JP2020093452A - Sheet member, method of manufacturing the same, and socket using the sheet member - Google Patents

Abstract

To achieve stable and inexpensive manufacturing of sheet members having a plurality of through holes to be accurately formed by molding, by making it possible to reliably remove a molding burr formed on the sheet member having the plurality of through holes by a simple method without using special equipment.SOLUTION: In a sheet member 1 formed of a sheet-like elastic material and having a first surface 11 and a second surface 12 facing in opposite directions, a plurality of through holes 10 penetrating from the first surface 11 to the second surface 12 is provided. An area between an inner wall surface 10a of the through hole 10 and the first surface 11 has a location 13 where the elastic material is missing.SELECTED DRAWING: Figure 3

Description

The present invention relates to a sheet member and a method for manufacturing the same, and in particular, it is used for holding a contact pin of an electrical component socket electrically connected to an electrical component such as a semiconductor device (hereinafter referred to as “IC package”). And a method of manufacturing the same, and a socket using the same.

Conventionally, as a socket for electric parts, an IC socket in which a contact pin is arranged is known. This IC socket is arranged on a wiring board and is configured to accommodate an IC package to be inspected. The terminals of this IC package and the electrodes of the wiring board are electrically connected via contact pins. After being connected, a test such as a continuity test is performed.

In recent years, due to the miniaturization and integration of IC packages, the pitch (interval) between terminals formed in large numbers in the IC package has become narrower. Along with this, even in an IC socket for inspecting an IC package, it is necessary to narrow the pitch of contact pins for making electrical contact with these many terminals.

If the structure of the IC socket is complicated, it is difficult to narrow the pitch of the contact pins, and therefore, simplification of the structure of the IC socket is demanded.

Against this background, an IC socket using a single elastic sheet member having a plurality of through holes has been proposed. In such an IC socket, since the contact pin can be pressure-contacted by using the elastic force of the sheet member, a contact pin having no coil spring can be used. It is held in each through hole and is elastically held by one sheet member. Since such a structure is simpler than the structure in which each contact pin has a coil spring, the contact pin can be downsized, and the pitch of the contact pins of the IC socket can also be narrowed. Is possible.

As a method of forming a through hole, that is, a holding hole for holding a contact pin, in the elastic sheet member, for example, there is a method by laser processing. In laser processing, a holding hole is formed by converging laser light into a minute spot diameter and using this to repeatedly scan a predetermined portion of the sheet member. At this time, since the processed portion is continuously affected by the heat of the laser light, it is difficult to form the diameter of the holding hole accurately and uniformly in the thickness direction of the elastic sheet member. The cross-sectional shape including the axis of the hole may deviate from the designed shape.

Further, the method of forming the holding hole by laser processing has the following problems. (1) The shape of the holding hole that can be formed is limited. (2) The powder of the component of the sheet member such as silica is generated because it is heated by the laser light, the powder adheres to the inner wall of the formed holding hole, and the adhered powder is removed from the inner wall of the holding hole. Difficult to do. (3) Since it is necessary to process the holding holes one by one, a lot of time is required when processing a large number of holding holes. (4) In the process of sequentially processing the holding holes from one side of the sheet, the elastic sheet member is deformed due to the influence of heat, and the positions and shapes of the holding holes to be processed thereafter are deviated from the designed positions and shapes. ..

When forming the holding hole by laser processing, as a method of changing the position and shape of the holding hole to the designed position and shape, for example, a film formed of polyimide or the like is attached to the surface of the elastic sheet member to make it elastic. A method of suppressing thermal deformation of the sheet member can be considered, but in this case, a step of attaching the film to the elastic sheet member in advance is required, which takes a lot of time and labor.

On the other hand, if an elastic sheet member having a holding hole is manufactured by a method such as injection molding using a molding die in which a molding pin for forming the holding hole is erected, such a laser processing can be performed. It is possible to avoid various problems. Patent Document 1 discloses a method of manufacturing an elastic member having a holding hole for holding an electronic component much larger than a contact pin using a molding die. However, in the method using the molding pin, the resin enters into the gap between the molding pin and the groove for inserting the molding pin, so that a so-called molding burr is generated. According to the technique disclosed in Patent Document 1, the surface of the elastic sheet member manufactured by molding is subjected to surface treatment by polishing such as surface grinding, milling grinding, lapping, or mirror finishing processing to form a molding burr. To be removed.

JP 2012-71434A

However, in the technique disclosed in Patent Document 1, a large-scale secondary processing of surface treatment by polishing is required as post-processing for removing the molding burr formed on the surface of the sheet member, and equipment therefor is also required. Will be needed. Further, particularly for a member having a large number of minute holding holes such as an elastic sheet member for an IC socket, the surface treatment by polishing causes a problem such as clogging of the holding holes. There was a problem that was not preferable.

The present invention was devised in view of such a demand, and an object of the present invention is to reliably remove a molding burr formed on a sheet member by a simple method without using special equipment. This makes it possible to stably and inexpensively manufacture a sheet member in which a holding hole is accurately formed by molding.

In order to achieve the above object, the sheet member of the present invention has a first surface and a second surface which are formed of an elastic material and which face in mutually opposite directions, and penetrate through from the first surface to the second surface. The sheet member is provided with a plurality of through holes described above, and has a portion where the elastic material is missing in a region between the inner wall surface of the through hole and the first surface.

In order to achieve the above object, the sheet member of the present invention has a first surface and a second surface which are formed of an elastic material and which face in mutually opposite directions, and penetrate through from the first surface to the second surface. The sheet member is provided with a plurality of through holes described above, and has a fracture surface of the elastic material in a region between the inner wall surface of the through hole and the first surface.

In order to achieve the above object, the sheet member of the present invention has a first surface and a second surface which are formed of an elastic material and which face in mutually opposite directions, and penetrate through from the first surface to the second surface. In the sheet member having the plurality of through holes described above, a burr removal mark is formed in a region between the inner wall surface of the through hole and the first surface.

In order to achieve the above object, the sheet member of the present invention has a first surface and a second surface which are formed of an elastic material and which face in mutually opposite directions, and penetrate through from the first surface to the second surface. In the sheet member having a plurality of through-holes, the adhesive component is attached to the first surface around the region between the inner wall surface of the through-hole and the first surface. ..

In order to achieve the above object, a method for manufacturing a sheet member of the present invention is a step of filling a sheet member having a plurality of through holes with an elastic material in a molding die to form the sheet member, And a step of adhering an adhesive material to the sheet member so as to cover the periphery of the opening portion, and a step of peeling the adhesive material from the sheet member.

In order to achieve the above object, a socket of the present invention includes the sheet member and a contact pin inserted into the through hole of the sheet member.

According to the present invention, it is possible to provide a sheet member in which a plurality of through holes are accurately formed by molding. Further, such a sheet member can be manufactured stably and inexpensively.

