromaticity diagram according to the emission wavelength of the light emitting element, the chromaticity diagram between the phosphors and the chromaticity diagram connected by the light emitting element is shown. Can emit light at any point. In addition, a nitride phosphor, an oxynitride phosphor, or a silicate phosphor that converts near-ultraviolet to visible light into a yellow to red region can be used. For example, L ₂ SiO ₄ :Eu (L is an alkaline earth metal), particularly (Sr _x Mae _1-x ) ₂ SiO ₄ :Eu (Mae is an alkaline earth metal such as Ca or Ba) can be mentioned. As the nitride-based phosphor and the oxynitride (oxynitride) phosphor, Sr-Ca-Si-N:Eu, Ca-Si-N:Eu, Sr-Si-N:Eu, Sr-Ca-Si. -O-N: Eu, Ca- Si-O-N: Eu, Sr-Si-O-N: include Eu, the alkaline earth silicon nitride phosphor, the general formula LSi ₂ O ₂ N _2: Eu , L _x Si _y N _(2/3x+4/3y) : Eu or L _x Si _y O _z N _{(2/3x+4/3y-2/3z)} : Eu (L is Sr, Ca, It is represented by either Sr or Ca).

(Coating member)
As shown in FIG. 1, the covering member 30 covers a part of the light source unit and the surface of the light transmitting member, specifically, covers the light source unit including at least the light emitting element so as to be embedded, and additionally the light transmitting unit. The member extends and covers the incident side surface of the member. Further, a part of the wavelength conversion member 40 in the light source section, specifically, the side surface thereof is covered, and the surface of the light source section exposed from the light conversion section serves as an emission surface and enters the light transmission member. The base material of the covering member 30 is a resin material, and it is preferable that a silicone resin composition, a modified silicone resin composition, or the like is used since it has a good light-transmitting property, but an epoxy resin composition or a modified epoxy resin composition is used. A transparent insulating resin composition such as an acrylic resin composition can be used. Further, a sealing member having excellent weather resistance, such as a hybrid resin containing at least one of these resins, can be used, and the translucent resin is suitable for coating a desired region in the present invention and molding the same. It is also possible to use an inorganic material having excellent light resistance such as glass, silica gel or the like. Furthermore, it is preferable that the covering member 30 is made of a resin molded body having high heat resistance because it can cope with heat generation of the light emitting element of the light source section and the wavelength conversion member 40. In the first embodiment, a silicone resin is used as the resin forming the base material of the covering member 30. Silicone resin has excellent heat resistance, water repellency, and electrical insulation, and has the advantage that it does not easily deteriorate over time. Furthermore, the surface of the covering member 30 can be formed into a desired shape, for example, the shape of an inclined surface or a curved surface shown in the drawing, to enhance the function and effect of the reflection area, control the directivity and the color distribution, and collect light. By properly combining with the optical function of the light transmitting member, the emission characteristics of the device can be controlled.

Further, the covering member 30 contains at least one kind of light-reflecting material 35 in the base material. By containing a light-reflecting material, the reflectance of the coating member is increased, and more preferably, when the particles having low absorptivity are used, light absorption and loss are reduced, and a coating member having a light scattering property can be obtained. Specifically, translucent particles are used. The light-reflecting material is one kind of oxide selected from the group consisting of Ti, Zr, Nb, Al and Si, or at least one kind of AlN and MgF, and specifically, TiO ₂ and ZrO ₂ , Nb ₂ O ₅ , Al ₂ O ₃ , MgF, AlN, and SiO ₂ . Since the particles of the light-reflecting material are one kind of oxide selected from the group consisting of Ti, Zr, Nb, and Al, the material can have high reflectivity and low absorptivity, and the substrate, especially the light-transmitting material can be used. It is preferable because the difference in refractive index from the resin is increased. In addition, the covering member can also be configured by a molded body of the light-reflecting material, specifically, an agglomerate obtained by aggregating the particles, a sintered body, or other porous material, and the like. Further, it may be a molded product by the sol-gel method, and it is preferable because the difference in the refractive index between the light-reflecting material and the air in the porous material can be increased, the light reflectivity can be enhanced, and the material can be made of an inorganic material. On the other hand, a covering member provided with a base material such as the above resin is capable of molding into a desired shape and controllability of the covering region, and also has improved sealing performance and airtightness. preferable. Further, in consideration of the characteristics of both the covering members, a composite molded body of both can be formed. For example, a part of the porous molded body, the outer surface side is impregnated with resin, and the inner surface side of the light emitting element side is It can have a porous structure. As described above, the covering member or the enclosing body that encloses the light source unit by the covering member may be such that the inner region communicates with the outside or may be gas permeable, and at least the form does not leak light. ..

In the covering member 30 containing the light-reflecting material 35 in the base material described above, the depth at which light leaks differs depending on the concentration and density of the base material. Should be adjusted. For example, when the wall thickness is made small with a relatively small light emitting device, it is preferable to provide a high-concentration light-reflecting material. On the other hand, its concentration and particle size can be appropriately adjusted so that it is suitable for the preparation of the raw material of the covering member containing the light-reflecting material, the coating of the raw material, the molding, etc., and the particle diameter is similar to that of conventional fillers and the like. Can be used, and the same applies to the porous body. As an example, it is preferable that the content concentration of the light reflective material 35 is 20% by weight or more, and the wall thickness of the covering member 30 is 20 μm or more. Within this range, the productivity is good, and emitted light with high brightness and high directivity can be obtained from the first surface, which is the light emitting surface. Further, other fillers may be added to the resin base material. For example, a heat conductive material can be added, heat generated by the light source can be efficiently diffused, reliability can be improved, and high output can be achieved. As the heat conductive material, specifically, a heat conductivity of 0.8 W/K·m or more is preferable, and for example, a metal material such as Ag or Cu, or a ceramic material having good heat dissipation such as diamond, alumina, AlN or glass. These may be included, and these may be mixed and contained. Further, a pigment or the like may be mixed and colored to absorb light having a specific wavelength.

