JP2020094285A - Substrate holder and film deposition apparatus - Google Patents

Abstract

To provide a substrate holder that can hold a substrate while suppressing occurrence of breakage in the substrate.SOLUTION: A substrate holder 30 for holding a substrate 2 while exposing a treatment region 21a of the substrate 2 includes: holding parts 310, 320 for holding both sides 21, 22 of the substrate 2 in non-contact with a corner part 24 of the substrate 2; an abutment part 330 abutting on an end face 23 of the substrate 2 in non-contact with the corner part 24 of the substrate 2.SELECTED DRAWING: Figure 1

Description

The present invention relates to a substrate holder and a film forming apparatus.

In a film forming process of a substrate used for a semiconductor device, there is a method in which the substrate is supported in an upright state (a posture in which a surface to be processed is vertical) and is conveyed between chambers of a film forming apparatus. The substrate is held by the substrate holder in a state where the surface to be processed is opened (exposed) to the outside, and is moved between the chambers by the transfer means that supports the substrate holder (Patent Document 1). An example of the configuration of the substrate holder is a configuration in which the substrate is sandwiched between two upper and lower frame bodies, and the frame body is fixed and held by fastening the frame body with a fastener such as a screw.

International Publication WO2016/017602

FIG. 8 is a schematic cross-sectional view (cut-side end view) showing a configuration of a substrate holder according to a conventional example. As shown in FIG. 8, the substrate holder 130 has an opening that exposes the processed region of the substrate 2, and a first frame 131 that contacts the first surface 21 including the processed region of the substrate 2, and the substrate. The second frame body 132 is in contact with the second surface 22 of the second frame 22, and is fastened with the screw 34. As shown in part C of FIG. 8, the corner portion 24 of the substrate 2 (the boundary portion between the first surface 21 and the substrate-side end surface 23, and the boundary portion between the second surface 22 and the substrate-side end surface 23) is The first frame 131 and the second frame 132 are in contact with each other. Therefore, chipping (chips (chips) are generated due to chipped corners) occurs at the corners 24 due to the force due to tightening, the deformation due to thermal expansion during heating, and the like. The corner portion 24 of the substrate 2 is a portion where burrs are generated at the time of manufacturing the substrate, and when the burrs are chipped to form chips, the inside of the device is contaminated. Further, even if chipping is small at the beginning, the damage range is likely to spread in a later process by catching it, and once it occurs, it has a great influence on productivity. As a conventional example of the countermeasure, there is chamfering of the substrate, but there is a problem that the cost of the substrate increases.

It is an object of the present invention to provide a substrate holder that can hold a substrate while suppressing the occurrence of damage to the substrate.

In order to achieve the above object, the substrate holder of the present invention,
A substrate holder for holding a substrate by exposing a processed region of the substrate,
A holding part that holds both sides of the board without contacting the corners of the board,
Non-contact with the corners of the board, butted against the end surface of the board,
It is characterized by including.
In order to achieve the above object, the film forming apparatus of the present invention is
A film forming apparatus for forming a film on a substrate,
A plurality of chambers including a film forming chamber,
A substrate transfer unit that supports the substrate holder and moves between the plurality of chambers,
It is characterized by including.

According to the present invention, it is possible to hold a substrate while suppressing the occurrence of damage to the substrate.

Schematic sectional view of a substrate holder according to an embodiment of the present invention (cutaway end view) Schematic perspective exploded view of a substrate holder according to an embodiment of the present invention Schematic sectional view of a substrate holder according to an embodiment of the present invention (cutaway end view) Schematic plan view of the second frame body of the substrate holder according to the embodiment of the present invention. Schematic sectional view of a substrate holder according to a modified example of the embodiment of the present invention (cut end view) Schematic sectional view of a substrate holder according to a modified example of the embodiment of the present invention (cut end view) Schematic plan view of the second frame body of the substrate holder according to the second embodiment of the present invention. Schematic sectional view of a substrate holder according to a conventional example (cutaway end view) Schematic diagram of a sputtering apparatus in an embodiment of the present invention Schematic diagram of a film forming apparatus according to an embodiment of the present invention An example of flow chart of film formation process

MODES FOR CARRYING OUT THE INVENTION Modes for carrying out the present invention will be exemplarily described in detail below based on embodiments with reference to the drawings. However, the dimensions, materials, shapes, and their relative arrangements of the components described in this embodiment should be appropriately changed depending on the configuration of the apparatus to which the invention is applied and various conditions. That is, the scope of the present invention is not intended to be limited to the following embodiments.

