JP2020080278A - Induction cooker - Google Patents

Abstract

To provide an induction cooker in which the temperature detection accuracy of a contact-type temperature sensor is improved and variations in a temperature detection accuracy for each induction cooker can be suppressed.SOLUTION: The induction cooker comprises: a top plate 2 on which a material to be heated is mounted; heating coils 5a and 5b arranged below the top plate, and performs induction heating on the material to be heated; a contact type temperature sensor 30 detecting a temperature of the top plate; a movable part 31 on which the contact type temperature sensor is arranged; a holding part 32 holding the movable part; and a spring 33 pushing up the holding part toward the top plate. The movable part has a contact face 31a which comes in contact with the top plate, and can be moved with respect to the holding part.SELECTED DRAWING: Figure 4

Description

  The present invention relates to an induction heating cooker including a sensor that detects the temperature of an object to be heated.

  Conventionally, an induction heating cooker including a temperature sensor that detects the temperature of an object to be heated on a top plate is known. As a temperature sensor for detecting the temperature of the object to be heated, a contact temperature sensor using a thermistor and a non-contact temperature sensor using an infrared sensor are known. In the contact type temperature sensor, the thermistor is brought into contact with the top plate, and the temperature of the object to be heated is detected through the top plate.

  Further, in an induction heating cooker including a contact type temperature sensor, a configuration has been proposed in which a holding table holding the contact type temperature sensor is pushed up toward a top plate by a coil spring fixed to a fixed table (for example, Patent Document 1). And Patent Document 2). By providing the said structure, a contact-type temperature sensor and a top plate can be contact|adhered, and as a result, a fall of the detection precision of a contact-type temperature sensor can be prevented.

JP-A-4-366588 JP, 6-104075, A

  Here, in the above-mentioned conventional configuration, when the holding table or the fixing table is not attached in parallel with the top plate, the contact temperature sensor is held in a state of being inclined with respect to the top plate. In this case, even if the holder is pushed up toward the top plate by the spring, a gap is generated between the top plate and the contact temperature sensor. As a result, the top plate and the contact-type temperature sensor do not come into close contact with each other, and the detection accuracy of the contact-type temperature sensor decreases. Therefore, in order to bring the top plate and the contact-type temperature sensor into close contact with each other, it is necessary to dispose the contact-type temperature sensor and the top plate in parallel. Further, in order to arrange the top plate and the contact type temperature sensor in parallel, it is necessary to attach a holding base for holding the contact type temperature sensor and a fixing base for fixing the holding base in parallel with the top plate. Furthermore, it is necessary to attach a spring that pushes up the holding table toward the top plate vertically to the top plate.

  However, since there is a limit to the assembly accuracy of the parts, it is difficult to attach all of the holding table, the fixing table and the spring in parallel or perpendicular to the top plate. Further, since the assembling accuracy of the parts differs depending on the product, the parts may be attached with different inclinations for each product. Therefore, in the conventional configuration, the adhesion between the top plate and the contact temperature sensor differs depending on the product, and as a result, the temperature detection accuracy of the contact temperature sensor varies among products.

  The present invention is to solve the above problems, and provides an induction heating cooker capable of improving the temperature detection accuracy of a contact temperature sensor and suppressing variations in the temperature detection accuracy of each product. The purpose is to

  The induction heating cooker according to the present invention includes a top plate on which an object to be heated is placed, a heating coil arranged below the top plate to inductively heat the object to be heated, and a contact type for detecting the temperature of the top plate. The temperature sensor, the movable portion in which the contact temperature sensor is arranged, the holding portion that holds the movable portion, and the elastic body that pushes up the holding portion toward the top plate are provided. , Has a movable contact surface with respect to the holding portion.

  Another induction heating cooker according to the present invention detects the temperature of the top plate on which the object to be heated is placed, the heating coil which is arranged below the table and which induction-heats the object to be heated, and the temperature of the tabletop. The contact-type temperature sensor, the movable part in which the contact-type temperature sensor is arranged, and which is composed of an elastic body, and the holding part that holds the moving part are provided. And has a movable contact surface.

  According to the induction heating cooker of the present invention, since the movable part in which the contact temperature sensor is arranged has a contact surface that is in contact with the top plate and is movable with respect to the holding part, the holding part is provided with respect to the top plate. Even in a state in which the contact type temperature sensor and the top plate are obliquely arranged, it is possible to suppress the generation of a gap between the contact type temperature sensor and the top plate. As a result, it is possible to improve the temperature detection accuracy of the contact temperature sensor and suppress variations in the detection accuracy of the contact temperature sensor for each product.

FIG. 3 is a schematic perspective view of the induction heating cooker according to the first embodiment. It is a schematic block diagram of the principal part of the induction heating cooking appliance in Embodiment 1. FIG. 6 is a diagram illustrating a holding mechanism of the contact temperature sensor according to the first embodiment. FIG. 6 is a diagram illustrating a holding mechanism of the contact-type temperature sensor according to the first embodiment and is a diagram showing a state in which a holding portion is not arranged in parallel with a top plate. FIG. 8 is a diagram illustrating a holding mechanism of the contact temperature sensor according to the second embodiment. FIG. 9 is a diagram illustrating a holding mechanism of the contact-type temperature sensor according to the second embodiment, and is a diagram showing a state in which a holding portion is not arranged in parallel with a top plate. FIG. 10 is a diagram illustrating a holding mechanism of a contact temperature sensor according to the third embodiment. FIG. 11 is a diagram illustrating a holding mechanism of the contact-type temperature sensor according to the third embodiment, and is a diagram showing a state in which a holding portion is not arranged in parallel with the top plate. It is a figure explaining the holding mechanism of the contact type temperature sensor in Embodiment 4. It is a figure explaining the holding mechanism of the contact temperature sensor in Embodiment 4, and is a figure showing the state where a holding part is not arranged in parallel with a top board. It is a figure explaining the holding mechanism of the contact type temperature sensor in Embodiment 5. It is a figure explaining the holding mechanism of the contact type temperature sensor in Embodiment 6. It is a figure explaining the holding mechanism of the contact type temperature sensor in Embodiment 7. It is a figure explaining the holding mechanism of the contact-type temperature sensor in Embodiment 8.