The area covered by the covering member is as described above, which will be described in detail below. By covering the side surface of the light source section and the side surface of the wavelength conversion member, it is possible to prevent light from leaking from the side surface, and also to prevent light from being emitted outward from the side surface, resulting in color unevenness in the overall emission color. And uneven brightness can be reduced. In addition, a part of the light source is exposed, specifically, the side surfaces of the light emitting element, the wavelength conversion member, and other members are covered to expose the upper surface, and the emission area is limited to direct the emitted light. And the brightness on the emission surface can be enhanced. Furthermore, the heat generated in the light source part, particularly the wavelength conversion member, is conducted to the covering member 30, and the heat dissipation property can be improved as compared with the case where it is not covered. In addition to the side surface of the wavelength conversion member 40, a part of the light emitting element side surface (second surface) may be covered. Specifically, as shown in FIGS. The covering member 30 is filled between the covering member 50 and 50, and the periphery of the light emitting element 10 is covered with the covering member 30. That is, the exposed surface is covered on the second surface except the facing area that is joined to the light emitting element 10. In this way, the optical connection region and the coating region of the coating member 30 are provided on the second surface, and the side surface of the light-emitting element is extended from the coating region to coat the side surface of the light emitting element, so that the primary region is formed in the connection region. Light can be guided with high efficiency, and the light in the wavelength conversion member can be reflected on the second surface side to suppress light absorption in the substrate 50. Further, when a plurality of light emitting elements 10 are joined, the above-mentioned problem is increased in the adjacent elements, but the covering member 30 is filled also between the elements, and the separation area between the element joining areas adjacent to each other on the second surface is provided. It is preferable that the above-mentioned effects are obtained by coating

The light emitting device of the present invention has a structure in which the exposed surface side of the covering member 30 forms the periphery of the first surface (emission surface) of the light source unit, and forms the reflection region of the light transmitting member and the opposing region thereof. Various other forms can be adopted for the other exposed surface area and the inner side. For example, the covering member 30 may cover the side surface of the wavelength conversion member 40 to form the exposed surface, and the side surface or the periphery of the light source section on the inner side thereof may be in contact with or separated from each other. In this case, A covering member that is in contact with or separated from the light emitting element is provided. As shown in the figure, it is preferable in manufacturing that the light emitting element 10 is encapsulated continuously from the side surface and the second surface of the wavelength conversion member to embed the light source unit. On the other hand, on the inner side, in addition to such contact, the covering member 30 can be arranged outside of the side surface of the light emitting element 10 so as to be spaced apart. It is preferable because reflection can be realized and deterioration of the covering member such as resin due to light or heat can be prevented. Further, a structure may be provided in which the gaps are provided also in the separated regions of the plurality of light emitting elements 10. At this time, it is preferable to form an exposed portion having a high refractive index difference between air and gas in the inner space of the void so that the refractive index difference with the light emitting element 10 is increased.

In the present invention, the light transmissive member is provided on the light incident side surface with a reflective region outside the incident region of the light source unit, and the reflective region is provided on the surface of the light transmissive member, and further at the interface with the covering member. The reflection function largely depends on the material and surface morphology of each member. In the first embodiment, the covering member containing the light reflecting material and the light transmitting member formed on the covering member are formed at the interface, so that the reflecting member has suitable reflection and scattering functions. Specifically, the mutually translucent materials form an interface between the translucent materials, a high reflectance is obtained, and further, a scattering function is imparted by the light reflective material in the covering member. It Thereby, it is possible to improve the light extraction efficiency, improve the brightness, and the color unevenness, and particularly when the device is downsized, that is, the proportion of the light source unit L is large, or the diameter of the light transmitting member is small or the shape is deformed from the spherical surface, The effect is increased when flattened. At this time, it is particularly preferable that a difference in refractive index is provided to each member forming the interface, and if the refractive index is large on the side of the light transmitting member, the reflectance of the interface of the translucent material is improved and the output of the device is improved. However, it is preferable that the side of the coating member has a large amount of light taken in and scattered therein, which is superior in orientation and luminance/chromaticity distribution. Therefore, not only the optical element function of the above-mentioned light transmitting member and the interface between both members, which will be described later, the shape of the reflecting surface, but also the material and composition of both members, as well as the concentration and distribution state of the above-mentioned reflecting material in the covering member are adjusted. Also by doing so, the light emitting device of the present invention can appropriately control its light emitting characteristics. Especially when the wavelength conversion member is included in the light source section, the chromaticity and brightness distribution of the light emitted from the light source section is unique due to the shape and other properties of the member, which can be controlled by the function of the reflection area. preferable. Furthermore, since both members are made of resin, the resin interface can be formed into a desired shape, and as will be described later, it is possible to design a device having various directivity and other light emission characteristics, which is preferable.