(Example 1)
<Overall structure of film forming apparatus>
FIG. 10 is a schematic diagram schematically showing the overall configuration of the film forming apparatus 1 according to the embodiment of the present invention. The film forming apparatus 1 includes a stocker chamber 11 for accommodating a substrate 2 to be film-formed, a heating chamber 12 for heating the substrate 2, and a film-forming chamber 13 for forming a film on a surface to be processed of the substrate 2. And In the film forming chamber 13, a substrate processing apparatus 14 for performing pretreatment such as cleaning of the surface to be processed of the substrate 2 and etching treatment prior to the film forming processing, and film forming processing to the surface to be processed of the substrate 2 The sputtering device 15 as a film forming processing unit. The film forming apparatus 1 according to the present embodiment is configured to transfer between the chambers in a state where the substrate 2 is erected vertically (a posture in which the surface to be processed is vertical) (see FIG. 9).

FIG. 11 is an example of a flowchart of the film forming process in this embodiment. The substrate 2 is sequentially transferred from the stocker chamber 11 to the heating chamber 12 (S101), from the heating chamber 12 to the substrate processing apparatus 14 of the film forming chamber 13 (S103), and from the substrate processing apparatus 14 to the sputtering apparatus 15 (S105). Then, a film forming process is performed. After the substrate 2 is heat-treated by the heater 121 in the heating chamber 12 (S102), first, surface treatment is performed by the substrate processing apparatus 14 in the film forming chamber 13 (S104). The surface-treated substrate 2 is then subjected to a sputtering process using targets 151, 152 and 153 made of different materials by the sputtering device 15 (S106), and the film forming process is completed. The film forming process flow shown here is merely an example, and the present invention is not limited to the process contents shown here.

The film forming apparatus 1 according to the present embodiment can be applied to, for example, various electrode formations involving pretreatment. Specific examples include, for example, film formation of a plating seed film for a FC-BGA (Flip-Chip Ball Grid Array) mounting substrate and a metal laminated film for a SAW (Surface Acoustic Wave) device. In addition, a conductive hard film in a bonding portion of an LED, a film of a terminal film of a MLCC (Multi-Layered Ceramic Capacitor), and the like can be given. In addition, it can be applied to the film formation of the electromagnetic shield film in the electronic component package and the terminal film of the chip resistor. The size of the processed substrate 2 may be, for example, 200 mm×200 mm in length and width and 0.7 to 6.0 mm in thickness. As the material of the substrate 2, glass, alumina, ceramic, LTCC (Low
(Temperature Co-fired Ceramics: low temperature co-fired ceramics) and the like.

<Substrate transport configuration and sputtering device>
As described above, the substrate 2 is conveyed vertically between the chambers of the film forming apparatus 1, and the surface 21 to be processed becomes vertical even in the sputtering chamber 51 (chamber). Is oriented horizontally). As shown in FIG. 9, the substrate 2 is held and held by the substrate holder 30 with the peripheral edge portion of the outer periphery of the processing target region being held (exposed) in the processing target surface 21. The substrate holder 30 that holds the substrate 2 is supported by the substrate holder support portion 43. The substrate holder support part 43 is provided with a wheel 431 as a substrate transfer means below, and is configured to be movable in the sputtering chamber 51 on a rail 432 laid on the bottom surface of the sputtering chamber 51 while supporting the substrate holder 30. Has been done. The term "vertical" used herein means that it is perpendicular to the bottom surface of the sputtering chamber 51 or the top surface of the rail 432 (substrate transfer surface), and may not match the gravity direction (vertical direction) depending on the device configuration. . Similarly, the horizontal direction referred to here may not coincide with the direction orthogonal to the gravity direction. That is, in this embodiment, the vertical and horizontal directions are defined on the assumption that the installation surface of the substrate holder support portion 43 on the inner wall of each chamber is a horizontal surface, but if the direction of the installation surface changes, the vertical direction It goes without saying that the rules for the left and right directions also change accordingly.