  Hereinafter, an embodiment in which the induction heating cooker according to the present invention is applied to a home IH (Induction Heating) cooker will be described with reference to the drawings. Further, the induction heating cooker shown in the drawings shows an example of the induction heating cooker of the present invention, and the induction heating cooker shown in the drawings does not limit the applicable equipment of the present invention. Further, in the following description, in order to facilitate understanding, terms indicating directions (for example, “up”, “down”, “right”, “left”, “front”, “rear”, etc. are used as appropriate. These are for illustration purposes only and do not limit the invention. In addition, in each of the drawings, the configurations denoted by the same reference numerals indicate the same or corresponding configurations, which are common to all the texts of the specification. In each drawing, the relative dimensional relationship or shape of each component may be different from the actual one.

Embodiment 1.
(Structure of induction heating cooker)
FIG. 1 is a schematic perspective view of induction heating cooker 100 according to the first embodiment. As shown in FIG. 1, the induction heating cooker 100 includes a main body 1 and a top plate 2 arranged on the upper surface of the main body 1. A front operation unit 3 is provided on the front surface of the main body 1. The front operation unit 3 includes a power switch for turning on/off the power of the induction heating cooker 100, a plurality of operation dials for adjusting heat power, and the like.

  The top plate 2 is composed of, for example, a heat-resistant glass plate and a metal frame body attached around the glass plate. The top plate 2 is provided with a heating port 4 which is a heating area. As shown in FIG. 1, three heating ports 4 are provided in this embodiment. The heating port 4 is printed on the top plate 2 so as to indicate a region in which an object to be heated such as a pot or a frying pan is placed. A heating coil 5 as a heating source is provided inside the main body 1 below the heating port 4. The heating port 4 is formed in the same shape as the outer shape of the heating coil 5 which is a heating source, or in a shape slightly larger than the outer shape of the heating coil 5. In the present embodiment, the heating port 4 is formed in a circular shape in top view. A transparent window 40 is provided in the heating port 4 of the top plate 2. The transmissive window 40 is provided to detect infrared rays of the object to be heated which is transmitted through the top plate 2 by the non-contact temperature sensor 20 (FIG. 2). The numbers and shapes of the heating ports 4 and the heating coils 5 are not limited to the example shown in FIG.

  An operation display unit 6 is provided on the front side of the top plate 2. The operation display unit 6 of the present embodiment includes, for example, a display screen having a plurality of light emitting diodes (LEDs) and a capacitance type touch sensor. The touch sensor accepts a user's operation input such as the heating power of the heating coil 5 corresponding to each heating port 4, the temperature, and the cooking mode via the top plate 2. The display screen displays a thermal power display showing the magnitude of the thermal power set by the front operation unit 3 or the touch sensor, or information about the setting state and the operating state of the induction heating cooker 100. Here, the information regarding the operating state of the induction heating cooker 100 includes the selected cooking mode, the progress of automatic cooking, the temperature of the object to be heated placed on the heating port 4, and the display of warning information. ..

  FIG. 2 is a schematic configuration diagram of a main part of the induction heating cooker 100 according to the first embodiment. FIG. 2 shows a schematic end view and a functional configuration of the induction heating cooker 100 together with the object to be heated 400 placed on the upper surface 2 a of the top plate 2. Although only one heating coil 5 is shown in FIG. 2, the structure related to the other heating coils 5 is the same as that in FIG. As shown in FIG. 2, inside the main body 1 of the induction heating cooker 100 and below the top plate 2, the heating coil 5, the non-contact temperature sensor 20, the contact temperature sensor 30, and the temperature detection. A unit 11, a control unit 12, and an inverter 13 are provided.

  The heating coil 5 is supported by the coil support body 51. The coil support 51 is made of, for example, a non-magnetic metal, and is supported by the housing of the main body 1. Further, the heating coil 5 of the present embodiment is composed of a concentric first coil 5a and a second coil 5b.

  The non-contact temperature sensor 20 is an infrared temperature sensor configured by a photodiode or a thermopile that detects infrared energy radiated from the bottom of the object to be heated 400 placed on the heating coil 5. The non-contact temperature sensor 20 is arranged below the transparent window 40 of the top plate 2 and between the first coil 5a and the second coil 5b. The non-contact temperature sensor 20 is housed in a resin sensor case 21 so that the cooling air flowing near the heating coil 5 does not directly hit the non-contact temperature sensor 20. Further, the non-contact temperature sensor 20 is held in the sensor case 21 while maintaining a spatial distance so that the ambient temperature around the non-contact temperature sensor 20 becomes uniform. The sensor case 21 is fixed to the coil support 51 with a tapping screw or the like, and the distance between the top plate 2 and the non-contact temperature sensor 20 is kept constant.

  The contact temperature sensor 30 is, for example, a thermocouple or a thermistor. The contact-type temperature sensor 30 is held by the holding mechanism 300 while being in contact with the lower surface 2b of the top plate 2. By bringing the detection surface of the contact-type temperature sensor 30 into contact with the top plate 2, the heat transferred from the object to be heated 400 to the top plate 2 is detected by the contact-type temperature sensor 30. The contact temperature sensor 30 is arranged between the first coil 5a and the second coil 5b. The number of the contact-type temperature sensors 30 held in one holding mechanism 300 may be one or plural. Further, a plurality of contact temperature sensors 30 may be arranged for one heating coil 5. The holding mechanism 300 of the contact temperature sensor 30 will be described in detail later.