As described above, the light emitting device of the present invention has two regions surrounding the light source unit, one light transmitting member side being a light guide region having a light emitting surface, and the other covering member side being lighter than that. It is a covered area with high reflectance, and the light source part has a structure in which an incident area where the exit surface is exposed from the covered area and is coupled to the light guide area and a reflective area are provided at the boundary between the light guide and covered areas. ing. By enclosing the light source part with these two regions and providing the incident region and the reflection region at the joint part or the boundary region, the above-mentioned respective functions and effects are appropriately expressed and controlled, and desired emission characteristics, A light emitting device that can be downsized can be obtained. In particular, it is preferable that the emission surface of the light source section is a surface light source and is a planar incident area so that the reflection area at the boundary portion continuing to it can function in cooperation. On the other hand, as shown in the examination of the device 140 and the models DD and DA, which will be described later, it is preferable that the covering region is preferably formed, that is, it is provided at the boundary between the two regions. For example, the outer edge of the light transmissive member, which is wider than the covering member, faces the mounting substrate exposed from the covering member and is provided with a boundary, so that the characteristics of the device are greatly affected by the substrate surface having a low reflectance. Further, in another example, when the light leaking from the light source section or the path thereof is provided on the side surface or the mounting side surface of the light source section, the amount of light is large, so that the output and efficiency are greatly reduced. For example, the side surface of the light emitting element and the surface (the substrate side and the mounting side) facing the incident area are exposed from the covering member, and the surface having a lower reflectance and a higher light absorption rate than the covering member such as the substrate surface is exposed there. Therefore, the influence becomes remarkable. Therefore, it is preferable that either the periphery of the light source portion or the exposed surface of low reflectance and high absorption rate is covered, or preferably both of them are formed, and the covering member as in the first embodiment. Is a structure having both of them. Therefore, it is preferable that the covering region is provided so as to face substantially the entire region of the light guide region, and the light incident side surface of the light transmitting member is included in the surface of the covering member. It is preferable that the area other than the emission surface is covered. Specifically, as shown in the figure, a covering member is provided as an underfill on the opposing surface side of the light emitting element, and a structure having both is provided. The structure has a structure that prevents the exposure of the surface having a high absorption rate and a high absorptivity, the surface of the substrate, and the formation of a light leakage path from the light source section. Therefore, the surface of the light source section facing the emission side is included by the covering member and the covering area, that is, the surface of the facing covering material and the covering area (the surface on the substrate 50 side in the figure) is covered by the covering member from the light source section. It is preferably separated.

The reflecting surfaces provided at the boundary between the light guide region and the covering region are provided on the surfaces of the respective regions which face each other, and when the two are joined as in the first embodiment, they are provided at the interface thereof. In the former case, when facing each other while being separated from each other, as in the second embodiment, a reflecting function is given to each of the facing surfaces of the light transmitting member and the covering member, and they are superimposed, so that the light extraction efficiency is high. In the latter case, since the reflection function is provided at the boundary region and the interface between the members, it becomes easy to control the directivity. Therefore, the reflecting surface can have a desired reflecting function in molding of each region and each member, and if the inclination of the surface is substantially flat with respect to the incident region, light is extracted in the emitting direction of the light source unit, On the other hand, when the reflecting surface is inclined outward, as in the case of the second embodiment, for example, when the normal direction is inclined outward with respect to the optical axis of the light source unit, has a wide directivity and conversely is inclined inward. In that case, high-luminance light emission is obtained, which is preferable. Further, a structure provided with various optical surfaces such as a convex curved surface and a concave curved surface can obtain desired light emitting characteristics, and in the case of a scattering coating member containing a light reflecting material, each region, each Different reflection functions can be provided on the respective facing surfaces of the member, and when the two are joined, the above-mentioned interface reflection and internal scattering function can be imparted, and when the two are separated, diffused reflection on the surface of the covering member promotes light extraction. Can be a structure. As described above, the coating region, the reflectance of the coating member, for example, the concentration of the light-reflecting material may be constant as in the embodiments and examples, and different regions may be provided or distributed. You may Thereby, different reflection functions can be imparted to each region and part, for example, the concentration of the light-reflecting material may be changed between the inner region on the light source side and the outer region outside it, or each region may be covered by a covering member having a different concentration. The light emitting device can be formed to have different scattering properties in each of the inner and outer regions. For example, the outer region may be made of a high-concentration light-reflecting material to enhance the scattering property and reduce the color unevenness of the outer edge portion of the emitted light.

(Light transmitting member)
The light transmissive member 20 may be bonded to the first surface of the light emitting element 10 or the first surface of the wavelength conversion member 40 to improve the light extraction efficiency. The light transmitting member 20 has at least a light emitting side surface 21 and a light incident side surface, and the light emitting side surface 21 can be formed into various shapes depending on the purpose. For example, as described above, by forming the surface 21 on the light emitting side into a convex lens shape having a convex curved surface and a spherical surface (hemispherical surface), uniform transmission characteristics (critical angle) can be obtained with respect to light incident in all azimuth angles. Can be taken out efficiently. Further, the radiation angle of light can be made smaller than that of the spherical surface by using not only the spherical surface but also a desired curvature and a convex lens shape, for example, a bullet shape. Besides, the light may be diffused by forming a concave curved surface or a concave lens shape, and as described in Embodiment 4 and FIG. 9, it may be an optical element having a desired directivity.

The light transmitting member 20 is formed using a resin material such as an epoxy resin, a silicone resin, a modified silicone resin, a urea resin, a urethane resin, an acrylic resin, a polycarbonate resin, a polyimide resin, or the like, like the base material of the covering member 30. can do. Since the light transmitting member 20 also plays a role as a sealing material that protects the light emitting element 10 and the wavelength conversion member 40, a material excellent in weather resistance, heat resistance, and hardness is preferable, such as an epoxy resin or a hard silicone resin. Are preferable, and glass may be used. Furthermore, the above-mentioned phosphor, and/or the above-mentioned light-scattering particles such as TiO ₂ , and/or the above-mentioned filler such as quartz glass, and the above-mentioned pigment, etc. are appropriately added to the light-transmissive member 20. A desired light emitting property can be obtained, and the same applies to a transparent resin material such as a transparent member and the adhesive 15. Further, the light transmitting member 20 can be molded into a desired size and a desired shape as described above by compression molding, transfer molding, or the like.