The perspective view which shows the structure of a sheet member. The top view which shows the structure of a sheet member. FIG. 3 is a schematic cross-sectional view showing the configuration of the sheet member, which is an enlarged view of a cross section taken along the line III-III of FIG. 2. FIG. 4 is a schematic partial cross-sectional view showing the IV section of FIG. The typical sectional view of the important section of a mold. FIG. 3 is a schematic cross-sectional view of a molding die for explaining the steps up to the production of a sheet member in which a molding burr is formed, which is an intermediate product using the molding die. FIG. 3 is a schematic cross-sectional view of a molding die for explaining the steps up to the production of a sheet member in which a molding burr is formed, which is an intermediate product using the molding die. FIG. 3 is a schematic cross-sectional view of a molding die for explaining the steps up to the production of a sheet member in which a molding burr is formed, which is an intermediate product using the molding die. FIG. 3 is a schematic cross-sectional view of a molding die for explaining the steps up to the production of a sheet member in which a molding burr is formed, which is an intermediate product using the molding die. FIG. 3 is a schematic cross-sectional view of a molding die for explaining the steps up to the production of a sheet member in which a molding burr is formed, which is an intermediate product using the molding die. FIG. 6 is a diagram for explaining a method for removing a molding burr in the method for manufacturing a sheet member, and is a schematic cross-sectional view of a peripheral portion of a holding hole. FIG. 6 is a diagram for explaining a method for removing a molding burr in the method for manufacturing a sheet member, and is a schematic cross-sectional view of a peripheral portion of a holding hole. FIG. 6 is a diagram for explaining a method for removing a molding burr in the method for manufacturing a sheet member, and is a schematic cross-sectional view of a peripheral portion of a holding hole. FIG. 6 is a diagram for explaining a method for removing a molding burr in the method for manufacturing a sheet member, and is a schematic cross-sectional view of a peripheral portion of a holding hole. FIG. 6 is a diagram for explaining a method for removing a molding burr in the method for manufacturing a sheet member, and is a schematic cross-sectional view of a peripheral portion of a holding hole. FIG. 6 is a diagram for explaining a method for removing a molding burr in the method for manufacturing a sheet member, and is a schematic cross-sectional view of a peripheral portion of a holding hole. FIG. 6 is a diagram for explaining a method for removing a molding burr in the method for manufacturing a sheet member, and is a schematic cross-sectional view of a peripheral portion of a holding hole. The perspective view which shows the structure of an IC socket. The top view which shows the structure of an IC socket. The side view which shows the structure of an IC socket. Sectional drawing which expands and shows the contact pin periphery of IC socket. FIG. 9 is a schematic cross-sectional view of a peripheral portion of a holding hole showing a configuration of a modified example of the sheet member. FIG. 9 is a schematic cross-sectional view of a peripheral portion of a holding hole showing a configuration of a modified example of the sheet member. FIG. 9 is a schematic cross-sectional view of a peripheral portion of a holding hole showing a configuration of a modified example of the sheet member. FIG. 9 is a schematic cross-sectional view of a peripheral portion of a holding hole showing a configuration of a modified example of the sheet member. FIG. 9 is a schematic cross-sectional view of a peripheral portion of a holding hole showing a configuration of a modified example of the sheet member. FIG. 9 is a schematic cross-sectional view of a peripheral portion of a holding hole showing a configuration of a modified example of the sheet member.

Hereinafter, a sheet member according to an embodiment of the present invention, a method for manufacturing the same, and a socket using the sheet member will be described with reference to the drawings. The embodiments described below are merely examples, and do not exclude various modifications and application of techniques that are not explicitly described in the following embodiments. In addition, each configuration of the embodiment can be variously modified and implemented without departing from the spirit thereof. Furthermore, the configurations of the embodiments can be selected or combined as needed.

In addition, in the following embodiments, a sheet member for holding a contact pin applied to an IC socket will be described as an embodiment of a sheet member of the present invention, a manufacturing method thereof, and a socket using the same. And

Further, for convenience, the contact pins of the IC socket will be described assuming that the first contact portion is arranged on the upper side and the second contact portion is arranged on the lower side. However, it goes without saying that the arrangement of the contact pins and the IC socket is not limited to such arrangement.

In addition, in all the drawings for explaining the embodiments, the same elements are denoted by the same reference symbols in principle and the description thereof may be omitted.

[1. Structure of sheet member]
The configuration of the contact pin holding sheet member 1 will be described with reference to FIGS. FIG. 1 is a perspective view showing the configuration of the sheet member 1. FIG. 2 is a plan view showing the configuration of the sheet member 1. FIG. 3 is a schematic cross-sectional view showing the configuration of the sheet member 1, and is an enlarged view of the III-III cross section of FIG. 2. FIG. 4 is a partial cross-sectional view showing the IV portion of FIG. 3 in a larger scale than that of FIG.

The sheet member 1 shown in FIGS. 1 to 3 is a sheet-like member having a substantially square shape in plan view and having elasticity, and holds a plurality of contact pins 200 described later. Therefore, the sheet member 1 is provided with a plurality of holding holes 10 which are through holes for holding the contact pins 200 in accordance with the arrangement of the contact pins 200. In the present embodiment, as shown in FIGS. 1 and 2, a plurality of holding holes 10 arranged in rows along each of the four sides of the sheet member 1 are provided in four rows from the inside to the outside of the sheet member 1. Has been.

As well shown in FIG. 3, the sheet member 1 has a first surface 11 and a second surface 12 facing in opposite directions, and each holding hole 10 has a first surface 11 and a second surface 12 respectively. Is formed as a through hole. In the present embodiment, the holding hole 10 is formed on the first surface 11 side, and is formed on the second surface 12 side so as to be connected to the first hole portion 10-1 and the lower portion of the first hole portion 10-1. The second hole portion 10-2 and the first hole portion 10-1 and the second hole portion 10-2 are both cross-sections (cut in a direction orthogonal to the axial direction of the holding hole 10). The cross section) is circular and is coaxially arranged vertically (in the thickness direction of the sheet member 1), and the second hole portion 10-2 is formed to have a larger diameter than the first hole portion 10-1. The contact pin 200 having a shape corresponding to the shape of the holding hole 10 is inserted into the holding hole 10.

As shown in FIGS. 1 and 3, the inner peripheral edge of a frame member 21, which will be described later, is incorporated into each recess 12a provided on the side of the second surface 12 of each side surface of the sheet member 1. The holding hole 10 is provided at a predetermined distance from each of the four sides of the sheet member 1 in plan view as shown in FIGS. 1 and 2, so as to avoid the inner peripheral edge.