The sputtering chamber 51 of the sputtering apparatus 15 has been evacuated to a predetermined high vacuum pressure by an exhaust device 56 in advance. The substrate holder 30 moves at a constant speed in the sputtering chamber 51, and during that time, the substrate 2 is subjected to a film forming process by the cathode unit 50. In the sputtering chamber 51, the substrate 2 (substrate holder 30) and the cathode unit 50 are arranged so as to face each other in the horizontal direction. The sputtering chamber 51 is adjusted to a vacuum degree (for example, 2×10 Pa to 2×10 ⁻⁵ Pa) suitable for the sputtering process by the exhaust device 56, and the flow rate of the sputtering gas is controlled from the gas supply source 57. Supplied. As a result, a sputtering atmosphere is formed inside the sputtering chamber 51. As the sputtering gas, for example, a rare gas such as Ar, Kr, or Xe or a reactive gas for film formation is used.

The target 151, which is a plate-shaped film forming material, is arranged so as to be parallel to the transport path of the substrate 2, that is, the surface 21 to be processed of the substrate 2. A cathode electrode 251 is provided in close contact with the target 151 on the side opposite to the side facing the substrate 2. A power supply 55 is connected to the cathode electrode 251, and the sputtering chamber 51 is grounded. When voltage is applied by the power supply 55, the cathode electrode 251 serves as a cathode and the wall of the sputtering chamber 51 serves as an anode.

<Sputtering>
By forming the sputtering atmosphere and applying a voltage from the power supply 55 to the cathode electrode 251, a plasma region is generated near the surface of the target 151 facing the substrate 2. The target particles are emitted from the surface of the target 151 facing the substrate 2 due to the collision between the sputtering gas ions generated by the generation of the plasma region and the target 151. The target particles emitted from the target 151 fly toward the substrate 2 and are deposited, whereby a film is formed on the surface 21 to be processed of the substrate 2. The targets 152 and 153 are also different in material from the target 151 and have the same film formation processing mechanism by sputtering.

<Structure of substrate holder 30 (characteristics of this embodiment)>
With reference to FIGS. 1 to 4, the configuration of the substrate holder 30, which is a feature of this embodiment, will be described.
FIG. 1 is a schematic partial cross-sectional view (cut end view) of a substrate holder according to an embodiment of the present invention. FIG. 2 is a schematic perspective exploded view of the substrate holder according to the embodiment of the present invention. FIG. 3 is a schematic cross-sectional view (cut-side end view) of the substrate holder according to the embodiment of the present invention, and is a diagram for explaining how the substrate 2 is assembled to the substrate holder 30. FIG. 4 is a schematic plan view of the second frame body of the substrate holder according to the embodiment of the present invention.

As described above, the substrate holder 30 holds the substrate 2 by exposing the region to be processed of the substrate 2, and is roughly the substrate retainer 31 that is the first frame body and the second frame body. The substrate 2 is held by sandwiching both sides of the substrate 2 with the substrate holder body 32. The processed surface 21, which is one surface (first surface) of the substrate 2, is composed of a processed area 21a to which the above-described film formation processing is applied and a peripheral area 21b surrounding the outside (outer circumference) thereof. To be done.

The substrate retainer 31 is inside the substrate end portion in the peripheral region 21 b of the processed surface 21 of the substrate 2, that is, the corner portion 24 (substrate end portion) of the boundary between the processed surface 21 and the side end surface 23 of the substrate 2. The contact surface (first contact portion) 310 that contacts the surface to be processed 21 is provided at the position. How much inside of the corner portion 24 the contact surface 310 is brought into contact with the peripheral area 21b of the processed surface 21 is appropriately set within a range in which the occurrence of chipping can be suppressed. The contact surface 310 is a tip end surface of the convex portion 311 projecting in the direction facing the substrate holder body 32 in the substrate retainer 31. The convex portion 311 is formed in a substantially rectangular ring shape at a portion of the substrate retainer 31 facing the substrate holder body 32. A groove (concave portion) for forming a gap for making the substrate retainer 31 non-contact with the corner portion 24 of the substrate 2 outside the convex portion 311 in the portion of the substrate retainer 31 facing the substrate holder body 32. 313 is formed. In addition, an opening portion 312 that opens (exposes) the processed surface 21 of the substrate 2 to the outside is formed inside the convex portion 311 in the portion of the substrate holder 31 facing the substrate holder body 32. The substrate retainer 31 is a frame-shaped member that surrounds the area to be processed 21 a of the substrate 2.