(Mounting board)
On the other hand, in the light emitting device 100 of FIG. 1, as the substrate 50 on which the light emitting element 10 is mounted, one having a wiring 51 connected to an electrode of the element formed on at least the surface can be used, and a wiring 52 for external connection can be used. (FIGS. 7 and 9) and the like may be provided. The material of the substrate is, for example, aluminum nitride (AlN), and is made of single crystal, polycrystal, sintered substrate, other materials such as ceramics such as alumina, glass, semi-metal or metal substrate such as Si, and laminated layers thereof. A body or a composite body can be used, and metal and ceramic are preferable because they have high heat dissipation. It should be noted that the substrate 50 may not have wiring. For example, the growth substrate side may be mounted with the element of FIG. 5 to connect the electrode of the element to the electrode of the device by wire, or the wiring may be provided to the wavelength conversion member to connect. But it's okay. Further, as in the illustrated light emitting device, the cover member 30 may be provided on the mounting substrate 50, or the outer side surface of the mounting substrate 50 may be covered. Further, it is preferable that at least the surface of the mounting substrate 50 is made of a highly reflective material. As shown in FIGS. 1 and 2, the light emitting element 10 is bonded onto the wiring 51 by a conductive adhesive material 60 and electrically connected to the outside. As the conductive adhesive material 60, solder, Ag paste, Au bump, or the like can be used.

(Frame, laminated substrate, base material)
The light emitting device 100 shown in FIG. 1 has a frame body 55 and is a holding member for the covering member 30. The frame body 55 can be formed of ceramic, resin, or the like. Alumina, which has high light reflectivity, is preferable, but it is not limited to this as long as a reflective film is formed on the surface. If it is a resin, screen molding or the like may be used, and the molded body may be adhered to the mounting substrate. Further, it is preferable to increase the reflectance by using a light-reflecting material like the covering member 30. Further, like the above-mentioned addition member, the frame body may be colored depending on the purpose. The frame body can be removed after filling or molding the covering member. Further, the frame body may be formed integrally with the mounting substrate of the light emitting element, such as the laminated substrate 56, a device substrate having a cavity structure made of a base material or the like.

(Adhesive)
An adhesive material 15 may be interposed at the interface between the light emitting element 10 and the wavelength conversion member 40, whereby both members are fixed. The adhesive 15 is preferably made of a material that can effectively guide light emitted from the light emitting element 10 to the wavelength conversion member 40 side and can optically connect both members. Examples of the material include resin materials used for the above-mentioned members, and as an example, a translucent adhesive material such as silicone resin is used. A similar translucent adhesive may be provided between the other members, for example, the adhesive 55 in the second embodiment (FIG. 7) on the optical path.

(Method of manufacturing light emitting device)
An example of a method of manufacturing the light emitting device 100 of the example shown in FIG. 1 will be described below with reference to FIG. First, as shown in FIG. 6A, bumps 60 are formed on the substrate 58 or on the light emitting element 10, and the light emitting element 10 is flip-chip mounted via the bumps 60. In this example, one LED chip is arranged and mounted in a region corresponding to one light emitting device on the submount substrate 58 (however, the number of LED chips can be appropriately changed). Next, a silicone resin as an adhesive is applied to the first surface side of the light emitting element 10 (the back surface of the sapphire substrate 1 or the exposed surface of the nitride semiconductor 11 when the substrate is removed) to form the wavelength conversion member 40. Stack. Then, the silicone resin is thermally cured to bond the light emitting element 10 and the wavelength conversion member 40. Further, a frame 57 having a predetermined size and shape is provided upright around the light emitting element 10. Here, the height of the frame 57 is lower than that of the first surface of the wavelength conversion member 40, but may be substantially the same or higher.

Next, a liquid resin 31 containing light-reflecting particles is potted in the frame 57 by a dispenser (liquid metering device) 71 or the like so as to cover the side surface of the wavelength conversion member 40. The dropped resin 36 creeps up on the wall surface side of the light emitting element 10 due to the surface tension, and covers the side surface of the wavelength conversion member 40. Then, the resin 36 is cured to form a covering member 37. Here, in the covering member 37, a concave portion that is recessed at a position lower than the first surface of the wavelength conversion member 40 is formed on the surface thereof, in other words, a convex portion in which the first surface of the wavelength conversion member 40 is arranged at the highest position. The window portion is shaped like a window, and the surface of the covering member 37 becomes an inclined surface in the periphery thereof. Next, as shown in FIG. 6(B), an appropriate amount of liquid thermosetting resin 26 serving as a light transmitting member is dropped on the covering member 37 and the wavelength converting member 40 by the same dispenser or the like. Subsequently, as shown in FIG. 6C, a predetermined pressure is applied from above by the upper mold 72 having a hemispherical lens mold to compress the resin layer 26, and in that state for a predetermined time. The resin layer 26 is held and the resin layer 26 is primarily cured. Here, it is preferable that the heating temperature and the heating time in the mold are set to conditions such that the resin reaches a hardness sufficient to maintain a predetermined shape. For example, the primary curing temperature is 100 to 170°C, preferably about 120 to 150°C. The curing time is 200 to 900 seconds, preferably 250 to 600 seconds. Further, depending on the shape of the inner surface of the upper mold 72, it is possible to form a lens having a desired lens diameter and a desired radius of curvature.