The material of the sheet member 1 is a resin material having elasticity, for example, natural rubber, urethane rubber, silicone rubber, fluororubber, or the like. Further, these materials may be a compound product containing a filler or the like, or a mixed product obtained by alloying or blending a plurality of kinds of resins. These materials are appropriately selected depending on the application and use conditions of the sheet member.

As an example of various dimensions of the sheet member 1, the vertical dimension L1 is 20 mm, the lateral dimension L2 is 20 mm, the thickness dimension t is 1 mm, the inner diameter D1 of the first hole portion 10-1 of the holding hole 10 is 0.1 mm, The inner diameter D2 of the second hole portion 10-2 is 0.2 mm.

Here, the sheet member 1 is manufactured by injection molding (hereinafter also simply referred to as “molding”) using a molding die 100 described later. During this molding, burrs (hereinafter referred to as “molding burrs”) are formed around the opening of the holding hole 10, particularly around the opening of the holding hole 10 on the first surface 11 as described later. Then, in the step of removing the molding burr, as shown in FIG. 3, a region 13 in which the shape of the mark after the molding burr is left is formed on the entire circumference or a part of the periphery of the opening.

That is, the molding burrs are removed by peeling the molding burrs from the sheet member 1 with the adhesive tape 80 as described later. By removing the molding burr, it is not possible to control the location where the sheet member 1 is missing, and the location where the elastic member is missing in the sheet member 1 is formed in an unordered manner, and this becomes the shape of the mark from which the molding burr is removed.

Hereinafter, the shape of the mark after removing the molding burr is referred to as "burr removal mark", and the region 13 is also referred to as a removal mark region 13.

Hereinafter, the removal trace area 13 will be further described with reference to FIG. FIG. 4 is a schematic partial cross-sectional view showing an IV portion of FIG. 3, that is, a cross section around the opening of the holding hole 10 of the sheet member 1 in an enlarged manner as compared with FIG. 3. In FIG. 4, a state before the molding burr 11x is removed is shown by a chain double-dashed line, and a state after the molding burr 11x is removed is shown by a solid line.

The removal trace region 13 is formed around the opening of the holding hole 10, specifically between the first surface 11 and the inner wall surface (the wall surface defining the holding hole 10) 10a forming the holding hole 10. The holding hole 10 is specifically a space surrounded by an inner wall surface 10a that holds the contact pin 200 in contact with the contact pin 200 (in other words, a transfer surface of a pin piece 104 described later).

The molding burr 11x generated around the opening of the holding hole 10 on the first surface 11 is removed by using an adhesive tape 80 described later. Specifically, after the adhesive surface 81 of the adhesive tape 80 is attached to the first surface 11 in the range including the molding burr 11x, the adhesive tape 80 is peeled off from the first surface 11. As a result, a part of the molding burr 11x attached to the adhesive tape 80 is torn off. By such attachment and peeling of the adhesive tape 80, the molding burr 11x is removed to the root, that is, to the boundary Ls with the first surface 11. When it is attempted to surely remove the molding burr 11x to the root, a part 11y deeper than the boundary Ls is removed. Therefore, between the first surface 11 and the inner wall surface 10a (a portion connecting the first surface 11 and the inner wall surface 10a), a concave region 13 that is recessed from the first surface 11 is formed.

In addition, it is preferable that all the molding burrs can be removed by one operation in the steps of attaching and peeling off the adhesive tape 80. However, if one operation is insufficient, the same operation is performed on the same portion. The desired burr-removed surface may be formed by repeating the above process a plurality of times. Further, this work may be performed on the entire first surface 11 at once, or the first surface 11 is divided into a plurality of small areas, and the molding burr is removed by each small area. You may make it complete|finish a sheet member of a sheet.

Since the molding burr 11x is removed (broken) from the first surface 11 so as to be torn off, the fracture surface of the elastic material, that is, the surface of the region 13 becomes an irregular undulating surface (so-called jagged surface). That is, the area 13 becomes a removal mark area having an irregular undulating surface as a burr removal mark. The irregular undulation surface is, for example, a surface in which the height (depth) of the irregularities forming the undulations and/or the arrangement of the irregularities forming the undulations is irregular. It should be noted that in FIG. 4, the undulations of the burr removal traces in the removal trace region 13 are exaggeratedly and greatly shown.

In other words, at least a part of the removal trace area 13 is the first surface 11 that is the transfer surface of the molding die 100, which will be described later, and the holding hole 10 that is the transfer surface of the pin piece 104. This is a region whose surface roughness is rougher than that of the inner wall surface 10a. The surface roughness is exemplified by line roughness defined by JISB0601 or surface roughness defined by ISO25178.

As described above, the removal trace area 13 is formed in a concave shape between the first surface 11 and the inner wall surface 10 a. This concave shape is a mortar that narrows from the first surface 11 toward the holding hole 10. Often shaped.

In addition, when there are many holding holes 10, when the molding burr 11x is removed by the adhesive tape 80, the holding hole 10 may be removed to the outside of the region where the molding burr 11x is formed. That is, there may be at least one holding hole 10 in which the removal trace region 13 exists, as shown by the alternate long and short dash line in FIG. 4, at a position deviating from the position where the molding burr 11x was formed. The presence of such a large removal trace region 13 is one indicator that the molding burr 11x has been reliably removed in all of the numerous holding holes 10. Therefore, such a large removal mark region 13 may be intentionally formed.

[2. Sheet member manufacturing method]
Hereinafter, the method of manufacturing the sheet member 1 will be described while explaining the configuration of the molding die 100.

First, the configuration of the molding die 100 will be described with reference to FIG. FIG. 5 is a schematic sectional view of a main part of the molding die 100. Note that FIG. 5 shows a state immediately before the material 1M of the sheet member 1 is injected into the cavity 103 described later.

As shown in FIG. 5, the molding die 100 includes an upper die 101 and a lower die 102. With the upper mold 101 and the lower mold 102 closed, a cavity 103 is formed between the lower surface 101s2 of the upper mold 101 and the upper surface 102s1 of the lower mold 102. The cavity 103 is a space filled with the material 1M of the sheet member 1 at a predetermined injection pressure. In this embodiment, the position of the upper mold 101 is fixed, and the lower mold 102 is movable in the vertical direction in FIG.

In the molding die 100, the sheet member 1 is formed in a state in which the sheet member 1 shown in FIGS. 1 and 3 is vertically inverted. That is, the first surface 11 on the upper side in FIGS. 1 and 3 is formed as a transfer surface of the upper surface 102s1 of the lower mold 102. On the other hand, the lower second surface 12 in FIGS. 1 and 3 is formed as a transfer surface of the lower surface 101s2 of the upper mold 101.

As shown in FIG. 5, the inner peripheral edge of the frame member 21 is previously installed in the cavity 103, and the sheet member 1 formed by injection molding is integrated with the frame member 21.