The substrate holder body 32 is the other surface (second surface) of the substrate 2, that is, the corner portion 24 of the boundary between the rear surface 22 and the side end surface 23 of the substrate 2 on the rear surface 22 opposite to the surface to be processed 21. The contact surface (second contact portion) 320 that contacts the back surface 22 is provided at a position further inside. How much inside of the corner portion 24 the contact surface 320 is brought into contact with the back surface 22 is appropriately set within a range in which the occurrence of chipping can be suppressed. The contact surface 320 is a tip end surface of the convex portion 321 that projects in the direction facing the substrate retainer 31 in the substrate holder body 32. The convex portion 321 is formed in a substantially rectangular ring shape at the portion of the substrate holder body 32 facing the substrate retainer 31. A groove portion (recessed portion) for forming a gap that makes the substrate holder main body 32 non-contact with the corner portion 24 of the substrate 2 is provided outside the convex portion 321 in the portion of the substrate holder main body 32 facing the substrate retainer 31. ) 323 is formed. Further, a concave portion 322 facing the back surface 22 of the substrate 2 with a gap is formed inside the convex portion 321 in the portion of the substrate holder body 32 facing the substrate retainer 31. Instead of the recess 322, an opening may be provided like the opening 312 of the substrate retainer 31. That is, a holder configuration may be used in which the back surface 22 of the substrate 2 is opened to the outside.

Positioning pins 33, which are abutting members for positioning the substrate 2 with respect to the substrate holder body 32, are fixed to the substrate holder body 32 with screws 35. The positioning pin 33 has a tip shape in which the width in the direction perpendicular to the substrate 2 gradually narrows toward the side end surface 23 of the substrate 2, and the tip surface 330 serves as an abutting portion. Abuts 23. Here, the direction perpendicular to the substrate 2 is synonymous with the thickness direction of the substrate 2, the direction in which the substrate retainer 31 and the substrate holder main body 32 face each other, the Z-axis direction in FIG. The width of the tip end surface 330 of the positioning pin 33 in the direction perpendicular to the substrate 2 is smaller than the thickness of the substrate 2 and is a position that avoids contact with the corner portion 24. In the present embodiment, the side end face is in the central portion in the direction. Abut 22. The position where the tip end surface 330 contacts the side end surface 22 does not have to be the central portion as long as it is a position where the occurrence of chipping can be suppressed.

The substrate retainer 31 and the substrate holder main body 32 are fastened and fixed to each other by a screw 34 as a fastening means in a state where the positioning pin 33 abuts on the end surface 23 of the substrate 2 and the contact surfaces 310 and 320 sandwich the substrate 2. .. The substrate retainer 31 and the substrate holder main body 32 are fastened at a plurality of locations by a plurality of screws 34, and in this embodiment, the clamping force per screw 34 is 5 to 40 cN/m. The screw hole 314 of the substrate retainer 31 and the screw hole 324 of the substrate holder main body 32 are provided on the substrate 2 outside the position where the positioning pin 33 and the substrate 2 abut. When the screws 34 are fastened, the contact surfaces 310 and 320 form a sandwiching portion that sandwiches both surfaces of the substrate 2 without contacting the corner portion 24 of the substrate 2. The substrate retainer 31, the substrate holder body 32, and the positioning pins 33 are made of SUS in this embodiment, but other metals may be used as long as they have a certain hardness. Further, another material may be appropriately used as long as a desired positioning and holding function can be obtained.

The contact surface 310 of the substrate retainer 31 and the contact surface 320 of the substrate holder main body 32 are configured to be in contact with both sides of the substrate 2 inside the corner portion 24 of the substrate 2 without contacting the corner portion 24. Thus, the force acting on the corner portion 24 in the thickness direction (Z direction) of the substrate 2 can be relaxed. In addition, the positioning pin 33 is configured so as to be in contact with the end face 23 of the substrate 2 inside the corner portion 24 of the substrate 2 and not in contact with the corner portion 24. The forces acting in the directions (directions parallel to the surfaces 21 and 22 of the substrate 2, XY directions) can be relaxed. As described above, since the substrate holder 30 does not have a portion that comes into contact with the corner portion 24 of the substrate 2, chipping can be suppressed from occurring in the substrate 2 that is not chamfered. That is, according to this embodiment, it is possible to hold the substrate while suppressing the occurrence of damage to the substrate.