  The temperature detection unit 11 is configured by hardware such as a circuit device that realizes the function, or an arithmetic unit such as a microcomputer and software executed on the arithmetic unit. The temperature detector 11 receives the output values of the non-contact temperature sensor 20 and the contact temperature sensor 30, and calculates the temperature of the object to be heated 400 based on the received output values. The temperature obtained by the temperature detection unit 11 is transmitted to the control unit 12.

  The control unit 12 is composed of hardware such as a circuit device that realizes the function, or an arithmetic unit such as a microcomputer and software executed on the arithmetic unit. The control unit 12 controls the operation of the induction heating cooker 100 based on the setting content input by operating the front operation unit 3 or the operation display unit 6. Further, the control unit 12 controls the inverter 13 based on the cooking temperature set by the user and the temperature of the object to be heated 400 calculated by the temperature detection unit 11 to perform heating control.

  The inverter 13 is a drive circuit that converts an AC power source of the commercial power source 200 into a high frequency current and supplies the high frequency current to the heating coil 5. Note that the induction heating cooker 100 may include a configuration other than that shown in FIG. 2, and may include, for example, a communication unit that communicates with an external device. Further, the control unit 12 may have the function of the temperature detection unit 11 and the temperature detection unit 11 may be omitted.

(Operation of induction heating cooker)
Next, the operation of the induction heating cooker 100 of the present embodiment will be described. First, when the user turns on the power switch of the front operation unit 3, the control unit 12 is activated. Then, when the user sets the cooking temperature using the operation display unit 6 and the like and gives an instruction to start heating, the control unit 12 drives the heating coil 5. Specifically, the control unit 12 controls the inverter 13 so as to drive the heating coil 5 based on the temperature set by the user, and the inverter 13 supplies electric power of a predetermined frequency to the heating coil 5.

  As a result, a magnetic flux is generated from the heating coil 5, and the magnetic flux generates an eddy current in the object to be heated 400 to heat the object to be heated 400. Then, the infrared rays emitted from the object to be heated 400 are received by the non-contact temperature sensor 20, and an output value according to the amount of received light is output to the temperature detection unit 11. In addition, the amount of heat generated by heating the object to be heated 400 is transferred to the top plate 2 to heat the top plate 2. Then, the temperature of the top plate 2 is detected by the contact-type temperature sensor 30 arranged below the top plate 2, and an output value corresponding to the detected temperature is output to the temperature detection unit 11.

  The temperature detection unit 11 obtains the temperature of the object to be heated 400 based on the output value of the non-contact temperature sensor 20 and the output value of the contact type temperature sensor 30, and sends the temperature to the control unit 12. For example, when the non-contact temperature sensor 20 is composed of a thermopile, the temperature detection unit 11 sets the temperature corresponding to the output value of the non-contact temperature sensor 20 and the temperature corresponding to the output value of the contact temperature sensor 30. The difference is obtained as the temperature of the object to be heated 400.

  Then, the control unit 12 performs feedback control so that the temperature of the object to be heated 400 transmitted from the temperature detection unit 11 reaches the set temperature. Specifically, when the temperature of the object to be heated 400 is lower than the set temperature, electric power is supplied to the heating coil 5. Then, when the temperature of the object to be heated 400 approaches the set temperature, the frequency of the power supply is increased to reduce the power supply to the heating coil 5. Further, when the temperature of the object to be heated 400 exceeds the set temperature, the control unit 12 stops the inverter 13 and stops the power supply to the heating coil 5. By repeating the above operation until the end of cooking, the temperature of the object to be heated 400 is maintained at the set temperature. Further, when the temperature of the object to be heated 400 obtained by the temperature detecting unit 11 is equal to or higher than the preset upper limit value, the control unit 12 determines that the temperature of the object to be heated 400 has become too high, and the heating coil 5 May be stopped.

  Then, when the heating and cooking are completed, the control unit 12 stops the inverter 13 and cuts off the power supply to the heating coil 5. By such control, in the induction heating cooker 100, automatic heating cooking according to the set temperature is performed.

(Contact-type temperature sensor holding mechanism)
FIG. 3 is a diagram illustrating a holding mechanism 300 of the contact temperature sensor 30 according to the first embodiment. As shown in FIG. 3, the contact-type temperature sensor 30 of the present embodiment is held by the holding mechanism 300 so as to come into contact with the top plate 2. More specifically, the holding mechanism 300 holds the contact temperature sensor 30 so that the detection surface of the contact temperature sensor 30 and the lower surface 2b of the top plate 2 are in close contact with each other. The bottom surface 2b of the top plate 2 is the back surface of the top surface 2a on which the object to be heated 400 of the top plate 2 is placed. The holding mechanism 300 of the contact-type temperature sensor 30 is arranged between the movable portion 31 in which the contact-type temperature sensor 30 is arranged, the holding portion 32 that holds the movable portion 31, and the holding portion 32 and the coil support body 51. Spring 33.

  The movable portion 31 is composed of an elastic body having flexibility and heat resistance. As an example, the movable portion 31 is made of silicon rubber or ceramic paper having a heat resistant temperature of 200° C. or higher. It should be noted that the movable portion 31 may be one that does not undergo plastic deformation, and a sponge or the like is also included in the elastic body. The movable portion 31 has a contact surface 31 a that contacts the top plate 2 and is movable with respect to the holding portion 32. To be movable with respect to the holding unit 32 means to be displaced, tilted, or rotated independently of the holding unit 32. In the present embodiment, the contact temperature sensor 30 is arranged at the center of the contact surface 31a of the movable portion 31. Specifically, the contact-type temperature sensor 30 is embedded in the movable portion 31 so that the contact surface 31a and the detection surface of the contact-type temperature sensor 30 are flush with each other. The movable portion 31 is attached in a compressed state between the holding portion 32 and the top plate 2.