Further, the molding die 100 further includes a plurality of pin pieces 104. The pin piece 104 is for forming a holding hole 10 for holding a contact pin 200 described later. Therefore, the shape of the portion of the pin piece 104 arranged in the cavity 103 is the same as the shape of the portion of the contact pin 200 arranged in the cavity 103. In other words, the shape of the holding hole 10 is reversed. Shaped.

Each pin piece 104 is composed of a large diameter portion 104a having a relatively short axial length, a medium diameter portion 104b having a relatively long axial length, and a small diameter portion 104c having a relatively long axial length, which are arranged coaxially from the top. Further, the tip of the small diameter portion 104c is tapered.

A hole portion 101h for setting the pin piece 104 is formed in the upper die 101, and a hole portion 102h into which the tip portion of the small diameter portion 104c of the pin piece 104 is inserted when the die is closed in the lower die 102. (Hereinafter, it is also referred to as “nozzle hole 102h”). The hole portion 101h of the upper die 101 includes a large diameter hole portion 101h1 and a medium diameter hole portion 101h2 which is continuously provided below the large diameter hole portion 101h1 and has a diameter smaller than that of the large diameter hole portion 101h1. .. The lower die 102h has a smaller diameter hole 102h than the medium diameter hole portion 101h2. The large-diameter hole portion 101h1, the medium-diameter hole portion 101h2, and the slotted hole 102h, through which the same pin piece 104 is inserted, are coaxially arranged vertically.

The large-diameter hole portion 101h1 is recessed from the upper surface 101s1 of the upper die 101, and the medium-diameter hole portion 101h2 extends from the lower end of the large-diameter hole portion 101h1 to the lower surface 101s2 of the upper die 101. The large diameter portion 104a of the pin piece 104 is stored in the large diameter hole portion 101h1. Specifically, the lower surface of the large diameter portion 104a of the pin piece 104 is placed on the stepped portion formed by the difference in diameter between the large diameter hole portion 101h1 and the medium diameter hole portion 101h2.

The groove 102h extends from the upper surface 102s1 to the lower surface 102s2 of the lower mold 102. The tip (lower end) of the pin piece 104 is inserted into the upper part of the slotted hole 102h.

When the cavity 103 is formed by closing the upper die 101 and the lower die 102, the lower portion of the medium diameter portion 104b and the upper portion of the small diameter portion 104c of the pin piece 104 are placed in the cavity 103. A portion of the pin piece 104 arranged in the cavity 103 has an inverted shape of the holding hole 10.

Next, a method of manufacturing the sheet member will be described with reference to FIGS. 6A to 6E. Specifically, the method for producing the sheet member 1 ′, which is an intermediate product in which the molding burr 11 x has not been removed yet (the step of molding the sheet member by filling the elastic member with the molding material), The reason for this will be explained. FIG. 6A to FIG. 6E are schematic diagrams sequentially showing the steps of manufacturing the sheet member 1 ′ in the state in which the molding burrs, which are intermediate products, are formed using the molding die 100, using the molding die state. FIG. 6C to 6E, an enlarged view of a main part is also shown.

As shown in FIG. 6A, in a state where the upper mold 101 and the lower mold 102 are separated (mold open state), the pin pieces 104 are respectively installed in the plurality of holes 101h provided in the upper mold 101. Each pin piece 104 is fixed at this installation position by a fixing plate (not shown) arranged on the upper die 101. In this state, the tip (lower end) of the pin piece 104 has not yet been inserted into the slotted hole 102h of the lower mold 102. Then, after the frame member 21 is installed on the lower mold 102, the lower mold 102 is moved upward from this state as shown by a black arrow to approach the upper mold 101.

As a result, the molding die 100 is in a state in which the tip of the pin piece 104 installed in the upper die 101 is inserted into the nodule hole 102h of the lower die 102. From this state, the lower die 102 is further moved upward to completely close the forming die 100, so that a cavity 103 is formed between the upper die 101 and the lower die 102, as shown in FIG. 6B. The state shown in FIG. 6B is the same as the state shown in FIG.

Here, since the pin piece 104 is fixed to the hole portion 101h of the upper die 101, the clearance between the hole portion 101h and the pin piece 104 is set small so that the pin piece 104 does not come off from the hole portion 101h. There is. On the other hand, the clearance between the slotted hole 102h of the lower die 102 and the pin piece 104 is set to be wider than the clearance between the hole portion 101h of the upper die 101 and the pin piece 104. This is because even if the positions of the pin piece 104 and the scoring hole 102h do not exactly match, if the lower die 102 is brought close to the upper die 101, the tip of the pin piece 104 will enter the scoring hole 102h. Is.

Then, as shown in FIG. 6C, the material 1M (elastic material) of the sheet member 1 having fluidity is filled in the cavity 103 at a predetermined injection pressure. As described above, the clearance CL between the groove 102h of the lower die 102 and the pin piece 104 is set to be wider than the clearance CL between the hole portion 101h of the upper die 101 and the pin piece 104. Therefore, a part of the material 1M injected into the cavity 103 flows into the clearance CL.

After the material 1M is hardened, the lower mold 102 is separated from the upper mold 101 as shown by a black arrow in FIG. 6C, and the pin piece 104 is pulled out from the nozoki hole 102h of the lower mold 102 as shown in FIG. 6D. The material 1M that has flowed into the groove 102h appears as a molding burr 11x.

Then, as shown in FIG. 6E, the sheet member 1 ′ in which the molding burr which is an intermediate product is formed is taken out together with the frame member 21 from the lower mold 102.

Here, if the thickness of the molding burr 11x is too thick, it becomes difficult to remove the molding burr 11x with the adhesive tape 80. The thickness of the molding burr 11x is proportional to the size of the clearance CL between the pin piece 104 and the scoring hole 102h. Therefore, it is preferable that the clearance CL between the pin piece 104 and the dowel hole 102h is as small as possible so that it is not difficult to insert the pin piece 104 into the dowel hole 102h when the upper die 101 and the lower die 102 are assembled.

Next, a method for removing burrs from the sheet member 1'will be described with reference to FIGS. 7A to 7G. 7A to 7G are views for explaining a method for removing the molding burr 11x, and are schematic cross-sectional views of the peripheral portion of the holding hole 10.

After molding the sheet member 1 ′ using the above-described molding die 100, the molding burr 11 x of the sheet member 1 ′ taken out from the molding die 100 has an adhesive tape 80 (adhesive material) in the procedure shown in FIGS. 7A to 7G. ) Is used to remove. Note that FIGS. 7A to 7G show that one molding holding burr 11x is removed by focusing on one holding hole 10, but the size of the adhesive tape 80 is all that is formed on the sheet member 1′. It has a size capable of covering the holding hole 10 (for example, substantially the same size as the first surface 11).