<Assembling the substrate 2 into the substrate holder 30>
As shown in FIG. 3, in assembling the substrate 2 into the substrate holder 30, first, the substrate 2 is placed in a predetermined substrate accommodating portion of the substrate holder main body 32. It is placed on the contact surface 320 (FIG. 3A). At that time, the back surface 22 of the substrate 2 is placed on the contact surface 320, and the side end surface 23 of the substrate 2 is abutted against the tip end surface 330 of the positioning pin 33, whereby the substrate 2 can be positioned with respect to the substrate holder body 32. Yes (Fig. 3(B)). A state in which a frame-shaped substrate retainer 31 is covered on the substrate holder 32 on which the substrate 2 is positioned so as to cover the outer peripheral edge (peripheral region 21b) of the substrate 2 and the substrate 2 is sandwiched by the contact surfaces 310 and 320. To do. Then, by fastening with the screw 34, the substrate 2, the substrate pressing member 31, and the substrate holder main body 32 are integrally fixed (FIG. 3(C)).

<Arrangement of positioning pins 33>
As shown in FIG. 4, a plurality of positioning pins 33 are provided. The plurality of positioning pins 33 provided are arranged so as to abut only one of the two sides of the four sides of the substrate 2 that face each other. That is, the positioning pin 33 abuts on only one of the two sides, and the force in the direction along the substrate 2 does not act on the other side from the substrate holder 30. That is, the plurality of positioning pins 33 are not arranged to face each other in the butting direction. By configuring the portion of the substrate 2 opposite to the portion that abuts the positioning pin 33 in the direction along the substrate 2, the dimensional error in the substrate 2 and the substrate holder 30, dimensional change due to thermal expansion, etc. Can be absorbed to position the substrate 2.

In addition, the plurality of positioning pins 33 are respectively arranged at a position that abuts the end face 23 on one side of the two sides of the four sides of the substrate 2 that do not face each other and a position that abuts the end face 23 on the other side. It That is, by performing positioning in two directions along the substrate 2, the substrate 2 can be accurately positioned with respect to the substrate holder 30. Further, by arranging the plurality of positioning pins 33 so as to abut against one of the four sides of the substrate 2 at different positions, it is possible to perform more accurate positioning. Furthermore, by setting the side of the substrate 2 with which the positioning pin 33 abuts to be the lower end side of the four sides of the substrate 2 when the substrate 2 is vertically erected, the lower end surface of the substrate 2 when the substrate 2 is transported. The end face 23, which becomes the above, is supported by the positioning pin 33. As a result, a more stable holding state of the substrate 2 can be realized.

<Modification 1>
FIG. 5A is a schematic partial cross-sectional view (cut-side end view) of a substrate holder 30a according to a first modification of the first embodiment of the present invention. In this modification, the same components as those in the first embodiment are designated by the same reference numerals, and the repeated description will be omitted. As shown in FIG. 5A, in this modification, the positioning pin 33 is arranged in the groove 323 of the substrate holder body 32. Further, the substrate retainer 31 and the substrate holder main body 32 are in contact with each other at the portion tightened by the screw 34. Further, in the substrate holder main body 32, the contact surface 325 that contacts the substrate retainer 31 and the contact surface 320 that contacts the substrate 2 are configured to have the same height (in the Z direction of FIG. 2 and the like). ing. According to this configuration, in manufacturing the substrate holder body 32, the contact surfaces 320, 325 and the installation portion of the positioning pin 23 can be formed by the step of forming the groove 323, and the manufacturing cost can be reduced. You can

<Modification 2>
FIG. 5B is a schematic partial cross-sectional view (cut-side end view) of the substrate holder 30b according to the second modification of the first embodiment of the present invention. In this modified example, the same components as those in the first and modified examples are denoted by the same reference numerals, and the repeated description will be omitted. As shown in FIG. 5B, in the second modification, unlike the first modification, in the substrate retainer 31, the contact surface 315 that contacts the substrate holder body 32 and the contact surface 310 that contacts the substrate 2 are provided. , (In the Z direction in FIG. 2 and the like), they have the same height. According to this structure, in manufacturing the substrate retainer 31, the contact surfaces 310 and 315 can also be formed in the step of forming the groove portion 313, and the manufacturing cost can be reduced.