  The lower surface of the movable portion 31 is fixed to the upper surface of the holding portion 32 with an adhesive or the like. The holding portion 32 is made of a plate-shaped metal or resin having rigidity and heat resistance. The holding part 32 is formed to be larger than the movable part 31 in a top view.

  The spring 33 is, for example, a coil spring. The spring 33 has a diameter smaller than the width of the holding portion 32, and may have the same diameter as the width of the movable portion 31, for example. The upper end of the spring 33 is fixed to a groove provided on the lower surface of the holding portion 32, and the lower end of the spring 33 is fixed to the coil support body 51. The spring 33 is attached in a compressed state between the holding portion 32 and the coil support body 51. It should be noted that the spring 33 may be any elastic body and is not limited to the coil spring.

  In the holding mechanism 300 of the present embodiment, the holding portion 32 is pushed up toward the top plate 2 by the spring 33. Then, the movable portion 31 held by the holding portion 32 is also pushed up toward the top plate 2, and the contact-type temperature sensor 30 arranged on the contact surface 31a of the movable portion 31 is pressed against the lower surface 2b of the top plate 2. As a result, the top plate 2 and the contact-type temperature sensor 30 come into close contact with each other.

  Here, FIG. 3 shows a state in which the holding portion 32 is arranged in parallel with the top plate 2. Specifically, the holding portion 32 and the coil support body 51 are attached in parallel to the top plate 2, and the spring 33 is attached to be perpendicular to the top plate 2. However, the holder 32 may not be arranged in parallel with the top plate 2 due to an assembly error of the holder 32, the spring 33, or the coil support 51.

  FIG. 4 is a diagram for explaining the holding mechanism 300 of the contact-type temperature sensor 30 according to the first embodiment, and is a diagram showing a state in which the holding portion 32 is not arranged in parallel with the top plate 2. As shown in FIG. 4, when the spring 33 is not vertically attached to the top plate 2, in other words, when the spring 33 is diagonally attached to the coil support body 51, the holding portion 32 is parallel to the top plate 2. I won't. Therefore, when the contact-type temperature sensor 30 is arranged in the holding portion 32 as in the above-described conventional technique, the contact-type temperature sensor 30 is not arranged in parallel with the top plate 2 and the top-plate 2 and the contact-type temperature sensor 30. An air gap will be generated between and. In this case, the top plate 2 and the contact-type temperature sensor 30 do not come into close contact with each other, and as a result, the detection accuracy of the contact-type temperature sensor 30 decreases.

  On the other hand, in the holding mechanism 300 of the present embodiment, the contact surface 31a on which the contact temperature sensor 30 is arranged is movable with respect to the holding portion 32, so that the contact temperature sensor 30 is mounted on the top plate 2. Can be closely attached. Specifically, as shown in FIG. 4, when the holding portion 32 is pushed up by the spring 33 in a state where the holding portion 32 is obliquely arranged with respect to the top plate 2, the contact surface 31 a is diagonally inclined with respect to the top plate 2. Pressed. At this time, since the movable portion 31 is an elastic body, it is deformed by the force from the top plate 2. As a result, the contact surface 31a that is oblique with respect to the top plate 2 moves along the lower surface 2b of the top plate 2, and the top plate 2 and the contact surface 31a come into close contact with each other. As a result, the contact-type temperature sensor 30 arranged on the contact surface 31a and the top plate 2 come into close contact with each other. In other words, the whole area of the contact surface 31a can be brought into contact with the lower surface 2b of the top plate 2 so that no space is generated between the top plate 2 and the contact surface 31a.

  As described above, in the present embodiment, since the holding mechanism 300 has the contact surface 310a that is movable with respect to the holding portion 32, even when the holding portion 32 is obliquely arranged with respect to the top plate 2, The gap between the contact temperature sensor 30 and the top plate 2 can be filled. As a result, the contact-type temperature sensor 30 can be brought into close contact with the lower surface 2b of the top plate 2.

  As a result, the temperature of the object to be heated 400 can be detected with the contact-type temperature sensor 30 in close contact with the lower surface 2b of the top plate 2, and the temperature detection accuracy is improved. Further, by having the contact surface 31a that is movable independently of the holding portion 32, the assembly error of the holding portion 32, the spring 33 and the coil support 51 is absorbed by the movement of the contact surface 31a, and the contact temperature sensor 30 is connected. It can be brought into close contact with the top plate 2. Therefore, the contact property of the contact-type temperature sensor 30 for each product to the top plate 2 can be made constant, and the variation in the detection accuracy of the contact-type temperature sensor 30 for each product can be suppressed.

  Although FIG. 4 shows the case where the spring 33 is not attached vertically to the top plate 2, the present invention is not limited to this. For example, even when the holding portion 32 is attached to be inclined with respect to the spring 33, or when the coil support body 51 is attached to be inclined with respect to the housing of the main body 1, the contact type temperature sensor is moved by the movement of the contact surface 31a. The top 30 can be closely attached to the top plate 2. Further, the contact-type temperature sensor 30 can be brought into close contact with the top plate 2 regardless of whether the holding portion 32, the spring 33, or the coil support body 51 is inclined in any of the front, rear, left, and right directions. Further, by adjusting the thickness, elasticity, compression state, or the like of the movable portion 31, it is possible to correspond to any inclination angle.

Embodiment 2.
Next, a second embodiment of the present invention will be described. The second embodiment is different from the first embodiment in the configuration of the movable portion in the holding mechanism of the contact temperature sensor 30. The other configuration and control of induction heating cooker 100 are the same as those in the first embodiment.