Further, as shown in FIG. 6D, the substrate provided with the series of light emitting devices in which the resin molded body 27 having the desired lens shape is formed is taken out from the mold and heated under predetermined conditions to mold the resin. The body 27 is secondarily cured. The conditions of the secondary curing are, for example, the temperature of the secondary curing is set equal to or higher than that of the primary curing so that the resin molded body 27 is sufficiently cured, and the time of the secondary curing is set to be longer than the primary curing. Preferably. In the case of epoxy resin and hard silicone resin, the time for secondary curing is set to about 3 to 5 hours. If the secondary curing is sufficiently performed in this way, it is possible to prevent unreacted curing components from remaining in the resin molded body 80 and adversely affecting the reliability of the light emitting device. Further, by performing secondary curing after taking out from the mold, the throughput of the process can be increased. Finally, dicing is performed at a predetermined position (for example, the dotted line A in FIG. 6D), cut into a desired size, and individualized to obtain the light emitting device 100 in FIG.

(Embodiment 2)
FIG. 7A is a schematic sectional view of the light emitting device 200 according to Embodiment 2 of the present invention.
(B) is a schematic sectional view for explaining the peripheral portion of the light source. In the light emitting device 200, the structure other than the light transmitting member 20 is substantially the same as that of the first embodiment, and therefore, the same configurations are denoted by the same reference numerals and the description thereof will be appropriately omitted. The light emitting device 200 has a configuration in which a light transmitting member 20 preformed in a hemispherical shape having a diameter R (=W) is bonded to a first surface of a wavelength converting member 40 via a light transmitting adhesive material 28. ing. In this light emitting device 200, an incident area 82 that joins the adhesive 28 with a diameter L2 and a reflective area 92 outside the incident area 82 are provided on the light incident side surface of the light transmitting member 20. The reflective region 92 and the surface 93 of the covering member are separated from each other, and a space 85 is provided between them, and the reflective region 92 is the bottom surface of the light transmitting member 20 and forms an interface with the air to reflect the light. Therefore, the light extraction efficiency can be improved. As can be seen from the above-described analysis result shown in FIG. 4, the light emitting device 200 according to the second embodiment has a higher light extraction efficiency than the light emitting device 100 according to the first embodiment. It is small and has an excellent configuration when the device is small. The translucent adhesive material 28 is preferably a material having a refractive index substantially the same as that of the light transmissive member 20 to be joined. This is for reducing the reflection of light at the interface between the light transmitting member 20 and the light transmitting adhesive 28 and improving the optical coupling efficiency. If the light transmitting member 20 and the light transmitting adhesive 28 are made of substantially the same material, for example, if they are made of substantially the same resin. It can be achieved easily.

Further, the intervening translucent adhesive material 28 is provided in a region facing the incident region 82 on the light source unit side, that is, on the surface on the light incident side, with the first face of the wavelength conversion member 40 which is the emission face of the light source unit. An incident area 81 having a diameter L1 is provided at the interface, and a reflective area 91 is provided at the interface with the surface of the covering member. The diameter L2 is preferably larger than the diameter L1, so that light can be efficiently guided from the light source section to the light transmitting member 20. In addition, since the reflective region 91 is provided, the return light in the translucent adhesive material is reflected and scattered on the surface of the covering member, and the optical coupling efficiency to the light transmissive member 20 can be improved. Depending on the range of the covering/joining area between the covering area (the light incident area 81 and the reflecting area 91) on the light source section side of the translucent adhesive 28 and the reflecting area 93 of the covering member exposed from the adhesive, The ratio of the reflection areas 91 and 92 outside the light source section can be adjusted, and for example, substantially the entire area of the surface of the light transmitting member 20 on the light incident side may be covered with the translucent adhesive material 28. In this case, a space between the light transmissive member and the covering member is filled with the translucent adhesive to form a transparent region, which promotes the transmission of light from the light transmissive member 20 into the translucent adhesive 28. In the same manner as in No. 1, the reflection area 91 on the surface of the covering member reflects the returning light and takes it out to the outside. That is, the incident surface side 25 is separated from the emission surface 81 of the light source section and the surface 93 of the covering member through the translucent adhesive, so that the light propagates in the separation area sandwiched between the surfaces. Then, the light is reflected and scattered by the surface 93, and is also reflected by the reflection area 92 facing the surface 93, so that an efficient reflection structure can be obtained.

(Embodiment 3)
FIG. 8 is a schematic cross-sectional view for explaining the vicinity of the light source unit of the light emitting device according to Embodiment 3 of the present invention. Note that the structure around the light source portion of the light emitting device described here can be applied to the configurations of the light emitting devices in other embodiments. The incident region 83 of the light transmitting member has a concavo-convex structure so that the incident light from the light emitting element 10 and/or the wavelength conversion member 40 of the light source unit is scattered, and the return light can be reflected and scattered. The reflection function of the region 90 can be supplemented, the directivity of the light emitted from the light emitting surface can be widened, and uneven brightness and uneven color can be easily reduced. In particular, when a plurality of light emitting elements 10 are mounted on one wavelength conversion member 40, the influence of the arrangement of each light emitting element 10 and the influences of light distribution, luminance unevenness, and color unevenness caused thereby are large and reduced. Therefore, it is preferable. Further, the uneven surface is expected to improve the optical coupling efficiency and the adhesion of both members. In addition, such a concavo-convex structure can be provided not only on the surface of the wavelength conversion member, but also on the surface of the light emitting element side thereof, and further on the surface of each member on the optical path to obtain the same effect. It may be provided in the boundary region with the transmissive member or in the light source part, for example, on the surface of the substrate 1 on the semiconductor layer 11 side, and such a structure is used although not described in detail in the examples. The concavo-convex structure such as the concavo-convex surface 43 of the wavelength conversion member can be provided by polishing, dry etching, wet etching, etc., and in addition to the irregular concavo-convex structure, the concavo-convex structure having a regular pattern can be formed.

