JP2020083947A5 - - Google Patents

Claims (14)

A paste containing an inorganic powder (A) and an alkali-soluble resin (B-1) having a polyether structure. The paste according to claim 1, wherein the TI value (3 rpm / 30 rpm) at 25 ° C. is 1.0 or more and 3.0 or less. The paste according to claim 1 or 2, wherein the alkali-soluble resin (B-1) has a dicarboxylic acid structure and / or a dicarboxylic acid anhydride structure . The paste according to any one of claims 1 to 3 , further containing an organic solvent (C-1) having an SP value of 18.5 to 22.1 (J / cm ³ ) ^1/2. The paste according to claim 4 , wherein the organic solvent (C-1) contains an ether structure and an acetate structure . The paste according to any one of claims 1 to 5 , further containing an alkali-soluble resin (B-2) having a photoreactive functional group. The paste according to claim 6 , wherein the alkali-soluble resin (B-2) has a novolak structure. The paste according to any one of claims 1 to 7, wherein the alkali-soluble resin (B-1) has a structure represented by the following general formula (3).

(In the above general formula (3), l is an arbitrary natural number, R ⁶ is an alkylene group having 2 to 8 carbon atoms, R ⁷ is an ether group or two independent hydroxyl groups, and R ⁸ has 1 to 24 carbon atoms. It represents a monovalent hydrocarbon group. A and b represent mol% (a + b = 100) of the repeating unit, a is in the range of 35 to 65, and b is in the range of 35 to 65. R ⁶ , R ⁷ , and R ⁸ may be the same or different, respectively.) The paste according to claim 8 , wherein l in the general formula (3) is an integer of 5 to 60 . A cured film obtained by curing the paste according to any one of claims 1 to 9. A fired body obtained by firing the cured film according to claim 10. The electronic component including the fired body according to claim 11. A method for manufacturing an electronic component, which comprises a step of applying the paste according to any one of claims 1 to 9 by a screen printing method, a step of drying, and a step of exposing and developing. A ceramic laminate with wiring having a ceramic layer on the uppermost layer of a laminate having a plurality of layers of ceramics with wiring having a wiring pattern with a wiring pitch of 10 to 60 μm on the ceramic layer, and the maximum thickness of a portion including the wiring pattern. A ceramic laminate with wiring in which the difference between A and the minimum thickness B of the portion not including the wiring pattern is 10 μm or less.