  FIG. 5 is a diagram illustrating a holding mechanism 300A of the contact temperature sensor 30 according to the second embodiment. As shown in FIG. 5, the holding mechanism 300A of the contact-type temperature sensor 30 according to the present embodiment includes a movable portion 310 in which the contact-type temperature sensor 30 is arranged, a holding portion 320 that holds the movable portion 310, and a holding portion. The spring 33 is provided between the coil support member 320 and the coil support member 51.

  The movable part 310 has a ball joint structure, and has a shape in which the upper part of a sphere is cut off. The spherical portion of the movable portion 310 is a spherical portion 310b, and the cut surface is a contact surface 310a. The movable portion 310 is made of heat-resistant resin such as polypropylene or fluororesin. The contact surface 310 a of the movable portion 310 contacts the top plate 2 and is movable with respect to the holding portion 320. The contact-type temperature sensor 30 is embedded in the movable portion 310 so that the contact surface 310a of the movable portion 310 and the detection surface of the contact-type temperature sensor 30 are flush with each other.

  The movable part 310 is rotatably held by the holding part 320. The holding portion 320 is made of a plate-shaped metal or resin having rigidity and heat resistance, and has a concave portion 321 in the center that can make spherical contact with the spherical portion 310b of the movable portion 310. By fitting the spherical portion 310b into the recess 321 of the holding portion 320, the movable portion 310 can rotate in any direction.

  Like the first embodiment, the spring 33 is a coil spring having a diameter smaller than the width of the holding portion 320. The upper end of the spring 33 is fixed to a groove provided on the lower surface of the holding portion 320, and the lower end of the spring 33 is fixed to the coil support body 51. The spring 33 is attached in a compressed state between the holding portion 320 and the coil support body 51.

  FIG. 6 is a diagram for explaining the holding mechanism 300 of the contact-type temperature sensor 30 according to the second embodiment, and is a diagram showing a state in which the holding portion 320 is not arranged parallel to the top plate 2. As shown in FIG. 6, also in the present embodiment, the contact-type temperature sensor 30 can be brought into close contact with the top plate 2 even when the holding portion 320 is not arranged parallel to the top plate 2. Specifically, as shown in FIG. 6, when the holding part 320 is pushed up by the spring 33 in a state where the holding part 320 is diagonally arranged with respect to the top plate 2, the contact surface 310 a is pushed diagonally to the top plate 2. Applied. At this time, since the movable portion 310 has a ball joint structure, it is rotated by the force from the top plate 2. As a result, the contact surface 310a that was oblique with respect to the top plate 2 moves along the lower surface 2b of the top plate 2, and the top plate 2 and the contact surface 310a come into close contact with each other. As a result, the contact-type temperature sensor 30 arranged on the contact surface 310a and the top plate 2 come into close contact with each other.

  As described above, also in the present embodiment, the contact-type temperature sensor is provided even when the holding part 320 is obliquely attached to the top plate 2 by the contact surface 310a that is rotatable independently of the holding part 320. The gap between 30 and the top plate 2 can be filled. As a result, the contact-type temperature sensor 30 can be brought into close contact with the lower surface 2b of the top plate 2, improving the temperature detection accuracy of the contact-type temperature sensor 30 as in the first embodiment, and improving the temperature detection accuracy of each product. Can be suppressed.

  It should be noted that the movable part 310 is not limited to the ball joint structure as long as it has a universal joint structure rotatable in any direction.

Embodiment 3.
Next, a third embodiment of the present invention will be described. The third embodiment is different from the first embodiment in that the holding mechanism of the contact temperature sensor 30 includes a heat receiving portion 34. Other configurations and controls of the induction heating cooker 100 are the same as those in the first embodiment.

  FIG. 7 is a diagram illustrating a holding mechanism 300B of the contact temperature sensor 30 according to the third embodiment. As shown in FIG. 7, the holding mechanism 300B of the contact-type temperature sensor 30 according to the present embodiment includes a movable portion 31, a holding portion 32, a spring 33, and a movable portion 31 above the movable portion 31. The heat receiving part 34 is arranged between the top plate 2 and the top plate 2.

  The configurations of the movable portion 31, the holding portion 32, and the spring 33 of this embodiment are the same as those of the first embodiment. The heat receiving portion 34 is made of a material having a higher thermal conductivity than the top plate 2, such as aluminum or copper. The heat receiving portion 34 is formed to be larger than the detection surface of the contact temperature sensor 30 so as to contact the top plate 2 in a larger area than the detection surface of the contact temperature sensor 30 in a top view. By arranging the heat receiving part 34 having a high thermal conductivity and a large contact area above the contact type temperature sensor 30 and closely contacting it with the top plate 2, the heat of the top plate 2 efficiently contacts through the heat receiving part 34. It is transmitted to the temperature sensor 30. In addition, in order to transfer the heat of the top plate 2 to the contact type temperature sensor 30 more efficiently, the heat receiving section 34 may be arranged so as to surround the contact type temperature sensor 30.

  FIG. 8 is a diagram illustrating a holding mechanism 300B of the contact temperature sensor 30 according to the third embodiment, and is a diagram illustrating a state in which the holding portion 32 is not arranged in parallel with the top plate 2. As shown in FIG. 8, also in the present embodiment, the heat receiving portion 34 can be brought into close contact with the top plate 2 even when the holding portion 32 is not arranged parallel to the top plate 2. More specifically, as described in the first embodiment, the movable portion 31 is deformed by the force from the top plate 2, so that the contact surface 31a that is inclined with respect to the top plate 2 becomes the lower surface 2b of the top plate 2. Moves along. As a result, the top plate 2 and the heat receiving portion 34 provided above the contact surface 31a come into close contact with each other.