Further, in the light emitting device shown in FIG. 8, the light emitting element 10 has a structure in which a semiconductor element structure 11 having a plurality of light emitting regions (light emitting layers) separated from each other is provided on one growth substrate 1. In this way, by bonding a single light emitting element and further forming the growth substrate 1 into the light emitting element 10 in which the light emitting regions are separated, a plurality of light emitting elements 10 are mounted on one wavelength conversion member 40. Compared with the case, the influence of the arrangement of the light emitting elements 10 and the light distribution can be reduced. Further, the wavelength conversion member 40 has a width smaller than the width of the first surface (the back surface of the growth substrate 1) of the light emitting element 10, that is, at least a pair of opposing side surfaces of the wavelength conversion member 40 has the light emitting element. It is located inside the side surface of 10. With this configuration, the luminance is relatively increased by narrowing the light emitting region, and the ratio of the color mixture of the primary light and the secondary light can be made uniform within the surface, so that the wavelength conversion member 40 as in the first embodiment. If the side surface of the light emitting element 10 is located substantially on the same plane as the side surface of the light emitting element 10, the amount of light from the light emitting element 10 is insufficient at the outer edge portion of the wavelength conversion member, and color unevenness easily occurs. it can. However, the “substantially the same surface” in the present specification may be substantially the same surface in terms of the function described above, and is, for example, about ±10% of the dimensions of the wavelength conversion member 40 and the light emitting element 10. can do. Further, in the light emitting device shown in FIG. 8, the light emitting element 10 and the wavelength conversion member 40 are directly bonded without a translucent adhesive material. Such joining can be realized by surface activation or crystal joining by thermocompression bonding, and by not using an adhesive that is a resin material with a relatively small refractive index, the interface with different refractive indexes is not increased and the bonding efficiency is improved. It is possible to improve the heat dissipation from the wavelength conversion member 40.

(Embodiment 4)
9A, 9B and 9C are schematic cross-sectional views of light emitting devices 300, 400 and 500 according to Embodiment 4 of the present invention, respectively. The fourth embodiment shows a modification of the shape of the light transmitting member 20 and the surface of the light emitting side thereof in the light emitting device according to the present invention, which can be applied to each of the embodiments and other main structures. Since the above is substantially the same as that of the first embodiment, the same components are designated by the same reference numerals and the description thereof will be appropriately omitted.

The shape of the light-emitting side surface 21 of the light transmitting member 20 in the light emitting device 300 of the example shown in FIG. 9A has a convex curved surface which is a flat shape from a hemispherical surface. More specifically, as shown by a black circle in the figure, the center of curvature is located at a position distant from the center of the surface of the wavelength conversion member 40 downward by Y, and the surface 21 has a diameter R (curvature radius) with the center as the center. It is composed of a part of a spherical surface of r=R/2), and its diameter (cross section width) W is W=2×(r ² −Y ² ) ^1/2 . Device 140, Model D described above
As shown in (DA), by making the light transmitting member 20 have a flat shape, the light emitting device can be made smaller and thinner, but the surface 21 changes from a hemispherical surface, so that the inner surface of the light transmitting member 20 is changed. Light reflection increases. However, in the light emitting device of the present invention, since the reflection area 90 occupies most of the surface of the light transmitting member 20 on the light incident side, the light in the light transmitting member is reflected there and is further scattered by the light reflecting material 35. By doing so, it can be taken out efficiently. In the drawing, the covering member 30 has a cross-sectional width sufficiently wider than that of the light transmitting member 20, but it goes without saying that the covering members 30 can be made smaller so that both ends are substantially the same. Further, the light emitting device 300 has the Zener diode electrically connected to the light emitting element 10 on the substrate 50. As described above, the protective element 14 for electrically protecting the light emitting element is embedded in the covering member 30 as shown in the drawing, and if it is separated from the light source section and the reflection area, it is optically effective with respect to other main constituent members. In addition, the diameters of the light emitting device and the covering member can be made substantially equal to the diameter of the light transmitting member, that is, if the light emitting device and the covering member are arranged inside the light transmitting member 20 and in the reflection region 90, the light emitting device can be downsized. It is preferable because it does not hinder the conversion.

In the light emitting device 400 of the example shown in FIG. 9B, the shape of the light transmitting member 20 is configured by an upper surface 22 composed of two convex curved surfaces intersecting directly above the center of the wavelength conversion member 40, and a side surface 23 thereof. Light emitted from the surface of the light source unit passes through the incident area 80, is reflected laterally mainly using the upper surface 22 as a reflecting surface, and is extracted outside the device by using the side surface 23 mainly as a light emitting surface. In addition, on the upper surface 22, a reflective film or member such as a metal film, a dielectric multilayer film, or a covering member containing the light reflective material 35 may be formed in order to enhance its reflection function. Further, in such a light emitting device, the extraction efficiency is improved by the reflection and scattering by the upper surface 22 and the reflection region 94, and the color unevenness of the emitted light of the wavelength conversion member 40 is alleviated. Moreover, the side surface of the wavelength conversion member 40 may be exposed from the coating member 30 by it.

In the light emitting device 500 of the example shown in FIG. 9C, the light transmitting member 20 has a shape including a flat upper surface 23 and a side surface 24 formed of a curved surface inclined toward the inner light source section. Have. As a result, the light emitted from the surface of the light source unit passes through the incident area 80, is condensed upward by the side surface 24, and is extracted from the upper surface 23 to the outside of the device. A similar reflective film may be formed on the side surface 24 as described in the light emitting device 400, and as shown by a dotted line in the drawing, a new frame is newly formed on the frame 56. It is also possible to fill a covering member containing the light-reflecting material 35 and form a laminated structure of the second light-reflecting layer covering the light-transmitting member 20.