As shown in FIGS. 7A to 7G, the molding burr 11x is removed with the sheet member 1'with the first surface 11 on which the molding burr 11x is prominently formed facing up. That is, the molding burr 11x is removed in a state in which the state taken out from the molding die 100 shown in FIG. 6E is turned upside down.

First, as shown in FIG. 7A, the adhesive tape 80 is placed above the sheet member 1 ′ with the adhesive surface 81 facing the sheet member 1 ′. Specifically, one adhesive tape 80 is arranged above the sheet member 1'so as to cover the molding burrs 11x of all the holding holes 10 formed in the sheet member 1'from above.

Next, as shown in FIG. 7B, the adhesive tape 80 is pressed against the sheet member 1 ′, and one adhesive tape 80 is simultaneously attached to the molding burrs 11 x of all the holding holes 10 formed in the sheet member 1 ′. Attached (step of attaching adhesive material to sheet member). 7B, the adhesive surface 81 of the adhesive tape 80 is not in contact with the sheet member 1', but in reality, the adhesive surface 81 is pressed against the sheet member 1', and the molding burr 11x and the sheet member 1'are actually pressed. Stick to both. If the adhesive tape 80 is transparent, there is no air layer between the adhesive tape 80 and the molding burr 11x and the sheet member 1', that is, the adhesive tape 80 is adhered to the molding burr 11x and the sheet member 1'without a gap. You can see that it is attached.

Next, as shown in FIG. 7C, the adhesive tape 80 is peeled off from the sheet member 1'. Here, the adhesive force of the adhesive tape 80 is adjusted to such strength that the molding burr 11x can be torn off and removed in consideration of the type of elastic material forming the sheet member 1'and the expected thickness of the molding burr 11x. Has been done. Therefore, when the adhesive tape 80 is peeled off from the sheet member 1 ′, a part (most part in this example) 11x-1 of the molding burr 11x (hereinafter referred to as “removal burr 11x-1”) sticks to the adhesive tape 80. The sheet member 1 ′ is removed (step of peeling the adhesive material from the sheet member).

In the state of the sheet member 1′ shown in FIG. 7C, most of the molding burr 11x (removal burr 11x-1) is removed, and a minute convex portion (molding burr 11x-2) remains at the opening of the holding hole 10. However, if such residual burr is acceptable as a sheet member (that is, if residual molding burr 11x-2 is acceptable as a product), the burr is removed at this stage. You may finish the work. In this case, the sheet member 1'in the state shown in FIG. 7C may be a finished product.

Further, when the minute convex portions are not allowed to remain, the subsequent burr removal work shown in FIGS. 7D to 7F is performed to obtain a finished product as a sheet member. In this case, the adhesive tape 80 is replaced with a new (unused) adhesive tape 80, and the burr removal operation is performed. As shown in FIG. 7D, this new adhesive tape 80 is arranged above the sheet member 1'with the adhesive surface 81 facing the sheet member 1'.

Next, as shown in FIG. 7E, the adhesive tape 80 is attached to the sheet member 1'.

Next, as shown in FIG. 7F, when the adhesive tape 80 is peeled off from the sheet member 1 ′, the molding burr 11x-3 forming a part of the molding burr 11x-2 is attached to the adhesive tape 80, and the sheet member The small molding burr 11x-4 remains on the sheet member 1'being removed from the sheet member 1'.

Hereinafter, the above-described procedure shown in FIGS. 7D, 7E, and 7F is performed until the molding burr does not adhere to the adhesive tape 80 (or until the adhesion amount of the molding burr becomes less than a predetermined amount, or by visually adhering). This is repeated until the molding burr attached to the tape 80 cannot be confirmed). Then, the sheet member 1 is completed as shown in FIG. 7G. As a result of removing the molding burr 11x, the removal mark region 13 is formed on the sheet member 1 as described above.

When the molding burr is removed by the adhesive tape 80, the adhesive surface 81 of the adhesive tape 80 is attached to the periphery of the removal mark region 13 of the first surface 11 once or a plurality of times. The adhesive component forming the adhesive surface 81 may adhere to the periphery of the removal trace area 13.

The method for removing the molding burr 11x is not limited to the method in which one adhesive tape 80 is collectively attached to all the holding holes 10 of the sheet member 1'as described above. One adhesive tape 80 is attached to a part (including only one) of the holding holes 10 of the sheet member 1'and the adhesive tape 80 is peeled off from the sheet member 1'. By doing so, the molding burr 11x of the part of the holding hole 10 may be removed. In this case, the molding burr 11x of all the holding holes 10 of the sheet member 1'is removed by sequentially changing the position where the adhesive tape 80 is attached, that is, the region where the molding burr 11x is removed.

As described above, when the region of the sheet member 1'for removing the molding burr 11x is sequentially changed, the number of times the adhesive tape 80 is attached and peeled off may vary depending on the region. In other words, since the size, thickness, shape, etc. of each molding burr 11x are different, the number of times of sticking and peeling the adhesive tape 80 necessary to remove the molding burr 11x may also differ depending on the region. Then, by peeling off the adhesive tape 80, fine irregularities are removed and smoothed in the region where the molding burr 11x is not formed, or the elastic material is minutely removed from the first surface 11, and the surface is removed. The roughness changes. That is, since the number of times of peeling off the adhesive tape 80 differs depending on the region, regions with different surface roughness may be formed even on the same first surface 11. For the same reason, when the molding burr 11x is removed using the adhesive tape 80 only on the first surface 11, the first surface 11 and the second surface 12 may have different surface roughnesses.

The mold 100 will be further described.

First, the upper mold 101 and the lower mold 102 will be described (see FIG. 5). The material used for the upper mold 101 and the lower mold 102 is preferably a metal material having a relatively low hardness. If the material has low hardness, the holes 101h and 102h for attaching the pin pieces 104 can be easily formed in the upper mold 101 and the lower mold 102 by drilling. Such a material having a relatively low hardness is, for example, aluminum, an aluminum alloy, stainless steel, or the like. Examples of the aluminum alloy include Al-Mg alloy, Al-Zn-Mg alloy, and Al-Zn-Mg-Cu alloy. Examples of stainless steel include SUS301, SUS304, and SUS316.

Next, the pin piece 104 will be described. The material used for the pin piece 104 is preferably a material whose linear expansion coefficient is smaller than the linear expansion coefficient of the upper mold 101 and the lower mold 102, and is preferably a lathe-processable metal.