  As described above, also in the present embodiment, similarly to the first embodiment, it is possible to improve the temperature detection accuracy of contact-type temperature sensor 30 and suppress variations in temperature detection accuracy among products. Further, by providing the heat receiving portion 34 above the contact type temperature sensor 30, the contact area with the top plate 2 is widened, and the heat from the top plate 2 is efficiently and stably transferred to the contact type temperature sensor 30. be able to. Thereby, the temperature detection accuracy of the contact temperature sensor 30 can be further improved. In addition, by providing the heat receiving portion 34 having high thermal conductivity, the detection speed of the contact temperature sensor 30 also increases.

Fourth Embodiment
Next, a fourth embodiment of the invention will be described. The fourth embodiment is different from the second embodiment in that the holding mechanism of the contact temperature sensor 30 includes a heat receiving portion 34. Other configurations and controls of induction heating cooker 100 are the same as those in the second embodiment.

  FIG. 9 is a diagram illustrating a holding mechanism 300C of the contact temperature sensor 30 according to the fourth embodiment. As shown in FIG. 9, the holding mechanism 300C of the contact-type temperature sensor 30 according to the present embodiment includes a movable portion 310, a holding portion 320, a spring 33, and a movable portion 310 above the movable portion 310. The heat receiving part 34 is arranged between the top plate 2 and the top plate 2.

  The configurations of the movable portion 310, the holding portion 320, and the spring 33 of this embodiment are the same as those of the second embodiment. The heat receiving portion 34 is similar to that of the third embodiment, and is made of a material such as aluminum or copper having a higher thermal conductivity than the top plate 2. The heat receiving portion 34 is formed to be larger than the detection surface of the contact temperature sensor 30 so as to contact the top plate 2 in a larger area than the detection surface of the contact temperature sensor 30 in a top view. By arranging the heat receiving part 34 having a high thermal conductivity and a large contact area above the contact type temperature sensor 30 and closely contacting the top plate 2, the heat of the top plate 2 efficiently contacts through the heat receiving part 34. It is transmitted to the temperature sensor 30. In addition, in order to more efficiently transfer the heat of the top plate 2 to the contact temperature sensor 30, the heat receiving portion 34 may be arranged so as to surround the contact temperature sensor 30.

  FIG. 10 is a diagram illustrating a holding mechanism 300C of the contact-type temperature sensor 30 according to the fourth embodiment, and is a diagram illustrating a state in which the holding portion 320 is not arranged in parallel with the top plate 2. As shown in FIG. 10, also in the present embodiment, the heat receiving portion 34 can be brought into close contact with the top plate 2 even when the holding portion 320 is not arranged parallel to the top plate 2. More specifically, as described in the second embodiment, the movable portion 310 is rotated by the force from the top plate 2, so that the contact surface 310a that is inclined with respect to the top plate 2 becomes the lower surface 2b of the top plate 2. Move along. As a result, the top plate 2 and the heat receiving portion 34 provided above the contact surface 310a come into close contact with each other.

  As described above, also in the present embodiment, similarly to the second embodiment, it is possible to improve the temperature detection accuracy of contact-type temperature sensor 30 and suppress variations in temperature detection accuracy among products. Further, by providing the heat receiving portion 34, similarly to the third embodiment, the temperature detection accuracy of the contact temperature sensor 30 can be further improved, and the detection speed of the contact temperature sensor 30 also increases.

Embodiment 5.
Next, a fifth embodiment of the invention will be described. The fifth embodiment is different from the third embodiment in that the holding mechanism of the contact temperature sensor 30 includes a thermal interface material (TIM) 35. Other configurations and controls of the induction heating cooker 100 are the same as those in the third embodiment.

  FIG. 11 is a diagram illustrating a holding mechanism 300D of the contact temperature sensor 30 according to the fifth embodiment. As shown in FIG. 11, the holding mechanism 300D of the contact-type temperature sensor 30 according to the present embodiment is located above the movable portion 31, the holding portion 32, the spring 33, the heat receiving portion 34, and the heat receiving portion 34. , A thermal interface material 35 disposed between the heat receiving portion 34 and the top plate 2.

  The configurations of the movable portion 31, the holding portion 32, the spring 33, and the heat receiving portion 34 of this embodiment are the same as those of the third embodiment. The thermal interface material 35 is made of, for example, a heat conductive sheet such as a silicon gel sheet, or a material having high heat conductivity and flexibility such as a heat transfer gel or grease. The thermal interface material 35 is arranged on the entire area or a part of the upper surface of the heat receiving section 34.

  In the present embodiment, the same effect as in the third embodiment can be obtained, and by providing the thermal interface material 35 above the heat receiving portion 34, even when the lower surface 2b of the top plate 2 is not a flat surface, It is possible to suppress the generation of voids with the plate 2. For example, even when the top plate 2 is warped due to aged deterioration or is deformed by placing a heavy object on the top plate 2, the thermal interface material 35 is used to fill the gap with the top plate 2. You can Further, the thermal interface material 35 can also fill the minute gaps or the gaps due to the irregularities existing on the lower surface 2b of the top plate 2. Thereby, the heat of the top plate 2 can be efficiently transmitted to the contact temperature sensor 30 via the thermal interface material 35 and the heat receiving portion 34, and the temperature detection accuracy of the contact temperature sensor 30 can be further improved. it can.

Sixth embodiment.
Next, a sixth embodiment of the present invention will be described. The sixth embodiment differs from the fourth embodiment in that the holding mechanism of the contact temperature sensor 30 includes the thermal interface material 35. Other configurations and controls of the induction heating cooker 100 are similar to those of the fourth embodiment.

  FIG. 12 is a diagram illustrating a holding mechanism 300E of the contact temperature sensor 30 according to the sixth embodiment. As shown in FIG. 12, the holding mechanism 300E of the contact-type temperature sensor 30 according to the present embodiment is located above the movable portion 310, the holding portion 320, the spring 33, the heat receiving portion 34, and the heat receiving portion 34. , A thermal interface material 35 disposed between the heat receiving portion 34 and the top plate 2.