<Modification 3>
FIG. 6A is a schematic partial cross-sectional view (cut-side end view) of a substrate holder 30c according to a third modification of the first embodiment of the present invention. In this modified example, the same components as those of the first and modified examples 1 and 2 are designated by the same reference numerals, and the repeated description will be omitted. As shown in FIG. 6A, in the modified example 3, a region outside the convex portion 321 in the portion of the substrate holder main body 32 facing the substrate retainer 31 is provided with a groove like the groove portion 323 of the first embodiment. It is configured to eliminate the irregular shape. Specifically, the area outside the contact surface 320 of the substrate holder main body 32 is configured by a single surface 326 that forms a gap between the substrate holder body 32 and the substrate 2 so as to form a non-contact state with the substrate 2. ing. A part of the single surface 326 also serves as a surface for contacting the installation surface of the positioning pin 33 and the contact surface 315 of the substrate retainer 31. With such a configuration, the substrate holder body 32 can be made into a simple configuration that does not require the formation of the groove portion 323 and the positioning pin 33 installation portion as in the first embodiment, and the cost for manufacturing the substrate holder body 32 can be reduced. Can be reduced.

<Modification 4>
FIG. 6B is a schematic partial cross-sectional view (cut-side end view) of the substrate holder 30d according to the fourth modification of the first embodiment of the present invention. In this modification, the same components as those in the first embodiment and the first to third modifications are designated by the same reference numerals, and the repeated description will be omitted. As shown in FIG. 6B, in the modified example 4, unlike the modified example 3, the region outside the convex portion 311 in the part of the substrate retainer 31 facing the substrate holder body 32 is the same as in the first example. The configuration is such that a groove-like uneven shape such as the groove portion 313 is eliminated. Specifically, the area outside the contact surface 310 of the substrate retainer 31 is the plate 2
It is composed of a single surface 316 forming a gap with the substrate 2 so as to form a non-contact state with the substrate 2. Then, a part of the single surface 316 also serves as a surface that comes into contact with the contact surface 325 of the substrate holder body 32. With this configuration, the substrate retainer 31 can have a simple configuration that does not require the formation of the groove 313 as in the first embodiment, and the cost for manufacturing the substrate retainer 31 can be reduced.

(Example 2)
FIG. 7 is a schematic plan view of the substrate holder body 32e of the substrate holder 30e according to the second embodiment of the present invention. In this embodiment, the same components as those in the first embodiment and the modified examples 1 to 4 are designated by the same reference numerals, and the repeated description will be omitted. The substrate holder 30e according to the second embodiment has a configuration capable of accommodating and holding two substrates. Specifically, as shown in FIG. 7, the two substrates can be horizontally arranged and held at the same height. Note that FIG. 7 illustrates only the substrate holder body 32e and the positioning pins 33, and the substrate and the substrate retainer are not shown.

As shown in FIG. 7, the substrate holder main body 32e is provided with two recesses 322a and 322b corresponding to the two substrates respectively, and the contact surface 320 and the positioning pin 33 are arranged on the outer periphery of each of the recesses. ing. Here, in this embodiment, a positioning pin 33e is provided which enters the area between the adjacent substrates and positions one of the two substrates. The positioning pin 33e has a fixed portion 33e1, an extending portion 33e2, and a protruding portion 33e3. The fixing portion 33e1 is fixed with a screw 35 to a surface (or a surface facing the substrate pressing surface) that is brought into contact with the substrate retainer by fastening a screw 34 outside the substrate arrangement space in the substrate holder body 32e. The extending portion 33e2 extends from the fixed portion 33e1 between the two substrate arrangement spaces to a position facing one side of the substrate at a predetermined position. The projecting portion 33e3 projects from the side of the extending portion 33e2 toward the substrate placement space, and the tip surface 330e of the projecting portion 33e3 abuts the one side of the substrate to position the substrate.

According to the positioning pin 33e of the present embodiment, in the holder configuration in which the two substrates are arranged side by side, the space provided for forming the screwing points (screw holes 324) between the two substrate installation spaces is used. Then, the abutting portion can be formed. Therefore, according to the present embodiment, it is possible to arrange the two substrates at the minimum required distance and to hold the substrates while suppressing the occurrence of damage to the substrates. The positioning structure using the positioning pins 33e of this embodiment can be appropriately applied to a substrate holder capable of holding three or more substrates.