The above examples show examples of application to various light transmitting members in the light emitting device of the present invention, and in the devices of FIGS. 9(b) and 9(c), the above-described reflective regions 94 and 95 are also included. The light source unit is provided with an incident region inside the light source unit. In particular, in a light transmitting member having various shapes instead of the convex curved surface as in FIG. 9A and other embodiments, more light is confined inside the light transmitting member than the convex curved surface, and Other structures work well. Also, regarding the relationship between the diameter L of the light source section and the diameter W of the light transmitting member, the relationship between the L/W ratio and the light extraction efficiency tends to become more prominent, and the efficiency drop tends to increase. it is conceivable that. As described above, the devices of FIGS. 9B and 9C have a structure in which, in addition to the reflection region facing the covering member on the incident surface side, the reflection regions are provided on the other surfaces 22 and 24, Further, the light emitting surface 23 is provided, and by this structure, suitable reflection and scattering by the covering member can be achieved in a part of the reflection region, particularly in the vicinity of the light source portion, and a device having a desired light emitting characteristic can be realized.

(Embodiment 5)
FIG. 10 is a schematic cross-sectional view of a light emitting device 600 according to Embodiment 5 of the present invention, and the other main structure except the mounting form of light emitting element 10 is substantially the same as in Embodiment 1, and therefore, The same configurations are denoted by the same reference numerals and description thereof will be omitted as appropriate. In the light-emitting device of the present invention, the light source section is covered with the light-reflecting covering member 30 and optically coupled to the light-transmitting member. Regarding the covering form, specifically, the mounting form of the light-emitting element and the covering member, It can take various forms. The light emitting device 600 of FIG. 9 is an example thereof, and the covering member 30 is molded into a rectangular parallelepiped shape or a plate shape without the substrate 50, and this molded body constitutes the exposed surface of the light emitting device together with the light transmitting member 20. ing. An electric conductor 61 connected to each electrode of the light emitting element 10 is provided, and an external connection portion is formed reaching the back surface side of the covering member 30. The stretching direction, the exposure position, and the surface of the conductor 61 can be changed as appropriate, and for example, the conductor 61 may be stretched outside on the same surface as the light transmitting member 20 and exposed. The conductor 61 may have a columnar shape as shown in FIG. 9 or a combination of layered shapes. With such a light emitting device 600, the light source portion such as the light emitting element 10 can be almost completely covered with the covering member 30 except the incident region 80 of the light source portion, and the light emitted from the light source portion is mounted on the mounting substrate 50. It is possible to reduce absorption and loss due to the conductor wiring and the like, and it is possible to improve the efficiency of extracting light from the light source unit.

Such an apparatus, for example, mounts a light emitting element on a supporting substrate, applies a covering member to form a molded body, and performs surface treatment with a release agent or the like in advance, and peels it from the supporting substrate. It can be realized by a method of taking out the molded body of the covering member in which the light source unit is embedded. For other structures, the light transmitting member may be molded or adhered before or after peeling of the molded body, and may be cut into individual devices before and after the peeling, and a supporting substrate such as a mold may be formed. The molded body may be formed on the light transmissive member by using it. Further, in the wiring structure of the light source part, the surface on the incident region 80 side is placed so as to face the support substrate, and a conductor is formed by film formation, plating, bumps or the like as an electrode of the light emitting element and as a conductor on the electrode. However, the coating member may be formed, the wiring side surface is placed facing the supporting substrate, the light emitting element side, the supporting substrate side or both in advance, the conductor or the wiring layer on the supporting substrate, You may peel by providing the conductor which combined them.

Hereinafter, examples according to the present invention will be described in detail. Needless to say, the present invention is not limited to the examples described below.

(Examples 1 to 3)
In the light emitting devices of Examples 1 to 3, the light emitting element 10 as shown in FIG. 7, or the element and the wavelength conversion member 40 bonded to the element are covered with the side surface by the covering member, and the exposed emission surface of the upper surface of the light source unit. It has a structure in which the lens 20 is adhered to the upper surface thereof with an adhesive 28. Specifically, on the wiring 51 of the AlN ceramic substrate 50, one blue LED chip having a substantially square shape of about 1 mm×1 mm is flip-chip mounted by the bump 60 as the light emitting element 10. In the first embodiment, the side surface of the LED chip is covered with the covering member 30 filling the periphery thereof in a state where the emission surface of the surface of the sapphire substrate which is the growth substrate 1 of the LED 10 is exposed. The covering member 30 is a silicone resin containing the light-reflecting material 35, which is fine particles of TiO _{2 having} a particle diameter of about 270 nm, in a concentration of about 23 weight percent. Further, in Examples 2 and 3, one piece of YAG sintered body, which is the plate-like wavelength conversion member 40, is bonded onto the growth substrate 1 of the LED 10 by the translucent adhesive 15 made of silicone resin. Then, as shown in the drawing, in a state where the emission surface of the surface of the wavelength conversion member 40 is exposed, as in the first embodiment, a part of the bottom surface and the side surface of the wavelength conversion member 40 by the covering member 30, the side surface of the LED chip, and the like. The surface of is encapsulated. The surface of the covering member 30 is inclined in the vicinity of the light source part so as to crawl on the side surface continuous from the emission surface of the light source part as shown in the figure. The outer shape of the wavelength conversion member 40 is a rectangular shape having dimensions of about 1.1 mm×1.1 mm in Example 2 and about 1.5 mm×1.5 mm in Example 3, and the thickness thereof is about 150 μm. Then, in each of the examples, the coating member is made of a silicone resin so that the light emitting element 10 or the light emitting portion of the light source portion of the wavelength conversion member 40 is included on the surface of the coating member and the optical axis is located substantially at the center thereof. The hemispherical lens-shaped light-transmitting member 20 having a diameter R of about 4 mm is bonded to the light-exiting surface thereof with a light-transmitting adhesive 28 made of the same silicone resin.