  The configurations of the movable portion 310, the holding portion 320, the spring 33, and the heat receiving portion 34 of this embodiment are the same as those of the fourth embodiment. The thermal interface material 35 is similar to that of the fifth embodiment, and is made of, for example, a heat conductive sheet such as a silicon gel sheet, or a material having high heat conductivity and flexibility such as a heat transfer gel or grease. The thermal interface material 35 is arranged on the entire area or a part of the upper surface of the heat receiving section 34.

  In the present embodiment, the same effect as in Embodiment 4 can be obtained, and by providing the thermal interface material 35 above the heat receiving portion 34, even when the lower surface 2b of the top plate 2 is not flat, It is possible to suppress the generation of a gap with the top plate 2. Thereby, the heat of the top plate 2 can be efficiently transmitted to the contact temperature sensor 30 via the thermal interface material 35 and the heat receiving portion 34, and the temperature detection accuracy of the contact temperature sensor 30 can be further improved. it can.

Embodiment 7.
Next, a seventh embodiment of the invention will be described. The seventh embodiment differs from the first embodiment in that the holding mechanism does not include the spring 33. The other configuration and control of induction heating cooker 100 are the same as those in the first embodiment.

  FIG. 13 is a diagram illustrating a holding mechanism 300F of the contact temperature sensor 30 according to the seventh embodiment. As shown in FIG. 13, the holding mechanism 300F of the contact-type temperature sensor 30 according to the present embodiment has a movable portion 31 in which the contact-type temperature sensor 30 is arranged, a holding portion 32a that holds the movable portion 31, and a holding portion. And a leg portion 32b supporting 32a. The movable portion 31 of the present embodiment has the same configuration as that of the first embodiment, and is fixed to the upper surface of the holding portion 32a with an adhesive or the like. The movable portion 31 has a contact surface 31a that contacts the top plate 2 and is movable with respect to the holding portion 32a. The movable portion 31 is attached in a compressed state between the holding portion 32a and the top plate 2.

  The holding portion 32a of the present embodiment is fixed to the coil support body 51 via the leg portions 32b. Like the holding portion 32a, the leg portion 32b is made of a plate-shaped metal or resin having rigidity and heat resistance. In the present embodiment, the two leg portions 32b extend from the lower surface of the holding portion 32a, and the lower ends of the leg portions 32b are fixed to the coil support body 51. Further, the holding portion 32a and the leg portion 32b may be integrally formed, or may be formed of separate members. The number and shape of the leg portions 32b are not limited to the example of FIG.

  In the holding mechanism 300F of the present embodiment, when the movable portion 31 is attached in a compressed state, the contact temperature sensor 30 arranged on the contact surface 31a of the movable portion 31 is pressed against the lower surface 2b of the top plate 2, The top plate 2 and the contact-type temperature sensor 30 come into close contact with each other. Also in this embodiment, the contact-type temperature sensor 30 can be brought into close contact with the top plate 2 even when the holding portion 32a is not arranged in parallel with the top plate 2. More specifically, as described in the first embodiment, the movable portion 31 is deformed by the force from the top plate 2, so that the contact surface 31a that is inclined with respect to the top plate 2 becomes the lower surface 2b of the top plate 2. Moves along. As a result, the top plate 2 and the contact-type temperature sensor 30 provided on the contact surface 31a come into close contact with each other.

  As described above, also in the present embodiment, it is possible to improve the temperature detection accuracy of contact-type temperature sensor 30 as in the first embodiment and suppress variations in temperature detection accuracy among products. Furthermore, by omitting the spring from the holding mechanism 300F, the number of parts can be reduced. Further, by reducing the number of parts, it is possible to improve the assembling property and reduce the assembling error. Therefore, it is easy to keep the adhesion between the top plate 2 and the contact-type temperature sensor 30 constant, and at the same time for each product. It is possible to further suppress variations in the detection accuracy of the contact temperature sensor 30.

  As a modified example of the present embodiment, the leg portion 32b may be omitted and the holding portion 32a may be directly fixed to the coil support body 51. Thereby, the number of parts can be further reduced, and the heating coil 5 can be brought close to the top plate 2.

Eighth embodiment.
Next, an eighth embodiment of the present invention will be described. The eighth embodiment differs from the first embodiment in the structure of the holding mechanism of the contact temperature sensor 30. The other configuration and control of induction heating cooker 100 are the same as those in the first embodiment.

  FIG. 14 is a diagram illustrating a holding mechanism 300G of the contact temperature sensor 30 according to the eighth embodiment. As shown in FIG. 14, the holding mechanism 300G includes a heat receiving portion 340 in which the contact temperature sensor 30 is arranged, a joint portion 310A holding the heat receiving portion 340, a holding portion 320A holding the joint portion 310A, and a holding portion. It is composed of a spring 33A provided below 320A.

  The heat receiving portion 340 is made of a material having a higher thermal conductivity than the top plate 2, such as aluminum or copper. The heat receiving section 340 has a contact surface 340a that is in contact with the top plate 2 and is movable with respect to the holding section 320A. In the present embodiment, contact temperature sensor 30 is embedded in heat receiving section 340 and arranged.

  The heat receiving portion 340 is fixed to the joint portion 310A and rotates as the joint portion 310A rotates. In the present embodiment, heat receiving portion 340 and joint portion 310A form a movable portion. The joint portion 310A has a ball joint structure and is made of a heat-resistant resin such as polypropylene or fluororesin. The joint portion 310A has a spherical shape and is rotatably held by the holding portion 320A. 320 A of holding parts have the recessed part 321A which can make spherical contact with 310 A of joint parts in the center. By fitting the joint portion 310A into the recess 321A of the holding portion 320A, the joint portion 310A and the heat receiving portion 340 can rotate in arbitrary directions.