In a high temperature state in which the cavity 103 is filled with the high temperature material 1M, the holes 101h and 102h and the pin piece 104 are thermally expanded. When the pin piece 104 is smaller than the linear expansion coefficient of the upper die 101 and the lower die 102, the diameter of the pin piece 104 increases, that is, the shape of the portion of the sheet member 1 which is a molded product is involved in the formation of the holding hole 10. Also, the decrease of the inner diameter due to the expansion of the holes 101h and 102h of the molding die 100, that is, the change of the shape of the molding die 100 becomes larger. As a result, the clearance CL between the hole portions 101h and 102h and the pin piece 104 can be reduced without making the shape of the holding hole 10 of the sheet member 1 largely different from the designed shape. When the clearance CL between the hole portion 101h of the upper die 101 and the pin piece 104 becomes smaller, the pin piece 104 and the upper die 101 are in an interference fit state, and as a result, the upper die 101 and the pin piece 104 become firm. Will be combined with. Further, when the clearance CL between the knurled hole 102h of the lower die 102 and the pin piece 104 becomes small, the entry of the material 1M into the clearance CL that causes the molding burr 11x is reduced. Therefore, the molding burr 11x is thin and small, and the molding burr 11x can be easily removed.

Examples of materials that satisfy the conditions of the linear expansion coefficient and workability include steel materials such as stainless steel, carbon steel, carbon tool steel or high speed steel (high speed steel), and tungsten. Examples of stainless steel include SUS403, SUS410, and SUS430. An example of carbon steel is S50C. Examples of the carbon tool steel include SK120 (former JIS standard SK2), SK95 (former JIS standard SK4), and SK85 (former JIS standard SK5). Examples of high-speed steel include SKH2 and SKH50.

[3. IC socket configuration]
A configuration of an embodiment of an IC socket using the sheet member of the present invention and a method of using the IC socket will be described with reference to FIGS. 8 to 11. FIG. 8 is a perspective view showing the configuration of the IC socket 2 according to the embodiment of the present invention. FIG. 9 is a plan view showing the configuration of the IC socket 2 according to the embodiment of the present invention. FIG. 10 is a side view showing the configuration of the IC socket 2 according to the embodiment of the present invention. FIG. 11 is an enlarged cross-sectional view showing the periphery of the contact pin 200 of the IC socket 2 according to the embodiment of the present invention. In addition, in FIG. 10, only some contact pins 200 are shown for convenience.

As shown in FIGS. 8 to 10, the IC socket 2 includes a socket body 20 and a frame member 21.

The frame member 21 is a rectangular frame-shaped member that surrounds the four sides of the socket body 20. The inner peripheral edge of the frame member 21 is assembled to the sheet member 1 at the time of molding as described above. As a result, the frame member 21 is attached to the outer periphery of the socket body 20.

As shown in FIG. 11, the IC socket 2 is arranged on the wiring board 4, and the IC package 3 is housed on the upper surface. In the IC package 3, a plurality of spherical solder balls 31 as terminals are provided in a predetermined range on the peripheral portion of the lower surface of the substantially rectangular package body 30.

The IC socket 2 is configured to electrically connect the solder balls 31 of the IC package 3 to the electrodes (not shown) of the wiring board 4. The IC socket 2 is used, for example, in a test device for a continuity test on the IC package 3.

The socket body 20 of the IC socket 2 will be specifically described. The socket body 20 is configured to accommodate the IC package 3, and is inserted into each of the sheet member 1 and a plurality of holding holes 10 provided in the sheet member 1, as shown in FIGS. 8 to 11. The contact pin 200 is held.

Each contact pin 200 is held on the first surface 11 side of the sheet member 1 and has a substantially rod-shaped (here, substantially cylindrical) first contactor 201, and is held on the second surface 12 side of the sheet member 1 to be first. The second contactor 202 has a substantially tubular shape (here, a substantially cylindrical shape) having an outer diameter larger than that of the first contactor 201. The outer diameter of the contact pin 200 is, for example, about 0.2 mm.

The first contactor 201 is inserted into the first hole portion 10-1 of the holding hole 10 from the first surface 11 of the sheet member 1 and comes into contact with the upper solder ball 31. The second contact 202 is inserted into the second hole portion 10-2 of the holding hole 10 from the second surface 12 of the sheet member 1 and contacts the electrode of the wiring board 4 below. At this time, the lower end portion of the first contactor 201 is inserted into the inner space of the cylindrical second contactor 202 and is in contact with the inner peripheral surface 202c of the second contactor 202 so that it can slide. With such a configuration, the solder balls 31 of the IC package 3 and the electrodes of the wiring board 4 are electrically connected via the first contact 201 and the second contact 202.

The first contactor 201 integrally includes a substantially cylindrical first insertion portion 201a and a disk-shaped first contact portion 201b provided at one end thereof and having a diameter larger than that of the first insertion portion 201a and relatively thin. ing. Both the first insertion portion 201a and the first contact portion 201b are made of metal. Further, a plurality of protrusions 201c having a predetermined shape are formed on the upper surface of the first contact portion 201b. In this embodiment, the shape of each protrusion 201c is a substantially conical shape. These protrusions 201c come into contact with the solder balls 31 of the IC package 3, respectively.

The second contact 202 includes a cylindrical portion 202a and a second contact portion 202b. Both the cylindrical portion 202a and the second contact portion 202b are made of metal. The inner peripheral surface 202c of the cylindrical portion 202a is formed in a size and shape such that the inner peripheral surface 202c can come into contact with the first insertion portion 201a of the first contactor 201 and can slide. The second contact portion 202b has a configuration in which the end of the cylindrical portion 202a on the second surface 12 side of the sheet member 1 is bent. The distance between the second contact portion 202b and the first contact portion 201b can be changed by the elasticity of the sheet member 1 itself and the pressing force from above and below in FIG.

Then, the first insertion portion 201a of the first contactor 201 is inserted into the first hole portion 10-1 formed on the first surface 11 side of the sheet member 1. Further, the cylindrical portion 202a of the second contactor 202 is inserted into the second hole portion 10-2 formed on the opposite second surface 12 side.

Then, the first contact portion 201b of the first contactor 201 is exposed to the first surface 11 side of the sheet member 1 (here, the lower surface of the first contact portion 201b is placed on the first surface 11 of the sheet member 1). State). Further, the upper end of the cylindrical portion 202a contacts the step between the first hole portion 10-1 and the second hole portion 10-2, and the second contact portion 202b is exposed on the second surface 12 of the sheet member 1. It becomes a state.

Here, a method of using the IC socket 2 will be described with reference to FIG. First, the IC socket 2 is arranged so that the second contact portion 202b of the second contact 202 contacts the terminal of the wiring board 4. Next, the IC package 3 is housed in the first surface 11 of the sheet member 1 of the IC socket 2 so that the solder balls 31 of the IC package 3 come into contact with the protrusions 201c of the first contact portion 201b.