<Other>
In the present embodiment, the contact surfaces 310 and 320 (the convex portions 311 and 321) are continuously formed in a substantially rectangular ring shape, but may be formed intermittently.
In addition, although the contact surfaces 310 and 320 are formed to have the same width in the present embodiment, they may have different widths. Further, the contact positions of the contact surfaces 310 and 320 may be displaced from each other in the width direction of the substrate 2.
The number and arrangement of the positioning pins 33 and the screws 34 are not limited to the number and arrangement in each of the above-described embodiments, and can be changed as appropriate. It should be noted that the screwing position by the screw 34 can prevent the pitching from occurring more reliably if it is separated from the corner of the substrate by a certain distance.
Each of the above-described embodiments and modifications can be combined with each other as much as possible.

2... Substrate, 21... Surface to be processed (first surface), 22... Back surface (second surface), 23... End face, 24... Corner, 30... Substrate holder, 31... Substrate retainer (first frame) , 310... Abutting surface (first abutting portion), 32... Substrate holder main body (second frame), 320... Abutting surface (second abutting portion), 33... Positioning pin, 330... Tip surface (projection) Abutting part), 34... Screw (fastening means)

Claims (16)

A substrate holder for holding a substrate by exposing a processed region of the substrate,
A holding part that holds both sides of the board without contacting the corners of the board,
Non-contact with the corners of the board, butted against the end surface of the board,
A substrate holder comprising: The sandwiching portion is
A first contact portion that contacts the first surface at a position inside the substrate end portion in a peripheral region outside the processed region of the first surface including the processed region of the substrate;
A second contact portion that contacts the second surface at a position inside the substrate end portion on a second surface of the substrate opposite to the first surface;
Have
The substrate holder according to claim 1, wherein the substrate is sandwiched between the first contact portion and the second contact portion. A first frame body having the first contact portion and an opening portion that exposes the region to be processed;
A second frame body having the second contact portion and the butting portion;
Fastening means for fastening the first frame body and the second frame body in a state where the abutting portion abuts on the end surface of the substrate and the first abutting portion and the second abutting portion sandwich the substrate. ,
The substrate holder according to claim 2, further comprising: The said 1st frame body has the groove part for forming a clearance gap between the said 1st frame body and the corner|angular part of a board|substrate, on the outer side of the said 1st contact part. Board holder. The said 2nd frame has a groove part for forming a clearance gap between the said 2nd frame and the corner|angular part of a board|substrate on the outer side of the said 2nd contact part, 3 or 4 characterized by the above-mentioned. The substrate holder described in. The substrate holder according to any one of claims 1 to 5, wherein a width of the abutting portion in a direction perpendicular to the substrate is smaller than a thickness of the substrate. 7. The substrate holder according to claim 1, wherein the abutting portion abuts on a central portion of the end surface of the substrate in a direction perpendicular to the substrate. The substrate holder according to claim 1, further comprising a plurality of the abutting portions. The substrate holder according to claim 8, wherein the plurality of abutting portions are arranged so as to abut only one of two sides of the four sides of the substrate which face each other. The plurality of abutting portions,
An abutting portion that abuts an end face on one of two sides of the four sides of the substrate that do not face each other;
An abutting portion that abuts an end surface on the other of the two sides;
The substrate holder according to claim 8 or 9, further comprising: The substrate according to any one of claims 8 to 10, wherein the plurality of abutting portions include a plurality of abutting portions abutting at different positions with respect to one of the four sides of the substrate. holder. A substrate holder that is supported by a substrate transfer means that moves between a plurality of chambers in a film forming apparatus so that the surface to be processed of the substrate is oriented in the horizontal direction,
The substrate holder according to any one of claims 8 to 11, wherein the plurality of abutting portions include abutting portions that abut an end surface of a lower end side of the substrate. It is possible to hold multiple substrates,
The substrate holder according to any one of claims 8 to 12, wherein at least one of the abutting portions is arranged between adjacent substrates. A film forming apparatus for forming a film on a substrate,
A plurality of chambers including a film forming chamber,
A substrate transfer unit that supports the substrate holder according to any one of claims 1 to 13 and that moves between the plurality of chambers,
A film forming apparatus comprising: 15. The film forming apparatus according to claim 14, wherein the substrate transfer unit supports the substrate holder so that a surface to be processed of the substrate is vertical. The substrate holder includes a plurality of the abutting portions,
The film forming apparatus according to claim 15, wherein at least one of the plurality of abutting portions abuts an end surface of a lower end side of the substrate.