  The spring 33A is a coil spring and is attached in a compressed state between the holding portion 320A and the coil support body 51, and pushes the holding portion 320A toward the top plate 2.

  Also in the present embodiment, the heat receiving portion 340 can be brought into close contact with the top plate 2 even when the holding portion 320A is not arranged parallel to the top plate 2. Specifically, when a force from the top plate 2 is applied to the heat receiving section 340, the joint section 310A holding the heat receiving section 340 rotates. As a result, the contact surface 340a that is oblique with respect to the top plate 2 moves along the lower surface 2b of the top plate 2. As a result, the top plate 2 and the contact surface 340a come into close contact with each other, and the heat of the top plate 2 is transferred to the contact temperature sensor 30 via the heat receiving portion 340.

  As described above, also in the present embodiment, it is possible to improve the temperature detection accuracy of contact-type temperature sensor 30 as in the second embodiment and suppress variations in temperature detection accuracy among products. Furthermore, by embedding the contact temperature sensor 30 in the heat receiving portion 340, it is possible to further improve the temperature detection accuracy of the contact temperature sensor 30 and increase the detection speed.

  The above is the description of the embodiment of the present invention, but the present invention is not limited to the above embodiment, and various modifications can be made without departing from the gist of the present invention. For example, the positions of the contact-type temperature sensor 30 and the holding mechanism thereof are not limited to the positions between the first coil 5a and the second coil 5b, and can be arranged at any position on the coil support 51. In addition, the shapes of the movable portion 31 and the holding portion 32 in the above-described embodiment may be arbitrary shapes, and may be a rectangular shape, a circular shape, a polygonal shape, or the like in a top view.

  Further, at least a part including the contact surface 310a of the movable portion 310 in the second, fourth, sixth and eighth embodiments may be made of an elastic body. In this case, the portion below the spherical portion 310b and in contact with the holding portion 320 may be configured to have a strength that can withstand rotation.

  Further, in the fifth and sixth embodiments, the configuration in which the thermal interface material 35 is arranged above the heat receiving portion 34 has been described, but the heat receiving portion 34 is omitted and heat is generated above the contact surface 31a and the contact surface 310a. The interface material 35 may be arranged. In addition, in the first to eighth embodiments, a spring that pushes up the coil support body 51 toward the top plate 2 may be provided.

  Furthermore, in the above-described embodiment, the contact-type temperature sensor 30 is arranged in the center of the contact surface 31a or the contact surface 310a, but the present invention is not limited to this. For example, the contact temperature sensor 30 may be arranged at a position deviated from the center of the contact surface 31a or the contact surface 310a. In the present embodiment, since the contact surface 31a and the contact surface 310a move and come into close contact with the lower surface 2b of the top plate 2, no matter where the contact-type temperature sensor 30 is arranged, the contact-type temperature sensor 30 may be placed on the top surface 2b. It is in close contact with the plate 2 and the temperature can be accurately detected.

  Further, when the movable portion 31 or the movable portion 310 is made of an elastic body, the contact temperature sensor 30 may be arranged so as to project upward from the contact surface 31a or the contact surface 310a. Alternatively, when the movable portion 31 or the movable portion 310 is made of an elastic body and a material having thermal conductivity, the contact temperature sensor 30 may be arranged inside the movable portion 31 or the movable portion 310.

  DESCRIPTION OF SYMBOLS 1 main body, 2 top plate, 2a upper surface, 2b lower surface, 3 front operation unit, 4 heating port, 5 heating coil, 5a first coil, 5b second coil, 6 operation display unit, 11 temperature detection unit, 12 control unit, 13 inverter, 20 non-contact temperature sensor, 21 sensor case, 30 contact temperature sensor, 31, 310 movable part, 31a, 310a, 340a contact surface, 32, 32a, 320, 320A holding part, 32b leg part, 33, 33A spring, 34, 340 heat receiving part, 35 thermal interface material, 40 transparent window, 51 coil support, 100 induction heating cooker, 200 commercial power supply, 300, 300A, 300B, 300C, 300D, 300E, 300F, 300G holding mechanism , 310A Joint part, 310b Sphere part, 321, 321A concave part, 400 Heated object.

Claims (8)

A top plate on which the object to be heated is placed,
A heating coil that is arranged below the top plate and that induction-heats the object to be heated,
A contact type temperature sensor for detecting the temperature of the top plate,
A movable part in which the contact type temperature sensor is arranged,
A holding part for holding the movable part,
An elastic body that pushes up the holding portion toward the top plate,
The induction heating cooker, wherein the movable part has a contact surface that is in contact with the top plate and is movable with respect to the holding part.   The induction heating cooker according to claim 1, wherein the movable portion is formed of an elastic body or a universal joint.   The induction heating cooker according to claim 1, wherein the contact-type temperature sensor is disposed on the contact surface.   The induction heating cooker according to any one of claims 1 to 3, wherein the contact surface is in close contact with the top plate even when the top plate and the holding portion are not arranged in parallel. .   The induction heating cooker according to any one of claims 1 to 4, further comprising a heat receiving portion arranged between the contact surface and the top plate.   The induction heating cooker according to any one of claims 1 to 5, further comprising a thermal interface material disposed between the contact surface and the top plate. The movable part includes a heat receiving part,
The induction heating cooker according to claim 1, wherein the contact-type temperature sensor is arranged in the heat receiving unit. A top plate on which the object to be heated is placed,
A heating coil that is arranged below the top plate and that induction-heats the object to be heated,
A contact type temperature sensor for detecting the temperature of the top plate,
The contact type temperature sensor is arranged, a movable part composed of an elastic body,
A holding unit that holds the movable unit,
The induction heating cooker, wherein the movable part has a contact surface that is in contact with the top plate and is movable with respect to the holding part.

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