When the IC package 3 is pressed downward by an automatic machine or the like in that state, the first contact portion 201b is pressed downward by the solder balls 31 of the IC package 3 from the state of FIG. Along with that, the sheet member 1 having an elastic force is pressed by the lower surface of the first contact portion 201b. As a result, the sheet member 1 is compressed and deformed between the lower surface of the first contact portion 201b and the step surface between the first hole portion 10-1 and the second hole portion 10-2, and is returned to the original state. The repulsive force to be tried, that is, the repulsive force directed upward is provided. At the same time, the stepped surface between the first hole portion 10-1 and the second hole portion 10-2 in the sheet member 1 presses the cylindrical portion 202a inserted into the second hole portion 10-2 downward. ..

As a result, the upward repulsive force of the sheet member 1 ensures a predetermined contact pressure between the first contact portion 201b and the solder ball 31 of the IC package 3. At the same time, the step surface between the first hole portion 10-1 and the second hole portion 10-2 presses the cylindrical portion 202a downward, so that the second contact portion 202b and the electrode of the wiring board 4 are brought into contact with each other at a predetermined level. The pressure is secured.

After the connection between the first contact 201 and the second contact 202, the continuity test of the IC package 3 is performed.

[4. Action effect]
According to one embodiment of the present invention, the following operational effects are obtained.

By manufacturing the sheet member 1 using the molding die 100, the sheet member 1 having the plurality of holding holes 10 (through holes) can be manufactured accurately and efficiently. Further, since the molding burr 11x generated around the opening of the holding hole 10 can be removed by a simple method using the adhesive tape 80, special equipment for removing the molding burr 11x is unnecessary. Therefore, according to one embodiment of the present invention, it is possible to realize the provision of the sheet member 1 in which the molding burr 11x is removed and the holding hole is accurately formed by injection molding. Further, since the molding burr 11x can be removed by using the adhesive tape 80 without using special equipment, the sheet member 1 in which the holding holes 10 are accurately formed by molding can be stably and inexpensively. It can be manufactured.

Further, when the sheet member 1 is used for an IC socket, since the holding hole 10 through which the contact pin 200 is inserted is minute, the molding burr 11x around the holding hole 10 is removed by the surface treatment by polishing. This is not preferable because the holes 10 may be clogged, and the surface treatment by polishing is not suitable for removing the molding burr 11x from the sheet member 1 and damages the periphery of the holding holes 10. There was a risk of it. On the other hand, in the removal of burrs using the adhesive tape 80, by appropriately adjusting the adhesive force of the adhesive tape 80, only the minute molding burrs 11x of the holding holes 10 can be substantially removed as described above. Therefore, according to the embodiment of the present invention, it is possible to remove the molding burr 11x of the sheet member 1 for the IC socket 2 without damaging the periphery of the holding hole 10 and thus to manufacture the sheet member 1 for the IC socket 2. Produce an effect.

Furthermore, by making the periphery of the holding hole 10 concave so as to be recessed from the first surface 11, it is possible to reliably remove the molding burr 11x around the holding hole 10 without leaving it.

[5. Modification]
(1) The shape of the sheet member is not limited to the shape of the above-described embodiment and can be variously changed. Hereinafter, a configuration of a modified example of the sheet member will be described with reference to FIGS. 12A to 12E. 12A to 12E are schematic cross-sectional views of the peripheral portion of the holding hole showing the configuration of the modified example of the sheet member. Note that the removal mark region is omitted in FIGS. 12A to 12E. In addition, in FIG. 12F, an enlarged view of the first hole portion 10F-1 is also shown.

Each modified example of the sheet member is different in the shape (see FIG. 3) of the first hole portion 10-1 of the holding hole 10 of the above embodiment. Therefore, each modification will be described only with respect to a portion corresponding to the first hole portion 10-1 of the above-described embodiment.

In the holding hole 10A in the sheet member 1A shown in FIG. 12A, a large-diameter portion 10A-1 which is a drum-shaped space is formed substantially at the center in the axial direction of the first hole portion 10-1. The hourglass shape is a shape that includes a columnar portion and a low-conical truncated cone portion that is integrally provided above and below the columnar portion.

In the holding hole 10B in the sheet member 1B shown in FIG. 12B, a large wedge-shaped space (that is, a truncated cone shape that expands upward) is formed in the center of the first hole portion 10-1 in the axial direction. The diameter portion 10B-1 is formed.

In the holding hole 10C in the sheet member 1C shown in FIG. 12C, a large-diameter portion 10C-1 that is a drum-shaped space is formed substantially at the center in the axial direction of the first hole portion 10-1. The drum shape is a shape in which a truncated cone portion whose diameter is expanded downward is arranged on the upper side and a truncated cone portion whose diameter is decreased downward is arranged on the lower side, and is a shape in which the upper and lower centers are generally expanded in the lateral direction. ..

In the holding hole 10D in the sheet member 1D shown in FIG. 12D, a portion corresponding to the first hole portion 10-1 of the holding hole 10 of the above embodiment is formed in an inverted drum-shaped space. The inverted drum shape is a rotating body shape in which a narrowed portion 10D-1 with a narrowed upper portion, a narrowed portion 10D-2 with a narrowed central portion, and a columnar portion 10D-3 are sequentially arranged in this order from the top. The inverted drum-shaped space composed of the narrowed portion 10D-1, the narrowed portion 10D-2, and the columnar portion 10D-3 has a larger diameter than the first hole portion 10-1 of the holding hole 10 of the above embodiment. The diameter is generally the same as that of the second hole portion 10-2.

In the holding hole 10E in the sheet member 1E shown in FIG. 12E, the portion corresponding to the first hole portion 10-1 of the holding hole 10 of the above-described embodiment is a space of a full gradient shape, that is, a cone whose diameter decreases as it goes upward. It is a trapezoidal portion 10E-1.

In the sheet member 1F shown in FIG. 12F, the first hole portion 10F-1 corresponding to the first hole portion 10-1 of the holding hole 10 of the above-described embodiment has the accommodation diameter portion 10F-2 and the diameter expansion portion 10F-3. Is a space in the shape of a rotating body arranged alternately in the axial direction.

The outer shapes of the portion of the pin piece for forming the holding holes 10A to 10F, which is located inside the cavity 103, and the portion of the contact pin that is located inside the holding holes 10A to 10F have wall shapes surrounding the holding holes 10A to 10F. It has the same shape as. Further, when removing the pin piece from the holding holes 10A to 10F and inserting the contact pin, the elasticity of the sheet members 1A to 1F is used to expand the holding holes 10A to 10F to remove the pin piece, The contact pin can be inserted.

Since the cross-sectional shape of the sheet members 1A to 1F as described above differs depending on the axial positions of the holding holes 10A to 10F, the contact pins are inserted when the contact pins having the shapes corresponding to the holding holes 10A to 10F are inserted. Axial movement of the pin can be suppressed. That is, the contact pin and the holding holes 10A to 10F are locked to each other in the axial direction due to the difference in the cross-sectional shapes of the holding holes 10A to 10F and the contact pin depending on the positions in the axial direction. Axial movement can be suppressed.