The ratio (L/R) of the diameter L of the light source portion to the diameter R of the light transmitting member 20 is about 0.250 in Example 1, about 0.275 in Example 2, and about 0.375 in Example 3, respectively. is there. The blue monochromatic light-emitting device of Example 1 emits light with an emission peak wavelength of 449 nm and an emission output of 522 mW at a driving current of 350 mA. Further, the white light emitting device of Example 2 has a luminous flux of 115 lm (chromaticity y value of 0.38) at a driving current of 350 mA, and a luminous flux of 170 lm (same chromaticity y value) at a driving current of 550 mA, and has relatively high brightness. .. The white light emitting device of Example 3 has a relatively high luminous flux with a luminous flux of 135 lm (chromaticity y value of 0.38) at a driving current of 350 mA and a luminous flux of 200 lm (same chromaticity y value) at a driving current of 550 mA.

(Examples 4 to 6)
Next, by changing the configuration of the wavelength conversion member 40, the influence of the presence or absence of the light transmission member 20 on the light emission efficiency will be verified below. The light emitting device of the fourth embodiment is the same as that of the third embodiment, and the light emitting devices of the fifth and sixth embodiments respectively change only the configuration of the wavelength conversion member 40 of the fourth embodiment. In Example 6, a silicate phosphor of (Sr,Ba) ₂ SiO ₄ :Eu was dispersed in a silicone resin in the same manner as in Example 5 using a sheet in which the same YAG phosphor was dispersed in a silicone resin. It is a sheet. These resin sheets are produced by spin-coating a resin coated with a release agent with a resin having a phosphor diffused therein, curing the resin, and cutting it into a predetermined size. In the light emitting devices of Examples 4 to 6, the difference in light emission efficiency depending on the presence or absence of the light transmitting member 20 is shown in FIG. It should be noted that after mounting the light transmitting member 20 of Examples 4, 5, and 6 are denoted as D, E, and F, and before mounting the light transmitting member 20 are denoted as d, e, and f, respectively. As shown in FIG. 11, in any of the examples, by mounting the light transmitting member 20, it is possible to increase efficiency in light emission of the same chromaticity, and it can be confirmed that light emission efficiency is improved.

When a sintered body is used as the wavelength conversion member 40, it may be difficult to produce a sintered body, the conversion efficiency may be reduced, or the firing of two or more kinds of phosphors may be greatly restricted. is there. On the other hand, a sheet produced by diffusing a phosphor in a resin has a low production temperature and does not impair the characteristics of the phosphor, and thus can be produced regardless of the type of the phosphor. For example, as shown in FIG. 11, the resin sheet using the silicate phosphor exhibits higher conversion efficiency than that using the YAG phosphor. The surface of the plate coated with the release agent may be flat, or a concavo-convex structure may be formed on the resin sheet as a concavo-convex surface.

INDUSTRIAL APPLICABILITY The light emitting device of the present invention can be suitably used for a light source for illumination, an LED display, a backlight light source such as a liquid crystal display device, a traffic light, a lighting switch, various sensors and various indicators.

10... Light emitting element (1... Growth substrate, 2... First conductivity type (n type) semiconductor layer, 3... Active layer, 4... Second conductivity type (p type) semiconductor layer, 5... Translucent conductive layer, 6 ...Second electrode (p-side pad electrode), 7
... 1st electrode (n side pad electrode), 8... Protective film, 11... Semiconductor element structure, 14... Protective element, 15... Adhesive material, 16... Light emitting part, 20 (20a-d)... Light transmitting member ( 21... Surface on light emitting side, 22, 24, 25... Reflective surface, 23... Light emitting surface) 26... Resin layer, 28... Adhesive material, 30-34... Covering member, 35... Light reflecting material, 40... Light transmitting ( (Wavelength conversion) member, 50, 58... Mounting substrate/base material (51-52... Wiring pattern, 55-57... Frame body or laminated substrate or base material), 60... Conductive adhesive material, 61... Conductor, 71... Dispenser, 72... Upper mold

Claims (3)

A covering member containing a light-reflecting material,
A light-transmitting member having a light-emitting side surface and a light-incident side surface that faces the surface of the covering member and is disposed in the surface;
On the light incident side surface of the light transmitting member, a light emitting element and the incident area of the light emitting element are coupled to an incident area surrounded by an outer reflection area, and a light source part partially embedded in the covering member. And a wavelength conversion member that is coupled to the side and is excited by the light emitting element. The light transmitting member is a convex curved surface on the light emitting side, at least the reflection region on the light incident side is a substantially flat surface,
The light emitting device according to claim 1, wherein a cross-sectional width of the incident region is half or less of a surface of the light incident side. A covering member containing a light-reflecting material,
A light-transmitting member having a light-emitting side surface of a convex curved surface and a light-incident side surface that faces the surface of the covering member and is disposed in the surface;
A light source unit is provided on the light incident side surface of the light transmitting member, the light source unit being coupled to an inner incident region surrounded by a reflection region of a substantially flat surface and partially embedded in the covering member. And a light emitting element provided in
A light-emitting device in which a cross-sectional width of the incident region is half or less of a surface of the light incident side.

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