(2) In addition, the cross-sectional shape of the holding hole may be non-circular such as D-shaped. In this case, rotation of the contact pin around the axis can be suppressed.

(3) In the above-described embodiment, the surface indicated by the reference numeral 11 of the sheet member 1 ′ has been described as the first surface of the present invention, but the surface indicated by the reference numeral 12 of the sheet member 1 ′ is the first surface of the present invention. The molding burr may be removed by the adhesive tape 80.

(4) In the above-described embodiment, the shape of the removal trace area 13 is described as a concave shape that is recessed from the first surface 11. However, as long as it does not hinder the electrical connection between the IC package 3 and the wiring board 4 by the contact pins 200, the molding burr 11x remains slightly, and the removal mark region 13 is left on the first surface 11 or the first surface 11. It may be a convex shape that is more convex than the second surface 12. Alternatively, the surface shape of the removed trace area 13 may be an uneven shape centered on the boundary Ls (see FIG. 4 ), that is, a shape that is substantially flush with the first surface 11 or the second surface 12.

(5) The molding burr 11x may be removed by rolling the adhesive tape 80 on the surface of the sheet member 1'. Specifically, the adhesive tape 80 is attached to the outer peripheral surface of the cylindrical or cylindrical holding member with the adhesive surface 81 facing outward, and the adhesive tape 80 is rolled together with the holding member on the sheet member 1'. Good. By rolling the adhesive tape 80 on the sheet member 1 ′, a part of the adhesive tape 80 is attached to the molding burr 11 x of the sheet member 1 ′ (step of attaching the adhesive material to the sheet member). By further rolling the adhesive tape 80 on the sheet member 1', the part of the adhesive tape 80 is peeled off from the sheet member 1', and the molding burr 11x is removed (the adhesive material is pulled from the sheet member. Peeling step).

(6) In the above embodiment, the contact pin holding sheet member of the present invention and the method for manufacturing the same, and the socket using the contact pin holding sheet member are applied to the IC socket for inspecting the IC package. The present invention is not limited to this, and can be applied to various other uses such as inspection of other electric parts or connectors.

INDUSTRIAL APPLICABILITY The present invention is particularly suitably used as a contact pin holding sheet member, a method for manufacturing the same, and a socket using the contact pin holding sheet member.

1,1A-1F Sheet member 1'Sheet member (intermediate product)
1M material (elastic material)
2 IC socket 3 IC package 4 Wiring board 10, 10A, 10B, 10C, 10D, 10E, 10F Holding hole 10-1 First hole portion 10-2 Second hole portion 10A-1, 10B-1, 10C-1 Large Diameter part 10D-1, 10D-2 Drawing part 10D-3 Column part 10E-1 Frustum shape part 10F-1 1st hole part 10F-2 Inner diameter part 10F-3 Expanding part 10a Inner wall surface 11 1st surface 11x , 11x-1, 11x-2, 11x-3, 11x-4 Molding burr 11y Deeper than the boundary Ls 12 Second surface 12a Recess 13 Removal mark area 20 Socket body 21 Frame member 30 Package body 31 Solder ball 80 Adhesion Tape (adhesive material)
81 Adhesive surface 100 Mold 101 Upper mold 101h Hole 101h1 Large diameter hole 101h2 Medium diameter hole 101s1 Upper surface 101s2 Lower surface 102 Lower mold 102h Hole (Nozzle hole)
102s1 Upper surface 102s2 Lower surface 103 Cavity 104 Pin piece 104a Large diameter part 104b Medium diameter part 104c Small diameter part 200 Contact pin 201 1st contactor 201a 1st insertion part 201b 1st contact part 201c Projection part 202 2nd contact part 202a Cylindrical part 202b 2nd contact part 202c Inner peripheral surface CL Clearance L1 Vertical dimension L2 Horizontal dimension Ls Boundary t Thickness dimension

Claims (14)

A sheet member, which is formed of an elastic material, has a first surface and a second surface facing in mutually opposite directions, and is provided with a plurality of through holes penetrating from the first surface to the second surface. There
A sheet member having a portion where the elastic material is missing in a region between an inner wall surface of the through hole and the first surface. A sheet member, which is formed of an elastic material, has a first surface and a second surface facing in mutually opposite directions, and is provided with a plurality of through holes penetrating from the first surface to the second surface. There
A sheet member having a fracture surface of the elastic material in a region between an inner wall surface of the through hole and the first surface. A sheet member, which is formed of an elastic material, has a first surface and a second surface facing in mutually opposite directions, and is provided with a plurality of through holes penetrating from the first surface to the second surface. There
A sheet member having a burr removal mark formed in a region between an inner wall surface of the through hole and the first surface. A sheet member, which is formed of an elastic material, has a first surface and a second surface facing in mutually opposite directions, and is provided with a plurality of through holes penetrating from the first surface to the second surface. There
A sheet member in which an adhesive component is attached to the periphery of a region between the inner wall surface of the through hole and the first surface on the first surface. The sheet member according to any one of claims 1 to 4, wherein the shape of the region is a concave shape that is recessed from the first surface. The sheet member according to claim 5, wherein the concave shape is a mortar shape that narrows toward the holding hole. The sheet member according to any one of claims 1 to 6, wherein the surface of the region is an irregular undulating surface. The sheet member according to claim 1, wherein the surface roughness of the region is rougher than the surface roughness of the first surface and the surface roughness of the inner wall surface of the through hole. The sheet member according to any one of claims 1 to 8, wherein a shape of a cross section of the holding hole, which is cut in a direction intersecting the axial direction of the through hole, differs depending on a position in the axial direction. The said through-hole is provided with two or more, The said area|region is formed in the position deviated from the location where the burr was formed in at least one said through-hole among these through-holes. The sheet member according to any one of claims. A step of filling a sheet member having a plurality of through holes with an elastic material in a molding die to form the sheet;
A step of attaching an adhesive material to the sheet member so as to cover the periphery of the opening of the through hole with respect to the sheet member;
And a step of peeling the adhesive material from the sheet member. The sheet member is provided with a plurality of the through holes,
The method for manufacturing a sheet member according to claim 11, wherein the step of attaching the adhesive material includes the step of attaching the adhesive material to the sheet member so as to cover all openings of the plurality of through holes. The step of attaching the adhesive material includes a step of attaching the adhesive material to the sheet member by rolling the adhesive material on the sheet member,
The step of peeling off the adhesive material from the sheet member includes a step of peeling off the adhesive material from the sheet member by further rolling the adhesive material on the sheet member. Sheet member manufacturing method. A sheet member according to any one of claims 1 to 10,
A socket having a contact pin inserted into the through hole of the sheet member.

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